TWI780196B - Load port, and the comparison processing method in the load port - Google Patents

Load port, and the comparison processing method in the load port Download PDF

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TWI780196B
TWI780196B TW107127406A TW107127406A TWI780196B TW I780196 B TWI780196 B TW I780196B TW 107127406 A TW107127406 A TW 107127406A TW 107127406 A TW107127406 A TW 107127406A TW I780196 B TWI780196 B TW I780196B
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collation
comparison
container
conveying
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TW201922602A (en
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三浦辰
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日商昕芙旎雅股份有限公司
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Abstract

提供一種檢測在經過中間處理工程前後平面尺寸相異之搬送對象物的混載，而有助於半導體製造中的運用率提升之載入埠、及載入埠中的對照處理方法。 　　構成為進行：就座保持處理，保持載置桌台(5)上的搬送容器(FOUP(3)或第2搬送容器(C))；及後方牽引處理，令載置桌台(5)上的搬送容器從就座位置移動至搬送對象物授受位置；及第1對照處理，通過處於開狀態的框(4)的開口部(41)將對照器(M2)置放於可偵測第1搬送對象物(W)之第1對照位置(P1)來執行；及第2對照處理，將對照器(M2)置放於可偵測第2搬送對象物(F)之第2對照位置來執行。Provided is a loading port that detects mixed loading of conveyed objects with different plane sizes before and after an intermediate processing process, which contributes to the improvement of the utilization rate in semiconductor manufacturing, and a comparison processing method in the loading port. It is constituted to carry out: the seat holding process, holding the conveying container (FOUP (3) or the second conveying container (C)) on the table (5); The conveying container moves from the seating position to the conveying object accepting position; and for the first comparison process, place the comparator (M2) on the opening (41) of the frame (4) in the open state to detect the first The first comparison position (P1) of the object to be transported (W) is executed; and the second comparison process is performed by placing the collation device (M2) at the second comparison position that can detect the second object to be transported (F) .

Description

載入埠，及載入埠中的對照處理方法Load port, and the method of comparison processing in the load port

本發明有關半導體製造工程中，用來與可將複數片的晶圓等搬送對象物收納至多段式狹槽(slot)的搬送容器亦即FOUP之間授受搬送對象物之載入埠(load-port)，特別有關具備了對照包括FOUP的各狹槽中有無第1搬送對象物之狀態的資訊之對照(mapping)機構的載入埠、及載入埠中的對照處理方法。In the semiconductor manufacturing process of the present invention, a loading port (load- port), especially the loading port equipped with a mapping mechanism that checks information on the presence or absence of the first object to be transported in each slot of the FOUP, and the mapping processing method in the loading port.

例如在半導體的製造工程中，為求良率或品質之提升，係在無塵室內進行晶圓之處理。近年來，係導入「微環境(Mini-Environment)方式」亦即僅針對晶圓周圍的局部性空間進一步提升潔淨度，採用於進行晶圓搬送等其他處理之手段。微環境方式中，是在框體的內部載置構成大致封閉之晶圓搬送室(以下稱搬送室)的壁面的一部分，並且在高清淨的內部空間供晶圓等搬送對象物收納之搬送容器亦即FOUP(Front-Opening Unified Pod；晶舟)，而在緊貼於FOUP的門之狀態下，具有令該FOUP門開閉的機能之載入埠係鄰接於搬送室而設置。以下，將可卡合於FOUP門而令FOUP門開閉之載入埠的門稱為「載入埠門」。For example, in the semiconductor manufacturing process, in order to improve the yield rate or quality, wafers are processed in a clean room. In recent years, the "Mini-Environment" method has been introduced, that is, only the local space around the wafer is used to further improve the cleanliness, and it is used for other processing methods such as wafer transfer. In the micro-environment method, a part of the wall constituting a substantially closed wafer transfer chamber (hereinafter referred to as the transfer chamber) is placed inside the frame, and a transfer container for storing objects to be transferred such as wafers in a high-clean internal space That is, FOUP (Front-Opening Unified Pod; crystal boat), and in the state of being close to the door of the FOUP, the loading port with the function of opening and closing the door of the FOUP is provided adjacent to the transfer chamber. Hereinafter, the door of the loading port that can be engaged with the FOUP door to open and close the FOUP door is referred to as "loading port door".

這樣的載入埠，為用來與搬送室之間進行搬送對象物的取出放入之裝置，作用成為搬送室與FOUP之間的介面部。又，構成為若在對於FOUP門而言令載入埠門緊貼之狀態下該些FOUP門及載入埠門同時被開啟，則能夠藉由配置於搬送室內的搬送機器人，將FOUP內的搬送對象物取出至搬送室內，或將搬送對象物從搬送室內收納至FOUP內。Such a loading port is a device for loading and unloading objects to be transported between the transfer chamber and functions as an interface between the transfer chamber and the FOUP. In addition, if the FOUP door and the loading port door are simultaneously opened in a state where the loading port door is in close contact with the FOUP door, the transfer robot in the transfer chamber can be used to move the load in the FOUP. The object to be transported is taken out to the transfer chamber, or the object to be conveyed is stored in the FOUP from the transfer chamber.

在載入埠，備有可檢測設於FOUP內之多段式狹槽中搬送對象物的有無或收納姿勢之對照機構。作為對照機構之一例，能夠舉出下述之物，即，將在先端部具備了對照感測器之對照器(mapper)，構成為可在令其後退至比載入埠的框還靠搬送室側之不可對照位置、與通過框的開口部而接近至比不可對照位置還靠FOUP內之可對照位置之間移動。此外，對照機構，具備支撐對照器之對照移動部(對照臂)，其構成為將對照器維持在可對照位置而令對照臂朝高度方向移動，藉此可對每一狹槽偵測多段式狹槽中的搬送對象物。另，對照臂的升降移動，是和載入埠門的升降移動一體或獨立地進行。At the loading port, there is a collation mechanism that can detect the presence or storage posture of the object to be conveyed in the multi-stage slots in the FOUP. As an example of the collation mechanism, the following can be mentioned, that is, the collation device (mapper) equipped with a collation sensor at the tip is configured so that it can be transported further than the frame of the loading port after being retracted. Move between the unmatched position on the chamber side and the collimable position that is closer to the FOUP than the unmatched position through the opening of the frame. In addition, the collation mechanism has a collation moving part (comparison arm) that supports the collation device, and is configured to maintain the collation device at a position that can be collated and move the collation arm in the height direction, so that multi-stage type can be detected for each slot. Objects to be conveyed in the slot. In addition, the lifting movement of the control arm is performed integrally with or independently of the lifting movement of the loading port door.

不過，半導體製造的中間工程～後工程(例如底部拋光(back-lapping)處理工程、晶圓層積處理工程、切割處理工程等)中，會在鄰接於搬送室而設置之複數種類的處理室內各自施以適當的處理。因此，在處理室內，例如底部拋光處理前之晶圓、底部拋光處理後的薄晶圓會在被保持於環狀框之狀態下受到搬送。However, in the intermediate process to post-process of semiconductor manufacturing (such as bottom polishing (back-lapping) process, wafer lamination process, dicing process, etc.), there are multiple types of processing chambers installed adjacent to the transfer chamber. Appropriate treatment is applied to each. Therefore, in the processing chamber, for example, the wafer before the bottom polishing process and the thin wafer after the bottom polishing process are transported while being held by the ring frame.

此處，供底部拋光處理後的薄晶圓保持之環狀框，例如為被設定成0.3～0.7mm程度的厚度之物。被保持於環狀框的晶圓，會在被收容至和FOUP相異之專用的容器亦即框匣(frame casstte)之狀態下受到搬送。Here, the annular frame for holding the thin wafer after the bottom polishing process is set to have a thickness of about 0.3 to 0.7 mm, for example. The wafers held in the ring frame are transported in a state of being housed in a frame cassette, which is a dedicated container different from the FOUP.

上述這樣的半導體製造的中間工程～後工程中，以往，中間處理工程以後的薄晶圓(被保持於環狀框的薄晶圓)是藉由搬送環狀框之專用的機器人、或搬送收納了環狀框的框匣之專用的機器人而被直接搬送至下一工程，或被搬送至不同於載入埠之框匣專用的載置空間。此外，在對於搬送室而言設置處理內容(底部拋光處理工程、晶圓層積處理工程、切割處理工程等)相異的複數種處理室之半導體製造裝置中，框匣往載入埠之搬送、裝載是藉由作業者來進行。In the intermediate process to the post-process of semiconductor manufacturing as described above, conventionally, thin wafers (thin wafers held in a ring frame) after the intermediate process process have been transported by a dedicated robot for transporting the ring frame, or transported and stored. A dedicated robot for a cassette with a ring frame is directly transported to the next process, or it is transported to a dedicated loading space for a cassette other than the loading port. In addition, in a semiconductor manufacturing device in which a plurality of processing chambers with different processing contents (bottom polishing processing, wafer lamination processing, dicing processing, etc.) are installed in the transfer chamber, the transfer of the cassette to the loading port , Loading is carried out by the operator.

另一方面，當著眼於與載入埠之間授受搬送容器之機構(例如OHT；Overhead Hoist Transfer；空中懸吊式搬送系統)的搬送效率改善、搬送產距(takt)改善這一點的情形下，對於搬送室而言設有處理內容相異的複數種處理室之構成中，料想理想是以晶圓搬送機器人來搬送保持薄晶圓之環狀框、或利用FOUP的載置空間亦即載入埠來作為框匣的載置空間，藉此使用共通的裝置來取用框匣與FOUP。On the other hand, when focusing on the improvement of the transfer efficiency and the improvement of the transfer distance (takt) of the mechanism (such as OHT; Overhead Hoist Transfer; aerial suspension transfer system) that transfers containers to and from the loading port In the configuration where the transfer chamber is equipped with a plurality of processing chambers with different processing contents, it is conceivable that the wafer transfer robot is ideal for transferring the ring-shaped frame holding the thin wafer, or using the loading space of the FOUP, that is, the loading The port is used as a loading space for the cassette, so that the cassette and FOUP can be accessed using a common device.

當設想了這樣的使用形態的情形下，料想在中間處理工程以後，可能會發生例如底部拋光處理前的晶圓亦即未被保持於環狀框之晶圓、或底部拋光處理後被保持於環狀框之晶圓被混載收容於載入埠上的FOUP內或框匣內之事態。也就是說，會有本應被收納於FOUP之晶圓被誤投入/誤積載至框匣內，或本應被收納於框匣之環狀框被誤投入/誤積載至FOUP內之事態發生的可能性。若這樣的事態發生，會妨礙半導體製造工程的順暢進行，直接導致製造效率的降低。When such a use form is envisaged, it is expected that after the intermediate processing, for example, the wafer before the bottom polishing process, that is, the wafer that is not held in the ring frame, or the wafer held in the ring frame after the bottom polishing process may occur. The wafers in the ring frame are mixed and stored in the FOUP or the cassette on the load port. That is to say, wafers that should be stored in the FOUP are mistakenly loaded/stacked into the cassette, or ring frames that should be stored in the cassette are mistakenly loaded/stacked into the FOUP. possibility. If such a situation occurs, it will hinder the smooth progress of the semiconductor manufacturing process and directly lead to a decrease in manufacturing efficiency.

專利文獻1中，揭示一種將配置於搬送容器的周圍之對照感測器沿著搬送容器的高度方向做升降移動，藉此判定搬送容器內的每一狹槽是否收納有晶圓之對照處理。料想這樣的對照處理，亦可判定在搬送容器內是否收納有晶圓。 [先前技術文獻] [專利文獻]Patent Document 1 discloses a collation process in which a collation sensor arranged around a transfer container is moved up and down along the height direction of the transfer container to determine whether each slot in the transfer container contains a wafer. It is expected that such a collation process can also determine whether or not a wafer is accommodated in the transfer container. [Prior Art Document] [Patent Document]

[專利文獻1]日本特開2016-181655號公報[Patent Document 1] Japanese Patent Laid-Open No. 2016-181655

[發明所欲解決之問題][Problem to be solved by the invention]

然而，專利文獻1記載之構成中，當在搬送容器內混載有相異尺寸的晶圓的情形下，料想無法區別是否發生混載。再者，必須在搬送容器的周圍配置對照感測器之專利文獻1記載的構成，會招致對照機構的大型化而佔據面積亦會變大，並且為了不讓來自對照感測器的照射光被搬送容器遮擋，會要求在搬送容器沒有遮蔽物、或是搬送容器由具有透光性的素材來形成，因此會有可適用的搬送容器受限定之問題。However, in the configuration described in Patent Document 1, when wafers of different sizes are mixed in the transfer container, it is expected that it is impossible to distinguish whether or not the mixed loading occurs. In addition, the configuration described in Patent Document 1, which requires the collation sensor to be arranged around the transport container, will increase the size of the collation mechanism and increase the occupied area. The shielding of the conveying container requires that there is no shield on the conveying container, or the conveying container is formed of a light-transmitting material, so there is a problem that the applicable conveying container is limited.

此外，處理相異尺寸的晶圓之載入埠中，作為設計成能夠共用對照裝置之技術，亦有人提議一種對照裝置，是把將檢測波的照射軸朝向左右的水平方向之對照感測器安裝在朝上下方向移動之對照臂，而令將檢測波的照射軸朝向左右的水平方向之第1伸出感測器往對照感測器的移動方向遠離而安裝在對照元件，又，設置將檢測波的照射軸朝向對照感測器的上下移動方向之第2伸出感測器(參照日本特開2015-211164號公報)。In addition, as a technology designed to be able to share a comparison device in a load port that handles wafers of different sizes, a comparison device is also proposed. Installed on the contrast arm that moves up and down, and the first protruding sensor that directs the irradiation axis of the detection wave toward the horizontal direction of the left and right is installed on the contrast element away from the moving direction of the contrast sensor. The irradiation axis of the detection wave is directed toward the second protruding sensor in the vertical movement direction of the sensor (refer to Japanese Patent Application Laid-Open No. 2015-211164).

按照這樣的對照裝置，當將對照感測器***至最小尺寸的搬送容器的內部，而在搬送容器內令其朝上下方向移動時，可藉由第1伸出感測器檢測可能會和對照感測器衝撞之伸出的晶圓，並且可藉由第2伸出感測器檢測比對照感測器還先行移動而可能會和第1伸出感測器衝撞之伸出的晶圓。According to such a collation device, when the collation sensor is inserted into the interior of the smallest-sized transport container and moved in the vertical direction in the transport container, it is possible to detect a possible conflict with the collation by the first protruding sensor. The protruding wafer collides with the sensor, and the protruding wafer that may collide with the first protruding sensor can be detected by the second protruding sensor that moves ahead of the control sensor.

然而，這樣的對照裝置，除了對照感測器以外，還需要第1伸出感測器及第2伸出感測器，因此會有感測器數量增加而構造變得複雜，成本亦增大之問題。However, such a comparison device requires a first extension sensor and a second extension sensor in addition to the comparison sensor, so the number of sensors increases, the structure becomes complicated, and the cost increases. question.

本發明係著眼於這樣的待解問題而研發，主要目的在於提供一種無需大幅變更以往的載入埠的構成，而可檢測在經過中間工程前後平面尺寸相異之搬送對象物彼此被混載(包括誤投入/誤積載)於搬送容器，而有助於半導體製造中的運用率(utilization rate)提升之載入埠、及載入埠中的對照處理方法。另，本發明，不限定於中間處理後的搬送對象物的平面尺寸和環狀框的平面尺寸相依之態樣，為一可通盤適用於中間工程前的搬送對象物與中間工程後的搬送對象物的平面尺寸相異之態樣之技術。 [解決問題之技術手段]The present invention was developed focusing on such problems to be solved, and the main purpose is to provide a configuration that does not require a large change to the conventional loading port, and can detect that objects to be transported that are different in planar size before and after the intermediate process are mixed with each other (including Misplacement/misplacement) in the transfer container, which contributes to the improvement of the utilization rate (utilization rate) in the semiconductor manufacturing loading port, and the comparison processing method in the loading port. In addition, the present invention is not limited to the aspect that the planar size of the object to be conveyed after the intermediate treatment is dependent on the planar size of the annular frame, and is applicable to both the object to be conveyed before the intermediate process and the object to be conveyed after the intermediate process. The technology of different aspects of the plane size of the object. [Technical means to solve the problem]

亦即本發明，係有關和在內部具備了搬送機器人之搬送室共同構成EFEM之載入埠。本發明中，於載入埠和搬送室並排之前後方向，將載入埠側定義為前方，將搬送室側定義為後方。That is, the present invention is concerned with constituting the loading port of EFEM together with a transfer chamber equipped with a transfer robot inside. In the present invention, in the front-rear direction where the loading port and the transfer chamber are arranged side by side, the loading port side is defined as the front, and the transfer chamber side is defined as the rear.

本發明之載入埠，具備：平板狀的框，以站立姿勢併設於搬送室且具有可供第1搬送對象物以略水平姿勢通過之開口部；及載置桌台，可載置第1搬送容器即FOUP；及載入埠門，可和FOUP所具有之FOUP門卡合，且可將框的開口部開閉；及就座保持機構，將從外部被搬送來的FOUP保持於載置桌台上；及門開閉機構，令載入埠門移動至朝搬送室側後退之門開放位置，藉此將框的開口部設為開狀態；及牽引機構，在相對於框而言以朝前方突出之姿勢配置之載置桌台上，令FOUP在就座位置與搬送對象物授受位置之間朝前後方向移動；及對照機構，於藉由門開閉機構將開口部設為了開狀態之狀態下，對照有關包括位於搬送對象物授受位置的FOUP內的各狹槽中的第1搬送對象物的有無之狀態之資訊；及控制部，掌控該些各機構(就座保持機構、牽引機構、門開閉機構、及對照機構)的動作。此處，作為本發明中的第1搬送對象物，能夠舉出晶圓。此外，若搬送對象物例如為晶圓，則用來搬送搬送對象物之搬送室為晶圓搬送室。The loading port of the present invention is provided with: a flat frame, which is set in the transfer chamber in a standing posture and has an opening through which the first object to be transferred can pass in a substantially horizontal posture; and a loading table on which the first object can be placed. The transfer container is the FOUP; and the loading port door, which can be engaged with the FOUP door of the FOUP, and can open and close the opening of the frame; and the seat holding mechanism, which holds the FOUP transferred from the outside on the loading table on the platform; and the door opening and closing mechanism, so that the loading port door moves to the door opening position retreating toward the transfer chamber side, thereby setting the opening of the frame to an open state; and the traction mechanism, facing forward relative to the frame On the loading table with a prominent posture configuration, the FOUP can be moved in the front and rear direction between the seating position and the delivery and receiving position; and the control mechanism, when the opening is set to the open state by the door opening and closing mechanism , comparing the information about the presence or absence of the first object to be conveyed in each slot in the FOUP including the receiving and receiving position of the object to be conveyed; Opening and closing mechanism, and control mechanism) action. Here, a wafer can be mentioned as the first object to be conveyed in the present invention. In addition, if the object to be transferred is, for example, a wafer, the transfer chamber used to transfer the object to be transferred is a wafer transfer chamber.

此外，本發明中的搬送機器人，只要是配置於搬送室內之物即可，能夠利用已知之物。另，搬送機器人，可為不構成本發明的載入埠的一部分之物，亦可為構成本發明的載入埠的一部分之物。作為搬送機器人，已知有構成為在連結了複數個臂要素的連桿機構的先端部設置機械手，而可藉由此機械手把持搬送對象物在搬送容器與搬送室之間做取出放入之物。然而，本發明中的搬送機器人不限定於此類型。In addition, as the transfer robot in the present invention, any known one can be used as long as it is arranged in the transfer chamber. In addition, the transfer robot may not constitute a part of the loading port of the present invention, or may constitute a part of the loading port of the present invention. As a transfer robot, there is known a configuration in which a manipulator is provided at the tip of a link mechanism that connects a plurality of arm elements, and the manipulator can grasp the object to be transported and take it out and put it in between the transport container and the transport chamber. things. However, the transfer robot in the present invention is not limited to this type.

本發明中的對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐對照器且通過處於開狀態之開口部令對照器移動至可藉由對照感測器偵測FOUP中收容有第1搬送對象物之第1對照位置。此處，本發明中的對照移動部，可為滿足藉由門開閉機構而和載入埠門一起朝前後方向及上下方向動作之第1動作條件、及和門開閉機構獨立地動作之第2動作條件的雙方之物，或亦可為滿足其中一方之物。此外，本發明中，作為令對照器移動至第1對照位置之構成的具體例，能夠舉出藉由對照移動部全體傾動來令對照器往前方傾動而置放於第1對照位置之構成，或藉由對照移動部全體往前方滑動移動來令對照器往前方移動而置放於第1對照位置之構成。The collation mechanism in the present invention is equipped with: a collation device with a collation sensor at the tip; Detect the first collation position where the first object to be transported is stored in the FOUP. Here, the comparison moving part in the present invention can satisfy the first operation condition of moving in the front-back direction and the up-down direction together with the loading port door by the door opening and closing mechanism, and the second operation condition of independently operating with the door opening and closing mechanism. The thing of both sides of the action condition, or it can also be the thing that satisfies one of them. In addition, in the present invention, as a specific example of the configuration for moving the collation device to the first collation position, a configuration in which the collation device is tilted forward and placed at the first collation position by tilting the entire collation moving part , or by sliding and moving the entire control moving part forward to make the collation device move forward and place it at the first comparison position.

又，本發明之載入埠，其特徵為，控制部可執行：就座保持處理，藉由就座保持機構，把可將和第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽之第2搬送容器或FOUP保持於載置桌台上；及後方牽引處理，藉由牽引機構令載置桌台上的第2搬送容器或FOUP從就座位置移動至搬送對象物授受位置；及門開放處理，藉由門開閉機構將開口部設為開狀態；及第1對照處理，通過處於開狀態之開口部將對照器置放於第1對照位置而令其執行對照機構所做之對照處理；及第2對照處理，通過處於開狀態之開口部將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置而令其執行對照機構所做之對照處理；係選擇性地執行第1對照處理及第2對照處理的其中一方或雙方。In addition, the loading port of the present invention is characterized in that the control unit can execute: seat holding process, by means of the seat holding mechanism, the second transport object that can be different from the first transport object in planar size can be accommodated The second transport container or FOUP in the multi-stage slot is held on the loading table; and the rear traction processing, the second transport container or FOUP on the loading table is moved from the seating position to the transport object by the traction mechanism The receiving position; and the door opening process, the opening is set to the open state by the door opening and closing mechanism; and the first comparison process, the collation device is placed in the first comparison position through the open opening to make it perform the comparison The comparison treatment done by the organization; and the second comparison treatment, the comparison device is placed in the second transportation container which can detect the second transportation object contained in the second transportation container through the opening part in the open state. Comparing the position and ordering it to perform the comparison treatment done by the comparison institution; it is to selectively execute one or both of the first comparison treatment and the second comparison treatment.

此處，作為「和第1搬送對象物平面尺寸相異的第2搬送對象物」之一例，能夠舉出於中間工程後薄晶圓及保持它之環狀框的組合、或環狀框單體等，但不限定於此。另，薄晶圓，為連同平面尺寸比薄晶圓還大的環狀框受到搬送之物，因此規範第2搬送對象物的平面尺寸之部件並非薄晶圓，而是環狀框。當這樣的環狀框為第2搬送對象物的情形下，本發明中的「可將第2搬送對象物收容於多段式狹槽之第2搬送容器」，為可將環狀框多段式地收容之框匣，惟第2搬送容器亦不限定於此。Here, as an example of "the second object to be transferred that is different in planar size from the first object to be transferred", a combination of a thin wafer after the intermediate process and a ring-shaped frame holding it, or a ring-shaped frame sheet can be mentioned. body, etc., but not limited thereto. In addition, a thin wafer is transported together with a ring frame whose planar size is larger than that of the thin wafer, so the part that regulates the planar size of the second object to be transported is not the thin wafer but the ring frame. When such an annular frame is the second object to be conveyed, "the second object to be conveyed can be accommodated in a second conveying container in a multistage slot" in the present invention means that the annular frame can be placed in a multistage manner. The storage box is not limited to the second transport container.

按照這樣的本發明之載入埠，使用對照有關包括FOUP內的各狹槽中的第1搬送對象物的有無之狀態之資訊的對照機構，來執行第2對照處理，藉此便可對照有關包括第2搬送容器內的各狹槽中的第2搬送對象物的有無之狀態之資訊。According to such a loading port of the present invention, the second collation process is executed by using a collation mechanism that collates information on the presence or absence of the first object to be conveyed in each slot in the FOUP, thereby enabling collation of the relevant information. Information on the presence or absence of the second object to be conveyed in each slot in the second conveyance container is included.

又，當第2搬送對象物的平面尺寸比第1搬送對象物還大的情形下，對載置於載置桌台之第1搬送容器亦即FOUP內的每一狹槽進行判定是否收納有第2搬送對象物之第2對照處理，若偵測收納有第2搬送對象物，則便能掌握第2搬送對象物被誤投入於FOUP。此外，當在載置桌台上載置了第2搬送容器的情形下，如果對於和依第2對照處理而未收納有第2搬送對象物之資訊建立了關連之狹槽而言，第1對照處理的偵測結果為收納有第1搬送對象物之偵測結果，則便能掌握第1搬送對象物被誤投入於第2搬送容器。Also, when the planar size of the second object to be conveyed is larger than that of the first object to be conveyed, it is determined whether or not the first object to be conveyed is stored in each slot in the FOUP, which is the first conveyance container placed on the table. In the second collation process of the second object to be transported, if it is detected that the second object to be transported is stored, it can be grasped that the second object to be transported has been put into the FOUP by mistake. In addition, when the second transport container is placed on the mounting table, if the slot associated with the information that the second transport object is not stored according to the second collation process, the first collation If the detection result of the processing is the detection result that the first object to be conveyed is stored, it can be grasped that the first object to be conveyed has been mistakenly put into the second conveyance container.

像這樣，按照本發明之載入埠，利用至少具備了對照器及對照移動部之對照機構，基於第1對照處理的偵測結果、與第2對照處理的偵測結果(偵測資訊)的雙方或其中一方，可辨明平面尺寸相異的搬送對象物是否被混載於搬送容器內。是故，按照本發明之載入埠，無需大幅變更以往的載入埠的構成，避免對照機構的大型化及構造的複雜化，於中間工程以後，即使採用將平面尺寸相異的搬送對象物收容至載置於共通的載入埠上之FOUP(第1搬送容器)或第2搬送容器而取用之使用形態的情形下，仍可偵測相異的搬送對象物在FOUP或第2搬送容器中被誤混載(誤投入/誤積載)，而能夠謀求半導體製造中的運用率提升。In this way, according to the load port of the present invention, using the collation mechanism equipped with at least a collation device and a collation moving part, based on the detection result of the first collation process and the detection result (detection information) of the second collation process Both or one of them can identify whether objects to be transported with different planar dimensions are mixed in the transport container. Therefore, according to the loading port of the present invention, there is no need to greatly change the composition of the conventional loading port, avoiding the enlargement of the comparison mechanism and the complexity of the structure. In the case of being stored in the FOUP (the first transport container) or the second transport container loaded on the common loading port and used, it is still possible to detect the different transport objects in the FOUP or the second transport Misplacement (misplacement/misstowage) in the container can improve the utilization rate in semiconductor manufacturing.

另，即使當容許第1或第2搬送容器內混載第1或第2搬送對象物的情形下，按照本發明仍能藉由對照處理來掌握該混載的狀態。In addition, even when the mixed loading of the first or second objects to be transported in the first or second transport container is allowed, according to the present invention, the state of the mixed loading can be grasped by the collation process.

又，本發明中，是將第2對照處理執行時對照器被置放之第2對照位置，設定成和第1對照處理執行時對照器被置放之第1對照位置為相異位置。作為本發明之比較例，若為藉由置放於同一對照處理位置之對照器的對照感測器來偵測平面尺寸相異的搬送對象物之構成，則必須令相互平面尺寸相異的搬送對象物彼此的外緣的一部分切齊。然後，為了令平面尺寸相異的搬送對象物彼此的外緣的一部分切齊，不得不因應搬送對象物的平面尺寸來變更搬送機器人所做之搬送對象物的搬送距離或搬送位置，而被迫做繁雜的控制。另一方面，本發明之載入埠中，無需令載置桌台上的搬送對象物的中心依第1搬送對象物及第2搬送對象物而相異，作為搬送機器人的搬送控制能夠採用以往的簡單控制。是故，按照本發明，不會要求因應搬送對象物的平面尺寸來變更搬送機器人所做之搬送對象物的搬送距離或搬送位置，比起上述比較例會成為簡單的控制，亦有助於半導體製造中的運用率提升。Also, in the present invention, the second collation position where the collation device is placed when the second collation process is executed is set to be different from the first collation position where the collation device is placed when the first collation process is performed. As a comparative example of the present invention, if the collation sensor of the comparator placed in the same collation processing position detects the composition of the conveyed objects with different plane sizes, it is necessary to make the conveyance objects with different plane sizes A part of the outer edge of each object is aligned. Then, in order to align parts of the outer edges of the objects to be conveyed with different planar dimensions, the conveying distance or the conveying position of the conveyed object by the conveying robot has to be changed according to the planar size of the conveyed object, and it is forced to Do complex controls. On the other hand, in the loading port of the present invention, it is not necessary to make the center of the object to be conveyed on the table stand different according to the first object to be conveyed and the second object to be conveyed, and the conventional method can be adopted as the conveying control of the conveying robot. simple controls. Therefore, according to the present invention, it is not required to change the conveying distance or conveying position of the conveying object made by the conveying robot in response to the planar size of the conveying object, which will become a simpler control than the above-mentioned comparative example, and also contribute to semiconductor manufacturing. Increased utilization in .

本發明中的「第1對照位置」及「第2對照位置」，可因應第1搬送對象物及第2搬送對象物的平面尺寸而適當設定，惟作為第1對照位置的良好例子，能夠舉出對照感測器被配置於比框當中面向搬送室之後壁面(最接近搬送室之壁面)還前方之位置，作為第2對照位置的良好例子，能夠舉出對照感測器被配置於比框的後壁面還後方之位置。又，本發明中，可設定成於將對照器置放於第1對照位置之狀態下令對照移動部做升降動作藉此進行第1對照處理，並且於將對照器置放於第2對照位置之狀態下令對照移動部做升降動作藉此進行第2對照處理。The "first collation position" and "second collation position" in the present invention can be appropriately set in response to the planar dimensions of the first object to be conveyed and the second object to be conveyed, but as a good example of the first collation location, The out-of-control sensor is arranged at a position in front of the rear wall facing the transfer chamber (the wall closest to the transfer chamber) in the middle of the frame. The rear wall is also the rear position. Also, in the present invention, it can be set to order the collation moving part to perform a lifting action in the state where the collation device is placed at the first comparison position, so as to perform the first comparison process, and after placing the collation device at the second comparison position The second collation process is performed by commanding the collation moving part to move up and down according to the status.

再加上，本發明之載入埠中，若控制部為具有判別藉由就座保持機構保持了FOUP或第2搬送容器的哪一者之容器判別部之物，則可基於容器判別部所做的判別資訊，基於事先設定好的動作序列如就座保持處理、門開放處理、後方牽引處理、第1對照處理、第2對照處理的順序，或進行第1對照處理及第2對照處理雙方、或是僅進行其中一方的對照處理等，來自動控制各機構的動作。In addition, in the loading port of the present invention, if the control unit has a container discriminating unit that discriminates which of the FOUP or the second transport container is held by the seat holding mechanism, it can be based on the container discriminating unit. The judgment information to be made is based on the pre-set sequence of actions such as the order of the seat keeping process, the door opening process, the rear traction process, the first control process, and the second control process, or both the first control process and the second control process , or only one of the comparison processing, etc., to automatically control the action of each mechanism.

特別是，本發明中較佳是，控制部，當容器判別部判斷出藉由就座保持機構保持了第2搬送容器的情形下，依序執行了就座保持處理、門開放處理、後方牽引處理之後，執行第1對照處理及第2對照處理雙方。此為本發明特有的動作序列，是為了避免當第2搬送容器於前後方向的尺寸比FOUP還大的情形下，若比門開放處理還先進行了後方牽引處理的情形下第2搬送容器會衝撞載入埠門這樣的事態。另，第1對照處理與第2對照處理的順序並無特別限定。另，前後方向的尺寸比FOUP還大之第2搬送容器中收容的第2搬送對象物，為比第1搬送對象物還大的平面尺寸。能夠藉由進行判定第2搬送對象物的有無之第2對照處理、及判定第1搬送對象物的有無之第1對照處理的雙方，來提高偵測這樣的第2搬送容器中混載第1搬送對象物與第2搬送對象物之對照精度。In particular, in the present invention, it is preferable that the control unit sequentially executes the seat holding process, the door opening process, and the rear pulling process when the container judging unit judges that the second transport container is held by the seat holding mechanism. After the processing, both the first collation processing and the second collation processing are executed. This is an action sequence unique to the present invention, in order to avoid that when the size of the second transport container in the front-rear direction is larger than that of the FOUP, if the rear traction process is performed before the door opening process, the second transport container will A situation such as a collision loading port gate. In addition, the order of the first control treatment and the second control treatment is not particularly limited. In addition, the second object to be conveyed stored in the second conveyance container having a dimension in the front-rear direction larger than that of the FOUP has a planar size larger than that of the first object to be conveyed. By performing both the second collation process for judging the presence or absence of the second object to be conveyed and the first collation process for judging the presence or absence of the first object to be conveyed, it is possible to improve the detection of the mixed loading of the first conveyance object in the second conveyance container. The comparison accuracy between the object and the second object to be conveyed.

此外，本發明係有關一種具備了對照機構之載入埠中的對照處理方法，該對照機構是被用於用來在可將複數片的第1搬送對象物存儲於多段式狹槽之第1搬送容器與搬送室之間授受第1搬送對象物，而對照有關包括第1搬送容器的各狹槽中的第1搬送對象物的有無之狀態之資訊，其特徵為，作為載入埠，適用構成為可與第2搬送容器之間授受第2搬送對象之物，該第2搬送容器係可將和第1搬送對象物平面尺寸相異的第2搬送對象物存儲複數個於多段式狹槽，作為對照機構，適用具備：對照器，在先端部具有對照感測器；及對照移動部，支撐對照器且令對照器移動至可藉由對照感測器偵測第1搬送容器中收容有第1搬送對象物之第1對照位置之物，選擇性地執行：第1對照處理，將對照器置放於第1對照位置而令其執行對照機構所做之對照處理；及第2對照處理，將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置而執行對照處理；的其中一方或雙方。In addition, the present invention relates to a collation processing method in a loading port provided with a collation mechanism for storing a plurality of first conveying objects in a first multi-stage slot. The information about the presence or absence of the first object to be conveyed in each slot including the first conveyance container is compared between the transfer container and the transfer chamber for receiving and receiving the first object to be conveyed, and is characterized in that, as the loading port, the The second conveying object can be transferred to and received from the second conveying container, and the second conveying container can store a plurality of second conveying objects different in plane size from the first conveying object in the multi-stage slot , as a comparison mechanism, it is applicable to have: a comparison device, which has a comparison sensor at the tip; The object in the first comparison position of the first object to be transported is selectively executed: the first comparison treatment, placing the collation device at the first comparison position and making it perform the comparison treatment done by the comparison institution; and the second comparison treatment , placing the collation device at the second collation position where the collation sensor detects that the second conveying object is accommodated in the second conveying container to perform the collation process; one or both of them.

若為這樣的對照處理方法，會發揮如同上述的載入埠所發揮的種種作用效果之作用效果，能夠謀求半導體製造中的運用率提升。特別是，本發明中較佳是，第1搬送對象物及第2搬送對象物是在第1搬送容器或第2搬送容器內將彼此的中心位置以相互一致之方式被收容之狀態下執行對照處理(第1對照處理、第2對照處理)。 [發明之功效]According to such a comparison processing method, various functions and effects similar to those exerted by the above-mentioned load port can be exerted, and the utilization rate in semiconductor manufacturing can be improved. In particular, in the present invention, it is preferable that the first object to be conveyed and the second object to be conveyed are compared in a state where their center positions are accommodated in the first conveyance container or the second conveyance container so as to coincide with each other. Treatment (1st control treatment, 2nd control treatment). [Efficacy of Invention]

本發明，於半導體製造工程中，為一種載入埠及對照處理方法，係具備了對照機構之載入埠中的對照處理方法，該對照機構是被用於用來在可與將複數片的晶圓存儲於多段式狹槽之第1搬送容器之間授受晶圓等的第1搬送對象物，而對照有關包括第1搬送容器的各狹槽中的第1搬送對象物的有無之狀態之資訊，其特徵為，構成為可與第2搬送容器之間授受第1搬送對象物，該第2搬送容器係可將平面尺寸比第1搬送對象物還大的第2搬送對象物存儲複數個於多段式狹槽，作為對照機構，適用具備：對照器，在先端部具有對照感測器；及對照移動部，支撐對照器而可藉由門開閉機構和載入埠門一起動作，且可和門開閉機構獨立地動作之物，可執行：第1對照處理，將對照器置放於可藉由對照感測器偵測FOUP中收容有第1搬送對象物之第1對照位置而令其執行對照處理；及第2對照處理，將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置而執行對照處理；係選擇性地執行第一對照處理及第二對照處理的其中一方或雙方。The present invention is a loading port and collation processing method in semiconductor manufacturing engineering. It is a collation processing method in a loading port equipped with a collation mechanism. The collation mechanism is used to compare multiple chips. Wafers are stored between the first transfer containers in the multi-stage slots, and the first transfer objects such as wafers are transferred and received, and the state of the presence or absence of the first transfer objects in each slot including the first transfer container is compared. The information is characterized in that it is configured to be able to transfer the first object to be conveyed to and from the second conveyance container, and the second conveyance container can store a plurality of second objects to be conveyed that are larger in plane size than the first object to be conveyed In the multi-stage slot, as the collation mechanism, it is suitable to have: a collation, which has a collation sensor at the tip; Objects that act independently of the door opening and closing mechanism can perform: the first comparison process, placing the comparison device at the first comparison position that can detect the first object to be transported in the FOUP through the comparison sensor to make it Execute the comparison treatment; and the second comparison treatment, place the comparison device at the second comparison position where the second transportation object can be detected by the comparison sensor to detect the second transportation object in the second transportation container, and perform the comparison treatment; it is optional One or both of the first control process and the second control process are performed in a timely manner.

也就是說，本發明，採用了下述這樣嶄新的技術思想，即，使用簡單的構成之對照機構，構成為可執行第1對照處理及第2對照處理，而選擇性地執行第1對照處理及第2對照處理的一方或雙方。按照基於這樣的技術思想之本發明，能夠提供一種避免對照機構的大型化及構造的複雜化，而可於經過中間處理工程前後在共通的載入埠上的第1搬送容器即FOUP或第2搬送容器中偵測是否有平面尺寸相異的搬送對象物混載，而有助於半導體製造中的運用率提升之載入埠、及載入埠中的對照處理方法。That is to say, the present invention adopts such a novel technical idea as follows, that is, using a collation mechanism with a simple structure, it is configured to be able to perform the first collation process and the second collation process, and selectively execute the first collation process And one or both of the second control treatment. According to the present invention based on such a technical idea, it is possible to provide a first transfer container, FOUP, or a second transfer container that can be placed on a common loading port before and after an intermediate processing process without increasing the size of the comparison mechanism and complicating the structure. It detects whether objects to be transported with different planar dimensions are mixed in the transport container, which contributes to the improvement of the utilization rate in semiconductor manufacturing, and the comparison processing method in the load port.

以下參照圖面，說明本發明之一實施形態。One embodiment of the present invention will be described below with reference to the drawings.

本實施形態之載入埠1，例如為用於半導體的製造工程中，如圖1及圖2所示，在無塵室內，構成搬送室2的壁面的一部分，用來在搬送室2與FOUP3等的搬送容器3之間進行晶圓W等搬送對象物的取出放入之物。載入埠1，構成EFEM(Equipment Front End Module；前端設備模組)的一部分，為作用成為搬送容器3與搬送室2的介面部分之物。EFEM中取用的晶圓W的尺寸被標準化為SEMI (Semiconductor Equipment and Materials International；國際半導體設備暨材料協會)規格，本實施形態中適用直徑300(半徑150)mm的晶圓W。The loading port 1 of this embodiment is, for example, used in the manufacturing process of semiconductors. As shown in FIGS. The objects to be transported such as wafer W are taken out and placed between transport containers 3 such as wafers W and the like. The loading port 1 constitutes a part of an EFEM (Equipment Front End Module) and functions as an interface between the transfer container 3 and the transfer chamber 2 . The size of the wafer W used in EFEM is standardized to the SEMI (Semiconductor Equipment and Materials International; International Semiconductor Equipment and Materials Association) standard, and a wafer W with a diameter of 300 (radius 150) mm is applicable in this embodiment.

本實施形態中的FOUP3，如圖1模型化示意般，具備可通過搬出入口31而將內部空間3S僅朝後方開放之FOUP本體32、及可將搬出入口31開閉之FOUP本體32。FOUP3，在內部設置多段式狹槽，構成為可在各狹槽收容搬送對象物W亦即晶圓W，而構成為可透過搬出入口31將該些晶圓W取出放入之已知之物。後述的圖8模型化地示意在FOUP3內的狹槽34收容了晶圓W之狀態。在FOUP本體32的向上面，設置供自動地搬送搬送容器3的裝置(例如OHT：Over Head Transport)等把持之凸緣部35。The FOUP 3 in this embodiment includes a FOUP main body 32 capable of opening the internal space 3S only to the rear through a carry-out entrance 31 as shown in the schematic diagram of FIG. 1 , and a FOUP main body 32 capable of opening and closing the carry-out entrance 31 . The FOUP 3 is provided with multi-stage slots inside, and is configured to accommodate wafers W which are objects W to be transported in each slot, and is configured to be a known thing that can take out and put in these wafers W through the carry-out port 31 . FIG. 8 , which will be described later, schematically shows a state in which wafers W are accommodated in slots 34 in FOUP 3 . On the upper surface of the FOUP main body 32, a flange portion 35 to be gripped by a device (for example, OHT: Over Head Transport) that automatically transports the transport container 3 is provided.

本實施形態之載入埠1，如圖2至圖6等所示，具備：呈板狀的框4，構成搬送室2的壁面的一部分，且形成有用來將搬送室2的內部空間2S開放之開口部41；及載置桌台5，相對於框4而言令其以朝前方突出之略水平姿勢設置；及就座保持機構6，將從外部被搬送來的FOUP3保持於載置桌台5上；及牽引機構7，在載置桌台5上令FOUP3在就座位置與搬送對象物授受位置之間朝前後方向D移動；及載入埠門8，將框4的開口部41開閉；及門開閉機構9，令載入埠門8移動至朝搬送室2側後退之門開放位置(O)，藉此將框4的開口部41設為開狀態；及對照機構M，於藉由門開閉機構9而將框4的開口部41設為開狀態之狀態下，對照有關包括位於搬送對象物授受位置之FOUP3內的各狹槽34中有無晶圓W(相當於本發明之「第1搬送對象物」)的狀態之資訊。The loading port 1 of this embodiment, as shown in FIGS. The opening 41 of the frame; and the loading table 5, which is set in a substantially horizontal posture protruding forward with respect to the frame 4; and the seat holding mechanism 6, which holds the FOUP3 transported from the outside on the loading table On the platform 5; and the traction mechanism 7, on the loading table 5, the FOUP3 is moved in the front and rear direction D between the seating position and the conveying object receiving position; and the loading port door 8, the opening 41 of the frame 4 Opening and closing; and the door opening and closing mechanism 9, so that the loading port door 8 is moved to the door open position (O) retreating towards the transfer chamber 2 side, thereby setting the opening 41 of the frame 4 to an open state; and the contrasting mechanism M, in In the state where the opening 41 of the frame 4 is opened by the door opening and closing mechanism 9, the presence or absence of the wafer W (corresponding to the present invention) in each slot 34 including the FOUP 3 located at the transfer object receiving position is compared. Information on the state of "the first object to be transported").

框4，以起立姿勢配置，為一具有可和載置於載置桌台5上的FOUP3的搬出入口連通之大小的開口部41之略矩形板狀之物。圖1模型化地揭示框4的開口部41。本實施形態之載入埠1，藉由框4來構成搬送室2的壁面的一部分。在框4的下端，設置具有腳輪及設置腳之腳部42。The frame 4 is placed in a standing posture and is a substantially rectangular plate-shaped object having an opening 41 of a size that can communicate with the carry-out entrance of the FOUP 3 placed on the loading table 5 . FIG. 1 schematically shows the opening 41 of the frame 4 . The loading port 1 of the present embodiment has a frame 4 constituting a part of the wall surface of the transfer chamber 2 . At the lower end of the frame 4, a foot part 42 having casters and a foot is provided.

載置桌台5，設於在框4當中比高度方向中央還稍靠上方的位置以略水平姿勢配置之水平基台50(支撐台)的上部，為一在FOUP本體32和框4相向之朝向下可載置FOUP3之物。如圖4所示，在載置桌台5，設置令其向上突出之複數個突起51，藉由令該些突起51卡合至形成於FOUP3的底面之孔(圖示省略)，來謀求載置桌台5上的FOUP3之定位。The loading table 5 is set on the upper part of the horizontal base 50 (supporting platform) arranged in a slightly horizontal posture at a position slightly above the center in the height direction of the frame 4, and is a place where the FOUP body 32 and the frame 4 face each other. Facing downwards, FOUP3 can be loaded. As shown in FIG. 4, on the loading table 5, a plurality of protrusions 51 protruding upward are provided, and these protrusions 51 are engaged with holes (not shown) formed on the bottom surface of the FOUP 3 to achieve loading. Position the FOUP3 on the table 5.

就座保持機構6，為一將設於載置桌台5的鎖定爪61(參照圖5)設為鉤住而固定至設於FOUP3的底面之被鎖定部(圖示省略)的鎖定狀態，藉此將FOUP3保持於載置桌台5上之物。此外，本實施形態之載入埠1中，藉由解除對於被鎖定部之鎖定爪61的鎖定狀態，能夠將FOUP3設為可從載置桌台5遠離之狀態。The seating holding mechanism 6 is in a locked state in which the locking claw 61 (see FIG. 5 ) provided on the mounting table 5 is hooked and fixed to a locked portion (not shown) provided on the bottom surface of the FOUP 3 , Thereby, the FOUP 3 is held on the mounting table 5 . In addition, in the loading port 1 of the present embodiment, by releasing the locked state of the locking claw 61 of the locked portion, the FOUP 3 can be set in a state where it can be separated from the mounting table 5 .

牽引機構7，為一在載置桌台5上令FOUP3在FOUP本體32從載入埠門8遠離規定距離之位置亦即就座位置、與使FOUP本體32緊貼載入埠門8之位置亦即搬送對象物授受位置之間朝前後方向D移動之物。牽引機構7，是使用令載置桌台5前後移動之未圖示之滑軌等來構成。就座保持機構6及牽引機構7，亦能想成是載置桌台5所具備之機構。The traction mechanism 7 is a position where the FOUP 3 is seated at a position where the FOUP body 32 is away from the loading port door 8 by a predetermined distance on the loading table 5, and a position where the FOUP body 32 is close to the loading port door 8 That is, the object to be conveyed moves in the front-back direction D between the receiving and receiving positions. The traction mechanism 7 is configured using a slide rail (not shown) or the like which moves the loading table 5 back and forth. Seating holding mechanism 6 and traction mechanism 7 can also be thought of as the mechanisms that the table 5 is placed on.

另，圖1中，作為載置桌台5上的FOUP3之載置狀態，係簡化示意成FOUP3的底面接觸載置桌台5的上面之狀態。然而，實際上，比載置桌台5的上面還朝上方突出之複數個突起51，會卡合至形成於FOUP3的底面之有底的孔，藉此支撐FOUP3，而載置桌台5的上面與FOUP3的底面被規定成相互不接觸，在載置桌台5的上面與FOUP3的底面之間會形成規定的間隙。In addition, in FIG. 1 , as a state in which the FOUP 3 is placed on the placement table 5 , the state in which the bottom surface of the FOUP 3 is in contact with the upper surface of the placement table 5 is simplified and illustrated. However, actually, a plurality of protrusions 51 that protrude upward from the top of the table 5 are engaged with bottomed holes formed on the bottom of the FOUP 3 to support the FOUP 3 and place the table 5. The upper surface and the bottom surface of the FOUP 3 are defined so as not to be in contact with each other, and a predetermined gap is formed between the upper surface of the mounting table 5 and the bottom surface of the FOUP 3 .

本發明及本實施形態中，在載置於載置桌台5的FOUP3和框4並排之前後方向D(參照圖1等)，將FOUP3側定義成前方、框4側定義成後方。In the present invention and this embodiment, in the front-rear direction D (refer to FIG. 1 etc.) where FOUP 3 and frame 4 placed on the mounting table 5 are aligned, the FOUP 3 side is defined as the front and the frame 4 side is defined as the rear.

載入埠門8，為一可在將框4的開口部41密閉之全閉位置(C)、及比全閉位置(C)還朝搬送室2側後退之門開放位置(O)、及使開口部41的開口空間朝後方完全開放之全開位置(圖示省略)之間移動之物。載入埠門8，具備可吸附而保持FOUP本體32之卡合部81(參照圖4)，構成為可維持與FOUP本體32之卡合狀態而和FOUP本體32一體地在全閉位置(C)、門開放位置(O)及全開位置之間移動。本實施形態中，是將全閉位置(C)、門開放位置(O)及被置放了的載入埠門8的姿勢設定成同一姿勢。又，全開位置與全閉位置(C)之間的載入埠門8的移動路徑，係由令位於全閉位置(C)的載入埠門8維持其高度位置而往搬送室2側移動至門開放位置(O)為止之路徑(水平路徑)、及令位於門開放位置(O)的載入埠門8維持其前後位置而往下方移動至全開位置為止之路徑(鉛直路徑)所構成。為了讓置放至門開放位置(O)的載入埠門8能夠朝鉛直方向及水平方向的任一者移動，被保持於置放至門開放位置(O)的載入埠門8之FOUP本體32，係和載入埠門8一起被置放至比框4還後方的位置(從FOUP本體32完全地遠離，而被配置於搬送室2的內部空間2S之位置)。The loading port door 8 is a fully closed position (C) that seals the opening 41 of the frame 4, and a door open position (O) that retreats toward the transfer chamber 2 side from the fully closed position (C), and It is a thing that moves between the fully open position (not shown) where the opening space of the opening 41 is completely opened toward the rear. The loading port door 8 is equipped with an engaging portion 81 (referring to FIG. 4 ) that can absorb and hold the FOUP body 32, and is configured to maintain the engaged state with the FOUP body 32 and to be integrally in the fully closed position (C) with the FOUP body 32. ), the door open position (O) and the fully open position. In this embodiment, the fully closed position (C), the door open position (O), and the postures of the placed loading port door 8 are set to the same posture. Also, the moving path of the loading port door 8 between the fully open position and the fully closed position (C) is to move toward the transfer chamber 2 side by keeping the loading port door 8 at the fully closed position (C) at its height position. Consists of the path (horizontal path) to the door open position (O) and the path (vertical path) that keeps the loading port door 8 at the door open position (O) in its front-back position and moves downward to the fully open position . In order to allow the loading port door 8 placed at the door open position (O) to move in either the vertical direction or the horizontal direction, the FOUP held on the loading port door 8 placed at the door open position (O) The main body 32 is placed at a position behind the frame 4 together with the loading port door 8 (a position completely away from the FOUP main body 32 and placed in the inner space 2S of the transfer chamber 2).

這樣的載入埠門8之移動，是藉由設於載入埠1之門開閉機構9而實現。門開閉機構9，為一令載入埠門8移動至門開放位置(O)或全開位置，藉此透過設為開狀態之框4的開口來使FOUP3的內部空間連通至搬送室2之物。門開閉機構9，例如是使用將支撐載入埠門8的支撐框80以可朝前後方向D移動之方式予以支撐之可動塊體(圖示省略)、或將可動塊體以可朝上下方向H移動之方式予以支撐之滑軌(圖示省略)來構成，為一令致動器等驅動源(圖示省略)作動，而使載入埠門8朝前後方向D及上下方向H移動之物。另，雖亦可為分別具備前後移動用的致動器、及上下移動用的致動器之態樣，但就零件數刪減這一點而言，以共通的致動器作為驅動源來進行載入埠門8的前後移動及上下移動之態樣較為優良。Such movement of the loading port door 8 is realized by the door opening and closing mechanism 9 provided in the loading port 1 . The door opening and closing mechanism 9 is a thing that makes the loading port door 8 move to the door open position (O) or the fully open position, thereby making the internal space of the FOUP3 communicate with the transfer chamber 2 through the opening of the frame 4 set to the open state . The door opening and closing mechanism 9 is, for example, a movable block (not shown) that supports the support frame 80 that supports the loaded port door 8 in a manner that can move forward and backward. The way H moves is formed by supporting slide rails (not shown in the figure), which are used to activate a driving source such as an actuator (not shown in the figure), so that the loading port door 8 moves in the front-back direction D and the up-down direction H. things. In addition, although the actuator for forward and backward movement and the actuator for vertical movement can be separately provided, in terms of reducing the number of parts, a common actuator is used as a drive source. The forward and backward movement and up and down movement of the loading port 8 are relatively good.

本實施形態之載入埠門8，具備連結切換機構82，係將FOUP門32與FOUP本體32之卡合狀態(閂鎖狀態)解除而造出可將FOUP門32從FOUP本體32拆卸之狀態(解閂鎖狀態)(參照圖4)。The loading port door 8 of the present embodiment is equipped with a connection switching mechanism 82, which releases the engaged state (latch state) between the FOUP door 32 and the FOUP body 32 to create a state where the FOUP door 32 can be detached from the FOUP body 32. (Unlatched state) (refer to FIG. 4).

對照機構M，如圖3、圖5及圖8等所示，在先端部具備：對照器M2，具有可檢測藉由設於FOUP3內的多段式狹槽34而於高度方向H被多段狀地收納之搬送對象物W的有無之對照感測器M1(發送器M11、接收器M12)；及對照臂M3(相當於本發明之「對照移動部」)，支撐對照器M2；為一可檢測FOUP3內的搬送對象物W的有無或收納姿勢之物。圖8模型化地揭示於FOUP3內被載置於狹槽34之晶圓W(第1搬送對象物)的收容狀態。The collation mechanism M, as shown in Fig. 3, Fig. 5 and Fig. 8, etc., is provided at the tip part: a collation device M2, which can detect the multi-stage shape in the height direction H by the multi-stage slot 34 provided in the FOUP3. The contrast sensor M1 (transmitter M11, receiver M12) of the presence or absence of the conveyed object W received; and the contrast arm M3 (equivalent to the "contrast moving part" of the present invention), which supports the contrast device M2; The presence or absence of the conveyed object W in FOUP3 or the object of the storage posture. FIG. 8 schematically shows the storage state of the wafer W (first object to be transported) placed on the slot 34 in the FOUP 3 .

對照器M2，如圖8所示，為以從對照臂M3的規定處朝前方突出之形態，於寬幅方向相隔規定距離並設左右一對，而在先端部安裝有對照感測器M1之物。對照感測器M1，由發出訊號亦即光束(線型光)之發送器M11(發光感測器)、及接收從發送器M11發出的訊號之接收器M12(受光感測器)所構成。另，亦可藉由發送器、及將從發送器發出的線型光朝向發送器反射之反射部來構成對照感測器M1。在此情形下，發送器還具有身為接收器之機能。如圖8所示，為了讓將光軸ML朝向左右的水平方向之對照感測器M1(M11、M12)於對照處理時不會干涉偵測對象亦即搬送對象物W，係將對照感測器M1(M11、M12)彼此的左右的跨距因應搬送對象物W的平面尺寸而設定成適當的值。The comparator M2, as shown in FIG. 8, is in the form of protruding forward from a predetermined position of the collation arm M3, and a left and right pair is arranged at a predetermined distance in the width direction, and a collation sensor M1 is installed at the tip. thing. The contrast sensor M1 is composed of a transmitter M11 (luminescence sensor) that emits a signal, that is, a light beam (linear light), and a receiver M12 (light-receiving sensor) that receives a signal from the transmitter M11. In addition, the contrast sensor M1 may be constituted by a transmitter and a reflector that reflects the linear light emitted from the transmitter toward the transmitter. In this case, the transmitter also functions as a receiver. As shown in Figure 8, in order to prevent the collation sensor M1 (M11, M12) with the optical axis ML facing the left and right horizontal direction from interfering with the detection object, that is, the conveying object W during the collation process, the collation sensor The left and right distance between the devices M1 ( M11 , M12 ) is set to an appropriate value in accordance with the planar size of the object W to be conveyed.

對照臂M3，為一令於前後方向D之對照器M2的位置，在圖8(ii)所示位置亦即可通過處於開狀態的開口部41而藉由對照感測器M1偵測FOUP3中收容有晶圓W之第1對照位置(P1)、與圖8(i)所示位置亦可不可藉由對照感測器M1偵測FOUP3中收容有晶圓W之不能對照晶圓位置(P2)之間移動之物。本實施形態之對照臂M3，如圖3所示，呈框狀，一體或一體性地具有上框部M31、及從上框部M31的兩端各自朝下方延伸之左右一對的側框部M32、及設於兩側框部M32的下端部間之下框部M33，而構成為在藉由該些上框部M31、兩側框部M32及下框部M33被圍繞之朝前後方向D開口的對照臂M3的內部空間MS，能夠收容載入埠門8本體、以及從搬送室2側被覆載入埠門8的周邊部件之門罩83。The comparison arm M3 is the position of the comparison device M2 in the front-rear direction D. In the position shown in FIG. The first collation position (P1) containing the wafer W and the position shown in FIG. ) between things that move. The control arm M3 of this embodiment, as shown in FIG. 3 , is in a frame shape and integrally or integrally has an upper frame portion M31 and a pair of left and right side frame portions extending downward from both ends of the upper frame portion M31. M32, and the lower frame portion M33 disposed between the lower ends of the both side frame portions M32, and constituted in the front-rear direction D surrounded by the upper frame portion M31, the both side frame portions M32, and the lower frame portion M33. The inner space MS of the opening control arm M3 can accommodate the main body of the loading port door 8 and the door cover 83 that covers the peripheral parts of the loading port door 8 from the transfer chamber 2 side.

本實施形態中，在對照臂M3的上框部M31將對照器M2以令其朝前方突出之姿勢支撐。是故，設於對照器M2的先端部之對照感測器M1，係配置於比對照臂M3還朝前方突出之位置。本實施形態之載入埠1，是將對照臂M3的下框部M33安裝在構成門開閉機構9之部件。具體而言，將下框部M33安裝在支撐載入埠門8之支撐框80。是故，伴隨門開閉機構9所做之載入埠門8的升降作動，對照臂M3亦會一體地作動。其結果，對照機構M全體會和載入埠門8朝同一方向升降移動。另，本實施形態中，雖採用對照機構M和門8一體地作動之構成，但亦可在對照機構M設置專用的升降機構(僅使對照機構M單獨地升降之機構)，藉此做成相對於門8而言對照機構M獨立地升降之構成。In the present embodiment, the collimator M2 is supported by the upper frame portion M31 of the control arm M3 in a posture such that it protrudes forward. Therefore, the collation sensor M1 provided at the tip of the collation device M2 is arranged at a position protruding forward from the collation arm M3. In the loading port 1 of the present embodiment, the lower frame portion M33 of the control arm M3 is attached to a member constituting the door opening and closing mechanism 9 . Specifically, the lower frame portion M33 is attached to the support frame 80 that supports the loading port door 8 . Therefore, with the lifting action of the loading port door 8 done by the door opening and closing mechanism 9, the control arm M3 will also act integrally. As a result, the whole collation mechanism M moves up and down in the same direction as the loading port door 8 . In addition, in this embodiment, although the composition of the collation mechanism M and the door 8 is integrally moved, it is also possible to set a dedicated lifting mechanism (a mechanism that only makes the collation mechanism M rise and fall independently) on the collation mechanism M, thereby making Relative to the door 8, the control mechanism M is independently raised and lowered.

本實施形態之對照機構M，具備以對照臂M3與門開閉機構9之安裝部中的樞支點作為中心而使對照臂M3全體傾動之傾動機構M4。傾動機構M4，如圖3、圖5及圖6所示，具備：傾動曲柄M41，連結至下框部M33；及連結軸M42(相當於樞支點)，以令和長邊方向一致的軸方向和載入埠1的寬幅方向一致之姿勢配置，且將傾動曲柄M41及門支撐框80相互連結；及進退可動部M43，以朝前後方向D貫通形成於框4的狹縫狀的***孔之姿勢配置，可朝前後方向D做進退動作；及樞支軸M44，將傾動曲柄M41的下端部樞接至進退可動部M43的後端部。The collation mechanism M of this embodiment is equipped with the tilting mechanism M4 which tilts the whole collation arm M3 centering on the pivot point in the mounting part of the collation arm M3 and the door opening and closing mechanism 9. The tilting mechanism M4, as shown in Fig. 3, Fig. 5 and Fig. 6, has: a tilting crank M41 connected to the lower frame part M33; Arranged in the same posture as the width direction of the loading port 1, and connect the tilt crank M41 and the door support frame 80 to each other; The posture configuration can move forward and backward toward the front and rear direction D; and the pivot shaft M44 pivotally connects the lower end of the tilting crank M41 to the rear end of the forward and backward movable part M43.

這樣的傾動機構M4，於將圖5等所示之對照器M2置放至不能對照晶圓位置(P2)的狀態下，藉由未圖示的驅動源使進退可動部M43往後方(搬送室2側)移動，藉此將傾動曲柄M41的下端部往後方推而使傾動曲柄M41全體繞樞支軸M44旋轉(傾動)。藉此，傾動曲柄M41，會於使上端部朝前方(FOUP3側)移動之方向旋動，連結至傾動曲柄M41的對照臂M3會和傾動曲柄M41往同一方向傾動。其結果，對照臂M3當中兩側框部M32的上端部側區域及上框部M31全體，會通過開口部41突出至比框4的最後面4B還前方的空間(FOUP3側的空間)。依以上，對照器M2，如圖6所示，便被置放至使對照感測器M1通過開口部41而突出至比框4的最後面4B還前方的空間之第1對照位置(P1)。另，傾動機構M4，於將對照器M2置放至第1對照位置(P1)的狀態下，藉由使進退可動部M43往前方(FOUP3側)移動，便能將對照器M2置放至不能對照晶圓位置(P2)。Such a tilting mechanism M4, when the collimator M2 shown in FIG. 2 side) to move, whereby the lower end of the tilting crank M41 is pushed backward to rotate (tilt) the entire tilting crank M41 around the pivot shaft M44. Thereby, the tilting crank M41 rotates in the direction to move the upper end forward (FOUP3 side), and the control arm M3 connected to the tilting crank M41 tilts in the same direction as the tilting crank M41. As a result, the upper end side regions of both side frame portions M32 and the entire upper frame portion M31 of the control arm M3 protrude through the opening 41 to a space ahead of the rearmost surface 4B of the frame 4 (space on the FOUP3 side). According to the above, the collation device M2, as shown in FIG. 6 , is placed to the first collation position (P1) where the collation sensor M1 protrudes through the opening 41 to a space ahead of the rearmost surface 4B of the frame 4. . In addition, the tilting mechanism M4 can place the collation device M2 at the first collation position (P1) by moving the forward and backward movable part M43 forward (to the FOUP3 side) in the state where the collation device M2 is placed. Wafer position (P2) cannot be compared.

對照機構M，構成為可將對照器M2的前後方向之位置維持在第1對照位置(P1)或不能對照晶圓位置(P2)而和上述門開閉機構9的升降移動一體地升降。像這樣，本實施形態中的對照臂M3，為一藉由門開閉機構9而和載入埠門8一起朝前後方向及上下方向動作之物，且為一和門開閉機構9獨立而藉由傾動機構M4動作之物。The collation mechanism M is configured to be able to maintain the position of the collimator M2 in the front-rear direction at the first collation position (P1) or not to collate the wafer position (P2), and to be raised and lowered integrally with the lifting movement of the door opening and closing mechanism 9 described above. In this way, the control arm M3 in this embodiment is a thing that moves in the front-back direction and the up-and-down direction together with the loading port door 8 by the door opening and closing mechanism 9, and is independent of the door opening and closing mechanism 9 and is operated by the door opening and closing mechanism 9. What the tilting mechanism M4 moves.

本實施形態之載入埠1，能夠具備底部排淨(bottom purge)部，其設於載置桌台5而從FOUP3的底面側對該FOUP3內注入氮氣或惰性氣體或是乾燥空氣等適當選擇的氣體亦即環境氣體(亦稱為排淨氣體，本實施形態中主要使用氮氣或乾燥空氣)，而可將FOUP3內的氣體環境置換成環境氣體。底部排淨部，是以在載置桌台5上的規定處設有複數個之未圖示的噴嘴作為主體而成，令複數個噴嘴作用成為注入規定的環境氣體之底部排淨注入用噴嘴、或排出FOUP3內的氣體環境之底部排淨排出用噴嘴。該些複數個噴嘴，為可在嵌入至設於FOUP3的底部之注入口及排出口(皆圖示省略)的狀態予以連結之物。可透過注入口從底部排淨注入用噴嘴對FOUP3的內部空間2S供給環境氣體，透過排出口從底部排淨排出用噴嘴排出FOUP3的內部空間2S的氣體環境(此氣體環境，從排淨處理執行開始至規定時間為止為空氣或空氣以外的清淨度低之環境氣體，於該規定時間經過後為充填於FOUP3的內部空間2S的清淨度高之環境氣體)，藉此進行排淨處理。 The loading port 1 of the present embodiment can be provided with a bottom purge part, which is provided on the mounting table 5 and injects nitrogen gas, inert gas, or dry air into the FOUP3 from the bottom surface side of the FOUP3, and selects as appropriate. The gas in the FOUP3 is the ambient gas (also known as exhaust gas, nitrogen or dry air is mainly used in this embodiment), and the gas environment in the FOUP3 can be replaced by the ambient gas. The bottom cleaning part is mainly composed of a plurality of nozzles not shown in the figure at predetermined positions on the mounting table 5, and the plurality of nozzles function as bottom cleaning injection nozzles for injecting specified ambient gas. , or discharge the bottom of the gas environment in FOUP3 with a nozzle for clean discharge. These plural nozzles can be connected in a state of being fitted into an inlet and an outlet (both of which are not shown) provided at the bottom of the FOUP 3 . The injection nozzle can supply ambient gas to the internal space 2S of FOUP3 through the injection port from the bottom, and the gas environment of the internal space 2S of the FOUP3 can be discharged from the discharge nozzle through the discharge port (this gas environment is executed from the exhaust process. Air or other ambient air with low cleanliness until a predetermined time period, and after the predetermined time elapses, the internal space 2S of the FOUP 3 is filled with high cleanliness ambient gas), thereby performing a purge process.

這樣的載入埠1，和在內部具備了搬送機器人21之搬送室2共同構成EFEM。本實施形態中，如圖2所示，在搬送室2的前面(前壁面)2F將載入埠1並排配置複數(例如3台)。EFEM的作動，是藉由載入埠1的控制器(圖3所示之控制部1C)、或EFEM全體的控制器(圖1所示之控制部2C)而受到控制。 Such a loading port 1 constitutes an EFEM together with a transfer chamber 2 equipped with a transfer robot 21 inside. In this embodiment, as shown in FIG. 2 , a plurality of loading ports 1 (for example, three) are arranged side by side on the front surface (front wall surface) 2F of the transfer chamber 2 . The operation of the EFEM is controlled by the controller of the load port 1 (the control unit 1C shown in FIG. 3 ), or the controller of the entire EFEM (the control unit 2C shown in FIG. 1 ).

在搬送室2的內部空間2S，設有可將晶圓W等搬送對象物在載入埠1上的FOUP3與處理室R之間搬送之搬送機器人21。搬送機器人21，如圖1及圖2所示，例如為 一具備將複數個連桿要素相互予以可水平迴旋地連結，而在先端部設置搬送對象物把持部211(機械手)之臂212、及將構成臂212的基端部之臂基座予以可迴旋地支撐朝且搬送室2的寬幅方向(載入埠1的並列方向)走行之走行部之物。搬送機器人21，具有連桿構造(多關節構造)，其形狀會在臂長成為最小之折疊狀態、與臂長變得比折疊狀態時還長之伸長狀態之間變化。能夠適用在臂212的先端將可個別控制之複數個機械手211於高度方向多段狀地設置之搬送機器人21。 In the internal space 2S of the transfer chamber 2, a transfer robot 21 capable of transferring objects to be transferred such as wafers W between the FOUP 3 on the load port 1 and the processing chamber R is provided. Transport robot 21, as shown in Figure 1 and Figure 2, is for example An arm 212 that connects a plurality of link elements to each other in a horizontally rotatable manner, and provides an object gripping part 211 (manipulator) at the tip, and an arm base that configures the base end of the arm 212 The running part that runs in the width direction of the transfer chamber 2 (the direction in which the loading ports 1 are aligned) is rotatably supported. The transfer robot 21 has a link structure (multi-joint structure), and its shape changes between a folded state in which the arm length becomes the minimum, and an extended state in which the arm length becomes longer than that in the folded state. It can be applied to the transfer robot 21 in which a plurality of individually controllable manipulators 211 are arranged in multiple stages in the height direction at the tip of the arm 212 .

搬送室2，構成為供載入埠1及處理室R連接，藉此讓內部空間2S成為略密閉之狀態。在搬送室2的內部空間2S，形成從上方朝向下方之氣流亦即下降流(down flow)。是故，即使當搬送室2的內部空間2S中存在污染晶圓W的表面之微粒的情形下，仍可藉由下降流將微粒朝下方推下，而抑制微粒附著到搬送中的晶圓W的表面。圖1中，以箭頭模型化地揭示形成有下降流之搬送室2內的氣體的流動。亦可構成在搬送室2的側面或搬送室2的內部空間2S配置緩衝工作站、對準器(aligner)等適當的工作站而成之EFEM。 The transfer chamber 2 is configured so that the loading port 1 and the processing chamber R are connected, thereby making the internal space 2S a slightly sealed state. In the internal space 2S of the transfer chamber 2 , a downflow (down flow), which is an airflow directed downward from above, is formed. Therefore, even when there are particles contaminating the surface of the wafer W in the internal space 2S of the transfer chamber 2, the particles can still be pushed down by the downward flow, thereby suppressing the particles from adhering to the wafer W being transferred. s surface. In FIG. 1 , the flow of gas in the transfer chamber 2 in which downflow is formed is shown schematically by arrows. It is also possible to configure an EFEM in which appropriate workstations such as a buffer station and an aligner are arranged on the side of the transfer chamber 2 or in the inner space 2S of the transfer chamber 2 .

本實施形態中，在和搬送室2當中配置了載入埠1的壁面2F(前壁面)相向之壁面2B(後壁面)，於寬幅方向並排配置複數(圖示例中為3室)之處理室R(半導體處理裝置)，而構成為在各處理室R內各自施以相異之適當的處理。作為在半導體製造工程的中間工程或後工程進行之處 理例，能夠舉出底部拋光處理工程、晶圓層積處理工程、切割處理工程等。另，處理室R的作動，是藉由處理室R的控制器(圖1所示之控制部RC)而受到控制。此處，處理室R全體的控制器(控制部RC)、或EFEM全體的控制器(控制部2C)，為載入埠1的控制部1C之上位控制器。 In this embodiment, the wall surface 2B (rear wall surface) facing the wall surface 2F (front wall surface) of the loading port 1 is arranged in the transfer chamber 2, and a plurality of (three chambers in the illustrated example) are arranged side by side in the width direction. The processing chamber R (semiconductor processing apparatus) is configured so that different appropriate processing is performed in each processing chamber R. As an intermediate process or post-process in the semiconductor manufacturing process Examples include a bottom polishing process, a wafer lamination process, a dicing process, and the like. In addition, the operation of the processing chamber R is controlled by the controller of the processing chamber R (the control unit RC shown in FIG. 1 ). Here, the controller (control unit RC) of the entire processing chamber R or the controller of the entire EFEM (control unit 2C) is the higher-level controller of the control unit 1C of the load port 1 .

各處理室R的內部空間MS、搬送室2的內部空間2S及被載置於各載入埠1上的FOUP3的內部空間2S，被維持在高清淨度。另一方面，在配置載入埠1的空間換言之即處理室外、EFEM外成為相對低清淨度。另，圖1及圖2，為載入埠1及搬送室2的相對位置關係、及具備該些載入埠1及搬送室2之EFEM與處理室R的相對位置關係模型化示意圖。 The internal space MS of each processing chamber R, the internal space 2S of the transfer chamber 2, and the internal space 2S of the FOUP 3 loaded on each loading port 1 are maintained at high cleanliness. On the other hand, the cleanliness is relatively low in the space where the load port 1 is arranged, that is, outside the processing room and outside the EFEM. In addition, FIG. 1 and FIG. 2 are schematic diagrams showing the relative positional relationship between the loading port 1 and the transfer chamber 2, and the relative positional relationship between the EFEM having the loading port 1 and the transfer chamber 2 and the processing chamber R.

本實施形態中，在鄰接於搬送室2而設置之複數種類的處理室R內各自施加適當的處理。是故，底部拋光處理前的晶圓W、或底部拋光處理後被保持於環狀框F的薄晶圓W1等會透過鄰接於搬送室2而設置之載入埠1被搬送至處理室R內。此處，將底部拋光處理後的薄晶圓W1(比底部拋光處理前還被加工成較薄之晶圓W1)予以保持之環狀框F，為一形成一定程度的元件構造，而藉由底部拋光處理等被設定為例如0.3~0.7mm程度的厚度之物。另，底部拋光處理前後，晶圓W和薄晶圓W1的平面尺寸沒有變化。圖7(i)揭示第1搬送對象物亦即晶圓W，同圖(ii)揭示未保持薄晶圓W1之環狀框F，同圖(iii)揭示保持了薄晶圓W1之環狀框F。 In this embodiment, appropriate processing is applied to each of the plurality of types of processing chambers R provided adjacent to the transfer chamber 2 . Therefore, the wafer W before the bottom polishing process, or the thin wafer W1 held in the ring frame F after the bottom polishing process is transported to the processing chamber R through the loading port 1 provided adjacent to the transfer chamber 2 Inside. Here, the ring-shaped frame F holding the thin wafer W1 after the bottom polishing process (the wafer W1 processed to be thinner than before the bottom polishing process) is a device structure formed to a certain extent, and by Bottom polishing and the like are set to have a thickness of about 0.3 to 0.7 mm, for example. In addition, there is no change in the planar dimensions of the wafer W and the thin wafer W1 before and after the bottom polishing process. Fig. 7(i) shows the wafer W which is the first object to be transported, the same figure (ii) shows the ring frame F which does not hold the thin wafer W1, and the same figure (iii) shows the ring shape which holds the thin wafer W1 Box F.

環狀框F，由具有比晶圓W還大一圈的平面尺寸之環狀本體F1、及張貼在環狀本體F1全體之膜F2所構成，為一可在膜F2上貼附保持底部拋光處理後的薄晶圓W1之物。被保持於這樣的環狀框F之薄晶圓W1，是在專用的搬送容器3亦即框匣C中收容一個個環狀框F之狀態下被搬送。在框匣C設有多段式的狹槽C1，構成為可在各狹槽C1載置環狀框F。圖9模型化地揭示在框匣C的狹槽C1載置了環狀框F之狀態。 The ring-shaped frame F is composed of a ring-shaped body F1 with a planar size larger than the wafer W, and a film F2 attached to the entire ring-shaped body F1. It is a film F2 that can be attached to maintain the bottom polishing Thin wafer W1 after processing. The thin wafer W1 held by such an annular frame F is transported in a state where the individual annular frames F are accommodated in the cassette C which is a dedicated transport container 3 . The frame case C is provided with a plurality of slits C1, and is configured so that the annular frame F can be placed on each slit C1. FIG. 9 schematically shows the state in which the ring frame F is placed on the slot C1 of the frame case C. As shown in FIG.

本實施形態中，是在著眼於與載入埠1之間授受搬送容器3之搬送容器自動搬送裝置(OHT)的搬送效率改善、搬送產距(takt)改善這一點，而對於搬送室2而言設有處理內容相異的複數種處理室R之構成中，構成為以搬送機器人21來搬送保持底部拋光處理後的薄晶圓W1之環狀框F、或利用FOUP3的載置空間亦即載入埠1來作為框匣C的載置空間，藉此可並行地使用框匣C與FOUP3。也就是說，構成為以載入埠1作為介面，而可在載置於載入埠1上之框匣C與搬送機器人21之間搬送一個個環狀框F。此處，保持了薄晶圓W1之狀態的環狀框F相當於本發明之「第2搬送對象物」，框匣C相當於本發明之「第2搬送容器」。 In the present embodiment, the improvement of the transfer efficiency and the improvement of the transfer pitch (takt) of the transfer container automatic transfer device (OHT) for transferring the transfer container 3 between the loading port 1 and the transfer chamber 2 are focused on. In the configuration in which a plurality of processing chambers R with different processing contents are provided, the transfer robot 21 is used to transfer and hold the ring-shaped frame F holding the bottom polished thin wafer W1, or the placement space of the FOUP 3 is used. Load port 1 is used as a loading space for cassette C, so that cassette C and FOUP3 can be used in parallel. That is, the loading port 1 is used as an interface so that the individual ring frames F can be transferred between the frame cassette C placed on the loading port 1 and the transfer robot 21 . Here, the annular frame F holding the state of the thin wafer W1 corresponds to the "second transport object" of the present invention, and the cassette C corresponds to the "second transport container" of the present invention.

本實施形態之載入埠1中，構成為能夠將以多段狀收容和晶圓W平面尺寸相異的環狀框F之框匣C載置於載置桌台5，又，藉由就座保持機構6將框匣C保持於載置桌台5上，藉由牽引機構7可將載置桌台5上的框匣C在就座位置與搬送對象物授受位置之間朝前後方向移動。當在載置桌台5上載置有FOUP3的情形下之就座位置、搬送對象物授受位置，分別和當在載置桌台5上載置有框匣C的情形下之就座位置、搬送對象物授受位置相同。也就是說，載置牽引機構7所做的牽引處理時之載置桌台5的移動量，於當在載置桌台5上載置有FOUP3之情形下、及於當在載置桌台5上載置有框匣C之情形下為相同移動量。In the loading port 1 of the present embodiment, the frame cassette C that accommodates the ring-shaped frame F different in planar size from the wafer W in multiple stages is configured to be able to be mounted on the mounting table 5, and by seating The holding mechanism 6 holds the cassette C on the mounting table 5, and the cassette C on the mounting table 5 can be moved forward and backward between the seating position and the transfer target position by the traction mechanism 7. The seating position when FOUP 3 is placed on the loading table 5 and the receiving and receiving position of the object to be transported are respectively the seating position and the object to be transported when the case C is placed on the loading table 5 The location of giving and receiving is the same. In other words, the amount of movement of the loading table 5 during the pulling process performed by the loading and pulling mechanism 7 is when the FOUP 3 is loaded on the loading table 5 and when the loading table 5 is placed on it. It is the same amount of movement when the frame box C is placed on it.

本實施形態中，是令保持於載置桌台5上之搬送容器3(FOUP3、框匣C)的工件中心(晶圓W的中心、環狀框F的中心)相互一致。是故，使載置桌台5上的FOUP3藉由牽引機構7而從就座位置移動到了搬送對象物授受位置之時間點下的FOUP3內的晶圓W的中心，會和使載置桌台5上的框匣C藉由牽引機構7而從就座位置移動到了搬送對象物授受位置之時間點下的框匣C內的環狀框F的中心一致。藉此，當藉由搬送機器人21將工件(晶圓W、環狀框F)相對於搬送容器3(FOUP3、框匣C)做取出放入時，搬送機器人21只要以工件中心來對齊即可，而不需要每一相異的搬送容器3的教導(teaching)，搬送機器人21的控制會變得簡易。In this embodiment, the workpiece centers (the center of the wafer W, the center of the ring frame F) of the transfer containers 3 (FOUP3, cassette C) held on the mounting table 5 are made to coincide with each other. Therefore, the center of the wafer W in the FOUP 3 at the time point when the FOUP 3 on the loading table 5 is moved from the seating position to the conveyance target receiving position by the traction mechanism 7 is aligned with the loading table. The centers of the ring-shaped frames F in the cassette C at the time when the cassette C on the top 5 is moved from the seating position to the conveyance target receiving position by the traction mechanism 7 are aligned. Thus, when the transfer robot 21 takes the workpiece (wafer W, ring frame F) into and out of the transfer container 3 (FOUP3, frame box C), the transfer robot 21 only needs to align it with the center of the workpiece. , without the need for teaching (teaching) of each different transport container 3, the control of the transport robot 21 will become simple.

此外，本實施形態中，是將框4的開口部41設定成環狀框F可以略水平姿勢通過之開口尺寸。In addition, in the present embodiment, the opening 41 of the frame 4 is set to an opening size such that the annular frame F can pass through in a substantially horizontal posture.

不過，當構成為以晶圓W搬送機器人21搬送保持底部拋光處理後的薄晶圓W1之環狀框F，或利用FOUP3的載置空間亦即載入埠1作為框匣C的載置空間，而可在共通的載入埠1並行使用框匣C與FOUP3的情形下，料想可能會發生載置桌台5上的框匣C中有底部拋光處理前的晶圓W和保持底部拋光處理後的薄晶圓W1之環狀框F混載，或載置桌台5上的FOUP3中有保持底部拋光處理後的薄晶圓W1之環狀框F和底部拋光處理前的晶圓W混載之事態。However, when the wafer W transfer robot 21 is used to transfer and hold the annular frame F holding the bottom polished thin wafer W1, or the loading port 1, which is the loading space of the FOUP 3, is used as the loading space of the cassette C , and in the case that the cassette C and FOUP3 can be used in parallel at the common load port 1, it is conceivable that there may be a wafer W before the bottom polishing process in the cassette C on the loading table 5 and the bottom polishing process remains The ring frame F of the thin wafer W1 after the bottom polishing process is mixed, or the ring frame F holding the thin wafer W1 after the bottom polishing process and the wafer W before the bottom polishing process are mixed in the FOUP3 on the loading table 5 situation.

鑑此，本實施形態之載入埠1中，構成為能夠藉由對照機構M所做的對照處理來判別在載置桌台5上的搬送容器3(FOUP3、框匣C)內是否有搬送對象物W(底部拋光處理前的晶圓W、保持底部拋光處理後的薄晶圓W1之環狀框F)混載。In view of this, in the loading port 1 of the present embodiment, it is configured to be able to judge whether there is any transport in the transport container 3 (FOUP3, cassette C) on the loading table 5 through the collation process performed by the collation mechanism M. Objects W (wafer W before bottom polishing, ring frame F holding thin wafer W1 after bottom polishing) are mixed and loaded.

本實施形態中，是令置放至搬送對象物授受位置之載置桌台5上的搬送對象物W(晶圓W、環狀框F)的中心一致，因此平面尺寸相異之搬送對象物W(晶圓W、環狀框F)的邊端位置和邊端位置不會相互一致，而會於前後方向D產生差距。本實施形態中，利用於此前後方向D搬送對象物W(晶圓W、環狀框F)的位置會發生差距，而構成為能夠藉由對照機構M所做的對照處理來判別在載置桌台5上的搬送容器3(FOUP3、框匣C)內是否有平面尺寸相異之搬送對象物(底部拋光處理前的晶圓W、保持底部拋光處理後的薄晶圓W1之環狀框F)混載。In this embodiment, the centers of the object W (wafer W, ring frame F) placed on the loading table 5 at the object transfer position are aligned, so the objects to be transferred are different in planar size. The edge position and the edge position of W (wafer W, ring frame F) do not coincide with each other, but there is a difference in the front-back direction D. In the present embodiment, the position of the object W (wafer W, ring frame F) to be transported in the front-rear direction D is disparate, and it is configured so that it can be discriminated by the collation process performed by the collation mechanism M. Whether there are objects to be transported in the transport container 3 (FOUP3, cassette C) on the table 5 with different planar dimensions (the wafer W before the bottom polishing process, the ring frame holding the thin wafer W1 after the bottom polishing process) F) Mixed load.

本實施形態之控制部1C，具有容器判別部1Ca，判別藉由就座保持機構6而保持於載置桌台5上的是FOUP3或框匣C的哪一者。作為容器判別部1Ca，係適用構成為僅當在載置桌台5載置了框匣C的情形下才會發出偵測訊號之物。具體而言，構成為藉由反射型感測器所做的偵測處理，而能夠判定在載置桌台5是否保持了框匣C。The control unit 1C of the present embodiment has a container discriminating unit 1Ca, and discriminates whether the FOUP 3 or the cassette C is held on the mounting table 5 by the seat holding mechanism 6 . As the container discriminating unit 1Ca, what is configured to emit a detection signal only when the cassette C is placed on the placing table 5 is applied. Specifically, it is configured so that whether or not the cassette C is held on the mounting table 5 can be determined by detection processing by a reflective sensor.

又，本實施形態之載入埠1，其特徵為，控制部1C可執行：第1對照處理，通過處於開狀態之開口部41將對照器M2置放於第1對照位置(P1)而令其執行對照機構M所做之對照處理；及第2對照處理，通過處於開狀態之開口部41將對照器M2置放於可藉由對照感測器M1偵測框匣C中收容有環狀框F之第2對照位置(P2)而令其執行對照機構M所做之對照處理，係選擇性地執行第1對照處理及第2對照處理的其中一方或雙方。本實施形態中，於前後方向D將第2對照位置(P2)設定在和不能對照晶圓位置(P2)同一位置。第1對照處理，為將對照器M2置放至第1對照位置(P1)的狀態下令對照臂M3做升降動作，藉此對搬送容器內的每一狹槽(FOUP內的每一狹槽34、框匣C內的每一狹槽C1)取得有關搬送對象物的資訊之處理，第2對照處理，為將對照器M2置放至第2對照位置(P2)的狀態下令對照臂M3做升降動作，藉此對搬送容器3內的每一狹槽34取得有關搬送對象物W的資訊之處理。Also, the loading port 1 of the present embodiment is characterized in that the control unit 1C can execute: the first collation process, and the collation device M2 is placed in the first collation position (P1) through the opening 41 in the open state to make It executes the comparison process done by the comparison mechanism M; and the second comparison process, through the opening 41 in the open state, the collation device M2 is placed in the frame box C that can be detected by the comparison sensor M1. The second comparison position (P2) of frame F is made to perform the comparison treatment done by the comparison institution M, which is to selectively execute one or both of the first comparison treatment and the second comparison treatment. In this embodiment, the second collation position ( P2 ) is set at the same position as the collation-unable wafer position ( P2 ) in the front-rear direction D. The first comparison process is to place the comparison device M2 in the state of the first comparison position (P1) and order the comparison arm M3 to perform a lifting action, thereby checking each slot in the transport container (each slot 34 in the FOUP) , Each slot C1 in the frame box C) The process of obtaining information about the object to be transported, the second comparison process, in order to place the comparison device M2 to the state of the second comparison position (P2), order the comparison arm M3 to do the lifting The operation is a process of acquiring information on the object W to be transported for each slot 34 in the transport container 3 .

此處，對照感測器M1，為一發出訊號亦即光束(線型光)，以是否接收該訊號來偵測搬送對象物W的有無之物，能夠將光束的軌跡(線型光線條)想成是檢測線條ML。也就是說，在將對照器M2置放至第1對照位置(P1)的狀態下進行之第1對照處理時的檢測線條ML，為橫切FOUP3中收容的晶圓W之線條(參照圖7(ii))，在將對照器M2置放至第2對照位置(P2)的狀態下進行之第2對照處理時的檢測線條ML，為橫切框匣C中收容的環狀框F之線條(參照圖8(i))。特別是，本實施形態中，著眼於框匣C具有比晶圓W還大的平面尺寸，在將對照器M2置放至第2對照位置(P2)的狀態下進行之第2對照處理時的檢測線條ML，是設定成不會橫切FOUP3中收容的晶圓W之線條。這樣的對照器M2的第1對照位置(P1)及第2對照位置(P2)，能夠因應從搬送對象物W(晶圓W、環狀框F)的中心WC、FC或搬送容器3(FOUP3、框匣C)的中心至檢測線條ML為止之沿前後方向D的距離來設定。Here, compared with the sensor M1, it sends out a signal, that is, a light beam (linear light), and detects the presence or absence of the conveyed object W by receiving the signal. The trajectory of the light beam (linear light line) can be thought of as is the detection line ML. That is, the detection line ML at the time of the first collation process performed with the collimator M2 placed at the first collation position (P1) is a line crossing the wafer W accommodated in the FOUP3 (refer to FIG. 7 (ii)), the detection line ML during the second comparison process with the collation device M2 placed in the second comparison position (P2) is the line that cuts across the ring-shaped frame F contained in the frame box C (Refer to FIG. 8(i)). In particular, in this embodiment, attention is paid to the fact that the cassette C has a larger planar size than the wafer W, and when the collimator M2 is placed at the second collation position (P2) and the second collation process is performed The detection line ML is set so as not to cross the wafer W accommodated in the FOUP3. The first collation position (P1) and the second collation position (P2) of such a comparator M2 can respond from the center WC, FC or the transfer container 3 (FOUP3) of the transfer object W (wafer W, ring frame F). , the center of the box C) to the detection line ML along the front-back direction D to set the distance.

於第1對照處理時，藉由從發送器M11朝向接收器M12發出訊號而在發送器M11與接收器M12之間形成的訊號路徑，會在晶圓W存在之處被遮擋，在晶圓W不存在之處不會被遮擋而會到達接收器M12。藉此，便能依序檢測於高度方向H並排收納之晶圓W的有無或收納姿勢。如此，關於FOUP3內的所有的狹槽34或框匣C內的所有的狹槽C1，便能獲得有關晶圓W的有無或收納姿勢之資訊(搬送對象物檢測資訊)。In the first collation process, the signal path formed between the transmitter M11 and the receiver M12 by sending a signal from the transmitter M11 toward the receiver M12 is blocked where the wafer W exists, and the wafer W The non-existing place will not be blocked and will reach the receiver M12. Thereby, it is possible to sequentially detect the presence or absence or the storage posture of the wafers W stored side by side in the height direction H. In this way, information on the presence or absence of the wafer W or the storage posture (transfer object detection information) can be obtained with respect to all the slots 34 in the FOUP 3 or all the slots C1 in the cassette C.

於第2對照處理時，藉由從發送器M11朝向接收器M12發出訊號而在發送器M11與接收器M12之間形成的訊號路徑，會在環狀框F存在之處被遮擋，在環狀框F不存在之處不會被遮擋而會到達接收器M12。藉此，便能依序檢測於高度方向H並排收納之環狀框F的有無或收納姿勢。如此，關於FOUP3內的所有的狹槽34或框匣C內的所有的狹槽34，便能獲得有關環狀框F的有無或收納姿勢之資訊(搬送對象物檢測資訊)。In the second comparison process, the signal path formed between the transmitter M11 and the receiver M12 by sending a signal from the transmitter M11 toward the receiver M12 is blocked at the place where the ring frame F exists. Where the frame F does not exist, it will not be blocked and will reach the receiver M12. Thereby, it is possible to sequentially detect the presence or the storage posture of the annular frames F stored side by side in the height direction H. FIG. In this way, information on the presence or absence of the ring frame F and the storage posture (object detection information) can be obtained with respect to all the slots 34 in the FOUP 3 or all the slots 34 in the cassette C.

本實施形態之載入埠1，藉由從控制部1C對各部、各機構賦予驅動指令來執行規定的動作。控制部1C，具有下述構成，即，具備了進行記憶部、ROM、RAM、I/O埠、CPU、外部的顯示裝置(未圖示)等之間的資料的輸出入之輸出入介面(IF)，及將它們相互連接而在各部之間傳達資訊之匯流排。The load port 1 of this embodiment executes predetermined operations by giving drive commands to each part and each mechanism from the control part 1C. The control unit 1C has a configuration including an I/O interface ( IF), and the bus that connects them to each other and conveys information between the various parts.

記憶部中，因應在此載入埠1被執行之處理的種類，而記憶有控制手續(動作序列)。也就是說，此記憶部中，存儲有規定的動作程式。本實施形態中的程式，係身為可執行之程式而被存儲於非暫時性的電腦可讀取的記錄媒體(硬碟等)之物。In the memory part, control procedures (operation sequences) are stored in accordance with the type of processing executed in the load port 1 . That is, a predetermined operation program is stored in this memory unit. The program in this embodiment is stored in a non-transitory computer-readable recording medium (hard disk, etc.) as an executable program.

ROM，由硬碟、EEPROM、快閃記憶體等所構成，為記憶CPU的動作程式等之記錄媒體。RAM，作用成為CPU的工作區等。I/O埠，例如將CPU所輸出的控制訊號往各部、各機構輸出，或將來自感測器的資訊供給至CPU。ROM is composed of a hard disk, EEPROM, flash memory, etc., and is a recording medium that memorizes the operating program of the CPU. RAM, which acts as the work area of the CPU, etc. I/O ports, for example, output control signals output by the CPU to various parts and mechanisms, or supply information from sensors to the CPU.

CPU，構成控制部1C的中樞，執行ROM中記憶的動作程式。CPU，沿著記憶部中記憶的程式來控制載入埠1的動作。The CPU constitutes the core of the control unit 1C, and executes the operation programs stored in the ROM. The CPU controls the operation of the load port 1 according to the program stored in the memory unit.

接下來、參照示意動作流程之圖10等，說明本實施形態之載入埠1的使用方法(特別是對照處理方法)及作用。Next, referring to Fig. 10 etc. showing the flow of operation, the method of using the load port 1 of this embodiment (particularly the collation processing method) and its function will be described.

首先，FOUP3或框匣C的其中一方，藉由在沿著搬送室2當中配置了載入埠1之共通的壁面3A而延伸之直線上的搬送線(動線)作動之OHT等搬送容器自動搬送裝置，被搬送至載入埠1的上方，而被載置於載置桌台5上，則本實施形態之載入埠1中，控制部1C會執行藉由就座保持機構6保持於載置桌台5上之就座保持處理St1(參照圖10)。本實施形態中的就座保持處理St1的具體的處理，係將載置桌台5上的鎖定爪61鉤住設於FOUP3的底面或框匣C的底面之被鎖定部(圖示省略)而設為鎖定狀態之處理。藉此，便能將FOUP3或框匣C載置而固定於載置桌台5上的規定的就座位置。當FOUP3被載置於載置桌台5上的情形下，設於載置桌台5之定位用突起51會嵌入FOUP3的定位用凹部。First, one of the FOUP 3 or the cassette C is automatically transported by the transport container such as OHT on the straight line extending along the common wall surface 3A where the loading port 1 is arranged in the transport chamber 2. The transport device is transported to the top of the loading port 1 and placed on the loading table 5. In the loading port 1 of the present embodiment, the control unit 1C executes the process of holding the seat on the loading port 1 by the seating holding mechanism 6. Seating holding process St1 on the mounting table 5 (refer to FIG. 10 ). The specific processing of the seat holding processing St1 in this embodiment is to hook the locking claw 61 on the loading table 5 to the locked portion (not shown) provided on the bottom surface of the FOUP 3 or the bottom surface of the case C. Set the processing of the locked state. Thereby, the FOUP 3 or the casket C can be placed and fixed at a predetermined seating position on the placement table 5 . When the FOUP3 is placed on the mounting table 5, the positioning protrusion 51 provided on the mounting table 5 fits into the positioning recess of the FOUP3.

本實施形態中，控制部1C是基於容器判別部1Ca的輸出訊號來判別藉由就座保持機構6保持了FOUP3或框匣C的哪一者(容器判別處理St2)。本實施形態之容器判別處理St2，係藉由容器判別部1Ca來判別載置桌台5上的搬送容器是否為框匣C之處理。又，本實施形態之載入埠1，於當載置桌台5上保持了FOUP3的情形下、與當在載置桌台5上保持了框匣C的情形下令其動作序列相異。In the present embodiment, the control unit 1C discriminates which of the FOUP 3 or the cassette C is held by the seat holding mechanism 6 based on the output signal of the container discriminating unit 1Ca (container discriminating process St2). The container discriminating process St2 of the present embodiment is a process of discriminating whether or not the transported container placed on the table 5 is a cassette C by the container discriminating unit 1Ca. Also, the loading port 1 of the present embodiment makes its operation sequence different when the FOUP 3 is held on the loading table 5 and when the cassette C is held on the loading table 5 .

另，本實施形態中，亦能構成為可對朝搬送室2的寬幅方向並排配置3台之載入埠1的載置桌台5各自載置FOUP3或框匣C，而藉由檢測搬送容器(FOUP3、框匣C)在載置桌台5上是否被載置於規定的位置之就座感測器(圖示省略)，來檢測搬送容器(FOUP3、框匣C)已被載置於載置桌台5上的就座位置。In addition, in this embodiment, it can also be configured so that the FOUP 3 or the cassette C can be placed on each of the loading tables 5 of the loading ports 1 arranged side by side in the width direction of the transfer chamber 2, and by detecting the transfer The seating sensor (not shown) to detect whether the container (FOUP3, cassette C) is placed at a predetermined position on the loading table 5, to detect that the transport container (FOUP3, cassette C) has been loaded In the seating position on the loading table 5.

本實施形態之載入埠1中，控制部1C，當判別在載置桌台5上保持了FOUP3的情形下(容器判別處理St2；No)，循以下的處理手續。接續上述的就座保持處理St1，本實施形態之載入埠1中，控制部1C，藉由牽引機構7使載置桌台5從就座位置朝向框4後退至搬送對象物授受位置為止(後方牽引處理St3)。藉由此後方牽引處理St3，能夠將FOUP門32連結(對接；docking)至事先被命令在全閉位置(C)待命之載入埠門8而以緊貼狀態予以保持。本實施形態中，構成為使用設於上述的載入埠門8之卡合部81來將FOUP門32連結至該載入埠門8而以緊貼狀態予以保持。In the loading port 1 of the present embodiment, when the control unit 1C judges that the FOUP 3 is held on the loading table 5 (container judging process St2; No), it follows the following processing procedure. Continuing the above-mentioned seating holding process St1, in the loading port 1 of the present embodiment, the control unit 1C uses the traction mechanism 7 to make the loading table 5 retreat from the seating position toward the frame 4 to the conveying object accepting position ( Rear traction handling St3). By this rear pulling process St3, the FOUP door 32 can be connected (docked) to the loading port door 8 commanded to stand by at the fully closed position (C) in advance, and can be held in a close-contact state. In the present embodiment, the FOUP door 32 is connected to the loading port door 8 using the engaging portion 81 provided on the loading port door 8 described above, and held in a close-contact state.

本實施形態之載入埠1中，於FOUP3被載置於載置桌台5上的就座位置之時間點，控制部1C，檢測到FOUP3的底面部已推壓設於載置桌台5之例如加壓感測器，以此為契機，控制部1C，賦予令設於載置桌台5的底部排淨注入用噴嘴及底部排淨排出用噴嘴往比載置桌台5的上面還上方伸進之驅動命令(訊號)。其結果，會將該些各噴嘴(底部排淨注入用噴嘴、底部排淨排出用噴嘴)各自連結至FOUP3的注入口及排出口，成為可執行排淨處理之狀態。In the loading port 1 of this embodiment, when the FOUP 3 is placed on the seating position on the placing table 5, the control unit 1C detects that the bottom portion of the FOUP 3 has been pushed onto the placing table 5 For example, the pressure sensor, using this as an opportunity, the control unit 1C gives the bottom drain injection nozzle and the bottom drain discharge nozzle provided on the mounting table 5 to be lower than the upper surface of the mounting table 5. Drive commands (signals) extending from above. As a result, each of these nozzles (bottom purge injection nozzle, bottom purge discharge nozzle) is connected to the injection port and the discharge port of the FOUP3, and the purge process can be performed.

然後，本實施形態之載入埠1中，控制部1C發出驅動命令，對FOUP3的內部空間2S執行排淨處理St4。此排淨處理St4，係透過注入口從底部排淨注入用噴嘴對FOUP3的內部空間2S供給規定的環境氣體，而將在此之前滯留於FOUP3的內部空間2S的氣體透過排出口從底部排淨排出用噴嘴予以排出之處理。藉由此排淨處理St4，能夠將FOUP3的內部空間2S以環境氣體填滿，於短時間內使FOUP3內的水分濃度及氧濃度各自降低至規定值以下，而將FOUP3內中的搬送對象物W的周圍環境設為低濕度環境及低氧環境。Then, in the load port 1 of the present embodiment, the control unit 1C issues a drive command to execute the cleaning process St4 on the internal space 2S of the FOUP 3 . In this exhaust process St4, the injection nozzle supplies the specified ambient gas to the internal space 2S of the FOUP3 from the bottom through the injection port, and the gas that has remained in the internal space 2S of the FOUP3 until then is exhausted from the bottom through the exhaust port. Discharging is carried out with nozzles. Through this cleaning process St4, the internal space 2S of the FOUP3 can be filled with ambient gas, and the moisture concentration and oxygen concentration in the FOUP3 can be reduced to below the specified value in a short time, and the objects to be transported in the FOUP3 can be removed. The surrounding environment of W is set as a low-humidity environment and a low-oxygen environment.

另，可適用於比被載置於載置桌台5上還之前的時間點事先施加排淨處理之FOUP3，對於這樣的FOUP3可執行排淨處理St4，亦可選擇不執行排淨處理St4。In addition, it is applicable to the FOUP3 that has been subjected to the cleaning process before it is placed on the mounting table 5, and it is possible to perform the cleaning process St4 on such a FOUP3, and it is also possible to select not to perform the cleaning process St4.

接著，本實施形態之載入埠1中，控制部1C，藉由連結切換機構82，進行解除FOUP門32與FOUP本體32之卡合狀態而設為可將FOUP門32從FOUP本體32拆卸之解閂鎖狀態之處理(解閂鎖處理St5)。Next, in the loading port 1 of the present embodiment, the control unit 1C releases the engaged state of the FOUP door 32 and the FOUP body 32 by connecting the switching mechanism 82 so that the FOUP door 32 can be detached from the FOUP body 32 Processing of the unlocked state (unlatching process St5).

接續解閂鎖處理St5，本實施形態之載入埠1中，控制部1C，執行藉由門開閉機構9使載入埠門8從全閉位置(C)往後方移動至門開放位置(O)，而將框4的開口部41設為開狀態之處理(門開放處理St6)。具體而言，控制部1C，藉由門開閉機構9使載入埠門8從全閉位置(C)至門開放位置(O)為止沿著上述的水平路徑移動規定距離。此時，載入埠門8，藉由卡合部81將FOUP門32一體地保持而移動。是故，藉由門開放處理St6，FOUP3的搬出入口31亦和框4的開口部41同樣地成為開狀態。Following the unlocking process St5, in the loading port 1 of the present embodiment, the control unit 1C executes the door opening and closing mechanism 9 to move the loading port door 8 backward from the fully closed position (C) to the door open position (O ) to open the opening 41 of the frame 4 (door opening process St6). Specifically, the control unit 1C moves the loading port door 8 by a predetermined distance along the above-mentioned horizontal path from the fully closed position (C) to the door open position (O) by the door opening and closing mechanism 9 . At this time, the loading port door 8 is moved while integrally holding the FOUP door 32 by the engaging portion 81 . Therefore, similarly to the opening 41 of the frame 4, the carry-out entrance 31 of the FOUP 3 is opened by the door opening process St6.

接下來，本實施形態之載入埠1中，控制部1C，藉由對照機構M進行第2對照處理St7。對照機構M的對照器M2，於門開放處理St6的執行剛完畢後，是被置放於不能對照晶圓位置(P2)(參照圖8(i))。本實施形態中，是將對照器M2的第2對照位置(P2)設定在和不能對照晶圓位置(P2)同一位置，而將門開放處理St6剛完畢後之對照感測器M1的高度位置，設定在比FOUP3內的最上段的狹槽34還稍微上側之位置。將此對照感測器M1的高度位置訂為「第2對照開始高度位置」。按照這樣的本實施形態之載入埠1，可於門開放處理St6剛完畢後進行第2對照處理St7。另，本實施形態之載入埠1，是於比執行第2對照處理St7還之前的時間點執行門開放處理St6，因此框4的開口部41及FOUP3的搬出入口31會處於開狀態。Next, in the load port 1 of this embodiment, the control unit 1C performs the second collating process St7 by the collating mechanism M. The collimator M2 of the collation mechanism M is placed at the collation-unable wafer position ( P2 ) immediately after the door opening process St6 is completed (see FIG. 8( i )). In this embodiment, the second collation position (P2) of the collation device M2 is set at the same position as the non-collating wafer position (P2), and the height position of the collation sensor M1 immediately after the door opening process St6 is completed, It is set at a position slightly above the uppermost slit 34 in the FOUP3. Set the height position of the comparison sensor M1 as "the second comparison start height position". According to the load port 1 of this embodiment, the second matching process St7 can be performed immediately after the door opening process St6 is completed. In addition, since the loading port 1 of this embodiment executes the door opening process St6 before the execution of the second collation process St7, the opening 41 of the frame 4 and the export port 31 of the FOUP3 are opened.

然後，本實施形態之載入埠1中，藉由門開閉機構9使載入埠門8從門開放位置(O)朝向全開位置往下方移動，則對照機構M全體亦往下方移動。藉此，對照器M2，會將前後位置維持在第2對照位置(P2)，而從第2對照開始高度位置移動至比最下段的狹槽34還低之位置(第2對照結束高度位置)。控制部1C，循以上手續，檢測形成於對照感測器M1彼此之間的訊號路徑是否被遮擋，而執行對每一狹槽34獲得有關環狀框F的有無或收納姿勢的資訊(搬送對象物檢測資訊)之第2對照處理St7。Then, in the loading port 1 of the present embodiment, when the loading port door 8 is moved downward from the door open position (O) toward the fully open position by the door opening and closing mechanism 9, the whole collation mechanism M also moves downward. Thereby, the comparator M2 maintains the front-rear position at the second collation position (P2), and moves from the second collation start height position to a position lower than the lowermost slot 34 (the second collation end height position) . The control unit 1C, following the above procedures, detects whether the signal path formed between the collation sensors M1 is blocked, and executes obtaining information on the existence or storage posture of the ring-shaped frame F for each slot 34 (transfer object The second control treatment St7.

當第2對照處理St7的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的FOUP3內之狹槽34中收容有環狀框F。另，當環狀框F為放不進FOUP3內之大小的情形下，可設定成依據第2對照處理St7的結果為「有偵測到」，來通報錯誤，而不執行第1對照處理St9(將對照處理停止)，亦能設定成根本不執行第2對照處理St7。When the result of the second comparison process St7 is "detected", it can be recognized that the annular frame F is accommodated in the slot 34 in the FOUP 3 on the mounting table 5 . In addition, when the size of the ring frame F is too large to fit in the FOUP3, it can be set to report an error based on the result of the second comparison process St7 being "detected", without executing the first comparison process St9 (stopping the collation process), it is also possible to set not to execute the 2nd collation process St7 at all.

另一方面，當第2對照處理St7的結果為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有環狀框F。On the other hand, when the result of the second comparison process St7 is "not detected", it can be recognized that the annular frame F is not accommodated in the slot 34 .

本實施形態之載入埠1中，控制部1C，接續第2對照處理St7，執行令對照器M2從第2對照結束高度位置上昇至第2對照開始高度位置之處理(對照上昇處理St8)。具體而言，本實施形態中的對照上昇處理St8，能夠以藉由門開閉機構9使載入埠門8從全開位置朝向門開放位置(O)往上方移動之處理來執行。In the load port 1 of the present embodiment, the control unit 1C executes the process of raising the collation device M2 from the second collation end height position to the second collation start height position following the second collation process St7 (collation raising process St8). Specifically, the contrast raising process St8 in this embodiment can be executed as a process of moving the loading port door 8 upward from the fully open position toward the door open position (O) by the door opening and closing mechanism 9 .

接下來，本實施形態之載入埠1中，控制部1C，藉由對照機構M進行第1對照處理St9。具體而言，藉由傾動機構M4使對照器M2從第2對照位置(P2)移動至圖6及圖8(ii)所示之第1對照位置(P1)，而將對照器M2置放於對照感測器M1會被配置在FOUP3內之最上段的狹槽34的稍微上側之高度位置(第1對照開始高度位置)，而藉由門開閉機構9使載入埠門8從門開放位置(O)朝向全開位置往下方移動，則對照機構M全體亦往下方移動。藉此，對照器M2，會將前後位置維持在第1對照位置(P1)，而從第1對照開始高度位置移動至比最下段的狹槽34還低之位置(第1對照結束高度位置)。控制部1C，循以上手續，檢測形成於對照感測器M1彼此之間的訊號路徑是否被遮擋，而執行對每一狹槽34獲得有關晶圓W的有無或收納姿勢的資訊(搬送對象物檢測資訊)之第1對照處理St9。Next, in the load port 1 of this embodiment, the control unit 1C performs the first collating process St9 by the collating mechanism M. Specifically, the collation device M2 is moved from the second comparison position (P2) to the first comparison position (P1) shown in Fig. 6 and Fig. 8(ii) by the tilting mechanism M4, and the collation device M2 is placed on The collation sensor M1 will be arranged at the height position slightly above the uppermost slot 34 in the FOUP3 (the first collation start height position), and the loading port door 8 will be opened from the door opening position by the door opening and closing mechanism 9 (O) If it moves downward toward the fully open position, the entire control mechanism M also moves downward. Thereby, the comparator M2 maintains the front-rear position at the first collation position (P1), and moves from the first collation start height position to a position lower than the lowermost slot 34 (the first collation end height position) . The control unit 1C, following the above procedures, detects whether the signal path formed between the collation sensors M1 is blocked, and executes obtaining information on the presence or absence of the wafer W or the storage posture (transport object) for each slot 34. Detection information) of the first control treatment St9.

另，於接續對照上昇處理St8而令對照器M2從第2對照位置(P2)移動到了第1對照位置(P1)之時間點，如果對照感測器M1的尺寸條件是會被置放於比FOUP3內的最上段的狹槽34還下側，則只要藉由適當的處理(若為本實施形態，是令對照機構M和載入埠門8一體地往上方移動規定距離之處理)，來調整對照器M2的高度位置使得對照感測器M1會被置放於比FOUP3內的最上段的狹槽34還上側即可。In addition, at the point in time when the collation device M2 is moved from the second collation position (P2) to the first collation position (P1) following the collation raising process St8, if the size condition of the collation sensor M1 is to be placed in the comparison If the uppermost slot 34 in the FOUP3 is still on the lower side, then only by appropriate processing (in the case of this embodiment, it is the processing of moving the collation mechanism M and the loading port door 8 upward for a predetermined distance integrally) to It only needs to adjust the height position of the contrast device M2 so that the contrast sensor M1 is placed on the upper side than the uppermost slot 34 in the FOUP3.

當第1對照處理St9的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的FOUP3內之狹槽34中收容有環狀框F、晶圓W的其中一者。另一方面，當第1對照處理St9的結果為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有晶圓W、環狀框F的任一者。When the result of the first comparison process St9 is "detected", it can be identified that either the ring frame F or the wafer W is accommodated in the slot 34 in the FOUP3 on the mounting table 5 . On the other hand, when the result of the first comparison process St9 is "not detected", it can be seen that neither the wafer W nor the ring frame F is accommodated in the slot 34 .

然後，本實施形態中，如圖11所示，能夠以藉由第1對照處理St9及第2對照處理St7而獲得之搬送對象物檢測資訊的結果，來辨明FOUP3內的收容狀況。也就是說，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果為「有偵測到」的情形下，能夠辨明該狹槽34中收容有晶圓W(正常積載)。此外，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果亦為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有晶圓W、環狀框F的任一者(空狹槽狀態)。Then, in the present embodiment, as shown in FIG. 11 , the storage status in the FOUP3 can be clarified based on the results of object detection information obtained by the first collation process St9 and the second collation process St7. That is to say, when the detection result of the second comparison process St7 is "not detected", and the detection result of the first comparison process St9 is "detected", it can be identified that the There is wafer W (normal stowage). In addition, when the detection result of the second control process St7 is "not detected", and the detection result of the first control process St9 is also "not detected", it can be identified that the slot 34 does not accommodate There is any one of the wafer W and the ring frame F (empty slot state).

另一方面，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果亦為「有偵測到」的情形下，能夠辨明該狹槽34中收容有環狀框F、晶圓W的其中一者(混載)。此外，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果為「無偵測到」的情形下，該狹槽34中的收容狀況成為矛盾，因此能夠辨明感測器錯誤。On the other hand, when the detection result of the second comparison process St7 is "detected", and the detection result of the first comparison process St9 is also "detected", it is possible to distinguish the One of the ring frame F and the wafer W (mixed loading) is accommodated. In addition, when the detection result of the second comparison process St7 is "detected" and the detection result of the first comparison process St9 is "not detected", the storage status in the slot 34 becomes contradictory. , so sensor errors can be discerned.

依以上，於在載置桌台5上保持了FOUP3的狀態下，若第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果為「有偵測到」，則能夠辨明為在FOUP3內未有晶圓W與環狀框F混載之「正常積載」，若為其以外的偵測結果，則能夠辨明為在FOUP3內混載收容有晶圓W與環狀框F，或是感測器錯誤。According to the above, in the state where FOUP3 is kept on the loading table 5, if the detection result of the second comparison process St7 is "not detected", the detection result of the first comparison process St9 is "detected". If "arrived", it can be identified as "normal loading" in which wafer W and ring frame F are not mixed in FOUP3. Circle F, or sensor error.

接下來，當在載置桌台5上保持了框匣C的情形下說明動作序列。本實施形態之載入埠1中，控制部1C，當判別在載置桌台5上保持了框匣C的情形下(容器判別處理St2；Yes)，循以下的處理手續。接續上述的就座保持處理St1，本實施形態之載入埠1中，控制部1C，執行藉由門開閉機構9使載入埠門8從全閉位置(C)往後方移動至門開放位置(O)，而將框4的開口部41設為開狀態之處理(門開放處理St6)，接續門開放處理St6，藉由牽引機構7使載置桌台5從就座位置朝向框4後退至搬送對象物授受位置(後方牽引處理St3)。Next, a sequence of operations will be described in a case where the cassette C is held on the mounting table 5 . In the loading port 1 of the present embodiment, when the control unit 1C judges that the cassette C is held on the loading table 5 (container judging process St2; Yes), the following processing procedures are followed. Following the above-mentioned seat holding process St1, in the loading port 1 of the present embodiment, the control unit 1C executes the door opening and closing mechanism 9 to move the loading port door 8 backward from the fully closed position (C) to the door open position (0), and the processing of opening the opening 41 of the frame 4 (door opening processing St6), following the door opening processing St6, the loading table 5 is retreated from the seating position toward the frame 4 by the traction mechanism 7 Go to the receiving position of the object to be conveyed (rear traction process St3).

本實施形態中適用之框匣C的平面尺寸，特別是前後方向的尺寸，比FOUP3的前後方向的尺寸還大，因此當比門開放處理St6還先執行了後方牽引處理St3的情形下，收容於框匣C內之環狀框F或是框匣C本體恐會和載入埠門8接觸。鑑此，本實施形態中，當在載置桌台5上載置了框匣C的情形下，係設定成將門開放處理St6優先於後方牽引處理St3執行。The plane dimension of the case C applicable to this embodiment, especially the dimension in the front-rear direction, is larger than the dimension in the front-rear direction of the FOUP3. Therefore, when the rear pulling process St3 is performed before the door opening process St6, it is stored. The annular frame F in the frame box C or the body of the frame box C may be in contact with the loading port 8 . In view of this, in the present embodiment, when the cassette C is placed on the loading table 5, it is set so that the door opening process St6 is executed with priority over the rear pulling process St3.

此外，本實施形態中適用之框匣C，為開放匣，因此能夠省略排淨處理及解閂鎖處理。另，中間工程、後工程中，搬送室2內的高空間清淨性並不必要，因此作為環狀框F的搬送容器3能夠使用開放匣。In addition, since the cassette C applied in this embodiment is an open cassette, it is possible to omit the cleaning process and the unlocking process. In addition, high cleanliness in the transfer chamber 2 is not necessary in the intermediate process and post-process, so an open box can be used as the transfer container 3 of the ring frame F.

然後，本實施形態之載入埠1中，控制部1C，接續後方牽引處理St3，執行將對照器M2置放於第2對照位置(P2)而進行之第2對照處理St7(參照圖9(i))、對照上昇處理St8、及將對照器M2置放於第1對照位置(P1)而進行之第1對照處理St9(參照圖9(ii))。Then, in the load port 1 of the present embodiment, the control unit 1C, following the rear pulling process St3, executes the second collation process St7 by placing the collation device M2 at the second collation position (P2) (see FIG. 9( i)), the first collation process St9 performed by placing the collation device M2 at the first collation position (P1), the collation raising process St8 (see FIG. 9(ii)).

當第2對照處理St7的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的框匣C內之狹槽C1中收容有環狀框F。另一方面，當第2對照處理St7的結果為「無偵測到」的情形下，能夠辨明該狹槽C1中未收容有環狀框F。When the result of the second comparison process St7 is "detected", it can be recognized that the annular frame F is accommodated in the slot C1 in the frame case C on the mounting table 5 . On the other hand, when the result of the second comparison process St7 is "not detected", it can be recognized that the annular frame F is not accommodated in the slot C1.

當第1對照處理St9的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的框匣C內之狹槽C1中收容有環狀框F、晶圓W的其中一者。另一方面，當第1對照處理St9的結果為「無偵測到」的情形下，能夠辨明該狹槽C1中未收容有晶圓W、環狀框F的任一者。When the result of the first comparison process St9 is "detected", it can be identified that either the annular frame F or the wafer W is accommodated in the slot C1 in the cassette C on the mounting table 5 By. On the other hand, when the result of the first comparison process St9 is "not detected", it can be seen that neither the wafer W nor the ring frame F is accommodated in the slot C1.

然後，本實施形態中，如圖11所示，能夠以藉由第1對照處理St9及第2對照處理St7而獲得之搬送對象物檢測資訊的結果，來辨明框匣C內的收容狀況。也就是說，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果亦為「有偵測到」的情形下，能夠辨明該狹槽C1中收容有環狀框F。此外，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果為「無偵測到」的情形下，該狹槽C1中的收容狀況成為矛盾，因此能夠辨明感測器錯誤。Then, in this embodiment, as shown in FIG. 11 , the storage status in the cassette C can be clarified based on the results of the object detection information obtained by the first collation process St9 and the second collation process St7. That is to say, when the detection result of the second comparison process St7 is "detected", and the detection result of the first comparison process St9 is also "detected", it is possible to distinguish the Contains ring frame F. In addition, when the detection result of the second comparison process St7 is "detected" and the detection result of the first comparison process St9 is "not detected", the storage status in the slot C1 becomes contradictory. , so sensor errors can be discerned.

另一方面，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果為「有偵測到」的情形下，能夠辨明該狹槽C1中收容有晶圓W。此外，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果亦為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有環狀框F、晶圓W的任一者(空狹槽狀態)。On the other hand, when the detection result of the second comparison process St7 is "not detected" and the detection result of the first comparison process St9 is "detected", it can be distinguished that the There is wafer W. In addition, when the detection result of the second control process St7 is "not detected", and the detection result of the first control process St9 is also "not detected", it can be identified that the slot 34 does not accommodate There is any one of the ring frame F and the wafer W (empty slot state).

依以上，於在載置桌台5上保持了框匣C的狀態下，若第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果亦為「有偵測到」，則能夠辨明為在框匣C內未有環狀框F與晶圓W混載之「正常積載」，若為其以外的偵測結果，則能夠辨明為在框匣C內混載收容有環狀框F與晶圓W，或是感測器錯誤。According to the above, in the state where the frame box C is kept on the loading table 5, if the detection result of the second comparison process St7 is "detected", the detection result of the first comparison process St9 is also " Detected", it can be identified as "normal stowage" in which there is no mixed loading of ring frame F and wafer W in cassette C, and if it is other than the detection result, it can be identified as in cassette C Mixed storage of ring frame F and wafer W, or sensor error.

本實施形態之載入埠1中，在載置桌台5上保持了FOUP3的情形下，在載置桌台5上保持了框匣C的情形下，在它們任一種情形下，控制部1C皆執行第1對照處理、第2對照處理，於該些2次的對照處理結束後，在將對照器M2置放於搬送室2的內部空間之狀態(例如置放於第2對照位置(P2)之狀態)下，執行藉由門開閉機構9使載入埠門8下降至全開位置之處理。藉此，對照機構M，會和往全開位置移動之載入埠門8一起往下方移動。本實施形態之載入埠1中，控制部1C，當基於第1對照處理及第2對照處理的偵測結果而辨明出非混載狀態或感測器錯誤狀態的情形下，係執行從載置桌台5上的FOUP3或框匣C將搬送對象物(晶圓W、環狀框F)藉由搬送機器人21依序往規定的搬送目的地(處理室R(具體而言為載入/載出室)、緩衝工作站、對準器等)搬送之處理。In the loading port 1 of the present embodiment, when the FOUP 3 is held on the mounting table 5, and when the cassette C is held on the mounting table 5, in either case, the control unit 1C All perform the first comparison treatment and the second comparison treatment. After these two comparison treatments are completed, the comparison device M2 is placed in the state of the internal space of the transfer chamber 2 (for example, placed in the second comparison position (P2 ) state), the process of lowering the loading port door 8 to the fully open position by the door opening and closing mechanism 9 is performed. Thereby, the collation mechanism M moves downward together with the loading port door 8 which moves toward the fully open position. In the load port 1 of the present embodiment, the control unit 1C executes the slave loading process when the non-mixed load state or the sensor error state is identified based on the detection results of the first collation process and the second collation process. The FOUP 3 or the cassette C on the table 5 sequentially sends the object to be transported (wafer W, ring frame F) to the specified transport destination (processing room R (specifically, loading/loading) by the transport robot 21 . Out of the room), buffer workstation, aligner, etc.) handling.

另一方面，當基於第1對照處理及第2對照處理的偵測結果而辨明出為混載狀態或感測器錯誤狀態的情形下，載置桌台5上的FOUP3或框匣C，會藉由搬送容器自動搬送裝置從載置桌台5被移載往其他空間，新的FOUP3或框匣C藉由搬送容器自動搬送裝置被載置於載置桌台5上，而循上述的動作序列。On the other hand, when it is identified as a mixed loading state or a sensor error state based on the detection results of the first comparison process and the second comparison process, the FOUP3 or the cassette C on the loading table 5 will be borrowed The container is transferred from the placement table 5 to other spaces by the automatic container transfer device, and the new FOUP3 or box C is placed on the placement table 5 by the transfer container automatic transfer device, and the above-mentioned action sequence is followed .

按照以上所述本實施形態之載入埠1，可使用對照有關包括FOUP3內的各狹槽34中的第1搬送對象物(晶圓W)的有無之狀態的資訊之對照機構M，來執行第2對照處理，而藉由第2對照處理來對照有關包括第2搬送容器(框匣C)內的各狹槽C1中的第2搬送對象物(環狀框F)的有無之狀態的資訊，基於第1對照處理的偵測結果與第2對照處理的偵測結果之雙方、或其中一方，而可辨明平面尺寸相異的搬送對象物W是否混載於載置桌台5上的FOUP3或框匣C內。是故，按照本實施形態之載入埠1，無需大幅變更以往的載入埠的構成，避免對照機構M的大型化及構造的複雜化，於中間工程以後，即使採用將互相平面尺寸相異的搬送對象物(晶圓W、環狀框F)利用共通的載入埠1來收容至載置於載入埠1上之FOUP3(第1搬送容器)或框匣C(第2搬送容器)而取用之使用形態的情形下，仍可偵測相異的搬送對象物(晶圓W、環狀框F)在FOUP3或框匣C中被誤混載(誤投入/誤積載)，而能夠謀求半導體製造中的運用率提升。According to the load port 1 of this embodiment as described above, it is possible to use the collating mechanism M for collating information on the presence or absence of the first object to be transported (wafer W) in each slot 34 in the FOUP 3. The second collation process is to collate the information about the state of the presence or absence of the second conveyance object (ring frame F) in each slot C1 in the second conveyance container (cassette C) by the second collation process Based on both or one of the detection results of the first comparison process and the second comparison process, it can be distinguished whether the conveyed objects W with different plane sizes are mixed on the FOUP3 or FOUP3 on the loading table 5. Inside Box C. Therefore, according to the loading port 1 of this embodiment, there is no need to greatly change the composition of the conventional loading port, avoiding the enlargement of the comparison mechanism M and the complexity of the structure. The object to be transported (wafer W, ring frame F) is stored in FOUP3 (first transport container) or cassette C (second transport container) placed on the load port 1 using the common load port 1 However, in the case of the used form, it is still possible to detect that different objects to be transported (wafer W, ring frame F) are misloaded (misplaced/misstowed) in FOUP3 or cassette C, and can To improve the utilization rate in semiconductor manufacturing.

又，本實施形態中，構成為藉由分別置放於第1對照位置(P1)或第2對照位置(P2)之對照器M2來偵測令載置桌台5上的工件中心互相一致之搬送對象物(晶圓W、環狀框F)的端部。也就是說，本實施形態中，是構成為於第1搬送對象物(晶圓W)及第2搬送對象物(環狀框F)在第1搬送容器(FOUP3)內或第2搬送容器(框匣C)內以彼此的中心位置相互一致之方式被收容之狀態下執行對照處理(第1對照處理、第2對照處理)，因此不必因應搬送對象物(晶圓W、環狀框F)的尺寸來變更搬送機器人21所做的搬送對象物之搬送距離或搬送位置，能夠謀求控制的簡化。Also, in this embodiment, it is configured to detect that the centers of the workpieces on the mounting table 5 coincide with each other by using the collimator M2 respectively placed at the first collation position (P1) or the second collation position (P2). The end of the object to be transported (wafer W, ring frame F). That is, in this embodiment, the first object to be transported (wafer W) and the second object to be transported (ring frame F) are configured such that they are placed in the first transport container (FOUP3) or in the second transport container ( The collation process (the first collation process, the second collation process) is performed in a state where the center positions of each other are accommodated in the cassette C), so there is no need to deal with the object to be transported (wafer W, ring frame F) Simplification of control can be achieved by changing the conveying distance or conveying position of the object to be conveyed by the conveying robot 21 according to the size of the object.

再加上，按照本實施形態之載入埠1，控制部1C，具有判別藉由就座保持機構6保持了FOUP3或框匣C的哪一者之容器判別部1Ca，因此可基於容器判別部1Ca所做的判別資訊，基於事先設定好的動作序列如就座保持處理、門開放處理、後方牽引處理、第1對照處理、第2對照處理的順序，或進行第1對照處理及第2對照處理雙方、或是僅進行其中一方的對照處理等，來自動控制各機構的動作。In addition, according to the loading port 1 of the present embodiment, the control unit 1C has a container discriminating unit 1Ca for discriminating which of the FOUP 3 or the cassette C is held by the seat holding mechanism 6, so it can be based on the container discriminating unit 1Ca. The discrimination information made by 1Ca is based on the pre-set sequence of actions such as the order of seat keeping processing, door opening processing, rear traction processing, first comparison processing, and second comparison processing, or performing the first comparison processing and the second comparison processing It can automatically control the actions of each mechanism by processing both sides, or performing comparison processing on only one of them.

特別是，本實施形態之載入埠1中，當判斷出藉由就座保持機構6保持了框匣C之搬送容器為框匣C的情形下，依序執行了就座保持處理、門開放處理、後方牽引處理之後，執行第1對照處理及第2對照處理雙方，藉此便能避免框匣C和載入埠門8衝撞之事態。In particular, in the loading port 1 of the present embodiment, when it is judged that the transport container holding the cassette C by the seating holding mechanism 6 is the cassette C, the seating holding process and the door opening are sequentially performed. After the processing and the rear traction processing, both the first comparison processing and the second comparison processing are performed, so that the collision between the cassette C and the loading port door 8 can be avoided.

此外，按照本實施形態中採用之載入埠1中的對照處理方法，會發揮如同上述的載入埠所發揮的種種作用效果之作用效果，能夠謀求半導體製造中的運用率提升。In addition, according to the collation processing method in the load port 1 adopted in this embodiment, various functions and effects similar to those of the above-mentioned load port are exerted, and the utilization rate in semiconductor manufacturing can be improved.

另，本發明並不限於上述實施形態。例如，上述實施形態中，作為第1搬送對象物係示例晶圓，作為和第1搬送對象物平面尺寸相異的第2搬送對象物係示例了保持中間處理完畢的薄晶圓之環狀框，但第1搬送對象物、第2搬送對象物不限定於它們。收容第2搬送對象物之第2搬送容器亦不限定於框匣，只要是和第2搬送對象物的尺寸等相應之適當的搬送容器即可。作為搬送容器，亦能適用附門的框匣。在此情形下，需要將匣門卸下之處理(解閂鎖處理)。In addition, this invention is not limited to the said embodiment. For example, in the above-mentioned embodiment, the wafer is exemplified as the first object to be transported, and the annular frame holding the thin wafer after intermediate processing is exemplified as the second object to be transported that is different in planar size from the first object to be transported. , but the first object to be conveyed and the second object to be conveyed are not limited to them. The second transport container for storing the second transport object is not limited to the box, and may be an appropriate transport container according to the size and the like of the second transport object. As a transport container, a frame box with a door can also be applied. In this case, a process of removing the cassette door (unlatching process) is required.

此外，第2搬送對象物為比第1搬送對象物平面尺寸還小之物亦無妨。在此情形下，執行關於第2搬送對象物之對照處理(第2對照處理)時的對照器的位置(第2對照位置)，會成為比執行關於第1搬送對象物之對照處理(第1對照處理)時的對照器的位置(第1對照位置)還前方。In addition, the second object to be conveyed may be smaller in plane size than the first object to be conveyed. In this case, the position of the collator (second collating position) when the collating process (second collating process) on the second object to be transported is executed will be different from that when the collating process (first collating process) on the first object to be transported is executed. The position of the collimator (the first control position) at the time of the control treatment) was still forward.

本發明中的「第1對照位置」及「第2對照位置」，可因應第1搬送對象物及第2搬送對象物的平面尺寸來適當設定，第2對照位置亦可為和上述實施形態中的不能對照晶圓位置相異之位置。按照本發明，從生產性提升的觀點看來，對於晶圓的大徑化進展，而從目前為止的直徑300(半徑150)mm往直徑450(半徑225)mm乃至直徑500(半徑250)mm的晶圓轉變推進這樣近來的傾向亦能良好地對應。也就是說，不僅是上述這樣半導體製造的中間工程、後工程，於初期工程中亦可以本發明之載入埠來取用2種類的尺寸不同的搬送對象物與和其相應之2種類的搬送容器，而進行正確的對照處理。The "first comparison position" and "second comparison position" in the present invention can be appropriately set in response to the planar dimensions of the first object to be transported and the second object to be transported, and the second comparison position can also be the same as in the above-mentioned embodiment. It is not possible to compare positions with different wafer positions. According to the present invention, from the viewpoint of productivity improvement, the increase in the diameter of wafers is progressing from the current diameter of 300 (radius 150) mm to diameter 450 (radius 225) mm and even diameter 500 (radius 250) mm The recent trend of wafer conversion advancement also corresponds well. That is to say, not only the above-mentioned intermediate process and post-process of semiconductor manufacturing, but also in the initial process, the loading port of the present invention can be used to take two types of objects to be transported with different sizes and corresponding two types of transport objects. container without the correct control treatment.

能夠適當變更將對照器置放於第1對照位置而執行之第1對照處理、及將對照器置放於第2對照位置而執行之第2對照處理的順序。此外，當第1或第2搬送容器中根本不會混載目的以外的搬送對象物之狀況下，亦能一面使用1種類的載入埠來取用2種類的搬送容器、2種類的搬送對象物，一面僅執行和搬送容器及搬送對象物相應之第1對照處理或第2對照處理的其中一方。The order of the first collation process executed by placing the collimator at the first collation position and the second collation process performed by placing the collimator at the second collation position can be appropriately changed. In addition, even when the first or second transport container does not mix objects other than the intended object at all, it is also possible to use one type of loading port to pick up two types of transport containers and two types of objects to be transported. , while executing only one of the first matching process or the second matching process corresponding to the transport container and the transport object.

上述實施形態中，對照機構的對照移動部(對照臂)，係示例了滿足藉由門開閉機構而和載入埠門一起朝前後方向及上下方向動作，且和門開閉機構獨立地動作之第2動作條件的雙方之物，但只要為滿足它們其中一方的條件之物即可。例如，能夠適用構成為具備使對照移動部往前後方向水平移動之滑動機構，而藉由滑動機構使對照器在第1對照位置與第2對照位置之間前後移動之對照機構，或採用藉由和門開閉機構不同的移動機構來使對照機構朝高度方向之構成。此外，對照機構，只要是於藉由門開閉機構將框的開口部設為開狀態之狀態下可實施對照處理之物即可，本發明中所謂「將框的開口部設為開狀態之狀態」，為涵括上述實施形態中將載入埠門置放於門開放位置之狀態、及置放於全開位置之狀態的雙方之概念。對照機構，只要為和載入埠門的升降移動獨立而可升降移動之物，則亦可於將載入埠門置放於相當於上述實施形態中的門開放位置之位置的狀態下實施對照處理，亦可於將門置放於相當於上述實施形態中的全開位置之位置的狀態下實施對照處理。In the above-mentioned embodiment, the collation moving part (contrast arm) of the collation mechanism is exemplified to satisfy the requirement of moving forward, backward and up and down together with the loading port door by the door opening and closing mechanism, and independently of the door opening and closing mechanism. 2 The thing of both sides of the action condition, as long as it is the thing that satisfies the condition of one of them. For example, it is possible to apply a collation mechanism that is configured to have a sliding mechanism that moves the collation moving part horizontally in the front-back direction, and the collation device is moved back and forth between the first collation position and the second collation position by the slide mechanism, or by using A different moving mechanism from the door opening and closing mechanism to make the control mechanism face the height direction. In addition, as long as the matching mechanism can perform the matching process in the state where the opening of the frame is opened by the door opening and closing mechanism, the so-called "state where the opening of the frame is opened" in the present invention " is a concept that includes both the state where the loading port door is placed in the door open position and the state where it is placed in the fully open position in the above-mentioned embodiment. As long as the comparison mechanism is independent of the lifting movement of the loading port door and can move up and down, the comparison can also be carried out in a state where the loading port door is placed at a position corresponding to the door open position in the above-mentioned embodiment. As for the processing, the comparison processing may be performed with the door placed at a position corresponding to the fully open position in the above-mentioned embodiment.

此外，本發明中，作為對照機構，能夠適用下述之物，即，具備：在先端部具有對照感測器之對照器；及對照移動部，將對照器的基端部或基端部鄰近予以可水平或略水平迴旋地支撐，且通過處於開狀態的框的開口部而使對照器移動至可藉由對照感測器偵測第1搬送容器(FOUP)中收容有第1搬送對象物之第1對照位置。在此情形下，例如對照移動部，係具備：作為對照感測器的迴旋中心之左右一對的迴旋軸；及使迴旋軸適當朝正逆方向同步旋轉之驅動部；及收容迴旋軸及驅動部的至少一部分或全部之機殼；將機殼做成安裝於載入埠門的適當處之構成，而能夠將對照器設定成可在第1對照位置、與不能藉由對照感測器偵測第1搬送容器中收容有第1搬送對象物的不能對照晶圓位置之間繞迴旋軸移動。又，能夠採用設計成將對照器的迴旋角度(例如以安裝於不能對照位置之對照器為基準之迴旋角度)設定為和使其從不能對照位置移動至第1對照位置時之迴旋角度相異的值，藉此通過處於開狀態的框的開口部而將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置之構成(第1構成)，或是設計成將對照器的迴旋角度設定為和使其從不能對照位置移動至第1對照位置時之迴旋角度相同的值，且控制載入埠門的前後方向的進退動作(前進、後退)，藉此將對照器置放於第2對照位置之構成(第2構成)。若為第1構成，則可將對照器的第2對照位置與不能對照位置設定為同一位置，而另一方面若為第2構成，則第2對照位置與不能對照位置必然地會成為相異位置。即使是這樣的對照機構，仍能在將對照器置放於第1對照位置之狀態下使載入埠門適當升降移動，藉此使對照機構全體升降而實施第1對照處理，而能在將對照器置放於第2對照位置之狀態下使載入埠門適當升降移動，藉此使對照機構全體升降而實施第2對照處理。若為這樣的構成，則上述實施形態中的對照臂或傾動機構便不需要。In addition, in the present invention, as the collation mechanism, the following can be applied, that is, it is provided with: a collation device having a collation sensor at the tip; It is supported horizontally or slightly horizontally, and the collation device can be moved through the opening of the open frame until the collation sensor detects that the first conveying object is contained in the first conveying container (FOUP). The first control position. In this case, for example, the comparison moving part is equipped with: a pair of left and right rotation shafts as the center of rotation of the comparison sensor; At least a part or all of the casing; the casing is made to be installed at a suitable place on the loading port door, and the collation device can be set to be at the first collation position, and can not be detected by the collation sensor It is measured that the first transfer object accommodated in the first transfer container moves around the rotary axis between positions of the non-contrastable wafer. In addition, it is possible to adopt a design that sets the turning angle of the collation device (for example, the turning angle based on the collation device installed at the non-collating position) to be different from the turning angle when it moves from the non-collating position to the first collating position. value, thereby placing the comparator at the second collation position where the collation sensor can detect that the second conveying object is accommodated in the second conveying container through the opening of the frame in the open state ( 1st configuration), or it is designed to set the turning angle of the comparator to the same value as the turning angle when it moves from the non-collation position to the first collation position, and to control the forward and backward movement of the loading port door (forward, backward), thereby placing the comparator at the second collation position (second configuration). If it is the first structure, the second collation position and the non-collating position of the collimator can be set at the same position, but on the other hand, if it is the second structure, the second collation position and the non-collating position will inevitably become different Location. Even with such a collation mechanism, the loading port door can be properly moved up and down in the state where the collation device is placed at the first collation position, so that the entire collation mechanism can be lifted up and down to implement the first collation process. When the collation device is placed at the second collation position, the loading port door is properly moved up and down, so that the whole collation mechanism is raised and lowered to implement the second collation process. With such a configuration, the control arm and the tilting mechanism in the above-mentioned embodiments are unnecessary.

此外，亦可藉由搬送機器人將搬送對象物(第1搬送對象物、第2搬送對象物)收容到了載入埠上的搬送容器(第1搬送容器、第2搬送容器)之後，也進行第1對照處理、第2對照處理的雙方或一方，來辨明是否為混載狀態。In addition, after the transfer object (the first transfer object, the second transfer object) is stored in the transfer container (the first transfer container, the second transfer container) on the loading port by the transfer robot, the second transfer may also be performed. 1 control treatment and both or one of the 2 control treatment to identify whether it is a mixed loading state.

另，就座保持機構、牽引機構、門開閉機構等各機構的具體構成或驅動源亦能適當變更。In addition, the specific configuration and driving source of each mechanism such as the seat holding mechanism, the traction mechanism, and the door opening and closing mechanism can also be appropriately changed.

作為判別藉由保持就座保持機構保持了種類相異的搬送容器(若為上述實施形態則為FOUP、框匣)的哪一者之容器判別部，亦可適用藉由是否偵測到載置平台上的搬送容器為FOUP，來判別搬送容器。It is also possible to apply the method of detecting whether or not a placement is detected as the container determination unit for determining which of the transport containers of different types (FOUP and cassette in the case of the above-mentioned embodiment) is held by the seat holding mechanism. The conveying container on the platform is FOUP, and the conveying container is judged.

本發明之載入埠，如上述般可作為構成EFEM的一部分之物來使用，亦能適用於EFEM以外的搬送裝置。The load port of the present invention can be used as a part of EFEM as described above, and can also be applied to transfer devices other than EFEM.

此外，例如亦可作為構成篩選裝置的一部分之物來使用，該篩選裝置是在搬送室的壁面配置複數個本發明之載入埠，而可藉由配置於搬送室內的搬送機器人在載置於各載入埠的載置桌台上之搬送容器間抽換搬送對象物。In addition, for example, it can also be used as a part of a screening device in which a plurality of loading ports of the present invention are arranged on the wall surface of the transfer chamber, and a transfer robot arranged in the transfer chamber can be placed on the Swap the object to be transported between the transport containers on the loading table of each loading port.

本發明之載入埠所鄰接配置的搬送室，為在內部空間具備有搬送機器人之物。本發明中，可將對於各載入埠的載置桌台上的搬送容器(第1搬送容器、第2搬送容器)而言之搬送對象物(第1搬送對象物、第2搬送對象物)的搬出入處理，構成為以單一的搬送機器人來進行之態樣、或是構成為以複數個搬送機器人來進行之態樣的任一種。作為搬送機器人，能夠適用具有3個以上的搬送對象物把持部(若為上述實施形態則為機械手)之物。此外，作為搬送機器人，能夠適用具有1個搬送對象物把持部之物。此外，亦能適用搬送對象物把持部是由機械手以外的規定部件等所構成之搬送機器人。The transfer chamber arranged adjacent to the loading port of the present invention is equipped with a transfer robot in the internal space. In the present invention, the object to be transported (the first object to be transported, the second object to be transported) to the transport container (the first transport container, the second transport container) on the mounting table of each loading port can be The carrying-in/out processing of the above-described processing is performed either by a single transfer robot or by a plurality of transfer robots. As a transfer robot, what has three or more transfer target object grasping parts (in the case of the above-mentioned embodiment, a robot arm) can be applied. In addition, as a transfer robot, what has one transfer target object grasping part can be applied. In addition, it is also possible to apply a transfer robot in which the gripping part of the transfer object is constituted by predetermined members other than the manipulator.

配置於搬送室的壁面之載入埠亦可為1台。上述實施形態中，示例了載入埠的框係構成為搬送室的外壁的一部分之態樣，但框亦可為沿著搬送室的外壁而設置之物。There may be one loading port arranged on the wall surface of the transfer chamber. In the above embodiment, the case where the frame of the loading port is constituted as a part of the outer wall of the transfer chamber was exemplified, but the frame may be provided along the outer wall of the transfer chamber.

上述實施形態，作為搬送對象物示例了晶圓，但搬送對象物亦可為倍縮光罩(reticle)、液晶搬送對象物、玻璃搬送對象物、培養平板(culture plate)、培養容器、碟、或培養皿等。也就是說，本發明能夠適用於將收容於半導體、液晶、細胞培養等各種領域中的容器之搬送對象予以授受之載入埠。In the above-mentioned embodiment, a wafer was exemplified as an object to be transported, but the object to be transported may also be a reticle, a liquid crystal transport object, a glass transport object, a culture plate, a culture container, a dish, or Petri dishes etc. That is to say, the present invention can be applied to a loading port for accepting and accepting transport objects of containers accommodated in various fields such as semiconductors, liquid crystals, and cell cultures.

鄰接於搬送室而設置之處理室的處理內容或數量亦能適當變更。The processing content and number of processing chambers provided adjacent to the transfer chamber can also be appropriately changed.

上述實施形態中，示例了載入埠具備控制部，由控制部來掌控載入埠門的移動等各部的作動之態樣，但亦可構成為藉由掌控載入埠的上位裝置(若為上述實施形態則為EFEM、或是處理室)的作動之控制部(上位控制器亦即上述的EFEM全體的控制部或處理室的控制部)來一併掌控載入埠的作動。 In the above-mentioned embodiment, the load port has a control unit, and the control unit controls the movement of each part such as the movement of the load port gate, but it can also be configured by controlling the upper device of the load port (if In the above embodiment, the operation control part of the EFEM (or the processing chamber) (the upper controller, that is, the control part of the entire EFEM or the control part of the processing chamber) controls the operation of the load port.

此外，上述的控制部，不依賴專用的系統，而可使用通常的電腦系統來實現。例如，能夠在汎用電腦中從存儲有用來執行上述處理的程式之記錄媒體(軟碟、CD-ROM等)安裝該程式，藉此構成執行上述處理之控制部。又，用來供給該些程式之手段為任意。除能夠上述般透過規定的記錄媒體來供給外，例如亦可透過通訊線路、通訊網路、通訊系統等來供給。在此情形下，例如亦可在通訊網路的布告欄(BBS)公布該程式，而將其透過網路來疊加至載波來提供。又，能夠藉由起動像這樣被提供的程式，於OS的控制下如同其他應用程式般執行，來執行上述處理。 In addition, the above-mentioned control unit does not depend on a dedicated system, but can be realized using a normal computer system. For example, the program can be installed in a general-purpose computer from a recording medium (floppy disk, CD-ROM, etc.) storing the program for executing the above-mentioned processing, thereby constituting a control unit that executes the above-mentioned processing. Also, the means for supplying these programs is arbitrary. In addition to being able to be supplied through a predetermined recording medium as described above, for example, it may be supplied through a communication line, a communication network, a communication system, and the like. In this case, for example, the program may be published on a bulletin board (BBS) of a communication network, and provided by being superimposed on a carrier wave through the network. Also, the above processing can be executed by activating the provided program and executing it like other application programs under the control of the OS.

除此之外，有關各部分的具體構成亦不限於上述實施形態，在不脫離本發明要旨之範圍內可為各種變形。In addition, the specific structure of each part is not limited to the said embodiment, Various modifications are possible within the range which does not deviate from the gist of this invention.

1:載入埠 1: load port

1C:(載入埠1的)控制部 1C: (load port 1) control section

1Ca:容器判別部 1Ca: container identification department

2:搬送室 2: transfer room

2C:(EFEM全體的)控制部 2C: (Overall of EFEM) Control Department

21:搬送機器人 21: Transfer robot

4:框 4: frame

41:開口部 41: Opening

3:FOUP 3: FOUP

32:FOUP門 32: FOUP door

34:狹槽 34: slot

5:載置桌台 5: Mounting table

6:就座保持機構 6: Seating Keeping Mechanism

7:牽引機構 7: traction mechanism

8:載入埠門 8: Load Port Gate

9:門開閉機構 9: Door opening and closing mechanism

C:第2搬送容器(框匣) C: The second transport container (frame box)

F:第2搬送對象物(環狀框) F: The second object to be transported (circular frame)

M:對照機構 M: comparison institution

M1:對照感測器 M1: control sensor

M2:對照器 M2: Comparator

M3:對照移動部(對照臂) M3: Control moving part (control arm)

RC:(處理室R的)控制部 RC: (of processing chamber R) control section

W:第1搬送對象物(晶圓) W: The first object to be transported (wafer)

[圖1]揭示具備了本發明一實施形態之載入埠的EFEM及其周邊裝置的相對位置關係之模型化示意側面圖。 　　[圖2]將圖1所示相對位置關係簡化後的平面圖。 　　[圖3]同實施形態之載入埠的立體圖。 　　[圖4]同實施形態之載入埠一部分省略示意正面圖。 　　[圖5]在載置桌台上載置有框匣且載入埠門處於門開放位置之狀態的同實施形態之載入埠的側面圖。 　　[圖6]對應於圖5而示意將對照器置放至第1對照位置的狀態之圖。 　　[圖7]同實施形態中的搬送對象物的平面圖。 　　[圖8]對於收容在FOUP內的狹槽的第1搬送對象物之對照機構的對照處理動作模型化示意圖。 　　[圖9]對於收容在第2搬送容器內的狹槽的第2搬送對象物之對照機構的對照處理動作模型化示意圖。 　　[圖10]本實施形態中的載入埠的動作手續示意流程圖。 　　[圖11]本實施形態中的第1對照處理及第2對照處理之偵測狀況及對照結果示意圖表。[FIG. 1] A schematic side view of a model showing the relative positional relationship between an EFEM equipped with a load port and its peripheral devices according to an embodiment of the present invention. [Fig. 2] Simplified plan view of the relative positional relationship shown in Fig. 1. [Fig. 3] A perspective view of the loading port of the same embodiment. [Fig. 4] It is a schematic front view with part of the loading port of the same embodiment omitted. [Fig. 5] A side view of the loading port of the same embodiment with the frame case placed on the loading table and the loading port door in the door open position. [Fig. 6] Corresponding to Fig. 5, it is a diagram showing the state where the comparator is placed at the first collation position. [FIG. 7] A plan view of an object to be conveyed in the same embodiment. [Fig. 8] Schematic diagram of the collation processing operation model of the collation mechanism for the first object to be transported in the slot in the FOUP. [FIG. 9] Schematic diagram of the collation processing operation model of the collation mechanism for the second object to be conveyed stored in the slot in the second conveyance container. [FIG. 10] A schematic flowchart of the operation procedure of the load port in this embodiment. [Figure 11] Schematic diagram of the detection status and comparison results of the first control treatment and the second control treatment in this embodiment.

Claims (7)

一種載入埠，係和在內部具備了搬送機器人之搬送室共同構成EFEM之載入埠，其特徵為，具備：平板狀的框，以站立姿勢併設於前述搬送室且具有可供第1搬送對象物以略水平姿勢通過之開口部；及載置桌台，可載置第1搬送容器，該第1搬送容器具有可將複數個前述第1搬送對象物多段狀地收容之狹槽(slot)；及載入埠門，可將前述框的前述開口部開閉；及就座保持機構，將從外部被搬送來的前述第1搬送容器保持於前述載置桌台上；及門開閉機構，令前述載入埠門移動至朝前述搬送室側後退之門開放位置，藉此將前述框的前述開口部設為開狀態；及牽引機構，在相對於前述框而言以朝前方突出之姿勢配置之前述載置桌台上，令前述第1搬送容器在就座位置與搬送對象物授受位置之間朝前後方向移動；及對照機構，於藉由前述門開閉機構將前述開口部設為了開狀態之狀態下，對照有關包括位於前述搬送對象物授受位置的前述第1搬送容器內的前述各狹槽中的前述第1搬送對象物的有無之狀態之資訊；及控制部，掌控前述就座保持機構、前述牽引機構、前述門開閉機構、及前述對照機構的動作； 前述對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐前述對照器且通過處於開狀態之前述開口部令前述對照器移動至可藉由前述對照感測器偵測前述第1搬送容器中收容有前述第1搬送對象物之第1對照位置，前述載置桌台，可載置第2搬送容器，該第2搬送容器係可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽，前述控制部，可執行：就座保持處理，藉由前述就座保持機構，把可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽之第2搬送容器或前述第1搬送容器保持於前述載置桌台上；及後方牽引處理，藉由前述牽引機構令前述載置桌台上的前述第2搬送容器或第1搬送容器從前述就座位置移動至前述搬送對象物授受位置；及門開放處理，藉由前述門開閉機構將前述開口部設為開狀態；及第1對照處理，通過處於開狀態之前述開口部將前述對照器置放於前述第1對照位置而令其執行前述對照機構所做之對照處理；及第2對照處理，通過處於開狀態之前述開口部將前述對照器置放於可藉由和前述第1對照處理中運用的前述對照感測器共通之前述對照感測器偵測前述第2搬送容器中收容有前述第2搬送對象物之第2對照位置而令其執行前述對照機構所做之對照處理；係選擇性地執行前述第1對照處理及前述第2對照處理的其中一方或雙方。 A loading port that constitutes a loading port of EFEM together with a transfer chamber equipped with a transfer robot inside, is characterized in that: a flat frame is provided in a standing posture in the transfer chamber and has a first transfer The opening part through which the object passes through in a substantially horizontal posture; and the loading table on which the first transport container can be placed. ); and the loading port door, which can open and close the aforementioned opening of the aforementioned frame; and the seat holding mechanism, which keeps the aforementioned first transport container transported from the outside on the aforementioned loading table; and the door opening and closing mechanism, The aforementioned loading port door is moved to the door opening position retreating toward the aforementioned transfer chamber side, whereby the aforementioned opening of the aforementioned frame is set to an open state; and the pulling mechanism is in a forward protruding posture relative to the aforementioned frame On the above-mentioned loading table configured, the above-mentioned first conveying container is moved in the front-rear direction between the seating position and the conveying object receiving position; In the state of the state, the information about the presence or absence of the first conveying object in the aforementioned slots in the first conveying container located at the receiving position of the conveying object is compared; and the control unit controls the seating Actions of the holding mechanism, the aforementioned traction mechanism, the aforementioned door opening and closing mechanism, and the aforementioned comparison mechanism; The aforesaid collation mechanism is equipped with: a collation device having a collation sensor at the tip; The device detects the first comparison position where the first conveying object is stored in the first conveying container, and the aforementioned loading table can place the second conveying container, which can be combined with the first conveying container. The second object to be transported that is different in plane size from the object is stored in the multi-stage slot, and the control unit can perform: seat holding processing, and the plane of the first object to be transported can be combined with the above-mentioned first object to be transported by the seat holding mechanism The second conveying objects of different sizes are accommodated in the second conveying container of the multi-stage slot or the aforementioned first conveying container is kept on the aforementioned loading table; The second transport container or the first transport container on the table is moved from the seating position to the transport object receiving position; and the door opening process is to open the opening by the door opening and closing mechanism; and the first Contrast treatment, place the aforesaid comparator at the aforesaid first collation position through the aforesaid opening in the open state to make it execute the collation treatment done by the aforesaid collation mechanism; and second collation treatment, pass through the aforesaid opening in the open state By placing the collation device in the same collation sensor as the collation sensor used in the first collation process, it is possible to detect the second object containing the second object to be transported in the second transport container. Comparing the location and making it perform the comparison treatment performed by the aforementioned comparison institution; it is to selectively execute one or both of the aforementioned first comparison treatment and the aforementioned second comparison treatment. 如申請專利範圍第1項所述之載入埠，其中，前述第1對照位置，為前述對照感測器被配置於比前述框當中面向前述搬送室之後壁面還前方之位置，前述第2對照位置，為前述對照感測器被配置於比前述框的前述後壁面還後方之位置。 The loading port as described in item 1 of the scope of the patent application, wherein the first comparison position is that the comparison sensor is arranged at a position in front of the rear wall facing the transfer chamber in the aforementioned frame, and the second comparison position The position means that the comparison sensor is disposed behind the rear wall of the frame. 如申請專利範圍第2項所述之載入埠，其中，前述控制部，具有：容器判別部，判別藉由前述就座保持機構保持了前述第1搬送容器或前述第2搬送容器的哪一者，當前述容器判別部判斷出藉由前述就座保持機構保持了前述第2搬送容器的情形下，依序執行前述就座保持處理、前述門開放處理、前述後方牽引處理之後，執行前述第1對照處理及前述第2對照處理的雙方。 The loading port according to claim 2, wherein the control unit includes a container discriminating unit that discriminates which of the first transport container or the second transport container is held by the seating holding mechanism. Or, when the container judging unit judges that the second transport container is held by the seat holding mechanism, the seat holding process, the door opening process, and the rear pulling process are sequentially performed, and then the second transport container is executed. Both of the 1 control treatment and the aforementioned 2nd control treatment. 一種載入埠中的對照處理方法，係具備了對照機構之載入埠中的對照處理方法，該對照機構是被用於用來在可將複數片的第1搬送對象物存儲於多段式狹槽之第1搬送容器與搬送室之間授受前述第1搬送對象物，而對照有關包括前述第1搬送容器的各狹槽中的第1搬送對象物的有無之狀態之資訊，前述載入埠，構成為可與第2搬送容器之間授受前述第2搬送對象物，該第2搬送容器係可將和第1搬送對象物平面尺寸相異的第2搬送對象物存儲複數個於多段式狹 槽，前述對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐前述對照器且令前述對照器移動至可藉由前述對照感測器偵測前述第1搬送容器中收容有前述第1搬送對象物之第1對照位置，執行第1對照處理及第2對照處理的雙方，以偵測前述第1搬送容器中是否混載有前述第2搬送對象物或前述第2搬送容器中是否混載有前述第1搬送對象物，其中，該第1對照處理是將前述對照器置放於前述第1對照位置而令其執行前述對照機構所做之對照處理，該第2對照處理是將前述對照器置放於可藉由對照感測器偵測前述第2搬送容器中收容有前述第2搬送對象物之第2對照位置而執行對照處理。 A collation processing method in a loading port, which is a collation processing method in a loading port equipped with a collation mechanism, which is used to store a plurality of sheets of first conveyed objects in a multi-stage slot The first transfer object in the slot is exchanged between the first transfer container and the transfer chamber, and the information about the presence or absence of the first transfer object in each slot including the first transfer container is checked. , is configured to be able to transfer the aforementioned second object to be conveyed between the second conveying container, and the second conveying container can store a plurality of second objects to be conveyed that are different in planar size from the first object to be conveyed in a multi-stage narrow The groove, the above-mentioned comparison mechanism, is equipped with: a comparison device, which has a comparison sensor at the tip; In the first collation position where the first object to be conveyed is stored in the conveyance container, both the first collation process and the second collation process are executed to detect whether the second conveyance object or the above-mentioned Whether or not the first object to be transported is mixed in the second transport container, wherein the first comparison process is to place the aforementioned collation device at the aforementioned first comparison position and make it perform the collation process performed by the aforementioned collation mechanism, the first collation device 2. The collation process is to place the collation device at the second collation position where the collation sensor can detect that the second conveying object is stored in the second conveying container to execute the collation process. 一種載入埠，係和在內部具備了搬送機器人之搬送室共同構成EFEM之載入埠，其特徵為，具備：平板狀的框，以站立姿勢併設於前述搬送室且具有可供第1搬送對象物以略水平姿勢通過之開口部；及載置桌台，可載置第1搬送容器，該第1搬送容器具有可將複數個前述第1搬送對象物多段狀地收容之狹槽(slot)；及載入埠門，可將前述框的前述開口部開閉；及就座保持機構，將從外部被搬送來的前述第1搬送容器保持於前述載置桌台上；及 門開閉機構，令前述載入埠門移動至朝前述搬送室側後退之門開放位置，藉此將前述框的前述開口部設為開狀態；及牽引機構，在相對於前述框而言以朝前方突出之姿勢配置之前述載置桌台上，令前述第1搬送容器在就座位置與搬送對象物授受位置之間朝前後方向移動；及對照機構，於藉由前述門開閉機構將前述開口部設為了開狀態之狀態下，對照有關包括位於前述搬送對象物授受位置的前述第1搬送容器內的前述各狹槽中的前述第1搬送對象物的有無之狀態之資訊；及控制部，掌控前述就座保持機構、前述牽引機構、前述門開閉機構、及前述對照機構的動作；前述對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐前述對照器且通過處於開狀態之前述開口部令前述對照器移動至可藉由前述對照感測器偵測前述第1搬送容器中收容有前述第1搬送對象物之第1對照位置，前述載置桌台，可載置第2搬送容器，該第2搬送容器係可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽，前述控制部，可執行：就座保持處理，藉由前述就座保持機構，把可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽之第2搬送容器或前述第1搬送容器保持於前述載置桌台上；及後方牽引處理，藉 由前述牽引機構令前述載置桌台上的前述第2搬送容器或第1搬送容器從前述就座位置移動至前述搬送對象物授受位置；及門開放處理，藉由前述門開閉機構將前述開口部設為開狀態；及第1對照處理，通過處於開狀態之前述開口部將前述對照器置放於前述第1對照位置而令其執行前述對照機構所做之對照處理；及第2對照處理，通過處於開狀態之前述開口部將前述對照器置放於可藉由前述對照感測器偵測前述第2搬送容器中收容有前述第2搬送對象物之第2對照位置而令其執行前述對照機構所做之對照處理；係選擇性地執行前述第1對照處理及前述第2對照處理的其中一方或雙方，前述第1對照位置，為前述對照感測器被配置於比前述框當中面向前述搬送室之後壁面還前方之位置，前述第2對照位置，為前述對照感測器被配置於比前述框的前述後壁面還後方之位置。 A loading port that constitutes a loading port of EFEM together with a transfer chamber equipped with a transfer robot inside, is characterized in that: a flat frame is provided in a standing posture in the transfer chamber and has a first transfer The opening part through which the object passes through in a substantially horizontal posture; and the loading table on which the first transport container can be placed. ); and the loading port door, which can open and close the aforementioned opening of the aforementioned frame; and the seat holding mechanism, which keeps the aforementioned first transport container transported from the outside on the aforementioned loading table; and The door opening and closing mechanism moves the aforementioned loading port door to the door open position retreating toward the side of the transfer chamber, whereby the aforementioned opening of the aforementioned frame is set to an open state; On the above-mentioned loading table arranged in a protruding posture in front, the above-mentioned first conveying container is moved in the front-rear direction between the seating position and the conveying object receiving position; In the state where the part is set to the open state, the information about the presence or absence of the first object to be conveyed in the slots of the first conveyance container located at the receiving position of the object to be conveyed is collated; and the control part, Control the actions of the aforementioned seat keeping mechanism, the aforementioned traction mechanism, the aforementioned door opening and closing mechanism, and the aforementioned comparison mechanism; the aforementioned comparison mechanism is equipped with: a comparison device with a comparison sensor at the tip; and through the opening in the open state, the collation device can be moved to the first collation position where the first object to be conveyed is stored in the first conveying container by the collation sensor, and the placement table The table can be equipped with a second transport container, and the second transport container can store a second transport object different in planar size from the first transport object in the multi-stage slot, and the control unit can execute: The seat holding process is to hold the second transport container or the first transport container that can store the second transport object that is different in planar size from the first transport object in the multi-stage slot by the seat holding mechanism. On the aforementioned loading table; and rear traction processing, by The aforementioned second transport container or the first transport container on the aforementioned loading table is moved from the aforementioned seating position to the aforementioned transport object receiving position by the aforementioned traction mechanism; part is set to an open state; and the first comparison process is to place the aforementioned collation device at the aforementioned first comparison position through the aforementioned opening part in the open state to make it perform the comparison process done by the aforementioned comparison mechanism; and the second comparison process , place the aforesaid comparator at the second collation position where the aforesaid second conveying object is accommodated in the aforesaid second conveying container through the aforesaid collation sensor to make it perform the aforesaid The comparison process done by the comparison institution; it is to selectively execute one or both of the aforementioned first comparison treatment and the aforementioned second comparison treatment. The position where the rear wall of the transfer chamber is further forward, and the second collation position is a position where the collation sensor is arranged behind the rear wall of the frame. 一種載入埠，係和在內部具備了搬送機器人之搬送室共同構成EFEM之載入埠，其特徵為，具備：平板狀的框，以站立姿勢併設於前述搬送室且具有可供第1搬送對象物以略水平姿勢通過之開口部；及載置桌台，可載置第1搬送容器，該第1搬送容器具有可將複數個前述第1搬送對象物多段狀地收容之狹槽(slot)；及載入埠門，可將前述框的前述開口部開閉；及 就座保持機構，將從外部被搬送來的前述第1搬送容器保持於前述載置桌台上；及門開閉機構，令前述載入埠門移動至朝前述搬送室側後退之門開放位置，藉此將前述框的前述開口部設為開狀態；及牽引機構，在相對於前述框而言以朝前方突出之姿勢配置之前述載置桌台上，令前述第1搬送容器在就座位置與搬送對象物授受位置之間朝前後方向移動；及對照機構，於藉由前述門開閉機構將前述開口部設為了開狀態之狀態下，對照有關包括位於前述搬送對象物授受位置的前述第1搬送容器內的前述各狹槽中的前述第1搬送對象物的有無之狀態之資訊；及控制部，掌控前述就座保持機構、前述牽引機構、前述門開閉機構、及前述對照機構的動作；前述對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐前述對照器且通過處於開狀態之前述開口部令前述對照器移動至可藉由前述對照感測器偵測前述第1搬送容器中收容有前述第1搬送對象物之第1對照位置，前述載置桌台，可載置第2搬送容器，該第2搬送容器係可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽，前述控制部，可執行：就座保持處理，藉由前述就座保持機構，把可將和前述第1搬送對象物平面尺寸相異的 第2搬送對象物收容於多段式狹槽之第2搬送容器或前述第1搬送容器保持於前述載置桌台上；及後方牽引處理，藉由前述牽引機構令前述載置桌台上的前述第2搬送容器或第1搬送容器從前述就座位置移動至前述搬送對象物授受位置；及門開放處理，藉由前述門開閉機構將前述開口部設為開狀態；及第1對照處理，通過處於開狀態之前述開口部將前述對照器置放於前述第1對照位置而令其執行前述對照機構所做之對照處理；及第2對照處理，通過處於開狀態之前述開口部將前述對照器置放於可藉由前述對照感測器偵測前述第2搬送容器中收容有前述第2搬送對象物之第2對照位置而令其執行前述對照機構所做之對照處理；係選擇性地執行前述第1對照處理及前述第2對照處理的其中一方或雙方，又，前述控制部，具有：容器判別部，判別藉由前述就座保持機構保持了前述第1搬送容器或前述第2搬送容器的哪一者，當前述容器判別部判斷出藉由前述就座保持機構保持了前述第2搬送容器的情形下，依序執行前述就座保持處理、前述門開放處理、前述後方牽引處理之後，執行前述第1對照處理及前述第2對照處理的雙方。 A loading port that constitutes a loading port of EFEM together with a transfer chamber equipped with a transfer robot inside, is characterized in that: a flat frame is provided in a standing posture in the transfer chamber and has a first transfer The opening part through which the object passes through in a substantially horizontal posture; and the loading table on which the first transport container can be placed. ); and the loading port door, which can open and close the aforementioned opening of the aforementioned frame; and a seating holding mechanism for holding the first transport container transported from the outside on the loading table; and a door opening and closing mechanism for moving the loading port door to a door opening position retreating toward the side of the transport chamber, Thereby, the aforementioned opening of the aforementioned frame is set to an open state; and the traction mechanism makes the aforementioned first transfer container at the seating position on the aforementioned loading table arranged in a posture protruding forward with respect to the aforementioned frame. Move toward the front-back direction between the delivery and receiving position of the conveyed object; and the collation mechanism, in the state where the aforementioned opening is set to the open state by the aforementioned door opening and closing mechanism, collates the aforementioned first position including the position of the conveyed object. information on the presence or absence of the first object to be transported in each of the slots in the transport container; and a control unit that controls the actions of the seat holding mechanism, the traction mechanism, the door opening and closing mechanism, and the comparison mechanism; The aforesaid collation mechanism is equipped with: a collation device having a collation sensor at the tip; The device detects the first comparison position where the first conveying object is stored in the first conveying container, and the aforementioned loading table can place the second conveying container, which can be combined with the first conveying container. The second object to be transported that is different in plane size from the object is stored in the multi-stage slot, and the control unit can perform: seat holding processing, and the plane of the first object to be transported can be combined with the above-mentioned first object to be transported by the seat holding mechanism different sizes The second conveying object accommodated in the second conveying container of the multi-stage slit or the aforementioned first conveying container is held on the aforementioned loading table; The second transfer container or the first transfer container is moved from the seating position to the transfer target object receiving position; and the door opening process is to open the opening by the door opening and closing mechanism; and the first comparison process is performed by The aforementioned opening in the open state places the aforementioned collation device at the aforementioned first comparison position to make it perform the comparison process done by the aforementioned comparison mechanism; Placed in the second comparison position where the aforementioned second transfer object is stored in the aforementioned second transfer container through the aforementioned comparison sensor, so that it can perform the comparison process done by the aforementioned comparison mechanism; it is selectively executed In one or both of the first comparison process and the second comparison process, the control unit includes a container discrimination unit for discriminating whether the first transport container or the second transport container is held by the seating holding mechanism. When the container judging unit judges that the second conveyance container is held by the seat holding mechanism, after sequentially executing the seat holding process, the door opening process, and the rear pulling process, Both the aforementioned first control process and the aforementioned second control process were performed. 一種載入埠，係和在內部具備了搬送機器人之搬送室共同構成EFEM之載入埠，其特徵為，具備：平板狀的框，以站立姿勢併設於前述搬送室且具有可供第1搬送對象物以略水平姿勢通過之開口部；及 載置桌台，可載置第1搬送容器，該第1搬送容器具有可將複數個前述第1搬送對象物多段狀地收容之狹槽(slot)；及載入埠門，可將前述框的前述開口部開閉；及就座保持機構，將從外部被搬送來的前述第1搬送容器保持於前述載置桌台上；及門開閉機構，令前述載入埠門移動至朝前述搬送室側後退之門開放位置，藉此將前述框的前述開口部設為開狀態；及牽引機構，在相對於前述框而言以朝前方突出之姿勢配置之前述載置桌台上，令前述第1搬送容器在就座位置與搬送對象物授受位置之間朝前後方向移動；及對照機構，於藉由前述門開閉機構將前述開口部設為了開狀態之狀態下，對照有關包括位於前述搬送對象物授受位置的前述第1搬送容器內的前述各狹槽中的前述第1搬送對象物的有無之狀態之資訊；及控制部，掌控前述就座保持機構、前述牽引機構、前述門開閉機構、及前述對照機構的動作；前述對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐前述對照器且通過處於開狀態之前述開口部令前述對照器移動至可藉由前述對照感測器偵測前述第1搬送容器中收容有前述第1搬送對象物之第1對照位置，前述載置桌台，可載置第2搬送容器，該第2搬送容器 係可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽，前述控制部，可執行：就座保持處理，藉由前述就座保持機構，把可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽之第2搬送容器或前述第1搬送容器保持於前述載置桌台上；及後方牽引處理，藉由前述牽引機構令前述載置桌台上的前述第2搬送容器或前述第1搬送容器從前述就座位置移動至前述搬送對象物授受位置；及門開放處理，藉由前述門開閉機構將前述開口部設為開狀態；及第1對照處理，通過處於開狀態之前述開口部將前述對照器置放於前述第1對照位置而令其執行前述對照機構所做之對照處理；及第2對照處理，通過處於開狀態之前述開口部將前述對照器置放於可藉由前述對照感測器偵測前述第2搬送容器中收容有前述第2搬送對象物之第2對照位置而令其執行前述對照機構所做之對照處理，在置放於前述搬送對象物授受位置的前述載置桌台上的前述第1搬送容器內的前述第1搬送對象物的中心位置，和置放於前述搬送對象物授受位置的前述載置桌台上的前述第2搬送容器內的前述第2搬送對象物的中心位置被收容成一致的狀態下，執行前述第1對照處理及前述第2對照處理的其中一方或雙方。A loading port that constitutes a loading port of EFEM together with a transfer chamber equipped with a transfer robot inside, is characterized in that: a flat frame is provided in a standing posture in the transfer chamber and has a first transfer The opening through which the object passes in a roughly horizontal posture; and The loading table is capable of placing the first transport container, and the first transport container has a slot (slot) capable of accommodating a plurality of the aforementioned first transport objects in a multi-stage manner; and the loading port door is capable of placing the aforementioned frame opening and closing of the aforementioned opening; and a seating holding mechanism for holding the aforementioned first transport container transported from the outside on the aforementioned loading table; and a door opening and closing mechanism for moving the aforementioned loading port door toward the aforementioned transporting chamber. The opening position of the side retreat door, whereby the aforementioned opening of the aforementioned frame is set to an open state; 1. The transfer container moves forward and backward between the seating position and the transfer object receiving position; and the collation mechanism, in the state where the opening is opened by the door opening and closing mechanism, collates the objects that are located in the transfer object. information on the presence or absence of the first object to be conveyed in each of the slots in the first conveyance container at the receiving position; and a control unit that controls the seat holding mechanism, the traction mechanism, the door opening and closing mechanism, and the action of the aforementioned comparison mechanism; the aforementioned comparison mechanism is provided with: a comparison device, which has a comparison sensor at the tip; and a comparison moving part, which supports the aforementioned comparison device and moves the aforementioned comparison device to the The first collation position where the first object to be conveyed is stored in the first conveying container can be detected by the collation sensor, and the placing table can place a second conveying container, and the second conveying container The second object to be conveyed that is different in planar size from the first object to be conveyed can be accommodated in the multi-stage slot, and the control unit can perform: the seat holding process, and the seat holding mechanism can be used to store the second object to be conveyed. The second object to be conveyed that is different in planar size from the first object to be conveyed is accommodated in the second conveyance container in the multi-stage slot or the first conveyance container is held on the aforementioned loading table; and the rear traction process is performed by The aforementioned traction mechanism moves the aforementioned second transport container or the aforementioned first transport container on the aforementioned loading table from the aforementioned seating position to the aforementioned transport object receiving position; part is set to an open state; and the first comparison process is to place the aforementioned collation device at the aforementioned first comparison position through the aforementioned opening part in the open state to make it perform the comparison process done by the aforementioned comparison mechanism; and the second comparison process , place the aforesaid comparator at the second collation position where the aforesaid second conveying object is accommodated in the aforesaid second conveying container through the aforesaid collation sensor to make it perform the aforesaid The comparison process performed by the comparison mechanism is placed on the center position of the first conveying object in the aforementioned first conveying container on the aforementioned loading table at the aforementioned conveying object accepting position, and placed on the aforementioned conveying object. In a state where the center positions of the second objects to be conveyed in the second conveyance container on the loading table at the receiving position are accommodated in a consistent state, one of the first collation process and the second collation process is executed or both.
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