TW201922602A

TW201922602A - Loading port, and mapping processing method in loading port including a seating holding processing, a rear traction processing, a first mapping processing and a second mapping processing

Info

Publication number: TW201922602A
Application number: TW107127406A
Authority: TW
Inventors: 三浦辰
Original assignee: 日商昕芙旎雅股份有限公司
Priority date: 2017-11-06
Filing date: 2018-08-07
Publication date: 2019-06-16
Also published as: JP7082274B2; JP7385151B2; JP2019087598A; JP2022103434A; TWI780196B; TWI812466B; TW202306874A; CN109755166B; CN109755166A

Abstract

Provided are a loading port and a mapping processing method in the loading port that improve the utilization rate in semiconductor manufacturing by detecting a mixed load of to-be-transported objects having different plane sizes before and after an intermediate processing. The load port is configured to perform: a seating holding processing to hold a transfer container (FOUP (3) or a second transfer container (C)) on the loading table (5); and a rear traction processing, so that the transport container on the loading table (5) is moved from the seating position to the to-be-transported object receiving position; and a first mapping processing that is performed by placing the mapping device (M2), through the opening portion (41) of the frame (4) in the open state, in the first mapping position (P1) in which the first to-be-transported object (W) can be detected; and a second mapping processing that is performed by placing the mapping device (M2) in the second mapping position in which the second to-be-transported object (F) can be detected.

Description

載入埠，及載入埠中的對照處理方法Load 埠, and load the control method in 埠

本發明有關半導體製造工程中，用來與可將複數片的晶圓等搬送對象物收納至多段式狹槽(slot)的搬送容器亦即FOUP之間授受搬送對象物之載入埠(load-port)，特別有關具備了對照包括FOUP的各狹槽中有無第1搬送對象物之狀態的資訊之對照(mapping)機構的載入埠、及載入埠中的對照處理方法。In the semiconductor manufacturing process, the loading and unloading object is loaded and received between the FOUP, which is a transport container that can transport a plurality of wafers and the like to a multi-stage slot. In particular, the loading method of the mapping mechanism and the matching processing method for loading the information in the presence or absence of the first transport object in each of the slots including the FOUP.

例如在半導體的製造工程中，為求良率或品質之提升，係在無塵室內進行晶圓之處理。近年來，係導入「微環境(Mini-Environment)方式」亦即僅針對晶圓周圍的局部性空間進一步提升潔淨度，採用於進行晶圓搬送等其他處理之手段。微環境方式中，是在框體的內部載置構成大致封閉之晶圓搬送室(以下稱搬送室)的壁面的一部分，並且在高清淨的內部空間供晶圓等搬送對象物收納之搬送容器亦即FOUP(Front-Opening Unified Pod；晶舟)，而在緊貼於FOUP的門之狀態下，具有令該FOUP門開閉的機能之載入埠係鄰接於搬送室而設置。以下，將可卡合於FOUP門而令FOUP門開閉之載入埠的門稱為「載入埠門」。For example, in the manufacturing process of semiconductors, in order to improve the yield or quality, wafer processing is performed in a clean room. In recent years, the "Mini-Environment" method has been introduced, that is, the cleanliness is further improved only for the local space around the wafer, and is used for other processing such as wafer transfer. In the micro-environment system, a part of the wall surface of the wafer transfer chamber (hereinafter referred to as a transfer chamber) that is substantially closed is placed in the interior of the housing, and the transfer container for storing the object such as a wafer is stored in a high-definition internal space. In other words, the FOUP (Front-Opening Unified Pod) is placed in close contact with the transfer chamber in a state in which the FOUP door is opened and closed in close contact with the FOUP. Hereinafter, a door that can be engaged with a FOUP door to open and close the FOUP door is referred to as a "loading trick".

這樣的載入埠，為用來與搬送室之間進行搬送對象物的取出放入之裝置，作用成為搬送室與FOUP之間的介面部。又，構成為若在對於FOUP門而言令載入埠門緊貼之狀態下該些FOUP門及載入埠門同時被開啟，則能夠藉由配置於搬送室內的搬送機器人，將FOUP內的搬送對象物取出至搬送室內，或將搬送對象物從搬送室內收納至FOUP內。Such a loading device is a device for taking out and transporting an object to and from the transfer chamber, and functions as a face portion between the transfer chamber and the FOUP. In addition, when the FOUP door and the loading door are simultaneously opened in the state in which the loading door is attached to the FOUP door, the transfer robot placed in the transfer room can be placed in the FOUP. The object to be transported is taken out into the transfer room, or the object to be transported is stored in the FOUP from the transfer room.

在載入埠，備有可檢測設於FOUP內之多段式狹槽中搬送對象物的有無或收納姿勢之對照機構。作為對照機構之一例，能夠舉出下述之物，即，將在先端部具備了對照感測器之對照器(mapper)，構成為可在令其後退至比載入埠的框還靠搬送室側之不可對照位置、與通過框的開口部而接近至比不可對照位置還靠FOUP內之可對照位置之間移動。此外，對照機構，具備支撐對照器之對照移動部(對照臂)，其構成為將對照器維持在可對照位置而令對照臂朝高度方向移動，藉此可對每一狹槽偵測多段式狹槽中的搬送對象物。另，對照臂的升降移動，是和載入埠門的升降移動一體或獨立地進行。In the loading cassette, a matching mechanism for detecting the presence or absence of the object to be transported or the storage posture in the multi-segment slot provided in the FOUP is provided. As an example of the control means, a mapper having a collimator sensor is provided at the tip end portion, and is configured to be retracted to a frame that is moved back to the load port. The uncontrollable position on the chamber side moves closer to the controllable position within the FOUP than the openable portion of the frame. In addition, the control mechanism has a control moving portion (control arm) supporting the comparator, which is configured to maintain the collimator in the controllable position and move the control arm in the height direction, thereby detecting the multi-segment for each slot. The object to be transported in the slot. In addition, the lifting movement of the control arm is performed integrally or independently with the lifting movement of the loading card.

不過，半導體製造的中間工程～後工程(例如底部拋光(back-lapping)處理工程、晶圓層積處理工程、切割處理工程等)中，會在鄰接於搬送室而設置之複數種類的處理室內各自施以適當的處理。因此，在處理室內，例如底部拋光處理前之晶圓、底部拋光處理後的薄晶圓會在被保持於環狀框之狀態下受到搬送。However, in intermediate engineering to post-engineering of semiconductor manufacturing (for example, back-lapping processing, wafer stratification processing, cutting processing, etc.), there are a plurality of processing chambers disposed adjacent to the transfer chamber. Each is given appropriate treatment. Therefore, in the processing chamber, for example, the wafer before the bottom polishing process and the thin wafer after the bottom polishing process are carried while being held in the annular frame.

此處，供底部拋光處理後的薄晶圓保持之環狀框，例如為被設定成0.3～0.7mm程度的厚度之物。被保持於環狀框的晶圓，會在被收容至和FOUP相異之專用的容器亦即框匣(frame casstte)之狀態下受到搬送。Here, the ring frame for holding the thin wafer after the bottom polishing treatment is, for example, a material having a thickness of about 0.3 to 0.7 mm. The wafer held in the ring frame is transported in a state of being stored in a frame cassette which is a dedicated container different from the FOUP.

上述這樣的半導體製造的中間工程～後工程中，以往，中間處理工程以後的薄晶圓(被保持於環狀框的薄晶圓)是藉由搬送環狀框之專用的機器人、或搬送收納了環狀框的框匣之專用的機器人而被直接搬送至下一工程，或被搬送至不同於載入埠之框匣專用的載置空間。此外，在對於搬送室而言設置處理內容(底部拋光處理工程、晶圓層積處理工程、切割處理工程等)相異的複數種處理室之半導體製造裝置中，框匣往載入埠之搬送、裝載是藉由作業者來進行。In the intermediate engineering to the post-engineering of semiconductor manufacturing, the conventional thin film (the thin wafer held in the ring frame) after the intermediate processing is a dedicated robot for transporting the ring frame, or is transported and stored. The dedicated robot of the frame of the ring frame is directly transported to the next project, or is transported to a mounting space dedicated to the frame other than the loading frame. In addition, in a semiconductor manufacturing apparatus in which a plurality of types of processing chambers having different processing contents (bottom polishing processing, wafer layering processing, cutting processing, etc.) are provided in the transfer chamber, the frame is loaded and loaded. Loading is done by the operator.

另一方面，當著眼於與載入埠之間授受搬送容器之機構(例如OHT；Overhead Hoist Transfer；空中懸吊式搬送系統)的搬送效率改善、搬送產距(takt)改善這一點的情形下，對於搬送室而言設有處理內容相異的複數種處理室之構成中，料想理想是以晶圓搬送機器人來搬送保持薄晶圓之環狀框、或利用FOUP的載置空間亦即載入埠來作為框匣的載置空間，藉此使用共通的裝置來取用框匣與FOUP。On the other hand, in the case of focusing on the improvement of the transport efficiency of the mechanism for transporting the transport container (for example, OHT; Overhead Hoist Transfer; air suspension transport system) and the improvement of the transport yield (takt) In the configuration in which the transfer chamber is provided with a plurality of types of processing chambers having different processing contents, it is preferable that the wafer transfer robot transports the ring frame holding the thin wafer or the mounting space using the FOUP. It is used as a mounting space for the frame, whereby a common device is used to access the frame and the FOUP.

當設想了這樣的使用形態的情形下，料想在中間處理工程以後，可能會發生例如底部拋光處理前的晶圓亦即未被保持於環狀框之晶圓、或底部拋光處理後被保持於環狀框之晶圓被混載收容於載入埠上的FOUP內或框匣內之事態。也就是說，會有本應被收納於FOUP之晶圓被誤投入/誤積載至框匣內，或本應被收納於框匣之環狀框被誤投入/誤積載至FOUP內之事態發生的可能性。若這樣的事態發生，會妨礙半導體製造工程的順暢進行，直接導致製造效率的降低。When such a use form is envisaged, it is expected that after the intermediate processing, for example, a wafer before the bottom polishing process, that is, a wafer that is not held in the ring frame, or after the bottom polishing process, may be held. The wafer of the ring frame is mixed and contained in the FOUP loaded in the crucible or in the frame. In other words, there is a situation in which the wafer that should be stored in the FOUP is misplaced/missed into the frame, or the ring frame that should be stored in the frame is mistakenly inserted/missed into the FOUP. The possibility. If such a situation occurs, it will hinder the smooth progress of semiconductor manufacturing engineering and directly lead to a reduction in manufacturing efficiency.

專利文獻1中，揭示一種將配置於搬送容器的周圍之對照感測器沿著搬送容器的高度方向做升降移動，藉此判定搬送容器內的每一狹槽是否收納有晶圓之對照處理。料想這樣的對照處理，亦可判定在搬送容器內是否收納有晶圓。 [先前技術文獻] [專利文獻]Patent Document 1 discloses a collation process in which a collation sensor disposed around a transfer container is moved up and down along a height direction of a transfer container to determine whether or not a wafer is accommodated in each slot in the transfer container. It is also conceivable that such a comparison process can determine whether or not a wafer is stored in the transfer container. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2016-181655號公報[Patent Document 1] JP-A-2016-181655

[發明所欲解決之問題][The problem that the invention wants to solve]

然而，專利文獻1記載之構成中，當在搬送容器內混載有相異尺寸的晶圓的情形下，料想無法區別是否發生混載。再者，必須在搬送容器的周圍配置對照感測器之專利文獻1記載的構成，會招致對照機構的大型化而佔據面積亦會變大，並且為了不讓來自對照感測器的照射光被搬送容器遮擋，會要求在搬送容器沒有遮蔽物、或是搬送容器由具有透光性的素材來形成，因此會有可適用的搬送容器受限定之問題。However, in the configuration described in Patent Document 1, when a wafer having a different size is mixed in the transfer container, it is considered that it is impossible to distinguish whether or not the mixing occurs. In addition, it is necessary to arrange the configuration described in Patent Document 1 in which the sensor is placed around the transport container, and the size of the control unit is increased, and the area occupied by the control unit is also increased, and the illumination light from the contrast sensor is not allowed to be If the transport container is blocked, it is required that the transport container has no shielding or the transport container is formed of a light-transmitting material. Therefore, there is a problem that the applicable transport container is limited.

此外，處理相異尺寸的晶圓之載入埠中，作為設計成能夠共用對照裝置之技術，亦有人提議一種對照裝置，是把將檢測波的照射軸朝向左右的水平方向之對照感測器安裝在朝上下方向移動之對照臂，而令將檢測波的照射軸朝向左右的水平方向之第1伸出感測器往對照感測器的移動方向遠離而安裝在對照元件，又，設置將檢測波的照射軸朝向對照感測器的上下移動方向之第2伸出感測器(參照日本特開2015-211164號公報)。In addition, in the processing of wafers of different sizes, as a technique designed to be able to share a comparison device, a comparison device is proposed, which is a contrast sensor that directs the illumination axis of the detection wave to the horizontal direction of the left and right. The control arm that is moved in the up-and-down direction is mounted, and the first extension sensor that directs the illumination axis of the detection wave in the horizontal direction of the left and right is moved away from the direction of movement of the sensor, and is mounted on the control element. The second extension sensor that detects the irradiation axis of the wave toward the vertical movement direction of the comparison sensor (refer to Japanese Laid-Open Patent Publication No. 2015-211164).

按照這樣的對照裝置，當將對照感測器***至最小尺寸的搬送容器的內部，而在搬送容器內令其朝上下方向移動時，可藉由第1伸出感測器檢測可能會和對照感測器衝撞之伸出的晶圓，並且可藉由第2伸出感測器檢測比對照感測器還先行移動而可能會和第1伸出感測器衝撞之伸出的晶圓。According to such a comparison device, when the contrast sensor is inserted into the inside of the transport container of the smallest size and moved in the up and down direction in the transport container, the first extension sensor can detect and compare The sensor collides with the extended wafer, and the second protruding sensor can detect the protruding wafer that may be moved forward with the first protruding sensor by moving forward with the comparison sensor.

然而，這樣的對照裝置，除了對照感測器以外，還需要第1伸出感測器及第2伸出感測器，因此會有感測器數量增加而構造變得複雜，成本亦增大之問題。However, such a comparison device requires a first extension sensor and a second extension sensor in addition to the comparison sensor, so that the number of sensors increases, the configuration becomes complicated, and the cost increases. The problem.

本發明係著眼於這樣的待解問題而研發，主要目的在於提供一種無需大幅變更以往的載入埠的構成，而可檢測在經過中間工程前後平面尺寸相異之搬送對象物彼此被混載(包括誤投入/誤積載)於搬送容器，而有助於半導體製造中的運用率(utilization rate)提升之載入埠、及載入埠中的對照處理方法。另，本發明，不限定於中間處理後的搬送對象物的平面尺寸和環狀框的平面尺寸相依之態樣，為一可通盤適用於中間工程前的搬送對象物與中間工程後的搬送對象物的平面尺寸相異之態樣之技術。 [解決問題之技術手段]The present invention has been developed in view of such a problem to be solved, and a main object thereof is to provide a configuration in which a transfer object having a different plane size before and after an intermediate project can be mixed with each other without including a configuration in which a conventional loading cassette is largely changed. The mis-input/incorrect stowage) is used to transport the container, and contributes to the loading rate of the utilization rate in the semiconductor manufacturing process and the matching processing method loaded in the crucible. Further, the present invention is not limited to the aspect in which the plane size of the object to be transported after the intermediate processing is different from the plane size of the ring frame, and is a transportable object that can be applied to the transport object before the intermediate work and the transport object after the intermediate work. The technique of the different dimensions of the object. [Technical means to solve the problem]

亦即本發明，係有關和在內部具備了搬送機器人之搬送室共同構成EFEM之載入埠。本發明中，於載入埠和搬送室並排之前後方向，將載入埠側定義為前方，將搬送室側定義為後方。In other words, the present invention relates to a loading chamber of an EFEM in association with a transfer chamber having a transfer robot therein. In the present invention, the loading side is defined as the front side and the transfer chamber side is defined as the rear side in the front-rear direction in which the loading cassette and the transfer chamber are arranged side by side.

本發明之載入埠，具備：平板狀的框，以站立姿勢併設於搬送室且具有可供第1搬送對象物以略水平姿勢通過之開口部；及載置桌台，可載置第1搬送容器即FOUP；及載入埠門，可和FOUP所具有之FOUP門卡合，且可將框的開口部開閉；及就座保持機構，將從外部被搬送來的FOUP保持於載置桌台上；及門開閉機構，令載入埠門移動至朝搬送室側後退之門開放位置，藉此將框的開口部設為開狀態；及牽引機構，在相對於框而言以朝前方突出之姿勢配置之載置桌台上，令FOUP在就座位置與搬送對象物授受位置之間朝前後方向移動；及對照機構，於藉由門開閉機構將開口部設為了開狀態之狀態下，對照有關包括位於搬送對象物授受位置的FOUP內的各狹槽中的第1搬送對象物的有無之狀態之資訊；及控制部，掌控該些各機構(就座保持機構、牽引機構、門開閉機構、及對照機構)的動作。此處，作為本發明中的第1搬送對象物，能夠舉出晶圓。此外，若搬送對象物例如為晶圓，則用來搬送搬送對象物之搬送室為晶圓搬送室。The loading cassette of the present invention includes a flat-shaped frame that is provided in the transfer chamber in a standing posture and has an opening that allows the first transport object to pass in a horizontal posture; and the table is placed on the table. The transfer container is a FOUP; and the loading door can be engaged with the FOUP door of the FOUP, and the opening of the frame can be opened and closed; and the seating holding mechanism holds the FOUP conveyed from the outside on the mounting table. On the stage; and the door opening and closing mechanism, the loading door is moved to the door opening position toward the transfer room side, thereby opening the opening of the frame; and the traction mechanism is facing forward with respect to the frame The FOP is placed in the front and rear direction between the seating position and the transfer object receiving position, and the control mechanism is configured to open the opening by the door opening and closing mechanism. Information relating to the presence or absence of the first object to be transported in each of the slots in the FOUP at the transfer position of the object to be transported; and a control unit for controlling the respective mechanisms (sitting mechanism, traction mechanism, door) Opening and closing mechanism, and control The action of the organization). Here, as the first object to be transported in the present invention, a wafer can be cited. In addition, when the object to be transported is, for example, a wafer, the transfer chamber for transporting the object to be transported is a wafer transfer chamber.

此外，本發明中的搬送機器人，只要是配置於搬送室內之物即可，能夠利用已知之物。另，搬送機器人，可為不構成本發明的載入埠的一部分之物，亦可為構成本發明的載入埠的一部分之物。作為搬送機器人，已知有構成為在連結了複數個臂要素的連桿機構的先端部設置機械手，而可藉由此機械手把持搬送對象物在搬送容器與搬送室之間做取出放入之物。然而，本發明中的搬送機器人不限定於此類型。In addition, the transport robot in the present invention may be any one that is disposed in the transport chamber, and a known object can be used. Further, the transfer robot may be a part that does not constitute a part of the loading cassette of the present invention, or may be a part that constitutes a loading cassette of the present invention. As a transport robot, it is known that a robot is provided at a tip end portion of a link mechanism in which a plurality of arm elements are connected, and the robot can hold the transport object between the transport container and the transfer chamber. Things. However, the transport robot in the present invention is not limited to this type.

本發明中的對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐對照器且通過處於開狀態之開口部令對照器移動至可藉由對照感測器偵測FOUP中收容有第1搬送對象物之第1對照位置。此處，本發明中的對照移動部，可為滿足藉由門開閉機構而和載入埠門一起朝前後方向及上下方向動作之第1動作條件、及和門開閉機構獨立地動作之第2動作條件的雙方之物，或亦可為滿足其中一方之物。此外，本發明中，作為令對照器移動至第1對照位置之構成的具體例，能夠舉出藉由對照移動部全體傾動來令對照器往前方傾動而置放於第1對照位置之構成，或藉由對照移動部全體往前方滑動移動來令對照器往前方移動而置放於第1對照位置之構成。The control mechanism of the present invention comprises: a contrast device having a contrast sensor at the tip end; and a control moving portion supporting the collator and moving the collimator through the opening portion in the open state to be controllable by the contrast sensor The first control position in which the first transport object is stored in the FOUP is detected. Here, the control moving portion in the present invention may be the first operating condition that satisfies the loading and closing mechanism in the front-rear direction and the vertical direction by the door opening and closing mechanism, and the second operation that independently operates the door opening and closing mechanism. The objects of both sides of the operating conditions may also be ones that satisfy one of them. Further, in the present invention, as a specific example of the configuration for moving the collimator to the first collimation position, a configuration in which the collimator is tilted forward by the tilting of the entire moving portion and placed in the first collating position is exemplified. Or, by moving the entire moving portion forward, the collimator is moved forward and placed in the first control position.

又，本發明之載入埠，其特徵為，控制部可執行：就座保持處理，藉由就座保持機構，把可將和第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽之第2搬送容器或FOUP保持於載置桌台上；及後方牽引處理，藉由牽引機構令載置桌台上的第2搬送容器或FOUP從就座位置移動至搬送對象物授受位置；及門開放處理，藉由門開閉機構將開口部設為開狀態；及第1對照處理，通過處於開狀態之開口部將對照器置放於第1對照位置而令其執行對照機構所做之對照處理；及第2對照處理，通過處於開狀態之開口部將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置而令其執行對照機構所做之對照處理；係選擇性地執行第1對照處理及第2對照處理的其中一方或雙方。Further, the loading unit according to the present invention is characterized in that the control unit can perform the seating holding process, and the second holding object that can be different in the plane size of the first conveying object can be accommodated by the seating holding mechanism. The second transfer container or the FOUP of the multi-segment slot is held on the mounting table; and the rear traction process causes the second transfer container or the FOUP on the table to be moved from the seated position to the transport target by the traction mechanism The object receiving and receiving position; and the door opening process, the opening portion is opened by the door opening and closing mechanism; and the first comparison processing, the contrast device is placed in the first control position through the opening portion in the open state, and the comparison is performed In the second control processing, the second collimator is placed in the opening portion of the open state, and the second transport container can be detected by the collating sensor. The control unit performs a comparison process with the control unit; and selectively performs one or both of the first control process and the second control process.

此處，作為「和第1搬送對象物平面尺寸相異的第2搬送對象物」之一例，能夠舉出於中間工程後薄晶圓及保持它之環狀框的組合、或環狀框單體等，但不限定於此。另，薄晶圓，為連同平面尺寸比薄晶圓還大的環狀框受到搬送之物，因此規範第2搬送對象物的平面尺寸之部件並非薄晶圓，而是環狀框。當這樣的環狀框為第2搬送對象物的情形下，本發明中的「可將第2搬送對象物收容於多段式狹槽之第2搬送容器」，為可將環狀框多段式地收容之框匣，惟第2搬送容器亦不限定於此。Here, as an example of the "second transfer object that is different from the first transfer target plane size", a combination of a thin wafer and an annular frame holding the intermediate process, or a ring frame can be cited. Body, etc., but is not limited to this. In addition, since the thin wafer is conveyed with the annular frame having a larger planar size than the thin wafer, the member that defines the planar size of the second transport object is not a thin wafer but a ring frame. In the case where the annular frame is the second object to be transported, the second transport container in which the second transport object can be accommodated in the multi-segment slot can be multi-staged in a ring-shaped frame. The frame to be housed is not limited to this.

按照這樣的本發明之載入埠，使用對照有關包括FOUP內的各狹槽中的第1搬送對象物的有無之狀態之資訊的對照機構，來執行第2對照處理，藉此便可對照有關包括第2搬送容器內的各狹槽中的第2搬送對象物的有無之狀態之資訊。According to the loading mechanism of the present invention, the second collation processing is executed by using a collating unit that controls information on the presence or absence of the first transport object in each slot in the FOUP, thereby The information on the presence or absence of the second object to be transported in each of the slots in the second transport container is included.

又，當第2搬送對象物的平面尺寸比第1搬送對象物還大的情形下，對載置於載置桌台之第1搬送容器亦即FOUP內的每一狹槽進行判定是否收納有第2搬送對象物之第2對照處理，若偵測收納有第2搬送對象物，則便能掌握第2搬送對象物被誤投入於FOUP。此外，當在載置桌台上載置了第2搬送容器的情形下，如果對於和依第2對照處理而未收納有第2搬送對象物之資訊建立了關連之狹槽而言，第1對照處理的偵測結果為收納有第1搬送對象物之偵測結果，則便能掌握第1搬送對象物被誤投入於第2搬送容器。In the case where the plane size of the second object to be transported is larger than that of the first object to be transported, it is determined whether or not each slot in the FOUP of the first transport container placed on the table is placed. In the second collation processing of the second object to be transported, when the second object to be transported is detected and stored, it is possible to grasp that the second object to be transported is erroneously placed in the FOUP. In the case where the second transport container is placed on the mounting table, the first control is used to establish a related slot for the information that the second transport object is not stored in the second collation processing. When the detection result of the processing is the detection result of the first object to be transported, it is possible to grasp that the first object to be transported is erroneously placed in the second transport container.

像這樣，按照本發明之載入埠，利用至少具備了對照器及對照移動部之對照機構，基於第1對照處理的偵測結果、與第2對照處理的偵測結果(偵測資訊)的雙方或其中一方，可辨明平面尺寸相異的搬送對象物是否被混載於搬送容器內。是故，按照本發明之載入埠，無需大幅變更以往的載入埠的構成，避免對照機構的大型化及構造的複雜化，於中間工程以後，即使採用將平面尺寸相異的搬送對象物收容至載置於共通的載入埠上之FOUP(第1搬送容器)或第2搬送容器而取用之使用形態的情形下，仍可偵測相異的搬送對象物在FOUP或第2搬送容器中被誤混載(誤投入/誤積載)，而能夠謀求半導體製造中的運用率提升。As described above, according to the loading port of the present invention, the detection result of the first collation processing and the detection result (detection information) processed by the second collation are used by the collating unit having at least the collator and the collating moving portion. In either or both of them, it is possible to discriminate whether or not the object to be transported having a different plane size is mixed in the transport container. Therefore, according to the loading cassette of the present invention, it is not necessary to significantly change the configuration of the conventional loading cassette, and it is possible to avoid the enlargement of the size of the control mechanism and the complication of the structure, and even after the intermediate work, even the object to be transported having different plane sizes is used. When the FOUP (first transfer container) or the second transfer container that is placed on the common loading cassette is used in the form of use, it is possible to detect different objects to be transported in the FOUP or the second transfer. The container is mis-mixed (missing/missing), and the utilization rate in semiconductor manufacturing can be improved.

另，即使當容許第1或第2搬送容器內混載第1或第2搬送對象物的情形下，按照本發明仍能藉由對照處理來掌握該混載的狀態。In addition, even when the first or second transfer object is allowed to be mixed in the first or second transfer container, the state of the mixed load can be grasped by the collation processing according to the present invention.

又，本發明中，是將第2對照處理執行時對照器被置放之第2對照位置，設定成和第1對照處理執行時對照器被置放之第1對照位置為相異位置。作為本發明之比較例，若為藉由置放於同一對照處理位置之對照器的對照感測器來偵測平面尺寸相異的搬送對象物之構成，則必須令相互平面尺寸相異的搬送對象物彼此的外緣的一部分切齊。然後，為了令平面尺寸相異的搬送對象物彼此的外緣的一部分切齊，不得不因應搬送對象物的平面尺寸來變更搬送機器人所做之搬送對象物的搬送距離或搬送位置，而被迫做繁雜的控制。另一方面，本發明之載入埠中，無需令載置桌台上的搬送對象物的中心依第1搬送對象物及第2搬送對象物而相異，作為搬送機器人的搬送控制能夠採用以往的簡單控制。是故，按照本發明，不會要求因應搬送對象物的平面尺寸來變更搬送機器人所做之搬送對象物的搬送距離或搬送位置，比起上述比較例會成為簡單的控制，亦有助於半導體製造中的運用率提升。Further, in the present invention, the second control position at which the collimator is placed when the second collation processing is executed is set to be a different position from the first collimation position at which the collimator is placed when the first collation processing is executed. As a comparative example of the present invention, if a collation object having a different plane size is detected by a collimator of a collimator placed at the same matching processing position, it is necessary to transport the mutually different plane sizes. The objects are aligned with a part of the outer edge of each other. Then, in order to align a part of the outer edges of the objects to be transported having different plane sizes, it is necessary to change the transport distance or transport position of the transport object by the transport robot in accordance with the plane size of the transport object. Do complicated control. On the other hand, in the loading cassette of the present invention, the center of the object to be transported on the table is not required to be different depending on the first object to be transported and the second object to be transported, and the transport control of the transport robot can be used as a transport control. Simple control. Therefore, according to the present invention, it is not required to change the transport distance or the transport position of the transport object by the transport robot in accordance with the plane size of the transport object, which is simple control compared to the above comparative example, and contributes to semiconductor manufacturing. The utilization rate in the increase.

本發明中的「第1對照位置」及「第2對照位置」，可因應第1搬送對象物及第2搬送對象物的平面尺寸而適當設定，惟作為第1對照位置的良好例子，能夠舉出對照感測器被配置於比框當中面向搬送室之後壁面(最接近搬送室之壁面)還前方之位置，作為第2對照位置的良好例子，能夠舉出對照感測器被配置於比框的後壁面還後方之位置。又，本發明中，可設定成於將對照器置放於第1對照位置之狀態下令對照移動部做升降動作藉此進行第1對照處理，並且於將對照器置放於第2對照位置之狀態下令對照移動部做升降動作藉此進行第2對照處理。In the present invention, the "first control position" and the "second control position" can be appropriately set in accordance with the plane size of the first transfer object and the second transfer target, but a good example of the first control position can be mentioned. The comparison sensor is disposed at a position forward of the wall surface (the wall surface closest to the transfer chamber) facing the transfer chamber in the frame, and as a good example of the second control position, the comparison sensor is disposed in the comparison frame. The rear wall is also at the rear. Further, in the present invention, the collating unit may be placed in the first control position to cause the collating moving portion to perform the raising and lowering operation to perform the first collation processing, and the collimator is placed in the second collating position. In the state, the comparison moving unit performs a lifting operation to perform the second comparison processing.

再加上，本發明之載入埠中，若控制部為具有判別藉由就座保持機構保持了FOUP或第2搬送容器的哪一者之容器判別部之物，則可基於容器判別部所做的判別資訊，基於事先設定好的動作序列如就座保持處理、門開放處理、後方牽引處理、第1對照處理、第2對照處理的順序，或進行第1對照處理及第2對照處理雙方、或是僅進行其中一方的對照處理等，來自動控制各機構的動作。In addition, in the loading cassette of the present invention, the control unit is configured to have a container discriminating unit that determines which of the FOUP or the second transport container is held by the seating holding mechanism. The discrimination information to be made is based on a sequence of operations set in advance such as a seat holding process, a door opening process, a rear pulling process, a first comparison process, and a second comparison process, or both the first comparison process and the second comparison process. Or, it is possible to automatically control the operation of each mechanism by performing only one of the control processes.

特別是，本發明中較佳是，控制部，當容器判別部判斷出藉由就座保持機構保持了第2搬送容器的情形下，依序執行了就座保持處理、門開放處理、後方牽引處理之後，執行第1對照處理及第2對照處理雙方。此為本發明特有的動作序列，是為了避免當第2搬送容器於前後方向的尺寸比FOUP還大的情形下，若比門開放處理還先進行了後方牽引處理的情形下第2搬送容器會衝撞載入埠門這樣的事態。另，第1對照處理與第2對照處理的順序並無特別限定。另，前後方向的尺寸比FOUP還大之第2搬送容器中收容的第2搬送對象物，為比第1搬送對象物還大的平面尺寸。能夠藉由進行判定第2搬送對象物的有無之第2對照處理、及判定第1搬送對象物的有無之第1對照處理的雙方，來提高偵測這樣的第2搬送容器中混載第1搬送對象物與第2搬送對象物之對照精度。In the present invention, the control unit preferably performs the seating holding process, the door opening process, and the rear traction in the case where the container determining unit determines that the second transfer container is held by the seating holding mechanism. After the treatment, both the first comparison process and the second comparison process are performed. In the case where the size of the second transport container in the front-rear direction is larger than the FOUP, the second transport container may be subjected to the rear pull processing before the door opening process. Crashing into the situation like loading a door. Further, the order of the first comparison treatment and the second comparison treatment is not particularly limited. In addition, the second transfer object accommodated in the second transfer container having a size larger than the FOUP in the front-rear direction is a larger planar size than the first transfer target. It is possible to increase the first transport in the second transport container by detecting both the second collation processing for determining the presence or absence of the second transport target and the first collation processing for determining the presence or absence of the first transport target. The accuracy of the comparison between the object and the second object to be transported.

此外，本發明係有關一種具備了對照機構之載入埠中的對照處理方法，該對照機構是被用於用來在可將複數片的第1搬送對象物存儲於多段式狹槽之第1搬送容器與搬送室之間授受第1搬送對象物，而對照有關包括第1搬送容器的各狹槽中的第1搬送對象物的有無之狀態之資訊，其特徵為，作為載入埠，適用構成為可與第2搬送容器之間授受第2搬送對象之物，該第2搬送容器係可將和第1搬送對象物平面尺寸相異的第2搬送對象物存儲複數個於多段式狹槽，作為對照機構，適用具備：對照器，在先端部具有對照感測器；及對照移動部，支撐對照器且令對照器移動至可藉由對照感測器偵測第1搬送容器中收容有第1搬送對象物之第1對照位置之物，選擇性地執行：第1對照處理，將對照器置放於第1對照位置而令其執行對照機構所做之對照處理；及第2對照處理，將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置而執行對照處理；的其中一方或雙方。Further, the present invention relates to a collation processing method for loading a plurality of first transport objects in a multi-segment slot, which is provided in a loading cassette of a collating unit. When the first transfer object is transferred between the transfer container and the transfer chamber, the information on the presence or absence of the first transfer target in each of the slots including the first transfer container is used as the load port. In the second transfer container, the second transfer container can store a plurality of second transfer objects that are different in size from the first transfer target in the multi-stage slot. As a control mechanism, the utility model is characterized in that: a control device is provided, and a control sensor is provided at the tip end portion; and the control moving portion supports the collator and moves the collimator to detect that the first transport container is accommodated by the contrast sensor The first control position of the first transport object is selectively executed: the first collation processing, the collimator is placed in the first control position, and the contrast processing by the collating mechanism is performed; and the second collation processing Will be compared The device is placed in a second control position in which the second transport object is stored in the second transport container, and one or both of the control processes are performed.

若為這樣的對照處理方法，會發揮如同上述的載入埠所發揮的種種作用效果之作用效果，能夠謀求半導體製造中的運用率提升。特別是，本發明中較佳是，第1搬送對象物及第2搬送對象物是在第1搬送容器或第2搬送容器內將彼此的中心位置以相互一致之方式被收容之狀態下執行對照處理(第1對照處理、第2對照處理)。 [發明之功效]In the case of such a comparison processing method, the effects of various effects exerted by the loading and the like described above are exerted, and the utilization rate in semiconductor manufacturing can be improved. In the present invention, it is preferable that the first transfer object and the second transfer target perform the comparison in a state in which the center positions of the first transfer container or the second transfer container are mutually aligned. Treatment (first control treatment, second control treatment). [Effects of the invention]

本發明，於半導體製造工程中，為一種載入埠及對照處理方法，係具備了對照機構之載入埠中的對照處理方法，該對照機構是被用於用來在可與將複數片的晶圓存儲於多段式狹槽之第1搬送容器之間授受晶圓等的第1搬送對象物，而對照有關包括第1搬送容器的各狹槽中的第1搬送對象物的有無之狀態之資訊，其特徵為，構成為可與第2搬送容器之間授受第1搬送對象物，該第2搬送容器係可將平面尺寸比第1搬送對象物還大的第2搬送對象物存儲複數個於多段式狹槽，作為對照機構，適用具備：對照器，在先端部具有對照感測器；及對照移動部，支撐對照器而可藉由門開閉機構和載入埠門一起動作，且可和門開閉機構獨立地動作之物，可執行：第1對照處理，將對照器置放於可藉由對照感測器偵測FOUP中收容有第1搬送對象物之第1對照位置而令其執行對照處理；及第2對照處理，將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置而執行對照處理；係選擇性地執行第一對照處理及第二對照處理的其中一方或雙方。The present invention, in a semiconductor manufacturing process, is a loading and contrasting processing method, which is provided with a matching processing method in a loading mechanism of a comparison mechanism, which is used to be used in a plurality of sheets. When the wafer is stored in the first transfer container of the multi-stage slot, the first transfer object such as a wafer is transferred, and the presence or absence of the first transfer target in each of the slits including the first transfer container is controlled. In the second transfer container, the first transfer object can be stored in the second transfer container, and the second transfer container can store a plurality of second transfer objects having a larger planar size than the first transfer target. In the multi-segment slot, as a control mechanism, the utility model is provided with: a contrast controller having a contrast sensor at the tip end; and a control moving portion supporting the collator and being actuable by the door opening and closing mechanism and the loading trick, and The object that operates independently of the door opening and closing mechanism can perform the first comparison processing, and the reference device can be placed in the first control position in which the first transport object is accommodated in the FOUP by the control sensor. Perform a comparison process; And the second collation processing, the collimator is placed in the second control container to detect the second control position in which the second transport object is stored in the second transport container, and the collation processing is performed; One or both of the control treatment and the second control treatment.

也就是說，本發明，採用了下述這樣嶄新的技術思想，即，使用簡單的構成之對照機構，構成為可執行第1對照處理及第2對照處理，而選擇性地執行第1對照處理及第2對照處理的一方或雙方。按照基於這樣的技術思想之本發明，能夠提供一種避免對照機構的大型化及構造的複雜化，而可於經過中間處理工程前後在共通的載入埠上的第1搬送容器即FOUP或第2搬送容器中偵測是否有平面尺寸相異的搬送對象物混載，而有助於半導體製造中的運用率提升之載入埠、及載入埠中的對照處理方法。In other words, the present invention adopts a novel technical idea of using a simple configuration control mechanism to perform the first collation processing and the second collation processing, and selectively perform the first collation processing. And one or both of the second comparison treatments. According to the present invention based on such a technical idea, it is possible to provide a first transfer container that is a FOUP or a second transfer container that can be used in a common loading port before and after an intermediate process, in order to avoid an increase in size and structure of the control mechanism. In the transport container, it is detected whether or not the transport object having a different plane size is mixed, which contributes to the loading of the application rate in the semiconductor manufacturing process and the matching processing method in the load.

以下參照圖面，說明本發明之一實施形態。Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

本實施形態之載入埠1，例如為用於半導體的製造工程中，如圖1及圖2所示，在無塵室內，構成搬送室2的壁面的一部分，用來在搬送室2與FOUP3等的搬送容器3之間進行晶圓W等搬送對象物的取出放入之物。載入埠1，構成EFEM(Equipment Front End Module；前端設備模組)的一部分，為作用成為搬送容器3與搬送室2的介面部分之物。EFEM中取用的晶圓W的尺寸被標準化為SEMI (Semiconductor Equipment and Materials International；國際半導體設備暨材料協會)規格，本實施形態中適用直徑300(半徑150)mm的晶圓W。In the manufacturing process for semiconductors, for example, as shown in FIGS. 1 and 2, a part of the wall surface of the transfer chamber 2 is formed in the transfer chamber 2 and the FOUP 3 in the clean room. The transfer container 3 and the like are placed between the transfer container 3 and the like. The load 埠1 constitutes a part of the EFEM (Equipment Front End Module), and functions as an interface portion between the transfer container 3 and the transfer chamber 2. The size of the wafer W taken in the EFEM is standardized to the SEMI (Semiconductor Equipment and Materials International) specification, and in the present embodiment, the wafer W having a diameter of 300 (radius 150) mm is applied.

本實施形態中的FOUP3，如圖1模型化示意般，具備可通過搬出入口31而將內部空間3S僅朝後方開放之FOUP本體32、及可將搬出入口31開閉之FOUP本體32。FOUP3，在內部設置多段式狹槽，構成為可在各狹槽收容搬送對象物W亦即晶圓W，而構成為可透過搬出入口31將該些晶圓W取出放入之已知之物。後述的圖8模型化地示意在FOUP3內的狹槽34收容了晶圓W之狀態。在FOUP本體32的向上面，設置供自動地搬送搬送容器3的裝置(例如OHT：Over Head Transport)等把持之凸緣部35。As shown in the model of FIG. 1, the FOUP 3 of the present embodiment includes an FOUP main body 32 that can open the internal space 3S only to the rear side by the carry-out port 31, and an FOUP main body 32 that can open and close the carry-out inlet 31. The FOUP 3 is provided with a plurality of slits in the inside, and is configured to accommodate the object W, that is, the wafer W, in each of the slits, and is configured to take out the wafers W into the known contents through the carry-out port 31. Fig. 8 which will be described later schematically shows a state in which the wafer W is accommodated in the slit 34 in the FOUP 3. The flange portion 35 that is gripped by a device (for example, OHT: Over Head Transport) that automatically transports the transport container 3 is provided on the upper side of the FOUP main body 32.

本實施形態之載入埠1，如圖2至圖6等所示，具備：呈板狀的框4，構成搬送室2的壁面的一部分，且形成有用來將搬送室2的內部空間2S開放之開口部41；及載置桌台5，相對於框4而言令其以朝前方突出之略水平姿勢設置；及就座保持機構6，將從外部被搬送來的FOUP3保持於載置桌台5上；及牽引機構7，在載置桌台5上令FOUP3在就座位置與搬送對象物授受位置之間朝前後方向D移動；及載入埠門8，將框4的開口部41開閉；及門開閉機構9，令載入埠門8移動至朝搬送室2側後退之門開放位置(O)，藉此將框4的開口部41設為開狀態；及對照機構M，於藉由門開閉機構9而將框4的開口部41設為開狀態之狀態下，對照有關包括位於搬送對象物授受位置之FOUP3內的各狹槽34中有無晶圓W(相當於本發明之「第1搬送對象物」)的狀態之資訊。As shown in FIG. 2 to FIG. 6 and the like, the loading cassette 1 of the present embodiment includes a plate-shaped frame 4 that constitutes a part of the wall surface of the transfer chamber 2, and is formed to open the internal space 2S of the transfer chamber 2. The opening portion 41; and the mounting table 5 are provided in a horizontal posture in which the frame 4 protrudes forward; and the seating holding mechanism 6 holds the FOUP 3 conveyed from the outside on the mounting table. And the traction mechanism 7 moves the FOUP 3 in the front-rear direction D between the seating position and the transfer object receiving position on the mounting table 5; and loads the card door 8 to open the opening 41 of the frame 4. Opening and closing; the door opening and closing mechanism 9 moves the loading door 8 to the door opening position (O) which is retracted toward the transfer chamber 2 side, thereby opening the opening 41 of the frame 4; and the control mechanism M, In the state in which the opening portion 41 of the frame 4 is opened by the door opening and closing mechanism 9, the presence or absence of the wafer W in each of the slits 34 including the FOUP 3 located at the transfer target receiving position (corresponding to the present invention) Information on the status of the "first transport object".

框4，以起立姿勢配置，為一具有可和載置於載置桌台5上的FOUP3的搬出入口連通之大小的開口部41之略矩形板狀之物。圖1模型化地揭示框4的開口部41。本實施形態之載入埠1，藉由框4來構成搬送室2的壁面的一部分。在框4的下端，設置具有腳輪及設置腳之腳部42。The frame 4 is disposed in a standing posture and is a substantially rectangular plate-like object having an opening portion 41 of a size that can communicate with the carry-out port of the FOUP 3 placed on the mounting table 5. FIG. 1 modelmatically reveals the opening 41 of the frame 4. In the loading cassette 1 of the present embodiment, a part of the wall surface of the transfer chamber 2 is constituted by the frame 4. At the lower end of the frame 4, a leg portion 42 having a caster and a set foot is provided.

載置桌台5，設於在框4當中比高度方向中央還稍靠上方的位置以略水平姿勢配置之水平基台50(支撐台)的上部，為一在FOUP本體32和框4相向之朝向下可載置FOUP3之物。如圖4所示，在載置桌台5，設置令其向上突出之複數個突起51，藉由令該些突起51卡合至形成於FOUP3的底面之孔(圖示省略)，來謀求載置桌台5上的FOUP3之定位。The mounting table 5 is disposed at an upper portion of the horizontal base 50 (supporting table) disposed in a slightly horizontal position at a position slightly above the center in the height direction in the frame 4, and is disposed in the FOUP main body 32 and the frame 4 The FOUP 3 can be placed facing downwards. As shown in FIG. 4, a plurality of protrusions 51 for projecting upward are provided on the table 5, and the protrusions 51 are engaged with holes formed in the bottom surface of the FOUP 3 (not shown). Position the FOUP3 on the table 5.

就座保持機構6，為一將設於載置桌台5的鎖定爪61(參照圖5)設為鉤住而固定至設於FOUP3的底面之被鎖定部(圖示省略)的鎖定狀態，藉此將FOUP3保持於載置桌台5上之物。此外，本實施形態之載入埠1中，藉由解除對於被鎖定部之鎖定爪61的鎖定狀態，能夠將FOUP3設為可從載置桌台5遠離之狀態。The seating holding mechanism 6 is a locked state in which a locking claw 61 (see FIG. 5) provided on the mounting table 5 is hooked and fixed to a locked portion (not shown) provided on the bottom surface of the FOUP 3. Thereby, the FOUP 3 is held on the table 5 . Further, in the loading cassette 1 of the present embodiment, the FOUP 3 can be moved away from the mounting table 5 by releasing the locked state of the locking claw 61 of the locked portion.

牽引機構7，為一在載置桌台5上令FOUP3在FOUP本體32從載入埠門8遠離規定距離之位置亦即就座位置、與使FOUP本體32緊貼載入埠門8之位置亦即搬送對象物授受位置之間朝前後方向D移動之物。牽引機構7，是使用令載置桌台5前後移動之未圖示之滑軌等來構成。就座保持機構6及牽引機構7，亦能想成是載置桌台5所具備之機構。The traction mechanism 7 is a position on the mounting table 5 that positions the FOUP 3 at a position away from the loading door 8 from the loading door 8 by a predetermined distance, that is, a seating position, and the FOUP body 32 is closely attached to the door 8. In other words, the object to be transported is moved in the front-rear direction D between the transfer positions. The traction mechanism 7 is configured by using a slide rail or the like (not shown) that moves the mounting table 5 forward and backward. The seating holding mechanism 6 and the traction mechanism 7 can also be thought of as a mechanism for mounting the table 5.

另，圖1中，作為載置桌台5上的FOUP3之載置狀態，係簡化示意成FOUP3的底面接觸載置桌台5的上面之狀態。然而，實際上，比載置桌台5的上面還朝上方突出之複數個突起51，會卡合至形成於FOUP3的底面之有底的孔，藉此支撐FOUP3，而載置桌台5的上面與FOUP3的底面被規定成相互不接觸，在載置桌台5的上面與FOUP3的底面之間會形成規定的間隙。In addition, in FIG. 1, the mounting state of the FOUP 3 on the mounting table 5 is simplified in a state in which the bottom surface of the FOUP 3 is in contact with the upper surface of the mounting table 5. However, actually, a plurality of protrusions 51 projecting upward from the upper surface of the mounting table 5 are engaged with the bottomed holes formed in the bottom surface of the FOUP 3, thereby supporting the FOUP 3 and placing the table 5 The upper surface of the FOUP 3 is defined so as not to be in contact with each other, and a predetermined gap is formed between the upper surface of the mounting table 5 and the bottom surface of the FOUP 3.

本發明及本實施形態中，在載置於載置桌台5的FOUP3和框4並排之前後方向D(參照圖1等)，將FOUP3側定義成前方、框4側定義成後方。In the present invention and the present embodiment, the FOUP 3 side is defined as the front side and the frame 4 side is defined as the rear side in the rear direction D (see FIG. 1 and the like) before and after the FOUP 3 and the frame 4 placed on the mounting table 5 are arranged side by side.

載入埠門8，為一可在將框4的開口部41密閉之全閉位置(C)、及比全閉位置(C)還朝搬送室2側後退之門開放位置(O)、及使開口部41的開口空間朝後方完全開放之全開位置(圖示省略)之間移動之物。載入埠門8，具備可吸附而保持FOUP本體32之卡合部81(參照圖4)，構成為可維持與FOUP本體32之卡合狀態而和FOUP本體32一體地在全閉位置(C)、門開放位置(O)及全開位置之間移動。本實施形態中，是將全閉位置(C)、門開放位置(O)及被置放了的載入埠門8的姿勢設定成同一姿勢。又，全開位置與全閉位置(C)之間的載入埠門8的移動路徑，係由令位於全閉位置(C)的載入埠門8維持其高度位置而往搬送室2側移動至門開放位置(O)為止之路徑(水平路徑)、及令位於門開放位置(O)的載入埠門8維持其前後位置而往下方移動至全開位置為止之路徑(鉛直路徑)所構成。為了讓置放至門開放位置(O)的載入埠門8能夠朝鉛直方向及水平方向的任一者移動，被保持於置放至門開放位置(O)的載入埠門8之FOUP本體32，係和載入埠門8一起被置放至比框4還後方的位置(從FOUP本體32完全地遠離，而被配置於搬送室2的內部空間2S之位置)。The loading door 8 is a fully closed position (C) in which the opening 41 of the frame 4 is sealed, and a door open position (O) which is retracted toward the transfer chamber 2 side from the fully closed position (C), and The object that moves between the fully open positions (not shown) that open the opening space of the opening 41 toward the rear is opened. The loading door 8 includes an engaging portion 81 (see FIG. 4) that can be sucked and held by the FOUP main body 32, and is configured to maintain the engagement with the FOUP main body 32 and to be fully integrated with the FOUP main body 32 (C). ), moving between the door open position (O) and the fully open position. In the present embodiment, the fully closed position (C), the door open position (O), and the placed posture of the loading trick 8 are set to the same posture. Further, the movement path of the loading card 8 between the fully open position and the fully closed position (C) is such that the loading door 8 at the fully closed position (C) maintains its height position and moves toward the transfer chamber 2 side. A path (horizontal path) up to the door open position (O), and a path (vertical path) in which the loading door 8 at the door open position (O) maintains the front and rear positions and moves downward to the fully open position (vertical path) . In order to allow the loading trick 8 placed in the door open position (O) to move in either the vertical direction and the horizontal direction, the FOUP of the loading trick 8 placed in the door open position (O) is held. The main body 32 is placed at a position rearward of the frame 4 (within the FOUP main body 32 and is disposed at the position of the internal space 2S of the transfer chamber 2) together with the loading door 8.

這樣的載入埠門8之移動，是藉由設於載入埠1之門開閉機構9而實現。門開閉機構9，為一令載入埠門8移動至門開放位置(O)或全開位置，藉此透過設為開狀態之框4的開口來使FOUP3的內部空間連通至搬送室2之物。門開閉機構9，例如是使用將支撐載入埠門8的支撐框80以可朝前後方向D移動之方式予以支撐之可動塊體(圖示省略)、或將可動塊體以可朝上下方向H移動之方式予以支撐之滑軌(圖示省略)來構成，為一令致動器等驅動源(圖示省略)作動，而使載入埠門8朝前後方向D及上下方向H移動之物。另，雖亦可為分別具備前後移動用的致動器、及上下移動用的致動器之態樣，但就零件數刪減這一點而言，以共通的致動器作為驅動源來進行載入埠門8的前後移動及上下移動之態樣較為優良。The movement of such a loading trick 8 is achieved by the door opening and closing mechanism 9 provided in the loading cassette 1. The door opening and closing mechanism 9 moves the door 8 to the door open position (O) or the fully open position, thereby allowing the internal space of the FOUP 3 to communicate with the transfer chamber 2 through the opening of the frame 4 in the open state. . The door opening and closing mechanism 9 is, for example, a movable block (not shown) that supports the support frame 80 that supports the loading of the door 8 so as to be movable in the front-rear direction D, or the movable block can be vertically moved. The slide rail (not shown) supported by the H-movement method is configured to move the loading shutter 8 in the front-rear direction D and the vertical direction H by actuating a drive source (not shown) such as an actuator. Things. In addition, the actuators for moving forward and backward and the actuator for moving up and down may be provided, but the number of components is reduced, and a common actuator is used as a drive source. Loading the back and forth movement of the card 8 and moving up and down are superior.

本實施形態之載入埠門8，具備連結切換機構82，係將FOUP門32與FOUP本體32之卡合狀態(閂鎖狀態)解除而造出可將FOUP門32從FOUP本體32拆卸之狀態(解閂鎖狀態)(參照圖4)。The loading/unloading door 8 of the present embodiment includes a connection switching mechanism 82, and the state in which the FOUP door 32 and the FOUP main body 32 are engaged (latched state) is released, and the state in which the FOUP door 32 can be detached from the FOUP main body 32 is created. (unlatched state) (refer to Figure 4).

對照機構M，如圖3、圖5及圖8等所示，在先端部具備：對照器M2，具有可檢測藉由設於FOUP3內的多段式狹槽34而於高度方向H被多段狀地收納之搬送對象物W的有無之對照感測器M1(發送器M11、接收器M12)；及對照臂M3(相當於本發明之「對照移動部」)，支撐對照器M2；為一可檢測FOUP3內的搬送對象物W的有無或收納姿勢之物。圖8模型化地揭示於FOUP3內被載置於狹槽34之晶圓W(第1搬送對象物)的收容狀態。As shown in FIGS. 3, 5, and 8 and the like, the collimator M includes a collimator M2 having a multi-stage slot 34 provided in the FOUP 3 and being multi-staged in the height direction H. A comparison sensor M1 (transmitter M11, receiver M12) for storing the object to be transported W; and a control arm M3 (corresponding to the "control moving portion" of the present invention) support the collator M2; The presence or absence of the object to be transported in the FOUP 3 or the object in which the posture is stored. FIG. 8 is modeled in a state in which the wafer W (the first object to be transported) placed in the slit 34 is placed in the FOUP 3 .

對照器M2，如圖8所示，為以從對照臂M3的規定處朝前方突出之形態，於寬幅方向相隔規定距離並設左右一對，而在先端部安裝有對照感測器M1之物。對照感測器M1，由發出訊號亦即光束(線型光)之發送器M11(發光感測器)、及接收從發送器M11發出的訊號之接收器M12(受光感測器)所構成。另，亦可藉由發送器、及將從發送器發出的線型光朝向發送器反射之反射部來構成對照感測器M1。在此情形下，發送器還具有身為接收器之機能。如圖8所示，為了讓將光軸ML朝向左右的水平方向之對照感測器M1(M11、M12)於對照處理時不會干涉偵測對象亦即搬送對象物W，係將對照感測器M1(M11、M12)彼此的左右的跨距因應搬送對象物W的平面尺寸而設定成適當的值。As shown in FIG. 8, the collimator M2 has a pair of left and right sides spaced apart from each other in a width direction by a predetermined distance from a predetermined portion of the control arm M3, and a contrast sensor M1 is attached to the tip end portion. Things. The comparison sensor M1 is composed of a transmitter M11 (light-emitting sensor) that emits a signal, that is, a beam (linear light), and a receiver M12 (light-receiving sensor) that receives a signal from the transmitter M11. Alternatively, the collating sensor M1 may be configured by a transmitter and a reflecting portion that reflects linear light emitted from the transmitter toward the transmitter. In this case, the transmitter also has a function as a receiver. As shown in FIG. 8, in order to allow the collimator M1 (M11, M12) in the horizontal direction in which the optical axis ML is oriented to the left and right does not interfere with the object to be detected, that is, the object to be transported W, the contrast sensing is performed. The right and left spans of the M1 (M11, M12) are set to appropriate values in accordance with the planar size of the object W to be transported.

對照臂M3，為一令於前後方向D之對照器M2的位置，在圖8(ii)所示位置亦即可通過處於開狀態的開口部41而藉由對照感測器M1偵測FOUP3中收容有晶圓W之第1對照位置(P1)、與圖8(i)所示位置亦可不可藉由對照感測器M1偵測FOUP3中收容有晶圓W之不能對照晶圓位置(P2)之間移動之物。本實施形態之對照臂M3，如圖3所示，呈框狀，一體或一體性地具有上框部M31、及從上框部M31的兩端各自朝下方延伸之左右一對的側框部M32、及設於兩側框部M32的下端部間之下框部M33，而構成為在藉由該些上框部M31、兩側框部M32及下框部M33被圍繞之朝前後方向D開口的對照臂M3的內部空間MS，能夠收容載入埠門8本體、以及從搬送室2側被覆載入埠門8的周邊部件之門罩83。The control arm M3 is a position of the collimator M2 in the front-rear direction D, and the position shown in FIG. 8(ii) can also be detected in the FOUP3 by the comparison sensor M1 through the opening portion 41 in the open state. The first control position (P1) in which the wafer W is accommodated, and the position shown in FIG. 8(i) may not be detected by the comparison sensor M1. The wafer wafer W in the FOUP 3 cannot be compared with the wafer position (P2). ) moving between things. As shown in FIG. 3, the control arm M3 of the present embodiment has a frame shape, and has an upper frame portion M31 integrally and integrally, and a pair of right and left side frame portions extending downward from both ends of the upper frame portion M31. M32 and the lower frame portion M33 provided between the lower end portions of the side frame portions M32, and are configured to be surrounded by the upper frame portion M31, the both side frame portions M32, and the lower frame portion M33 in the front-rear direction D. The inner space MS of the opening comparison arm M3 is capable of accommodating the door cover 83 that carries the main body of the card door 8 and that covers the peripheral member of the card door 8 from the side of the transfer chamber 2.

本實施形態中，在對照臂M3的上框部M31將對照器M2以令其朝前方突出之姿勢支撐。是故，設於對照器M2的先端部之對照感測器M1，係配置於比對照臂M3還朝前方突出之位置。本實施形態之載入埠1，是將對照臂M3的下框部M33安裝在構成門開閉機構9之部件。具體而言，將下框部M33安裝在支撐載入埠門8之支撐框80。是故，伴隨門開閉機構9所做之載入埠門8的升降作動，對照臂M3亦會一體地作動。其結果，對照機構M全體會和載入埠門8朝同一方向升降移動。另，本實施形態中，雖採用對照機構M和門8一體地作動之構成，但亦可在對照機構M設置專用的升降機構(僅使對照機構M單獨地升降之機構)，藉此做成相對於門8而言對照機構M獨立地升降之構成。In the present embodiment, the collimator M2 is supported by the upper frame portion M31 of the comparison arm M3 so as to protrude forward. Therefore, the collimator sensor M1 provided at the tip end portion of the collimator M2 is disposed at a position that protrudes forward from the control arm M3. In the loading cassette 1 of the present embodiment, the lower frame portion M33 of the comparison arm M3 is attached to the member constituting the door opening and closing mechanism 9. Specifically, the lower frame portion M33 is attached to the support frame 80 that supports the loading cassette 8. Therefore, with the movement of the loading and unloading mechanism 8 by the door opening and closing mechanism 9, the control arm M3 is also integrally activated. As a result, the entire control mechanism M moves up and down in the same direction as the loading card 8. Further, in the present embodiment, the control mechanism M and the door 8 are integrally operated. However, a special lifting mechanism (a mechanism for vertically moving the control mechanism M alone) may be provided in the matching mechanism M. The control mechanism M is independently raised and lowered with respect to the door 8.

本實施形態之對照機構M，具備以對照臂M3與門開閉機構9之安裝部中的樞支點作為中心而使對照臂M3全體傾動之傾動機構M4。傾動機構M4，如圖3、圖5及圖6所示，具備：傾動曲柄M41，連結至下框部M33；及連結軸M42(相當於樞支點)，以令和長邊方向一致的軸方向和載入埠1的寬幅方向一致之姿勢配置，且將傾動曲柄M41及門支撐框80相互連結；及進退可動部M43，以朝前後方向D貫通形成於框4的狹縫狀的***孔之姿勢配置，可朝前後方向D做進退動作；及樞支軸M44，將傾動曲柄M41的下端部樞接至進退可動部M43的後端部。The comparison mechanism M of the present embodiment includes a tilting mechanism M4 that tilts the entire arm M3 with the pivot point of the control arm M3 and the mounting portion of the door opening and closing mechanism 9 as a center. As shown in FIGS. 3, 5, and 6, the tilting mechanism M4 includes a tilting crank M41 connected to the lower frame portion M33, and a connecting shaft M42 (corresponding to a pivot point) so as to be aligned with the longitudinal direction. The tilting crank M41 and the door support frame 80 are coupled to each other in a posture in which the width direction of the magazine 1 is aligned, and the forward and backward movable portion M43 penetrates the slit-shaped insertion hole formed in the frame 4 in the front-rear direction D. The posture is arranged to advance and retreat in the front-rear direction D; and the pivot shaft M44 pivotally connects the lower end portion of the tilting crank M41 to the rear end portion of the advancing and retracting movable portion M43.

這樣的傾動機構M4，於將圖5等所示之對照器M2置放至不能對照晶圓位置(P2)的狀態下，藉由未圖示的驅動源使進退可動部M43往後方(搬送室2側)移動，藉此將傾動曲柄M41的下端部往後方推而使傾動曲柄M41全體繞樞支軸M44旋轉(傾動)。藉此，傾動曲柄M41，會於使上端部朝前方(FOUP3側)移動之方向旋動，連結至傾動曲柄M41的對照臂M3會和傾動曲柄M41往同一方向傾動。其結果，對照臂M3當中兩側框部M32的上端部側區域及上框部M31全體，會通過開口部41突出至比框4的最後面4B還前方的空間(FOUP3側的空間)。依以上，對照器M2，如圖6所示，便被置放至使對照感測器M1通過開口部41而突出至比框4的最後面4B還前方的空間之第1對照位置(P1)。另，傾動機構M4，於將對照器M2置放至第1對照位置(P1)的狀態下，藉由使進退可動部M43往前方(FOUP3側)移動，便能將對照器M2置放至不能對照晶圓位置(P2)。In the tilting mechanism M4, the collimator M2 shown in FIG. 5 and the like is placed in a state in which the wafer position (P2) cannot be compared, and the advancing and retracting movable portion M43 is moved to the rear by a driving source (not shown) (transport chamber) The two sides are moved, whereby the lower end portion of the tilting crank M41 is pushed rearward, and the tilting crank M41 is rotated all about the pivot axis M44 (tilted). Thereby, the tilting crank M41 is rotated in the direction in which the upper end portion is moved forward (the FOUP 3 side), and the control arm M3 coupled to the tilting crank M41 is tilted in the same direction as the tilting crank M41. As a result, the upper end portion side region and the upper frame portion M31 of the both side frame portions M32 of the control arm M3 protrude through the opening portion 41 to a space (the space on the FOUP 3 side) that is further forward than the rearmost surface 4B of the frame 4. According to the above, the collimator M2, as shown in FIG. 6, is placed so that the collimator sensor M1 protrudes through the opening 41 to the first comparison position (P1) of the space ahead of the rearmost face 4B of the frame 4. . Further, in the tilting mechanism M4, when the collimator M2 is placed in the first collimating position (P1), the collimator M2 can be placed by moving the advancing and retracting movable portion M43 forward (the FOUP3 side). Cannot compare wafer position (P2).

對照機構M，構成為可將對照器M2的前後方向之位置維持在第1對照位置(P1)或不能對照晶圓位置(P2)而和上述門開閉機構9的升降移動一體地升降。像這樣，本實施形態中的對照臂M3，為一藉由門開閉機構9而和載入埠門8一起朝前後方向及上下方向動作之物，且為一和門開閉機構9獨立而藉由傾動機構M4動作之物。The comparison mechanism M is configured to maintain the position of the collimator M2 in the front-rear direction at the first control position (P1) or the wafer position (P2), and to move up and down integrally with the lifting movement of the door opening and closing mechanism 9. In this manner, the control arm M3 in the present embodiment is a member that is moved in the front-rear direction and the vertical direction together with the loading card 8 by the door opening and closing mechanism 9, and is independent of the door opening and closing mechanism 9 by The tilting mechanism M4 moves.

本實施形態之載入埠1，能夠具備底部排淨(bottom purge)部，其設於載置桌台5而從FOUP3的底面側對該FOUP3內注入氮氣或惰性氣體或是乾燥空氣等適當選擇的氣體亦即環境氣體(亦稱為排淨氣體，本實施形態中主要使用氮氣或乾燥空氣)，而可將FOUP3內的氣體環境置換成環境氣體。底部排淨部，是以在載置桌台5上的規定處設有複數個之未圖示的噴嘴作為主體而成，令複數個噴嘴作用成為注入規定的環境氣體之底部排淨注入用噴嘴、或排出FOUP3內的氣體環境之底部排淨排出用噴嘴。該些複數個噴嘴，為可在嵌入至設於FOUP3的底部之注入口及排出口(皆圖示省略)的狀態予以連結之物。可透過注入口從底部排淨注入用噴嘴對FOUP3的內部空間2S供給環境氣體，透過排出口從底部排淨排出用噴嘴排出FOUP3的內部空間2S的氣體環境(此氣體環境，從排淨處理執行開始至規定時間為止為空氣或空氣以外的清淨度低之環境氣體，於該規定時間經過後為充填於FOUP3的內部空間2S的清淨度高之環境氣體)，藉此進行排淨處理。The loading cassette 1 of the present embodiment can include a bottom purge unit which is provided on the table 5 and appropriately injects nitrogen gas, inert gas or dry air into the FOUP 3 from the bottom surface side of the FOUP 3 . The gas is also an ambient gas (also referred to as a purge gas, which is mainly nitrogen or dry air in the present embodiment), and the gas atmosphere in the FOUP 3 can be replaced with an ambient gas. The bottom draining portion is formed by providing a plurality of nozzles (not shown) as a main body at a predetermined position on the mounting table 5, and the plurality of nozzles serve as a bottom discharge injection nozzle for injecting a predetermined environmental gas. Or discharge the nozzle at the bottom of the gas environment in the FOUP3. The plurality of nozzles are connected to each other in a state in which they are fitted into an injection port and a discharge port (all of which are omitted) provided at the bottom of the FOUP 3. The gas can be supplied to the internal space 2S of the FOUP 3 through the injection port through the injection port, and the gas atmosphere of the internal space 2S of the FOUP 3 can be discharged from the bottom through the discharge port (this gas environment is executed from the discharge process). The ambient gas having a low degree of cleanness other than air or air, which is a predetermined period of time, is an environmental gas having a high degree of cleanness filled in the internal space 2S of the FOUP 3 after the predetermined time elapses, thereby performing a draining process.

這樣的載入埠1，和在內部具備了搬送機器人21之搬送室2共同構成EFEM。本實施形態中，如圖2所示，在搬送室2的前面(前壁面)2F將載入埠1並排配置複數(例如3台)。EFEM的作動，是藉由載入埠1的控制器(圖2所示之控制部1C)、或EFEM全體的控制器(圖1所示之控制部C)而受到控制。Such a loading cassette 1 constitutes an EFEM together with a transfer chamber 2 in which the transfer robot 21 is provided. In the present embodiment, as shown in Fig. 2, the front surface (front wall surface) 2F of the transfer chamber 2 is loaded with 埠1 and arranged in parallel (for example, three units). The operation of the EFEM is controlled by the controller (the control unit 1C shown in FIG. 2) loaded with the 埠1 or the controller (the control unit C shown in FIG. 1) of the entire EFEM.

在搬送室2的內部空間2S，設有可將晶圓W等搬送對象物在載入埠1上的FOUP3與處理室R之間搬送之搬送機器人21。搬送機器人21，如圖1及圖2所示，例如為一具備將複數個連桿要素相互予以可水平迴旋地連結，而在先端部設置搬送對象物把持部211(機械手)之臂212、及將構成臂212的基端部之臂基座予以可迴旋地支撐朝且搬送室2的寬幅方向(載入埠1的並列方向)走行之走行部之物。搬送機器人21，具有連桿構造(多關節構造)，其形狀會在臂長成為最小之折疊狀態、與臂長變得比折疊狀態時還長之伸長狀態之間變化。能夠適用在臂212的先端將可個別控制之複數個機械手211於高度方向多段狀地設置之搬送機器人21。In the internal space 2S of the transfer chamber 2, a transfer robot 21 that can transport a transfer object such as a wafer W between the FOUP 3 loaded in the cassette 1 and the processing chamber R is provided. As shown in FIG. 1 and FIG. 2, the transport robot 21 includes, for example, an arm 212 that is provided with a plurality of link elements that are horizontally reciprocally coupled to each other, and a transport target gripping unit 211 (manipulator) is provided at the tip end portion. And the arm base constituting the base end portion of the arm 212 is rotatably supported by the traveling portion that travels in the width direction of the transfer chamber 2 (loaded in the parallel direction of the crucible 1). The transport robot 21 has a link structure (multi-joint structure), and its shape changes between a folded state in which the arm length is the smallest and an extended state in which the arm length is longer than the folded state. It is possible to apply to the transfer robot 21 in which a plurality of robot arms 211 that can be individually controlled are provided in a plurality of stages in the height direction at the tip end of the arm 212.

搬送室2，構成為供載入埠1及處理室R連接，藉此讓內部空間2S成為略密閉之狀態。在搬送室2的內部空間2S，形成從上方朝向下方之氣流亦即下降流(down flow)。是故，即使當搬送室2的內部空間2S中存在污染晶圓W的表面之微粒的情形下，仍可藉由下降流將微粒朝下方推下，而抑制微粒附著到搬送中的晶圓W的表面。圖1中，以箭頭模型化地揭示形成有下降流之搬送室2內的氣體的流動。亦可構成在搬送室2的側面或搬送室2的內部空間2S配置緩衝工作站、對準器(aligner)等適當的工作站而成之EFEM。The transfer chamber 2 is configured to connect the loading cassette 1 and the processing chamber R, thereby allowing the internal space 2S to be slightly sealed. In the internal space 2S of the transfer chamber 2, a downflow that is a downward flow from the upper side toward the lower side is formed. Therefore, even when particles of the surface of the wafer W are contaminated in the internal space 2S of the transfer chamber 2, the particles can be pushed downward by the descending flow to suppress the adhesion of the particles to the wafer W being transported. s surface. In Fig. 1, the flow of the gas in the transfer chamber 2 in which the downflow is formed is modeled by an arrow. It is also possible to form an EFEM in which an appropriate workstation such as a buffer workstation or an aligner is disposed on the side surface of the transfer chamber 2 or the internal space 2S of the transfer chamber 2.

本實施形態中，在和搬送室2當中配置了載入埠1的壁面2F(前壁面)相向之壁面2B(後壁面)，於寬幅方向並排配置複數(圖示例中為3室)之處理室R(半導體處理裝置)，而構成為在各處理室R內各自施以相異之適當的處理。作為在半導體製造工程的中間工程或後工程進行之處理例，能夠舉出底部拋光處理工程、晶圓層積處理工程、切割處理工程等。另，處理室R的作動，是藉由處理室R的控制器(圖1所示之控制部RC)而受到控制。此處，處理室R全體的控制器(控制部RC)、或EFEM全體的控制器(控制部C)，為載入埠1的控制部1C之上位控制器。In the present embodiment, the wall surface 2B (rear wall surface) on which the wall surface 2F (front wall surface) of the crucible 1 is placed is disposed in the transfer chamber 2, and a plurality of (three chambers in the illustrated example) are arranged side by side in the width direction. The processing chamber R (semiconductor processing apparatus) is configured to perform appropriate processing in each of the processing chambers R. Examples of the processing performed in the intermediate engineering or the post-engineering of the semiconductor manufacturing engineering include a bottom polishing processing project, a wafer lamination processing project, and a cutting processing project. Further, the operation of the processing chamber R is controlled by the controller (the control unit RC shown in Fig. 1) of the processing chamber R. Here, the controller (control unit RC) of the entire processing chamber R or the controller (control unit C) of the entire EFEM is the upper controller of the control unit 1C loaded with the 埠1.

各處理室R的內部空間MS、搬送室2的內部空間2S及被載置於各載入埠1上的FOUP3的內部空間2S，被維持在高清淨度。另一方面，在配置載入埠1的空間換言之即處理室外、EFEM外成為相對低清淨度。另，圖1及圖2，為載入埠1及搬送室2的相對位置關係、及具備該些載入埠1及搬送室2之EFEM與處理室R的相對位置關係模型化示意圖。The internal space MS of each processing chamber R, the internal space 2S of the transfer chamber 2, and the internal space 2S of the FOUP 3 placed on each loading cassette 1 are maintained at high definition clarity. On the other hand, in the space where the load 埠1 is configured, in other words, the outside of the processing room and the outside of the EFEM become relatively low cleanliness. 1 and 2 are schematic diagrams showing the relative positional relationship between the loading cassette 1 and the transfer chamber 2, and the relative positional relationship between the EFEM and the processing chamber R including the loading cassette 1 and the transfer chamber 2.

本實施形態中，在鄰接於搬送室2而設置之複數種類的處理室R內各自施加適當的處理。是故，底部拋光處理前的晶圓W、或底部拋光處理後被保持於環狀框F的薄晶圓W1等會透過鄰接於搬送室2而設置之載入埠1被搬送至處理室R內。此處，將底部拋光處理後的薄晶圓W1(比底部拋光處理前還被加工成較薄之晶圓W1)予以保持之環狀框F，為一形成一定程度的元件構造，而藉由底部拋光處理等被設定為例如0.3～0.7mm程度的厚度之物。另，底部拋光處理前後，晶圓W和薄晶圓W1的平面尺寸沒有變化。圖7(i)揭示第1搬送對象物亦即晶圓W，同圖(ii)揭示未保持薄晶圓W1之環狀框F，同圖(iii)揭示保持了薄晶圓W1之環狀框F。In the present embodiment, appropriate processing is applied to each of the plurality of types of processing chambers R provided adjacent to the transfer chamber 2. Therefore, the wafer W before the bottom polishing process or the thin wafer W1 held by the ring frame F after the bottom polishing process is transferred to the processing chamber R through the loading cassette 1 provided adjacent to the transfer chamber 2 Inside. Here, the ring-shaped frame F which is held by the bottom-polished thin wafer W1 (which is processed into a thinner wafer W1 before the bottom polishing process) is formed to form a certain degree of component structure by The bottom polishing treatment or the like is set to a thickness of, for example, about 0.3 to 0.7 mm. In addition, the wafer size of the wafer W and the thin wafer W1 did not change before and after the bottom polishing process. Fig. 7(i) shows the wafer W as the first object to be transported, and Fig. 7(ii) shows the ring frame F in which the thin wafer W1 is not held, and Fig. 3(iii) shows the ring in which the thin wafer W1 is held. Box F.

環狀框F，由具有比晶圓W還大一圈的平面尺寸之環狀本體F1、及張貼在環狀本體F1全體之膜F2所構成，為一可在膜F2上貼附保持底部拋光處理後的薄晶圓W1之物。被保持於這樣的環狀框F之薄晶圓W1，是在專用的搬送容器3亦即框匣C中收容一個個環狀框F之狀態下被搬送。在框匣C設有多段式的狹槽C1，構成為可在各狹槽C1載置環狀框F。圖9模型化地揭示在框匣C的狹槽C1載置了環狀框F之狀態。The annular frame F is composed of an annular body F1 having a planar size larger than the wafer W, and a film F2 attached to the entire annular body F1, so as to be attached to the film F2 to maintain the bottom polishing. The processed thin wafer W1. The thin wafer W1 held in the ring frame F is conveyed in a state in which one ring frame F is accommodated in the frame C which is a dedicated transfer container 3 . A plurality of slits C1 are provided in the frame C, and the annular frame F can be placed on each of the slots C1. Fig. 9 modelmatically discloses a state in which the ring frame F is placed in the slot C1 of the frame C.

本實施形態中，是在著眼於與載入埠1之間授受搬送容器3之搬送容器自動搬送裝置(OHT)的搬送效率改善、搬送產距(takt)改善這一點，而對於搬送室2而言設有處理內容相異的複數種處理室R之構成中，構成為以搬送機器人21來搬送保持底部拋光處理後的薄晶圓W1之環狀框F、或利用FOUP3的載置空間亦即載入埠1來作為框匣C的載置空間，藉此可並行地使用框匣C與FOUP3。也就是說，構成為以載入埠1作為介面，而可在載置於載入埠1上之框匣C與搬送機器人21之間搬送一個個環狀框F。此處，保持了薄晶圓W1之狀態的環狀框F相當於本發明之「第2搬送對象物」，框匣C相當於本發明之「第2搬送容器」。In the present embodiment, the transfer efficiency of the transfer container automatic transfer device (OHT) between the loading and unloading container 3 is improved, and the transfer yield (takt) is improved, and the transfer chamber 2 is used. In the configuration in which a plurality of processing chambers R having different processing contents are provided, the transfer robot 21 is configured to transport the ring frame F holding the thin wafer W1 after the bottom polishing process, or the mounting space using the FOUP 3 The 埠1 is loaded as the placement space of the frame ,C, whereby the frame 匣C and the FOUP3 can be used in parallel. That is, it is configured such that the load frame 1 is used as the interface, and one ring frame F can be transported between the frame C placed on the load cassette 1 and the transfer robot 21. Here, the ring frame F in which the thin wafer W1 is held corresponds to the "second transfer object" of the present invention, and the frame C corresponds to the "second transfer container" of the present invention.

本實施形態之載入埠1中，構成為能夠將以多段狀收容和晶圓W平面尺寸相異的環狀框F之框匣C載置於載置桌台5，又，藉由就座保持機構6將框匣C保持於載置桌台5上，藉由牽引機構7可將載置桌台5上的框匣C在就座位置與搬送對象物授受位置之間朝前後方向移動。當在載置桌台5上載置有FOUP3的情形下之就座位置、搬送對象物授受位置，分別和當在載置桌台5上載置有框匣C的情形下之就座位置、搬送對象物授受位置相同。也就是說，載置牽引機構7所做的牽引處理時之載置桌台5的移動量，於當在載置桌台5上載置有FOUP3之情形下、及於當在載置桌台5上載置有框匣C之情形下為相同移動量。In the loading cassette 1 of the present embodiment, the frame C of the annular frame F which is accommodated in a plurality of stages and different in plane size of the wafer W can be placed on the mounting table 5, and can be seated. The holding mechanism 6 holds the frame C on the placing table 5, and the frame mechanism C on the mounting table 5 can be moved in the front-rear direction between the seating position and the conveying target receiving position by the pulling mechanism 7. The seating position and the object to be conveyed in the case where the FOUP 3 is placed on the mounting table 5, and the seating position and the object to be transported, respectively, when the frame C is placed on the mounting table 5 The object is given the same location. That is to say, the amount of movement of the table 5 when the traction processing by the traction mechanism 7 is placed is performed when the FOUP 3 is placed on the mounting table 5, and when the table 5 is placed. The same amount of movement is applied in the case where the frame 匣C is placed.

本實施形態中，是令保持於載置桌台5上之搬送容器3(FOUP3、框匣C)的工件中心(晶圓W的中心、環狀框F的中心)相互一致。是故，使載置桌台5上的FOUP3藉由牽引機構7而從就座位置移動到了搬送對象物授受位置之時間點下的FOUP3內的晶圓W的中心，會和使載置桌台5上的框匣C藉由牽引機構7而從就座位置移動到了搬送對象物授受位置之時間點下的框匣C內的環狀框F的中心一致。藉此，當藉由搬送機器人21將工件(晶圓W、環狀框F)相對於搬送容器3(FOUP3、框匣C)做取出放入時，搬送機器人21只要以工件中心來對齊即可，而不需要每一相異的搬送容器3的教導(teaching)，搬送機器人21的控制會變得簡易。In the present embodiment, the center of the workpiece (the center of the wafer W and the center of the annular frame F) of the transfer container 3 (the FOUP 3 and the frame C) held on the table 5 is aligned with each other. Therefore, the center of the wafer W in the FOUP 3 at the time when the FOUP 3 on the table 5 is moved from the seated position to the transfer target receiving position by the pulling mechanism 7 is placed on the table. The frame C on the fifth frame C is aligned with the center of the ring frame F in the frame C at the time of moving from the seated position to the transfer target receiving position by the pulling mechanism 7. By this means, when the workpiece (wafer W, ring frame F) is taken out and transported to the transport container 3 (FOUP3, frame C) by the transport robot 21, the transport robot 21 can be aligned by the center of the workpiece. The teaching of the transfer robot 3 is simplified, and the teaching of the transfer container 3 is not required.

此外，本實施形態中，是將框4的開口部41設定成環狀框F可以略水平姿勢通過之開口尺寸。Further, in the present embodiment, the opening portion 41 of the frame 4 is set to an opening size in which the annular frame F can pass in a horizontal posture.

不過，當構成為以晶圓W搬送機器人21搬送保持底部拋光處理後的薄晶圓W1之環狀框F，或利用FOUP3的載置空間亦即載入埠1作為框匣C的載置空間，而可在共通的載入埠1並行使用框匣C與FOUP3的情形下，料想可能會發生載置桌台5上的框匣C中有底部拋光處理前的晶圓W和保持底部拋光處理後的薄晶圓W1之環狀框F混載，或載置桌台5上的FOUP3中有保持底部拋光處理後的薄晶圓W1之環狀框F和底部拋光處理前的晶圓W混載之事態。However, it is configured such that the wafer W transport robot 21 transports the ring frame F that holds the thin wafer W1 after the bottom polishing process, or the mounting space of the FOUP 3, that is, the load space of the frame C is loaded. In the case where the common loading 埠1 is used in parallel with the frame 匣C and the FOUP3, it is expected that the wafer W before the bottom polishing process and the bottom polishing process in the frame 匣C on the mounting table 5 may occur. The ring frame F of the rear thin wafer W1 is mixed, or the FOUP 3 on the mounting table 5 has a ring frame F for holding the thin wafer W1 after the bottom polishing process and a wafer W before the bottom polishing process. situation.

鑑此，本實施形態之載入埠1中，構成為能夠藉由對照機構M所做的對照處理來判別在載置桌台5上的搬送容器3(FOUP3、框匣C)內是否有搬送對象物W(底部拋光處理前的晶圓W、保持底部拋光處理後的薄晶圓W1之環狀框F)混載。As a result, in the loading cassette 1 of the present embodiment, it is possible to determine whether or not the transport container 3 (FOUP3, frame C) on the mounting table 5 is transported by the collation processing by the collating unit M. The object W (the wafer W before the bottom polishing treatment and the annular frame F of the thin wafer W1 after the bottom polishing treatment) are mixed.

本實施形態中，是令置放至搬送對象物授受位置之載置桌台5上的搬送對象物W(晶圓W、環狀框F)的中心一致，因此平面尺寸相異之搬送對象物W(晶圓W、環狀框F)的邊端位置和邊端位置不會相互一致，而會於前後方向D產生差距。本實施形態中，利用於此前後方向D搬送對象物W(晶圓W、環狀框F)的位置會發生差距，而構成為能夠藉由對照機構M所做的對照處理來判別在載置桌台5上的搬送容器3(FOUP3、框匣C)內是否有平面尺寸相異之搬送對象物(底部拋光處理前的晶圓W、保持底部拋光處理後的薄晶圓W1之環狀框F)混載。In the present embodiment, the center of the transport object W (wafer W, ring frame F) placed on the mounting table 5 placed at the transfer target receiving position is aligned, and therefore the transport target is different in plane size. The edge position and the edge position of W (wafer W, ring frame F) do not coincide with each other, and a gap is generated in the front-rear direction D. In the present embodiment, the position of the object W (the wafer W and the ring frame F) is shifted in the front-rear direction D, and the position can be determined by the collation processing by the collation unit M. Whether there is a transfer object having a different planar size in the transfer container 3 (FOUP3, frame C) on the table 5 (a wafer W before the bottom polishing process and a ring frame of the thin wafer W1 after the bottom polishing process) F) Mixed.

本實施形態之控制部1C，具有容器判別部1Ca，判別藉由就座保持機構6而保持於載置桌台5上的是FOUP3或框匣C的哪一者。作為容器判別部1Ca，係適用構成為僅當在載置桌台5載置了框匣C的情形下才會發出偵測訊號之物。具體而言，構成為藉由反射型感測器所做的偵測處理，而能夠判定在載置桌台5是否保持了框匣C。The control unit 1C of the present embodiment includes the container determining unit 1Ca, and determines which of the FOUP 3 or the frame C is held by the seating holding mechanism 6 on the placing table 5. The container discriminating unit 1Ca is configured to emit a detection signal only when the frame C is placed on the mounting table 5. Specifically, it is possible to determine whether or not the frame C is held on the table 5 by the detection processing by the reflection type sensor.

又，本實施形態之載入埠1，其特徵為，控制部1C可執行：第1對照處理，通過處於開狀態之開口部41將對照器M2置放於第1對照位置(P1)而令其執行對照機構M所做之對照處理；及第2對照處理，通過處於開狀態之開口部41將對照器M2置放於可藉由對照感測器M1偵測框匣C中收容有環狀框F之第2對照位置(P2)而令其執行對照機構M所做之對照處理，係選擇性地執行第1對照處理及第2對照處理的其中一方或雙方。本實施形態中，於前後方向D將第2對照位置(P2)設定在和不能對照晶圓位置(P2)同一位置。第1對照處理，為將對照器M2置放至第1對照位置(P1)的狀態下令對照臂M3做升降動作，藉此對搬送容器內的每一狹槽(FOUP內的每一狹槽34、框匣C內的每一狹槽C1)取得有關搬送對象物的資訊之處理，第2對照處理，為將對照器M2置放至第2對照位置(P2)的狀態下令對照臂M3做升降動作，藉此對搬送容器3內的每一狹槽34取得有關搬送對象物W的資訊之處理。Further, in the loading cassette 1 of the present embodiment, the control unit 1C can perform the first collation processing, and the collating unit M2 is placed in the first collimating position (P1) by the opening portion 41 in the open state. The comparison processing performed by the comparison mechanism M is performed; and the second comparison processing is performed by placing the collimator M2 in the opening portion 41 in the open state, and the ring is accommodated in the detection frame M by the contrast sensor M1. At the second control position (P2) of the frame F, the comparison processing by the comparison means M is performed, and one or both of the first comparison processing and the second comparison processing are selectively executed. In the present embodiment, the second control position (P2) is set to the same position as the wafer position (P2) in the front-back direction D. In the first comparison processing, the control arm M3 is caused to move up and down in a state where the collimator M2 is placed at the first control position (P1), thereby each slot in the transport container (each slot 34 in the FOUP) In the slot C1) in the frame C, the information on the object to be transported is acquired, and in the second comparison process, the control arm M3 is lifted and lowered in the state where the collimator M2 is placed in the second control position (P2). The operation is performed to acquire information on the information of the object W to be transported to each of the slots 34 in the transport container 3.

此處，對照感測器M1，為一發出訊號亦即光束(線型光)，以是否接收該訊號來偵測搬送對象物W的有無之物，能夠將光束的軌跡(線型光線條)想成是檢測線條ML。也就是說，在將對照器M2置放至第1對照位置(P1)的狀態下進行之第1對照處理時的檢測線條ML，為橫切FOUP3中收容的晶圓W之線條(參照圖7(ii))，在將對照器M2置放至第2對照位置(P2)的狀態下進行之第2對照處理時的檢測線條ML，為橫切框匣C中收容的環狀框F之線條(參照圖8(i))。特別是，本實施形態中，著眼於框匣C具有比晶圓W還大的平面尺寸，在將對照器M2置放至第2對照位置(P2)的狀態下進行之第2對照處理時的檢測線條ML，是設定成不會橫切FOUP3中收容的晶圓W之線條。這樣的對照器M2的第1對照位置(P1)及第2對照位置(P2)，能夠因應從搬送對象物W(晶圓W、環狀框F)的中心WC、FC或搬送容器3(FOUP3、框匣C)的中心至檢測線條ML為止之沿前後方向D的距離來設定。Here, the contrast sensor M1 is a light beam (linear light), and whether or not the signal is received to detect the presence or absence of the object to be transported W can be considered as a trajectory of the light beam (linear light strip). Is to detect the line ML. In other words, the detection line ML at the time of the first comparison processing performed in the state where the collimator M2 is placed at the first comparison position (P1) is a line that crosses the wafer W accommodated in the FOUP 3 (refer to FIG. 7). (ii)) The detection line ML at the time of the second comparison processing performed in the state where the collimator M2 is placed at the second control position (P2) is the line of the ring frame F accommodated in the frame 匣C (Refer to Figure 8(i)). In particular, in the present embodiment, attention is paid to the fact that the frame C has a larger planar size than the wafer W, and the second matching process is performed in a state where the collator M2 is placed in the second control position (P2). The detection line ML is a line that is set so as not to cross the wafer W accommodated in the FOUP 3. In the first control position (P1) and the second control position (P2) of the comparator M2, the center WC, the FC, or the transfer container 3 (FOUP3) from the object W (wafer W, ring frame F) can be transported. The distance from the center of the frame C) to the front-back direction D up to the detection line ML is set.

於第1對照處理時，藉由從發送器M11朝向接收器M12發出訊號而在發送器M11與接收器M12之間形成的訊號路徑，會在晶圓W存在之處被遮擋，在晶圓W不存在之處不會被遮擋而會到達接收器M12。藉此，便能依序檢測於高度方向H並排收納之晶圓W的有無或收納姿勢。如此，關於FOUP3內的所有的狹槽34或框匣C內的所有的狹槽C1，便能獲得有關晶圓W的有無或收納姿勢之資訊(搬送對象物檢測資訊)。During the first comparison processing, the signal path formed between the transmitter M11 and the receiver M12 by transmitting a signal from the transmitter M11 toward the receiver M12 is blocked at the presence of the wafer W, on the wafer W. Where it does not exist, it will not be blocked and will reach the receiver M12. Thereby, the presence or absence of the wafer W accommodated in the height direction H and the storage posture can be sequentially detected. In this way, information on the presence or absence of the wafer W or the storage posture (transport object detection information) can be obtained for all the slits 34 in the FOUP 3 or all the slots C1 in the frame C.

於第2對照處理時，藉由從發送器M11朝向接收器M12發出訊號而在發送器M11與接收器M12之間形成的訊號路徑，會在環狀框F存在之處被遮擋，在環狀框F不存在之處不會被遮擋而會到達接收器M12。藉此，便能依序檢測於高度方向H並排收納之環狀框F的有無或收納姿勢。如此，關於FOUP3內的所有的狹槽34或框匣C內的所有的狹槽34，便能獲得有關環狀框F的有無或收納姿勢之資訊(搬送對象物檢測資訊)。In the second comparison processing, the signal path formed between the transmitter M11 and the receiver M12 by transmitting a signal from the transmitter M11 toward the receiver M12 is blocked in the presence of the ring frame F, in the ring shape. Where the box F does not exist, it will not be blocked and will reach the receiver M12. Thereby, the presence or absence of the annular frame F accommodated in the height direction H and the storage posture can be sequentially detected. In this way, information on the presence or absence of the ring frame F or the storage posture (transport object detection information) can be obtained for all the slots 34 in the FOUP 3 or all the slots 34 in the frame C.

本實施形態之載入埠1，藉由從控制部1C對各部、各機構賦予驅動指令來執行規定的動作。控制部1C，具有下述構成，即，具備了進行記憶部、ROM、RAM、I/O埠、CPU、外部的顯示裝置(未圖示)等之間的資料的輸出入之輸出入介面(IF)，及將它們相互連接而在各部之間傳達資訊之匯流排。In the loading cassette 1 of the present embodiment, a predetermined operation is performed by giving a drive command to each unit and each unit from the control unit 1C. The control unit 1C has a configuration in which an input/output interface for inputting and outputting data between a memory unit, a ROM, a RAM, an I/O port, a CPU, an external display device (not shown), and the like is provided ( IF), and the bus that connects them to each other to convey information between the departments.

記憶部中，因應在此載入埠1被執行之處理的種類，而記憶有控制手續(動作序列)。也就是說，此記憶部中，存儲有規定的動作程式。本實施形態中的程式，係身為可執行之程式而被存儲於非暫時性的電腦可讀取的記錄媒體(硬碟等)之物。In the memory unit, the type of processing to be executed by 埠1 is loaded here, and the control procedure (operation sequence) is stored. In other words, a predetermined operation program is stored in the memory unit. The program in the present embodiment is stored in a non-transitory computer-readable recording medium (hard disk, etc.) as an executable program.

ROM，由硬碟、EEPROM、快閃記憶體等所構成，為記憶CPU的動作程式等之記錄媒體。RAM，作用成為CPU的工作區等。I/O埠，例如將CPU所輸出的控制訊號往各部、各機構輸出，或將來自感測器的資訊供給至CPU。The ROM is composed of a hard disk, an EEPROM, a flash memory, or the like, and is a recording medium that memorizes an operation program of the CPU or the like. The RAM acts as a work area for the CPU. I/O埠, for example, outputs a control signal output by the CPU to each unit, each mechanism, or supplies information from the sensor to the CPU.

CPU，構成控制部1C的中樞，執行ROM中記憶的動作程式。CPU，沿著記憶部中記憶的程式來控制載入埠1的動作。The CPU constitutes a hub of the control unit 1C and executes an operation program stored in the ROM. The CPU controls the action of loading 埠1 along the program stored in the memory unit.

接下來、參照示意動作流程之圖10等，說明本實施形態之載入埠1的使用方法(特別是對照處理方法)及作用。Next, a method of using the loading cassette 1 (in particular, a matching processing method) and an operation will be described with reference to FIG. 10 and the like showing the operational flow.

首先，FOUP3或框匣C的其中一方，藉由在沿著搬送室2當中配置了載入埠1之共通的壁面3A而延伸之直線上的搬送線(動線)作動之OHT等搬送容器自動搬送裝置，被搬送至載入埠1的上方，而被載置於載置桌台5上，則本實施形態之載入埠1中，控制部1C會執行藉由就座保持機構6保持於載置桌台5上之就座保持處理St1(參照圖10)。本實施形態中的就座保持處理St1的具體的處理，係將載置桌台5上的鎖定爪61鉤住設於FOUP3的底面或框匣C的底面之被鎖定部(圖示省略)而設為鎖定狀態之處理。藉此，便能將FOUP3或框匣C載置而固定於載置桌台5上的規定的就座位置。當FOUP3被載置於載置桌台5上的情形下，設於載置桌台5之定位用突起51會嵌入FOUP3的定位用凹部。First, one of the FOUP 3 or the frame C is automatically moved by a transport line (moving line) such as an OHT that is placed on a straight line extending along the line 3A in which the common wall surface 3A of the crucible 1 is placed in the transfer chamber 2 When the transport device is transported to the upper side of the loading cassette 1 and placed on the mounting table 5, the loading unit 1 of the present embodiment executes the control unit 1C by the seating holding mechanism 6. The seating holding process St1 on the table 5 is placed (see Fig. 10). The specific processing of the seating holding process St1 in the present embodiment is to hook the locking claw 61 on the table 5 to the locked portion (not shown) provided on the bottom surface of the FOUP 3 or the bottom surface of the frame C. Set to lock processing. Thereby, the FOUP 3 or the frame C can be placed and fixed to a predetermined seating position on the table 5 . When the FOUP 3 is placed on the mounting table 5, the positioning projection 51 provided on the mounting table 5 is fitted into the positioning recess of the FOUP 3.

本實施形態中，控制部1C是基於容器判別部1Ca的輸出訊號來判別藉由就座保持機構6保持了FOUP3或框匣C的哪一者(容器判別處理St2)。本實施形態之容器判別處理St2，係藉由容器判別部1Ca來判別載置桌台5上的搬送容器是否為框匣C之處理。又，本實施形態之載入埠1，於當載置桌台5上保持了FOUP3的情形下、與當在載置桌台5上保持了框匣C的情形下令其動作序列相異。In the present embodiment, the control unit 1C determines which of the FOUP 3 or the frame C is held by the seating holding mechanism 6 based on the output signal of the container determination unit 1Ca (container determination processing St2). In the container discrimination processing St2 of the present embodiment, the container discriminating unit 1Ca determines whether or not the transport container on the table 5 is a frame C. Further, in the loading cassette 1 of the present embodiment, when the FOUP 3 is held on the mounting table 5, the operation sequence is different when the frame C is held on the mounting table 5.

另，本實施形態中，亦能構成為可對朝搬送室2的寬幅方向並排配置3台之載入埠1的載置桌台5各自載置FOUP3或框匣C，而藉由檢測搬送容器(FOUP3、框匣C)在載置桌台5上是否被載置於規定的位置之就座感測器(圖示省略)，來檢測搬送容器(FOUP3、框匣C)已被載置於載置桌台5上的就座位置。In addition, in the present embodiment, the FOUP 3 or the frame C can be placed on each of the mounting tables 5 in which the loading cassettes 1 are arranged in the width direction of the transfer chamber 2, and the detection is carried out. Whether or not the container (FOUP3, frame C) is placed on the mounting table 5 at a predetermined position (not shown), and the transfer container (FOUP3, frame C) has been placed. The seating position on the table 5 is placed.

本實施形態之載入埠1中，控制部1C，當判別在載置桌台5上保持了FOUP3的情形下(容器判別處理St2；No)，循以下的處理手續。接續上述的就座保持處理St1，本實施形態之載入埠1中，控制部1C，藉由牽引機構7使載置桌台5從就座位置朝向框4後退至搬送對象物授受位置為止(後方牽引處理St3)。藉由此後方牽引處理St3，能夠將FOUP門32連結(對接；docking)至事先被命令在全閉位置(C)待命之載入埠門8而以緊貼狀態予以保持。本實施形態中，構成為使用設於上述的載入埠門8之卡合部81來將FOUP門32連結至該載入埠門8而以緊貼狀態予以保持。In the loading cassette 1 of the present embodiment, when the control unit 1C determines that the FOUP 3 is held on the mounting table 5 (container determination processing St2; No), the following processing procedure is followed. In the above-described seating holding process St1, in the loading cassette 1 of the present embodiment, the control unit 1C causes the placing table 5 to retreat from the seating position toward the frame 4 to the conveying target receiving position by the pulling mechanism 7 ( Rear traction treatment St3). By the rear traction processing St3, the FOUP door 32 can be connected (docking) to the loading door 8 which is commanded to be in the fully closed position (C) to be held in the close state. In the present embodiment, the FOP door 32 is coupled to the loading door 8 by the engaging portion 81 provided in the above-described loading/reporting door 8, and is held in a close contact state.

本實施形態之載入埠1中，於FOUP3被載置於載置桌台5上的就座位置之時間點，控制部1C，檢測到FOUP3的底面部已推壓設於載置桌台5之例如加壓感測器，以此為契機，控制部1C，賦予令設於載置桌台5的底部排淨注入用噴嘴及底部排淨排出用噴嘴往比載置桌台5的上面還上方伸進之驅動命令(訊號)。其結果，會將該些各噴嘴(底部排淨注入用噴嘴、底部排淨排出用噴嘴)各自連結至FOUP3的注入口及排出口，成為可執行排淨處理之狀態。In the loading cassette 1 of the present embodiment, when the FOUP 3 is placed on the seating position on the mounting table 5, the control unit 1C detects that the bottom surface portion of the FOUP 3 is pressed against the mounting table 5 For example, the pressure sensor is used as the control unit 1C to give the bottom discharge cleaning nozzle and the bottom discharge cleaning nozzle provided on the mounting table 5 to the upper surface of the mounting table 5 The drive command (signal) that protrudes above. As a result, each of the nozzles (the bottom discharge nozzle and the bottom discharge nozzle) are connected to the injection port and the discharge port of the FOUP 3, and the discharge process can be performed.

然後，本實施形態之載入埠1中，控制部1C發出驅動命令，對FOUP3的內部空間2S執行排淨處理St4。此排淨處理St4，係透過注入口從底部排淨注入用噴嘴對FOUP3的內部空間2S供給規定的環境氣體，而將在此之前滯留於FOUP3的內部空間2S的氣體透過排出口從底部排淨排出用噴嘴予以排出之處理。藉由此排淨處理St4，能夠將FOUP3的內部空間2S以環境氣體填滿，於短時間內使FOUP3內的水分濃度及氧濃度各自降低至規定值以下，而將FOUP3內中的搬送對象物W的周圍環境設為低濕度環境及低氧環境。Then, in the loading cassette 1 of the present embodiment, the control unit 1C issues a drive command to execute the drain processing St4 on the internal space 2S of the FOUP 3. In the cleaning process St4, the predetermined ambient gas is supplied to the internal space 2S of the FOUP 3 through the injection port from the bottom, and the gas which has been retained in the internal space 2S of the FOUP 3 is discharged from the bottom through the discharge port. The discharge is discharged by a nozzle. By the cleaning process St4, the internal space 2S of the FOUP 3 can be filled with the ambient gas, and the water concentration and the oxygen concentration in the FOUP 3 can be reduced to a predetermined value or less in a short time, and the object to be transported in the FOUP 3 can be transported. The surrounding environment of W is set to a low humidity environment and a low oxygen environment.

另，可適用於比被載置於載置桌台5上還之前的時間點事先施加排淨處理之FOUP3，對於這樣的FOUP3可執行排淨處理St4，亦可選擇不執行排淨處理St4。Further, it is applicable to the FOUP 3 that has been previously subjected to the draining process at a time before being placed on the mounting table 5, and the draining process St4 can be executed without performing the draining process St4 for such a FOUP3.

接著，本實施形態之載入埠1中，控制部1C，藉由連結切換機構82，進行解除FOUP門32與FOUP本體32之卡合狀態而設為可將FOUP門32從FOUP本體32拆卸之解閂鎖狀態之處理(解閂鎖處理St5)。Next, in the loading cassette 1 of the present embodiment, the control unit 1C is configured to release the engagement state between the FOUP door 32 and the FOUP main body 32 by the connection switching mechanism 82, so that the FOUP door 32 can be detached from the FOUP main body 32. The process of unlocking the latch state (unlatch processing St5).

接續解閂鎖處理St5，本實施形態之載入埠1中，控制部1C，執行藉由門開閉機構9使載入埠門8從全閉位置(C)往後方移動至門開放位置(O)，而將框4的開口部41設為開狀態之處理(門開放處理St6)。具體而言，控制部1C，藉由門開閉機構9使載入埠門8從全閉位置(C)至門開放位置(O)為止沿著上述的水平路徑移動規定距離。此時，載入埠門8，藉由卡合部81將FOUP門32一體地保持而移動。是故，藉由門開放處理St6，FOUP3的搬出入口31亦和框4的開口部41同樣地成為開狀態。In the loading/unloading process St5 of the present embodiment, the control unit 1C executes the door opening and closing mechanism 9 to move the loading/lowering door 8 from the fully closed position (C) to the rear to the door open position (O). The process of setting the opening 41 of the frame 4 to the open state (door opening process St6). Specifically, the control unit 1C moves the loading trick 8 by a predetermined distance along the horizontal path from the fully closed position (C) to the door open position (O) by the door opening and closing mechanism 9. At this time, the card door 8 is loaded, and the FOUP door 32 is integrally held by the engaging portion 81 and moved. Therefore, by the door opening process St6, the carry-in/out port 31 of the FOUP 3 is also opened in the same manner as the opening 41 of the frame 4.

接下來，本實施形態之載入埠1中，控制部1C，藉由對照機構M進行第2對照處理St7。對照機構M的對照器M2，於門開放處理St6的執行剛完畢後，是被置放於不能對照晶圓位置(P2)(參照圖8(i))。本實施形態中，是將對照器M2的第2對照位置(P2)設定在和不能對照晶圓位置(P2)同一位置，而將門開放處理St6剛完畢後之對照感測器M1的高度位置，設定在比FOUP3內的最上段的狹槽34還稍微上側之位置。將此對照感測器M1的高度位置訂為「第2對照開始高度位置」。按照這樣的本實施形態之載入埠1，可於門開放處理St6剛完畢後進行第2對照處理St7。另，本實施形態之載入埠1，是於比執行第2對照處理St7還之前的時間點執行門開放處理St6，因此框4的開口部41及FOUP3的搬出入口31會處於開狀態。Next, in the loading cassette 1 of the present embodiment, the control unit 1C performs the second collation processing St7 by the collating unit M. The collimator M2 of the collation unit M is placed at the unmatched wafer position (P2) immediately after the execution of the gate opening process St6 is completed (see FIG. 8(i)). In the present embodiment, the second control position (P2) of the collimator M2 is set at the same position as the wafer position (P2), and the height position of the collation sensor M1 immediately after the door opening process St6 is completed. It is set to a position slightly above the uppermost slot 34 in the FOUP 3. The height position of the comparison sensor M1 is set as "second control start height position". According to the loading cassette 1 of the present embodiment, the second comparison processing St7 can be performed immediately after the door opening processing St6 is completed. Further, in the loading cassette 1 of the present embodiment, the door opening processing St6 is executed at a time point before the execution of the second matching processing St7. Therefore, the opening portion 41 of the frame 4 and the carry-in/out port 31 of the FOUP 3 are in an open state.

然後，本實施形態之載入埠1中，藉由門開閉機構9使載入埠門8從門開放位置(O)朝向全開位置往下方移動，則對照機構M全體亦往下方移動。藉此，對照器M2，會將前後位置維持在第2對照位置(P2)，而從第2對照開始高度位置移動至比最下段的狹槽34還低之位置(第2對照結束高度位置)。控制部1C，循以上手續，檢測形成於對照感測器M1彼此之間的訊號路徑是否被遮擋，而執行對每一狹槽34獲得有關環狀框F的有無或收納姿勢的資訊(搬送對象物檢測資訊)之第2對照處理St7。Then, in the loading cassette 1 of the present embodiment, when the loading/closing door 8 is moved downward from the door opening position (O) toward the fully open position by the door opening and closing mechanism 9, the entire comparison mechanism M is also moved downward. Thereby, the collimator M2 maintains the front-rear position at the second control position (P2), and moves from the second control start height position to a position lower than the lowermost slot 34 (second control end height position). . The control unit 1C detects whether or not the signal path formed between the control sensors M1 is blocked by the above procedure, and performs information on the presence or absence of the ring frame F or the storage posture for each slot 34 (transport object) The second comparison processing of the object detection information) is St7.

當第2對照處理St7的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的FOUP3內之狹槽34中收容有環狀框F。另，當環狀框F為放不進FOUP3內之大小的情形下，可設定成依據第2對照處理St7的結果為「有偵測到」，來通報錯誤，而不執行第1對照處理St9(將對照處理停止)，亦能設定成根本不執行第2對照處理St7。When the result of the second comparison processing St7 is "detected", it can be recognized that the annular frame F is accommodated in the slit 34 in the FOUP 3 on the mounting table 5. In addition, when the ring frame F is not in the size of the FOUP 3, it can be set to notify the error according to the result of the second collation processing St7, and the first comparison processing St9 is not executed. (The control process is stopped), and it can also be set so that the second comparison process St7 is not executed at all.

另一方面，當第2對照處理St7的結果為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有環狀框F。On the other hand, when the result of the second collation processing St7 is "no detection", it can be recognized that the annular frame F is not accommodated in the slit 34.

本實施形態之載入埠1中，控制部1C，接續第2對照處理St7，執行令對照器M2從第2對照結束高度位置上昇至第2對照開始高度位置之處理(對照上昇處理St8)。具體而言，本實施形態中的對照上昇處理St8，能夠以藉由門開閉機構9使載入埠門8從全開位置朝向門開放位置(O)往上方移動之處理來執行。In the loading cassette 1 of the present embodiment, the control unit 1C continues the second comparison processing St7, and executes processing for raising the collimator M2 from the second control end height position to the second comparison start height position (control rising processing St8). Specifically, the collation raising process St8 in the present embodiment can be executed by the process in which the loading and closing mechanism 9 moves the loading card 8 upward from the fully open position toward the door open position (O).

接下來，本實施形態之載入埠1中，控制部1C，藉由對照機構M進行第1對照處理St9。具體而言，藉由傾動機構M4使對照器M2從第2對照位置(P2)移動至圖6及圖8(ii)所示之第1對照位置(P1)，而將對照器M2置放於對照感測器M1會被配置在FOUP3內之最上段的狹槽34的稍微上側之高度位置(第1對照開始高度位置)，而藉由門開閉機構9使載入埠門8從門開放位置(O)朝向全開位置往下方移動，則對照機構M全體亦往下方移動。藉此，對照器M2，會將前後位置維持在第1對照位置(P1)，而從第1對照開始高度位置移動至比最下段的狹槽34還低之位置(第1對照結束高度位置)。控制部1C，循以上手續，檢測形成於對照感測器M1彼此之間的訊號路徑是否被遮擋，而執行對每一狹槽34獲得有關晶圓W的有無或收納姿勢的資訊(搬送對象物檢測資訊)之第1對照處理St9。Next, in the loading cassette 1 of the present embodiment, the control unit 1C performs the first collation processing St9 by the collating unit M. Specifically, the tilting mechanism M4 moves the collimator M2 from the second collating position (P2) to the first collating position (P1) shown in FIGS. 6 and 8(ii), and the collator M2 is placed on the collimator M2. The comparison sensor M1 is disposed at a slightly upper height position (the first comparison start height position) of the uppermost slot 34 in the FOUP 3, and the loading shutter 8 is opened from the door by the door opening and closing mechanism 9. (O) Moving downward toward the fully open position, the entire control mechanism M also moves downward. Thereby, the collimator M2 maintains the front-rear position at the first comparison position (P1), and moves from the first comparison start height position to a position lower than the lowermost slot 34 (the first control end height position). . The control unit 1C detects whether or not the signal path formed between the control sensors M1 is blocked by the above procedure, and performs information on the presence or absence of the wafer W or the storage posture for each slot 34 (transport object) The first comparison processing of the detection information) is St9.

另，於接續對照上昇處理St8而令對照器M2從第2對照位置(P2)移動到了第1對照位置(P1)之時間點，如果對照感測器M1的尺寸條件是會被置放於比FOUP3內的最上段的狹槽34還下側，則只要藉由適當的處理(若為本實施形態，是令對照機構M和載入埠門8一體地往上方移動規定距離之處理)，來調整對照器M2的高度位置使得對照感測器M1會被置放於比FOUP3內的最上段的狹槽34還上側即可。In addition, when the control unit M2 is moved from the second control position (P2) to the first control position (P1), the size of the control sensor M1 is placed in the comparison. The lowermost slot 34 in the FOUP 3 is also on the lower side, and if it is appropriately processed (in the present embodiment, the control mechanism M and the loading gate 8 are moved upward by a predetermined distance) The height position of the collimator M2 is adjusted so that the collimator sensor M1 is placed on the upper side of the uppermost slot 34 in the FOUP 3.

當第1對照處理St9的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的FOUP3內之狹槽34中收容有環狀框F、晶圓W的其中一者。另一方面，當第1對照處理St9的結果為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有晶圓W、環狀框F的任一者。When the result of the first comparison processing St9 is "detected", it is possible to recognize that one of the annular frame F and the wafer W is accommodated in the slit 34 in the FOUP 3 on the mounting table 5. On the other hand, when the result of the first collation processing St9 is "no detection", it is possible to recognize that the wafer 34 and the ring frame F are not accommodated in the slot 34.

然後，本實施形態中，如圖11所示，能夠以藉由第1對照處理St9及第2對照處理St7而獲得之搬送對象物檢測資訊的結果，來辨明FOUP3內的收容狀況。也就是說，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果為「有偵測到」的情形下，能夠辨明該狹槽34中收容有晶圓W(正常積載)。此外，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果亦為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有晶圓W、環狀框F的任一者(空狹槽狀態)。In the present embodiment, as shown in FIG. 11, the storage state detection information obtained by the first collation processing St9 and the second collation processing St7 can be used to identify the storage state in the FOUP 3. In other words, when the detection result of the second comparison processing St7 is "no detection", and the detection result of the first comparison processing St9 is "detected", it can be recognized that the slot 34 is accommodated. There is wafer W (normal stowage). In addition, when the detection result of the second comparison processing St7 is "no detection", and the detection result of the first comparison processing St9 is also "no detection", it can be discerned that the slot 34 is not accommodated. There is either wafer W or ring frame F (empty slot state).

另一方面，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果亦為「有偵測到」的情形下，能夠辨明該狹槽34中收容有環狀框F、晶圓W的其中一者(混載)。此外，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果為「無偵測到」的情形下，該狹槽34中的收容狀況成為矛盾，因此能夠辨明感測器錯誤。On the other hand, when the detection result of the second comparison processing St7 is "detected", and the detection result of the first comparison processing St9 is also "detected", the slot 34 can be identified. One of the ring frame F and the wafer W (mixed) is housed. In addition, when the detection result of the second comparison processing St7 is "detected", and the detection result of the first comparison processing St9 is "no detection", the storage condition in the slot 34 becomes contradictory. Therefore, it is possible to discern sensor errors.

依以上，於在載置桌台5上保持了FOUP3的狀態下，若第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果為「有偵測到」，則能夠辨明為在FOUP3內未有晶圓W與環狀框F混載之「正常積載」，若為其以外的偵測結果，則能夠辨明為在FOUP3內混載收容有晶圓W與環狀框F，或是感測器錯誤。According to the above, in the state in which the FOUP 3 is held on the mounting table 5, if the detection result of the second comparison processing St7 is "no detection", the detection result of the first comparison processing St9 is "detected". In this case, it can be recognized that there is no "normal stowage" in which the wafer W and the ring frame F are mixed in the FOUP 3. If the detection result is other than the detection result, it can be recognized that the wafer W is mixed and stored in the FOUP 3 Ring frame F, or sensor error.

接下來，當在載置桌台5上保持了框匣C的情形下說明動作序列。本實施形態之載入埠1中，控制部1C，當判別在載置桌台5上保持了框匣C的情形下(容器判別處理St2；Yes)，循以下的處理手續。接續上述的就座保持處理St1，本實施形態之載入埠1中，控制部1C，執行藉由門開閉機構9使載入埠門8從全閉位置(C)往後方移動至門開放位置(O)，而將框4的開口部41設為開狀態之處理(門開放處理St6)，接續門開放處理St6，藉由牽引機構7使載置桌台5從就座位置朝向框4後退至搬送對象物授受位置(後方牽引處理St3)。Next, the operation sequence will be described in the case where the frame C is held on the placement table 5. In the loading cassette 1 of the present embodiment, when the control unit 1C determines that the frame C is held on the mounting table 5 (container determination processing St2; Yes), the following processing procedure is followed. Following the seating holding process St1 described above, in the loading cassette 1 of the present embodiment, the control unit 1C executes the door opening and closing mechanism 9 to move the loading/reporting door 8 from the fully closed position (C) to the rear to the door open position. (O), the opening portion 41 of the frame 4 is opened (door opening processing St6), and the door opening processing St6 is continued, and the loading table 5 is moved backward from the seating position toward the frame 4 by the pulling mechanism 7. It is the position (transfer processing St3) of the object to be conveyed.

本實施形態中適用之框匣C的平面尺寸，特別是前後方向的尺寸，比FOUP3的前後方向的尺寸還大，因此當比門開放處理St6還先執行了後方牽引處理St3的情形下，收容於框匣C內之環狀框F或是框匣C本體恐會和載入埠門8接觸。鑑此，本實施形態中，當在載置桌台5上載置了框匣C的情形下，係設定成將門開放處理St6優先於後方牽引處理St3執行。The plane size of the frame C applied in the present embodiment, particularly the dimension in the front-rear direction, is larger than the dimension in the front-rear direction of the FOUP 3. Therefore, when the rear traction process St3 is executed before the door opening process St6, the case is accommodated. The ring frame F or the frame C body in the frame C may be in contact with the loading tool 8. In the present embodiment, when the frame C is placed on the mounting table 5, the door opening process St6 is set to be executed in preference to the rear pulling process St3.

此外，本實施形態中適用之框匣C，為開放匣，因此能夠省略排淨處理及解閂鎖處理。另，中間工程、後工程中，搬送室2內的高空間清淨性並不必要，因此作為環狀框F的搬送容器3能夠使用開放匣。Further, since the frame C applied in the present embodiment is open, the draining process and the unlocking process can be omitted. Further, in the intermediate work and the post-engineering, the high space detergency in the transfer chamber 2 is unnecessary, and therefore, the transfer container 3 as the annular frame F can be opened.

然後，本實施形態之載入埠1中，控制部1C，接續後方牽引處理St3，執行將對照器M2置放於第2對照位置(P2)而進行之第2對照處理St7(參照圖9(i))、對照上昇處理St8、及將對照器M2置放於第1對照位置(P1)而進行之第1對照處理St9(參照圖9(ii))。Then, in the loading cassette 1 of the present embodiment, the control unit 1C continues the rear pulling processing St3, and executes the second matching processing St7 in which the collimator M2 is placed at the second control position (P2) (see FIG. 9 (see FIG. 9). i)), the comparison control step St8, and the first comparison processing St9 (see FIG. 9(ii)) performed by placing the comparator M2 at the first control position (P1).

當第2對照處理St7的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的框匣C內之狹槽C1中收容有環狀框F。另一方面，當第2對照處理St7的結果為「無偵測到」的情形下，能夠辨明該狹槽C1中未收容有環狀框F。When the result of the second comparison processing St7 is "detected", it can be recognized that the annular frame F is accommodated in the slit C1 in the frame C on the mounting table 5. On the other hand, when the result of the second collation processing St7 is "no detection", it can be recognized that the annular frame F is not accommodated in the slot C1.

當第1對照處理St9的結果為「有偵測到」的情形下，能夠辨明載置桌台5上的框匣C內之狹槽C1中收容有環狀框F、晶圓W的其中一者。另一方面，當第1對照處理St9的結果為「無偵測到」的情形下，能夠辨明該狹槽C1中未收容有晶圓W、環狀框F的任一者。When the result of the first comparison processing St9 is "detected", it can be recognized that one of the annular frame F and the wafer W is accommodated in the slot C1 in the frame C on the mounting table 5. By. On the other hand, when the result of the first collation processing St9 is "no detection", it is possible to discriminate that either the wafer W or the ring frame F is not accommodated in the slot C1.

然後，本實施形態中，如圖11所示，能夠以藉由第1對照處理St9及第2對照處理St7而獲得之搬送對象物檢測資訊的結果，來辨明框匣C內的收容狀況。也就是說，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果亦為「有偵測到」的情形下，能夠辨明該狹槽C1中收容有環狀框F。此外，當第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果為「無偵測到」的情形下，該狹槽C1中的收容狀況成為矛盾，因此能夠辨明感測器錯誤。In the present embodiment, as shown in FIG. 11, the storage state detection information obtained by the first comparison processing St9 and the second comparison processing St7 can be used to identify the storage state in the frame C. In other words, when the detection result of the second comparison processing St7 is "detected", and the detection result of the first comparison processing St9 is also "detected", the slot C1 can be identified. The ring frame F is housed. In addition, when the detection result of the second comparison processing St7 is "detected", and the detection result of the first comparison processing St9 is "no detection", the storage condition in the slot C1 becomes contradictory. Therefore, it is possible to discern sensor errors.

另一方面，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果為「有偵測到」的情形下，能夠辨明該狹槽C1中收容有晶圓W。此外，當第2對照處理St7的偵測結果為「無偵測到」，第1對照處理St9的偵測結果亦為「無偵測到」的情形下，能夠辨明該狹槽34中未收容有環狀框F、晶圓W的任一者(空狹槽狀態)。On the other hand, when the detection result of the second comparison processing St7 is "no detection", and the detection result of the first comparison processing St9 is "detected", it can be recognized that the slot C1 is accommodated. There is wafer W. In addition, when the detection result of the second comparison processing St7 is "no detection", and the detection result of the first comparison processing St9 is also "no detection", it can be discerned that the slot 34 is not accommodated. There is either a ring frame F or a wafer W (empty slot state).

依以上，於在載置桌台5上保持了框匣C的狀態下，若第2對照處理St7的偵測結果為「有偵測到」，第1對照處理St9的偵測結果亦為「有偵測到」，則能夠辨明為在框匣C內未有環狀框F與晶圓W混載之「正常積載」，若為其以外的偵測結果，則能夠辨明為在框匣C內混載收容有環狀框F與晶圓W，或是感測器錯誤。According to the above, in the state in which the frame C is held on the mounting table 5, if the detection result of the second comparison processing St7 is "detected", the detection result of the first comparison processing St9 is also " If it is detected, it can be identified that there is no "normal stowage" in which the ring frame F and the wafer W are mixed in the frame C. If the detection result is other than the detection result, it can be discerned as being in the frame C. The mixed frame accommodates the ring frame F and the wafer W, or is a sensor error.

本實施形態之載入埠1中，在載置桌台5上保持了FOUP3的情形下，在載置桌台5上保持了框匣C的情形下，在它們任一種情形下，控制部1C皆執行第1對照處理、第2對照處理，於該些2次的對照處理結束後，在將對照器M2置放於搬送室2的內部空間之狀態(例如置放於第2對照位置(P2)之狀態)下，執行藉由門開閉機構9使載入埠門8下降至全開位置之處理。藉此，對照機構M，會和往全開位置移動之載入埠門8一起往下方移動。本實施形態之載入埠1中，控制部1C，當基於第1對照處理及第2對照處理的偵測結果而辨明出非混載狀態或感測器錯誤狀態的情形下，係執行從載置桌台5上的FOUP3或框匣C將搬送對象物(晶圓W、環狀框F)藉由搬送機器人21依序往規定的搬送目的地(處理室R(具體而言為載入/載出室)、緩衝工作站、對準器等)搬送之處理。In the loading cassette 1 of the present embodiment, when the FOUP 3 is held on the mounting table 5, when the frame C is held on the mounting table 5, in either case, the control unit 1C The first comparison process and the second comparison process are performed, and after the two comparison processes are completed, the comparator M2 is placed in the internal space of the transfer chamber 2 (for example, placed in the second control position (P2) In the state of the state), the process of lowering the loading trick 8 to the fully open position by the door opening and closing mechanism 9 is performed. Thereby, the collating mechanism M moves downward together with the loading trick 8 moving to the fully open position. In the loading cassette 1 of the present embodiment, the control unit 1C performs the slave placement when the non-mixed state or the sensor error state is recognized based on the detection results of the first collation processing and the second collation processing. The FOUP 3 or the frame C on the table 5 transports the object (wafer W, ring frame F) to the predetermined transfer destination by the transfer robot 21 (the processing chamber R (specifically, loading/loading) Handling), buffering station, aligner, etc.)

另一方面，當基於第1對照處理及第2對照處理的偵測結果而辨明出為混載狀態或感測器錯誤狀態的情形下，載置桌台5上的FOUP3或框匣C，會藉由搬送容器自動搬送裝置從載置桌台5被移載往其他空間，新的FOUP3或框匣C藉由搬送容器自動搬送裝置被載置於載置桌台5上，而循上述的動作序列。On the other hand, when the detection state of the first collation processing and the second collation processing is recognized as the mixed state or the sensor error state, the FOUP 3 or the frame C on the table 5 is loaded. The transfer container automatic transfer device is transferred from the mounting table 5 to another space, and the new FOUP 3 or the frame C is placed on the mounting table 5 by the transfer container automatic transfer device, and the above-described action sequence is followed. .

按照以上所述本實施形態之載入埠1，可使用對照有關包括FOUP3內的各狹槽34中的第1搬送對象物(晶圓W)的有無之狀態的資訊之對照機構M，來執行第2對照處理，而藉由第2對照處理來對照有關包括第2搬送容器(框匣C)內的各狹槽C1中的第2搬送對象物(環狀框F)的有無之狀態的資訊，基於第1對照處理的偵測結果與第2對照處理的偵測結果之雙方、或其中一方，而可辨明平面尺寸相異的搬送對象物W是否混載於載置桌台5上的FOUP3或框匣C內。是故，按照本實施形態之載入埠1，無需大幅變更以往的載入埠的構成，避免對照機構M的大型化及構造的複雜化，於中間工程以後，即使採用將互相平面尺寸相異的搬送對象物(晶圓W、環狀框F)利用共通的載入埠1來收容至載置於載入埠1上之FOUP3(第1搬送容器)或框匣C(第2搬送容器)而取用之使用形態的情形下，仍可偵測相異的搬送對象物(晶圓W、環狀框F)在FOUP3或框匣C中被誤混載(誤投入/誤積載)，而能夠謀求半導體製造中的運用率提升。According to the loading cassette 1 of the present embodiment described above, it is possible to perform the comparison mechanism M for controlling the presence or absence of the information of the first transport object (wafer W) in each of the slots 34 in the FOUP 3. In the second comparison processing, information on the presence or absence of the second transfer object (annular frame F) in each of the slots C1 in the second transfer container (frame C) is controlled by the second control process. Based on either or both of the detection result of the first collation processing and the detection result of the second collation processing, it is possible to discriminate whether or not the transport object W having a different plane size is mixed with the FOUP 3 on the mounting table 5 or Box 匣C. Therefore, according to the loading cassette 1 of the present embodiment, it is not necessary to significantly change the configuration of the conventional loading cassette, and it is possible to avoid the enlargement of the comparison mechanism M and the complication of the structure, and even after the intermediate engineering, even if the mutual plane dimensions are different The object to be transported (wafer W, ring frame F) is stored in the FOUP 3 (first transfer container) or frame C (second transfer container) placed on the loading cassette 1 by the common loading cassette 1 In the case of the use form, it is possible to detect that the different objects to be transported (wafer W, ring frame F) are mismixed in the FOUP 3 or the frame C (missing/missing), and Seek to increase the utilization rate in semiconductor manufacturing.

又，本實施形態中，構成為藉由分別置放於第1對照位置(P1)或第2對照位置(P2)之對照器M2來偵測令載置桌台5上的工件中心互相一致之搬送對象物(晶圓W、環狀框F)的端部。也就是說，本實施形態中，是構成為於第1搬送對象物(晶圓W)及第2搬送對象物(環狀框F)在第1搬送容器(FOUP3)內或第2搬送容器(框匣C)內以彼此的中心位置相互一致之方式被收容之狀態下執行對照處理(第1對照處理、第2對照處理)，因此不必因應搬送對象物(晶圓W、環狀框F)的尺寸來變更搬送機器人21所做的搬送對象物之搬送距離或搬送位置，能夠謀求控制的簡化。Further, in the present embodiment, it is configured to detect that the center of the workpiece on the mounting table 5 coincides with each other by the collimator M2 placed at the first comparison position (P1) or the second comparison position (P2). The end of the object (wafer W, ring frame F) is transported. In other words, in the first embodiment, the first transfer object (wafer W) and the second transfer target (annular frame F) are in the first transfer container (FOUP3) or the second transfer container (in the second embodiment). In the frame C), the collation processing (the first collation processing and the second collation processing) is performed in a state in which the center positions of the two are aligned with each other. Therefore, it is not necessary to transport the object (wafer W, ring frame F). In the size, the transport distance or the transport position of the transport object by the transport robot 21 is changed, and the control can be simplified.

再加上，按照本實施形態之載入埠1，控制部1C，具有判別藉由就座保持機構6保持了FOUP3或框匣C的哪一者之容器判別部1Ca，因此可基於容器判別部1Ca所做的判別資訊，基於事先設定好的動作序列如就座保持處理、門開放處理、後方牽引處理、第1對照處理、第2對照處理的順序，或進行第1對照處理及第2對照處理雙方、或是僅進行其中一方的對照處理等，來自動控制各機構的動作。In addition, according to the loading cassette 1 of the present embodiment, the control unit 1C has a container discriminating unit 1Ca that determines which of the FOUP 3 or the frame C is held by the seating holding mechanism 6, and therefore can be based on the container discriminating unit. The discrimination information made by 1Ca is based on a preset operation sequence such as a seating hold process, a door open process, a rear pull process, a first control process, a second control process, or a first control process and a second control. The operation of each mechanism is automatically controlled by processing both sides or by performing only one of the comparison processes.

特別是，本實施形態之載入埠1中，當判斷出藉由就座保持機構6保持了框匣C之搬送容器為框匣C的情形下，依序執行了就座保持處理、門開放處理、後方牽引處理之後，執行第1對照處理及第2對照處理雙方，藉此便能避免框匣C和載入埠門8衝撞之事態。In particular, in the loading cassette 1 of the present embodiment, when it is determined that the transport container holding the frame C by the seating holding mechanism 6 is the frame C, the seating holding process and the door opening are sequentially performed. After the treatment and the rear traction processing, both the first comparison processing and the second comparison processing are executed, whereby the situation in which the frame C and the loading card 8 collide can be avoided.

此外，按照本實施形態中採用之載入埠1中的對照處理方法，會發揮如同上述的載入埠所發揮的種種作用效果之作用效果，能夠謀求半導體製造中的運用率提升。Further, according to the collation processing method in the loading cassette 1 used in the present embodiment, the effects of various effects exerted by the above-described loading cassettes are exerted, and the utilization rate in semiconductor manufacturing can be improved.

另，本發明並不限於上述實施形態。例如，上述實施形態中，作為第1搬送對象物係示例晶圓，作為和第1搬送對象物平面尺寸相異的第2搬送對象物係示例了保持中間處理完畢的薄晶圓之環狀框，但第1搬送對象物、第2搬送對象物不限定於它們。收容第2搬送對象物之第2搬送容器亦不限定於框匣，只要是和第2搬送對象物的尺寸等相應之適當的搬送容器即可。作為搬送容器，亦能適用附門的框匣。在此情形下，需要將匣門卸下之處理(解閂鎖處理)。Further, the present invention is not limited to the above embodiment. For example, in the above-described embodiment, the first transport target sample wafer is a ring-shaped frame that holds the intermediate processed thin wafer as the second transport target that is different in size from the first transport target. However, the first object to be transported and the object to be transported to the second object are not limited to these. The second transfer container that accommodates the second transfer target is not limited to the frame, and may be an appropriate transfer container depending on the size of the second transfer target or the like. As the transport container, the frame with the door can also be applied. In this case, the process of removing the cardia (unlatch processing) is required.

此外，第2搬送對象物為比第1搬送對象物平面尺寸還小之物亦無妨。在此情形下，執行關於第2搬送對象物之對照處理(第2對照處理)時的對照器的位置(第2對照位置)，會成為比執行關於第1搬送對象物之對照處理(第1對照處理)時的對照器的位置(第1對照位置)還前方。In addition, the second object to be transported may be smaller than the plane size of the first object to be transported. In this case, the position (second control position) of the collimator in the case of the second processing object (the second collation processing) is performed in comparison with the execution of the first transport object (first The position of the comparator (the first control position) at the time of the control treatment was also forward.

本發明中的「第1對照位置」及「第2對照位置」，可因應第1搬送對象物及第2搬送對象物的平面尺寸來適當設定，第2對照位置亦可為和上述實施形態中的不能對照晶圓位置相異之位置。按照本發明，從生產性提升的觀點看來，對於晶圓的大徑化進展，而從目前為止的直徑300(半徑150)mm往直徑450(半徑225)mm乃至直徑500(半徑250)mm的晶圓轉變推進這樣近來的傾向亦能良好地對應。也就是說，不僅是上述這樣半導體製造的中間工程、後工程，於初期工程中亦可以本發明之載入埠來取用2種類的尺寸不同的搬送對象物與和其相應之2種類的搬送容器，而進行正確的對照處理。The "first control position" and the "second control position" in the present invention can be appropriately set in accordance with the plane size of the first transport object and the second transport object, and the second control position may be the same as in the above embodiment. Can not be compared to the location of the wafer location. According to the present invention, from the viewpoint of productivity improvement, the diameter of the wafer progresses, and from now on, the diameter 300 (radius 150) mm to the diameter 450 (radius 225) mm or even the diameter 500 (radius 250) mm The recent trend of wafer transfer advancement is also well matched. In other words, it is not only the intermediate engineering and the post-engineering of semiconductor manufacturing as described above, but also the two types of transport objects and the two types of transports that are different in size can be used in the initial project. The container is properly processed.

能夠適當變更將對照器置放於第1對照位置而執行之第1對照處理、及將對照器置放於第2對照位置而執行之第2對照處理的順序。此外，當第1或第2搬送容器中根本不會混載目的以外的搬送對象物之狀況下，亦能一面使用1種類的載入埠來取用2種類的搬送容器、2種類的搬送對象物，一面僅執行和搬送容器及搬送對象物相應之第1對照處理或第2對照處理的其中一方。The order of the first collation processing performed by placing the collimator in the first collimation position and the second collation processing performed by placing the collimator in the second collation position can be appropriately changed. In addition, in the case where the first or second transfer container does not mix the object to be transported at the same time, it is possible to use two types of transfer containers and two types of transfer objects using one type of load cassette. One of the first collation processing or the second collation processing corresponding to the transport container and the transport target is performed.

上述實施形態中，對照機構的對照移動部(對照臂)，係示例了滿足藉由門開閉機構而和載入埠門一起朝前後方向及上下方向動作，且和門開閉機構獨立地動作之第2動作條件的雙方之物，但只要為滿足它們其中一方的條件之物即可。例如，能夠適用構成為具備使對照移動部往前後方向水平移動之滑動機構，而藉由滑動機構使對照器在第1對照位置與第2對照位置之間前後移動之對照機構，或採用藉由和門開閉機構不同的移動機構來使對照機構朝高度方向之構成。此外，對照機構，只要是於藉由門開閉機構將框的開口部設為開狀態之狀態下可實施對照處理之物即可，本發明中所謂「將框的開口部設為開狀態之狀態」，為涵括上述實施形態中將載入埠門置放於門開放位置之狀態、及置放於全開位置之狀態的雙方之概念。對照機構，只要為和載入埠門的升降移動獨立而可升降移動之物，則亦可於將載入埠門置放於相當於上述實施形態中的門開放位置之位置的狀態下實施對照處理，亦可於將門置放於相當於上述實施形態中的全開位置之位置的狀態下實施對照處理。In the above-described embodiment, the control moving portion (control arm) of the matching mechanism is exemplified by the operation of the door opening and closing mechanism in the front-rear direction and the vertical direction together with the loading and closing mechanism, and the door opening and closing mechanism is operated independently. (2) The two things of the operating conditions, but they are only required to satisfy the conditions of one of them. For example, it is possible to apply a sliding mechanism having a sliding mechanism that horizontally moves the collimating moving portion in the front-rear direction, and a collimating mechanism that moves the collimator back and forth between the first collating position and the second collating position by the sliding mechanism, or by using a sliding mechanism A moving mechanism different from the door opening and closing mechanism is configured to make the control mechanism face in the height direction. In addition, in the present invention, the control unit may be in a state in which the opening of the frame is in an open state, and the opening of the frame is in an open state. The concept of both the state in which the trick door is placed in the door open position and the state in which it is placed in the fully open position in the above embodiment is included. The contrast mechanism can be moved in a state in which the loading door is placed at a position corresponding to the door open position in the above embodiment as long as it can be moved up and down independently of the lifting movement of the loading card. The treatment may be performed in a state in which the door is placed at a position corresponding to the fully open position in the above embodiment.

此外，本發明中，作為對照機構，能夠適用下述之物，即，具備：在先端部具有對照感測器之對照器；及對照移動部，將對照器的基端部或基端部鄰近予以可水平或略水平迴旋地支撐，且通過處於開狀態的框的開口部而使對照器移動至可藉由對照感測器偵測第1搬送容器(FOUP)中收容有第1搬送對象物之第1對照位置。在此情形下，例如對照移動部，係具備：作為對照感測器的迴旋中心之左右一對的迴旋軸；及使迴旋軸適當朝正逆方向同步旋轉之驅動部；及收容迴旋軸及驅動部的至少一部分或全部之機殼；將機殼做成安裝於載入埠門的適當處之構成，而能夠將對照器設定成可在第1對照位置、與不能藉由對照感測器偵測第1搬送容器中收容有第1搬送對象物的不能對照晶圓位置之間繞迴旋軸移動。又，能夠採用設計成將對照器的迴旋角度(例如以安裝於不能對照位置之對照器為基準之迴旋角度)設定為和使其從不能對照位置移動至第1對照位置時之迴旋角度相異的值，藉此通過處於開狀態的框的開口部而將對照器置放於可藉由對照感測器偵測第2搬送容器中收容有第2搬送對象物之第2對照位置之構成(第1構成)，或是設計成將對照器的迴旋角度設定為和使其從不能對照位置移動至第1對照位置時之迴旋角度相同的值，且控制載入埠門的前後方向的進退動作(前進、後退)，藉此將對照器置放於第2對照位置之構成(第2構成)。若為第1構成，則可將對照器的第2對照位置與不能對照位置設定為同一位置，而另一方面若為第2構成，則第2對照位置與不能對照位置必然地會成為相異位置。即使是這樣的對照機構，仍能在將對照器置放於第1對照位置之狀態下使載入埠門適當升降移動，藉此使對照機構全體升降而實施第1對照處理，而能在將對照器置放於第2對照位置之狀態下使載入埠門適當升降移動，藉此使對照機構全體升降而實施第2對照處理。若為這樣的構成，則上述實施形態中的對照臂或傾動機構便不需要。Further, in the present invention, as the control means, it is possible to apply a collimator having a collimator at the tip end portion and a collimator moving portion to be adjacent to the base end portion or the base end portion of the collimator The support can be supported by the opening of the frame in the open state, and the collimator can be moved to detect that the first transfer object is accommodated in the first transfer container (FOUP) by the contrast sensor. The first control position. In this case, for example, the control moving portion includes: a pair of right and left turning shafts as a center of rotation of the collimator; and a driving unit that rotates the turning shaft in the forward and reverse directions; and the rotating shaft and the driving At least a part or all of the casing of the part; the casing is configured to be mounted at a suitable position for loading the card, and the collimator can be set to be in the first control position, and cannot be detected by the contrast sensor In the first transfer container, the unconstrained wafer position in which the first transfer object is accommodated is moved around the revolving axis. Further, it is possible to adopt a design in which the swing angle of the collimator (for example, the swing angle based on the collimator attached to the uncontrollable position) is set to be different from the swing angle when moving from the uncontrollable position to the first collimated position. By setting the value of the second collimating object in the second transport container by the contrast sensor, the collimator can be placed in the opening of the frame in the open state. The first configuration) is designed to set the swing angle of the collimator to the same value as the swing angle when moving from the uncontrollable position to the first collimated position, and to control the forward and backward movements of the front and rear direction of the loading of the cardia. (Advance and retreat), whereby the comparator is placed in the second control position (second configuration). In the first configuration, the second control position and the uncontrollable position of the collimator can be set to the same position. On the other hand, if the second configuration is used, the second control position and the uncontrollable position are inevitably different. position. Even in such a comparison mechanism, the loading and unloading can be appropriately moved up and down while the collimator is placed in the first collimating position, whereby the first collating unit can be lifted and lowered, and the first collation processing can be performed. When the collimator is placed in the second control position, the loading and unloading door is appropriately moved up and down, and the second collation processing is performed by raising and lowering the entire comparison mechanism. With such a configuration, the control arm or the tilting mechanism in the above embodiment is not required.

此外，亦可藉由搬送機器人將搬送對象物(第1搬送對象物、第2搬送對象物)收容到了載入埠上的搬送容器(第1搬送容器、第2搬送容器)之後，也進行第1對照處理、第2對照處理的雙方或一方，來辨明是否為混載狀態。In addition, after the transporting object (the first transporting object and the second transporting object) is transported to the transport container (the first transport container and the second transport container) loaded on the raft, the transport robot also performs the first (1) Both the control process and the second comparison process are used to determine whether or not they are in a mixed state.

另，就座保持機構、牽引機構、門開閉機構等各機構的具體構成或驅動源亦能適當變更。Further, the specific configuration or drive source of each of the seating holding mechanism, the traction mechanism, and the door opening and closing mechanism can be appropriately changed.

作為判別藉由保持就座保持機構保持了種類相異的搬送容器(若為上述實施形態則為FOUP、框匣)的哪一者之容器判別部，亦可適用藉由是否偵測到載置平台上的搬送容器為FOUP，來判別搬送容器。It is also possible to determine whether or not the container is detected by the container discriminating unit that determines which of the transport containers (which are FOUP and frame 为 in the above embodiment) is held by the occupant holding mechanism. The transfer container on the platform is FOUP to determine the transfer container.

本發明之載入埠，如上述般可作為構成EFEM的一部分之物來使用，亦能適用於EFEM以外的搬送裝置。The loading cassette of the present invention can be used as a part constituting the EFEM as described above, and can also be applied to a conveying apparatus other than the EFEM.

此外，例如亦可作為構成篩選裝置的一部分之物來使用，該篩選裝置是在搬送室的壁面配置複數個本發明之載入埠，而可藉由配置於搬送室內的搬送機器人在載置於各載入埠的載置桌台上之搬送容器間抽換搬送對象物。Further, for example, it may be used as a part constituting a screening device in which a plurality of loading magazines of the present invention are disposed on the wall surface of the transfer chamber, and can be placed on the transport robot disposed in the transfer chamber. The object to be transported is exchanged between the transfer containers on the loading table on each of the loaded magazines.

本發明之載入埠所鄰接配置的搬送室，為在內部空間具備有搬送機器人之物。本發明中，可將對於各載入埠的載置桌台上的搬送容器(第1搬送容器、第2搬送容器)而言之搬送對象物(第1搬送對象物、第2搬送對象物)的搬出入處理，構成為以單一的搬送機器人來進行之態樣、或是構成為以複數個搬送機器人來進行之態樣的任一種。作為搬送機器人，能夠適用具有3個以上的搬送對象物把持部(若為上述實施形態則為機械手)之物。此外，作為搬送機器人，能夠適用具有1個搬送對象物把持部之物。此外，亦能適用搬送對象物把持部是由機械手以外的規定部件等所構成之搬送機器人。In the transfer chamber in which the loading cassette of the present invention is disposed adjacent to each other, the transfer robot is provided in the internal space. In the present invention, the object to be transported (the first transport object and the second transport object) can be transported to the transport container (the first transport container and the second transport container) on the loading table. The carry-in/out process is either a single transfer robot or a configuration in which a plurality of transfer robots are used. As the transport robot, it is possible to apply three or more objects to be transported (or a robot in the above embodiment). In addition, as the transport robot, it is possible to apply a thing having one transport object grasping unit. In addition, the transport target gripping unit is a transport robot including a predetermined member other than the robot.

配置於搬送室的壁面之載入埠亦可為1台。上述實施形態中，示例了載入埠的框係構成為搬送室的外壁的一部分之態樣，但框亦可為沿著搬送室的外壁而設置之物。The loading port disposed on the wall surface of the transfer chamber may also be one. In the above embodiment, the frame in which the crucible is loaded is exemplified as a part of the outer wall of the transfer chamber, but the frame may be provided along the outer wall of the transfer chamber.

上述實施形態，作為搬送對象物示例了晶圓，但搬送對象物亦可為倍縮光罩(reticle)、液晶搬送對象物、玻璃搬送對象物、培養平板(culture plate)、培養容器、碟、或培養皿等。也就是說，本發明能夠適用於將收容於半導體、液晶、細胞培養等各種領域中的容器之搬送對象予以授受之載入埠。In the above-described embodiment, the wafer is exemplified as the object to be transported, but the object to be transported may be a reticle, a liquid crystal transfer object, a glass transfer object, a culture plate, a culture container, a dish, or the like. Or petri dishes, etc. In other words, the present invention can be applied to the loading and unloading of a container to be transported in various fields such as semiconductors, liquid crystals, and cell culture.

鄰接於搬送室而設置之處理室的處理內容或數量亦能適當變更。The processing content or the number of processing chambers provided adjacent to the transfer chamber can also be appropriately changed.

上述實施形態中，示例了載入埠具備控制部，由控制部來掌控載入埠門的移動等各部的作動之態樣，但亦可構成為藉由掌控載入埠的上位裝置(若為上述實施形態則為EFEM、或是處理室)的作動之控制部(上位控制器亦即上述的EFEM全體的控制部或處理室的控制部)來一併掌控載入埠的作動。In the above embodiment, the loading unit is provided with a control unit, and the control unit controls the movement of each part such as the movement of the loading card. However, the control unit may be configured to control the loading device (if In the above embodiment, the control unit of the EFEM or the processing chamber is operated (the upper controller, that is, the control unit of the entire EFEM or the control unit of the processing chamber), and the loading operation is controlled.

此外，上述的控制部，不依賴專用的系統，而可使用通常的電腦系統來實現。例如，能夠在汎用電腦中從存儲有用來執行上述處理的程式之記錄媒體(軟碟、CD-ROM等)安裝該程式，藉此構成執行上述處理之控制部。又，用來供給該些程式之手段為任意。除能夠上述般透過規定的記錄媒體來供給外，例如亦可透過通訊線路、通訊網路、通訊系統等來供給。在此情形下，例如亦可在通訊網路的布告欄(BBS)公布該程式，而將其透過網路來疊加至載波來提供。又，能夠藉由起動像這樣被提供的程式，於OS的控制下如同其他應用程式般執行，來執行上述處理。Further, the above-described control unit can be realized by a normal computer system without depending on a dedicated system. For example, the program can be installed in a general-purpose computer from a recording medium (a floppy disk, a CD-ROM, or the like) storing a program for executing the above-described processing, thereby configuring a control unit that executes the above-described processing. Moreover, the means for supplying the programs is arbitrary. In addition to being able to be supplied through a predetermined recording medium as described above, for example, it may be supplied via a communication line, a communication network, a communication system, or the like. In this case, for example, the program can also be published on the bulletin board (BBS) of the communication network, and it is provided by superimposing it on the carrier through the network. Further, the above processing can be executed by starting a program provided as described above and executing it like another application under the control of the OS.

除此之外，有關各部分的具體構成亦不限於上述實施形態，在不脫離本發明要旨之範圍內可為各種變形。The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit and scope of the invention.

1‧‧‧載入埠1‧‧‧Loading

1C‧‧‧控制部1C‧‧‧Control Department

1Ca‧‧‧容器判別部1Ca‧‧‧ Container Discrimination Department

2‧‧‧搬送室2‧‧‧Transport room

21‧‧‧搬送機器人21‧‧‧Transfer robot

4‧‧‧框4‧‧‧ box

41‧‧‧開口部41‧‧‧ openings

3‧‧‧FOUP3‧‧‧FOUP

32‧‧‧FOUP門32‧‧‧FOUP door

34‧‧‧狹槽34‧‧‧ slot

5‧‧‧載置桌台5‧‧‧Place the table

6‧‧‧就座保持機構6‧‧‧Seat holding mechanism

7‧‧‧牽引機構7‧‧‧ traction mechanism

8‧‧‧載入埠門8‧‧‧Loading tips

9‧‧‧門開閉機構9‧‧‧door opening and closing mechanism

C‧‧‧第2搬送容器(框匣)C‧‧‧Second transport container (box 匣)

F‧‧‧第2搬送對象物(環狀框)F‧‧‧Second transport object (ring frame)

M‧‧‧對照機構M‧‧‧Comparative institutions

M1‧‧‧對照感測器M1‧‧‧ contrast sensor

M2‧‧‧對照器M2‧‧‧Control

M3‧‧‧對照移動部(對照臂)M3‧‧‧Comparative Moving Department (Control Arm)

W‧‧‧第1搬送對象物(晶圓)W‧‧‧First transport object (wafer)

[圖1]揭示具備了本發明一實施形態之載入埠的EFEM及其周邊裝置的相對位置關係之模型化示意側面圖。　　[圖2]將圖1所示相對位置關係簡化後的平面圖。　　[圖3]同實施形態之載入埠的立體圖。　　[圖4]同實施形態之載入埠一部分省略示意正面圖。　　[圖5]在載置桌台上載置有框匣且載入埠門處於門開放位置之狀態的同實施形態之載入埠的側面圖。　　[圖6]對應於圖5而示意將對照器置放至第1對照位置的狀態之圖。　　[圖7]同實施形態中的搬送對象物的平面圖。　　[圖8]對於收容在FOUP內的狹槽的第1搬送對象物之對照機構的對照處理動作模型化示意圖。　　[圖9]對於收容在第2搬送容器內的狹槽的第2搬送對象物之對照機構的對照處理動作模型化示意圖。　　[圖10]本實施形態中的載入埠的動作手續示意流程圖。　　[圖11]本實施形態中的第1對照處理及第2對照處理之偵測狀況及對照結果示意圖表。Fig. 1 is a schematic plan side view showing a relative positional relationship between an EFEM and a peripheral device including a loading cassette according to an embodiment of the present invention. Fig. 2 is a plan view showing a simplified relative positional relationship shown in Fig. 1. Fig. 3 is a perspective view of the loading cassette of the same embodiment. [Fig. 4] A front view of a part of the same embodiment is omitted. Fig. 5 is a side view showing a loading cassette of the same embodiment in a state in which a frame is placed on a mounting table and a door is placed in a door open position. Fig. 6 is a view corresponding to Fig. 5 showing a state in which a comparator is placed at a first comparison position. Fig. 7 is a plan view of the object to be transported in the same embodiment. FIG. 8 is a schematic diagram showing a comparison processing operation of a collation mechanism of a first transport object accommodated in a slot in the FOUP. FIG. FIG. 9 is a schematic diagram showing a control processing operation of a collation mechanism of a second transfer object accommodated in a slit in the second transfer container. Fig. 10 is a flow chart showing the operation procedure of the loading cassette in the present embodiment. Fig. 11 is a schematic diagram showing the detection conditions and the comparison results of the first comparison processing and the second comparison processing in the present embodiment.

Claims

一種載入埠，係和在內部具備了搬送機器人之搬送室共同構成EFEM之載入埠，其特徵為，具備：　　平板狀的框，以站立姿勢併設於前述搬送室且具有可供第1搬送對象物以略水平姿勢通過之開口部；及　　載置桌台，可載置第1搬送容器即FOUP，該第1搬送容器具有可將複數個前述第1搬送對象物多段狀地收容之狹槽(slot)；及　　載入埠門，可和前述FOUP所具有之FOUP門卡合，且可將前述框的前述開口部開閉；及　　就座保持機構，將從外部被搬送來的前述FOUP保持於前述載置桌台上；及　　門開閉機構，令前述載入埠門移動至朝前述搬送室側後退之門開放位置，藉此將前述框的前述開口部設為開狀態；及　　牽引機構，在相對於前述框而言以朝前方突出之姿勢配置之前述載置桌台上，令前述FOUP在就座位置與搬送對象物授受位置之間朝前後方向移動；及　　對照機構，於藉由前述門開閉機構將前述開口部設為了開狀態之狀態下，對照有關包括位於前述搬送對象物授受位置的前述FOUP內的前述各狹槽中的前述第1搬送對象物的有無之狀態之資訊；及　　控制部，掌控前述就座保持機構、前述牽引機構、前述門開閉機構、及前述對照機構的動作；　　前述對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐前述對照器且通過處於開狀態之前述開口部令前述對照器移動至可藉由前述對照感測器偵測前述FOUP中收容有前述第1搬送對象物之第1對照位置，　　前述載置桌台，可載置第2搬送容器，該第2搬送容器係可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽，　　前述控制部，可執行：就座保持處理，藉由前述就座保持機構，把可將和前述第1搬送對象物平面尺寸相異的第2搬送對象物收容於多段式狹槽之第2搬送容器或前述FOUP保持於前述載置桌台上；及後方牽引處理，藉由前述牽引機構令前述載置桌台上的前述第2搬送容器或FOUP從前述就座位置移動至前述搬送對象物授受位置；及門開放處理，藉由前述門開閉機構將前述開口部設為開狀態；及第1對照處理，通過處於開狀態之前述開口部將前述對照器置放於前述第1對照位置而令其執行前述對照機構所做之對照處理；及第2對照處理，通過處於開狀態之前述開口部將前述對照器置放於可藉由前述對照感測器偵測前述第2搬送容器中收容有前述第2搬送對象物之第2對照位置而令其執行前述對照機構所做之對照處理；係選擇性地執行前述第1對照處理及前述第2對照處理的其中一方或雙方。A loading cassette that is configured to form an EFEM in combination with a transfer chamber in which a transfer robot is provided, and is characterized in that: a flat frame is provided in a standing position and is provided in the transfer chamber and has a first transportable position The opening portion through which the object passes in a slightly horizontal posture; and the mounting table, the FOUP of the first transfer container, which has a slot in which a plurality of the first transfer objects can be accommodated in a plurality of stages (slot); and loading the door, and engaging with the FOUP door of the FOUP, and opening and closing the opening of the frame; and the seating holding mechanism, holding the FOUP conveyed from the outside And the door opening and closing mechanism, wherein the loading and unloading mechanism moves the door to the door opening position that is retracted toward the transfer chamber side, thereby opening the opening of the frame; and the traction mechanism The FOP is placed in the front-rear direction between the seating position and the conveyance object receiving position on the mounting table disposed in a posture that protrudes forwardly with respect to the frame; and In the state in which the opening is in the open state, the control unit is configured to control the first transfer object in each of the slots included in the FOUP located at the transfer target receiving position. And a control unit that controls the actions of the seat-holding mechanism, the traction mechanism, the door opening and closing mechanism, and the control mechanism; the control mechanism has a comparator and has a contrast sensing at the tip end And the control moving portion, supporting the collimator and moving the collimator through the opening portion in an open state to detect that the first transport object is accommodated in the FOUP by the collating sensor In the second position, the second transfer container can accommodate the second transfer target having the same size as the first transfer target in the multi-stage slot, and the second transport container can be placed in the multi-stage slot. The control unit can execute the seating holding process, and the first holding object can be transported by the seating holding mechanism The second transfer object having a different surface size is accommodated in the second transfer container of the multi-segment slot or the FOUP is held on the mounting table; and the rear traction process is performed by the traction mechanism to mount the table The second transfer container or the FOUP moves from the seating position to the transfer target receiving position; and the door opening process is performed by the door opening and closing mechanism, wherein the opening is in an open state; and the first comparison process is The opening portion of the open state places the collimator at the first control position and performs a matching process by the collimating mechanism; and the second collation processing, the collimator is placed by the opening portion in an open state A second control position in which the second transfer object is accommodated in the second transfer container is detected by the collating sensor, and the collimation processing performed by the collimating mechanism is performed; and the aforementioned One or both of the first control treatment and the second control treatment.

如申請專利範圍第1項所述之載入埠，其中，前述第1對照位置，為前述對照感測器被配置於比前述框當中面向前述搬送室之後壁面還前方之位置，　　前述第2對照位置，為前述對照感測器被配置於比前述框的前述後壁面還後方之位置。The loader according to the first aspect of the invention, wherein the first control position is such that the contrast sensor is disposed further forward than a wall surface facing the transfer chamber in the frame, and the second control is The position is such that the aforementioned contrast sensor is disposed at a position rearward of the rear wall surface of the frame.

如申請專利範圍第1或2項所述之載入埠，其中，前述控制部，具有：容器判別部，判別藉由前述就座保持機構保持了前述FOUP或前述第2搬送容器的哪一者。The loading unit according to claim 1 or 2, wherein the control unit includes a container determining unit that determines which of the FOUP or the second transfer container is held by the seating holding mechanism. .

如申請專利範圍第3項所述之載入埠，其中，前述控制部，當前述容器判別部判斷出藉由前述就座保持機構保持了前述第2搬送容器的情形下，依序執行前述就座保持處理、前述門開放處理、前述後方牽引處理之後，執行前述第1對照處理及前述第2對照處理的雙方。The loading unit according to the third aspect of the invention, wherein the control unit determines that the second transport container is held by the seating holding mechanism when the container determining unit determines that the second transport container is held by the seating holding mechanism. After the seat holding process, the door opening process, and the rear pull process, both the first comparison process and the second comparison process are performed.

一種載入埠中的對照處理方法，係具備了對照機構之載入埠中的對照處理方法，該對照機構是被用於用來在可將複數片的第1搬送對象物存儲於多段式狹槽之第1搬送容器與搬送室之間授受前述第1搬送對象物，而對照有關包括前述第1搬送容器的各狹槽中的第1搬送對象物的有無之狀態之資訊，　　前述載入埠，構成為可與第2搬送容器之間授受前述第2搬送對象，該第2搬送容器係可將和第1搬送對象物平面尺寸相異的第2搬送對象物存儲複數個於多段式狹槽，　　前述對照機構，係具備：對照器，在先端部具有對照感測器；及對照移動部，支撐前述對照器且令前述對照器移動至可藉由前述對照感測器偵測前述第1搬送容器中收容有前述第1搬送對象物之第1對照位置，　　選擇性地執行：第1對照處理，將前述對照器置放於前述第1對照位置而令其執行前述對照機構所做之對照處理；及第2對照處理，將前述對照器置放於可藉由對照感測器偵測前述第2搬送容器中收容有前述第2搬送對象物之第2對照位置而執行對照處理；的其中一方或雙方。A control processing method for loading a magazine is provided with a matching processing method in a loading mechanism of a comparison mechanism, and the comparison mechanism is used to store a plurality of first transport objects in a multi-segment narrow The first transfer object is transferred between the first transfer container and the transfer chamber, and the information on the presence or absence of the first transfer target in each slot including the first transfer container is loaded. In the second transfer container, the second transfer container can store a plurality of second transfer objects different in size from the first transfer target in the multi-segment slot. The control mechanism includes: a contrast device having a contrast sensor at the tip end; and a control moving portion supporting the collator and moving the collimator to detect the first transport by the collating sensor The first control position of the first transport object is accommodated in the container, and the first collation is selectively performed, and the collimator is placed in the first control position to execute the pair And a second control process, wherein the collimator is placed in the second control position in the second transfer container in which the second transfer object is stored by the contrast sensor; One or both of the treatments;

如申請專利範圍第5項所述之對照處理方法，其中，前述第1搬送對象物及前述第2搬送對象物，是以在前述第1搬送容器或前述第2搬送容器內中心位置一致之方式被收容，而被做前述對照處理。The control method according to the fifth aspect of the invention, wherein the first transfer object and the second transfer target are in a position in which the center position of the first transfer container or the second transfer container is the same It is contained and is treated as the aforementioned comparison.