TWI777427B - 連接器 - Google Patents

連接器 Download PDF

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Publication number
TWI777427B
TWI777427B TW110106572A TW110106572A TWI777427B TW I777427 B TWI777427 B TW I777427B TW 110106572 A TW110106572 A TW 110106572A TW 110106572 A TW110106572 A TW 110106572A TW I777427 B TWI777427 B TW I777427B
Authority
TW
Taiwan
Prior art keywords
conductive
elastic conductive
connector
elastic
insulating
Prior art date
Application number
TW110106572A
Other languages
English (en)
Chinese (zh)
Other versions
TW202133500A (zh
Inventor
鄭永倍
樸晶默
金賢永
金俊用
鄭友鎔
李埈湖
金岡德
樸勇奎
Original Assignee
南韓商Isc股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商Isc股份有限公司 filed Critical 南韓商Isc股份有限公司
Publication of TW202133500A publication Critical patent/TW202133500A/zh
Application granted granted Critical
Publication of TWI777427B publication Critical patent/TWI777427B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Surgical Instruments (AREA)
TW110106572A 2020-02-26 2021-02-24 連接器 TWI777427B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20200023896 2020-02-26
KR10-2020-0023896 2020-02-26
KR10-2020-0051420 2020-04-28
KR1020200051420A KR102346779B1 (ko) 2020-02-26 2020-04-28 전기접속용 커넥터

Publications (2)

Publication Number Publication Date
TW202133500A TW202133500A (zh) 2021-09-01
TWI777427B true TWI777427B (zh) 2022-09-11

Family

ID=77785146

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110106572A TWI777427B (zh) 2020-02-26 2021-02-24 連接器

Country Status (2)

Country Link
KR (1) KR102346779B1 (ko)
TW (1) TWI777427B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230139575A (ko) * 2022-03-28 2023-10-05 주식회사 아이에스시 검사용 커넥터

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110085788A (ko) * 2010-01-21 2011-07-27 이재학 테스트 소켓 및 그 테스트 소켓의 제조방법
KR20150008264A (ko) * 2013-07-11 2015-01-22 (주)이니큐브 반도체 테스트 장치의 컨택터
KR101526536B1 (ko) * 2013-12-27 2015-06-10 주식회사 아이에스시 전도성 탄성부재, 전도성 탄성부재의 제조방법 및 전기적 검사소켓
TWM505728U (zh) * 2014-10-07 2015-07-21 Advanced Connetek Inc 連接器結構
TWI584531B (zh) * 2014-04-23 2017-05-21 第一精工股份有限公司 電連接器
CN207116749U (zh) * 2017-07-05 2018-03-16 泰科电子(上海)有限公司 连接器
KR101930866B1 (ko) * 2018-08-08 2018-12-20 황동원 반도체 디바이스 테스트용 콘택트 및 소켓장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090077991A (ko) 2008-01-14 2009-07-17 (주)마이크로컨텍솔루션 전도성 러버 핀을 이용한 소켓
KR102063761B1 (ko) 2018-10-19 2020-01-08 (주)티에스이 신호 전송 커넥터 및 그 제조방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110085788A (ko) * 2010-01-21 2011-07-27 이재학 테스트 소켓 및 그 테스트 소켓의 제조방법
KR20150008264A (ko) * 2013-07-11 2015-01-22 (주)이니큐브 반도체 테스트 장치의 컨택터
KR101526536B1 (ko) * 2013-12-27 2015-06-10 주식회사 아이에스시 전도성 탄성부재, 전도성 탄성부재의 제조방법 및 전기적 검사소켓
TWI584531B (zh) * 2014-04-23 2017-05-21 第一精工股份有限公司 電連接器
TWM505728U (zh) * 2014-10-07 2015-07-21 Advanced Connetek Inc 連接器結構
CN207116749U (zh) * 2017-07-05 2018-03-16 泰科电子(上海)有限公司 连接器
KR101930866B1 (ko) * 2018-08-08 2018-12-20 황동원 반도체 디바이스 테스트용 콘택트 및 소켓장치

Also Published As

Publication number Publication date
KR102346779B1 (ko) 2022-01-05
TW202133500A (zh) 2021-09-01
KR20210108852A (ko) 2021-09-03

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