TWI774012B

TWI774012B - Vapor chamber

Info

Publication number: TWI774012B
Application number: TW109121379A
Authority: TW
Inventors: 王清汗
Original assignee: 煌傑金屬複合材料科技股份有限公司
Priority date: 2020-06-23
Filing date: 2020-06-23
Publication date: 2022-08-11
Also published as: TW202200957A

Abstract

本發明提出一種均溫板，基本上包括：下殼體、上殼體以及工作流體，本發明使用金屬複合板製作下殼體和上殼體，下殼體和上殼體互相密合連接形成真空且密封的腔體，工作流體則填充入所述的腔體，其中金屬複合板的結構包含一金屬基材以及複合於金屬基材的至少一側表面的銅金屬層，所述的金屬基材包括：不鏽鋼以及鋁基碳化矽金屬基複合材料(Al/SiC)其中的任一種；本發明使用金屬複合板製作均溫板的腔體，金屬複合板的銅金屬層可以通過衝壓工序形成多個分布於腔體內的支撐構件，不需要採用複雜、具污染性及高成本的蝕刻工藝，能夠提高生產效率並降低成本，而且金屬複合板的金屬基材能夠提供足夠的結構強度。 The invention proposes a temperature equalizing plate, which basically includes: a lower shell, an upper shell and a working fluid. The invention uses a metal composite plate to make the lower shell and the upper shell, and the lower shell and the upper shell are tightly connected to each other to form A vacuum and sealed cavity, the working fluid is filled into the cavity, wherein the structure of the metal composite plate includes a metal base material and a copper metal layer compounded on at least one surface of the metal base material, the metal base The material includes: any one of stainless steel and aluminum-based silicon carbide metal matrix composite material (Al/SiC). Each support member distributed in the cavity does not need to adopt a complicated, polluting and high-cost etching process, which can improve production efficiency and reduce costs, and the metal base material of the metal composite plate can provide sufficient structural strength.

Description

均溫板 Vapor chamber

本發明涉及一種導熱裝置，特別是一種均溫板。 The invention relates to a heat conduction device, in particular to a temperature equalizing plate.

由於電子技術的進步以及半導體元件不斷朝向高性能、高功率以及輕薄化的方向發展，各種電子裝置例如行動通訊裝置(俗稱智慧型手機)、平板電腦和筆記型電腦的散熱問題愈顯重要，特別是高功率高發熱的微處理器或晶片容易因為高熱而受到損壞，傳統使用風扇和鋁擠型散熱鰭片的散熱裝置已無法提供足夠的散熱能力。 Due to the advancement of electronic technology and the continuous development of semiconductor components in the direction of high performance, high power and thinness, the heat dissipation problem of various electronic devices such as mobile communication devices (commonly known as smart phones), tablet computers and notebook computers has become more and more important, especially High-power and high-heat-generating microprocessors or chips are easily damaged due to high heat. Traditional heat dissipation devices using fans and aluminum extruded heat dissipation fins can no longer provide sufficient heat dissipation capacity.

2002年，Y.Avenas等人提出以平板式熱管作為均溫板(Vapor chamber)，均溫板是一種能將點熱源的熱量傳遞至大面積部件進行散熱的裝置，均溫板的功能及工作原理與熱導管(heat pipe)相同，只是熱傳導方式不同進而具備均溫的特性，利用封閉於板狀腔體內的工作流體的相變化及流動傳熱，將熱能擴散至冷凝端散發熱量，並以毛細結構將內部工作流體導回至熱源處，進而實現快速熱傳導及熱擴散。 In 2002, Y. Avenas et al. proposed to use a flat-plate heat pipe as a vapor chamber. The vapor chamber is a device that can transfer heat from a point heat source to large-area components for heat dissipation. The function and work of the vapor chamber The principle is the same as that of a heat pipe, except that the heat conduction method is different and has the characteristics of uniform temperature. Using the phase change and flow heat transfer of the working fluid enclosed in the plate-shaped cavity, the heat energy is diffused to the condensing end to dissipate heat. The capillary structure guides the internal working fluid back to the heat source, thereby achieving rapid heat conduction and heat diffusion.

均溫板的構造基本上包括：毛細結構、容器及工作流體三個部份。已知的均溫板多使用銅板、鋁板或不鏽鋼板製作其外殼，例如已公布的中國實用新型專利授權公告號CN202354019U的”鋁均溫板”。以銅板製作的均溫板為例，傳統均溫板的製造方法基本上先將銅板沖壓成型為預定尺寸，並製作上、下蓋之微結構，已知形成微結構的技術包括：機械加工(如CNC加工)、噴砂、冷熔射噴覆和噴銲，再將上、下蓋接合(例如使用擴散接合)製成具有中空腔體的容器，在容器預留注水口甚至在注水口銲接細銅管以供後面抽真空及填充工作流體(通常為純水)使用，待工作流體填充至之預計水量即以壓力剪封閉注水用的細銅管，確認充填水量，再以熔銲方式封口確保容器內之腔體的真空度，均溫板即製造完成。 The structure of the vapor chamber basically includes three parts: capillary structure, container and working fluid. Known vapor chambers mostly use copper plates, aluminum plates or stainless steel plates to make their shells, such as the "aluminum vapor chamber" of the published China Utility Model Patent Authorization Announcement No. CN202354019U. Taking the temperature chamber made of copper plate as an example, the traditional manufacturing method of the temperature chamber basically first punches the copper plate into a predetermined size, and manufactures the microstructures of the upper and lower covers. Known techniques for forming microstructures include: (such as CNC machining), sandblasting, cold melt spray coating and spray welding, and then join the upper and lower lids (for example, using diffusion bonding) to make a container with a hollow cavity, and reserve a water injection port in the container or even at the water injection port. Weld the thin copper tube for later vacuuming and filling with the working fluid (usually pure water). After the working fluid is filled to the estimated water volume, the thin copper tube for water injection is closed with pressure shears, and the filling water volume is confirmed, and then the welding method is used. The sealing ensures the vacuum degree of the cavity in the container, and the uniform temperature plate is manufactured.

由於電子產品的輕薄化、高性能化和高功率化的趨勢，均溫板也相應需要輕薄化，傳統使用銅板或鋁板製作的均溫板，使用薄的銅板或鋁板製作均熱板的外殼(或稱上、下蓋)並形成腔體，很容易因外力而彎曲變形；另一方面需要在腔體的內側製作適當的支撐結構，避免腔體在抽真空的製程中產生塌陷或損壞，傳統在銅板或鋁板製作支撐結構除了可以利用機械加工之外，針對極薄的薄型均溫板，例如已公開的中國發明專利申請公布號CN 106376214A的”薄型均溫板”，提出使用蝕刻製程在腔體的內側製作支撐結構或其他微結構。然而前述已知用於製作毛細結構或是支撐結構的噴砂、冷熔射噴覆、噴銲和蝕刻等多種方法的製程較多且複雜，除了增加製造成本也容易造成污染。 Due to the trend of thinning, high performance and high power of electronic products, the vapor chamber also needs to be thinner and lighter. Traditionally, the vapor chamber is made of copper or aluminum plates, and the shell of the vapor chamber is made of thin copper or aluminum plates ( or upper and lower covers) and form a cavity, which is easy to bend and deform due to external force; on the other hand, it is necessary to make an appropriate support structure on the inside of the cavity to avoid collapse or damage to the cavity during the vacuuming process. Traditional In addition to machining the copper plate or aluminum plate to make the support structure, for extremely thin thin vapor chambers, such as the "thin vapor chamber" of the published Chinese invention patent application publication number CN 106376214A, it is proposed to use an etching process in the cavity Support structures or other microstructures are made on the inside of the body. However, the above-mentioned known methods such as sandblasting, cold spray coating, spray welding and etching for fabricating capillary structures or support structures have many and complicated processes, which not only increase the manufacturing cost but also easily cause pollution.

在已核准的臺灣發明專利(專利證書號TW I625503B)的”散熱裝置及其製造方法”，其中提出了一種主要使用鈦金屬板體製作的均溫板，用以減少均溫溫板的重量。雖然鈦金屬具具高強度和質輕的特性，但是鈦金屬的成本較高且不易加工。 In the approved Taiwan Invention Patent (Patent Certificate No. TW I625503B), "Heat Dissipation Device and Its Manufacturing Method", a vapor chamber mainly made of titanium metal plate is proposed to reduce the weight of the vapor chamber. Although titanium has high strength and light weight, it is expensive and difficult to machine.

本發明所要解決的技術問題在於提供一種均溫板。 The technical problem to be solved by the present invention is to provide a vapor chamber.

基於解決現有技術使用蝕刻工藝及上述的其他問題，本發明提出的均溫板的一種實施例構造包括： Based on solving the problems of the prior art using the etching process and other problems mentioned above, the present invention One example configuration of the proposed vapor chamber includes:

一下殼體，是由一金屬複合板製成，下殼體具有分別位於相對兩側的一第一表面和一第二表面，金屬複合板的結構包含一金屬基材以及複合於所述的金屬基材的一側表面的一銅金屬層，第一表面至少具有一平直面用以和熱源接觸，下殼體的邊緣向外延伸有一下半管部，下半管部具有從第二表面朝向第一表面的方向凹陷的一第一溝槽； The lower shell is made of a metal composite plate. The lower shell has a first surface and a second surface respectively located on opposite sides. The structure of the metal composite plate includes a metal base material and a metal composite plate. A copper metal layer on one side surface of the base material, the first surface at least has a flat surface for contacting with the heat source, the edge of the lower shell extends outward with a lower half pipe portion, and the lower half pipe portion has a direction from the second surface to the first half pipe. A first groove recessed in the direction of a surface;

一上殼體，使用所述的金屬複合板製成，上殼體具有分別位於相對兩側的一第三表面和一第四表面，上殼體的邊緣向外延伸有一上半管部，上半管部的位置與下半管部對應，上半管部具有從第三表面朝向第四表面的方向凹陷的一第二溝槽，下殼體的第二表面的週邊與上殼體的第三表面的週邊密合連接，在下殼體和上殼體之間形成中空的一腔體，下半管部和上半管部的兩側邊緣互相密合連接共同構成與腔體的內部連通的一金屬管，腔體內抽真空後切除多餘的金屬管並將金屬管的管口封閉以形成真空且密封的腔體； an upper shell, made of the metal composite plate, the upper shell has a third surface and a fourth surface respectively located on opposite sides, an upper half pipe portion extends outward from the edge of the upper shell, and the upper shell The position of the half-pipe portion corresponds to the lower half-pipe portion, the upper half-pipe portion has a second groove recessed from the third surface toward the fourth surface, and the periphery of the second surface of the lower casing is connected to the first groove of the upper casing. The peripheries of the three surfaces are tightly connected to form a hollow cavity between the lower shell and the upper shell, and the two side edges of the lower half-pipe and the upper half-pipe are closely connected to each other to form a cavity that communicates with the interior of the cavity. A metal tube, after the cavity is evacuated, the excess metal tube is cut off and the mouth of the metal tube is closed to form a vacuum and sealed cavity;

一支撐構件，配置於腔體之中，支撐構件介於第二表面和第三表面之間用以支撐起真空且密封的腔體；以及 a support member disposed in the cavity, the support member is interposed between the second surface and the third surface for supporting the vacuum and sealed cavity; and

一工作流體，填充於真空且密封的腔體之內。 A working fluid is filled in the vacuum and sealed cavity.

其中均溫板的厚度為1~6mm，金屬複合板的金屬基材包括：不鏽鋼和鋁基碳化矽金屬基複合材料其中的任一種，金屬複合板的厚度為0.05~3.0mm，其中金屬複合板的銅金屬層的厚度是金屬複合板的厚度的5%~50%。 The thickness of the temperature equalizing plate is 1~6mm, the metal base material of the metal composite plate includes: any one of stainless steel and aluminum-based silicon carbide metal matrix composite material, the thickness of the metal composite plate is 0.05~3.0mm, and the metal composite plate has a thickness of 0.05~3.0mm. The thickness of the copper metal layer is 5%~50% of the thickness of the metal composite plate.

其中金屬基材作為下殼體的第一表面以及上殼體的第四表面，銅金屬層作為下殼體的第二表面以及上殼體的第三表面，支撐構件是通過衝壓工藝形成的多個突起物，該些突起物形成於第二表面和第三表面其中的任一者或全部，突起物是錐形體，任二個相鄰的該突起物的底端之間具有一間距，該突起物的最大寬度和該間距的比例為1：1~1：0.5。 The metal base material is used as the first surface of the lower casing and the fourth surface of the upper casing surface, the copper metal layer is used as the second surface of the lower case and the third surface of the upper case, the support member is a plurality of protrusions formed by a stamping process, and the protrusions are formed in the second surface and the third surface. In any one or all of the protrusions, the protrusions are tapered, and there is a distance between the bottom ends of any two adjacent protrusions, and the ratio of the maximum width of the protrusions to the spacing is 1:1 to 1:0.5.

其中形成於第二表面的突起物的末端係抵頂於第三表面，突起物的末端具有一帽頭。 The end of the protrusion formed on the second surface is pressed against the third surface, and the end of the protrusion has a cap.

其中形成於第三表面的突起物的末端係抵頂該第二表面，突起物的末端具有一帽頭。 The end of the protrusion formed on the third surface is pressed against the second surface, and the end of the protrusion has a cap.

其中形成於第二表面以及形成於第三表面的突起物的末端互相抵頂。 The ends of the protrusions formed on the second surface and the third surface abut against each other.

作為本發明均溫板的優選構造，其中金屬基材作為下殼體的第一表面以及上殼體的第四表面，銅金屬層作為下殼體的第二表面以及上殼體的第三表面，所述的支撐構件是銅金屬網，銅金屬網附著於腔體的內側表面。 As a preferred structure of the vapor chamber of the present invention, the metal substrate is used as the first surface of the lower case and the fourth surface of the upper case, and the copper metal layer is used as the second surface of the lower case and the third surface of the upper case. , the support member is a copper metal mesh, and the copper metal mesh is attached to the inner surface of the cavity.

作為本發明均溫板的優選構造，其中銅金屬層作為下殼體的第一表面以及上殼體的第四表面，金屬基材作為下殼體的第二表面以及上殼體的第三表面，所述的支撐構件是銅金屬網，銅金屬網附著於腔體的內側表面。 As a preferred structure of the vapor chamber of the present invention, the copper metal layer is used as the first surface of the lower case and the fourth surface of the upper case, and the metal base material is used as the second surface of the lower case and the third surface of the upper case , the support member is a copper metal mesh, and the copper metal mesh is attached to the inner surface of the cavity.

作為本發明均溫板的優選構造，其中下殼體是平直的板狀，上殼體具有從第三表面朝向第四表面的方向凹陷的一第二凹陷部，第二凹陷部和下殼體共同構成所述的腔體，所述的週邊圍繞在第二凹陷部的周圍。 As a preferred configuration of the vapor chamber of the present invention, the lower case is in a flat plate shape, the upper case has a second recessed portion recessed from the third surface toward the fourth surface, the second recessed portion and the lower case The bodies together form the cavity, and the periphery surrounds the second recess.

作為本發明均溫板的優選構造，其中上殼體是平直的板狀，下殼體具有從第二表面朝向第一表面的方向凹陷的一第一凹陷部，第一凹陷部和上殼體共同構成所述的腔體，所述的週邊圍繞在第一凹陷部的周圍。 As the preferred structure of the vapor chamber of the present invention, wherein the upper casing is in a flat plate shape, The lower casing has a first concave portion recessed from the second surface toward the first surface, the first concave portion and the upper casing together form the cavity, and the periphery surrounds the first concave portion .

作為本發明均溫板的優選構造，其中下殼體具有從第二表面朝向第一表面的方向凹陷的一第一凹陷部，所述的週邊圍繞在第一凹陷部的周圍；上殼體具有從第三表面朝向第四表面的方向凹陷的一第二凹陷部，所述的週邊圍繞在第二凹陷部的周圍，第一凹陷部和第二凹陷部共同構成所述的腔體。 As a preferred configuration of the vapor chamber of the present invention, the lower casing has a first concave portion recessed from the second surface toward the first surface, and the periphery surrounds the first concave portion; the upper casing has A second recessed portion is recessed from the third surface toward the fourth surface, the periphery surrounds the second recessed portion, and the first recessed portion and the second recessed portion together constitute the cavity.

本發明提出的均溫板的另一種實施例構造包含： Another embodiment structure of the vapor chamber proposed by the present invention includes:

一下殼體，是由一金屬複合板製成，所述的金屬複合板的結構包含一金屬基材以及複合於所述的金屬基材的相對兩側表面的一第一銅金屬層和一第二銅金屬層，金屬基材介於第一銅金屬層和第二銅金屬層之間，下殼體具有分別位於相對兩側的一第一表面和一第二表面，第一銅金屬層作為第一表面，第二銅金屬層作為第二表面，第一表面至少具有一平直面用以和熱源接觸，下殼體的邊緣向外延伸有一下半管部，下半管部具有從第二表面朝向第一表面的方向凹陷的一第一溝槽； The lower shell is made of a metal composite plate. The structure of the metal composite plate includes a metal base material and a first copper metal layer and a first copper metal layer compounded on the opposite side surfaces of the metal base material. Two copper metal layers, the metal base material is interposed between the first copper metal layer and the second copper metal layer, the lower case has a first surface and a second surface respectively located on opposite sides, and the first copper metal layer serves as a The first surface, the second copper metal layer is used as the second surface, the first surface at least has a flat surface for contacting with the heat source, the edge of the lower shell extends outwardly with a lower half-pipe portion, and the lower half-pipe portion has a surface extending from the second surface. a first groove recessed toward the direction of the first surface;

一上殼體，使用所述的金屬複合板製成，上殼體具有分別位於相對兩側的一第三表面和一第四表面，第一銅金屬層作為第三表面，第二銅金屬層作為第四表面，上殼體的邊緣向外延伸有一上半管部，上半管部的位置與下半管部對應，上半管部具有從第三表面朝向第四表面的方向凹陷的一第二溝槽，下殼體的第二表面的週邊與上殼體的第三表面的週邊密合連接，在下殼體和上殼體之間形成中空的一腔體，下半管部和上半管部的兩側邊緣互相密合連接共同構成與腔體的內部連通的一金屬管，腔體內抽真空後切除多餘的金屬管並將所述的金屬管的管口封閉以形成真空且密封的腔體； an upper casing, made of the metal composite plate, the upper casing has a third surface and a fourth surface respectively located on opposite sides, the first copper metal layer is used as the third surface, and the second copper metal layer is used as the third surface. As the fourth surface, an upper half-pipe portion extends outward from the edge of the upper casing, the position of the upper half-pipe portion corresponds to the lower half-pipe portion, and the upper half-pipe portion has a recessed portion from the third surface toward the fourth surface. The second groove, the periphery of the second surface of the lower case is tightly connected with the periphery of the third surface of the upper case, and a hollow cavity is formed between the lower case and the upper case, and the lower half pipe and the upper case are in close contact with each other. The two sides of the half-pipe are closely connected to each other to form a metal pipe that communicates with the interior of the cavity. After vacuuming the inside, cut off the redundant metal tube and seal the mouth of the metal tube to form a vacuum and sealed cavity;

均溫板的厚度為1~6mm，其中金屬複合板的金屬基材包括：不鏽鋼和鋁基碳化矽金屬基複合材料其中的任一種，金屬複合板的厚度為0.05~3.0mm，金屬複合板的第一銅金屬層和第二銅金屬層的厚度相同，其中金屬複合板的第一銅金屬層和第二銅金屬層的總厚度是金屬複合板的厚度的5%~50%。 The thickness of the temperature equalizing plate is 1~6mm, and the metal base material of the metal composite plate includes: any one of stainless steel and aluminum-based silicon carbide metal matrix composite material, the thickness of the metal composite plate is 0.05~3.0mm, and the thickness of the metal composite plate is 0.05~3.0mm. The thicknesses of the first copper metal layer and the second copper metal layer are the same, wherein the total thickness of the first copper metal layer and the second copper metal layer of the metal composite plate is 5%-50% of the thickness of the metal composite plate.

作為本發明提出的均溫板的另一種實施例的優選構造，所述的支撐構件是銅金屬網，所述的銅金屬網附著於腔體的內側表面。 As a preferred configuration of another embodiment of the vapor chamber provided by the present invention, the support member is a copper metal mesh, and the copper metal mesh is attached to the inner surface of the cavity.

本發明均溫板的優點及功效在於，本發明使用金屬複合板製作均溫板的腔體，金屬複合板的銅金屬層可以通過衝壓工序形成的多個支撐構件，不需要採用複雜、具污染性及高成本的蝕刻工藝，金屬複合板的金屬基材能夠提供足夠的結構強度。本發明均溫板可以保證均溫板的結構強度，又能提高生產效率並降低成本，提升產品競爭力。 The advantages and effects of the vapor chamber of the present invention lie in that the present invention uses the metal composite plate to make the chamber of the vapor chamber, and the copper metal layer of the metal composite plate can be formed by a plurality of supporting members through the stamping process, and does not need to use complex, polluting The metal substrate of the metal clad plate can provide sufficient structural strength due to the flexible and high-cost etching process. The temperature-spreading plate of the invention can ensure the structural strength of the temperature-spreading plate, can improve production efficiency, reduce costs, and enhance product competitiveness.

10:下殼體 10: Lower shell

11:第一表面 11: The first surface

12:第二表面 12: Second surface

13:下半管部 13: Lower half pipe

131:第一溝槽 131: First groove

20:上殼體 20: Upper shell

21:第三表面 21: Third Surface

22:第四表面 22: Fourth surface

23:上半管部 23: Upper half pipe

231:第二溝槽 231: Second groove

30:突出部 30: Protrusion

31:帽頭 31: cap head

40:金屬網 40: Metal mesh

50:金屬管 50: Metal tube

60:工作流體 60: Working fluid

B:週邊 B: Around

C:腔體 C: cavity

D:間距 D: Spacing

W:寬度 W: width

M:中間層 M: middle layer

第1圖是本發明均溫板的一種實施例的分解構造示意圖。 FIG. 1 is a schematic diagram of an exploded structure of an embodiment of the vapor chamber of the present invention.

第2圖是第1圖之實施例的部分構造圖，繪示其中下殼體的正面構造示意圖。 FIG. 2 is a partial structural view of the embodiment of FIG. 1 , showing a schematic front view of the lower casing.

第3-1圖是本發明均溫板的下殼體、上殼體以及支撐構件的第一種實施例的構造示意圖，其中下殼體和上殼體分離。 Fig. 3-1 is a schematic structural diagram of the first embodiment of the lower casing, the upper casing and the supporting member of the vapor chamber of the present invention, wherein the lower casing and the upper casing are separated.

第3-2圖是第3-1圖繪示之實施例的斷面構造示意圖(斷面的方向如第2圖A-A所示)及其局部放大圖，其中下殼體和上殼體密合連接。 Fig. 3-2 is a schematic diagram of the cross-sectional structure of the embodiment shown in Fig. 3-1 (the direction of the cross-section is shown in Fig. 2 A-A) and a partial enlarged view, wherein the lower casing and the upper casing are tightly sealed connect.

第4圖是本發明均溫板的下殼體、上殼體以及支撐構件的第二種實施例的斷面構造示意圖及其局部放大圖。 FIG. 4 is a schematic cross-sectional structure diagram and a partial enlarged view of the second embodiment of the lower casing, the upper casing and the supporting member of the vapor chamber according to the present invention.

第5-1圖是本發明均溫板的下殼體、上殼體以及支撐構件的第三種實施例的構造示意圖，其中下殼體和上殼體分離。 Fig. 5-1 is a schematic structural diagram of the third embodiment of the lower casing, the upper casing and the supporting member of the vapor chamber of the present invention, wherein the lower casing and the upper casing are separated.

第5-2圖是第5-1圖繪示之實施例的斷面構造示意圖及其局部放大圖，其中下殼體和上殼體密合連接。 Fig. 5-2 is a schematic cross-sectional structure diagram and a partial enlarged view of the embodiment shown in Fig. 5-1, wherein the lower casing and the upper casing are tightly connected.

第6-1圖是本發明均溫板的下殼體、上殼體以及支撐構件的第四種實施例的構造示意圖，其中下殼體和上殼體分離。 Fig. 6-1 is a schematic structural diagram of the fourth embodiment of the lower case, the upper case and the support member of the vapor chamber of the present invention, wherein the lower case and the upper case are separated.

第6-2圖是第6-1圖繪示之實施例的斷面構造示意圖及其局部放大圖，其中下殼體和上殼體密合連接。 Fig. 6-2 is a schematic cross-sectional view and a partial enlarged view of the embodiment shown in Fig. 6-1, wherein the lower casing and the upper casing are tightly connected.

第7圖是本發明均溫板的一種實施例的斷面構造示意圖及其局部放大圖，其中繪示支撐構件的另一種實施方式。 FIG. 7 is a schematic cross-sectional structure diagram and a partial enlarged view of an embodiment of the vapor chamber of the present invention, wherein another embodiment of the support member is shown.

第8圖是本發明均溫板的第二種實施例的斷面構造示意圖及其局部放大圖。 Fig. 8 is a schematic cross-sectional structure diagram and a partial enlarged view of the second embodiment of the vapor chamber of the present invention.

第9圖是本發明均溫板的第三種實施例的斷面構造示意圖，其中用於製作上殼體和下殼體的金屬複合板具有三層結構。 Fig. 9 is a schematic cross-sectional structure diagram of the third embodiment of the vapor chamber of the present invention, wherein the metal composite plate used for making the upper casing and the lower casing has a three-layer structure.

第10圖是本發明均溫板的第四種實施例的斷面構造示意圖，其中用於製作上殼體和下殼體的金屬複合板具有三層結構。 Fig. 10 is a schematic cross-sectional structure diagram of the fourth embodiment of the vapor chamber of the present invention, wherein the metal composite plate used for making the upper casing and the lower casing has a three-layer structure.

在下文的實施方式中所述的位置關係，包括：上，下，左和右，若無特別指明，皆是以圖式中組件繪示的方向為基準。 The positional relationships described in the following embodiments, including: up, down, left and right, are based on the directions shown by the components in the drawings unless otherwise specified.

本發明提出的均溫板的一種實施例構造基本上包括：下殼體10、上殼體20(見第1圖)、支撐構件以及工作流體60(表示於第7圖)，依據下文及圖式的各種實施例，均溫板的整體厚度為1~6mm。 An embodiment structure of the vapor chamber proposed by the present invention basically includes: a lower casing 10, an upper casing 20 (see FIG. 1), a support member and a working fluid 60 (shown in FIG. 7), according to the following and the drawings In various embodiments of the formula, the overall thickness of the temperature equalizing plate is 1-6 mm.

首先請參閱第1圖是本發明均溫板的一種實施例的分解構造示意圖，同時請參閱第2圖是第1圖之實施例的正面構造示意圖(其中上殼體20因位於下殼體10的背面故以虛線繪示)。本發明均溫板的一種實施例的下殼體10和上殼體20都是由一種具有雙層結構的金屬複合板製成，金屬複合板的結構包含一金屬基材以及複合於所述的金屬基材的一側表面的一銅金屬層。 First, please refer to FIG. 1, which is a schematic diagram of an exploded structure of an embodiment of the vapor chamber of the present invention, and please refer to FIG. 2, which is a schematic diagram of the front structure of the embodiment of FIG. The back of it is shown in dashed lines). The lower casing 10 and the upper casing 20 of an embodiment of the vapor chamber of the present invention are both made of a metal composite plate with a double-layer structure. The structure of the metal composite plate includes a metal substrate and a composite A copper metal layer on one side surface of the metal substrate.

其中金屬基材包括：不鏽鋼以及鋁基碳化矽(Al/SiC)金屬基複合材料(Metal Matrix Composites,MMC)其中的任一種。鋁基碳化矽(Al/SiC)金屬基複合材料具有以下特點：金屬基(鋁)和陶瓷系強化材(SiC：碳化矽)是通過粉末冶金技術燒結，然後壓製成板材後再和銅金屬層通過滾軋工藝製成所述具有雙層結構的金屬複合板。一般而言，鋁基碳化矽(Al/SiC)金屬基複合材料其中鋁和碳化矽(SiC)的組成比例為1：1，意即鋁基碳化矽(Al/SiC)金屬基複合材料中的鋁和碳化矽各佔50%，而且鋁合金中均勻分散SiC粒子，具有更加優異物理特性，包括：輕量高剛性(與鋁同等密度，剛性為1.6倍)，熱膨脹率小(比銅熱膨脹更小)，以及熱傳導率高(是普通鑄造材料的1.4倍)。作為本發明均溫板的一種優選實施例構造，均溫板的厚度為 1~6mm，金屬複合板的金屬基材包括：不鏽鋼和鋁基碳化矽金屬基複合材料其中的任一種，金屬複合板的厚度為0.05~3.0mm，其中金屬複合板的銅金屬層的厚度是金屬複合板的厚度的5%~50%。其中優選的實施方式，金屬複合板的金屬基材和銅金屬層的厚度比為1：1。可以使均溫板具有較佳的結構強度，相較於傳統完全使用銅或鋁金屬製造的薄型均溫板，本發明使用上述具有雙層結構的金屬複合板製作而成的均溫板能更好地承受外力而不會輕易地彎曲變形。 The metal base material includes any one of stainless steel and aluminum-based silicon carbide (Al/SiC) metal matrix composites (Metal Matrix Composites, MMC). The aluminum-based silicon carbide (Al/SiC) metal matrix composite material has the following characteristics: the metal matrix (aluminum) and the ceramic reinforcement (SiC: silicon carbide) are sintered by powder metallurgy technology, and then pressed into a plate and then passed through the copper metal layer. The metal clad plate with the double-layer structure is produced by a rolling process. Generally speaking, the aluminum-based silicon carbide (Al/SiC) metal matrix composite material has a composition ratio of aluminum and silicon carbide (SiC) of 1:1, which means that the aluminum-based silicon carbide (Al/SiC) metal matrix composite material has a Aluminum and silicon carbide each account for 50%, and the SiC particles are uniformly dispersed in the aluminum alloy, which has more excellent physical properties, including: light weight and high rigidity (the same density as aluminum, 1.6 times the rigidity), low thermal expansion rate (higher thermal expansion than copper) small), and high thermal conductivity (1.4 times that of ordinary casting materials). As a preferred embodiment structure of the vapor chamber of the present invention, the thickness of the vapor chamber is 1~6mm, the metal base material of the metal clad plate includes: any one of stainless steel and aluminum-based silicon carbide metal matrix composite materials, the thickness of the metal clad plate is 0.05~3.0mm, and the thickness of the copper metal layer of the metal clad plate is 5%~50% of the thickness of the metal composite plate. In a preferred embodiment, the thickness ratio of the metal base material and the copper metal layer of the metal composite plate is 1:1. It can make the vapor chamber have better structural strength. Compared with the traditional thin vapor chamber made of copper or aluminum metal, the vapor chamber made of the metal composite plate with the double-layer structure of the present invention can be more efficient. It can withstand external forces well without bending and deforming easily.

請參閱第1圖，下殼體10具有分別位於相對兩側的一第一表面11和一第二表面12，第一表面11至少具有一平直面用以和熱源接觸，下殼體10的邊緣向外延伸有一下半管部13，下半管部13具有從第二表面12朝向第一表面11的方向凹陷的一第一溝槽131；上殼體20具有分別位於相對兩側的一第三表面21和一第四表面22，上殼體20的邊緣向外延伸有一上半管部23，上半管部23的位置與下半管部13對應，上半管部23具有從第三表面21朝向第四表面22的方向凹陷的一第二溝槽231，下殼體10的第二表面12的週邊B與上殼體20的第三表面21的週邊B密合連接(例如使用擴散接合或是雷射焊接連接)，在下殼體10和上殼體20之間形成中空的一腔體C，其中上半管部23和下半管部13是通過衝壓工藝形成，下半管部13和上半管部23的兩側邊緣互相密合連接共同構成與腔體C的內部連通的一金屬管50，金屬管50的管口作為對腔體C抽真空和填充工作流體60的入口，依序是先將腔體C抽至低真空狀態，然後在腔體C填充工作流體60(通常為純水)至預定的容量，填充完畢後切除多餘的金屬管50，再以焊接工藝封閉金屬管50的管口確保腔體C內的真空度，均溫板即製造完成。其中工作流體60填充於腔體C 之內(表示於第7圖)，優選的工作流體60是純水，因為純水具高表面張力、高潛熱與操作溫度範圍廣。 Referring to FIG. 1, the lower case 10 has a first surface 11 and a second surface 12 on opposite sides, respectively. The first surface 11 has at least one flat surface for contacting the heat source. The edge of the lower case 10 faces toward the heat source. A lower half-pipe portion 13 extends outward, and the lower half-pipe portion 13 has a first groove 131 recessed from the second surface 12 toward the first surface 11 ; the upper casing 20 has a third half-pipe portion located on opposite sides respectively. Surface 21 and a fourth surface 22, an upper half-pipe portion 23 extends outward from the edge of the upper casing 20, the position of the upper half-pipe portion 23 corresponds to the lower half-pipe portion 13, and the upper half-pipe portion 23 has a direction from the third surface. 21 is a second groove 231 recessed in the direction of the fourth surface 22, the periphery B of the second surface 12 of the lower case 10 is closely connected with the periphery B of the third surface 21 of the upper case 20 (for example, using diffusion bonding) or laser welding connection), a hollow cavity C is formed between the lower casing 10 and the upper casing 20, wherein the upper half-pipe 23 and the lower half-pipe 13 are formed by a stamping process, and the lower half-pipe 13 The two sides of the upper half-pipe portion 23 are closely connected to each other to form a metal tube 50 that communicates with the interior of the cavity C. The mouth of the metal tube 50 serves as an inlet for evacuating the cavity C and filling the working fluid 60. The sequence is to first pump the cavity C to a low vacuum state, then fill the cavity C with the working fluid 60 (usually pure water) to a predetermined volume, cut off the excess metal tube 50 after filling, and then seal the metal by welding. The nozzle of the pipe 50 ensures the vacuum degree in the cavity C, and the temperature equalizing plate is manufactured. The working fluid 60 is filled in the cavity C Within (shown in Figure 7), the preferred working fluid 60 is pure water because of its high surface tension, high latent heat, and wide operating temperature range.

將均溫板設置於熱源(例如電子裝置的微處理器)上，熱會通過下殼體10傳導進入腔體C並使其內部的工作流體60吸熱而汽化成為蒸汽。因為在低真空度的環境中，工作流體60更容易汽化，工作流體60汽化產生的蒸汽的體積會快速膨脹，蒸氣會迅速充滿腔體C，其接觸到均溫板的溫度較低的冷凝端，例如；設置風扇、散熱片、水冷系統的位置，蒸氣會釋放所吸收的熱量並重新凝結為液狀，之後通過毛細結構的導引再回流到熱源處，如此在腔體C內進行汽相-液相的循環變化，達到帶走熱量以及均勻分散熱量的功效。 When the vapor chamber is set on a heat source (eg, a microprocessor of an electronic device), the heat will be conducted into the cavity C through the lower casing 10 and the working fluid 60 inside will absorb heat and be vaporized into steam. Because in the low vacuum environment, the working fluid 60 is easier to vaporize, the volume of the steam generated by the vaporization of the working fluid 60 will expand rapidly, and the steam will quickly fill the cavity C, which contacts the lower temperature condensation end of the vapor chamber. , for example; where fans, heat sinks, and water cooling systems are set, the vapor will release the absorbed heat and condense into liquid again, and then return to the heat source through the guidance of the capillary structure, so that the vapor phase is carried out in the cavity C. -The cyclic change of the liquid phase achieves the effect of taking away heat and dispersing heat evenly.

本發明均溫板的下殼體10、上殼體20以及支撐構件的形狀及其構造包含幾種不同優選的實施方式，將配合圖式在下文中說明。首先說明在第3-1圖至第7圖的數種實施例中，其中金屬複合板的金屬基材作為下殼體10的第一表面11以及上殼體20的第四表面22，銅金屬層作為下殼體10的第二表面12以及上殼體20的第三表面21。支撐構件配置於腔體C之中，支撐構件介於第二表面12和第三表面21之間用以支撐起真空且密封的腔體C。支撐構件的一種實施方式是通過衝壓工藝形成的多個突起物30，這些突起物30形成於第二表面12和第三表面21其中的任一者或全部，這些突起物30彼此間隔地排列並且均勻地分布在腔體C之中，任二個相鄰的突起物30的底端之間具有一間距D(其中突起物30的底端是指突起物30與下殼體10的第二表面12的連接處，或是突起物30與上殼體20的第三表面21的連接處)。 The shapes and structures of the lower casing 10 , the upper casing 20 and the supporting member of the vapor chamber of the present invention include several different preferred embodiments, which will be described below with reference to the drawings. First of all, it will be explained that in several embodiments shown in FIGS. 3-1 to 7, the metal base material of the metal composite plate is used as the first surface 11 of the lower casing 10 and the fourth surface 22 of the upper casing 20, and the copper metal The layers serve as the second surface 12 of the lower case 10 and the third surface 21 of the upper case 20 . The support member is disposed in the cavity C, and the support member is interposed between the second surface 12 and the third surface 21 to support the vacuum and sealed cavity C. One embodiment of the support member is a plurality of protrusions 30 formed by a stamping process on either or both of the second surface 12 and the third surface 21, the protrusions 30 being spaced apart from each other and Evenly distributed in the cavity C, there is a distance D between the bottom ends of any two adjacent protrusions 30 (wherein the bottom end of the protrusions 30 refers to the protrusions 30 and the second surface of the lower casing 10 ) 12, or the connection between the protrusion 30 and the third surface 21 of the upper casing 20).

突起物30的功能之一在於避免腔體C在抽真空的製程中，構成腔體C的下殼體10和上殼體20產生塌陷或損壞；突起物30的另一功能亦可作為均溫板的毛細結構，只要所述的間距D適當，液態的工作流體60就能吸附於突起物30的底端，進而保證工作流體60能盡可能地附著在腔體C的內側表面，繼而在吸熱後蒸發為汽態達到導熱及散熱的效果。作為優選地實施方式，所述的突起物30是錐形體，其中突起物30的底部較寬(寬度為W)，突起物的末端(遠離第二表面12或第三表面21的一端)相對較窄，突起物30的最大寬度W和間距D的比例為1：1~1：0.5，可以增加腔體C的容積，進而提高均溫板的腔體C內的工作流體60的容量，可以降低燒乾(dry out)的現象發生的機率。 One of the functions of the protrusions 30 is to prevent the cavity C from being formed during the vacuuming process. The lower casing 10 and the upper casing 20 forming the cavity C are collapsed or damaged; another function of the protrusions 30 can also be used as the capillary structure of the vapor chamber, as long as the distance D is appropriate, the liquid working fluid 60 It can be adsorbed on the bottom end of the protrusion 30, thereby ensuring that the working fluid 60 can adhere to the inner surface of the cavity C as much as possible, and then evaporate into a vapor state after absorbing heat to achieve the effect of heat conduction and heat dissipation. As a preferred embodiment, the protrusion 30 is a cone, wherein the bottom of the protrusion 30 is wider (width is W), and the end of the protrusion (the end away from the second surface 12 or the third surface 21 ) is relatively Narrow, the ratio of the maximum width W of the protrusions 30 to the distance D is 1:1~1:0.5, which can increase the volume of the cavity C, thereby increasing the capacity of the working fluid 60 in the cavity C of the vapor chamber, and can reduce the The chance of a dry out phenomenon.

請參閱第3-1圖和第3-2圖是本發明均溫板的下殼體10、上殼體20以及支撐構件的第一種實施例的構造示意圖。其中下殼體10是平直的板狀，上殼體20具有從第三表面21朝向第四表面22的方向凹陷的一第二凹陷部(用以在下殼體10和上殼體20互相密合連接後形成腔體C)，所述的週邊B圍繞在第二凹陷部的周圍。其中突起物30是通過衝壓工藝形成於下殼體10的第二表面12，突起物30的末端係抵頂於上殼體20的第三表面21。 Please refer to Fig. 3-1 and Fig. 3-2, which are schematic structural diagrams of the first embodiment of the lower casing 10, the upper casing 20 and the supporting member of the vapor chamber of the present invention. The lower case 10 is in a flat plate shape, and the upper case 20 has a second concave portion recessed from the third surface 21 toward the fourth surface 22 (for the lower case 10 and the upper case 20 to be in close contact with each other) Cavity C) is formed after joint connection, and the periphery B surrounds the periphery of the second concave portion. The protrusions 30 are formed on the second surface 12 of the lower case 10 by a stamping process, and the ends of the protrusions 30 are abutted against the third surface 21 of the upper case 20 .

請參閱第4圖是本發明均溫板的下殼體10、上殼體20以及支撐構件的第二種實施例的斷面構造示意圖及其局部放大圖。其中下殼體10是平直的板狀，上殼體20具有從第三表面21朝向第四表面22的方向凹陷的一第二凹陷部(用以形成腔體C)，所述的週邊B圍繞在第二凹陷部的周圍。和第3-2圖的區別在於，其中突起物30是通過衝壓工藝形成於上殼體20的第三表面21，突起物30的末端係抵頂於下殼體20的第二表面(由金屬層12構成)。 Please refer to FIG. 4 , which is a schematic cross-sectional structure diagram and a partial enlarged view of the second embodiment of the lower casing 10 , the upper casing 20 and the supporting member of the vapor chamber of the present invention. The lower case 10 is in the shape of a flat plate, the upper case 20 has a second recess (for forming a cavity C) recessed from the third surface 21 toward the fourth surface 22 , and the periphery B around the second recess. The difference from FIG. 3-2 is that the protrusions 30 are formed on the third surface 21 of the upper casing 20 by a stamping process, and the ends of the protrusions 30 are abutted against the second surface of the lower casing 20 (made of metal). layer 12).

請參閱第5-1圖和第5-2圖是本發明均溫板的下殼體10、上殼體20以及支撐構件的第三種實施例的構造示意圖。其中上殼體20是平直的板狀，下殼體10具有從第二表面12朝向第一表面11的方向凹陷的一第一凹陷部(用以形成腔體C)，所述的週邊B圍繞在第一凹陷部的周圍。其中形成於第二表面12的突起物30的末端係抵頂於上殼體20的第三表面21。 Please refer to FIGS. 5-1 and 5-2, which are schematic structural diagrams of the third embodiment of the lower casing 10, the upper casing 20 and the supporting member of the vapor chamber of the present invention. The upper casing 20 is a flat plate, the lower casing 10 has a first recess (for forming a cavity C) recessed from the second surface 12 toward the first surface 11 , and the periphery B around the first recess. The ends of the protrusions 30 formed on the second surface 12 abut against the third surface 21 of the upper casing 20 .

請參閱第6-1圖和第6-2圖是本發明均溫板的下殼體10、上殼體20以及支撐構件的第四種實施例的構造示意圖。其中下殼體10具有從第二表面12朝向第一表面11的方向凹陷的一第一凹陷部，所述的週邊B圍繞在第一凹陷部的周圍；上殼體20具有從第三表面21朝向第四表面22的方向凹陷的一第二凹陷部，所述的週邊B圍繞在第二凹陷部的周圍，第一凹陷部和第二凹陷部共同構成所述的腔體C。其中形成於下殼體10的第二表面12以及形成於上殼體20的第三表面21的突起物30的末端係互相抵頂。 Please refer to Fig. 6-1 and Fig. 6-2, which are schematic structural diagrams of the fourth embodiment of the lower casing 10, the upper casing 20 and the supporting member of the vapor chamber of the present invention. The lower case 10 has a first recessed portion recessed from the second surface 12 toward the first surface 11 , and the periphery B surrounds the first recessed portion; the upper case 20 has a first recessed portion from the third surface 21 A second concave portion concave toward the direction of the fourth surface 22, the periphery B surrounds the second concave portion, and the first concave portion and the second concave portion together constitute the cavity C. The ends of the protrusions 30 formed on the second surface 12 of the lower casing 10 and the third surface 21 of the upper casing 20 abut against each other.

請參閱第7圖，其中繪示了通過衝壓工藝形成的多個突起物30的另一種實施例構造，和第3-2圖的區別在於，其中形成於第二表面12的突起物30是較為細長的錐形體，這些突起物30的末端係抵頂於第三表面21，其中突起物的末端具有一帽頭31，可以通過對突起30物的末端擠壓或衝壓形成所述的帽頭31。帽頭31可以引導在第三表面21凝結的液態的工作流體60流回至突起物30的底端，進而保證工作流體60能盡可能地附著在腔體C的內側表面，繼而在吸熱後蒸發為汽態達到導熱及散熱的效果。 Please refer to FIG. 7, which shows another embodiment of the structure of the plurality of protrusions 30 formed by the stamping process. The difference from FIG. 3-2 is that the protrusions 30 formed on the second surface 12 are relatively Elongated cones, the ends of these protrusions 30 are pressed against the third surface 21, wherein the end of the protrusions has a cap head 31, and the cap head 31 can be formed by extruding or punching the ends of the protrusions 30 . The cap head 31 can guide the liquid working fluid 60 condensed on the third surface 21 to flow back to the bottom end of the protrusion 30, thereby ensuring that the working fluid 60 can adhere to the inner surface of the cavity C as much as possible, and then evaporate after absorbing heat To achieve the effect of heat conduction and heat dissipation for the vapor state.

請參閱第8圖是本發明均溫板的第二種實施例的斷面構造示意圖及其局部放大圖，其中金屬複合板的金屬基材作為下殼體10的第一表面11以及上殼體20的第四表面22，銅金屬層作為下殼體10的第二表面12以及上殼體20的第三表面21，和第3-2圖的區別在於，其中第二表面12和第三表面21是平直面，所述的支撐構件是銅金屬網40，銅金屬網40附著於腔體C的內側表面，其中一種實施方式是通過燒結工藝將銅金屬網40繞結於腔體C的內側表面，銅金屬網40的功能之一在於避免腔體C在抽真空的製程中，構成腔體C的下殼體10和上殼體20產生塌陷或損壞；銅金屬網40的另一功能亦可作為均溫板的毛細結構。 Please refer to FIG. 8 , which is a schematic cross-sectional structure diagram and a partial enlarged view of the second embodiment of the vapor chamber of the present invention, wherein the metal substrate of the metal composite plate serves as the first surface 11 of the lower casing 10 and the upper casing The fourth surface 22 of 20, the copper metal layer serves as the second surface 12 of the lower case 10 to and the third surface 21 of the upper casing 20, and the difference from Fig. 3-2 is that the second surface 12 and the third surface 21 are flat planes, and the supporting member is a copper metal mesh 40, a copper metal mesh 40 Attached to the inner surface of the cavity C, one of the embodiments is to wrap the copper metal mesh 40 on the inner surface of the cavity C through a sintering process. One of the functions of the copper metal mesh 40 is to avoid the cavity C during the vacuuming process. Among them, the lower casing 10 and the upper casing 20 constituting the cavity C are collapsed or damaged; another function of the copper metal mesh 40 can also be used as the capillary structure of the vapor chamber.

在本發明的進一步實施方式，其中第8圖中的下殼體10的第一表面11以及上殼體20的第四表面22也可以是銅金屬層，下殼體10的第二表面12以及上殼體20的第三表面21是較硬的金屬基材。 In a further embodiment of the present invention, the first surface 11 of the lower case 10 and the fourth surface 22 of the upper case 20 in FIG. 8 may also be copper metal layers, and the second surface 12 of the lower case 10 and The third surface 21 of the upper casing 20 is a relatively hard metal substrate.

請參閱第9圖是本發明均溫板的第三種實施例的斷面構造示意圖，和第3-2圖的區別在於，其中用於製作上殼體20和下殼體10的金屬複合板具有三層結構。其中具有三層結構的金屬複合板包含一金屬基材以及複合於所述的金屬基材的相對兩側表面的一第一銅金屬層和一第二銅金屬層，同樣地，金屬基材可以是不鏽鋼以及鋁基碳化矽金屬基複合材料其中的任一種，金屬基材介於第一銅金屬層和第二銅金屬層之間，下殼體10具有分別位於相對兩側的一第一表面11和一第二表面12，第一銅金屬層作為第一表面11，第二銅金屬層作為第二表面12；上殼體20具有分別位於相對兩側的第三表面21和第四表面22，第一銅金屬層作為第三表面21，第二銅金屬層作為第四表面22，較硬的金屬基材作為下殼體10和上殼體20的中間層M。這種使用具有三層結構的金屬複合板製作的均溫板，其中的下殼體10、上殼體20以及支撐構件的形狀及其構造，可以比照前述第3-1圖至第8圖的幾種不同實施方式變換，例如第9圖其中的支撐構件是通過衝壓工藝形成的多個突起物30；例如第10圖其中的支撐構件是銅金屬網40。作為一種較佳的實施例，均溫板的厚度為1~6mm，其中金屬複合板的金屬基材包括：不鏽鋼和鋁基碳化矽金屬基複合材料其中的任一種，金屬複合板的厚度為0.05~3.0mm，金屬複合板的第一銅金屬層和第二銅金屬層的厚度相同，其中金屬複合板的第一銅金屬層和第二銅金屬層的總厚度是金屬複合板的厚度的5%~50%。 Please refer to FIG. 9, which is a schematic cross-sectional structure diagram of the third embodiment of the vapor chamber of the present invention. The difference from FIG. 3-2 is that the metal composite plates used to make the upper casing 20 and the lower casing 10 are used. Has a three-layer structure. The metal composite board with a three-layer structure includes a metal substrate, a first copper metal layer and a second copper metal layer that are compounded on opposite sides of the metal substrate. Similarly, the metal substrate can be It is any one of stainless steel and aluminum-based silicon carbide metal-based composite materials, the metal base material is between the first copper metal layer and the second copper metal layer, and the lower casing 10 has a first surface on opposite sides respectively. 11 and a second surface 12, the first copper metal layer is used as the first surface 11, and the second copper metal layer is used as the second surface 12; the upper casing 20 has a third surface 21 and a fourth surface 22 on opposite sides respectively , the first copper metal layer is used as the third surface 21 , the second copper metal layer is used as the fourth surface 22 , and the harder metal substrate is used as the middle layer M between the lower casing 10 and the upper casing 20 . The shape and structure of the lower casing 10 , the upper casing 20 and the supporting member in the vapor chamber made of the metal clad plate with a three-layer structure can be compared with the above-mentioned Fig. 3-1 to Fig. 8 Several different embodiments are changed. For example, the support member in Fig. 9 is formed by a stamping process. A plurality of protrusions 30 are formed; for example, the support member in FIG. 10 is a copper metal mesh 40 . As a preferred embodiment, the thickness of the temperature equalizing plate is 1-6 mm, and the metal base material of the metal composite plate includes: any one of stainless steel and aluminum-based silicon carbide metal-based composite materials, and the thickness of the metal composite plate is 0.05 mm. ~3.0mm, the thickness of the first copper metal layer and the second copper metal layer of the metal composite board is the same, wherein the total thickness of the first copper metal layer and the second copper metal layer of the metal composite board is 5 times the thickness of the metal composite board %~50%.

雖然本發明已通過上述的實施例公開如上，然其並非用以限定本發明，本領域技術人員，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，因此本發明的專利保護範圍須視本申請的權利要求所界定者為准。 Although the present invention has been disclosed above through the above-mentioned embodiments, it is not intended to limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection shall be subject to those defined by the claims of this application.

10:下殼體 10: Lower shell

11:第一表面 11: The first surface

12:第二表面 12: Second surface

13:下半管部 13: Lower half pipe

131:第一溝槽 131: First groove

20:上殼體 20: Upper shell

22:第四表面 22: Fourth surface

23:上半管部 23: Upper half pipe

231:第二溝槽 231: Second groove

30:突出部 30: Protrusion

50:金屬管 50: Metal tube

B:週邊 B: Around

C:腔體 C: cavity

Claims

一種均溫板，包含：一下殼體，是由一金屬複合板製成，該下殼體具有分別位於相對兩側的一第一表面和一第二表面，該金屬複合板的結構包含一金屬基材以及複合於該金屬基材的一側表面的一銅金屬層，該第一表面至少具有一平直面用以和熱源接觸，該下殼體的邊緣向外延伸有一下半管部，該下半管部具有從該第二表面朝向該第一表面的方向凹陷的一第一溝槽，該金屬複合板的該金屬基材包括：不鏽鋼和鋁基碳化矽金屬基複合材料其中的任一種，該金屬複合板的厚度為0.05~3.0mm，該金屬複合板的銅金屬層的厚度是金屬複合板的厚度的5%~50%；一上殼體，使用該金屬複合板製成，該上殼體具有分別位於相對兩側的一第三表面和一第四表面，該上殼體的邊緣向外延伸有一上半管部，該上半管部的位置與該下半管部對應，該上半管部具有從該第三表面朝向該第四表面的方向凹陷的一第二溝槽，該下殼體的該第二表面的週邊與該上殼體的該第三表面的週邊以擴散接合或是雷射焊接密合連接，在該下殼體和該上殼體之間形成中空的一腔體，該下半管部和該上半管部的兩側邊緣互相密合連接共同構成與該腔體的內部連通的一金屬管，該腔體內抽真空後切除多餘的該金屬管並將該金屬管的管口封閉以形成真空且密封的該腔體；一支撐構件，配置於該腔體之中，該支撐構件介於該第二表面和該第三表面之間用以支撐起真空且密封的該腔體；以及一工作流體，填充於真空且密封的該腔體之內。 A temperature equalizing plate, comprising: a lower shell, which is made of a metal composite plate, the lower shell has a first surface and a second surface respectively located on opposite sides, and the structure of the metal composite plate includes a metal composite plate. The base material and a copper metal layer compounded on one side surface of the metal base material, the first surface at least has a flat surface for contacting with the heat source, the edge of the lower shell extends outward with a lower half pipe portion, the lower The half-pipe portion has a first groove recessed from the second surface toward the first surface, and the metal base material of the metal composite plate includes: any one of stainless steel and aluminum-based silicon carbide metal-based composite materials, The thickness of the metal clad plate is 0.05~3.0mm, and the thickness of the copper metal layer of the metal clad plate is 5% to 50% of the thickness of the metal clad plate; an upper shell is made of the metal clad plate, and the upper The shell has a third surface and a fourth surface respectively located on opposite sides, the edge of the upper shell extends outward with an upper half-pipe portion, the position of the upper half-pipe portion corresponds to the lower half-pipe portion, the The upper half-pipe has a second groove recessed from the third surface toward the fourth surface, the periphery of the second surface of the lower case and the periphery of the third surface of the upper case are for diffusion Bonding or laser welding tight connection, a hollow cavity is formed between the lower casing and the upper casing, and the two sides of the lower half-pipe and the upper half-pipe are closely connected to each other to form together A metal tube communicated with the interior of the cavity, after the cavity is evacuated, the excess metal tube is cut off and the mouth of the metal tube is closed to form a vacuum and sealed cavity; a support member is disposed in the cavity In the cavity, the support member is interposed between the second surface and the third surface to support the vacuum and sealed cavity; and a working fluid is filled in the vacuum and sealed cavity.

如請求項1所述的均溫板，其中該均溫板的厚度是1~6mm。 The vapor chamber as claimed in claim 1, wherein the thickness of the vapor chamber is 1-6 mm.

如請求項2所述的均溫板，其中該金屬基材作為該下殼體的該第一表面以及該上殼體的該第四表面，該銅金屬層作為該下殼體的該第二表面以及該上殼體的該第三表面，該支撐構件是通過衝壓工藝形成的多個突起物，該些突起物形成於該第二表面和該第三表面其中的任一者或全部，該些突起物是錐形體，任二個相鄰的該突起物的底端之間具有一間距，該突起物的最大寬度和該間距的比例為1：1~1：0.5。 The vapor chamber as claimed in claim 2, wherein the metal substrate is used as the first surface of the lower case and the fourth surface of the upper case, and the copper metal layer is used as the second surface of the lower case The surface and the third surface of the upper casing, the support member is a plurality of protrusions formed by a stamping process, the protrusions are formed on any or all of the second surface and the third surface, the Some of the protrusions are tapered, and there is a distance between the bottom ends of any two adjacent protrusions, and the ratio of the maximum width of the protrusions to the distance is 1:1 to 1:0.5.

如請求項3所述的均溫板，其中形成於該第二表面的該些突起物的末端係抵頂於該第三表面，該些突起物的末端具有一帽頭。 The vapor chamber as claimed in claim 3, wherein the ends of the protrusions formed on the second surface are pressed against the third surface, and the ends of the protrusions have a cap.

如請求項3所述的均溫板，其中形成於該第三表面的該些突起物的末端係抵頂於該第二表面，該些突起物的末端具有一帽頭。 The vapor chamber as claimed in claim 3, wherein the ends of the protrusions formed on the third surface are pressed against the second surface, and the ends of the protrusions have a cap.

如請求項3所述的均溫板，其中形成於該第二表面以及形成於該第三表面的該些突起物的末端互相抵頂。 The vapor chamber as claimed in claim 3, wherein ends of the protrusions formed on the second surface and the third surface abut against each other.

如請求項2所述的均溫板，其中該金屬基材作為該下殼體的該第一表面以及該上殼體的該第四表面，該銅金屬層作為該下殼體的該第二表面以及該上殼體的該第三表面，該支撐構件是銅金屬網，該銅金屬網附著於該腔體的內側表面。 The vapor chamber as claimed in claim 2, wherein the metal substrate is used as the first surface of the lower case and the fourth surface of the upper case, and the copper metal layer is used as the second surface of the lower case The surface and the third surface of the upper casing, the support member is a copper metal mesh, and the copper metal mesh is attached to the inner surface of the cavity.

如請求項2所述的均溫板，其中該銅金屬層作為該下殼體的該第一表面以及該上殼體的該第四表面，該金屬基材作為該下殼體的該第二表面以及該上殼體的該第三表面，該支撐構件是銅金屬網，該銅金屬網附著於該腔體的內側表面。 The vapor chamber as claimed in claim 2, wherein the copper metal layer is used as the first surface of the lower case and the fourth surface of the upper case, and the metal substrate is used as the second surface of the lower case The surface and the third surface of the upper casing, the support member is a copper metal mesh, and the copper metal mesh is attached to the inner surface of the cavity.

如請求項1所述的均溫板，其中該下殼體是平直的板狀，該上殼體具有從該第三表面朝向該第四表面的方向凹陷的一第二凹陷部，該第二凹陷部和該下殼體共同構成該腔體，該週邊圍繞在該第二凹陷部的周圍。 The vapor chamber as claimed in claim 1, wherein the lower case is in the shape of a flat plate, and the upper case has A second recessed portion is recessed from the third surface toward the fourth surface, the second recessed portion and the lower case together form the cavity, and the periphery surrounds the second recessed portion.

如請求項1所述的均溫板，其中該上殼體是平直的板狀，該下殼體具有從該第二表面朝向該第一表面的方向凹陷的一第一凹陷部，該第一凹陷部和該上殼體共同構成該腔體，該週邊圍繞在該第一凹陷部的周圍。 The vapor chamber as claimed in claim 1, wherein the upper case is in a flat plate shape, the lower case has a first recessed portion recessed from the second surface toward the first surface, the first A recessed portion and the upper casing together form the cavity, and the periphery surrounds the first recessed portion.

如請求項1所述的均溫板，其中該下殼體具有從該第二表面朝向該第一表面的方向凹陷的一第一凹陷部，該週邊圍繞在該第一凹陷部的周圍；該上殼體具有從該第三表面朝向該第四表面的方向凹陷的一第二凹陷部，該週邊圍繞在該第二凹陷部的周圍，該第一凹陷部和該第二凹陷部共同構成該腔體。 The vapor chamber as claimed in claim 1, wherein the lower case has a first recessed portion recessed from the second surface toward the first surface, and the periphery surrounds the first recessed portion; the The upper casing has a second recessed portion recessed from the third surface toward the fourth surface, the periphery surrounds the second recessed portion, and the first recessed portion and the second recessed portion together constitute the cavity.

一種均溫板，包含：一下殼體，是由一金屬複合板製成，該金屬複合板的結構包含一金屬基材以及複合於該金屬基材的相對兩側表面的一第一銅金屬層和一第二銅金屬層，該金屬基材介於該第一銅金屬層和該第二銅金屬層之間，該下殼體具有分別位於相對兩側的一第一表面和一第二表面，該第一銅金屬層作為該第一表面，該第二銅金屬層作為該第二表面，該第一表面至少具有一平直面用以和熱源接觸，該下殼體的邊緣向外延伸有一下半管部，該下半管部具有從該第二表面朝向該第一表面的方向凹陷的一第一溝槽，該金屬複合板的該金屬基材包括：不鏽鋼和鋁基碳化矽金屬基複合材料其中的任一種，該金屬複合板的厚度為0.05~3.0mm，該金屬複合板的該第一銅金屬層和該第二銅金屬層的厚度相同，該第一銅金屬層和該第二銅金屬層的總厚度是該金屬複合板的厚度的5%~50%；一上殼體，使用該金屬複合板製成，該上殼體具有分別位於相對兩側的一第三表面和一第四表面，該第一銅金屬層作為該第三表面，該第二銅金屬層作為該第四表面，該上殼體的邊緣向外延伸有一上半管部，該上半管部的位置與該下半管部對應，該上半管部具有從該第三表面朝向該第四表面的方向凹陷的一第二溝槽，該下殼體的該第二表面的週邊與該上殼體的該第三表面的週邊以擴散接合或是雷射焊接密合連接，在該下殼體和該上殼體之間形成中空的一腔體，該下半管部和該上半管部的兩側邊緣互相密合連接共同構成與該腔體的內部連通的一金屬管，該腔體內抽真空後切除多餘的該金屬管並將該金屬管的管口封閉以形成真空且密封的該腔體；一支撐構件，配置於該腔體之中，該支撐構件介於該第二表面和該第三表面之間用以支撐起真空且密封的該腔體；以及一工作流體，填充於真空且密封的該腔體之內。 A temperature equalizing plate, comprising: a lower shell, which is made of a metal composite plate, the structure of the metal composite plate includes a metal base material and a first copper metal layer compounded on the opposite side surfaces of the metal base material and a second copper metal layer, the metal substrate is interposed between the first copper metal layer and the second copper metal layer, and the lower case has a first surface and a second surface respectively located on opposite sides , the first copper metal layer is used as the first surface, the second copper metal layer is used as the second surface, the first surface at least has a flat surface for contact with the heat source, and the edge of the lower casing extends outwards Half-pipe, the lower half-pipe has a first groove recessed from the second surface toward the first surface, the metal base material of the metal composite plate includes: stainless steel and aluminum-based silicon carbide metal matrix composite Any one of the materials, the thickness of the metal composite plate is 0.05~3.0mm, the thickness of the first copper metal layer and the second copper metal layer of the metal composite plate are the same, and the thickness of the first copper metal layer and the second copper metal layer is the same. The total thickness of the copper metal layer is the thickness of the metal composite plate 5%~50% of the degree; an upper casing is made of the metal composite plate, the upper casing has a third surface and a fourth surface respectively located on opposite sides, and the first copper metal layer serves as the The third surface, the second copper metal layer serves as the fourth surface, an upper half pipe portion extends outward from the edge of the upper casing, the position of the upper half pipe portion corresponds to the lower half pipe portion, the upper half pipe portion The part has a second groove recessed from the third surface toward the fourth surface, and the periphery of the second surface of the lower case and the periphery of the third surface of the upper case are diffusion bonded or The laser welding is closely connected, a hollow cavity is formed between the lower casing and the upper casing, and the two side edges of the lower half-pipe and the upper half-pipe are closely connected to each other to form the cavity. A metal tube communicated with the inside of the body, the cavity is evacuated and then the excess metal tube is cut off and the mouth of the metal tube is closed to form a vacuum and sealed cavity; a support member is arranged in the cavity wherein, the support member is interposed between the second surface and the third surface to support the vacuum and sealed cavity; and a working fluid is filled in the vacuum and sealed cavity.

如請求項12所述的均溫板，其中該均溫板的厚度是1~6mm。 The vapor chamber as claimed in claim 12, wherein the thickness of the vapor chamber is 1-6 mm.

如請求項13所述的均溫板，其中該支撐構件是通過衝壓工藝形成的多個突起物，該些突起物形成於該第二表面和該第三表面其中的任一者或全部，該些突起物是錐形體，任二個相鄰的該突起物的底端之間具有一間距，該突起物的最大寬度和該間距的比例為1：1~1：0.5。 The vapor chamber as claimed in claim 13, wherein the support member is a plurality of protrusions formed by a stamping process, the protrusions are formed on any or all of the second surface and the third surface, the Some of the protrusions are tapered, and there is a distance between the bottom ends of any two adjacent protrusions, and the ratio of the maximum width of the protrusions to the distance is 1:1 to 1:0.5.

如請求項14所述的均溫板，其中形成於該第二表面的該些突起物的末端係抵頂於該第三表面，該些突起物的末端具有一帽頭。 The vapor chamber as claimed in claim 14, wherein the ends of the protrusions formed on the second surface are pressed against the third surface, and the ends of the protrusions have a cap.

如請求項14所述的均溫板，其中形成於該第三表面的該些突起物的末端係抵頂於該第二表面，該些突起物的末端具有一帽頭。 The vapor chamber as claimed in claim 14, wherein the ends of the protrusions formed on the third surface The ends are pressed against the second surface, and the ends of the protrusions have a cap.

如請求項14所述的均溫板，其中形成於該第二表面以及形成於該第三表面的該些突起物的末端互相抵頂。 The vapor chamber as claimed in claim 14, wherein ends of the protrusions formed on the second surface and the third surface abut against each other.

如請求項13所述的均溫板，其中該支撐構件是銅金屬網，該銅金屬網附著於該腔體的內側表面。 The vapor chamber of claim 13, wherein the support member is a copper metal mesh attached to the inner side surface of the cavity.

如請求項12所述的均溫板，其中該下殼體是平直的板狀，該上殼體具有從該第三表面朝向該第四表面的方向凹陷的一第二凹陷部，該第二凹陷部和該下殼體共同構成該腔體，該週邊圍繞在該第二凹陷部的周圍。 The vapor chamber as claimed in claim 12, wherein the lower case is in a flat plate shape, the upper case has a second recessed portion recessed from the third surface toward the fourth surface, the first The two concave parts and the lower casing together form the cavity, and the periphery surrounds the second concave part.

如請求項12所述的均溫板，其中該上殼體是平直的板狀，該下殼體具有從該第二表面朝向該第一表面的方向凹陷的一第一凹陷部，該第一凹陷部和該上殼體共同構成該腔體，該週邊圍繞在該第一凹陷部的周圍。 The vapor chamber as claimed in claim 12, wherein the upper case is a flat plate, the lower case has a first recessed portion recessed from the second surface toward the first surface, the first A recessed portion and the upper casing together form the cavity, and the periphery surrounds the first recessed portion.

如請求項12所述的均溫板，其中該下殼體具有從該第二表面朝向該第一表面的方向凹陷的一第一凹陷部，該週邊圍繞在該第一凹陷部的周圍；該上殼體具有從該第三表面朝向該第四表面的方向凹陷的一第二凹陷部，該週邊圍繞在該第二凹陷部的周圍，該第一凹陷部和該第二凹陷部共同構成該腔體。 The vapor chamber as claimed in claim 12, wherein the lower case has a first recessed portion recessed from the second surface toward the first surface, and the periphery surrounds the first recessed portion; the The upper casing has a second recessed portion recessed from the third surface toward the fourth surface, the periphery surrounds the second recessed portion, and the first recessed portion and the second recessed portion together constitute the cavity.