CN110763062A - Heat conduction and heat dissipation integrated flat heat pipe - Google Patents
Heat conduction and heat dissipation integrated flat heat pipe Download PDFInfo
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- CN110763062A CN110763062A CN201911200535.2A CN201911200535A CN110763062A CN 110763062 A CN110763062 A CN 110763062A CN 201911200535 A CN201911200535 A CN 201911200535A CN 110763062 A CN110763062 A CN 110763062A
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- 238000001816 cooling Methods 0.000 claims abstract description 21
- 238000000926 separation method Methods 0.000 claims abstract description 20
- 230000010354 integration Effects 0.000 claims abstract description 6
- 238000010521 absorption reaction Methods 0.000 claims description 22
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- 239000011248 coating agent Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004809 Teflon Substances 0.000 claims description 5
- 229920006362 Teflon® Polymers 0.000 claims description 5
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat conduction and heat dissipation integrated flat heat pipe, wherein a condenser is designed at the position of a cavity of the traditional flat heat pipe to replace a condensation surface, steam generated at an evaporation end can be directly condensed on the surface of the condenser, and heat released by condensation is directly taken away by a cooling working medium in the condenser, so that the integration of heat conduction and heat sink heat dissipation of the flat heat pipe is realized. Compared with the traditional flat heat pipe, the flat heat pipe has the following advantages: 1) the steam generated at the evaporation end is directly condensed on the surface of the condenser without passing through a liquid layer, so that the gas-liquid separation in the real sense is realized; 2) the heat emitted in the condensation process is directly taken away by the cooling working medium flowing in the condenser, and the thermal contact resistance between the flat heat pipe and the heat sink is avoided; 3) the condenser is arranged at the cavity position of the traditional flat heat pipe, the supporting effect on the inside of the flat heat pipe is also achieved while steam is condensed, the structure is more compact, and the total volume of heat conduction and heat dissipation of the flat heat pipe is reduced.
Description
Technical Field
The invention belongs to the technical field of heat transfer, and particularly relates to a heat conduction and heat dissipation integrated flat heat pipe which can be applied to cooling of devices such as servers, computer mainboards, aerospace heating elements and the like.
Background
In recent years, with the continuous progress and development of electronic technology, the high frequency and high speed of electronic components and the density and miniaturization of integrated circuits have led to a rapid increase in the amount of heat generated per unit volume of electronic devices. The increasing of the integration degree of electronic circuits and the power consumption of various high-power electronic devices and the smaller and smaller size of the electronic devices or devices make the devices have higher and higher requirements on heat dissipation. If the heat generated during the operation of the components can not be timely and effectively dissipated, the working performance and the service life of the equipment can be seriously influenced. Most devices affect the working efficiency due to insufficient heat dissipation, so how to improve the heat dissipation capability of the devices has become a key factor that must be considered when designing the devices.
The flat heat pipe has the advantages of extremely high heat conductivity, excellent isothermal property, larger heat transfer area and the like, and can meet the requirements of electronic and electrical equipment on compactness, high heat dissipation efficiency and the like of a heat dissipation device, so that the flat heat pipe is widely applied to the aspects of heat dissipation of the electrical equipment, cooling of electronic devices and heat dissipation of large-scale integrated circuit boards.
The appearance of the flat heat pipe is rectangular, and comprises: evaporation cover plate, wick, condensation apron and liquid filling pipe. After the liquid working medium is evaporated, the generated gaseous working medium flows to the condensation end under the action of the air pressure difference, then the gaseous working medium is condensed at the air-liquid interface, and the heat released by condensation is transferred out by the liquid absorption core and the working medium. The condensed liquid working medium flows back to the evaporation end under the action of the capillary force of the liquid absorption core and enters the next circulation, and the flat heat pipe continuously transfers heat to the outside through the reciprocating circulation.
In a 'flat heat pipe patent' (application No. 201711070454.6), Zhaoyao et al sets the interior of a flat shell in a hollow manner, and sets several grooves distributed crosswise on the upper and lower inner surfaces of the flat shell, and there are protrusions between adjacent grooves. Under the condition of low heat flow density, the liquid working medium in the surface area of the liquid absorption core is heated and evaporated, then enters the mutually communicated channels, does not need to pass through the liquid layer, and is directly contacted with the condensing surface with lower temperature. However, under the condition of high heat flux density, the liquid working medium on the evaporation surface generates large connected gas due to boiling, the steam is difficult to penetrate through the inside of the liquid absorbing core and only overflows from a gap part between the liquid absorbing core and the side plate, when the heat flux density is high, a large number of bubbles exist on the evaporation surface to influence liquid backflow, and then the drying is caused to cause the damage of the flat heat pipe. Therefore, the new structure designed by the invention patent of the Zhaoyao et al can only realize gas-liquid separation under the condition of low heat flux density, and the heat transfer performance of the heat pipe is weakened by the flow resistance between gas phase and liquid phase under the condition of high heat flux density; wangchong et al in the patent of "a flat heat pipe and method for manufacturing the same" (application No. 201610424480.3) have improved the overall gas-liquid circulation efficiency of the heat pipe by hydrophilic and hydrophobic modification of the evaporation surface and the condensation surface, and at the same time, have effectively strengthened the mechanical strength of the flat heat pipe by processing a boss on the condensation cover plate. But the condensation heat of the flat heat pipe is transferred to the outside of the heat pipe through the heat conduction of the heat pipe wall, the part of heat is dissipated through an external heat sink, and thermal contact resistance exists between the heat sink and the flat heat pipe, so that the heat dissipation of the heat sink is weakened; the conventional flat heat pipe has two side surfaces, one side serving as an evaporation surface and the other side serving as a condensation surface, which are not replaceable in position, and therefore, the heat pipe is not suitable for cooling a double-side heat source, such as a lithium battery stack. In view of the above-mentioned problems of flat heat pipes and conventional flat heat pipes, the invention provides a heat conduction and dissipation integrated flat heat pipe.
Disclosure of Invention
The invention aims to solve the technical problem of providing a heat conduction and heat dissipation integrated flat heat pipe, which realizes gas-liquid separation and integrates heat conduction and heat dissipation, and has a more compact integral structure.
The technical scheme of the invention is as follows:
the utility model provides a dull and stereotyped heat pipe of heat conduction and heat dissipation integration, includes dull and stereotyped casing 1, imbibition core 2, condenser 5 and liquid charging pipe 13, wherein:
the upper inner surface and the lower inner surface of the flat shell 1 are provided with an array of micron-sized raised structures which are integrally wrapped outside the heat conduction and radiation integrated flat heat pipe;
the flat shell 1 is provided with a hole communicated with the interior of the flat shell, and the liquid charging pipe 13 is fixedly connected to the flat shell 1 through the hole;
the liquid absorption core 2 is of a front-back opening structure, the outer surface of the liquid absorption core is tightly attached to the inner surface of the flat plate shell 1, the upper inner surface and the lower inner surface of the liquid absorption core 2 are provided with boss structures 3 on the upper side and the lower side of an integrated structure, and the left inner surface and the right inner surface of the liquid absorption core 2 are provided with boss structures 4 on the left side and the right side;
the condenser 5 is arranged in the cavity of the liquid absorption core 2, the upper outer surface and the lower outer surface of the condenser are fin structures 11 of an integrated structure, and the fin structures 11 are in contact with the boss structures 3 on the upper side and the lower side; the condenser 5 comprises an upper cover plate 6, a liquid separation plate 7 and a lower cover plate 8, wherein the liquid separation plate 7 is positioned between the upper cover plate 6 and the lower cover plate 8, divides the condenser 5 into an upper chamber and a lower chamber which are independent, and forms a cooling working medium inlet 9 and a cooling working medium outlet 10; the liquid separation plate 7 is provided with a through hole 12 to realize the circulation of cooling working medium between the upper chamber and the lower chamber; the upper cover plate 6 and the lower cover plate 8 are consistent in structure, and a snake-shaped semi-closed channel structure is arranged at the part of the upper cover plate and the lower cover plate for circulation of cooling working media.
The flat plate shell 1 is made of a copper-based material, the inner surface of the flat plate shell is coated with a super-hydrophilic coating with a nanometer thickness, the main components of the super-hydrophilic coating are nanometer silicon oxide and nanometer titanium oxide, and the contact angle is less than 10 degrees.
The liquid absorption core 2 is a single capillary and sintered copper powder structure and has super-hydrophilic property; the main components of the material for carrying out super-hydrophilic modification on the liquid absorbing core 2 are nano silicon oxide and nano titanium oxide.
The cross sections of the boss structures 3 on the upper side and the lower side and the boss structures 4 on the left side and the right side are rectangular, trapezoidal, triangular or semicircular.
The upper surface and the lower surface of the liquid absorption core 2 are combined with the inner surface of the flat plate shell 1 in a pressing mode.
The condenser 5 is made of copper-based materials.
The surface layer of the fin structure 11 is provided with a super-hydrophobic coating, and the super-hydrophobic coating is a Teflon coating with a contact angle larger than 150 degrees.
The upper cover plate 6, the liquid separation plate 7 and the lower cover plate 8 are combined in a welding and bonding mode.
After the liquid filling pipe 13 fills the cooling working medium into the flat heat pipe, a certain area of the flat heat pipe is heated, the temperature of the heated area is increased, and the heat is immediately transferred into the flat heat pipe in a heat conduction mode. The liquid in the area corresponding to the surface of the internal evaporating plate and the area nearby is gasified (evaporated and boiled), and the generated gas working medium flows to the condenser 5 due to the air pressure difference, and is condensed in a bead shape on the surface of the condenser 5. Part of working medium at the evaporation end is converted into gas from liquid, and the condensed liquid working medium continuously flows and is supplemented to the evaporation end under the driving of capillary force of the liquid absorption core 2. The heat of the heated area is continuously transferred to the condenser 5 through gas-liquid phase change and circular flow of the cooling working medium.
The condenser 5 is communicated with the outside through a pipeline, a cooling working medium enters a working medium flow passage at the upper part of the condenser 5 through a working medium inlet 9, then flows into a working medium flow passage at the lower part through a through hole 12 of the liquid separation plate 7, and finally flows out of the condenser 5 through a working medium outlet 10. The heat emitted by the condensed steam is continuously taken away by the flowing liquid working medium, and the heat conduction and the heat dissipation of the flat heat pipe are integrated by the reciprocating circulation.
The invention has the beneficial effects that:
(1) the vapor generated at the evaporation end is directly condensed on the surface of the condenser without passing through a liquid layer, so that the gas-liquid separation in the real sense is realized;
(2) the heat emitted in the condensation process is directly taken away by the cooling working medium flowing in the condenser, and the thermal contact resistance between the flat heat pipe and the heat sink is avoided;
(3) the upper surface and the lower surface of the condenser can be contacted with steam to condense the steam, so that the heat dissipation area is obviously increased;
(4) the condenser is arranged at the cavity position of the traditional flat heat pipe, so that the support effect on the interior of the flat heat pipe is achieved while the steam is condensed, the structure is more compact, and the total volume of heat conduction and heat dissipation is reduced;
(5) the heat conduction and heat dissipation integrated flat heat pipe has no directivity, and the upper surface and the lower surface can be used as evaporation surfaces;
(6) the reflux distance of the condenser is greatly reduced, so that the wick with small capillary force can meet the requirement of condensation reflux.
Drawings
FIG. 1 is a front view of an assembly of a flat housing and wick;
FIG. 2 is SEM images of the upper and lower inner surfaces of the flat housing;
FIG. 3 is an oblique view of an assembly of a flat housing and wick;
FIG. 4(a) is a schematic diagram of a condenser structure;
FIG. 4(b) is a schematic view of the structure of the upper cover plate;
FIG. 4(c) is a schematic view of the structure of the liquid separation plate;
FIG. 4(d) is a schematic view of the structure of the lower cover plate;
FIG. 5 is a schematic diagram of a heat-conducting and heat-dissipating integrated flat heat pipe before packaging;
FIG. 6 is a schematic diagram of a heat-conducting and heat-dissipating integrated flat heat pipe after being packaged;
in the figure: 1, a flat shell; 2 a wick; 3, boss structures on the upper side and the lower side; 4, boss structures on the left side and the right side; 5, a condenser; 6, an upper cover plate; 7, a liquid separating plate; 8, a lower cover plate; 9 a cooling working medium inlet; 10 a cooling working medium outlet; 11 a ribbed structure; 12 through holes; 13 liquid filling pipe.
Detailed Description
The following further describes a specific embodiment of the present invention with reference to the drawings and technical solutions.
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. It is to be understood that such description is merely illustrative of the features and advantages of the present invention, and is not intended to limit the scope of the claims.
The invention discloses a heat conduction and heat dissipation integrated flat heat pipe, which comprises: a flat housing 1, a wick 2, a condenser 5, and a charge pipe 13.
The upper inner surface and the lower inner surface of the flat shell 1 are provided with an array of micron-sized convex structures;
the flat plate shell 1 is provided with a small hole communicated with the interior of the flat plate shell, and the liquid charging pipe 13 is fixedly connected to the flat plate shell 1 through the small hole;
the liquid absorption core 2 is tightly attached to the inner surface of the flat plate shell 1, the upper surface and the lower surface of the liquid absorption core 2 are respectively in contact with the protrusions of the upper inner surface and the lower inner surface of the flat plate shell 1, and the inner side of the liquid absorption core 2 is provided with a regular boss structure.
Condenser 5 sets up in the cavity position, and condenser 5 outside is equipped with fin structure 11, contacts with the boss structure of imbibition core 2.
Fig. 1 is a front view of an assembly of a flat plate housing and a wick, in which the inner surface of the flat plate housing 1 has an array of raised structures having a hydrophilic nature. On the basis, the modified polymer is subjected to super-hydrophilic modification. Since the super-hydrophilic modification technology has been fully developed and applied, there are many ways to modify super-hydrophilic, and this example selects the coating method. Namely, a layer of super-hydrophilic coating is coated on the inner surface of a flat plate shell, and the main components of the coating are nano silicon oxide and nano titanium oxide. And after the coating is finished, drying the coated substrate in a vacuum drying oven for 2 hours, wherein the finally obtained surface contact angle is less than 10 degrees.
The flat shell is formed by welding a flat plate with a microstructure processed on one surface, and a welding method is not particularly limited, but good sealing performance needs to be ensured. By way of example, the welding method used in the present application is brazing. The material of the flat housing is well known to those skilled in the art, and the flat housing is not limited to this application, and the material of the flat housing is a copper plate.
Fig. 2 shows an SEM image of the inner surface of the flat casing, which is magnified 100 times. The interface shape of the raised structures is approximately circular, as can be seen from the structures in the SEM pictures, with a diameter of about 80 microns. The raised structure is formed by etching, and the height of the raised portion is about 100 microns.
Fig. 3 is an oblique view of an assembly of a flat-plate shell and a wick, in which the wick 2 of the flat-plate heat pipe is contained, and the capillary structure of the wick 2 may be sintered copper powder, copper foam, a wire mesh, or a micro-channel structure. The present example employs a sintered copper powder structure as the wick 2. The wick 2 has upper and lower boss structures 3 and left and right boss structures 4, and the cross section of the boss structures may be any one of rectangular, trapezoidal, triangular, and semicircular, and in this example, a rectangular cross section is used. The boss structures on the left side, the right side, the upper side and the lower side are all contacted with a condenser 5 positioned at the cavity position. It can be seen that the boss structures 4 on the left and right sides are not continuous boss structures, but are divided into 4 sections of shorter boss structures, so that the gas flow at the upper end and the lower end is smooth. The boss structure and the liquid suction core 2 are integrated, have a single capillary structure and are formed by sintering copper powder in a graphite template at one time, so that the structure is more stable, and the mechanical strength of the flat heat pipe is effectively improved.
And soaking the sintered liquid absorption core 2 in a prepared super-hydrophilic solution (the main components of the solution are nano silicon oxide and nano titanium oxide), taking out the liquid absorption core 2 after about 1 hour of soaking, and drying in a vacuum drying oven for 2 hours to finally obtain the liquid absorption core 2 with the super-hydrophilic characteristic.
As shown in fig. 4, the condenser 5 is composed of 3 parts, including an upper cover plate 6, a liquid separation plate 7, and a lower cover plate 8. The outer sides of the upper cover plate 6 and the lower cover plate 8 are both provided with regular fin structures 11. A Teflon coating is coated on the outer surfaces of the upper cover plate 6 and the lower cover plate 8, namely the surfaces with the fin structures 11, so that the surfaces of the fin structures 11 have super-hydrophobic characteristics, and after the surfaces are dried, the contact angle of the surfaces is measured to be larger than 150 degrees.
The upper cover plate 6 and the lower cover plate 8 have on the inside a semi-closed channel structure through which a cooling medium flows, which channel structure is in this example machined by milling. The semi-closed channel and the liquid separation plate 7 jointly form a closed working medium flow channel, and the upper working medium flow channel and the lower working medium flow channel are communicated through a through hole 12 in the liquid separation plate 7. The cooling working medium flows through the flow channel formed by the upper cover plate 6 and the liquid separation plate 7 and enters the flow channel formed by the liquid separation plate 7 and the lower cover plate 8 through the through hole 12 of the liquid separation plate 7. The shape of the through hole of the liquid separation plate 7 may be rectangular or circular, and is preferably rectangular in this example. The upper cover plate 6, the liquid separation plate 7, and the lower cover plate 8 are joined by welding or bonding, and the method of welding or bonding is not particularly limited, but it is necessary to ensure good sealability. In the present application, welding is used as an example, and in order to ensure good sealing performance and sufficient mechanical strength, the welding is brazing.
Fig. 5 is a schematic diagram of the heat-conducting and heat-dissipating integrated flat heat pipe before packaging, and it can be seen that the outer surface of the wick 2 is tightly attached to the inner surface of the shell, and the wick 2 can be attached to the shell in a pressing manner. In the present example, the wick 2 is a sintered copper powder structure, and the copper powder is directly sintered on the inner surface of the flat plate housing 1 without being bonded by pressing. The inner surface of the wick 2 is in compression fit with the fin structure 11 of the condenser 5.
Fig. 6 is a schematic diagram of a heat-conducting and heat-dissipating integrated flat heat pipe after being packaged. The application the dull and stereotyped casing 1 outside is provided with the through-hole, liquid charging pipe 13 set up in the through-hole, realized the inside and outside evacuation of dull and stereotyped heat pipe and the topping up process of liquid through liquid charging pipe 13. It can be seen that the cooling medium inlet 9 and the cooling medium outlet 10 are in communication with the outside for the inflow and outflow of the cooling medium, so that the interior of the condenser 5 is not evacuated, but the enclosed space formed between the outer surface of the condenser 5 and the inner surface of the flat shell is evacuated.
So far, examples of the present disclosure have been described in detail with reference to the accompanying drawings. It is to be understood that the implementations not described or depicted in the text of the description or drawings are well known to those of ordinary skill in the art and are not described in detail. Furthermore, the above description is not intended to limit the definition of the elements and methods to the particular structures, shapes and forms shown in the examples, which may be modified or substituted simply by those skilled in the art.
From the above description, those skilled in the art should clearly recognize that the present disclosure is based on a heat conduction and dissipation integrated flat heat pipe.
In conclusion, the heat conduction and heat dissipation integrated flat heat pipe is provided based on the heat conduction and heat dissipation, a condenser is designed at the cavity position of the traditional flat heat pipe to replace a condensation surface, steam generated at an evaporation end can be directly condensed on the surface of the condenser, and heat released by condensation is directly taken away by a cooling working medium inside the condenser, so that the heat conduction and heat dissipation integration of the flat heat pipe is realized, the structure is compact, the mechanical strength is increased, and meanwhile, the heat dissipation capacity of the flat heat pipe is remarkably improved.
It should also be noted that the terms with respect to directions, such as "upper", "lower", "left", "right", etc., mentioned in the examples, refer to the directions of the drawings only, and do not limit the scope of the present disclosure. And the sizes and shapes of the respective elements in the drawings do not reflect the actual sizes and proportions, but merely represent the contents of the present examples.
The technical solutions and advantages of the present disclosure have been described in detail with reference to the specific examples, and it should be understood that the above description is only exemplary of the present disclosure, and is not intended to limit the present disclosure. Any modification, improvement or equivalent replacement made on the principle and spirit of the present disclosure is within the protection scope of the present disclosure.
Claims (10)
1. The utility model provides a dull and stereotyped heat pipe of heat conduction and heat dissipation integration, its characterized in that, this heat conduction and heat dissipation integration dull and stereotyped heat pipe includes dull and stereotyped casing (1), imbibition core (2), condenser (5) and liquid charging pipe (13), wherein:
the upper inner surface and the lower inner surface of the flat shell (1) are provided with an array of micron-sized protruding structures, and the protruding structures are integrally wrapped outside the heat conduction and radiation integrated flat heat pipe;
the flat shell (1) is provided with a hole communicated with the interior of the flat shell, and the liquid filling pipe (13) is fixedly connected to the flat shell (1) through the hole;
the liquid absorption core (2) is of a front-back opening structure, the outer surface of the liquid absorption core is tightly attached to the inner surface of the flat plate shell (1), the upper inner surface and the lower inner surface of the liquid absorption core (2) are provided with boss structures (3) of the upper side and the lower side of an integrated structure, and the left inner surface and the right inner surface of the liquid absorption core (2) are provided with boss structures (4) of the left side and the right;
the condenser (5) is arranged in the cavity of the liquid absorption core (2), the upper outer surface and the lower outer surface of the condenser are fin structures (11) of an integrated structure, and the fin structures (11) are in contact with the boss structures (3) on the upper side and the lower side; the condenser (5) comprises an upper cover plate (6), a liquid separation plate (7) and a lower cover plate (8), wherein the liquid separation plate (7) is positioned between the upper cover plate (6) and the lower cover plate (8), the condenser (5) is divided into an upper chamber and a lower chamber which are independent, and a cooling working medium inlet (9) and a cooling working medium outlet (10) are formed; a through hole (12) is formed in the liquid separating plate (7) to realize the circulation of cooling working media between the upper chamber and the lower chamber; the upper cover plate (6) and the lower cover plate (8) are consistent in structure, and a snake-shaped semi-closed channel structure is arranged at the part of the upper cover plate and the lower cover plate for circulation of cooling working media.
2. The heat conduction and dissipation integrated flat heat pipe according to claim 1, wherein the flat housing (1) is made of a copper-based material, the inner surface of the flat housing is coated with a nano-thickness super-hydrophilic coating, the super-hydrophilic coating mainly comprises nano-silica and nano-titania, and the contact angle is less than 10 degrees.
3. The heat conduction and dissipation integrated flat heat pipe as claimed in claim 1 or 2, wherein the wick (2) is a single capillary, sintered copper powder structure having super-hydrophilic characteristics; the main components of the material for carrying out super-hydrophilic modification on the imbibing core (2) are nano silicon oxide and nano titanium oxide.
4. The heat conduction and dissipation integrated flat heat pipe according to claim 1 or 2, wherein the cross-sections of the upper and lower side boss structures (3) and the left and right side boss structures (4) are rectangular, trapezoidal, triangular or semicircular.
5. A heat conduction and dissipation integrated flat heat pipe according to claim 3, wherein the cross-section of the upper and lower side boss structures (3) and the left and right side boss structures (4) is rectangular, trapezoidal, triangular or semicircular.
6. The heat conduction and dissipation integrated flat heat pipe according to claim 1, 2 or 5, wherein the surface layer of the fin structure (11) has a super-hydrophobic coating, and the super-hydrophobic coating is a teflon coating with a contact angle greater than 150 degrees.
7. The heat conduction and dissipation integrated flat heat pipe according to claim 3, wherein the surface layer of the fin structure (11) has a super-hydrophobic coating, and the super-hydrophobic coating is a Teflon coating with a contact angle greater than 150 degrees.
8. The heat conduction and dissipation integrated flat heat pipe according to claim 4, wherein the surface layer of the fin structure (11) has a super-hydrophobic coating, and the super-hydrophobic coating is a Teflon coating with a contact angle greater than 150 degrees.
9. The heat conduction and dissipation integrated flat heat pipe according to claim 1, 2, 5, 7 or 8, wherein the condenser (5) is made of copper-based material.
10. The heat conduction and dissipation integrated flat plate heat pipe as claimed in claim 6, wherein the condenser (5) is made of copper-based material.
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| CN201911200535.2A CN110763062A (en) | 2019-11-29 | 2019-11-29 | Heat conduction and heat dissipation integrated flat heat pipe |
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| CN201911200535.2A CN110763062A (en) | 2019-11-29 | 2019-11-29 | Heat conduction and heat dissipation integrated flat heat pipe |
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| CN110763062A true CN110763062A (en) | 2020-02-07 |
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| CN115412649A (en) * | 2022-08-16 | 2022-11-29 | 常州大学 | Heat pipe type cooling system for fax machine |
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