TWI773889B - 用以提高聚醯亞胺膜的接著性的聚醯亞胺前驅物組成物、由上述聚醯亞胺前驅物組成物製備的聚醯亞胺膜及其製備方法以及包括此聚醯亞胺膜的電子裝置 - Google Patents

用以提高聚醯亞胺膜的接著性的聚醯亞胺前驅物組成物、由上述聚醯亞胺前驅物組成物製備的聚醯亞胺膜及其製備方法以及包括此聚醯亞胺膜的電子裝置 Download PDF

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TWI773889B
TWI773889B TW108111105A TW108111105A TWI773889B TW I773889 B TWI773889 B TW I773889B TW 108111105 A TW108111105 A TW 108111105A TW 108111105 A TW108111105 A TW 108111105A TW I773889 B TWI773889 B TW I773889B
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group
polyimide
precursor composition
polyimide precursor
polyimide film
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TW108111105A
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Chinese (zh)
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TW202017972A (zh
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黃仁煥
李翼祥
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南韓商聚酰亞胺先端材料有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW108111105A 2018-10-31 2019-03-29 用以提高聚醯亞胺膜的接著性的聚醯亞胺前驅物組成物、由上述聚醯亞胺前驅物組成物製備的聚醯亞胺膜及其製備方法以及包括此聚醯亞胺膜的電子裝置 TWI773889B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0131727 2018-10-31
KR1020180131727A KR102004659B1 (ko) 2018-10-31 2018-10-31 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름

Publications (2)

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TW202017972A TW202017972A (zh) 2020-05-16
TWI773889B true TWI773889B (zh) 2022-08-11

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TW108111105A TWI773889B (zh) 2018-10-31 2019-03-29 用以提高聚醯亞胺膜的接著性的聚醯亞胺前驅物組成物、由上述聚醯亞胺前驅物組成物製備的聚醯亞胺膜及其製備方法以及包括此聚醯亞胺膜的電子裝置

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KR (1) KR102004659B1 (ko)
TW (1) TWI773889B (ko)
WO (2) WO2020091146A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102004659B1 (ko) * 2018-10-31 2019-10-01 에스케이씨코오롱피아이 주식회사 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름
JP2024521539A (ja) * 2021-06-07 2024-05-31 デュポン エレクトロニクス インコーポレイテッド 電子デバイスで使用するためのポリマー
CN117203264A (zh) * 2022-04-08 2023-12-08 杰富意化学株式会社 聚酰亚胺前体组合物及聚酰亚胺
CN114805806B (zh) * 2022-05-10 2024-04-02 上海华谊三爱富新材料有限公司 降低聚酰胺酸溶液粘度的方法和聚酰亚胺膜的制备方法
CN114920931A (zh) * 2022-05-27 2022-08-19 中化学科学技术研究有限公司 聚酰亚胺前体组合物、聚酰亚胺膜及其制备方法
CN116730631A (zh) * 2022-05-27 2023-09-12 中化学科学技术研究有限公司 聚酰亚胺层叠体及其制备方法
CN115505125B (zh) * 2022-10-31 2023-08-29 杭州福斯特电子材料有限公司 聚酰亚胺组合物、聚合物、薄膜及包含其的产品
KR20240107470A (ko) * 2022-12-30 2024-07-09 피아이첨단소재 주식회사 폴리이미드 전구체

Citations (3)

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CN102056975A (zh) * 2008-06-09 2011-05-11 株式会社Adeka 磷酸酯系阻燃剂的固体化方法
CN102197091A (zh) * 2008-10-31 2011-09-21 宇部兴产株式会社 聚酰亚胺前体溶液组合物
TW201518409A (zh) * 2013-08-06 2015-05-16 Mitsubishi Gas Chemical Co 聚醯亞胺樹脂組成物及聚醯亞胺樹脂－纖維複合材

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JPS54133934A (en) * 1978-04-05 1979-10-18 Sankyo Co Coinnoperated game machine
US7579134B2 (en) * 2005-03-15 2009-08-25 E. I. Dupont De Nemours And Company Polyimide composite coverlays and methods and compositions relating thereto
KR101503189B1 (ko) * 2011-07-08 2015-03-16 미쓰이 가가쿠 가부시키가이샤 폴리이미드 수지 조성물 및 그것을 포함하는 적층체
WO2015125895A1 (ja) * 2014-02-21 2015-08-27 三菱化学株式会社 ポリイミド前駆体及び／又はポリイミドを含む組成物、並びにポリイミドフィルム
KR102041595B1 (ko) * 2016-12-30 2019-11-06 롯데첨단소재(주) 내열성 및 절연성이 우수한 수지 조성물 및 이로부터 제조된 성형품
KR102004659B1 (ko) * 2018-10-31 2019-10-01 에스케이씨코오롱피아이 주식회사 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102056975A (zh) * 2008-06-09 2011-05-11 株式会社Adeka 磷酸酯系阻燃剂的固体化方法
CN102197091A (zh) * 2008-10-31 2011-09-21 宇部兴产株式会社 聚酰亚胺前体溶液组合物
TW201518409A (zh) * 2013-08-06 2015-05-16 Mitsubishi Gas Chemical Co 聚醯亞胺樹脂組成物及聚醯亞胺樹脂－纖維複合材

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WO2020091432A1 (ko) 2020-05-07
WO2020091146A1 (ko) 2020-05-07
KR102004659B1 (ko) 2019-10-01
TW202017972A (zh) 2020-05-16

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