TWI772750B - Mask temperature control device and mask exposure device - Google Patents
Mask temperature control device and mask exposure device Download PDFInfo
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- TWI772750B TWI772750B TW109105198A TW109105198A TWI772750B TW I772750 B TWI772750 B TW I772750B TW 109105198 A TW109105198 A TW 109105198A TW 109105198 A TW109105198 A TW 109105198A TW I772750 B TWI772750 B TW I772750B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Electron Beam Exposure (AREA)
- Control Of Temperature (AREA)
Abstract
本發明提供一種光罩溫度控制裝置及光罩曝光裝置。此光罩溫度控制裝置包含：氣體溫控單元、氣體輸送單元及光罩存放單元；前述氣體輸送單元用於向前述光罩存放單元輸送氣浴氣體，前述氣體溫控單元用於將前述氣體輸送單元傳輸至前述光罩存放單元的氣浴氣體的溫度調節至預設溫度閾值範圍；其中，前述光罩存放單元包含版架主體及隔板，前述隔板固定在前述版架主體內，相鄰兩個前述隔板中間形成容納空間，前述容納空間用於放置光罩。 The invention provides a mask temperature control device and a mask exposure device. The mask temperature control device includes: a gas temperature control unit, a gas delivery unit and a mask storage unit; the gas delivery unit is used to deliver the gas bath gas to the mask storage unit, and the gas temperature control unit is used to deliver the gas The temperature of the gas bath gas transmitted from the unit to the above-mentioned photomask storage unit is adjusted to a preset temperature threshold range; wherein, the above-mentioned photomask storage unit includes a plate frame main body and a partition plate, and the above-mentioned partition plate is fixed in the above-mentioned plate frame main body, adjacent to the plate frame body. A accommodating space is formed between the two aforesaid partitions, and the foregoing accommodating space is used for placing a photomask.
Description
本發明實施例關於光刻設備技術領域，例如關於一種光罩溫度控制裝置及光罩曝光裝置。 Embodiments of the present invention relate to the technical field of lithography equipment, for example, to a mask temperature control device and a mask exposure device.
隨著半導體技術的發展，以及高科技設備朝著小巧、精緻以及複雜的方向發展，對積體電路的線寬提出更高的要求，據此，要求光刻機需要更高的套刻解析度，而光刻機的套刻解析度受到機械、光學、溫度以及潔淨度等因素的影響，上述因素的微小變化都有可能影響光刻機的套刻解析度。 With the development of semiconductor technology and the development of high-tech equipment in the direction of compactness, refinement and complexity, higher requirements are placed on the line width of integrated circuits. Accordingly, higher overlay resolution is required for lithography machines. , and the overlay resolution of the lithography machine is affected by factors such as mechanics, optics, temperature, and cleanliness. Small changes in the above factors may affect the overlay resolution of the lithography machine.
光刻機的整機結構中，光罩傳輸模組為光刻機內部實現光罩由光罩存放單元轉接至光罩單元的唯一模組，其上版的溫度精度直接影響套刻解析度，因此，在光罩傳輸區域設置光罩溫控單元以保證上版的溫度尤為重要。但是，光罩材質通常為低膨脹石英玻璃，低膨脹石英玻璃的導熱換熱效率較低，導致光罩溫度控制較為困難。 In the overall structure of the lithography machine, the mask transfer module is the only module inside the lithography machine that realizes the transfer of the mask from the mask storage unit to the mask unit. The temperature accuracy of the upper plate directly affects the overlay resolution. Therefore, it is particularly important to set a mask temperature control unit in the mask transmission area to ensure the temperature of the upper plate. However, the material of the reticle is usually low-expansion quartz glass, and the low-expansion quartz glass has low thermal conductivity and heat transfer efficiency, which makes it difficult to control the temperature of the reticle.
本發明提供一種光罩溫度控制裝置及光罩曝光裝置，以降低光罩溫度控制難度。 The invention provides a photomask temperature control device and a photomask exposure device to reduce the difficulty of photomask temperature control.
本發明實施例提出一種光罩溫度控制裝置，該光罩溫度控制裝置包含：氣體溫控單元、氣體輸送單元及光罩存放單元； An embodiment of the present invention provides a mask temperature control device, the mask temperature control device includes: a gas temperature control unit, a gas conveying unit, and a mask storage unit;
前述氣體輸送單元用於向前述光罩存放單元輸送氣浴氣體，前述氣體溫控單元用於將前述氣體輸送單元傳輸至前述光罩存放單元的氣浴氣體的溫度調節至預設溫度閾值範圍內； The aforementioned gas delivery unit is used to deliver the gas bath gas to the aforementioned reticle storage unit, and the aforementioned gas temperature control unit is used to adjust the temperature of the gas bath gas delivered from the aforementioned gas delivery unit to the aforementioned reticle storage unit within a preset temperature threshold range ;
其中，前述光罩存放單元包含版架主體及隔板，前述隔板固定在前述版架主體內，相鄰兩個前述隔板中間形成容納空間，前述容納空間用於放置光罩。 Wherein, the photomask storage unit includes a main body of a plate frame and a partition, the partition plate is fixed in the main body of the plate frame, and a accommodating space is formed between two adjacent partition plates, and the above-mentioned accommodating space is used for placing the photomask.
本發明實施例進一步提供一種光罩曝光裝置，該光罩曝光裝置包含上述任一種光罩溫度控制裝置。 Embodiments of the present invention further provide a mask exposure device, which includes any one of the above-mentioned mask temperature control devices.
本發明實施例提供的光罩溫度控制裝置可藉由隔板將版架主體內的空間分為多層，實現光罩存放單元中各容納空間的分層隔離設計，有利於氣浴氣體層流通過光罩，從而有利於提高光罩控溫裝置的溫度穩定效率，有利於降低光罩溫度控制難度。 The mask temperature control device provided by the embodiment of the present invention can divide the space in the main body of the plate frame into multiple layers by means of the partition plate, so as to realize the layered isolation design of each accommodation space in the mask storage unit, which is beneficial to the laminar flow of the gas bath gas. The photomask is beneficial to improve the temperature stabilization efficiency of the photomask temperature control device, and is beneficial to reduce the difficulty of temperature control of the photomask.
10:光罩溫度控制裝置 10: Mask temperature control device
20:光罩 20: Photomask
110:氣體輸送單元 110: Gas delivery unit
111:氣體傳輸管路 111: Gas transmission line
112:濾布 112: filter cloth
113:轉換接頭 113: Adapter
120:氣體溫控單元 120: Gas temperature control unit
121:冷卻水入口 121: Cooling water inlet
122:冷卻水出口 122: Cooling water outlet
123:進水管路 123: Water inlet pipeline
124:出水管路 124: Water outlet pipeline
130:光罩存放單元 130: Reticle storage unit
131:版架主體 131: Frame main body
132:隔板 132: Separator
133:光罩支撐件 133: Photomask support
140:溫度感測器 140: temperature sensor
150:壓力流量調節單元 150: Pressure flow adjustment unit
151:調壓閥 151: Pressure regulating valve
152:節流閥 152: Throttle valve
160:漏液檢測感測器 160: Leak detection sensor
170:壓力感測器 170: Pressure Sensor
180:氣浴氣體採樣介面 180: Air bath gas sampling interface
1111:進氣口 1111: Air intake
1112:出氣口 1112: Air outlet
1113:主管路 1113: Main Road
1114:支管路 1114: Branch pipeline
1311:輔助固定平臺 1311: Auxiliary fixed platform
1321:固定點 1321: Fixed point
1331:連接件 1331: Connector
1332:圓柱支撐體 1332: Cylindrical Support
13311:第一端 13311: First end
13312:第二端 13312: Second end
【圖1】係本發明實施例提供的一種光罩溫度控制裝置的結構示意圖。 [FIG. 1] is a schematic structural diagram of a mask temperature control device provided by an embodiment of the present invention.
【圖2】係本發明實施例提供的另一種光罩溫度控制裝置的結構示意圖。 FIG. 2 is a schematic structural diagram of another mask temperature control device provided by an embodiment of the present invention.
【圖3】係本發明實施例提供的又一種光罩溫度控制裝置的光罩存放單元的結構示意圖。 3 is a schematic structural diagram of a photomask storage unit of another photomask temperature control device provided by an embodiment of the present invention.
【圖4】係圖3中隔板的結構示意圖。 [FIG. 4] It is a schematic diagram of the structure of the separator in FIG. 3. [FIG.
【圖5】係本發明實施例提供的又一種光罩溫度控制裝置的結構示意圖。 FIG. 5 is a schematic structural diagram of another photomask temperature control device provided by an embodiment of the present invention.
【圖6】係圖5中壓力流量調節單元的結構示意圖。 [FIG. 6] is a schematic structural diagram of the pressure-flow adjustment unit in FIG. 5. [FIG.
【圖7】係圖5中氣體輸送單元的局部結構示意圖。 [FIG. 7] It is a partial structural schematic diagram of the gas delivery unit in FIG. 5. [FIG.
【圖8】係圖5中光罩溫度控制裝置的工作原理圖。 [Fig. 8] It is a working principle diagram of the temperature control device of the photomask in Fig. 5. [Fig.
【圖9】係圖5提供的光罩溫度控制裝置的氣浴流場分佈模擬結果圖。 [FIG. 9] It is a simulation result diagram of the air bath flow field distribution of the mask temperature control device provided in FIG. 5. [FIG.
以下結合所添附之圖式及實施例對本發明作進一步的詳細說明。圖1係本發明實施例提供的一種光罩溫度控制裝置的結構示意圖。參照圖1，該光罩溫度控制裝置10包含：氣體輸送單元110、氣體溫控單元120及光罩存放單元130；氣體輸送單元110用於向光罩存放單元130輸送氣浴氣體，氣體溫控單元120用於將氣體輸送單元110傳輸至光罩存
放單元130的氣浴氣體的溫度調節至預設溫度閾值範圍內的數值。光罩存放單元130包含版架主體131及隔板132，隔板132固定在版架主體131內，相鄰兩個隔板132中間形成容納空間，容納空間用於放置光罩。
The present invention will be further described in detail below in conjunction with the attached drawings and embodiments. FIG. 1 is a schematic structural diagram of a mask temperature control device provided by an embodiment of the present invention. Referring to FIG. 1 , the mask
氣體輸送單元110將氣浴氣體由氣體供給端傳輸至光罩存放單元130，氣浴氣體在氣體輸送單元110中傳輸的過程中，氣體溫控單元120調節氣浴氣體的溫度並將氣浴氣體的溫度穩定至預設溫度閾值範圍內，該穩定溫度的氣浴氣體被輸送至光罩存放單元130。
The
示例性地，預設溫度閾值範圍與光罩的溫度範圍相對應，光罩的溫度範圍可為基準溫度±允許誤差溫度。基準溫度為光罩的理想溫度值，光罩的溫度達到該基準溫度時，可上版。允許誤差溫度為在理想溫度值附近，光罩溫度可波動的範圍，在允許誤差溫度範圍內亦可上版；該情況下光罩溫度，對後續曝光工藝的影響在產品品質監控可接受的範圍內。 Exemplarily, the preset temperature threshold range corresponds to the temperature range of the reticle, and the temperature range of the reticle may be the reference temperature ± the allowable error temperature. The reference temperature is the ideal temperature value of the photomask. When the temperature of the photomask reaches the reference temperature, the plate can be loaded. The allowable error temperature is the range in which the temperature of the mask can fluctuate around the ideal temperature value, and the plate can also be printed within the allowable error temperature range; in this case, the impact of the mask temperature on the subsequent exposure process is within the acceptable range for product quality monitoring Inside.
示例性地，光罩的溫度範圍可為22±0.1℃時，光罩存放單元130周邊自然環境溫度亦會對光罩的溫度有影響，使得光罩的溫度波動範圍大於預設溫度閾值範圍的溫度波動範圍，因此，預設溫度閾值範圍的允許誤差溫度可設置為小於±0.05℃，即預設溫度閾值範圍為22±0.05℃。
Exemplarily, when the temperature range of the reticle can be 22±0.1°C, the ambient temperature of the
如此，可藉由將氣浴氣體吹到光罩表面，藉由換熱方式，使光罩的溫度穩定在22±0.1℃。 In this way, the temperature of the photomask can be stabilized at 22±0.1°C by means of heat exchange by blowing the gas bath gas onto the surface of the photomask.
需要說明的係，預設溫度閾值範圍的取值可根據光罩溫度控制裝置的實際需求設置，本發明實施例對此不作限定。 It should be noted that the value of the preset temperature threshold range may be set according to the actual requirements of the mask temperature control device, which is not limited in the embodiment of the present invention.
光罩存放單元130包含版架主體131及隔板132，藉由隔
板132可將版架主體131所包圍的空間相互隔開而形成多個容納空間，每個容納空間又可稱為一個光罩槽。因此，光罩存放單元130中，光罩槽採用隔板132相互隔離，可防止沒有放置光罩的光罩槽因氣阻降低造成氣流紊亂，有利於提高氣浴氣體的流動穩定性，從而有利於提高氣浴氣體與光罩的換熱過程的穩定性，有利於降低光罩溫度控制的難度；進而，有利於提高光刻機中光罩上版時間，有利於提高光刻產率。
The
需要說明的係，圖1中利用箭頭方向示出氣體輸送單元110中的氣浴氣體流向。圖1中僅示例性地示出光罩存放單元130的數量為兩個，每個光罩存放單元130中的隔板132的數量為7個，但並非對本發明實施例提供的光罩溫度控制裝置10的限定。在其他實施方式中，可根據光罩溫度控制裝置10的實際需求，設置光罩存放單元130的數量以及光罩存放單元130中的隔板132的數量，本發明實施例對此不作限定。
In addition, in FIG. 1, the flow direction of the gas bath gas in the
選擇性地，圖2係本發明實施例提供的另一種光罩溫度控制裝置的結構示意圖。結合圖1至圖2，光罩存放單元130進一步包含光罩支撐件133；每個隔板132的承載光罩的一面分別設置多個光罩支撐件133；光罩支撐件133用於支撐放置於容納空間中的光罩，以及用於固定隔板132。
Optionally, FIG. 2 is a schematic structural diagram of another mask temperature control device provided by an embodiment of the present invention. 1 to 2 , the
如此設置，可僅藉由對光罩支撐件133的立體形狀的設置，使得光罩支撐件133不僅能支撐放置於容納空間中的光罩，進一步能固定隔板132；從而可無需額外設置固定隔板132的機構，因此無需額外預留空間以設置固定隔板132的機構，可簡化光罩存放單元130的內部結構，有利於降低隔板132的固定難度，有利於降低光罩存放單元130的設
計及組裝難度，從而有利於降低光罩溫度控制裝置10整體的設計難度，有利於簡化其結構。
With this arrangement, only by setting the three-dimensional shape of the
選擇性地，圖3係本發明實施例提供的又一種光罩溫度控制裝置的光罩存放單元的結構示意圖。如圖3所示，光罩支撐件133包含連接件1331及圓柱支撐體1332；版架主體131包含輔助固定平臺1311；連接件1331的第一端13311與前述輔助固定平臺1311固定連接，連接件1331的第二端13312與輔助固定平臺1311的檯面之間設置有固定間隙，該固定間隙用於固定隔板132；圓柱支撐體1332的一端設置於連接件1331的背離輔助固定平臺1311的一側，圓柱支撐體1332的另一端用於支撐光罩20。
Optionally, FIG. 3 is a schematic structural diagram of a photomask storage unit of another photomask temperature control device provided by an embodiment of the present invention. As shown in FIG. 3 , the
示例性地，以版架主體131的殼體部分為長方體為例，該版架主體131包含底面、頂面以及側面；側面為氣浴氣體吹入的面，氣浴氣體進入光罩存放單元130後的流動方向平行於底面及頂面。輔助固定平臺1311的延伸方向平行於版架主體131的底面及頂面，每個輔助固定平臺1311靠近頂面的一側均可設置立柱，該立柱可用於支撐連接件1331，立柱的形狀及分佈方式可根據光罩溫度控制裝置的實際需求設置，本發明實施例對此不作限定。
Exemplarily, taking the housing part of the plate holder
示例性地，輔助固定平臺1311與版架主體131的殼體部分可採用相同的材料一體成型，如此，有利於減少光罩存放單元130製作的工藝步驟，有利於簡化光罩溫度控制裝置的製備工藝。
Exemplarily, the auxiliary fixing platform 1311 and the housing part of the plate frame
示例性地，圓柱支撐體1332亦包含相對的底面及頂面，以及連接於底面及頂面之間的側面，圓柱支撐體1332的底面、頂面、版架
主體131的殼體部分的底面及頂面均平行設置，據此，一方面有利於氣浴氣體在光罩存放單元130中流經光罩時為層流，有利於增大溫度穩定的氣浴氣體與光罩20的接觸面積，從而有利於提高氣浴氣體與光罩20的換熱效率，有利於降低控溫難度，提高控溫精度；另一方面，利用圓柱支撐體1332的頂面支撐光罩，有利於減小光罩20與圓柱支撐體1332的接觸面積，從而有利於提高光罩20的溫度均勻性，同時，圓柱支撐體1332的頂面為平面，利用該平面對光罩20進行支撐，有利於使得光罩20與光罩支撐件133接觸部分的受力均勻，從而有利於避免光罩20受損。
Exemplarily, the
示例性地，光罩支撐件133中的連接件1331與圓柱支撐體1332亦可採用相同的材料一體成型，如此，有利於減少光罩支撐件133製作的工藝步驟，有利於簡化光罩溫度控制裝置的製備工藝。
Exemplarily, the connecting
首先，需要說明的係，圖2中僅示例性地示出隔板132的數量為5個，圖3中僅示例性地示出隔板132的數量為3個，但均不構成對本發明實施例提供的光罩溫度控制裝置的限定。在其他實施方式中，可根據光罩溫度控制裝置的實際需求，設置光罩存放單元130中的隔板132的數量，本發明實施例對此不作限定。
First of all, it should be noted that FIG. 2 only exemplarily shows that the number of
其次，需要說明的係，圖2及圖3中僅示例性地示出光罩溫度控制裝置中的光罩存放單元130的一側面結構，僅為了示出光罩存放單元130中的隔板132與光罩支撐件133的相對位置關係；其中，光罩支撐件133的形狀可根據溫度控制裝置的實際需求設置，可滿足同時起到支撐光罩20及固定隔板132的作用即可。
Next, it should be noted that FIG. 2 and FIG. 3 only exemplarily show a side structure of the
選擇性地，圖4係圖3中隔板的結構示意圖，圖3及圖4
中分別示出隔板的側面結構及平面結構。參照圖3及圖4，隔板132為直板結構；隔板132的邊側被連接件1331的第二端13312與輔助固定平臺1311的檯面之間的固定間隙夾緊固定。
Optionally, FIG. 4 is a schematic diagram of the structure of the separator in FIG. 3 , FIG. 3 and FIG. 4
The side structure and the plane structure of the separator are shown in Fig. 3 and 4 , the
隔板132為直板結構，氣浴氣體在流經光罩時可形成層流，有利於增大換熱面積，使得換熱效率較高；有利於與降低光罩溫度控制難度，以及有利於減少光罩溫度穩定所用的時間，有利於提高上版效率。
The
利用輔助固定平臺1311與連接件1331之間形成的固定間隙將隔板132夾緊固定，一方面，可增加隔板132的穩固性，從而有利於增加光罩20控溫過程中的氣浴氣體的流動穩定性，有利於降低光罩20的控溫難度；另一方面，相比於直接利用螺釘固定光罩20的結構而言，由於不增加額外的隔板固定結構，進一步可避免為該結構預留空間而增加光罩存放單元的設計難度，從而有利於降低光罩溫度控制裝置的整體設計及製作難度。
The
示例性地，光罩20的支撐點與隔板132的固定點對應設置。光罩採用四個點支撐，最大限度的增加氣浴氣體與光罩的換熱面積，在實現相同的溫度時，有效地縮短換熱時間。
Exemplarily, the supporting point of the
示例性地，隔板132為金屬隔板，其厚度為0.8mm。
Illustratively, the
需要說明的係，圖4中僅示例性地示出固定點1321為4個，且位於隔板132的相對的兩邊緣，但並不構成對本發明實施例提供的光罩溫度控制裝置的限定。在其他實施方式中，進一步可根據光罩溫度控制裝置的實際需求，設置固定位置，示例性地，可藉由設置連接件1331
及輔助固定平臺1311的形狀，將固定間隙設置為條狀，並利用該條狀的固定間隙固定隔板132相對的兩側邊；在此基礎上，光罩支撐件133可藉由兩條窄條凸起支撐光罩20，本發明實施例對隔板固定方式及光罩支撐方式均不限定。
It should be noted that, FIG. 4 only exemplarily shows that there are four fixed points 1321 and are located at two opposite edges of the
圖5係本發明實施例提供的又一種光罩溫度控制裝置的結構示意圖。參照圖5，氣體溫控單元120包含熱交換器，熱交換器設置於氣體輸送單元110的傳輸路徑中；熱交換器用於將氣體輸送單元110所傳輸的氣浴氣體的溫度穩定至預設溫度閾值範圍。
FIG. 5 is a schematic structural diagram of another photomask temperature control device provided by an embodiment of the present invention. Referring to FIG. 5 , the gas
熱交換器中可通入高溫度精度的循環冷卻水(溫度為22℃)，當氣浴氣體接入到熱交換器時，氣浴氣體會與高溫度精度循環冷卻水進行換熱，實現氣浴氣體的溫度穩定性，提高氣浴氣體的溫度精度。示例性地，氣體溫控單元120入口處(即進氣口)的氣浴氣體的溫度為22±0.1℃，在熱交換器換熱之後，氣浴氣體的溫度換熱到22±0.05℃。 High temperature precision circulating cooling water (22°C) can be introduced into the heat exchanger. When the gas bath gas is connected to the heat exchanger, the gas bath gas will exchange heat with the high temperature precision circulating cooling water to realize the gas bath. The temperature stability of the bath gas improves the temperature accuracy of the gas bath gas. Exemplarily, the temperature of the gas bath gas at the inlet of the gas temperature control unit 120 (ie, the air inlet) is 22±0.1°C, and after the heat exchange by the heat exchanger, the temperature of the gas bath gas is exchanged to 22±0.05°C.
需要說明的係，可根據光罩溫度控制裝置的實際需求，示例性地，根據循環冷卻水及氣浴氣體的流量、壓力、溫度等指標計算選取滿足換熱需求的熱交換器，以具備本技術手段下正常工況所需的製冷量，本發明實施例對熱交換器的具體型號及規格並不限定。此外，熱交換器為高純熱交換器，以確保氣浴氣體不被污染，從而確保氣浴氣體的潔淨度不被破壞。 It should be noted that, according to the actual needs of the mask temperature control device, exemplarily, according to the flow rate, pressure, temperature and other indicators of the circulating cooling water and the gas bath gas, the heat exchanger that meets the heat exchange needs can be calculated and selected, so as to have this heat exchanger. The cooling capacity required under normal working conditions under the technical means does not limit the specific model and specification of the heat exchanger in the embodiments of the present invention. In addition, the heat exchanger is a high-purity heat exchanger to ensure that the gas bath gas is not contaminated, thereby ensuring that the cleanliness of the gas bath gas is not damaged.
繼續參照圖5，該光罩溫度控制裝置10進一步包含溫度感測器140；溫度感測器140設置於以下至少之一的位置：位於氣體輸送單元110中，且位於氣體溫控單元120與氣體輸送單元110的出氣口1112之
間；位於光罩存放單元130中。
Continuing to refer to FIG. 5 , the mask
溫度感測器140用於監測氣浴氣體經過熱交換器之後的溫度。如此，有利於確保進入光罩存放單元130中的氣浴氣體的溫度穩定性。
The
需要說明的係，圖5中僅示例性地示出溫度感測器140的數量為1個，且設置於光罩存放單元130中，以檢測氣浴氣體進入光罩存放單元130後的溫度，亦可理解為檢測進風溫度；但並不構成對本發明實施例提供的光罩溫度控制裝置的限定。在其他實施方式中，溫度感測器140的數量進一步可為2個或更多個，可設置於氣體溫控單元120與氣體輸送單元110的出氣口1112之間，本發明實施例對此不作限定。
It should be noted that FIG. 5 only exemplarily shows that the number of
熱交換器為管殼式熱交換器；管殼式熱交換器中流通有導熱流體，導熱流體的流向與氣浴氣體在氣體輸送單元中的傳輸方向相反。 The heat exchanger is a shell-and-tube heat exchanger; a heat-conducting fluid circulates in the shell-and-tube heat exchanger, and the flow direction of the heat-conducting fluid is opposite to the transmission direction of the gas bath gas in the gas conveying unit.
示例性地，可參照圖1，箭頭所指方向為氣浴氣體的傳輸方向，導熱流體的流向與箭頭所指的方向相反。 1 , the direction indicated by the arrow is the transmission direction of the gas bath gas, and the flow direction of the heat transfer fluid is opposite to the direction indicated by the arrow.
示例性地，亦可參照圖5，氣體輸送單元110包含進氣口1111及出氣口1112，氣體溫控單元120(以熱交換器為例)包含冷卻水入口121及冷卻水出口122；氣體輸送單元110中的氣浴氣體的傳輸方向由進氣口1111沿氣體輸送單元110的路徑指向出氣口1112，氣體溫控單元120中導熱流體(以循環冷卻水為例)的流向由冷卻水入口121指向冷卻水出口122。
5 , the
如此，熱交換器的兩端通入流向相反的氣浴氣體及高溫度精度循環冷卻水，藉由循環冷卻水與氣浴氣體進行換熱，控制氣浴氣體的 溫度，有利於提高氣浴氣體與導熱流體(即循環冷卻水)的熱交換效率，縮短換熱時間。 In this way, both ends of the heat exchanger are fed with gas bath gas flowing in opposite directions and circulating cooling water with high temperature accuracy. The temperature is beneficial to improve the heat exchange efficiency between the gas bath gas and the heat transfer fluid (ie, circulating cooling water), and shorten the heat exchange time.
需要說明的係，熱交換器進一步可為所屬技術領域中具有通常知識者可知的其他類型的熱交換器，本發明實施例對此不再贅述亦不作限定。 It should be noted that, the heat exchanger may further be other types of heat exchangers known to those skilled in the art, which are neither repeated nor limited in the embodiment of the present invention.
繼續參照圖5，該光罩溫度控制裝置10進一步包含壓力流量調節單元150，壓力流量調節單元150設置於氣體輸送單元110的進氣口1111處；壓力流量調節單元150用於將氣浴氣體的壓力調節至預設壓力閾值，且將氣浴氣體的流量調節至預設流量閾值。
Continuing to refer to FIG. 5 , the mask
如此，可實現氣浴氣體達到預設的壓力及流量指標。預設壓力閾值及預設流量閾值均可根據光罩溫度控制裝置的實際需求設置，本發明實施例對此不作限定。 In this way, the gas bath gas can reach the preset pressure and flow rate indicators. Both the preset pressure threshold and the preset flow threshold can be set according to actual requirements of the mask temperature control device, which are not limited in this embodiment of the present invention.
藉由對氣浴氣體的壓力及流量調節，有利於提高氣浴氣體的流動穩定性，從而有利於提高氣浴氣體與光罩的換熱穩定性，有利於降低光罩溫度控制難度，以及有利於提高光罩的溫度穩定性。 By adjusting the pressure and flow of the gas bath gas, it is beneficial to improve the flow stability of the gas bath gas, thereby helping to improve the heat exchange stability between the gas bath gas and the mask, reducing the difficulty of controlling the temperature of the mask, and To improve the temperature stability of the photomask.
預設壓力閾值的範圍可以為1.7Bar~5Bar，在此範圍內，氣浴氣體的壓力值的波動範圍越小，氣浴氣體的壓力越穩定；波動範圍的取值為0Bar時，氣浴氣體的壓力穩定性最佳。示例性地，氣浴氣體的壓力值可為1.7Bar、1.9Bar或2Bar或在上述取值範圍內的其他壓力值，本發明實施例對此不作限定。 The range of the preset pressure threshold can be 1.7Bar~5Bar. Within this range, the smaller the fluctuation range of the gas bath gas pressure value, the more stable the gas bath gas pressure; when the fluctuation range is 0Bar, the gas bath gas the best pressure stability. Exemplarily, the pressure value of the gas bath gas may be 1.7 Bar, 1.9 Bar, or 2 Bar, or other pressure values within the above-mentioned value range, which are not limited in this embodiment of the present invention.
預設流量閾值的範圍可以為200NL/min~500NL/min，在此範圍內，氣浴氣體的流量值的波動範圍越小，氣浴氣體的流動性越穩 定，波動範圍的取值為0NL/min時，氣浴氣體的流動穩定性最佳。示例性地，氣浴氣體的流量值可為200NL/min、220NL/min或250NL/min或上述取值範圍內的其他流量值，本發明實施例對此不作限定。 The preset flow threshold can be in the range of 200NL/min~500NL/min. Within this range, the smaller the fluctuation range of the gas bath gas flow value, the more stable the gas bath gas flow. When the fluctuation range is 0NL/min, the flow stability of the gas bath gas is the best. Exemplarily, the flow value of the gas bath gas may be 200NL/min, 220NL/min, or 250NL/min, or other flow values within the foregoing value ranges, which are not limited in this embodiment of the present invention.
圖6係圖5中壓力流量調節單元的結構示意圖。參照圖6，壓力流量調節單元150包含調壓閥151及節流閥152；調壓閥151用於調節氣浴氣體的壓力，節流閥152用於調節氣浴氣體的流量。
FIG. 6 is a schematic diagram of the structure of the pressure-flow regulating unit in FIG. 5 . 6 , the pressure-
示例性地，調壓閥151可為高純減壓閥，節流閥152可為高純節流閥，如此可避免氣浴氣體被壓力流量調節單元150污染，以確保氣浴氣體具有較高的潔淨度。示例性地，潔淨度可為ISO Class1。
Exemplarily, the
需要說明的係，調壓閥151及節流閥152的型號或規格均可根據光罩溫度控制裝置的實際需求，選擇所屬技術領域中具有通常知識者可知的型號或規格，本發明實施例對此不作限定。
It should be noted that the models or specifications of the
繼續參照圖2及圖5，氣體輸送單元110包含氣體傳輸管路111及濾布112；氣體傳輸管路111的進氣口1111為氣體輸送單元110的進氣口，氣體傳輸管路111的出氣口1112為氣體輸送單元110的出氣口1112，氣體傳輸管路111的出氣口1112與光罩存放單元130連接，氣浴氣體的流動方向與隔板132所在的平面平行；濾布112固定於氣體傳輸管路111的出氣口1112。
2 and 5, the
其中，氣體傳輸管路111中的氣浴氣體經濾布112後，均勻吹到光罩存放單元130的各光罩槽；在氣浴氣體與光罩20接觸後，會對光罩20進行熱交換，實現光罩20的溫度控制。藉由設置濾布112，有利於保證氣浴氣體往每槽光罩槽出風均勻，有利於光罩存放單元130中各
光罩槽溫度均一，從而有利於使得各光罩溫度穩定性一致。
The gas bath gas in the
濾布112的目數的取值範圍為300目~500目。
The value range of the mesh number of the
如此設置，進一步可利用濾布112過濾氣浴氣體在氣體傳輸管路111中傳輸時可能引入的雜質，有利於確保進入光罩存放單元130中的氣浴氣體的潔淨度。示例性地，可保持氣浴氣體的潔淨度ISO Class1不被破壞。
With this arrangement, the
需要說明的係，上文中僅以ISO14644-1(國際標準)示出氣浴氣體的潔淨度等級，但並不構成對本發明實施例提供的光罩溫度控制裝置的限定。在其他實施方式中，亦可採用其他的潔淨度等級劃分標準表徵氣浴氣體的潔淨度等級，本發明實施例對此不作限定。 It should be noted that the above only shows the cleanliness level of the gas bath gas by ISO14644-1 (international standard), but does not constitute a limitation on the mask temperature control device provided by the embodiment of the present invention. In other embodiments, other cleanliness level classification standards may also be used to represent the cleanliness level of the gas bath gas, which is not limited in the embodiment of the present invention.
圖7係圖5中氣體輸送單元的局部結構示意圖。參照圖1及圖7，氣體傳輸管路111包含主管路1113及至少兩路支管路1114，光罩存放單元130的數量為至少兩個；光罩存放單元130與支管路1114一一對應設置。
FIG. 7 is a schematic diagram of a partial structure of the gas delivery unit in FIG. 5 . 1 and 7 , the
其中，主管路1113中的氣浴氣體的溫度範圍與兩支管路1114中的氣浴氣體的溫度範圍均相同，溫度感測器140進一步可設置於支管路1114中。
The temperature range of the gas bath gas in the main pipeline 1113 is the same as the temperature range of the gas bath gas in the two
需要說明的係，圖1及圖7中均僅示例性地示出光罩存放單元130的數量為2個，但並非對本發明實施例提供的光罩溫度控制裝置的限定。在其他實施方式中，進一步可根據光罩溫度控制裝置的實際需求，設置光罩存放單元130的數量，以及適應性地設置支管路1114的數量，本發明實施例對此不作限定。
It should be noted that both FIG. 1 and FIG. 7 only exemplarily show that the number of
繼續參照圖7，氣體輸送單元110進一步包含轉換接頭113，轉換接頭113連接於主管路1113與至少兩路支管路1114的相連的介面處；轉換接頭113用於將主管路1113中的氣體傳輸至至少兩路支管路1114中。
Continuing to refer to FIG. 7 , the
其中，轉換接頭為高純產品，以確保氣浴氣體不被污染，即確保氣浴氣體的潔淨度不被破壞。 Among them, the conversion joint is a high-purity product to ensure that the gas bath gas is not polluted, that is, to ensure that the cleanliness of the gas bath gas is not damaged.
氣體傳輸管路111的內側壁的粗糙度小於或等於0.3μm。
The roughness of the inner side wall of the
如此設置，以確保氣浴氣體不被污染，即確保氣浴氣體的潔淨度不被破壞。 This arrangement ensures that the air bath gas is not polluted, that is, to ensure that the cleanliness of the air bath gas is not damaged.
示例性地，氣體傳輸管路111可採用電拋光工藝加工。此外，氣體傳輸管路亦可採用所屬技術領域中具有通常知識者可知的工藝加工，本發明實施例對此不再贅述亦不作限定。
Illustratively, the
圖8係圖5中光罩溫度控制裝置的工作原理圖。參照圖5及圖8，該光罩溫度控制裝置10中的管路可分為水路(圖8中用帶箭頭的虛線示出水流方向)及氣路(圖8中用帶箭頭的實線示出氣流方向)兩路。水路由環境提供循環冷卻水(溫度為22℃)，在循環冷卻水的水路路徑上設置漏液檢測感測器160，以即時檢測循環冷卻水漏液情況。隨後循環冷卻水進入熱交換器，由熱交換器流出的冷卻水返回環境冷卻水回收口。氣路有環境提供氣浴氣體，溫度為22±0.1℃，潔淨度為ISO Class1；氣浴氣體與循環冷卻水流向相反的方式進入熱交換器，熱交換器流出的氣浴氣體通入電拋光的氣體傳輸管路111，氣浴氣體經氣體傳輸管路111輸送到光罩存放單元130中的光罩槽，氣浴氣體經過循環冷卻水換熱後溫度
穩定(示例性地，22±0.05℃)，溫度穩定後的氣浴氣體與光罩槽中存放的光罩20進行熱交換，從而保證光罩20溫度控制到需求值(示例性地，22±0.1℃)。
FIG. 8 is a working principle diagram of the mask temperature control device in FIG. 5 . Referring to FIGS. 5 and 8 , the pipelines in the mask
在氣體傳輸管路111的進氣口處進一步可設置調壓閥151及節流閥152，以調節氣浴氣體的壓力及流量；對應地，在氣體傳輸管路111中進一步可設置壓力感測器170，以檢測氣浴氣體的壓力。在光罩槽的進風口處可設置溫度感測器140，以測量氣浴進風溫度，在光罩槽的進風口處進一步可設置氣浴氣體採樣介面180，以對氣浴氣體採樣，測量其潔淨度、壓力等參數，本發明實施例對其他可選擇測量的氣浴氣體的參數不再贅述亦不作限定。
A
示例性地，圖9係圖5提供的光罩溫度控制裝置的氣浴流場分佈模擬結果圖。參照圖9，氣浴氣體流經光罩20時基本為層流，據此氣浴氣體與光罩20的換熱效果較佳。
Exemplarily, FIG. 9 is a simulation result diagram of the air bath flow field distribution of the mask temperature control device provided in FIG. 5 . Referring to FIG. 9 , when the gas bath gas flows through the
需要說明的係，圖8中僅將漏液檢測感測器160設置在進水管路123上，但並非對本發明實施例提供的光罩溫度控制裝置的限定。在其他實施方式中，漏液檢測感測器160進一步可設置在出水管路124上，本發明實施例對此不作限定。
It should be noted that, in FIG. 8 , only the liquid
本發明實施例進一步提供一種光罩曝光裝置，該光罩曝光裝置包含上述任一種光罩溫度控制裝置。因而該光刻裝置具有上述光罩溫度控制裝置所具有的技術效果，可參照上文理解，下文中不再贅述。 Embodiments of the present invention further provide a mask exposure device, which includes any one of the above-mentioned mask temperature control devices. Therefore, the lithography apparatus has the technical effects of the above-mentioned mask temperature control apparatus, which can be understood with reference to the above, and will not be described in detail below.
示例性地，該光刻裝置進一步可包含照明單元、光罩單元、投影物鏡及承載單元；照明單元用於輸出光線，光罩單元用於承載溫 度穩定後的光罩，承載單元用於承載待曝光樣品，投影物鏡將光線投影至待曝光樣品上，以對待曝光樣品進行曝光。其中，光罩存放於光罩溫度控制裝置的光罩存放單元中，參照上文，由於光罩溫度控制難度降低，有利於提高光罩上版溫度精度，縮短上版時間，從而有利於提高光刻解析度，提高光刻產率。 Exemplarily, the lithography apparatus may further comprise an illumination unit, a reticle unit, a projection objective lens and a carrying unit; the illuminating unit is used for outputting light, and the reticle unit is used for carrying a temperature The photomask after the degree of stability is stabilized, the carrying unit is used to carry the sample to be exposed, and the projection objective lens projects light onto the sample to be exposed to expose the sample to be exposed. Among them, the reticle is stored in the reticle storage unit of the reticle temperature control device. Referring to the above, since the difficulty of controlling the reticle temperature is reduced, it is beneficial to improve the temperature accuracy of the reticle and shorten the stencil time, which is beneficial to improve the photomask temperature. Scale resolution, improve lithography productivity.
需要說明的係，本發明實施例提供的光刻裝置進一步可包含所屬技術領域中具有通常知識者可知的其他組件或零件，不再贅述不作限定。 It should be noted that the lithography apparatus provided by the embodiments of the present invention may further include other components or parts known to those with ordinary knowledge in the technical field, which will not be described again without limitation.
本發明要求在2019年5月16日提交中國專利局、申請號為201910409932.4的中國專利申請的優先權，以上發明的全部內容藉由引用結合在本發明中。 The present invention claims the priority of the Chinese patent application with the application number 201910409932.4 submitted to the Chinese Patent Office on May 16, 2019, and the entire contents of the above invention are incorporated herein by reference.
10:光罩溫度控制裝置 10: Mask temperature control device
110:氣體輸送單元 110: Gas delivery unit
120:氣體溫控單元 120: Gas temperature control unit
130:光罩存放單元 130: Reticle storage unit
131:版架主體 131: Frame main body
132:隔板 132: Separator
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| CN201910409932.4A CN111948907B (en) | 2019-05-16 | 2019-05-16 | Mask plate temperature control device and mask exposure device |
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| CN111948907B (en) | 2022-01-28 |
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