TWI772493B - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method Download PDF

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TWI772493B
TWI772493B TW107129049A TW107129049A TWI772493B TW I772493 B TWI772493 B TW I772493B TW 107129049 A TW107129049 A TW 107129049A TW 107129049 A TW107129049 A TW 107129049A TW I772493 B TWI772493 B TW I772493B
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substrate
frame
unit
main
peeling
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TW107129049A
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TW201921463A (en
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田村武
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日商琳得科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

An object of the invention is to provide a substrate processing system that can reduce the installation footprint as viewed from the vertical direction. The invention provides a substrate processing system comprising an ultraviolet ray irradiation section which irradiates ultraviolet rays onto a protective tape that protects a substrate, a mount section which mounts the substrate to a frame via an adhesive tape provided on the opposite side of the substrate from the ultraviolet-irradiated protective tape, and a detachment section which detaches the protective tape from the substrate that has been mounted to the frame via the adhesive tape, wherein the ultraviolet ray irradiation section is provided above the mount section in the vertical direction in alignment with the mount section.

Description

基板處理系統及基板處理方法Substrate processing system and substrate processing method

本發明係關於一種基板處理系統及基板處理方法。The present invention relates to a substrate processing system and a substrate processing method.

近幾年，為了因應半導體裝置的小型化或輕量化的要求，會在半導體晶圓等基板的第一主表面形成元件、電路及端子等之後，磨削與基板之第一主表面相反側的第二主表面，而使基板薄化。在薄化後或是薄化前，會進行切割。In recent years, in order to meet the requirements of miniaturization and weight reduction of semiconductor devices, after forming components, circuits, terminals, etc. on the first main surface of a substrate such as a semiconductor wafer, the surface on the opposite side of the first main surface of the substrate is ground. the second major surface, thereby thinning the substrate. After thinning or before thinning, cutting is performed.

在進行薄化或切割等加工的期間，基板之第一主表面係以保護膠帶進行保護。保護膠帶係採用藉由紫外線照射會降低黏著力者。黏著力降低後，便可藉由剝離作業輕易地將保護膠帶從基板剝離。During processing such as thinning or cutting, the first main surface of the substrate is protected with a protective tape. Protective tapes are those that reduce the adhesive force by UV irradiation. After the adhesion is reduced, the protective tape can be easily peeled off from the substrate by a peeling operation.

紫外線照射於保護膠帶之後，在將保護膠帶從基板剝離之前，基板係藉由與保護膠帶不同的黏著膠帶裝設於框架。黏著膠帶，係以覆蓋環狀框架之開口部的方式裝設於框架，並在框架的開口部，與基板的第二主表面貼合。After the protective tape is irradiated with ultraviolet rays, before peeling the protective tape from the substrate, the substrate is attached to the frame by an adhesive tape different from the protective tape. The adhesive tape is installed on the frame by covering the opening of the annular frame, and is attached to the second main surface of the substrate at the opening of the frame.

專利文獻1的裝置包含：加工部，其磨削晶圓的背面；UV(紫外線)照射部，其將紫外線照射於保護晶圓表面的保護膠帶；安裝部，其藉由貼附於晶圓背面的黏著膠帶，將晶圓裝設於框架；剝離部，其將保護膠帶從晶圓剝離。 [習知技術文獻] [專利文獻]The apparatus of Patent Document 1 includes: a processing part that grinds the back surface of the wafer; a UV (ultraviolet) irradiation part that irradiates ultraviolet rays to a protective tape that protects the surface of the wafer; and a mounting part that adheres to the back surface of the wafer by The adhesive tape mounts the wafer on the frame; the peeling part peels the protective tape off the wafer. [Previously known technical literature] [Patent Literature]

專利文獻1：日本特開2002-343756號公報Patent Document 1: Japanese Patent Laid-Open No. 2002-343756

[發明所欲解決之問題][Problems to be Solved by Invention]

專利文獻1的裝置中，在垂直方向觀察下，UV照射部與安裝部係分開設置(參照專利文獻1的圖1)。因此，在垂直方向觀察下的設置面積較大。In the device of Patent Document 1, the UV irradiation unit and the mounting unit are provided separately from each other when viewed in the vertical direction (see FIG. 1 of Patent Document 1). Therefore, the installation area viewed in the vertical direction is large.

本發明係鑑於上述課題而完成者，其目的在於提供一種基板處理系統，可降低在垂直方向觀察下的設置面積。 [解決問題之技術手段]The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a substrate processing system that can reduce the installation area when viewed in the vertical direction. [Technical means to solve problems]

為了解決上述課題，依本發明之一態樣，係提供一種基板處理系統，包含： 紫外線照射部，將紫外線照射於保護基板的保護膠帶； 安裝部，藉由以該基板為基準而設在與紫外線照射後之該保護膠帶為相反側的黏著膠帶，將該基板裝設於框架；及 剝離部，從藉由該黏著膠帶裝設於該框架的該基板將該保護膠帶剝離； 該紫外線照射部，在該安裝部之垂直方向上方與該安裝部重疊設置。 [對照先前技術之功效]In order to solve the above problems, according to an aspect of the present invention, a substrate processing system is provided, including: The ultraviolet irradiation part irradiates ultraviolet rays to the protective tape that protects the substrate; an attaching part for attaching the substrate to the frame by using an adhesive tape provided on the opposite side of the protective tape after ultraviolet irradiation with the substrate as a reference; and a peeling part for peeling off the protective tape from the substrate mounted on the frame by the adhesive tape; The ultraviolet irradiation part is arranged to overlap with the installation part above the vertical direction of the installation part. [Compared to the efficacy of the prior art]

依本發明之一態樣，係提供一種基板處理系統，可降低在垂直方向觀察下的設置面積。According to an aspect of the present invention, a substrate processing system is provided, which can reduce the installation area when viewed in the vertical direction.

以下，參照圖式說明用於實施本發明之態樣。在各圖式中，針對相同或是對應的構成，賦與相同或是對應的符號並省略其說明。在以下說明中，X方向、Y方向及Z方向係相互垂直的方向，X方向及Y方向係水平方向，而Z方向係垂直方向。以垂直軸為旋轉中心的旋轉方向稱為θ方向。在本說明書中，所謂下方係意指垂直方向下方，所謂上方係意指垂直方向上方。Hereinafter, an aspect for carrying out the present invention will be described with reference to the drawings. In each drawing, the same or corresponding components are assigned the same or corresponding symbols, and the description thereof will be omitted. In the following description, the X direction, the Y direction and the Z direction are mutually perpendicular directions, the X direction and the Y direction are the horizontal directions, and the Z direction is the vertical direction. The direction of rotation with the vertical axis as the center of rotation is called the θ direction. In this specification, "lower" means vertically downward, and "upper" means vertically upward.

圖1係顯示藉由依本發明之一實施態樣之基板處理系統處理前之基板的立體圖。基板10，例如為半導體基板、藍寶石基板等。基板10之第一主表面11係由形成為晶格狀之複數切割道予以分隔，並在分隔的各區域中預先形成元件、電路及端子等。沿著形成為晶格狀之複數切割道分割基板10，藉此得到晶片13(參照圖2)。FIG. 1 is a perspective view showing a substrate before processing by a substrate processing system according to an embodiment of the present invention. The substrate 10 is, for example, a semiconductor substrate, a sapphire substrate, or the like. The first main surface 11 of the substrate 10 is separated by a plurality of scribe lines formed in a lattice shape, and components, circuits, terminals, etc. are pre-formed in the separated regions. The wafer 13 is obtained by dividing the substrate 10 along a plurality of scribe lines formed in a lattice shape (see FIG. 2 ).

保護膠帶14係貼合於基板10之第一主表面11。保護膠帶14，係在切割或薄化等加工進行的期間，保護基板10之第一主表面11，進而保護預先形成於第一主表面11之元件、電路及端子等。保護膠帶14，係覆蓋基板10之第一主表面11的整體。The protective tape 14 is attached to the first main surface 11 of the substrate 10 . The protective tape 14 protects the first main surface 11 of the substrate 10 during processing such as cutting or thinning, and further protects components, circuits, terminals, etc. previously formed on the first main surface 11 . The protective tape 14 covers the entirety of the first main surface 11 of the substrate 10 .

保護膠帶14，係以薄片基材與塗佈於薄片基材表面的黏著劑所構成。該黏著劑，係可藉由紫外線照射而硬化進而降低黏著力者。黏著力降低後，便可藉由剝離作業而輕易地將保護膠帶14從基板10剝離。The protective tape 14 is composed of a sheet base material and an adhesive coated on the surface of the sheet base material. The adhesive can be hardened by ultraviolet irradiation to reduce the adhesive force. After the adhesive force is lowered, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

圖2係顯示藉由依本發明之一實施態樣之基板處理系統處理後之基板的立體圖。基板10，係在切割並薄化之後，藉由黏著膠帶18裝設於框架19。又，圖1所示之保護膠帶14，係從基板10被剝離並去除。2 is a perspective view showing a substrate after being processed by the substrate processing system according to an embodiment of the present invention. The substrate 10 , after being cut and thinned, is attached to the frame 19 by means of adhesive tape 18 . In addition, the protective tape 14 shown in FIG. 1 is peeled and removed from the board|substrate 10. As shown in FIG.

黏著膠帶18，係以薄片基材與塗佈於薄片基材表面的黏著劑所構成。黏著膠帶18，係以覆蓋環狀框架19之開口部的方式裝設於框架19，並在框架19的開口部與基板10貼合。藉此，可固持框架19而搬運基板10，提高基板10的操控性。The adhesive tape 18 is composed of a sheet base material and an adhesive coated on the surface of the sheet base material. The adhesive tape 18 is installed on the frame 19 so as to cover the opening of the annular frame 19 , and is attached to the substrate 10 at the opening of the frame 19 . As a result, the substrate 10 can be conveyed while holding the frame 19 , thereby improving the operability of the substrate 10 .

如圖2所示，在黏著膠帶18與基板10之間，亦可設置DAF(裸晶貼附膜：Die Attach Film)15。DAF15係裸晶接合用的黏接薄片。DAF15係用於晶片13的貼附等。DAF15可為導電性、絕緣性中之任一種。As shown in FIG. 2 , a DAF (Die Attach Film) 15 may also be provided between the adhesive tape 18 and the substrate 10 . DAF15 is an adhesive sheet for bare die bonding. The DAF 15 is used for attaching the wafer 13 and the like. DAF15 may be either conductive or insulating.

DAF15係形成為小於框架19的開口部，並設於框架19的內側。DAF15係覆蓋基板10之第二主表面12的整體。又，由於在未進行晶片13之疊設的情況下，不需要DAF15，故基板10可僅藉由黏著膠帶18裝設於框架19。The DAF 15 is formed smaller than the opening of the frame 19 , and is provided inside the frame 19 . The DAF 15 covers the entire second main surface 12 of the substrate 10 . In addition, since the DAF 15 is not required when the wafers 13 are not stacked, the substrate 10 can be mounted on the frame 19 only by the adhesive tape 18 .

圖3係顯示依本發明之一實施態樣之基板處理系統的俯視圖。在圖3中，係將搬入用晶圓匣盒35及搬出用晶圓匣盒45切開，以圖示搬入用晶圓匣盒35之內部及搬出用晶圓匣盒45之內部。在圖3中，箭頭係表示在安裝部500或剝離部600等中之基板10及框架19的移動方向。3 is a top view showing a substrate processing system according to an embodiment of the present invention. In FIG. 3, the wafer cassette 35 for carrying out and the wafer cassette 45 for carrying out are cut open to illustrate the inside of the wafer cassette 35 for carrying in and the inside of the wafer cassette 45 for carrying out. In FIG. 3 , arrows indicate the moving directions of the substrate 10 and the frame 19 in the mounting portion 500 or the peeling portion 600 or the like.

基板處理系統1進行下述各種處理：基板10的切割、基板10的薄化、對保護膠帶14的紫外線照射、基板10的安裝、將保護膠帶14從基板10的剝離、及對框架19的ID貼附等。The substrate processing system 1 performs the following various processes: dicing of the substrate 10 , thinning of the substrate 10 , ultraviolet irradiation to the protective tape 14 , mounting of the substrate 10 , peeling of the protective tape 14 from the substrate 10 , and ID to the frame 19 Attached etc.

基板處理系統1包含：控制部20、搬入部30、搬出部40、主搬運路50、主搬運部58及各種處理部。處理部雖未特別限定，但設有例如：切割部100、薄化部200、紫外線照射部400、安裝部500、剝離部600及ID貼附部700。The substrate processing system 1 includes a control unit 20 , a loading unit 30 , a loading unit 40 , a main conveyance path 50 , a main conveyance unit 58 , and various processing units. Although the processing part is not particularly limited, for example, a cutting part 100 , a thinning part 200 , an ultraviolet irradiation part 400 , a mounting part 500 , a peeling part 600 , and an ID sticking part 700 are provided.

如圖3所示，控制部20，係以例如電腦構成，其包含：CPU(中央處理單元：Central Processing Unit)21、記憶體等儲存媒體22、輸入介面23及輸出介面24。控制部20，係使CPU21執行儲存於儲存媒體22的程式，藉此進行各種控制。又，控制部20，係以輸入介面23接收來自外部的訊號，並以輸出介面24將訊號傳輸至外部。As shown in FIG. 3 , the control unit 20 is constituted by, for example, a computer, and includes a CPU (Central Processing Unit) 21 , a storage medium 22 such as a memory, an input interface 23 and an output interface 24 . The control unit 20 performs various controls by causing the CPU 21 to execute a program stored in the storage medium 22 . In addition, the control unit 20 receives signals from the outside through the input interface 23 and transmits the signals to the outside through the output interface 24 .

控制部20的程式，係儲存於資訊儲存媒體，並從資訊儲存媒體進行安裝。資訊儲存媒體可列舉例如：硬碟(HD)、軟性磁碟(FD)、光碟(CD)、磁光碟(MO)及記憶卡等。又，程式亦可藉由網際網路從伺服器下載並進行安裝。The program of the control part 20 is stored in the information storage medium, and is installed from the information storage medium. Examples of information storage media include hard disk (HD), flexible disk (FD), compact disk (CD), magneto-optical disk (MO), and memory cards. Also, the program can also be downloaded and installed from a server via the Internet.

搬入部30，係將收納有處理前之基板10的搬入用晶圓匣盒35從外部搬入。搬入用晶圓匣盒35，係例如在Z方向上隔著間隔，收納有複數片藉由黏著膠帶18裝設於框架19之前的基板10。The carrying-in unit 30 carries in the carrying-in cassette 35 in which the substrates 10 before processing are accommodated from the outside. The wafer cassette 35 for carrying in is, for example, spaced in the Z direction, and accommodates a plurality of substrates 10 that are mounted before the frame 19 with the adhesive tape 18 .

搬入用晶圓匣盒35為了在Z方向上隔著間隔收納複數片基板10，而具有在Z方向上隔著間隔並水平配置的複數之成對的收納板36。如圖3所示，一對收納板36，係支撐基板10的Y方向兩端部。The wafer cassette 35 for carrying in has a plurality of pairs of storage plates 36 arranged horizontally at intervals in the Z direction in order to accommodate the plurality of substrates 10 in the Z direction. As shown in FIG. 3 , the pair of storage plates 36 support both ends of the substrate 10 in the Y direction.

搬入用晶圓匣盒35為了抑制保護膠帶14的捲起等變形，可將保護膠帶14朝上並水平收納基板10。從搬入用晶圓匣盒35取出之基板10，在上下翻轉之後，搬運至切割部100等處理部。The wafer cassette 35 for carrying in can accommodate the substrate 10 horizontally with the protective tape 14 facing upward in order to suppress deformation such as rolling up of the protective tape 14 . The substrate 10 taken out from the carrying-in cassette 35 is turned upside down, and then conveyed to a processing section such as the dicing section 100 .

搬入部30具備載置搬入用晶圓匣盒35的載置板31。載置板31係在Y方向上呈一列地設置複數個。又，載置板31的個數，並不限定於圖示的數量。The carry-in unit 30 includes a placement plate 31 on which the wafer cassette 35 for carrying in is placed. A plurality of mounting plates 31 are provided in a row in the Y direction. In addition, the number of objects of the mounting plate 31 is not limited to the number shown in figure.

搬出部40，將收納有處理後之基板10的搬出用晶圓匣盒45搬出至外部。搬出用晶圓匣盒45，係在Z方向上隔著間隔收納複數片例如藉由黏著膠帶18裝設於框架19後的基板10。The unloading unit 40 unloads the unloading cassette 45 in which the processed substrate 10 is accommodated to the outside. The unloading wafer cassette 45 accommodates a plurality of substrates 10 mounted on the frame 19 by, for example, the adhesive tape 18 at intervals in the Z direction.

搬出用晶圓匣盒45，為了在Z方向上隔著間隔收納複數片基板10，而具有在Z方向上隔著間隔並水平配置的複數之成對的收納板46。如圖3所示，一對收納板46，係支撐框架19的Y方向兩端部。The unloading wafer cassette 45 has a plurality of pairs of storage plates 46 arranged horizontally with an interval in the Z direction in order to accommodate the plurality of substrates 10 in the Z direction. As shown in FIG. 3 , the pair of storage plates 46 support both ends of the frame 19 in the Y direction.

搬出部40具備載置搬出用晶圓匣盒45的載置板41。載置板41在Y方向上呈一列地設置複數個。又，載置板41的個數，並不限定於圖示的數量。The unloading unit 40 includes a mounting plate 41 on which the unloading cassette 45 is placed. A plurality of mounting plates 41 are provided in a row in the Y direction. In addition, the number of objects of the mounting plate 41 is not limited to the number shown in figure.

主搬運路50，係主搬運部58對搬入部30、搬出部40及複數之處理部搬運基板10的通路，並例如在Y方向上延伸。在主搬運路50上，設有在Y方向上延伸的Y軸引導部51，而Y軸滑件52可沿著Y軸引導部51自由移動。The main conveyance path 50 is a passage through which the main conveyance unit 58 conveys the substrates 10 to the load-in unit 30 , the load-out unit 40 , and the plurality of processing units, and extends, for example, in the Y direction. The main conveyance path 50 is provided with a Y-axis guide portion 51 extending in the Y direction, and the Y-axis slider 52 can freely move along the Y-axis guide portion 51 .

主搬運部58，係固持基板10並同時沿著主搬運路50移動，以搬運基板10。主搬運部58，亦可藉由框架19固持基板10。主搬運部58，雖係以真空吸附基板10或框架19，但亦能以靜電吸附。主搬運部58，包含作為搬運基體的Y軸滑件52等，而可沿著Y方向移動。主搬運部58，不僅在Y方向上，亦可在X方向、Z方向及θ方向上移動。The main conveyance unit 58 is moved along the main conveyance path 50 while holding the substrate 10 to convey the substrate 10 . The main conveying portion 58 may hold the substrate 10 by the frame 19 . Although the main conveying part 58 uses vacuum to adsorb the substrate 10 or the frame 19, it can also be electrostatically adsorbed. The main conveying portion 58 includes the Y-axis slider 52 as a conveying base and the like, and is movable in the Y direction. The main conveyance unit 58 can move not only in the Y direction but also in the X direction, the Z direction, and the θ direction.

主搬運部58，可具有用來固持基板10的複數之固持部。複數之固持部，係在Z方向上隔著間隔並列設置。複數之固持部，亦可依基板10的處理階段，而區別使用。The main conveying part 58 may have a plurality of holding parts for holding the substrate 10 . A plurality of holding parts are arranged in parallel with an interval in the Z direction. The plurality of holding parts can also be used differently according to the processing stage of the substrate 10 .

主搬運部58，例如包含：第一固持部，其用於將基板10從搬入用晶圓匣盒35取出；第二固持部，其用於搬運因切割或薄化等加工而強度降低之基板10。第二固持部，可用來搬運裝設於框架19之前的基板10。此情況下，主搬運部58可更包含第三固持部，其用於搬運裝設於框架19之後的基板10。第三固持部，係藉由框架19來固持基板10。The main conveying portion 58 includes, for example, a first holding portion for taking out the substrate 10 from the wafer cassette 35 for carrying in, and a second holding portion for conveying a substrate whose strength is reduced by processing such as dicing or thinning 10. The second holding portion can be used to transport the substrate 10 installed in front of the frame 19 . In this case, the main conveying part 58 may further include a third holding part for conveying the substrate 10 installed behind the frame 19 . The third holding portion holds the substrate 10 by the frame 19 .

在垂直方向觀察下，搬入部30、搬出部40及複數之處理部，係與主搬運路50鄰接而設置。例如，將主搬運路50的長邊方向設為Y方向。搬入部30與搬出部40係與主搬運路50之X方向一側(圖3中左側，以下稱為「前側」。)鄰接而設置。又，切割部100、薄化部200、剝離部600及ID貼附部700係與主搬運路50之X方向相反側(圖3中右側，以下稱為「後側」)鄰接而設置。剝離部600與ID貼附部700係在Z方向上疊設，ID貼附部700係在剝離部600的上方與剝離部600重疊設置。再者，安裝部500係與主搬運路50之Y方向一端部鄰接而設置。安裝部500與紫外線照射部400係在Z方向上疊設，紫外線照射部400係在安裝部500的上方與安裝部500重疊設置。When viewed in the vertical direction, the carrying-in part 30 , the carrying-out part 40 , and a plurality of processing parts are provided adjacent to the main conveyance path 50 . For example, let the longitudinal direction of the main conveyance path 50 be the Y direction. The carry-in portion 30 and the carry-out portion 40 are provided adjacent to one side in the X direction (the left side in FIG. 3 , hereinafter referred to as the “front side”) of the main conveyance path 50 . Moreover, the cutting part 100, the thinning part 200, the peeling part 600, and the ID sticking part 700 are provided adjacent to the side opposite to the X direction (the right side in FIG. 3, hereinafter referred to as the "rear side") of the main conveyance path 50. The peeling portion 600 and the ID sticking portion 700 are stacked in the Z direction, and the ID sticking portion 700 is provided above the peeling portion 600 to overlap the peeling portion 600 . In addition, the attachment part 500 is provided adjacent to the one end part of the Y direction of the main conveyance path 50. The mounting portion 500 and the ultraviolet irradiation portion 400 are stacked in the Z direction, and the ultraviolet irradiation portion 400 is provided to overlap the mounting portion 500 above the mounting portion 500 .

依本實施態樣，搬入部30及複數之處理部，係與主搬運路50鄰接而設置。因此，主搬運部58可對搬入部30及複數之處理部傳遞基板10。藉此，可使主搬運部58多功能化，而提高主搬運部58的工作量，進而改善主搬運部58的可用率。According to this embodiment, the carry-in unit 30 and the plurality of processing units are provided adjacent to the main conveyance path 50 . Therefore, the main transfer unit 58 can transfer the substrate 10 to the transfer unit 30 and a plurality of processing units. Thereby, the main conveying part 58 can be multi-functional, the workload of the main conveying part 58 can be increased, and the availability of the main conveying part 58 can be improved.

又，依本實施態樣，搬出部40亦與主搬運路50鄰接而設置。因此，主搬運部58可對搬出部40遞送基板10。藉此，可使主搬運部58更加多功能化，進一步提高主搬運部58的工作量，而進一步改善主搬運部58的可用率。又，由於複數之處理部與搬出部40係與主搬運路50鄰接而設置，故在一處理部中，於基板10發生異常的情況下，可將發生異常之基板10迅速地搬運至搬出部40而不用搬運至其他處理部。Moreover, according to this embodiment, the carry-out part 40 is also provided adjacent to the main conveyance path 50 . Therefore, the main conveying unit 58 can deliver the substrate 10 to the unloading unit 40 . Thereby, the function of the main conveying unit 58 can be further increased, the workload of the main conveying unit 58 can be further increased, and the availability of the main conveying unit 58 can be further improved. In addition, since a plurality of processing sections and unloading sections 40 are provided adjacent to the main conveyance path 50, in the case where an abnormality occurs in the substrate 10 in one processing section, the abnormal substrate 10 can be quickly transported to the unloading section 40 without being transported to other processing units.

又，處理部的配置或個數，並不限定於圖3所示之配置或個數，而係可任意選擇。又，複數之處理部，亦能以任意單位進行分散或是統合配置。以下，針對各處理部進行說明。In addition, the arrangement and the number of the processing units are not limited to those shown in FIG. 3 , but can be arbitrarily selected. In addition, a plurality of processing units can be distributed or integrated in arbitrary units. Hereinafter, each processing unit will be described.

圖4係顯示依本發明之一實施態樣之切割部的圖式。切割部100係進行基板10的切割。在本說明書中，所謂基板10的切割，係意指用於將基板10分割為複數晶片13的加工，其包含分割基板10及於基板10形成分割的起點。切割部100，例如包含：切割平台110、基板加工部120及移動機構部130。FIG. 4 is a diagram showing a cutting portion according to an embodiment of the present invention. The dicing part 100 performs dicing of the substrate 10 . In this specification, the dicing of the substrate 10 means a process for dividing the substrate 10 into a plurality of wafers 13 , and includes dividing the substrate 10 and forming the starting point of the division in the substrate 10 . The cutting unit 100 includes, for example, a cutting table 110 , a substrate processing unit 120 , and a moving mechanism unit 130 .

切割平台110，係藉由保護膠帶14而固持基板10。例如，切割平台110，係在基板10之第二主表面12朝上的狀態下，水平地固持基板10。切割平台110雖舉例為使用真空夾頭，亦可使用靜電夾頭等。The dicing platform 110 holds the substrate 10 by the protective tape 14 . For example, the dicing stage 110 holds the substrate 10 horizontally with the second main surface 12 of the substrate 10 facing upward. Although the cutting platform 110 is exemplified by using a vacuum chuck, an electrostatic chuck or the like can also be used.

基板加工部120，例如進行被切割平台110所固持之基板10的切割。基板加工部120，例如包含：雷射振盪器121、及使來自雷射振盪器121的雷射光線照射於基板10之光學系統122。光學系統122，係以使來自雷射振盪器121的雷射光線朝基板10聚集的聚光透鏡等所構成。The substrate processing unit 120 , for example, performs dicing of the substrate 10 held by the dicing table 110 . The substrate processing unit 120 includes, for example, a laser oscillator 121 and an optical system 122 for irradiating the substrate 10 with laser light from the laser oscillator 121 . The optical system 122 is constituted by a condenser lens or the like for condensing the laser light from the laser oscillator 121 toward the substrate 10 .

移動機構部130，係使切割平台110與基板加工部120相對移動。移動機構部130，例如以使切割平台110在X方向、Y方向、Z方向及θ方向上移動的XYZθ平台等所構成。The moving mechanism unit 130 relatively moves the dicing table 110 and the substrate processing unit 120 . The moving mechanism part 130 is constituted by, for example, an XYZθ stage that moves the cutting stage 110 in the X direction, the Y direction, the Z direction, and the θ direction.

控制部20，係控制基板加工部120及移動機構部130，沿著基板10的切割道進行基板10的切割。如圖4所示，可於基板10內部形成作為斷開之起點的改質層2，亦可於基板10的雷射照射面(例如，在圖4中為頂面)形成雷射加工溝槽。雷射加工溝槽，可在基板厚度方向上貫通基板10，亦可不貫通。The control unit 20 controls the substrate processing unit 120 and the moving mechanism unit 130 to cut the substrate 10 along the dicing lanes of the substrate 10 . As shown in FIG. 4 , a modified layer 2 can be formed inside the substrate 10 as a starting point for disconnection, and laser processing trenches can also be formed on the laser irradiation surface (for example, the top surface in FIG. 4 ) of the substrate 10 . . The laser processing trench may or may not penetrate through the substrate 10 in the thickness direction of the substrate.

在基板10內部形成改質層2的情況，係使用對基板10具有透射性的雷射光線。改質層2，例如藉由局部地使基板10內部熔融並固化而形成。另一方面，在基板10的雷射照射面形成雷射加工溝槽的情況，係使用對基板10具有吸收性的雷射光線。In the case of forming the modified layer 2 inside the substrate 10 , a laser beam having transmittance to the substrate 10 is used. The modified layer 2 is formed, for example, by locally melting and solidifying the inside of the substrate 10 . On the other hand, in the case of forming the laser processing grooves on the laser irradiation surface of the substrate 10 , a laser beam having an absorptivity to the substrate 10 is used.

又，在本實施態樣中，基板加工部120，雖具有將雷射光線照射至基板10的雷射振盪器121，但亦可具有切割基板10的切割刀片，或是具有於基板10之表面形成劃線溝槽的劃線器。In addition, in this embodiment, the substrate processing unit 120 has a laser oscillator 121 for irradiating the substrate 10 with laser light, but may also have a dicing blade for cutting the substrate 10 or a surface of the substrate 10 . A scriber that forms scribe grooves.

又，在本實施態樣中，切割部100，雖係作為基板處理系統1的一部分而設置，但亦可設於基板處理系統1的外部。此情況下，基板10係經過切割後，從外部搬入至搬入部30，並在搬入部30中，被從搬入用晶圓匣盒35取出，搬運至薄化部200，而不是切割部100。In addition, in this embodiment, although the dicing part 100 is provided as a part of the substrate processing system 1 , it may be provided outside the substrate processing system 1 . In this case, after dicing, the substrate 10 is carried in from the outside into the carrying part 30 , and in the carrying part 30 , is taken out from the carrying cassette 35 and carried to the thinning part 200 instead of the dicing part 100 .

薄化部200(參照圖3)，係藉由對與切割後之基板10之被保護膠帶14所保護的第一主表面11相反側的第二主表面12進行加工，以薄化基板10。The thinned portion 200 (see FIG. 3 ) thins the substrate 10 by processing the second main surface 12 opposite to the first main surface 11 protected by the protective tape 14 of the diced substrate 10 .

在以切割部100形成分割起點的情況下，藉由以薄化部200將加工應力施加於基板10，而使裂縫從分割之起點往基板厚度方向前進，基板10即被分割成複數個晶片13。When the dicing portion 100 is used to form the starting point of division, the thinned portion 200 applies processing stress to the substrate 10 to cause cracks to advance from the starting point of division to the thickness direction of the substrate, whereby the substrate 10 is divided into a plurality of wafers 13 .

又，在以切割部100於基板10內部形成改質層2的情況下，藉由以薄化部200薄化基板10，而去除改質層2。In addition, when the modified layer 2 is formed inside the substrate 10 by the dicing portion 100 , the modified layer 2 is removed by thinning the substrate 10 by the thinning portion 200 .

如圖3所示，薄化部200，例如包含：旋轉平台201、夾頭平台202、粗磨削部210、精磨削部220及受損層去除部230。As shown in FIG. 3 , the thinned part 200 includes, for example, a rotary table 201 , a chuck table 202 , a rough grinding part 210 , a fine grinding part 220 and a damaged layer removing part 230 .

旋轉平台201，係以旋轉平台201的中心線為中心旋轉。複數(例如，在圖3中為4個)夾頭平台202係圍繞著旋轉平台201之旋轉中心線並以等間隔進行配置。The rotating platform 201 rotates around the center line of the rotating platform 201 . A plurality of (for example, four in FIG. 3 ) chuck stages 202 are arranged around the rotation centerline of the rotary stage 201 at equal intervals.

複數之夾頭平台202係與旋轉平台201一起，以旋轉平台201的中心線為中心旋轉。旋轉平台201的中心線，係設為垂直。每次旋轉平台201旋轉，與粗磨削部210、精磨削部220及受損層去除部230相向的夾頭平台202就會變更。The plurality of chuck tables 202 are rotated together with the rotary table 201 around the center line of the rotary table 201 . The center line of the rotating platform 201 is set to be vertical. Each time the rotary table 201 rotates, the chuck table 202 facing the rough grinding part 210 , the fine grinding part 220 and the damaged layer removing part 230 is changed.

各夾頭平台202，係藉由保護膠帶14而固持基板10。夾頭平台202，係在基板10之第二主表面12朝上的狀態下，水平地固持基板10。夾頭平台202係例如使用真空夾頭，亦可使用靜電夾頭等。Each chuck stage 202 holds the substrate 10 by the protective tape 14 . The chuck stage 202 holds the substrate 10 horizontally with the second main surface 12 of the substrate 10 facing upward. The chuck stage 202 uses, for example, a vacuum chuck, or an electrostatic chuck or the like.

圖5係顯示依本發明之一實施態樣之薄化部之粗磨削部的圖式。粗磨削部210，係進行基板10的粗磨削。如圖5所示，粗磨削部210，例如具有旋轉磨石211。旋轉磨石211，係以其中心線為中心旋轉並同時下降，進而對被夾頭平台202所固持之基板10的頂面(亦即第二主表面12)進行加工。5 is a diagram showing a rough grinding portion of a thinned portion according to an embodiment of the present invention. The rough grinding portion 210 performs rough grinding of the substrate 10 . As shown in FIG. 5 , the rough grinding unit 210 has, for example, a rotating grindstone 211 . The rotating grindstone 211 rotates around its centerline and descends at the same time, thereby processing the top surface (ie, the second main surface 12 ) of the substrate 10 held by the chuck table 202 .

精磨削部220，係進行基板10的精磨削。精磨削部220的構成與粗磨削部210的構成大致相同。但是，精磨削部220之旋轉磨石之磨粒的平均粒徑，係小於粗磨削部210之旋轉磨石之磨粒的平均粒徑。The fine grinding part 220 performs fine grinding of the substrate 10 . The structure of the fine grinding part 220 is substantially the same as that of the rough grinding part 210 . However, the average particle diameter of the abrasive grains of the rotating grindstone of the fine grinding part 220 is smaller than the average particle diameter of the abrasive grains of the rotating grindstone of the rough grinding part 210 .

受損層去除部230，係將因粗磨削或精磨削等磨削而形成於基板10之第二主表面12的受損層去除。例如，受損層去除部230，係對基板10供給處理液而進行濕蝕刻處理，以去除受損層。又，受損層的去除方法並未特別限定。The damaged layer removing portion 230 removes the damaged layer formed on the second main surface 12 of the substrate 10 by grinding such as rough grinding or fine grinding. For example, the damaged layer removing unit 230 supplies the processing liquid to the substrate 10 to perform wet etching treatment to remove the damaged layer. In addition, the removal method of a damaged layer is not specifically limited.

又，薄化部200，亦可具有進行基板10之研磨的研磨部。研磨部的構成與粗磨削部210的構成大致相同。基板10的研磨，例如可列舉CMP(化學機械研磨：Chemical Mechanical Polishing)等。又，薄化部200，亦可具有吸除部，其形成捕獲雜質之吸除點(例如，結晶缺陷或扭曲)。夾頭平台202的數量，雖在圖3中為4個，但可依照加工種類的數量而適當變更。又，亦可在一個加工部(例如，受損層去除部230)進行複數種類的加工(例如，去除受損層與形成吸除點)。In addition, the thinned portion 200 may have a polishing portion for polishing the substrate 10 . The configuration of the grinding portion is substantially the same as that of the rough grinding portion 210 . The polishing of the substrate 10 includes, for example, CMP (Chemical Mechanical Polishing) and the like. In addition, the thinned portion 200 may also have a gettering portion, which forms a gettering point for capturing impurities (eg, crystal defects or distortion). Although the number of chuck stages 202 is four in FIG. 3 , it can be appropriately changed according to the number of processing types. In addition, a plurality of types of processing (eg, removal of damaged layers and formation of suction points) may be performed in one processing section (eg, damaged layer removal section 230 ).

圖6係顯示依本發明之一實施態樣之紫外線照射部的圖式。紫外線照射部400，係使紫外線照射於用來保護經切割並薄化後之基板10的保護膠帶14。保護膠帶14的黏著劑可藉由紫外線的照射而硬化，進而降低保護膠帶14的黏著力。黏著力降低後，便可藉由剝離作業輕易地將保護膠帶14從基板10剝離。FIG. 6 is a diagram showing an ultraviolet irradiation part according to an embodiment of the present invention. The ultraviolet irradiation part 400 irradiates ultraviolet rays to the protective tape 14 for protecting the diced and thinned substrate 10 . The adhesive of the protective tape 14 can be hardened by irradiation of ultraviolet rays, thereby reducing the adhesive force of the protective tape 14 . After the adhesive force is reduced, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

紫外線照射部400，係在框體內部具有紫外線燈410，該框體係搬入有被保護膠帶14所保護之基板10。紫外線燈410，係以保護膠帶14為基準，將紫外線從與基板10相反側照射於保護膠帶14。The ultraviolet irradiation part 400 has an ultraviolet lamp 410 inside a frame body into which the substrate 10 protected by the protective tape 14 is loaded. The ultraviolet lamp 410 is based on the protective tape 14 and irradiates the protective tape 14 with ultraviolet rays from the side opposite to the substrate 10 .

圖7係顯示依本發明之一實施態樣之安裝部的圖式。在圖7中，兩點鏈線係表示黏著膠帶18及DAF15安裝後的狀態。安裝部500，係藉由以基板10為基準而設在與紫外線照射後之保護膠帶14之相反側的黏著膠帶18，將基板10裝設於框架19。黏著膠帶18，係以覆蓋環狀框架19之開口部的方式裝設於框架19，並在框架19的開口部與基板10貼合。FIG. 7 is a diagram showing a mounting portion according to an embodiment of the present invention. In FIG. 7 , the two-dot chain line indicates the state after the adhesive tape 18 and the DAF 15 are attached. The mounting portion 500 mounts the substrate 10 to the frame 19 by using the adhesive tape 18 provided on the opposite side of the protective tape 14 after the ultraviolet irradiation with the substrate 10 as a reference. The adhesive tape 18 is installed on the frame 19 so as to cover the opening of the annular frame 19 , and is attached to the substrate 10 at the opening of the frame 19 .

安裝部500，雖亦可僅藉由黏著膠帶18將切割並薄化後的基板10裝設於框架19，但在圖7中是藉由預先疊設好之黏著膠帶18及DAF15，裝設於框架19。DAF15，係形成為小於框架19的開口部，並設於框架19的內側。DAF15，係覆蓋整個基板10之第二主表面12。Although the mounting part 500 can also be mounted on the frame 19 with the cut and thinned substrate 10 only by the adhesive tape 18, in FIG. Frame 19. The DAF 15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19 . The DAF 15 covers the entire second main surface 12 of the substrate 10 .

安裝部500，例如包含：安裝平台510，其固持基板10及框架19；及疊層用滾子520，其藉由黏著膠帶18，對於被安裝平台510所固持之框架19裝設基板10。The mounting portion 500 includes, for example, a mounting platform 510 that holds the substrate 10 and the frame 19 , and a lamination roller 520 that mounts the substrate 10 to the frame 19 held by the mounting platform 510 using the adhesive tape 18 .

安裝平台510，係平行地固持框架19與配置於框架19之開口部的基板10。框架19及基板10，可被水平地固持。框架19的頂面與基板10的頂面，可具有與DAF15之厚度相同程度的高低差。又，在不使用DAF15的情況下，可將框架19的頂面與基板10的頂面配置於同一平面上。The mounting platform 510 holds the frame 19 and the substrate 10 disposed in the opening of the frame 19 in parallel. The frame 19 and the substrate 10 can be held horizontally. The top surface of the frame 19 and the top surface of the substrate 10 may have a height difference of the same degree as the thickness of the DAF 15 . In addition, when the DAF 15 is not used, the top surface of the frame 19 and the top surface of the substrate 10 can be arranged on the same plane.

黏著膠帶18等，係在捲繞於芯部的狀態下供給，再從芯部取出並使用。黏著膠帶18，係一邊藉由張力包附於疊層用滾子520，一邊通過疊層用滾子520與基板10之間，而疊設於基板10。又，黏著膠帶18，係一邊藉由張力包附於疊層用滾子520，一邊通過疊層用滾子520與框架19之間，而疊設於框架19。The adhesive tape 18 and the like are supplied while being wound around the core, and then taken out from the core and used. The adhesive tape 18 is attached to the lamination roller 520 by tension, and passes between the lamination roller 520 and the substrate 10 to be stacked on the substrate 10 . In addition, the adhesive tape 18 passes between the lamination roller 520 and the frame 19 while being attached to the lamination roller 520 by tension, and is stacked on the frame 19 .

如圖7所示，安裝部500，係使黏著膠帶18從框架19之一端側朝向另一端側，依序貼合於框架19及基板10。藉此，可抑制空氣的進入等。又，由於在使黏著膠帶18與基板10貼合的期間，係將基板10平坦地固持，故可抑制基板10的破損。As shown in FIG. 7 , in the mounting portion 500 , the adhesive tape 18 is sequentially attached to the frame 19 and the substrate 10 from one end side of the frame 19 to the other end side. Thereby, entry of air etc. can be suppressed. In addition, since the substrate 10 is held flat while the adhesive tape 18 is attached to the substrate 10 , breakage of the substrate 10 can be suppressed.

圖8係顯示依本發明之一實施態樣之剝離部的圖式。在圖8中，兩點鏈線係表示保護膠帶14剝離前的狀態。剝離部600，係將保護膠帶14從藉由黏著膠帶18裝設於框架19的基板10剝離。不需要用的保護膠帶14可予以去除。剝離部600，例如包含：剝離平台610及剝離用滾子620。FIG. 8 is a diagram showing a peeling portion according to an embodiment of the present invention. In FIG. 8 , the two-dot chain line indicates a state before the protective tape 14 is peeled off. The peeling part 600 peels off the protective tape 14 from the substrate 10 attached to the frame 19 by the adhesive tape 18 . Unnecessary protective tape 14 can be removed. The peeling part 600 includes, for example, a peeling table 610 and a peeling roller 620 .

保護膠帶14，係一邊藉由張力包附於剝離用滾子620，一邊通過剝離用滾子620與基板10之間，而從基板10剝離。此期間，剝離平台610，係藉由黏著膠帶18等平坦地固持基板10及框架19。從基板10剝離後的保護膠帶14，係捲收於未圖示的捲收芯部。The protective tape 14 is peeled off from the substrate 10 while passing between the peeling roller 620 and the substrate 10 while being wrapped around the peeling roller 620 by tension. During this period, the peeling stage 610 holds the substrate 10 and the frame 19 flat by the adhesive tape 18 or the like. The protective tape 14 peeled off from the board|substrate 10 is wound up by the winding core part which is not shown in figure.

如圖8所示，剝離部600，係一邊使保護膠帶14從基板10之一端側朝向另一端側依序變形，一邊從基板10剝離。藉此，可順暢地將保護膠帶14與基板10剝離。又，由於在將保護膠帶14與基板10剝離的期間，係將基板10平坦地固持，故可抑制基板10的破損。As shown in FIG. 8 , the peeling portion 600 is peeled off from the substrate 10 while sequentially deforming the protective tape 14 from one end side of the substrate 10 toward the other end side. Thereby, the protective tape 14 and the board|substrate 10 can be peeled off smoothly. Moreover, since the board|substrate 10 is hold|maintained flat while the protective tape 14 and the board|substrate 10 are peeled, the damage of the board|substrate 10 can be suppressed.

又，剝離部600，亦可將保護膠帶14與基板10平行地剝離。Moreover, the peeling part 600 may peel the protective tape 14 in parallel with the board|substrate 10.

圖9係顯示依本發明之一實施態樣之ID貼附部的圖式。ID貼附部700讀取保護膠帶14已剝離之基板10的識別資訊16(參照圖2)，再將讀取之識別資訊16印刷於標籤17(參照圖2參照)，並將印刷完成之標籤17貼附於框架19。識別資訊16係用以識別基板10的資訊，其以數字或文字、記號、一維條碼、二維條碼等來表示。FIG. 9 is a diagram showing an ID attaching part according to an embodiment of the present invention. The ID attaching part 700 reads the identification information 16 (refer to FIG. 2 ) of the substrate 10 from which the protective tape 14 has been peeled off, and then prints the read identification information 16 on the label 17 (refer to FIG. 2 ), and prints the printed label. 17 is attached to the frame 19. The identification information 16 is information for identifying the substrate 10 , which is represented by numbers or characters, symbols, one-dimensional barcodes, two-dimensional barcodes, and the like.

ID貼附部700，例如包含：ID貼附平台710、讀取裝置720及標籤印刷裝置730。ID貼附平台710藉由黏著膠帶18等固持基板10及框架19。讀取裝置720讀取預先形成於基板10的識別資訊16。標籤印刷裝置730將由讀取裝置720所讀取之識別資訊16印刷於標籤17，再將印刷完成之標籤17以貼合機等貼附於框架19。印刷於標籤17之識別資訊16與預先形成於基板10之識別資訊16，如圖2所示，可將相同內容以不同形式來表示。The ID attaching unit 700 includes, for example, an ID attaching platform 710 , a reading device 720 and a label printing device 730 . The ID attaching platform 710 holds the substrate 10 and the frame 19 by the adhesive tape 18 or the like. The reading device 720 reads the identification information 16 previously formed on the substrate 10 . The label printing device 730 prints the identification information 16 read by the reading device 720 on the label 17 , and then attaches the printed label 17 to the frame 19 by a laminating machine or the like. The identification information 16 printed on the label 17 and the identification information 16 pre-formed on the substrate 10, as shown in FIG. 2, can represent the same content in different forms.

接著，說明使用上述構成之基板處理系統1的基板處理方法。圖10係依本發明之一實施態樣之基板處理方法的流程圖。Next, a substrate processing method using the substrate processing system 1 having the above-described configuration will be described. FIG. 10 is a flowchart of a substrate processing method according to an embodiment of the present invention.

如圖10所示，基板處理方法包含下述步驟：搬入步驟S101、切割步驟S102、薄化步驟S103、紫外線照射步驟S104、安裝步驟S105、剝離步驟S106、ID貼附步驟S107及搬出步驟S108。該等步驟，係在藉由控制部20的控制下實施。又，該等步驟的順序，並不限定於圖10所示之順序。例如，亦可在薄化步驟S103後，進行切割步驟S102。As shown in FIG. 10, the substrate processing method includes the following steps: a loading step S101, a cutting step S102, a thinning step S103, an ultraviolet irradiation step S104, a mounting step S105, a peeling step S106, an ID attaching step S107, and an unloading step S108. These steps are implemented under the control of the control unit 20 . In addition, the order of these steps is not limited to the order shown in FIG. 10 . For example, the cutting step S102 may also be performed after the thinning step S103.

在搬入步驟S101中，主搬運部58將基板10從被置於搬入部30之搬入用晶圓匣盒35取出，再將取出之基板10搬運至切割部100。In the carrying-in step S101 , the main conveying unit 58 takes out the substrate 10 from the carrying cassette 35 placed in the carrying-in unit 30 , and then conveys the taken-out substrate 10 to the dicing unit 100 .

如圖4所示，在切割步驟S102中，由切割部100進行基板10的切割。在進行基板10切割的期間，基板10之第一主表面11係被保護膠帶14所保護。在切割部100所切割之基板10，藉由主搬運部58搬運至薄化部200。As shown in FIG. 4 , in the dicing step S102 , the dicing unit 100 performs dicing of the substrate 10 . During the dicing of the substrate 10 , the first main surface 11 of the substrate 10 is protected by the protective tape 14 . The substrate 10 cut by the cutting part 100 is conveyed to the thinning part 200 by the main conveying part 58 .

如圖5所示，在薄化步驟S103中，薄化部200藉由對基板10之第二主表面12進行加工以薄化基板10。在進行基板10薄化的期間，基板10之第一主表面11係被保護膠帶14所保護。在薄化部200所薄化之基板10，藉由主搬運部58搬運至後述傳遞部300後，再藉由後述第一副搬運部910搬運至紫外線照射部400。As shown in FIG. 5 , in the thinning step S103 , the thinning portion 200 thins the substrate 10 by processing the second main surface 12 of the substrate 10 . During the thinning of the substrate 10 , the first main surface 11 of the substrate 10 is protected by the protective tape 14 . The board|substrate 10 thinned by the thinning part 200 is conveyed to the transmission part 300 mentioned later by the main conveyance part 58, and is conveyed to the ultraviolet irradiation part 400 by the 1st sub-transport part 910 mentioned later.

如圖6所示，在紫外線照射步驟S104中，紫外線照射部400將紫外線照射於保護膠帶14。藉由紫外線的照射可使保護膠帶14的黏著劑硬化，而降低保護膠帶14的黏著力。黏著力降低後，便可藉由剝離作業輕易地將保護膠帶14從基板10剝離。As shown in FIG. 6 , in the ultraviolet irradiation step S104 , the ultraviolet irradiation unit 400 irradiates the protective tape 14 with ultraviolet rays. The adhesive of the protective tape 14 can be hardened by the irradiation of ultraviolet rays, thereby reducing the adhesive force of the protective tape 14 . After the adhesive force is reduced, the protective tape 14 can be easily peeled off from the substrate 10 by a peeling operation.

紫外線照射步驟S104，雖然亦可在安裝步驟S105之後進行，但在本實施態樣中，係在安裝步驟S105之前進行。藉此，可防止在安裝步驟S105與基板10貼合之黏著膠帶18，被紫外線照射而劣化。在紫外線照射部400受到紫外線照射之保護膠帶14所貼附的基板10，藉由後述第一副搬運部910被搬運至安裝部500。The ultraviolet irradiation step S104 may be performed after the mounting step S105, but in this embodiment, it is performed before the mounting step S105. As a result, the adhesive tape 18 attached to the substrate 10 in the mounting step S105 can be prevented from being degraded by irradiation with ultraviolet rays. The board|substrate 10 to which the protective tape 14 irradiated with the ultraviolet-ray irradiation part 400 is attached is conveyed to the mounting part 500 by the 1st sub-conveyance part 910 mentioned later.

如圖7所示，在安裝步驟S105中，安裝部500藉由黏著膠帶18，將已切割並薄化後之基板10裝設於框架19。安裝部500，雖然亦可僅藉由黏著膠帶18，將已切割並薄化後之基板10裝設於框架19，但在本實施態樣中，係藉由預先疊設好之黏著膠帶18及DAF15，將已切割並薄化後之基板10裝設於框架19。在安裝部500藉由黏著膠帶18裝設於框架19之基板10，藉由後述第二副搬運部920搬運至剝離部600。As shown in FIG. 7 , in the mounting step S105 , the mounting portion 500 mounts the cut and thinned substrate 10 to the frame 19 by using the adhesive tape 18 . Although the mounting portion 500 can also mount the cut and thinned substrate 10 on the frame 19 only by the adhesive tape 18, in this embodiment, the pre-stacked adhesive tape 18 and The DAF15 mounts the cut and thinned substrate 10 on the frame 19 . The mounting portion 500 is mounted on the substrate 10 of the frame 19 by the adhesive tape 18, and is transported to the peeling portion 600 by the second sub transport portion 920 described later.

如圖8所示，在剝離步驟S106中，剝離部600從藉由安裝部500透過黏著膠帶18裝設於框架19的基板10將保護膠帶14剝離。不需要的保護膠帶14可予以去除。已在剝離部600將保護膠帶14剝離之基板10，藉由後述之第三副搬運部930搬運至ID貼附部700。As shown in FIG. 8 , in the peeling step S106 , the peeling portion 600 peels off the protective tape 14 from the substrate 10 mounted on the frame 19 through the adhesive tape 18 by the mounting portion 500 . Unnecessary protective tape 14 can be removed. The board|substrate 10 which peeled the protective tape 14 in the peeling part 600 is conveyed to the ID sticking part 700 by the 3rd sub-conveying part 930 mentioned later.

如圖9所示，在ID貼附步驟S107中，ID貼附部700讀取預先形成於基板10的識別資訊16(參照圖2)，並將讀取到之識別資訊16印刷於標籤17(圖2參照)，再將印刷完成之標籤17貼附於框架19。As shown in FIG. 9 , in the ID attaching step S107 , the ID attaching unit 700 reads the identification information 16 (refer to FIG. 2 ) previously formed on the substrate 10 , and prints the read identification information 16 on the label 17 ( 2), and then attach the printed label 17 to the frame 19.

在搬出步驟S108中，主搬運部58將基板10從ID貼附部700搬運至搬出部40，並在搬出部40中，將基板10收納於搬出用晶圓匣盒45的內部。搬出用晶圓匣盒45，從搬出部40被搬出至外部。與搬出用晶圓匣盒45一起被搬出至外部的基板10，被逐片地拾取晶片13。以這種方式，製造晶片13。In the unloading step S108 , the main conveying unit 58 conveys the substrate 10 from the ID attaching unit 700 to the unloading unit 40 , and in the unloading unit 40 , accommodates the substrate 10 inside the unloading cassette 45 . The unloading cassette 45 is unloaded from the unloading unit 40 to the outside. The substrates 10 carried out to the outside together with the carry-out cassette 45 are picked up one by one for the wafers 13 . In this way, wafer 13 is manufactured.

圖11係顯示依本發明之一實施態樣之基板處理系統之主要部分的俯視圖。圖12係顯示依本發明之一實施態樣之安裝部、在安裝部上方與安裝部重疊設置的紫外線照射部及傳遞部的側面圖。圖13係顯示依本發明之一實施態樣之剝離部、及在剝離部上方與剝離部重疊設置之ID貼附部的側面圖。在圖11～圖13中，箭頭係表示在安裝部500或剝離部600等中的基板10及框架19的移動方向。FIG. 11 is a top view showing a main part of a substrate processing system according to an embodiment of the present invention. 12 is a side view showing a mounting portion according to an embodiment of the present invention, an ultraviolet irradiation portion and a transmission portion disposed above the mounting portion and overlapping the mounting portion. 13 is a side view showing a peeling portion according to an embodiment of the present invention, and an ID sticking portion provided above the peeling portion to overlap the peeling portion. In FIGS. 11 to 13 , arrows indicate the moving directions of the substrate 10 and the frame 19 in the mounting portion 500 , the peeling portion 600 , and the like.

基板處理系統1包含安裝部500。如圖12所示，安裝部500，例如包含：安裝平台510、疊層用滾子520、安裝平台引導部530、框架供給部540及框架搬運部550。The substrate processing system 1 includes the mounting unit 500 . As shown in FIG. 12 , the mounting portion 500 includes, for example, a mounting platform 510 , a stacking roller 520 , a mounting platform guide portion 530 , a frame supply portion 540 , and a frame conveying portion 550 .

如圖11所示，安裝平台引導部530，係在X方向上延伸，並在Y方向上隔著間隔設置了一對。安裝平台510可沿著一對安裝平台引導部530移動。作為使安裝平台510移動的驅動源，係例如使用伺服馬達。As shown in FIG. 11 , the mounting platform guides 530 are extended in the X direction, and a pair are provided at intervals in the Y direction. The mounting platform 510 is movable along a pair of mounting platform guides 530 . As a drive source for moving the mounting platform 510, for example, a servo motor is used.

如圖12所示，在安裝平台引導部530之後側端部的上方設有疊層用滾子520，而在安裝平台引導部530之前側端部的下方設有框架供給部540。框架供給部540，係從外部將收納有裝設基板10前的框架19之框架用晶圓匣盒541搬入。框架用晶圓匣盒541，係在Z方向上並列收納複數之框架19。又，亦可不設框架用晶圓匣盒541，亦可由作業員將框架19設置於框架供給部540。亦可分成複數次而每次複數片，將框架19設置於框架供給部540。As shown in FIG. 12 , the stacking roller 520 is provided above the rear end of the mounting platform guide 530 , and the frame supply portion 540 is provided below the front end of the mounting platform guide 530 . The frame supply unit 540 carries in the frame cassette 541 in which the frame 19 before mounting the substrate 10 is accommodated from the outside. The cassette 541 for frames accommodates a plurality of frames 19 in parallel in the Z direction. In addition, the cassette 541 for frames may not be provided, and the frame 19 may be set in the frame supply part 540 by an operator. It is also possible to set the frame 19 in the frame supply part 540 by dividing the frame 19 into a plurality of pieces each time.

如圖3所示，可將搬入部30及搬出部40設於主搬運路50之寬度方向的一側(前側)，而安裝部500則與主搬運路50之長邊方向的一端部鄰接設置。此情況下，如圖12所示，可從前側將框架用晶圓匣盒541搬入到框架供給部540。處理前的物品(基板10或框架19)從前側搬入，將處理後的物品(裝設有基板10之框架19)搬出至前側。可將物品的搬入搬出集中於前側，而提高維修或搬運效率。As shown in FIG. 3 , the carrying-in part 30 and the carrying-out part 40 may be provided on one side (front side) in the width direction of the main conveyance path 50 , and the mounting part 500 may be provided adjacent to one end in the longitudinal direction of the main conveyance path 50 . . In this case, as shown in FIG. 12 , the frame cassette 541 can be carried into the frame supply unit 540 from the front side. The articles before processing (the substrate 10 or the frame 19 ) are carried in from the front side, and the articles after the processing (the frame 19 on which the substrate 10 is mounted) are carried out to the front side. The loading and unloading of items can be concentrated on the front side, and the maintenance or transport efficiency can be improved.

框架搬運部550，係將框架19從置於框架供給部540之框架用晶圓匣盒541取出，再將取出之框架19載置於安裝平台510。框架搬運部550，例如在Z方向觀察下係配置於一對安裝平台引導部530之間，並可在Z方向上移動。作為使框架搬運部550移動的驅動源，係例如使用伺服馬達等。The frame conveying unit 550 takes out the frame 19 from the frame cassette 541 placed on the frame supply unit 540 , and then places the taken frame 19 on the mounting platform 510 . The frame conveyance portion 550 is disposed between the pair of mounting platform guide portions 530, for example, when viewed in the Z direction, and is movable in the Z direction. As a drive source which moves the frame conveyance part 550, a servomotor etc. are used, for example.

框架搬運部550具有吸附框架19的吸附部559。吸附部559係例如在X方向上隔著間隔設有複數個，並吸附著框架19之X方向兩端部。吸附部559具有抽吸孔。抽吸孔之氣體係例如被真空泵等抽吸源所抽吸。使抽吸源動作而令負壓產生於吸附部559，藉此使框架搬運部550真空吸附框架19。另一方面，使抽吸源的動作停止而將抽吸孔開放於大氣，藉此使框架搬運部550解除框架19的真空吸附。在解除真空吸附時，亦可使正壓產生於框架搬運部550。在本說明書中，所謂負壓係指低於大氣壓力的壓力，而所謂正壓係指高於大氣壓力的壓力。The frame conveying part 550 has a suction part 559 which suctions the frame 19 . The suction parts 559 are provided, for example, at intervals in the X direction, and suction both ends of the frame 19 in the X direction. The suction part 559 has suction holes. The gas system of the suction hole is sucked by a suction source such as a vacuum pump, for example. By operating the suction source to generate negative pressure in the suction part 559 , the frame conveying part 550 is caused to vacuum suction the frame 19 . On the other hand, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the frame conveying unit 550 releases the vacuum suction of the frame 19 . When releasing the vacuum suction, a positive pressure may be generated in the frame conveying part 550 . In this specification, the so-called negative pressure refers to the pressure lower than the atmospheric pressure, and the so-called positive pressure refers to the pressure higher than the atmospheric pressure.

安裝平台510，係在安裝平台引導部530之主搬運路50側(前側)的端部，從框架搬運部550承接框架19。具體而言，首先，框架搬運部550從圖12中以實線所示之位置升高至圖12中以兩點鏈線所示之位置，即於Z方向上通過在Y方向上隔著間隔設置之一對安裝平台引導部530之間。此時，安裝平台510，係在不妨礙框架搬運部550上升的退避位置待命。其後，當安裝平台510移動至框架搬運部550的正下方時，框架搬運部550下降，並將被框架搬運部550所固持之框架19載置於安裝平台510。The mounting platform 510 is attached to the end of the mounting platform guide portion 530 on the main conveyance path 50 side (front side), and receives the frame 19 from the frame conveyance portion 550 . Specifically, first, the frame conveying part 550 is raised from the position shown by the solid line in FIG. 12 to the position shown by the two-dot chain line in FIG. One pair of mounting platform guides 530 is provided. At this time, the mounting platform 510 is on standby at a retracted position that does not prevent the frame conveying portion 550 from rising. After that, when the mounting platform 510 is moved to just below the frame transporting portion 550 , the frame transporting portion 550 descends, and the frame 19 held by the frame transporting portion 550 is placed on the mounting platform 510 .

其後，安裝平台510以從主搬運路50遠離的方式往X方向(後側)移動，在往疊層用滾子520的正下方移動的途中，從後述第一副搬運部910承接基板10。基板10係配置於框架19的開口部，而安裝平台510係藉由保護膠帶14固持基板10。After that, the mounting table 510 is moved in the X direction (rear side) so as to be away from the main conveyance path 50 , and the substrate 10 is received from the first sub conveyance unit 910 described later on the way of moving directly below the stacking rollers 520 . . The substrate 10 is disposed in the opening of the frame 19 , and the mounting platform 510 holds the substrate 10 by the protective tape 14 .

其後，安裝平台510以進一步從主搬運路50遠離的方式往X方向(後側)移動，往疊層用滾子520的正下方移動。如圖7所示，疊層用滾子520將黏著膠帶18貼合於載置於安裝平台510的框架19、及配置於框架19之開口部的基板10。黏著膠帶18，係設置於以基板10作為基準時之與保護膠帶14相反之一側(上側)。After that, the mounting platform 510 is moved in the X direction (rear side) so as to be further away from the main conveyance path 50 , and is moved directly below the lamination rollers 520 . As shown in FIG. 7 , the lamination roller 520 adheres the adhesive tape 18 to the frame 19 placed on the mounting platform 510 and the substrate 10 arranged in the opening of the frame 19 . The adhesive tape 18 is provided on the opposite side (upper side) of the protective tape 14 when the substrate 10 is used as a reference.

基板處理系統1包含紫外線照射部400。如圖11及圖12所示，紫外線照射部400係在安裝部500的上方與安裝部500重疊設置。例如，紫外線照射部400，在Z方向觀察下，係與一對安裝平台引導部530重疊設置。The substrate processing system 1 includes an ultraviolet irradiation unit 400 . As shown in FIGS. 11 and 12 , the ultraviolet irradiation unit 400 is provided so as to overlap the mounting portion 500 above the mounting portion 500 . For example, the ultraviolet irradiation part 400 is provided to overlap with the pair of mounting platform guide parts 530 when viewed in the Z direction.

由於紫外線照射部400與安裝部500係在Z方向上疊設，故在Z方向觀察下，和紫外線照射部400與安裝部500為沿橫向並列設置的情況相比，可降低在Z方向觀察下之基板處理系統1的設置面積。又，將基板10從紫外線照射部400搬運至安裝部500的流程較佳。Since the ultraviolet irradiation part 400 and the mounting part 500 are superimposed in the Z direction, in the Z direction observation, compared with the case where the ultraviolet irradiation part 400 and the mounting part 500 are arranged side by side in the lateral direction, the reduction in the Z direction observation can be reduced. The installation area of the substrate processing system 1. Moreover, the flow of conveying the board|substrate 10 from the ultraviolet irradiation part 400 to the mounting part 500 is preferable.

基板處理系統1可包含傳遞部300，其從主搬運部58(參照圖3)承接已切割並薄化後之基板10。傳遞部300，從主搬運部58承接基板10，再將承接之基板10遞送至後述第一副搬運部910。The substrate processing system 1 may include a transfer unit 300 that receives the cut and thinned substrate 10 from the main conveyance unit 58 (see FIG. 3 ). The transfer unit 300 receives the substrates 10 from the main conveyance unit 58 and delivers the received substrates 10 to the first sub-conveyance unit 910 to be described later.

如圖11所示，傳遞部300係與主搬運路50鄰接，同時如圖12所示，在安裝部500的上方與安裝部500重疊設置。例如，傳遞部300在Z方向觀察下，係與一對安裝平台引導部530重疊設置。在安裝部500與主搬運路50之Y方向端部鄰接而設置的情況下，傳遞部300亦與主搬運路50之Y方向端部鄰接而設置。As shown in FIG. 11 , the transmission part 300 is adjacent to the main conveyance path 50 , and as shown in FIG. 12 , is provided so as to overlap the attachment part 500 above the attachment part 500 . For example, the transmission part 300 is provided to overlap with the pair of mounting platform guide parts 530 when viewed in the Z direction. When the attachment part 500 is provided adjacent to the Y direction end of the main conveyance path 50 , the transmission part 300 is also provided adjacent to the Y direction end of the main conveyance path 50 .

由於傳遞部300與安裝部500係在Z方向上疊設，故在Z方向觀察下，和安裝部500與傳遞部300為沿橫向並列設置的情況相比，可降低在Z方向觀察下之基板處理系統1的設置面積。又，可將傳遞部300配置於與紫外線照射部400相同的高度，並將傳遞部300配置於紫外線照射部400的旁邊，而使基板10從傳遞部300搬運至紫外線照射部400的流程為佳。Since the transmitting portion 300 and the mounting portion 500 are stacked in the Z direction, the substrate viewed in the Z direction can be reduced compared to the case where the mounting portion 500 and the transmitting portion 300 are arranged side by side in the lateral direction when viewed in the Z direction. The installation area of the processing system 1 . In addition, the transfer part 300 can be arranged at the same height as the ultraviolet irradiation part 400, and the transfer part 300 can be arranged beside the ultraviolet irradiation part 400, and the process of conveying the substrate 10 from the transfer part 300 to the ultraviolet irradiation part 400 is preferable. .

例如像圖11所示者，在Z方向觀察下，從前側到後側，係依序並列設置傳遞部300、紫外線照射部400及疊層用滾子520。因此，可提高基板10從傳遞部300經由紫外線照射部400再載置於安裝平台510的流程，進而提高基板10的搬運效率。For example, as shown in FIG. 11 , when viewed in the Z direction, the transmission part 300 , the ultraviolet irradiation part 400 , and the lamination roller 520 are arranged in parallel in this order from the front side to the rear side. Therefore, the process of remounting the substrate 10 from the transfer unit 300 to the mounting platform 510 via the ultraviolet irradiation unit 400 can be improved, thereby improving the conveyance efficiency of the substrate 10 .

傳遞部300可兼用作對準部，其取得用於將相對於框架19之基板10的裝設位置對位的資訊。藉此，例如因為在薄化部200與主搬運部58之間傳遞基板10，或在主搬運部58與傳遞部300之間傳遞基板10等，而產生基板10之位置偏移的情況下，可矯正基板10在X方向、Y方向或θ方向上的位置。其矯正係使框架19之開口部的中心與基板10的中心一致，並使相對於框架19之基板10的方向成為既定之方向。The transmission unit 300 can also be used as an alignment unit that acquires information for aligning the installation position of the substrate 10 with respect to the frame 19 . As a result, for example, when the substrate 10 is displaced by transferring the substrate 10 between the thinned portion 200 and the main conveying portion 58, or transferring the substrate 10 between the main conveying portion 58 and the transferring portion 300, or the like, the position of the substrate 10 is shifted. The position of the substrate 10 in the X direction, the Y direction or the θ direction can be corrected. The correction is performed so that the center of the opening of the frame 19 and the center of the base plate 10 are aligned, and the direction of the base plate 10 with respect to the frame 19 is a predetermined direction.

如圖12所示，傳遞部300例如包含：傳遞平台310，其固持基板10；拍攝部320，其拍攝被傳遞平台310所固持之基板10的影像；及旋轉驅動部330，其使傳遞平台310旋轉。作為傳遞平台310，例如雖係使用真空夾頭，但亦可使用靜電夾頭等。拍攝部320，例如設於傳遞平台310的上方，並從固持於傳遞平台310之基板10的上方拍攝基板10。旋轉驅動部330，係藉由使傳遞平台310旋轉，而變更以傳遞平台310所固持之基板10的拍攝位置。As shown in FIG. 12 , the transfer unit 300 includes, for example: a transfer platform 310 that holds the substrate 10 ; an imaging unit 320 that captures an image of the substrate 10 held by the transfer platform 310 ; and a rotational drive unit 330 that makes the transfer platform 310 rotate. As the transfer stage 310, for example, a vacuum chuck is used, but an electrostatic chuck or the like may also be used. The imaging unit 320 is provided, for example, above the transfer platform 310 , and images the substrate 10 from above the substrate 10 held on the transfer platform 310 . The rotation drive unit 330 changes the imaging position of the substrate 10 held by the transfer table 310 by rotating the transfer table 310 .

傳遞部300，係將藉由拍攝部320所拍攝之基板10的影像轉換成電信號，並傳輸至控制部20。控制部20，係對藉由拍攝部320所拍攝之基板10的影像進行影像處理，藉此偵測固持於傳遞平台310之基板10的位置。作為其偵測方法，係使用下述習知的方法：將基板10的圖案(例如分割圖案)與基準圖案進行比對的方法，或是從基板10外圍上的複數點求取基板10之中心點與基板10之方向的方法等。基板10的方向，係從形成於基板10外圍之凹口的位置等偵測。亦可使用定向平面代替凹口。藉此，控制部20可掌握固定於傳遞平台310之基板10在座標系上的位置。The transmitting unit 300 converts the image of the substrate 10 photographed by the photographing unit 320 into an electrical signal, and transmits it to the control unit 20 . The control unit 20 performs image processing on the image of the substrate 10 captured by the imaging unit 320 , thereby detecting the position of the substrate 10 held on the transfer platform 310 . As the detection method, the following conventional methods are used: a method of comparing the pattern of the substrate 10 (eg, a division pattern) with a reference pattern, or the center of the substrate 10 is obtained from a plurality of points on the periphery of the substrate 10 The method of the direction of the point and the substrate 10, and the like. The orientation of the substrate 10 is detected from the position of the notch formed on the periphery of the substrate 10 and the like. Orientation planes can also be used instead of notches. Thereby, the control unit 20 can grasp the position of the substrate 10 fixed to the transfer platform 310 on the coordinate system.

基板10之θ方向的對位，係例如藉由使傳遞平台310旋轉而進行。另一方面，基板10之X方向的對位或基板10之Y方向的對位，係在解除傳遞平台310對基板10的固持後進行，即在將基板10從傳遞部300經由紫外線照射部400，再搬運至安裝部500的期間進行。例如，基板10之X方向的對位或基板10之Y方向的對位，係在後述第一副搬運部910從傳遞平台310承接基板10時，或是第一副搬運部910將基板10遞送至安裝平台510時進行。藉此進行相對於安裝平台510之基板10的載置位置的對位，進而進行相對於框架19之基板10的裝設位置的對位。The alignment of the substrate 10 in the θ direction is performed, for example, by rotating the transfer stage 310 . On the other hand, the alignment of the substrate 10 in the X direction or the alignment in the Y direction of the substrate 10 is performed after releasing the holding of the substrate 10 by the transfer stage 310 , that is, after the substrate 10 is passed from the transfer unit 300 through the ultraviolet irradiation unit 400 . , and then carry it out to the mounting part 500 . For example, the alignment of the substrate 10 in the X direction or the alignment in the Y direction of the substrate 10 is performed when the first sub-conveyor 910 receives the substrate 10 from the transfer platform 310 , or when the first sub-conveyor 910 delivers the substrate 10 , which will be described later. until the platform 510 is installed. Thereby, alignment is performed with respect to the mounting position of the substrate 10 of the mounting platform 510 , and further alignment with respect to the mounting position of the substrate 10 of the frame 19 is performed.

基板處理系統1包含剝離部600。如圖13所示，剝離部600，例如包含：剝離平台610、剝離用滾子620及剝離平台引導部630。The substrate processing system 1 includes the peeling unit 600 . As shown in FIG. 13 , the peeling unit 600 includes, for example, a peeling table 610 , a peeling roller 620 , and a peeling table guide 630 .

如圖11所示，剝離平台引導部630，係在X方向上延伸，並在Y方向上隔著間隔設置一對。剝離平台610可沿著一對剝離平台引導部630移動。作為使剝離平台610移動的驅動源，例如使用伺服馬達。As shown in FIG. 11 , the peeling platform guides 630 are extended in the X direction, and a pair are provided at intervals in the Y direction. The peeling platform 610 is movable along a pair of peeling platform guides 630 . As a drive source which moves the peeling stage 610, a servomotor is used, for example.

如圖13所示，剝離平台610，係在剝離平台引導部630之X方向的中央部中，從後述第二副搬運部920承接框架19。框架19係預先藉由黏著膠帶18裝設有基板10。剝離平台610，係藉由黏著膠帶18固持基板10及框架19。As shown in FIG. 13 , the peeling table 610 is fastened to the center portion of the peeling table guide portion 630 in the X direction, and receives the frame 19 from a second sub-conveying portion 920 to be described later. The frame 19 is pre-installed with the substrate 10 by the adhesive tape 18 . The peeling platform 610 holds the substrate 10 and the frame 19 by the adhesive tape 18 .

其後，剝離平台610以從主搬運路50遠離的方式往X方向(後側)移動，並朝剝離用滾子620的正下方移動。如圖8所示，剝離用滾子620係一邊使保護膠帶14從基板10的一端側朝另一端側依序變形，一邊使其從基板10剝離。Then, the peeling table 610 moves to the X direction (rear side) so that it may move away from the main conveyance path 50, and it moves to the directly below the roller 620 for peeling. As shown in FIG. 8 , the peeling roller 620 peels off the protective tape 14 from the substrate 10 while sequentially deforming the protective tape 14 from one end side to the other end side of the substrate 10 .

基板處理系統1可包含ID貼附部700。如圖11及圖13所示，ID貼附部700係與主搬運路50鄰接而設置。主搬運部58，係將ID貼附部700貼附好標籤17之框架19，從ID貼附部700搬運至搬出部40，並收納至載置於搬出部40的搬出用晶圓匣盒45。The substrate processing system 1 may include the ID attaching part 700 . As shown in FIGS. 11 and 13 , the ID sticking unit 700 is provided adjacent to the main conveyance path 50 . The main conveying unit 58 is the frame 19 for attaching the label 17 to the ID sticking unit 700 , and is conveyed from the ID sticking unit 700 to the unloading unit 40 , and stored in the unloading cassette 45 placed on the unloading unit 40 . .

如圖11及圖13所示，基板處理系統1，可在剝離部600的上方與剝離部600重疊設置ID貼附部700。例如，ID貼附部700在Z方向觀察下，係與一對剝離平台引導部630重疊設置。As shown in FIGS. 11 and 13 , in the substrate processing system 1 , the ID sticking unit 700 may be provided above the peeling unit 600 to overlap the peeling unit 600 . For example, the ID sticking part 700 is provided to overlap with the pair of peeling table guide parts 630 when viewed in the Z direction.

因為剝離部600與ID貼附部700係在Z方向上疊設，故在Z方向觀察下，和剝離部600與ID貼附部700為沿橫向並列設置的情況相比，可降低在Z方向觀察下之基板處理系統1的設置面積。又，將基板10從剝離部600搬運至ID貼附部700的流程較佳。Since the peeling part 600 and the ID attaching part 700 are stacked in the Z direction, the Z direction can be reduced in the Z direction compared to the case where the peeling part 600 and the ID attaching part 700 are arranged side by side in the lateral direction. Observe the installation area of the substrate processing system 1 below. Moreover, the flow of conveying the board|substrate 10 from the peeling part 600 to the ID sticking part 700 is preferable.

如圖11等所示，基板處理系統1可包含：主搬運部58(參照圖3)、第一副搬運部910、第二副搬運部920及第三副搬運部930。主搬運部58，係將基板10從搬入部30經由切割部100或薄化部200再搬運至傳遞部300。第一副搬運部910，係將基板10從傳遞部300經由紫外線照射部400再搬運至安裝部500。第二副搬運部920，係將基板10從安裝部500搬運至剝離部600，並使基板10上下翻轉。第三副搬運部930，係將基板10從剝離部600搬運至ID貼附部700。主搬運部58，係將基板10從ID貼附部700搬運至搬出部40。As shown in FIG. 11 and the like, the substrate processing system 1 may include the main conveyance unit 58 (see FIG. 3 ), a first sub conveyance unit 910 , a second sub conveyance unit 920 , and a third sub conveyance unit 930 . The main conveying part 58 is used to convey the substrate 10 from the carrying part 30 to the conveying part 300 via the dicing part 100 or the thinning part 200 again. The first sub-conveying unit 910 re-conveys the substrate 10 from the transfer unit 300 to the mounting unit 500 via the ultraviolet irradiation unit 400 . The second sub-conveying part 920 conveys the substrate 10 from the mounting part 500 to the peeling part 600 and turns the substrate 10 upside down. The third sub-conveying unit 930 conveys the substrate 10 from the peeling unit 600 to the ID sticking unit 700 . The main conveying unit 58 conveys the substrate 10 from the ID sticking unit 700 to the unloading unit 40 .

第一副搬運部910可在X方向及Z方向上移動。如圖11所示，例如，X軸引導部911係相對於安裝部500加以固定。Z軸引導部913係固定於沿著X軸引導部911在X方向上移動的X軸滑件912。而第一副搬運部910係固定於沿著Z軸引導部913在Z方向上移動的Z軸滑件914。又，第一副搬運部910，亦可為了基板10之Y方向的對位，而進一步往Y方向移動。The first sub-conveying unit 910 is movable in the X direction and the Z direction. As shown in FIG. 11 , for example, the X-axis guide portion 911 is fixed to the mounting portion 500 . The Z-axis guide portion 913 is fixed to the X-axis slider 912 that moves in the X direction along the X-axis guide portion 911 . On the other hand, the first sub-conveying portion 910 is fixed to the Z-axis slider 914 that moves in the Z-direction along the Z-axis guide portion 913 . In addition, the first sub-conveying portion 910 may be further moved in the Y direction for alignment of the substrate 10 in the Y direction.

第一副搬運部910吸附基板10。第一副搬運部910為了抑制基板10的變形或破損，可具有大於基板10之主表面(例如第二主表面12)的吸附面。可平坦地固持基板10之第二主表面12之整體，進而可抑制基板10的變形或破損。The first sub-conveying unit 910 adsorbs the substrate 10 . In order to suppress deformation or damage of the substrate 10 , the first sub-conveying portion 910 may have a suction surface larger than the main surface (eg, the second main surface 12 ) of the substrate 10 . The entirety of the second main surface 12 of the substrate 10 can be held flat, thereby suppressing deformation or damage of the substrate 10 .

第一副搬運部910，例如以多孔夾頭所構成，具有多孔體。多孔體之孔洞的氣體，例如被真空泵等抽吸源所抽吸。使抽吸源動作而使負壓產生於第一副搬運部910，藉此使第一副搬運部910真空吸附基板10。另一方面，使抽吸源之動作停止而將多孔質體的孔開放於大氣，以使第一副搬運部910解除基板10的真空吸附。解除真空吸附時，亦可使正壓產生於第一副搬運部910。The first sub-conveying part 910 is constituted by, for example, a porous chuck, and has a porous body. The gas in the pores of the porous body is sucked by a suction source such as a vacuum pump, for example. The suction source is actuated to generate a negative pressure in the first sub-conveying part 910 , whereby the first sub-conveying part 910 is vacuum suctioned to the substrate 10 . On the other hand, the operation of the suction source is stopped and the pores of the porous body are opened to the atmosphere, so that the first sub-conveyor 910 releases the vacuum suction of the substrate 10 . When the vacuum suction is released, positive pressure may be generated in the first sub-conveying part 910 .

第一副搬運部910，係藉由固持基板10並在X方向及Z方向上移動，將基板10從傳遞部300經由紫外線照射部400再搬運至安裝部500。例如，將基板10從傳遞平台310向上舉起，通過紫外線燈410的上方，再下降至安裝平台510。作為使第一副搬運部910移動的驅動源，例如使用伺服馬達等。The first sub-conveying unit 910 holds the substrate 10 and moves the substrate 10 in the X direction and the Z direction, and then conveys the substrate 10 from the transfer unit 300 to the mounting unit 500 via the ultraviolet irradiation unit 400 . For example, the substrate 10 is lifted up from the transfer platform 310 , passes over the ultraviolet lamp 410 , and then descends to the mounting platform 510 . As a drive source which moves the 1st sub conveyance part 910, a servomotor etc. are used, for example.

第一副搬運部910，係在保護膠帶14朝下之狀態從上方固持基板10，並於在Y方向上延伸之紫外線燈410的上方沿著X方向移動。紫外線燈410為了可照射保護膠帶14之Y方向全體，故紫外線燈410的Y方向尺寸係大於基板10的直徑。第一副搬運部910通過紫外線燈410上方的速度，係以能夠充分地降低保護膠帶14的黏著力的方式加以設定。The first sub-conveyor 910 holds the substrate 10 from above with the protective tape 14 facing downward, and moves in the X direction above the ultraviolet lamp 410 extending in the Y direction. Since the ultraviolet lamp 410 can irradiate the entire Y direction of the protective tape 14 , the dimension in the Y direction of the ultraviolet lamp 410 is larger than the diameter of the substrate 10 . The speed at which the first sub-conveyor 910 passes over the ultraviolet lamp 410 is set so that the adhesive force of the protective tape 14 can be sufficiently reduced.

依本實施態樣，由於在紫外線照射於保護膠帶14的期間，係以第一副搬運部910固持基板10，故能以主搬運部58固持並搬運其他基板10。因此，可提高整個基板處理系統1之基板10的搬運效率，進而提高整個基板處理系統1之基板10的處理速度。According to the present embodiment, since the substrate 10 is held by the first sub-conveying portion 910 while the protective tape 14 is irradiated with ultraviolet rays, other substrates 10 can be held and conveyed by the main conveying portion 58 . Therefore, the conveyance efficiency of the substrates 10 of the entire substrate processing system 1 can be improved, and the processing speed of the substrates 10 of the entire substrate processing system 1 can be improved.

第二副搬運部920可在Y方向或Z方向上移動。如圖12所示，例如Y軸引導部921係相對於安裝部500及剝離部600加以固定。Y軸引導部921，在Z方向觀察下係橫跨安裝部500及剝離部600雙方而設置。Z軸引導部923係固定於沿著Y軸引導部921在Y方向上移動的Y軸滑件922。翻轉部925係固定於沿著Z軸引導部923在Z方向上移動的Z軸滑件924。翻轉部925係以翻轉軸926為中心，可上下翻轉地固持第二副搬運部920。翻轉軸926的軸方向，在本實施態樣中可為Y方向，亦可為X方向。The second sub-conveying part 920 is movable in the Y direction or the Z direction. As shown in FIG. 12 , for example, the Y-axis guide portion 921 is fixed to the mounting portion 500 and the peeling portion 600 . The Y-axis guide portion 921 is provided across both the mounting portion 500 and the peeling portion 600 when viewed in the Z direction. The Z-axis guide portion 923 is fixed to the Y-axis slider 922 that moves in the Y direction along the Y-axis guide portion 921 . The inversion portion 925 is fixed to the Z-axis slider 924 that moves in the Z direction along the Z-axis guide portion 923 . The reversing part 925 is centered on the reversing shaft 926, and holds the second sub-conveying part 920 so as to be able to be turned upside down. The axial direction of the inversion shaft 926 may be the Y direction or the X direction in this embodiment.

第二副搬運部920具有吸附框架19的吸附部929。在翻轉軸926的軸方向(例如Y方向)上，隔著間隔設有複數吸附部929(參照圖14)，其吸附框架19之Y方向兩端部。吸附部929具有抽吸孔。抽吸孔的氣體係例如被真空泵等抽吸源所抽吸。使抽吸源動作而使負壓產生於第二副搬運部920，藉此使第二副搬運部920真空吸附框架19。另一方面，使抽吸源的動作停止而將抽吸孔開放於大氣，藉此使第二副搬運部920解除框架19的真空吸附。解除真空吸附時，亦可使正壓產生於第二副搬運部920。The second sub-conveying part 920 has a suction part 929 that suctions the frame 19 . In the axial direction (for example, the Y direction) of the inversion shaft 926, a plurality of suction portions 929 (see FIG. 14 ) are provided at intervals, and the suction portions 929 suction both ends of the frame 19 in the Y direction. The suction part 929 has suction holes. The gas system of the suction hole is sucked by a suction source such as a vacuum pump, for example. The suction source is actuated to generate a negative pressure in the second sub-conveying portion 920 , thereby causing the second sub-conveying portion 920 to vacuum suction the frame 19 . On the other hand, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the second sub-conveying unit 920 releases the vacuum suction of the frame 19 . When the vacuum suction is released, positive pressure may be generated in the second sub-conveying part 920 .

圖14係顯示依本發明之一實施態樣之第二副搬運部之動作的圖式。在圖14中，箭頭係表示從安裝部500到剝離部600之基板10及框架19的移動方向。第二副搬運部920，係藉由固持框架19並在Y方向及Z方向上移動，將已藉由黏著膠帶18而裝設於框架19的基板10從安裝部500搬運至剝離部600。作為使第二副搬運部920移動的驅動源，例如使用伺服馬達等。FIG. 14 is a diagram showing the operation of the second auxiliary conveying part according to an embodiment of the present invention. In FIG. 14 , arrows indicate the moving directions of the substrate 10 and the frame 19 from the mounting portion 500 to the peeling portion 600 . The second sub-conveying unit 920 moves the substrate 10 mounted on the frame 19 by the adhesive tape 18 from the mounting unit 500 to the peeling unit 600 by holding the frame 19 and moving in the Y and Z directions. As a drive source for moving the second sub-conveying unit 920, for example, a servo motor or the like is used.

第二副搬運部920，係將框架19從安裝平台510向上舉起後，藉由翻轉部925例如使框架19從圖14中以實線所示之位置，移動至圖14中以一點鏈線所示之位置。藉此，將已藉由黏著膠帶18而裝設於框架19的基板10上下翻轉。其後，第二副搬運部920係如圖14中以兩點鏈線所示，將框架19載置於剝離平台610。剝離平台610，係以不干擾複數吸附部929的方式，固持框架19之Y方向中央部，該複數吸附部929係在翻轉軸926之軸方向(在本實施態樣中為Y方向)隔著間隔設置。The second sub-transporting portion 920 lifts the frame 19 upward from the mounting platform 510 , and moves the frame 19 from the position shown by the solid line in FIG. 14 to the one-point chain line in FIG. the position shown. Thereby, the substrate 10 mounted on the frame 19 by the adhesive tape 18 is turned upside down. After that, the second sub-conveying unit 920 places the frame 19 on the peeling platform 610 as shown by the two-dotted chain line in FIG. 14 . The peeling platform 610 holds the central portion in the Y direction of the frame 19 in a manner not to interfere with the plurality of suction portions 929, which are separated from each other in the axial direction (the Y direction in this embodiment) of the reversing shaft 926. interval setting.

依本實施態樣，基板10在從安裝部500搬運至剝離部600的過程中，藉由翻轉部925而上下翻轉。藉此，可使將基板10夾在中間而設置的黏著膠帶18與保護膠帶14的配置相反。具體而言，在基板10的下側係配置黏著膠帶18，而在基板10的上側係配置保護膠帶14。由於保護膠帶14係以基板10為基準而配置於與剝離平台610相反側，故較容易從基板10剝離。According to this embodiment, the substrate 10 is turned upside down by the turning portion 925 in the process of being conveyed from the mounting portion 500 to the peeling portion 600 . Thereby, the arrangement of the adhesive tape 18 and the protective tape 14 which are provided with the substrate 10 therebetween can be reversed. Specifically, the adhesive tape 18 is arranged on the lower side of the substrate 10 , and the protective tape 14 is arranged on the upper side of the substrate 10 . Since the protective tape 14 is arranged on the opposite side of the peeling platform 610 with reference to the substrate 10 , it is easier to peel off from the substrate 10 .

第三副搬運部930可在X方向及Z方向上移動。如圖11所示，例如X軸引導部931係相對於剝離部600固定。Z軸引導部933係固定於沿著X軸引導部931在X方向上移動的X軸滑件932。第三副搬運部930係固定於沿著Z軸引導部933在Z方向上移動的Z軸滑件934。又，第三副搬運部930亦可為了基板10之Y方向的對位，而進一步往Y方向移動。The third sub-conveying unit 930 is movable in the X direction and the Z direction. As shown in FIG. 11 , for example, the X-axis guide portion 931 is fixed to the peeling portion 600 . The Z-axis guide portion 933 is fixed to the X-axis slider 932 that moves in the X direction along the X-axis guide portion 931 . The third sub-conveying portion 930 is fixed to the Z-axis slider 934 that moves in the Z-direction along the Z-axis guide portion 933 . In addition, the third sub-conveying portion 930 may be further moved in the Y direction for alignment of the substrate 10 in the Y direction.

第三副搬運部930具有吸附框架19的吸附部939。例如在X方向上隔著間隔設置複數吸附部939，其吸附框架19之X方向兩端部。吸附部939具有抽吸孔。抽吸孔的氣體係例如被真空泵等抽吸源所抽吸。使抽吸源動作而使負壓產生於第三副搬運部930，藉此使第三副搬運部930真空吸附框架19。另一方面，使抽吸源的動作停止並將抽吸孔開放於大氣，藉此使第三副搬運部930解除框架19的真空吸附。解除真空吸附時，亦可使正壓產生於第三副搬運部930。The third sub-conveying part 930 has a suction part 939 that suctions the frame 19 . For example, a plurality of suction parts 939 are provided at intervals in the X direction, and the suction parts 939 suction the both ends of the frame 19 in the X direction. The suction part 939 has suction holes. The gas system of the suction hole is sucked by a suction source such as a vacuum pump, for example. The suction source is actuated to generate a negative pressure in the third sub-conveying portion 930 , thereby causing the third sub-conveying portion 930 to vacuum the frame 19 . On the other hand, by stopping the operation of the suction source and opening the suction hole to the atmosphere, the third sub-conveying unit 930 releases the vacuum suction of the frame 19 . When the vacuum suction is released, positive pressure may be generated in the third sub-conveying part 930 .

第三副搬運部930，係藉由固持框架19並在X方向及Z方向上移動，將已藉由黏著膠帶18而裝設於框架19的基板10從剝離部600搬運至ID貼附部700。例如，將基板10從剝離平台610向上舉起，再下降至ID貼附平台710。作為使第三副搬運部930移動的驅動源，例如使用伺服馬達等。The third sub-conveying unit 930 holds the frame 19 and moves in the X and Z directions to convey the substrate 10 mounted on the frame 19 by the adhesive tape 18 from the peeling unit 600 to the ID attaching unit 700 . For example, the substrate 10 is lifted up from the peeling stage 610 and then lowered to the ID attaching stage 710 . As a drive source for moving the third sub-conveying unit 930, a servo motor or the like is used, for example.

在第一變形例中，與上述實施態樣不同，並沒有第三副搬運部930，第三副搬運部930的功用係由主搬運部58加以實現。亦即，主搬運部58會將基板10從剝離部600搬運至ID貼附部700。以下，主要針對相異點進行說明。In the first modification, unlike the above-described embodiment, the third sub-conveying portion 930 is not provided, and the function of the third sub-conveying portion 930 is realized by the main conveying portion 58 . That is, the main conveyance part 58 conveys the board|substrate 10 from the peeling part 600 to the ID sticking part 700. Hereinafter, the differences will be mainly described.

圖15係顯示依第一變形例之剝離部及在剝離部的上方與剝離部重疊設置之ID貼附部的側面圖。在圖15中，箭頭係表示在剝離部600等中之基板10及框架19的移動方向。如圖15所示，剝離部600係與主搬運路50鄰接而設置。15 is a side view showing a peeling portion according to a first modification and an ID sticking portion provided above the peeling portion to overlap the peeling portion. In FIG. 15 , arrows indicate the moving directions of the substrate 10 and the frame 19 in the peeling portion 600 and the like. As shown in FIG. 15, the peeling part 600 is provided adjacent to the main conveyance path 50.

剝離平台610係在剝離平台引導部630之X方向中央部，從第二副搬運部920承接框架19。框架19係預先藉由黏著膠帶18而裝設有基板10。剝離平台610，係藉由黏著膠帶18固持基板10及框架19。The peeling table 610 is located at the center portion of the peeling table guide portion 630 in the X direction, and receives the frame 19 from the second sub-conveying portion 920 . The frame 19 is preliminarily mounted with the substrate 10 by means of the adhesive tape 18 . The peeling platform 610 holds the substrate 10 and the frame 19 by the adhesive tape 18 .

其後，剝離平台610以從主搬運路50遠離的方式往X方向(後側)移動，即朝向剝離用滾子620的正下方移動。如圖8所示，剝離用滾子620係使保護膠帶14一邊從基板10之一端側朝另一端側依序變形，一邊從基板10剝離。Then, the peeling table 610 moves to the X direction (rear side) so that it may move away from the main conveyance path 50, that is, moves directly below the roller 620 for peeling. As shown in FIG. 8 , the peeling roller 620 peels off the protective tape 14 from the substrate 10 while sequentially deforming the protective tape 14 from the one end side to the other end side of the substrate 10 .

其後，剝離平台610以接近主搬運路50的方式往X方向(前側)移動，在剝離平台引導部630之主搬運路50側(前側)的端部中，將框架19遞送至主搬運部58(參照圖3)。主搬運部58，係藉由一邊固持框架19一邊在Z方向及X方向上移動，而將框架19載置於ID貼附平台710。After that, the peeling table 610 moves in the X direction (front side) so as to approach the main conveyance path 50, and at the end of the peeling table guide 630 on the main conveyance path 50 side (front side), the frame 19 is delivered to the main conveying section 58 (see Figure 3). The main conveying unit 58 moves the frame 19 in the Z direction and the X direction while holding the frame 19 to place the frame 19 on the ID sticking table 710 .

依本變形例，與上述實施態樣不同，並沒有第三副搬運部930，第三副搬運部930的功用係由主搬運部58加以實現。亦即，主搬運部58會將基板10從剝離部600搬運至ID貼附部700。藉此，可使主搬運部58多功能化，而提高主搬運部58的工作量，進而改善主搬運部58的可用率。According to this modification, unlike the above-described embodiment, there is no third sub-conveying portion 930 , and the function of the third sub-conveying portion 930 is realized by the main conveying portion 58 . That is, the main conveyance part 58 conveys the board|substrate 10 from the peeling part 600 to the ID sticking part 700. Thereby, the main conveying part 58 can be multi-functional, the workload of the main conveying part 58 can be increased, and the availability of the main conveying part 58 can be improved.

在第二變形例中，與上述第一變形例不同，並沒有第一副搬運部910，第一副搬運部910的功用係由主搬運部58加以實現。亦即，主搬運部58會將切割並薄化後基板10，依序搬運至紫外線照射部400及安裝部500。在本變形例中，由於並沒有第一副搬運部910，故可不具有將基板10從主搬運部58轉送至第一副搬運部910的傳遞部300。以下，主要針對相異點進行說明。In the second modification, unlike the first modification described above, there is no first sub-conveying portion 910 , and the function of the first sub-conveying portion 910 is realized by the main conveying portion 58 . That is, the main conveying part 58 conveys the cut and thinned substrate 10 to the ultraviolet irradiation part 400 and the mounting part 500 in order. In this modification, since the first sub-conveying unit 910 is not provided, the transfer unit 300 for transferring the substrate 10 from the main conveying unit 58 to the first sub-conveying unit 910 may not be provided. Hereinafter, the differences will be mainly described.

圖16係顯示依第二變形例之基板處理系統之主要部分的俯視圖。在圖16中，箭頭係表示在安裝部500或剝離部600等中之基板10及框架19的移動方向。如圖16所示，紫外線照射部400及安裝部500係與主搬運路50鄰接而設置。在安裝部500與主搬運路50之Y方向一端部鄰接而設置的情況下，紫外線照射部400亦與主搬運路50之Y方向一端部鄰接而設置。FIG. 16 is a plan view showing a main part of a substrate processing system according to a second modification. In FIG. 16, arrows indicate the moving directions of the substrate 10 and the frame 19 in the mounting portion 500, the peeling portion 600, or the like. As shown in FIG. 16 , the ultraviolet irradiation part 400 and the attachment part 500 are provided adjacent to the main conveyance path 50 . When the attachment portion 500 is provided adjacent to one end portion in the Y direction of the main conveyance path 50 , the ultraviolet irradiation portion 400 is also provided adjacent to one end portion in the Y direction of the main conveyance path 50 .

主搬運部58(參照圖3)，係藉由固持基板10並在Y方向及Z方向上移動，將基板10依序搬運至紫外線照射部400及安裝部500。主搬運部58，首先從主搬運路50***至紫外線照射部400。The main conveyance unit 58 (see FIG. 3 ) moves the substrate 10 in the Y direction and the Z direction while holding the substrate 10 to convey the substrate 10 to the ultraviolet irradiation unit 400 and the mounting unit 500 in this order. The main conveyance unit 58 is first inserted into the ultraviolet irradiation unit 400 from the main conveyance path 50 .

主搬運部58，係在保護膠帶14朝下的狀態從上方固持基板10，並於X方向上延伸之紫外線燈410的上方沿著Y方向移動。紫外線燈410為了可照射保護膠帶14之X方向的整體，故紫外線燈410的X方向尺寸係大於基板10的直徑。主搬運部58通過紫外線燈410上方的速度，係以能夠充分降低保護膠帶14的黏著力的方式加以設定。The main conveying portion 58 holds the substrate 10 from above with the protective tape 14 facing downward, and moves in the Y direction above the ultraviolet lamp 410 extending in the X direction. Since the ultraviolet lamp 410 can irradiate the entire protective tape 14 in the X direction, the dimension in the X direction of the ultraviolet lamp 410 is larger than the diameter of the substrate 10 . The speed at which the main conveying part 58 passes over the ultraviolet lamp 410 is set so that the adhesive force of the protective tape 14 can be sufficiently reduced.

接著，主搬運部58，係從紫外線照射部400拉出至主搬運路50，在主搬運路50中下降，接著從主搬運路50***安裝部500。其後，主搬運部58，係在安裝部500內部下降，而將基板10遞送至安裝平台510。Next, the main conveyance part 58 is pulled out from the ultraviolet irradiation part 400 to the main conveyance path 50 , descends in the main conveyance path 50 , and then inserted into the mounting part 500 from the main conveyance path 50 . After that, the main conveying unit 58 descends inside the mounting unit 500 to deliver the substrate 10 to the mounting platform 510 .

安裝平台510，係在安裝平台引導部530之主搬運路50側(前側)的端部中，承接基板10與框架19雙方。安裝平台510，亦可先承接基板10與框架19中任一個。The mounting platform 510 is attached to the end portion of the mounting platform guide portion 530 on the main conveyance path 50 side (front side), and receives both the substrate 10 and the frame 19 . The mounting platform 510 can also receive any one of the substrate 10 and the frame 19 first.

依本變形例，與上述第一變形例不同，並沒有第一副搬運部910，第一副搬運部910的功用係由主搬運部58加以實現。亦即，主搬運部58會將切割並薄化後基板10依序搬運至紫外線照射部400及安裝部500。藉此，可使主搬運部58多功能化，而提高主搬運部58的工作量，進而改善主搬運部58的可用率。According to this modification, unlike the above-described first modification, there is no first sub-conveying portion 910 , and the function of the first sub-conveying portion 910 is realized by the main conveying portion 58 . That is, the main conveying part 58 conveys the cut and thinned substrate 10 to the ultraviolet irradiation part 400 and the mounting part 500 in order. Thereby, the main conveying part 58 can be multi-functional, the workload of the main conveying part 58 can be increased, and the availability of the main conveying part 58 can be improved.

以上，雖針對基板處理系統及基板處理方法的實施態樣加以說明，但本發明並不限定於上述實施態樣等，而係可在申請專利範圍所記載之本發明要旨的範圍內，進行各種的變更及改良。In the above, the embodiments of the substrate processing system and the substrate processing method have been described, but the present invention is not limited to the above-described embodiments and the like, and various implementations are possible within the scope of the gist of the present invention described in the scope of the patent application. changes and improvements.

例如，關於上述實施態樣，揭露以下附帶記述。 (附記1) 一種基板處理方法，其包含下述步驟： 紫外線照射步驟，紫外線照射部將紫外線照射於保護基板的保護膠帶； 安裝步驟，安裝部藉由以該基板為基準而設於與紫外線照射後之該保護膠帶之相反側的黏著膠帶，使該基板裝設於框架；及 剝離步驟，剝離部將該保護膠帶從藉由該黏著膠帶而裝設於該框架的該基板剝離； 其中，將該基板從在該安裝部之垂直方向上方與該安裝部重疊設置的該紫外線照射部搬運至該安裝部。For example, regarding the above-mentioned embodiment, the following supplementary descriptions are disclosed. (Supplement 1) A substrate processing method, comprising the following steps: In the ultraviolet irradiation step, the ultraviolet irradiation part irradiates the ultraviolet rays on the protective tape for protecting the substrate; an installation step, wherein the installation part installs the substrate on the frame by using an adhesive tape provided on the opposite side of the protective tape after ultraviolet irradiation with the substrate as a reference; and a peeling step, wherein the peeling part peels off the protective tape from the substrate mounted on the frame by the adhesive tape; Here, the substrate is conveyed to the mounting portion from the ultraviolet irradiation portion provided to overlap the mounting portion above the mounting portion in the vertical direction.

(附記2) 如附記1所記載之基板處理方法，其中， 將藉由該黏著膠帶而裝設於該框架前的該基板，從載置於搬入部的搬入用晶圓匣盒取出； 將藉由該黏著膠帶而裝設於該框架後的該基板，收納至載置於搬出部的搬出用晶圓匣盒； 使固持該基板的主搬運部沿著與該搬入部、該安裝部、該剝離部及該搬出部鄰接而設置的主搬運路移動。(Supplement 2) The substrate processing method as described in appendix 1, wherein, taking out the substrate mounted in front of the frame by the adhesive tape from the wafer cassette for loading placed on the loading portion; accommodating the substrate mounted on the frame by the adhesive tape in a cassette for unloading placed on the unloading part; The main conveyance part holding the board is moved along the main conveyance path provided adjacent to the carry-in part, the mounting part, the peeling part, and the carry-out part.

(附記3) 如附記2所記載之基板處理方法，更包含， ID貼附步驟，ID貼附部讀取已剝離該保護膠帶之該基板的識別資訊，並將讀取之該識別資訊印刷於標籤，再將印刷完成之標籤貼附於該框架； 在垂直方向觀察下，該基板係從與該主搬運路鄰接而設置的該ID貼附部搬運至該搬出部。(Supplement 3) The substrate processing method as described in Supplementary Note 2, further comprising, In the ID attaching step, the ID attaching part reads the identification information of the substrate from which the protective tape has been peeled off, prints the read identification information on the label, and then attaches the printed label to the frame; When viewed in the vertical direction, the substrate is conveyed to the unloading portion from the ID sticking portion provided adjacent to the main conveyance path.

(附記4) 如附記3所記載之基板處理方法，其中， 該基板，係從該剝離部搬運至在該剝離部之垂直方向上方與該剝離部重疊設置的該ID貼附部。(Supplement 4) The substrate processing method as described in appendix 3, wherein, The substrate is conveyed from the peeling portion to the ID sticking portion provided to overlap the peeling portion above the vertical direction of the peeling portion.

(附記5) 如附記3或4所記載之基板處理方法，其中， 將該基板從該搬入部搬運至在垂直方向觀察下，與該主搬運路鄰接，同時在該安裝部垂直方向上方與該安裝部重疊設置的傳遞部時，係使該主搬運部移動； 將該基板從該傳遞部經由該紫外線照射部再搬運至該安裝部時，係使固持該基板的第一副搬運部移動； 將該基板從該安裝部搬運至該剝離部，並使該基板上下翻轉時，係使固持該框架的第二副搬運部移動； 將該基板從該剝離部搬運至該ID貼附部時，係使固持該框架的第三副搬運部移動； 將該基板從該ID貼附部搬運至該搬出部時，係使該主搬運部移動。(Supplement 5) The substrate processing method as described in appendix 3 or 4, wherein, When the substrate is conveyed from the carrying part to the transfer part which is adjacent to the main conveying road when viewed in the vertical direction and is overlapped with the installation part in the vertical direction above the installation part, the main conveying part is moved; When the substrate is re-transported from the transfer part to the mounting part via the ultraviolet irradiation part, the first sub-transport part holding the substrate is moved; When the substrate is transported from the mounting part to the peeling part, and the substrate is turned upside down, the second sub-transporting part holding the frame is moved; When the substrate is transported from the peeling part to the ID attaching part, the third sub-transporting part holding the frame is moved; When the board is conveyed from the ID sticking unit to the unloading unit, the main conveying unit is moved.

(附記6) 如附記3或4所記載之基板處理方法，其中， 將該基板從該搬入部搬運至在垂直方向觀察下，與該主搬運路鄰接，同時在該安裝部之垂直方向上方與該安裝部重疊設置的傳遞部時，係使該主搬運部移動； 將該基板從該傳遞部經由該紫外線照射部再搬運至該安裝部時，係使固持該基板的第一副搬運部移動； 將該基板從該安裝部搬運至該剝離部，並使該基板上下翻轉時，係使固持該框架的第二副搬運部移動； 將該基板從該剝離部經由該ID貼附部再搬運至該搬出部時，係使該主搬運部移動。(Supplement 6) The substrate processing method as described in appendix 3 or 4, wherein, When the substrate is transported from the loading portion to a transfer portion that is adjacent to the main transport path when viewed in the vertical direction, and at the same time is arranged to overlap the mounting portion above the mounting portion in the vertical direction, the main transport portion is moved; When the substrate is re-transported from the transfer part to the mounting part via the ultraviolet irradiation part, the first sub-transport part holding the substrate is moved; When the substrate is transported from the mounting part to the peeling part, and the substrate is turned upside down, the second sub-transporting part holding the frame is moved; When the substrate is re-conveyed from the peeling part to the carrying-out part via the ID sticking part, the main conveying part is moved.

(附記7) 如附記5或6所記載之基板處理方法，其中， 在該傳遞部中，取得用於將相對於該框架之該基板的裝設位置對位的資訊。(Supplement 7) The substrate processing method as described in appendix 5 or 6, wherein, In the transmission section, information for aligning the installation position of the substrate with respect to the frame is acquired.

(附記8) 如附記3或4所記載之基板處理方法，其中， 將該基板從該搬入部經由該紫外線照射部再搬運至該安裝部時，係使該主搬運部移動； 將該基板從該安裝部搬運至該剝離部，並使該基板上下翻轉時，係使固持該框架的副搬運部移動； 將該基板從該剝離部經由該ID貼附部再搬運至該搬出部時，係使該主搬運部移動。(Supplement 8) The substrate processing method as described in appendix 3 or 4, wherein, When the substrate is transported from the loading section to the mounting section via the ultraviolet irradiation section, the main transport section is moved; When the board is conveyed from the mounting part to the peeling part, and the board is turned upside down, the auxiliary conveying part holding the frame is moved; When the substrate is re-conveyed from the peeling part to the carrying-out part via the ID sticking part, the main conveying part is moved.

(附記9) 如附記2～8中任1項所記載之基板處理方法，其中， 該主搬運路係在水平之既定方向上延伸，該搬入部及該搬出部係設於該主搬運路之寬度方向一側，而該安裝部係與該主搬運路之長邊方向一端部鄰接而設置； 該安裝部包含：框架供給部，其將收納有裝設該基板前之該框架的框架用晶圓匣盒從外部搬入； 對於該框架供給部，該框架用晶圓匣盒係從該寬度方向一側搬入。(Supplement 9) The substrate processing method according to any one of Supplementary Notes 2 to 8, wherein, The main conveyance path extends in a predetermined horizontal direction, the carry-in portion and the carry-out portion are provided on one side of the main conveyance path in the width direction, and the mounting portion is adjacent to one end portion in the longitudinal direction of the main conveyance path while setting; The mounting unit includes a frame supply unit that carries in the frame cassette containing the frame before the substrate is mounted from the outside; In the frame supply unit, the cassette for the frame is carried in from one side in the width direction.

1‧‧‧基板處理系統 2‧‧‧改質層 10‧‧‧基板 11‧‧‧第一主表面 12‧‧‧第二主表面 13‧‧‧晶片 14‧‧‧保護膠帶 15‧‧‧DAF(裸晶貼附膜：Die Attach Film) 16‧‧‧識別資訊 17‧‧‧標籤 18‧‧‧黏著膠帶 19‧‧‧框架 20‧‧‧控制部 21‧‧‧CPU(中央處理單元：Central Processing Unit) 22‧‧‧儲存媒體 23‧‧‧輸入介面 24‧‧‧輸出介面 30‧‧‧搬入部 31、41‧‧‧載置板 35‧‧‧搬入用晶圓匣盒 36、46‧‧‧收納板 40‧‧‧搬出部 45‧‧‧搬出用晶圓匣盒 50‧‧‧主搬運路 51‧‧‧Y軸引導部 52‧‧‧Y軸滑件 58‧‧‧主搬運部 100‧‧‧切割部 110‧‧‧切割平台 120‧‧‧基板加工部 121‧‧‧雷射振盪器 122‧‧‧光學系統 130‧‧‧移動機構部 200‧‧‧薄化部 201‧‧‧旋轉平台 202‧‧‧夾頭平台 210‧‧‧粗磨削部 211‧‧‧旋轉磨石 220‧‧‧精磨削部 230‧‧‧受損層去除部 300‧‧‧傳遞部 310‧‧‧傳遞平台 320‧‧‧拍攝部 330‧‧‧旋轉驅動部 400‧‧‧紫外線照射部 410‧‧‧紫外線燈 500‧‧‧安裝部 510‧‧‧安裝平台 520‧‧‧疊層用滾子 530‧‧‧安裝平台引導部 540‧‧‧框架供給部 541‧‧‧框架用晶圓匣盒 550‧‧‧框架搬運部 559、929、939‧‧‧吸附部 600‧‧‧剝離部 610‧‧‧剝離平台 620‧‧‧剝離用滾子 630‧‧‧剝離平台引導部 700‧‧‧ID貼附部 710‧‧‧ID貼附平台 720‧‧‧讀取裝置 730‧‧‧標籤印刷裝置 910‧‧‧第一副搬運部 911、931‧‧‧X軸引導部 912、932‧‧‧X軸滑件 913、923、933‧‧‧Z軸引導部 914、924、934‧‧‧Z軸滑件 920‧‧‧第二副搬運部 921‧‧‧Y軸引導部 922‧‧‧Y軸滑件 925‧‧‧翻轉部 926‧‧‧翻轉軸 930‧‧‧第三副搬運部 S101～S108‧‧‧步驟1‧‧‧Substrate processing system 2‧‧‧modified layer 10‧‧‧Substrate 11‧‧‧First main surface 12‧‧‧Second main surface 13‧‧‧Chip 14‧‧‧Protective tape 15‧‧‧DAF (Die Attach Film) 16‧‧‧Identifying Information 17‧‧‧Label 18‧‧‧Adhesive tape 19‧‧‧Framework 20‧‧‧Control Department 21‧‧‧CPU (Central Processing Unit) 22‧‧‧Storage media 23‧‧‧Input interface 24‧‧‧Output interface 30‧‧‧Moving in 31, 41‧‧‧ Mounting plate 35‧‧‧Wafer cassettes for loading 36, 46‧‧‧Storage board 40‧‧‧Removal Department 45‧‧‧Wafer cassettes for unloading 50‧‧‧Main Carry Road 51‧‧‧Y-axis guide 52‧‧‧Y-axis slide 58‧‧‧Main Handling Department 100‧‧‧Cutting section 110‧‧‧Cutting platform 120‧‧‧Substrate Processing Department 121‧‧‧Laser oscillator 122‧‧‧Optical System 130‧‧‧Mobile Mechanism Department 200‧‧‧Thinning 201‧‧‧Rotating platform 202‧‧‧Chuck platform 210‧‧‧Rough grinding department 211‧‧‧Rotary Grinding Stone 220‧‧‧Fine Grinding Department 230‧‧‧Removal of damaged layer 300‧‧‧Transmission Department 310‧‧‧Transfer Platform 320‧‧‧Photography Department 330‧‧‧Rotary drive 400‧‧‧UV irradiation 410‧‧‧UV Lamp 500‧‧‧Installation Department 510‧‧‧Installation Platform 520‧‧‧Rollers for lamination 530‧‧‧Installation platform guide 540‧‧‧Frame Supply Department 541‧‧‧Wafer cassettes for frames 550‧‧‧Frame Handling Department 559, 929, 939‧‧‧Adsorption part 600‧‧‧Peeling part 610‧‧‧Peeling Platform 620‧‧‧Peeling roller 630‧‧‧Peeling platform guide 700‧‧‧ID Attachment Department 710‧‧‧ID Attachment Platform 720‧‧‧Reading device 730‧‧‧Label printing device 910‧‧‧First Deputy Handling Department 911, 931‧‧‧X-axis guide 912, 932‧‧‧X-axis slide 913, 923, 933‧‧‧Z-axis guide 914, 924, 934‧‧‧Z-axis slide 920‧‧‧Second Transportation Department 921‧‧‧Y-axis guide 922‧‧‧Y-axis slide 925‧‧‧Turnover 926‧‧‧Flip axis 930‧‧‧The Third Transport Department Steps S101～S108‧‧‧

圖1係顯示藉由依本發明之一實施態樣之基板處理系統處理前之基板的立體圖。 圖2係顯示藉由依本發明之一實施態樣之基板處理系統處理後之基板的立體圖。 圖3係顯示依本發明之一實施態樣之基板處理系統的俯視圖。 圖4係顯示依本發明之一實施態樣之切割部的圖式。 圖5係顯示依本發明之一實施態樣之薄化部之粗磨削部的圖式。 圖6係顯示依本發明之一實施態樣之紫外線照射部的圖式。 圖7係顯示依本發明之一實施態樣之安裝部的圖式。 圖8係顯示依本發明之一實施態樣之剝離部的圖式。 圖9係顯示依本發明之一實施態樣之ID貼附部的圖式。 圖10係顯示依本發明之一實施態樣之基板處理方法的流程圖。 圖11係顯示依本發明之一實施態樣之基板處理系統之主要部分的俯視圖。 圖12係顯示依本發明之一實施態樣之安裝部、在安裝部之上方與安裝部重疊設置之紫外線照射部，及傳遞部的側面圖。 圖13係顯示依本發明之一實施態樣之剝離部、及在剝離部之上方與剝離部重疊設置之ID貼附部的側面圖。 圖14係顯示依本發明之一實施態樣之第二副搬運部之動作的圖式。 圖15係顯示依本發明之第一變形例之剝離部、及在剝離部之上方與剝離部重疊設置之ID貼附部的側面圖。 圖16係顯示依本發明之第二變形例之基板處理系統之主要部分的俯視圖。FIG. 1 is a perspective view showing a substrate before processing by a substrate processing system according to an embodiment of the present invention. 2 is a perspective view showing a substrate after being processed by the substrate processing system according to an embodiment of the present invention. 3 is a top view showing a substrate processing system according to an embodiment of the present invention. FIG. 4 is a diagram showing a cutting portion according to an embodiment of the present invention. 5 is a diagram showing a rough grinding portion of a thinned portion according to an embodiment of the present invention. FIG. 6 is a diagram showing an ultraviolet irradiation part according to an embodiment of the present invention. FIG. 7 is a diagram showing a mounting portion according to an embodiment of the present invention. FIG. 8 is a diagram showing a peeling portion according to an embodiment of the present invention. FIG. 9 is a diagram showing an ID attaching part according to an embodiment of the present invention. FIG. 10 is a flowchart showing a substrate processing method according to an embodiment of the present invention. FIG. 11 is a top view showing a main part of a substrate processing system according to an embodiment of the present invention. 12 is a side view showing a mounting portion, an ultraviolet irradiation portion disposed above the mounting portion and overlapping the mounting portion, and a transmission portion according to an embodiment of the present invention. 13 is a side view showing a peeling portion according to an embodiment of the present invention, and an ID attaching portion provided above the peeling portion to overlap the peeling portion. FIG. 14 is a diagram showing the operation of the second auxiliary conveying part according to an embodiment of the present invention. 15 is a side view showing a peeling portion according to a first modification of the present invention, and an ID sticking portion provided above the peeling portion to overlap the peeling portion. FIG. 16 is a plan view showing a main part of a substrate processing system according to a second modification of the present invention.

1‧‧‧基板處理系統 1‧‧‧Substrate processing system

10‧‧‧基板 10‧‧‧Substrate

14‧‧‧保護膠帶 14‧‧‧Protective tape

15‧‧‧DAF(裸晶貼附膜：Die Attach Film) 15‧‧‧DAF (Die Attach Film)

19‧‧‧框架 19‧‧‧Framework

20‧‧‧控制部 20‧‧‧Control Department

21‧‧‧CPU(中央處理單元：Central Processing Unit) 21‧‧‧CPU (Central Processing Unit)

22‧‧‧儲存媒體 22‧‧‧Storage media

23‧‧‧輸入介面 23‧‧‧Input interface

24‧‧‧輸出介面 24‧‧‧Output interface

30‧‧‧搬入部 30‧‧‧Moving in

31‧‧‧載置板 31‧‧‧Place plate

35‧‧‧搬入用晶圓匣盒 35‧‧‧Wafer cassettes for loading

36‧‧‧收納板 36‧‧‧Storage board

40‧‧‧搬出部 40‧‧‧Removal Department

41‧‧‧載置板 41‧‧‧Place plate

45‧‧‧搬出用晶圓匣盒 45‧‧‧Wafer cassettes for unloading

46‧‧‧收納板 46‧‧‧Storage board

50‧‧‧主搬運路 50‧‧‧Main Carry Road

51‧‧‧Y軸引導部 51‧‧‧Y-axis guide

52‧‧‧Y軸滑件 52‧‧‧Y-axis slide

58‧‧‧主搬運部 58‧‧‧Main Handling Department

100‧‧‧切割部 100‧‧‧Cutting section

200‧‧‧薄化部 200‧‧‧Thinning

201‧‧‧旋轉平台 201‧‧‧Rotating platform

202‧‧‧夾頭平台 202‧‧‧Chuck platform

210‧‧‧粗磨削部 210‧‧‧Rough grinding department

220‧‧‧精磨削部 220‧‧‧Fine Grinding Department

230‧‧‧受損層去除部 230‧‧‧Removal of damaged layer

300‧‧‧傳遞部 300‧‧‧Transmission Department

400‧‧‧紫外線照射部 400‧‧‧UV irradiation

410‧‧‧紫外線燈 410‧‧‧UV Lamp

500‧‧‧安裝部 500‧‧‧Installation Department

510‧‧‧安裝平台 510‧‧‧Installation Platform

520‧‧‧疊層用滾子 520‧‧‧Rollers for lamination

600‧‧‧剝離部 600‧‧‧Peeling part

610‧‧‧剝離平台 610‧‧‧Peeling Platform

620‧‧‧剝離用滾子 620‧‧‧Peeling roller

700‧‧‧ID貼附部 700‧‧‧ID Attachment Department

710‧‧‧ID貼附平台 710‧‧‧ID Attachment Platform

Claims (5)

一種基板處理系統，包含：安裝部，藉由將黏著膠帶貼合至基板及框架，以形成藉由前述黏著膠帶將前述基板裝設於前述框架而成之裝設物；搬入部，將收納有藉由前述黏著膠帶裝設於前述框架前之前述基板的搬入用晶圓匣盒，從外部搬入；搬出部，將收納有前述裝設物之搬出用晶圓匣盒，搬出至外部；主搬運路，在垂直方向觀察下，與前述搬入部、前述安裝部及前述搬出部鄰接而設置；主搬運部，固持前述基板並沿著前述主搬運路移動，以搬運前述基板；及ID貼附部，讀取前述基板的識別資訊，將讀取之前述識別資訊印刷於標籤，並將印刷完成之前述標籤貼附於前述裝設物；前述ID貼附部在垂直方向觀察下，係與前述主搬運路鄰接而設置。 A substrate processing system, comprising: an installation part for attaching an adhesive tape to a substrate and a frame to form an installation in which the substrate is installed on the frame by using the adhesive tape; The carrying-in cassette of the substrate mounted on the front of the frame by the adhesive tape is carried in from the outside; the carry-out section carries out the carrying-out cassette containing the mounted objects to the outside; the main conveying A road, when viewed in a vertical direction, is provided adjacent to the carrying-in part, the mounting part, and the carrying-out part; a main conveying part holds the substrate and moves along the main conveying path to convey the substrate; and an ID attaching part , read the identification information of the substrate, print the read identification information on the label, and attach the printed label to the installation object; the ID attaching part is viewed in the vertical direction and is connected to the main It is installed adjacent to the conveyance road. 如請求項1所記載之基板處理系統，其中具備：切割部，進行前述基板的切割；前述切割部在垂直方向觀察下與前述主搬運路鄰接而設置。 The substrate processing system according to claim 1, further comprising: a dicing unit for dicing the substrate; and the dicing unit is provided adjacent to the main conveyance path when viewed in a vertical direction. 如請求項1或2所記載之基板處理系統，其中具備：薄板化部，將前述基板薄板化；前述薄板化部在垂直方向觀察下與前述主搬運路鄰接而設置。 The substrate processing system according to claim 1 or 2, further comprising: a thinning unit for thinning the substrate; and the thinning unit is provided adjacent to the main conveyance path when viewed in a vertical direction. 一種基板處理系統，包含： 安裝部，藉由將黏著膠帶貼合至基板及框架，以形成藉由前述黏著膠帶將前述基板裝設於框架而成之裝設物；搬入部，將收納有藉由前述黏著膠帶裝設於前述框架前之前述基板的搬入用晶圓匣盒，從外部搬入；搬出部，將收納有前述裝設物之搬出用晶圓匣盒，搬出至外部；主搬運路，在垂直方向觀察下，與前述搬入部、前述安裝部及前述搬出部鄰接而設置；及主搬運部，固持前述基板並沿著前述主搬運路移動，以搬運前述基板；前述主搬運路於水平的預定方向延伸，前述搬入部及前述搬出部設置於前述主搬運路的寬度方向的一側，前述安裝部與前述主搬運路的長邊方向一端部鄰接而設置；前述安裝部具有從外部將框架用晶圓匣盒搬入之框架供給部，前述框架用晶圓匣盒收納裝設前述基板前之前述框架；前述框架用晶圓匣盒係從前述寬度方向的一側搬入至前述框架供給部。 A substrate processing system, comprising: The installation part is formed by attaching the adhesive tape to the substrate and the frame to form an installation which is formed by attaching the substrate to the frame with the adhesive tape; The wafer cassette for carrying the substrate before the frame is carried in from the outside; the carry-out section carries the wafer cassette for carrying out the carrying object containing the installation objects to the outside; the main conveying path is viewed in the vertical direction, and a main conveying part for holding the substrate and moving along the main conveying path to convey the substrate; the main conveying path extends in a predetermined horizontal direction, and the The carrying-in part and the carrying-out part are provided on one side in the width direction of the main conveyance path, and the attachment part is provided adjacent to one end in the longitudinal direction of the main conveyance path; In the loaded frame supply unit, the frame cassette accommodates the frame before the substrate is mounted, and the frame wafer cassette is loaded into the frame supply unit from one side in the width direction. 一種基板處理方法，具有：安裝部藉由將黏著膠帶貼合至基板及框架，以形成藉由前述黏著膠帶將前述基板裝設於前述框架而成之裝設物；從放置於搬入部之搬入用晶圓匣盒，取出藉由前述黏著膠帶裝設至前述框架前之前述基板；將前述裝設物收納於放置於搬出部之搬出用晶圓匣盒； 使固持前述基板之主搬運部沿著主搬運路移動，前述主搬運路與前述搬入部、前述安裝部及前述搬出部鄰接而設置；ID貼附部讀取前述基板的識別資訊，將讀取之前述識別資訊印刷於標籤，並將印刷完成之前述標籤貼附於前述裝設物；從前述ID貼附部將前述基板搬運至前述搬出部，前述ID貼附部於垂直方向觀察下與前述主搬運路鄰接而設置。A substrate processing method, comprising: a mounting part attaches an adhesive tape to a substrate and a frame to form an installation in which the substrate is mounted on the frame by the adhesive tape; Using a wafer cassette, take out the substrate before being mounted on the frame by the adhesive tape; store the mounted object in the unloading wafer cassette placed in the unloading part; The main conveying part holding the substrate is moved along the main conveying path, and the main conveying path is provided adjacent to the carrying-in part, the mounting part, and the carrying-out part; the ID sticking part reads the identification information of the board, and reads the The above identification information is printed on the label, and the printed label is attached to the installation object; the substrate is transported from the ID attaching part to the unloading part, and the ID attaching part is viewed in the vertical direction. The main conveyance road is adjacent and installed.
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