TWI771753B - Wafer box detection device and wafer box detection method - Google Patents
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Abstract
本發明提供一種晶圓盒檢測裝置，適於對一盒體進行檢測，盒體內配置有複數個待測物，且晶圓盒檢測裝置包括一臺座、一影像感測單元、一旋轉機構以及一控制單元。臺座適於承載盒體；影像感測單元用以偵測這些待測物且擷取一第一影像以及一第二影像；旋轉機構配置於臺座以及影像感測單元之間；控制單元電性連接於旋轉機構以及影像感測單元，且控制單元包括一輸出單元。此外，本發明還提供一種透過上述晶圓盒檢測裝置檢測盒體的晶圓盒檢測方法。 The invention provides a wafer box detection device, which is suitable for detecting a box body, wherein a plurality of objects to be detected are arranged in the box body, and the wafer box detection device includes a base, an image sensing unit, a rotating mechanism and a control unit. The pedestal is suitable for carrying the box body; the image sensing unit is used to detect the objects to be tested and capture a first image and a second image; the rotating mechanism is arranged between the pedestal and the image sensing unit; the control unit is electrically It is sexually connected to the rotating mechanism and the image sensing unit, and the control unit includes an output unit. In addition, the present invention also provides a wafer cassette inspection method for inspecting the cassette body through the above-mentioned wafer cassette inspection device.
Description
本發明提供一種晶圓盒檢測裝置及晶圓盒檢測方法，且特別是關於一種可透過相異二方向所擷取的二影像偵測盒體中待測物配置資訊的晶圓盒檢測裝置，以及利用上述晶圓盒檢測裝置實現檢測流程自動化的晶圓盒檢測方法。 The present invention provides a wafer box detection device and a wafer box detection method, and particularly relates to a wafer box detection device capable of detecting the configuration information of an object to be tested in a box body through two images captured in two different directions, And a wafer box detection method using the above-mentioned wafer box detection device to realize the automation of the detection process.
晶圓是一種在半導體產業中被高度利用的電子元件。一般而言，裝配有晶圓的晶圓盒可大致分為前開式通用晶圓盒(front opening unified pod,FOUP)以及前開式晶圓運輸盒(front opening shipping box,FOSB)兩大種類，這兩種晶圓盒通常會以壓克力等透明材質製成，且在運送過程中，晶圓盒會被放入包裝晶圓盒的專用袋體內，以避免運輸過程中外界的雜質混入從而汙染晶圓。 A wafer is an electronic component that is highly utilized in the semiconductor industry. Generally speaking, wafer cassettes equipped with wafers can be roughly divided into two categories: front opening unified pod (FOUP) and front opening shipping box (FOSB). The two types of wafer cassettes are usually made of transparent materials such as acrylic, and during the transportation process, the wafer cassettes will be put into a special bag for packaging the wafer cassettes to avoid contamination caused by the mixing of external impurities during transportation. wafer.
然而，在進行包裝前或後，需要確認晶圓盒內裝配的晶圓片是否有缺漏、重疊或歪斜等不良配置情況發生，而這些確認步驟多半以人工的方式進行，不僅曠日廢時，且僅藉由單一角度的目視，工作人員較難以發現視覺死角上的不良配置情況，進而造成檢測流程的延宕、檢測良率的降低以及人力的耗費。 However, before or after packaging, it is necessary to confirm whether the wafers assembled in the wafer cassette are missing, overlapping or skewed, and these confirmation steps are mostly performed manually, which is not only time-consuming, but also And only by visual inspection from a single angle, it is more difficult for the staff to find the bad configuration on the blind spot of the vision, which in turn causes the delay of the inspection process, the reduction of inspection yield and the consumption of manpower.
發明人遂竭其心智悉心研究，進而研發出一種可透過相異二方向所擷取的二影像偵測盒體中待測物配置資訊的晶圓盒檢測裝置，以及利用上述晶圓盒檢測裝置實現檢測流程自動化的晶圓盒檢測方法，以期達到加速檢測流程、提高檢測良率以及節省人力的效果。 The inventor then exhausted his mind and researched carefully, and further developed a wafer box inspection device that can detect the configuration information of the object to be tested in the box body through two images captured in two different directions, and use the above wafer box inspection device. A wafer cassette inspection method that automates the inspection process, in order to achieve the effect of accelerating the inspection process, improving the inspection yield and saving manpower.
本發明提供一種晶圓盒檢測裝置，適於對一盒體進行檢測，盒體內配置有複數個待測物，且晶圓盒檢測裝置包括一臺座、一影像感測單元、一旋轉機構以及一控制單元。臺座適於承載盒體；影像感測單元用以偵測這些待測物且擷取一第一影像以及一第二影像；旋轉機構配置於臺座以及影像感測單元之間；控制單元電性連接於旋轉機構以及影像感測單元，且控制單元包括一輸出單元，其中，控制單元接收第一影像以及第二影像，對第一影像以及第二影像執行一影像辨識程序，且透過輸出單元輸出這些待測物的一配置資訊。 The invention provides a wafer box detection device, which is suitable for detecting a box body, wherein a plurality of objects to be detected are arranged in the box body, and the wafer box detection device includes a base, an image sensing unit, a rotating mechanism and a control unit. The pedestal is suitable for carrying the box body; the image sensing unit is used to detect the objects to be tested and capture a first image and a second image; the rotating mechanism is arranged between the pedestal and the image sensing unit; the control unit is electrically The control unit is connected to the rotating mechanism and the image sensing unit, and the control unit includes an output unit, wherein the control unit receives the first image and the second image, performs an image recognition program on the first image and the second image, and transmits the image through the output unit. A configuration information of the objects to be tested is output.
在一實施例中，晶圓盒檢測裝置還包括一發光單元，且發光單元用以在影像感測單元擷取第一影像以及第二影像時提供一光源。 In one embodiment, the wafer cassette inspection apparatus further includes a light-emitting unit, and the light-emitting unit is used for providing a light source when the image sensing unit captures the first image and the second image.
在一實施例中，上述的影像感測單元包括複數個影像感測器，且這些影像感測器沿待測物的排列方向配置。 In one embodiment, the above-mentioned image sensing unit includes a plurality of image sensors, and these image sensors are arranged along the arrangement direction of the objects to be tested.
在一實施例中，上述的盒體包括一第一角部以及一第二角部，且第一影像以及第二影像分別為影像感測單元透過第一角部以及第二角部擷取的二影像。 In one embodiment, the box body includes a first corner and a second corner, and the first image and the second image are captured by the image sensing unit through the first corner and the second corner, respectively. Two images.
另一方面，本發明還提供一種晶圓盒檢測方法，適於透過上述的晶圓盒檢測裝置檢測一盒體，且晶圓盒檢測方法包括：將盒體配置於臺座上，影像感測單元擷取包括待測物的一第一影像，控制單元驅動旋轉機構以使盒體以及影像感測單元彼此相對旋轉一角度；影像感測單元擷取包括待測物的一第二影像；控制單元接收第一影像以及第二影像，並對第一影像以及第二影像執行一影像辨識程序，以及控制單元透過輸出單元輸出這些待測物的一配置資訊。 On the other hand, the present invention also provides a wafer cassette detection method, which is suitable for detecting a cassette body through the above-mentioned wafer cassette detection device, and the wafer cassette detection method includes: arranging the cassette body on a pedestal, and image sensing The unit captures a first image including the object to be tested, the control unit drives the rotating mechanism to make the box body and the image sensing unit rotate relative to each other at an angle; the image sensing unit captures a second image including the object to be tested; control The unit receives the first image and the second image, and executes an image recognition program on the first image and the second image, and the control unit outputs a configuration information of the objects to be tested through the output unit.
在一實施例中，上述的影像辨識程序包括：將第一影像以及第二影像中盒體的內部劃分為複數個區間，以及依據這些區間內的影像灰階值分佈與一標準灰階值分佈進行比對，判斷待測物的配置資訊。 In one embodiment, the above-mentioned image recognition process includes: dividing the inside of the box in the first image and the second image into a plurality of intervals, and according to the image grayscale value distribution and a standard grayscale value distribution in these intervals Compare and judge the configuration information of the object to be tested.
在一實施例中，上述的影像感測單元包括複數個影像感測器，這些影像感測器沿待測物的排列方向配置，且這些影像感測器分別擷取這些區間中的部份區間。 In one embodiment, the above-mentioned image sensing unit includes a plurality of image sensors, the image sensors are arranged along the arrangement direction of the object to be tested, and the image sensors capture part of the intervals respectively .
在一實施例中，上述的配置資訊包括這些待測物的一正常資訊、一重疊資訊、一空缺資訊以及一歪斜資訊。 In one embodiment, the above-mentioned configuration information includes a normal information, an overlap information, a vacancy information and a skew information of the objects to be tested.
在一實施例中，上述的晶圓盒檢測裝置還包括一發光單元，且晶圓盒檢測方法還包括：發光單元在影像感測單元擷取第一影像以及第二影像時提供一光源。 In one embodiment, the above-mentioned wafer cassette inspection device further includes a light-emitting unit, and the wafer cassette inspection method further includes: the light-emitting unit provides a light source when the image sensing unit captures the first image and the second image.
在一實施例中，上述的盒體包括一第一角部以及一第二角部，上述的將盒體配置於臺座上包括：使第一角部對位於影像感測單元；且上述的控制單元驅動旋轉機構以使盒體以及影像感測單元彼此相對旋轉一角度包括：使第二角部對位於影像感測單元。 In one embodiment, the box body includes a first corner portion and a second corner portion, and disposing the box body on the pedestal includes: aligning the first corner portion with the image sensing unit; and the aforementioned The control unit driving the rotation mechanism to rotate the box body and the image sensing unit relative to each other by an angle includes: making the second corner align with the image sensing unit.
藉此，本發明的晶圓盒檢測裝置能藉由旋轉機構使盒體以及影像感測單元彼此相對旋轉，並透過影像感測單元分別擷取第一影像以及第二影像，再由控制單元對第一影像以及第二影像執行影像辨識程序而得到待測物的配置資訊。另一方面，本發明的晶圓盒檢測方法能透過上述的晶圓盒檢測裝置得到待測物的配置資訊，從而達到加速檢測流程、提高檢測良率以及節省人力的效果。 Thereby, the wafer cassette inspection device of the present invention can rotate the cassette body and the image sensing unit relative to each other through the rotating mechanism, and respectively capture the first image and the second image through the image sensing unit, and then the control unit checks The first image and the second image execute an image recognition procedure to obtain configuration information of the object to be tested. On the other hand, the wafer cassette inspection method of the present invention can obtain the configuration information of the object to be tested through the above-mentioned wafer cassette inspection device, thereby achieving the effects of speeding up the inspection process, improving the inspection yield and saving manpower.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
1:晶圓盒檢測裝置 1: Wafer cassette inspection device
100:臺座 100: Pedestal
200:影像感測單元 200: Image Sensing Unit
210:第一影像感測器 210: The first image sensor
220:第二影像感測器 220: Second Image Sensor
230:第三影像感測器 230: Third Image Sensor
300:旋轉機構 300: Rotary Mechanism
400:控制單元 400: Control Unit
500:發光單元 500: Light unit
2、2’:盒體 2, 2': box body
22:第一角部 22: The first corner
24:第二角部 24: Second corner
3、3’:待測物 3, 3': object to be tested
A-A、A’-A’:剖面 A-A, A'-A': Section
S01~S06:步驟 S01~S06: Steps
T:厚度 T: Thickness
X、Y:方向 X, Y: direction
圖1為本發明的晶圓盒檢測裝置的一實施例的立體示意圖。 FIG. 1 is a schematic perspective view of an embodiment of a wafer cassette inspection device of the present invention.
圖2為本發明的晶圓盒檢測方法的一實施例的步驟流程圖。 FIG. 2 is a flow chart of the steps of an embodiment of the wafer cassette inspection method of the present invention.
圖3為圖1中的盒體的俯視示意圖。 FIG. 3 is a schematic top view of the box body in FIG. 1 .
圖4為承載有正常配置待測物的盒體沿著圖3中A-A剖面的剖視示意圖。 FIG. 4 is a schematic cross-sectional view of the box body carrying the normally configured object to be tested along the section A-A in FIG. 3 .
圖5為承載有不良配置待測物的盒體沿著圖3中A-A剖面的剖視示意圖。 FIG. 5 is a schematic cross-sectional view of the box body carrying the object to be tested with poor configuration along the section A-A in FIG. 3 .
圖6為第一影像或第二影像中正常配置情況的待測物的示意圖。 FIG. 6 is a schematic diagram of the object to be tested in a normal configuration in the first image or the second image.
圖7為第一影像或第二影像中發生重疊配置情況的待測物的示意圖。 FIG. 7 is a schematic diagram of the object to be tested in the overlapping arrangement in the first image or the second image.
圖8為第一影像或第二影像中發生歪斜配置情況的待測物的示意圖。 FIG. 8 is a schematic diagram of the object to be tested with a skewed arrangement in the first image or the second image.
有關本發明之前述及其它技術內容、特點與功效，在以下配合參考圖式之較佳實施例的詳細說明中，將可清楚地呈現。值得一提的是，以下實施例所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用以說明，而非對本發明加以限制。此外，在下列各個實施例中，相同或相似的元件將採用相同或相似的標號。 The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Accordingly, the directional terms used are intended to illustrate, but not to limit the invention. In addition, in each of the following embodiments, the same or similar elements will be given the same or similar reference numerals.
請參考圖1及圖2，其中圖1為本發明的晶圓盒檢測裝置的一實施例的立體示意圖，而圖2為本發明的晶圓盒檢測方法的一實施例的步驟流程圖。本實施例的晶圓盒檢測裝置1適於對一盒體2進行檢測，其中盒體2例如是一晶圓盒，且晶圓盒檢測裝置1包括一臺座100、一影像感測單元200、一旋轉機構300以及一控制單元400，其中旋轉機構300配置於臺座100以及影像感測單元200之間，
控制單元400例如是一電腦並電性連接於影像感測單元200以及旋轉機構300，且控制單元400包括一輸出單元(未繪示)，其中輸出單元例如是一顯示螢幕。
Please refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a three-dimensional schematic diagram of an embodiment of a wafer cassette inspection apparatus of the present invention, and FIG. 2 is a flow chart of steps of an embodiment of a wafer cassette inspection method of the present invention. The wafer
請參考圖3及圖4，其中圖3為圖1中的盒體的俯視示意圖，而圖4為承載有正常配置待測物的盒體沿著圖3中A-A剖面的剖視示意圖。詳細而言，本實施例的臺座100適於承載盒體2，而旋轉機構300為一旋轉汽缸，可帶動臺座100自由地平移或旋轉。另一方面，盒體2內配置有複數個待測物3，其中待測物3例如是晶圓片。為了防止待測物3在盒體2內部有不良配置的情況發生，本實施例的晶圓盒檢測裝置1透過影像感測單元200對盒體2內的待測物3進行影像擷取，並將擷取的影像傳送至控制單元400進行影像辨識，再透過輸出單元得到待測物3的配置資訊。
Please refer to FIG. 3 and FIG. 4 , wherein FIG. 3 is a schematic top view of the box body in FIG. 1 , and FIG. 4 is a cross-sectional view of the box body carrying the normally configured DUT along the section A-A in FIG. 3 . In detail, the
以下將針對本實施例的晶圓盒檢測方法如何透過晶圓盒檢測裝置1對配置有待測物3的盒體2進行檢測加以說明。首先，工作人員透過人工或機械手臂提取的方式將盒體2配置於臺座100上(步驟S01)。在本實施例中，盒體2是以壓克力等透明材質製成，因此影像感測單元200可直接擷取盒體2內部的待測物3的影像，但本發明對此並不加以限制，在其它可能的實施例中，盒體2也可以使用有色材質或一般可見光無法穿透的材質製成，而影像感測單元200則對應配置可穿透上述盒體2的特殊波長光線(例如X光)進行影像擷取。
The following will describe how the cassette detection method of the present embodiment detects the
由於晶圓盒在上方以及前方通常配置有機械手臂提取用的提取部元件，為了防止在影像擷取時上述元件遮擋到影像內的辨識特徵，較佳地，盒體2的後部包括一第一角部22，且在將盒體2配置於臺座100上時，配置的工作人員或機械手臂可對盒體2進行方位校正，使盒體2的第一角部22對位於影像感測單元200，此時影像感測單元200擷取包括待測物3的一第一影像(步驟S02)，換言
之，第一影像為影像感測單元200透過第一角部22擷取的影像。藉由這樣的配置，不僅可避免第一影像內的特徵受到遮擋，且可同時偵測到待測物3沿相鄰於第一角部22的兩側邊方向的配置情形，從而以較少的影像擷取數量得到足夠的影像辨識資訊。
Since the wafer cassette is usually equipped with extractor elements for robotic arm extraction above and in front of the wafer cassette, in order to prevent the above-mentioned elements from obscuring the identification features in the image during image capture, preferably, the rear of the
為了得到高品質的影像以及良好的對比結果，較佳地，晶圓盒檢測裝置1還包括一發光單元500，其中發光單元500例如是一發光板，且發光單元500用以在影像感測單元200擷取第一影像時提供一光源。當然，若晶圓盒檢測裝置1本身所在的環境為光線充足的地方(例如室外)，晶圓盒檢測裝置1也可以不配置發光單元500，而僅透過外界的光線進行影像擷取。
In order to obtain high-quality images and good comparison results, preferably, the wafer
之後，控制單元400會驅動旋轉機構300以使盒體2以及影像感測單元200彼此相對旋轉一角度(步驟S03)，在本實施例中是將旋轉機構300設置於盒體2上，並以旋轉盒體2的方式進行相對旋轉，且旋轉的角度例如是90度，但在其它可能的實施例中，也可以將旋轉機構300設置於影像感測單元200上，以盒體2固定不動，而影像感測單元200繞盒體2公轉的方式進行相對旋轉，又甚至可讓盒體2或影像感測單元200其中之一滑動一段距離從而產生相對角度差，本發明對此不加以限制。較佳地，盒體2還包括一第二角部24，且控制單元400驅動旋轉機構300的同時使盒體2的第二角部24對位於影像感測單元200，此時影像感測單元200擷取包括待測物3的一第二影像(步驟S04)，換言之，第一影像為影像感測單元200透過第二角部24擷取的影像。藉由這樣的配置，可避免第二影像內的特徵受到遮擋，且可同時偵測到獨立於相鄰於第一角部22的兩側邊方向的待測物3配置情形。相似地，上述的發光單元500亦可在影像感測單元200擷取第二影像時提供光源，以使第二影像的品質以及對比得到提昇。
After that, the
值得一提的是，為了能對盒體2內的待測物3進行更精密的辨識，本實施例的影像感測單元200包括一第一影像感測器210、一第二影像感測器220以及一第三影像感測器230，其中第一影像感測器210、第二影像感測器220以及第三影像感測器230例如是感光耦合元件(charge-coupled device,CCD)相機，且這些影像感測器沿待測物3的排列方向配置。透過這樣的配置，在後續的影像辨識程序中，各個影像感測器可分別擷取不同區域的待測物3的影像，使得單一影像的特徵的解析度更為提昇。
It is worth mentioning that, in order to more precisely identify the object to be tested 3 in the
在影像感測單元200擷取第一影像以及第二影像後，第一影像以及第二影像將會被傳送至控制單元400，而控制單元400接收第一影像以及第二影像，並對第一影像以及第二影像執行一影像辨識程序(步驟S05)。請同時參考圖4及圖5，其中圖5為承載有不良配置待測物的盒體沿著圖3中A-A剖面的剖視示意圖。具體而言，如圖5所示，影像辨識程序會將第一影像以及第二影像中盒體2的內部劃分為複數個區間，在本實施例中例如是劃分為25層，並依據這些區間的影像灰階值分佈與一標準灰階值分佈進行比對，判斷這些待測物的配置資訊，且上述的影像感測器分別擷取這些區間中的部份區間。在本實施例中，以第一影像感測器210偵測第1~8層，第二影像感測器220偵測第9~17層，而第三影像感測器230偵測第18~25層為例。
After the
請參考圖6至圖8，其中圖6為第一影像或第二影像中正常配置情況的待測物的示意圖，圖7為第一影像或第二影像中發生重疊配置情況的待測物的示意圖，而圖8為第一影像或第二影像中發生歪斜配置情況的待測物的示意圖。詳細而言，本實施例的晶圓盒檢測裝置1所檢測待測物3的配置資訊包括待測物3的一正常資訊、一重疊資訊、一空缺資訊以及一歪斜資訊，控制單元400會根
據正常配置的待測物3的影像灰階值分佈，建立一X-Y方向座標系以及一厚度T的閾值，倘若盒體2內的待測物3如圖7所示有兩個待測物重疊在同一層，此時待測物3的影像灰階值的分佈厚度將會超過正常配置的待測物3的厚度T，因此控制單元400可透過影像辨識得知該層的待測物3有重疊的情形發生，並輸出一重疊資訊；相似地，若控制單元400在第一影像以及第二影像的特定區域層未偵測到任何待測物3的灰階值分佈，則可判定該層發生待測物3缺漏的情形，並輸出一空缺資訊；同理，倘若盒體2內的待測物3如圖8所示有歪斜的狀況，此時待測物3的影像灰階值的分佈方向將會與標準的X-Y方向座標系產生偏差，因此控制單元400可透過影像辨識得知該層的待測物3有歪斜的情形發生，並輸出一歪斜資訊。
Please refer to FIGS. 6 to 8 , wherein FIG. 6 is a schematic diagram of the DUT in the first image or the second image in the normal configuration, and FIG. 7 is the DUT in the first image or the second image in the overlapping configuration. and FIG. 8 is a schematic diagram of the object to be tested with a skewed arrangement in the first image or the second image. In detail, the configuration information of the object to be tested 3 detected by the wafer
在上述影像辨識程序執行完畢後，控制單元400將透過輸出單元輸出這些待測物3的配置資訊(步驟S06)。具體而言，當盒體2內的待測物3配置情形如圖5所示時，控制單元400會透過輸出單元輸出例如下表的資訊：
其中位置一為盒體2的第一角部22對位於影像感測單元200時的位置，而位置二為盒體2的第二角部24對位於影像感測單元200時的位置。藉由控制單元輸出上述配置資訊，檢測流程可有效地自動化從而節省人力，且使用者可快速得知第3層的待測物3有重疊情形、第5層的待測物3有缺漏情形，且第8層的待測物3有歪斜情形，從而快速得知盒體2內待測物3的配置資訊，因此可達到加速流程以及提高檢測良率的效果。
The first position is the position where the
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，上述實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。且應注意的是，舉凡與上述實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。 The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the above embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all the changes and substitutions equivalent to the above-mentioned embodiments should be considered to be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.
1:晶圓盒檢測裝置 1: Wafer cassette inspection device
100:臺座 100: Pedestal
200:影像感測單元 200: Image Sensing Unit
210:第一影像感測器 210: The first image sensor
220:第二影像感測器 220: Second Image Sensor
230:第三影像感測器 230: Third Image Sensor
300:旋轉機構 300: Rotary Mechanism
400:控制單元 400: Control Unit
500:發光單元 500: Light unit
2:盒體 2: Box
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| JP2004266221A (en) * | 2003-03-04 | 2004-09-24 | Honda Electron Co Ltd | Inspecting apparatus and method for wafer storing cassette |
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| TWM606479U (en) * | 2020-09-14 | 2021-01-11 | 鴻績工業股份有限公司 | Wafer box inspection device |
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| JP2004266221A (en) * | 2003-03-04 | 2004-09-24 | Honda Electron Co Ltd | Inspecting apparatus and method for wafer storing cassette |
| US20100074514A1 (en) * | 2006-12-07 | 2010-03-25 | Yoshinori Hayashi | Wafer containing cassette inspection device and method |
| US20200203201A1 (en) * | 2017-06-08 | 2020-06-25 | Brooks Automation Gmbh | Method for inspecting a container and inspection system |
| TW202027209A (en) * | 2018-09-06 | 2020-07-16 | 日商東京威力科創股份有限公司 | Substrate state determining apparatus substrate processing apparatus model generating apparatus and substrate state determining method |
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