TWI771324B - Surface polishing apparatus - Google Patents

Surface polishing apparatus Download PDF

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TWI771324B
TWI771324B TW106133306A TW106133306A TWI771324B TW I771324 B TWI771324 B TW I771324B TW 106133306 A TW106133306 A TW 106133306A TW 106133306 A TW106133306 A TW 106133306A TW I771324 B TWI771324 B TW I771324B
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workpiece
laser light
light
circularly polarized
optical path
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TW106133306A
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Chinese (zh)
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TW201813775A (en
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井上裕介
吉原秀明
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日商創技股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crushing And Grinding (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

[課題] 係提供一種一邊測量工件一邊研磨工件的平面之平面研磨裝置，其係藉由抑制旋轉側接頭部的旋轉角度所導致之光強度的變動，而抑制光纜所傳輸的光訊號之光強度的變動。 　　[解決手段] 平面研磨裝置(1)，係具備：光旋轉接頭(60)、將光旋轉接頭(60)的一次側連接於光源(3)的一次側光纜(51)、以及將光旋轉接頭(60)的二次側連接於測量器(探測頭)(41)的二次側光纜(52)。光旋轉接頭(60)，係具有：對於連接於一次側光纜(51)的機體作固定設置的靜止側接頭部、以及連接於二次側光纜(52)並與上定盤(20)的旋轉軸線一起旋轉的旋轉側接頭部；在從光源(3)至靜止側接頭部之間，設置有輸出圓偏光的雷射光之圓偏光輸出部(53)。[Problem] It is to provide a plane polishing apparatus for polishing the plane of the workpiece while measuring the workpiece, which suppresses the light intensity of the optical signal transmitted by the optical cable by suppressing the fluctuation of the light intensity caused by the rotation angle of the rotating side joint portion. changes. [Solution] A plane polishing apparatus (1) is provided with an optical rotary joint (60), a primary side optical cable (51) connecting the primary side of the optical rotary joint (60) to the light source (3), and an optical rotary joint The secondary side of (60) is connected to the secondary side optical cable (52) of the measuring device (probe) (41). The optical rotary joint (60) is provided with: a stationary side joint part fixedly arranged for the body connected to the primary side optical fiber cable (51), and connected to the secondary side optical fiber cable (52) and rotated with the upper platen (20) A rotary side joint part whose axes rotate together; between the light source (3) and the stationary side joint part, a circularly polarized light output part (53) for outputting circularly polarized laser light is provided.

Description

平面研磨裝置Surface Grinding Device

[0001] 本發明，係有關於研磨工件的平面之平面研磨裝置，特別是，有關於一邊測量工件一邊研磨工件的平面之平面研磨裝置。The present invention, be related to the plane grinding device of the plane of grinding workpiece, especially, be related to the plane grinding device that grinds the plane of workpiece while measuring workpiece.

[0002] 作為研磨工件的平面之平面研磨裝置，一般而言，已知有同時研磨工件的兩面之兩面研磨裝置、或是研磨工件的單面之單面研磨裝置。就該等平面研磨裝置而言，為了提升工件的研磨精度，係一般測量工件的厚度或剖面形狀，一邊研磨工件的平面。例如，於專利文獻1之第5圖，係揭示有一種平面研磨裝置，其係朝向工件照射測定光，並且將接收該反射光的厚度測定裝置安裝於旋轉自如的上定盤。於該平面研磨裝置，係在工件之研磨當中，從厚度測定裝置朝向工件射出測定光，並以厚度測定裝置接收工件所反射的反射光。並且，厚度測定裝置所接收的反射光，係透過光纜、光纜旋轉接頭傳輸至外部的運算裝置，而以該運算裝置運算工件的厚度。 　　[0003] 另外，該種光旋轉接頭，係具有：對於機體等固定構件作固定設置，保持靜止側光纜的靜止側接頭部、以及與上定盤等旋轉構件一起旋轉，保持旋轉側光纜的旋轉側接頭部。並且，如亦於專利文獻2所示般，若使光訊號入射該種光旋轉接頭，則光訊號的光量(光強度)係會因旋轉側接頭部的旋轉角度而有所變動。因此，若對於專利文獻1所記載之平面研磨裝置的光旋轉接頭傳輸光訊號，則該光訊號的光量會因旋轉側接頭部的旋轉角度而有所變動，且工件厚度的測量值會隨時間變動。然而，若工件厚度的測量值有所變動，則會對於工件的研磨精度產生影響，故期望能夠抑制工件的厚度或剖面形狀等之測量值的變動。 ［先前技術文獻］ ［專利文獻］ 　　[0004] 　　[專利文獻1]日本特開2008-227393號公報 　　[專利文獻2]日本特開2002-178257號公報[0002] As a plane grinding device for grinding the plane of a workpiece, generally speaking, a double-sided grinding device for simultaneously grinding both sides of a workpiece or a single-sided grinding device for grinding a single side of the workpiece is known. In order to improve the grinding accuracy of the workpiece, such plane grinding apparatuses generally measure the thickness or cross-sectional shape of the workpiece while grinding the plane of the workpiece. For example, FIG. 5 of Patent Document 1 discloses a surface polishing apparatus that irradiates a workpiece with measuring light, and mounts a thickness measuring apparatus that receives the reflected light on a rotatable upper platen. In the plane polishing device, during the polishing of the workpiece, the measuring light is emitted toward the workpiece from the thickness measuring device, and the reflected light reflected by the workpiece is received by the thickness measuring device. In addition, the reflected light received by the thickness measuring device is transmitted to an external computing device through the optical cable and the optical cable rotary joint, and the thickness of the workpiece is calculated by the computing device. In addition, this kind of optical swivel joint has: make fixed arrangement for fixed members such as body, keep the stationary side joint part of the stationary side optical cable and rotate together with the rotating members such as the upper surface plate, and keep the rotation of the rotating side optical cable. side connector. Furthermore, as also shown in Patent Document 2, when an optical signal is incident on such an optical rotary joint, the light quantity (light intensity) of the optical signal varies depending on the rotation angle of the rotary joint portion. Therefore, if an optical signal is transmitted to the optical rotary joint of the surface polishing apparatus described in Patent Document 1, the light quantity of the optical signal varies depending on the rotation angle of the rotary joint portion, and the measured value of the workpiece thickness changes with time. change. However, if the measurement value of the workpiece thickness varies, the polishing accuracy of the workpiece is affected, so it is desirable to suppress the variation in the measurement value of the workpiece thickness, cross-sectional shape, and the like. [PRIOR ART DOCUMENT] [PATENT DOCUMENT] [0004] [PATENT DOCUMENT 1] JP-A-2008-227393 [PATENT DOCUMENT 2] JP-A-2002-178257

［發明所欲解決的技術課題］ 　　[0005] 本發明之技術性課題，係提供一種一邊測量工件一邊研磨工件的平面之平面研磨裝置，其係藉由抑制旋轉側接頭部的旋轉角度所導致之光強度的變動，而抑制光纜或光旋轉接頭等傳輸路、以及測量器等所傳輸的光訊號之光強度的變動。 ［用以解決課題的技術方案］ 　　[0006] 用以解決前述課題之本發明，係一種平面研磨裝置，係具有旋轉自如地受到支承的上定盤及下定盤，在該上定盤與下定盤之間夾持工件，並使兩定盤旋轉而研磨前述工件的兩面，其特徵為：該平面研磨裝置，係具備：安裝於前述任一個定盤，使用雷射光測量前述工件的工件測量機構；該工件測量機構，係具有：對於前述工件照射前述雷射光，並且接收來自該工件的反射光的測量器、以及將前述雷射光從光源傳輸至前述測量器的光傳輸路；該光傳輸路，係具備：配置於安裝有前述工件測量機構的定盤的旋轉軸線上的光旋轉接頭、將該光旋轉接頭的一次側連接於前述光源的一次側光路、以及將該光旋轉接頭的二次側連接於前述測量器的二次側光路；前述光旋轉接頭，係具有：對於連接於前述一次側光路的機體作固定設置的靜止側接頭部、以及連接於前述二次側光路並與安裝有前述工件測量機構的定盤等一起旋轉的旋轉側接頭部；在從前述光源至靜止側接頭部之間，係設置有輸出圓偏光之雷射光的圓偏光輸出部。 　　[0007] 亦即，本發明，係一種平面研磨裝置，係具有：定盤、以及保持工件的保持部，使該定盤及保持部至少一方旋轉，並在使前述工件與前述定盤接觸的狀態，研磨工件的單面，其特徵為：該平面研磨裝置，係具備：安裝於前述定盤或是保持部之任一者，使用雷射光測量前述工件的工件測量機構；前述工件測量機構，係具有：對於前述工件照射前述雷射光，並且接收來自該工件的反射光的測量器、以及將雷射光從前述光源傳輸至前述測量器的光傳輸路；該光傳輸路，係具備：設置於安裝有前述工件測量機構的定盤或是保持部的旋轉軸線上的光旋轉接頭、將該光旋轉接頭的一次側連接於前述光源的一次側光路、以及將該光旋轉接頭的二次側連接於前述測量器的二次側光路；前述光旋轉接頭，係具有：連接於前述一次側光路且對於機體作固定設置的靜止側接頭部、以及連接於前述二次側光路並與前述定盤或是保持部之至少一方一起旋轉的旋轉側接頭部；在從前述光源至靜止側接頭部之間，係設置有輸出圓偏光之雷射光的圓偏光輸出部。 　　[0008] 在此，所謂「在從前述光源至靜止側接頭部之間，係設置有輸出圓偏光之雷射光的圓偏光輸出部」，係包含在光源設置圓偏光輸出部、或是在靜止側接頭部設置圓偏光輸出部。 　　另外，於使用在傳輸雷射光的光傳輸路具有靜止側接頭部及旋轉側接頭部的光旋轉接頭之平面研磨裝置中，從連接於靜止側接頭部的一次側光路，朝向連接於旋轉側接頭部的二次側光路射出的雷射光的光強度，係因旋轉側接頭部對於靜止側接頭部的旋轉角度而有週期性變動。就該光旋轉接頭所傳輸的雷射光而言，依據本發明之發明者所進行之研究，在從一次側光路所射出之雷射光的偏光特性為直線偏光或橢圓偏光時，二次側光路所傳輸的雷射光的偏光方位及光強度會因旋轉側接頭部的旋轉角度而有所變動。此時，二次側光路所傳輸的雷射光的光強度，有與從一次側光路射出的雷射光的光強度幾乎相同的情形，亦有幾乎為零的情形。另一方面，在從一次側光路所射出之雷射光的偏光特性為圓偏光時，二次側光路所傳輸的雷射光的偏光方位會對應於旋轉側接頭部的旋轉角度而變化，但其光強度係無關於旋轉側接頭部的旋轉角度而幾乎為一定。此時，二次側光路所傳輸的雷射光的光強度，為從一次側光路射出的雷射光的光強度之約一半。 　　[0009] 因此，入射至二次側光路的雷射光的偏光方位及光強度，係因從一次側光路朝向二次側光路射出的雷射光的偏光特性、偏光方位、以及旋轉側接頭部的旋轉角度而有週期性的變動。亦即，於具有靜止側接頭部及旋轉側接頭部的光旋轉接頭中，旋轉側接頭部，係發揮等同於使所傳輸的雷射光的偏光特性及偏光方位隨旋轉角度變化的偏光板之功能。此時，在從一次側光路射出的雷射光為圓偏光的雷射光時，二次側光路所傳輸的雷射光的光強度係幾乎為一定。 　　[0010] 另外，本發明，係：前述圓偏光輸出部係用以將前述一次側光路所傳輸的雷射光的偏光轉換成圓偏光的圓偏光調整用偏波調整器為佳。 　　進而，在前述二次側光路，設置用以將前述二次側光路所傳輸的雷射光的偏光轉換成直線偏光的直線偏光調整用偏波調整器為佳。 　　並且，前述測量器，係具有：使從前述二次側光路所傳輸的直線偏光的雷射光分離為第1雷射光及第2雷射光的偏光分束器、使該第1雷射光及第2雷射光的偏光成為圓偏光地作偏光的波長板、以及使反射通過前述波長板的第1雷射光再度入射至前述波長板的反射板；將前述第2雷射光照射至前述工件，並將該工件所反射的反射光、與前述反射板所反射的第1雷射光的反射光藉由前述偏光分束器進行合成為佳。 ［發明之效果］ 　　[0011] 依據本發明，係在將雷射光從光源傳輸至測量器的光傳輸路，具備了具有靜止側接頭部及旋轉側接頭部的光旋轉接頭，並在從光源至靜止側接頭部之間，設置有輸出圓偏光的雷射光之圓偏光輸出部。如前述般，從靜止側接頭部入射至旋轉側接頭部的雷射光的光強度，在入射的雷射光為直線偏光或橢圓偏光時，會因旋轉側接頭部的旋轉角度而有所變化，然而若使入射至旋轉側接頭部的雷射光為圓偏光，則能夠抑制從靜止側接頭部入射至旋轉側接頭部的雷射光之光強度的變動。因此，能夠使光傳輸路或測量器所傳輸的光訊號的光強度保持在穩定狀態，而能夠抑制工件厚度或形狀等測量值的變動。[Technical Problem to be Solved by the Invention] [0005] The technical problem of the present invention is to provide a surface grinding device for grinding the flat surface of a workpiece while measuring the workpiece, which is caused by suppressing the rotation angle of the rotating side joint portion. Fluctuations in light intensity are suppressed, and fluctuations in light intensity of optical signals transmitted by transmission paths such as optical cables, optical rotary joints, and measuring instruments are suppressed. [Technical Solution for Solving the Problems] [0006] The present invention for solving the aforementioned problems is a flat surface polishing device having an upper surface plate and a lower surface plate that are rotatably supported, and the upper surface plate and the lower surface plate are rotatably supported. The workpiece is clamped between, and the two surface plates are rotated to grind both sides of the workpiece. It is characterized in that: the plane grinding device is equipped with a workpiece measuring mechanism that is installed on any of the surface plates and uses laser light to measure the workpiece; The workpiece measuring mechanism is provided with: a measuring device that irradiates the laser light to the workpiece and receives the reflected light from the workpiece, and an optical transmission path that transmits the laser light from the light source to the measuring device; the optical transmission path, The system includes: an optical rotary joint arranged on the rotation axis of the platen on which the workpiece measurement mechanism is mounted, a primary side optical path connecting the primary side of the optical rotary joint to the light source, and a secondary side of the optical rotary joint The secondary side optical path connected to the aforementioned measuring instrument; the aforementioned optical rotary joint has: a stationary side joint part for fixing the body connected to the aforementioned primary side optical path; The rotary side joint part that rotates together with the table plate of the workpiece measuring mechanism; between the light source and the stationary side joint part, there is a circularly polarized light output part that outputs circularly polarized laser light. That is, the present invention, is a kind of plane grinding device, is to have: plate and the holding part that keeps workpiece, make this plate and holding part at least one side rotate, and make aforesaid workpiece contact with aforesaid plate state, grinding a single side of a workpiece, characterized in that: the plane grinding device is equipped with: a workpiece measuring mechanism installed on the above-mentioned fixed plate or any one of the holding parts, and using laser light to measure the above-mentioned workpiece; the above-mentioned workpiece measuring mechanism, The system has: a measuring device that irradiates the laser light to the workpiece and receives the reflected light from the workpiece, and an optical transmission path that transmits the laser light from the light source to the measuring device; the optical transmission path is provided with: An optical rotary joint on the rotation axis of the platen or holding portion on which the workpiece measuring mechanism is mounted, the primary side of the optical rotary joint is connected to the primary side optical path of the light source, and the secondary side of the optical rotary joint is connected On the secondary side optical path of the aforementioned measuring device; the aforementioned optical rotary joint has: a stationary side joint portion connected to the aforementioned primary side optical path and fixedly arranged for the body, and a stationary side joint portion connected to the aforementioned secondary side optical path and connected to the aforementioned fixed plate or At least one of the holding parts is a rotating side joint part that rotates together; between the light source and the stationary side joint part, a circularly polarized light output part for outputting circularly polarized laser light is provided. Here, the so-called "from the aforementioned light source to the stationary side joint portion, is provided with a circularly polarized light output portion that outputs the laser light of circularly polarized light", is included in the light source and is provided with a circularly polarized light output portion or is at rest. The side joint portion is provided with a circularly polarized light output portion. In addition, in a plane polishing apparatus using an optical rotary joint having a stationary-side joint portion and a rotating-side joint portion in the optical transmission path for transmitting laser light, the optical path from the primary side connected to the stationary-side joint portion goes toward the rotation-side joint. The light intensity of the laser light emitted from the secondary-side optical path of the section fluctuates periodically due to the rotation angle of the rotating-side joint section with respect to the stationary-side joint section. As far as the laser light transmitted by the optical rotary joint is concerned, according to the research conducted by the inventors of the present invention, when the polarization characteristics of the laser light emitted from the primary side optical path are linearly polarized or elliptically polarized, the secondary side optical path The polarization direction and light intensity of the transmitted laser light vary depending on the rotation angle of the rotary joint portion. At this time, the light intensity of the laser light transmitted from the secondary side optical path may be almost the same as the light intensity of the laser light emitted from the primary side optical path, or it may be almost zero. On the other hand, when the polarization characteristic of the laser light emitted from the primary side optical path is circularly polarized light, the polarization azimuth of the laser light transmitted from the secondary side optical path will change according to the rotation angle of the rotating side joint part, but its light The strength is almost constant regardless of the rotation angle of the rotation-side joint portion. At this time, the light intensity of the laser light transmitted from the secondary side optical path is about half of the light intensity of the laser light emitted from the primary side optical path. Therefore, the polarization azimuth and light intensity of the laser light incident on the secondary side optical path are due to the polarization characteristics, polarization azimuth and rotation of the rotating side joint portion of the laser light emitted from the primary side optical path toward the secondary side optical path. The angle changes periodically. That is, in an optical rotary joint having a stationary-side joint portion and a rotating-side joint portion, the rotating-side joint portion functions as a polarizing plate that changes the polarization characteristics and polarization orientation of the transmitted laser light with the rotation angle. . At this time, when the laser light emitted from the primary side optical path is circularly polarized laser light, the light intensity of the laser light transmitted by the secondary side optical path is almost constant. [0010] In addition, the present invention, the system: the circularly polarized light output part is used to convert the polarized light of the laser light transmitted by the above-mentioned primary side optical path into circularly polarized light. It is better to adjust the polarization adjuster for circularly polarized light. Furthermore, it is preferable that a polarization adjuster for adjusting linear polarization is provided on the secondary side optical path for converting the polarized light of the laser light transmitted by the secondary side optical path into linear polarized light. In addition, the measuring device includes a polarization beam splitter that separates the linearly polarized laser light transmitted from the secondary side optical path into a first laser light and a second laser light, and separates the first laser light and the second laser light. The polarized light of the laser light becomes a circularly polarized wave plate, and the first laser light reflected by the wave plate is incident on the wave plate again; the second laser light is irradiated to the workpiece, and the The reflected light reflected by the workpiece and the reflected light of the first laser light reflected by the reflecting plate are preferably combined by the polarizing beam splitter. [Effect of the Invention] [0011] According to the present invention, an optical rotary joint having a stationary side joint portion and a rotating side joint portion is provided in the optical transmission path for transmitting the laser light from the light source to the measuring device, and the optical rotary joint is provided from the light source to the measuring device. A circularly polarized light output part for outputting circularly polarized laser light is provided between the stationary side joint parts. As described above, the light intensity of the laser light incident from the stationary-side joint portion to the rotating-side joint portion varies depending on the rotation angle of the rotating-side joint portion when the incident laser light is linearly polarized or elliptically polarized. When the laser light incident on the rotating-side joint portion is circularly polarized, it is possible to suppress fluctuations in the light intensity of the laser light incident on the rotating-side joint portion from the stationary-side joint portion. Therefore, the light intensity of the optical signal transmitted by the optical transmission path or the measuring device can be kept in a stable state, and the fluctuation of the measured value such as the thickness and shape of the workpiece can be suppressed.

[0013] 本發明，係有關於一邊測量工件一邊研磨工件的平面之平面研磨裝置，且對於研磨工件的兩面之兩面研磨裝置、研磨工件的單面之單面研磨裝置皆能適用。另外，本發明，雖能夠運用於工件的厚度或剖面形狀等各種測量，然而於本實施形態中係以測量工件的厚度為例進行說明。 　　第1圖至第4圖，係表示作為本發明之平面研磨裝置的實施形態之平面研磨裝置1，其係具有以旋轉軸線L1為中心旋轉的下定盤10、以及被機體2所支承並以旋轉軸線L2為中心旋轉的上定盤20，並使該等定盤10、20旋轉而研磨工件W的兩面。於該平面研磨裝置中，旋轉軸線L1、L2係配置在同一軸線上。 　　[0014] 於機體2，係設置有包含雷射光的光源3以及運算控制部4的測量單元5，並且支承有用以使上定盤20升降的升降用致動器7。光源3係輸出雷射光，運算控制部4係收集工件W的厚度等測定資料(測量值)，並進行所收集的各種資料之運算或分析等而控制研磨裝置1整體。又，包含光源3及運算控制部4的測量單元5，係設置在機體2外之不受上定盤20或下定盤10的旋轉的影響的位置(機體2以外之與上定盤20或下定盤10的旋轉無緣的位置)亦可。 　　[0015] 在下定盤10的中心係配置有太陽齒輪11，在下定盤10的外周係內齒輪12以包圍下定盤10的方式作配置。在太陽齒輪11的中央下部係連接有第1驅動軸13，在下定盤10的中央下部係連接有第2驅動軸14，在內齒輪12的中央下部係連接有第3驅動軸15。另外，在下定盤10的中心係連接有第4驅動軸16，該第4驅動軸16係被收容於第1驅動軸13。第1驅動軸13係被收容於第2驅動軸14，第2驅動軸14係被收容於第3驅動軸15。該等第1驅動軸13至第4驅動軸16，係構成為藉由未圖示的驅動裝置進行驅動旋轉。 　　[0016] 在上定盤20與下定盤10之間，係以與太陽齒輪11及內齒輪12嚙合的方式中介設置有複數個保持矽晶圓等之工件W的遊星輪37。於各遊星輪37係形成有工件保持孔37a，並將工件W保持於該工件保持孔37a。前述各遊星輪37，係藉由太陽齒輪11與內齒輪12的旋轉，於太陽齒輪11的周圍自轉及/或公轉。另外，在上定盤20的下面及下定盤10的上面，係分別貼附有研磨墊18a、18b，並藉由遊星輪37自轉及/或公轉，研磨被保持於各遊星輪37的工件W的上下兩面。 　　[0017] 上定盤20，係透過定盤懸吊件31安裝於升降用致動器7的升降桿32。升降桿32的中心軸線，係與前述旋轉軸線L1、L2一致。在定盤懸吊件31的外周側的下面，係在設置有朝向下方向延伸的複數個支撐螺柱33，該支撐螺柱33係安裝在上定盤20的上面。另外，在定盤懸吊件31的內周面與升降桿32的外周面之間，係中介設置有：軸承34，係雖將該定盤懸吊件31與升降桿32於上下方向固定地作結合，但於上定盤20的旋轉方向相對地旋轉自如地作結合。 　　[0018] 於前述支撐螺柱33，係安裝有用以保持後述之測量器(探測頭)41的保持支架36。該探測頭41，係藉由調整保持支架36的安裝位置，而配置於貫穿上定盤20的上下面的測量孔23之正上方。另外，於測量孔23，係安裝有在下端設置了透明的窗板25的窗構件26。又，探測頭41，係能夠直接安裝於上定盤20，或是採取使探測頭41保持於固定在定盤懸吊件31的保持支架36的方式等，只要是能夠與上定盤20一體旋轉即可。 　　[0019] 上定盤20，係在工件W之非研磨時，藉由升降桿32上升至待命位置(未圖示)，並在工件W之研磨時，下降至第1圖的研磨位置。當上定盤20下降，因安裝於上定盤20的鉤22係卡合於第4驅動軸16的上端的驅動器17，上定盤20與定盤懸吊件31係藉由第4驅動軸16透過驅動器17受到驅動，而一體地旋轉。 　　[0020] 另外，於上定盤20，係具備使用從光源3射出的雷射光測量工件W的厚度或形狀的工件測量機構40。該工件測量機構40，係具有：對於工件W照射雷射光，並且接收來自工件W的反射光的探測頭41、以及將雷射光從光源3傳輸至探測頭41的光傳輸路50。 　　[0021] 光傳輸路50，係具備：光旋轉接頭60、作為將光旋轉接頭60的一次側連接於光源3的一次側光路之一次側光纜51、以及作為將光旋轉接頭60的二次側連接於探測頭41的二次側光路之二次側光纜52。光旋轉接頭60，係配置於上定盤20的旋轉軸線L2上，並配置在升降桿32的下端部32a與定盤懸吊件31之間。 　　[0022] 光旋轉接頭60，係具有相對地旋轉自如的靜止側接頭部61及旋轉側接頭部62。另外，在靜止側接頭部61與旋轉側接頭部62之間，係中介設置有軸承64。靜止側接頭部61，係固定安裝在對於機體2為非旋轉的升降桿32的下端部32a。另外，旋轉側接頭部62，係藉由連結於定盤懸吊件31而與定盤懸吊件31及上定盤20一體旋轉。 　　[0023] 另外，升降桿32、靜止側接頭部61、以及旋轉側接頭部62，係形成為與插通孔32b、61a、62a位於同一軸線上，於升降桿32的插通孔32b及靜止側接頭部61的插通孔61a，係***有一次側光纜51，於旋轉側接頭部62的插通孔62a，係***有二次側光纜52。另外，於靜止側接頭部61的插通孔61a、以及旋轉側接頭部62的插通孔62a，係設置有具有聚光性的GRIN(Gradient Refractive Index)透鏡61b、62b。 　　[0024] 於定盤懸吊件31的中央部下面，係以包覆旋轉接頭60的方式配置有呈有底筒狀的纜線罩件73，並以與定盤懸吊件31及上定盤20一體旋轉的方式受到安裝。旋轉側接頭部62與纜線罩件73係藉由連結構件72受到連結，藉此，在上定盤20旋轉時旋轉側接頭部62會與上定盤20一起旋轉。從旋轉側接頭部62的插通孔62a被導出的二次側光纜52，在從形成於定盤懸吊件31的纜線插通孔35被導出至定盤懸吊件31的外部之後，連接於探測頭41。 　　[0025] 一次側光纜51，其一端側係連接於光源3，且其另一端側係***至靜止側接頭部61，並在該兩端之間，設置有作為使雷射光偏光為圓偏光的圓偏光輸出部之圓偏光調整用偏波調整器53。又，使雷射光偏光為圓偏光的圓偏光輸出部，取代圓偏光調整用偏波調整器53，使用射出圓偏光的雷射光的光源亦可。 　　[0026] 另一方面，二次側光纜52，其一端側係***至旋轉側接頭部62，且其另一端側係連接於探測頭41。並且，於該二次側光纜52，係設置有用以將圓偏光的雷射光轉換成直線偏光的直線偏光調整用偏波調整器54。又，前述一次側光纜51及二次側光纜52，係使用單模光纖 (single-mode fiber)、多模光纖(multi-mode fiber)之任一者皆可。另外，一次側光纜51係使用偏波保持光纖 (polarization-maintaining fiber)亦可。 　　[0027] 探測頭41，係具備：分離雷射光的偏光分束器42、轉換該分離了的雷射光的偏光的波長板43a、43b、反射通過了波長板43a的雷射光的反射板(鏡)44、以及檢測雷射光並轉換為電訊號的光偵測器45。在此之偏光分束器42，係使用令雷射光的P波穿透並使S波反射的類型，波長板43a、43b係使用λ/4板。受到光偵測器45所轉換的電訊號，係經由未圖示的纜線傳輸至運算控制部4。 　　[0028] 接著，針對在工件W之研磨時照射至工件W雷射光的光路及偏光特性進行說明。從光源3所輸出的雷射光，係藉由圓偏光調整用偏波調整器53轉換為圓偏光，並入射至光旋轉接頭60的靜止側接頭部61。入射至靜止側接頭部61的雷射光，係穿透GRIN透鏡61b，並進入靜止側接頭部61與旋轉側接頭部62之間的空隙。然後，進入至該空隙的圓偏光之雷射光，係進入至設置於旋轉側接頭部62的GRIN透鏡62b。此時，從靜止側接頭部61射出的雷射光的偏光特性，係藉由圓偏光調整用偏波調整器53成為圓偏光。因圓偏光係作為平行偏波的P波的分量的比例為50%，作為垂直偏波的S波的分量的比例為50%，故即使旋轉側接頭部62為僅傳輸一方之偏波分量的旋轉角度，藉由為混合P波及S波的圓偏光之雷射光，能夠持續將一定的光強度的雷射光從旋轉側接頭部62輸出。亦即，即使以靜止側接頭部61及旋轉側接頭部62之不連續的部位傳輸光，亦不會有因旋轉側接頭部62成為反射面而導致光強度降低或產生變動、或是對於靜止側接頭部61之旋轉側接頭部62的相對旋轉角度導致光強度產生變動之情事，而能夠使透過旋轉側接頭部62傳輸至二次側光纜52的雷射光的光強度無關於旋轉側接頭部62的旋轉角度而幾乎為一定。 　　[0029] 入射至二次側光纜52的圓偏光之雷射光，係藉由直線偏光調整用偏波調整器54被偏光為直線偏光。此時，因入射至直線偏光調整用偏波調整器54的雷射光的光強度係無關於旋轉側接頭部62的旋轉角度而幾乎為一定，故被偏光為直線偏光的雷射光的光強度，亦無關於旋轉側接頭部62的旋轉角度而幾乎為一定。 　　[0030] 從二次側光纜52入射至探測頭41的直線偏光的雷射光，係藉由偏光分束器42分離為P波及S波。此時，因入射至偏光分束器42的雷射光的光強度，係無關於旋轉側接頭部62的旋轉角度而幾乎為一定，故以偏光分束器42所分離的P波及S波的光強度，亦無關於旋轉側接頭部62的旋轉角度而幾乎為一定。 　　[0031] 穿透偏光分束器42的直線偏光之P波，係在通過λ/4板43a之際被轉換為圓偏光，以鏡44反射之後，在返回相同的光路並再度通過λ/4板43a之際被轉換為直線偏光的S波。然後，被轉換為直線偏光的S波之雷射光係入射至偏光分束器42，並被反射至光偵測器45方向。 　　另一方面，藉由穿透偏光分束器42所反射的直線偏光之S波，係在通過λ/4板43b之際被轉換為圓偏光，以工件W反射之後，在返回相同的光路並再度通過λ/4板43b之際被轉換為直線偏光的P波。然後，被轉換為直線偏光的P波之雷射光係穿透偏光分束器42，並入射至光偵測器45。然後，從二次側光纜52入射至偏光分束器42之際受到分離的雷射光，係藉由鏡44或工件W被反射，於再度入射至偏光分束器42之際受到合成，並入射至光偵測器45。入射至光偵測器45的雷射光係被轉換為電訊號並傳輸至運算控制部4，該電訊號係受到運算控制部4運算處理，並如第4圖所示，作為對於樣本數(時間)之工件厚度顯示於畫面。 　　[0032] 於本實施形態中，入射至光偵測器45的雷射光的光強度，係無關於旋轉側接頭部62的旋轉角度而幾乎為一定。因此，能夠抑制旋轉側接頭部62的旋轉角度所導致之研磨當中的工件測量值之週期性變動。另外，照射至工件W的雷射光，以直線偏光輸入至偏光分束器42，之後被轉換為圓偏光並照射至工件W，而能夠使到達工件W的雷射光的光強度之損耗為最低限度。 　　[0033] 另一方面，作為對於本實施形態之比較例，係藉由一種平面研磨裝置進行說明，其係除了圓偏光調整用偏波調整器未設置於一次側光纜51、以及直線偏光調整用偏波調整器54未設置於二次側光纜52以外，具有與第3圖所示之平面研磨裝置實質上相同的構成(未圖示)。於該比較例中，因入射至光旋轉接頭60的雷射光係橢圓偏光或直線偏光等偏光特性並非一定的雷射光，故從光旋轉接頭60射出的雷射光的偏光特性或光強度係隨著旋轉側接頭部62的旋轉角度有週期性變動。並且，因從該光旋轉接頭60射出的雷射光的光強度有週期性變動，故以偏光分束器42分離、合成的雷射光的光強度會有週期性變動。因此，從光偵測器45傳輸至運算控制部4的電訊號，係因旋轉側接頭部62的旋轉角度而有週期性變動，故以運算控制部4所運算處理並顯示於畫面的對於樣本數(時間)之工件測量值，亦有週期性變動(參照第5圖)。 　　[0034] 於前述之實施形態中，雖係針對於上定盤20安裝探測頭41，並於升降桿32的下端部32a與定盤懸吊件31之間安裝光旋轉接頭60的平面研磨裝置1進行說明，然而作為變形例，亦能夠構成為將探測頭41安裝於下定盤10，並將旋轉接頭60配置於下定盤10的旋轉軸線L1上，並從下定盤10側測量工件W。在變形例的情形下，於第1圖、第2圖中，能夠視賦予符號32的部分為進行旋轉的下定盤用驅動軸，並視賦予符號31的部分為下定盤用驅動軸的周圍之靜止的機體部分，如此，則靜止側接頭部61成為旋轉側接頭部，旋轉側接頭部62成為靜止側接頭部。另外，連接於靜止側接頭部61的一次側光纜51係成為與旋轉側接頭部62及探測頭41連接的二次側光纜。此時，於下定盤10，係形成有貫穿其上下面的測量孔23，並於該測量孔23的正下方配置探測頭41。進而，纜線罩件73係安裝於作為靜止側之機體部分，收容於纜線罩件73內的二次側光纜52係成為連接測量單元5與靜止側接頭部61的一次側光纜。 　　[0035] 另外，本發明之平面研磨裝置，係亦可為：一種單面研磨裝置，其係具有以第1旋轉軸線為中心旋轉的定盤、以及以第2旋轉軸線為中心旋轉並保持工件W的保持部，並藉由在使保持了工件W的保持部與定盤接觸的狀態使定盤及保持部旋轉，而研磨工件W的單面。於該單面研磨裝置中，探測頭係設置於保持部，光旋轉接頭係配置於第2旋轉軸線上，一次側光纜係連接於光源至靜止側接頭部之間，二次側光纜係連接於探測頭及旋轉側接頭部。另外，於一次側光纜係設置有圓偏光調整用偏波調整器，於二次側光纜係設置有直線偏光調整用偏波調整器。因於該單面研磨裝置中使用於研磨當中之工件測量的雷射光的光路，係與前述之兩面研磨裝置實質上相同，故省略其說明。又，前述單面研磨裝置，係探測頭設置於定盤，而光旋轉接頭配置於第1旋轉軸線上亦可。 　　[0036] 另外，單面研磨裝置，係定盤或是保持部之任一方旋轉並固定另一方者亦可。在係定盤旋轉而保持部固定的單面研磨裝置的情形下，探測頭係設置於定盤，光旋轉接頭係配置於定盤的旋轉軸線上。另外，在係定盤固定而保持部旋轉的單面研磨裝置的情形下，探測頭係設置於保持部，光旋轉接頭係配置於保持部的旋轉軸線上。又，定盤及保持部之兩方旋轉的單面研磨裝置、與定盤或保持部任一方旋轉而另一方固定的單面研磨裝置，係其他的構成實質上相同，故省略針對其他構成及雷射光的光路的說明。 　　[0037] 於如此之單面研磨裝置，從光源所輸出的雷射光，亦係藉由圓偏光調整用偏波調整器轉換為圓偏光，並入射至光旋轉接頭。並且，因從靜止側接頭部朝向旋轉側接頭部射出的雷射光的偏光特性為圓偏光，故透過旋轉側接頭部傳輸至二次側光纜的雷射光的光強度係無關於旋轉側接頭部的旋轉角度而幾乎為一定。因此，於單面研磨裝置中，亦與兩面研磨裝置相同，能夠抑制旋轉側接頭部的旋轉角度所導致之研磨當中的工件測量值之週期性變動。 　　另外，於前述單面研磨裝置中，亦與兩面研磨裝置相同，將以直線偏光輸入至偏光分束器並照射至工件的雷射光轉換為圓偏光，而能夠使到達工件的雷射光的光強度之損耗為最低限度。The present invention, be related to the plane grinding device of the plane that grinds workpiece while measuring workpiece, and can be applicable to the two-sided grinding device of both sides of grinding workpiece, the single-sided grinding device of grinding the single side of workpiece. In addition, although this invention can be applied to various measurements, such as the thickness of a workpiece|work, a cross-sectional shape, etc., in this embodiment, the measurement of the thickness of a workpiece|work is demonstrated as an example. FIGS. 1 to 4 show a flat surface polishing apparatus 1 as an embodiment of the flat surface polishing apparatus of the present invention, which has a lower surface plate 10 that rotates around a rotation axis L1, and is supported by the body 2 to rotate The axis L2 is the upper platen 20 that rotates at the center, and both surfaces of the workpiece W are ground by rotating these platens 10 and 20 . In this surface polishing apparatus, the rotation axes L1 and L2 are arranged on the same axis. [0014] The body 2 is provided with a light source 3 including laser light and a measurement unit 5 of the arithmetic control unit 4, and is supported with an actuator 7 for raising and lowering the upper platen 20. The light source 3 outputs laser light, and the calculation control unit 4 collects measurement data (measurement values) such as the thickness of the workpiece W, and controls the entire polishing apparatus 1 by calculating or analyzing the collected data. In addition, the measurement unit 5 including the light source 3 and the arithmetic control unit 4 is installed at a position outside the body 2 that is not affected by the rotation of the upper platen 20 or the lower platen 10 (outside the body 2 and the upper platen 20 or the lower platen) A position where the rotation of the disk 10 is not possible) may also be used. [0015] The sun gear 11 is arranged at the center of the lower surface plate 10, and the inner gear 12 is arranged on the outer periphery of the lower surface plate 10 so as to surround the lower surface plate 10. The first drive shaft 13 is connected to the lower center of the sun gear 11 , the second drive shaft 14 is connected to the lower center of the lower face plate 10 , and the third drive shaft 15 is connected to the lower center of the ring gear 12 . In addition, a fourth drive shaft 16 is connected to the center of the lower surface plate 10 , and the fourth drive shaft 16 is accommodated in the first drive shaft 13 . The first drive shaft 13 is accommodated in the second drive shaft 14 , and the second drive shaft 14 is accommodated in the third drive shaft 15 . These 1st drive shaft 13 to 4th drive shaft 16 are comprised so that it may be driven and rotated by the drive device which is not shown in figure. [0016] Between the upper surface plate 20 and the lower surface plate 10, a plurality of pinwheels 37 holding workpieces W such as silicon wafers are interposed in a manner of meshing with the sun gear 11 and the internal gear 12. A workpiece holding hole 37a is formed in each of the planetary wheels 37, and the workpiece W is held in the workpiece holding hole 37a. Each of the aforementioned planetary gears 37 rotates and/or revolves around the sun gear 11 by the rotation of the sun gear 11 and the internal gear 12 . In addition, polishing pads 18 a and 18 b are attached to the lower surface of the upper surface plate 20 and the upper surface of the lower surface plate 10 , respectively, and the workpieces W held by the planetary wheels 37 are polished by the rotation and/or revolution of the planetary wheels 37 . the upper and lower sides. [0017] The upper surface plate 20 is mounted on the lift rod 32 of the lift actuator 7 through the surface plate suspension member 31. The central axis of the lift rod 32 coincides with the aforementioned rotation axes L1 and L2. A plurality of support studs 33 extending downward are attached to the lower surface of the outer peripheral side of the surface plate hanger 31 , and the support studs 33 are attached to the upper surface of the upper surface plate 20 . In addition, between the inner peripheral surface of the plate hanger 31 and the outer peripheral surface of the lift rod 32, a bearing 34 is interposed, and the plate hanger 31 and the lift rod 32 are fixed in the up-down direction. They are combined, but they are combined relatively rotatably in the rotation direction of the upper platen 20 . [0018] A holding bracket 36 for holding a measuring device (probe) 41 to be described later is attached to the aforementioned support stud 33. The probe head 41 is disposed just above the measurement hole 23 penetrating the upper and lower surfaces of the upper surface plate 20 by adjusting the installation position of the holding bracket 36 . In addition, a window member 26 having a transparent window plate 25 provided at the lower end is attached to the measurement hole 23 . Further, the probe head 41 can be directly attached to the upper platen 20, or the probe head 41 can be held by the holding bracket 36 fixed to the platen hanger 31, as long as it can be integrated with the upper platen 20. Just rotate. [0019] The upper platen 20 is raised to the standby position (not shown) by the lifting rod 32 when the workpiece W is not ground, and when the workpiece W is ground, it descends to the grinding position in Figure 1. When the upper platen 20 is lowered, the hooks 22 mounted on the upper platen 20 are engaged with the driver 17 at the upper end of the fourth drive shaft 16, and the upper platen 20 and the platen hanger 31 are connected by the fourth drive shaft. 16 is driven by a driver 17 to rotate integrally. [0020] In addition, the upper surface plate 20 is provided with a workpiece measuring mechanism 40 that measures the thickness or shape of the workpiece W using the laser light emitted from the light source 3. The workpiece measurement mechanism 40 includes a probe head 41 that irradiates the workpiece W with laser light and receives reflected light from the workpiece W, and an optical transmission path 50 that transmits the laser light from the light source 3 to the probe head 41 . The optical transmission path 50 is provided with: an optical rotary joint 60, a primary side optical cable 51 serving as a primary side optical path connecting the primary side of the optical rotary joint 60 to the light source 3, and a secondary side serving as the optical rotary joint 60. The secondary side optical cable 52 connected to the secondary side optical path of the probe head 41 . The optical rotary joint 60 is arranged on the rotation axis L2 of the upper platen 20 , and is arranged between the lower end portion 32 a of the lift rod 32 and the platen hanger 31 . [0022] The optical rotary joint 60 has a stationary-side joint portion 61 and a rotating-side joint portion 62 that are relatively rotatable. In addition, a bearing 64 is interposed between the stationary-side joint portion 61 and the rotation-side joint portion 62 . The stationary side joint portion 61 is fixedly attached to the lower end portion 32 a of the lift rod 32 which is not rotated with respect to the body 2 . In addition, the rotating-side joint portion 62 is connected to the plate hanger 31 to rotate integrally with the plate hanger 31 and the upper platen 20 . In addition, the elevating rod 32, the stationary side joint portion 61, and the rotating side joint portion 62 are formed so as to be located on the same axis as the insertion holes 32b, 61a, 62a, and the insertion holes 32b of the elevating rod 32 and the stationary side are formed on the same axis. The primary side optical cable 51 is inserted into the insertion hole 61 a of the side joint part 61 , and the secondary side optical fiber cable 52 is inserted into the insertion hole 62 a of the rotary side joint part 62 . In addition, GRIN (Gradient Refractive Index) lenses 61b and 62b having condensing properties are provided in the insertion hole 61a of the stationary side joint part 61 and the insertion hole 62a of the rotary side joint part 62 . Below the central portion of the plate suspension member 31, a cable cover member 73 with a bottomed cylindrical shape is arranged in a manner to cover the rotary joint 60, and is arranged with the plate suspension member 31 and the upper fixed plate. The disk 20 is mounted in such a manner that it rotates integrally. The rotation-side joint part 62 and the cable cover 73 are connected by the connecting member 72 , whereby the rotation-side joint part 62 rotates together with the upper platen 20 when the upper platen 20 rotates. The secondary-side optical cable 52 led out from the insertion hole 62 a of the rotary-side joint portion 62 is led out from the cable insertion hole 35 formed in the plate hanger 31 to the outside of the plate hanger 31 , Connected to the probe head 41 . The primary side optical cable 51 is connected to the light source 3 at one end, and the other end is inserted into the stationary side joint portion 61, and between the two ends, is provided with a device for making the laser light polarized into circularly polarized light. Polarization adjuster 53 for adjusting circularly polarized light in the output portion of circularly polarized light. In addition, a circularly polarized light output unit that polarizes the laser light into circularly polarized light may be a light source that emits circularly polarized laser light instead of the polarization adjuster 53 for adjusting circularly polarized light. [0026] On the other hand, one end side of the secondary side optical cable 52 is inserted into the rotary side joint portion 62, and the other end side thereof is connected to the probe head 41. In addition, the secondary-side optical cable 52 is provided with a polarization adjuster 54 for adjusting linear polarization for converting circularly polarized laser light into linear polarization. In addition, the primary side optical cable 51 and the secondary side optical cable 52 may use either a single-mode fiber or a multi-mode fiber. In addition, a polarization-maintaining fiber may be used for the primary-side optical cable 51 . Probe 41 is equipped with: polarizing beam splitter 42 for separating laser light, wavelength plates 43a, 43b for converting the polarized light of the separated laser light, reflecting plate (mirror) for the laser light that has passed through wavelength plate 43a. ) 44, and a photodetector 45 that detects the laser light and converts it into an electrical signal. Here, as the polarizing beam splitter 42, a type that transmits the P wave of the laser light and reflects the S wave is used, and the wavelength plates 43a and 43b are λ/4 plates. The electrical signal converted by the photodetector 45 is transmitted to the arithmetic control unit 4 via a cable not shown. [0028] Next, the optical path and polarization characteristics of the laser light irradiated to the workpiece W during the grinding of the workpiece W will be described. The laser light output from the light source 3 is converted into circularly polarized light by the polarization adjuster 53 for adjusting circularly polarized light, and is incident on the stationary side joint portion 61 of the optical rotary joint 60 . The laser light incident on the stationary-side joint portion 61 penetrates the GRIN lens 61 b and enters the gap between the stationary-side joint portion 61 and the rotating-side joint portion 62 . Then, the circularly polarized laser light entering the space enters the GRIN lens 62 b provided in the rotary joint portion 62 . At this time, the polarization characteristics of the laser light emitted from the stationary-side joint portion 61 are circularly polarized by the polarization adjuster 53 for adjusting circular polarization. Since the ratio of the component of the P wave, which is a parallel polarized wave, is 50%, and the ratio of the component of the S wave, which is a vertically polarized wave, is 50%, even if the rotary joint portion 62 transmits only one of the polarized wave components, the circularly polarized light system has a ratio of 50%. With respect to the rotation angle, laser light with a constant light intensity can be continuously output from the rotating-side joint portion 62 by the circularly polarized laser light that is a mixture of P-wave and S-wave. That is, even if light is transmitted through discontinuous portions of the stationary-side joint portion 61 and the rotating-side joint portion 62, the light intensity will not decrease or fluctuate due to the rotating-side joint portion 62 becoming a reflective surface, or there will be no change in light intensity. The relative rotation angle of the rotary-side joint part 62 of the side joint part 61 causes the light intensity to vary, so that the light intensity of the laser light transmitted through the rotary-side joint part 62 to the secondary-side optical cable 52 can be made independent of the rotary-side joint part. The rotation angle of 62 is almost constant. [0029] The circularly polarized laser light incident on the secondary side optical cable 52 is polarized into linearly polarized light by the polarization adjuster 54 for adjusting linearly polarized light. At this time, since the light intensity of the laser light incident on the polarization adjuster 54 for linear polarization adjustment is almost constant regardless of the rotation angle of the rotating side joint portion 62, the light intensity of the laser light polarized as linearly polarized light is It is almost constant regardless of the rotation angle of the rotation-side joint portion 62 . [0030] The linearly polarized laser light incident on the probe head 41 from the secondary side optical cable 52 is separated into P waves and S waves by the polarization beam splitter 42. At this time, since the light intensity of the laser light incident on the polarization beam splitter 42 is almost constant regardless of the rotation angle of the rotary joint portion 62 , the light of the P wave and the S wave separated by the polarization beam splitter 42 is used. The strength is almost constant regardless of the rotation angle of the rotation-side joint portion 62 . The P wave of the linearly polarized light that penetrates the polarizing beam splitter 42 is converted into circularly polarized light when passing through the λ/4 plate 43a, after reflecting with the mirror 44, returning to the same optical path and passing through the λ/4 again The plate 43a is converted into linearly polarized S waves. Then, the laser light of the S-wave converted into linearly polarized light is incident on the polarization beam splitter 42 and reflected to the direction of the photodetector 45 . On the other hand, the S wave of linearly polarized light reflected by the penetrating polarizing beam splitter 42 is converted into circularly polarized light when passing through the λ/4 plate 43b, and after being reflected by the workpiece W, returns to the same optical path and When passing through the λ/4 plate 43b again, it is converted into a linearly polarized P wave. Then, the laser light of the P wave converted into linearly polarized light passes through the polarization beam splitter 42 and is incident on the photodetector 45 . Then, the laser light that was separated when incident on the polarizing beam splitter 42 from the secondary side optical cable 52 is reflected by the mirror 44 or the workpiece W, and is combined when entering the polarizing beam splitter 42 again, and is incident on to the photodetector 45. The laser light incident on the photodetector 45 is converted into an electrical signal and transmitted to the arithmetic control unit 4, and the electrical signal is subjected to arithmetic processing by the arithmetic control unit 4, and as shown in FIG. ) of the workpiece thickness is displayed on the screen. [0032] In this embodiment, the light intensity of the laser light incident on the photodetector 45 is almost constant regardless of the rotation angle of the rotary joint portion 62. Therefore, the periodic variation of the workpiece measurement value during grinding due to the rotation angle of the rotary joint portion 62 can be suppressed. In addition, the laser light irradiated to the workpiece W is input to the polarization beam splitter 42 as linearly polarized light, and then converted into circularly polarized light and irradiated to the workpiece W, so that the loss of the light intensity of the laser light reaching the workpiece W can be minimized . On the other hand, as the comparative example for the present embodiment, be described by a kind of plane grinding device, and it is not arranged on primary side optical cable 51 and linearly polarized light adjustment with polarization adjuster except circularly polarized light adjustment. The polarization adjuster 54 is not provided outside the secondary-side optical cable 52, and has substantially the same configuration (not shown) as the plane polishing apparatus shown in FIG. 3 . In this comparative example, since the laser light incident on the optical rotary joint 60 is laser light with non-constant polarization characteristics such as elliptically polarized light or linearly polarized light, the polarization characteristics or light intensity of the laser light emitted from the optical rotary joint 60 vary with The rotation angle of the rotation-side joint portion 62 varies periodically. In addition, since the light intensity of the laser light emitted from the optical rotary joint 60 changes periodically, the light intensity of the laser light separated and combined by the polarization beam splitter 42 changes periodically. Therefore, the electrical signal transmitted from the photodetector 45 to the arithmetic control unit 4 periodically changes due to the rotation angle of the rotating side joint portion 62 , so the sample is processed by the arithmetic control unit 4 and displayed on the screen. The measured value of the workpiece in number (time) also fluctuates periodically (refer to Figure 5). In the aforementioned embodiment, although the probe head 41 is installed on the upper surface plate 20, the plane grinding device of the optical rotary joint 60 is installed between the lower end portion 32a of the lifting rod 32 and the surface plate suspension member 31. 1. However, as a modification, the probe 41 can be attached to the lower platen 10, the rotary joint 60 can be arranged on the rotation axis L1 of the lower platen 10, and the workpiece W can be measured from the lower platen 10 side. In the case of the modified example, in Figs. 1 and 2, the portion to which reference numeral 32 is attached can be regarded as the rotating lower platen drive shaft, and the portion denoted by numeral 31 can be regarded as the periphery of the lower platen's drive shaft. As for the stationary body portion, the stationary side joint portion 61 becomes the rotation side joint portion, and the rotation side joint portion 62 becomes the stationary side joint portion. In addition, the primary-side optical cable 51 connected to the stationary-side joint portion 61 becomes a secondary-side optical cable connected to the rotary-side joint portion 62 and the probe head 41 . At this time, the lower surface plate 10 is formed with a measurement hole 23 penetrating the upper and lower surfaces thereof, and the probe 41 is disposed directly below the measurement hole 23 . Furthermore, the cable cover 73 is attached to the body part as the stationary side, and the secondary side optical cable 52 accommodated in the cable cover 73 becomes the primary side optical cable connecting the measurement unit 5 and the stationary side connector 61 . In addition, the plane grinding device of the present invention can also be: a kind of single-sided grinding device, and it system has the platen that rotates with the 1st axis of rotation as the center and rotates with the 2nd axis of rotation and keeps the workpiece One side of the workpiece W is ground by rotating the table and the holding portion in a state where the holding portion holding the workpiece W is in contact with the table plate. In the single-side polishing device, the probe head is arranged on the holding part, the optical rotary joint is arranged on the second rotation axis, the primary side optical cable is connected between the light source and the stationary side joint part, and the secondary side optical cable is connected to Probe head and rotary side joint. In addition, a polarization adjuster for adjusting circular polarization is provided on the primary side optical cable system, and a polarization adjuster for linear polarization adjustment is installed on the secondary side optical fiber cable system. Since the optical path of the laser beam used in the measurement of the workpiece during polishing in the single-side polishing apparatus is substantially the same as that of the aforementioned double-side polishing apparatus, the description thereof is omitted. In addition, in the above-mentioned single-side polishing apparatus, the probe head may be provided on the surface plate, and the optical rotary joint may be arranged on the first rotation axis. [0036] In addition, the single-side grinding device can be either the fixed plate or the holding portion to rotate and fix the other. In the case of a single-side polishing apparatus in which the table plate rotates and the holding portion is fixed, the probe head is provided on the table plate, and the optical rotary joint is arranged on the rotation axis of the table plate. In addition, in the case of the single-side polishing apparatus in which the surface plate is fixed and the holding portion rotates, the probe head is provided on the holding portion, and the optical rotary joint is arranged on the rotation axis of the holding portion. In addition, the single-side polishing device in which both the platen and the holding portion rotate, and the single-side polishing device in which one of the platen and the holding portion is rotated and the other is fixed, have substantially the same other structures, so it is omitted to describe other structures and Illustration of the optical path of the laser light. [0037] In such a single-side polishing device, the laser light output from the light source is also converted into circularly polarized light by a circularly polarized light adjusting polarizer, and is incident on the optical rotary joint. In addition, since the polarization characteristic of the laser light emitted from the stationary side joint portion toward the rotating side joint portion is circularly polarized light, the light intensity of the laser light transmitted through the rotating side joint portion to the secondary side optical cable is independent of the rotating side joint portion. The rotation angle is almost constant. Therefore, in the single-side polishing apparatus, similarly to the double-side polishing apparatus, the periodic variation of the workpiece measurement value during polishing due to the rotation angle of the rotary joint portion can be suppressed. In addition, in the aforementioned single-side polishing apparatus, similarly to the double-side polishing apparatus, the linearly polarized laser light input to the polarization beam splitter and irradiated to the workpiece is converted into circularly polarized light, so that the light intensity of the laser light reaching the workpiece can be increased. losses to a minimum.

[0038]1‧‧‧平面研磨裝置3‧‧‧光源10‧‧‧下定盤20‧‧‧上定盤40‧‧‧工件測量機構41‧‧‧測量器(探測頭)42‧‧‧偏光分束器43a、43b‧‧‧波長板44‧‧‧反射板50‧‧‧光傳輸路51‧‧‧一次側光纜(一次側光路)52‧‧‧二次側光纜(二次側光路)53‧‧‧圓偏光調整用偏波調整器54‧‧‧直線偏光調整用偏波調整器60‧‧‧光旋轉接頭61‧‧‧靜止側接頭部62‧‧‧旋轉側接頭部L1、L2‧‧‧旋轉軸線W‧‧‧工件[0038] 1‧‧‧Plane grinding device 3‧‧‧Light source 10‧‧‧Lower plate 20‧‧‧Upper plate 40‧‧‧Workpiece measuring mechanism 41‧‧‧Measurer (probe) 42‧‧‧Polarized light Beam splitters 43a, 43b‧‧‧Wavelength plate 44‧‧‧Reflector 50‧‧‧Optical transmission path 51‧‧‧Primary side optical cable (Primary side optical path) 52‧‧‧Secondary side optical fiber cable (Secondary side optical path) 53‧‧‧Polarization adjuster for circular polarization adjustment 54‧‧‧Polarization adjuster for linear polarization adjustment 60‧‧‧Optical rotary joint 61‧‧‧Stationary side joint part 62‧‧‧Rotating side joint part L1, L2 ‧‧‧Rotation axis W‧‧‧Workpiece

[0012] 　　[第1圖]係概略表示本發明之平面研磨裝置的實施形態的剖面圖。 　　[第2圖]係將第1圖的旋轉接頭周邊擴大的剖面圖。 　　[第3圖]係表示第1圖所示之平面研磨裝置的光學系的示意圖。 　　[第4圖]係表示第1圖所示之平面研磨裝置所測量的工件厚度的圖表。 　　[第5圖]係表示以比較例所示之平面研磨裝置所測定的工件厚度的圖表。[0012] [FIG. 1] is a cross-sectional view schematically showing an embodiment of the surface polishing apparatus of the present invention. [Fig. 2] is an enlarged cross-sectional view around the rotary joint shown in Fig. 1. [Fig. 3] is a schematic diagram showing the optical system of the surface polishing apparatus shown in Fig. 1. [Fig. 4] is a graph showing the thickness of the workpiece measured by the surface grinding device shown in Fig. 1. [Fig. 5] is a graph showing the thickness of the workpiece measured by the surface polishing apparatus shown in the comparative example.

1‧‧‧平面研磨裝置 1‧‧‧Plane grinding device

2‧‧‧機體 2‧‧‧Airframe

3‧‧‧光源 3‧‧‧Light source

4‧‧‧運算控制部 4‧‧‧Computation Control Section

5‧‧‧測量單元 5‧‧‧Measurement unit

7‧‧‧升降用致動器 7‧‧‧Actuator for lifting

10‧‧‧下定盤 10‧‧‧Fixing

11‧‧‧太陽齒輪 11‧‧‧Sun Gear

12‧‧‧內齒輪 12‧‧‧Internal gear

13‧‧‧第1驅動軸 13‧‧‧1st drive shaft

14‧‧‧第2驅動軸 14‧‧‧Second drive shaft

15‧‧‧第3驅動軸 15‧‧‧3rd drive shaft

16‧‧‧第4驅動軸 16‧‧‧4th drive shaft

17‧‧‧驅動器 17‧‧‧Drive

18a‧‧‧研磨墊 18a‧‧‧Polishing pads

18b‧‧‧研磨墊 18b‧‧‧Polishing pad

20‧‧‧上定盤 20‧‧‧Fixed

22‧‧‧鉤 22‧‧‧Hook

23‧‧‧測量孔 23‧‧‧Measuring hole

25‧‧‧窗板 25‧‧‧Window panel

26‧‧‧窗構件 26‧‧‧Window Components

31‧‧‧定盤懸吊件 31‧‧‧Fixed plate suspension

32‧‧‧升降桿 32‧‧‧Lifting rod

33‧‧‧支撐螺柱 33‧‧‧Support Stud

34‧‧‧軸承 34‧‧‧Bearing

36‧‧‧保持支架 36‧‧‧Retaining bracket

37‧‧‧遊星輪 37‧‧‧Star Cruises

37a‧‧‧工件保持孔 37a‧‧‧Workpiece holding hole

40‧‧‧工件測量機構 40‧‧‧Workpiece measuring mechanism

41‧‧‧測量器(探測頭) 41‧‧‧Measurer (Probe)

50‧‧‧光傳輸路 50‧‧‧Optical transmission path

51‧‧‧一次側光纜(一次側光路) 51‧‧‧Primary side optical cable (primary side optical path)

52‧‧‧二次側光纜(二次側光路) 52‧‧‧Secondary side optical cable (secondary side optical path)

53‧‧‧圓偏光調整用偏波調整器 53‧‧‧Polarization adjuster for circular polarization adjustment

54‧‧‧直線偏光調整用偏波調整器 54‧‧‧Polarization adjuster for linear polarization adjustment

60‧‧‧光旋轉接頭 60‧‧‧Optical rotary joint

W‧‧‧工件 W‧‧‧Workpiece

L1‧‧‧旋轉軸線 L1‧‧‧Rotation axis

L2‧‧‧旋轉軸線 L2‧‧‧Rotation axis

Claims (7)

一種平面研磨裝置，係具有旋轉自如地受到機體支承的上定盤及下定盤，在該上定盤與下定盤之間夾持工件，並使兩定盤旋轉而研磨前述工件的兩面，其特徵為：該平面研磨裝置，係具備使用雷射光測量前述工件的工件測量機構；該工件測量機構，係具有：對於前述工件照射前述雷射光，並且接收來自該工件的反射光的測量器、以及將前述雷射光從光源傳輸至前述測量器的光傳輸路；前述測量器，係安裝於前述上定盤及下定盤之其中一方，該光傳輸路，係具備：配置於安裝有前述測量器的定盤的旋轉軸線上的光旋轉接頭、將該光旋轉接頭的一次側連接於前述光源的一次側光路、以及將該光旋轉接頭的二次側連接於前述測量器的二次側光路；前述光旋轉接頭，係具有：連接於前述一次側光路且對於機體作固定設置的靜止側接頭部、以及連接於前述二次側光路並與安裝有前述測量器的定盤一起旋轉的旋轉側接頭部；在前述一次側光路，於除了前述靜止側接頭部的位置，係設置有輸出圓偏光之雷射光的圓偏光輸出部，從前述圓偏光輸出部通過一次側光路被傳輸至前述靜止側接頭部的圓偏光之雷射光，係從該靜止側接頭部入射 至前述旋轉側接頭部。 A plane grinding device is provided with an upper platen and a lower platen that are rotatably supported by a body, clamps a workpiece between the upper platen and the lower platen, and rotates the two platens to grind both sides of the workpiece. It is: the plane grinding device is provided with a workpiece measuring mechanism for measuring the workpiece using laser light; the workpiece measuring mechanism is provided with: irradiating the workpiece with the laser light and receiving the reflected light from the workpiece. The laser light is transmitted from the light source to the optical transmission path of the measuring device; the measuring device is installed on one of the upper platen and the lower platen, and the optical transmission path is provided with: a fixed position where the measuring device is installed. an optical rotary joint on the axis of rotation of the disk, a primary side optical path connecting the primary side of the optical rotary joint to the aforementioned light source, and a secondary side optical path connecting the secondary side of the optical rotary joint to the aforementioned measuring instrument; the aforementioned light The rotary joint has: a stationary side joint part connected to the primary side optical path and fixedly arranged for the body, and a rotary side joint part connected to the secondary side optical path and rotating together with the plate on which the measuring instrument is installed; In the primary-side optical path, a circularly polarized light output portion for outputting circularly polarized laser light is provided at a position other than the stationary-side joint portion, and the circularly polarized light output portion is transmitted to the stationary-side joint portion through the primary-side optical path. The circularly polarized laser light is incident from the stationary side joint part to the aforementioned rotary side joint. 一種平面研磨裝置，係具有：受到機體支承的定盤、以及保持工件的保持部，使該定盤及保持部至少一方旋轉，並在使前述工件與前述定盤接觸的狀態，研磨工件的單面，其特徵為：該平面研磨裝置，係具備使用雷射光測量前述工件的工件測量機構；前述工件測量機構，係具有：對於前述工件照射前述雷射光，並且接收來自該工件的反射光的測量器、以及將雷射光從光源傳輸至前述測量器的光傳輸路；前述測量器，係安裝於前述定盤或保持部之其中一方，該光傳輸路，係具備：設置於安裝有前述測量器的定盤或是保持部的旋轉軸線上的光旋轉接頭、將該光旋轉接頭的一次側連接於前述光源的一次側光路、以及將該光旋轉接頭的二次側連接於前述測量器的二次側光路；前述光旋轉接頭，係具有：連接於前述一次側光路且對於機體作固定設置的靜止側接頭部、以及連接於前述二次側光路並與前述定盤或是保持部之至少一方一起旋轉的旋轉側接頭部；在前述一次側光路，於除了前述靜止側接頭部的位置，係設置有輸出圓偏光之雷射光的圓偏光輸出部， 從前述圓偏光輸出部通過一次側光路被傳輸至前述靜止側接頭部的圓偏光之雷射光，係從該靜止側接頭部入射至前述旋轉側接頭部。 A plane grinding device comprising: a platen supported by a body, and a holding portion for holding a workpiece, at least one of the platen and the holding portion is rotated, and a single unit for grinding the workpiece in a state where the workpiece and the platen are brought into contact with each other. It is characterized in that: the plane grinding device is equipped with a workpiece measuring mechanism for measuring the workpiece using laser light; the workpiece measuring mechanism is equipped with: irradiating the workpiece with the laser light, and receiving the measurement of the reflected light from the workpiece a device, and an optical transmission path for transmitting the laser light from the light source to the measuring device; the measuring device is mounted on one of the platen or the holding part, and the optical transmission path is provided with: The optical rotary joint on the rotation axis of the fixed plate or the holding part, the primary side of the optical rotary joint is connected to the optical path of the primary side of the light source, and the secondary side of the optical rotary joint is connected to the measurement device. The secondary side optical path; the aforementioned optical rotary joint has: a stationary side joint portion connected to the aforementioned primary side optical path and fixedly arranged on the body, and connected to the aforementioned secondary side optical path and connected to at least one of the aforementioned platen or the holding portion The rotating side joint part that rotates together; in the primary side optical path, at a position other than the static side joint part, there is a circularly polarized light output part that outputs circularly polarized laser light, The circularly polarized laser light transmitted from the circularly polarized light output portion to the stationary-side joint portion through the primary-side optical path is incident on the rotating-side joint portion from the stationary-side joint portion. 如請求項1或2所述之平面研磨裝置，其中，前述圓偏光輸出部係設置於機體。 The plane polishing device according to claim 1 or 2, wherein the circularly polarized light output part is provided in the body. 如請求項1或2所述之平面研磨裝置，其中，前述圓偏光輸出部，係用以將來自前述光源的雷射光的偏光轉換成圓偏光的雷射光之圓偏光調整用偏波調整器，該圓偏光調整用偏波調整器係設置於前述光源與靜止側接頭部之間。 The plane polishing apparatus according to claim 1 or 2, wherein the circularly polarized light output part is a polarizer for adjusting circular polarization for converting the polarized light of the laser light from the light source into circularly polarized laser light, The polarization adjuster for adjusting circularly polarized light is provided between the light source and the stationary side joint part. 如請求項1或2所述之平面研磨裝置，其中，前述圓偏光輸出部，係輸出圓偏光的雷射光的光源。 The plane polishing apparatus according to claim 1 or 2, wherein the circularly polarized light output unit is a light source that outputs circularly polarized laser light. 如請求項1或2所述之平面研磨裝置，其中，在前述二次側光路，設置有用以將前述二次側光路所傳輸的雷射光的偏光轉換成直線偏光的直線偏光調整用偏波調整器。 The plane polishing apparatus according to claim 1 or 2, wherein the secondary-side optical path is provided with a polarization adjustment for linear polarization adjustment for converting the polarization of the laser light transmitted through the secondary-side optical path into linearly polarized light device. 如請求項6所述之平面研磨裝置，其中，前述測量器，係具有：使從前述二次側光路所傳輸的直線偏光的雷射光分離為第1雷射光及第2雷射光的偏光 分束器、使該第1雷射光及第2雷射光的偏光成為圓偏光地作偏光的波長板、以及使反射通過前述波長板的第1雷射光再度入射至前述波長板的反射板；將前述第2雷射光照射至前述工件，並將該工件所反射的反射光、與前述反射板所反射的第1雷射光的反射光藉由前述偏光分束器進行合成。 The plane polishing apparatus according to claim 6, wherein the measuring device has a polarized light that separates the linearly polarized laser light transmitted from the secondary side optical path into a first laser light and a second laser light a beam splitter, a wavelength plate for polarizing the polarized light of the first laser light and the second laser light to be circularly polarized, and a reflector for making the first laser light reflected through the wavelength plate re-incident to the wavelength plate; The second laser light is irradiated to the workpiece, and the reflected light reflected by the workpiece and the reflected light of the first laser light reflected by the reflecting plate are combined by the polarizing beam splitter.
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