TW201813775A - Surface polishing apparatus capable of polishing a workpiece while measuring the workpiece and also suppressing changes in the thickness of a workpiece - Google Patents
Surface polishing apparatus capable of polishing a workpiece while measuring the workpiece and also suppressing changes in the thickness of a workpiece Download PDFInfo
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- TW201813775A TW201813775A TW106133306A TW106133306A TW201813775A TW 201813775 A TW201813775 A TW 201813775A TW 106133306 A TW106133306 A TW 106133306A TW 106133306 A TW106133306 A TW 106133306A TW 201813775 A TW201813775 A TW 201813775A
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- 238000005498 polishing Methods 0.000 title claims abstract description 34
- 230000003287 optical effect Effects 0.000 claims abstract description 131
- 230000010287 polarization Effects 0.000 claims description 27
- 230000007246 mechanism Effects 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000523 sample Substances 0.000 abstract description 18
- 239000013307 optical fiber Substances 0.000 abstract description 6
- 238000005259 measurement Methods 0.000 description 14
- 239000000725 suspension Substances 0.000 description 14
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000001514 detection method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Crushing And Grinding (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
[0001] 本發明，係有關於研磨工件的平面之平面研磨裝置，特別是，有關於一邊測量工件一邊研磨工件的平面之平面研磨裝置。[0001] The present invention relates to a surface polishing device for grinding a flat surface of a workpiece, and more particularly to a surface polishing device for grinding a flat surface of a workpiece while measuring the workpiece.
[0002] 作為研磨工件的平面之平面研磨裝置，一般而言，已知有同時研磨工件的兩面之兩面研磨裝置、或是研磨工件的單面之單面研磨裝置。就該等平面研磨裝置而言，為了提升工件的研磨精度，係一般測量工件的厚度或剖面形狀，一邊研磨工件的平面。例如，於專利文獻1之第5圖，係揭示有一種平面研磨裝置，其係朝向工件照射測定光，並且將接收該反射光的厚度測定裝置安裝於旋轉自如的上定盤。於該平面研磨裝置，係在工件之研磨當中，從厚度測定裝置朝向工件射出測定光，並以厚度測定裝置接收工件所反射的反射光。並且，厚度測定裝置所接收的反射光，係透過光纜、光纜旋轉接頭傳輸至外部的運算裝置，而以該運算裝置運算工件的厚度。 [0003] 另外，該種光旋轉接頭，係具有：對於機體等固定構件作固定設置，保持靜止側光纜的靜止側接頭部、以及與上定盤等旋轉構件一起旋轉，保持旋轉側光纜的旋轉側接頭部。並且，如亦於專利文獻2所示般，若使光訊號入射該種光旋轉接頭，則光訊號的光量(光強度)係會因旋轉側接頭部的旋轉角度而有所變動。因此，若對於專利文獻1所記載之平面研磨裝置的光旋轉接頭傳輸光訊號，則該光訊號的光量會因旋轉側接頭部的旋轉角度而有所變動，且工件厚度的測量值會隨時間變動。然而，若工件厚度的測量值有所變動，則會對於工件的研磨精度產生影響，故期望能夠抑制工件的厚度或剖面形狀等之測量值的變動。 ［先前技術文獻］ ［專利文獻］ [0004] [專利文獻1]日本特開2008-227393號公報 [專利文獻2]日本特開2002-178257號公報[0002] As a flat surface grinding device for grinding a flat surface of a workpiece, in general, a two-side grinding device for simultaneously grinding both sides of a workpiece or a single-side grinding device for grinding one side of a workpiece is known. For such surface grinding devices, in order to improve the grinding accuracy of the workpiece, the thickness or cross-sectional shape of the workpiece is generally measured, and the plane of the workpiece is polished at the same time. For example, in FIG. 5 of Patent Document 1, there is disclosed a plane polishing device that irradiates measurement light toward a work, and attaches a thickness measurement device that receives the reflected light to a freely rotatable upper platen. In this plane grinding device, during the grinding of the workpiece, the measuring light is emitted from the thickness measuring device toward the workpiece, and the reflected light reflected by the workpiece is received by the thickness measuring device. In addition, the reflected light received by the thickness measuring device is transmitted to an external computing device through an optical cable or an optical cable rotary joint, and the thickness of the workpiece is calculated by the computing device. [0003] In addition, this type of optical rotary joint is provided with fixed members such as a machine body, a stationary side joint portion holding a stationary side optical cable, and a rotating member such as an upper platen to rotate together to maintain rotation of the rotary side optical cable. Side joint section. In addition, as also shown in Patent Document 2, when an optical signal is made incident on such an optical rotary joint, the light amount (light intensity) of the optical signal varies depending on the rotation angle of the rotary-side joint portion. Therefore, if an optical signal is transmitted to the optical rotary joint of the flat grinding device described in Patent Document 1, the light amount of the optical signal changes due to the rotation angle of the rotary-side joint portion, and the measured value of the workpiece thickness changes with time. change. However, if the measurement value of the workpiece thickness varies, it will affect the polishing accuracy of the workpiece, so it is desirable to be able to suppress the variation of the measurement value such as the thickness and cross-sectional shape of the workpiece. [Prior Art Document] [Patent Document] [0004] [Patent Document 1] Japanese Patent Laid-Open No. 2008-227393 [Patent Document 2] Japanese Patent Laid-Open No. 2002-178257
［發明所欲解決的技術課題］ [0005] 本發明之技術性課題，係提供一種一邊測量工件一邊研磨工件的平面之平面研磨裝置，其係藉由抑制旋轉側接頭部的旋轉角度所導致之光強度的變動，而抑制光纜或光旋轉接頭等傳輸路、以及測量器等所傳輸的光訊號之光強度的變動。 ［用以解決課題的技術方案］ [0006] 用以解決前述課題之本發明，係一種平面研磨裝置，係具有旋轉自如地受到支承的上定盤及下定盤，在該上定盤與下定盤之間夾持工件，並使兩定盤旋轉而研磨前述工件的兩面，其特徵為：該平面研磨裝置，係具備：安裝於前述任一個定盤，使用雷射光測量前述工件的工件測量機構；該工件測量機構，係具有：對於前述工件照射前述雷射光，並且接收來自該工件的反射光的測量器、以及將前述雷射光從光源傳輸至前述測量器的光傳輸路；該光傳輸路，係具備：配置於安裝有前述工件測量機構的定盤的旋轉軸線上的光旋轉接頭、將該光旋轉接頭的一次側連接於前述光源的一次側光路、以及將該光旋轉接頭的二次側連接於前述測量器的二次側光路；前述光旋轉接頭，係具有：對於連接於前述一次側光路的機體作固定設置的靜止側接頭部、以及連接於前述二次側光路並與安裝有前述工件測量機構的定盤等一起旋轉的旋轉側接頭部；在從前述光源至靜止側接頭部之間，係設置有輸出圓偏光之雷射光的圓偏光輸出部。 [0007] 亦即，本發明，係一種平面研磨裝置，係具有：定盤、以及保持工件的保持部，使該定盤及保持部至少一方旋轉，並在使前述工件與前述定盤接觸的狀態，研磨工件的單面，其特徵為：該平面研磨裝置，係具備：安裝於前述定盤或是保持部之任一者，使用雷射光測量前述工件的工件測量機構；前述工件測量機構，係具有：對於前述工件照射前述雷射光，並且接收來自該工件的反射光的測量器、以及將雷射光從前述光源傳輸至前述測量器的光傳輸路；該光傳輸路，係具備：設置於安裝有前述工件測量機構的定盤或是保持部的旋轉軸線上的光旋轉接頭、將該光旋轉接頭的一次側連接於前述光源的一次側光路、以及將該光旋轉接頭的二次側連接於前述測量器的二次側光路；前述光旋轉接頭，係具有：連接於前述一次側光路且對於機體作固定設置的靜止側接頭部、以及連接於前述二次側光路並與前述定盤或是保持部之至少一方一起旋轉的旋轉側接頭部；在從前述光源至靜止側接頭部之間，係設置有輸出圓偏光之雷射光的圓偏光輸出部。 [0008] 在此，所謂「在從前述光源至靜止側接頭部之間，係設置有輸出圓偏光之雷射光的圓偏光輸出部」，係包含在光源設置圓偏光輸出部、或是在靜止側接頭部設置圓偏光輸出部。 另外，於使用在傳輸雷射光的光傳輸路具有靜止側接頭部及旋轉側接頭部的光旋轉接頭之平面研磨裝置中，從連接於靜止側接頭部的一次側光路，朝向連接於旋轉側接頭部的二次側光路射出的雷射光的光強度，係因旋轉側接頭部對於靜止側接頭部的旋轉角度而有週期性變動。就該光旋轉接頭所傳輸的雷射光而言，依據本發明之發明者所進行之研究，在從一次側光路所射出之雷射光的偏光特性為直線偏光或橢圓偏光時，二次側光路所傳輸的雷射光的偏光方位及光強度會因旋轉側接頭部的旋轉角度而有所變動。此時，二次側光路所傳輸的雷射光的光強度，有與從一次側光路射出的雷射光的光強度幾乎相同的情形，亦有幾乎為零的情形。另一方面，在從一次側光路所射出之雷射光的偏光特性為圓偏光時，二次側光路所傳輸的雷射光的偏光方位會對應於旋轉側接頭部的旋轉角度而變化，但其光強度係無關於旋轉側接頭部的旋轉角度而幾乎為一定。此時，二次側光路所傳輸的雷射光的光強度，為從一次側光路射出的雷射光的光強度之約一半。 [0009] 因此，入射至二次側光路的雷射光的偏光方位及光強度，係因從一次側光路朝向二次側光路射出的雷射光的偏光特性、偏光方位、以及旋轉側接頭部的旋轉角度而有週期性的變動。亦即，於具有靜止側接頭部及旋轉側接頭部的光旋轉接頭中，旋轉側接頭部，係發揮等同於使所傳輸的雷射光的偏光特性及偏光方位隨旋轉角度變化的偏光板之功能。此時，在從一次側光路射出的雷射光為圓偏光的雷射光時，二次側光路所傳輸的雷射光的光強度係幾乎為一定。 [0010] 另外，本發明，係：前述圓偏光輸出部係用以將前述一次側光路所傳輸的雷射光的偏光轉換成圓偏光的圓偏光調整用偏波調整器為佳。 進而，在前述二次側光路，設置用以將前述二次側光路所傳輸的雷射光的偏光轉換成直線偏光的直線偏光調整用偏波調整器為佳。 並且，前述測量器，係具有：使從前述二次側光路所傳輸的直線偏光的雷射光分離為第1雷射光及第2雷射光的偏光分束器、使該第1雷射光及第2雷射光的偏光成為圓偏光地作偏光的波長板、以及使反射通過前述波長板的第1雷射光再度入射至前述波長板的反射板；將前述第2雷射光照射至前述工件，並將該工件所反射的反射光、與前述反射板所反射的第1雷射光的反射光藉由前述偏光分束器進行合成為佳。 ［發明之效果］ [0011] 依據本發明，係在將雷射光從光源傳輸至測量器的光傳輸路，具備了具有靜止側接頭部及旋轉側接頭部的光旋轉接頭，並在從光源至靜止側接頭部之間，設置有輸出圓偏光的雷射光之圓偏光輸出部。如前述般，從靜止側接頭部入射至旋轉側接頭部的雷射光的光強度，在入射的雷射光為直線偏光或橢圓偏光時，會因旋轉側接頭部的旋轉角度而有所變化，然而若使入射至旋轉側接頭部的雷射光為圓偏光，則能夠抑制從靜止側接頭部入射至旋轉側接頭部的雷射光之光強度的變動。因此，能夠使光傳輸路或測量器所傳輸的光訊號的光強度保持在穩定狀態，而能夠抑制工件厚度或形狀等測量值的變動。[Technical Problem to be Solved by the Invention] 000 [0005] The technical problem of the present invention is to provide a plane grinding device that grinds the plane of a workpiece while measuring the workpiece, which is caused by suppressing the rotation angle of the joint portion on the rotating side. The variation of the light intensity suppresses the variation of the light intensity of a transmission path such as an optical cable or an optical rotary joint, and an optical signal transmitted by a measuring instrument. [Technical Solution to Solve the Problem]] [0006] The present invention for solving the foregoing problem is a plane grinding device having an upper platen and a lower platen that are rotatably supported, and the upper platen and the lower platen The workpiece is clamped between the two plates and the two plates are rotated to grind both sides of the workpiece. The planar grinding device is provided with a workpiece measuring mechanism mounted on any of the plates and measuring the workpiece using laser light; The workpiece measuring mechanism includes a measuring device for irradiating the workpiece with the laser light and receiving reflected light from the workpiece, and a light transmission path for transmitting the laser light from a light source to the measuring device; the optical transmission path, The optical rotary joint is arranged on a rotation axis of a fixed plate on which the workpiece measuring mechanism is mounted, a primary side of the optical rotary joint is connected to a primary optical path of the light source, and a secondary side of the optical rotary joint. The secondary side optical path connected to the measuring device; the optical rotary joint has: for the body connected to the primary side optical path; A stationary side joint portion that is fixedly arranged, and a rotary side joint portion that is connected to the secondary side optical path and rotates together with a fixed plate or the like on which the workpiece measuring mechanism is mounted; between the light source and the stationary side joint portion, A circularly polarized light output unit that outputs laser light of circularly polarized light. [0007] That is, the present invention relates to a flat grinding device including a fixed plate and a holding portion that holds a workpiece, at least one of the fixed plate and the holding portion is rotated, and the workpiece is brought into contact with the fixed plate. The state of grinding a single side of a workpiece is characterized in that the plane grinding device includes: a workpiece measuring mechanism mounted on either of the aforementioned platen or holding portion and measuring the workpiece using laser light; the workpiece measuring mechanism, The measuring device includes a measuring device for irradiating the workpiece with the laser light and receiving reflected light from the workpiece, and a light transmission path for transmitting the laser light from the light source to the measuring device. The optical transmission path is provided with: The optical rotary joint on the rotation axis of the fixed plate or the holding part on which the workpiece measuring mechanism is mounted, the primary side of the optical rotary joint is connected to the primary optical path of the light source, and the secondary side of the optical rotary joint is connected. The secondary side optical path of the measuring device; the optical rotary joint includes: connected to the primary side optical path and fixedly arranged for the body A stationary side joint part connected to the secondary side optical path and rotating with at least one of the fixed plate or the holding part; an output is provided between the light source and the stationary side joint part The circularly polarized light output section of the circularly polarized laser light. [0008] Here, the "circularly polarized light output unit for outputting laser light of circularly polarized light is provided between the aforementioned light source and the stationary side joint portion", and includes a circularly polarized light output unit provided in the light source or a stationary light source. The side joint portion is provided with a circularly polarized light output portion. In addition, in a planar polishing apparatus using an optical rotary joint having a stationary side joint portion and a rotary side joint portion in an optical transmission path for transmitting laser light, the primary side optical path connected to the stationary side joint portion is directed to the rotary side joint. The light intensity of the laser light emitted from the secondary-side optical path of the unit varies periodically due to the rotation angle of the rotation-side joint portion with respect to the stationary-side joint portion. With regard to the laser light transmitted by the optical rotary joint, according to research conducted by the inventor of the present invention, when the polarization characteristic of the laser light emitted from the primary side optical path is linearly polarized or elliptical, the secondary side optical path is The polarization direction and light intensity of the transmitted laser light vary depending on the rotation angle of the rotating side joint. At this time, the light intensity of the laser light transmitted through the secondary side optical path may be almost the same as the light intensity of the laser light emitted from the primary side optical path, or there may be a case where it is almost zero. On the other hand, when the polarization characteristic of the laser light emitted from the primary side optical path is circularly polarized, the polarization direction of the laser light transmitted by the secondary side optical path changes according to the rotation angle of the rotation side joint portion, but the light The strength is almost constant regardless of the rotation angle of the rotation-side joint portion. At this time, the light intensity of the laser light transmitted through the secondary side optical path is about half of the light intensity of the laser light emitted from the primary side optical path. [0009] Therefore, the polarization orientation and light intensity of the laser light incident on the secondary side optical path are due to the polarization characteristics, polarization orientation, and rotation of the rotation-side joint portion of the laser light emitted from the primary side optical path toward the secondary side optical path. There are periodic changes in angle. That is, in an optical rotary joint having a stationary side joint portion and a rotary side joint portion, the rotary side joint portion functions as a polarizing plate that is equivalent to changing the polarization characteristics and polarization direction of the transmitted laser light with the rotation angle. . At this time, when the laser light emitted from the primary optical path is circularly polarized laser light, the light intensity of the laser light transmitted through the secondary optical path is almost constant. [0010] In addition, according to the present invention, the circularly polarized light output unit is preferably a circularly polarized polarization adjuster for converting the polarized light of the laser light transmitted through the primary side optical path into circularly polarized light. Further, it is preferable that a linear polarizer for linear polarization adjustment is provided in the secondary optical path to convert polarized light of the laser light transmitted through the secondary optical path into linear polarized light. The measuring device further includes a polarizing beam splitter that separates the linearly polarized laser light transmitted from the secondary side optical path into a first laser light and a second laser light, and separates the first laser light and the second laser light. The polarized light of the laser light becomes a circularly polarized wavelength plate, and the first laser light reflected through the wavelength plate is incident again on the reflective plate of the wavelength plate; the second laser light is irradiated to the workpiece, and The reflected light reflected from the workpiece and the first laser light reflected from the reflecting plate are preferably combined by the polarizing beam splitter. [Effects of the Invention] [0011] According to the present invention, an optical transmission path for transmitting laser light from a light source to a measuring device is provided with a light rotary joint having a stationary side joint portion and a rotary side joint portion, and A circularly polarized light output portion for laser light that outputs circularly polarized light is provided between the stationary side joint portions. As described above, when the incident laser light is linearly polarized or elliptically polarized, the light intensity of the laser light incident from the stationary-side joint to the rotation-side joint changes depending on the rotation angle of the rotation-side joint. However, If the laser light incident on the rotation-side joint part is circularly polarized, it is possible to suppress the variation in light intensity of the laser light incident on the rotation-side joint part from the stationary side joint part. Therefore, the light intensity of the optical signal transmitted by the optical transmission path or the measuring device can be maintained in a stable state, and variations in measured values such as the thickness or shape of the workpiece can be suppressed.
[0013] 本發明，係有關於一邊測量工件一邊研磨工件的平面之平面研磨裝置，且對於研磨工件的兩面之兩面研磨裝置、研磨工件的單面之單面研磨裝置皆能適用。另外，本發明，雖能夠運用於工件的厚度或剖面形狀等各種測量，然而於本實施形態中係以測量工件的厚度為例進行說明。 第1圖至第4圖，係表示作為本發明之平面研磨裝置的實施形態之平面研磨裝置1，其係具有以旋轉軸線L1為中心旋轉的下定盤10、以及被機體2所支承並以旋轉軸線L2為中心旋轉的上定盤20，並使該等定盤10、20旋轉而研磨工件W的兩面。於該平面研磨裝置中，旋轉軸線L1、L2係配置在同一軸線上。 [0014] 於機體2，係設置有包含雷射光的光源3以及運算控制部4的測量單元5，並且支承有用以使上定盤20升降的升降用致動器7。光源3係輸出雷射光，運算控制部4係收集工件W的厚度等測定資料(測量值)，並進行所收集的各種資料之運算或分析等而控制研磨裝置1整體。又，包含光源3及運算控制部4的測量單元5，係設置在機體2外之不受上定盤20或下定盤10的旋轉的影響的位置(機體2以外之與上定盤20或下定盤10的旋轉無緣的位置)亦可。 [0015] 在下定盤10的中心係配置有太陽齒輪11，在下定盤10的外周係內齒輪12以包圍下定盤10的方式作配置。在太陽齒輪11的中央下部係連接有第1驅動軸13，在下定盤10的中央下部係連接有第2驅動軸14，在內齒輪12的中央下部係連接有第3驅動軸15。另外，在下定盤10的中心係連接有第4驅動軸16，該第4驅動軸16係被收容於第1驅動軸13。第1驅動軸13係被收容於第2驅動軸14，第2驅動軸14係被收容於第3驅動軸15。該等第1驅動軸13至第4驅動軸16，係構成為藉由未圖示的驅動裝置進行驅動旋轉。 [0016] 在上定盤20與下定盤10之間，係以與太陽齒輪11及內齒輪12嚙合的方式中介設置有複數個保持矽晶圓等之工件W的遊星輪37。於各遊星輪37係形成有工件保持孔37a，並將工件W保持於該工件保持孔37a。前述各遊星輪37，係藉由太陽齒輪11與內齒輪12的旋轉，於太陽齒輪11的周圍自轉及/或公轉。另外，在上定盤20的下面及下定盤10的上面，係分別貼附有研磨墊18a、18b，並藉由遊星輪37自轉及/或公轉，研磨被保持於各遊星輪37的工件W的上下兩面。 [0017] 上定盤20，係透過定盤懸吊件31安裝於升降用致動器7的升降桿32。升降桿32的中心軸線，係與前述旋轉軸線L1、L2一致。在定盤懸吊件31的外周側的下面，係在設置有朝向下方向延伸的複數個支撐螺柱33，該支撐螺柱33係安裝在上定盤20的上面。另外，在定盤懸吊件31的內周面與升降桿32的外周面之間，係中介設置有：軸承34，係雖將該定盤懸吊件31與升降桿32於上下方向固定地作結合，但於上定盤20的旋轉方向相對地旋轉自如地作結合。 [0018] 於前述支撐螺柱33，係安裝有用以保持後述之測量器(探測頭)41的保持支架36。該探測頭41，係藉由調整保持支架36的安裝位置，而配置於貫穿上定盤20的上下面的測量孔23之正上方。另外，於測量孔23，係安裝有在下端設置了透明的窗板25的窗構件26。又，探測頭41，係能夠直接安裝於上定盤20，或是採取使探測頭41保持於固定在定盤懸吊件31的保持支架36的方式等，只要是能夠與上定盤20一體旋轉即可。 [0019] 上定盤20，係在工件W之非研磨時，藉由升降桿32上升至待命位置(未圖示)，並在工件W之研磨時，下降至第1圖的研磨位置。當上定盤20下降，因安裝於上定盤20的鉤22係卡合於第4驅動軸16的上端的驅動器17，上定盤20與定盤懸吊件31係藉由第4驅動軸16透過驅動器17受到驅動，而一體地旋轉。 [0020] 另外，於上定盤20，係具備使用從光源3射出的雷射光測量工件W的厚度或形狀的工件測量機構40。該工件測量機構40，係具有：對於工件W照射雷射光，並且接收來自工件W的反射光的探測頭41、以及將雷射光從光源3傳輸至探測頭41的光傳輸路50。 [0021] 光傳輸路50，係具備：光旋轉接頭60、作為將光旋轉接頭60的一次側連接於光源3的一次側光路之一次側光纜51、以及作為將光旋轉接頭60的二次側連接於探測頭41的二次側光路之二次側光纜52。光旋轉接頭60，係配置於上定盤20的旋轉軸線L2上，並配置在升降桿32的下端部32a與定盤懸吊件31之間。 [0022] 光旋轉接頭60，係具有相對地旋轉自如的靜止側接頭部61及旋轉側接頭部62。另外，在靜止側接頭部61與旋轉側接頭部62之間，係中介設置有軸承64。靜止側接頭部61，係固定安裝在對於機體2為非旋轉的升降桿32的下端部32a。另外，旋轉側接頭部62，係藉由連結於定盤懸吊件31而與定盤懸吊件31及上定盤20一體旋轉。 [0023] 另外，升降桿32、靜止側接頭部61、以及旋轉側接頭部62，係形成為與插通孔32b、61a、62a位於同一軸線上，於升降桿32的插通孔32b及靜止側接頭部61的插通孔61a，係***有一次側光纜51，於旋轉側接頭部62的插通孔62a，係***有二次側光纜52。另外，於靜止側接頭部61的插通孔61a、以及旋轉側接頭部62的插通孔62a，係設置有具有聚光性的GRIN(Gradient Refractive Index)透鏡61b、62b。 [0024] 於定盤懸吊件31的中央部下面，係以包覆旋轉接頭60的方式配置有呈有底筒狀的纜線罩件73，並以與定盤懸吊件31及上定盤20一體旋轉的方式受到安裝。旋轉側接頭部62與纜線罩件73係藉由連結構件72受到連結，藉此，在上定盤20旋轉時旋轉側接頭部62會與上定盤20一起旋轉。從旋轉側接頭部62的插通孔62a被導出的二次側光纜52，在從形成於定盤懸吊件31的纜線插通孔35被導出至定盤懸吊件31的外部之後，連接於探測頭41。 [0025] 一次側光纜51，其一端側係連接於光源3，且其另一端側係***至靜止側接頭部61，並在該兩端之間，設置有作為使雷射光偏光為圓偏光的圓偏光輸出部之圓偏光調整用偏波調整器53。又，使雷射光偏光為圓偏光的圓偏光輸出部，取代圓偏光調整用偏波調整器53，使用射出圓偏光的雷射光的光源亦可。 [0026] 另一方面，二次側光纜52，其一端側係***至旋轉側接頭部62，且其另一端側係連接於探測頭41。並且，於該二次側光纜52，係設置有用以將圓偏光的雷射光轉換成直線偏光的直線偏光調整用偏波調整器54。又，前述一次側光纜51及二次側光纜52，係使用單模光纖 (single-mode fiber)、多模光纖(multi-mode fiber)之任一者皆可。另外，一次側光纜51係使用偏波保持光纖 (polarization-maintaining fiber)亦可。 [0027] 探測頭41，係具備：分離雷射光的偏光分束器42、轉換該分離了的雷射光的偏光的波長板43a、43b、反射通過了波長板43a的雷射光的反射板(鏡)44、以及檢測雷射光並轉換為電訊號的光偵測器45。在此之偏光分束器42，係使用令雷射光的P波穿透並使S波反射的類型，波長板43a、43b係使用λ/4板。受到光偵測器45所轉換的電訊號，係經由未圖示的纜線傳輸至運算控制部4。 [0028] 接著，針對在工件W之研磨時照射至工件W雷射光的光路及偏光特性進行說明。從光源3所輸出的雷射光，係藉由圓偏光調整用偏波調整器53轉換為圓偏光，並入射至光旋轉接頭60的靜止側接頭部61。入射至靜止側接頭部61的雷射光，係穿透GRIN透鏡61b，並進入靜止側接頭部61與旋轉側接頭部62之間的空隙。然後，進入至該空隙的圓偏光之雷射光，係進入至設置於旋轉側接頭部62的GRIN透鏡62b。此時，從靜止側接頭部61射出的雷射光的偏光特性，係藉由圓偏光調整用偏波調整器53成為圓偏光。因圓偏光係作為平行偏波的P波的分量的比例為50%，作為垂直偏波的S波的分量的比例為50%，故即使旋轉側接頭部62為僅傳輸一方之偏波分量的旋轉角度，藉由為混合P波及S波的圓偏光之雷射光，能夠持續將一定的光強度的雷射光從旋轉側接頭部62輸出。亦即，即使以靜止側接頭部61及旋轉側接頭部62之不連續的部位傳輸光，亦不會有因旋轉側接頭部62成為反射面而導致光強度降低或產生變動、或是對於靜止側接頭部61之旋轉側接頭部62的相對旋轉角度導致光強度產生變動之情事，而能夠使透過旋轉側接頭部62傳輸至二次側光纜52的雷射光的光強度無關於旋轉側接頭部62的旋轉角度而幾乎為一定。 [0029] 入射至二次側光纜52的圓偏光之雷射光，係藉由直線偏光調整用偏波調整器54被偏光為直線偏光。此時，因入射至直線偏光調整用偏波調整器54的雷射光的光強度係無關於旋轉側接頭部62的旋轉角度而幾乎為一定，故被偏光為直線偏光的雷射光的光強度，亦無關於旋轉側接頭部62的旋轉角度而幾乎為一定。 [0030] 從二次側光纜52入射至探測頭41的直線偏光的雷射光，係藉由偏光分束器42分離為P波及S波。此時，因入射至偏光分束器42的雷射光的光強度，係無關於旋轉側接頭部62的旋轉角度而幾乎為一定，故以偏光分束器42所分離的P波及S波的光強度，亦無關於旋轉側接頭部62的旋轉角度而幾乎為一定。 [0031] 穿透偏光分束器42的直線偏光之P波，係在通過λ/4板43a之際被轉換為圓偏光，以鏡44反射之後，在返回相同的光路並再度通過λ/4板43a之際被轉換為直線偏光的S波。然後，被轉換為直線偏光的S波之雷射光係入射至偏光分束器42，並被反射至光偵測器45方向。 另一方面，藉由穿透偏光分束器42所反射的直線偏光之S波，係在通過λ/4板43b之際被轉換為圓偏光，以工件W反射之後，在返回相同的光路並再度通過λ/4板43b之際被轉換為直線偏光的P波。然後，被轉換為直線偏光的P波之雷射光係穿透偏光分束器42，並入射至光偵測器45。然後，從二次側光纜52入射至偏光分束器42之際受到分離的雷射光，係藉由鏡44或工件W被反射，於再度入射至偏光分束器42之際受到合成，並入射至光偵測器45。入射至光偵測器45的雷射光係被轉換為電訊號並傳輸至運算控制部4，該電訊號係受到運算控制部4運算處理，並如第4圖所示，作為對於樣本數(時間)之工件厚度顯示於畫面。 [0032] 於本實施形態中，入射至光偵測器45的雷射光的光強度，係無關於旋轉側接頭部62的旋轉角度而幾乎為一定。因此，能夠抑制旋轉側接頭部62的旋轉角度所導致之研磨當中的工件測量值之週期性變動。另外，照射至工件W的雷射光，以直線偏光輸入至偏光分束器42，之後被轉換為圓偏光並照射至工件W，而能夠使到達工件W的雷射光的光強度之損耗為最低限度。 [0033] 另一方面，作為對於本實施形態之比較例，係藉由一種平面研磨裝置進行說明，其係除了圓偏光調整用偏波調整器未設置於一次側光纜51、以及直線偏光調整用偏波調整器54未設置於二次側光纜52以外，具有與第3圖所示之平面研磨裝置實質上相同的構成(未圖示)。於該比較例中，因入射至光旋轉接頭60的雷射光係橢圓偏光或直線偏光等偏光特性並非一定的雷射光，故從光旋轉接頭60射出的雷射光的偏光特性或光強度係隨著旋轉側接頭部62的旋轉角度有週期性變動。並且，因從該光旋轉接頭60射出的雷射光的光強度有週期性變動，故以偏光分束器42分離、合成的雷射光的光強度會有週期性變動。因此，從光偵測器45傳輸至運算控制部4的電訊號，係因旋轉側接頭部62的旋轉角度而有週期性變動，故以運算控制部4所運算處理並顯示於畫面的對於樣本數(時間)之工件測量值，亦有週期性變動(參照第5圖)。 [0034] 於前述之實施形態中，雖係針對於上定盤20安裝探測頭41，並於升降桿32的下端部32a與定盤懸吊件31之間安裝光旋轉接頭60的平面研磨裝置1進行說明，然而作為變形例，亦能夠構成為將探測頭41安裝於下定盤10，並將旋轉接頭60配置於下定盤10的旋轉軸線L1上，並從下定盤10側測量工件W。在變形例的情形下，於第1圖、第2圖中，能夠視賦予符號32的部分為進行旋轉的下定盤用驅動軸，並視賦予符號31的部分為下定盤用驅動軸的周圍之靜止的機體部分，如此，則靜止側接頭部61成為旋轉側接頭部，旋轉側接頭部62成為靜止側接頭部。另外，連接於靜止側接頭部61的一次側光纜51係成為與旋轉側接頭部62及探測頭41連接的二次側光纜。此時，於下定盤10，係形成有貫穿其上下面的測量孔23，並於該測量孔23的正下方配置探測頭41。進而，纜線罩件73係安裝於作為靜止側之機體部分，收容於纜線罩件73內的二次側光纜52係成為連接測量單元5與靜止側接頭部61的一次側光纜。 [0035] 另外，本發明之平面研磨裝置，係亦可為：一種單面研磨裝置，其係具有以第1旋轉軸線為中心旋轉的定盤、以及以第2旋轉軸線為中心旋轉並保持工件W的保持部，並藉由在使保持了工件W的保持部與定盤接觸的狀態使定盤及保持部旋轉，而研磨工件W的單面。於該單面研磨裝置中，探測頭係設置於保持部，光旋轉接頭係配置於第2旋轉軸線上，一次側光纜係連接於光源至靜止側接頭部之間，二次側光纜係連接於探測頭及旋轉側接頭部。另外，於一次側光纜係設置有圓偏光調整用偏波調整器，於二次側光纜係設置有直線偏光調整用偏波調整器。因於該單面研磨裝置中使用於研磨當中之工件測量的雷射光的光路，係與前述之兩面研磨裝置實質上相同，故省略其說明。又，前述單面研磨裝置，係探測頭設置於定盤，而光旋轉接頭配置於第1旋轉軸線上亦可。 [0036] 另外，單面研磨裝置，係定盤或是保持部之任一方旋轉並固定另一方者亦可。在係定盤旋轉而保持部固定的單面研磨裝置的情形下，探測頭係設置於定盤，光旋轉接頭係配置於定盤的旋轉軸線上。另外，在係定盤固定而保持部旋轉的單面研磨裝置的情形下，探測頭係設置於保持部，光旋轉接頭係配置於保持部的旋轉軸線上。又，定盤及保持部之兩方旋轉的單面研磨裝置、與定盤或保持部任一方旋轉而另一方固定的單面研磨裝置，係其他的構成實質上相同，故省略針對其他構成及雷射光的光路的說明。 [0037] 於如此之單面研磨裝置，從光源所輸出的雷射光，亦係藉由圓偏光調整用偏波調整器轉換為圓偏光，並入射至光旋轉接頭。並且，因從靜止側接頭部朝向旋轉側接頭部射出的雷射光的偏光特性為圓偏光，故透過旋轉側接頭部傳輸至二次側光纜的雷射光的光強度係無關於旋轉側接頭部的旋轉角度而幾乎為一定。因此，於單面研磨裝置中，亦與兩面研磨裝置相同，能夠抑制旋轉側接頭部的旋轉角度所導致之研磨當中的工件測量值之週期性變動。 另外，於前述單面研磨裝置中，亦與兩面研磨裝置相同，將以直線偏光輸入至偏光分束器並照射至工件的雷射光轉換為圓偏光，而能夠使到達工件的雷射光的光強度之損耗為最低限度。[0013] The present invention relates to a surface grinding device that grinds the plane of a workpiece while measuring the workpiece, and is applicable to both the two-side grinding device that grinds both sides of the workpiece and the single-side grinding device that grinds one side of the workpiece. In addition, although the present invention can be applied to various measurements such as the thickness and cross-sectional shape of a workpiece, in this embodiment, the thickness of the workpiece is measured as an example for description. Figures 1 to 4 show a surface polishing apparatus 1 as an embodiment of the surface polishing apparatus of the present invention, which has a lower platen 10 that rotates around a rotation axis L1, and is supported by the body 2 and rotates. The axis L2 is an upper fixed plate 20 that rotates at the center, and the fixed plates 10 and 20 are rotated to grind both surfaces of the workpiece W. In this plane polishing apparatus, the rotation axes L1 and L2 are arranged on the same axis. [0014] The machine body 2 is provided with a light source 3 including a laser light and a measurement unit 5 of the arithmetic control unit 4, and supports a lifting actuator 7 for lifting the upper plate 20. The light source 3 outputs laser light, and the calculation control unit 4 collects measurement data (measurement values) such as the thickness of the workpiece W, and performs calculation or analysis of various collected data to control the entire polishing apparatus 1. In addition, the measurement unit 5 including the light source 3 and the arithmetic control unit 4 is located outside the body 2 without being affected by the rotation of the upper platen 20 or the lower platen 10 (other than the body 2 and the upper platen 20 or the lower platen). (Position of the disc 10 without rotation) may also be used. [0015] A sun gear 11 is disposed at the center of the lower platen 10, and an internal gear 12 of the outer periphery of the lower platen 10 is disposed so as to surround the lower platen 10. A first drive shaft 13 is connected to the lower center of the sun gear 11, a second drive shaft 14 is connected to the lower center of the lower plate 10, and a third drive shaft 15 is connected to the lower center of the internal gear 12. A fourth drive shaft 16 is connected to the center of the lower platen 10, and the fourth drive shaft 16 is housed in the first drive shaft 13. The first drive shaft 13 is housed in the second drive shaft 14, and the second drive shaft 14 is housed in the third drive shaft 15. The first drive shaft 13 to the fourth drive shaft 16 are configured to be driven and rotated by a drive device (not shown). [0016] Between the upper platen 20 and the lower platen 10, a plurality of star wheels 37 holding workpieces W such as silicon wafers are interposed so as to mesh with the sun gear 11 and the internal gear 12. A work holding hole 37a is formed in each of the star wheels 37, and a work W is held in the work holding hole 37a. Each of the planetary wheels 37 is rotated and / or revolved around the sun gear 11 by the rotation of the sun gear 11 and the internal gear 12. In addition, polishing pads 18a and 18b are attached to the lower surface of the upper platen 20 and the upper surface of the lower platen 10, respectively, and the workpieces W held by the planetary wheels 37 are polished by the rotation and / or revolution of the planetary wheels 37, respectively. Up and down. [0017] The upper fixed plate 20 is attached to the lifting rod 32 of the lifting actuator 7 through the fixed plate suspension 31. The central axis of the lifting rod 32 is consistent with the aforementioned rotation axes L1 and L2. A plurality of support studs 33 extending downward are provided below the outer peripheral side of the platen suspension 31, and the support studs 33 are mounted on the upper platen 20. In addition, between the inner peripheral surface of the plate suspension 31 and the outer surface of the lifting rod 32, a bearing 34 is provided as an intermediary, although the plate suspension 31 and the lifting rod 32 are fixed in a vertical direction. The coupling is performed in a relatively rotatable manner with respect to the rotation direction of the upper platen 20. [0018] A holding bracket 36 is mounted on the support stud 33 to hold a measuring device (probe) 41 described later. The detection head 41 is disposed directly above the measurement hole 23 penetrating the upper and lower surfaces of the upper fixed plate 20 by adjusting the mounting position of the holding bracket 36. A window member 26 having a transparent window plate 25 at the lower end is attached to the measurement hole 23. The probe head 41 can be directly mounted on the upper platen 20, or the probe head 41 can be held by the holding bracket 36 fixed to the platen suspension 31, as long as it can be integrated with the upper platen 20 Just rotate it. [0019] The upper platen 20 is raised to the standby position (not shown) by the lifting rod 32 when the workpiece W is not being ground, and is lowered to the grinding position shown in FIG. 1 when the workpiece W is being ground. When the upper platen 20 is lowered, since the hook 22 mounted on the upper platen 20 is engaged with the driver 17 on the upper end of the fourth drive shaft 16, the upper platen 20 and the plate suspension member 31 are connected by the fourth drive shaft. 16 is driven through the driver 17, and rotates integrally. [0020] In addition, the upper platen 20 is provided with a workpiece measuring mechanism 40 that measures the thickness or shape of the workpiece W using laser light emitted from the light source 3. The workpiece measuring mechanism 40 includes a probe 41 that irradiates laser light to the workpiece W and receives reflected light from the workpiece W, and an optical transmission path 50 that transmits laser light from the light source 3 to the probe 41. [0021] The optical transmission path 50 includes an optical rotary joint 60, a primary optical cable 51 as a primary optical path connecting the primary side of the optical rotary joint 60 to the light source 3, and a secondary side as an optical rotary joint 60. A secondary-side optical cable 52 connected to the secondary-side optical path of the probe 41. The optical rotary joint 60 is disposed on the rotation axis L2 of the upper fixed plate 20 and is disposed between the lower end portion 32 a of the lifting rod 32 and the fixed plate suspension 31. [0022] The optical rotary joint 60 includes a stationary-side joint portion 61 and a rotary-side joint portion 62 that are relatively rotatable. A bearing 64 is provided between the stationary-side joint portion 61 and the rotating-side joint portion 62. The stationary-side joint portion 61 is fixedly attached to the lower end portion 32 a of the lifting rod 32 which is non-rotating to the body 2. The rotation-side joint portion 62 is integrally rotated with the plate suspension 31 and the upper plate 20 by being connected to the plate suspension 31. [0023] In addition, the lift rod 32, the stationary-side joint portion 61, and the rotation-side joint portion 62 are formed on the same axis as the insertion holes 32b, 61a, and 62a, and are inserted into the insertion hole 32b of the lift rod 32 and stationary. A primary optical fiber cable 51 is inserted into the insertion hole 61 a of the side joint portion 61, and a secondary optical fiber cable 52 is inserted into the insertion hole 62 a of the rotation side joint portion 62. In addition, the insertion holes 61 a of the stationary-side joint portion 61 and the insertion holes 62 a of the rotary-side joint portion 62 are provided with GRIN (Gradient Refractive Index) lenses 61 b and 62 b having light-condensing properties. [0024] A bottomed cable cover 73 is arranged below the central portion of the fixed plate suspension 31 so as to cover the rotary joint 60, and is connected to the fixed plate suspension 31 and the upper plate. The disk 20 is mounted in such a manner as to rotate integrally. The rotation-side joint portion 62 and the cable cover 73 are connected by a connecting member 72, whereby the rotation-side joint portion 62 rotates together with the upper platen 20 when the upper platen 20 is rotated. After the secondary-side optical cable 52 led out from the insertion hole 62 a of the rotation-side joint portion 62 is led out from the cable insertion hole 35 formed in the plate suspension 31 to the outside of the plate suspension 31, Connected to the detection head 41. [0025] One end of the primary-side optical cable 51 is connected to the light source 3, and the other end thereof is inserted into the stationary-side joint portion 61, and between the two ends, a device for polarizing laser light into circularly polarized light is provided. A polarizer 53 for circularly polarized light adjustment of the circularly polarized light output section. In addition, the circularly polarized light output section for polarizing the laser light into circularly polarized light may use a light source that emits laser light of circularly polarized light instead of the circularly polarized light adjustment polarizer 53. [0026] On the other hand, one end of the secondary-side optical cable 52 is inserted into the rotation-side joint portion 62, and the other end thereof is connected to the probe 41. A linear polarizer 54 is provided on the secondary-side optical cable 52 for converting the circularly polarized laser light into the linearly polarized light. The primary optical cable 51 and the secondary optical cable 52 may be a single-mode fiber or a multi-mode fiber. Alternatively, the primary optical fiber cable 51 may use a polarization-maintaining fiber. [0027] The probe 41 includes a polarizing beam splitter 42 that separates laser light, wavelength plates 43a and 43b that convert the polarized light of the separated laser light, and a reflecting plate (mirror) that reflects the laser light that has passed through the wavelength plate 43a. 44), and a photodetector 45 that detects laser light and converts it into a signal. Here, the polarizing beam splitter 42 is a type that transmits the P wave of the laser light and reflects the S wave. The wavelength plates 43a and 43b are λ / 4 plates. The electric signal converted by the photodetector 45 is transmitted to the arithmetic control unit 4 through a cable (not shown). [0028] Next, the optical path and polarization characteristics of the laser light irradiated to the workpiece W during grinding of the workpiece W will be described. The laser light output from the light source 3 is converted into circularly polarized light by the circularly polarized light adjustment wave adjuster 53 and is incident on the stationary side joint portion 61 of the optical rotary joint 60. The laser light incident on the stationary-side joint portion 61 penetrates the GRIN lens 61 b and enters a gap between the stationary-side joint portion 61 and the rotation-side joint portion 62. Then, the circularly polarized laser light entering the gap enters the GRIN lens 62 b provided in the rotation-side joint portion 62. At this time, the polarization characteristic of the laser light emitted from the stationary-side joint portion 61 is made into circularly polarized light by the circularly polarized light adjustment polarizer 53. Since the ratio of the P-wave component of the parallel polarized light system as a parallel polarized wave is 50% and the proportion of the S-wave component as a vertical polarized wave is 50%, even if the rotating side joint portion 62 transmits only one polarization component The rotation angle can continuously output laser light of a constant light intensity from the rotation-side joint portion 62 by using laser light of circularly polarized light mixed with P waves and S waves. That is, even if light is transmitted at discrete portions of the stationary side joint portion 61 and the rotary side joint portion 62, there will be no decrease or change in light intensity due to the rotation side joint portion 62 becoming a reflecting surface, or no change in light intensity. The relative rotation angle of the rotation-side joint portion 62 of the side joint portion 61 causes a change in light intensity, and the light intensity of the laser light transmitted through the rotation-side joint portion 62 to the secondary-side optical cable 52 is irrelevant to the rotation-side joint portion. The rotation angle of 62 is almost constant. [0029] The laser light of the circularly polarized light incident on the secondary-side optical cable 52 is polarized into linearly polarized light by a linearly polarized light adjustment polarizer 54. At this time, since the light intensity of the laser light incident on the linear polarization adjustment polarizer 54 is almost constant regardless of the rotation angle of the rotation-side joint portion 62, the light intensity of the laser light polarized by the linear polarization is The rotation angle of the rotation-side joint portion 62 is also almost constant. [0030] The linearly polarized laser light incident from the secondary-side optical cable 52 to the detection head 41 is separated into a P wave and an S wave by a polarizing beam splitter 42. At this time, since the light intensity of the laser light incident on the polarizing beam splitter 42 is almost constant regardless of the rotation angle of the rotation-side joint portion 62, the P-wave and S-wave light separated by the polarizing beam splitter 42 is used. The strength is almost constant regardless of the rotation angle of the rotation-side joint portion 62. [0031] The P-wave of linearly polarized light penetrating the polarizing beam splitter 42 is converted into circularly polarized light as it passes through the λ / 4 plate 43a, is reflected by the mirror 44, returns to the same optical path, and passes through λ / 4 again. The plate 43a is converted into a linearly polarized S wave. Then, the laser light of the S wave converted into the linearly polarized light is incident on the polarizing beam splitter 42 and is reflected in the direction of the light detector 45. On the other hand, the S-wave of the linearly polarized light reflected by the penetrating polarizing beam splitter 42 is converted into circularly polarized light when passing through the λ / 4 plate 43b, and is reflected by the workpiece W. After returning to the same optical path and When passing through the λ / 4 plate 43b again, the P wave is converted into linearly polarized light. Then, the laser light of the P wave converted into the linearly polarized light passes through the polarizing beam splitter 42 and enters the photodetector 45. Then, the laser light that is separated from the secondary side optical cable 52 when it enters the polarizing beam splitter 42 is reflected by the mirror 44 or the workpiece W, and is combined when it is incident on the polarizing beam splitter 42 again, and is incident. To the light detector 45. The laser light incident on the photodetector 45 is converted into an electric signal and transmitted to the arithmetic control section 4. The electric signal is subjected to arithmetic processing by the arithmetic control section 4, and as shown in FIG. ) The workpiece thickness is displayed on the screen. [0032] In this embodiment, the light intensity of the laser light incident on the photodetector 45 is almost constant regardless of the rotation angle of the rotation-side joint portion 62. Therefore, it is possible to suppress the periodic variation of the measured value of the workpiece during grinding caused by the rotation angle of the rotation-side joint portion 62. In addition, the laser light irradiated to the workpiece W is input to the polarizing beam splitter 42 as linearly polarized light, and then converted into circularly polarized light and irradiated to the workpiece W, so that the loss of the light intensity of the laser light reaching the workpiece W can be minimized. . [0033] On the other hand, as a comparative example of this embodiment, a planar polishing device will be described, which is not provided on the primary optical cable 51 and for linear polarization adjustment except for the circular polarization adjustment polarizer. The polarization adjuster 54 is not provided outside the secondary-side optical cable 52 and has a configuration substantially the same as that of the planar polishing apparatus shown in FIG. 3 (not shown). In this comparative example, since the laser light incident on the optical rotary joint 60 is a laser light whose polarization characteristics such as elliptical polarization or linear polarization are not constant, the polarization characteristics or light intensity of the laser light emitted from the optical rotary joint 60 varies with The rotation angle of the rotation-side joint portion 62 varies periodically. In addition, since the light intensity of the laser light emitted from the optical rotary joint 60 changes periodically, the light intensity of the laser light separated and synthesized by the polarizing beam splitter 42 changes periodically. Therefore, the electrical signal transmitted from the photodetector 45 to the arithmetic control unit 4 varies periodically due to the rotation angle of the rotation-side joint unit 62. Therefore, the sample processed by the arithmetic control unit 4 and displayed on the screen is sampled. The measured value of time (time) also changes periodically (refer to Figure 5). [0034] In the foregoing embodiment, the surface grinding device is equipped with a probe head 41 for the upper platen 20, and an optical rotary joint 60 is installed between the lower end portion 32a of the lifting rod 32 and the platen suspension 31. 1 will be described. However, as a modification, the probe 41 can be mounted on the lower platen 10, the rotary joint 60 can be arranged on the rotation axis L1 of the lower platen 10, and the workpiece W can be measured from the lower platen 10 side. In the case of the modification, in FIG. 1 and FIG. 2, the portion given the symbol 32 can be regarded as the drive shaft for the lower plate which rotates, and the portion given the symbol 31 can be regarded as the periphery of the drive plate for the lower plate. In a stationary body portion, the stationary-side joint portion 61 becomes a rotation-side joint portion, and the stationary-side joint portion 62 becomes a stationary-side joint portion. The primary-side optical cable 51 connected to the stationary-side joint portion 61 is a secondary-side optical cable connected to the rotation-side joint portion 62 and the probe 41. At this time, a measurement hole 23 penetrating the upper and lower surfaces of the lower platen 10 is formed, and a probe 41 is disposed directly below the measurement hole 23. Further, the cable cover 73 is attached to the body portion serving as the stationary side, and the secondary-side optical cable 52 accommodated in the cable cover 73 is a primary-side optical cable connecting the measurement unit 5 and the stationary-side joint portion 61. [0035] In addition, the plane grinding device of the present invention may be a single-side grinding device having a fixed plate that rotates around a first rotation axis and a workpiece that rotates around a second rotation axis. The holding portion of W is configured to rotate the fixed plate and the holding portion while the holding portion holding the workpiece W is in contact with the fixed plate, thereby polishing one surface of the workpiece W. In this single-side polishing device, the probe head is provided on the holding portion, the optical rotary joint is disposed on the second rotation axis, the primary optical cable is connected between the light source and the stationary side connector, and the secondary optical cable is connected to Probe head and rotary joint. In addition, a polarizer for circularly polarized light adjustment is provided on the primary optical fiber cable system, and a polarizer for linearly polarized light adjustment is provided on the secondary optical fiber cable system. Since the optical path of the laser light measured by the workpiece used in grinding in this single-sided grinding device is substantially the same as the aforementioned two-side grinding device, description thereof is omitted. In addition, in the single-side polishing device, the detection head is provided on the fixed plate, and the optical rotary joint may be disposed on the first rotation axis. [0036] In addition, the single-side grinding device may be either a fixed plate or a holding portion that rotates and fixes the other. In the case of a single-side polishing device that rotates the fixed plate and the holding portion is fixed, the detection head is provided on the fixed plate, and the optical rotary joint is arranged on the rotation axis of the fixed plate. In addition, in the case of a one-side polishing device that fixes the fixed plate and rotates the holding portion, the probe head is provided on the holding portion, and the optical rotary joint is disposed on the rotation axis of the holding portion. In addition, the single-side polishing device that rotates both the fixed plate and the holding portion and the single-sided polishing device that rotates on either one of the fixed plate or the holding portion and is fixed on the other side are substantially the same in other configurations, so the other configurations and Description of the optical path of the laser light. [0037] In such a single-side grinding device, the laser light output from the light source is also converted into circularly polarized light by a circularly polarized light adjustment polarizer, and is incident on a light rotary joint. In addition, since the polarization characteristic of the laser light emitted from the stationary side joint portion toward the rotation side joint portion is circularly polarized light, the light intensity of the laser light transmitted through the rotation side joint portion to the secondary side optical cable is not related to the rotation side joint portion. The rotation angle is almost constant. Therefore, in the single-side polishing device, similarly to the double-side polishing device, it is possible to suppress the periodic variation of the measured value of the workpiece during grinding caused by the rotation angle of the rotary joint portion. In addition, in the single-side polishing device described above, similar to the double-side polishing device, the laser light that is input to the polarizing beam splitter and irradiates the workpiece with linearly polarized light is converted into circularly polarized light, and the light intensity of the laser light reaching the workpiece can be changed. The loss is minimal.
[0038][0038]
1‧‧‧平面研磨裝置1‧‧‧ plane grinding device
3‧‧‧光源3‧‧‧ light source
10‧‧‧下定盤10‧‧‧ lower order
20‧‧‧上定盤20‧‧‧Upper Order
40‧‧‧工件測量機構40‧‧‧Workpiece measuring mechanism
41‧‧‧測量器(探測頭)41‧‧‧ measuring device (probe)
42‧‧‧偏光分束器42‧‧‧polarized beam splitter
43a、43b‧‧‧波長板43a, 43b‧‧‧wavelength plate
44‧‧‧反射板44‧‧‧Reflector
50‧‧‧光傳輸路50‧‧‧Optical transmission path
51‧‧‧一次側光纜(一次側光路)51‧‧‧Primary optical cable (Primary optical path)
52‧‧‧二次側光纜(二次側光路)52‧‧‧Secondary optical cable (secondary optical path)
53‧‧‧圓偏光調整用偏波調整器53‧‧‧Polarizer for circular polarization adjustment
54‧‧‧直線偏光調整用偏波調整器54‧‧‧Polarizer for linear polarization adjustment
60‧‧‧光旋轉接頭60‧‧‧light rotary joint
61‧‧‧靜止側接頭部61‧‧‧Stationary side joint
62‧‧‧旋轉側接頭部62‧‧‧Rotary side joint
L1、L2‧‧‧旋轉軸線L1, L2‧‧‧Axis of rotation
W‧‧‧工件W‧‧‧ Workpiece
[0012] [第1圖]係概略表示本發明之平面研磨裝置的實施形態的剖面圖。 [第2圖]係將第1圖的旋轉接頭周邊擴大的剖面圖。 [第3圖]係表示第1圖所示之平面研磨裝置的光學系的示意圖。 [第4圖]係表示第1圖所示之平面研磨裝置所測量的工件厚度的圖表。 [第5圖]係表示以比較例所示之平面研磨裝置所測定的工件厚度的圖表。[0012] FIG. 1 is a cross-sectional view schematically showing an embodiment of a plane polishing apparatus according to the present invention.第 [Fig. 2] is a cross-sectional view showing an enlarged periphery of the rotary joint shown in Fig. 1. [Fig. 3] is a schematic diagram showing the optical system of the plane polishing apparatus shown in Fig. 1. [Fig.第 [Fig. 4] is a graph showing the thickness of the workpiece measured by the surface grinding apparatus shown in Fig. 1.第 [FIG. 5] is a graph showing the thickness of a workpiece measured by the surface polishing apparatus shown in the comparative example.
Claims (5)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016199085A JP6771216B2 (en) | 2016-10-07 | 2016-10-07 | Flat surface polishing device |
| JP2016-199085 | 2016-10-07 |
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| Publication Number | Publication Date |
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| TW201813775A true TW201813775A (en) | 2018-04-16 |
| TWI771324B TWI771324B (en) | 2022-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW106133306A TWI771324B (en) | 2016-10-07 | 2017-09-28 | Surface polishing apparatus |
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| Country | Link |
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| JP (1) | JP6771216B2 (en) |
| KR (1) | KR102336201B1 (en) |
| CN (1) | CN107914212B (en) |
| TW (1) | TWI771324B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI807007B (en) * | 2018-04-17 | 2023-07-01 | 日商創技股份有限公司 | Polishing apparatus |
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| JPH0716871B2 (en) * | 1986-12-23 | 1995-03-01 | スピ−ドフアム株式会社 | Grinder with sizing device |
| JPH08300256A (en) * | 1995-05-09 | 1996-11-19 | Speedfam Co Ltd | Surface grinding machine with work thickness measuring device |
| JPH10202514A (en) * | 1997-01-20 | 1998-08-04 | Speedfam Co Ltd | Automatic sizing device |
| JPH10260015A (en) * | 1997-03-21 | 1998-09-29 | Olympus Optical Co Ltd | Optical measuring device for abrasion amount |
| JP2000271854A (en) * | 1999-03-25 | 2000-10-03 | Hitachi Ltd | Machining method and device thereof, and machining method for semiconductor substrate |
| JP3817962B2 (en) * | 1999-03-31 | 2006-09-06 | 松下電器産業株式会社 | Shape measuring method and apparatus |
| JP3506114B2 (en) * | 2000-01-25 | 2004-03-15 | 株式会社ニコン | MONITOR DEVICE, POLISHING APPARATUS HAVING THE MONITOR DEVICE, AND POLISHING METHOD |
| JP2002178257A (en) * | 2000-12-12 | 2002-06-25 | Nikon Corp | Polishing surface observing device and polishing device |
| JP2002202108A (en) * | 2000-12-28 | 2002-07-19 | Hitachi Electronics Eng Co Ltd | Plate thickness measuring device |
| CN100488729C (en) * | 2002-10-17 | 2009-05-20 | 株式会社荏原制作所 | Polishing state monitoring apparatus and polishing apparatus and method |
| WO2004111572A1 (en) * | 2003-06-13 | 2004-12-23 | Ebara Corporation | Measuring apparatus |
| JP2005175177A (en) * | 2003-12-11 | 2005-06-30 | Nikon Corp | Optical apparatus and aligner |
| KR100819616B1 (en) * | 2006-03-13 | 2008-04-04 | 미쓰비시덴키 가부시키가이샤 | Laser beam apparatus |
| JP2008227393A (en) | 2007-03-15 | 2008-09-25 | Fujikoshi Mach Corp | Double-side polishing apparatus for wafer |
| JP5813959B2 (en) * | 2011-02-07 | 2015-11-17 | 株式会社ディスコ | Laser beam irradiation mechanism and laser processing apparatus |
| CN102221416B (en) * | 2011-03-10 | 2012-10-10 | 清华大学 | Polishing solution physical parameter measuring apparatus, measuring method and chemically mechanical polishing equipment |
| JP2015225184A (en) * | 2014-05-27 | 2015-12-14 | 株式会社オプトハブ | Rotary joint |
-
2016
- 2016-10-07 JP JP2016199085A patent/JP6771216B2/en active Active
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2017
- 2017-09-26 KR KR1020170123941A patent/KR102336201B1/en active IP Right Grant
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI807007B (en) * | 2018-04-17 | 2023-07-01 | 日商創技股份有限公司 | Polishing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107914212A (en) | 2018-04-17 |
| JP2018058186A (en) | 2018-04-12 |
| JP6771216B2 (en) | 2020-10-21 |
| TWI771324B (en) | 2022-07-21 |
| CN107914212B (en) | 2021-03-30 |
| KR20180038976A (en) | 2018-04-17 |
| KR102336201B1 (en) | 2021-12-07 |
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