TWI770598B - Substrate processing method, substrate processing apparatus, and computer readable recording medium - Google Patents

Substrate processing method, substrate processing apparatus, and computer readable recording medium Download PDF

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TWI770598B
TWI770598B TW109130077A TW109130077A TWI770598B TW I770598 B TWI770598 B TW I770598B TW 109130077 A TW109130077 A TW 109130077A TW 109130077 A TW109130077 A TW 109130077A TW I770598 B TWI770598 B TW I770598B
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森井俊樹
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日商斯庫林集團股份有限公司
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Abstract

本發明係基於區域最終使用時刻，自複數個處理區域中選擇1個處理區域。區域最終使用時刻係屬於相同處理區域之複數個處理單元之單元最終使用時刻或修正單元最終使用時刻中最早之時刻。修正單元最終使用時刻係自單元最終使用時刻減去搬送時間後之時刻。並且，自屬於所選擇之處理區域之複數個處理單元中選擇1個處理單元。其後，將基板藉由基板搬送系統，自裝載埠上之載具搬送至所選擇之處理單元。In the present invention, one processing area is selected from a plurality of processing areas based on the time of final use of the area. The final use time of the area is the earliest time of the final use time of the unit or the final use time of the modified unit of a plurality of processing units belonging to the same processing area. The corrected unit final use time is the time obtained by subtracting the conveyance time from the unit final use time. Then, one processing unit is selected from a plurality of processing units belonging to the selected processing area. After that, the substrate is transported from the carrier on the loading port to the selected processing unit by the substrate transport system.

Description

基板處理方法、基板處理裝置及電腦可讀取之記錄媒體Substrate processing method, substrate processing apparatus, and computer-readable recording medium

本申請案係基於2018年5月11日提出之日本專利申請案第2018-092485號而主張優先權，該申請案之全部內容於本文藉由引用而併入。This application claims priority based on Japanese Patent Application No. 2018-092485 filed on May 11, 2018, the entire contents of which are incorporated herein by reference.

本發明係關於處理基板之基板處理方法及基板處理裝置，以及藉由基板處理裝置所具備之控制裝置執行之電腦程式。處理對象之基板包含例如半導體晶圓、光碟用基板、磁碟用基板、磁光碟用基板、光罩用基板、陶瓷基板、太陽電池用基板、液晶顯示裝置或有機EL(electroluminescence，電致發光)顯示裝置等之FPD(Flat Panel Display，平板顯示器)用基板等。The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate, and a computer program executed by a control device included in the substrate processing apparatus. The substrates to be processed include, for example, semiconductor wafers, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for masks, ceramic substrates, substrates for solar cells, liquid crystal display devices, or organic EL (electroluminescence) FPD (Flat Panel Display) substrates for display devices, etc.

半導體裝置或液晶顯示裝置等之製造步驟中，使用處理半導體晶圓或液晶顯示裝置用玻璃基板等基板之基板處理裝置。於專利文獻1中，揭示有用於具備複數個處理單元之基板處理裝置之排程。In the manufacturing steps of semiconductor devices, liquid crystal display devices, etc., a substrate processing apparatus for processing substrates such as semiconductor wafers and glass substrates for liquid crystal display devices is used. In Patent Document 1, a schedule for a substrate processing apparatus including a plurality of processing units is disclosed.

專利文獻1記載之排程中，將複數個處理單元基於搬送路徑長或搬送時間，分類成複數個處理區域。製作處理基板之排程表時，自複數個處理區域中選擇1個處理區域。其後，自屬於所選擇之處理區域之複數個處理單元中選擇1個處理單元。排程表係以由所選擇之處理單元處理基板之方式製作。藉由執行該排程表，而實際搬送及處理基板。In the schedule described in Patent Document 1, a plurality of processing units are classified into a plurality of processing areas based on a conveyance path length or a conveyance time. When creating a schedule for processing substrates, one processing area is selected from a plurality of processing areas. After that, one processing unit is selected from the plurality of processing units belonging to the selected processing area. The schedule is created in such a way that the substrates are processed by the selected processing unit. By executing the schedule, the substrates are actually transported and processed.

又，專利文獻1記載之排程中，揭示有基於區域使用率之大小關係選擇處理區域，於存在區域使用率相等之複數個處理區域之情形時，基於區域最終使用時刻選擇處理區域。區域使用率係用以處理基板所需要之時間除以處理該基板之處理區域中之有效(可利用)處理單元之數的值。In addition, the schedule described in Patent Document 1 discloses that a processing area is selected based on the magnitude relationship of the area usage rates, and when there are a plurality of processing areas with the same area usage rate, the processing area is selected based on the area final usage time. The area utilization rate is a value obtained by dividing the time required to process a substrate by the number of active (available) processing units in the processing area for processing the substrate.

於專利文獻1之段落0059中，記載有「將屬於該處理區域PZ之處理單元MPC之單元最終時刻中最晚者作為區域最終使用時刻登錄於記憶部63」。於專利文獻1之段落0099中，記載有「對區域使用率賦予第1優先順序，於區域最終使用時刻賦予第2優先順序，對區域編號(搬送距離或搬送時間)賦予第3優先順序。但，亦可使區域最終使用時刻與區域使用率之優先順序相反」。In the paragraph 0059 of Patent Document 1, it is described that "the last one of the unit final times of the processing units MPC belonging to the processing area PZ is registered in the memory unit 63 as the area final use time." In paragraph 0099 of Patent Document 1, it is described that "the area usage rate is assigned the first priority order, the area final use time is assigned the second priority order, and the area number (transportation distance or conveyance time) is assigned the third priority order. However, , it is also possible to reverse the priority of the area final usage time and area usage rate”.

[先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2017-183545號公報[Prior Art Literature] [Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2017-183545

[發明所欲解決之問題][Problems to be Solved by Invention]

專利文獻1所記載之排程藉由基於區域使用率之大小關係選擇處理區域，而均等地選擇複數個處理區域，以普遍使用基板處理裝置所具備之所有處理單元之方式製作排程表。The schedule described in Patent Document 1 selects processing areas based on the magnitude relationship of area utilization, selects a plurality of processing areas equally, and creates a schedule table by generally using all processing units of a substrate processing apparatus.

但，根據本發明者之研究可知，以專利文獻1記載之排程，無法判斷各處理區域之基板之投入狀況，因此，儘管於其他處理區域存在空的處理單元，所有處理單元仍選擇使用中之處理區域之情形。However, according to the research of the present inventors, the schedule described in Patent Document 1 cannot determine the input status of substrates in each processing area. Therefore, although there are empty processing units in other processing areas, all processing units are still selected for use. of the processing area.

具體而言，可知於基板之處理時間減少之情形時，選擇如此之處理區域。例如，如圖17所示，即使第1處理區域PZ1及第2處理區域PZ1中有空的處理單元MPC，亦以屬於第3處理區域PZ3之處理單元MPC17處理第6片基板W6。該情形時，需要延緩基板W6之搬送直至處理單元MPC17空出為止，導致基板處理裝置運轉率減低。因此，專利文獻1記載之發明有改善之餘地。Specifically, it can be seen that when the processing time of the substrate is reduced, such a processing area is selected. For example, as shown in FIG. 17, even if there are empty processing cells MPC in the first processing zone PZ1 and the second processing zone PZ1, the sixth substrate W6 is processed by the processing cell MPC17 belonging to the third processing zone PZ3. In this case, it is necessary to delay the conveyance of the substrate W6 until the processing unit MPC17 becomes vacant, resulting in a decrease in the operating rate of the substrate processing apparatus. Therefore, the invention described in Patent Document 1 has room for improvement.

因此，本發明之目的之一係提供一種可普遍使用基板處理裝置所具備之所有處理單元，且提高基板處理裝置之運轉率之基板處理方法、基板處理裝置及電腦程式。 [解決問題之技術手段]Therefore, one of the objects of the present invention is to provide a substrate processing method, a substrate processing apparatus and a computer program which can generally use all the processing units of the substrate processing apparatus and improve the operation rate of the substrate processing apparatus. [Technical means to solve problems]

本發明之一實施形態提供一種基板處理方法，其係藉由以基板搬送系統將上述基板自裝載埠上之載具搬送至處理基板之複數個處理單元之基板處理裝置而執行者，其包含如下步驟：所屬確認步驟，其確認上述複數個處理單元之各者係屬於基於自上述裝載埠上之上述載具對上述處理單元搬送上述基板所需要之搬送時間、或表示自上述裝載埠至上述處理單元之距離之搬送距離所分類之複數個處理區域之哪一者；單元最終使用時刻取得步驟，其對於上述複數個處理單元之各者，取得表示上述處理單元用以處理上述基板最後使用之時刻之單元最終使用時刻；修正單元最終使用時刻計算步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻與關於上述複數個處理單元之上述搬送時間，對於上述複數個處理單元之各者，計算表示相同之上述處理單元中自上述單元最終使用時刻減去上述搬送時間後之時刻之修正單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述修正單元最終使用時刻計算步驟中所得之複數個上述修正單元最終使用時刻，對於上述複數個處理區域之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述修正單元最終使用時刻中最早時刻之區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中，選擇上述區域最終使用時刻最早之1個上述處理區域；單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其以上述搬送系統將上述基板自上述裝載埠上之上述載具搬送至上述單元選擇步驟中選擇之上述處理單元。An embodiment of the present invention provides a substrate processing method, which is performed by using a substrate transfer system to transfer the substrate from a carrier on a loading port to a substrate processing apparatus of a plurality of processing units for processing the substrate, including the following Step: belonging to a confirming step, which confirms that each of the plurality of processing units is based on the transfer time required to transfer the substrate from the carrier on the loading port to the processing unit, or indicates that from the loading port to the processing Which one of the plurality of processing areas classified by the conveying distance of the distance of the unit; the step of obtaining the final use time of the unit, for each of the plurality of processing units, obtaining the time indicating the last use of the processing unit for processing the substrate The final use time of the unit; the calculation step of correcting the final use time of the unit, which is based on the final use time of a plurality of the above-mentioned units obtained in the step of obtaining the final use time of the unit and the above-mentioned transfer time about the above-mentioned plurality of processing units, for the above-mentioned plurality of processing units For each of the units, calculate the corrected unit end-of-use time representing the time after subtracting the above-mentioned conveyance time from the above-mentioned unit end-of-use time in the same above-mentioned processing unit; the area end-of-use time specific step, which is calculated based on the above-mentioned corrected unit end-of-use time The final use time of the plurality of correction units obtained in the step, for each of the plurality of processing areas, an area representing the earliest time among the final use times of the correction units of the plurality of processing units belonging to the same processing area is specified The final use time; the area selection step, which is based on a plurality of the above-mentioned area final use times specified in the above-mentioned area final use time specific step, and selects the above-mentioned area from the above-mentioned plurality of processing areas with the earliest final use time. One above-mentioned processing area a unit selection step of selecting one of the above-mentioned processing units from among a plurality of the above-mentioned processing units belonging to the above-mentioned processing area selected in the above-mentioned area selection step; and a substrate transfer step of transferring the above-mentioned substrate from the above-mentioned loading port by the above-mentioned transfer system The above-mentioned carrier is conveyed to the above-mentioned processing unit selected in the above-mentioned unit selection step.

根據該構成，並非基於區域使用率之大小關係選擇處理區域，而基於區域最終使用時刻，自複數個處理區域中選擇1個處理區域。並且，自屬於所選擇之處理區域之複數個處理單元中選擇1個處理單元。其後，將基板藉由基板搬送系統，自裝載埠上之載具搬送至所選擇之處理單元。因此，不僅於基板之處理時間未變化之情形，於基板之處理時間減少之情形亦可均等地選擇複數個處理區域，可普遍使用基板處理裝置所具備之所有處理單元。藉此，可提高基板處理裝置之運轉率。According to this configuration, the processing area is not selected based on the magnitude relationship of the area usage rate, but one processing area is selected from a plurality of processing areas based on the time when the area is last used. Then, one processing unit is selected from a plurality of processing units belonging to the selected processing area. After that, the substrate is transported from the carrier on the loading port to the selected processing unit by the substrate transport system. Therefore, not only when the processing time of the substrate is unchanged, but also when the processing time of the substrate is reduced, a plurality of processing areas can be equally selected, and all processing units provided in the substrate processing apparatus can be generally used. Thereby, the operation rate of the substrate processing apparatus can be improved.

並且，區域最終使用時刻並非基於最早的單元使用時刻，而係基於最早的修正單元最終時刻而特定。修正單元最終使用時刻係自表示處理單元用以處理基板最後使用之時刻之單元最終使用時刻，減去自裝載埠上之載具對處理單元搬送基板所需要之搬送時間後之時刻。因此，可減少複數個處理區域間之搬送時間差，可避免僅選擇靠近裝載埠之處理區域。藉此，可進而均等地選擇複數個處理區域。In addition, the area final use time is not based on the earliest unit use time, but is specified based on the earliest corrected unit final time. The corrected unit end-use time is the unit end-use time indicating the last time the processing unit is used to process the substrate minus the transfer time required to transfer the substrate from the carrier on the loading port to the processing unit. Therefore, the transfer time difference between the plurality of processing areas can be reduced, and only the processing area close to the loading port can be avoided to be selected. Thereby, a plurality of processing regions can be selected evenly.

本發明之其他實施形態提供一種基板處理方法，其係藉由以基板搬送系統將上述基板自裝載埠上之載具搬送至處理基板之複數個處理單元之基板處理裝置而執行者，其包含如下步驟：所屬確認步驟，其確認上述複數個處理單元之各者屬於基於自上述裝載埠上之上述載具對上述處理單元搬送上述基板所需要之搬送時間、或表示自上述裝載埠至上述處理單元之距離之搬送距離所分類之複數個處理區域之哪一者；單元最終使用時刻取得步驟，其對於上述複數個處理單元之各者，取得表示上述處理單元用以處理上述基板最後使用之時刻之單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻，對於上述複數個處理區域之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述單元最終使用時刻中最早時刻之區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中選擇上述區域最終使用時刻最早之1個上述處理區域；單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其以上述搬送系統將上述基板自上述裝載埠上之上述載具搬送至上述單元選擇步驟中選擇之上述處理單元。Another embodiment of the present invention provides a substrate processing method, which is performed by using a substrate transfer system to transfer the substrate from a carrier on a loading port to a substrate processing apparatus of a plurality of processing units for processing the substrate, including the following Step: belonging confirmation step, which confirms that each of the plurality of processing units belongs to the processing unit based on the transfer time required to transfer the substrate from the carrier on the loading port to the processing unit, or indicates that the processing unit is from the loading port to the processing unit Which of the plurality of processing areas classified by the conveying distance of the distance; the unit final use time obtaining step, for each of the plurality of processing units, obtaining the time indicating the last use time of the processing unit for processing the substrate The unit final use time; the area final use time specific step, which is based on a plurality of the above unit final use times obtained in the above unit final use time acquisition step, and for each of the above-mentioned plural processing areas, specifies the above-mentioned processing that belongs to the same The area final use time at the earliest of the above unit final use times of the plurality of above-mentioned processing units in the area; the area selection step is based on the above-mentioned area final use time specified in the above-mentioned area final use time specific step of the plurality of above-mentioned area final use times, from the above plural Among the processing areas, the one above-mentioned processing area with the earliest final use time of the above-mentioned area is selected; the unit selection step is to select one above-mentioned processing unit from the plurality of above-mentioned processing units belonging to the above-mentioned processing area selected in the above-mentioned area selection step; and a substrate transfer step of transferring the substrate from the carrier on the loading port to the processing unit selected in the unit selection step by the transfer system.

根據該構成，並非基於區域使用率之大小關係選擇處理區域，而基於區域最終使用時刻，自複數個處理區域中選擇1個處理區域。並且，自屬於所選擇之處理區域之複數個處理單元中，選擇1個處理單元。其後，將基板藉由基板搬送系統，自裝載埠上之載具搬送至所選擇之處理單元。因此，不僅於基板之處理時間未變化之情形，於基板之處理時間減少之情形，亦可均等地選擇複數個處理區域，可普遍使用基板處理裝置所具備之所有處理單元。藉此，可提高基板處理裝置之運轉率。According to this configuration, the processing area is not selected based on the magnitude relationship of the area usage rate, but one processing area is selected from a plurality of processing areas based on the time when the area is last used. Then, one processing unit is selected from the plurality of processing units belonging to the selected processing area. After that, the substrate is transported from the carrier on the loading port to the selected processing unit by the substrate transport system. Therefore, not only when the processing time of the substrate is unchanged, but also when the processing time of the substrate is reduced, a plurality of processing areas can be equally selected, and all processing units of the substrate processing apparatus can be generally used. Thereby, the operation rate of the substrate processing apparatus can be improved.

基板處理之開始時刻可為基板搬入至處理單元內之時刻，亦可為基板開始旋轉之時刻，亦可為其以外之時刻。基板處理之結束時刻，即，單元最終使用時刻可為將基板自處理單元搬出之時刻，亦可為基板停止旋轉之時刻，亦可為其以外之時刻。將基板搬入至處理單元內之時刻及自處理單元搬出之時刻例如亦可為開閉設置於處理單元之處理腔室之開口之擋閘開始向打開位置(開口打開位置)移動之時刻。The start time of the substrate processing may be the time when the substrate is loaded into the processing unit, the time when the substrate starts to rotate, or the time other than that. The end time of the substrate processing, that is, the final use time of the unit may be the time when the substrate is unloaded from the processing unit, the time when the substrate stops rotating, or the time other than that. The timing when the substrate is carried into the processing unit and when the substrate is carried out from the processing unit may be, for example, the timing when the shutter that opens and closes the opening of the processing chamber provided in the processing unit starts to move to the open position (opening position).

上述2個實施形態中，以下特徵之至少一者亦可加入於上述基板處理方法中。In the above-mentioned two embodiments, at least one of the following features may be added to the above-mentioned substrate processing method.

上述基板處理方法於上述修正單元最終使用時刻計算步驟前，進而包含搬送時間登錄步驟，其登錄相同值作為用以屬於相同之上述處理區域之複數個上述處理單元之上述搬送時間。The substrate processing method further includes a transport time registration step of registering the same value as the transport time for the plurality of processing units belonging to the same processing area before the correction unit final use time calculation step.

根據該構成，對於屬於相同處理區域之複數個處理單元，登錄相同值作為搬送時間。即使係屬於相同處理區域之複數個處理單元，搬送距離亦嚴格不同，故搬送時間亦嚴格不同。但，若所屬之處理區域相同，則搬送時間差極小，搬送時間於該等處理單元間大致相等。因此，若對於屬於相同處理區域之複數個處理單元登錄相同值作為搬送時間，則可減少該等處理區域間之搬送時間差，且簡化搬送時間之設定。According to this configuration, the same value is registered as the conveyance time for a plurality of processing units belonging to the same processing area. Even if a plurality of processing units belong to the same processing area, the transport distances are strictly different, so the transport times are also strictly different. However, if the processing areas to which they belong are the same, the difference in transfer time is extremely small, and the transfer time is approximately equal between the processing units. Therefore, if the same value is registered as the transport time for a plurality of processing units belonging to the same processing area, the transport time difference between the processing areas can be reduced, and the setting of the transport time can be simplified.

上述區域選擇步驟包含如下步驟：第1檢索步驟，其於上述複數個處理區域中，檢索上述區域最終使用時刻最早之上述處理區域；第2檢索步驟，其於上述第1檢索步驟中見到複數個上述處理區域為候補區域之情形時，於上述候補區域所含之複數個上述處理區域中，檢索上述單元最終使用時刻最早之上述處理單元之數最大之上述處理區域；及選擇步驟，其自上述第2檢索步驟中見到之至少1個上述處理區域中，選擇1個上述處理區域。The above-mentioned area selection step includes the following steps: a first retrieval step, which searches for the above-mentioned processing area with the earliest final use time of the above-mentioned area among the above-mentioned plural processing areas; When each of the above-mentioned processing areas is a candidate area, searching for the above-mentioned processing area with the largest number of the above-mentioned processing units with the earliest last use time of the above-mentioned unit among the plurality of above-mentioned processing areas included in the above-mentioned candidate area; One of the above-mentioned processing areas is selected from at least one of the above-mentioned processing areas found in the above-mentioned second search step.

根據該構成，有區域最終使用時刻最早之複數個處理區域之情形時，自該等處理區域中，選擇單元最終使用時刻最早之處理單元數最大之處理區域。對所選擇之處理單元搬送基板前，或對所選擇之處理單元搬送基板時，於該處理單元發生異常之情形時，需要重新選擇其他處理單元。如此之情形時，若係於相同處理區域中有單元最終使用時刻最早之其他處理單元，則可選擇該處理單元作為新的處理單元。因此，可以比較簡單之變更設定基板之新的搬送路徑。According to this configuration, when there are a plurality of processing areas with the earliest area final use time, among the processing areas, the processing area with the largest number of processing units with the earliest unit final use time is selected. Before transferring substrates to the selected processing unit, or when transferring substrates to the selected processing unit, when an abnormality occurs in the processing unit, it is necessary to reselect another processing unit. In this case, if there is another processing unit in the same processing area with the earliest unit final use time, this processing unit can be selected as a new processing unit. Therefore, it is relatively easy to change and set a new conveyance path of the substrate.

上述區域選擇步驟亦可進而包含第3檢索步驟，其於上述第2檢索步驟中見到複數個上述處理區域之情形時，於上述第2檢索步驟中見到之複數個上述處理區域中，檢索上述搬送時間或搬送距離最小之上述處理區域。該情形時，上述選擇步驟亦可為自上述第3檢索步驟中見到之至少1個上述處理區域中選擇1個上述處理區域之步驟。The above-mentioned area selection step may further include a third search step, which, when a plurality of the above-mentioned processing areas are found in the above-mentioned second search step, searches the plurality of above-mentioned processing areas found in the above-mentioned second search step. The above-mentioned processing area where the above-mentioned conveyance time or conveyance distance is the smallest. In this case, the above-mentioned selection step may be a step of selecting one of the above-mentioned processing areas from at least one of the above-mentioned processing areas found in the above-mentioned third retrieval step.

上述基板處理方法於上述單元最終使用時刻取得步驟之前，亦可進而包含最終使用時刻初始化步驟，其將所有上述處理單元之上述單元最終使用時刻變更為相同值(例如0)。Before the step of obtaining the final use time of the above-mentioned unit, the above-mentioned substrate processing method may further include a step of initializing the above-mentioned final use time, which changes the above-mentioned unit final use time of all the above-mentioned processing units to the same value (eg, 0).

上述基板處理方法進而包含基板處理步驟，其以比搬送至上述複數個處理單元之任一者之最近的基板處理時間短之處理時間，於上述基板搬送步驟後，以上述單元選擇步驟中選擇之上述處理單元處理上述基板。The above-mentioned substrate processing method further includes a substrate processing step of selecting the one selected in the above-mentioned unit selection step after the above-mentioned substrate conveying step with a processing time shorter than the most recent substrate processing time conveyed to any one of the above-mentioned plurality of processing units. The above-mentioned processing unit processes the above-mentioned substrate.

根據該構成，基板之處理時間比最近之基板更減少。如此之情形時，亦基於區域最終使用時刻，自複數個處理區域中選擇1個處理區域，故與基於區域使用率之大小關係選擇處理區域之情形相比，可均等地選擇複數個處理區域。因此，即使基板之搬送路徑或處理時間不同之情形，亦可普遍使用所有處理單元，可進而提高基板處理裝置之運轉率。According to this structure, the processing time of a board|substrate is reduced more than the nearest board|substrate. Even in such a case, one processing area is selected from a plurality of processing areas based on the time of final use of the area, so that a plurality of processing areas can be equally selected compared to the case where processing areas are selected based on the magnitude relationship of the area usage rates. Therefore, even if the conveying paths or processing times of the substrates are different, all processing units can be generally used, which can further improve the operation rate of the substrate processing apparatus.

本發明之進而其他實施形態提供一種基板處理裝置，其具備：裝載埠，其載置收納基板之載具；複數個處理單元，其處理自上述裝載埠上之上述載具搬送來之上述基板；基板搬送系統，其於上述裝載埠上之上述載具與上述複數個處理單元間搬送上述基板；及控制裝置，其控制上述基板搬送系統。Still another embodiment of the present invention provides a substrate processing apparatus comprising: a loading port on which a carrier for accommodating substrates is mounted; a plurality of processing units for processing the substrates transferred from the carrier on the loading port; A substrate transfer system for transferring the substrate between the carrier on the loading port and the plurality of processing units; and a control device for controlling the substrate transfer system.

上述控制裝置執行如下步驟：所屬確認步驟，其確認上述複數個處理單元之各者係屬於基於自上述裝載埠上之上述載具對上述處理單元搬送上述基板所需要之搬送時間、或表示上述裝載埠至上述處理單元之距離之搬送距離所分類之複數個處理區域之哪一者；單元最終使用時刻取得步驟，其對於上述複數個處理單元之各者，取得表示上述處理單元用以處理上述基板最後使用之時刻之單元最終使用時刻；修正單元最終使用時刻計算步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻與關於上述複數個單元之上述搬送時間，對於上述複數個處理單元之各者，計算表示相同之上述處理單元中自上述單元最終使用時刻減去上述搬送時間後之時刻之修正單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述修正單元最終使用時刻計算步驟中所得之複數個上述修正單元最終使用時刻，對於上述複數個處理區域之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述修正單元最終使用時刻中最早時刻之區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中選擇上述區域最終使用時刻最早之1個上述處理區域；單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其以上述基板搬送系統將上述基板自上述裝載埠上之上述載具搬送至上述單元選擇步驟中選擇之上述處理單元。根據該構成，可發揮與上述效果相同之效果。The control device performs the following step: a belonging confirmation step, which confirms that each of the plurality of processing units belongs to a transfer time required to transfer the substrate to the processing unit from the carrier on the loading port, or indicates the loading Which one of the plurality of processing areas is classified by the conveyance distance of the distance from the port to the above-mentioned processing unit; the step of obtaining the final use time of the unit, which, for each of the above-mentioned plurality of processing units, obtains a representation indicating that the above-mentioned processing unit is used to process the above-mentioned substrate The final use time of the unit at the time of last use; the calculation step of correcting the final use time of the unit is based on the final use time of a plurality of the above-mentioned units obtained in the above-mentioned unit final-use time obtaining step and the above-mentioned conveying time for the above-mentioned plurality of units. Each of the plurality of processing units calculates the corrected unit final use time representing the time after subtracting the above-mentioned conveyance time from the above-mentioned unit final use time in the same above-mentioned processing units; the area final use time specific step is based on the above-mentioned correction unit final use time. The final use time of the plurality of correction units obtained in the use time calculation step, and for each of the plurality of processing areas, the earliest among the final use times of the correction units representing the plurality of processing units belonging to the same processing area is specified. The final use time of the area at the time; the area selection step, which is based on a plurality of the above area final use times specified in the above-mentioned area final use time specific step, and selects the above-mentioned area from the plurality of processing areas with the earliest final use time of the above-mentioned area. a processing area; a unit selection step of selecting one of the above-mentioned processing units from among a plurality of the above-mentioned processing units belonging to the above-mentioned processing area selected in the above-mentioned area selection step; and a substrate transfer step of transferring the above-mentioned substrate from the above-mentioned substrate transfer system The above-mentioned carrier on the above-mentioned loading port is conveyed to the above-mentioned processing unit selected in the above-mentioned unit selection step. According to this structure, the same effect as the above-mentioned effect can be exhibited.

本發明之進而其他實施形態提供一種基板處理裝置，其具備：裝載埠，其載置收納基板之載具；複數個處理單元，其處理自上述裝載埠上之上述載具搬送來之上述基板；基板搬送系統，其於上述裝載埠上之上述載具與上述複數個處理單元間搬送上述基板；及控制裝置，其控制上述基板搬送系統。Still another embodiment of the present invention provides a substrate processing apparatus comprising: a loading port on which a carrier for accommodating substrates is mounted; a plurality of processing units for processing the substrates transferred from the carrier on the loading port; A substrate transfer system for transferring the substrate between the carrier on the loading port and the plurality of processing units; and a control device for controlling the substrate transfer system.

上述控制裝置執行如下步驟：所屬確認步驟，其確認上述複數個處理單元之各者係屬於基於自上述裝載埠上之上述載具對上述處理單元搬送上述基板所需要之搬送時間、或表示自上述裝載埠至上述處理單元之距離之搬送距離所分類之複數個處理區域之哪一者；單元最終使用時刻取得步驟，其對於上述複數個處理單元之各者，取得表示上述處理單元用以處理上述基板最後使用之時刻之單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻，對於上述複數個處理單元之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述單元最終使用時刻中最早時刻之區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中，選擇上述區域最終使用時刻最早之1個上述處理區域；單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其以上述基板搬送系統將上述基板自上述裝載埠上之上述載具搬送至上述單元選擇步驟中選擇之上述處理單元。根據該構成，可發揮與上述效果相同之效果。The control device executes the following step: a belonging confirmation step, which confirms that each of the plurality of processing units belongs to a transfer time required to transfer the substrate to the processing unit from the carrier on the loading port, or indicates a transfer time from the Which of the plurality of processing areas is classified by the distance from the loading port to the processing unit; the step of obtaining the final use time of the unit, for each of the plurality of processing units, the acquisition indicates that the processing unit is used to process the above The final use time of the unit at the time of the last use of the substrate; the specific step of the final use time of the area, which is based on the final use time of a plurality of the above units obtained in the above step of obtaining the final use time of the unit, and for each of the plurality of processing units, a specific output Represents the area final use time at the earliest of the above unit final use times of the plurality of above processing units belonging to the same above mentioned processing area; the area selection step is based on the above area final use time specific step. At the time of use, from the plurality of processing areas, the one above-mentioned processing area with the earliest final use time of the above-mentioned area is selected; in the unit selection step, among the plurality of above-mentioned processing units belonging to the above-mentioned processing area selected in the above-mentioned area selection step, Selecting one of the above-mentioned processing units; and a substrate transporting step of transporting the above-mentioned substrates from the above-mentioned carrier on the above-mentioned loading port to the above-mentioned processing unit selected in the above-mentioned unit selecting step by using the above-mentioned substrate transporting system. According to this structure, the same effect as the above-mentioned effect can be exhibited.

上述2個實施形態中，以下特徵之至少一者亦可加入於上述基板處理裝置中。In the above-mentioned two embodiments, at least one of the following features may be incorporated into the above-mentioned substrate processing apparatus.

上述控制裝置於上述修正單元最終使用時刻計算步驟前，進而執行搬送時間登錄步驟，其登錄相同值作為用以屬於相同之上述處理區域之複數個上述處理單元之上述搬送時間。根據該構成，可發揮與上述效果相同之效果。The control device further executes a transport time registration step before the correction unit final use time calculation step, and registers the same value as the transport time for a plurality of the processing units belonging to the same processing area. According to this structure, the same effect as the above-mentioned effect can be exhibited.

上述區域選擇步驟包含如下步驟：第1檢索步驟，其於上述複數個處理區域中檢索上述區域最終使用時刻最早之上述處理區域；第2檢索步驟，其於上述第1檢索步驟中見到複數個上述處理區域為候補區域之情形時，於上述候補區域所含之複數個上述處理區域中，檢索上述單元最終使用時刻最早之上述處理單元之數最大之上述處理區域；及選擇步驟，其自上述第2檢索步驟中見到之至少1個上述處理區域中，選擇1個上述處理區域。根據該構成，可發揮與上述效果相同之效果。The above-mentioned area selection step includes the following steps: a first search step, which searches for the above-mentioned processing area with the earliest final use time of the above-mentioned area among the above-mentioned plural processing areas; When the above-mentioned processing area is a candidate area, among a plurality of the above-mentioned processing areas included in the above-mentioned candidate area, search for the above-mentioned processing area with the largest number of the above-mentioned processing units with the earliest last use time of the above-mentioned unit; Among at least one of the above-mentioned processing areas found in the second search step, one of the above-mentioned processing areas is selected. According to this structure, the same effect as the above-mentioned effect can be exhibited.

上述控制裝置進而執行基板處理步驟，其以比搬送至上述複數個處理單元之任一者之最近的基板處理時間短之處理時間，於上述基板搬送步驟後，以上述單元選擇步驟中選擇之上述處理單元處理上述基板。根據該構成，可發揮與上述效果相同之效果。The control device further executes a substrate processing step, wherein the processing time is shorter than the processing time of the most recent substrate conveyed to any one of the plurality of processing units, after the substrate conveying step, the above-mentioned selected in the unit selection step is used. The processing unit processes the above-mentioned substrate. According to this structure, the same effect as the above-mentioned effect can be exhibited.

本發明之進而其他實施形態提供一種電腦程式，其係藉由以基板搬送系統將上述基板自裝載埠上之載具搬送至處理基板之複數個處理單元之基板處理裝置所具備之控制裝置而執行者，且係以使作為上述控制裝置之電腦執行上述基板處理方法之至少一者之方式組入步驟群之電腦程式。上述電腦程式亦可記錄於電腦可讀取之記錄媒體。記錄媒體可為如雷射碟片等之光碟，亦可為記憶卡等半導體記憶體。Still another embodiment of the present invention provides a computer program executed by a control device included in a substrate processing apparatus that transfers the substrate from a carrier on a loading port to a plurality of processing units that process the substrate by a substrate transfer system which is a computer program incorporated into the step group so that the computer serving as the control device executes at least one of the substrate processing methods described above. The above computer program can also be recorded on a computer-readable recording medium. The recording medium may be an optical disc such as a laser disc or a semiconductor memory such as a memory card.

本發明之上述或進而其他目的、特徵及效果係參照隨附圖式，由以下敘述之實施形態之說明而明確。The above-mentioned and other objects, features, and effects of the present invention will be clarified from the description of the embodiments described below with reference to the accompanying drawings.

圖1係本發明之一實施形態之基板處理裝置1之模式性俯視圖。圖2係顯示沿圖1所示之切斷線Ⅱ-Ⅱ線之鉛垂剖面之基板處理裝置1之模式性剖視圖。FIG. 1 is a schematic plan view of a substrate processing apparatus 1 according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing the substrate processing apparatus 1 in a vertical cross-section along the cutting line II-II shown in FIG. 1 .

基板處理裝置1係逐片處理半導體晶圓等圓板狀基板W之單片式裝置。基板處理裝置1包含載具保持部2、分度器部3及處理部4。The substrate processing apparatus 1 is a single-wafer type apparatus for processing a disk-shaped substrate W such as a semiconductor wafer one by one. The substrate processing apparatus 1 includes a carrier holding unit 2 , an indexer unit 3 , and a processing unit 4 .

載具保持部2包含分別保持可收納複數片基板W之基板收納容器即載具C之複數個裝載埠LP。裝載埠LP係保持載具C之載具保持單元。裝載埠LP係將載具C投入於基板處理裝置1之位置。載具C藉由裝載埠LP開閉。The carrier holding part 2 includes a plurality of load ports LP for holding the carrier C, which is a substrate storage container capable of accommodating a plurality of substrates W, respectively. The load port LP is a carrier holding unit that holds the carrier C. The loading port LP puts the carrier C into the position of the substrate processing apparatus 1 . The carrier C is opened and closed by the load port LP.

分度器部3包含分度器機器人IR。分度器機器人IR執行：將未處理之基板W自載置於載具保持部2上之載具C取出，交付給處理部4之搬入動作；及自處理部4接收已處理之基板W，收納於保持於載具保持部2之載具C之收納動作。The indexer unit 3 includes an indexer robot IR. The indexer robot IR performs the carrying operation of taking out the unprocessed substrate W from the carrier C placed on the carrier holding unit 2 and delivering it to the processing unit 4; and receiving the processed substrate W from the processing unit 4 and storing it in Storing operation of the carrier C held by the carrier holding portion 2 .

處理部4包含：複數個處理單元MPC1～MPC24(以下總稱時稱為「處理單元MPC」)、第1主搬送機器人CR1、第2主搬送機器人CR2、第1交接單元PASS1、第2交接單元PASS2。分度器機器人IR、第1主搬送機器人CR1及第2主搬送機器人CR2構成於載具保持部2與保持單元MPC間搬送基板W之基板搬送系統TS1。The processing unit 4 includes a plurality of processing units MPC1 to MPC24 (hereinafter collectively referred to as "processing units MPC"), a first main transfer robot CR1, a second main transfer robot CR2, a first delivery unit PASS1, and a second delivery unit PASS2 . The indexer robot IR, the first main transfer robot CR1, and the second main transfer robot CR2 constitute a substrate transfer system TS1 that transfers the substrate W between the carrier holding unit 2 and the holding unit MPC.

於處理部4內，於俯視時，形成自分度器部3直線狀延伸之搬送路徑5。於該搬送路徑5內，自分度器部3側起依序配置有第1交接單元PASS1、第1主搬送機器人CR1、第2交接單元PASS2及第2主搬送機器人CR2。第1交接單元PASS1係中介分度器機器人IR與第1主搬送機器人CR1間之基板W交接之單元。第2交接單元PASS2係中介第1主搬送機器人CR1與第2主搬送機器人CR2間之基板W交接之單元。第1及第2交接單元PASS1、PASS2具備暫時保持基板W之複數個基板載置台15。In the processing part 4, the conveyance path 5 extended linearly from the indexer part 3 is formed in planar view. In this conveyance path 5, the 1st transfer unit PASS1, the 1st main transfer robot CR1, the 2nd transfer unit PASS2, and the 2nd main transfer robot CR2 are arrange|positioned in this order from the indexer part 3 side. The first transfer unit PASS1 is a unit for transferring the substrate W between the indexer robot IR and the first main transfer robot CR1. The second transfer unit PASS2 is a unit that mediates the transfer of the substrate W between the first main transfer robot CR1 and the second main transfer robot CR2. The first and second delivery units PASS1 and PASS2 include a plurality of substrate mounts 15 that temporarily hold the substrate W.

複數個處理單元MPC形成複數個塔TW1～TW6(以下總稱時稱為「塔TW」。)。各塔TW包含於上下積層之複數個處理單元MPC(例如4個處理單元MPC)。複數個塔TW係沿搬送路徑5排列。3個塔TW1、TW3、TW5係配置於搬送路徑5之一側。其餘3個塔TW2、TW4、TW6係配置於搬送路徑5之另一側。The plurality of processing units MPC form a plurality of towers TW1 to TW6 (hereinafter collectively referred to as "tower TW"). Each tower TW includes a plurality of processing units MPC (eg, 4 processing units MPC) stacked on top and bottom. A plurality of towers TW are arranged along the conveyance path 5 . The three towers TW1 , TW3 , and TW5 are arranged on one side of the conveyance path 5 . The remaining three towers TW2 , TW4 , and TW6 are arranged on the other side of the conveyance path 5 .

複數個處理單元MPC形成隔著搬送路徑5對向之3對塔TW。具體而言，塔TW1及塔TW2係隔著搬送路徑5對向。同樣地，塔TW3及塔TW4係隔著搬送路徑5對向，塔TW5及塔TW6係隔著搬送路徑5對向。The plurality of processing units MPC form three pairs of towers TW facing each other across the conveyance path 5 . Specifically, the tower TW1 and the tower TW2 face each other across the conveyance path 5 . Similarly, the tower TW3 and the tower TW4 face each other across the conveyance path 5 , and the tower TW5 and the tower TW6 face each other across the conveyance path 5 .

分度器部3至塔TW1之距離與分度器部3至塔TW2之距離相等或大致相等。因此，自分度器部3對塔TW1搬送基板W所需要之搬送時間，與自分度器部3對塔TW2搬送基板W所需要之搬送時間相等或大致相等。即，各對塔(TW1與TW2、TW3與TW4、TW5與TW6)係配置於與分度器部3之距離相等或大致相等之位置，自分度器部3對各對塔TW搬送基板W所需要之搬送時間相等或大致相等。The distance from the indexer portion 3 to the tower TW1 is equal or approximately equal to the distance from the indexer portion 3 to the tower TW2. Therefore, the transfer time required to transfer the substrate W from the indexer unit 3 to the tower TW1 is equal to or substantially equal to the transfer time required to transfer the substrate W from the indexer unit 3 to the tower TW2. That is, each pair of towers ( TW1 and TW2 , TW3 and TW4 , TW5 and TW6 ) is arranged at a position equal to or substantially equal to the distance from the indexer unit 3 , and the indexer unit 3 carries the substrate W to each pair of towers TW for the transfer required. time equal or approximately equal.

3對塔(TW1與TW2、TW3與TW4、TW5與TW6)分別形成3個處理區域PZ1、PZ2、PZ3(以下總稱時稱為「處理區域PZ」)。即，於最靠近分度器部3之位置隔著搬送路徑5對向之一對塔TW1、TW2形成第1處理區域PZ1。接著，於靠近分度器部3之位置隔著搬送路徑5對向之一對塔TW3、TW4形成第2處理區域PZ2。接著，於靠近分度器部3之位置隔著搬送路徑5對向之一對塔TW5、TW6形成第3處理區域PZ3。The three pairs of towers (TW1 and TW2, TW3 and TW4, and TW5 and TW6) respectively form three processing zones PZ1, PZ2, and PZ3 (hereinafter collectively referred to as "processing zones PZ"). That is, the 1st processing area PZ1 is formed in the position closest to the indexer part 3 by the pair of towers TW1 and TW2 opposed to each other with the conveyance path 5 interposed therebetween. Next, the second processing zone PZ2 is formed at a position close to the indexer section 3 and facing the pair of towers TW3 and TW4 across the conveyance path 5 . Next, a third processing zone PZ3 is formed at a position close to the indexer section 3 and facing one pair of towers TW5 and TW6 across the conveyance path 5 .

於第1處理區域PZ1與分度器部3間，配置有第1交接單元PASS1。對第1交接單元PASS1，於分度器3之相反側，配置有第1主搬送機器人CR1。第1主搬送機器人CR1於俯視時配置於一對塔TW1、TW2之間。對第1主搬送機器人CR1，於第1交接單元PASS1之相反側配置有第2交接單元PASS2。第1主搬送機器人CR1係以與第1交接單元PASS1、第1處理區域PZ1之塔TW1、TW2及第2交接單元PASS2對向之方式配置。A first delivery unit PASS1 is arranged between the first processing zone PZ1 and the indexer unit 3 . The first main transfer robot CR1 is arranged on the opposite side of the indexer 3 to the first delivery unit PASS1. The first main transfer robot CR1 is disposed between the pair of towers TW1 and TW2 in plan view. With respect to the first main transfer robot CR1, the second transfer unit PASS2 is arranged on the opposite side of the first transfer unit PASS1. The first main transfer robot CR1 is arranged so as to face the first delivery unit PASS1, the towers TW1 and TW2 of the first processing zone PZ1, and the second delivery unit PASS2.

對第2交接單元PASS2，於第1主搬送機器人CR1之相反側配置有第2主搬送機器人CR2。第2主搬送機器人CR2於俯視時配置於一對塔TW3、TW4之間，於俯視時配置於一對塔TW5、TW6之間。第2主搬送機器人CR2係以與第2交接單元PASS2及塔TW3～TW6對向之方式配置。The second main transfer robot CR2 is arranged on the opposite side of the first main transfer robot CR1 to the second delivery unit PASS2. The second main transfer robot CR2 is disposed between the pair of towers TW3 and TW4 in a plan view, and is disposed between the pair of towers TW5 and TW6 in a plan view. The second main transfer robot CR2 is arranged so as to face the second delivery unit PASS2 and the towers TW3 to TW6.

分度器機器人IR於該實施形態中係水平多關節臂型機器人。分度器機器人IR包含：保持基板W之手11、與手11耦合之多關節臂12、使多關節臂12繞鉛垂之旋轉軸線13旋轉之臂旋轉機構(未圖示)、及使多關節臂12上下移動之臂昇降機構(未圖示)。藉由如此之構成，分度器機器人IR使手11對保持於任意裝載埠LP之載具C及第1交接單元PASS1存取，對該存取端搬入/搬出基板W。藉此，分度器機器人IR於處理部4(更正確而言，係第1交接單元PASS1)與任意載具C之間搬送基板W。The indexer robot IR is a horizontal articulated arm type robot in this embodiment. The indexer robot IR includes a hand 11 holding the substrate W, a polyarticulated arm 12 coupled to the hand 11, an arm rotation mechanism (not shown) that rotates the polyarticulated arm 12 around a vertical rotation axis 13, and a polyarticulated arm 12. Up and down arm lifting mechanism (not shown). With this configuration, the indexer robot IR allows the hand 11 to access the carrier C and the first delivery unit PASS1 held in an arbitrary load port LP, and to carry in/out the substrate W to the access end. Thereby, the indexer robot IR transfers the board|substrate W between the processing part 4 (more precisely, the 1st delivery unit PASS1) and arbitrary carriers C.

對於第1主搬送機器人CR1及第2主搬送機器人CR2，可使用具有大致相同構成之基板搬送機器人。如此之基板搬送機器人較佳包含：一對手21、22，其保持基板W；一對手進退機構23、24，其使一對手21、22分別於水平方向進退；手旋轉機構(未圖示)，其使一對手進退機構23、24繞鉛垂之旋轉軸線25旋轉；及手昇降機構(未圖示)，其使手進退機構23、24上下移動。For the first main transfer robot CR1 and the second main transfer robot CR2, substrate transfer robots having substantially the same configuration can be used. Such a substrate conveying robot preferably includes: a pair of hands 21, 22, which hold the substrate W; a pair of hand advancing and retreating mechanisms 23, 24, which make a pair of hands 21, 22 advance and retreat in the horizontal direction; a hand rotation mechanism (not shown), It makes a pair of hand advance and retreat mechanisms 23, 24 rotate around a vertical axis of rotation 25; and a hand lift mechanism (not shown), which makes the hand advance and retreat mechanisms 23, 24 move up and down.

藉由如此之構成，第1主搬送機器人CR1及第2主搬送機器人CR2可以一手21、22將基板W自存取端取出，以另一手21、22對存取端搬入基板W。藉由將如此構成之基板搬送機器人應用於第1主搬送機器人CR1，第1主搬送機器人CR1係可使手21、22對於第1交接單元PASS1、形成塔TW、TW2之複數個處理單元MPC、及第2交接單元PASS2直接存取，可對該存取端搬入/搬出基板W。又，藉由將如上述構成之基板搬送機器人應用於第2主搬送機器人CR2，第2主搬送機器人CR2係可使手21、22對於第2交接單元PASS2、及形成塔TW3～TW6之複數個處理單元MPC直接存取，對該存取端搬入/搬出基板W。With this configuration, the first main transfer robot CR1 and the second main transfer robot CR2 can take out the substrate W from the access end with one hand 21 and 22 and carry the substrate W into the access end with the other hand 21 and 22 . By applying the substrate transfer robot thus constituted to the first main transfer robot CR1, the first main transfer robot CR1 enables the hands 21 and 22 to handle the first handover unit PASS1, the plurality of processing units MPC forming the towers TW and TW2, And the second delivery unit PASS2 directly accesses the substrate W to/from the access end. Furthermore, by applying the substrate transfer robot configured as described above to the second main transfer robot CR2, the second main transfer robot CR2 can enable the hands 21 and 22 to connect the hands 21 and 22 to the second transfer unit PASS2 and a plurality of towers TW3 to TW6. The processing unit MPC directly accesses the substrate W to/from the access end.

另，圖2係顯示分度器機器人IR具備1隻手11之例，但分度器機器人IR亦可具備2隻手11。該情形時，第1主搬送機器人CR1亦可具備4隻手21、22。同樣地，第2主搬送機器人CR2亦可具備4隻手21、22。分度器機器人IR具備2隻手11之情形時，分度器機器人IR可使用2隻手11同時保持2片基板W。因此，分度器機器人IR可對裝載埠LP上之載具C或第1交接單元PASS1，進行同時搬出2片基板W之同時搬出動作，及同時搬入2片基板W之同時搬入動作。2 shows an example in which the indexer robot IR has one hand 11 , but the indexer robot IR may have two hands 11 . In this case, the first main transfer robot CR1 may be provided with four hands 21 and 22 . Likewise, the second main transfer robot CR2 may include four hands 21 and 22 . When the indexer robot IR has two hands 11, the indexer robot IR can hold two substrates W using the two hands 11 at the same time. Therefore, the indexer robot IR can carry out the simultaneous carry-out operation of simultaneously carrying out two substrates W and the simultaneous carry-in operation of simultaneously carrying in the two substrates W to the carrier C or the first delivery unit PASS1 on the load port LP.

圖3係用於說明處理單元MPC之構成例之模式性剖視圖。圖3所示之處理單元MPC係以藥液洗淨基板表面之表面洗淨單元。處理單元MPC包含：設有供基板W通過之開口31a之處理腔室31、配置於處理腔室31內之處理杯32、及配置於處理杯32內之旋轉夾盤33。處理腔室31包含設有開口31a之隔板31b，及開閉開口31a之擋閘31c。FIG. 3 is a schematic cross-sectional view for explaining a configuration example of the processing unit MPC. The processing unit MPC shown in FIG. 3 is a surface cleaning unit for cleaning the surface of a substrate with a chemical solution. The processing unit MPC includes a processing chamber 31 provided with an opening 31 a for the substrate W to pass through, a processing cup 32 disposed in the processing chamber 31 , and a spin chuck 33 disposed in the processing cup 32 . The processing chamber 31 includes a partition 31b having an opening 31a, and a shutter 31c opening and closing the opening 31a.

處理單元MPC進而包含對基板W供給藥液之藥液噴嘴34，及對基板W供給清洗液(純水等)之清洗液噴嘴35。旋轉夾盤33一面水平保持1片基板W，一面繞通過基板W之中央部之鉛垂的旋轉軸線36旋轉。藥液噴嘴34及清洗液噴嘴35預先配置於處理腔室31內，向保持於旋轉夾盤33之基板W之上面分別噴出藥液及清洗液。藉由如此構成，可執行對基板W之上面供給藥液，以該藥液處理基板W之上面之藥液處理(基板處理步驟)；以清洗液洗掉基板W上面之藥液(基板處理步驟)；及以離心力甩掉基板W上之液滴之旋轉乾燥處理(基板處理步驟)。The processing unit MPC further includes a chemical solution nozzle 34 for supplying a chemical solution to the substrate W, and a cleaning solution nozzle 35 for supplying a cleaning solution (pure water or the like) to the substrate W. The spin chuck 33 rotates around a vertical rotation axis 36 passing through the center of the substrate W while holding one substrate W horizontally. The chemical liquid nozzles 34 and the cleaning liquid nozzles 35 are disposed in the processing chamber 31 in advance, and respectively spray the chemical liquid and the cleaning liquid onto the upper surface of the substrate W held by the spin chuck 33 . With this configuration, the chemical solution is supplied to the upper surface of the substrate W, and the chemical solution is processed (substrate processing step) with the chemical solution; ); and spin-drying (substrate processing step) in which the droplets on the substrate W are thrown off by centrifugal force.

圖4係用以說明處理單元MPC之其他構成例之模式性剖視圖。圖4所示之處理單元MPC係刷洗基板W之周端面之端面洗淨單元。處理單元MPC包含處理腔室31、配置於處理腔室31內之旋轉夾盤33、藥液噴嘴34、及刷洗基板W之端面之刮擦構件37。FIG. 4 is a schematic cross-sectional view for explaining another configuration example of the processing unit MPC. The processing unit MPC shown in FIG. 4 is an end surface cleaning unit for scrubbing the peripheral end surface of the substrate W. As shown in FIG. The processing unit MPC includes a processing chamber 31 , a spin chuck 33 disposed in the processing chamber 31 , a chemical liquid nozzle 34 , and a scraping member 37 for brushing the end surface of the substrate W.

旋轉夾盤33一面水平保持1片基板W，一面饒通過基板W之中央部之鉛垂的旋轉軸線36旋轉。藥液噴嘴34對保持於旋轉夾盤33之基板W表面供給藥液。若旋轉夾盤33於使基板W旋轉之狀態下將刮擦構件37按壓於基板W之周端面，則刮擦構件37擦過基板W之周端面全周。藉此，刷洗基板W之周端面全周(基板處理步驟)。The spin chuck 33 rotates around a vertical rotation axis 36 passing through the central portion of the substrate W while holding one substrate W horizontally. The chemical liquid nozzle 34 supplies chemical liquid to the surface of the substrate W held by the spin chuck 33 . When the spin chuck 33 presses the scraping member 37 against the peripheral end surface of the substrate W while the substrate W is rotating, the scraping member 37 wipes the entire circumference of the peripheral end surface of the substrate W. Thereby, the entire circumference of the peripheral end surface of the substrate W is brushed (substrate processing step).

圖5係用以說明基板處理裝置1之電性構成之方塊圖。基板處理裝置1具備作為控制裝置之電腦60。電腦60控制處理單元MPC1～MPC24、主搬送機器人CR1、CR2及分度器機器人IR。電腦60亦可為個人電腦(FA個人電腦)。FIG. 5 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 1 . The substrate processing apparatus 1 is provided with the computer 60 as a control apparatus. The computer 60 controls the processing units MPC1 to MPC24, the main transfer robots CR1 and CR2, and the indexer robot IR. The computer 60 may also be a personal computer (FA personal computer).

電腦60具備控制部61、輸入輸出部62及記憶部63。控制部61包含CPU等運算單元。輸入輸出部62包含顯示單元等輸出機器、鍵盤、指向裝置、及觸控面板等輸入機器。再者，輸入輸出部62包含用以與外部電腦即主機電腦64通信之通信模組。記憶部63包含固體記憶體裝置、硬碟驅動器等記憶裝置。The computer 60 includes a control unit 61 , an input/output unit 62 , and a memory unit 63 . The control unit 61 includes an arithmetic unit such as a CPU. The input/output unit 62 includes output devices such as a display unit, and input devices such as a keyboard, a pointing device, and a touch panel. Furthermore, the input-output unit 62 includes a communication module for communicating with the host computer 64, which is an external computer. The memory unit 63 includes memory devices such as solid-state memory devices and hard disk drives.

控制部61包含排程功能部65，及處理執行指示部66。排程功能部65將基板W自載具C搬出，以處理單元MPC1～MPC24中之一個以上處理該基板W後，為了將該處理後之基板W收納於載具C，而製作用以使基板處理裝置1之資源遵循時間序列作動之計劃(排程表)。處理執行指示部66遵循藉由排程功能部65製作之排程表，使基板處理裝置1之資源動作。所謂資源，係基板處理裝置1所具備之用以處理基板所使用之各種單元。具體而言，處理單元MPC1～MPC24、分度器機器人IR、主搬送機器人CR1、CR2及該等構成要素包含於基板處理裝置1之資源中。The control unit 61 includes a schedule function unit 65 and a process execution instruction unit 66 . The scheduler function unit 65 unloads the substrates W from the carrier C, processes the substrates W by one or more of the processing units MPC1 to MPC24, and then prepares the substrates W to accommodate the processed substrates W in the carrier C. The resources of the processing device 1 follow a schedule (schedule) of time-series actions. The process execution instruction unit 66 operates the resources of the substrate processing apparatus 1 in accordance with the schedule table created by the schedule function unit 65 . The so-called resources are various units used for processing a substrate included in the substrate processing apparatus 1 . Specifically, the processing units MPC1 to MPC24 , the indexer robot IR, the main transfer robots CR1 and CR2 , and these constituent elements are included in the resources of the substrate processing apparatus 1 .

記憶部63記憶各種資料等。記憶於記憶部63之資料中，包含控制部61執行之程式70、自主機電腦64接收之製程工作資料(製程工作資訊)80、藉由排程功能部65製作之排程表資料81、各處理單元MPC及各處理區域PZ之使用履歷資料82、及各處理區域PZ之搬送時間資料83。The memory unit 63 stores various data and the like. The data stored in the memory unit 63 includes the program 70 executed by the control unit 61 , the process work data (process work information) 80 received from the host computer 64 , the schedule table data 81 created by the schedule function unit 65 , each The usage history data 82 of the processing unit MPC and each processing area PZ, and the transfer time data 83 of each processing area PZ.

記憶於記憶部63之程式70包含：用以使控制部61作為排程功能部65作動之排程表製作程式71，及用以使控制部61作為處理執行指示部66作動之處理執行程式72。程式70可為預先安裝於電腦60者，亦可為自記錄媒體M送往記憶部63者，亦可為通過輸入輸出部62之通信模組送往記憶部63者。記錄媒體M例如係雷射碟片等之光碟或記憶卡等半導體記憶體。記錄媒體M係非暫時性有形媒體(non-transitory tangible media)之一例。The program 70 stored in the memory unit 63 includes a schedule creation program 71 for operating the control unit 61 as the schedule function unit 65 and a process execution program 72 for operating the control unit 61 as the process execution instruction unit 66 . The program 70 may be preinstalled in the computer 60 , may be sent from the recording medium M to the memory unit 63 , or may be sent to the memory unit 63 through the communication module of the input/output unit 62 . The recording medium M is, for example, an optical disc such as a laser disc or a semiconductor memory such as a memory card. The recording medium M is an example of a non-transitory tangible medium.

製程工作資料80包含賦予各基板W之製程工作(PJ)碼，及對應於製程工作碼之製程。製程係定義基板處理內容之資料，包含基板處理條件及基板處理順序。更具體而言，包含基板種類資訊、並行處理單元資訊、使用處理液資訊、及處理時間資訊等。基板種類資訊係表示處理對象之基板W之種類之資訊。基板W之種類之具體例係用以完成製品所使用之製品基板、用以維護處理單元MPC所使用、於製品製造中不使用之非製品基板等。所謂並行處理單元資訊，係指定可使用之處理單元MPC之處理單元指定資訊，可藉由指定之處理單元MPC進行並行處理。即，只要以指定處理單元中任一者處理基板W即可。所謂使用處理液資訊，係指定用以處理基板所使用之處理液之種類之資訊。具體例係指定藥液之種類及藥液之溫度之資訊。所謂處理時間資訊，係供給處理液之持續時間等。使用處理液資訊及處理時間資訊係處理條件資訊之一例。The process work data 80 includes a process work (PJ) code assigned to each substrate W, and a process corresponding to the process work code. Process is the data that defines the substrate processing content, including substrate processing conditions and substrate processing sequence. More specifically, it includes substrate type information, parallel processing unit information, used processing liquid information, processing time information, and the like. The substrate type information is information indicating the type of the substrate W to be processed. Specific examples of the types of substrates W are product substrates used to complete products, non-product substrates used for maintenance of the processing unit MPC, and non-product substrates not used in product manufacturing. The so-called parallel processing unit information is the processing unit specifying information of the processing unit MPC that can be used, and the parallel processing can be performed by the designated processing unit MPC. That is, the substrate W may be processed by any one of the designated processing units. The processing liquid information used is information specifying the type of processing liquid used for processing the substrate. A specific example is the information specifying the type of the medicinal solution and the temperature of the medicinal solution. The so-called processing time information refers to the duration of supply of the processing liquid and the like. The used processing liquid information and processing time information are examples of processing condition information.

所謂製程工作，是指為實施共通處理而對1片或複數片基板W進行之該處理。所謂製程工作碼，係用以識別製程工作之識別資訊(基板群識別資訊)。即，對賦予共通之製程工作碼之複數片基板W，實施利用與該製程工作碼建立對應之製程之共通處理。例如，對處理順序(自載具C取出之順序)連續之複數片基板W實施共通處理時，對該等複數片基板W賦予共通之製程工作碼。但，亦可能有對應於不同製程工作碼之基板處理內容(製程)為相同之情形。The process work refers to the processing performed on one or a plurality of substrates W in order to perform common processing. The so-called process work code is the identification information (substrate group identification information) used to identify the process work. That is, a common process using a process corresponding to the process work code is performed on a plurality of substrates W to which a common process work code is assigned. For example, when a common process is performed on a plurality of substrates W whose processing sequence (the sequence of taking out from the carrier C) is continuous, a common process work code is assigned to the plurality of substrates W. However, there may be cases where the substrate processing contents (processes) corresponding to different process work codes are the same.

控制部61自主機電腦64經由輸入輸出部62取得對於各基板W之製程工作資料，並記憶於記憶部63。製程工作資料之取得及記憶只要較對各基板W執行排程前進行即可。例如，亦可於將載具C保持於裝載埠LP1～LP4後，立即自主機電腦64對控制61賦予對應於收納於該載具C之基板W之製程工作資料。The control unit 61 acquires the process work data for each substrate W from the host computer 64 via the input/output unit 62 and stores it in the memory unit 63 . The acquisition and memory of the process work data only need to be performed before the scheduling of each substrate W is performed. For example, after holding the carrier C in the load ports LP1 to LP4, the control 61 may be given the process work data corresponding to the substrate W stored in the carrier C from the host computer 64 immediately.

排程功能部65基於存儲於記憶部63之製程工作資料80，計劃各製程工作，將表示該計劃之排程表資料81存儲於記憶部63。處理執行指示部66基於存儲於記憶部63之排程表資料81，控制分度器機器人IR、主搬送機器人CR1、CR2及處理單元MPC1～MPC24，藉此以基板處理裝置1執行製程工作。The schedule function part 65 plans each process work based on the process work data 80 stored in the memory part 63 , and stores in the memory part 63 schedule table data 81 indicating the plan. The process execution instruction unit 66 controls the indexer robot IR, the main transfer robots CR1 , CR2 , and the processing units MPC1 to MPC24 based on the schedule data 81 stored in the memory unit 63 , thereby executing the process operation with the substrate processing apparatus 1 .

圖6係用以說明藉由排程功能部65執行之處理例之流程圖。更具體而言，表示藉由電腦60之控制部61執行排程表製作程式71，而以特定之控制週期重複執行之處理。換言之，於排程表製作程式71，以使電腦60執行圖6所示之處理之方式，組入步驟群。FIG. 6 is a flowchart for explaining an example of processing performed by the schedule function unit 65 . More specifically, the control unit 61 of the computer 60 executes the schedule creation program 71, and shows the process of repeating execution at a specific control cycle. In other words, in the schedule creation program 71, the step group is incorporated in a manner to make the computer 60 execute the processing shown in FIG. 6 .

主機電腦64對控制部61賦予製程工作資料，由控制部61指示開始藉由該製程工作資料定義之製程工作，即，開始基板處理(步驟S1)。控制部61接收該製程工作資料，並存儲於記憶部63。排程功能部65使用該製程工作資料，進行用以執行製程工作之排程。製程工作之開始亦可由作業者操作輸入輸出部62之操作部而指示。The host computer 64 assigns the process work data to the control unit 61, and the control unit 61 instructs to start the process work defined by the process work data, that is, to start the substrate processing (step S1). The control unit 61 receives the process work data and stores it in the memory unit 63 . The scheduling function part 65 uses the process work data to perform a schedule for executing the process work. The start of the process work can also be instructed by the operator operating the operation unit of the input/output unit 62 .

排程功能部65對經賦予製程工作資料所含之製程工作(PJ)碼之1片以上基板W，逐片依序執行排程。首先，排程功能部65參照對應於製程工作資料之製程，基於該製程之並行處理單元資訊，特定出用以處理基板W可使用之1個以上處理單元MPC(步驟S2)。接著，排程功能部65執行用以選擇應使用於基板處理之1個處理區域PZ之處理區域選擇處理(步驟S3)。處理區域選擇處理之細節於下文敘述。The scheduling function unit 65 sequentially executes the scheduling for one or more substrates W to which the process work (PJ) code included in the process work data is assigned. First, the scheduling function unit 65 refers to the process corresponding to the process work data, and specifies one or more processing units MPC that can be used for processing the substrate W based on the parallel processing unit information of the process (step S2 ). Next, the schedule function part 65 executes a process area selection process for selecting one process area PZ to be used for the substrate process (step S3). Details of the processing region selection process are described below.

接著，排程功能部65製作用以處理1片基板W之臨時時間表(步驟S4)。例如，處理區域選擇處理中，選擇第1處理區域PZ1，於對應於製程工作資料之製程之並行處理單元資訊中，包含第1處理區域PZ1之所有處理單元MPC1～MPC8。即，考慮遵循該製程之基板處理於8個處理單元MPC1～MPC8之任一者中均可執行之情形。該情形時，該基板W通過之路徑為8個。即，用以處理該基板W可選擇之路徑為通過處理單元MPC1～MPC8之任一者之8個路徑。因此，排程功能部65對該1片基板W製作對應於該8個路徑之臨時時間表。Next, the scheduling function unit 65 creates a temporary schedule for processing one substrate W (step S4). For example, in the processing area selection process, the first processing area PZ1 is selected, and all the processing units MPC1-MPC8 of the first processing area PZ1 are included in the parallel processing unit information of the process corresponding to the process work data. That is, consider the case where the substrate processing following this process can be performed in any one of the eight processing units MPC1 to MPC8. In this case, the number of paths through which the substrate W passes is eight. That is, the selectable paths for processing the substrate W are 8 paths through any one of the processing units MPC1 to MPC8. Therefore, the scheduling function unit 65 creates a temporary schedule corresponding to the eight paths for the one substrate W. As shown in FIG.

圖7A係顯示對應於通過處理單元MPC1之路徑之臨時時間表。該臨時時間表包含：表示藉由分度器機器人IR自載具C搬出(Get)基板W之區塊；表示藉由分度器機器人IR向第1交接單元PASS1搬入(Put)該基板W之區塊；表示藉由第1主搬送機器人CR1自第1交接單元PASS1搬出(Get)該基板W之區塊；表示藉由第1主搬送機器人CR1向處理單元MPC1搬入(Put)該基板W之區塊；表示藉由處理單元MPC1對該基板W之處理之處理區塊；表示藉由第1主搬送機器人CR1自處理單元MPC1搬出(Get)已處理之基板W之區塊；表示藉由第1主搬送機器人CR1向第1交接單元PASS1搬入(Put)該基板W之區塊；表示藉由分度器機器人IR自第1交接單元PASS1搬出(Get)該基板W之區塊；及表示藉由分度器機器人IR向載具C搬入(Put)該基板W之區塊。排程功能部65藉由以時間軸上不互相重疊之方式依序配置該等區塊，而製作臨時時間表。Figure 7A shows a provisional schedule corresponding to the path through processing unit MPC1. The temporary schedule includes: a block representing the unloading (Get) of the substrate W from the carrier C by the indexer robot IR; a block representing the placing (Put) of the substrate W to the first handover unit PASS1 by the indexer robot IR; The block of the substrate W that is carried out (Get) from the first transfer unit PASS1 by the first main transfer robot CR1; the block of the substrate W that is put in (Put) to the processing unit MPC1 by the first main transfer robot CR1; The processing block for the processing of the substrate W by the processing unit MPC1; represents the block where the processed substrate W is transported (Get) from the processing unit MPC1 by the first main transfer robot CR1; represents the block by the first main transfer robot CR1 carries (Put) the block of the substrate W to the first transfer unit PASS1; indicates that the block of the substrate W is carried out (Get) from the first transfer unit PASS1 by the indexer robot IR; Tool C is put into the block of the substrate W. The scheduling function unit 65 creates a temporary schedule by sequentially arranging the blocks so as not to overlap each other on the time axis.

若製作使用處理單元MPC1之臨時時間表，則排程功能部65對相同基板W製作對應於分別通過處理單元MPC2～MPC8之7條路徑之相同的7個臨時時間表(將處理區塊分別配置於處理單元MPC2～MPC8之臨時時間表)。如此，對1片基板W製作合計8個臨時時間表。並且，所製作之臨時時間表作為排程表資料81之一部分存儲於記憶部63。於臨時時間表之製作階段，未考慮與其他基板W相關之區塊之干涉(時間軸上之互相重疊)。When the provisional schedule using the processing unit MPC1 is created, the scheduler function unit 65 creates seven provisional schedules for the same substrate W corresponding to the seven paths passing through the processing units MPC2 to MPC8 (separately arranged processing blocks). Temporary schedule in processing units MPC2-MPC8). In this way, a total of eight provisional schedules are created for one substrate W. In addition, the created temporary schedule is stored in the memory unit 63 as a part of the schedule data 81 . In the production stage of the provisional timetable, the interference of blocks related to other substrates W (overlapping each other on the time axis) is not considered.

若排程功能部65結束製作對應於1片基板W之所有臨時時間表(步驟S5)，則執行主排程(步驟S6～S9)。所謂主排程，係以不使製作之臨時時間表之區塊與各資源之其他區塊重複之方式，將其配置於時間軸上。將藉由主排程製作之排程表資料存儲於記憶部63。When the schedule function part 65 completes the production of all the temporary schedules corresponding to one substrate W (step S5 ), the main schedule is executed (steps S6 to S9 ). The so-called master schedule is arranged on the time axis in such a way that the blocks of the created temporary schedule do not overlap with other blocks of each resource. The schedule data created by the master schedule is stored in the memory unit 63 .

若進而具體說明，則排程功能部65選擇製作完之複數個臨時時間表中之一者，取得一個構成該臨時時間表之區塊(步驟S6)。此時取得之區塊係未配置之區塊中配置於臨時時間表之時間軸上最早位置之區塊。再者，排程功能部65檢索可配置該取得之區塊之位置(步驟S7)，於該檢索出之位置配置該區塊(步驟S8)。各區塊係配置為同一資源於相同時間不重複使用，且於時間軸上最早位置。同樣動作對於構成所選擇之臨時時間表之所有區塊重複執行(步驟S9)。如此，藉由配置構成所選擇之臨時時間表之所有區塊，而完成對應於該臨時時間表之主排程。該主排程係對製作之所有臨時時間表執行(步驟S10)。即，有可以8個處理單元MPC1～MPC8之任一者處理基板W之情形時，執行8個主排程。To be more specific, the schedule function unit 65 selects one of the plurality of temporary schedules that have been created, and acquires one block constituting the temporary schedule (step S6 ). The block obtained at this time is the block located at the earliest position on the time axis of the temporary schedule among the unallocated blocks. Furthermore, the scheduling function part 65 searches for a position where the acquired block can be arranged (step S7), and arranges the block at the searched position (step S8). Each block is configured so that the same resource is not reused at the same time and is at the earliest position on the time axis. The same action is repeated for all the blocks constituting the selected temporary schedule (step S9). In this way, by configuring all the blocks constituting the selected temporary schedule, the main schedule corresponding to the temporary schedule is completed. The main schedule is executed for all the temporary schedules produced (step S10). That is, when there is a case where any one of the eight processing units MPC1 to MPC8 can process the substrate W, eight main schedules are executed.

若結束該8個主排程，則進行單元選擇處理(步驟S11)。單元選擇處理中，選擇1個主排程，即，選擇通過1個處理單元MPC之主排程，藉此選擇處理1片基板W之處理單元MPC。單元選擇處理中，處理該基板W，選擇返回至載具C之時刻最早之1個主排程(步驟S11，單元選擇步驟)。When the eight main schedules are completed, the unit selection process is performed (step S11). In the cell selection process, one master schedule is selected, that is, the master schedule that passes through one processing unit MPC is selected, whereby the processing unit MPC for processing one substrate W is selected. In the cell selection process, the substrate W is processed, and one main schedule with the earliest time to return to the carrier C is selected (step S11, cell selection step).

若存在基板W返回至載具C之時刻相等之複數個主排程時(步驟S12：是)，則選擇使用自上次使用後經過時間最長之處理單元MPC，即單元最終使用時刻最早之處理單元MPC之主排程(步驟S13，單元選擇步驟)。藉此，可以均等地使用1個處理區域PZ內之處理單元MPC之方式，選擇處理單元MPC。If there are multiple main schedules with the same time when the substrate W returns to the carrier C (step S12: Yes), the processing unit MPC with the longest elapsed time since the last use is selected to be used, that is, the processing unit with the earliest final use time Main schedule of cell MPC (step S13, cell selection step). Thereby, the processing unit MPC can be selected by using the processing unit MPC in one processing area PZ equally.

存在複數個使用單元最終時刻最早之處理單元MPC之主排程時(步驟S14：是)，選擇使用編號較小(即預先附加之優先順序較高)之處理單元MPC之主排程(步驟S15，單元選擇步驟)。例如，留有使用處理單元MPC1之主排程及使用處理單元MPC2之主排程作為候補之情形時，由於處理單元MPC1較處理單元MPC2末尾之編號更小，故選擇使用處理單元MPC1之主排程。When there are a plurality of master schedules of the processing unit MPC with the earliest usage unit final time (step S14: Yes), the master schedule of the processing unit MPC with the smaller number (ie, the higher priority added in advance) is selected (step S15 ) , unit selection step). For example, when the main schedule using the processing unit MPC1 and the main schedule using the processing unit MPC2 are reserved as candidates, since the processing unit MPC1 has a smaller number at the end of the processing unit MPC2, the main schedule using the processing unit MPC1 is selected. Procedure.

如此，若選擇對應於1個臨時時間表之1個主排程，則結束對該1片基板W之排程(步驟S16)。並且，將表示所選擇之主排程之排程資料存儲於記憶部63。處理執行指示部66於其後之任意時點，實際開始對該基板W之處理(步驟S17，基板搬送步驟及基板處理步驟)。即，開始藉由分度器機器人IR將基板W自載具C搬出，藉由主搬送機器人CR1、CR2向處理單元MPC搬送基板W之基板搬送動作。In this way, if one main schedule corresponding to one temporary schedule is selected, the schedule for one substrate W is ended (step S16 ). Then, schedule data indicating the selected main schedule is stored in the memory unit 63 . The process execution instructing unit 66 actually starts the process of the substrate W at any point thereafter (step S17 , the substrate conveying step and the substrate processing step). That is, the substrate transfer operation of transferring the substrate W from the carrier C by the indexer robot IR and transferring the substrate W to the processing unit MPC by the main transfer robots CR1 and CR2 is started.

若排程功能部65結束對於1片基板W之排程，則將處理該基板W之處理單元MPC之單元最終使用時刻登錄於記憶部63(步驟S18)。再者，排程功能部65求出該處理單元MPC所屬之處理區域PZ之可投入率，並登錄於記憶部63(步驟S19)。可投入率之細節於下文敘述。單元最終使用時刻及可投入率係使用履歷資料82(參照圖5)之一例。並且，自步驟S3至步驟S20之一連串動作係對構成製程工作之所有基板W依序執行(步驟S20)。When the scheduling function part 65 completes the scheduling for one substrate W, it registers the unit final use time of the processing unit MPC processing the substrate W in the memory part 63 (step S18). Furthermore, the schedule function part 65 obtains the availability rate of the processing area PZ to which the processing unit MPC belongs, and registers it in the memory part 63 (step S19). Details of the available rate are described below. The unit final use time and availability rate are examples of the use history data 82 (see FIG. 5 ). And, a series of actions from step S3 to step S20 are sequentially performed on all the substrates W constituting the process work (step S20 ).

處理區域選擇步驟(步驟S3)中，若選擇第2處理區域PZ2，則排程功能部65對1片基板W製作對應於分別通過處理單元MPC9～MPC16之8條路徑之8個臨時時間表(將處理區塊分別配置於處理單元MPC9～MPC16之臨時時間表)。藉此，對1片基板W製作合計8個臨時時間表。In the process area selection step (step S3 ), when the second process area PZ2 is selected, the scheduler function unit 65 creates 8 temporary schedules ( The processing blocks are respectively allocated to the temporary schedules of the processing units MPC9-MPC16). Thereby, a total of eight temporary schedules are created for one substrate W.

圖7B係顯示對應於通過處理單元MPC9之路徑之臨時時間表。該臨時時間表包含：表示藉由分度器機器人IR自載具C搬出(Get)基板W之區塊；表示藉由分度器機器人IR向第1交接單元PASS1搬入(Put)該基板W之區塊；表示藉由第1主搬送機器人CR1自第1交接單元PASS1搬出(Get)該基板W之區塊；表示藉由第1主搬送機器人CR1向第2交接單元PASS2搬入(Put)該基板W之區塊；表示藉由第2主搬送機器人CR2自第2交接單元PASS2搬出(Get)該基板W之區塊；表示藉由第2主搬送機器人CR2向處理單元MPC9搬入(Put)該基板W之區塊；表示藉由處理單元MPC9對該基板W之處理之處理區塊；表示藉由第2主搬送機器人CR2自處理單元MPC9搬出(Get)已處理之基板W之區塊；表示藉由第2主搬送機器人CR2向第2交接單元PASS2搬入(Put)該基板W之區塊；表示藉由第1主搬送機器人CR1自第2交接單元PASS2搬出(Get)該基板之區塊；表示藉由第1主搬送機器人CR1向第1交接單元PASS1搬入(Put)該基板W之區塊；表示藉由分度器機器人IR自第1交接單元PASS1搬出(Get)該基板W之區塊；及表示藉由分度器機器人IR向載具C搬入(Put)該基板W之區塊。排程功能部65藉由以時間軸上不互相重疊之方式依序配置該等區塊，而製作臨時時間表。Figure 7B shows a provisional schedule corresponding to the path through processing unit MPC9. The temporary schedule includes: a block representing the unloading (Get) of the substrate W from the carrier C by the indexer robot IR; a block representing the placing (Put) of the substrate W to the first handover unit PASS1 by the indexer robot IR; The block of the substrate W is carried out (Get) from the first transfer unit PASS1 by the first main transfer robot CR1; the block of the substrate W is put in (Put) by the first main transfer robot CR1 to the second transfer unit PASS2 ; Indicates the block of the substrate W that is carried out (Get) from the second transfer unit PASS2 by the second main transfer robot CR2; Indicates the block of the substrate W that is put in (Put) by the second main transfer robot CR2 to the processing unit MPC9 ; Indicates the processing block of the substrate W processed by the processing unit MPC9; Indicates the block where the processed substrate W is removed (Get) from the processing unit MPC9 by the second main transfer robot CR2; The transfer robot CR2 carries (Put) the block of the substrate W to the second transfer unit PASS2; indicates that the block of the substrate W is transferred (Get) from the second transfer unit PASS2 by the first main transfer robot CR1; The main transfer robot CR1 carries in (Put) the block of the substrate W to the first transfer unit PASS1; indicates the block of the substrate W that is carried out (Get) from the first transfer unit PASS1 by the indexer robot IR; and indicates the indexer robot The IR carries (Put) the block of the substrate W to the carrier C. The scheduling function unit 65 creates a temporary schedule by sequentially arranging the blocks so as not to overlap each other on the time axis.

處理區域選擇處理(步驟S3)中，若選擇第3處理區域PZ3，則排程功能部65對1片基板W製作對應於分別通過處理單元MPC17～MPC24之8條路徑之8個臨時時間表(將處理區域分別配置於處理單元MPC17～MPC24之臨時時間表)。藉此，對1片基板W製作合計8個臨時時間表。圖7C係顯示對應於通過處理單元MPC17之路徑之臨時時間表。該臨時時間表與圖7B之臨時時間表大致相同。In the process area selection process (step S3 ), when the third process area PZ3 is selected, the scheduler function unit 65 creates 8 temporary schedules ( The processing areas are respectively allocated to the temporary schedules of the processing units MPC17 to MPC24). Thereby, a total of eight temporary schedules are created for one substrate W. FIG. 7C shows a provisional schedule corresponding to the path through processing unit MPC17. The provisional schedule is substantially the same as the provisional schedule of Figure 7B.

圖8係用以說明處理區域選擇處理(圖6之步驟S3)之一例之流程圖。圖9A及圖9B係顯示記憶於記憶部63(參照圖5)之處理區域資料之一例。圖10A～圖10E係顯示記憶於記憶部63之可投入率、區域最終使用時刻、最舊腔室數及有效腔室數之一例。FIG. 8 is a flowchart for explaining an example of the processing area selection process (step S3 in FIG. 6 ). FIGS. 9A and 9B show an example of processing area data stored in the memory unit 63 (see FIG. 5 ). FIGS. 10A to 10E show an example of the availability rate, the area final use time, the oldest number of chambers, and the number of valid chambers stored in the memory unit 63 .

有效腔室數係屬於相同處理區域PZ之複數個處理單元MPC中可使用(有效)之處理單元MPC之數量。最舊腔室數係屬於相同處理區域PZ之複數個處理單元MPC中單元最終使用時刻最早之有效處理單元MPC之數量。可投入率係表示同一處理區域PZ之最舊腔室數相對於有效腔室數之比例之百分率((最舊腔室數/有效腔室數)×100)。處理區域資料、可投入率、區域最終使用時刻、最舊腔室數及有效腔室數作為使用履歷資料82記憶於每個處理區域。The number of effective chambers is the number of usable (effective) processing units MPC among a plurality of processing units MPC belonging to the same processing zone PZ. The number of the oldest chambers is the number of the effective processing units MPC with the earliest unit final use time among the plurality of processing units MPC belonging to the same processing zone PZ. The available rate represents the percentage of the ratio of the number of the oldest chambers to the number of effective chambers in the same processing zone PZ ((number of oldest chambers/number of effective chambers)×100). The processing area data, the availability rate, the final use time of the area, the number of the oldest chambers, and the number of effective chambers are stored in each processing area as the use history data 82 .

於記憶部63，如圖9A所示，對於所有處理單元MPC，登錄有表示處理區域PZ之設定之處理區域資料。該例中，對於處理單元MPC1～MPC8，登錄表示屬於第1處理區域PZ1之處理區域資料「1」。又，對於處理單元MPC9～MPC16，登錄表示屬於第2處理區域PZ2之處理區域資料「2」。再者，對於處理單元MPC17～MPC24，登錄表示屬於第3處理區域PZ3之處理區域資料「3」。In the memory unit 63, as shown in FIG. 9A, processing area data indicating the setting of the processing area PZ is registered for all the processing units MPC. In this example, for the processing units MPC1 to MPC8, the processing area data "1" indicating that it belongs to the first processing area PZ1 is registered. In addition, to the processing units MPC9 to MPC16, processing area data "2" indicating that it belongs to the second processing area PZ2 is registered. Furthermore, in the processing units MPC17 to MPC24, processing area data "3" indicating that it belongs to the third processing area PZ3 is registered.

任一處理單元MPC為了維護等而無法利用於基板處理時，如圖9B所示，替代識別處理區域PZ之資料(編號)，而登錄表示無效之資料(例如，表示「維護中」之資料等)。所謂維護，例如係定期計劃之處理單元MPC之洗淨等。When any one of the processing units MPC cannot be used for substrate processing for maintenance or the like, as shown in FIG. 9B , the data (number) for identifying the processing area PZ is replaced, and the data indicating invalid (for example, the data indicating “in maintenance”, etc. ). The so-called maintenance is, for example, regularly scheduled cleaning of the processing unit MPC.

排程功能部65選擇應處理各基板W之處理區域PZ時，基於記憶於記憶部63(參照圖5)之處理區域資料，判定各處理單元MPC是屬於哪一處理區域PZ，及是否存在無效之處理單元MPC(圖8之步驟S31，所屬確認步驟)。並且，排程功能部65自記憶部63讀出所有處理單元MPC1～MPC24之單元最終使用時刻(圖8之步驟S32，單元最終使用時刻取得步驟)。When the scheduling function unit 65 selects the processing area PZ to be processed for each substrate W, it determines to which processing area PZ each processing unit MPC belongs and whether there is an invalidation based on the processing area data stored in the memory unit 63 (see FIG. 5 ). The processing unit MPC (step S31 in FIG. 8 , belongs to the confirmation step). Then, the scheduling function unit 65 reads out the unit final use time of all the processing units MPC1 to MPC24 from the memory unit 63 (step S32 in FIG. 8 , the unit final use time acquisition step).

再者，排程功能部65對於所有處理單元MPC1～MPC24，自記憶部63讀出自裝載埠LP上之載具C對處理單元MPC搬送基板W所需要之搬送時間。其後，排程功能部65對於各個處理單元MPC，自單元最終使用時刻減去搬送時間，將所得值(時刻)作為修正單元最終使用時刻，登錄於記憶部63(圖8之步驟S33，修正單元最終使用時刻計算步驟)。修正單元最終使用時刻包含於使用履歷資料82中。修正單元最終使用時刻之細節於下文敘述。Furthermore, the scheduling function unit 65 reads out, from the memory unit 63 , the transfer time required to transfer the substrate W from the carrier C on the load port LP to the processing unit MPC for all the processing units MPC1 to MPC24 . After that, the scheduler function unit 65 subtracts the conveyance time from the unit final use time for each processing unit MPC, and registers the obtained value (time) as the corrected unit final use time in the memory unit 63 (step S33 in FIG. 8 , correction). The unit finally uses the moment calculation step). The last use time of the correction unit is included in the use history data 82 . The details of the time of final use of the correction unit are described below.

圖10A～圖10E係顯示於所有處理單元MPC1～MPC24可使用(有效)且初始化之狀態下，進行應用相同製程之複數片基板W之排程之情形之記憶部63內之使用履歷資料82之變遷之一例。FIGS. 10A to 10E show the usage history data 82 in the memory section 63 in a state in which all the processing units MPC1 to MPC24 are available (valid) and initialized, in a situation where scheduling of a plurality of substrates W applying the same process is performed An example of change.

如圖10A所示，於進行第1片基板W之排程前，各處理區域PZ之可投入率(最舊腔室數/有效腔室數×100)為100%，各處理區域PZ之區域最終使用時刻為初始值(圖10中為0)，各處理區域PZ之最舊腔室數為8。各處理區域PZ之有效腔室數為8。應用於複數片基板W之製程中，指定所有處理單元MPC1～MPC24作為並行處理單元。As shown in FIG. 10A , before the scheduling of the first substrate W is performed, the availability ratio (number of oldest chambers/number of effective chambers×100) of each processing zone PZ is 100%, and the area of each processing zone PZ is 100%. The final use time is the initial value (0 in FIG. 10 ), and the number of the oldest chambers in each processing zone PZ is 8. The number of effective chambers in each processing zone PZ is eight. In a process applied to a plurality of substrates W, all the processing units MPC1 to MPC24 are designated as parallel processing units.

若將基板處理裝置1初始化，則所有單元最終使用時刻亦初始化，登錄初始值(例如0)作為所有處理單元MPC1～MPC24之單元最終使用時刻。單元最終使用時刻為初始值以外值之情形時，使用搬送時間修正單元最終使用時刻，但單元最終時刻為初始值之情形時，登錄初始值作為修正單元最終使用時刻。圖10A所示例中，由於所有處理單元MPC1～MPC24之修正單元最終使用時刻為初始值，故所有區域最終使用時刻為初始值(圖10A中為0)。When the substrate processing apparatus 1 is initialized, the final use time of all the units is also initialized, and an initial value (for example, 0) is registered as the unit final use time of all the processing units MPC1 to MPC24. When the final use time of the unit is a value other than the initial value, use the transport time to correct the final use time of the unit, but when the final time of the unit is the initial value, register the initial value as the corrected final use time of the unit. In the example shown in FIG. 10A , since the final use times of the correction units of all the processing units MPC1 to MPC24 are initial values, the final use times of all areas are initial values (0 in FIG. 10A ).

選擇處理第1片基板W之處理區域PZ時，排程功能部65檢索所有處理區域PZ1～PZ3中區域最終使用時刻最早之處理區域PZ，確認複數個處理區域PZ是否包含於候補區域中(圖8之步驟S34，第1檢索步驟)。候補區域為1個之情形時，即，僅見到1個區域最終使用時刻最早之處理區域PZ之情形時(圖8之步驟S34：否)，用於第1片基板W而選擇該處理區域PZ(圖8之步驟S35，區域選擇步驟)。圖10A所示例中，由於所有區域最終使用時刻為初始值，故所有處理區域PZ1～PZ3相當於區域最終使用時刻最早之處理區域PZ。When the processing area PZ for processing the first substrate W is selected, the scheduling function unit 65 searches all the processing areas PZ1 to PZ3 for the processing area PZ with the earliest area final use time, and confirms whether the plurality of processing areas PZ are included in the candidate areas (Fig. Step S34 of 8, the first retrieval step). When there is only one candidate area, that is, when only the processing area PZ with the earliest final use time of one area is found (step S34 in FIG. 8 : NO), the processing area PZ is selected for the first substrate W (Step S35 in FIG. 8, area selection step). In the example shown in FIG. 10A , since the final use time of all areas is the initial value, all the processing areas PZ1 to PZ3 correspond to the processing area PZ with the earliest area final use time.

見到複數個區域最終使用時刻最早之處理區域PZ之情形時(圖8之步驟S34：是)，排程功能部65於候補區域所含之複數個處理區域PZ中，檢索可投入率((最舊腔室數/有效腔室數)×100)最大之處理區域PZ，確認相當於該檢索條件之複數個處理區域PZ是否包含於候補區域中(圖8之步驟S36，第2檢索步驟)。見到之處理區域PZ為1個之情形時，即，可投入率最大之處理區域PZ為1個之情形時(圖8之步驟S36：否)，用於第1片基板W而選擇該處理區域PZ(圖8之步驟S37，區域選擇步驟及選擇步驟)。圖10A所示例中，由於所有單元最終使用時刻為初始值，故所有處理區域PZ1～PZ3相當於可投入率最大之處理區域PZ。When the processing area PZ with the earliest final use time of the plurality of areas is found (step S34 in FIG. 8: YES), the scheduling function unit 65 searches the plurality of processing areas PZ included in the candidate area for the availability rate ((( The number of oldest chambers/number of effective chambers)×100) is the largest processing area PZ, and it is checked whether a plurality of processing areas PZ corresponding to the search conditions are included in the candidate area (step S36 in FIG. 8 , the second search step) . When there is only one processing zone PZ seen, that is, when there is one processing zone PZ with the largest input rate (step S36 in FIG. 8 : NO), the processing is selected for the first substrate W Area PZ (step S37 in FIG. 8, area selection step and selection step). In the example shown in FIG. 10A , since the final use time of all the units is the initial value, all the processing areas PZ1 to PZ3 correspond to the processing area PZ with the highest availability rate.

見到複數個可投入率最大之處理區域PZ之情形時(圖8之步驟S36：是)，排程功能部65用於第1片基板W而選擇候補區域所含之複數個處理區域PZ中區域編號最小(即，預先附加之優先順序最高)之處理區域PZ(圖8之步驟S38，區域選擇步驟、第3檢索步驟及選擇步驟)。圖10A所示例中，選擇區域編號最小之第1處理區域PZ1，作為處理第1片基板W之處理區域PZ。因此，如圖10B所示，第1處理區域PZ1之最舊腔室數自8減少至7，第1處理區域PZ1之可投入率減少至87.5%((7/8)×100)。When a plurality of processing areas PZ with the largest input rate are found (step S36 in FIG. 8 : Yes), the scheduling function unit 65 selects the plurality of processing areas PZ included in the candidate area for the first substrate W The processing area PZ with the smallest area number (ie, the highest priority added in advance) is the processing area PZ (step S38 in FIG. 8 , the area selection step, the third search step, and the selection step). In the example shown in FIG. 10A , the first processing zone PZ1 with the smallest zone number is selected as the processing zone PZ for processing the first substrate W. Therefore, as shown in FIG. 10B , the number of the oldest chambers in the first processing zone PZ1 is reduced from 8 to 7, and the availability ratio of the first processing zone PZ1 is reduced to 87.5% ((7/8)×100).

若對第1片基板W之排程結束，則排程功能部65推測第1片基板W結束之時刻，將推測之時刻作為處理第1片基板W之處理單元MPC之單元最終使用時刻，登錄於記憶部63。其後，排程功能部65自處理第1片基板W之處理單元MPC之單元最終使用時刻，減去搬運至該處理單元MPC之搬送時間，將所得值(時刻)作為修正單元最終使用時刻登錄於記憶部63。即，對於處理第1片基板W之處理單元MPC，將新的單元最終使用時刻及修正單元最終使用時刻登錄於記憶部63。對於第2片之後的基板W，亦係若排程結束，則對用於以處理基板W而選擇之處理單元MPC，將新的單元最終使用時刻及修正單元最終使用時刻登錄於記憶部63。When the scheduling for the first substrate W is completed, the schedule function unit 65 estimates the time at which the first substrate W ends, and registers the estimated time as the unit final use time of the processing unit MPC that processes the first substrate W. in the memory unit 63 . After that, the scheduling function unit 65 subtracts the transfer time to the processing unit MPC from the unit final use time of the processing unit MPC that processes the first substrate W, and registers the obtained value (time) as the corrected unit final use time. in the memory unit 63 . That is, for the processing unit MPC that processes the first substrate W, the new unit final use time and the corrected unit final use time are registered in the memory unit 63 . Also for the second and subsequent substrates W, when the scheduling is completed, the new unit final use time and the corrected unit final use time are registered in the memory unit 63 for the processing unit MPC selected for processing the substrate W.

若對於第1片基板W之排程結束，則將處理第1片基板W之處理單元MPC之單元最終使用時刻及修正單元最終使用時刻變更為初始值以外之值。區域最終使用時刻係屬於相同處理區域PZ之所有處理單元MPC之修正單元最終使用時刻中最早之時刻。即使變更處理第1片基板W之處理單元MPC之修正單元最終使用時刻，與該處理單元MPC屬於相同處理區域PZ之其他處理單元MPC之修正單元最終使用時刻仍為初始值。因此，處理第1片基板W之處理單元MPC所屬之處理區域PZ之區域最終使用時刻仍為初始值不變。When the scheduling for the first substrate W is completed, the unit final use time and the corrected unit final use time of the processing unit MPC that processes the first substrate W are changed to values other than the initial values. The area final use time is the earliest time among the correction unit final use times of all the processing units MPC belonging to the same processing area PZ. Even if the final use time of the correction unit of the processing unit MPC processing the first substrate W is changed, the final use time of the correction unit of the other processing units MPC belonging to the same processing area PZ as the processing unit MPC is still the initial value. Therefore, the final use time of the area of the processing area PZ to which the processing unit MPC processing the first substrate W belongs is still the initial value.

選擇處理第2片基板W之處理區域PZ時，與上述同樣地，選擇3個處理區域PZ中之任一者。圖10B所示例中，各處理區域PZ之區域最終使用時刻為初始值，但由於第2處理區域PZ2及第3處理區域PZ3相當於可投入率最大之處理區域PZ，故用於第2片基板W而選擇區域編號最小之第2處理區域PZ2。因此，如圖10C所示，第2處理區域PZ2之最舊腔室數自8減少至7，第2處理區域PZ2之可投入率減少至87.5%((7/8)×100)。When selecting the processing area PZ for processing the second substrate W, any one of the three processing areas PZ is selected in the same manner as described above. In the example shown in FIG. 10B , the area final use time of each processing area PZ is the initial value, but since the second processing area PZ2 and the third processing area PZ3 correspond to the processing area PZ with the largest input rate, they are used for the second substrate W to select the second processing zone PZ2 with the smallest zone number. Therefore, as shown in FIG. 10C , the number of the oldest chambers in the second processing zone PZ2 is reduced from 8 to 7, and the availability ratio of the second processing zone PZ2 is reduced to 87.5% ((7/8)×100).

選擇處理第3片基板W之處理區域PZ時，亦與上述同樣地，選擇3個處理區域PZ中之任一者。圖10C所示例中，各處理區域PZ之區域最終使用時刻為初始值，但由於第3處理區域PZ3之可投入率最高，故用於第3片基板W而選擇第3處理區域PZ3。因此，如圖10D所示，第3處理區域PZ3之最舊腔室數自8減少至7，第3處理區域PZ3之可投入率減少至87.5%((7/8)×100)。When selecting the processing area PZ for processing the third substrate W, any one of the three processing areas PZ is selected in the same manner as described above. In the example shown in FIG. 10C , the final use time of each processing zone PZ is the initial value, but the third processing zone PZ3 is selected for the third substrate W because the availability rate of the third processing zone PZ3 is the highest. Therefore, as shown in FIG. 10D , the number of the oldest chambers in the third processing zone PZ3 is reduced from 8 to 7, and the availability ratio of the third processing zone PZ3 is reduced to 87.5% ((7/8)×100).

選擇處理第4片基板W之處理區域PZ時，亦與上述同樣地，選擇3個處理區域PZ中之任一者。圖10D所示例中，各處理區域PZ之區域最終使用時刻為初始值，由於可投入率於3個處理區域PZ之間相等，故用於第4片基板W而選擇區域編號最小之第1處理區域PZ1。因此，如圖10E所示，第1處理區域PZ1之最舊腔室數自7減少至6，第1處理區域PZ1之可投入率減少至75%((6/8)×100)。When selecting the processing area PZ for processing the fourth substrate W, any one of the three processing areas PZ is selected in the same manner as described above. In the example shown in FIG. 10D , the area final use time of each processing area PZ is the initial value, and since the available input rate is equal among the three processing areas PZ, the first processing with the smallest area number is selected for the fourth substrate W Zone PZ1. Therefore, as shown in FIG. 10E , the number of the oldest chambers in the first processing zone PZ1 is reduced from 7 to 6, and the availability ratio of the first processing zone PZ1 is reduced to 75% ((6/8)×100).

處理第5片以後之基板W之處理區域PZ亦與上述同樣地，選擇3個處理區域PZ中之任一者。若製作使用屬於相同處理區域PZ之所有處理單元MPC之排程表，則對於屬於該處理區域PZ之各個處理單元MPC，將單元最終使用時刻及修正單元最終使用時刻變更為初始值以外的值。該情形時，排程功能部65將屬於該處理區域PZ之所有處理單元MPC之修正單元最終使用使用中最早之時刻，作為區域最終使用時刻，登錄於記憶部63。藉此，將區域最終使用時刻變更為初始值以外的值。Also in the processing region PZ for processing the fifth and subsequent substrates W, any one of the three processing regions PZ is selected in the same manner as described above. If a schedule table using all the processing cells MPC belonging to the same processing zone PZ is created, the cell final use time and the corrected cell final use time are changed to values other than the initial values for each processing cell MPC belonging to the processing zone PZ. In this case, the scheduling function unit 65 registers the earliest time in the final use of the correction unit of all the processing units MPC belonging to the processing area PZ in the memory unit 63 as the area final use time. Thereby, the area final use time is changed to a value other than the initial value.

圖11A～圖11E係顯示如圖9B所示為了維護而將屬於第1處理區域PZ1之4個處理單元MPC5～MPC8設為無效(不可使用)，於其他所有處理單元MPC1～MP4及MPC9～MPC24可使用(有效)且初始化之狀態下，進行應用相同製程之複數片基板W之排程之情形之記憶部63內之使用履歷資料82之變遷之一例。11A to 11E show that as shown in FIG. 9B , the four processing units MPC5 to MPC8 belonging to the first processing area PZ1 are disabled (unusable) for maintenance, and all other processing units MPC1 to MP4 and MPC9 to MPC24 An example of the transition of the usage history data 82 in the memory section 63 in the state of being usable (valid) and initialized, in the case of performing the scheduling of a plurality of substrates W applying the same process.

如圖11A所示，於進行第1片基板W之排程前，各處理區域PZ之可投入率為100%，各處理區域PZ之區域最終使用時刻為初始值(圖11中為0)，第1處理區域PZ1之最舊腔室數為4，第2處理區域PZ2及第3處理區域PZ3之最舊腔室數為8。第1處理區域PZ1之有效腔室數為4，第2處理區域PZ2及第3處理區域PZ3之有效腔室數為8。應用於複數片基板W之製程中，指定所有處理單元MPC1～MPC24作為並行處理單元。As shown in FIG. 11A , before the scheduling of the first substrate W is performed, the availability rate of each processing area PZ is 100%, and the final use time of each processing area PZ is the initial value (0 in FIG. 11 ). The number of the oldest chambers in the first processing zone PZ1 is four, and the number of the oldest chambers in the second processing zone PZ2 and the third processing zone PZ3 is eight. The number of effective chambers in the first processing zone PZ1 is four, and the number of effective chambers in the second processing zone PZ2 and the third processing zone PZ3 is eight. In a process applied to a plurality of substrates W, all the processing units MPC1 to MPC24 are designated as parallel processing units.

選擇處理第1片基板W之處理區域PZ時，如圖11A所示，區域最終使用時刻於任一處理區域PZ皆為初始值，可投入率於3個處理區域PZ之間相等，故排程功能部65選擇區域編號最小之第1處理區域PZ1，作為處理第1片基板W之處理區域PZ，進行以第1處理區域PZ1處理第1片基板W之排程。因此，如圖11B所示，第1處理區域PZ1之最舊腔室數自4減少至3，第1處理區域PZ1之可投入率減少至75%((3/4)×100)。When the processing zone PZ for processing the first substrate W is selected, as shown in FIG. 11A , the final use time of the zone is the initial value in any processing zone PZ, and the available input rate is equal among the three processing zones PZ, so the schedule is The function unit 65 selects the first processing zone PZ1 with the smallest zone number as the processing zone PZ for processing the first substrate W, and performs a schedule for processing the first substrate W in the first processing zone PZ1. Therefore, as shown in FIG. 11B , the number of the oldest chambers in the first processing zone PZ1 is reduced from 4 to 3, and the availability ratio of the first processing zone PZ1 is reduced to 75% ((3/4)×100).

選擇處理第2片基板W之處理區域PZ時，如圖11B所示，區域最終使用時刻於任一處理區域PZ皆為初始值，由於第2處理區域PZ2及第3處理區域PZ3之可投入率最高，故排程功能部65用於第2片基板W而選擇區域編號最小之第2處理區域PZ2。因此，如圖11C所示，第2處理區域PZ2之最舊腔室數自8減少至7，第2處理區域PZ2之可投入率減少至87.5%((7/8)×100)。When the processing zone PZ for processing the second substrate W is selected, as shown in FIG. 11B , the final use time of the zone is the initial value in any processing zone PZ, due to the availability ratio of the second processing zone PZ2 and the third processing zone PZ3 Therefore, the scheduling function part 65 selects the second processing zone PZ2 with the smallest zone number for the second substrate W. Therefore, as shown in FIG. 11C , the number of the oldest chambers in the second processing zone PZ2 is reduced from 8 to 7, and the availability ratio of the second processing zone PZ2 is reduced to 87.5% ((7/8)×100).

選擇處理第3片基板W之處理區域PZ時，如圖11C所示，區域最終使用時刻於任一處理區域PZ皆為初始值，由於第3處理區域PZ3之可投入率最高，故排程功能部65用於第3片基板W而選擇第3處理區域PZ3。因此，如圖11D所示，第3處理區域PZ3之最舊腔室數自8減少至7，第3處理區域PZ3之可投入率減少至87.5%((7/8)×100)。When the processing zone PZ for processing the third substrate W is selected, as shown in FIG. 11C , the final use time of the zone is the initial value in any processing zone PZ. Since the availability rate of the third processing zone PZ3 is the highest, the scheduling function The part 65 is used for the third substrate W to select the third processing zone PZ3. Therefore, as shown in FIG. 11D , the number of the oldest chambers in the third processing zone PZ3 is reduced from 8 to 7, and the availability ratio of the third processing zone PZ3 is reduced to 87.5% ((7/8)×100).

選擇處理第4片基板W之處理區域PZ時，如圖11D所示，區域最終使用時刻於任一處理區域PZ皆為初始值，由於第2處理區域PZ2及第3處理區域PZ3之可投入率最高，故排程功能部65用於第4片基板W而選擇區域編號最小之第2處理區域PZ2。因此，如圖11E所示，第2處理區域PZ2之最舊腔室數自7減少至6，第2處理區域PZ2之可投入率減少至75%((6/8)×100)。When selecting the processing zone PZ for processing the fourth substrate W, as shown in FIG. 11D , the final use time of the zone is the initial value in any processing zone PZ, because the availability ratio of the second processing zone PZ2 and the third processing zone PZ3 Therefore, the scheduling function part 65 selects the second processing zone PZ2 with the smallest zone number for the fourth substrate W. Therefore, as shown in FIG. 11E , the number of the oldest chambers in the second processing zone PZ2 is reduced from 7 to 6, and the availability ratio of the second processing zone PZ2 is reduced to 75% ((6/8)×100).

選擇處理第5片基板W之處理區域PZ時，如圖11E所示，區域最終使用時刻於任一處理區域PZ皆為初始值，由於第3處理區域PZ3之可投入率最高，故排程功能部65用於第4片基板W而選擇第3處理區域PZ3。因此，如圖11F所示，第3處理區域PZ3之最舊腔室數自7減少至6，第3處理區域PZ3之可投入率減少至75%((6/8)×100)。When the processing zone PZ for processing the fifth substrate W is selected, as shown in FIG. 11E , the final use time of the zone is the initial value in any processing zone PZ. Since the availability rate of the third processing zone PZ3 is the highest, the scheduling function The portion 65 is used for the fourth substrate W to select the third processing region PZ3. Therefore, as shown in FIG. 11F , the number of the oldest chambers in the third processing zone PZ3 is reduced from 7 to 6, and the availability ratio of the third processing zone PZ3 is reduced to 75% ((6/8)×100).

圖12係顯示所有單元最終使用時刻變更為初始值以外之值後之單元最終使用時刻、搬送時間及修正單元最終使用時刻之一例。FIG. 12 shows an example of the unit final use time, the transfer time, and the corrected unit final use time after the final use time of all units is changed to a value other than the initial value.

圖12係顯示第1～3片基板W依處理單元MPC1、處理單元MPC9、處理單元MPC17之順序，搬入至該等處理單元MPC1、MPC9及MPC17之例。圖12所示例中，處理單元MPC1之單元最終使用時刻為12點00分00秒，處理單元MPC9之單元最終使用時刻為12點00分15秒，處理單元MPC17之單元最終使用時刻為12點00分30秒。FIG. 12 shows an example in which the first to third substrates W are loaded into the processing units MPC1 , MPC9 , and MPC17 in the order of the processing unit MPC1 , the processing unit MPC9 , and the processing unit MPC17 . In the example shown in Figure 12, the final use time of the unit of the processing unit MPC1 is 12:00:00, the final use time of the unit of the processing unit MPC9 is 12:00:15, and the final use time of the unit of the processing unit MPC17 is 12:00 30 seconds.

又，圖12係顯示第1處理區域PZ1之搬送時間為10秒，第2處理區域PZ2之搬送時間為15秒，第3處理區域PZ3之搬送時間為15秒之例。各處理區域PZ之搬送時間登錄於搬送時間資料83(參照圖5)(搬送時間登錄步驟)。處理單元MPC1及處理單元MPC2雖屬於第1處理區域PZ1，但自裝載埠LP至處理單元MPC1之距離嚴格而言，與自裝載埠LP至處理單元MPC2之距離不同。因此，基板W搬送至處理單元MPC1之搬送時間嚴格而言，與基板W搬送至處理單元MPC2之搬送時間不同。但，圖12所示例中，若係屬於相同處理區域PZ之處理單元MPC，則視為搬送時間大致相等，將1個搬送時間登錄於屬於相同處理區域PZ之所有處理單元MPC。12 shows an example in which the transport time of the first processing zone PZ1 is 10 seconds, the transport time of the second processing zone PZ2 is 15 seconds, and the transport time of the third processing zone PZ3 is 15 seconds. The transfer time of each processing area PZ is registered in the transfer time data 83 (see FIG. 5 ) (transfer time registration step). Although the processing unit MPC1 and the processing unit MPC2 belong to the first processing zone PZ1, strictly speaking, the distance from the load port LP to the processing unit MPC1 is different from the distance from the load port LP to the processing unit MPC2. Therefore, strictly speaking, the conveyance time for the substrate W to be conveyed to the processing unit MPC1 is different from the conveyance time for the substrate W to be conveyed to the processing unit MPC2. However, in the example shown in FIG. 12 , if the processing units MPC belong to the same processing area PZ, the transfer time is considered to be approximately equal, and one transfer time is registered to all the processing units MPC belonging to the same processing area PZ.

排程功能部65自處理單元MPC1之單元最終使用時刻減去第1處理區域PZ1之搬送時間，登錄所得值(時刻)作為處理單元MPC1之修正單元最終使用時刻。具體而言，排程功能部65將11點59分50秒(12點00分00秒-10秒)登錄為處理單元MPC1之修正單元最終使用時刻。同樣地，排程功能部65將12點00分00秒(12點00分15秒-15秒)登錄為處理單元MPC9之修正單元最終使用時刻，將12點00分15秒(12點00分30秒-15秒)登錄為處理單元MPC17之修正單元最終使用時刻。The schedule function unit 65 subtracts the transfer time of the first processing area PZ1 from the unit final use time of the processing unit MPC1, and registers the resulting value (time) as the corrected unit final use time of the processing unit MPC1. Specifically, the schedule function unit 65 registers 11:59:50 (12:00:00-10 seconds) as the correction unit final use time of the processing unit MPC1. Similarly, the schedule function unit 65 registers 12:00:00 (12:00:15-15 seconds) as the correction unit final use time of the processing unit MPC9, and registers 12:00:15 (12:00 30 seconds-15 seconds) is registered as the final use time of the correction unit of the processing unit MPC17.

接著，排程功能部65將屬於相同處理區域PZ之所有有效處理單元MPC之修正單元最終使用時刻中最早之時刻，作為該處理區域PZ之區域最終使用時刻，登錄於記憶部63(區域最終使用時刻特定步驟)。圖12所示例之情形時，處理單元MPC1之修正單元最終使用時刻於處理單元MPC1～MPC8之修正單元最終使用時刻中最早。又，圖12所示例之情形時，處理單元MPC9之修正單元最終使用時刻於處理單元MPC9～MPC16之修正單元最終使用時刻中最早，處理單元MPC17之修正單元最終使用時刻於處理單元MPC17～MPC24之修正單元最終使用時刻中最早。因此，排程功能部65登錄處理單元MPC1之修正單元最終使用時刻，作為第1處理區域PZ1之區域最終使用時刻，登錄處理單元MPC9之修正單元最終使用時刻，作為第2處理區域PZ2之區域最終使用時刻，登錄處理單元MPC17之修正單元最終使用時刻，作為第1處理區域PZ1之區域最終使用時刻。Next, the scheduling function unit 65 registers the earliest time among the correction unit final use times of all valid processing units MPC belonging to the same processing area PZ as the area final use time of the processing area PZ in the memory unit 63 (area final use time). time-specific steps). In the case illustrated in FIG. 12 , the final use time of the correction unit of the processing unit MPC1 is the earliest among the final use times of the correction units of the processing units MPC1 to MPC8. In addition, in the case shown in FIG. 12 , the final use time of the correction unit of the processing unit MPC9 is the earliest among the final use times of the correction units of the processing units MPC9 to MPC16, and the final use time of the correction unit of the processing unit MPC17 is between the processing units MPC17 to MPC24. The correction unit is the earliest in the final use time. Therefore, the scheduling function unit 65 registers the final use time of the correction unit of the processing unit MPC1 as the area final use time of the first processing area PZ1, and registers the correction unit final use time of the processing unit MPC9 as the area final use time of the second processing area PZ2 The use time is registered as the final use time of the correction unit of the processing unit MPC17 as the area final use time of the first processing area PZ1.

圖13A～圖13E係顯示所有單元最終使用時刻變更為初始值以外的值後，進行應用相同製程之複數片基板W之排程之情形之記憶部63內之使用履歷資料82之變遷之一例。FIGS. 13A to 13E show an example of the transition of the usage history data 82 in the memory section 63 in the case where the scheduling of a plurality of substrates W applying the same process is performed after the final usage time of all cells is changed to a value other than the initial value.

如圖13A所示，於進行第1片基板W之排程前，各處理區域PZ之可投入率為12.5((1/8)×100)，各處理區域PZ之區域最終使用時刻係初始值以外之各不相同的值，各處理區域PZ之最舊腔室數為1。各處理區域PZ之有效腔室數為8。應用於複數片基板W之製程中，指定所有處理單元MPC1～MPC24作為並行處理單元。As shown in FIG. 13A , before the scheduling of the first substrate W, the input rate of each processing zone PZ is 12.5 ((1/8)×100), and the final use time of each processing zone PZ is the initial value Other than the different values, the number of the oldest chambers in each processing zone PZ is 1. The number of effective chambers in each processing zone PZ is eight. In a process applied to a plurality of substrates W, all the processing units MPC1 to MPC24 are designated as parallel processing units.

圖13A係顯示第1處理區域PZ1之區域最終使用時刻為12點00分00秒，第2處理區域PZ2之區域最終使用時刻為12點00分30秒，第3處理區域PZ3之區域最終使用時刻為12點01分00秒。選擇處理第1片基板W之處理區域PZ時，如圖13A所示，由於第1處理區域PZ1之區域最終使用時刻最早，故排程功能部65選擇第1處理區域PZ1，作為處理第1片基板W之處理區域PZ。Fig. 13A shows that the last use time of the first processing zone PZ1 is 12:00:00, the last use time of the second processing zone PZ2 is 12:00:30, and the last use time of the third processing zone PZ3 It is 12:01:00. When selecting the processing zone PZ for processing the first substrate W, as shown in FIG. 13A , since the final use time of the first processing zone PZ1 is the earliest, the scheduling function unit 65 selects the first processing zone PZ1 as the first processing zone PZ1 The processing zone PZ of the substrate W.

圖13B係顯示對屬於第1處理區域PZ1之所有處理單元MPC1～MPC8中，以修正單元最終使用時刻最早之處理單元MPC，處理第1片基板W之例。因此，第1處理區域PZ1之區域最終使用時刻變更為與進行第1片基板W之排程前之時刻不同之時刻。圖13B係顯示第1處理區域PZ1之區域最終使用時刻自12點00分00秒變更為12點01分30秒之例。13B shows an example of processing the first substrate W with the processing unit MPC having the earliest correction unit final use time among all the processing units MPC1 to MPC8 belonging to the first processing zone PZ1. Therefore, the area final use time of the first processing area PZ1 is changed to a time different from the time before the scheduling of the first substrate W is performed. FIG. 13B shows an example in which the area final use time of the first processing area PZ1 is changed from 12:00:00 to 12:01:30.

選擇處理第2片基板W之處理區域PZ時，如圖13B所示，由於第2處理區域PZ2之區域最終使用時刻(12點00分30秒)最早，故排程功能部65選擇第2處理區域PZ2，作為處理第2片基板W之處理區域PZ，製作以屬於第2處理區域PZ2之所有處理單元MPC9～MPC16中，修正單元最終使用時刻最早之處理單元MPC處理基板W之排程表。因此，如圖13C所示，第2處理區域PZ2之區域最終使用時刻自12點00分30秒更新為12點02分00秒。When selecting the processing zone PZ for processing the second substrate W, as shown in FIG. 13B , since the last use time (12:00:30) of the second processing zone PZ2 is the earliest, the scheduler function unit 65 selects the second processing The area PZ2, as the processing area PZ for processing the second substrate W, is prepared by modifying the schedule table for processing the substrate W by the processing unit MPC with the earliest unit final use time among all the processing units MPC9 to MPC16 belonging to the second processing area PZ2. Therefore, as shown in FIG. 13C , the area final use time of the second processing area PZ2 is updated from 12:00:30 to 12:02:00.

選擇處理第3片基板W之處理區域PZ時，如圖13C所示，由於第3處理區域PZ3之區域最終使用時刻(12點01分00秒)最早，故排程功能部65選擇第3處理區域PZ3，作為處理第3片基板W之處理區域PZ，製作使屬於第3處理區域PZ3之所有處理單元MPC17～MPC24中，修正單元最終使用時刻最早之處理單元MPC處理基板W之排程表。因此，如圖13D所示，第3處理區域PZ3之區域最終使用時刻自12點01分00秒更新為12點02分30秒。When selecting the processing zone PZ for processing the third substrate W, as shown in FIG. 13C , since the last use time (12:01:00 sec) of the third processing zone PZ3 is the earliest, the scheduling function unit 65 selects the third processing The area PZ3 is used as the processing area PZ for processing the third substrate W, and a schedule table for processing the substrate W by the processing unit MPC whose final use time of the correction unit is the earliest among all the processing units MPC17 to MPC24 belonging to the third processing area PZ3 is created. Therefore, as shown in FIG. 13D , the area final use time of the third processing area PZ3 is updated from 12:01:00 to 12:02:30.

選擇處理第4片基板W之處理區域PZ時，如圖13D所示，由於第1處理區域PZ1之區域最終使用時刻(12點01分30秒)最早，故排程功能部65選擇第1處理區域PZ1，作為處理第4片基板W之處理區域PZ，製作以屬於第1處理區域PZ1之所有處理單元MPC1～MPC8中，修正單元最終使用時刻最早之處理單元MPC處理基板W之排程表。因此，如圖13E所示，第1處理區域PZ1之區域最終使用時刻自12點01分30秒更新為12點03分00秒。When selecting the processing zone PZ for processing the fourth substrate W, as shown in FIG. 13D , since the last use time (12:01:30) of the zone in the first processing zone PZ1 is the earliest, the scheduling function unit 65 selects the first processing The area PZ1, as the processing area PZ for processing the fourth substrate W, is prepared by modifying the schedule table for processing the substrate W by the processing unit MPC with the earliest unit final use time among all the processing units MPC1 to MPC8 belonging to the first processing area PZ1. Therefore, as shown in FIG. 13E , the area final use time of the first processing area PZ1 is updated from 12:01:30 to 12:03:00.

處理第5片以後之基板W之處理區域PZ亦與上述同樣地，自3個處理區域PZ中選擇區域最終使用時刻最早之處理區域PZ。但若有複數個區域最終使用時刻最早之處理區域PZ之情形時，自其中選擇可投入率最大之處理區域PZ。但是，依然剩餘複數個處理區域PZ之情形時，則選擇剩餘之複數個處理區域PZ中區域編號最小之處理區域PZ。In the processing area PZ for processing the fifth and subsequent substrates W, similarly to the above, the processing area PZ with the earliest final use time of the area is selected from the three processing areas PZ. However, if there are a plurality of processing areas PZ with the earliest final use time, the processing area PZ with the highest availability rate is selected from among them. However, when there are still a plurality of processing areas PZ remaining, the processing area PZ with the smallest area number among the remaining plurality of processing areas PZ is selected.

接著，針對基板W之處理時間減少之情形之排程進行說明。Next, the schedule in the case where the processing time of the substrate W is reduced will be described.

首先，參照圖14A～圖14F及圖15A～圖15B，針對第1實施形態之排程進行說明，其後，參照圖16A～圖16F及圖17，針對第1比較例之排程進行說明。First, the schedule of the first embodiment will be described with reference to FIGS. 14A to 14F and FIGS. 15A to 15B , and thereafter, the schedule of the first comparative example will be described with reference to FIGS. 16A to 16F and FIG. 17 .

圖14A～圖14F係顯示第1實施例之可投入率、區域最終使用時刻、最舊腔室數及有效腔室數之一例之表。圖14A～圖14F係顯示進行應用第1時間處理基板W之第1製程之複數片基板W之排程後，進行應用比第1處理時間短之第2處理時間處理基板W之第2製程之複數片基板W之排程之情形，記憶部63內之使用履歷資料82之變遷之一例。FIGS. 14A to 14F are tables showing an example of the availability rate, the area final use time, the number of oldest chambers, and the number of effective chambers in the first embodiment. FIGS. 14A to 14F show the second process of processing the substrates W by applying the second processing time shorter than the first processing time after the scheduling of the plurality of substrates W using the first process using the first processing time to process the substrates W is performed. In the case of scheduling of a plurality of substrates W, it is an example of the transition of the usage history data 82 in the memory unit 63 .

如圖14A所示，於進行第1片基板W之排程前，各處理區域PZ之可投入率為100%((8/8)×100)，各處理區域PZ之區域最終使用時刻為初始值(圖14A中為0)，各處理區域PZ之最舊腔室數為8。各處理區域PZ之有效腔室數為8。各單元最終使用時刻為初始值。第1製程及第2製程中，指定所有處理單元MPC1～MPC24作為並行處理單元。於第1製程指定之第1處理時間例如為240秒，於第2製程指定之第2處理時間例如為60秒。As shown in FIG. 14A , before the scheduling of the first substrate W, the availability rate of each processing zone PZ is 100% ((8/8)×100), and the final use time of each processing zone PZ is the initial value (0 in FIG. 14A ), the number of oldest chambers in each processing zone PZ is 8. The number of effective chambers in each processing zone PZ is eight. The final use time of each unit is the initial value. In the first process and the second process, all the processing units MPC1 to MPC24 are designated as parallel processing units. The first processing time specified in the first process is, for example, 240 seconds, and the second processing time specified in the second process is, for example, 60 seconds.

選擇處理應用第1製程之第1片基板W之處理區域PZ時，如圖14A所示，由於區域最終使用時刻於任一處理區域PZ皆為初始值，可投入率於3個處理區域PZ之間相等，故排程功能部65選擇區域編號最小之第1處理區域PZ1，作為處理第1片基板W之處理區域PZ。因此，如圖14B所示，第1處理區域PZ1之最舊腔室數自8減少至7，第1處理區域PZ1之可投入率減少至87.5%((7/8)×100)。When selecting the processing area PZ of the first substrate W to which the first process is applied, as shown in FIG. 14A , since the final use time of the area is the initial value in any processing area PZ, the available input rate is among the three processing areas PZ. Therefore, the scheduling function unit 65 selects the first processing zone PZ1 with the smallest zone number as the processing zone PZ for processing the first substrate W. Therefore, as shown in FIG. 14B , the number of the oldest chambers in the first processing zone PZ1 is reduced from 8 to 7, and the availability ratio of the first processing zone PZ1 is reduced to 87.5% ((7/8)×100).

選擇處理應用第1製程之第2片基板W之處理區域PZ時，如圖14B所示，由於區域最終使用時刻於任一處理區域PZ皆為初始值，第2處理區域PZ2及第3處理區域PZ3之可投入率最高，故排程功能部65用於第2片基板W而選擇區域編號最小之第2處理區域PZ2。因此，如圖14C所示，第2處理區域PZ2之最舊腔室數自8減少至7，第2處理區域PZ2之可投入率減少至87.5%((7/8)×100)。When selecting the processing area PZ of the second substrate W to which the first process is applied, as shown in FIG. 14B , since the final use time of the area is the initial value of any processing area PZ, the second processing area PZ2 and the third processing area Since PZ3 has the highest input rate, the scheduling function unit 65 selects the second processing area PZ2 with the smallest area number for the second substrate W. Therefore, as shown in FIG. 14C , the number of the oldest chambers in the second processing zone PZ2 is reduced from 8 to 7, and the availability ratio of the second processing zone PZ2 is reduced to 87.5% ((7/8)×100).

選擇處理應用處理時間與第1製程不同之第2製程之第3片基板W之處理區域PZ時，如圖14C所示，由於區域最終使用時刻於任一處理區域PZ皆為初始值，第3處理區域PZ3之可投入率最高，故排程功能部65用於第3片基板W而選擇第3處理區域PZ3。因此，如圖14D所示，第3處理區域PZ3之最舊腔室數自8減少至7，第3處理區域PZ3之可投入率減少至87.5%((7/8)×100)。When selecting the processing area PZ of the third substrate W of the second process whose processing time is different from that of the first process, as shown in FIG. 14C , since the final use time of the area is the initial value in any processing area PZ, the third The processing area PZ3 has the highest input rate, so the scheduling function unit 65 selects the third processing area PZ3 for the third substrate W. Therefore, as shown in FIG. 14D , the number of the oldest chambers in the third processing zone PZ3 is reduced from 8 to 7, and the availability ratio of the third processing zone PZ3 is reduced to 87.5% ((7/8)×100).

選擇處理應用第2製程之第4片基板W之處理區域PZ時，如圖14D所示，由於區域最終使用時刻於任一處理區域PZ皆為初始值，可投入率於3個處理區域PZ之間相等，故排程功能部65選擇區域編號最小之第1處理區域PZ1，作為處理第4片基板W之處理區域PZ。因此，如圖14E所示，第1處理區域PZ1之最舊腔室數自7減少至6，第1處理區域PZ1之可投入率減少至75%((6/8)×100)。When selecting the processing area PZ of the fourth substrate W in which the second process is applied, as shown in FIG. 14D , since the final use time of the area is the initial value in any processing area PZ, the available input rate is among the three processing areas PZ. Therefore, the scheduling function unit 65 selects the first processing zone PZ1 with the smallest zone number as the processing zone PZ for processing the fourth substrate W. Therefore, as shown in FIG. 14E , the number of the oldest chambers in the first processing zone PZ1 is reduced from 7 to 6, and the availability ratio of the first processing zone PZ1 is reduced to 75% ((6/8)×100).

選擇處理應用第2製程之第5片基板W之處理區域PZ時，如圖14E所示，由於區域最終使用時刻於任一處理區域PZ皆為初始值，第2處理區域PZ2及第3處理區域PZ3之可投入率最高，故排程功能部65用於第5片基板W而選擇區域編號最小之第2處理區域PZ2。因此，如圖14F所示，第2處理區域PZ2之最舊腔室數自7減少至6，第2處理區域PZ2之可投入率減少至75%((6/8)×100)。When selecting the processing area PZ of the fifth substrate W to which the second process is applied, as shown in FIG. 14E, since the final use time of the area is the initial value in any processing area PZ, the second processing area PZ2 and the third processing area The input rate of PZ3 is the highest, so the scheduling function part 65 selects the second processing area PZ2 with the smallest area number for the fifth substrate W. Therefore, as shown in FIG. 14F , the number of the oldest chambers in the second processing zone PZ2 is reduced from 7 to 6, and the availability ratio of the second processing zone PZ2 is reduced to 75% ((6/8)×100).

圖15A及圖15B係顯示第1實施例之排程表之時序圖。圖15A係顯示進行應用第1處理時間處理基板W之第1製程之第1～2片基板W1～W2之排程後之排程表之一例。圖15A所示例中，以由第1處理區域PZ1之處理單元MPC1處理第1片基板W1，由第2處理區域PZ2之處理單元MPC9處理第2片基板W2之方式，製作排程表。15A and 15B are timing charts showing the schedule table of the first embodiment. FIG. 15A shows an example of a schedule table after the first to second substrates W1 to W2 of the first process of processing the substrate W by applying the first processing time are scheduled. In the example shown in FIG. 15A , a schedule is created such that the first substrate W1 is processed by the processing unit MPC1 in the first processing zone PZ1 and the second substrate W2 is processed by the processing unit MPC9 in the second processing zone PZ2 .

圖15B係顯示進行應用第2處理時間處理基板W之第2製程之第3～6片基板W3～W6之排程後之排程表之一例。圖15B所示例中，以由第3處理區域PZ3之處理單元MPC17處理第3片基板W3，由第1處理區域PZ1之處理單元MPC2處理第4片基板W4之方式，製作排程表。又，圖15B所示例中，以由第2處理區域PZ2之處理單元MPC10處理第5片基板W5，由第3處理區域PZ3之處理單元MPC18處理第6片基板W6之方式，製作排程表。FIG. 15B shows an example of a schedule table after performing the scheduling of the third to sixth substrates W3 to W6 of the second process of processing the substrate W by applying the second processing time. In the example shown in FIG. 15B , a schedule is created such that the processing unit MPC17 in the third processing zone PZ3 processes the third substrate W3 and the processing unit MPC2 in the first processing zone PZ1 processes the fourth substrate W4. 15B , a schedule is created such that the processing unit MPC10 in the second processing zone PZ2 processes the fifth substrate W5 and the processing unit MPC18 in the third processing zone PZ3 processes the sixth substrate W6.

如圖15B所示，若使表示屬於相同處理區域PZ之所有處理單元MPC之修正單元最終使用時刻中最早時刻之區域最終使用時刻最初優先，選擇處理區域PZ，則不僅於基板W之處理時間不變化之情形，於基板W之處理時間減少之情形時，亦可均等地選擇所有處理區域PZ1～PZ3，可有效選擇空的處理單元MPC。因此，與使如後述之區域使用率最初優先，選擇處理區域PZ之情形相比，可提高基板處理裝置1之運轉率。As shown in FIG. 15B , if the final use time of the area representing the earliest time among the correction unit final use times of all the processing units MPC belonging to the same processing area PZ is given priority first, and the processing area PZ is selected, not only the processing time of the substrate W is different, In the case of the change, when the processing time of the substrate W is reduced, all the processing regions PZ1 to PZ3 can be equally selected, and the empty processing unit MPC can be effectively selected. Therefore, compared to the case where the processing zone PZ is selected with priority given to the area usage rate as described later, the operation rate of the substrate processing apparatus 1 can be improved.

接著，參照圖16A～圖16F及圖17，針對第1比較例之排程進行說明。Next, the schedule of the first comparative example will be described with reference to FIGS. 16A to 16F and FIG. 17 .

以下，針對並非基於區域最終使用時刻，而基於區域使用率為基準，選擇處理基板W之處理區域PZ之例進行說明。區域使用率係用以處理基板W所需要之時間除以處理該基板W之處理區域PZ之有效(可利用)處理單元MPC之數的值。若用以處理基板W所需要之時間為240秒，屬於處理該基板W之處理區域PZ之有效處理單元MPC之數為3，則區域使用率為80(=240/3)。Hereinafter, an example in which the processing area PZ of the processing substrate W is selected based on the area usage rate rather than the area final use time will be described. The area usage rate is a value obtained by dividing the time required for processing the substrate W by the number of effective (available) processing units MPC in the processing area PZ processing the substrate W. If the time required for processing the substrate W is 240 seconds, and the number of effective processing units MPC belonging to the processing area PZ processing the substrate W is 3, the area utilization rate is 80 (=240/3).

圖16A～圖16F所示之區域最終使用時刻並非意指屬於某處理區域PZ之所有處理單元MPC之修正單元最終使用時刻中最早之時刻，而意指屬於某處理區域PZ之所有處理單元MPC之單元最終使用時刻中最晚時刻。因此，若製作以屬於某處理區域PZ之1個處理單元MPC處理基板W之排程表，則屬於該處理區域PZ之其他處理單元MPC之單元最終使用時刻即使為初始值，該處理區域PZ之區域最終使用時刻亦變更為處理基板W之處理單元MPC之單元最終使用時刻。16A to 16F do not mean the earliest time of the final use time of the correction unit of all the processing units MPC belonging to a certain processing area PZ, but mean the time of the final use of all the processing units MPC belonging to a certain processing area PZ. The latest time in the final use time of the unit. Therefore, if a schedule table for processing the substrate W by one processing unit MPC belonging to a certain processing zone PZ is created, the final use time of the cells of the other processing units MPC belonging to the processing zone PZ is the initial value, and the processing zone PZ is The area final use time is also changed to the unit final use time of the processing unit MPC that processes the substrate W.

圖16A～圖16F係顯示第1比較例之區域使用率、區域最終使用時刻、有效腔室數之一例之表。圖16A～圖16F係顯示進行應用第1時間處理基板W之第1製程之複數片基板W之排程後，進行應用比第1處理時間短之第2處理時間處理基板W之第2製程之複數片基板W之排程之情形之記憶部63內之使用履歷資料82之變遷之一例。16A to 16F are tables showing an example of the area usage rate, the area final use time, and the number of effective chambers in the first comparative example. FIGS. 16A to 16F show the second process of processing the substrates W by applying the second processing time shorter than the first processing time after the scheduling of a plurality of substrates W using the first process using the first processing time to process the substrates W is performed. An example of the transition of the usage history data 82 in the memory section 63 in the case of scheduling of a plurality of substrates W.

如圖16A所示，於進行第1片基板W之排程前，各處理區域PZ之區域使用率為0，區域最終使用時刻為初始值(圖16A中為0)，各處理區域PZ之有效腔室數為3。第1製程及第2製程中，指定所有處理單元MPC1～MPC24作為並行處理單元。以第1製程指定之第1處理時間例如為240秒，以第2製程指定之第2處理時間例如為60秒。As shown in FIG. 16A , before the scheduling of the first substrate W is performed, the area usage rate of each processing area PZ is 0, the final use time of the area is the initial value (0 in FIG. 16A ), and the effective area of each processing area PZ The number of chambers is 3. In the first process and the second process, all the processing units MPC1 to MPC24 are designated as parallel processing units. The first processing time specified by the first process is, for example, 240 seconds, and the second processing time specified by the second process is, for example, 60 seconds.

選擇處理應用第1製程之第1片基板W之處理區域PZ時，如圖16A所示，由於區域使用率於任一處理區域PZ皆為0，區域最終使用時刻於任一處理區域PZ皆為初始值，故排程功能部65選擇區域編號最小之第1處理區域PZ1，作為處理第1片基板W之處理區域PZ。因此，如圖16B所示，第1處理區域PZ1之區域使用率增加。圖16B係顯示第1處理時間為240秒，第1處理區域PZ1之區域使用率自0增加至80(=240/3)之例。When the processing zone PZ of the first substrate W to which the first process is applied is selected, as shown in FIG. 16A , since the zone usage rate is 0 in any processing zone PZ, the final use time of the zone is 0 in any processing zone PZ As the initial value, the scheduling function unit 65 selects the first processing zone PZ1 with the smallest zone number as the processing zone PZ for processing the first substrate W. Therefore, as shown in FIG. 16B , the area usage rate of the first processing area PZ1 increases. FIG. 16B shows an example in which the first processing time is 240 seconds, and the area usage rate of the first processing area PZ1 is increased from 0 to 80 (=240/3).

選擇處理應用第1製程之第2片基板W之處理區域PZ時，如圖16B所示，由於第2處理區域PZ2及第3處理區域ZP3之區域使用率為0，第2處理區域PZ2及第3處理區域PZ3之區域最終使用時刻為初始值，故排程功能部65選擇區域編號最小之第2處理區域PZ2，作為處理第2片基板W之處理區域PZ。因此，如圖16C所示，第2處理區域PZ2之區域使用率增加。圖16C係顯示第1處理時間為240秒，第2處理區域PZ2之區域使用率自0增加至80(=240/3)之例。When the processing area PZ of the second substrate W to which the first process is applied is selected, as shown in FIG. 16B , since the area usage rate of the second processing area PZ2 and the third processing area ZP3 is 0, the second processing area PZ2 and the third processing area 3. The final use time of the processing zone PZ3 is the initial value, so the scheduling function unit 65 selects the second processing zone PZ2 with the smallest zone number as the processing zone PZ for processing the second substrate W. Therefore, as shown in FIG. 16C, the area usage rate of the second processing area PZ2 increases. FIG. 16C shows an example in which the first processing time is 240 seconds, and the area usage rate of the second processing area PZ2 is increased from 0 to 80 (=240/3).

選擇處理應用處理時間與第1製程不同之第2製程之第3片基板W之處理區域PZ時，如圖16C所示，由於第3處理區域PZ3之區域使用率最小，故排程功能部65選擇第3處理區域PZ3，作為處理第3片基板W之處理區域PZ。因此，如圖16D所示，第3處理區域PZ3之區域使用率增加。圖16D係顯示第2處理時間為60秒，第2處理區域PZ2之區域使用率自0增加至20(=60/3)之例。When selecting the processing area PZ of the third substrate W in the second process whose processing time is different from that of the first process, as shown in FIG. 16C , since the area usage rate of the third processing area PZ3 is the smallest, the scheduling function unit 65 The third processing zone PZ3 is selected as the processing zone PZ for processing the third substrate W. Therefore, as shown in FIG. 16D, the area usage rate of the third processing area PZ3 increases. FIG. 16D shows an example in which the second processing time is 60 seconds, and the area usage rate of the second processing area PZ2 is increased from 0 to 20 (=60/3).

選擇處理應用第2製程之第4片基板W之處理區域PZ時，如圖16D所示，由於第3處理區域PZ3之區域使用率仍然最小，故排程功能部65選擇第3處理區域PZ3，作為處理第4片基板W之處理區域PZ。因此，如圖16E所示，第3處理區域PZ3之區域使用率增加。圖16E係顯示第2處理區域PZ2之區域使用率增加至40(=120/3)之例。When the processing area PZ of the fourth substrate W to which the second process is applied is selected, as shown in FIG. 16D, since the area usage rate of the third processing area PZ3 is still the smallest, the scheduling function unit 65 selects the third processing area PZ3, As the processing area PZ in which the fourth substrate W is processed. Therefore, as shown in FIG. 16E, the area usage rate of the third processing area PZ3 increases. FIG. 16E shows an example in which the area usage rate of the second processing area PZ2 is increased to 40 (=120/3).

選擇處理應用第2製程之第5片基板W之處理區域PZ時，如圖16E所示，由於第3處理區域PZ3之區域使用率仍然最小，故排程功能部65選擇第3處理區域PZ3，作為處理第5片基板W之處理區域PZ。因此，如圖16F所示，第3處理區域PZ3之區域使用率增加。圖16F係顯示第2處理區域PZ2之區域使用率增加至60(=180/3)之例。When the processing area PZ of the fifth substrate W to which the second process is applied is selected, as shown in FIG. 16E, since the area usage rate of the third processing area PZ3 is still the smallest, the scheduling function unit 65 selects the third processing area PZ3, As the processing area PZ for processing the fifth substrate W. Therefore, as shown in FIG. 16F, the area usage rate of the third processing area PZ3 increases. FIG. 16F shows an example in which the area usage rate of the second processing area PZ2 is increased to 60 (=180/3).

選擇處理應用第2製程之第6片基板W之處理區域PZ時，如圖16F所示，由於第3處理區域PZ3之區域使用率仍然最小，故排程功能部65選擇第3處理區域PZ3，作為處理第6片基板W之處理區域PZ。因此，第3處理區域PZ3之區域使用率增加。具體而言，第2處理區域PZ2之區域使用率增加至80(=240/3)。藉此，第3處理區域PZ3之區域使用率與第1處理區域PZ1及第2處理區域PZ2之區域使用率相等。When the processing area PZ of the sixth substrate W to which the second process is applied is selected, as shown in FIG. 16F, since the area usage rate of the third processing area PZ3 is still the smallest, the scheduling function unit 65 selects the third processing area PZ3, As the processing zone PZ for processing the sixth substrate W. Therefore, the area usage rate of the third processing area PZ3 increases. Specifically, the area usage rate of the second processing area PZ2 is increased to 80 (=240/3). Thereby, the area usage rate of the third processing area PZ3 is equal to the area usage rates of the first processing area PZ1 and the second processing area PZ2.

圖17係顯示以區域使用率最初優先，選擇處理區域PZ，進行第3～6片基板W3～W6之排程後之排程表之時序圖。FIG. 17 is a timing chart showing the schedule table after the processing area PZ is selected and the third to sixth substrates W3 to W6 are scheduled with priority given to the area utilization rate at the beginning.

如上述，基於區域使用率選擇處理區域PZ之情形時，用於第6片基板W6而選擇第3處理區域PZ3。因此，如圖17所示，即使於第1處理區域PZ1及第2處理區域PZ2有空的處理單元MPC，亦以由屬於第3處理區域PZ3之處理單元MPC17處理第6片基板W6之方式，製作排程表。因此，以第1處理區域PZ1或第2處理區域PZ2處理第6片基板W6之情形時，雖可馬上開始第6片基板W6之搬送，但以第3處理區域PZ3處理第6片基板W6之情形時，必須延遲開始搬送，直至處理單元MPC17結束處理第3片基板W3。As described above, when the processing zone PZ is selected based on the zone usage rate, the third processing zone PZ3 is selected for the sixth substrate W6. Therefore, as shown in FIG. 17 , even if there are vacant processing units MPC in the first processing area PZ1 and the second processing area PZ2, the sixth substrate W6 is processed by the processing unit MPC17 belonging to the third processing area PZ3. Make a schedule. Therefore, when the sixth substrate W6 is processed in the first processing zone PZ1 or the second processing zone PZ2, the conveyance of the sixth substrate W6 can be started immediately, but the third processing zone PZ3 is used to process the sixth substrate W6. In this case, the start of conveyance must be delayed until the processing unit MPC17 finishes processing the third substrate W3.

如由比較圖17及圖15B可知，任一情形時，第3片基板W3皆以由處理單元MPC17處理之方式被排程，但圖15B所示例中，以由處理單元MPC2處理第4片基板W4，由處理單元MPC10處理第5片基板W5之方式，製作排程表。再者，圖15B所示例中，以由處理單元MPC17處理第6片基板W6之方式，製作排程表。因此，圖15B所示例中，由於有效地選擇空的處理單元MPC，故可防止如圖17所示之搬送延遲，可提高基板處理裝置1之運轉率。As can be seen by comparing FIG. 17 and FIG. 15B , in any case, the third substrate W3 is scheduled to be processed by the processing unit MPC17 , but in the example of FIG. 15B , the fourth substrate is processed by the processing unit MPC2 W4, the processing unit MPC10 processes the fifth substrate W5 to create a schedule. Furthermore, in the example shown in FIG. 15B , the schedule table is created so that the sixth substrate W6 is processed by the processing unit MPC17 . Therefore, in the example shown in FIG. 15B , since the empty processing unit MPC is efficiently selected, the transfer delay shown in FIG. 17 can be prevented, and the operation rate of the substrate processing apparatus 1 can be improved.

接著，針對以所有有效處理單元MPC排程基板W之處理後，基板W之處理時間減少之情形之排程進行說明。Next, a description will be given of a schedule in a case where the processing time of the substrate W is reduced after the processing of the substrate W is scheduled by all the effective processing units MPC.

首先，針對第2實施例之排程進行說明，其後，針對第2比較例之排程進行說明。First, the schedule of the second embodiment will be described, and then, the schedule of the second comparative example will be described.

圖18係顯示第2實施例之單元最終使用時刻、搬送時間及修正單元最終使用時刻之一例之表。圖19A～圖19D係顯示第2實施形態之排程表之時序圖。FIG. 18 is a table showing an example of the final use time of the unit, the transfer time, and the corrected final use time of the unit in the second embodiment. 19A to 19D are timing charts showing the schedule table of the second embodiment.

圖19A～圖19B係顯示進行應用第1處理時間處理基板W之第1製程之第1～11片基板W1～W11之排程後之排程表之一例。圖19A係顯示直至第1片基板W1之處理結束之時刻之排程表，圖19B係顯示接續圖19A。FIGS. 19A to 19B show an example of the schedule table after performing the schedule of the first to eleventh substrates W1 to W11 of the first process of processing the substrate W by applying the first processing time. FIG. 19A shows a schedule until the processing of the first substrate W1 ends, and FIG. 19B shows a continuation of FIG. 19A .

圖19C係顯示進行應用第2處理時間處理基板W之第2製程之第12片基板W12之排程後之排程表之一例。圖19D係顯示進行應用第2處理時間處理基板W之第2製程之第13～15片基板W13～W15之排程後之排程表之一例。FIG. 19C shows an example of the schedule table after performing the schedule of the 12th substrate W12 in the second process of processing the substrate W by applying the second processing time. FIG. 19D shows an example of the schedule table after performing the schedule of the 13th to 15th substrates W13 to W15 of the second process of processing the substrate W by applying the second processing time.

圖19A～圖19D係顯示處理單元MPC1、MPC2、MPC3、MPC9、MPC10、MPC11、MPC17、MPC18及MPC19為有效處理單元MPC之例。因此，各處理區域PZ之有效腔室數為3。第1製程及第2製程中，指定有所有處理單元MPC1～MPC24作為並行處理單元。以第1製程指定之第1處理時間例如為240秒，以第2製程指定之第2處理時間例如為60秒。FIGS. 19A to 19D show processing units MPC1 , MPC2 , MPC3 , MPC9 , MPC10 , MPC11 , MPC17 , MPC18 and MPC19 as examples of valid processing units MPC. Therefore, the number of effective chambers in each processing zone PZ is three. In the first process and the second process, all the processing units MPC1 to MPC24 are designated as parallel processing units. The first processing time specified by the first process is, for example, 240 seconds, and the second processing time specified by the second process is, for example, 60 seconds.

於進行第1片基板W之排程前，各處理區域PZ之可投入率為100%((3/3)×100)，各處理區域PZ之區域最終使用時刻為初始值，各處理區域PZ之最舊腔室數為3。進行第1片基板W之排程前之狀況與參照圖10A～圖10E說明之例大致相同。因此，第1～11片基板W1～W11之排程與參照圖10A～圖10E說明之例同樣地進行。Before the scheduling of the first substrate W, the availability rate of each processing zone PZ is 100% ((3/3)×100), the final use time of each processing zone PZ is the initial value, and each processing zone PZ The oldest chamber number is 3. The situation before the scheduling of the first substrate W is substantially the same as the example described with reference to FIGS. 10A to 10E . Therefore, the scheduling of the first to eleventh substrates W1 to W11 is performed in the same manner as in the example described with reference to FIGS. 10A to 10E .

具體而言，如圖19A所示，以由處理單元MPC1處理第1片基板W1，由處理單元MPC9處理第2片基板W2，由處理單元MPC17處理第3片基板W3之方式，製作排程表。又，以由處理單元MPC2處理第4片基板W4，由處理單元MPC10處理第5片基板W5，由處理單元MPC18處理第6片基板W6之方式，製作排程表。具又，以由處理單元MPC1處理第7片基板W7，由處理單元MPC9處理第8片基板W8，由處理單元MPC17處理第9片基板W9之方式，製作排程表。Specifically, as shown in FIG. 19A , the schedule table is created such that the first substrate W1 is processed by the processing unit MPC1, the second substrate W2 is processed by the processing unit MPC9, and the third substrate W3 is processed by the processing unit MPC17. . Furthermore, the schedule table is created so that the fourth substrate W4 is processed by the processing unit MPC2, the fifth substrate W5 is processed by the processing unit MPC10, and the sixth substrate W6 is processed by the processing unit MPC18. Furthermore, the schedule table is created such that the seventh substrate W7 is processed by the processing unit MPC1, the eighth substrate W8 is processed by the processing unit MPC9, and the ninth substrate W9 is processed by the processing unit MPC17.

又，如圖19B所示，以由處理單元MPC1處理第10片基板W10，由處理單元MPC9處理第11片基板W11之方式，製作排程表。即，以處理單元MPC1處理第1片基板W1後，以處理單元MPC1處理第10片基板W10。以處理單元MPC9處理第2片基板W2後，以處理單元MPC9處理第11片基板W11。如此，製作處理第1～11片基板W1～W11之排程表。Furthermore, as shown in FIG. 19B , the schedule table is created so that the tenth substrate W10 is processed by the processing unit MPC1 , and the eleventh substrate W11 is processed by the processing unit MPC9 . That is, after processing the first substrate W1 by the processing unit MPC1, the tenth substrate W10 is processed by the processing unit MPC1. After the second substrate W2 is processed by the processing unit MPC9, the eleventh substrate W11 is processed by the processing unit MPC9. In this manner, a schedule for processing the first to eleventh substrates W1 to W11 is created.

圖19B之下部係顯示製作處理第11片基板W11之排程表後之各處理單元MPC之單元最終使用時刻(時刻T1～T7)。製作處理第11片基板W11之排程表之時點之處理單元MPC1之單元最終使用時刻係時刻T6，該時點之處理單元MPC2之單元最終使用時刻係時刻T1，該時點之處理單元MPC3之單元最終使用時刻係時刻T3。該等之中最早之時刻係時刻T1。The lower part of FIG. 19B shows the cell final use times (times T1 to T7 ) of each processing unit MPC after the schedule table for processing the eleventh substrate W11 is produced. The final use time of the unit of the processing unit MPC1 at the time point when the schedule table for processing the 11th substrate W11 is made is time T6, the final use time of the unit of the processing unit MPC2 at this time point is time T1, and the unit of the processing unit MPC3 at this time point is the final use time. The use time is time T3. The earliest time among these is time T1.

圖18係顯示製作處理第11片基板W11之排程表之時點之所有有效處理單元MPC之單元最終使用時刻、搬送時間及修正單元最終使用時刻。處理單元MPC1、MPC2及MPC3所屬之第1處理區域PZ1之搬送時間係搬送時間t1。因此，處理單元MPC1之修正單元最終使用時刻係時刻T6－搬送時間t1，處理單元MPC2之修正單元最終使用時刻係時刻T1－搬送時間t1，處理單元MPC3之修正單元最終使用時刻係時刻T3－搬送時間t1。該等之中最早之時刻係時刻T1－搬送時間t1。FIG. 18 shows the unit final use time, the transfer time and the corrected unit final use time of all the effective processing units MPC at the time of making the schedule table for processing the 11th substrate W11 . The transfer time of the first processing zone PZ1 to which the processing units MPC1, MPC2 and MPC3 belong is the transfer time t1. Therefore, the final use time of the correction unit of the processing unit MPC1 is time T6-transfer time t1, the final use time of the correction unit of the processing unit MPC2 is time T1-transfer time t1, and the final use time of the correction unit of the processing unit MPC3 is time T3-transfer time time t1. The earliest time among these is time T1 - transfer time t1.

處理單元MPC9之單元最終使用時刻係時刻T7，處理單元MPC10之單元最終使用時刻係時刻T2，處理單元MPC11之單元最終使用時刻係時刻T4。如圖19B所示，該等之中最早之時刻係時刻T2。處理單元MPC9、處理單元MPC10及處理單元MPC11所屬之第2處理區域PZ2之搬送時間係搬送時間t2。因此，處理單元MPC9之修正單元最終使用時刻係時刻T7－搬送時刻t2，處理單元MPC10之修正單元最終使用時刻係時刻T2－搬送時間t2，處理單元MPC11之修正單元最終使用時刻係時刻T4－搬送時間t2。該等之中最早之時刻係時刻T2－搬送時間t2。The final use time of the units of the processing unit MPC9 is time T7, the final use time of the units of the processing unit MPC10 is time T2, and the final use time of the units of the processing unit MPC11 is time T4. As shown in FIG. 19B, the earliest of these is time T2. The transfer time of the second processing zone PZ2 to which the processing unit MPC9, the processing unit MPC10, and the processing unit MPC11 belong is the transfer time t2. Therefore, the final use time of the correction unit of the processing unit MPC9 is time T7-transfer time t2, the correction unit final use time of the processing unit MPC10 is time T2-transfer time t2, and the correction unit of the processing unit MPC11 The final use time is time T4-transfer time time t2. The earliest time among these is time T2 - transfer time t2.

處理單元MPC17之單元最終使用時刻係時刻T1，處理單元MPC18之單元最終使用時刻係時刻T3，處理單元MPC19之單元最終使用時刻係時刻T5。如圖19B所示，該等之中最早之時刻係時刻T2。處理單元MPC17、處理單元MPC18及處理單元MPC19所屬之第2處理區域PZ2之搬送時間係搬送時間t2。因此，處理單元MPC17之修正單元最終使用時刻係時刻T1－搬送時間t2，處理單元MPC18之修正單元最終使用時刻係時刻T3－搬送時間t2，處理單元MPC19之修正單元最終使用時刻係時刻T5－搬送時間t2。該等之中最早之時刻係時刻T1－搬送時間t2。The final use time of the units of the processing unit MPC17 is time T1, the final use time of the units of the processing unit MPC18 is time T3, and the final use time of the units of the processing unit MPC19 is time T5. As shown in FIG. 19B, the earliest of these is time T2. The transfer time of the second processing zone PZ2 to which the processing unit MPC17, the processing unit MPC18, and the processing unit MPC19 belong is the transfer time t2. Therefore, the final use time of the correction unit of the processing unit MPC17 is time T1-conveyance time t2, the final use time of the correction unit of the processing unit MPC18 is time T3-transfer time t2, and the final use time of the correction unit of the processing unit MPC19 is time T5-transfer time t2. The earliest time among these is time T1 - transfer time t2.

如圖18所示，製作處理第11片基板W11之排程表之時點之第1處理區域PZ1之區域最終使用時刻係時刻T1－搬送時間t1。該時點之第2處理區域PZ2之區域最終使用時刻係時刻T2－搬送時間t2。該時點之第3處理區域PZ3之區域最終使用時刻係時刻T1－搬送時間t2。如圖19A之左端附近所示，搬送時間t1短於搬送時間t2。因此，第3處理區域PZ3之區域最終使用時刻(T1－S2)於3個處理區域PZ之區域最終使用時刻之中最早。As shown in FIG. 18 , the area final use time of the first processing area PZ1 at the time when the schedule table for processing the 11th substrate W11 is created is time T1-conveyance time t1. The area final use time of the second processing area PZ2 at this time is time T2 - transfer time t2. The area final use time of the third processing area PZ3 at this time is time T1 - transfer time t2. As shown in the vicinity of the left end of FIG. 19A, the conveyance time t1 is shorter than the conveyance time t2. Therefore, the area final use time (T1-S2) of the third processing area PZ3 is the earliest among the area final use times of the three processing areas PZ.

由於第3處理區域PZ3之區域最終使用時刻於3個處理區域PZ之區域最終使用時刻之中最早，故排程功能部65用於第12片基板W12而選擇第3處理區域PZ3。圖19C係顯示以由屬於第3處理區域PZ3之處理單元MPC17處理第12片基板W12之方式進行排程之例。該例之情形，若製作處理第12片基板W12之排程表，則處理單元MPC17之單元最終使用時刻及修正單元最終使用時刻更新，第3處理區域PZ3之區域最終使用時刻更新。Since the area final use time of the third processing area PZ3 is the earliest among the area final use times of the three processing areas PZ, the scheduling function unit 65 selects the third processing area PZ3 for the twelfth substrate W12. FIG. 19C shows an example of scheduling so that the twelfth substrate W12 is processed by the processing unit MPC17 belonging to the third processing zone PZ3. In the case of this example, if a schedule for processing the twelfth substrate W12 is created, the cell final use time and the correction cell final use time of the processing unit MPC17 are updated, and the area final use time of the third processing zone PZ3 is updated.

如觀察圖19C可知，第12片基板W12之處理時間(第2處理時間)短於第1～11片基板W1～W11之處理時間(第1處理時間)。即，對第12片基板W12，應用比第1處理時間短之第2處理時間處理基板W之第2製程。同樣地，亦對第13～15片基板W13～W15應用第2製程。圖19D係顯示以由處理單元MPC2處理第13片基板W13，由處理單元MPC10處理第14片基板W14，由處理單元MPC18處理第15片基板W15之方式進行排程之例。19C , it can be seen that the processing time (second processing time) of the twelfth substrate W12 is shorter than the processing time (first processing time) of the first to eleventh substrates W1 to W11. That is, to the twelfth substrate W12, the second process of processing the substrate W is applied for the second processing time shorter than the first processing time. Similarly, the second process is also applied to the 13th to 15th substrates W13 to W15. 19D shows an example of scheduling such that the thirteenth substrate W13 is processed by the processing unit MPC2, the fourteenth substrate W14 is processed by the processing unit MPC10, and the fifteenth substrate W15 is processed by the processing unit MPC18.

接著，參照圖20，針對第2比較例之排程進行說明。Next, the schedule of the second comparative example will be described with reference to FIG. 20 .

圖20係顯示第2比較例之排程表之時序圖，係顯示以區域使用率最初優先，選擇處理區域PZ，進行第12～15片基板W12～W15之排程後之排程表之一例。FIG. 20 is a timing chart showing the schedule table of the second comparative example, which shows an example of the schedule table after the first priority is given to the area usage rate, the processing area PZ is selected, and the 12th to 15th substrates W12 to W15 are scheduled. .

第2比較例中，各處理區域PZ之有效腔室數或並行處理單元與第2實施例相同。對第1～11片基板W1～W11應用第1製程，對第12～15片基板W12～W15應用第2製程。至第11片基板W11為止之排程表與第2實施例相同。In the second comparative example, the number of effective chambers or parallel processing units in each processing zone PZ is the same as that of the second embodiment. The first process is applied to the first to eleventh substrates W1 to W11, and the second process is applied to the 12th to 15th substrates W12 to W15. The schedule up to the eleventh substrate W11 is the same as that of the second embodiment.

如圖20所示，若選擇不基於區域最終使用時刻，而基於區域使用率為基準選擇之處理區域PZ，則與第2實施例同樣地，以由第3處理區域PZ3處理第12片基板W12之方式，製作排程表。圖20係顯示以由處理單元MPC17處理第12片基板W12之方式進行排程之例。As shown in FIG. 20 , if the processing area PZ selected not based on the area final use time but based on the area usage rate is selected, the twelfth substrate W12 will be processed in the third processing area PZ3 as in the second embodiment. way to create a schedule. FIG. 20 shows an example of scheduling so that the twelfth substrate W12 is processed by the processing unit MPC17.

另一方面，於用於第13片基板W13，而開始選擇處理區域PZ之時點，空的處理單元MPC(例如，處理單元MPC2及處理單元MPC10)存在於第1處理區域PZ1及第2處理區域PZ2，但以由屬於第3處理區域PZ3之處理單元MPC18處理第13片基板W13之方式進行排程。同樣地，以由屬於第3處理區域PZ3之處理單元MPC19處理第14片基板W14，以由屬於第3處理區域PZ3之處理單元MPC17處理第15片基板W15之方式進行排程。On the other hand, when the selection of the processing area PZ is started for the thirteenth substrate W13, empty processing cells MPC (for example, processing unit MPC2 and processing unit MPC10) exist in the first processing area PZ1 and the second processing area PZ2, however, is scheduled so that the thirteenth substrate W13 is processed by the processing unit MPC18 belonging to the third processing zone PZ3. Similarly, the 14th substrate W14 is processed by the processing unit MPC19 belonging to the third processing zone PZ3, and the 15th substrate W15 is processed by the processing unit MPC17 belonging to the third processing zone PZ3.

圖20係顯示分度器機器人IR(參照圖1)將第14～15片基板W14～W15自裝載埠LP上之載具C同時搬出，將第14～15片基板W14～W15同時搬入於裝載埠LP上之載具C之例。對於圖19A～圖19D亦相同。圖19D所示例中，將第14～15片基板W14～W15於搬出時刻X1自載具C搬出，於搬入時刻Y1搬入至載具C。圖20所示例中，將第14～15片基板W14～W15於搬出時刻X2自載具C搬出，於搬入時刻Y2搬入至載具C。20 shows that the indexer robot IR (refer to FIG. 1 ) simultaneously unloads the 14th to 15th substrates W14 to W15 from the carrier C on the load port LP, and simultaneously loads the 14th to 15th substrates W14 to W15 to the load port LP Example of Vehicle C above. The same applies to FIGS. 19A to 19D . In the example shown in FIG. 19D , the 14th to 15th substrates W14 to W15 are carried out from the carrier C at the carry-out time X1, and are carried into the carrier C at the carry-in time Y1. In the example shown in FIG. 20, the 14th-15th board|substrates W14-W15 are carried out from the carrier C at the carry-out time X2, and are carried in to the carrier C at the carry-in time Y2.

第2實施例及第2比較例中，儘管於相同條件下以複數個處理單元MPC處理第12～15片基板W12～W15，但亦如圖19D所示，第2實施例之搬出時刻X1較第2比較例之搬出時刻X2僅早時間Z1，第2實施例之搬入時刻Y1較第2比較例之搬入時刻Y2僅早時間Z1。因此，第2實施例中，可均等地選擇3個處理區域PZ，不僅可提高基板處理裝置1之運轉率，與第2比較例相比亦可增加每單位時間之基板W之處理片數。藉此，可提高基板處理裝置1之處理量。In the second embodiment and the second comparative example, although the 12th to 15th substrates W12 to W15 are processed by a plurality of processing units MPC under the same conditions, as shown in FIG. 19D , the unloading time X1 of the second embodiment is relatively The moving-out time X2 of the second comparative example is earlier by time Z1, and the moving-in time Y1 of the second embodiment is earlier than the moving-in time Y2 of the second comparative example by only time Z1. Therefore, in the second embodiment, three processing zones PZ can be equally selected, which not only improves the operation rate of the substrate processing apparatus 1 but also increases the number of processed substrates W per unit time compared with the second comparative example. Thereby, the throughput of the substrate processing apparatus 1 can be improved.

如上所述，本實施形態中，並非基於區域使用率之大小關選擇處理區域PZ，而是基於區域最終使用時刻，自複數個處理區域PZ中選擇1個處理區域PZ。並且，自屬於所選擇之處理區域PZ之複數個處理單元MPC中選擇1個處理單元MPC。其後，將基板W藉由基板搬送系統TS1所含之分度器機器人IR、第1主搬送機器人CR1及第2主搬送機器人CR2，自裝載埠LP上之載具C搬送至所選擇之處理單元MPC。因此，不僅於基板W之處理時間不變化之情形，於基板W之處理時間減少之情形，亦可均等地選擇複數個處理區域PZ，可  普遍使用基板處理裝置1所具備之所有處理單元MPC1～MPC24。藉此，可提高基板處理裝置1之運轉率。As described above, in the present embodiment, the processing area PZ is not selected based on the magnitude of the area usage rate, but one processing area PZ is selected from the plurality of processing areas PZ based on the area final use time. Then, one processing unit MPC is selected from the plurality of processing units MPC belonging to the selected processing area PZ. After that, the substrate W is transferred from the carrier C on the load port LP to the selected processing unit MPC by the indexer robot IR, the first main transfer robot CR1 and the second main transfer robot CR2 included in the substrate transfer system TS1. . Therefore, not only when the processing time of the substrate W does not change, but also when the processing time of the substrate W is reduced, a plurality of processing regions PZ can be equally selected, and all the processing units MPC1 to MPC1 to the substrate processing apparatus 1 can be generally used. MPC24. Thereby, the operation rate of the substrate processing apparatus 1 can be improved.

並且，區域最終使用時刻並非基於最早單元最終使用時刻，而基於最早修正單元最終使用時刻而特定出。修正單元最終使用時刻係自表示處理單元MPC用於處理基板W最後使用之時刻之單元最終使用時刻，減去自裝載埠LP上之載具C對處理單元MPC搬送基板W所需要之搬送時間後之時刻。因此，可減少複數個處理區域PZ間之搬送時間差，可避免僅選擇靠近裝載埠LP之處理區域PZ。藉此，可進而均等地選擇複數個處理區域PZ。In addition, the area final use time is not based on the earliest unit final use time, but is specified based on the earliest corrected unit final use time. The corrected unit final use time is the unit final use time indicating the time when the processing unit MPC is used to process the substrate W at the end, minus the transfer time required to transfer the substrate W from the carrier C on the loading port LP to the processing unit MPC moment. Therefore, the transfer time difference between the plurality of processing zones PZ can be reduced, and only the processing zone PZ close to the load port LP can be avoided to be selected. Thereby, a plurality of processing regions PZ can be selected equally.

本實施形態中，對於屬於相同處理區域PZ之複數個處理單元MPC，登錄相同值作為搬送時間。即使係屬於相同處理區域PZ之複數個處理單元MPC，搬送距離亦嚴格不同，故搬送時間亦嚴格不同。但，若所屬之處理區域PZ相同，則搬送時間差極小，搬送時間於該等處理單元MPC之間大致相等。因此，若對於屬於相同處理區域PZ之複數個處理單元MPC登錄相同值作為搬送時間，則可減少該等處理區域PZ間之搬送時間差，且簡化搬送時間之設定。In the present embodiment, the same value is registered as the transfer time for a plurality of processing units MPC belonging to the same processing area PZ. Even if a plurality of processing units MPC belong to the same processing zone PZ, the transport distances are strictly different, and therefore the transport times are also strictly different. However, if the processing zones PZ to which they belong are the same, the difference in transfer time is extremely small, and the transfer time is approximately equal between the processing units MPC. Therefore, if the same value is registered as the transfer time for a plurality of processing units MPC belonging to the same processing zone PZ, the transfer time difference between the processing zones PZ can be reduced, and the setting of the transfer time can be simplified.

本實施形態中，有區域最終使用時刻最早之複數個處理區域PZ之情形時，自該等處理區域PZ中選擇可投入率最大之處理區域PZ。此意指於大多情況下，係選擇單元最終使用時刻最早之處理單元MPC之數最大之處理區域PZ。對所選擇之處理單元MPC搬送基板W前，或對所選擇之處理單元MPC搬送基板W時，於該處理單元MPC產生異常之情形時，需要重新選擇其他處理單元MPC。如此之情形時，若於相同處理區域PZ中有單元最終使用時刻最早之其他處理單元MPC，則可選擇該處理單元MPC作為新的處理單元MPC。因此，可以比較簡單之變更設定基板W之新的搬送路徑。In the present embodiment, when there are a plurality of processing areas PZ with the earliest area final use time, the processing area PZ with the largest availability rate is selected from the processing areas PZ. This means that in most cases, the processing area PZ with the largest number of processing units MPC with the earliest unit final use time is selected. Before transferring the substrate W to the selected processing unit MPC, or when transferring the substrate W to the selected processing unit MPC, when an abnormality occurs in the processing unit MPC, another processing unit MPC needs to be reselected. In this case, if there is another processing unit MPC with the earliest unit final use time in the same processing area PZ, the processing unit MPC can be selected as the new processing unit MPC. Therefore, a new conveyance path of the substrate W can be changed and set relatively easily.

本實施形態中，由於可普遍使用所有處理單元MPC，故可均等地使用旋轉夾盤33或刮擦構件37等之處理單元MPC所具備之裝置等，或對藥液噴嘴34送入藥液之泵等之與處理單元MPC關聯之裝置等。因此，可將該等消耗品之消耗程度平均化，可減少維護之頻率。藉此，可進而提高基板處理裝置1之運轉率。In the present embodiment, since all the processing units MPC can be commonly used, the devices provided in the processing unit MPC such as the rotary chuck 33 and the scraping member 37, etc., can be used equally, or the chemical liquid nozzle 34 can be fed with the chemical liquid. Pumps, etc., devices, etc. associated with the processing unit MPC. Therefore, the degree of consumption of these consumables can be averaged, and the frequency of maintenance can be reduced. Thereby, the operation rate of the substrate processing apparatus 1 can be further improved.

第1及第2實施例中，針對基板W之處理時間自第1處理時間減少為第2處理時間之例進行了說明。如此之情形時，由於亦基於區域最終使用時刻，自複數個處理區域PZ中選擇1個處理區域PZ，故與基於區域使用率之大小關係選擇處理區域PZ之情形相比，可均等地選擇複數個處理區域PZ。因此，即使基板W之搬送路徑或處理時間不同之情形，亦可普遍使用所有處理單元MPC，可進而提高基板處理裝置1之運轉率。In the first and second embodiments, an example in which the processing time of the substrate W is reduced from the first processing time to the second processing time has been described. In such a case, since one processing area PZ is selected from the plurality of processing areas PZ also based on the area final use time, it is possible to select a plurality of processing areas PZ equally compared to the case where the processing area PZ is selected based on the magnitude relationship of the area usage rate. A processing zone PZ. Therefore, even if the conveyance paths and processing times of the substrates W are different, all the processing units MPC can be generally used, and the operation rate of the substrate processing apparatus 1 can be further improved.

其他實施形態Other implementation forms

本發明不限定於上述實施形態之內容，可進行各種變更。The present invention is not limited to the contents of the above-described embodiments, and various modifications can be made.

例如，處理區域PZ亦可不基於搬送時間，而基於搬送距離進行分類。For example, the processing area PZ may be classified based on the conveyance distance instead of the conveyance time.

屬於相同處理區域PZ之處理單元MPC之數量亦可於3個處理區域PZ間不同。The number of processing units MPC belonging to the same processing zone PZ may also be different among the three processing zones PZ.

設置於基板處理裝置1之處理區域PZ之數量亦可為2個或5個以上。例如，亦可將第2處理區域PZ2及第3處理區域PZ3作為1個處理區域PZ處理。或者，亦可省略第3處理區域PZ3。The number of the processing regions PZ provided in the substrate processing apparatus 1 may be two or five or more. For example, the second processing area PZ2 and the third processing area PZ3 may be processed as one processing area PZ. Alternatively, the third processing area PZ3 may be omitted.

省略第3處理區域PZ3之情形時，第1主搬送機器人CR1亦可對屬於第1處理區域PZ1及第2處理區域PZ2之所有處理單元MPC進行基板W之搬入及搬出。該情形時，無需第2主搬送機器人CR2及第2交接單元PASS2。When the third processing zone PZ3 is omitted, the first main transfer robot CR1 can also carry in and unload the substrate W to all the processing units MPC belonging to the first processing zone PZ1 and the second processing zone PZ2. In this case, the second main transfer robot CR2 and the second delivery unit PASS2 are not required.

第2處理區域PZ2之搬送時間亦可與第3處理區域PZ3之搬送時間不同，亦可與第1處理區域PZ1之搬送時間相等。The conveyance time of the 2nd processing area PZ2 may be different from the conveyance time of the 3rd processing area PZ3, and may be equal to the conveyance time of the 1st processing area PZ1.

亦可並非對屬於相同處理區域PZ之複數個處理單元MPC登錄相同值作為搬送時間，而是對每處理單元MPC登錄搬送時間。即，對屬於相同處理區域PZ之複數個處理單元MPC登錄之搬送時間亦可互相不同。Instead of registering the same value as the transfer time for a plurality of processing units MPC belonging to the same processing area PZ, the transfer time may be registered for each processing unit MPC. That is, the transfer times registered in the plurality of processing units MPC belonging to the same processing area PZ may be different from each other.

見到複數個區域最終使用時刻最早之處理區域之情形時(圖8之步驟S34：是)，排程功能部亦可於候補區域所含之複數個處理區域中，檢索最舊腔室數最大之處理區域PZ，而並非檢索可投入率最大之處理區域PZ。When seeing the processing area with the earliest final use time of the plurality of areas (step S34 in FIG. 8 : Yes), the scheduling function unit can also search for the oldest chamber with the largest number of the processing areas included in the candidate area. The processing area PZ, rather than the processing area PZ with the largest available input rate.

見到複數個區域最終使用時刻最早之處理區域之情形時(圖8之步驟S34：是)，亦可基於區域編號選擇處理區域PZ，而並非基於可投入率選擇處理區域PZ。或者，亦可自區域最終使用時刻最早之複數個處理區域PZ中選擇任意處理區域PZ。When a plurality of processing areas with the earliest final use time are found (step S34 in FIG. 8 : Yes), the processing area PZ may also be selected based on the area number instead of the availability rate. Alternatively, an arbitrary processing area PZ may be selected from a plurality of processing areas PZ with the earliest area final use time.

亦可替代修正單元最終使用時刻，而使用單元最終使用時刻。或者，亦可替代單元最終使用時刻，而使用修正單元最終使用時刻。例如，區域最終使用時刻並非基於最早修正單元最終使用時刻，而是基於最早單元最終使用時刻而特定出。選擇處理基板W之處理單元MPC時，亦可以最早修正單元最終使用時刻最初優先，而非以最早區域最終使用時刻最初優先。Instead of correcting the final use time of the unit, use the final use time of the unit. Alternatively, instead of the final use time of the unit, the final use time of the unit can be corrected. For example, the area final use time is not based on the earliest modified unit final use time, but is specified based on the earliest unit final use time. When selecting the processing unit MPC for processing the substrate W, the earliest modification unit end-use time may also be given priority instead of the earliest area end-use time.

處理單元MPC3不限於圖3所示之表面洗淨單元及圖4所示之端面洗淨單元，亦可為以刮擦構件洗淨基板W之表面之表面刷洗單元、洗淨基板W之背面之背面洗淨單元等其他種類之處理單元。複數種處理單元亦可具備於1個基板處理裝置1中。The processing unit MPC3 is not limited to the surface cleaning unit shown in FIG. 3 and the end surface cleaning unit shown in FIG. Other types of processing units such as back cleaning units. A plurality of processing units may be provided in one substrate processing apparatus 1 .

亦可組合上述所有構成中之2個以上。亦可組合上述所有步驟中之2個以上。Two or more of the above-mentioned structures may be combined. It is also possible to combine two or more of all the above steps.

雖已針對本發明之實施形態進行詳細說明，但該等僅為用以明確本發明之技術性內容之具體例，本發明並非限定解釋於該等具體例，本發明之精神及範圍僅藉由隨附之申請專利範圍限定。Although the embodiments of the present invention have been described in detail, these are only specific examples for clarifying the technical content of the present invention, and the present invention is not limited to these specific examples, and the spirit and scope of the present invention are only defined by The accompanying patent application is limited in scope.

1:基板處理裝置 2:載具保持部 3:分度器部 4:處理部 5:搬送路徑 11:手 12:多關節臂 13:旋轉軸線 15:基板載置台 21:手 22:手 23:手進退機構 24:手進退機構 25:旋轉軸線 31:處理腔室 31a:開口 31b:隔板 31c:擋閘 32:處理杯 33:旋轉夾盤 34:藥液噴嘴 35:清洗液噴嘴 36:旋轉軸線 37:刮擦構件 60:電腦 61:控制部 62:輸入輸出部 63:記憶部 64:主機電腦 65:排程功能部 66:處理執行指示部 70:程式 71:排程表製作程式 72:處理執行程式 80:製程工作資料 81:排程表資料 82:使用履歷資料 83:搬送時間資料 C:載具 CR1:第1主搬送機器人 CR2:第2主搬送機器人 IR:分度器機器人 LP:裝載埠 LP1~LP4:裝載埠 M:記錄媒體 MPC:處理單元 MPC1~24:處理單元 PASS1:交接單元 PASS2:交接單元 PZ:處理區域 PZ1:第1處理區域 PZ2:第2處理區域 PZ3:第3處理區域 S1~S20:步驟 S31~S38:步驟 t1:搬送時間 t2:搬送時間 TS1:基板搬送系統 TW:塔 TW1~6:塔 W:基板 W1~15:基板 X1:搬出時刻 X2:搬出時刻 Y1:搬入時刻 Y2:搬入時刻1: Substrate processing device 2: Carrier Holder 3: Indexer part 4: Processing Department 5: conveying path 11: Hands 12: Multi-joint arm 13: Rotation axis 15: Substrate mounting table 21: Hands 22: Hands 23: Hand advance and retreat mechanism 24: Hand advance and retreat mechanism 25: Rotation axis 31: Processing Chamber 31a: Opening 31b: Separator 31c: Gate 32: Processing Cups 33: Rotary chuck 34: Liquid Nozzle 35: Cleaning fluid nozzle 36: Rotation axis 37: Scratch member 60: Computer 61: Control Department 62: Input and output part 63: Memory Department 64: host computer 65:Scheduling function department 66: Process execution instruction part 70: Program 71: Scheduler 72: Process execution program 80: Process work data 81: Schedule data 82: Use biographical information 83: Delivery time data C: vehicle CR1: 1st main transfer robot CR2: 2nd main transfer robot IR: Indexer Robot LP: Load port LP1~LP4: Load port M: recording medium MPC: Processing Unit MPC1~24: Processing unit PASS1: handover unit PASS2: handover unit PZ: Processing Zone PZ1: 1st processing zone PZ2: 2nd processing zone PZ3: 3rd processing zone S1~S20: Steps S31~S38: Steps t1: delivery time t2: delivery time TS1: Substrate Transfer System TW: Tower TW1~6: Tower W: substrate W1~15: Substrate X1: Move out moment X2: Move out moment Y1: Move in time Y2: Move in time

圖1係本發明之一實施形態之基板處理裝置之模式性俯視圖。 圖2係顯示沿圖1所示之切斷線Ⅱ-Ⅱ線之鉛垂剖面之基板處理裝置之模式性剖視圖。 圖3係用以說明處理單元之構成例之模式性剖視圖。 圖4係用以說明處理單元之其他構成例之模式性剖視圖。 圖5係用以說明基板處理裝置之電性構成之方塊圖。 圖6係用以說明藉由基板處理裝置所具備之電腦執行之處理例之流程圖。 圖7A係顯示排程時製作之臨時時間表之時序圖。 圖7B係顯示排程時製作之臨時時間表之時序圖。 圖7C係顯示排程時製作之臨時時間表之時序圖。 圖8係用以說明處理區域選擇處理(圖6之步驟S3)之一例之流程圖。 圖9A係顯示記憶於電腦之記憶部之處理區域資料之一例之表。 圖9B係顯示記憶於電腦之記憶部之處理區域資料之一例之表。 圖10A係顯示製作第1片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖10B係顯示製作第2片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖10C係顯示製作第3片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖10D係顯示製作第4片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖10E係顯示製作第5片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖11A係顯示屬於第1處理區域之4個處理單元無效之狀態下，製作第1片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖11B係顯示屬於第1處理區域之4個處理單元無效之狀態下，製作第2片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖11C係顯示屬於第1處理區域之4個處理單元無效之狀態下，製作第3片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖11D係顯示屬於第1處理區域之4個處理單元無效之狀態下，製作第4片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖11E係顯示屬於第1處理區域之4個處理單元無效之狀態下，製作第5片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖11F係顯示屬於第1處理區域之4個處理單元無效之狀態下，製作第6片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖12係顯示製作使用所有處理單元之排程表後之單元最終使用時刻、搬送時間、及修正單元最終使用時刻之一例之表。 圖13A係顯示製作使用所有處理單元之排程表後，製作第1片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖13B係顯示製作使用所有處理單元之排程表後，製作第2片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖13C係顯示製作使用所有處理單元之排程表後，製作第3片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖13D係顯示製作使用所有處理單元之排程表後，製作第4片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖13E係顯示製作使用所有處理單元之排程表後，製作第5片基板之排程表時之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表。 圖14A係顯示第1實施形態之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表，係顯示製作第1片基板之排程表前之狀態。 圖14B係顯示第1實施形態之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表，係顯示製作第2片基板之排程表前之狀態。 圖14C係顯示第1實施形態之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表，係顯示製作第3片基板之排程表前之狀態。 圖14D係顯示第1實施形態之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表，係顯示製作第4片基板之排程表前之狀態。 圖14E係顯示第1實施形態之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表，係顯示製作第5片基板之排程表前之狀態。 圖14F係顯示第1實施形態之可投入率、區域最終使用時刻、最舊腔室數、及有效腔室數之一例之表，係顯示製作第6片基板之排程表前之狀態。 圖15A係顯示第1實施例之排程表之時序圖，係顯示進行應用第1處理時間處理基板之第1製程之第1～2片基板之排程後之排程表之一例。 圖15B係顯示第1實施例之排程表之時序圖，係顯示進行應用第2處理時間處理基板之第2製程之第3～6片基板之排程後之排程表之一例。 圖16A係顯示製作第1比較例之區域使用率、區域最終使用時刻、有效腔室數之一例之表，係顯示製作第1片基板之排程表前之狀態。 圖16B係顯示製作第1比較例之區域使用率、區域最終使用時刻、有效腔室數之一例之表，係顯示製作第2片基板之排程表前之狀態。 圖16C係顯示製作第1比較例之區域使用率、區域最終使用時刻、有效腔室數之一例之表，係顯示製作第3片基板之排程表前之狀態。 圖16D係顯示製作第1比較例之區域使用率、區域最終使用時刻、有效腔室數之一例之表，係顯示製作第4片基板之排程表前之狀態。 圖16E係顯示製作第1比較例之區域使用率、區域最終使用時刻、有效腔室數之一例之表，係顯示製作第5片基板之排程表前之狀態。 圖16F係顯示製作第1比較例之區域使用率、區域最終使用時刻、有效腔室數之一例之表，係顯示製作第6片基板之排程表前之狀態。 圖17係顯示第1比較例之排程表之時序圖，係顯示以區域使用率最初優先，選擇處理區域，進行第3～6片基板之排程後之排程表之一例。 圖18係顯示第2實施例之單元最終使用時刻、搬送時間及修正單元最終使用時刻之一例之表。 圖19A係顯示第2實施例之排程表之時序圖，係顯示進行應用第1處理時間處理基板之第1製程之第1～11片基板之排程後之排程表之一例。 圖19B係顯示第2實施例之排程表之時序圖，係顯示接續圖19A。 圖19C係顯示第2實施例之排程表之時序圖，係顯示進行應用第2處理時間處理基板之第2製程之第12片基板之排程後之排程表之一例。 圖19D係顯示第2實施例之排程表之時序圖，係顯示進行應用第2處理時間處理基板之第2製程之第13～15片基板之排程後之排程表之一例。 圖20係顯示第2比較例之排程表之時序圖，係顯示以區域使用率最初優先，選擇處理區域，進行第12～15片基板之排程後之排程表之一例。FIG. 1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing the substrate processing apparatus in a vertical cross-section along the cutting line II-II shown in FIG. 1 . FIG. 3 is a schematic cross-sectional view for explaining a configuration example of a processing unit. FIG. 4 is a schematic cross-sectional view for explaining another configuration example of the processing unit. FIG. 5 is a block diagram illustrating the electrical configuration of the substrate processing apparatus. FIG. 6 is a flowchart for explaining an example of processing performed by a computer provided in the substrate processing apparatus. FIG. 7A is a timing diagram showing the provisional schedule created during scheduling. FIG. 7B is a timing diagram showing the provisional schedule created during scheduling. FIG. 7C is a timing diagram showing the provisional schedule created during scheduling. FIG. 8 is a flowchart for explaining an example of the processing area selection process (step S3 in FIG. 6 ). FIG. 9A is a table showing an example of processing area data stored in the memory section of the computer. FIG. 9B is a table showing an example of processing area data stored in the memory section of the computer. FIG. 10A is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of effective chambers when the schedule table for the production of the first substrate is shown. FIG. 10B is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of effective chambers when the schedule table for the production of the second substrate is shown. FIG. 10C is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of effective chambers when the schedule table for the production of the third substrate is made. FIG. 10D is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of effective chambers when the schedule table for the production of the fourth substrate is made. FIG. 10E is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of effective chambers when the schedule table for the production of the fifth substrate is made. FIG. 11A shows the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the first substrate is made when the four processing units belonging to the first processing area are invalid. An example table. FIG. 11B shows the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table of the second substrate is made when the four processing units belonging to the first processing area are invalid. An example table. FIG. 11C shows the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table of the third substrate is made when the four processing units belonging to the first processing area are invalid. An example table. 11D shows the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table of the fourth substrate is made when the four processing units belonging to the first processing area are invalid An example table. FIG. 11E shows the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the fifth substrate is made when the four processing units belonging to the first processing area are invalid. An example table. FIG. 11F shows the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the sixth substrate is made when the four processing units belonging to the first processing area are invalid. An example table. FIG. 12 is a table showing an example of the final use time of the unit, the transfer time, and the corrected final use time of the unit after a schedule table using all the processing units is created. FIG. 13A is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the first substrate is produced after the schedule table using all the processing units is produced. . FIG. 13B is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the second substrate is produced after the schedule table using all the processing units is produced. . 13C is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the third substrate is produced after the schedule table using all the processing units is produced . 13D is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the fourth substrate is produced after the schedule table using all the processing units is produced . FIG. 13E is a table showing an example of the availability rate, the final use time of the area, the number of the oldest chambers, and the number of valid chambers when the schedule table for the fifth substrate is produced after the schedule table using all the processing units is produced. . FIG. 14A is a table showing an example of the availability rate, area end use time, the oldest chamber number, and the effective number of chambers in the first embodiment, and shows the state before the schedule for producing the first substrate. FIG. 14B is a table showing an example of the availability rate, area final use time, the oldest chamber number, and the effective number of chambers in the first embodiment, and shows the state before the schedule for producing the second substrate. FIG. 14C is a table showing an example of the available input rate, area final use time, the oldest chamber number, and the effective number of chambers in the first embodiment, and shows the state before the schedule for producing the third substrate. 14D is a table showing an example of the availability rate, area final use time, number of oldest chambers, and number of effective chambers in the first embodiment, and shows the state before the schedule for producing the fourth substrate. FIG. 14E is a table showing an example of the availability rate, area end-use time, number of oldest chambers, and number of effective chambers in the first embodiment, and shows the state before the schedule for producing the fifth substrate. FIG. 14F is a table showing an example of the availability rate, area end-use time, number of oldest chambers, and number of effective chambers in the first embodiment, and shows the state before the schedule for producing the sixth substrate. 15A is a timing chart showing the schedule table of the first embodiment, which is an example of the schedule table after performing the scheduling of the first to second substrates in the first process of processing the substrates using the first processing time. 15B is a timing chart showing the schedule table of the first embodiment, which is an example of the schedule table after performing the scheduling of the 3rd to 6th substrates in the second process of processing the substrates using the second processing time. FIG. 16A is a table showing an example of the area usage rate, the area final use time, and the number of effective chambers in the production of the first comparative example, and shows the state before the schedule for producing the first substrate. FIG. 16B is a table showing an example of the area usage rate, the area final use time, and the number of effective chambers in the production of the first comparative example, and shows the state before the schedule table for the production of the second substrate. 16C is a table showing an example of the area utilization rate, the area final use time, and the number of effective chambers in the production of the first comparative example, and shows the state before the schedule table for the production of the third substrate. 16D is a table showing an example of the area usage rate, the final use time of the area, and the number of effective chambers in the production of the first comparative example, and shows the state before the schedule table for the production of the fourth substrate. FIG. 16E is a table showing an example of the area usage rate, the final use time of the area, and the number of effective chambers in the production of the first comparative example, and shows the state before the schedule for producing the fifth substrate. FIG. 16F is a table showing an example of the area usage rate, the final use time of the area, and the number of effective chambers in the production of the first comparative example, and shows the state before the schedule for producing the sixth substrate. FIG. 17 is a timing chart showing the schedule table of the first comparative example, which is an example of the schedule table after the first priority is given to the area usage rate, the processing area is selected, and the third to sixth substrates are scheduled. FIG. 18 is a table showing an example of the final use time of the unit, the transfer time, and the corrected final use time of the unit in the second embodiment. 19A is a timing chart showing the schedule table of the second embodiment, which is an example of the schedule table after performing the scheduling of the 1st to 11th substrates in the first process of processing the substrates using the first processing time. FIG. 19B is a timing chart showing the schedule table of the second embodiment, and the display is continued from FIG. 19A . FIG. 19C is a timing chart showing the schedule table of the second embodiment, which is an example of the schedule table after performing the scheduling of the 12th substrate in the second process of processing the substrate by applying the second processing time. 19D is a timing chart showing the schedule table of the second embodiment, which is an example of the schedule table after performing the scheduling of the 13th to 15th substrates in the second process of processing the substrates using the second processing time. FIG. 20 is a timing chart showing the schedule table of the second comparative example, which is an example of the schedule table after the area usage rate is prioritized first, the processing area is selected, and the 12th to 15th substrates are scheduled.

S31~S38:步驟 S31~S38: Steps

Claims (11)

一種基板處理方法，其係藉由基板處理裝置而執行者，該基板處理裝置具備複數個處理單元，使基板搬送系統將基板自裝載埠上之載具搬送至上述複數個處理單元，上述複數個處理單元係：形成有與上述裝載埠之距離相異之複數個處理區域，而處理上述基板；該基板處理方法包含如下步驟：單元最終使用時刻取得步驟，其就上述複數個處理單元之各者，取得表示上述處理單元為了處理上述基板被最後使用之時刻之單元最終使用時刻；修正單元最終使用時刻計算步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻、及將上述基板自上述裝載埠上之上述載具搬送至上述處理單元所需之上述複數個處理單元之搬送時間，就上述複數個處理單元之各者，計算表示相同之上述處理單元中自上述單元最終使用時刻減去上述搬送時間後之時刻之修正單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述修正單元最終使用時刻計算步驟中所得之複數個上述修正單元最終使用時刻，就上述複數個處理區域之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述修正單元最終使用時刻中，最早時刻的區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中，選擇上述區域最終使用時刻最早之1個上述處理區域； 單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其使上述搬送系統將上述基板，自上述裝載埠上之上述載具，搬送至上述單元選擇步驟中選擇之上述處理單元。 A substrate processing method, which is performed by a substrate processing apparatus, the substrate processing apparatus is provided with a plurality of processing units, and a substrate transport system is used to transport a substrate from a carrier on a loading port to the plurality of processing units, the plurality of processing units The processing unit is: a plurality of processing areas with different distances from the loading port are formed, and the substrate is processed; the substrate processing method includes the following steps: a unit final use time obtaining step, which is for each of the plurality of processing units. , obtaining the final use time of the unit representing the time when the processing unit is last used for processing the substrate; the calculation step of correcting the final use time of the unit, which is based on the final use time of a plurality of the above units obtained in the step of obtaining the final use time of the unit, and The transfer time of the plurality of processing units required to transfer the above-mentioned substrate from the above-mentioned carrier on the above-mentioned loading port to the above-mentioned processing unit, with respect to each of the above-mentioned plurality of processing units, is calculated from the above-mentioned unit of the above-mentioned processing units that represent the same The final use time of the correction unit at the time after the final use time minus the above-mentioned conveying time; the specific step of the area final use time, which is based on the plurality of the above-mentioned correction unit final use times obtained in the calculation step of the above-mentioned correction unit final use time. Each of the processing areas specifies the area final use time at the earliest among the correction unit final use times of the plurality of processing units belonging to the same processing area; the area selection step is based on the area final use time For the final use time of a plurality of the above-mentioned areas specified in the specific step, from the above-mentioned plurality of processing areas, select the above-mentioned processing area with the earliest final use time of the above-mentioned area; a unit selection step of selecting one of the above-mentioned processing units from among a plurality of the above-mentioned processing units belonging to the above-mentioned processing area selected in the above-mentioned area selection step; The above-mentioned carrier is conveyed to the above-mentioned processing unit selected in the above-mentioned unit selection step. 一種基板處理方法，其係藉由基板處理裝置而執行者，該基板處理裝置具備複數個處理單元，使基板搬送系統將基板自裝載埠上之載具搬送至上述複數個處理單元，上述複數個處理單元係：形成有與上述裝載埠之距離相異之複數個處理區域，而處理上述基板；該基板處理方法包含如下步驟：單元最終使用時刻取得步驟，其就上述複數個處理單元之各者，取得表示上述處理單元為了處理上述基板被最後使用之時刻之單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻，就上述複數個處理區域之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述單元最終使用時刻中最早時刻之區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中選擇上述區域最終使用時刻最早之1個上述處理區域；單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其使上述搬送系統將上述基板，自上述裝載埠上之 上述載具，搬送至上述單元選擇步驟中選擇之上述處理單元。 A substrate processing method, which is performed by a substrate processing apparatus, the substrate processing apparatus is provided with a plurality of processing units, and a substrate transport system is used to transport a substrate from a carrier on a loading port to the plurality of processing units, the plurality of processing units The processing unit is: a plurality of processing areas with different distances from the loading port are formed, and the substrate is processed; the substrate processing method includes the following steps: a unit final use time obtaining step, which is for each of the plurality of processing units. , obtain the unit final use time indicating the time when the processing unit is last used for processing the substrate; the area final use time specific step, which is based on a plurality of the unit final use times obtained in the unit final use time acquisition step, on the above Each of the plurality of processing areas specifies the area final use time representing the earliest time of the above-mentioned unit final use times of the plurality of above-mentioned processing units belonging to the same above-mentioned processing area; the area selection step is based on the above-mentioned area final use time specifying In the step of specifying the final use time of a plurality of the above-mentioned areas, the above-mentioned processing area with the earliest final use time of the above-mentioned area is selected from the above-mentioned plurality of processing areas; in the unit selection step, it belongs to the above-mentioned processing area selected in the above-mentioned area selection step. Among a plurality of the above-mentioned processing units in the area, one of the above-mentioned processing units is selected; and a substrate transfer step, which enables the above-mentioned transfer system to transfer the above-mentioned substrates from the above-mentioned loading port. The carrier is conveyed to the processing unit selected in the unit selection step. 如請求項1之基板處理方法，其中於上述修正單元最終使用時刻計算步驟之前，進而包含搬送時間登錄步驟，其登錄相同值作為用於屬於相同之上述處理區域之複數個上述處理單元之上述搬送時間。 The substrate processing method of claim 1, further comprising a transport time registration step of registering the same value as the transport for the plurality of processing units belonging to the same processing area before the correction unit final use time calculation step time. 如請求項1至3中任一項之基板處理方法，其中上述區域選擇步驟包含如下步驟：第1檢索步驟，其於上述複數個處理區域中，檢索上述區域最終使用時刻最早之上述處理區域；第2檢索步驟，其於上述第1檢索步驟中找到複數個上述處理區域作為候補區域之情形時，於上述候補區域所含之複數個上述處理區域中，檢索上述單元最終使用時刻最早之上述處理單元之數最大之上述處理區域；及選擇步驟，其自上述第2檢索步驟中所找到之至少1個上述處理區域中，選擇1個上述處理區域。 The substrate processing method according to any one of claims 1 to 3, wherein the area selection step comprises the following steps: a first retrieval step, which searches for the processing area with the earliest final use time of the area among the plurality of processing areas; The second search step includes, in the case of finding a plurality of the processing areas as candidate areas in the first search step, searching for the processing with the earliest final use time of the unit among the plurality of processing areas included in the candidate areas the above-mentioned processing area with the largest number of units; and a selection step of selecting one of the above-mentioned processing areas from at least one of the above-mentioned processing areas found in the above-mentioned second searching step. 如請求項1至3中任一項之基板處理方法，其進而包含基板處理步驟，其以比搬送至上述複數個處理單元之任一者之最近的基板處理時間短之處理時間，於上述基板搬送步驟後，使上述單元選擇步驟中選擇之上述處理單元處理上述基板。 The substrate processing method according to any one of claims 1 to 3, further comprising a substrate processing step of processing the substrate on the substrate with a processing time shorter than the most recent substrate processing time conveyed to any one of the plurality of processing units. After the conveyance step, the processing unit selected in the unit selection step is caused to process the substrate. 一種基板處理裝置，其包含：裝載埠，其載置收納基板之載具；複數個處理單元，其形成有與上述裝載埠之距離相異之複數個處理區域，處理自上述裝載埠上之上述載具搬送來之上述基板； 基板搬送系統，其於上述裝載埠上之上述載具與上述複數個處理單元間搬送上述基板；及控制裝置，其控制上述基板搬送系統，且上述控制裝置執行如下步驟：單元最終使用時刻取得步驟，其就上述複數個處理單元之各者，取得表示上述處理單元為了處理上述基板被最後使用之時刻之單元最終使用時刻；修正單元最終使用時刻計算步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻、及將上述基板自上述裝載埠上之上述載具搬送至上述處理單元所需之上述複數個處理單元之搬送時間，就上述複數個處理單元之各者，計算表示相同之上述處理單元中自上述單元最終使用時刻減去上述搬送時間後之時刻之修正單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述修正單元最終使用時刻計算步驟中所得之複數個上述修正單元最終使用時刻，就上述複數個處理區域之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述修正單元最終使用時刻中最早時刻之區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中選擇上述區域最終使用時刻最早之1個上述處理區域；單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其使上述基板搬送系統將上述基板，自上述裝載埠 上之上述載具，搬送至上述單元選擇步驟中選擇之上述處理單元。 A substrate processing apparatus, comprising: a loading port on which a carrier for accommodating substrates is placed; a plurality of processing units formed with a plurality of processing regions at different distances from the loading port, and processing from the above-mentioned loading port on the loading port the above-mentioned substrates conveyed by the carrier; A substrate transfer system for transferring the substrate between the carrier on the loading port and the plurality of processing units; and a control device for controlling the substrate transfer system, and the control device executes the following steps: a step of obtaining the final use time of the unit , which, for each of the plurality of processing units, obtains the unit final use time representing the time when the processing unit is last used for processing the substrate; the correction unit final use time calculation step is based on the unit final use time acquisition step in the step The obtained final use time of the plurality of the above-mentioned units, and the transfer time of the above-mentioned plurality of processing units required to transport the above-mentioned substrate from the above-mentioned carrier on the above-mentioned loading port to the above-mentioned processing unit, for each of the above-mentioned plurality of processing units, Calculate the correction unit final use time representing the time after subtracting the above conveyance time from the above unit final use time in the same processing units; the area final use time specific step, which is based on the above-mentioned complex number obtained in the correction unit final use time calculation step For each of the above-mentioned correction unit final use times, for each of the plurality of processing areas, specify the area final use time representing the earliest time among the above-mentioned correction unit final use times of the plurality of above-mentioned processing units belonging to the same above-mentioned processing area; area; A selection step, which selects one of the above-mentioned processing areas with the earliest final use time of the above-mentioned area from the above-mentioned plural processing areas based on a plurality of the above-mentioned area final-use times specified in the above-mentioned area final-use time specific step; The unit selection step, which Selecting one of the processing units from the plurality of processing units belonging to the processing area selected in the area selection step; and a substrate transfer step of causing the substrate transfer system to transfer the substrate from the load port The above-mentioned carrier is conveyed to the above-mentioned processing unit selected in the above-mentioned unit selection step. 一種基板處理裝置，其包含：裝載埠，其載置收納基板之載具；複數個處理單元，其形成有與上述裝載埠之距離相異之複數個處理區域，處理自上述裝載埠上之上述載具搬送來之上述基板；基板搬送系統，其於上述裝載埠上之上述載具與上述複數個處理單元間搬送上述基板；及控制裝置，其控制上述基板搬送系統，且上述控制裝置執行如下步驟：單元最終使用時刻取得步驟，其就上述複數個處理單元之各者，取得表示上述處理單元為了處理上述基板被最後使用之時刻之單元最終使用時刻；區域最終使用時刻特定步驟，其基於上述單元最終使用時刻取得步驟中取得之複數個上述單元最終使用時刻，就上述複數個處理區域之各者，特定出表示屬於相同之上述處理區域之複數個上述處理單元之上述單元最終使用時刻中最早時刻之區域最終使用時刻；區域選擇步驟，其基於上述區域最終使用時刻特定步驟中特定出之複數個上述區域最終使用時刻，自上述複數個處理區域中，選擇上述區域最終使用時刻最早之1個上述處理區域；單元選擇步驟，其自屬於上述區域選擇步驟中選擇之上述處理區域之複數個上述處理單元中，選擇1個上述處理單元；及基板搬送步驟，其使上述基板搬送系統將上述基板，自上述裝載埠 上之上述載具，搬送至上述單元選擇步驟中選擇之上述處理單元。 A substrate processing apparatus, comprising: a loading port on which a carrier for accommodating substrates is placed; a plurality of processing units formed with a plurality of processing regions at different distances from the loading port, and processing from the above-mentioned loading port on the loading port The substrate conveyed by a carrier; a substrate conveying system for conveying the substrate between the carrier on the loading port and the plurality of processing units; and a control device for controlling the substrate conveying system, and the control device executes as follows Steps: a unit end-use time obtaining step, for each of the plurality of processing units, obtaining a unit end-use time representing the time when the above-mentioned processing unit was last used for processing the above-mentioned substrate; an area end-use time specific step, which is based on the above-mentioned The unit final use time of the plurality of above-mentioned units obtained in the step of obtaining the unit final use time, for each of the above-mentioned plurality of processing areas, the earliest among the above-mentioned unit final use times representing the plurality of above-mentioned processing units belonging to the same above-mentioned processing area is specified. The final use time of the area at the time; the area selection step, which is based on a plurality of the above area final use times specified in the above-mentioned area final use time specific step, and selects the above-mentioned area from the plurality of processing areas with the earliest final use time. the above-mentioned processing area; a unit selection step of selecting one of the above-mentioned processing units from among a plurality of the above-mentioned processing units belonging to the above-mentioned processing area selected in the above-mentioned area selection step; and a substrate transfer step of causing the substrate transfer system to transfer the substrate , from the above loadport The above-mentioned carrier is conveyed to the above-mentioned processing unit selected in the above-mentioned unit selection step. 如請求項6之基板處理裝置，其中上述控制裝置於執行上述修正單元最終使用時刻計算步驟前，進而執行搬送時間登錄步驟，其登錄相同值作為用於屬於相同之上述處理區域之複數個上述處理單元之上述搬送時間。 The substrate processing apparatus of claim 6, wherein the control means further executes a transport time registration step before executing the correction unit final use time calculation step, and registers the same value as a plurality of the above-mentioned processes belonging to the same above-mentioned processing area The above transfer time of the unit. 如請求項6至8中任一項之基板處理裝置，其中上述區域選擇步驟包含如下步驟：第1檢索步驟，其於上述複數個處理區域中檢索上述區域最終使用時刻最早之上述處理區域；第2檢索步驟，其於上述第1檢索步驟中找到複數個上述處理區域作為候補區域之情形時，於上述候補區域所含之複數個上述處理區域中，檢索上述單元最終使用時刻最早之上述處理單元之數最大之上述處理區域；及選擇步驟，其自上述第2檢索步驟中找到之至少1個上述處理區域中，選擇1個上述處理區域。 The substrate processing apparatus according to any one of claims 6 to 8, wherein the area selection step includes the following steps: a first search step of searching for the processing area with the earliest final use time of the area among the plurality of processing areas; 2. A search step of searching for the processing unit whose last use time of the unit is the earliest among the plurality of processing areas included in the candidate area when a plurality of the processing areas are found as candidate areas in the first searching step and a selecting step of selecting one of the above-mentioned processing areas from at least one of the above-mentioned processing areas found in the above-mentioned second searching step. 如請求項6至8中任一項之基板處理裝置，其中上述控制裝置進而執行基板處理步驟，其以比搬送至上述複數個處理單元之任一者之最近的基板處理時間短之處理時間，於上述基板搬送步驟後，使上述單元選擇步驟中選擇之上述處理單元處理上述基板。 The substrate processing apparatus of any one of claims 6 to 8, wherein the control device further performs a substrate processing step with a processing time shorter than the most recent substrate processing time conveyed to any one of the plurality of processing units, After the said board|substrate conveyance process, the said process unit selected in the said unit selection process is made to process the said board|substrate. 一種電腦可讀取之記錄媒體，其係記錄有電腦程式者，該電腦程式係藉由包含於基板處理裝置之控制裝置而執行，該基板處理裝置具備複數個處理單元，使基板搬送系統將基板自裝載埠上之載具搬送至上述複數個處理單元，上述複數個處理單元係：形成有與上述裝載埠之距離相異之複 數個處理區域，而處理上述基板，該電腦程式係以使作為上述控制裝置之電腦執行如請求項1至3中任一項之基板處理方法之方式，編入步驟群者。 A computer-readable recording medium that records a computer program, the computer program is executed by a control device included in a substrate processing apparatus, the substrate processing apparatus is provided with a plurality of processing units, and a substrate conveying system is used to transfer the substrates. The plurality of processing units are transported from the carrier on the loading port to the above-mentioned plurality of processing units, and the plurality of processing units are formed with complexes having different distances from the loading port. A plurality of processing areas are used to process the above-mentioned substrate, and the computer program is programmed into the step group in such a manner that the computer serving as the above-mentioned control device executes the substrate processing method according to any one of Claims 1 to 3.
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