TWI770046B - 基板處理裝置及基板處理方法 - Google Patents
基板處理裝置及基板處理方法 Download PDFInfo
- Publication number
- TWI770046B TWI770046B TW106127060A TW106127060A TWI770046B TW I770046 B TWI770046 B TW I770046B TW 106127060 A TW106127060 A TW 106127060A TW 106127060 A TW106127060 A TW 106127060A TW I770046 B TWI770046 B TW I770046B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- cup
- outer peripheral
- peripheral side
- liquid
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3092—Recovery of material; Waste processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Coating Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016163243A JP6778548B2 (ja) | 2016-08-24 | 2016-08-24 | 基板処理装置及び基板処理方法 |
JP2016-163243 | 2016-08-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201820404A TW201820404A (zh) | 2018-06-01 |
TWI770046B true TWI770046B (zh) | 2022-07-11 |
Family
ID=61303462
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111121877A TWI799290B (zh) | 2016-08-24 | 2017-08-10 | 基板處理裝置及基板處理方法 |
TW106127060A TWI770046B (zh) | 2016-08-24 | 2017-08-10 | 基板處理裝置及基板處理方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111121877A TWI799290B (zh) | 2016-08-24 | 2017-08-10 | 基板處理裝置及基板處理方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6778548B2 (ja) |
CN (2) | CN207303050U (ja) |
TW (2) | TWI799290B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6778548B2 (ja) * | 2016-08-24 | 2020-11-04 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
KR102271566B1 (ko) * | 2019-10-28 | 2021-07-01 | 세메스 주식회사 | 기판 처리 장치 |
CN111458989B (zh) * | 2020-04-15 | 2023-05-09 | Tcl华星光电技术有限公司 | 显影设备 |
JP2023140684A (ja) * | 2022-03-23 | 2023-10-05 | 株式会社Screenホールディングス | 基板処理装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444029B1 (en) * | 1998-06-24 | 2002-09-03 | Tokyo Electron Limited | Multistage spin type substrate processing system |
US20140017615A1 (en) * | 2012-07-11 | 2014-01-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for resist coating and developing |
US9086190B2 (en) * | 2010-05-06 | 2015-07-21 | Tokyo Electron Limited | Chemical supply system, substrate treatment apparatus incorporating the same, and coating and developing system incorporating the same apparatus |
TWI524399B (zh) * | 2010-12-28 | 2016-03-01 | 東京威力科創股份有限公司 | 液體處理裝置及液體處理方法 |
TWI525687B (zh) * | 2011-11-21 | 2016-03-11 | Tokyo Electron Ltd | 液體處理裝置及液體處理方法 |
TWI545678B (zh) * | 2014-02-27 | 2016-08-11 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1140472A (ja) * | 1997-07-17 | 1999-02-12 | Sony Corp | 基板処理装置 |
JP3573445B2 (ja) * | 1998-07-31 | 2004-10-06 | 東京エレクトロン株式会社 | 現像装置及び洗浄装置 |
JP4339026B2 (ja) * | 2003-06-13 | 2009-10-07 | 東京エレクトロン株式会社 | 基板処理装置 |
JP2005079219A (ja) * | 2003-08-29 | 2005-03-24 | Tokyo Electron Ltd | 基板処理装置 |
JP2006286835A (ja) * | 2005-03-31 | 2006-10-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
EP2051285B1 (en) * | 2007-10-17 | 2011-08-24 | Ebara Corporation | Substrate cleaning apparatus |
JP5588418B2 (ja) * | 2011-10-24 | 2014-09-10 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
KR101512560B1 (ko) * | 2012-08-31 | 2015-04-15 | 가부시키가이샤 스크린 홀딩스 | 기판처리장치 |
JP6057624B2 (ja) * | 2012-09-03 | 2017-01-11 | 株式会社Screenセミコンダクターソリューションズ | カップおよび基板処理装置 |
JP6005604B2 (ja) * | 2012-09-13 | 2016-10-12 | 東京エレクトロン株式会社 | 現像処理装置 |
JP5954195B2 (ja) * | 2013-01-24 | 2016-07-20 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP6778548B2 (ja) * | 2016-08-24 | 2020-11-04 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
-
2016
- 2016-08-24 JP JP2016163243A patent/JP6778548B2/ja active Active
-
2017
- 2017-08-10 TW TW111121877A patent/TWI799290B/zh active
- 2017-08-10 TW TW106127060A patent/TWI770046B/zh active
- 2017-08-24 CN CN201721064087.4U patent/CN207303050U/zh not_active Withdrawn - After Issue
- 2017-08-24 CN CN201710733231.7A patent/CN107785292B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444029B1 (en) * | 1998-06-24 | 2002-09-03 | Tokyo Electron Limited | Multistage spin type substrate processing system |
US9086190B2 (en) * | 2010-05-06 | 2015-07-21 | Tokyo Electron Limited | Chemical supply system, substrate treatment apparatus incorporating the same, and coating and developing system incorporating the same apparatus |
TWI524399B (zh) * | 2010-12-28 | 2016-03-01 | 東京威力科創股份有限公司 | 液體處理裝置及液體處理方法 |
TWI525687B (zh) * | 2011-11-21 | 2016-03-11 | Tokyo Electron Ltd | 液體處理裝置及液體處理方法 |
US20140017615A1 (en) * | 2012-07-11 | 2014-01-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for resist coating and developing |
TWI545678B (zh) * | 2014-02-27 | 2016-08-11 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107785292A (zh) | 2018-03-09 |
TWI799290B (zh) | 2023-04-11 |
CN107785292B (zh) | 2024-01-05 |
TW202238675A (zh) | 2022-10-01 |
JP6778548B2 (ja) | 2020-11-04 |
TW201820404A (zh) | 2018-06-01 |
JP2018032696A (ja) | 2018-03-01 |
CN207303050U (zh) | 2018-05-01 |
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