TWI768240B - Low Profile Heat Sink - Google Patents
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Abstract
本發明係有關一種薄型均溫散熱片，其依序層疊一離型層；一黏著層；一基材層；以及一均溫散熱層，將複數個導熱填料混含於樹脂材料中，且令複數個導熱填料的分佈密度由上而下漸增；其中，該樹脂材料選用壓克力樹脂、聚脂樹脂、聚胺脂、胺基樹脂、醇酸樹脂、纖維素樹脂、硝基樹脂、醇基樹脂、吡咯烷酮基樹脂或氟樹脂之組合，而利用不同樹脂材料間之相分離效應令複數個導熱填料的分佈密度由上而下漸增。藉此，具有兼備平面均熱及垂直導熱的散熱特性之功效，且解決先前技術的散熱片以熱輻射散熱為主而無法在有限空間中產生良好散熱能力之問題，具有降低表面熱輻射散熱行為進而產生良好散熱能力之功效。The present invention relates to a thin heat-dissipating fin, which sequentially laminates a release layer; an adhesive layer; a substrate layer; and a heat-dissipating layer. The distribution density of the plurality of thermally conductive fillers increases gradually from top to bottom; among them, the resin material is selected from acrylic resin, polyester resin, polyurethane, amino resin, alkyd resin, cellulose resin, nitro resin, alcohol A combination of base resin, pyrrolidone-based resin or fluororesin, and the phase separation effect between different resin materials is used to make the distribution density of a plurality of thermally conductive fillers gradually increase from top to bottom. Thereby, it has the effect of having both planar heat dissipation and vertical heat dissipation, and solves the problem that the heat sink of the prior art mainly focuses on heat radiation and cannot generate good heat dissipation in a limited space, and can reduce the surface heat radiation behavior. And then produce the effect of good heat dissipation capacity.
Description
本發明係有關一種薄型均溫散熱片，尤指一種將複數個導熱填料混含於樹脂材料中，且令複數個導熱填料的分佈密度由上而下漸層增加而構成均溫散熱層之設計者。The present invention relates to a thin heat-dissipating fin, especially a design of mixing a plurality of heat-conducting fillers into a resin material, and increasing the distribution density of the plurality of heat-conducting fillers gradually from top to bottom to form a heat-spreading layer By.
按，因應目前高速運算之通訊載具、超薄型筆記型電腦、虛擬實境應用穿戴式載具或未來的5G通訊系統元件高發熱量低散熱空間的機構設計，大量使用薄型均熱板及高平面導熱係數的石墨材料產品，進行無風扇式的薄型化散熱結構設計已成為主流的解決方案；其中，具有高平面導熱係數的石墨材料〜天然/人造石墨紙產品是現行用於擴散局部熱量的主要散熱材料的首選。According to the current high-speed computing communication vehicles, ultra-thin notebook computers, wearable vehicles for virtual reality applications, or future 5G communication system components with high heat generation and low heat dissipation space, a large number of thin vapor chambers and high heat dissipation space are used. For graphite material products with planar thermal conductivity, fanless thin heat dissipation structure design has become a mainstream solution; among them, graphite materials with high planar thermal conductivity ~ natural/artificial graphite paper products are currently used for diffusing local heat. The first choice for the main heat dissipation material.
次按，近年來應用於上述散熱結構的石墨材料市售品以天然/人造石墨紙為主，其產品結構由上至下分別為：表面覆膜〜貼合膠〜天然/人造石墨紙(〜貼合膠〜底層覆膜)〜貼合膠〜離型紙；製造手段可區分成：第一，以天然石墨粉複合微量的可塑性樹脂進行輾壓成型石墨複材片，並經高溫燒結後脫脂後形成石墨片材胚料，最後再經反覆高壓輾壓提升密度形成平面導熱係數介於400W/mK〜900W/mK的天然石墨紙；第二，以聚醯亞胺膜為原料分別經過溫度範圍400℃〜1000℃及1200℃〜1800℃的碳化製程後，再經過2400℃〜2800℃的石墨化製程後製得平面導熱係數介於1200W/mK〜1700W/mK的人造石墨紙產品。上述產品雖因具有平面高導熱特性，而被廣泛導入現行的薄型散熱模組設計中，不過由於天然/人造石墨紙的垂直導熱係數較低、厚度薄所衍生之熱通量不足、加工手段繁複且須超高溫熱燒結製程與成品機械強度弱，故衍生之加工成型良率低之問題。因此，現有對應的生產製程通常都須將上述天然/人造石墨紙的兩側，透過反覆貼合的製程形成連續堆疊的積層結構，此舉不僅將大幅降低原先已經不佳的垂直傳熱能力外，更有甚者，為避免後續貼合於模組表面產生破碎掉粉的情況，各廠均針對雙面覆膜封邊開發對應的製程設備及貼合製程以改善製程良率，此舉均大幅度增加了現行石墨紙產品的製程困難及複雜度與單位製造成本。Second, in recent years, the commercially available products of graphite materials applied to the above-mentioned heat dissipation structure are mainly natural/artificial graphite paper, and its product structure from top to bottom is respectively: surface coating~lamination glue~natural/artificial graphite paper (~ Lamination glue ~ bottom layer coating) ~ lamination glue ~ release paper; the manufacturing method can be divided into: first, the graphite composite sheet is formed by rolling with natural graphite powder and a small amount of plastic resin, and degreased after high temperature sintering Graphite sheet blanks are formed, and finally, the density is increased by repeated high-pressure rolling to form natural graphite paper with a plane thermal conductivity of 400W/mK～900W/mK; After the carbonization process of ℃~1000℃ and 1200℃~1800℃, and then through the graphitization process of 2400℃~2800℃, the artificial graphite paper products with planar thermal conductivity between 1200W/mK~1700W/mK are obtained. Although the above-mentioned products are widely used in the current thin heat dissipation module design due to their planar high thermal conductivity, due to the low vertical thermal conductivity of natural/artificial graphite paper, insufficient heat flux due to thin thickness, and complicated processing methods In addition, the ultra-high temperature thermal sintering process is required and the mechanical strength of the finished product is weak, so the problem of low processing and molding yield is derived. Therefore, the existing corresponding production process usually requires two sides of the above-mentioned natural/artificial graphite paper to be repeatedly laminated to form a continuously stacked layered structure, which will not only greatly reduce the original poor vertical heat transfer ability. , What's more, in order to avoid the subsequent lamination on the surface of the module to produce broken powder, each factory has developed corresponding process equipment and lamination process for double-sided lamination and edge sealing to improve the process yield. It greatly increases the process difficulty and complexity and unit manufacturing cost of the current graphite paper products.
其次，具有高平面導熱係數(導熱係數大於1200W/mK)的天然/人造石墨紙之通常厚度界於25〜40μm間，此厚度下所具備的熱焓量對高速運算下所衍生的散熱需求已不敷使用，故許多散熱模組廠會藉貼合多層石墨紙(通常為3〜7層)提升整體橫向熱通量以達到散熱需求目標，此類做法不僅大幅增加製造的流程及成本，石墨紙脆弱的機械物性將更容易使成品不良率大幅提升。Secondly, the usual thickness of natural/artificial graphite paper with high planar thermal conductivity (thermal conductivity greater than 1200W/mK) is between 25 and 40 μm. It is not enough to use, so many heat dissipation module factories will increase the overall horizontal heat flux by laminating multi-layer graphite paper (usually 3 to 7 layers) to achieve the target of heat dissipation. The fragile mechanical properties of paper will make it easier to greatly increase the defective rate of finished products.
另一方面，為改善上述的問題，透過其他同具高導熱特性的奈米材料諸如奈米碳管(Carbon nanotube)、奈米石墨片(Graphite nanoplate)或石墨烯(Graphene)等材料為主的散熱片製程技術大量發表，其產品結構由上至下分別為：表面覆膜〜貼合膠〜散熱功能性塗層〜金屬薄膜〜貼合膠〜離型紙；現行以奈米碳管、奈米石墨片或石墨烯為主的散熱膜/片產品的技術開發手段，多將上述奈米材料進行分散製程油墨，並透過滾塗、噴塗或浸塗等塗佈製程塗佈於具有高導熱特性的金屬基材(如銅箔或鋁箔)表面形成奈米碳材/金屬複合散熱片產品，此類散熱片雖同具薄膜型式的特徵，但散熱行為則與上述強調平面導熱特徵的石墨紙不同而轉以熱輻射散熱特性為主，故在有限空間中所能產生的散熱能力仍無法與現有天然/人造石墨紙散熱產品匹敵。On the other hand, in order to improve the above-mentioned problems, other nanomaterials with high thermal conductivity such as carbon nanotubes, Graphite nanoplates or Graphene are used as the main materials. The process technology of heat sinks has been published a lot. The product structure from top to bottom is: surface coating ~ lamination glue ~ heat dissipation functional coating ~ metal film ~ lamination glue ~ release paper; For the technological development of graphite sheet or graphene-based heat dissipation film/sheet products, the above-mentioned nanomaterials are often dispersed in ink, and are coated on a thermally conductive material with high thermal conductivity through coating processes such as roller coating, spray coating or dip coating. Carbon nanomaterials/metal composite heat sink products are formed on the surface of metal substrates (such as copper foil or aluminum foil). Although these heat sinks have the same characteristics as thin films, their heat dissipation behavior is different from the above-mentioned graphite paper that emphasizes planar thermal conductivity. It is mainly based on heat radiation and heat dissipation characteristics, so the heat dissipation capacity that can be generated in a limited space is still unable to match the existing natural/artificial graphite paper heat dissipation products.
本發明之主要目的，係欲提供一種薄型均溫散熱片，具有兼備平面均熱及垂直導熱的散熱特性之功效。The main purpose of the present invention is to provide a thin heat-dissipating fin, which has the effect of having both planar heat-dissipating and vertical heat-dissipating heat dissipation properties.
本發明之另一目的，則欲解決先前技術的散熱片以熱輻射散熱為主而無法在有限空間中產生良好散熱能力之問題，具有降低表面熱輻射散熱行為進而產生良好散熱能力之功效。Another object of the present invention is to solve the problem that the prior art heat sink mainly focuses on heat radiation and cannot generate good heat dissipation in a limited space, and has the effect of reducing the surface heat radiation behavior to generate good heat dissipation.
為達上述功效，本發明之結構特徵，係依序層疊一離型層；一黏著層；一基材層；以及一均溫散熱層，厚度介於12μm 〜50μm，其將複數個導熱填料混含於樹脂材料中，且令複數個導熱填料的分佈密度由上而下漸層增加；其中，該樹脂材料選用壓克力樹脂、聚脂樹脂、聚胺脂、胺基樹脂、醇酸樹脂、纖維素樹脂、硝基樹脂、醇基樹脂、吡咯烷酮基樹脂或氟樹脂之組合，而利用不同樹脂材料間之極性差異而產生相分離效應，致使複數個導熱填料的分佈密度由上而下漸增。In order to achieve the above-mentioned effects, the structural features of the present invention are to sequentially stack a release layer; an adhesive layer; a substrate layer; It is contained in the resin material, and the distribution density of the plurality of thermally conductive fillers is gradually increased from top to bottom; wherein, the resin material is selected from acrylic resin, polyester resin, polyurethane, amine resin, alkyd resin, The combination of cellulose resin, nitro resin, alcohol-based resin, pyrrolidone-based resin or fluororesin, and the use of the polarity difference between different resin materials to produce a phase separation effect, resulting in a plurality of thermally conductive fillers The distribution density increases from top to bottom .
再者，該樹脂材料之組合成分中，最低極性樹脂材料的重量占比介於25％〜50％，最低極性樹脂材料最佳的重量占比介於30％〜40％。Furthermore, in the composition of the resin material, the weight proportion of the lowest polarity resin material is between 25% and 50%, and the optimal weight proportion of the lowest polarity resin material is between 30% and 40%.
另者，該導熱填料選用奈米碳管、天然石墨、人造石墨、薄型石墨片、石墨烯、寡層石墨烯、氧化石墨烯、氧化石墨、還原氧化石墨烯、碳黑之一或一種以上的組合；其中，該導熱填料選用碳含量≥98％、石墨烯層厚度≦2.5nm、石墨烯片徑平均片徑分布範圍介於0.1μm〜1.5μm、表面氧含量>1％的寡層石墨烯。In addition, the thermally conductive filler is selected from one or more of carbon nanotubes, natural graphite, artificial graphite, thin graphite flakes, graphene, few-layer graphene, graphene oxide, graphite oxide, reduced graphene oxide, and carbon black. combination; wherein, the thermally conductive filler is selected from the few-layer graphene with carbon content ≥ 98%, graphene layer thickness ≤ 2.5nm, graphene sheet diameter average sheet diameter distribution range between 0.1 μm ~ 1.5 μm, surface oxygen content> 1% .
又，該黏著層選用壓克力膠，該基材層選用銅箔、合金銅箔、鋁箔、合金鋁箔、不鏽鋼箔之一或一種以上的組合；其中，該黏著層的厚度介於5μm〜30μm，該基材層的厚度介於5μm〜100μm。Also, the adhesive layer is selected from acrylic glue, and the base material layer is selected from one or more combinations of copper foil, copper alloy foil, aluminum foil, aluminum alloy foil, and stainless steel foil; wherein, the thickness of the adhesive layer is between 5 μm and 30 μm. , the thickness of the substrate layer is between 5 μm and 100 μm.
然而，該均溫散熱層上表面的導熱填料分佈密度介於5％〜55％，該均溫散熱層下表面的導熱填料分佈密度介於58％〜97％；其中，該均溫散熱層上表面的導熱填料分佈密度最佳介於10％〜20％，該均溫散熱層下表面的導熱填料分佈密度最佳介於80％〜90％。However, the distribution density of the thermally conductive fillers on the upper surface of the temperature uniformity and heat dissipation layer is between 5% and 55%, and the distribution density of the thermally conductive fillers on the lower surface of the temperature uniformity and heat dissipation layer is between 58% and 97%. The optimal distribution density of the thermally conductive filler on the surface is between 10% and 20%, and the optimal distribution density of the thermally conductive filler on the lower surface of the temperature uniformity heat dissipation layer is between 80% and 90%.
藉此，將複數個導熱填料混含於樹脂材料中，且令複數個導熱填料的分佈密度由上而下漸層增加而構成均溫散熱層，兼備平面均熱及垂直導熱的散熱特性。In this way, a plurality of thermally conductive fillers are mixed into the resin material, and the distribution density of the plurality of thermally conductive fillers is gradually increased from top to bottom to form a temperature-spreading and heat-dissipating layer, which has both planar heat-dissipation and vertical heat-dissipation characteristics.
首先，請參閱［圖1〕所示，本發明係依序層疊一離型層10；一黏著層20；一基材層30；以及一均溫散熱層40，將複數個導熱填料41混含於樹脂材料42中，且令複數個導熱填料41的分佈密度由上而下漸增；其中，該樹脂材料42選用壓克力樹脂、聚脂樹脂、聚胺脂、胺基樹脂、醇酸樹脂、纖維素樹脂、硝基樹脂、醇基樹脂、吡咯烷酮基樹脂或氟樹脂之組合，而利用不同樹脂材料間之相分離效應令複數個導熱填料的分佈密度由上而下漸增。而本發明之製備方法乃包括分散步驟、混合步驟、貼合步驟及塗佈步驟：其中，分散步驟：將導熱填料41與處理溶劑於一定比例下產生高濃度導熱填料懸浮液；混合步驟：先將複數種樹脂材料42與溶劑混合形成黏著劑溶液，再將高濃度導熱填料懸浮液與黏著劑溶液均勻混合形成導熱填料樹脂糊料；貼合步驟：將一緻密基材層30與低熱阻性的黏著層20經滾壓貼合；塗佈步驟：將導熱填料樹脂糊料連續塗佈於緻密基材層30表面，控制適當加熱條件乾燥形成高導熱性的均溫散熱層40，而於乾燥過程中因重力及不同樹脂材料42黏度分佈產生相分離效應，致使內含之導熱填料41由上而下漸增分佈於均溫散熱層40內。First, as shown in FIG. 1 , in the present invention, a
實施例一： 1.將導熱填料、溶劑及分散劑等原料製備一高濃度導熱填料懸浮液；其中：導熱填料為寡層石墨烯，其特徵包含：碳含量≥98%、石墨烯層厚度≦2.5nm、石墨烯片徑平均片徑分布範圍介於0.1μm〜1.5μm，最佳分佈範圍介於0.3μm〜0.8μm、表面氧含量>1%；溶劑為二甲苯，分散劑為PVP K〜30及K〜90混合物。而將導熱性填料/分散劑/溶劑以2/1/7比例混合後，以低能球磨混合法進行均勻化製程，使用密度5.7g/cm3 的氧化鋯珠，研磨珠直徑比為4/2/1，填充重量比例為2/3/3，混合72小時後過濾形成導熱填料懸浮液，導熱填料懸浮液中導熱填料含量介於20〜23%，流動黏度介於1200〜4000cps。 2. 先將樹脂材料/溶劑以重量比2/8混合形成黏著劑溶液；其中，樹脂材料為壓克力樹脂、醇酸樹脂及聚胺脂的混合物，混合重量比例為2/1/0.5；溶劑為甲苯、二甲苯與乙酸丁酯的混合物。再將導熱性填料懸浮液/黏著劑溶液高速均質混合形成導熱填料樹脂糊料，攪拌轉速達16000rpm，模頭間距1mm，處理時間為1小時，導熱填料樹脂糊料的導熱填料含量介於15〜18%，流動黏度介於4000〜7000cps。 3.將一緻密基材層與低熱阻性的黏著層經滾壓貼合，貼合壓力為10〜30kg/cm2 ，貼合線速度為20m/min；其中：緻密基材層為電解銅箔，厚度為17um；低熱阻性黏著層材質為壓克力膠，厚度為15um。 4.將導熱填料樹脂糊料連續塗佈於基材層表面，並控制加熱條件乾燥形成高導熱性的均溫散熱層，其中：濕膜厚度為60um，塗佈線速度6〜8m/min，烘乾溫度介於90〜130℃。乾燥形成之均溫散熱層之厚度為15um，均溫散熱層上表面的導熱填料分佈密度為55％，均溫散熱層下表面的導熱填料分佈密度為60％。Embodiment 1: 1. Prepare a high-concentration thermally conductive filler suspension from raw materials such as thermally conductive fillers, solvents and dispersants; wherein: the thermally conductive filler is oligo-layer graphene, and its characteristics include: carbon content≥98%, graphene layer thickness≤ 2.5nm, graphene sheet diameter average sheet size distribution range is between 0.1μm～1.5μm, optimal distribution range is between 0.3μm～0.8μm, surface oxygen content>1%; solvent is xylene, dispersant is PVP K～ 30 and K~90 mixture. After mixing the thermal conductive filler/dispersant/solvent in a ratio of 2/1/7, the homogenization process is carried out by a low-energy ball milling mixing method, using zirconia beads with a density of 5.7g/ cm3 , and the diameter ratio of the grinding beads is 4/2 /1, the filling weight ratio is 2/3/3, and after mixing for 72 hours, a thermally conductive filler suspension is formed by filtering. 2. First, the resin material/solvent is mixed with a weight ratio of 2/8 to form an adhesive solution; wherein, the resin material is a mixture of acrylic resin, alkyd resin and polyurethane, and the mixing weight ratio is 2/1/0.5; The solvent is a mixture of toluene, xylene and butyl acetate. The thermal conductive filler suspension/adhesive solution is then homogeneously mixed at a high speed to form a thermally conductive filler resin paste. The stirring speed reaches 16000rpm, the distance between the die heads is 1mm, the processing time is 1 hour, and the thermally conductive filler content of the thermally conductive filler resin paste is between 15~ 18%, the flow viscosity is between 4000~7000cps. 3. The dense base material layer and the low thermal resistance adhesive layer are laminated by rolling, the lamination pressure is 10~30kg/cm 2 , and the lamination line speed is 20m/min; wherein: the dense base material layer is electrolytic copper Foil, thickness of 17um; low thermal resistance adhesive layer material is acrylic glue, thickness of 15um. 4. Continuously coat the thermally conductive filler resin paste on the surface of the base material layer, and control the heating conditions to dry to form a high thermal conductivity uniform temperature heat dissipation layer, wherein: the wet film thickness is 60um, and the coating line speed is 6~8m/min, The drying temperature is between 90~130℃. The thickness of the uniform temperature radiating layer formed by drying is 15um, the distribution density of the thermally conductive filler on the upper surface of the uniform temperature radiating layer is 55%, and the distribution density of the thermally conductive filler on the lower surface of the uniform temperature radiating layer is 60%.
實施例二： 1.將導熱填料、溶劑及分散劑等原料製備一高濃度導熱填料懸浮液；其中：導熱填料為寡層石墨烯，其特徵包含：碳含量≥98%、石墨烯層厚度≦2.5nm、石墨烯片徑平均片徑分布範圍介於0.1μm〜1.5μm，最佳分佈範圍介於0.3μm〜0.8μm、表面氧含量>1%；溶劑為乙酸丁酯，分散劑為PVP K〜30及K〜90混合物。而將導熱性填料/分散劑/溶劑以2/0.5/7.5比例混合後，以低能球磨混合法進行均勻化製程，使用密度5.7g/cm3 的氧化鋯珠，研磨珠直徑比為4/2/1，填充重量比例為2/3/3，混合72小時後過濾形成導熱填料懸浮液，導熱填料懸浮液中導熱填料含量介於20〜23%，流動黏度介於800〜1200cps。 2. 先將樹脂材料/溶劑以重量比2/8混合形成黏著劑溶液；其中，樹脂材料為壓克力樹脂、聚脂樹脂及吡咯烷酮基樹脂的混合物，混合重量比例為2/2/1；溶劑為乙酸丁酯、甲苯與二甲苯的混合物。再將導熱性填料懸浮液/黏著劑溶液高速均質混合形成導熱填料樹脂糊料，攪拌轉速達16000rpm，模頭間距1mm，處理時間為1小時，導熱填料樹脂糊料的導熱填料含量介於16〜18%，流動黏度介於3000〜6000cps。 3. 將一緻密基材層與低熱阻性的黏著層經滾壓貼合，貼合壓力為10〜30kg/cm2 ，貼合線速度為20m/min；其中：緻密基材層為電解銅箔，厚度為33um；低熱阻性黏著層材質為壓克力膠，厚度為15um。 4.將導熱填料樹脂糊料連續塗佈於基材層表面，並控制加熱條件乾燥形成高導熱性的均溫散熱層，其中：濕膜厚度為60um，塗佈線速度5〜7m/min，烘乾溫度介於90〜150℃。乾燥形成之均溫散熱層之厚度為15um，均溫散熱層上表面的導熱填料分佈密度為55％，均溫散熱層下表面的導熱填料分佈密度為58％。Embodiment 2: 1. Prepare a high-concentration thermally conductive filler suspension from raw materials such as thermally conductive fillers, solvents and dispersants; wherein: the thermally conductive filler is oligo-layer graphene, and its characteristics include: carbon content≥98%, graphene layer thickness≤ 2.5nm, graphene sheet diameter average sheet size distribution range is between 0.1μm~1.5μm, optimal distribution range is between 0.3μm~0.8μm, surface oxygen content>1%; solvent is butyl acetate, dispersant is PVP K ~30 and K~90 mixture. After mixing the thermal conductive filler/dispersant/solvent in a ratio of 2/0.5/7.5, the homogenization process is carried out by a low-energy ball milling mixing method, using zirconia beads with a density of 5.7g/ cm3 , and the diameter ratio of the grinding beads is 4/2 /1, the filling weight ratio is 2/3/3, and after mixing for 72 hours, a thermally conductive filler suspension is formed by filtering. 2. First mix the resin material/solvent with a weight ratio of 2/8 to form an adhesive solution; wherein, the resin material is a mixture of acrylic resin, polyester resin and pyrrolidone-based resin, and the mixing weight ratio is 2/2/1; The solvent was a mixture of butyl acetate, toluene and xylene. The thermal conductive filler suspension/adhesive solution is then homogeneously mixed at a high speed to form a thermally conductive filler resin paste. The stirring speed reaches 16000 rpm, the distance between the die heads is 1 mm, and the processing time is 1 hour. The thermal conductive filler content of the thermally conductive filler resin paste is between 16~ 18%, the flow viscosity is between 3000~6000cps. 3. The dense base material layer and the low thermal resistance adhesive layer are laminated by rolling, the lamination pressure is 10~30kg/cm 2 , and the lamination line speed is 20m/min; wherein: the dense base material layer is electrolytic copper Foil, the thickness is 33um; the low thermal resistance adhesive layer material is acrylic glue, the thickness is 15um. 4. Continuously coat the thermally conductive filler resin paste on the surface of the base material layer, and control the heating conditions to dry to form a high thermal conductivity uniform temperature heat dissipation layer, wherein: the wet film thickness is 60um, and the coating line speed is 5~7m/min, The drying temperature is between 90~150℃. The thickness of the uniform temperature radiating layer formed by drying is 15um, the distribution density of the thermally conductive filler on the upper surface of the uniform temperature radiating layer is 55%, and the distribution density of the thermally conductive filler on the lower surface of the uniform temperature radiating layer is 58%.
實施例三： 1.將導熱填料、溶劑及分散劑等原料製備一高濃度導熱填料懸浮液，其中：導熱填料為寡層石墨烯，其特徵包含：碳含量≥98%、石墨烯層厚度≦2.5nm、石墨烯片徑平均片徑分布範圍介於0.1μm〜1.5μm，最佳分佈範圍介於0.3μm〜0.8μm、表面氧含量>1%；溶劑為乙酸丁酯，分散劑為PVP K〜30及K〜90混合物。而將導熱性填料/分散劑/溶劑以2/0.5/7.5比例混合後，以低能球磨混合法進行均勻化製程，使用密度5.7g/cm3 的氧化鋯珠，研磨珠直徑比為4/2/1，填充重量比例為2/3/3，混合72小時後經過濾形成導熱填料懸浮液，導熱填料懸浮液中導熱填料含量介於20〜23%，流動黏度介於800〜1200cps。 2. 先將樹脂材料/溶劑以重量比2/8混合形成黏著劑溶液；其中，樹脂材料為壓克力樹脂、纖維素樹脂及醇基樹脂的混合物，混合重量比例為1/2/2；溶劑為乙酸丁酯、甲苯、二甲苯與松油醇的混合物。再將導熱性填料懸浮液/黏著劑溶液高速均質混合形成導熱填料樹脂糊料，攪拌轉速達16000rpm，模頭間距1mm，處理時間為1小時，導熱填料樹脂糊料的導熱填料含量介於14〜16%，流動黏度介於1000〜3000cps。 3. 將一緻密基材層與低熱阻性的黏著層經滾壓貼合，貼合壓力為10〜30kg/cm2 ，貼合線速度為20m/min；其中：緻密基材層為電解銅箔，厚度為33um；低熱阻性黏著層材質為壓克力膠，厚度為10um。 4. 將導熱填料樹脂糊料連續塗佈於基材層表面，並控制加熱條件乾燥形成高導熱性的均溫散熱層，其中：濕膜厚度為130um，塗佈線速度5〜7m/min，烘乾溫度介於90〜150℃。乾燥形成之均溫散熱層之厚度為25um，均溫散熱層上表面的導熱填料分佈密度為15％，均溫散熱層下表面的導熱填料分佈密度為90％。Embodiment 3: 1. Prepare a high-concentration thermally conductive filler suspension from raw materials such as thermally conductive fillers, solvents and dispersants, wherein: the thermally conductive fillers are oligo-layer graphene, and its characteristics include: carbon content ≥ 98%, graphene layer thickness≤ 2.5nm, graphene sheet diameter average sheet size distribution range is between 0.1μm~1.5μm, optimal distribution range is between 0.3μm~0.8μm, surface oxygen content>1%; solvent is butyl acetate, dispersant is PVP K ~30 and K~90 mixture. After mixing the thermal conductive filler/dispersant/solvent in a ratio of 2/0.5/7.5, the homogenization process is carried out by a low-energy ball milling mixing method, using zirconia beads with a density of 5.7g/ cm3 , and the diameter ratio of the grinding beads is 4/2 /1, the filling weight ratio is 2/3/3, and after mixing for 72 hours, a thermally conductive filler suspension is formed by filtering. 2. First mix the resin material/solvent with a weight ratio of 2/8 to form an adhesive solution; wherein, the resin material is a mixture of acrylic resin, cellulose resin and alcohol-based resin, and the mixing weight ratio is 1/2/2; The solvent is a mixture of butyl acetate, toluene, xylene and terpineol. The thermally conductive filler suspension/adhesive solution is then homogeneously mixed at a high speed to form a thermally conductive filler resin paste, the stirring speed is 16000rpm, the die head spacing is 1mm, the processing time is 1 hour, and the thermally conductive filler resin paste The content of the thermally conductive filler is between 14~ 16%, the flow viscosity is between 1000~3000cps. 3. The dense base material layer and the low thermal resistance adhesive layer are laminated by rolling, the lamination pressure is 10~30kg/cm 2 , and the lamination line speed is 20m/min; wherein: the dense base material layer is electrolytic copper Foil, thickness of 33um; low thermal resistance adhesive layer material is acrylic glue, thickness of 10um. 4. Continuously coat the thermal conductive filler resin paste on the surface of the substrate layer, and control the heating conditions to dry to form a high thermal conductivity uniform temperature heat dissipation layer, wherein: the wet film thickness is 130um, the coating line speed is 5~7m/min, The drying temperature is between 90~150℃. The thickness of the uniform temperature radiating layer formed by drying is 25um, the distribution density of the thermally conductive filler on the upper surface of the uniform temperature radiating layer is 15%, and the distribution density of the thermally conductive filler on the lower surface of the uniform temperature radiating layer is 90%.
實施例四： 1.將導熱填料、溶劑及分散劑等原料製備一高濃度導熱填料懸浮液，其中：導熱填料為寡層石墨烯，其特徵包含：碳含量≥98%、石墨烯層厚度≦2.5nm、石墨烯片徑平均片徑分布範圍介於0.1μm〜1.5μm，最佳分佈範圍介於0.3μm〜0.8μm、表面氧含量>1%；溶劑為乙酸丁酯，分散劑為PVP K〜30及K〜90混合物。而將導熱性填料/分散劑/溶劑以2/0.5/7.5比例混合後，以低能球磨混合法進行均勻化製程，使用密度5.7g/cm3 的氧化鋯珠，研磨珠直徑比為4/2/1，填充重量比例為2/3/3，混合72小時後經過濾形成導熱填料懸浮液，導熱填料懸浮液中導熱填料含量介於20〜23%，流動黏度介於800〜1200cps。 2. 先將樹脂材料/溶劑以重量比2/8混合形成黏著劑溶液；其中，樹脂材料為壓克力樹脂、纖維素樹脂及醇基樹脂的混合物，混合重量比例為1/2/2；溶劑為乙酸丁酯、甲苯、二甲苯與二元酸酯的混合物。再將導熱性填料懸浮液/黏著劑溶液高速均質混合形成導熱填料樹脂糊料，攪拌轉速達16000rpm，模頭間距1mm，處理時間為1小時，導熱填料樹脂糊料的導熱填料含量介於14〜16%，流動黏度介於1000〜3000cps。 3. 將一緻密基材層與低熱阻性的黏著層經滾壓貼合，貼合壓力為10〜30kg/cm2，貼合線速度為20m/min；其中：緻密基材層為電解銅箔，厚度為50um；低熱阻性黏著層材質為壓克力膠，厚度為10um。 4. 將導熱填料樹脂糊料連續塗佈於基材層表面，並控制加熱條件乾燥形成高導熱性的均溫散熱層，其中：濕膜厚度為130um，塗佈線速度5〜7m/min，烘乾溫度介於90〜150℃。乾燥形成之均溫散熱層之厚度為25um，均溫散熱層上表面的導熱填料分佈密度為15％，均溫散熱層下表面的導熱填料分佈密度為90％。Embodiment 4: 1. Prepare a high-concentration thermally conductive filler suspension from raw materials such as thermally conductive fillers, solvents and dispersants, wherein: the thermally conductive filler is oligo-layer graphene, and its characteristics include: carbon content≥98%, graphene layer thickness≤ 2.5nm, graphene sheet diameter average sheet size distribution range is between 0.1μm~1.5μm, optimal distribution range is between 0.3μm~0.8μm, surface oxygen content>1%; solvent is butyl acetate, dispersant is PVP K ~30 and K~90 mixture. After mixing the thermal conductive filler/dispersant/solvent in a ratio of 2/0.5/7.5, the homogenization process is carried out by a low-energy ball milling mixing method, using zirconia beads with a density of 5.7g/ cm3 , and the diameter ratio of the grinding beads is 4/2 /1, the filling weight ratio is 2/3/3, and after mixing for 72 hours, a thermally conductive filler suspension is formed by filtering. 2. First mix the resin material/solvent with a weight ratio of 2/8 to form an adhesive solution; wherein, the resin material is a mixture of acrylic resin, cellulose resin and alcohol-based resin, and the mixing weight ratio is 1/2/2; The solvent is a mixture of butyl acetate, toluene, xylene and dibasic acid esters. The thermally conductive filler suspension/adhesive solution is then homogeneously mixed at a high speed to form a thermally conductive filler resin paste, the stirring speed is 16000rpm, the die head spacing is 1mm, the processing time is 1 hour, and the thermally conductive filler resin paste The content of the thermally conductive filler is between 14~ 16%, the flow viscosity is between 1000~3000cps. 3. The dense base material layer and the low thermal resistance adhesive layer are laminated by rolling, the lamination pressure is 10~30kg/cm2, and the lamination line speed is 20m/min; wherein: the dense base material layer is electrolytic copper foil , the thickness is 50um; the material of the low thermal resistance adhesive layer is acrylic glue, the thickness is 10um. 4. Continuously coat the thermal conductive filler resin paste on the surface of the substrate layer, and control the heating conditions to dry to form a high thermal conductivity uniform temperature heat dissipation layer, wherein: the wet film thickness is 130um, the coating line speed is 5~7m/min, The drying temperature is between 90~150℃. The thickness of the uniform temperature radiating layer formed by drying is 25um, the distribution density of the thermally conductive filler on the upper surface of the uniform temperature radiating layer is 15%, and the distribution density of the thermally conductive filler on the lower surface of the uniform temperature radiating layer is 90%.
基於如是之構成，請參閱［圖2〕所示，透過包含一導熱塊50的測試模組，並以定溫度測試法量測本發明與市售石墨紙的散熱能力與均溫能力，量測結果如下表：其中，散熱片橫向溫度差數值越高可代表均溫能力越好，導熱塊縱向溫度差數值越高可代表散熱能力越好；因此，可知實施例3與石墨紙2的均溫能力相當而散熱能力有所提升，實施例4與石墨紙1的均溫能力相當而散熱能力有所提升；然而，實施例1、2的均溫能力雖然很好但散熱能力卻不佳，其乃因實施例1、2之均溫散熱層下表面的導熱填料分佈密度僅較上表面的導熱填料分佈密度微幅增加，致使實施例1、2的均溫能力很好，但散熱能力就不如兼具平面均熱及垂直導熱的實施例3、4。
是以，本發明將複數個導熱填料混含於樹脂材料中，且令複數個導熱填料的分佈密度由上而下漸層增加而構成的均溫散熱層，均溫能力可與石墨紙相當且散熱能力有所提升，具有兼備平面均熱及垂直導熱的散熱特性之功效，且解決先前技術的散熱片以熱輻射散熱為主而無法在有限空間中產生良好散熱能力之問題，具有降低表面熱輻射散熱行為進而產生良好散熱能力之功效。Therefore, in the present invention, a plurality of thermally conductive fillers are mixed into the resin material, and the distribution density of the plurality of thermally conductive fillers is gradually increased from top to bottom. The heat dissipation capacity has been improved, and it has the effect of having the heat dissipation characteristics of both flat heat dissipation and vertical heat conduction, and solves the problem that the heat sink of the prior art mainly focuses on heat radiation heat dissipation and cannot generate good heat dissipation capacity in a limited space, and has the ability to reduce surface heat. The radiative heat dissipation behavior produces the effect of good heat dissipation capacity.
綜上所述，本發明所揭示之技術手段，確具「新穎性」、「進步性」及「可供產業利用」等發明專利要件，祈請 鈞局惠賜專利，以勵發明，無任德感。To sum up, the technical means disclosed in the present invention do meet the requirements for invention patents such as "novelty", "progressiveness" and "availability for industrial use". Moral sense.
惟，上述所揭露之圖式、說明，僅為本發明之較佳實施例，大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或等效變化，仍應包括在本案申請專利範圍內。However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art according to the spirit of the present case should still be included in the scope of the patent application of the present case.
10:離型層 20:黏著層 30:基材層 40:均溫散熱層 41:導熱填料 42:樹脂材料 50:導熱塊10: Release layer 20: Adhesive layer 30: substrate layer 40: uniform temperature cooling layer 41: Thermally conductive filler 42: Resin material 50: Thermal block
［圖1〕係本發明之結構示意圖。 ［圖2〕係本發明散熱能力與均溫能力之量測方式說明圖。[Fig. 1] is a schematic diagram of the structure of the present invention. [FIG. 2] is an explanatory diagram of the measurement method of the heat dissipation capability and the temperature uniformity capability of the present invention.
10:離型層10: Release layer
20:黏著層20: Adhesive layer
30:基材層30: substrate layer
40:均溫散熱層40: uniform temperature cooling layer
41:導熱填料41: Thermally conductive filler
42:樹脂材料42: Resin material
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