CN105860866B - Equal thermal bonding tape - Google Patents

Equal thermal bonding tape Download PDF

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Publication number
CN105860866B
CN105860866B CN201610249636.9A CN201610249636A CN105860866B CN 105860866 B CN105860866 B CN 105860866B CN 201610249636 A CN201610249636 A CN 201610249636A CN 105860866 B CN105860866 B CN 105860866B
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parts
graphite
kapton
film
heat conduction
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CN201610249636.9A
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CN105860866A (en
Inventor
金闯
梁豪
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Jiangsu Stick New Materials Polytron Technologies Inc
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Jiangsu Stick New Materials Polytron Technologies Inc
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials

Abstract

A kind of equal thermal bonding tape of the present invention, graphite modified dose of painting are grouped as by the group of following parts by weight: benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, diaminodiphenylmethane, dimethylformamide, N-Methyl pyrrolidone, ethylene glycol, dimethyl silicone polymer, dibutyl phthalate；The heat conduction graphite patch passes through following steps and obtains: graphite modified dose of film is obtained treated Kapton in the upper surface of Kapton；Will that treated is cooling after Kapton is warming up to 1200 DEG C, to obtain the carbonized film of pre-burned；Roll the carbonized film of the pre-burned using calender；It is cooling after carbonized film is warming up to 2850 DEG C ~ 2950 DEG C；Graphite modified dose of the viscosity is 30000 ~ 48000CP.The present invention avoids hot-spot, while realizing the uniformity of heating conduction, improves the heat dissipation performance stability of product.

Description

Equal thermal bonding tape
Technical field
The present invention relates to a kind of equal thermal bonding tape, belong to soaking tape technology field.
Background technique
With modern microelectronic technology high speed development, electronic equipment (such as laptop, mobile phone, tablet computer) is increasingly Become ultra-thin, light, this structure significantly improves electronic equipment internal power density, and generated heat is not easy in operation It is discharged, is easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently It needs a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensures that electronic equipment operates normally.
Kapton is mostly used for flexible circuit board in the prior art, is obtained although having using polyimide film sintered Graphite heat radiation fin, to be covered on heat source, but be constrained to Kapton product quality and performances the good and the bad not Together, influenced the performance of the two-sided pad pasting heat dissipation performance of heat dissipation, there are following technical problems: heat dissipation is uneven, adhesive tape easily occurs Hot-spot, the heat dissipation performance for improving product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
Summary of the invention
Objects of the present invention are to provide a kind of equal thermal bonding tape, which improves in the vertical direction and the horizontal direction Heating conduction, avoids hot-spot, and while realize the uniformity of heating conduction, the heat dissipation performance for improving product is stablized Property, reliability, greatly reduce the cost of product.
To achieve the above object of the invention, the technical solution adopted by the present invention is that: a kind of equal thermal bonding tape, including heat conductive graphite patch Piece and thermally conductive adhesive layer coated on heat conduction graphite patch surface, this thermally conductive adhesive layer surface patch opposite with heat conduction graphite patch Conjunction has separated type material layer；The heat conduction graphite patch is made of Kapton, the first coat and the second coat, described First coat is located at Kapton upper surface；
First coat by film in Kapton upper surface graphite modified dosage form at this graphite modified dose Painting is grouped as by the group of following parts by weight: 24 parts of benzophenone tetracarboxylic dianhydride, 15 parts of pyromellitic acid anhydride, diamino hexichol 25 parts of methane, 21 parts of dimethylformamide, 10 parts of N-Methyl pyrrolidone, 1.6 parts of ethylene glycol, 2.6 parts of dimethyl silicone polymer, 1.4 parts of dibutyl phthalate；Graphite modified dose of the viscosity is 30000 ~ 48000 cP；
The heat conduction graphite patch is obtained by following steps:
Step 1: graphite modified dose of film is obtained in the upper surface of Kapton, treated that polyimides is thin Film；
Step 2: will that treated is cooling after Kapton is warming up to 1200 DEG C, to obtain the carbon of pre-burned Change film；
Step 3: rolling the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then cooled down after being warming up to 2850 DEG C ~ 2950 DEG C, To obtain the graphite film of main firing；
Step 5: the graphite film of resulting main firing is then carried out calendering to obtain the heat conduction graphite patch.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art:
1, the equal thermal bonding tape of the present invention, graphite linings are coated with one layer graphite modified dose of polyimides by upper surface in structure Film preparation forms, and improves heating conduction in the vertical direction and the horizontal direction, avoids adhesive tape hot-spot, realizes adhesive tape The uniformity of heating conduction；Secondly, its be located at graphite modified dose of Kapton surface by benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, 12 ~ 18 parts of pyromellitic acid anhydride, 20 ~ 28 parts of diaminodiphenylmethane, 30 ~ 35 parts of dimethylformamide, ethylene glycol 1.5 ~ 2.5 parts, 2 ~ 3 parts of dimethyl silicone polymer compositions, are coated on Kapton, the needle being filled in heating process Hole improves crystallinity simultaneously, also overcome be heat-shrinked it is excessive caused by it is uneven, improve graphite linings biaxial tension performance.
2, the equal thermal bonding tape of the present invention is located at graphite modified dose of Kapton surface by benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, 12 ~ 18 parts of pyromellitic acid anhydride, 20 ~ 28 parts of diaminodiphenylmethane, 20 ~ 25 parts of dimethylformamide, N- first 8 ~ 10 parts of base pyrrolidones, 1.5 ~ 2.5 parts of ethylene glycol, 2 ~ 3 parts of dimethyl silicone polymer composition, using dimethylformamide 20 ~ 25 parts, 8 ~ 10 parts of N-Methyl pyrrolidone reduce azeotropic point and smooth boiling point area, improve the flat of final products film forming Smooth property and flexibility；；Secondly, 20 ~ 25 parts of dimethylformamide, 8 ~ 10 parts of N-Methyl pyrrolidone and dibutyl phthalate 0.8 ~ 1.5 part of Kapton surface, prevents bubble from generating, and is more advantageous to the small pin hole of filled polyimide film, changes It has been apt to the uniformity of heat dissipation patch heating conduction.
3, the equal thermal bonding tape of the present invention, increases calendaring processes between the carbonized film and graphitization of pre-burned, and re-form Roll again after heat conduction graphite patch, avoid fold and be graphitized sintering process in volume contraction, improve compactness and Crystallinity further improves heating conduction in the vertical direction and the horizontal direction.
Specific embodiment
The present invention will be further described below with reference to examples:
Embodiment: a kind of equal thermal bonding tape, the heat-conducting glue including heat conduction graphite patch and coated on heat conduction graphite patch surface Adhesion coating, this thermally conductive adhesive layer surface opposite with heat conduction graphite patch are fitted with separated type material layer；The heat conduction graphite patch by Kapton, the first coat and the second coat composition, first coat are located at Kapton upper surface；
First coat by film in Kapton upper surface graphite modified dosage form at this graphite modified dose Painting is grouped as by the group of following parts by weight: 24 parts of benzophenone tetracarboxylic dianhydride, 15 parts of pyromellitic acid anhydride, diamino hexichol 25 parts of methane, 21 parts of dimethylformamide, 10 parts of N-Methyl pyrrolidone, 1.6 parts of ethylene glycol, 2.6 parts of dimethyl silicone polymer, 1.4 parts of dibutyl phthalate；Graphite modified dose of the viscosity is 30000 ~ 48000 cP；
The heat conduction graphite patch 1 is obtained by following steps:
Step 1: graphite modified dose of film is obtained in the upper surface of Kapton, treated that polyimides is thin Film；
Step 2: will that treated is cooling after Kapton is warming up to 1200 DEG C, to obtain the carbon of pre-burned Change film；
Step 3: rolling the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then cooled down after being warming up to 2850 DEG C ~ 2950 DEG C, To obtain the graphite film of main firing；
Step 5: the graphite film of resulting main firing is then carried out calendering to obtain the heat conduction graphite patch.
When using above-mentioned equal thermal bonding tape, the polyamides that graphite linings are coated with one layer graphite modified dose by upper surface in structure is sub- Amine film preparation forms, and improves heating conduction in the vertical direction and the horizontal direction, avoids adhesive tape hot-spot, realizes glue Uniformity with heating conduction；Secondly, it is located at graphite modified dose of Kapton surface by benzophenone tetracarboxylic dianhydride 20 ~ 25 parts, 12 ~ 18 parts of pyromellitic acid anhydride, 20 ~ 28 parts of diaminodiphenylmethane, 30 ~ 35 parts of dimethylformamide, second two 1.5 ~ 2.5 parts of alcohol, 2 ~ 3 parts of dimethyl silicone polymer compositions, are coated on Kapton, the needle being filled in heating process Hole improves crystallinity simultaneously, also overcome be heat-shrinked it is excessive caused by it is uneven, improve graphite linings biaxial tension performance, It also reduces azeotropic point and smooth boiling point area, improves the flatness and flexibility of final products film forming；Again, polyamides is sub- Amine film surface has graphite modified dose, improves graphite linings and thermally conductive adhesive layer heating conduction in two-sided pad pasting, and using pressure Prolong the carbonized film that machine rolls the pre-burned, the volume contraction for avoiding fold and being graphitized in sintering process improves densification Property and crystallinity, further improve heating conduction in the vertical direction and the horizontal direction；Again, dimethylformamide 20 ~ 25 Part, 8 ~ 10 parts of N-Methyl pyrrolidone and 0.8 ~ 1.5 part of Kapton surface of dibutyl phthalate, prevent bubble It generates, is more advantageous to the small pin hole of filled polyimide film, improve the uniformity of heat dissipation patch heating conduction.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.

Claims (1)

1. a kind of equal thermal bonding tape, including heat conduction graphite patch and coated on the thermally conductive adhesive layer on heat conduction graphite patch surface, this is led The hot glue adhesion coating surface opposite with heat conduction graphite patch is fitted with separated type material layer；It is characterized by: the heat conduction graphite patch It is made of Kapton, the first coat and the second coat, first coat, the second coat are located at poly- Imide membrane upper and lower surfaces；
First coat by film in Kapton upper surface graphite modified dosage form at, this graphite modified dose apply by The group of following parts by weight is grouped as: 24 parts of benzophenone tetracarboxylic dianhydride, 15 parts of pyromellitic acid anhydride, diaminodiphenylmethane 25 parts, 21 parts of dimethylformamide, 10 parts of N-Methyl pyrrolidone, 1.6 parts of ethylene glycol, 2.6 parts of dimethyl silicone polymer, adjacent benzene 1.4 parts of dibutyl carboxylic acid；Graphite modified dose of the viscosity is 30000 ~ 48000 cP；
The heat conduction graphite patch is obtained by following steps:
Step 1: the upper and lower surfaces by graphite modified dose of film in Kapton obtain treated Kapton；
Step 2: will that treated is cooling after Kapton is warming up to 1200 DEG C, to obtain the carbonized film of pre-burned；
Step 3: rolling the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then is cooled down after being warming up to 2850 DEG C ~ 2950 DEG C, thus Obtain the graphite film of main firing；
Step 5: the graphite film of resulting main firing is then carried out calendering to obtain the heat conduction graphite patch.
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CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch
CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
CN201610255486.2A Pending CN105860868A (en) 2014-01-26 2014-01-26 Preparation process of heat dissipation lamination film
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CN201511028668.8A Active CN105966019B (en) 2014-01-26 2014-01-26 For the heat conduction graphite patch of adhesive tape
CN201511014593.8A Active CN105965985B (en) 2014-01-26 2014-01-26 Preparation method for the heat conduction graphite patch of adhesive tape
CN201410036121.1A Active CN103796493B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for adhesive tape and preparation method thereof
CN201511028692.1A Active CN105969224B (en) 2014-01-26 2014-01-26 Equal thermal bonding tape for electronic device
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CN201610250629.0A Active CN105873414B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat conducting heat dissipation patch
CN201511014587.2A Active CN105969223B (en) 2014-01-26 2014-01-26 Manufacturing process for equal thermal bonding tape
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CN107441619A (en) * 2017-08-17 2017-12-08 成都三乙医疗科技有限公司 A kind of thermal conducting piece for electrotherapy
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy

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