TWI766285B - Curing method of optical clear adhesive - Google Patents
Curing method of optical clear adhesive Download PDFInfo
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- TWI766285B TWI766285B TW109117377A TW109117377A TWI766285B TW I766285 B TWI766285 B TW I766285B TW 109117377 A TW109117377 A TW 109117377A TW 109117377 A TW109117377 A TW 109117377A TW I766285 B TWI766285 B TW I766285B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/132—Phenols containing keto groups, e.g. benzophenones
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
- C08K5/3435—Piperidines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本發明涉及一種光學透明膠的固化方法。 The present invention relates to a curing method of optically transparent adhesive.
液態光學透明膠(Liquid Optical Clear Adhesive)是一種具有高透明度(大於90%)、以高分子為主體的透明液體。液態光學透明膠通常應用在觸控顯示面板的裝配過程中,其設置在玻璃蓋板(Cover Glass)與觸控感測層之間且用來黏結所述玻璃蓋板與所述觸控感測層。光學透明膠的高透明度的特性之一在於:降低背光在穿透光學透明膠時被光學透明膠吸收的程度,並維持顯示色彩圖像的清晰。因此,裝配觸控顯示面板過程中,高透明度的光學透明膠薄膜目視不可有缺陷,否則會直接或間接造成圖像顯示異常。缺陷可包括凹坑(dent)、氣泡(bubble)、介面分離(de-lamination)等等。 Liquid Optical Clear Adhesive is a transparent liquid with high transparency (greater than 90%) and macromolecule as the main body. The liquid optical clear adhesive is usually used in the assembly process of the touch display panel, which is disposed between the cover glass and the touch sensing layer and used to bond the cover glass and the touch sensing layer. Floor. One of the characteristics of the high transparency of the optical clear adhesive is to reduce the degree to which the backlight is absorbed by the optical clear adhesive when it penetrates the optical clear adhesive, and to maintain the clarity of the displayed color image. Therefore, in the process of assembling the touch display panel, the high-transparency optically transparent adhesive film should not be visually defective, otherwise it will directly or indirectly cause abnormal image display. Defects may include dents, bubbles, de-laminations, and the like.
習知的一種超低黏度(黏度<100cps)的液態光學透明膠,經點膠製程後光固化產生較高的不良率:光學透明膠表面形成凹坑(dent)。如圖1所示,觸控顯示面板100包括玻璃基板110、光學透明膠120、油墨層130、觸控層140、保護膜150、以及軟性基板160。在液態光學透明膠的預固化製程,液態光學膠在經過紫外光固化產生內部分子鏈結,因此膠水由液態轉換成半固態。此時照射的紫外光的均勻性若存在差異,則會導致鏈結程度不均勻,從而導致收縮應力拉扯進而在光學透明膠表面形成淺的凹坑。
A conventional ultra-low viscosity (viscosity <100cps) liquid optical clear adhesive has a high defect rate after light curing after the dispensing process: dents are formed on the surface of the optical clear adhesive. As shown in FIG. 1 , the
鑒於此,有必要提供一種光學透明膠的固化方法,包括:在基材的一表面上形成液態的光學透明膠;提供一多孔的緩衝層和一載物平臺,將所述緩衝層放置在所述載物平臺上,所述緩衝層中含有紫外光吸收劑;將所述基材以及所述光學透明膠轉移到所述載物平臺上,其中所述基材位於所述緩衝層和所述光學透明膠之間;以及紫外光照射所述光學透明膠使其預固化。 In view of this, it is necessary to provide a curing method for optically clear adhesive, which includes: forming a liquid optically clear adhesive on a surface of a substrate; providing a porous buffer layer and a stage, and placing the buffer layer on the On the stage, the buffer layer contains an ultraviolet light absorber; the substrate and the optically clear adhesive are transferred to the stage, wherein the substrate is located on the buffer layer and the buffer layer. between the optically transparent adhesives; and irradiating the optically transparent adhesives with ultraviolet light to pre-cure the optically transparent adhesives.
通過在載物平臺上設置緩衝層位於載物平臺與承載所述光學透明膠的基材之間,不僅可以降低微小異物對光學透明膠光固化的影響,還可有效減少紫外光透過緩衝層反射的紫外光能量。如此,預固化的光學透明膠能夠獲得均勻的厚度,而不會有凹坑之類的缺陷產生。 By arranging a buffer layer on the stage between the stage and the substrate carrying the optically clear adhesive, not only the influence of tiny foreign bodies on the photocuring of the optically clear adhesive can be reduced, but also the reflection of ultraviolet light through the buffer layer can be effectively reduced of ultraviolet light energy. In this way, the pre-cured optically clear adhesive can obtain a uniform thickness without defects such as pits.
100:觸控顯示面板 100: Touch display panel
110:玻璃基板 110: Glass substrate
130:油墨層 130: ink layer
140:觸控層 140: touch layer
150:保護膜 150: Protective film
160:軟性基板 160: Flexible substrate
10:基材 10: Substrate
120、20:光學透明膠 120, 20: Optical transparent glue
60:緩衝層 60: Buffer layer
50:載物平臺 50: Cargo Platform
圖1是習知技術中觸控顯示裝置中光學透明膠具有凹坑的剖面示意圖。 FIG. 1 is a schematic cross-sectional view of an optical transparent adhesive having pits in a touch display device in the prior art.
圖2A和圖2B為呈現載物平臺上具有微小的異物對光學透明膠影響的示意圖。 FIG. 2A and FIG. 2B are schematic diagrams showing the influence of tiny foreign objects on the stage on the optical clear adhesive.
圖3是本發明實施例的光學透明膠的固化方法的流程圖。 FIG. 3 is a flowchart of a curing method of an optically clear adhesive according to an embodiment of the present invention.
圖4是步驟S1的剖面示意圖。 FIG. 4 is a schematic cross-sectional view of step S1.
圖5是步驟S2的剖面示意圖。 FIG. 5 is a schematic cross-sectional view of step S2.
圖6是步驟S3-S4的剖面示意圖。 FIG. 6 is a schematic cross-sectional view of steps S3-S4.
圖7是實施例和對比例的測試結果的圖表。 FIG. 7 is a graph of test results of Examples and Comparative Examples.
附圖中示出了本發明的實施例,本發明可以藉由多種不同形式實現,而並不應解釋為僅局限於這裡所闡述的實施例。相反,提供這些實施例是為了使本發明更為全面和完整的公開,並使本領域的技術人員更充分地瞭解本發明的範圍。 The drawings illustrate embodiments of the present invention, which may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
習知技術中,顯示裝置的裝配/組裝過程包括:將光學透明膠塗覆到基材(例如觸控感測層)上,然後基材及其表面上的光學透明膠通常會被轉移到一載物平臺上,接著對光學透明膠進行紫外光照以光學透明膠進行預固化。 In the prior art, the assembly/assembly process of a display device includes: coating an optically clear adhesive on a substrate (such as a touch sensing layer), and then the optically clear adhesive on the substrate and its surface is usually transferred to a On the stage, the optically clear adhesive is then subjected to UV light to pre-cure the optically clear adhesive.
本案的發明人經研究發現:(1)如圖2A所示,如果載物平臺50上具有微小的異物,則會墊高基材10使基材10形成高低起伏的表面,在光學透明膠20流平後及光固化後導致該區域的光學透明膠20與其他的區域的光學透明膠20存在厚度差異;(2)圖2B中向下的直線箭頭代表入射的紫外光,向上的直線箭頭代表反射的紫外光,曲線箭頭代表紫外光的散射;如圖2B所示,照射紫外光時,紫外光的反射路徑受到異物影響,包含異物區域的紫外光行進路線與正常區域不同產生散射,照射能量不均進一步導致收縮應力差異,進而導致光學透明膠表面形成凹坑。可知,微小異物的存在導致光學透明膠表面形成凹坑。
The inventors of this case have found through research: (1) As shown in FIG. 2A , if there are tiny foreign objects on the
本案發明人設計了一特殊的緩衝層,通過該緩衝層設置在載物平臺上覆蓋微小異物的方式以降低異物影響且該緩衝層具有吸收紫外光能量的特性。 The inventor of the present application has designed a special buffer layer, which is arranged on the carrier platform to cover tiny foreign objects to reduce the influence of foreign objects, and the buffer layer has the characteristic of absorbing ultraviolet light energy.
如圖3所示,一種光學透明膠的固化方法,其包括如下步驟。可以理解的,以下步驟的順序可以根據需要進行調整。 As shown in FIG. 3 , a curing method of optically transparent adhesive includes the following steps. It can be understood that the sequence of the following steps can be adjusted as required.
步驟S1:如圖4所示,在基材10的一表面上形成液態的光學透明膠20。
Step S1 : as shown in FIG. 4 , a liquid optically
步驟S2:如圖5所示,提供一多孔的緩衝層60和一載物平臺50,所述緩衝層60中含有紫外光吸收劑,將所述緩衝層60放置在所述載物平臺50上。
Step S2 : as shown in FIG. 5 , a
步驟S3:如圖6所示,將所述基材10以及所述光學透明膠20轉移到所述載物平臺50,其中所述基材10位於所述緩衝層60和所述光學透明膠20之間。
Step S3 : as shown in FIG. 6 , transfer the
步驟S4:如圖6所示,紫外光照射所述光學透明膠20使其預固化。
Step S4 : as shown in FIG. 6 , the optically
本實施例中,所述光學透明膠20為應用於觸控顯示裝置中用於黏結觸控感測層與透明蓋板。所述基材10為觸控感測層。可以理解的,所述基材10不限於觸控感測層,還可以為顯示裝置的其他元件或其他電子裝置中需要設置光學透明膠的基材。
In this embodiment, the optically
所述緩衝層60採用高分子材料聚合發泡的方式形成,因此具有疏鬆多孔的形貌。另外,所述緩衝層60中的孔徑大小可通過控制發泡聚合反應的程度或時間進行調節。例如,所述緩衝層60的孔徑均值範圍為5-30μm,例如為17μm或24μm。所述緩衝層60的厚度為0.2-2mm,厚度小於0.2mm會導致紫外光不被吸收而被反射。本實施例中,所述緩衝層60的主要成分為聚乙烯,即採用聚乙烯聚合發泡的方式形成。
The
所述紫外光吸收劑為2-羥基-4-正辛氧基二苯甲酮、4-苯甲醯氧基-2,2,6,6-四甲基呱啶、或三(1,2,2,6,6-五甲呱啶基)亞磷酸酯。另外,所述紫外光吸收劑的添加用量為高分子材料的重量的0.1%~1%。本實施例中,所述紫外光吸收劑為2-羥基-4-正辛氧基二苯甲酮,其能夠強烈吸收波長為270-330nm的紫外線。 Described ultraviolet light absorber is 2-hydroxyl-4-n-octyloxy benzophenone, 4-benzyloxy-2,2,6,6-tetramethylpyridine, or tris(1,2 , 2,6,6-pentamethidyl) phosphite. In addition, the added amount of the ultraviolet light absorber is 0.1% to 1% of the weight of the polymer material. In this embodiment, the ultraviolet light absorber is 2-hydroxy-4-n-octyloxybenzophenone, which can strongly absorb ultraviolet rays with a wavelength of 270-330 nm.
實驗驗證:一實施例中,在載物平臺50上設置了厚度為1mm且孔徑均值為17μm的緩衝層60。另在同樣的載物平臺50上未設置緩衝層60作為對比例。然後在對比例的載物平臺(未設置緩衝層)和實施例的載物平臺(設置有緩衝層)上分別放置光學透明膠並分別進行紫外光照,經多次採樣並檢測光學透明膠有無凹坑,結果如圖7所示。其中,在對比例的載物平臺固化的光學透明膠共20個,結果每個均發現有凹坑,凹坑發生率為100%;而在實施例的載物平臺上固化的光學透明膠共70個,結果僅有5個發現有凹坑,凹坑發生率為7.1%。實施例的光學透明膠的凹坑的發生率相較於對比例的光學透明膠的凹坑發生率下降超過90%。這充分說明通過設置緩衝層60於載物平臺50上可極大降低光學透明膠的凹坑缺陷。
Experimental verification: In one embodiment, a
通過在載物平臺50上設置緩衝層60位於載物平臺50與承載所述光學透明膠20的基材10之間,不僅可以降低微小異物對光學透明膠光固化的影響,還可有效減少紫外光透過緩衝層60反射的紫外光能量。如此,預固化的光學透明膠20能夠獲得均勻的厚度,而不會有凹坑之類的缺陷產生。
By arranging the
紫外光照射所述光學透明膠為使所述光學透明膠20半固化而並非是完全固化,此時光學透明膠20具有一定的黏性。可以理解的,所述方法還包括在預固化的光學透明膠20上設置部件(圖未示),依靠光學透明膠20的黏性使所述部件和所述基材10黏結為一體。本實施例中,所述部件為透明蓋板。
The ultraviolet light irradiates the optically clear adhesive to make the optically
以上實施例僅用以說明本發明的技術方案而非限制,圖示中出現的上、下、左及右方向僅為了方便理解,儘管參照較佳實施例對本發明進行了詳細說明,本領域的普通技術人員應當理解,可以對本發明的技術方案進行修改或等同替換,而不脫離本發明技術方案的精神和範圍。 The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. The up, down, left and right directions appearing in the drawings are only for the convenience of understanding. Although the present invention has been described in detail with reference to the preferred embodiments, the Those of ordinary skill should understand that the technical solutions of the present invention may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.
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TW202144087A (en) | 2021-12-01 |
CN111592835A (en) | 2020-08-28 |
CN111592835B (en) | 2022-04-08 |
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