TWI765924B - 具有開放容積均衡用通路及側面圍阻體的平面基板邊緣接觸結構 - Google Patents

具有開放容積均衡用通路及側面圍阻體的平面基板邊緣接觸結構 Download PDF

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TWI765924B
TWI765924B TW106136280A TW106136280A TWI765924B TW I765924 B TWI765924 B TW I765924B TW 106136280 A TW106136280 A TW 106136280A TW 106136280 A TW106136280 A TW 106136280A TW I765924 B TWI765924 B TW I765924B
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substrate
susceptor
processing system
top surface
annular band
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TW201833974A (zh
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派崔克 百林
拉密許 謙德拉瑟哈蘭
卡爾 里瑟
保羅 孔科拉
艾里恩 拉芙依
克洛伊 巴爾達塞羅尼
珊卡 史旺明內森
可里伊許特克
崎山幸紀
愛德蒙 明歇爾
金成帝
安祖 杜瓦爾
法蘭克 帕斯果
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美商蘭姆研究公司
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Abstract

用於基板處理系統的基座包含基座主體，該基座主體包含面向基板表面。用以支撐基板之徑向外邊緣的環形帶部係設置於該面向基板表面上。凹部係定義於該基座主體的面向基板表面中，且位於該環形帶部的徑向內側。凹部產生介於基板之底部表面與基座主體之面向基板表面之間的容積。複數通氣孔穿過基座主體，並與該凹部流體連通，以在處理期間使基板之相反面上的壓力均衡。

Description

具有開放容積均衡用通路及側面圍阻體的平面基板邊緣接觸結構
本揭露內容相關於基板處理系統，且更尤其相關於基板處理系統用基座。
[相關申請案之交互參考]
本申請案主張2016年10月28日申請之美國臨時申請案第62/414,072號的權利。上述參考申請案的整體揭露內容係併入於此，以供參考。
本文提供的先前技術說明係針對概括性呈現本揭露內容之上下文的目的。此先前技術部分中所述之目前列名發明人之工作、及不可以其他方式認定為申請時之先前技術的實施態樣敘述皆不明示或暗示地承認其為針對本揭露內容的先前技術。
基板處理系統可用以在例如半導體晶圓的基板上沉積、蝕刻、或處理膜層。基板處理系統通常包含處理腔室、氣體分佈裝置、及基座。在處理期間，基板係設置於基座上。不同的氣體混合物可被引入處理腔室中，以處理膜層。基板加熱及/或射頻(RF)電漿亦可用以啟動化學反應。
基座的載送環通常沿著基板的徑向外邊緣以狹窄帶部接觸基板。通常，該狹窄帶部具有1.0至1.5mm的寬度。最小接觸面積(MCA,minimum contact area)銷係用以支撐基板的中心區域。基板中心處的MCA銷將基板的中心部抬升得比支撐基板的外邊緣之狹窄帶部更高，以產生基板翹曲的情形。換言 之，MCA銷的頂部表面係升得比狹窄帶部所界定的平坦表面更高。基板邊緣以切線或線接觸之方式接觸載送環。這在輸送及處理期間需要基板與基座的精確對準。由於所需的精確度及「現場」設置的限制，銷及載送環通常並不充分阻擋基板之背側上的沉積物。由於與基板背側邊緣的接觸大小亦受到限制，故此方法對於偏心基板定位亦較不寬容。
基板處理系統用基座包含基座主體，該基座主體包含面向基板表面。設置於該面向基板表面上的環形帶部係用以支撐基板的徑向外邊緣。凹部係定義於基座主體的面向基板表面中，且位於環形帶部的徑向內側。凹部產生介於基板之底部表面與基座主體之面向基板表面之間的容積。複數通氣孔穿過基座主體，且與凹部流體連通，以在處理期間使基板之相反面上的壓力均衡。
在其他特徵中，帶部具有從4mm至12mm之範圍內的寬度。帶部具有從5mm至9mm之範圍內的寬度。帶部具有從6mm至7mm之範圍內的寬度。帶部具有從2至32之範圍內的表面粗糙度(Ra)。表面粗糙度(Ra)在從2至24的範圍內。表面粗糙度(Ra)在從2至16的範圍內。
在其他特徵中，複數通氣孔包含從基座主體之徑向外側徑向地向內延伸的第一通氣孔部及從該第一通氣孔部的徑向內邊緣延伸至凹部的第二通氣孔部。
在其他特徵中，複數通氣孔包含從基座主體之底側向凹部軸向延伸的第一通氣孔部以及含有複數孔的第二通氣孔部，該複數孔將該第一通氣孔部連接至凹部。
在其他特徵中，帶部係由選自由以下者組成之群組的材料製成：形成於導電材料之表面上的介電塗層、無塗層導電材料、無塗層金屬、及無塗層介電材料。
在其他特徵中，環件係設置於基板及帶部的徑向外側。環件的頂部表面係置於基板的頂部表面上方。環件係由介電材料製成。
在其他特徵中，介電材料係選自由鋁土、鋁氮化物、藍寶石、石英、及矽氧化物組成的群組。環件包含設置於基板之徑向內側及下方的徑向內表面以及設置於基板之徑向外側的徑向外表面。環件的頂部表面平行於基板的頂部表面。環件係由介電材料製成。
在其他特徵中，介電材料係選自由鋁土、鋁氮化物、藍寶石、石英、及矽氧化物組成的群組。基座主體包含圍繞其徑向外邊緣的環形凹槽。環件係設置於該環形凹槽中。環件的底部表面位於基板的底部表面下方。環件的頂部表面位於基板的頂部表面下方。環件係由介電材料製成。
在其他特徵中，介電材料係選自由鋁土、鋁氮化物、藍寶石、石英、及矽氧化物組成的群組。
在其他特徵中，複數銷係設置於凹部中，以支撐基板的中心部。銷的頂部表面在處理期間係以下情形之一：位於環形帶部之頂部表面下方、平行於環形帶部之頂部表面、或位於環形帶部之頂部表面上方。
在其他特徵中，複數突出部支撐基板的中心部。突出部的頂部表面係以下情形之一：位於環形帶部之頂部表面下方、平行於環形帶部之頂部表面、或位於環形帶部之頂部表面上方。在處理期間，沿著基板的徑向外邊緣，基板的背側表面平行於帶部。
基板處理系統包含處理腔室及基座。基座係設置於處理腔室中。RF產生器係設置於處理腔室中。
在其他特徵中，複數最小接觸面積(MCA,minimum contact area)銷從基座主體延伸。控制器係用以在處理期間使MCA銷延伸，使得MCA銷的頂部表面係以下情形之一：位於帶部下方、平行於帶部、或位於帶部上方。
在其他特徵中，複數突出部從凹部中之基座主體向上延伸。
本揭露內容之應用的進一步領域將自實施方式、申請專利範圍、及圖式而變得明白。實施方式及特定範例僅意在說明的目的，且不意圖限制本揭露內容的範疇。
10:基板處理系統
12:處理腔室
14:噴淋頭
16:基座組件
18:基板
30:RF產生系統
32:RF電壓產生器
34:匹配網路
36:遠端電漿源
40:氣體輸送系統
42-1:氣體源
42-2:氣體源
42-N:氣體源
44-1:閥
44-2:閥
44-N:閥
46-1:質流控制器
46-2:質流控制器
46-N:質流控制器
48:歧管
50:加熱器
60:閥
62:泵浦
70:控制器
71:MCA銷
110:基座主體
118:凹部
119:頂部表面
122:環形帶部
126:內邊緣
128:外邊緣
132:環件
132-1:環件
132-2:環件
132-3:環件
150-1:通氣孔
150-2:通氣孔
150-3:通氣孔
150-4:通氣孔
150-V:通氣孔
152-1:第一通氣孔部
154-1:開口
156-1:第二通氣孔部
158-1:徑向內末端
161:MCA銷
200-1:通氣孔
200-2:通氣孔
210-2:第二通氣孔部
220:通孔
313:下部
315:凹槽
317:上部
330:環形凹槽
332:徑向內頂部表面
334:徑向最內表面
340:凹口
342:下部
350:頂部表面
300-1:徑向內表面
310-1:頂部表面
310-2:頂部表面
d1:高度
d2:高度
d3:距離
本揭露內容將自實施方式與隨附圖式而變得更完全地獲得理解，其中：圖1為根據本揭露內容，包含基座之基板處理系統的範例的功能方塊圖；圖2為根據本揭露內容，基座之範例的側面橫剖面圖；圖3為根據本揭露內容，基座之範例的立體圖；圖4~5為分別針對根據先前技術之狹窄帶部及針對根據本揭露內容之較寬帶部，說明背側沉積物厚度的圖表；圖6為根據本揭露內容之基座之範例的立體圖，該基座包含通往基板下方之凹部的徑向通氣孔；圖7為根據本揭露內容之基座之範例的立體圖，該基座包含通往基板下方之凹部的軸向通氣孔；圖8為說明在具有根據本揭露內容的通氣裝置、且沒有根據先前技術的通氣裝置之情況下，處理期間之基板位置之改變之樣本的圖表；圖9為根據本揭露內容之環件的範例的立體圖，該環件包含位於基板之頂部表面上方的頂部表面；圖10為根據本揭露內容之環件的範例的立體圖，該環件包含定位成平行於基板之頂部表面的頂部表面；以及 圖11為根據本揭露內容之環件的範例的立體圖，該環件包含位於基板之頂部表面下方的頂部表面。
在圖式中，可重複使用參考數字，以識別相似及/或相同的元件。
根據本揭露內容的基座包含在處理期間面向上且支撐基板之徑向外邊緣的環形帶部。該環形帶部相較於上述狹窄帶部具有顯著較大的寬度。沿著基板之背側表面的基板外直徑係保持為與環形帶部平行或與環形帶部呈切線接觸。
基座的上表面定義介於基板之底部表面與基座之上表面之間的凹部。該凹部係設置於環形帶部的徑向內側。設置通氣孔，以容許氣體從處理腔室的主處理容積流至基板下方之凹部容積。在一些範例中，MCA銷係用以支撐基板的中心部。在其他範例中，複數的固定突出部從基座的上表面在凹部中延伸，以支撐基板的中心部。
介電材料之環件可設置於環形帶部的徑向外側。環件的徑向內部可位於基板之外直徑的徑向內側、鄰近基板的外直徑、或位於基板之外直徑的徑向外側。環件的頂部表面可位於基板的頂部表面上方、平行於基板的頂部表面、或位於基板的頂部表面下方。
根據本揭露內容之基座的環形帶部在基板之背面的邊緣處提供較寬的接觸區域，這增加了基板位置公差。通氣孔提供凹部容積與主處理容積之間的壓力均衡。通氣孔可徑向導至基座的外直徑，或從基座的底部開始軸向導向。通氣孔的數目及通氣通道的大小將取決於製程壓力及特定製程中所使用的氣流而改變。
環形帶部的寬度取決於用以在基板上沉積膜層的製程溫度及化學成分而改變。環件的幾何形狀及位置相對於基板直徑及基座而改變，以針對 待沉積之特定膜層而調諧製程變數。取決於待沉積之特定膜層的製程變數，環件的厚度、體積、及形狀可作出改變。
現在參考圖1，其顯示用以執行本文中所述沉積之基板處理系統的範例。儘管顯示基板處理系統的特定範例，但仍可使用其他的基板處理系統。在一些範例中，基板處理系統執行膜層的電漿加強(PE,plasma enhanced)沉積。在一些範例中，基板處理系統執行電漿加強化學氣相沉積(PECVD,plasma-enhanced chemical vapor deposition)或電漿加強原子層沉積(PEALD,plasma-enhanced atomic layer deposition)，但仍可執行其他製程。
基板處理系統10包含容納基板處理系統10之其他元件且(在針對特定基板處理使用RF電漿的情況下)容納RF電漿的處理腔室12。基板處理系統10包含噴淋頭14及基座組件16。基板18係設置於基座組件16上。噴淋頭14引入並且分佈製程氣體。
在使用電漿的情況下，電漿可為直接電漿或遠端電漿。在此範例中，RF產生系統30產生並輸出RF電壓至噴淋頭14或基座組件16之任一者(另一者為DC接地、AC接地、或浮接)。僅舉例而言，RF產生系統30可包含產生RF電壓的RF電壓產生器32，該RF電壓係藉由匹配網路34饋送至噴淋頭14或基座組件16。或者，電漿可藉由遠端電漿源36而輸送。
氣體輸送系統40包含一或更多氣體源42-1、42-2、…、及42-N(統稱為氣體源42)，其中N係大於0的整數。氣體源42供應一或更多蝕刻氣體混合物、前驅物氣體混合物、清洗氣體混合物、灰化氣體混合物等至處理腔室12。亦可使用汽化前驅物。氣體源42係藉由閥44-1、44-2、…、及44-N(統稱為閥44)及質流控制器46-1、46-2、…、及46-N(統稱為質流控制器46)而連接至歧管48。歧管48的輸出係饋送至處理腔室12。僅舉例而言，歧管48的輸出係饋送至噴淋頭14。
加熱器50可連接至設置於基座組件16中的加熱器線圈(未顯示)。加熱器50可用以控制基座組件16和基板18的溫度。閥60和泵浦62可用以從處理腔室12排空反應物。控制器70可用以控制基板處理系統10的元件。僅舉例而言，控制器70可用以控制製程氣體的流動、製程參數(例如溫度、壓力、功率等)的監控、激發及消除電漿、移除反應物等。
在一些範例中，最小接觸面積(MCA)銷71係用以在處理期間支撐基板18的中心區域。若使用MCA銷，控制器70亦可用以致動MCA銷71。在一些範例中，MCA銷71的頂部表面係定位於環形帶部之頂部表面以下、平行於環形帶部之頂部表面、或環形帶部之頂部表面以上的高度，以提供基板與環形帶部之間的平行接觸。在一些範例中，MCA銷71係由藍寶石製成，但仍可使用其他材料。MCA銷可設定成使得高度係在環形帶部上方、平行於環形帶部、或在環形帶部下方，以改變基板(晶圓)與環形環件(密封帶部)之間的接觸力。藉由減小基板與環形環件之間的間隙，較高的接觸力可確保基板上減少的背側沉積物。對於MCA銷可在環形環件上方及下方兩者距離多遠的方面有所限制。在此兩個方向上，距離過遠皆降低基板與環件之間的接觸力而增加間隙。
現在參考圖2~3，基座組件16包含支撐基板18的基座主體110。凹部118可界定於基板18與基座主體110之頂部表面119之間。在一些範例中，凹部118具有圓柱形狀。環形帶部122係設置於凹部118的徑向外側。在一些範例中，環形帶部122係平坦的且包含徑向內邊緣126及徑向外邊緣128。基板18的外直徑在處理期間係與環形帶部122保持平行或切線接觸。環件132係設置於基座主體110上，大致上在基板18的徑向外側。
在一些範例中，環形帶部122具有2~32的表面粗糙度Ra。在一些範例中，環形帶部122具有2~24的表面粗糙度Ra。在一些範例中，環形帶部122 具有2~16的表面粗糙度Ra。在一些範例中，環形帶部122具有2~8的表面粗糙度Ra。
環形帶部122的徑向寬度係選擇成足夠寬，足以確保無論基板位置為何，基板邊緣皆保持為接觸狀態。在一些範例中，環形帶部122具有從4mm至12mm之範圍內的徑向寬度。在一些範例中，環形帶部122具有從5mm至9mm之範圍內的徑向寬度。在一些範例中，環形帶部122具有從6mm至7mm之範圍內的徑向寬度。
形成環形帶部122的材料可包含形成於導電材料之表面上的介電塗層、無塗層導電材料或金屬、或無塗層介電材料。用於環形帶部122的材料可選擇成不與用來沉積膜層的製程化學成分反應。選擇的額外準則包含阻抗及電漿交互作用。在一些範例中，用於環形帶部122的材料亦可選擇成提供與一些製程化學成分的特定交互作用。
現在參考圖4~5，其顯示環形帶部122的寬度對背側沉積物的影響。如可見，當環形帶部122具有上述狹窄寬度時，如圖4中所示，背側沉積物趨向於發生。當環形帶部122具有本文中所述之較寬寬度時，如圖5中所示，背側沉積物減少或消除。
現在參考圖6~7，其顯示使凹部118之容積通氣的不同變化例，以提供與主處理容積的壓力均衡。通氣步驟提供基板18之相反表面之間的壓力均衡，以減小基板18在環形帶部122上的移動。減小的移動有助於改善均勻性，並且有助於阻止背側沉積物。
例如，在圖6中，基座主體110包含複數通氣孔150-1、150-2、150-3、...、150-V(統稱為通氣孔150)(其中V為大於或等於1的整數)。如可察知，通氣孔的數目可視需要進行調整，以提供適當的動態壓力均衡。通氣孔150提供主處理容積與基板18下方之凹部118容積之間的流體連通。在此範例中，通氣孔 150包含在徑向上延伸、且包含位於基座主體110之徑向外表面上之開口154-1的第一通氣孔部152-1。第二通氣孔部156-1從第一通氣孔部152-1的徑向內末端158-1在軸向上延伸至凹部118中之基座主體110的上表面。第一通氣孔部152-1及第二通氣孔部156-1提供介於基板下方容積(凹部118之容積)與處理發生之主處理容積之間的流體連通路徑。換言之，因為處理腔室的主容積包含基板18的頂部表面，且通氣孔150提供基板18下方之凹部118容積中的壓力均衡，故發生壓力均衡，以防止基板移動。
基板18下方之凹部118的高度係選擇成容許氣體交換進出凹部118，而不在基板18上產生大到足以導致基板18於預定限制範圍內移動的向上壓力。在一些範例中，凹部118具有從0.004”至0.010”之範圍內的深度。在一些範例中，凹部具有從0.004”至0.008”之範圍內的深度。複數MCA銷161可用以支撐並抬起基板18的中心部。在一些範例中，MCA銷161係移動至MCA銷161之頂部表面平行於環形帶部122之頂部表面的高度。在一些範例中，MCA銷161係移動至MCA銷161之頂部表面位於環形帶部122之頂部表面上方的高度。在一些範例中，MCA銷161可包含三或六個MCA銷，但仍可使用額外的或較少的MCA銷。
在圖7中，其顯示通氣孔設置的另一範例。複數通氣孔200-1及200-2(統稱為通氣孔200)係設置成在軸向上使來自主處理容積的流體通往設置於基板18下方的凹部118。如可察知，儘管顯示兩通氣孔，但可在基座主體110的徑向周圍以隔開間距設置額外的通氣孔。在一些範例中，通氣孔200-1包含從基座主體110之底部表面、穿過基座主體110的一或更多覆層、延伸至凹部118中基座之頂部表面(或與之接近但隔開的位置)的第一通氣孔部210-1。第二通氣孔部210-2可選地將第一通氣孔部210-1連接至凹部118。在一些範例中，第二通氣孔部210-2的每一者包含複數隔開的通孔220，其具有分別與第一通氣孔部210-1及凹部118流體連通的相反末端。
在一些範例中，第一通氣孔部210-1具有從0.2”至0.8”之範圍內的直徑。在一些範例中，第一通氣孔部210-1具有從0.3”至0.5”之範圍內的直徑。在一些範例中，複數隔開的通孔220約比第一通氣孔部210-1小一個數量級。在一些範例中，複數隔開的通孔220具有從0.01”至0.08”之範圍內的直徑。在一些範例中，複數隔開的通孔220具有從0.01”至0.03”之範圍內的直徑。
現在參考圖8，輸送複數基板至製程，進行處理且然後取回。基板最初係輸送於(0,0)點附近，且後續在處理之後藉由自動機器臂而拿取。如可察知，自動機器臂的拿取位置提供基板在處理期間移動多少的指示。當基座主體不通氣時，由於主處理容積與凹部118容積之間的壓力差，基板趨向於在基座主體的頂部表面上移動。相反地，當使用通氣配置時，基板移動較少。當基板相對於環件移動時，可能發生沉積的局域化差異。當基板18具有減少的移動時，沉積物具有較少的變化。
現在參考圖9~11，其顯示環件132的諸多例示性設置。環件132具有大致上環形的形狀，且可由介電材料製成。在一些範例中，介電材料係選自鋁土、鋁氮化物、藍寶石、石英、及矽氧化物。在圖9中，環件132-1係設置於基板之外直徑(OD,outer diameter)及環形帶部122的徑向外側。環件132-1包含容納於基座主體110之凹槽315中的下部313。環件132-1更包含上部317。在一些範例中，環件132-1的上部317相較於下部313具有較大的徑向厚度。環件132-1包含隔開設置於環形帶部122之外邊緣128及基板18之徑向外邊緣之徑向外側的徑向內表面300-1。環件132-1的頂部表面310-1係位於基板18的頂部表面上方、平行於基板18的頂部表面、或位於基板18的頂部表面下方。
在圖10中，環件132-2包含至少部分位於基板18之徑向外邊緣下方的第一環形凹槽330。第一環形凹槽330係設置於基板18之外直徑的徑向內側、且於環形帶部122的徑向外側。環件132-2更包含隔開設置於基板18之徑向外邊緣 之徑向內側的徑向最內表面334。環件132-2的徑向內頂部表面332提供凹凸形狀，以容納基板18的徑向外邊緣。環件132-2的頂部表面310-2係位於基板18的頂部表面下方、上方、或平行於基板18的頂部表面。在一些範例中，頂部表面310-2位於與含基板18之頂部表面的平面平行的平面中。
在圖11中，基座主體110包含設置於基座主體110之徑向外邊緣周圍的環形凹口340。環件132-3具有環狀，且包含下部342，該下部342具有比環形凹口340之軸向高度d1更大的軸向高度d2。環件132-3的頂部表面350係設置於與基板18之頂部表面平行、或介於基板18之頂部表面上方或下方距離d3處的平面內。
環件132改變基板18之邊緣附近的離子化速率及電子密度。環件132降低此區域中發生不樂見之電漿不連續的情形。環件132亦實體上限制了基板18在基座主體110上的移動。環件132降低了使用一些氣體物種、帶部、及/或通氣裝置時可能發生於基板18之邊緣處的電漿團。環件132在基板18之外直徑處的接近程度可降低基板之邊緣附近的電子密度及離子化速率。
前述描述內容本質上僅係說明性的，且絕不意圖限制本揭露內容、其應用、或使用。本揭露內容之廣義教示可以各種形式實施。因此，儘管本揭露內容包含特定的範例，但本揭露內容的真正範疇不應該被如此所限制，因為其他修正將在研究圖式、說明書、及隨後之申請專利範圍時變得明白。應理解，方法內一或更多的步驟可在不改變本揭露內容之原理的情況下以不同的順序(或同時地)執行。進一步講，儘管每一實施例於以上係被描述為具有某些特徵，但相關本揭露內容任一實施例而描述之該等特徵的任何一或更多者可在任何其他實施例中實施，並且/或者可與任何其他實施例的特徵進行組合，即使該組合並未明確地描述亦然。換句話說，所描述的實施例並非係互相排斥，且一或更多實施例之間互相的置換仍屬於本揭露內容的範疇。
複數元件之間(例如，複數模組、複數電路元件、複數半導體覆層等之間)空間或功能的關係係使用諸多用語而描述，包含「連接」、「嚙合」、「耦接」、「鄰近」、「接近」、「在頂部上」、「上方」、「下方」、及「設置」。除非明確地描述成係「直接」的，否則當在以上揭露內容中描述第一及第二元件之間的關係時，該關係可為在第一及第二元件之間沒有其他中間元件出現的直接關係，也可為在第一及第二元件之間存在一或更多中間元件(空間上、或功能上)的間接關係。如本文中所使用，詞組「A、B、及C之至少一者」應被解釋成意指使用非排除性邏輯「或」的邏輯(A或B或C)，並且不應被解釋成意指「A之至少一者、B之至少一者、及C之至少一者」。
在一些實施例中，控制器為系統的一部分，該系統可為以上描述範例的一部分。如此之統可包含半導體處理設備，該半導體處理設備包含(複數)處理工具、(複數)腔室、(複數)處理平台、及/或特定的處理元件(基板基座、氣體流動系統等)。該等系統可與電子設備整合，以在半導體基板或基板的處理之前、期間、以及之後，控制該等系統的運作。電子設備可稱為「控制器」，其可控制系統或複數系統的諸多元件或子部件。取決於處理需求及/或系統類型，控制器可程式設計成控制本文中所揭露之製程的任何者，包含處理氣體的傳輸、溫度設定(例如，加熱及/或冷卻)、壓力設定、真空設定、功率設定、射頻(RF)產生器設定、RF匹配電路設定、頻率設定、流速設定、流體傳送設定、位置和操作設定、基板轉移(進出與特定系統相連接或相接合之工具及其他轉移工具、及/或裝載室)。
廣泛地講，控制器可定義為具有用以接收指令、發佈指令、控制操作、啟動清洗操作、啟動終點量測以及類似者之諸多積體電路、邏輯、記憶體、及/或軟體的電子設備。積體電路可包含：儲存程式指令之韌體形式的晶片、數位訊號處理器(DSP，digital signal processor)、定義為特殊用途積體電路(ASIC， application specific integrated circuit)的晶片、及/或一或更多微處理器、或執行程式指令(例如，軟體)的微控制器。程式指令可為以不同的單獨設定(或程式檔案)之形式而傳達至控制器或系統的指令，該單獨設定(或程式檔案)為實行(半導體晶圓上，或針對半導體基板之)特定的製程而定義操作參數。在一些實施例中，操作參數可為由製程工程師為了在一或更多以下者的製造期間實現一或更多處理步驟而定義之配方的一部分：覆層、材料、金屬、氧化物、矽、二氧化矽、表面、電路、及/或基板的晶粒。
在一些實施例中，控制器可為電腦的一部分，或耦接至電腦，該電腦係與系統整合、耦接至系統、以其他網路的方式接至系統、或其組合的方式而接至系統。舉例而言，控制器可在能容許遠端存取晶圓處理之「雲端」或廠房主機電腦系統的全部、或部分中。電腦可使系統能夠遠端存取，以監控製造操作的目前進度、檢查過去製造操作的歷史、自複數的製造操作而檢查其趨勢或效能度量，以改變目前處理的參數、設定目前處理之後的處理步驟、或開始新的製程。在一些範例中，遠端電腦(例如，伺服器)可通過網路而提供製程配方至系統，該網路可包含局域網路或網際網路。遠端電腦可包含使得可以輸入參數及/或設定、或對參數及/或設定進行程式設計的使用者介面，然後該參數及/或設定自遠端電腦而傳達至系統。在一些範例中，控制器以資料的形式接收指令，該指令為即將於一或更多操作期間進行之處理步驟的每一者而指定參數。吾人應理解，參數可特定地針對待執行之製程的類型、及控制器與之接合或加以控制之工具的類型。因此如上所述，控制器可為分散式，例如藉由包含以網路的方式接在一起、且朝向共同之目的(例如，本文所描述之製程及控制)而運作的一或更多分離的控制器。用於如此目的之分散式控制器的範例將是腔室上與位於遠端的一或更多積體電路(例如，在作業平臺位準處、或作為遠端電腦的一部分)進行通訊的一或更多積體電路，兩者相結合以控制腔室上的製程。
例示性系統可包含但不限於以下者：電漿蝕刻腔室或模組、沉積腔室或模組、旋轉淋洗腔室或模組、金屬電鍍腔室或模組、清洗腔室或模組、斜角緣部蝕刻腔室或模組、物理氣相沉積(PVD)腔室或模組、化學氣相沉積(CVD)腔室或模組、原子層沉積(ALD)腔室或模組、原子層蝕刻(ALE)腔室或模組、離子植入腔室或模組、軌道腔室或模組、及可在半導體基板的製造及/或加工中相關聯的、或使用的任何其他半導體處理系統。
如以上所提及，取決於待藉由工具而執行之(複數)製程步驟，控制器可與半導體製造工廠中的一或更多以下者進行通訊：其他工具電路或模組、其他工具元件、叢集工具、其他工具介面、鄰近的工具、相鄰的工具、遍及工廠而分布的工具、主電腦、另一控制器、或材料輸送中使用之工具，該材料輸送中使用之工具攜帶基板容器往返工具位置及/或裝載埠。
110‧‧‧基座主體
118‧‧‧凹部
122‧‧‧環形帶部
126‧‧‧內邊緣
128‧‧‧外邊緣
150-1‧‧‧通氣孔
150-2‧‧‧通氣孔
150-3‧‧‧通氣孔
150-4‧‧‧通氣孔
150-V‧‧‧通氣孔
152-1‧‧‧第一通氣孔部
154-1‧‧‧開口
156-1‧‧‧第二通氣孔部
158-1‧‧‧徑向內末端
161‧‧‧MCA銷

Claims (19)

  1. 一種基板處理系統用之基座，包含：一基座主體，其包含一面向基板表面、及圍繞該基座主體之一徑向外邊緣的一環形凹槽；一環形帶部，其係設置於該面向基板表面上，且係配置成支撐一基板的徑向外邊緣；一凹部，其係定義於該基座主體之該面向基板表面中，且係位於該環形帶部的徑向內側，其中該凹部建立介於該基板之一底部表面與該基座主體之該面向基板表面之間的一容積；複數通氣孔，其穿過該基座主體且與該凹部流體連通，以在處理期間使該基板之相反面上的壓力均衡，其中該複數通氣孔每一者包含：一第一通氣孔部，其從該基座主體的一徑向外側在徑向上向內延伸；以及一第二通氣孔部，其從該第一通氣孔部的一徑向內邊緣垂直地延伸至該凹部；以及一環件，其係與該基座主體分開、且設置於該基座主體上的該環形凹槽中，其中該環件的一底部表面位於該基板的一底部表面下方，其中該環件的一頂部表面位於該基板的一頂部表面下方，以及其中該環件係由介電材料製成。
  2. 如申請專利範圍第1項之基板處理系統用之基座，其中該環形帶部具有從4mm至12mm之範圍內的寬度。
  3. 如申請專利範圍第1項之基板處理系統用之基座，其中該環形帶部具有從5mm至9mm之範圍內的寬度。
  4. 如申請專利範圍第1項之基板處理系統用之基座，其中該環形帶部具有從6mm至7mm之範圍內的寬度。
  5. 如申請專利範圍第1項之基板處理系統用之基座，其中該環形帶部具有從2至32之範圍內的表面粗糙度(Ra)。
  6. 如申請專利範圍第5項之基板處理系統用之基座，其中該表面粗糙度(Ra)係在從2至24的範圍內。
  7. 如申請專利範圍第5項之基板處理系統用之基座，其中該表面粗糙度(Ra)係在從2至16的範圍內。
  8. 如申請專利範圍第1項之基板處理系統用之基座，其中該環形帶部係由選自由以下者組成之群組的一材料製成：形成於一導電材料之一表面上的一介電塗層、一無塗層導電材料、一無塗層金屬、及一無塗層介電材料。
  9. 如申請專利範圍第1項之基板處理系統用之基座，其中該介電材料係選自由鋁土、鋁氮化物、藍寶石、石英、及矽氧化物組成的群組。
  10. 如申請專利範圍第1項之基板處理系統用之基座，更包含：複數銷，其係設置於該凹部中，以支撐該基板的一中心部，其中該複數銷的一頂部表面在處理期間係以下情形之一：位於該環形帶部之一頂部表面下方、平行於該環形帶部之一頂部表面、或位於該環形帶部之一頂部表面上方。
  11. 如申請專利範圍第1項之基板處理系統用之基座，更包含：複數突出部，以支撐該基板的一中心部， 其中該複數突出部的一頂部表面係以下情形之一：位於該環形帶部之一頂部表面下方、平行於該環形帶部之一頂部表面、或位於該環形帶部之一頂部表面上方。
  12. 如申請專利範圍第1項之基板處理系統用之基座，其中在處理期間，該環形帶部係配置成沿著該徑向外邊緣而支撐該基板的一背側表面，使得該基板平行於該環形帶部。
  13. 如申請專利範圍第1項之基板處理系統用之基座，更包含從該基座主體在該凹部中向上延伸的複數突出部。
  14. 一種基板處理系統用之基座，包含：一基座主體，其包含一面向基板表面；一環形帶部，其係設置於該面向基板表面上，且係配置成支撐一基板的徑向外邊緣；一凹部，其係定義於該基座主體之該面向基板表面中，且係位於該環形帶部的徑向內側，其中該凹部建立介於該基板之一底部表面與該基座主體之該面向基板表面之間的一容積；複數通氣孔，其穿過該基座主體且與該凹部流體連通，以在處理期間使該基板之相反面上的壓力均衡，其中該複數通氣孔每一者包含：一第一通氣孔部，其從該基座主體的一徑向外側在徑向上向內延伸；以及一第二通氣孔部，其從該第一通氣孔部的一徑向內邊緣垂直地延伸至該凹部；以及一環件，其係與該基座主體分開、且設置於該基座主體上於該基板及該環形帶部的徑向外側， 其中該環件的一頂部表面係設置於該基板的一頂部表面上方，以及其中該環件係由介電材料製成。
  15. 如申請專利範圍第14項之基板處理系統用之基座，其中該介電材料係選自由鋁土、鋁氮化物、藍寶石、石英、及矽氧化物組成的群組。
  16. 一種基板處理系統用之基座，包含：一基座主體，其包含一面向基板表面；一環形帶部，其係設置於該面向基板表面上，且係配置成支撐一基板的徑向外邊緣；一凹部，其係定義於該基座主體之該面向基板表面中，且係位於該環形帶部的徑向內側，其中該凹部建立介於該基板之一底部表面與該基座主體之該面向基板表面之間的一容積；複數通氣孔，其穿過該基座主體且與該凹部流體連通，以在處理期間使該基板之相反面上的壓力均衡，其中該複數通氣孔每一者包含：一第一通氣孔部，其從該基座主體的一徑向外側在徑向上向內延伸；以及一第二通氣孔部，其從該第一通氣孔部的一徑向內邊緣垂直地延伸至該凹部；以及一環件，其係與該基座主體分開，其設置於該基座主體上，且其包含設置於該基板之徑向內側及下方的一徑向內表面、及設置於該基板之徑向外側的一徑向外表面，其中該環件的一頂部表面平行於該基板的一頂部表面，且其中該環件係由介電材料製成。
  17. 如申請專利範圍第16項之基板處理系統用之基座，其中該介電材料係選自由鋁土、鋁氮化物、藍寶石、石英、及矽氧化物組成的群組。
  18. 一種基板處理系統，包含：一處理腔室；如申請專利範圍第1項之基板處理系統用之基座，其中該基座係設置於該處理腔室中；以及一RF產生器，其係設置於該處理腔室中。
  19. 如申請專利範圍第18項之基板處理系統，更包含：複數最小接觸面積(MCA,minimum contact area)銷，其可從該基座主體延伸；以及一控制器，其係配置成在處理期間使該複數MCA銷延伸，使得該複數MCA銷的一頂部表面係以下情形之一：位於該環形帶部下方、平行於該環形帶部、或在該環形帶部的上方。
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