TWI763198B - 製造半導體封裝的方法以及半導體封裝 - Google Patents
製造半導體封裝的方法以及半導體封裝 Download PDFInfo
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- TWI763198B TWI763198B TW109145349A TW109145349A TWI763198B TW I763198 B TWI763198 B TW I763198B TW 109145349 A TW109145349 A TW 109145349A TW 109145349 A TW109145349 A TW 109145349A TW I763198 B TWI763198 B TW I763198B
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Abstract
一種方法包含:將多個封裝組件包封在包封體中,及在多個封裝組件上方形成第一多個重佈線層且電性耦接至多個封裝組件。第一多個重佈線層具有多個電源/接地焊墊堆疊,其中多個電源/接地焊墊堆疊中的每一者在第一多個重佈線層中的每一者中具有焊墊。多個電源/接地焊墊堆疊包含多個電源焊墊堆疊及多個接地焊墊堆疊。至少一個第二重佈線層形成於第一多個重佈線層上方。第二重佈線層包含電性連接至多個電源/接地焊墊堆疊的電源線及電接地線。
Description
本發明實施例是有關於一種製造半導體封裝的方法以及半導體封裝。
近年來,高效能計算應用一直受到關注。高效能計算應用可包含經整合至相同晶圓的多個核心元件。在高效能計算應用的製造中已經發現新問題。
本申請的一些實施例提供一種製造半導體封裝的方法,包括:將多個封裝組件包封在包封體中;在所述多個封裝組件上方形成第一多個重佈線層且電性耦接至所述多個封裝組件,其中所述第一多個重佈線層包括多個電源/接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊中的每一者在所述第一多個重佈線層中的每一者中具有焊墊,且其中所述多個電源/接地焊墊堆疊包括:多個電源焊墊堆疊;以及多個接地焊墊堆疊;以及在所述第一多個重佈線層上方形成至少一個第二重佈線層,其中所述至少一個第二重佈
線層包括電性連接至所述多個電源/接地焊墊堆疊的電源線及電接地線。
此外,本申請的其他實施例提供一種半導體封裝,包括:封裝組件;包封體,將所述封裝組件包封於其中;第一多個介電層,在所述封裝組件及所述包封體上方;第一多個重佈線層,延伸至所述第一多個介電層中,其中所述第一多個重佈線層包括經配置為與所述封裝組件交疊的陣列的多個電源/接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊包括多個電源焊墊堆疊及多個接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊中的每一者在所述第一多個重佈線層中的每一者中具有焊墊;第二多個介電層,在所述第一多個重佈線層上方;以及第二多個重佈線層,在所述第一多個重佈線層上方。
另外,本申請的其他實施例提供一種半導體封裝,包括:多個封裝組件,其中所述多個封裝組件包括元件晶粒;模製化合物,將所述多個封裝組件包封於其中;第一多個重佈線層,在所述多個封裝組件上方且電性連接至所述多個封裝組件,其中所述第一多個重佈線層包括多個金屬墊陣列,其中所述金屬墊陣列中的每一者與所述多個封裝組件中的一者的中心區域交疊,且其中所述多個金屬墊陣列中的每一者包括多個電源/接地焊墊堆疊;以及第二多個重佈線層,在所述第一多個重佈線層上方且電性連接至所述第一多個重佈線層。
20:載板
22:離型膜
24:晶粒貼合膜
26、49:封裝組件
26A:核心封裝組件
26B:IO晶粒
26CR:中心區域
26PR:周邊區域
28:部分
30:鈍化層
32:金屬墊
34、56:電連接器
36:保護層
38:包封體
48:導電特徵
50:重佈線結構
50A:下部重佈線結構
50B:上部重佈線結構
52:電源/接地焊墊堆疊
52-G:正電壓焊墊堆疊
52-P:接地電源焊墊堆疊
54:除氣孔
100:經重構晶圓
200:製程流程
202、204、206、208、210、212、214、216、218、220:製程
DL1、DL2、DL3、DL4、DL5、DL6、DL7:介電層
L:焊墊長度
pad-RDL1、pad-RDL2、pad-RDL3:電源焊墊
RDL1、RDL2、RDL3、RDL4、RDL5、RDL6:重佈線層
S1、S2:層間間距
S3:層內間距
S4:間距
via1、via2、via3、via4、via5、via6:通孔
x、y:移位
W:焊墊寬度
結合附圖閱讀以下詳細描述會最佳地理解本揭露的態
樣。應注意,根據業界中的標準慣例,各種特徵並未按比例繪製。事實上,可出於論述清楚起見而任意地增加在或減小各種特徵的尺寸。
圖1至圖13示出根據一些實施例的形成經重構晶圓的中間階段的橫截面圖。
圖14示出根據一些實施例的經重構晶圓的平面圖。
圖15示出根據一些實施例的在封裝組件的正上方的電源焊墊堆疊的平面圖及實例電源焊墊堆疊的放大圖。
圖16示出根據一些實施例的相鄰電源焊墊堆疊中的電源焊墊之間的層間間距及層內間距。
圖17示出根據一些實施例的電源焊墊堆疊中的交疊電源焊墊。
圖18示出根據一些實施例的電源焊墊具有未對準邊緣的電源焊墊堆疊。
圖19及圖20示出根據一些實施例的相同電源焊墊堆疊中的電源焊墊的移位。
圖21及圖22示出根據一些實施例的具有不同數目個層的電源焊墊堆疊。
圖23、圖24以及圖25示出根據一些實施例的在電源焊墊堆疊中具有不同大小及形狀的電源焊墊。
圖26及圖27示出根據一些實施例的連接相同電源焊墊堆疊中的電源焊墊的通孔的配置。
圖28示出根據一些實施例的頂部焊墊與電源焊墊堆疊中的底部焊墊的一部分交疊。
圖29示出根據一些實施例的頂部焊墊不與電源焊墊堆疊中的底部焊墊的任何部分交疊。
圖30示出根據一些實施例的電源焊墊堆疊的頂部焊墊不與相鄰電源焊墊堆疊中的底部焊墊的任何部分交疊。
圖31示出根據一些實施例的電源焊墊堆疊的頂部焊墊與相鄰電源焊墊堆疊中的底部焊墊的一部分交疊。
圖32示出根據一些實施例的電源焊墊堆疊中的電源焊墊的一些實例形狀。
圖33示出根據一些實施例的形成陣列的電源焊墊堆疊。
圖34示出根據一些實施例的形成非陣列重複模式的電源焊墊堆疊。
圖35、圖36以及圖37示出根據一些實施例的一些電源焊墊堆疊的分配。
圖38及圖39示出根據一些實施例的電源焊墊堆疊上方的電源線及接地線。
圖40示出根據一些實施例的用於形成經重構晶圓的製程流程。
以下揭露內容提供用以實施本發明的不同特徵的許多不同實施例或實例。以下描述組件及配置的具體實例以為了簡化本揭露。當然,這些組件及配置僅為實例且並不意欲為限制性的。舉例而言,在以下描述中,在第二特徵上方或在第二特徵上形成第一特徵可包含第一特徵與第二特徵直接接觸地形成的實施例,且亦
可包含在第一特徵與第二特徵之間可形成額外特徵,使得第一特徵與第二特徵可不直接接觸的實施例。另外,本揭露可在各種實例中重複附圖標號及/或字母。此重複是出於簡單及清楚的目的,且本身並不指示所論述的各種實施例及/或配置之間的關係。
另外,本文中為易於描述可使用諸如「在......之下」、「在......下方」、「下部」、「上覆」、「上部」以及類似者的空間相對術語來描述如圖式中所說明的一個部件或特徵與另一(些)部件或特徵的關係。除圖式中所描繪的定向之外,空間相對術語亦意欲涵蓋元件在使用或操作中的不同定向。設備可以其他方式定向(旋轉90度或處於其他定向),且本文中所使用的空間相對描述詞同樣可相應地進行解釋。
根據一些實施例提供一種電源及接地重佈線結構(其可用於高效能計算封裝中)及其形成方法。根據一些實施例,示出形成高效能計算封裝的中間階段。論述一些實施例的一些變型。本文中所論述的實施例將提供使得能夠製備或使用本揭露的主題的實例,且所屬技術領域中具有通常知識者將易於理解在屬於不同實施例的所設想範疇內的情況下可進行的修改。在各視圖及說明性實施例中,相同的附圖標號用以指代相同部件。儘管方法實施例可論述為以特定次序執行,但其他方法實施例可以任何邏輯次序執行。根據本揭露的一些實施例,經重構晶圓包含下部重佈線層及上部重佈線層。下部重佈線層中的電源焊墊形成電源焊墊堆疊,其中相鄰電源焊墊堆疊中的電源焊墊不具有交疊。因此減少了相鄰電源焊墊堆疊之間的電短路。
圖1至圖13示出根據本揭露的一些實施例的形成經重構
晶圓的中間階段的橫截面圖。經重構晶圓可包含根據一些實施例的高效能計算封裝。對應製程亦示意性地反映於圖40中所示的製程流程中。
參看圖1,設置載板20,且離型膜22形成於載板20上。載板20由透明材料形成,且可為玻璃載板、陶瓷載板、有機載板或類似者。離型膜22與載板20的頂部表面實體接觸。離形膜22可由光熱轉化(Light-To-Heat-Conversion;LTHC)塗佈材料形成。離型膜22可經由塗佈而塗覆至載板20上。根據本揭露的一些實施例,LTHC塗佈材料能夠在光/輻射(諸如雷射光束)的熱量下分解,且可使載板20自在其上放置及形成的結構離型。根據一些實施例,介電緩衝層(未示出)形成於離型膜22上方。介電緩衝層可由聚合物(諸如聚苯并噁唑(polybenzoxazole;PBO)、聚醯亞胺、苯并環丁烯(benzocyclobutene;BCB)或另一可適用的聚合物)形成。根據替代性實施例,省略介電緩衝層。
接著例如經由晶粒貼合膜(Die-Attach Film;DAF)24將封裝組件26放置於離型膜22上方。相應製程在圖40中的製程流程200中示出為製程202。封裝組件26可包含元件晶粒(諸如核心元件晶粒及輸入/輸出(Input/output;IO)晶粒),及在其中具有元件晶粒的封裝。元件晶粒可在相應半導體基底的前表面(面向上的表面)處包含半導體基底及積體電路元件(諸如主動元件,其包含例如未示出的電晶體)。半導體基底、積體電路元件以及內連線結構表示為部分28。根據本揭露的一些實施例,封裝組件26可包含邏輯晶粒,所述邏輯晶粒可包含中央處理單元(Central Processing Unit;CPU)晶粒、圖形處理單元(Graphic Processing
Unit;GPU)晶粒、行動應用程式晶粒、微型控制單元(Micro Control Unit;MCU)晶粒、基頻(BaseBand;BB)晶粒、應用程式處理器(Application processor;AP)晶粒、可程式邏輯陣列(Field-Programmable Gate Array;FPGA)晶粒、特殊應用積體電路(Application-Specific Integrated Circuit;ASIC)晶粒及/或類似者。封裝組件26亦可包含記憶體晶粒、輸入-輸出(IO)晶粒或類似者。記憶體晶粒可包含高頻寬記憶體(High-Bandwidth Memory;HBM)堆疊、混合記憶體立方體(Hybrid Memory Cubes;HMC)、動態隨機存取記憶體(Dynamic Random Access Memory;DRAM)晶粒、靜態隨機存取記憶體(Static Random Access Memory;SRAM)晶粒或類似者。封裝組件26亦可包含系統封裝,其中系統封裝包含經整合為系統的多個封裝。對應封裝組件26有時稱為系統單晶片(System-on-Chip;SoC)晶粒。
在封裝組件26的部分28上方,可存在金屬墊32。根據一些實施例,金屬墊32由鋁銅、銅、鎳、鋁或類似者形成。金屬墊的邊緣部分可由鈍化層30覆蓋,所述鈍化層30可由氧化矽、氮化矽、未經摻雜的矽酸鹽玻璃、其複合層或類似者形成或包括氧化矽、氮化矽、未經摻雜的矽酸鹽玻璃、其複合層或類似者。
根據一些實施例,電連接器34可形成於金屬墊32上方,其中電連接器34的下部部分穿透鈍化層30以接觸金屬墊32。電連接器34電性連接至封裝組件26中的積體電路元件。電連接器34可由金屬柱(或金屬墊)形成。電連接器34可包含用於提供電源(諸如提供VDD)的一些連接器、用於電接地(VSS)的一些連接器、用於信號佈線的一些連接器以及類似者。根據本揭露的一些
實施例,形成保護層36以覆蓋電連接器34,其中保護層36的一些部分覆蓋電連接器34。保護層36可由聚合物形成,所述聚合物可包括PBO、聚醯亞胺、BCB或類似者。
參看圖2,施配包封體38以包封封裝組件26且填充封裝組件26之間的間隙。相應製程在圖40中的製程流程200中示出為製程204。包封體38以可流動的形態安置,且接著經固化成固態。包封體38可包含模製化合物、模製底填充料、環氧樹脂及/或樹脂。當由模製化合物或模製底填充料形成時,包封體38可包含基質材料以及基質材料中的填充劑顆粒(未示出),所述基質材料可為聚合物、樹脂、環氧樹脂或類似者。填充劑顆粒可為SiO2、Al2O3、二氧化矽或類似者的介電顆粒,且可具有球形形狀。此外,球形填充劑顆粒可具有相同或不同的直徑。包封體38經施配成使得包封體38的頂部表面能夠高於封裝組件26中的電連接器34及保護層36的頂端的層級。
亦如圖3中所示,在施配包封體38之後,執行平坦化製程(諸如化學機械研磨(Chemical Mechanical Polish;CMP)製程或機械研磨製程)以使包封體38、保護層36以及封裝組件26的電連接器34平坦化。相應製程在圖40中的製程流程200中示出為製程206。因此,暴露封裝組件26的電連接器34。
在後續製程中,重佈線結構50(圖11)形成於包封體38上方,且相應製程繪示於圖4至圖11中。圖4至圖7示出根據一些實施例的形成下部重佈線結構50A。參看圖4,形成介電層DL1。相應製程在圖40中的製程流程200中示出為製程208。可使用聚合物形成介電層DL1,所述聚合物以可流動的形態施配,且接著
經固化。根據一些實施例,介電層DL1由PBO、聚醯亞胺、BCB或類似者形成。
參看圖5,形成包含金屬線及焊墊的重佈線(redistribution line;RDL)層RDL1。在本揭露中,術語「RDL層」用於指導電特徵,諸如共同位於相同層中且不包含通孔的金屬線及焊墊。因此,RDL層RDL1包含介電層DL1上方的重佈線的部分。亦形成通孔via1以延伸至介電層DL1中且將RDL層RDL1電性連接至封裝組件26。相應製程在圖40中的製程流程200中示出為製程210。根據一些實施例,形成製程包含:使介電層DL1圖案化以形成開口,經由所述開口顯露封裝組件26的電連接器34;沈積金屬晶種層;在金屬晶種層上方形成鍍覆罩幕(諸如光阻);使鍍覆罩幕圖案化;執行鍍覆製程以形成RDL層RDL1及通孔via1;移除鍍覆罩幕,以及接著移除直接位於經移除鍍覆罩幕之下的金屬晶種層的部分。亦將金屬晶種層的剩餘部分視為RDL層RDL1及通孔via1的部分。金屬晶種層可包含銅層,或可包含組合層,所述組合層包含鈦層及鈦層上方的銅層或類似者。舉例而言,經鍍覆材料可包含銅或銅合金。
圖6示出形成介電層DL2,所述介電層DL2可使用由用於形成介電層DL1的候選材料的相同族群中選出的材料來形成。相應製程在圖40中的製程流程200中示出為製程212。在後續製程中,如圖7中所示,形成RDL層RDL2及RDL層RDL3、通孔via2及通孔via3,以及介電層DL3及介電層DL4。相應製程在圖40中的製程流程200中示出為製程214。RDL層RDL2及RDL層RDL3以及通孔via2及通孔via3的材料及形成製程可分別類似於
RDL層RDL1及通孔via1的材料及形成製程。介電層DL3及介電層DL4的材料及形成製程可分別類似於介電層DL2的材料及形成製程。舉例而言,介電層DL3及介電層DL4可由聚醯亞胺、PBO、BCB或類似者形成。因此,在本文中未重複細節。因此形成包含RDL(RDL1、RDL2以及RDL3)、通孔(通孔via1、通孔via2以及通孔via3)以及介電層(介電層DL1、介電層DL2、介電層DL3以及介電層DL4)的下部重佈線結構50A。應瞭解,儘管在所論述實例中,下部重佈線結構50A具有三個RDL層,但根據一些實施例,下部重佈線結構50A中的RDL層的數目可為兩個、四個、五個或大於五個。
圖8至圖11示出根據一些實施例的形成上部重佈線結構50B(圖11)。相應製程在圖40中的製程流程200中示出為製程216。參看圖8,形成RDL層RDL4及通孔via4。RDL層RDL4及通孔via4的材料及形成製程可分別類似於RDL層RDL1及通孔via1的材料及形成製程。RDL層RDL4亦可在介電層DL4上方包含金屬線及焊墊。通孔via4延伸至介電層DL4中以接觸RDL層RDL3中的金屬線及焊墊。
接著,如圖9中所示,形成通孔via5。根據一些實施例,使用就形成RDL層RDL1而言基本上相同的製程來執行通孔via5的形成。根據替代性實施例,執行共用與RDL層RDL4相同的金屬晶種層的通孔via5的形成。因此,可在移除用於形成RDL層RDL4的鍍覆罩幕(未示出)之後但在蝕刻用於形成RDL層RDL4的金屬晶種層的暴露部分之前執行通孔via5的形成製程。通孔via5的形成製程可包含:形成覆蓋鍍覆RDL層RDL4及未經蝕刻
的金屬晶種層的鍍覆罩幕,使鍍覆罩幕圖案化以暴露出RDL層RDL4的一些部分,在鍍覆罩幕中的開口中鍍覆通孔via5,移除鍍覆罩幕,以及接著蝕刻未經RDL層RDL4覆蓋的金屬晶種層的部分。
參看圖10,形成介電層DL5。根據一些實施例,介電層DL5由模製化合物、模製底填充料、環氧樹脂、樹脂或類似者形成,且形成製程包含以可流動的形態施配介電層DL5,以及接著使介電層DL5固化。執行平坦化製程以使通孔via5及介電層DL5的頂部表面平坦化。因此顯露通孔via5。
圖11示出根據本揭露的一些實施例的形成RDL層RDL5及RDL層RDL6、通孔via6,以及介電層DL6及介電層DL7。RDL5及RDL6以及通孔via6的材料及形成製程可分別類似於RDL層RDL4及通孔via5的材料及形成製程。介電層DL6及介電層DL7的材料及形成製程可分別類似於介電層DL5的材料及形成製程。舉例而言,介電層DL6及介電層DL7可由模製化合物、模製底填充料、環氧化物、樹脂或類似者形成。形成製程亦可包含施配製程、固化製程以及平坦化製程。應瞭解,儘管將三個RDL層DL5、RDL層DL6以及RDL層DL7用作實例,但根據一些實施例,上部重佈線結構中的RDL層的數目可為兩個、四個、五個或大於五個。在後續製程中,可形成導電特徵48,所述導電特徵48可為凸塊下金屬(Under-Bump Metallurgies;UBM)。
因此,經由如圖4至圖11中所示的製程形成重佈線結構50。根據一些實施例,重佈線結構50包含下部重佈線結構50A及上部重佈線結構50B。上部重佈線結構50B中的介電層DL5、介
電層DL6以及介電層DL7可比下部重佈線結構50A中的介電層DL1、介電層DL2、介電層DL3以及介電層DL4中的任一者更厚。舉例而言,上部重佈線結構50B中的DL5、DL6以及DL7的厚度可等於下部重佈線結構50A中的介電層DL1、介電層DL2、介電層DL3以及介電層DL4的厚度的2倍(或大於2倍)。上部重佈線結構50B中的金屬線及焊墊亦可具有比下部重佈線結構50A中的金屬線及焊墊更大的厚度、節距、間距等。根據一些實施例,下部重佈線結構50A中的RDL可用於自封裝組件信號佈線至IO晶粒26B(圖14),且用於連接到上部重佈線結構50B中的電源線。上部重佈線結構50B中的RDL可用於電源佈線,且上部重佈線結構50B中的RDL可連接到電源模組。上部重佈線結構50B中的RDL可或可不用於電源佈線。
參看圖12,電連接器56形成於重佈線結構50的表面上。相應製程在圖40中的製程流程200中示出為製程218。電連接器56及重佈線結構50中的RDL電性連接至封裝組件26。在本揭露中,介電緩衝層(或若未形成介電緩衝層,則為離型膜22)上方的結構統稱為經重構晶圓100。
在後續製程中,例如藉由將雷射投射於離型膜22上以便使離型膜22分解從而使得經重構晶圓100可與載板20間隔開來將重佈線結構(經重構晶圓100)自載板20剝離。相應製程在圖40中的製程流程200中示出為製程220。根據本揭露的一些實施例,DAF 24例如在清潔製程或研磨製程中經移除。圖13中繪示所得經重構晶圓100。在後續製程中,經重構晶圓100(其可將所有元件晶粒26包含於其中)接合至額外封裝組件49,諸如電源模
組、積體被動元件(Integrated Passive Devices;IPD)及/或類似者。舉例而言,電源模組可包含用於調節電源的脈寬調變(Pulse Width Modulation;PWM)電路。另外,插座、接腳或類似者可連接至IO晶粒26B(圖14)。經重構晶圓100在接合至封裝組件49之前可不經鋸切。或者,可微調經重構晶圓100的非功能邊緣部分(其不將封裝組件包含於其中)。
圖14示出經重構晶圓100的平面圖。示出封裝組件26。根據一些實施例,封裝組件包含核心封裝組件26A及IO晶粒(或封裝)26B。核心封裝組件26A可佈局為陣列或諸如蜂巢圖案的其他重複佈局。根據一些實施例,核心封裝組件26A彼此相同,且具有相同結構及相同功能。IO晶粒26B可佈局在由核心封裝組件26A形成的陣列周圍。在經重構晶圓100的周邊區域中亦可存在插座(未示出)。
圖15示出核心封裝組件26A中的一者及與核心封裝組件26A的中心區域26CR交疊的電源/接地焊墊堆疊52的俯視圖。在本揭露中,電源/接地焊墊堆疊52包含用於電源供應器焊墊的電源焊墊(諸如VDD焊墊)及電接地(諸如VSS)焊墊。若採用負電源供應器電壓(negative power supply voltage),則電源/接地焊墊堆疊52亦將包含用於負電源供應器電壓的電源焊墊。另外,可存在一些虛設焊墊堆疊(dummy pad stacks),所述虛設焊墊堆疊為電浮置的。由於虛設焊墊堆疊用於減小其他電源焊墊堆疊的圖案加載效應(pattern-loading effect),因此所述虛設焊墊堆疊亦稱為電源/接地焊墊堆疊52。
中心區域26CR由周邊區域26PR包圍,所述周邊區域
26PR形成環繞中心區域26CR的環。電源焊墊堆疊52在RDL層RDL1直至上部RDL層RDLn(其中「n」可為等於2或大於2的整數)中包含電源焊墊。電源/接地焊墊堆疊52亦在RDL層RDL1與RDL層RDLn之間的所有RDL中包含電源焊墊。舉例而言,當n等於3時,電源/接地焊墊堆疊52在RDL層RDL1、RDL層RDL2以及RDL層RDL3中的每一者中包含電源焊墊。整數n亦比經重構晶圓100中的RDL的層的總數目至少小1,且可小2或3。舉例而言,在如圖13中所示的其中RDL層的總數目為6的實例中,「n」可為5、4、3或2。圖17及圖18示出一些實例,其中電源/接地焊墊堆疊52包含正電源焊墊堆疊52-P及接地電源焊墊堆疊52-G。電源/接地焊墊堆疊52中的每一者在RDL層RDL1、RDL層RDL2以及RDL層RDL3中分別包含電源焊墊pad-RDL1、電源焊墊pad-RDL2以及電源焊墊pad-RDL3。
再次參看圖15,在中心區域26CR中,除電源/接地焊墊堆疊52中的電源焊墊以外,亦不存在水平電源佈線。根據本揭露的一些實施例,電源/接地焊墊堆疊52完全藉由介電層(諸如如圖13、圖17以及圖18中所示的介電層DL1、介電層DL2以及介電層DL3)彼此間隔開,且在中心區域26CR中的電源/接地焊墊堆疊52之間不存在導電特徵。在圖15中所示的俯視圖中,在與其他電源焊墊堆疊中的任何其他電源焊墊交疊的任何電源焊墊堆疊52中可不存在電源焊墊,且沒有電源焊墊堆疊52具有與任何其他電源焊墊堆疊52的邊緣對準的任何邊緣。信號線(未示出)可分佈於周邊區域26PR中,且分佈於相鄰封裝組件26之間的間距(在圖14中所示的俯視圖中)中,使得信號可自核心封裝組件26A佈
線至如圖14中所示的IO晶粒26B。此外,不存在形成於電源/接地焊墊堆疊52之間的信號RDL。
在圖15的右側上,示出電源/接地焊墊堆疊52中的一者的俯視圖。電源焊墊堆疊52在RDL層RDL1、RDL層RDL2以及RDL層RDL3中分別包含電源焊墊pad-RDL1、電源焊墊pad-RDL2以及電源焊墊pad-RDL3。在本揭露中,數字附加至標記「pad-RDL」以顯示對應電源焊墊位於哪一RDL層中。在不敍述相應RDL層的數目的情況下亦可指代電源焊墊堆疊中的電源焊墊。舉例而言,電源焊墊可稱為「pad-RDL1」以顯示其在RDL層1中,或可稱作「pad-RDL」以顯示其為電源/接地焊墊堆疊中的焊墊。出於觀察的目的,電源焊墊pad-RDL1、電源焊墊pad-RDL2以及電源焊墊pad-RDL3繪示為交錯的。在其他實施例中,如後續段落中將論述,電源焊墊pad-RDL1、電源焊墊pad-RDL2以及電源焊墊pad-RDL3的對應邊緣中的一些或所有可相對於彼此經對準或移位。根據一些實施例,電源/接地焊墊堆疊52中的電源焊墊為在其中不具有孔的固體金屬墊。根據其他實施例,除氣孔54可形成於電源焊墊中,其中除氣孔填充有介電材料。在圖15中,使用虛線來繪示除氣孔54以表示可或可不形成所述除氣孔54。形成通孔(諸如通孔via3)以與相鄰RDL層中的金屬墊互連。在後續圖16至圖37中,未示出除氣孔54,儘管所述除氣孔54可或可不形成於這些圖中的每一者中。在一些實例中,電源焊墊堆疊52中的焊墊的尺寸(諸如長度、寬度、直徑等)在約20微米與50微米之間的範圍內,儘管所述尺寸可更大或更小。
如圖13中所示,經重構晶圓100可包含多個封裝組件
26,且因此形成多個電源焊墊以用於供應電源及用於接地。下部介電層(諸如下部介電層DL1、下部介電層DL2以及下部介電層DL3)可相對較薄,且RDL層RDL1、RDL層RDL2以及RDL層RDL3中的RDL亦相對較窄且具有相對較小的間距。因此,下部介電層中的電源重佈線更為可能受到諸如電短路的問題的影響。舉例而言,若正電源線/焊墊與接地線/焊墊交疊,則在製造製程中產生的一些不合需要的顆粒可使正電源線/焊墊至相鄰的下伏接地線/焊墊短路,從而導致元件故障。因此,電源/接地焊墊堆疊52用於豎直電源/接地連接,且不用於電源及電接地的橫向佈線。經由此設計,下部介電層中的電源分佈結構包含單獨電源/接地焊墊堆疊52,且正電源線/焊墊將不與任何其他接地線/焊墊交疊,且接地線/焊墊將不與任何其他正電源線/焊墊交疊。電短路的可能性減小。另一方面,由於上部電源重佈線結構(諸如在RDL層RDL6、RDL5(有時包含RDL4)中的上部電源重佈線結構)相對較寬且具有較大間距,因此電短路的可能性較低,且這些層可用於橫向電源佈線,且可在不形成離散電源焊墊堆疊的情況下形成橫向電源RDL。
圖16示出標記有電源焊墊之間的間距的兩個相鄰電源/接地焊墊堆疊52的平面圖。在本揭露中,術語「層間間距」用於指在不同RDL層中的兩個電源焊墊之間的間距,且術語「層內間距」用於指在相同RDL層中的兩個電源/接地焊墊之間的間距。在圖16中所示的實例中,間距S1及間距S2為兩個緊密相鄰的層中的電源/接地焊墊的層間間距。舉例而言,間距S1是RDL層RDL1中的電源/接地焊墊與RDL層RDL2中的電源/接地焊墊之間的層
間間距,且間距S2是RDL層RDL2中的電源/接地焊墊與RDL層RDL3中的電源/接地焊墊之間的層間間距。根據一些實施例,兩個緊接的相鄰RDL層中的兩個電源焊墊的層間間距(諸如層間間距S1及層間間距S2)及層內間距設計成小於將不會出現電短路的臨限值。舉例而言,在製造製程中不合需要地產生的顆粒可具有小於10微米的大小。因此,層間間距S1及層間間距S2以及層內間距S3可定義為大於10微米,使得若顆粒接觸電源焊墊中的一者,則顆粒將無法接觸相鄰電源焊墊以使電源焊墊短路。
圖17示出兩個相鄰電源/接地焊墊堆疊52。圖17的上部部分示出橫截面圖,且下部部分示出俯視圖。在一些實例中,電源/接地焊墊堆疊52中的一者為電源焊墊堆疊52-P,而另一電源/接地焊墊堆疊為接地焊墊堆疊52-G。上部RDL層中的上部電源焊墊的邊緣與下部電源焊墊的邊緣豎直對準。如圖17的下部部分中所示,不同RDL中的電源焊墊可具有相同大小及相同形狀,且上部電源焊墊可與相應下部電源焊墊完全交疊。
圖18示出兩個相鄰電源/接地焊墊堆疊52。圖18的上部部分示出橫截面圖,且下部部分示出俯視圖。上部RDL層中的上部電源焊墊的一些或所有邊緣可未對準下部電源焊墊的邊緣,而其他邊緣可經對準或未對準。如圖18的下部部分中所示,不同RDL中的電源焊墊可具有不同大小及/或不同形狀。
如圖17及圖18中所示,電源/接地焊墊堆疊52中的每一者電性連接至相應的下伏封裝組件26A中的電連接器34中的一者。在電源/接地焊墊堆疊52與相應連接的電連接器34之間可存在一對一對應性。另一方面,封裝組件26A的一些電連接器34
可用於信號佈線,且不連接至電源/接地焊墊堆疊52。信號電連接器34可配置於對應封裝組件26A的周邊區域26PR(圖15)中。用於電源及接地的電連接器34可配置於對應封裝組件26A的中心區域26CR中。
圖19及圖20示出相同電源焊墊堆疊52中的電源焊墊的某一交疊方案。相同電源焊墊堆疊52中的電源焊墊可具有所有對應邊緣經對準的相同俯視圖大小及相同俯視圖形狀。或者,電源焊墊可與其對應的下伏電源焊墊部分交疊。然而,電源焊墊將與其緊接的下伏電源焊墊的至少一部分交疊,使得可形成通孔(vias)以與電源焊墊互連。圖19示出根據一些實施例的電源焊墊的交疊,其中電源焊墊相對於彼此交錯(移位)以減小應力。每一上部電源焊墊與下伏電源焊墊中的每一者的至少一部分交疊。圖20示出根據其他實施例的電源焊墊的交疊,其中電源焊墊pad-RDL3與緊接的下伏焊墊pad-RDL2交疊,且不與焊墊pad-RDL1交疊,所述電源焊墊不是緊接著下伏的pad-RDL3。根據一些實施例,焊墊在焊墊的寬度方向上相對於其緊接的下伏焊墊的移位「x」小於或等於W/2,其中W是焊墊寬度。焊墊在焊墊的長度方向上相對於其緊接的下伏焊墊的移位「y」小於或等於L/2,其中L為焊墊長度。
圖21及圖22示出電源/接地焊墊堆疊52可延伸至不同數目個RDL層中。根據如前述圖17及圖18中所示的一些實施例,電源/接地焊墊堆疊52延伸至RDL層RDL1、RDL層RDL2以及RDL層RDL3中。電源/接地焊墊堆疊52亦可延伸至下部重佈線結構50A中的所有RDL層中,且不延伸至上部重佈線結構50B中的任何RDL層中。由於下部重佈線結構50A(參看圖13)
較薄且具有相鄰RDL之間的較小間距,因此在下部重佈線結構50A中形成電源/接地焊墊堆疊52但不延伸至上部重佈線結構50B中可使減小電短路的益處最大化,而不犧牲上部重佈線結構50B中的電源佈線能力,其中電短路的情況更為可能出現在下部重佈線結構50A中。圖21示出其中電源/接地焊墊堆疊52可延伸至RDL層RDL1及RDL層RDL2中但不延伸至RDL層RDL3、RDL層RDL4、RDL層RDL5、RDL層RDL6以及類似者中一些實施例。圖22示出其中電源/接地焊墊堆疊52可延伸至RDL層RDL1、RDL層RDL2、RDL層RDL3以及RDL層RDL4中但不延伸至RDL層RDL5、RDL層RDL6以及類似者中的一些實施例。
圖23、圖24以及圖25示出電源焊墊堆疊中的電源焊墊可具有任何形狀及大小,且相同電源焊墊堆疊中的電源焊墊的形狀及大小可彼此相同或不同。舉例而言,在圖23中,電源焊墊具有矩形形狀,且具有相同形狀及相同大小。相同電源焊墊堆疊52中的不同電源焊墊的大小及形狀亦可彼此相同或不同。在圖24中,電源焊墊具有不同形狀及大小,且頂部焊墊pad-RDL3具有與下伏電源焊墊中的每一者交疊的至少一部分。在圖25中,電源焊墊具有不同形狀及大小,且頂部焊墊pad-RDL3不與焊墊pad-RDL1的任何部分交疊。
圖26及圖27示出如何形成通孔以與相同電源焊墊堆疊52中的相鄰電源焊墊互連。在圖26中,兩個相鄰電源焊墊經由單個通孔連接。在圖27中,兩個相鄰電源焊墊經由多個通孔連接。應瞭解,電源焊墊可具有除氣孔(參看圖15中的除氣孔54),且通孔的位置及大小經分配為避開除氣孔。
在圖28中,電源焊墊具有相同或不同形狀及/或相同或不同大小,且頂部焊墊pad-RDL3具有與底部焊墊pad-RDL1交疊的至少一部分。在圖29中,電源焊墊亦具有相同或不同形狀及/或相同或不同大小,且頂部焊墊pad-RDL3不與焊墊pad-RDL1的任何部分交疊。
如前述段落中所闡述,當層間間距在兩個緊接的相鄰RDL層中的兩個金屬墊之間時,相鄰電源/接地焊墊堆疊的層間間距可大於約10微米。另一方面,當層間間距在兩個非緊接的相鄰RDL層中的兩個金屬墊之間時,此限制可放寬。舉例而言,圖30示出在相鄰電源焊墊堆疊中頂部焊墊pad-RDL3與底部焊墊pad-RDL1間隔開間距S4,所述間距S4可大於10微米,等於10微米或小於10微米。圖32示出頂部焊墊pad-RDL3與相鄰電源焊墊堆疊中的底部焊墊pad-RDL1交疊。由於非緊接的相鄰RDL層中的焊墊(諸如焊墊pad-RDL3及焊墊pad-RDL1)之間的豎直間距較大,因此即使出現交疊,電短路的風險亦較低。
圖32示出根據一些實施例的電源焊墊堆疊中的電源焊墊的一些實例形狀。一些實例形狀包含具有直角的矩形、具有圓化拐角的矩形、六邊形、八邊形、圓形或類似者。
圖33及圖34示出根據一些實施例的電源/接地焊墊堆疊52的佈局。圖33示出其中電源/接地焊墊堆疊52配置為陣列的實施例。圖34示出其中電源/接地焊墊堆疊52配置為不同於陣列的另一圖案的實施例。舉例而言,電源/接地焊墊堆疊52可配置為具有蜂巢圖案或任何其他重複圖案。電源/接地焊墊堆疊52亦可配置為具有非重複圖案。
圖35、圖36以及圖37示出相鄰電源焊墊堆疊的配置。應瞭解,電源焊墊堆疊經設計為電源焊墊堆疊還是接地焊墊堆疊與對應的下伏封裝組件26A中的下伏電連接器的佈局相關,且可採用任何佈局。舉例而言,圖35示出四個相鄰電源/接地焊墊堆疊52具有三個正電源焊墊堆疊52-P以及一個接地焊墊堆疊52-G。圖36示出四個相鄰電源/接地焊墊堆疊52具有兩個正電源焊墊堆疊52-P以及兩個接地焊墊堆疊52-G。圖36示出四個相鄰電源/接地焊墊堆疊52具有在每一列及每一行中交替的兩個正電源焊墊堆疊52-P以及兩個接地焊墊堆疊52-P。
圖38及圖39示出上部重佈線結構50B中的金屬線/焊墊的配置。圖38示出上部重佈線結構50B中的一些電源焊墊及電源重佈線可具有與上部重佈線結構50B中的對應的下伏電源重佈線的邊緣對準的邊緣。舉例而言,RDL層RDL4及RDL層RDL5中的電源焊墊/線具有與在RDL 4中的對應的下伏電源焊墊/線的邊緣對準的邊緣。在圖39中,上部重佈線結構50B中的電源焊墊及電源重佈線可與上部重佈線結構50B中的對應的下伏電源重佈線交疊。舉例而言,RDL層RDL5中的電源/接地焊墊/線與RDL層RDL4中的相鄰電源/接地焊墊/線交疊,RDL層RDL4中的相鄰電源/接地焊墊/線連接至電源焊墊堆疊。
本揭露的實施例具有一些有利特徵。藉由將在下部重佈線結構的至少下部部分中的電源焊墊堆疊形成為彼此間隔開的離散電源/接地焊墊堆疊52,降低了具有至電接地的電源短路的風險。本揭露的實施例不會導致製造成本的增加因為實施例涉及微影罩幕的改變,但不涉及製造製程的改變。
根據本揭露的一些實施例,一種方法包含:將多個封裝組件包封在包封體中;在多個封裝組件上方形成第一多個重佈線層且電性耦接至多個封裝組件,其中所述第一多個重佈線層包括多個電源/接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊中的每一者在第一多個重佈線層中的每一者中具有焊墊,且其中多個電源/接地焊墊堆疊包括多個電源焊墊堆疊;以及多個接地焊墊堆疊;及在第一多個重佈線層上方形成至少一個第二重佈線層,其中所述至少一個第二重佈線層包括電性連接至多個電源/接地焊墊堆疊的電源線及電接地線。在實施例中,形成第一多個重佈線層包括:施加聚合物層;使聚合物層圖案化以形成通孔開口;以及在聚合物層上方鍍覆第一多個重佈線層,其中通孔同時鍍覆於通孔開口中。在實施例中,形成至少一個第二重佈線層包括:形成電源線及電接地線;在電源線及電接地線上方形成額外通孔且接觸電源線與電接地線;以模製化合物模製電源線、電接地線以及額外通孔;以及使模製化合物及額外通孔平坦化。在實施例中,多個電源/接地焊墊堆疊在多個封裝組件中的一者的正上方,且其中在多個封裝組件的俯視圖中,多個電源/接地焊墊堆疊為彼此隔開。在實施例中,多個電源/接地焊墊堆疊在多個封裝組件中的一者的正上方,且其中在多個封裝組件的俯視圖中,多個電源/接地焊墊堆疊配置為陣列。在實施例中,如請求項所述的方法更包含:將多個封裝組件放置於載板上方;及在形成至少一個第二重佈線層之後,將載板自多個封裝組件剝離。在實施例中,多個封裝組件、第一多個重佈線層以及至少一個第二重佈線層形成經重構晶圓,且所述方法更包括將經重構晶圓接合至額外封裝組件。在實施例中,多個電源/接地
焊墊堆疊共同與多個封裝組件中的一者的中心區域交疊,且第一多個重佈線層在多個電源/接地焊墊堆疊之間不含信號線。
根據本發明的一些實施例,其中所述形成所述第一多個重佈線層包括:施加聚合物層;使所述聚合物層圖案化以形成通孔開口;以及在所述聚合物層上方鍍覆所述第一多個重佈線層,其中通孔同時鍍覆於所述通孔開口中。
根據本發明的一些實施例,其中所述形成所述至少一個第二重佈線層包括:形成所述電源線及所述電接地線;在所述電源線及所述電接地線上方形成額外通孔且接觸所述電源線與所述電接地線;以模製化合物模製所述電源線、所述電接地線以及所述額外通孔;以及使所述模製化合物及所述額外通孔平坦化。
根據本發明的一些實施例,其中所述多個電源/接地焊墊堆疊在所述多個封裝組件中的一者的正上方,且其中在所述多個封裝組件的俯視圖中,所述多個電源/接地焊墊堆疊為彼此隔開。
根據本發明的一些實施例,其中所述多個電源/接地焊墊堆疊在所述多個封裝組件中的一者的正上方,且其中在所述多個封裝組件的俯視圖中,所述多個電源/接地焊墊堆疊配置為陣列。
根據本發明的一些實施例,所述的方法,更包括:將所述多個封裝組件放置於載板上方;以及在形成所述至少一個第二重佈線層之後,將所述載板自所述多個封裝組件剝離。
根據本發明的一些實施例,其中所述多個封裝組件、所述第一多個重佈線層以及所述至少一個第二重佈線層形成經重構晶圓,且所述方法更包括將所述經重構晶圓接合至額外封裝組件。
根據本發明的一些實施例,其中所述多個電源/接地焊墊
堆疊共同與所述多個封裝組件中的一者的中心區域交疊,且所述第一多個重佈線層在所述多個電源/接地焊墊堆疊之間不含信號線。
根據本揭露的一些實施例,一種封裝包含:封裝組件;將封裝組件包封於其中的包封體;在封裝組件及包封體上方的第一多個介電層;延伸至第一多個介電層中的第一多個重佈線層,其中第一多個重佈線層包括經配置為與封裝組件交疊的陣列的多個電源/接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊包括多個電源焊墊堆疊及多個接地焊墊堆疊,其中多個電源/接地焊墊堆疊中的每一者在第一多個重佈線層中的每一者中具有焊墊;在第一多個重佈線層上方的第二多個介電層;以及在第一多個重佈線層上方的第二多個重佈線層。在實施例中,在封裝組件的俯視圖中,多個電源/接地焊墊堆疊具有相同形狀,且為彼此隔開。在實施例中,多個電源/接地焊墊堆疊具有大於約10微米的間距。在實施例中,在多個電源/接地焊墊堆疊中的每一者中,第一多個重佈線層中的所有焊墊具有相同形狀,且彼此豎直對準。在實施例中,第一多個介電層由聚合物形成,且第二多個介電層由模製化合物形成。在實施例中,第一多個介電層具有三個或大於三個層。在實施例中,在多個電源/接地焊墊堆疊之間無信號線。
根據本發明的一些實施例,其中在所述封裝組件的俯視圖中,所述多個電源/接地焊墊堆疊具有相同形狀,且為彼此隔開。
根據本發明的一些實施例,其中所述多個電源/接地焊墊
堆疊具有大於約10微米的間距。
根據本發明的一些實施例,其中在所述多個電源/接地焊墊堆疊中的每一者中,所述第一多個重佈線層中的所有焊墊具有相同形狀,且彼此豎直對準。
根據本發明的一些實施例,其中所述第一多個介電層由聚合物形成,且所述第二多個介電層由模製化合物形成。
根據本發明的一些實施例,其中所述第一多個介電層具有三個或大於三個層。
根據本發明的一些實施例,其中在所述多個電源/接地焊墊堆疊之間無信號線。
根據本揭露的一些實施例,一種封裝包含:多個封裝組件,其中所述多個封裝組件包括元件晶粒;將多個封裝組件包封於其中的模製化合物;在多個封裝組件上方且電性連接至多個封裝組件的第一多個重佈線層,其中所述第一多個重佈線層包括多個金屬墊陣列,其中金屬墊陣列中的每一者與多個封裝組件中的一者的中心區域交疊,且其中多個金屬墊陣列中的每一者包括多個電源/接地焊墊堆疊;以及在第一多個重佈線層上方且電性連接至第一多個重佈線層的第二多個重佈線層。在實施例中,金屬墊陣列中的一者中的電源/接地焊墊堆疊包括電性互連的多個金屬墊,且其中所述多個金屬墊在相應下伏的封裝組件中電性連接至電源焊墊或電接地焊墊。在實施例中,電源/接地焊墊堆疊中的上部焊墊與電源/接地焊墊堆疊中的對應下部焊墊完全交疊。在實施例中,電源/接地焊墊堆疊中的多個金屬墊為交錯的。在實施例中,金屬墊陣列中的一者中的相鄰電源/接地焊墊堆疊具有大於約10微米
的間距。
根據本發明的一些實施例,其中所述金屬墊陣列中的一者中的電源/接地焊墊堆疊包括電性互連的多個金屬墊,且其中所述多個金屬墊在相應下伏的封裝組件中電性連接至電源焊墊或電接地焊墊。
根據本發明的一些實施例,其中所述電源/接地焊墊堆疊中的上部焊墊與所述電源/接地焊墊堆疊中的對應下部焊墊完全交疊。
根據本發明的一些實施例,其中所述電源/接地焊墊堆疊中的所述多個金屬墊為交錯的。
根據本發明的一些實施例,其中所述金屬墊陣列中的一者中的相鄰電源/接地焊墊堆疊具有大於約10微米的間距。
前文概述若干實施例的特徵,使得所屬技術領域中具有通常知識者可更佳地理解本揭露的態樣。所屬技術領域中具有通常知識者應瞭解,其可易於使用本揭露作為設計或修改用於實現本文中所引入的實施例的相同目的及/或達成相同優點的其他製程及結構的基礎。所屬技術領域中具有通常知識者亦應認識到,此類等效構造並不脫離本揭露的精神及範疇,且所屬技術領域中具有通常知識者可在不脫離本揭露的精神及範疇的情況下在本文中進行各種改變、替代以及更改。
200:製程流程
202、204、206、208、210、212、214、216、218、220:製程
Claims (10)
- 一種製造半導體封裝的方法,包括:將多個封裝組件放置在載板上;將所述多個封裝組件包封在包封體中;在所述多個封裝組件上方形成第一多個重佈線層且電性耦接至所述多個封裝組件,其中所述第一多個重佈線層包括多個電源/接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊中的每一者在所述第一多個重佈線層中的每一者中具有焊墊,且其中所述多個電源/接地焊墊堆疊包括:多個電源焊墊堆疊;以及多個接地焊墊堆疊;在所述第一多個重佈線層上方形成至少一個第二重佈線層,其中所述至少一個第二重佈線層包括電性連接至所述多個電源/接地焊墊堆疊的電源線及電接地線;以及在形成所述至少一個第二重佈線層之後,將所述載板自所述多個封裝組件剝離。
- 如請求項1所述的方法,其中所述多個電源/接地焊墊堆疊在所述多個封裝組件中的一者的正上方,且其中在所述多個封裝組件的俯視圖中,所述多個電源/接地焊墊堆疊為彼此隔開。
- 如請求項1所述的方法,其中所述多個電源/接地焊墊堆疊在所述多個封裝組件中的一者的正上方,且其中在所述多個封裝組件的俯視圖中,所述多個電源/接地焊墊堆疊配置為陣列。
- 如請求項1所述的方法,其中所述多個電源/接地焊墊堆疊共同與所述多個封裝組件中的一者的中心區域交疊,且所 述第一多個重佈線層在所述多個電源/接地焊墊堆疊之間不含信號線。
- 一種半導體封裝,包括:封裝組件;包封體,將所述封裝組件包封於其中;第一多個介電層,在所述封裝組件及所述包封體上方,其中所述第一多個介電層由聚合物形成;第一多個重佈線層,延伸至所述第一多個介電層中,其中所述第一多個重佈線層包括經配置為與所述封裝組件交疊的陣列的多個電源/接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊包括多個電源焊墊堆疊及多個接地焊墊堆疊,其中所述多個電源/接地焊墊堆疊中的每一者在所述第一多個重佈線層中的每一者中具有焊墊;第二多個介電層,在所述第一多個重佈線層上方,其中所述第二多個介電層由模製化合物形成;以及第二多個重佈線層,在所述第一多個重佈線層上方。
- 如請求項5所述的半導體封裝,其中在所述封裝組件的俯視圖中,所述多個電源/接地焊墊堆疊具有相同形狀,且為彼此隔開。
- 如請求項5所述的半導體封裝,其中在所述多個電源/接地焊墊堆疊中的每一者中,所述第一多個重佈線層中的所有焊墊具有相同形狀,且彼此豎直對準。
- 如請求項5所述的半導體封裝,其中在所述多個電源/接地焊墊堆疊之間無信號線。
- 一種半導體封裝,包括:多個封裝組件,其中所述多個封裝組件包括元件晶粒;模製化合物,將所述多個封裝組件包封於其中;第一多個重佈線層,在所述多個封裝組件上方且電性連接至所述多個封裝組件,其中所述第一多個重佈線層包括多個金屬墊陣列,其中所述金屬墊陣列中的每一者與所述多個封裝組件中的一者的中心區域交疊,且其中所述多個金屬墊陣列中的每一者包括多個電源/接地焊墊堆疊,且所述多個電源/接地焊墊堆疊中的金屬墊與所述多個電源/接地焊墊堆疊中的每一者的每一個上部金屬墊交錯,每一個上部金屬墊包括與所述多個電源/接地焊墊堆疊中的每一者的對應下部金屬墊的一部分重疊的第一部分以及延伸超出所述對應下部金屬墊邊緣的第二部分;以及第二多個重佈線層,在所述第一多個重佈線層上方且電性連接至所述第一多個重佈線層。
- 如請求項9所述的半導體封裝,其中所述金屬墊陣列中的一者中的相鄰電源/接地焊墊堆疊具有大於10微米的間距。
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US11804443B2 (en) | 2023-10-31 |
DE102020100946A1 (de) | 2021-07-01 |
US20210391270A1 (en) | 2021-12-16 |
US20210202391A1 (en) | 2021-07-01 |
CN113053761A (zh) | 2021-06-29 |
DE102020100946B4 (de) | 2022-04-14 |
US11107771B2 (en) | 2021-08-31 |
CN113053761B (zh) | 2024-04-05 |
KR102402914B1 (ko) | 2022-05-27 |
KR20210084196A (ko) | 2021-07-07 |
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