TWI753584B - Apparatus for bonding multiple clips in semiconductro package and semiconductor package produdec using the same - Google Patents

Apparatus for bonding multiple clips in semiconductro package and semiconductor package produdec using the same Download PDF

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TWI753584B
TWI753584B TW109132979A TW109132979A TWI753584B TW I753584 B TWI753584 B TW I753584B TW 109132979 A TW109132979 A TW 109132979A TW 109132979 A TW109132979 A TW 109132979A TW I753584 B TWI753584 B TW I753584B
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clip
lead frame
clips
semiconductor
inspection
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TW202121561A (en
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崔倫華
朴廷敏
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南韓商Ｊｍｊ韓國有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

一種半導體封裝的多重夾片黏合裝置，包括：引線框架承載部，供應供半導體晶片按第一齒距間距排列的引線框架；夾片承載部，供應供夾片按第二齒距間距排列的夾片方陣；夾片剪裁部，將夾片方陣按各個夾片剪裁；夾片裝載部，裝載夾片；引線框架排列部，將引線框架排列至夾片貼合位置；第一檢查部，檢查引線框架的夾片貼合位置的排列狀態或排列誤差；夾片貼合部，選擇夾片並按第一齒距間距排列，貼合至引線框架上部；引線框架卸載部，排出完成夾片貼合的引線框架；控制部，控制引線框架的供應、排列、檢查及排出，及夾片的供應、剪裁及貼合。 A multiple clip bonding device for a semiconductor package, comprising: a lead frame carrying part for supplying lead frames for semiconductor chips to be arranged at a first pitch interval; a clip carrying part for supplying clips for the clips to be arranged at a second pitch pitch Chip array; clip cutting part, cutting the clip array according to each clip; clip loading part, loading clips; lead frame arranging part, arranging the lead frame to the clip bonding position; the first inspection part, checking the leads The arrangement state or arrangement error of the clip attachment position of the frame; the clip attachment part, select the clips and arrange them according to the first tooth pitch, and attach them to the upper part of the lead frame; the lead frame unloading part, discharge the clip to complete the attachment The control part controls the supply, arrangement, inspection and discharge of the lead frame, as well as the supply, cutting and lamination of the clips.

Description

半導體封裝多重夾片黏合裝置及同裝置製造的半導體封 裝 Semiconductor package multi-clip bonding device and semiconductor package manufactured by the same device Pack

本發明涉及一種半導體封裝的多重夾片黏合裝置及通過同裝置製造的半導體封裝，其將引線框架的排列誤差最小化，以提高引線框架和夾片的貼合準確率，並且依次檢查夾片貼合工藝，以使半導體封裝的不合格率最小化。 The present invention relates to a multi-clip bonding device for a semiconductor package and a semiconductor package manufactured by the same device, which minimizes the arrangement error of the lead frame, improves the bonding accuracy of the lead frame and the clip, and checks the clip sticking in sequence. integrated process to minimize the defect rate of semiconductor packaging.

通常，實現電力用半導體元件的高電壓大電流半導體封裝在使用導電性夾片而代替焊接引線時，為了將夾片與半導體晶片貼合，而在將夾片排列至半導體晶片之後貼合。 Generally, when a high-voltage, high-current semiconductor package that realizes a power semiconductor element uses conductive clips instead of soldering leads, in order to bond the clips to the semiconductor wafer, the clips are arranged on the semiconductor wafer and then bonded.

為了將多個夾片分別排列至多個半導體晶片並同時貼合，夾片的齒距和半導體晶片的齒距需保持一致。 In order to arrange a plurality of clips respectively on a plurality of semiconductor wafers and attach them at the same time, the tooth pitch of the clips and the tooth pitch of the semiconductor wafers need to be kept the same.

例如，在效率方面，與在引線框架貼合的半導體晶片的齒距相比，在夾片方陣排列中的夾片的齒距小。在剪裁夾片之後，再次調整夾片的齒距並排列在引線框架上，再貼合夾片。 For example, in terms of efficiency, the pitch of the clips in a square array of clips is small compared to the pitch of the leadframe bonded semiconductor wafer. After cutting the clips, adjust the tooth pitch of the clips again and arrange them on the lead frame, and then fit the clips.

為了進行如上所述的夾片貼合工藝，需將貼合有半導體晶片的引線框架穩定地固定定位在夾片貼合固定位置，以在誤差允許範圍內排列，進而使產品不合格率降到最小化。 In order to carry out the clip bonding process as described above, the lead frame with the semiconductor chip attached needs to be stably fixed and positioned at the fixed position of the clip bonding, so as to be arranged within the allowable error range, thereby reducing the product failure rate to minimize.

並且，有需要提供一種多重夾片黏合裝置技術，其不僅檢查引線框架的排列，還檢查引線框架的差錯或不合格，並消除在選擇夾片前後的差錯發生的可能性；並且檢查引線框架和夾片的貼合狀態而糾正差錯或誤差，從而提高產品產出率，並解決因夾片的毛刺而引起的電問題。 Also, there is a need to provide a multi-clip bonding device technology that checks not only the arrangement of the lead frames, but also errors or nonconformities of the lead frames, and eliminates the possibility of errors occurring before and after clip selection; and that checks the lead frames and Errors or errors can be corrected according to the fit state of the clips, thereby increasing the product yield and solving electrical problems caused by burrs in the clips.

本發明的思想要解決的技術問題為提供一種半導體封裝的多重夾片黏合裝置及通過同裝置製造的半導體封裝，其將引線框架的排列誤差最小化，以提高引線框架和夾片的貼合準確率，並且依次檢查夾片貼合工藝，以使半導體封裝的不合格率最小化。 The technical problem to be solved by the idea of the present invention is to provide a multiple clip bonding device for a semiconductor package and a semiconductor package manufactured by the same device, which minimize the arrangement error of the lead frame, so as to improve the bonding accuracy of the lead frame and the clip. Accuracy and sequential inspection of the clip attachment process to minimize semiconductor package rejects.

為了實現如上所述的目的，本發明提供一種半導體封裝的多重夾片黏合裝置，其包括：引線框架承載部，用以供應供半導體晶片按第一齒距間距排列的引線框架；夾片承載部，用以供應供電連接所述半導體晶片和所述引線框架的簧片的夾片按第二齒距間距排列的夾片方陣；夾片剪裁部，用以將所述夾片方陣按各個夾片剪裁；夾片裝載部，用以裝載所剪裁的按第二齒距間距排列的所述夾片；引線框架排列部，用以將所述引線框架排列至夾片貼合位置；第一檢查部，用以檢查所述引線框架的夾片貼合位置的排列狀態或排列誤差；夾片貼合部，其中由所述夾片裝載部選擇所述夾片而再次按第一齒距間距排列，並移送至在所述引線框架排列部的夾片貼合位置上的按第一齒距間距排列的所述半導體晶片的所述引線框架上部，並與相應引線框架上部貼合；引線框 架卸載部，用以排出完成夾片貼合的引線框架；及控制部，用以控制所述引線框架的供應、排列、檢查和排出，及所述夾片的供應、剪裁及貼合。 In order to achieve the above-mentioned purpose, the present invention provides a multiple clip bonding device for a semiconductor package, which includes: a lead frame carrying part for supplying a lead frame for the semiconductor chips to be arranged at a first pitch; the clip carrying part , for supplying power supply and connecting the clips of the semiconductor chip and the reeds of the lead frame to a clip square array arranged according to the second tooth pitch; the clip cutting part is used to cut the clip square array according to each clip cutting; a clip loading part for loading the clips that are cut and arranged according to the second tooth pitch; a lead frame arranging part for arranging the lead frames to the clip attachment position; a first inspection part , to check the arrangement state or arrangement error of the clip bonding position of the lead frame; the clip bonding part, wherein the clips are selected by the clip loading part and arranged according to the first tooth pitch again, and transferred to the upper part of the lead frame of the semiconductor chips arranged according to the first tooth pitch at the clip bonding position of the lead frame arrangement part, and attached to the upper part of the corresponding lead frame; the lead frame The rack unloading part is used to discharge the lead frame after the clip attachment is completed; and the control part is used to control the supply, arrangement, inspection and discharge of the lead frame, and the supply, cutting and attaching of the clip.

在一方面，所述控制部確認通過所述第一檢查部所檢查出的排列誤差，以糾正通過所述夾片貼合部而形成的夾片的貼合位置。 On the one hand, the control unit confirms the alignment error detected by the first inspection unit to correct the bonding position of the clips formed by the clip bonding section.

在一方面，所述第一檢查部與在所述引線框架排列部上部分隔形成的XYR軸平臺結合形成，且通過在夾片貼合位置上部往復並拍攝所述引線框架的左右邊緣來檢查所述引線框架的排列狀態。 In one aspect, the first inspection part is formed in combination with an XYR axis stage formed separately on the upper part of the lead frame arrangement part, and the inspection is performed by reciprocating and photographing the left and right edges of the lead frame at the upper part of the clip attaching position. Describe the arrangement state of the lead frame.

在一方面，所述第一檢查部為飛行視覺攝像機或步進視覺攝像機。 In one aspect, the first inspection part is a flight vision camera or a stepping vision camera.

在一方面，所述引線框架排列部包括：平臺，設有所述夾片貼合位置；前段滑軌，用以從所述引線框架承載部向所述平臺移送所述引線框架；後段滑軌，用以從所述平臺向所述引線框架卸載部移送所述引線框架；前端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述前段滑軌的一側的軌道移送所述引線框架；後端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述後段滑軌的一側的軌道移送所述引線框架；限位感測器，用以檢測來自所述引線框架的所述引線框架承載部的供應；及限位感測器，用以檢測來自所述引線框架的所述引線框架卸載部的排出。 In one aspect, the lead frame arranging part includes: a platform provided with the clip attachment position; a front slide rail for transferring the lead frame from the lead frame carrying part to the platform; a back slide rail , used to transfer the lead frame from the platform to the lead frame unloading part; the front end grabs the rail unit to press one side of the lead frame to follow the lead frame formed on the front section of the slide rail. A rail on one side transfers the lead frame; a rear end grabs a rail unit for pressing one side of the lead frame to transfer the lead frame along a rail formed on one side of the rear slide rail a limit sensor for detecting the supply of the lead frame carrying portion from the lead frame; and a limit sensor for detecting the discharge from the lead frame unloading portion of the lead frame.

在一方面，所述平臺是指真空吸附所述引線框架而形成夾片貼合位置的真空吸附平臺，並包括：真空吸附板，由供安裝所述引線框架的多孔陶瓷構成；負壓供應單元，形成於所述真空吸附板下端而向所述真空吸附板供應負壓。 In one aspect, the platform refers to a vacuum adsorption platform for vacuum adsorbing the lead frame to form a clip attachment position, and includes: a vacuum adsorption plate, which is composed of porous ceramics for mounting the lead frame; a negative pressure supply unit , formed at the lower end of the vacuum suction plate to supply negative pressure to the vacuum suction plate.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：第二檢查部，分隔形成於所述前段滑軌的前端部上端，用以檢查向所述平臺移送的所 述引線框架有無半導體晶片、有無導電膠、導電膠體積及二維碼中的任一個以上。 In one aspect, the multiple-clip bonding device for semiconductor packages further includes: a second inspection portion formed separately on the upper end of the front end portion of the front-stage slide rail for inspecting all the parts transferred to the platform. Whether the lead frame has any one or more of semiconductor chip, conductive glue, conductive glue volume and two-dimensional code.

而且，還包括：第三檢查部，分隔形成於所述後段滑軌的前端部上端，檢查由所述平臺移送的所述夾片的貼合狀態或貼合誤差。 Furthermore, it further includes: a third inspection part which is formed in a partition at the upper end of the front end of the rear-stage slide rail, and inspects the bonding state or bonding error of the clips transferred by the platform.

在一方面，所述第二檢查部為飛行視覺攝像機或步進視覺攝像機。 In one aspect, the second inspection part is a flight vision camera or a stepping vision camera.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：第四檢查部，分隔形成於所述夾片貼合部的下端，用以檢查通過所述夾片貼合部而產生的所述引線框架排列部的所述夾片的貼合狀態，或檢查所述引線框架與所述夾片的貼合之後所述夾片貼合部的所述夾片的去除狀態。 In one aspect, the multiple-clip bonding apparatus for semiconductor packages further includes: a fourth inspection part formed separately at a lower end of the clip attaching part for inspecting the chip attaching part generated by passing through the clip attaching part. The bonding state of the clips in the lead frame arrangement part, or the removal state of the clips in the clip bonding part after the bonding of the lead frame and the clips is checked.

在一方面，所述控制部用以確認通過所述第四檢查部所檢查出的所述夾片的貼合狀態或去除狀態的差錯，並且在確認差錯時將所述夾片移送至廢料盒並去除。 On the one hand, the control unit is configured to confirm an error in the attachment state or the removal state of the clip detected by the fourth inspection unit, and when the error is confirmed, the clip is transferred to a waste box and remove.

在一方面，所述第四檢查部為飛行視覺攝像機或步進視覺攝像機。 In one aspect, the fourth inspection part is a flight vision camera or a stepping vision camera.

在一方面，所述夾片剪裁部為將所述夾片方陣按各個夾片而向下剪裁。 In one aspect, the clip cutting part is cut downward to cut the square array of clips according to each clip.

在一方面，通過所述夾片剪裁部而剪裁的所述逐個夾片的切削毛刺(burr)向上形成。 In one aspect, the clip-by- clip cutting burrs cut by the clip clipping portion are formed upward.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：黏合劑塗覆裝置，在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前塗覆導電膠。 In one aspect, the multiple clip bonding apparatus for a semiconductor package further includes: an adhesive coating device for coating an upper portion of a lead frame for arranging the semiconductor chips for coating a conductive layer before attaching the clips glue.

在一方面，所述半導體封裝的多重夾片粘合裝置還包括：黏合劑塗覆裝置，設置在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前，在所述半導體晶片和所述引線框架的簧片上塗覆導電膠。 In one aspect, the multiple clip bonding apparatus for semiconductor packages further includes: an adhesive coating device disposed on the upper portion of the lead frame for arranging the semiconductor wafers, and used to, before attaching the clips, Conductive glue is coated on the semiconductor wafer and the springs of the lead frame.

本發明還提供一種通過上述半導體封裝的多重夾片黏合裝置而製造的半導體封裝。 The present invention also provides a semiconductor package manufactured by the above-mentioned multiple clip bonding apparatus for the semiconductor package.

10:引線框架 10: Lead frame

11:半導體晶片 11: Semiconductor wafer

12:簧片 12: Reed

13:導電膠 13: Conductive glue

14:導電膠 14: Conductive glue

20:夾片方陣 20: Clip square matrix

21:夾片 21: Clip

22:連接部 22: Connection part

23:夾片框架 23: Clip frame

110:引線框架承載部 110: Lead frame carrying part

111:裝料庫 111: Loading library

112:電機 112: Motor

113:輸送帶 113: Conveyor belt

114:裝料拾取器 114: Loading Picker

115:推送器 115: Pusher

115a:T杆 115a: T-bar

115b:齒條 115b: rack

115c:電機 115c: Motor

120:夾片承載部 120: Clip carrier

121:夾片捲盤 121: Clip reel

122:襯底捲盤 122: Substrate Reel

123:供應滾軸 123: Supply Roller

124:電機 124: Motor

125:調節手柄 125: Adjustment handle

130:夾片剪裁部 130: Clip cutting department

131:剪裁帶 131: Cut Tape

131a:剪裁孔 131a: Cut Holes

132:打孔器 132: Hole Punch

133:加壓板 133: Pressure plate

134:剪裁氣缸 134: Cut Cylinder

135:導板 135: guide plate

135a:沖孔 135a: Punching

136:第一廢料盒 136: First Scrap Box

140:夾片裝載部 140: Clip loading part

141:夾片安裝器 141: Clip Installer

142:裝載氣缸 142: Loading Cylinder

143:導軌 143: Rails

144:驅動單元 144: Drive unit

150:引線框架排列部 150: Lead frame arrangement part

151:真空吸附平臺 151: Vacuum adsorption platform

152:前段滑軌 152: Front slide rail

153:後段滑軌 153: Rear slide rail

154:導軌 154: Rails

155:前端抓取軌道單元 155: Front Grab Track Unit

156:後端抓取軌道單元 156: Rear Grab Track Unit

157,158:限位感測器 157,158: Limit sensor

160:第一檢查部 160: First Inspection Department

161:XYR軸平臺 161: XYR axis platform

162:監控器 162: Monitor

170:夾片貼合部 170: Clip fitting part

171:貼合焊嘴 171: Fit the tip

172:可變塊 172: mutable block

172a:凸輪從動件 172a: Cam Followers

173:真空管件 173: Vacuum fittings

174:直線導軌 174: Linear guide

175:固定板 175: Fixed plate

175a:狹槽 175a: Slot

176:可變凸輪板 176: Variable Cam Plate

176a:凸輪插槽 176a: Cam slot

177:線形發動機 177: Linear Engine

180:引線框架卸載部 180: Lead frame unloading part

181:卸料庫 181: Unloading warehouse

191:第二檢查部 191: Second Inspection Department

192:第三檢查部 192: The Third Inspection Department

193:第四檢查部 193: Fourth Inspection Department

194:第二廢料盒 194: Second Scrap Box

P1:第一齒距 P1: The first tooth pitch

P2:第二齒距 P2: The second pitch

[圖1A]及[圖1B]為本發明的實施例的半導體封裝的多重夾片黏合裝置從不同視角觀看的立體圖；[圖2A]為圖1的半導體封裝的多重夾片黏合裝置的平面圖；[圖2B]為圖1的半導體封裝的多重夾片黏合裝置的側面圖；[圖3]為圖1的半導體封裝的多重夾片黏合裝置從另一視角觀看的側面圖；[圖4]為圖1的半導體封裝的多重夾片黏合裝置中的夾片方陣的局部放大示意圖；[圖5]為顯示將圖1的半導體封裝的多重夾片黏合裝置中的夾片剪裁部分離出來的示意圖；[圖6A]為圖1的半導體封裝的多重夾片黏合裝置中的主要結構的示意圖；[圖6B]為圖1的半導體封裝的多重夾片黏合裝置中的部分結構的示意圖；[圖7]為圖6的夾片貼合部及引線框架排列部的示意圖；[圖8]為圖1的半導體封裝的多重夾片黏合裝置中的引線框架承載部的局部放大示意圖； [圖9]為圖1的半導體封裝的多重夾片黏合裝置中的夾片貼合部的分解圖；[圖10A]及[圖10B]為例示圖9的夾片貼合部的齒距調節的示意圖；[圖11]為例示通過圖1的半導體封裝的多重夾片黏合裝置而貼合形成的半導體封裝截面結構的示意圖。 [FIG. 1A] and [FIG. 1B] are perspective views of the multiple clip-bonding device for semiconductor packaging according to an embodiment of the present invention; [FIG. 2A] is a plan view of the multiple-clip-bonding device for semiconductor packaging in FIG. 1; [ FIG. 2B ] is a side view of the multi-clip bonding device for the semiconductor package of FIG. 1 ; [ FIG. 3 ] is a side view of the multi-clip bonding device for the semiconductor package of FIG. 1 viewed from another perspective; [ FIG. 4 ] is a FIG. 1 is a partially enlarged schematic view of the clip array in the multi-clip bonding device for semiconductor packaging; [ FIG. 5 ] is a schematic diagram showing the separation of the clip cutting part in the multi-clip bonding device for semiconductor packaging in FIG. 1 ; [FIG. 6A] is a schematic diagram of the main structure of the multi-clip bonding apparatus for the semiconductor package of FIG. 1; [FIG. 6B] is a schematic diagram of a part of the structure of the multi-clip bonding apparatus for the semiconductor package of FIG. 1; [FIG. 7] FIG. 6 is a schematic diagram of the clip bonding part and the lead frame arrangement part; [ FIG. 8 ] is a partial enlarged schematic view of the lead frame carrying part in the multiple clip bonding device of the semiconductor package of FIG. 1 ; [ FIG. 9 ] is an exploded view of the clip attaching part in the multi-clip attaching device of the semiconductor package of FIG. 1 ; [ FIG. 10A ] and [ FIG. 10B ] illustrate the pitch adjustment of the clip attaching part of FIG. 9 11 is a schematic diagram illustrating a cross-sectional structure of a semiconductor package formed by lamination by the multiple clip bonding apparatus of the semiconductor package of FIG. 1 .

下面，參照附圖而對本發明的實施例進行具體說明，以使本發明所屬技術領域的普通技術人員容易實施。本發明通過各種相異的形式實現，並非限定於在此說明的實施例。 Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art to which the present invention pertains can be easily implemented. The present invention is implemented in various different forms, and is not limited to the embodiments described herein.

參照圖1至圖11，對本發明的實施例的半導體封裝的多重夾片黏合裝置作下列具體的說明。 Referring to FIGS. 1 to 11 , the following detailed description will be given to the multi-clip bonding apparatus for a semiconductor package according to an embodiment of the present invention.

本發明的實施例的半導體封裝的多重夾片黏合裝置具體地包括：引線框架承載部110，用以供應供半導體晶片11按第一齒距P1間距排列的引線框架10；夾片承載部120，用以供應供夾片21按第二齒距P2間距排列的夾片方陣20；夾片剪裁部130，用以將夾片方陣20按各個夾片21剪裁；夾片裝載部140，用以裝載夾片21；引線框架排列部150，用以將引線框架10排列至夾片貼合位置A；第一檢查部160，用以檢查引線框架10的夾片貼合位置A的排列狀態或排列誤差；夾片貼合部170，用以選擇夾片21而再次按第一齒距P1間距排列，貼合至引線框架10上部；引線框架卸載部180，用以排出完成夾片貼合的引線框架10；控制部(未圖示)，用以控制引線框架10的供應、排列、檢查及排出，及夾片21的供應、剪裁及貼合，並且以檢查引線框架10的排列狀態或排列誤差為主要目的。 The multiple clip-bonding device for a semiconductor package according to the embodiment of the present invention specifically includes: a lead frame carrying part 110 for supplying the lead frame 10 for arranging the semiconductor chips 11 according to the first pitch P1; the clip carrying part 120, The clip array 20 for supplying the clips 21 arranged according to the second tooth pitch P2; the clip cutting part 130 for cutting the clip array 20 according to each clip 21; the clip loading part 140 for loading The clip 21; the lead frame arranging part 150 is used for arranging the lead frame 10 to the clip attaching position A; the first inspection part 160 is used to check the arrangement state or the arranging error of the clip attaching position A of the lead frame 10 ; The clip attaching part 170 is used to select the clip 21 and arrange it according to the first pitch P1 again, and attach it to the upper part of the lead frame 10; 10; The control unit (not shown) is used to control the supply, arrangement, inspection and discharge of the lead frame 10, as well as the supply, cutting and lamination of the clips 21, and to check the arrangement state or arrangement error of the lead frame 10 as the main purpose.

首先，引線框架承載部110如圖1A、圖1B及圖8所示，將半導體晶片11(參照圖11)按第一齒距P1間距排列的引線框架10引入裝料庫111而裝載多個，將裝料庫111通過借助電機112而驅動的輸送帶113而移送至裝料拾取器(114)，而排列至前段滑軌152之後，通過推送器115的前進滑動而將引線框架10供應至引線框架排列部150。 First, as shown in FIG. 1A , FIG. 1B and FIG. 8 , the lead frame carrying portion 110 introduces the lead frames 10 in which the semiconductor chips 11 (see FIG. 11 ) are arranged at the first pitch P1 into the loading magazine 111 and loads a plurality of lead frames 10 . The loading magazine 111 is transferred to the loading picker (114) by the conveyor belt 113 driven by the motor 112, and after being arranged on the front-stage slide rail 152, the lead frame 10 is supplied to the lead wire by the forward sliding of the pusher 115. Frame arrangement part 150 .

在此，推送器115包括：T杆115a，用以推動被裝載至裝料庫111的引線框架10的一端；齒條115b，與T杆115a的後端結合形成；小齒輪(未圖示)，與齒條115b嚙合；電機115c，用以旋轉驅動小齒輪，以將T杆115a前後滑動。 Here, the pusher 115 includes: a T rod 115a for pushing one end of the lead frame 10 loaded into the loading magazine 111; a rack 115b, formed in combination with the rear end of the T rod 115a; a pinion (not shown) , meshes with the rack 115b; the motor 115c is used to drive the pinion to rotate to slide the T rod 115a back and forth.

另外，本發明的實施例公開引線框架承載部110用於將半導體晶片11按第一齒距P1間距排列的引線框架10引入至裝料庫111，以及裝載並供應引線框架10，但並非限定於此，亦可為能夠進行供應供半導體晶片11按第一齒距P1間距排列的引線框架10的各種變形的實施。 In addition, the embodiment of the present invention discloses that the lead frame carrying portion 110 is used to introduce the lead frames 10 with the semiconductor chips 11 arranged at the first pitch P1 into the loading library 111 , and to load and supply the lead frames 10 , but it is not limited to Here, it is also possible to implement various modifications capable of supplying the lead frame 10 in which the semiconductor chips 11 are arranged at the first pitch P1.

例如，對於存在將半導體晶片11按第一齒距P1間距排列至引線框架10上的先行工作臺與本發明的實施例的半導體封裝的多重夾片黏合裝置連接的情況，引線框架承載部110起到將由該先行工作臺移送的引線框架10承載至本發明的實施例的半導體封裝多重夾片黏合裝置的作用。 For example, in the case where there is an advance stage in which the semiconductor chips 11 are arranged on the lead frame 10 at the first pitch P1, the lead frame carrying portion 110 starts from the multi-clip bonding device of the semiconductor package according to the embodiment of the present invention. The function of carrying the lead frame 10 transferred from the advance stage to the semiconductor package multi-clip bonding apparatus of the embodiment of the present invention.

作為參考，適用MOSFET半導體或IGBT半導體作為半導體晶片11，但並非限定於此，也能夠由可控矽整流器(SCR)、電力電晶體、電力整流器、電力調整器或其組合的電力半導體構成。 For reference, a MOSFET semiconductor or an IGBT semiconductor is used as the semiconductor wafer 11 , but it is not limited to this, and can also be constituted by a power semiconductor of a silicon controlled rectifier (SCR), a power transistor, a power rectifier, a power regulator, or a combination thereof.

夾片承載部120將供通過導電膠13電連接半導體晶片11和引線框架10的簧片12的夾片21按第二齒距P2間距排列的夾片方陣20捲繞為捲筒形而供應至夾片剪裁部130。 The clip carrier portion 120 winds the clip array 20 in which the clips 21 of the springs 12 of the semiconductor wafer 11 and the lead frame 10 are electrically connected through the conductive glue 13 and arranged at the second pitch P2, and is supplied to the coil. Clip cutting part 130 .

在此，如圖4所示，夾片方陣20包括：夾片21，按能夠剪裁的最小齒距間距排列成矩陣；連接部22，相互連接夾片21；夾片框架23，按長度方向連接連接部22的兩端。 Here, as shown in FIG. 4 , the clip matrix 20 includes: clips 21 , which are arranged in a matrix according to the minimum tooth pitch that can be cut; a connecting portion 22 , which connects the clips 21 to each other; and a clip frame 23 , which is connected in the length direction. Both ends of the connecting portion 22 .

具體地，夾片承載部120如圖1A、圖1B、圖2A、圖2B及圖3所示，包括：夾片捲盤121，用以捲繞夾片方陣20；襯底捲盤122，用以從夾片方陣20去除襯底；供應滾軸123，用以將夾片方陣20移送至夾片剪裁部130；電機124，用以旋轉驅動供應滾軸123；調節手柄125，用以調節夾片方陣20的移送寬度。 Specifically, as shown in FIG. 1A , FIG. 1B , FIG. 2A , FIG. 2B and FIG. 3 , the clip carrying portion 120 includes: a clip reel 121 for winding the clip array 20 ; a substrate reel 122 for To remove the substrate from the clip array 20; the supply roller 123 to transfer the clip array 20 to the clip cutting part 130; the motor 124 to drive the supply roller 123 in rotation; the adjustment handle 125 to adjust the clip The transfer width of the sheet array 20.

另外，本發明的實施例的夾片承載部120公開一種由捲繞夾片方陣20的夾片捲盤121構成的捲盤類型，但並非限定於捲盤類型，也能夠以條狀供應夾片方陣20，亦能夠進行各種變形的實施。 In addition, the clip carrying portion 120 of the embodiment of the present invention discloses a reel type composed of a clip reel 121 that winds the clip square array 20, but it is not limited to the reel type, and the clip square can also be supplied in a strip shape. The array 20 can also be implemented with various modifications.

另外，在半導體晶片11和引線框架10的簧片12貼合夾片21之前，增加塗覆導電膠13的黏合劑塗覆裝置(未圖示)。導電膠13包含錫或鉛的焊錫系列、包含銀或銅的燒結(sintering)材料，以及包含金的共晶(eutectic)反應材料。 In addition, before the semiconductor wafer 11 and the spring 12 of the lead frame 10 are attached to the clip 21, an adhesive coating device (not shown) for coating the conductive adhesive 13 is added. The conductive paste 13 includes solder series of tin or lead, sintering material including silver or copper, and eutectic reactive material including gold.

夾片剪裁部130通過剪裁連接部22而將夾片方陣20按各個夾片21分離。 The clip cutting portion 130 separates the clip array 20 for each clip 21 by cutting the connecting portion 22 .

具體地，夾片剪裁部130如圖5及圖6A所示，包括：剪裁帶131，用以引導夾片方陣20，定位夾片21的剪裁孔131a按第二齒距P2間距排列形成；打孔器132，形成於剪裁帶131上端，以將剪裁孔131a向下側方向貫通的方式下降而剪裁夾片方陣20；加壓板133，供結合形成打孔器132；剪裁氣缸134，用以升降驅動加壓板133；導板135，分隔形成於剪裁帶131上端，供形成打孔器132貫通的沖孔135a而引導打孔器132的升降滑動；第一廢料盒136，用以回收經去除的夾片21的夾片方陣20。 Specifically, as shown in FIG. 5 and FIG. 6A , the clip cutting portion 130 includes: a clipping belt 131 for guiding the clip square 20, and the clipping holes 131a of the positioning clip 21 are arranged and formed according to the second tooth pitch P2; The hole device 132 is formed on the upper end of the cutting belt 131, and cuts the clip matrix 20 by descending the cutting hole 131a through the downward direction; the pressing plate 133 is used for combining to form the hole punch 132; the cutting cylinder 134 is used for Lifting and driving pressure plate 133; guide plate 135, formed separately on the upper end of the cutting belt 131, for forming the punching hole 135a through which the punch 132 passes through and guiding the lifting and sliding of the punch 132; the first waste box 136 is used for recycling The clip matrix 20 of the clips 21 removed.

在此，剪裁孔131a與夾片21的形狀相應並貫通形成，並將夾片方陣20通過打孔器132而如箭頭方向(參照圖5)所示，通過剪裁帶131的剪裁孔131a而向下側方向剪裁，在剪裁分離的夾片21的剪裁面邊緣發生的毛刺(burr)向上形成，在半導體晶片11和夾片21貼合時，完全消除因毛刺而產生的與半導體晶片11的非正常的接觸所導致的電問題的發生的可能性。 Here, the cutting holes 131a are formed to pass through according to the shape of the clip 21, and the clip square 20 is passed through the punch 132 to pass through the cutting holes 131a of the cutting tape 131 as shown in the arrow direction (refer to FIG. 5) through the punch 132. By cutting in the lower direction, the burr generated on the edge of the cutting surface of the clip 21 separated by cutting is formed upward, and when the semiconductor wafer 11 and the clip 21 are bonded together, the non-contact with the semiconductor wafer 11 caused by the burr is completely eliminated. The possibility of the occurrence of electrical problems caused by normal contact.

夾片裝載部140包括：夾片安裝器141，用以裝載所剪裁的按第二齒距P2間距排列的夾片21而滑動移送至與引線框架排列部150的選擇位置，如圖6A、圖6B及圖7所示，上升引入至剪裁帶131的剪裁孔131a而安裝所剪裁的夾片21；裝載氣缸142，用以上升驅動夾片安裝器141；導軌143，用以將安裝至夾片安裝器141的夾片21移動至選擇位置的方式引導按箭頭方向前後滑動；驅動單元144，用以沿著導軌143前後驅動。驅動單元144由與導軌143緊貼旋轉的輪子和旋轉驅動輪子的電機構成。 The clip loading part 140 includes: a clip mounter 141, which is used to load the clips 21 that are cut and arranged at the second pitch P2 and slide to a selected position with the lead frame arranging part 150, as shown in FIG. 6A , FIG. 6B and FIG. 7 , the clips 21 to be cut are mounted by rising and introduced into the clipping holes 131a of the clipping belt 131; the loading cylinder 142 is used to lift the clip mounter 141; the guide rails 143 are used to install the clips The way the clip 21 of the mounter 141 moves to the selected position is guided to slide back and forth in the direction of the arrow; the driving unit 144 is used for driving back and forth along the guide rail 143 . The drive unit 144 is composed of a wheel that rotates in close contact with the guide rail 143 and a motor that rotates and drives the wheel.

引線框架排列部150真空吸附引線框架10而排列至夾片貼合位置A(參照圖2B)。. The lead frame arranging part 150 vacuum-sucks the lead frame 10 and arranges it to the clip bonding position A (refer FIG. 2B). .

具體地，引線框架排列部150如圖2A、圖2B、圖6A、圖6B及圖8所示，包括：真空吸附平臺151，設有真空吸附引線框架10的夾片貼合位置A；前段滑軌152，用以從引線框架承載部110向真空吸附平臺151移送引線框架10；後段滑軌153，用以從真空吸附平臺151向引線框架卸載部180移送引線框架10；前端抓取軌道單元155，用以對引線框架10的一側面加壓而沿著形成於前段滑軌152的一側的導軌154移送引線框架10；後端抓取軌道單元156，用以對引線框架10的一側面加壓而沿著形成於後段滑軌153的一側的導軌154移送引線框架10；限位感測器157，用以檢測來自引線框架10的引線框架承載 部110的供應；限位感測器158，用以檢測通過引線框架10的引線框架卸載部180的排出。 Specifically, as shown in FIGS. 2A , 2B, 6A, 6B and 8 , the lead frame arrangement portion 150 includes: a vacuum adsorption platform 151 , which is provided with a clip attachment position A for vacuum adsorption of the lead frame 10 ; The rail 152 is used to transfer the lead frame 10 from the lead frame carrying part 110 to the vacuum suction platform 151; the rear slide rail 153 is used to transfer the lead frame 10 from the vacuum suction platform 151 to the lead frame unloading part 180; the front end grabs the rail unit 155 , used to press one side of the lead frame 10 to move the lead frame 10 along the guide rail 154 formed on one side of the front slide rail 152 ; Press to move the lead frame 10 along the guide rail 154 formed on one side of the rear slide rail 153 ; the limit sensor 157 is used to detect the lead frame load from the lead frame 10 Supply of part 110 ; limit sensor 158 to detect discharge of lead frame unloading part 180 through lead frame 10 .

在此，真空吸附平臺151由供安裝引線框架10的多孔陶瓷構成的真空吸附板、形成於真空吸附板下端而向真空吸附板供應負壓的負壓供應單元構成，在與夾片21貼合時，穩定地固定引線框架10。 Here, the vacuum suction stage 151 is composed of a vacuum suction plate made of porous ceramics on which the lead frame 10 is mounted, and a negative pressure supply unit formed at the lower end of the vacuum suction plate to supply negative pressure to the vacuum suction plate. , the lead frame 10 is stably fixed.

另外，真空吸附板在燒爐中10日左右時間內，在1300℃的高溫下通過燒結方式形成，保持均勻的氣孔分佈和2μm至3μm氣孔大小，均勻吸附各種尺寸或各種形狀的引線框架。即使僅通過一個真空吸附板也能夠吸附各種尺寸或各種形狀的引線框架。真空吸附板具有不存在產生本身粉塵及微粒、防止引線框架10的刮痕，以及具有103Ω cm2至109Ω cm2的表面電阻率的特性，而可釋放並去除半導體晶片11和引線框架10的靜電，並提供高真空及高強度的吸附力。 In addition, the vacuum adsorption plate is formed by sintering at a high temperature of 1300 ° C in the furnace for about 10 days, maintaining a uniform pore distribution and a pore size of 2 μm to 3 μm, and uniformly adsorbing lead frames of various sizes or shapes. Leadframes of various sizes or shapes can be picked up even by just one vacuum pick-up plate. The vacuum suction plate has the characteristics of not generating dust and particles, preventing scratches of the lead frame 10, and having a surface resistivity of 10 3 Ω cm 2 to 10 9 Ω cm 2 , and can release and remove the semiconductor wafer 11 and the leads The static electricity of the frame 10 provides high vacuum and high-strength adsorption force.

第一檢查部160如圖1A及圖6B所示，由飛行視覺攝像機或步進視覺攝像機構成，用以檢查引線框架10的夾片貼合位置A的排列狀態或排列誤差。 As shown in FIGS. 1A and 6B , the first inspection unit 160 is composed of a flying vision camera or a stepping vision camera, and is used to inspect the arrangement state or arrangement error of the clip bonding position A of the lead frame 10 .

例如，第一檢查部160與分隔形成於引線框架排列部150上部的XYR軸平臺161結合形成，通過在夾片貼合位置A上部往復引線框架10的左右邊緣，並連續拍攝(例如，2次往復及16攝拍攝)來檢查引線框架10的排列狀態，使控制部確認通過第一檢查部160所檢查出的引線框架10的排列誤差，並糾正夾片貼合部170的夾片貼合位置A，以提高引線框架10和夾片21的貼合準確率。 For example, the first inspection part 160 is formed in combination with the XYR axis stage 161 formed separately from the upper part of the lead frame arrangement part 150, and the left and right edges of the lead frame 10 are reciprocated at the upper part of the clip attaching position A, and images are continuously captured (for example, two times Reciprocation and 16-shot shooting) to check the alignment state of the lead frames 10 , the control unit confirms the alignment error of the lead frames 10 detected by the first inspection unit 160 , and corrects the clip bonding position of the clip bonding section 170 A, to improve the bonding accuracy of the lead frame 10 and the clip 21 .

之後，夾片貼合部170如圖7及圖9所示，與XYR軸平臺161結合形成，通過夾片裝載部140的夾片安裝器141選擇按第二齒距P2間距排列的夾片21，以及使夾片21再次按第一齒距P1間距排列，並向供按引線框架排列 部150的夾片貼合位置A的第一齒距P1間距排列半導體晶片11的引線框架10上部移送，且按一定壓力加壓，以與相應引線框架10上部貼合。 After that, as shown in FIG. 7 and FIG. 9 , the clip fitting part 170 is formed in combination with the XYR axis platform 161 , and the clips 21 arranged at the second pitch P2 are selected by the clip mounter 141 of the clip mounting part 140 . , and the clips 21 are arranged according to the first pitch P1 again, and are arranged according to the lead frame The upper portion of the lead frame 10 of the semiconductor wafer 11 arranged at the first pitch P1 of the clip bonding position A of the portion 150 is transferred and pressed with a certain pressure to be bonded to the upper portion of the corresponding lead frame 10 .

具體地，夾片貼合部170包括：貼合焊嘴171，真空吸附夾片21；多個可變塊172，在下端結合貼合焊嘴171，並以改變齒距的方式相互分離形成並咬合；真空管件173，向貼合焊嘴171提供負壓；直線導軌174，引導可變塊172的齒距的調節；固定板175，供固定形成直線導軌174，形成引導與可變塊172結合的凸輪從動件172a的左右擴展的狹槽175a；可變凸輪板176，引入凸輪從動件172a，且設有預定形狀的凸輪插槽176a，以調節齒距；線形發動機177，用於使可變凸輪板176前後滑動。此時，為了調節齒距而形成的凸輪插槽176a可形成為扇骨形狀，以在兩種齒距間進行調節，也可形成為彎曲(香蕉)形狀，以在三種齒距間進行調節，但其並非限定於此，能夠根據齒距類型的數量而形成為適當的形狀。 Specifically, the clip bonding part 170 includes: a bonding welding tip 171, a vacuum suction clip 21; a plurality of variable blocks 172, which are combined with the bonding welding tip 171 at the lower end, and are separated from each other by changing the tooth pitch. occlusal; vacuum tube 173, providing negative pressure to the welding tip 171; linear guide 174, guiding the adjustment of the tooth pitch of the variable block 172; The left and right expanding slots 175a of the cam follower 172a of the The variable cam plate 176 slides back and forth. At this time, the cam slot 176a formed for adjusting the pitch may be formed in a scallop shape for adjustment between two pitches, or in a curved (banana) shape for adjustment between three pitches, but It is not limited to this, and can be formed into an appropriate shape according to the number of pitch types.

因而，參照圖10A及圖10B，通過線形發動機177的前後滑動來前後移動可變凸輪板176，凸輪從動件172a之間的分隔根據凸輪插槽176a而擴展或縮小，以與半導體晶片11的第一齒距P1一致的方式，將貼合焊嘴171的齒距由夾片21的第二齒距P2向第一齒距P1改變，而再次按第一齒距P1間距排列夾片21。 10A and 10B , by sliding the linear motor 177 back and forth to move the variable cam plate 176 back and forth, the partition between the cam followers 172a is expanded or reduced according to the cam slot 176a to match the distance between the semiconductor wafers 11. In a way that the first tooth pitch P1 is the same, the tooth pitch of the welding tip 171 is changed from the second tooth pitch P2 of the clips 21 to the first tooth pitch P1, and the clips 21 are arranged again according to the first tooth pitch P1.

另外，如圖6B所示，還包括：監控器(CCTV)162，形成於夾片貼合部170的後端部，以影像方式拍攝夾片貼合部170的齒距調節狀態，由此，管理者也容易識別齒距調節狀態。 In addition, as shown in FIG. 6B , a monitor (CCTV) 162 is further included, which is formed at the rear end of the clip attaching part 170 to photograph the tooth pitch adjustment state of the clip attaching part 170 in an image manner, thereby, The manager also easily recognizes the pitch adjustment status.

引線框架卸載部180排出在真空吸附平臺151完成夾片貼合的引線框架10。由此排出的完成夾片貼合的引線框架10被裝載於卸料庫(181)，以用於 焊接或黏合劑固化等後續工藝，或通過另外設置的軌道(未圖示)運送或通過另外的選擇臂(未圖示)而移送至後續工序平臺。 The lead frame unloading part 180 discharges the lead frame 10 on which the clip bonding is completed on the vacuum suction stage 151 . The clip-bonded lead frame 10 thus discharged is loaded into the unloading magazine ( 181 ) for use in Subsequent processes such as welding or adhesive curing are transported to the subsequent process platform by means of additionally provided rails (not shown) or by additional selection arms (not shown).

控制部控制引線框架10的供應、排列、檢查及排出，及夾片21的供應、剪裁及貼合，確認通過第一檢查部160而產生的引線框架10的排列誤差，以糾正通過夾片貼合部170而產生的夾片的貼合位置而提高引線框架10和夾片21的貼合準確率。 The control part controls the supply, arrangement, inspection and discharge of the lead frames 10, and the supply, cutting and bonding of the clips 21, and confirms the arrangement error of the lead frames 10 generated by the first inspection part 160, so as to correct the pasting through the clips The bonding accuracy of the lead frame 10 and the clip 21 is improved due to the bonding position of the clip produced by the joint 170 .

另外，第二檢查部(191)由飛行視覺攝像機或步進視覺攝像機構成，如圖6B所示，分隔形成於前段滑軌152的前端部上端，用以檢查移送至真空吸附平臺151的引線框架10有無半導體晶片11、有無導電膠13、導電膠13的體積及/或二維碼，在檢測差錯時通過控制部而確定夾片貼合工藝進行與否。 In addition, the second inspection part (191) is composed of a flight vision camera or a stepping vision camera, and as shown in FIG. 6B, is formed separately on the upper end of the front end of the front-stage slide rail 152, and is used to inspect the lead frame transferred to the vacuum suction platform 151. 10 Whether there is a semiconductor wafer 11 , whether there is a conductive adhesive 13 , the volume of the conductive adhesive 13 and/or a two-dimensional code, when an error is detected, the control unit determines whether the clip bonding process is performed or not.

並且，第三檢查部192由飛行視覺攝像機或步進視覺攝像機構成，如圖6B所示，分隔形成於後段滑軌153的前端部上端，用以檢查由真空吸附平臺151移送的夾片21的貼合狀態及/或貼合誤差，並比對基準值識別誤差允許範圍。 In addition, the third inspection part 192 is composed of a flight vision camera or a stepping vision camera, as shown in FIG. 6B , and is formed at the upper end of the front end of the rear slide rail 153 to inspect the clamping pieces 21 transferred by the vacuum suction platform 151 . Fitting state and/or fitting error, and compare the reference value to identify the allowable error range.

並且，第四檢查部193由飛行視覺攝像機或步進視覺攝像機構成，如圖7所示，分隔形成於夾片貼合部170的下端，檢查通過夾片貼合部170而構成的引線框架排列部150的夾片21的貼合狀態，及/或在引線框架10和夾片21的貼合之後，檢查夾片貼合部170的夾片21的去除狀態，即，確認夾片貼合部170的貼合焊嘴171是否正常選擇夾片21和在夾片21的貼合之後，貼合焊嘴171空閒與否，控制部確認通過第四檢查部193所檢查出的夾片21的貼合狀態或去除狀態的差錯，在確認差錯時將夾片21移送至第二廢料盒(194)(參照圖8)，以分離回收並去除。 In addition, the fourth inspection unit 193 is constituted by a flight vision camera or a stepper vision camera, and as shown in FIG. 7 , is formed separately at the lower end of the clip bonding section 170 , and inspects the lead frame arrangement formed by the clip bonding section 170 . The bonding state of the clip 21 of the part 150, and/or after the bonding of the lead frame 10 and the clip 21, check the removal state of the clip 21 of the clip bonding part 170, that is, confirm the clip bonding part Whether the bonding tip 171 of 170 normally selects the clip 21 and after the bonding of the clip 21, whether the bonding tip 171 is free or not, the control unit confirms the bonding of the clip 21 detected by the fourth inspection section 193. If there is an error in the closed state or the removed state, when the error is confirmed, the clip 21 is transferred to the second waste box (194) (refer to FIG. 8 ) for separation, recovery and removal.

因此，為了在構成上述所述的半導體封裝的多重夾片黏合裝置時，將引線框架的排列誤差最小化而提高引線框架和夾片的貼合準確率；在貼合工藝之前(prebond)，檢查供應引線框架時的引線框架上有無半導體晶片11、有無導電膠13、導電膠13體積及二維碼中的至少一個；在貼合工藝之後(postbond)，檢查夾片的貼合狀態及貼合誤差，並比對基準值以識別誤差允許範圍，確認夾片的貼合狀態或去除狀態的差錯，依次檢查夾片貼合工藝而使半導體封裝的不合格率最小化，從而提高產品產出率。 Therefore, in order to minimize the alignment error of the lead frame and improve the bonding accuracy of the lead frame and the clip when constructing the above-mentioned multi-chip bonding device of the semiconductor package; before the bonding process (prebond), check the When supplying the lead frame, there is at least one of the semiconductor chip 11, the conductive adhesive 13, the volume of the conductive adhesive 13 and the two-dimensional code on the lead frame; after the bonding process (postbond), check the bonding state and bonding of the clip error, and compare the reference value to identify the allowable range of error, confirm the error of the bonding state or removal state of the clip, and check the clip bonding process in turn to minimize the failure rate of semiconductor packaging, thereby improving product yield. .

另外，本發明的實施例的半導體封裝的多重夾片黏合裝置可單獨使用，也能夠與先行或後行的各種工作臺連接使用。 In addition, the multi-clip bonding device for semiconductor package according to the embodiment of the present invention can be used alone, and can also be used in connection with various workbenches in advance or in the rear.

具體地，本發明的一實施例的引線框架承載部110與用於將半導體晶片11按第一齒距P1間距排列在引線框架10上的先行工作臺連接，以將由相應先行工作臺供應的引線框架10通過另外配置的軌道或另外的選擇臂而投入至本發明的半導體封裝的多重夾片黏合裝置。在該過程中，在半導體晶片11和引線框架10的簧片12上按完成塗覆的導電膠13的狀態由先行工作臺向引線框架承載部110供應或在本發明的半導體封裝的多重夾片黏合裝置內設置另外的黏合劑塗覆裝置(未圖示)，而在夾片貼合之前塗覆導電膠13。 Specifically, the lead frame carrying portion 110 of an embodiment of the present invention is connected to a leading stage for arranging the semiconductor chips 11 on the lead frame 10 according to the first pitch P1, so as to connect the leads supplied by the corresponding leading stage The frame 10 is thrown into the multiple clip-bonding device of the semiconductor package of the present invention by means of additionally configured rails or additional selection arms. In this process, the conductive adhesive 13 is supplied on the semiconductor wafer 11 and the reeds 12 of the lead frame 10 from the advance stage to the lead frame carrying part 110 in the state where the conductive adhesive 13 has been coated or the multiple clips of the semiconductor package of the present invention are supplied. An additional adhesive coating device (not shown) is arranged in the adhesive device, and the conductive adhesive 13 is coated before the clips are attached.

而且，對於本發明的一實施例的引線框架卸載部180，為了焊接或黏合劑固化等後續工藝，完成夾片貼合的引線框架10被裝載至卸料庫181，或通過另外設置的軌道(未圖示)或另外的選擇臂(未圖示)而移送至後續工作臺。 Moreover, for the lead frame unloading part 180 of an embodiment of the present invention, for subsequent processes such as soldering or adhesive curing, the lead frame 10 that has completed the clip bonding is loaded into the unloading magazine 181, or through a separately provided rail ( Not shown) or another selection arm (not shown) and transferred to the subsequent stage.

綜上，對本發明的優選的實施例進行了說明，但本發明並非限定於此，在申請專利範圍和發明的具體說明及附圖的範圍內進行各種變形的實施，並屬於該本發明的範圍內。 In summary, the preferred embodiments of the present invention have been described, but the present invention is not limited thereto. Various modifications can be implemented within the scope of the patent application, the specific description of the invention and the accompanying drawings, which belong to the scope of the present invention. Inside.

本發明具有以下效果：將引線框架的排列誤差最小化，而提高引線框架和夾片的貼合準確率；以及在貼合工藝之前(prebond)檢查供應引線框架時的引線框架上有無半導體晶片、有無導電膠、導電膠體積及二維碼中的至少一個，在貼合工藝之後(postbond)檢查夾片的貼合狀態及貼合誤差，識別相對於基準值的允許誤差範圍，確認夾片的貼合狀態或去除狀態的差錯，依次檢查夾片貼合工藝，以使半導體封裝的不合格率最小化，從而提高產品產出率。 The present invention has the following effects: minimize the alignment error of the lead frame, and improve the bonding accuracy of the lead frame and the clip; and check whether the lead frame has a semiconductor chip, Whether there is at least one of conductive adhesive, conductive adhesive volume and two-dimensional code, check the bonding state and bonding error of the clip after the bonding process (postbond), identify the allowable error range relative to the reference value, and confirm the clip. For errors in the bonding state or removal state, the clip bonding process is sequentially checked to minimize the failure rate of semiconductor packaging, thereby improving product yield.

再者，本發明還具有以下效果：通過由多孔陶瓷構成的真空吸附板，可均勻地真空吸附各種尺寸或各種形狀的引線框架。可僅通過一個真空吸附板來吸附各種尺寸或各種形狀的引線框架。由多孔陶瓷構成的真空吸附板可減少自帶粉塵及微粒的發生、防止發生引線框架的刮痕、放電而去除靜電，以及提供高真空及高強度的吸附力。 Furthermore, the present invention has the effect that lead frames of various sizes or shapes can be uniformly vacuum-adsorbed by the vacuum-adsorbing plate made of porous ceramics. Leadframes of various sizes or shapes can be picked up with just one vacuum pick-up plate. The vacuum suction plate composed of porous ceramics can reduce the occurrence of self-contained dust and particles, prevent lead frame scratches, discharge to remove static electricity, and provide high vacuum and high-strength suction force.

110:引線框架承載部 110: Lead frame carrying part

111:裝料庫 111: Loading library

112:電機 112: Motor

113:輸送帶 113: Conveyor belt

115:推送器 115: Pusher

120:夾片承載部 120: Clip carrier

121:夾片捲盤 121: Clip reel

122:襯底捲盤 122: Substrate Reel

125:調節手柄 125: Adjustment handle

160:第一檢查部 160: First Inspection Department

161:XYR軸平臺 161: XYR axis platform

170:夾片貼合部 170: Clip fitting part

180:引線框架卸載部 180: Lead frame unloading part

181:卸料庫 181: Unloading warehouse

Claims (17)

一種半導體封裝的多重夾片黏合裝置，其包括：引線框架承載部，用以供應供半導體晶片按第一齒距間距排列的引線框架；夾片承載部，用以供應供電連接所述半導體晶片和所述引線框架的簧片的夾片按第二齒距間距排列的夾片方陣；夾片剪裁部，用以將所述夾片方陣按各個夾片剪裁；夾片裝載部，用以裝載所剪裁的按第二齒距間距排列的所述夾片；引線框架排列部，用以將所述引線框架排列至夾片貼合位置，且包括：平臺，設有所述夾片貼合位置；前段滑軌，用以從所述引線框架承載部向所述平臺移送所述引線框架；後段滑軌，用以從所述平臺向所述引線框架卸載部移送所述引線框架；前端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述前段滑軌的一側的軌道移送所述引線框架；後端抓取軌道單元，用以對所述引線框架的一側面加壓，以沿著形成於所述後段滑軌的一側的軌道移送所述引線框架；限位感測器，用以檢測來自所述引線框架的所述引線框架承載部的供應；及限位感測器，用以檢測來自所述引線框架的所述引線框架卸載部的排出； 第一檢查部，用以檢查所述引線框架的夾片貼合位置的排列狀態或排列誤差；夾片貼合部，其中由所述夾片裝載部選擇所述夾片並再次按第一齒距間距排列，並移送至在所述引線框架排列部的夾片貼合位置上的按第一齒距間距排列的所述半導體晶片的所述引線框架上部，並與相應引線框架上部貼合；引線框架卸載部，用以排出完成夾片貼合的引線框架；及控制部，用以控制所述引線框架的供應、排列、檢查和排出，及所述夾片的供應、剪裁及貼合。 A multiple clip bonding device for a semiconductor package, comprising: a lead frame carrying part for supplying a lead frame for semiconductor chips arranged at a first pitch pitch; a clip carrying part for supplying power to connect the semiconductor chip and the The clips of the reeds of the lead frame are arranged according to the second tooth pitch; the clip cutting part is used to cut the clip square according to each clip; the clip loading part is used to load all the clips. The clips that are cut and arranged according to the second tooth pitch; the lead frame arranging part is used for arranging the lead frames to the clip attachment position, and includes: a platform, which is provided with the clip attachment position; The front slide rail is used to transfer the lead frame from the lead frame carrying part to the platform; the rear slide rail is used to transfer the lead frame from the platform to the lead frame unloading part; the front end grab rail a unit for pressing one side of the lead frame to transfer the lead frame along a track formed on one side of the front slide rail; a rear end grabbing rail unit for pressing the lead frame One side of the slide rail is pressed to move the lead frame along a track formed on one side of the rear slide rail; a limit sensor is used to detect the supply of the lead frame carrying portion from the lead frame ; and a limit sensor for detecting discharge from the lead frame unloading portion of the lead frame; a first inspection part for inspecting the arrangement state or arrangement error of the clip attachment positions of the lead frame; a clip attachment part in which the clip is selected by the clip loading part and the first tooth is pressed again Arranged at a pitch, and transferred to the upper part of the lead frame of the semiconductor chip arranged according to the first tooth pitch at the clip attachment position of the lead frame arrangement part, and attached to the upper part of the corresponding lead frame; The lead frame unloading part is used to discharge the lead frame after the clip attachment is completed; and the control part is used to control the supply, arrangement, inspection and discharge of the lead frame, and the supply, cutting and attaching of the clip. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述控制部確認通過所述第一檢查部所檢查出的排列誤差，以糾正通過所述夾片貼合部而形成的夾片的貼合位置。 The multiple-clip bonding apparatus for a semiconductor package according to claim 1, wherein the control section confirms the alignment error detected by the first inspection section to correct the misalignment of the clips formed by the clip bonding section Fit position. 如請求項2之半導體封裝的多重夾片黏合裝置，其中所述第一檢查部與在所述引線框架排列部上部分隔形成的XYR軸平臺結合形成，且通過在夾片貼合位置上部往復並拍攝所述引線框架的左右邊緣來檢查所述引線框架的排列狀態。 The multi-clip bonding device for a semiconductor package according to claim 2, wherein the first inspection portion is formed by combining with an XYR axis stage formed separately on the upper portion of the lead frame arrangement portion, and is formed by reciprocating and aligning the upper portion of the clip bonding position. The left and right edges of the lead frame are photographed to check the alignment state of the lead frame. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述第一檢查部為飛行視覺攝像機或步進視覺攝像機。 The multiple-clip bonding device for semiconductor packaging according to claim 1, wherein the first inspection part is a flying vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述平臺是指真空吸附所述引線框架而形成夾片貼合位置的真空吸附平臺，並包括：真空吸附板，由供安裝所述引線框架的多孔陶瓷構成； 負壓供應單元，形成於所述真空吸附板下端而向所述真空吸附板供應負壓。 The multi-clip bonding device for semiconductor packaging according to claim 1, wherein the platform refers to a vacuum adsorption platform for vacuum adsorbing the lead frame to form a clip attaching position, and comprising: a vacuum adsorption plate, which is used for mounting the Porous ceramic composition of the lead frame; The negative pressure supply unit is formed at the lower end of the vacuum suction plate to supply negative pressure to the vacuum suction plate. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括：第二檢查部，分隔形成於所述前段滑軌的前端部上端，用以檢查向所述平臺移送的所述引線框架有無半導體晶片、有無導電膠、導電膠體積及二維碼中的任一個以上。 The multiple-clip bonding device for semiconductor packages according to claim 1, further comprising: a second inspection part, formed separately at the upper end of the front end of the front-stage slide rail, for inspecting whether the lead frame transferred to the platform has or not Any one or more of a semiconductor wafer, the presence or absence of conductive adhesive, the volume of conductive adhesive, and a two-dimensional code. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括：第三檢查部，分隔形成於所述後段滑軌的前端部上端，用以檢查由所述平臺移送的所述夾片的貼合狀態或貼合誤差。 The multi-clip bonding device for semiconductor packaging according to claim 1, further comprising: a third inspection part, formed separately on the upper end of the front end of the rear slide rail, for inspecting the clips transferred by the platform. Fit state or fit error. 如請求項6之半導體封裝的多重夾片黏合裝置，其中所述第二檢查部為飛行視覺攝像機或步進視覺攝像機。 The multiple-clip bonding device for semiconductor packaging according to claim 6, wherein the second inspection part is a flying vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括：第四檢查部，分隔形成於所述夾片貼合部的下端，用以檢查通過所述夾片貼合部而產生的所述引線框架排列部的所述夾片的貼合狀態，或檢查在所述引線框架與所述夾片貼合之後所述夾片貼合部的所述夾片的去除狀態。 The multi-clip bonding device for a semiconductor package according to claim 1, further comprising: a fourth inspection part, which is formed separately at the lower end of the clip attaching part, and used for inspecting the chip attaching part generated by passing through the clip attaching part. The bonding state of the clips of the lead frame arrangement portion, or the removal state of the clips of the clip bonding portion after the lead frame is bonded to the clips is checked. 如請求項9之的半導體封裝的多重夾片黏合裝置，其中所述控制部用以確認通過所述第四檢查部所檢查出的所述夾片的貼合狀態或去除狀態的差錯，並且在確認差錯時將所述夾片移送至廢料盒而去除。 The multiple-clip bonding apparatus for a semiconductor package according to claim 9, wherein the control unit is configured to confirm an error in the attachment state or the removal state of the clips detected by the fourth inspection unit, and in the When an error is confirmed, the clip is transferred to a waste box and removed. 如請求項9之半導體封裝的多重夾片黏合裝置，其中所述第四檢查部為飛行視覺攝像機或步進視覺攝像機。 The multiple-clip bonding device for semiconductor packaging according to claim 9, wherein the fourth inspection part is a flying vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其中所述夾片剪裁部為將所述夾片方陣按各個夾片而向下剪裁。 The multi-clip bonding device for a semiconductor package according to claim 1, wherein the clip cutting part is to cut the square array of clips downward according to each clip. 如請求項1之半導體封裝的多重夾片黏合裝置，其中通過所述夾片剪裁部而剪裁的所述各個夾片的切削毛刺向上形成。 The multiple-clip bonding apparatus for a semiconductor package as claimed in claim 1, wherein the cutting burrs of the respective clips trimmed by the clip cutting portions are formed upward. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括：黏合劑塗覆裝置，設置在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前塗覆導電膠。 The multiple-clip bonding device for semiconductor packaging according to claim 1, further comprising: an adhesive coating device disposed on the upper portion of the lead frame for arranging the semiconductor chips, for coating the clips before attaching the clips Conductive plastic. 如請求項7之半導體封裝的多重夾片黏合裝置，其中所述第三檢查部為飛行視覺攝像機或步進視覺攝像機。 The multiple-clip bonding device for semiconductor packaging according to claim 7, wherein the third inspection part is a flying vision camera or a stepping vision camera. 如請求項1之半導體封裝的多重夾片黏合裝置，其還包括：黏合劑塗覆裝置，設置在供排列所述半導體晶片的引線框架的上部，用以在貼合所述夾片之前，在所述半導體晶片和所述引線框架的簧片上塗覆導電膠。 The multi-clip bonding device for a semiconductor package according to claim 1, further comprising: an adhesive coating device disposed on the upper portion of the lead frame for arranging the semiconductor chips, for attaching the clips before attaching the clips. Conductive glue is coated on the semiconductor wafer and the springs of the lead frame. 一種半導體封裝，其是通過如請求項1之半導體封裝的多重夾片黏合裝置而製成。 A semiconductor package manufactured by a multiple clip-bonding device for the semiconductor package as claimed in claim 1 .
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201023309A (en) * 2008-12-01 2010-06-16 Alpha & Omega Semiconductor Top-side cooled semiconductor package with stacked interconnection plates and method
US20100313415A1 (en) * 2009-06-11 2010-12-16 Chan Wai Lik Rotary clip bonder
TW201342500A (en) * 2012-04-02 2013-10-16 Daehwa Engineering Co Ltd Clip supplying apparatus for clip bonder, and clip bonder having the same
CN209169115U (en) * 2018-03-27 2019-07-26 Jmj韩国株式会社 The intermediate plate bonding apparatus and intermediate plate pick-up of semiconductor packages

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070045785A1 (en) * 2005-08-30 2007-03-01 Noquil Jonathan A Reversible-multiple footprint package and method of manufacturing
KR101544086B1 (en) 2014-02-07 2015-08-12 제엠제코(주) Multi clip mounting method for semiconductor packages and multi clip mounting system
KR101612730B1 (en) 2016-02-24 2016-04-26 제엠제코(주) Method for mounting clip for semiconductor package and the multi clip mounting apparatus for the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201023309A (en) * 2008-12-01 2010-06-16 Alpha & Omega Semiconductor Top-side cooled semiconductor package with stacked interconnection plates and method
US20100313415A1 (en) * 2009-06-11 2010-12-16 Chan Wai Lik Rotary clip bonder
TW201342500A (en) * 2012-04-02 2013-10-16 Daehwa Engineering Co Ltd Clip supplying apparatus for clip bonder, and clip bonder having the same
CN209169115U (en) * 2018-03-27 2019-07-26 Jmj韩国株式会社 The intermediate plate bonding apparatus and intermediate plate pick-up of semiconductor packages

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