TWI743870B - Mapping arrangement mechanism - Google Patents

Abstract

The present invention provides a mapping arrangement mechanism including a pick-up arm having a suction device. The suction device includes a main cavity structure, a replacement suction nozzle, and a transparent observation window provided on the main cavity structure. One end of the main cavity structure is provided with a vacuum tube connecting outlet, and another end of the main cavity structure is provided with a nozzle port. The replacement suction nozzle is detachably installed on the nozzle port. In the mapping arrangement mechanism, the transparent observation window, and the nozzle port and the replacement suction nozzle collectively constitute an optical observation path, and the optical observation path does not pass through the vacuum tube connecting outlet.

Description

排片機構Film arranging mechanism

本發明係關於一種排片機構。具體而言，本發明係關於一種具有透明觀測窗的排片機構。 The present invention relates to a sheet arrangement mechanism. Specifically, the present invention relates to a film arrangement mechanism with a transparent observation window.

隨著顯示技術的發展，LED、Mini LED、micro LED等晶片於顯示裝置中的應用亦逐漸增加。承上，在配置此些晶片時，往往需要使用吸取裝置來移動或排列晶片。然而，隨著製程次數的增加，移動或排列晶片所用的吸取裝置會自然磨損，而須進行更換。特別是，針對一些作業材料，為了減少或避免刮傷或撞壞材料本體或材料上之精密組件(例如但不限於藍寶石基板上之襯墊(pad)或磊晶等)，又或是吸取裝置可能會直接與精密組件接觸(例如襯墊(pad)或磊晶朝向吸取裝置等)，吸取裝置可使用較柔軟的材質所製成，從而使得吸取裝置更容易損壞或變形失能。如上所述，更換吸取裝置的頻率過高可能會提升製作顯示裝置的成本和時間，從而不利於量產及維持良率。進一步，由於每次更換吸取裝置都須重新校準吸取裝置與預定作業位置，此亦增加了製程作業的時間心力，甚至可能增加校準不準確的風險。特別是，若在校準後另外安裝真空管等來使吸取裝置可進行作業，則亦可能進一步增加安裝過程中碰觸移動整體設備，而導致校準再次失準的可能性。 With the development of display technology, the application of chips such as LED, Mini LED, and micro LED in display devices has gradually increased. In addition, when disposing these wafers, it is often necessary to use a suction device to move or arrange the wafers. However, as the number of processes increases, the suction device used to move or arrange the wafers will naturally wear out and must be replaced. In particular, for some working materials, in order to reduce or avoid scratches or damage to the material body or the precision components on the material (such as but not limited to pads or epitaxy on the sapphire substrate), or suction devices It may be in direct contact with precision components (such as pads or epitaxial oriented suction devices, etc.). The suction devices can be made of softer materials, so that the suction devices are more likely to be damaged or deformed. As described above, the frequency of replacing the suction device is too high, which may increase the cost and time of manufacturing the display device, which is not conducive to mass production and maintaining yield. Furthermore, since the suction device and the predetermined operating position must be recalibrated each time the suction device is replaced, this also increases the time and effort of the manufacturing process, and may even increase the risk of inaccurate calibration. In particular, if a vacuum tube or the like is additionally installed after calibration to make the suction device workable, it may further increase the possibility of touching and moving the entire device during the installation process, which may cause the calibration to be inaccurate again.

另外，在運用真空管於移動或排列晶片的過程中，真空管隨著插拔亦容易磨損，而可能產生彈性疲乏甚或漏氣使得作業效率不佳或作業不精準 的問題。承上，在真空管未確實固定之情況下，甚至可能產生鬆脫或甩脫的問題。此增加了重新安裝真空管所需的時間及心力，甚至可能意外地於鬆脫或甩脫過程中撞擊或摩擦生產設備或作業物件如晶片等。因此，需要發展能改善上述各種問題的技術或機構。 In addition, in the process of moving or arranging the wafers using the vacuum tube, the vacuum tube is also easy to wear as it is inserted and unplugged, which may cause elastic fatigue or even air leakage, resulting in poor operating efficiency or inaccurate operations. The problem. In addition, when the vacuum tube is not firmly fixed, the problem of loosening or throwing off may even occur. This increases the time and effort required to reinstall the vacuum tube, and may even accidentally hit or rub the production equipment or work objects such as wafers during the loosening or throwing process. Therefore, there is a need to develop technologies or institutions that can improve the above-mentioned various problems.

為解決上述問題，本發明之一實施例提供一種排片機構，其包含具有吸取裝置之拾取臂。該吸取裝置包含：主腔體、置換式吸嘴、以及設置於該主腔體上之透明觀測窗。主腔體之一端設有一真空管連接對口，而另一端設有一吸嘴端口。置換式吸嘴係可拆卸地安裝於該吸嘴端口上。在該排片機構中，透明觀測窗與吸嘴端口及置換式吸嘴共同形成一光學觀測路徑，且光學觀測路徑不通過真空管連接對口。 In order to solve the above-mentioned problems, an embodiment of the present invention provides a sheet ejection mechanism, which includes a pick-up arm with a suction device. The suction device includes a main cavity, a displacement suction nozzle, and a transparent observation window arranged on the main cavity. One end of the main cavity is provided with a vacuum tube connection pair, and the other end is provided with a suction nozzle port. The replacement nozzle is detachably installed on the nozzle port. In the film arrangement mechanism, the transparent observation window, the suction nozzle port and the displacement suction nozzle jointly form an optical observation path, and the optical observation path is not connected to the opposite port through a vacuum tube.

依據本發明之各實施例所提供之排片機構，可減少或避免頻繁更替吸取裝置所導致之製程時間及成本增加，可減少或避免安裝真空管時所導致之裝置偏移，且可改善校準吸取裝置的準確性及方便性。因此，根據本發明之排片機構，可改善排片機構之操作性、可靠性及產率。 According to the sheet ejection mechanism provided by the various embodiments of the present invention, the process time and cost increase caused by frequent replacement of the suction device can be reduced or avoided, the device deviation caused by the installation of the vacuum tube can be reduced or avoided, and the calibration of the suction device can be improved The accuracy and convenience. Therefore, according to the film ejection mechanism of the present invention, the operability, reliability and productivity of the film ejection mechanism can be improved.

10、10’、20、11、12、13、14:吸取裝置 10, 10’, 20, 11, 12, 13, 14: suction device

15:晶片 15: chip

50:藍膜 50: blue film

51、52、53:逆鱗節段 51, 52, 53: inverse scale segment

100、100’、101:主腔體 100, 100’, 101: main cavity

110:真空管連接對口 110: Vacuum tube connection counterpart

115:逆鱗結構 115: reverse scale structure

115’:固定環 115’: fixed ring

120:吸嘴端口 120: Nozzle port

125:螺紋結構 125: Thread structure

150:暫存基板 150: Temporary substrate

200、200’:置換式吸嘴 200, 200’: Displacement nozzle

205:置換式吸嘴口 205: Replacement nozzle mouth

210:螺紋吸嘴 210: Threaded nozzle

300:透明觀測窗 300: Transparent observation window

400:真空管 400: vacuum tube

500:CCD 500: CCD

600:固定夾 600: fixed clip

1000、1000’、2000、3000、4000:排片機構 1000, 1000’, 2000, 3000, 4000: Film arrangement mechanism

A1、A2、A3、A4:拾取臂 A1, A2, A3, A4: picking arm

S:預定位置 S: predetermined location

P1、P1’、P2:光學觀測路徑 P1, P1’, P2: Optical observation path

C:軸心基座 C: Axle base

M0、M1、M2、M3、M4、B1、B2:作動狀態 M0, M1, M2, M3, M4, B1, B2: operating status

θ1、θ2、θ3、θ4、θ5、θ6:預設角度 θ1, θ2, θ3, θ4, θ5, θ6: preset angle

R1、R2:區塊 R1, R2: block

圖1係為根據本發明之一實施例之排片機構之示意圖。 Fig. 1 is a schematic diagram of a sheet discharging mechanism according to an embodiment of the present invention.

圖2係為圖1所示之排片機構連接上真空管及置換式吸嘴之示意圖。 Fig. 2 is a schematic diagram of the film ejection mechanism shown in Fig. 1 connected with a vacuum tube and a displacement suction nozzle.

圖3A及圖3B係為根據本發明之一實施例之排片機構利用CCD進行校準之示意圖。 3A and 3B are schematic diagrams of the alignment mechanism using CCD to perform calibration according to an embodiment of the present invention.

圖4係為根據本發明之一實施例之排片機構拆卸更換主腔體之示意圖。 Fig. 4 is a schematic diagram of disassembling and replacing the main cavity of the sheet discharging mechanism according to an embodiment of the present invention.

圖5係為根據本發明之一實施例之利用排片機構拾取設置晶片之示意圖。 FIG. 5 is a schematic diagram of picking and setting wafers by a chip arrangement mechanism according to an embodiment of the present invention.

圖6係為根據本發明之一實施例之排片機構之示意圖。 Fig. 6 is a schematic diagram of a sheet discharging mechanism according to an embodiment of the present invention.

圖7係為根據本發明之一實施例之具有兩個拾取臂之排片機構之示意圖。 Fig. 7 is a schematic diagram of a sheet discharging mechanism with two pick-up arms according to an embodiment of the present invention.

圖8A至圖8D係為根據本發明之各實施例以排片機構進行排片之作動示意圖。 8A to 8D are schematic diagrams showing the action of the film discharging mechanism for discharging films according to various embodiments of the present invention.

圖9A及圖9B係為根據本發明之一實施例以具有四個拾取臂之排片機構進行排片之作動示意圖。 9A and FIG. 9B are schematic diagrams showing the action of a film discharging mechanism with four pick-up arms according to an embodiment of the present invention.

下文中將描述各種實施例，且所屬技術領域中具有通常知識者在參照說明搭配圖式下，應可輕易理解本發明之精神與原則。然而，雖然在文中會具體說明一些特定實施例，這些實施例僅作為例示性，且於各方面而言皆非視為限制性或窮盡性意義。因此，對於所屬技術領域中具有通常知識者而言，在不脫離本發明之精神與原則下，對於本發明之各種變化及修改應為顯而易見且可輕易達成的。 Various embodiments will be described below, and those skilled in the art should be able to easily understand the spirit and principle of the present invention by referring to the description and the accompanying drawings. However, although some specific embodiments will be specifically described in the text, these embodiments are only illustrative, and are not regarded as restrictive or exhaustive in every respect. Therefore, for those with ordinary knowledge in the technical field, various changes and modifications to the present invention should be obvious and easily reachable without departing from the spirit and principle of the present invention.

參照圖1，根據本發明之一實施例之排片機構1000可運用於對晶片進行排片作業。舉例而言，晶片可為LED(尺寸例如約莫250μm×250μm以上)、mini LED(尺寸例如約莫250μm×250μm至50μm×100μm之間)、micro LED(尺 寸例如約莫50μm×100μm以下)、或任何具有特殊配置或材質之單位結構。承上，所述排片機構1000包含具有吸取裝置10之拾取臂A1，以藉由吸取裝置10來拾取及設置晶片。具體而言，吸取裝置10包含主腔體100，其一端設有真空管連接對口110，而另一端設有吸嘴端口120；置換式吸嘴200，其可拆卸地安裝於吸嘴端口120上；以及透明觀測窗300，設置於主腔體100上。 1, the chip arrangement mechanism 1000 according to an embodiment of the present invention can be used for chip arrangement operations of wafers. For example, the chip can be an LED (size, for example, about 250μm×250μm or more), mini LED (size, for example, about 250μm×250μm to 50μm×100μm), micro LED (size For example, about 50μm×100μm or less), or any unit structure with special configuration or material. In addition, the chip arrangement mechanism 1000 includes a pickup arm A1 with a suction device 10 to pick up and set wafers by the suction device 10. Specifically, the suction device 10 includes a main cavity 100, one end of which is provided with a vacuum tube connection port 110, and the other end is provided with a suction nozzle port 120; a replacement suction nozzle 200, which is detachably mounted on the suction nozzle port 120; And the transparent observation window 300 is set on the main cavity 100.

承上所述，吸取裝置10之主腔體100可為任何材質所製成且具有空腔於其中的結構體，且具有連通該空腔之位於主腔體100之一端的真空管連接對口110、以及連通該空腔之位於主腔體100之另一端的吸嘴端口120。例如，根據本實施例，主腔體100可形成為L型主腔體100，且真空管連接對口110即位於L型的一端，吸嘴端口120則位於L型的另一端。然而，上述僅為示例，且根據本發明之其他實施例之主腔體100之形狀不限於此。 As mentioned above, the main cavity 100 of the suction device 10 can be a structure made of any material and has a cavity in it, and has a vacuum tube connecting port 110 at one end of the main cavity 100 communicating with the cavity, And a nozzle port 120 at the other end of the main cavity 100 communicating with the cavity. For example, according to the present embodiment, the main cavity 100 may be formed as an L-shaped main cavity 100, and the vacuum tube connection pair 110 is located at one end of the L-shape, and the suction nozzle port 120 is located at the other end of the L-shape. However, the foregoing is only an example, and the shape of the main cavity 100 according to other embodiments of the present invention is not limited to this.

根據本實施例，連同圖1參照圖2，真空管連接對口110可用於連接一真空管400，而吸嘴端口120可用於連接置換式吸嘴200。藉此，可利用真空管400對主腔體100之空腔抽取真空，而使另一端之置換式吸嘴200因應環境氣壓而產生吸力，從而可吸取晶片。其中，於設置連接有真空管400於真空管連接對口110下，透明觀測窗300可與吸嘴端口120及置換式吸嘴200共同形成一光學觀測路徑P1，且該光學觀測路徑P1不通過真空管連接對口110。因此，真空管400的設置不會干擾利用光學觀測路徑P1自透明觀測窗300觀測置換式吸嘴口205下的情況。 According to this embodiment, referring to FIG. 2 in conjunction with FIG. 1, the vacuum tube connection pair 110 can be used to connect a vacuum tube 400, and the nozzle port 120 can be used to connect a displacement suction nozzle 200. Thereby, the vacuum tube 400 can be used to draw a vacuum to the cavity of the main cavity 100, so that the displacement suction nozzle 200 at the other end generates suction in response to the ambient air pressure, so that the wafer can be sucked. Wherein, when the vacuum tube 400 is provided under the vacuum tube connection port 110, the transparent observation window 300 can form an optical observation path P1 together with the nozzle port 120 and the displacement suction nozzle 200, and the optical observation path P1 is not connected to the counterpart through the vacuum tube 110. Therefore, the installation of the vacuum tube 400 does not interfere with the observation of the replacement nozzle opening 205 from the transparent observation window 300 using the optical observation path P1.

舉例而言，透明觀測窗300、吸嘴端口120、及置換式吸嘴200可連成一直線，且因此可透過透明觀測窗300觀測通過吸嘴端口120及置換式吸嘴200，而可觀測以對齊或對位預定位置。在此配置下，吸嘴端口120與透明觀測窗300之直線連線不通過真空管連接對口110。然而，本發明不限於此直線式光學觀測路徑P1，且根據其他實施例亦可通過非直線之光學觀測路徑P1來透過透明觀 測窗300通過吸嘴端口120及置換式吸嘴200進行觀測，例如可以反射或折射方式來達成之非直線光學觀測路徑。 For example, the transparent observation window 300, the nozzle port 120, and the displacement suction nozzle 200 can be connected in a straight line, and therefore, the transparent observation window 300 can observe the passage of the suction nozzle port 120 and the displacement suction nozzle 200, and can observe Align or align a predetermined position. In this configuration, the straight line connecting the nozzle port 120 and the transparent observation window 300 does not connect to the opposite port 110 through a vacuum tube. However, the present invention is not limited to this linear optical observation path P1, and according to other embodiments, a non-linear optical observation path P1 can be used to pass the transparent observation path. The measuring window 300 is observed through the nozzle port 120 and the displacement nozzle 200, for example, a non-linear optical observation path can be achieved by reflection or refraction.

根據一些實施例，置換式吸嘴口205之孔徑可小於待轉移之物件，但本發明不限於此。 According to some embodiments, the aperture of the displacement nozzle 205 may be smaller than the object to be transferred, but the present invention is not limited to this.

如上所述，根據本實施例，可在真空管400安裝完畢後利用光學觀測路徑P1進行校準。例如，除了肉眼以外，在需要高精密準確度下，可透過任何儀器來觀測校準光學觀測路徑P1。承上，在一實施例中，圖3A及圖3B即為透過CCD(電荷耦合元件)500通過光學觀測路徑P1所視察的模擬視圖。其中，十字代表的是CCD 500的十字準星，十字準星中心即代表預設的預定位置S，而置換式吸嘴口205則代表穿過光學觀測路徑P1於置換式吸嘴口205透光看出去的孔洞。連同圖2參照圖3A及圖3B，可利用所述光學觀測路徑P1，藉由CCD(電荷耦合元件)500對組裝完成待進行排片作業之排片機構1000進行觀測，並在當置換式吸嘴口205所看出去的位置偏離預定位置S(例如CCD配置預設排片對準位點)時，對整體排片機構1000進行微調。因此，根據本實施例，可藉此改善對於物件進行作業的精準度及可靠性。進一步，由於真空管400已安裝設置完畢，可避免在校準完畢後才安裝真空管400所可能導致之裝置移動和作業預定位置之偏離。 As described above, according to this embodiment, the optical observation path P1 can be used for calibration after the vacuum tube 400 is installed. For example, in addition to the naked eye, when high-precision accuracy is required, any instrument can be used to observe the calibration optical observation path P1. In addition, in one embodiment, FIGS. 3A and 3B are simulated views inspected through a CCD (Charge Coupled Device) 500 through the optical observation path P1. Among them, the cross represents the crosshair of the CCD 500, the center of the crosshair represents the preset predetermined position S, and the displacement nozzle mouth 205 represents the light through the optical observation path P1 and the displacement nozzle mouth 205 is visible. Holes. Referring to FIGS. 3A and 3B in conjunction with FIG. 2, the optical observation path P1 can be used to observe the discharging mechanism 1000 that is assembled to be discharged by the CCD (Charge Coupled Device) 500, and when the replacement nozzle When the position seen by 205 deviates from the predetermined position S (for example, the CCD is configured with a preset film alignment position), the overall film alignment mechanism 1000 is fine-tuned. Therefore, according to this embodiment, the accuracy and reliability of operations on objects can be improved. Furthermore, since the vacuum tube 400 has been installed and set up, it is possible to avoid the deviation of the device movement and the predetermined operation position that may be caused by installing the vacuum tube 400 after the calibration is completed.

另外，根據本實施例，由於吸嘴是以置換式吸嘴200之形式進行連接組裝，因此當置換式吸嘴200磨損或故障或基於其他理由需要更換時，可無須更換整個吸取裝置10。詳細而言，參照圖2，置換式吸嘴200是實際上與作業物件如晶片進行接觸或互動的結構，且因而較容易磨損、故障或變形。為了維持作業的精準性和順利度，必須要定期或定次數的替換置換式吸嘴200。承上所述，由於置換式吸嘴200可自吸取裝置10單獨地拆卸及重新安裝，因而可減少或避免須自拾取臂A1上替換整個吸取裝置10之過程。因此，可減少重新安裝吸取裝置 10(包含但不限於主腔體100)之時間、成本及心力。另外，亦可減少或避免重新安裝吸取裝置10時可能導致的吸取裝置10移動和作業預定位置之偏離。 In addition, according to this embodiment, since the suction nozzle is connected and assembled in the form of a replacement suction nozzle 200, when the replacement suction nozzle 200 is worn or malfunctions or needs to be replaced for other reasons, the entire suction device 10 does not need to be replaced. In detail, referring to FIG. 2, the displacement suction nozzle 200 is a structure that actually contacts or interacts with a work object such as a wafer, and is therefore prone to wear, failure or deformation. In order to maintain the accuracy and smoothness of the operation, it is necessary to replace the replacement nozzle 200 on a regular or regular basis. As mentioned above, since the replacement suction nozzle 200 can be separately disassembled and reinstalled from the suction device 10, the process of replacing the entire suction device 10 from the pickup arm A1 can be reduced or avoided. Therefore, the reinstallation of the suction device can be reduced 10 (including but not limited to the main cavity 100) time, cost and effort. In addition, it can also reduce or avoid the deviation of the movement of the suction device 10 and the predetermined position of the operation that may be caused when the suction device 10 is reinstalled.

根據一些實施例，上述置換式吸嘴200可藉由較容易定位的卡扣或較容易置換的磁吸之方式而固定於吸嘴端口120。然而，本發明並不限於此，且根據其他實施例亦可運用任何可拆卸替換置換式吸嘴200之結構或手段。 According to some embodiments, the replacement nozzle 200 can be fixed to the nozzle port 120 by a buckle that is easier to locate or a magnetic attraction that is easier to replace. However, the present invention is not limited to this, and any detachable replacement nozzle 200 structure or method can also be used according to other embodiments.

另外，根據一些實施例，若需要減少或避免對於作業物件的可能傷害，或者增加對較小作業物件的吸取密合度，置換式吸嘴200可由材質較軟的電木或塑膠所製成。然而，本發明並不限於此，且根據製程和對於作業物件互動之間的要求，亦可採取其他任何材質來製作置換式吸嘴200。 In addition, according to some embodiments, if it is necessary to reduce or avoid possible damage to work objects, or to increase the suction tightness of smaller work objects, the replacement nozzle 200 may be made of bakelite or plastic with a softer material. However, the present invention is not limited to this, and any other material can be used to make the displacement suction nozzle 200 according to the manufacturing process and the requirements for the interaction of the work object.

接著，請參照圖4，根據本發明之又一實施例之排片機構1000’，拾取臂A1可進一步包含一固定夾600。舉例而言，固定夾600可包含兩個並排配置之臂體，其於臂體延伸之相對兩端點可相互靠近而於相對兩端點之間可相隔一段距離以設置安裝主腔體。上述固定夾600之兩臂體於至少一端點可具有固定螺絲鎖附以卡固安裝於兩臂體之間的主腔體，且吸取裝置10’之主腔體100或100’相對於固定夾600為可拆卸的。具體而言，固定架600可用於夾持定位根據本實施例之主腔體100或主腔體100’，且可拆卸替換。例如，可如圖4所示般鬆脫固定螺絲鬆開雙臂體以取下主腔體100，並設置再以雙臂體夾持定位其他主腔體100’而鎖附固定螺絲來固定雙臂體，或反之亦然。藉此，可在主腔體損壞時輕易替換主腔體(如主腔體100或100’)，或可運用不同的主腔體(如主腔體100或100’)來實施不同置換式吸嘴200或200’的組裝和作業程序。 Next, referring to FIG. 4, according to another embodiment of the sheet discharging mechanism 1000' of the present invention, the pickup arm A1 may further include a fixing clip 600. For example, the fixing clip 600 may include two arm bodies arranged side by side, and the opposite end points of the arm bodies can be close to each other and the opposite end points can be separated by a certain distance to set the main installation cavity. The two arms of the fixing clip 600 may have a fixing screw at at least one end to be fastened to the main cavity installed between the two arms, and the main cavity 100 or 100' of the suction device 10' is relative to the fixing clip 600 is detachable. Specifically, the fixing frame 600 can be used to clamp and position the main cavity 100 or the main cavity 100' according to this embodiment, and can be detachably replaced. For example, as shown in Figure 4, the two arms can be loosened to loosen the two arms to remove the main cavity 100, and the two arms can be clamped to position the other main cavity 100', and the fixing screws can be locked to fix the double arms. Arm body, or vice versa. In this way, the main cavity (such as the main cavity 100 or 100') can be easily replaced when the main cavity is damaged, or different main cavities (such as the main cavity 100 or 100') can be used to implement different replacement suctions. Assembly and operating procedures of the mouth 200 or 200'.

類似於上述圖2所述之實施例，根據本實施例，在安置主腔體100’下，透明觀測窗300可與吸嘴端口120及置換式吸嘴200’共同形成一光學觀測路徑P1’，且該光學觀測路徑P1’不通過真空管連接對口110。藉此，可透過光學觀測路徑P1’在不被真空管干擾下進行預定的校準程序。 Similar to the embodiment described in FIG. 2 above, according to this embodiment, under the arrangement of the main cavity 100', the transparent observation window 300 can form an optical observation path P1' together with the nozzle port 120 and the displacement nozzle 200' , And the optical observation path P1' is not connected to the opposite port 110 through a vacuum tube. Thereby, a predetermined calibration procedure can be performed through the optical observation path P1' without being disturbed by the vacuum tube.

參照圖5，根據本發明之各實施例之排片機構，如圖1及圖2所示之排片機構1000，在連接設置有置換式吸嘴200及安裝好真空管400以提供吸力下，可應用於拾取或配置晶片15，從而可進行移動作業物件或配置排片作業物件的作業程序。然而，上述僅為示例，且根據本發明之各實施例之排片機構可應用之作業程序不限於此。 5, the film ejection mechanism according to various embodiments of the present invention, such as the film ejection mechanism 1000 shown in FIGS. 1 and 2, can be applied when the displacement suction nozzle 200 is connected and the vacuum tube 400 is installed to provide suction. The wafer 15 is picked up or arranged, so that the operation procedure of moving the work object or arranging the chip arrangement work object can be carried out. However, the foregoing is only an example, and the applicable operating procedures of the sheet arranging mechanism according to the embodiments of the present invention are not limited to this.

接著，參照圖6，將進一步說明根據本發明之一變化實施例之排片機構2000。具體而言，排片機構2000可包含具有吸取裝置20之拾取臂A1，以藉由吸取裝置20來拾取及設置作業物件。承上，吸取裝置20可包含主腔體101，其一端設有真空管連接對口110，而另一端設有吸嘴端口120；置換式吸嘴200，其可拆卸地安裝於吸嘴端口120上；以及透明觀測窗300，設置於主腔體101上。另外，類似於上述圖2所述之實施例，根據本實施例，在安置主腔體101下，透明觀測窗300可與吸嘴端口120及置換式吸嘴200共同形成一光學觀測路徑P2，且該光學觀測路徑P2不通過真空管連接對口110。藉此，可透過光學觀測路徑P2在不被真空管400干擾下進行預定的校準程序。 Next, referring to FIG. 6, a film ejection mechanism 2000 according to a modified embodiment of the present invention will be further described. Specifically, the sheet discharging mechanism 2000 may include a picking arm A1 having a suction device 20 to pick up and set the work object by the suction device 20. In addition, the suction device 20 may include a main cavity 101, one end of which is provided with a vacuum tube connection port 110, and the other end is provided with a suction nozzle port 120; a replacement suction nozzle 200, which is detachably mounted on the suction nozzle port 120; And the transparent observation window 300 is set on the main cavity 101. In addition, similar to the embodiment described in FIG. 2 above, according to this embodiment, under the arrangement of the main cavity 101, the transparent observation window 300 can form an optical observation path P2 together with the nozzle port 120 and the displacement nozzle 200. In addition, the optical observation path P2 is not connected to the opposite port 110 through a vacuum tube. Thereby, a predetermined calibration procedure can be performed without being disturbed by the vacuum tube 400 through the optical observation path P2.

排片機構2000可具有類似於上述圖1及圖2所示之排片機構1000之結構和配置，且與上述各實施例相同或類似的結構或配置將不於此詳述而僅簡要地說明或予以省略。 The sheet discharging mechanism 2000 may have a structure and configuration similar to the sheet discharging mechanism 1000 shown in FIGS. 1 and 2 above, and the same or similar structures or configurations as in the foregoing embodiments will not be detailed here but only briefly described or given. Omitted.

如上述，排片機構2000與前文所述其他實施例相較，其差異在於其中真空管連接對口110可具有逆鱗結構115，且排片機構2000可進一步包含一固定環115’。具體而言，逆鱗結構115可具有至少二逆鱗節段如逆鱗節段51、52、53，且固定環115’可供卡固待設置之真空管400於逆鱗結構115之該些逆鱗節段51、52、53之其中一個上。藉此，可更穩固地安裝真空管400於真空管連接對口110上，從而減少或避免真空管400因磨損、彈性疲乏或老化等原因導致自真空管連接對口110鬆脫或甩脫。因此，可減少或避免須重新安裝或定位真空管400之程 序，且可減少或避免由於真空管400鬆脫或甩脫而導致的作業製程誤差或作業物件及設備損壞。 As mentioned above, compared with other embodiments described above, the sheet discharging mechanism 2000 differs in that the vacuum tube connecting port 110 may have a reverse scale structure 115, and the sheet discharging mechanism 2000 may further include a fixing ring 115'. Specifically, the inverted scale structure 115 may have at least two inverted scale segments, such as inverted scale segments 51, 52, 53, and the fixing ring 115' can be used to fix the vacuum tube 400 to be installed on the inverted scale segments 51, of the inverted scale structure 115. One of 52 and 53 is on. In this way, the vacuum tube 400 can be installed on the vacuum tube connection counterpart 110 more stably, thereby reducing or avoiding the vacuum tube 400 from being loosened or thrown off from the vacuum tube connection counterpart 110 due to wear, elastic fatigue, or aging. Therefore, the process of reinstalling or positioning the vacuum tube 400 can be reduced or avoided It can reduce or avoid the operation process error or the operation object and equipment damage caused by the loosening or throwing of the vacuum tube 400.

進一步，根據本實施例，排片機構2000可另外與螺紋吸嘴210搭配。具體而言，在此實施例中，排片機構2000之置換式吸嘴200可為螺紋吸嘴210，且主腔體101之吸嘴端口120可具有螺紋結構125對應以卡固螺紋吸嘴210。藉此，可增加置換式吸嘴200的可靠性，並藉由螺紋卡固定位來減少或避免作業過程中可能產生的磨損和偏移。因此，可減少替換置換式吸嘴200的頻率。 Furthermore, according to the present embodiment, the sheet discharging mechanism 2000 can be additionally matched with the threaded suction nozzle 210. Specifically, in this embodiment, the replacement suction nozzle 200 of the sheet discharging mechanism 2000 may be a threaded suction nozzle 210, and the suction nozzle port 120 of the main cavity 101 may have a threaded structure 125 corresponding to the threaded suction nozzle 210 to be locked. In this way, the reliability of the replacement suction nozzle 200 can be increased, and the possible abrasion and offset during the operation can be reduced or avoided by fixing the position of the threaded clamp. Therefore, the frequency of replacing the replacement nozzle 200 can be reduced.

接著，根據本發明之一實施例，將進一步說明利用排片機構進行排片作業的過程。 Next, according to an embodiment of the present invention, the process of using the film discharging mechanism to perform the film discharging operation will be further explained.

承上所述，根據一實施例，參照圖7，排片機構3000可進一步包含軸心基座C及對向拾取臂A2。具體而言，排片機構3000可具有相同或類似於上述各實施例所述之拾取臂A1之結構及配置之拾取臂A1及對向拾取臂A2。舉例而言，排片機構3000可具有兩個相對設置之拾取臂A1及A2，且其末端分別設置有吸取裝置11及吸取裝置12。其中，吸取裝置11及吸取裝置12可分別具有相同或類似於上述任一實施例之吸取裝置之結構及配置。承上，上述拾取臂A1與對向拾取臂A2基於軸心基座C可分別設置於排片機構3000之對向兩側，使得吸取裝置11及吸取裝置12可分別設置於對向兩側，且排片機構3000基於軸心基座C為可旋轉的。藉此，可使分別設置於對向兩側之吸取裝置11及吸取裝置12之位置可變化。 Based on the foregoing, according to an embodiment, referring to FIG. 7, the sheet discharging mechanism 3000 may further include an axis base C and an opposing picking arm A2. Specifically, the sheet discharging mechanism 3000 may have a pickup arm A1 and an opposing pickup arm A2 that are the same as or similar to the structure and configuration of the pickup arm A1 described in the foregoing embodiments. For example, the sheet discharging mechanism 3000 may have two oppositely arranged picking arms A1 and A2, and the ends of which are respectively provided with a suction device 11 and a suction device 12. Wherein, the suction device 11 and the suction device 12 may respectively have the same or similar structure and configuration of the suction device in any of the above-mentioned embodiments. In addition, the above-mentioned pickup arm A1 and the opposing pickup arm A2 can be respectively arranged on opposite sides of the sheet discharging mechanism 3000 based on the axis base C, so that the suction device 11 and the suction device 12 can be respectively arranged on the opposite sides, and The sheet discharging mechanism 3000 is rotatable based on the shaft base C. Thereby, the positions of the suction device 11 and the suction device 12 respectively arranged on the opposite sides can be changed.

上述排片機構3000可應用於轉移第一區塊R1上的作業物件至第二區塊R2上。舉例而言，如圖7所示，第一區塊R1可為配置有複數個晶片15之藍膜50，且第二區塊R2可為預定照預期陣列排列晶片15之暫存基板150。在此，晶片15可例如但不限於為mini LED。 The above-mentioned sheet arrangement mechanism 3000 can be applied to transfer the work objects on the first block R1 to the second block R2. For example, as shown in FIG. 7, the first block R1 may be a blue film 50 configured with a plurality of chips 15, and the second block R2 may be a temporary storage substrate 150 on which the chips 15 are arranged in a predetermined array. Here, the chip 15 may be, for example, but not limited to, a mini LED.

在一作動狀態M0下，排片機構3000可位於一起始位置，其中拾取臂A1及對向拾取臂A2皆非設置於第一區塊R1及第二區塊R2上。 In an actuation state M0, the sheet discharging mechanism 3000 can be located at an initial position, wherein the picking arm A1 and the opposing picking arm A2 are not arranged on the first block R1 and the second block R2.

接著，連同圖7參照圖8A，當須進行將第一區塊R1如藍膜50上的晶片15轉移並排列至第二區塊R2如暫存基板150上之作業程序時，可先將排片機構3000自作動狀態M0轉移至作動狀態M1。例如，根據本實施例，可將排片機構3000整體以逆時針旋轉一預設角度θ1如90度，而使拾取臂A1朝向第一區塊R1而對向拾取臂A2朝向第二區塊R2，且吸取裝置11對應於第一區塊R1而吸取裝置12對應於第二區塊R2。此時，拾取臂A1之吸取裝置11拾取第一區塊R1如藍膜50上的晶片15。 Next, referring to FIG. 8A in conjunction with FIG. 7, when the first block R1, such as the chip 15 on the blue film 50, needs to be transferred and arranged on the second block R2, such as the temporary storage substrate 150, the chip can be arranged first The mechanism 3000 transitions from the actuation state M0 to the actuation state M1. For example, according to this embodiment, the entire sheet discharging mechanism 3000 can be rotated counterclockwise by a predetermined angle θ1, such as 90 degrees, so that the picking arm A1 faces the first block R1 and the opposing picking arm A2 faces the second block R2. And the suction device 11 corresponds to the first block R1 and the suction device 12 corresponds to the second block R2. At this time, the picking device 11 of the picking arm A1 picks up the wafer 15 on the first block R1 such as the blue film 50.

接著，連同圖8A參照圖8B，可再將排片機構3000自作動狀態M1轉移至作動狀態M2。例如，根據本實施例，可將排片機構3000整體以順時針旋轉一預設角度θ2如180度，而使拾取臂A1朝向第二區塊R2而對向拾取臂A2朝向第一區塊R1，且吸取裝置11對應於第二區塊R2而吸取裝置12對應於第一區塊R1。此時，於上一作動狀態中自第一區塊R1拾取晶片15之拾取臂A1之吸取裝置11可放置晶片15於第二區塊R2如暫存基板150上之特定位置。同時，位於對向之對向拾取臂A2之吸取裝置12則可繼續拾取第一區塊R1如藍膜50上的晶片15。 Next, referring to FIG. 8B in conjunction with FIG. 8A, the sheet discharging mechanism 3000 can be transferred from the active state M1 to the active state M2. For example, according to this embodiment, the entire sheet discharging mechanism 3000 can be rotated clockwise by a predetermined angle θ2, such as 180 degrees, so that the picking arm A1 faces the second block R2 and the opposing picking arm A2 faces the first block R1. And the suction device 11 corresponds to the second block R2 and the suction device 12 corresponds to the first block R1. At this time, the suction device 11 of the pickup arm A1 that picks up the wafer 15 from the first block R1 in the previous operating state can place the wafer 15 in a specific position on the second block R2 such as the temporary storage substrate 150. At the same time, the suction device 12 located on the opposite pickup arm A2 can continue to pick up the wafer 15 on the first block R1 such as the blue film 50.

接著，連同圖8B參照圖8C，可再將排片機構3000自作動狀態M2轉移至作動狀態M3。例如，根據本實施例，可將排片機構3000整體以逆時針旋轉一預設角度θ3如180度，而使拾取臂A1朝向第一區塊R1而對向拾取臂A2朝向第二區塊R2，且吸取裝置11對應於第一區塊R1而吸取裝置12對應於第二區塊R2。此時，於上一作動狀態中自第一區塊R1拾取晶片15之對向拾取臂A2之吸取裝置12可放置晶片15於第二區塊R2如暫存基板150上之特定位置。同時，位於對向之拾取臂A1之吸取裝置11則可繼續拾取第一區塊R1如藍膜50上的晶片15。 Next, referring to FIG. 8C in conjunction with FIG. 8B, the sheet discharging mechanism 3000 can be transferred from the active state M2 to the active state M3. For example, according to this embodiment, the entire sheet discharging mechanism 3000 can be rotated counterclockwise by a predetermined angle θ3, such as 180 degrees, so that the picking arm A1 faces the first block R1 and the opposing picking arm A2 faces the second block R2. And the suction device 11 corresponds to the first block R1 and the suction device 12 corresponds to the second block R2. At this time, the suction device 12 of the opposing pickup arm A2 that picks up the wafer 15 from the first block R1 in the previous operating state can place the wafer 15 in a specific position on the second block R2 such as the temporary storage substrate 150. At the same time, the suction device 11 located on the opposite pickup arm A1 can continue to pick up the wafer 15 on the first block R1 such as the blue film 50.

承上所述，於進行排片的過程中，可重複地進行作動狀態M2及M3來實施晶片15的轉移及排列。例如，可依據作動狀態M0、作動狀態M1、作動 狀態M2、作動狀態M3、作動狀態M2、作動狀態M3、作動狀態M2、作動狀態M3.....作動狀態M0這樣的順序進行作業。然而，上述僅為示例，且本發明不限於此。 Based on the above, during the chip arrangement process, the actuation states M2 and M3 can be repeatedly performed to implement the transfer and arrangement of the wafer 15. For example, it can be based on the actuation state M0, actuation state M1, and actuation State M2, actuation state M3, actuation state M2, actuation state M3, actuation state M2, actuation state M3...actuation state M0, the operation is performed in this order. However, the above are only examples, and the present invention is not limited thereto.

在上述作業過程中，在開始之前，可運用上述任一實施例所述之通過透明觀測窗、吸嘴端口及置換式吸嘴之光學觀測路徑先行進行觀測及校準。例如，可依據需求分別例如但不限於在吸取裝置11對應於第一區塊R1、吸取裝置11對應於第二區塊R2、吸取裝置12對應於第一區塊R1、及/或吸取裝置12對應於第二區塊R2之情況之至少之一下利用光學觀測路徑進行校準。在校準完畢後，才開始進行作業。又或是，在作業過程中，只要碰撞到整體設備、經過一定次數或時間作業、更換任一組件如吸嘴、或人為判斷覺得有需要下，即再隨時利用光學觀測路徑再度進行校準。下文中的其他態樣也類似地可依據此原則進行校準，且說明書中將不再贅述此點。 In the above operation process, before starting, the optical observation path through the transparent observation window, the nozzle port and the replacement nozzle described in any of the above embodiments can be used to observe and calibrate first. For example, the suction device 11 corresponds to the first block R1, the suction device 11 corresponds to the second block R2, the suction device 12 corresponds to the first block R1, and/or the suction device 12 according to requirements. The optical observation path is used to perform calibration under at least one of the conditions corresponding to the second block R2. After the calibration is completed, the operation starts. Or, during the operation, as long as it collides with the whole equipment, after a certain number or time of operation, replaces any component such as the suction nozzle, or judges that it is necessary, the optical observation path can be used to recalibrate at any time. The following other aspects can be similarly calibrated according to this principle, and this point will not be repeated in the description.

另外，根據又一實施例，在作動狀態M2後亦可能非接續作動狀態M3而是接續作動狀態M4。詳細而言，連同圖8B參照圖8D，可再將排片機構3000自作動狀態M2轉移至作動狀態M4。例如，根據本實施例，可將排片機構3000整體以順時針繼續旋轉一預設角度θ4如180度，而使拾取臂A1朝向第一區塊R1而對向拾取臂A2朝向第二區塊R2，且吸取裝置11對應於第一區塊R1而吸取裝置12對應於第二區塊R2。此時，於上一作動狀態中自第一區塊R1拾取晶片15之對向拾取臂A2之吸取裝置12可放置晶片15於第二區塊R2如暫存基板150上之特定位置。同時，位於對向之拾取臂A1之吸取裝置11則可繼續拾取第一區塊R1如藍膜50上的晶片15。 In addition, according to another embodiment, after the actuation state M2, the actuation state M3 may not be continued but the actuation state M4 may be continued. In detail, referring to FIG. 8D in conjunction with FIG. 8B, the sheet discharging mechanism 3000 can be further transferred from the actuation state M2 to the actuation state M4. For example, according to this embodiment, the entire sheet discharging mechanism 3000 can be rotated clockwise by a predetermined angle θ4, such as 180 degrees, so that the picking arm A1 faces the first block R1 and the opposing picking arm A2 faces the second block R2. , And the suction device 11 corresponds to the first block R1 and the suction device 12 corresponds to the second block R2. At this time, the suction device 12 of the opposing pickup arm A2 that picks up the wafer 15 from the first block R1 in the previous operating state can place the wafer 15 in a specific position on the second block R2 such as the temporary storage substrate 150. At the same time, the suction device 11 located on the opposite pickup arm A1 can continue to pick up the wafer 15 on the first block R1 such as the blue film 50.

承上所述，於進行排片的過程中，可重複地進行作動狀態M2及M4來實施晶片15的轉移及排列。例如，可依據作動狀態M0、作動狀態M1、作動狀態M2、作動狀態M4、作動狀態M2、作動狀態M4、作動狀態M2、作動狀態M4.....作動狀態M0這樣的順序進行作業。然而，上述僅為示例，且本發明不限於此。 Based on the above, in the process of arranging the chips, the actuation states M2 and M4 can be repeatedly performed to implement the transfer and arrangement of the wafer 15. For example, the work can be performed in the order of the actuation state M0, the actuation state M1, the actuation state M2, the actuation state M4, the actuation state M2, the actuation state M4, the actuation state M2, the actuation state M4, and the actuation state M0. However, the above are only examples, and the present invention is not limited thereto.

如上所述，根據本發明之各實施例，如圖8A至圖8D所示，排片機構3000可來回地或順向地基於軸心基座C每回旋轉預設角度(如預設角度θ2、θ3、θ4)，使得拾取臂A1與對向拾取臂A2各別之吸取裝置11及吸取裝置12分別往復地於第一區塊R1及第二區塊R2之間移動。 As described above, according to various embodiments of the present invention, as shown in FIGS. 8A to 8D, the sheet discharging mechanism 3000 can back and forth or forwardly rotate a predetermined angle (such as a predetermined angle θ2, θ3, θ4), so that the suction device 11 and the suction device 12 of the pickup arm A1 and the opposing pickup arm A2 respectively reciprocate between the first block R1 and the second block R2.

上述示例中，排片完成之第二區塊R2如暫存基板150可接著進行例如但不限於巨量轉移(Mass Transfer)至玻璃基板等製程。然而，本發明不限於此所具體敘述的實施例，且根據本發明之排片機構可應用於各種適用之製程。 In the above example, the second block R2 that has been arranged such as the temporary storage substrate 150 can be followed by processes such as but not limited to Mass Transfer to the glass substrate. However, the present invention is not limited to the specific embodiments described here, and the sheet arrangement mechanism according to the present invention can be applied to various applicable manufacturing processes.

另外，根據其他實施例，上述設置有兩個拾取臂且相對旋轉180度往復移動的態樣僅為示例，且本發明不限於此。舉例而言，參照圖9A及圖9B，排片機構4000可包含軸心基座C及複數個拾取臂如四個拾取臂A1、A2、A3、A4。具體而言，排片機構4000可具有相同或類似於上述各實施例所述之拾取臂A1之結構及配置之四個拾取臂A1、A2、A3、A4。 In addition, according to other embodiments, the above-mentioned configuration in which two pick-up arms are provided and reciprocally moved 180 degrees relative to each other is only an example, and the present invention is not limited to this. For example, referring to FIG. 9A and FIG. 9B, the sheet discharging mechanism 4000 may include a shaft base C and a plurality of picking arms such as four picking arms A1, A2, A3, and A4. Specifically, the sheet discharging mechanism 4000 may have four picking arms A1, A2, A3, and A4 that are the same as or similar to the structure and configuration of the picking arm A1 described in the foregoing embodiments.

承上所述，排片機構4000可具有分別相隔設置之拾取臂A1、A2、A3、A4，且其末端分別設置有吸取裝置11、吸取裝置12、吸取裝置13及吸取裝置14。其中，吸取裝置11至14可分別具有相同或類似於上述任一實施例之吸取裝置之結構及配置。上述複數個拾取臂如四個拾取臂A1、A2、A3、A4基於軸心基座C可分別間隔地環繞該軸心基座C設置，使得吸取裝置11至14可分別環狀地相隔90度而設置，且排片機構4000基於軸心基座C為可旋轉的。藉此，可使分別設置之吸取裝置11至14之位置可變化。 Continuing from the above, the sheet discharging mechanism 4000 may have pickup arms A1, A2, A3, and A4 spaced apart, and the ends of which are provided with a suction device 11, a suction device 12, a suction device 13, and a suction device 14 respectively. Among them, the suction devices 11 to 14 may respectively have the same or similar structure and configuration of the suction device in any of the above-mentioned embodiments. The above-mentioned plural pickup arms, such as the four pickup arms A1, A2, A3, A4, can be arranged around the axis base C at intervals based on the axis base C, so that the suction devices 11 to 14 can be spaced apart by 90 degrees in a ring shape. However, it is provided that the sheet discharging mechanism 4000 is rotatable based on the shaft base C. Thereby, the positions of the suction devices 11 to 14 respectively provided can be changed.

接著，以拾取臂A1及其吸取裝置11為示例，在圖9A中，作動狀態B1可為拾取臂A1自圖9B所示作動狀態B2逆時針旋轉一預設角度θ5如90度之狀態。承上，在此作動狀態B1中，拾取臂A1之吸取裝置11可拾取第一區塊R1上的預定物件。 Next, taking the pickup arm A1 and the suction device 11 as an example, in FIG. 9A, the actuation state B1 may be a state where the pickup arm A1 rotates counterclockwise by a predetermined angle θ5 such as 90 degrees from the actuation state B2 shown in FIG. 9B. In conclusion, in this actuation state B1, the suction device 11 of the picking arm A1 can pick up the predetermined object on the first block R1.

接著，參照圖9B，作動狀態B2可為拾取臂A1自圖9A所示作動狀態B1順時針旋轉一預設角度θ6如90度之狀態。承上，在此作動狀態B2中，拾取臂A1之吸取裝置11可放下並排列預定物件於第二區塊R2上。承上所述，於進行排片的過程中，可重複地進行作動狀態B1及B2來實施作業物件的轉移及排列。另外，所屬技術領域中具有通常知識者應可在參照上述說明下，理解本發明之類似的運用原則，如拾取臂A2、A3或A4各別之作動及運用模式，且在此將不再一一贅述。 Next, referring to FIG. 9B, the actuation state B2 may be a state in which the pickup arm A1 rotates clockwise by a predetermined angle θ6, such as 90 degrees, from the actuation state B1 shown in FIG. 9A. On the other hand, in this actuation state B2, the suction device 11 of the pickup arm A1 can be put down and arranged on the second block R2. Based on the above, in the process of arranging the sheets, the actuation states B1 and B2 can be repeatedly performed to implement the transfer and arrangement of the work objects. In addition, those with ordinary knowledge in the technical field should be able to understand the similar operating principles of the present invention, such as the respective actions and operating modes of the picking arms A2, A3 or A4, by referring to the above description, and will not be described here. A repeat.

如上所述，根據本發明之各實施例，如圖9A及圖9B所示，排片機構4000可來回地或順向地基於軸心基座C每回旋轉預設角度(如預設角度θ5、θ6)，使得複數個拾取臂如四個拾取臂A1至A4之每一個之吸取裝置11、12、13、14分別往復地於不同區塊R1至R4之間移動。 As described above, according to various embodiments of the present invention, as shown in Figs. 9A and 9B, the sheet discharging mechanism 4000 can be rotated back and forth or in the forward direction based on the predetermined angle (such as the predetermined angle θ5, θ6), so that a plurality of pickup arms, such as the suction devices 11, 12, 13, and 14 of each of the four pickup arms A1 to A4, respectively reciprocally move between different blocks R1 to R4.

應注意的是，上述兩個拾取臂及四個拾取臂的態樣皆僅為示例，且根據本發明之其他實施例，亦可配置不同數量及分隔角度的拾取臂。承上，所屬技術領域中具有通常知識者應可明瞭，可依據拾取臂之數目和配置來設計作業過程中之旋轉角度，且在此將不再一一贅述。 It should be noted that the two pickup arms and the four pickup arms described above are only examples, and according to other embodiments of the present invention, different numbers and separation angles of pickup arms may also be configured. In conclusion, those with ordinary knowledge in the relevant technical field should understand that the rotation angle during the operation can be designed according to the number and configuration of the pick-up arms, and will not be repeated here.

綜上所述，根據本發明之各實施例，可提升排片機構作業校準的精確性及方便性，且可減少或避免替換組裝各組件所消耗的時間及成本。因此，根據本發明之排片機構，可改善製程的效率，從而提高量產的穩定性及可靠性。 In summary, according to the various embodiments of the present invention, the accuracy and convenience of the alignment of the sheet arrangement mechanism can be improved, and the time and cost of replacing and assembling various components can be reduced or avoided. Therefore, according to the chip arrangement mechanism of the present invention, the efficiency of the manufacturing process can be improved, thereby increasing the stability and reliability of mass production.

上文中所述僅為本發明之一些較佳實施例。應注意的是，在不脫離本發明之精神與原則下，本發明可進行各種變化及修改。所屬技術領域中具有通常知識者應明瞭的是，本發明由所附申請專利範圍所界定，且在符合本發明之意旨下，各種可能置換、組合、修飾及轉用等變化皆不超出本發明由所附申請專利範圍所界定之範疇。 The above are only some preferred embodiments of the present invention. It should be noted that various changes and modifications can be made to the present invention without departing from the spirit and principle of the present invention. Those with ordinary knowledge in the technical field should understand that the present invention is defined by the scope of the attached patent application, and all possible substitutions, combinations, modifications, and conversions are not beyond the scope of the present invention under the intent of the present invention. The scope defined by the scope of the attached patent application.

10:吸取裝置 10: Suction device

100:主腔體 100: main cavity

110:真空管連接對口 110: Vacuum tube connection counterpart

120:吸嘴端口 120: Nozzle port

200:置換式吸嘴 200: Replacement nozzle

300:透明觀測窗 300: Transparent observation window

1000:排片機構 1000: Film arrangement mechanism

A1:拾取臂 A1: Pickup arm

P1:光學觀測路徑 P1: Optical observation path

Claims (10)

一種排片機構，其包含：一拾取臂，具有一吸取裝置，該吸取裝置包含：一主腔體，其一端設有一真空管連接對口，而另一端設有一吸嘴端口；一置換式吸嘴，係可拆卸地安裝於該吸嘴端口上；及一透明觀測窗，設置於該主腔體上，其中該透明觀測窗與該吸嘴端口及該置換式吸嘴共同形成一光學觀測路徑，且其中該透明觀測窗於該光學觀測路徑未被阻隔的狀況下維持該主腔體的氣密性；其中，該光學觀測路徑不通過該真空管連接對口。 A sheet discharging mechanism, comprising: a pick-up arm with a suction device, the suction device comprising: a main cavity, one end of which is provided with a vacuum tube connection port, and the other end is provided with a suction nozzle port; a replacement suction nozzle, Detachably mounted on the mouthpiece port; and a transparent observation window is arranged on the main cavity, wherein the transparent observation window, the mouthpiece port and the displacement nozzle together form an optical observation path, and wherein The transparent observation window maintains the airtightness of the main cavity under the condition that the optical observation path is not blocked; wherein, the optical observation path is not connected to the opposite port through the vacuum tube. 如請求項1所述之排片機構，其中該真空管連接對口具有一逆鱗結構，該逆鱗結構具有至少二逆鱗節段。 The sheet arrangement mechanism according to claim 1, wherein the connecting port of the vacuum tube has an inverted scale structure, and the inverted scale structure has at least two inverted scale segments. 如請求項2所述之排片機構，其進一步包含一固定環，該固定環供卡固待設置之一真空管於該逆鱗結構之該些逆鱗節段之其中一個上。 The sheet arrangement mechanism according to claim 2, further comprising a fixing ring for clamping and fixing a vacuum tube on one of the inverted scale segments of the inverted scale structure. 如請求項1所述之排片機構，其中該主腔體係形成為一L型主腔體。 The sheet arrangement mechanism according to claim 1, wherein the main cavity system is formed as an L-shaped main cavity. 如請求項1所述之排片機構，其進一步包含一固定夾，該固定夾係用於夾持定位該主腔體，且該主腔體相對於該固定夾為可拆卸的。 The sheet arrangement mechanism according to claim 1, further comprising a fixing clip for clamping and positioning the main cavity, and the main cavity is detachable relative to the fixing clip. 如請求項1所述之排片機構，其中該置換式吸嘴係為一螺紋吸嘴，且該吸嘴端口具有一螺紋結構對應以卡固該螺紋吸嘴。 The sheet discharging mechanism according to claim 1, wherein the replacement suction nozzle is a threaded suction nozzle, and the suction nozzle port has a threaded structure corresponding to the threaded suction nozzle. 如請求項1所述之排片機構，其中該置換式吸嘴係藉由卡扣或磁吸之方式而固定於該吸嘴端口。 The sheet arranging mechanism according to claim 1, wherein the replacement suction nozzle is fixed to the suction nozzle port by means of buckle or magnetic attraction. 如請求項1所述之排片機構，其中該置換式吸嘴係由電木或塑膠所製成。 The sheet discharging mechanism according to claim 1, wherein the displacement suction nozzle is made of bakelite or plastic. 如請求項1所述之排片機構，其進一步包含一軸心基座及一對向拾取臂，該拾取臂與該對向拾取臂基於該軸心基座分別設置於該排片機構之對向兩側，且該排片機構係基於該軸心基座為可旋轉的，其中：該排片機構係來回地或順向地基於該軸心基座每回旋轉一預設角度，使得該拾取臂與該對向拾取臂各別之該吸取裝置分別往復地於一第一區塊及一第二區塊之間移動。 The sheet arranging mechanism according to claim 1, further comprising an axis base and a pair of picking arms, the picking arm and the opposing picking arm are respectively arranged on the opposite two of the sheet arranging mechanism based on the axis base Side, and the arranging mechanism is rotatable based on the axis base, wherein: the arranging mechanism is rotatably based on the axis base every time the axis base rotates back and forth, so that the pickup arm and the The suction devices of the opposing pick-up arms respectively reciprocate between a first block and a second block. 如請求項1所述之排片機構，其進一步包含一軸心基座及複數個該拾取臂，該複數個拾取臂分別間隔地環繞該軸心基座設置，且該排片機構係基於該軸心基座為可旋轉的，其中：該排片機構係來回地或順向地基於該軸心基座每回旋轉一預設角度，使得該複數個拾取臂之每一個之該吸取裝置分別往復地於不同區塊之間移動。 The sheet arrangement mechanism according to claim 1, further comprising an axis base and a plurality of the pick-up arms, the plurality of pick-up arms are respectively arranged around the axis base at intervals, and the sheet arrangement mechanism is based on the axis The base is rotatable, wherein: the sheet-arranging mechanism is based on a predetermined angle each time the shaft base rotates back and forth or in a forward direction, so that the suction device of each of the plurality of pick-up arms is reciprocated at each time Move between different blocks.

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