TW202203363A

TW202203363A - Mapping arrangement mechanism

Info

Publication number: TW202203363A
Application number: TW109122815A
Authority: TW
Inventors: 謝毅勳
Original assignee: 友達光電股份有限公司
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2022-01-16
Also published as: TWI743870B

Abstract

The present invention provides a mapping arrangement mechanism including a pick-up arm having a suction device. The suction device includes a main cavity structure, a replacement suction nozzle, and a transparent observation window provided on the main cavity structure. One end of the main cavity structure is provided with a vacuum tube connecting outlet, and another end of the main cavity structure is provided with a nozzle port. The replacement suction nozzle is detachably installed on the nozzle port. In the mapping arrangement mechanism, the transparent observation window, and the nozzle port and the replacement suction nozzle collectively constitute an optical observation path, and the optical observation path does not pass through the vacuum tube connecting outlet.

Description

排片機構Arrangement mechanism

本發明係關於一種排片機構。具體而言，本發明係關於一種具有透明觀測窗的排片機構。The present invention relates to a film arranging mechanism. Specifically, the present invention relates to a sheet arrangement mechanism with a transparent observation window.

隨著顯示技術的發展，LED、Mini LED、micro LED等晶片於顯示裝置中的應用亦逐漸增加。承上，在配置此些晶片時，往往需要使用吸取裝置來移動或排列晶片。然而，隨著製程次數的增加，移動或排列晶片所用的吸取裝置會自然磨損，而須進行更換。特別是，針對一些作業材料，為了減少或避免刮傷或撞壞材料本體或材料上之精密組件(例如但不限於藍寶石基板上之襯墊(pad)或磊晶等)，又或是吸取裝置可能會直接與精密組件接觸(例如襯墊(pad)或磊晶朝向吸取裝置等)，吸取裝置可使用較柔軟的材質所製成，從而使得吸取裝置更容易損壞或變形失能。如上所述，更換吸取裝置的頻率過高可能會提升製作顯示裝置的成本和時間，從而不利於量產及維持良率。進一步，由於每次更換吸取裝置都須重新校準吸取裝置與預定作業位置，此亦增加了製程作業的時間心力，甚至可能增加校準不準確的風險。特別是，若在校準後另外安裝真空管等來使吸取裝置可進行作業，則亦可能進一步增加安裝過程中碰觸移動整體設備，而導致校準再次失準的可能性。With the development of display technology, the applications of LED, Mini LED, micro LED and other chips in display devices are gradually increasing. On the other hand, when disposing such wafers, it is often necessary to use a suction device to move or arrange the wafers. However, as the number of processes increases, the suction devices used to move or align the wafers naturally wear out and need to be replaced. In particular, for some working materials, in order to reduce or avoid scratches or damage to the material body or precision components on the material (such as but not limited to pads or epitaxy on a sapphire substrate), or a suction device There may be direct contact with precision components (such as pads or epitaxy facing the suction device, etc.), and the suction device can be made of a softer material, so that the suction device is more likely to be damaged or deformed. As mentioned above, the high frequency of replacing the suction device may increase the cost and time of manufacturing the display device, which is not conducive to mass production and maintenance of yield. Further, since the suction device and the predetermined working position must be re-calibrated every time the suction device is replaced, this also increases the time and effort of the process operation, and may even increase the risk of inaccurate calibration. In particular, if a vacuum tube or the like is additionally installed after the calibration to enable the suction device to operate, it may further increase the possibility that the whole device is touched and moved during the installation process, resulting in misalignment of the calibration again.

另外，在運用真空管於移動或排列晶片的過程中，真空管隨著插拔亦容易磨損，而可能產生彈性疲乏甚或漏氣使得作業效率不佳或作業不精準的問題。承上，在真空管未確實固定之情況下，甚至可能產生鬆脫或甩脫的問題。此增加了重新安裝真空管所需的時間及心力，甚至可能意外地於鬆脫或甩脫過程中撞擊或摩擦生產設備或作業物件如晶片等。因此，需要發展能改善上述各種問題的技術或機構。In addition, in the process of using the vacuum tube to move or arrange the wafers, the vacuum tube is easily worn out as it is inserted and pulled out, which may cause elastic fatigue or even air leakage, resulting in poor work efficiency or inaccurate work. On the other hand, if the vacuum tube is not firmly fixed, there may even be a problem of loosening or throwing off. This increases the time and effort required to re-install the vacuum tube, and may even accidentally hit or rub against production equipment or work objects such as wafers during the loosening or flinging process. Therefore, there is a need to develop techniques or mechanisms that can improve the above-mentioned various problems.

解決問題之技術手段technical means to solve problems

為解決上述問題，本發明之一實施例提供一種排片機構，其包含具有吸取裝置之拾取臂。該吸取裝置包含：主腔體、置換式吸嘴、以及設置於該主腔體上之透明觀測窗。主腔體之一端設有一真空管連接對口，而另一端設有一吸嘴端口。置換式吸嘴係可拆卸地安裝於該吸嘴端口上。在該排片機構中，透明觀測窗與吸嘴端口及置換式吸嘴共同形成一光學觀測路徑，且光學觀測路徑不通過真空管連接對口。In order to solve the above problems, an embodiment of the present invention provides a film arranging mechanism, which includes a pick-up arm with a pick-up device. The suction device includes: a main cavity, a replaceable suction nozzle, and a transparent observation window arranged on the main cavity. One end of the main cavity is provided with a vacuum tube connection counterpart, and the other end is provided with a suction nozzle port. A replacement nozzle is removably mounted on the nozzle port. In the film arrangement mechanism, the transparent observation window, the suction nozzle port and the replaceable suction nozzle together form an optical observation path, and the optical observation path is not connected to the counterpart through a vacuum tube.

對照先前技術之功效Efficacy compared to prior art

依據本發明之各實施例所提供之排片機構，可減少或避免頻繁更替吸取裝置所導致之製程時間及成本增加，可減少或避免安裝真空管時所導致之裝置偏移，且可改善校準吸取裝置的準確性及方便性。因此，根據本發明之排片機構，可改善排片機構之操作性、可靠性及產率。The film arrangement mechanism provided according to the various embodiments of the present invention can reduce or avoid the increase in process time and cost caused by frequent replacement of the suction device, can reduce or avoid the device deviation caused by the installation of the vacuum tube, and can improve the calibration of the suction device accuracy and convenience. Therefore, according to the sheet arrangement mechanism of the present invention, the operability, reliability and productivity of the sheet arrangement mechanism can be improved.

下文中將描述各種實施例，且所屬技術領域中具有通常知識者在參照說明搭配圖式下，應可輕易理解本發明之精神與原則。然而，雖然在文中會具體說明一些特定實施例，這些實施例僅作為例示性，且於各方面而言皆非視為限制性或窮盡性意義。因此，對於所屬技術領域中具有通常知識者而言，在不脫離本發明之精神與原則下，對於本發明之各種變化及修改應為顯而易見且可輕易達成的。Various embodiments will be described below, and those skilled in the art should easily understand the spirit and principles of the present invention by referring to the description and the drawings. However, although some specific embodiments are described in detail herein, these embodiments are intended to be illustrative only, and are not to be considered in a limiting or exhaustive sense in all respects. Therefore, various changes and modifications to the present invention should be apparent to and can be easily accomplished by those skilled in the art without departing from the spirit and principles of the present invention.

參照圖1，根據本發明之一實施例之排片機構1000可運用於對晶片進行排片作業。舉例而言，晶片可為LED (尺寸例如約莫250 µm× 250 µm以上)、mini LED (尺寸例如約莫250 µm× 250 µm至50 µm× 100 µm之間)、micro LED (尺寸例如約莫50 µm× 100 µm以下)、或任何具有特殊配置或材質之單位結構。承上，所述排片機構1000包含具有吸取裝置10之拾取臂A1，以藉由吸取裝置10來拾取及設置晶片。具體而言，吸取裝置10包含主腔體100，其一端設有真空管連接對口110 ，而另一端設有吸嘴端口120；置換式吸嘴200，其可拆卸地安裝於吸嘴端口120上；以及透明觀測窗300，設置於主腔體100上。Referring to FIG. 1 , an arrangement mechanism 1000 according to an embodiment of the present invention can be used to arrange wafers. For example, the chip can be LED (for example, the size is about 250 µm × 250 µm or more), mini LED (for example, the size is about 250 µm × 250 µm to 50 µm × 100 µm), micro LED (for example, the size is about 50 µm × 100 µm). 100 µm or less), or any unit structure with special configuration or material. As mentioned above, the chip arrangement mechanism 1000 includes a pick-up arm A1 having a suction device 10 for picking up and setting wafers by the suction device 10 . Specifically, the suction device 10 includes a main cavity 100, one end of which is provided with a vacuum tube connection port 110, and the other end is provided with a suction nozzle port 120; a replaceable suction nozzle 200 is detachably mounted on the suction nozzle port 120; And the transparent observation window 300 is disposed on the main cavity 100 .

承上所述，吸取裝置10之主腔體100可為任何材質所製成且具有空腔於其中的結構體，且具有連通該空腔之位於主腔體100之一端的真空管連接對口110、以及連通該空腔之位於主腔體100之另一端的吸嘴端口120。例如，根據本實施例，主腔體100可形成為L型主腔體100，且真空管連接對口110即位於L型的一端，吸嘴端口120則位於L型的另一端。然而，上述僅為示例，且根據本發明之其他實施例之主腔體100之形狀不限於此。As mentioned above, the main cavity 100 of the suction device 10 can be a structure made of any material and has a cavity therein, and has a vacuum tube connecting counterpart 110, and the suction nozzle port 120 at the other end of the main cavity 100 that communicates with the cavity. For example, according to the present embodiment, the main cavity 100 can be formed as an L-shaped main cavity 100 , and the vacuum tube connection port 110 is located at one end of the L-shaped, and the suction nozzle port 120 is located at the other end of the L-shaped. However, the above is only an example, and the shape of the main cavity 100 according to other embodiments of the present invention is not limited thereto.

根據本實施例，連同圖1參照圖2，真空管連接對口110可用於連接一真空管400，而吸嘴端口120可用於連接置換式吸嘴200。藉此，可利用真空管400對主腔體100之空腔抽取真空，而使另一端之置換式吸嘴200因應環境氣壓而產生吸力，從而可吸取晶片。其中，於設置連接有真空管400於真空管連接對口110下，透明觀測窗300可與吸嘴端口120及置換式吸嘴200共同形成一光學觀測路徑P1，且該光學觀測路徑P1不通過真空管連接對口110。因此，真空管400的設置不會干擾利用光學觀測路徑P1自透明觀測窗300觀測置換式吸嘴口205下的情況。According to this embodiment, referring to FIG. 2 together with FIG. 1 , the vacuum tube connection port 110 can be used to connect a vacuum tube 400 , and the suction nozzle port 120 can be used to connect the replacement suction nozzle 200 . In this way, the vacuum tube 400 can be used to extract the vacuum from the cavity of the main cavity 100, and the displacement suction nozzle 200 at the other end can generate suction according to the ambient air pressure, so that the wafer can be sucked. The transparent observation window 300 can form an optical observation path P1 together with the suction nozzle port 120 and the replaceable suction nozzle 200 when the vacuum pipe 400 is connected to the vacuum pipe connection counterpart 110, and the optical observation path P1 is not connected to the counterpart port through the vacuum pipe. 110. Therefore, the installation of the vacuum tube 400 does not interfere with the observation of the replacement nozzle opening 205 from the transparent observation window 300 using the optical observation path P1.

舉例而言，透明觀測窗300、吸嘴端口120、及置換式吸嘴200可連成一直線，且因此可透過透明觀測窗300觀測通過吸嘴端口120及置換式吸嘴200，而可觀測以對齊或對位預定位置。在此配置下，吸嘴端口120與透明觀測窗300之直線連線不通過真空管連接對口110。然而，本發明不限於此直線式光學觀測路徑P1，且根據其他實施例亦可通過非直線之光學觀測路徑P1來透過透明觀測窗300通過吸嘴端口120及置換式吸嘴200進行觀測，例如可以反射或折射方式來達成之非直線光學觀測路徑。For example, the transparent viewing window 300 , the nozzle port 120 , and the replacement nozzle 200 may be in a straight line, and thus can be viewed through the transparent viewing window 300 through the nozzle port 120 and the replacement nozzle 200 , while the Align or register predetermined positions. In this configuration, the straight line connecting the suction nozzle port 120 and the transparent observation window 300 is not connected to the counterpart port 110 through a vacuum tube. However, the present invention is not limited to the linear optical observation path P1, and according to other embodiments, the non-linear optical observation path P1 can also be used to observe through the transparent observation window 300 through the suction nozzle port 120 and the replaceable suction nozzle 200, for example A non-linear optical observation path that can be achieved by reflection or refraction.

根據一些實施例，置換式吸嘴口205之孔徑可小於待轉移之物件，但本發明不限於此。According to some embodiments, the diameter of the displacement nozzle opening 205 may be smaller than the object to be transferred, but the invention is not limited thereto.

如上所述，根據本實施例，可在真空管400安裝完畢後利用光學觀測路徑P1進行校準。例如，除了肉眼以外，在需要高精密準確度下，可透過任何儀器來觀測校準光學觀測路徑P1。承上，在一實施例中，圖3A及圖3B即為透過CCD (電荷耦合元件) 500通過光學觀測路徑P1所視察的模擬視圖。其中，十字代表的是CCD 500的十字準星，十字準星中心即代表預設的預定位置S，而置換式吸嘴口205則代表穿過光學觀測路徑P1於置換式吸嘴口205透光看出去的孔洞。連同圖2參照圖3A及圖3B，可利用所述光學觀測路徑P1，藉由CCD (電荷耦合元件)500對組裝完成待進行排片作業之排片機構1000進行觀測，並在當置換式吸嘴口205所看出去的位置偏離預定位置S (例如CCD配置預設排片對準位點)時，對整體排片機構1000進行微調。因此，根據本實施例，可藉此改善對於物件進行作業的精準度及可靠性。進一步，由於真空管400已安裝設置完畢，可避免在校準完畢後才安裝真空管400所可能導致之裝置移動和作業預定位置之偏離。As described above, according to the present embodiment, calibration can be performed using the optical observation path P1 after the installation of the vacuum tube 400 is completed. For example, the calibration optical observation path P1 can be observed by any instrument other than the naked eye, where high precision accuracy is required. Continuing from the above, in one embodiment, FIGS. 3A and 3B are simulated views observed through the CCD (Charge Coupled Device) 500 through the optical observation path P1. Among them, the cross represents the crosshair of the CCD 500, the center of the crosshair represents the preset predetermined position S, and the replacement nozzle port 205 represents the optical observation path P1 to see through the replacement nozzle port 205. of holes. Referring to FIGS. 3A and 3B together with FIG. 2 , the optical observation path P1 can be used to observe the assembled film alignment mechanism 1000 to be performed by the CCD (Charge Coupled Device) 500 . When the position seen by 205 deviates from the predetermined position S (for example, the CCD is configured with a preset film alignment position), the overall film alignment mechanism 1000 is fine-tuned. Therefore, according to the present embodiment, the accuracy and reliability of the operation on the object can be improved thereby. Further, since the vacuum tube 400 has already been installed and set, it can avoid the deviation of the device movement and the operation predetermined position which may be caused by installing the vacuum tube 400 after the calibration is completed.

另外，根據本實施例，由於吸嘴是以置換式吸嘴200之形式進行連接組裝，因此當置換式吸嘴200磨損或故障或基於其他理由需要更換時，可無須更換整個吸取裝置10。詳細而言，參照圖2，置換式吸嘴200是實際上與作業物件如晶片進行接觸或互動的結構，且因而較容易磨損、故障或變形。為了維持作業的精準性和順利度，必須要定期或定次數的替換置換式吸嘴200。承上所述，由於置換式吸嘴200可自吸取裝置10單獨地拆卸及重新安裝，因而可減少或避免須自拾取臂A1上替換整個吸取裝置10之過程。因此，可減少重新安裝吸取裝置10(包含但不限於主腔體100)之時間、成本及心力。另外，亦可減少或避免重新安裝吸取裝置10時可能導致的吸取裝置10移動和作業預定位置之偏離。In addition, according to the present embodiment, since the suction nozzles are connected and assembled in the form of replacement suction nozzles 200 , when the replacement suction nozzle 200 is worn or malfunctioned or needs to be replaced for other reasons, it is not necessary to replace the entire suction device 10 . In detail, referring to FIG. 2 , the displaceable nozzle 200 is a structure that actually contacts or interacts with a work object such as a wafer, and thus is more prone to wear, failure or deformation. In order to maintain the accuracy and smoothness of the operation, it is necessary to replace the replacement nozzle 200 regularly or a certain number of times. As mentioned above, since the replaceable suction nozzle 200 can be separately disassembled and re-installed from the suction device 10, the process of replacing the entire suction device 10 from the pickup arm A1 can be reduced or avoided. Therefore, the time, cost and effort for reinstalling the suction device 10 (including but not limited to the main cavity 100 ) can be reduced. In addition, the deviation between the movement of the suction device 10 and the working predetermined position that may be caused when the suction device 10 is reinstalled can also be reduced or avoided.

根據一些實施例，上述置換式吸嘴200可藉由較容易定位的卡扣或較容易置換的磁吸之方式而固定於吸嘴端口120。然而，本發明並不限於此，且根據其他實施例亦可運用任何可拆卸替換置換式吸嘴200之結構或手段。According to some embodiments, the above-mentioned replaceable suction nozzle 200 can be fixed to the suction nozzle port 120 by means of snaps that are easier to locate or magnetic attraction that is easier to replace. However, the present invention is not limited to this, and any structure or means of detachably replacing the replaceable suction nozzle 200 can also be used according to other embodiments.

另外，根據一些實施例，若需要減少或避免對於作業物件的可能傷害，或者增加對較小作業物件的吸取密合度，置換式吸嘴200可由材質較軟的電木或塑膠所製成。然而，本發明並不限於此，且根據製程和對於作業物件互動之間的要求，亦可採取其他任何材質來製作置換式吸嘴200。In addition, according to some embodiments, if it is necessary to reduce or avoid possible damage to the work object, or to increase the suction adhesion to the smaller work object, the replaceable suction nozzle 200 can be made of soft bakelite or plastic. However, the present invention is not limited to this, and any other materials can also be used to manufacture the replaceable suction nozzle 200 according to the requirements between the manufacturing process and the interaction of the operating objects.

接著，請參照圖4，根據本發明之又一實施例之排片機構1000’，拾取臂A1可進一步包含一固定夾600。舉例而言，固定夾600可包含兩個並排配置之臂體，其於臂體延伸之相對兩端點可相互靠近而於相對兩端點之間可相隔一段距離以設置安裝主腔體。上述固定夾600之兩臂體於至少一端點可具有固定螺絲鎖附以卡固安裝於兩臂體之間的主腔體，且吸取裝置10’之主腔體100或100’相對於固定夾600為可拆卸的。具體而言，固定架600可用於夾持定位根據本實施例之主腔體100或主腔體100’，且可拆卸替換。例如，可如圖4所示般鬆脫固定螺絲鬆開雙臂體以取下主腔體100，並設置再以雙臂體夾持定位其他主腔體100’而鎖附固定螺絲來固定雙臂體，或反之亦然。藉此，可在主腔體損壞時輕易替換主腔體(如主腔體100或100’)，或可運用不同的主腔體(如主腔體100或100’)來實施不同置換式吸嘴200或200’的組裝和作業程序。Next, please refer to FIG. 4 , according to the film arrangement mechanism 1000 ′ of another embodiment of the present invention, the pickup arm A1 may further include a fixing clip 600 . For example, the fixing clip 600 may include two arm bodies arranged side by side, and the opposite end points of the arm bodies may be close to each other and separated by a distance between the opposite end points to set the installation main cavity. The two arms of the above-mentioned fixing clip 600 may have fixing screws at at least one end to lock the main cavity installed between the two arms, and the main cavity 100 or 100 ′ of the suction device 10 ′ is opposite to the fixing clip 600 is detachable. Specifically, the fixing bracket 600 can be used for clamping and positioning the main cavity 100 or the main cavity 100' according to the present embodiment, and can be detached and replaced. For example, as shown in FIG. 4 , the double arms can be loosened to remove the main cavity 100 , and then the other main cavity 100 ′ can be clamped and positioned by the double arms, and the set screws can be locked to fix the double arms 100 ′. arm body, or vice versa. In this way, the main cavity (such as the main cavity 100 or 100') can be easily replaced when the main cavity is damaged, or different replacement suction can be implemented by using a different main cavity (such as the main cavity 100 or 100'). Assembly and operating procedures for mouth 200 or 200'.

類似於上述圖2所述之實施例，根據本實施例，在安置主腔體100’下，透明觀測窗300可與吸嘴端口120及置換式吸嘴200’共同形成一光學觀測路徑P1’，且該光學觀測路徑P1’不通過真空管連接對口110。藉此，可透過光學觀測路徑P1’在不被真空管干擾下進行預定的校準程序。Similar to the embodiment described above in FIG. 2 , according to this embodiment, when the main cavity 100 ′ is placed, the transparent observation window 300 can form an optical observation path P1 ′ together with the suction nozzle port 120 and the replaceable suction nozzle 200 ′ , and the optical observation path P1 ′ is not connected to the counterpart 110 through a vacuum tube. Thereby, a predetermined calibration procedure can be performed through the optical observation path P1' without being disturbed by the vacuum tube.

參照圖5，根據本發明之各實施例之排片機構，如圖1及圖2所示之排片機構1000，在連接設置有置換式吸嘴200及安裝好真空管400以提供吸力下，可應用於拾取或配置晶片15，從而可進行移動作業物件或配置排片作業物件的作業程序。然而，上述僅為示例，且根據本發明之各實施例之排片機構可應用之作業程序不限於此。Referring to FIG. 5 , the film arrangement mechanism according to various embodiments of the present invention, such as the film arrangement mechanism 1000 shown in FIG. 1 and FIG. The wafers 15 are picked up or placed, so that a work procedure of moving work objects or placing wafer layout work objects can be performed. However, the above is only an example, and the operation procedures applicable to the film arrangement mechanism according to the embodiments of the present invention are not limited thereto.

接著，參照圖6，將進一步說明根據本發明之一變化實施例之排片機構2000。具體而言，排片機構2000可包含具有吸取裝置20之拾取臂A1，以藉由吸取裝置20來拾取及設置作業物件。承上，吸取裝置20可包含主腔體101，其一端設有真空管連接對口110 ，而另一端設有吸嘴端口120；置換式吸嘴200，其可拆卸地安裝於吸嘴端口120上；以及透明觀測窗300，設置於主腔體101上。另外，類似於上述圖2所述之實施例，根據本實施例，在安置主腔體101下，透明觀測窗300可與吸嘴端口120及置換式吸嘴200共同形成一光學觀測路徑P2，且該光學觀測路徑P2不通過真空管連接對口110。藉此，可透過光學觀測路徑P2在不被真空管400干擾下進行預定的校準程序。Next, referring to FIG. 6 , the sheet arrangement mechanism 2000 according to a variant embodiment of the present invention will be further described. Specifically, the sheet-arranging mechanism 2000 may include a pick-up arm A1 having a suction device 20 , so as to pick up and set the work objects by the suction device 20 . On the other hand, the suction device 20 may include a main cavity 101, one end of which is provided with a vacuum tube connection port 110, and the other end is provided with a suction nozzle port 120; a replaceable suction nozzle 200, which is detachably installed on the suction nozzle port 120; And the transparent observation window 300 is arranged on the main cavity 101 . In addition, similar to the embodiment described above in FIG. 2 , according to this embodiment, when the main cavity 101 is placed, the transparent observation window 300 can form an optical observation path P2 together with the suction nozzle port 120 and the replaceable suction nozzle 200 , And the optical observation path P2 is not connected to the counterpart 110 through a vacuum tube. Thereby, a predetermined calibration procedure can be performed through the optical observation path P2 without being disturbed by the vacuum tube 400 .

排片機構2000可具有類似於上述圖1及圖2所示之排片機構1000之結構和配置，且與上述各實施例相同或類似的結構或配置將不於此詳述而僅簡要地說明或予以省略。The film arranging mechanism 2000 may have a structure and configuration similar to the film arranging mechanism 1000 shown in the above-mentioned FIGS. 1 and 2 , and the same or similar structures or configurations as the above-mentioned embodiments will not be described in detail here, but will only be briefly described or given. Omit.

如上述，排片機構2000與前文所述其他實施例相較，其差異在於其中真空管連接對口110可具有逆鱗結構115，且排片機構2000可進一步包含一固定環115’。具體而言，逆鱗結構115可具有至少二逆鱗節段如逆鱗節段51、52、53，且固定環115’可供卡固待設置之真空管400於逆鱗結構115之該些逆鱗節段51、52、53之其中一個上。藉此，可更穩固地安裝真空管400於真空管連接對口110上，從而減少或避免真空管400因磨損、彈性疲乏或老化等原因導致自真空管連接對口110鬆脫或甩脫。因此，可減少或避免須重新安裝或定位真空管400之程序，且可減少或避免由於真空管400鬆脫或甩脫而導致的作業製程誤差或作業物件及設備損壞。As mentioned above, the difference between the chip arrangement 2000 and the other embodiments described above is that the vacuum tube connecting port 110 may have an inverse scale structure 115, and the film arrangement 2000 may further include a fixing ring 115'. Specifically, the inverse scale structure 115 may have at least two inverse scale segments such as the inverse scale segments 51 , 52 and 53 , and the fixing ring 115 ′ can be used to fasten the vacuum tube 400 to be installed on the inverse scale segments 51 , 53 of the inverse scale structure 115 , On one of 52 and 53. In this way, the vacuum tube 400 can be more stably installed on the vacuum tube connecting port 110, thereby reducing or preventing the vacuum tube 400 from loosening or falling off from the vacuum tube connecting port 110 due to wear, elastic fatigue or aging. Therefore, the procedure of re-installing or positioning the vacuum tube 400 can be reduced or avoided, and the operation process error or the damage of the working objects and equipment caused by the loosening or throwing off of the vacuum tube 400 can be reduced or avoided.

進一步，根據本實施例，排片機構2000可另外與螺紋吸嘴210搭配。具體而言，在此實施例中，排片機構2000之置換式吸嘴200可為螺紋吸嘴210，且主腔體210之吸嘴端口120可具有螺紋結構125對應以卡固螺紋吸嘴210。藉此，可增加置換式吸嘴200的可靠性，並藉由螺紋卡固定位來減少或避免作業過程中可能產生的磨損和偏移。因此，可減少替換置換式吸嘴200的頻率。Further, according to this embodiment, the sheet-arranging mechanism 2000 may be additionally matched with the threaded suction nozzle 210 . Specifically, in this embodiment, the replaceable suction nozzle 200 of the sheet-discharging mechanism 2000 can be a threaded suction nozzle 210 , and the suction nozzle port 120 of the main cavity 210 can have a threaded structure 125 corresponding to the threaded suction nozzle 210 . In this way, the reliability of the replaceable suction nozzle 200 can be increased, and the possible wear and deviation during the operation can be reduced or avoided by fixing the position with the screw. Therefore, the frequency of replacing the replacement nozzle 200 can be reduced.

接著，根據本發明之一實施例，將進一步說明利用排片機構進行排片作業的過程。Next, according to an embodiment of the present invention, the process of using the film arranging mechanism to perform the film arranging operation will be further described.

承上所述，根據一實施例，參照圖7，排片機構3000可進一步包含軸心基座C及對向拾取臂A2。具體而言，排片機構3000可具有相同或類似於上述各實施例所述之拾取臂A1之結構及配置之拾取臂A1及對向拾取臂A2。舉例而言，排片機構3000可具有兩個相對設置之拾取臂A1及A2，且其末端分別設置有吸取裝置11及吸取裝置12。其中，吸取裝置11及吸取裝置12可分別具有相同或類似於上述任一實施例之吸取裝置之結構及配置。承上，上述拾取臂A1與對向拾取臂A2基於軸心基座C可分別設置於排片機構3000之對向兩側，使得吸取裝置11及吸取裝置12可分別設置於對向兩側，且排片機構3000基於軸心基座C為可旋轉的。藉此，可使分別設置於對向兩側之吸取裝置11及吸取裝置12之位置可變化。Based on the above, according to an embodiment, referring to FIG. 7 , the film arranging mechanism 3000 may further include an axis base C and an opposing pick-up arm A2 . Specifically, the sheet arrangement mechanism 3000 may have a pickup arm A1 and an opposite pickup arm A2 that are the same or similar to the structure and configuration of the pickup arm A1 described in the above embodiments. For example, the sheet-arranging mechanism 3000 may have two oppositely arranged pick-up arms A1 and A2, and a suction device 11 and a suction device 12 are respectively provided at the ends thereof. Wherein, the suction device 11 and the suction device 12 can respectively have the same or similar structure and configuration of the suction device in any of the above-mentioned embodiments. On the basis of the above, the above-mentioned pickup arm A1 and the opposite pickup arm A2 can be respectively arranged on the opposite sides of the film arrangement mechanism 3000 based on the axis base C, so that the suction device 11 and the suction device 12 can be respectively arranged on the opposite sides, and The sheet arrangement mechanism 3000 is rotatable based on the shaft base C. Thereby, the positions of the suction devices 11 and 12 respectively disposed on the opposite sides can be changed.

上述排片機構3000可應用於轉移第一區塊R1上的作業物件至第二區塊R2上。舉例而言，如圖7所示，第一區塊R1可為配置有複數個晶片15之藍膜50，且第二區塊R2可為預定照預期陣列排列晶片15之暫存基板150。在此，晶片15可例如但不限於為mini LED。The above-mentioned sheet arrangement mechanism 3000 can be applied to transfer the operation objects on the first block R1 to the second block R2. For example, as shown in FIG. 7 , the first block R1 may be a blue film 50 configured with a plurality of chips 15 , and the second block R2 may be a temporary storage substrate 150 that is predetermined to arrange the chips 15 in a desired array. Here, the chip 15 can be, for example, but not limited to, a mini LED.

在一作動狀態M0下，排片機構3000可位於一起始位置，其中拾取臂A1及對向拾取臂A2皆非設置於第一區塊R1及第二區塊R2上。In an operating state M0, the film arrangement mechanism 3000 can be located at an initial position, wherein neither the pick-up arm A1 nor the opposite pick-up arm A2 is disposed on the first block R1 and the second block R2.

接著，連同圖7參照圖8A，當須進行將第一區塊R1如藍膜50上的晶片15轉移並排列至第二區塊R2如暫存基板150上之作業程序時，可先將排片機構3000自作動狀態M0轉移至作動狀態M1。例如，根據本實施例，可將排片機構3000整體以逆時針旋轉一預設角度θ1如90度，而使拾取臂A1朝向第一區塊R1而對向拾取臂A2朝向第二區塊R2，且吸取裝置11對應於第一區塊R1而吸取裝置12對應於第二區塊R2。此時，拾取臂A1之吸取裝置11拾取第一區塊R1如藍膜50上的晶片15。Next, referring to FIG. 8A together with FIG. 7 , when the operation procedure of transferring and arranging the wafers 15 on the first block R1 such as the blue film 50 to the second block R2 such as the temporary storage substrate 150 needs to be performed, the chips can be arranged first. The mechanism 3000 transitions from the actuation state M0 to the actuation state M1. For example, according to this embodiment, the entire film arrangement mechanism 3000 can be rotated counterclockwise by a predetermined angle θ1 such as 90 degrees, so that the pickup arm A1 faces the first block R1 and the opposing pickup arm A2 faces the second block R2. And the suction device 11 corresponds to the first block R1 and the suction device 12 corresponds to the second block R2. At this time, the suction device 11 of the pickup arm A1 picks up the first block R1 such as the wafer 15 on the blue film 50 .

接著，連同圖8A參照圖8B，可再將排片機構3000自作動狀態M1轉移至作動狀態M2。例如，根據本實施例，可將排片機構3000整體以順時針旋轉一預設角度θ2如180度，而使拾取臂A1朝向第二區塊R2而對向拾取臂A2朝向第一區塊R1，且吸取裝置11對應於第二區塊R2而吸取裝置12對應於第一區塊R1。此時，於上一作動狀態中自第一區塊R1拾取晶片15之拾取臂A1之吸取裝置11可放置晶片15於第二區塊R2如暫存基板150上之特定位置。同時，位於對向之對向拾取臂A2之吸取裝置12則可繼續拾取第一區塊R1如藍膜50上的晶片15。Next, referring to FIG. 8B together with FIG. 8A , the sheet arrangement mechanism 3000 can be transferred from the actuating state M1 to the actuating state M2 again. For example, according to this embodiment, the entire film arrangement mechanism 3000 can be rotated clockwise by a predetermined angle θ2 such as 180 degrees, so that the pickup arm A1 faces the second block R2 and the opposing pickup arm A2 faces the first block R1, And the suction device 11 corresponds to the second block R2 and the suction device 12 corresponds to the first block R1. At this time, the suction device 11 of the pick-up arm A1 that picks up the wafer 15 from the first block R1 in the previous operation state can place the wafer 15 in a specific position on the second block R2 such as the temporary storage substrate 150 . At the same time, the suction device 12 located at the opposite pick-up arm A2 can continue to pick up the first block R1 such as the wafer 15 on the blue film 50 .

接著，連同圖8B參照圖8C，可再將排片機構3000自作動狀態M2轉移至作動狀態M3。例如，根據本實施例，可將排片機構3000整體以逆時針旋轉一預設角度θ3如180度，而使拾取臂A1朝向第一區塊R1而對向拾取臂A2朝向第二區塊R2，且吸取裝置11對應於第一區塊R1而吸取裝置12對應於第二區塊R2。此時，於上一作動狀態中自第一區塊R1拾取晶片15之對向拾取臂A2之吸取裝置12可放置晶片15於第二區塊R2如暫存基板150上之特定位置。同時，位於對向之拾取臂A1之吸取裝置11則可繼續拾取第一區塊R1如藍膜50上的晶片15。Next, referring to FIG. 8C together with FIG. 8B , the film arrangement mechanism 3000 can be transferred from the actuating state M2 to the actuating state M3 again. For example, according to this embodiment, the entire film arrangement mechanism 3000 can be rotated counterclockwise by a predetermined angle θ3 such as 180 degrees, so that the pickup arm A1 faces the first block R1 and the opposing pickup arm A2 faces the second block R2. And the suction device 11 corresponds to the first block R1 and the suction device 12 corresponds to the second block R2. At this time, the suction device 12 of the opposite pick-up arm A2 that picks up the wafer 15 from the first block R1 in the previous operation state can place the wafer 15 on the second block R2 such as a specific position on the temporary storage substrate 150 . At the same time, the suction device 11 located on the opposite pickup arm A1 can continue to pick up the first block R1 such as the wafer 15 on the blue film 50 .

承上所述，於進行排片的過程中，可重複地進行作動狀態M2及M3來實施晶片15的轉移及排列。例如，可依據作動狀態M0、作動狀態M1、作動狀態M2、作動狀態M3、作動狀態M2、作動狀態M3、作動狀態M2、作動狀態M3….. 作動狀態M0這樣的順序進行作業。然而，上述僅為示例，且本發明不限於此。Based on the above, in the process of arranging the wafers, the operation states M2 and M3 can be repeatedly performed to implement the transfer and arrangement of the wafers 15 . For example, the operation can be performed in the order of operation state M0, operation state M1, operation state M2, operation state M3, operation state M2, operation state M3, operation state M2, operation state M3 . . . operation state M0. However, the above are only examples, and the present invention is not limited thereto.

在上述作業過程中，在開始之前，可運用上述任一實施例所述之通過透明觀測窗、吸嘴端口及置換式吸嘴之光學觀測路徑先行進行觀測及校準。例如，可依據需求分別例如但不限於在吸取裝置11對應於第一區塊R1、吸取裝置11對應於第二區塊R2、吸取裝置12對應於第一區塊R1、及/或吸取裝置12對應於第二區塊R2之情況之至少之一下利用光學觀測路徑進行校準。在校準完畢後，才開始進行作業。又或是，在作業過程中，只要碰撞到整體設備、經過一定次數或時間作業、更換任一組件如吸嘴、或人為判斷覺得有需要下，即再隨時利用光學觀測路徑再度進行校準。下文中的其他態樣也類似地可依據此原則進行校準，且說明書中將不再贅述此點。In the above operation process, before starting, the optical observation path through the transparent observation window, the suction nozzle port and the replaceable suction nozzle described in any of the above embodiments can be used to perform observation and calibration. For example, the suction device 11 corresponds to the first block R1, the suction device 11 corresponds to the second block R2, the suction device 12 corresponds to the first block R1, and/or the suction device 12, respectively, according to requirements. Calibration is performed using the optical observation path in at least one of the cases corresponding to the second block R2. After the calibration is completed, the work begins. Or, in the process of operation, as long as the entire equipment is collided, a certain number of times or time has passed, any component such as a suction nozzle is replaced, or human judgment feels necessary, the optical observation path can be used to calibrate again at any time. Other aspects hereinafter can be similarly calibrated according to this principle, and this point will not be repeated in the description.

另外，根據又一實施例，在作動狀態M2後亦可能非接續作動狀態M3而是接續作動狀態M4。詳細而言，連同圖8B參照圖8D，可再將排片機構3000自作動狀態M2轉移至作動狀態M4。例如，根據本實施例，可將排片機構3000整體以順時針繼續旋轉一預設角度θ4如180度，而使拾取臂A1朝向第一區塊R1而對向拾取臂A2朝向第二區塊R2，且吸取裝置11對應於第一區塊R1而吸取裝置12對應於第二區塊R2。此時，於上一作動狀態中自第一區塊R1拾取晶片15之對向拾取臂A2之吸取裝置12可放置晶片15於第二區塊R2如暫存基板150上之特定位置。同時，位於對向之拾取臂A1之吸取裝置11則可繼續拾取第一區塊R1如藍膜50上的晶片15。In addition, according to yet another embodiment, after the actuation state M2, the actuation state M3 may be followed instead of the actuation state M4. In detail, referring to FIG. 8D together with FIG. 8B , the sheet arrangement mechanism 3000 can be transferred from the actuating state M2 to the actuating state M4 again. For example, according to this embodiment, the entire film arrangement mechanism 3000 can be rotated clockwise by a predetermined angle θ4 such as 180 degrees, so that the pickup arm A1 faces the first block R1 and the opposing pickup arm A2 faces the second block R2 , and the suction device 11 corresponds to the first block R1 and the suction device 12 corresponds to the second block R2. At this time, the suction device 12 of the opposite pick-up arm A2 that picks up the wafer 15 from the first block R1 in the previous operation state can place the wafer 15 on the second block R2 such as a specific position on the temporary storage substrate 150 . At the same time, the suction device 11 located on the opposite pickup arm A1 can continue to pick up the first block R1 such as the wafer 15 on the blue film 50 .

承上所述，於進行排片的過程中，可重複地進行作動狀態M2及M4來實施晶片15的轉移及排列。例如，可依據作動狀態M0、作動狀態M1、作動狀態M2、作動狀態M4、作動狀態M2、作動狀態M4、作動狀態M2、作動狀態M4….. 作動狀態M0這樣的順序進行作業。然而，上述僅為示例，且本發明不限於此。As mentioned above, in the process of arranging the wafers, the operation states M2 and M4 can be repeatedly performed to implement the transfer and arrangement of the wafers 15 . For example, operation can be performed in the order of operation state M0, operation state M1, operation state M2, operation state M4, operation state M2, operation state M4, operation state M2, operation state M4 . . . operation state M0. However, the above are only examples, and the present invention is not limited thereto.

如上所述，根據本發明之各實施例，如圖8A至圖8D所示，排片機構3000可來回地或順向地基於軸心基座C每回旋轉預設角度(如預設角度θ2、θ3、θ4)，使得拾取臂A1與對向拾取臂A2各別之吸取裝置11及吸取裝置12分別往復地於第一區塊R1及第二區塊R2之間移動。As described above, according to various embodiments of the present invention, as shown in FIG. 8A to FIG. 8D , the film arrangement mechanism 3000 can rotate back and forth or in a forward direction based on each rotation of the axis base C by a predetermined angle (such as the predetermined angle θ2, θ3, θ4), so that the respective suction devices 11 and 12 of the pickup arm A1 and the opposite pickup arm A2 reciprocate between the first block R1 and the second block R2, respectively.

上述示例中，排片完成之第二區塊R2如暫存基板150可接著進行例如但不限於巨量轉移(Mass Transfer)至玻璃基板等製程。然而，本發明不限於此所具體敘述的實施例，且根據本發明之排片機構可應用於各種適用之製程。In the above-mentioned example, the second block R2 after chip arrangement, such as the temporary storage substrate 150 , may then undergo a process such as but not limited to mass transfer to a glass substrate. However, the present invention is not limited to the specifically described embodiments, and the chip arrangement mechanism according to the present invention can be applied to various applicable processes.

另外，根據其他實施例，上述設置有兩個拾取臂且相對旋轉180度往復移動的態樣僅為示例，且本發明不限於此。舉例而言，參照圖9A及圖9B，排片機構4000可包含軸心基座C及複數個拾取臂如四個拾取臂A1、A2、A3、A4。具體而言，排片機構4000可具有相同或類似於上述各實施例所述之拾取臂A1之結構及配置之四個拾取臂A1、A2、A3、A4。In addition, according to other embodiments, the above-mentioned aspect in which two pick-up arms are provided and are rotated 180 degrees relative to each other and moves back and forth is only an example, and the present invention is not limited thereto. For example, referring to FIG. 9A and FIG. 9B , the film arrangement mechanism 4000 may include an axis base C and a plurality of pick-up arms such as four pick-up arms A1 , A2 , A3 , and A4 . Specifically, the sheet arrangement mechanism 4000 may have four pickup arms A1 , A2 , A3 , and A4 that are the same or similar to the structure and configuration of the pickup arm A1 described in the above embodiments.

承上所述，排片機構4000可具有分別相隔設置之拾取臂A1、A2、A3、A4，且其末端分別設置有吸取裝置11、吸取裝置12、吸取裝置13及吸取裝置14。其中，吸取裝置11至14可分別具有相同或類似於上述任一實施例之吸取裝置之結構及配置。上述複數個拾取臂如四個拾取臂A1、A2、A3、A4基於軸心基座C可分別間隔地環繞該軸心基座C設置，使得吸取裝置11至14可分別環狀地相隔90度而設置，且排片機構4000基於軸心基座C為可旋轉的。藉此，可使分別設置之吸取裝置11至14之位置可變化。As mentioned above, the sheet-arranging mechanism 4000 may have pick-up arms A1, A2, A3, A4 arranged at intervals, and a suction device 11, a suction device 12, a suction device 13, and a suction device 14 are respectively provided at the ends thereof. Wherein, the suction devices 11 to 14 can respectively have the same or similar structure and configuration of the suction devices in any of the above-mentioned embodiments. The above-mentioned plurality of pick-up arms, such as four pick-up arms A1, A2, A3, A4, can be arranged around the axis base C at intervals based on the axis base C, so that the suction devices 11 to 14 can be respectively annularly separated by 90 degrees. However, the film arrangement mechanism 4000 is rotatable based on the axis base C. Thereby, the positions of the suction devices 11 to 14 provided respectively can be changed.

接著，以拾取臂A1及其吸取裝置11為示例，在圖9A中，作動狀態B1可為拾取臂A1自圖9B所示作動狀態B2逆時針旋轉一預設角度θ5如90度之狀態。承上，在此作動狀態B1中，拾取臂A1之吸取裝置11可拾取第一區塊R1上的預定物件。Next, taking the pickup arm A1 and its suction device 11 as an example, in FIG. 9A , the actuation state B1 may be a state in which the pickup arm A1 rotates counterclockwise by a predetermined angle θ5 such as 90 degrees from the actuation state B2 shown in FIG. 9B . As mentioned above, in this actuation state B1, the suction device 11 of the pick-up arm A1 can pick up the predetermined object on the first block R1.

接著，參照圖9B，作動狀態B2可為拾取臂A1自圖9A所示作動狀態B1順時針旋轉一預設角度θ6如90度之狀態。承上，在此作動狀態B2中，拾取臂A1之吸取裝置11可放下並排列預定物件於第二區塊R2上。承上所述，於進行排片的過程中，可重複地進行作動狀態B1及B2來實施作業物件的轉移及排列。另外，所屬技術領域中具有通常知識者應可在參照上述說明下，理解本發明之類似的運用原則，如拾取臂A2、A3或A4各別之作動及運用模式，且在此將不再一一贅述。Next, referring to FIG. 9B , the actuating state B2 may be a state in which the pickup arm A1 is rotated clockwise by a predetermined angle θ6 such as 90 degrees from the actuating state B1 shown in FIG. 9A . On the other hand, in this operating state B2, the suction device 11 of the pick-up arm A1 can put down and arrange the predetermined objects on the second block R2. As mentioned above, in the process of arranging the sheets, the operation states B1 and B2 can be repeatedly performed to implement the transfer and arrangement of the work objects. In addition, those with ordinary knowledge in the technical field should be able to understand the similar application principles of the present invention, such as the respective operation and operation modes of the pickup arms A2, A3 or A4, with reference to the above description, and will not be described herein again. One more elaboration.

如上所述，根據本發明之各實施例，如圖9A及圖9B所示，排片機構4000可來回地或順向地基於軸心基座C每回旋轉預設角度(如預設角度θ5、θ6)，使得複數個拾取臂如四個拾取臂A1至A4之每一個之吸取裝置11、12、13、14分別往復地於不同區塊R1至R4之間移動。As described above, according to various embodiments of the present invention, as shown in FIG. 9A and FIG. 9B , the film arranging mechanism 4000 can rotate back and forth or in a forward direction based on each rotation of the axis base C by a predetermined angle (eg, the predetermined angle θ5, θ6), so that the suction devices 11, 12, 13, and 14 of each of the plurality of pick-up arms, such as the four pick-up arms A1 to A4, move reciprocally between different blocks R1 to R4, respectively.

應注意的是，上述兩個拾取臂及四個拾取臂的態樣皆僅為示例，且根據本發明之其他實施例，亦可配置不同數量及分隔角度的拾取臂。承上，所屬技術領域中具有通常知識者應可明瞭，可依據拾取臂之數目和配置來設計作業過程中之旋轉角度，且在此將不再一一贅述。It should be noted that the above-mentioned two pick-up arms and four pick-up arms are only examples, and according to other embodiments of the present invention, different numbers and separation angles of pick-up arms can also be configured. As mentioned above, it should be clear to those with ordinary knowledge in the technical field that the rotation angle during the operation can be designed according to the number and configuration of the pick-up arms, which will not be repeated here.

綜上所述，根據本發明之各實施例，可提升排片機構作業校準的精確性及方便性，且可減少或避免替換組裝各組件所消耗的時間及成本。因此，根據本發明之排片機構，可改善製程的效率，從而提高量產的穩定性及可靠性。To sum up, according to the various embodiments of the present invention, the accuracy and convenience of the operation and calibration of the sheet arrangement mechanism can be improved, and the time and cost of replacing and assembling each component can be reduced or avoided. Therefore, according to the chip arrangement mechanism of the present invention, the efficiency of the process can be improved, thereby improving the stability and reliability of mass production.

上文中所述僅為本發明之一些較佳實施例。應注意的是，在不脫離本發明之精神與原則下，本發明可進行各種變化及修改。所屬技術領域中具有通常知識者應明瞭的是，本發明由所附申請專利範圍所界定，且在符合本發明之意旨下，各種可能置換、組合、修飾及轉用等變化皆不超出本發明由所附申請專利範圍所界定之範疇。The foregoing descriptions are only some preferred embodiments of the present invention. It should be noted that various changes and modifications can be made in the present invention without departing from the spirit and principles of the invention. Those with ordinary knowledge in the technical field should understand that the present invention is defined by the scope of the appended patent application, and under the meaning of the present invention, various possible changes such as substitution, combination, modification and diversion are within the scope of the present invention. The scope is defined by the attached scope of the patent application.

10、10’、20、11、12、13、14:吸取裝置 15:晶片 50:藍膜 51、52、53:逆鱗節段 100、100’、101:主腔體 110:真空管連接對口 115:逆鱗結構 115’:固定環 120:吸嘴端口 125:螺紋結構 150:暫存基板 200、200’:置換式吸嘴 205:置換式吸嘴口 210:螺紋吸嘴 300:透明觀測窗 400:真空管 500:CCD 600:固定夾 1000、1000’、2000、3000、4000:排片機構 A1、A2、A3、A4:拾取臂 S:預定位置 P1、P1’、P2:光學觀測路徑 C:軸心基座 M0、M1、M2、M3、M4、B1、B2:作動狀態 θ1、θ2、θ3、θ4、θ5、θ6:預設角度 R1、R2:區塊10, 10', 20, 11, 12, 13, 14: suction device 15: Wafer 50: blue film 51, 52, 53: Inverse squamous segment 100, 100', 101: main cavity 110: vacuum tube connection counterpart 115: Inverse scale structure 115': retaining ring 120: nozzle port 125: Thread structure 150: Temporary substrate 200, 200': Replacement nozzle 205: Replacement nozzle mouth 210: Threaded nozzle 300: Transparent observation window 400: Vacuum Tube 500:CCD 600: Fixing clip 1000, 1000’, 2000, 3000, 4000: film arrangement mechanism A1, A2, A3, A4: Pickup Arm S: Predetermined location P1, P1', P2: Optical observation path C: Axle base M0, M1, M2, M3, M4, B1, B2: Actuation status θ1, θ2, θ3, θ4, θ5, θ6: preset angles R1, R2: block

圖1係為根據本發明之一實施例之排片機構之示意圖。FIG. 1 is a schematic diagram of a film arranging mechanism according to an embodiment of the present invention.

圖2係為圖1所示之排片機構連接上真空管及置換式吸嘴之示意圖。FIG. 2 is a schematic view of the film arrangement mechanism shown in FIG. 1 connected to a vacuum tube and a replaceable suction nozzle.

圖3A及圖3B係為根據本發明之一實施例之排片機構利用CCD進行校準之示意圖。FIG. 3A and FIG. 3B are schematic diagrams of the alignment mechanism using CCD for calibration according to an embodiment of the present invention.

圖4係為根據本發明之一實施例之排片機構拆卸更換主腔體之示意圖。FIG. 4 is a schematic diagram of disassembling and replacing the main cavity of the sheet arrangement mechanism according to an embodiment of the present invention.

圖5係為根據本發明之一實施例之利用排片機構拾取設置晶片之示意圖。FIG. 5 is a schematic diagram of picking up and setting wafers by a wafer arrangement mechanism according to an embodiment of the present invention.

圖6係為根據本發明之一實施例之排片機構之示意圖。FIG. 6 is a schematic diagram of a film arranging mechanism according to an embodiment of the present invention.

圖7係為根據本發明之一實施例之具有兩個拾取臂之排片機構之示意圖。FIG. 7 is a schematic diagram of a film arranging mechanism with two pickup arms according to an embodiment of the present invention.

圖8A至圖8D係為根據本發明之各實施例以排片機構進行排片之作動示意圖。8A to FIG. 8D are schematic diagrams illustrating the operation of the film arranging mechanism for arranging films according to various embodiments of the present invention.

圖9A及圖9B係為根據本發明之一實施例以具有四個拾取臂之排片機構進行排片之作動示意圖。9A and FIG. 9B are schematic diagrams illustrating the operation of a film arranging mechanism having four pickup arms for arranging films according to an embodiment of the present invention.

無without

10:吸取裝置10: suction device

100:主腔體100: main cavity

110:真空管連接對口110: vacuum tube connection counterpart

120:吸嘴端口120: nozzle port

200:置換式吸嘴200: Replacement nozzle

300:透明觀測窗300: Transparent observation window

1000:排片機構1000: Arrangement mechanism

A1:拾取臂A1: Pickup Arm

P1:光學觀測路徑P1: Optical observation path

Claims

一種排片機構，其包含：一拾取臂，具有一吸取裝置，該吸取裝置包含：一主腔體，其一端設有一真空管連接對口，而另一端設有一吸嘴端口；一置換式吸嘴，係可拆卸地安裝於該吸嘴端口上；及一透明觀測窗，設置於該主腔體上，其中該透明觀測窗與該吸嘴端口及該置換式吸嘴共同形成一光學觀測路徑；其中，該光學觀測路徑不通過該真空管連接對口。A film arranging mechanism, comprising: A pick-up arm, having a suction device, the suction device includes: a main cavity, one end of which is provided with a vacuum tube connection counterpart, and the other end is provided with a suction nozzle port; a replaceable nozzle removably mounted on the nozzle port; and a transparent observation window disposed on the main cavity, wherein the transparent observation window forms an optical observation path together with the suction nozzle port and the replaceable suction nozzle; Wherein, the optical observation path is not connected to the counterpart through the vacuum tube.

如請求項1所述之排片機構，其中該真空管連接對口具有一逆鱗結構，該逆鱗結構具有至少二逆鱗節段。The sheet-arranging mechanism of claim 1, wherein the vacuum tube connection counterpart has an inverse scale structure, and the inverse scale structure has at least two inverse scale segments.

如請求項2所述之排片機構，其進一步包含一固定環，該固定環供卡固待設置之一真空管於該逆鱗結構之該些逆鱗節段之其中一個上。The sheet arrangement mechanism of claim 2, further comprising a fixing ring for clamping a vacuum tube to be installed on one of the inverse scale segments of the inverse scale structure.

如請求項1所述之排片機構，其中該主腔體係形成為一L型主腔體。The sheet arrangement mechanism according to claim 1, wherein the main cavity system is formed as an L-shaped main cavity.

如請求項1所述之排片機構，其進一步包含一固定夾，該固定夾係用於夾持定位該主腔體，且該主腔體相對於該固定夾為可拆卸的。The sheet arrangement mechanism according to claim 1, further comprising a fixing clip, the fixing clip is used for clamping and positioning the main cavity, and the main cavity is detachable relative to the fixing clip.

如請求項1所述之排片機構，其中該置換式吸嘴係為一螺紋吸嘴，且該吸嘴端口具有一螺紋結構對應以卡固該螺紋吸嘴。The chip arrangement mechanism of claim 1, wherein the replaceable suction nozzle is a threaded suction nozzle, and the suction nozzle port has a threaded structure corresponding to the threaded suction nozzle.

如請求項1所述之排片機構，其中該置換式吸嘴係藉由卡扣或磁吸之方式而固定於該吸嘴端口。The sheet-arranging mechanism of claim 1, wherein the replaceable suction nozzle is fixed to the suction nozzle port by means of snaps or magnetic attraction.

如請求項1所述之排片機構，其中該置換式吸嘴係由電木或塑膠所製成。The film arrangement mechanism of claim 1, wherein the replaceable suction nozzle is made of bakelite or plastic.

如請求項1所述之排片機構，其進一步包含一軸心基座及一對向拾取臂，該拾取臂與該對向拾取臂基於該軸心基座分別設置於該排片機構之對向兩側，且該排片機構係基於該軸心基座為可旋轉的，其中：該排片機構係來回地或順向地基於該軸心基座每回旋轉一預設角度，使得該拾取臂與該對向拾取臂各別之該吸取裝置分別往復地於一第一區塊及一第二區塊之間移動。The film arrangement mechanism according to claim 1, further comprising an axis base and a pair of opposing pick-up arms, the pickup arm and the opposing pickup arm are respectively disposed on two opposite sides of the film arrangement mechanism based on the axis base. side, and the film arrangement is rotatable based on the shaft base, wherein: The film arrangement mechanism is based on the rotation of the axis base by a preset angle each time back and forth or in a forward direction, so that the respective suction devices of the pick-up arm and the opposite pick-up arm reciprocate in a first block and Move between a second block.

如請求項1所述之排片機構，其進一步包含一軸心基座及複數個該拾取臂，該複數個拾取臂分別間隔地環繞該軸心基座設置，且該排片機構係基於該軸心基座為可旋轉的，其中：該排片機構係來回地或順向地基於該軸心基座每回旋轉一預設角度，使得該複數個拾取臂之每一個之該吸取裝置分別往復地於不同區塊之間移動。The film arrangement mechanism according to claim 1, further comprising an axis base and a plurality of the pickup arms, the plurality of pickup arms are respectively arranged around the axis base at intervals, and the film arrangement mechanism is based on the axis The base is rotatable, where: The film arranging mechanism is based on the rotation of the axis base by a predetermined angle each time back and forth or in a forward direction, so that the suction device of each of the plurality of pick-up arms reciprocally moves between different blocks respectively.