TWI736381B - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Resin molding apparatus and resin molded product manufacturing method Download PDF

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TWI736381B
TWI736381B TW109126031A TW109126031A TWI736381B TW I736381 B TWI736381 B TW I736381B TW 109126031 A TW109126031 A TW 109126031A TW 109126031 A TW109126031 A TW 109126031A TW I736381 B TWI736381 B TW I736381B
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resin
sheet
adsorption
molding
molding die
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TW109126031A
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Chinese (zh)
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TW202106485A (en
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中尾聡
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/20—Opening, closing or clamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3411—Feeding the material to the mould or the compression means using carrying means mounted onto arms, e.g. grippers, fingers, clamping frame, suction means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B29C2043/562—Compression moulding under special conditions, e.g. vacuum under vacuum conditions combined with isostatic pressure, e.g. pressurising fluids, gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B29L2007/002—Panels; Plates; Sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The present invention suppresses bending, wrinkling, or breakage of a sheet-shaped resin and supplies the sheet-shaped resin to a molding die includes: a first molding die 15 and a second molding die 16 that face each other; a mold clamping mechanism 17, which clamps the first molding die 15 and the second molding die 16; and a resin-supply mechanism 2, which supplies a sheet-shaped resin J to the first molding die 15 or the second molding die 16; and the resin-supply mechanism 2 including a adsorption member 31 formed with adsorption holes 311 that adsorb the other surface of the sheet-shaped resin J having a protective film PF on one surface.

Description

樹脂成形裝置及樹脂成形品的製造方法Resin molding device and manufacturing method of resin molded product

本發明有關於一種樹脂成形裝置及樹脂成形品的製造方法。The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

作為現有的樹脂成形裝置，如專利文獻1所示，考慮使用片狀樹脂來進行樹脂成形。As a conventional resin molding apparatus, as shown in Patent Document 1, it is considered to perform resin molding using a sheet-shaped resin.

此樹脂成形裝置構成為：將預先根據包裝而進行了最佳計量切割的多個片狀樹脂一併搬入至設置於下模的多個模腔中，藉由使用片狀樹脂來作為樹脂材料，而提高計量精度，實現向各模腔中的樹脂供給量的均勻化。 [現有技術文獻]This resin molding device is configured to carry a plurality of sheet-shaped resins that have been optimally metered and cut according to the packaging in advance into a plurality of cavities provided in the lower mold, and by using the sheet-shaped resin as the resin material, The measurement accuracy is improved, and the amount of resin supplied to each cavity is made uniform. [Prior Art Literature]

[專利文獻] [專利文獻1]日本專利特開2003-133350號公報[Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2003-133350

[發明所要解決的問題] 然而，對於片狀樹脂，在其單面或兩面設置有保護膜，必須在供給至下模等成形模之前從片狀樹脂上剝離保護膜。片狀樹脂由於軟且脆而無法維持形狀，故而將保護膜剝離時或者剝離後，片狀樹脂容易彎折、起皺、破損。特別是作為成型對象物的基板或晶圓越大型，則片狀樹脂越大，因此這些問題越顯著。因此，難以將剝離了保護膜的片狀樹脂以適當的狀態供給至成形模，其結果為，成為成形不良的原因。[The problem to be solved by the invention] However, a sheet-like resin is provided with a protective film on one or both sides, and the protective film must be peeled off from the sheet-like resin before being supplied to a molding die such as a lower mold. The sheet-like resin is soft and brittle and cannot maintain its shape. Therefore, when or after the protective film is peeled off, the sheet-like resin is likely to bend, wrinkle, and break. In particular, the larger the substrate or wafer as a molding target, the larger the sheet-like resin, and therefore these problems become more prominent. Therefore, it is difficult to supply the sheet-like resin from which the protective film is peeled to the molding die in an appropriate state, and as a result, it becomes a cause of molding failure.

因此，本發明是為了解決所述問題點而形成，主要課題為抑制片狀樹脂的彎折或褶皺或者破損而將片狀樹脂供給至成形模。Therefore, the present invention was formed in order to solve the above-mentioned problems, and the main problem is to suppress the bending, wrinkles, or breakage of the sheet-shaped resin and supply the sheet-shaped resin to the molding die.

[解決問題的技術手段] 即，本發明的樹脂成形裝置的特徵在於包括：彼此相向的第一成形模及第二成形模；合模機構，將所述第一成形模及所述第二成形模合模；以及樹脂供給機構，將片狀樹脂供給至所述第一成形模或所述第二成形模；並且所述樹脂供給機構包括吸附構件，所述吸附構件形成有對在其中一面設置有保護膜的所述片狀樹脂的另一面加以吸附的吸附孔。[Technical means to solve the problem] That is, the resin molding apparatus of the present invention is characterized by including: a first molding die and a second molding die facing each other; a mold clamping mechanism that closes the first molding die and the second molding die; and a resin supply Mechanism for supplying a sheet-shaped resin to the first molding die or the second molding die; and the resin supply mechanism includes an adsorption member formed with a pair of the sheet provided with a protective film on one side The other side of the shaped resin is adsorbed by the adsorption hole.

[發明的效果] 根據本發明，能夠抑制片狀樹脂的彎折或褶皺或者破損，將片狀樹脂供給至成形模。[Effects of the invention] According to the present invention, bending, wrinkles, or breakage of the sheet-shaped resin can be suppressed, and the sheet-shaped resin can be supplied to the molding die.

其次，對本發明，舉例來進一步詳細說明。但，本發明不受以下說明所限定。Next, the present invention will be described in further detail with examples. However, the present invention is not limited by the following description.

本發明的樹脂成形裝置如上所述，其特徵在於包括：彼此相向的第一成形模及第二成形模；合模機構，將所述第一成形模及所述第二成形模合模；以及樹脂供給機構，將片狀樹脂供給至所述第一成形模或所述第二成形模；並且所述樹脂供給機構包括吸附構件，所述吸附構件形成有對在其中一面設置有保護膜的所述片狀樹脂的另一面加以吸附的吸附孔。As described above, the resin molding apparatus of the present invention is characterized by including: a first molding die and a second molding die facing each other; a mold clamping mechanism that closes the first molding die and the second molding die; and A resin supply mechanism that supplies sheet-shaped resin to the first molding die or the second molding die; and the resin supply mechanism includes an adsorption member formed with a protective film on one side The other side of the sheet-shaped resin is adsorbed by the adsorption hole.

若為以所述方式構成的樹脂成形裝置，則能夠以使在其中一面設置有保護膜的片狀樹脂的另一面吸附於吸附構件的狀態，從片狀樹脂上剝離保護膜，因此在將保護膜剝離時或者剝離後能夠維持片狀樹脂的形狀。由此，抑制片狀樹脂的彎折或褶皺或者破損，能夠將片狀樹脂供給至成形模。其結果為，能夠減少使用片狀樹脂的樹脂成形的成形不良。 此外，由於使用片狀樹脂來作為樹脂材料，故而與使用液狀樹脂或顆粒狀樹脂的情況相比，能夠使樹脂材料對成形模內的供給量均勻化，還能夠對應欲使樹脂成形品變薄等要求。If it is a resin molding device constructed as described above, it is possible to peel off the protective film from the sheet-shaped resin in a state where the other side of the sheet-shaped resin provided with a protective film on one side is adsorbed to the adsorption member, so that the protection The shape of the sheet-like resin can be maintained during or after the film is peeled off. Thereby, bending, wrinkles, or breakage of the sheet-shaped resin can be suppressed, and the sheet-shaped resin can be supplied to the molding die. As a result, it is possible to reduce molding defects in resin molding using sheet resin. In addition, since sheet-like resin is used as the resin material, compared with the case of using liquid resin or granular resin, the amount of resin material supplied to the mold can be made uniform, and it can also respond to changes in resin molded products. Thin and other requirements.

為了使片狀樹脂確實地吸附於吸附構件，理想的是在所述吸附構件的形成有所述吸附孔的表面形成有多個凹凸。 若為此構成，則能夠利用多個凹凸，在吸附構件與片狀樹脂之間形成間隙，從此間隙中也藉由吸附孔來抽吸空氣。其結果為，片狀樹脂不僅從吸附孔吸附，也從凹部吸附，片狀樹脂的受壓面積增大，能夠使片狀樹脂確實地吸附於吸附構件。另外，由於片狀樹脂所受到的壓力分散化，故而能夠減少片狀樹脂的變形或破損，而且能夠抑制片狀樹脂進入吸附孔中而難以剝離的不良情況。In order to ensure that the sheet-shaped resin is adsorbed to the adsorption member, it is desirable that a plurality of irregularities are formed on the surface of the adsorption member on which the adsorption holes are formed. According to this configuration, a plurality of irregularities can be used to form a gap between the suction member and the sheet-shaped resin, and air can also be sucked through the suction hole from this gap. As a result, the sheet-like resin is adsorbed not only from the adsorption hole but also from the recessed portion, the pressure-receiving area of the sheet-like resin is increased, and the sheet-like resin can be reliably adsorbed to the adsorption member. In addition, since the pressure received by the sheet-like resin is dispersed, it is possible to reduce the deformation or breakage of the sheet-like resin, and it is possible to prevent the sheet-like resin from entering the suction holes and being difficult to peel off.

理想的是在所述吸附構件形成有多個所述吸附孔。 藉由如上所述在吸附構件形成多個吸附孔，能夠減小片狀樹脂從各吸附孔受到的壓力。其結果為，能夠減少片狀樹脂的變形或破損，並且能夠抑制片狀樹脂進入吸附孔中而難以剝離的不良情況。It is desirable that a plurality of the suction holes are formed in the suction member. By forming a plurality of suction holes in the suction member as described above, it is possible to reduce the pressure that the sheet-shaped resin receives from each suction hole. As a result, it is possible to reduce the deformation or breakage of the sheet-shaped resin, and it is possible to suppress the inconvenience that the sheet-shaped resin enters the suction holes and is difficult to peel off.

在一個抽吸流路連通於多個吸附孔的情況下，在位於距所述抽吸流路近的位置的吸附孔以及位於距所述抽吸流路遠的位置的吸附孔中，吸附力產生不均。為了解決此問題而抑制多個吸附孔的吸附力的不均，理想的是所述樹脂供給機構具有與所述多個吸附孔連通的多個抽吸流路。When one suction flow path is connected to a plurality of suction holes, in the suction holes located close to the suction flow path and the suction holes located far away from the suction flow path, the adsorption force Produce unevenness. In order to solve this problem and suppress the unevenness of the adsorption force of the plurality of adsorption holes, it is desirable that the resin supply mechanism has a plurality of suction flow paths communicating with the plurality of adsorption holes.

假定如下情況：在將所吸附的片狀樹脂供給至成形模時僅解除吸附，無法確實地分離片狀樹脂。另外，當片狀樹脂從吸附構件上分離時，片狀樹脂會部分性地捲曲，存在供給至成形模的片狀樹脂彎折或起皺的顧慮。 為了解決這些問題，理想的是所述吸附構件構成為能夠對所吸附的所述片狀樹脂的所述另一面噴出氣體。 若為此構成，則對所吸附的片狀樹脂的另一面噴射氣體，因此能夠從吸附構件上確實地分離片狀樹脂，並且能夠抑制分離後的片狀樹脂部分性地捲曲而彎折或起皺。It is assumed that when the adsorbed sheet-like resin is supplied to the molding die, only the adsorption is released, and the sheet-like resin cannot be reliably separated. In addition, when the sheet-like resin is separated from the adsorption member, the sheet-like resin may be partially curled, and the sheet-like resin supplied to the forming mold may be bent or wrinkled. In order to solve these problems, it is desirable that the adsorption member is configured to be able to eject gas to the other surface of the adsorbed sheet-like resin. With this configuration, the gas is injected to the other side of the adsorbed sheet-like resin, so that the sheet-like resin can be reliably separated from the adsorption member, and the separated sheet-like resin can be prevented from being partially curled and bent or raised. wrinkle.

作為能夠從吸附構件噴出氣體的具體實施方式，考慮在所述吸附構件形成對所吸附的所述片狀樹脂的所述另一面噴出氣體的氣體噴出孔。As a specific embodiment capable of ejecting gas from the adsorption member, it is conceivable to form a gas ejection hole in the adsorption member that ejects the gas to the other surface of the adsorbed sheet-shaped resin.

此時，為了將吸附構件的構成簡化，所述吸附孔理想的是兼用作所述氣體噴出孔。另外，片狀樹脂中進入吸附孔中的部分由氣體直接按壓，因此能夠從吸附構件上確實地分離片狀樹脂。At this time, in order to simplify the configuration of the adsorption member, it is desirable that the adsorption hole also serves as the gas ejection hole. In addition, the portion of the sheet-shaped resin that enters the adsorption hole is directly pressed by the gas, so that the sheet-shaped resin can be reliably separated from the adsorption member.

為了對成形模高精度地供給片狀樹脂，首先，理想的是在使片狀樹脂對準吸附構件的狀態下使其吸附。為了能夠容易進行此對準，所述吸附構件理想為具有用以使所述片狀樹脂對準的標記部。In order to supply the sheet-like resin to the forming mold with high accuracy, first, it is desirable to adsorb the sheet-like resin in a state where the sheet-like resin is aligned with the adsorption member. In order to be able to perform this alignment easily, the adsorption member desirably has a marking portion for aligning the sheet-shaped resin.

另外，本發明的樹脂成形品的製造方法將彼此相向的第一成形模及第二成形模合模來製造樹脂成形品，所述樹脂成形品的製造方法的特徵在於包括：吸附保持步驟，使在其中一面設置有保護膜的片狀樹脂的另一面吸附於吸附構件，來保持所述片狀樹脂；剝離步驟，從吸附保持於所述吸附構件的所述片狀樹脂上剝離所述保護膜；以及樹脂供給步驟，將剝離了所述保護膜的所述片狀樹脂供給至所述第一成形模或所述第二成形模；以及樹脂成形步驟，將所述第一成形模及所述第二成形模合模，使用所述片狀樹脂來進行樹脂成形。In addition, the method of manufacturing a resin molded product of the present invention clamps the first molding die and the second molding die facing each other to produce a resin molded product, and the method of manufacturing a resin molded product is characterized by including: an adsorption and holding step to make One side of the sheet-shaped resin provided with a protective film is adsorbed on the adsorption member to hold the sheet-like resin; the peeling step is to peel the protective film from the sheet-like resin adsorbed and held on the adsorption member And a resin supply step of supplying the sheet-shaped resin from which the protective film has been peeled to the first molding die or the second molding die; and a resin molding step of combining the first molding die and the The second molding mold is closed, and resin molding is performed using the sheet-shaped resin.

若為此種樹脂成形品的製造方法，則與所述樹脂成形裝置同樣，能夠以使在其中一面設置有保護膜的片狀樹脂的另一面吸附於吸附構件的狀態，從片狀樹脂上剝離保護膜，因此在將保護膜剝離時或者剝離後能夠維持片狀樹脂的形狀。由此，抑制片狀樹脂的彎折或褶皺或者破損，能夠將片狀樹脂供給至成形模。其結果為，能夠減少使用片狀樹脂的樹脂成形的成形不良。If it is such a method of manufacturing a resin molded product, like the resin molding apparatus, it is possible to peel off the sheet resin from the sheet resin in a state where the other side of the sheet-shaped resin provided with a protective film on one side is adsorbed to the adsorption member The protective film can maintain the shape of the sheet-like resin when or after peeling the protective film. Thereby, bending, wrinkles, or breakage of the sheet-shaped resin can be suppressed, and the sheet-shaped resin can be supplied to the molding die. As a result, it is possible to reduce molding defects in resin molding using sheet resin.

為了對成形模高精度地供給片狀樹脂，理想的是在所述樹脂供給步驟中，將所述吸附構件相對於所述第一成形模或所述第二成形模來定位。In order to supply the sheet-shaped resin to the molding die with high accuracy, it is desirable to position the adsorption member with respect to the first molding die or the second molding die in the resin supply step.

所述吸附構件構成為能夠對所吸附的所述片狀樹脂的所述另一面噴出氣體，理想的是在所述樹脂供給步驟中，解除所述吸附保持步驟中的吸附，對所述另一面噴出氣體，將所述片狀樹脂供給至所述第一成形模或所述第二成形模。 若為此構成，則對所吸附的片狀樹脂的另一面噴射氣體，因此能夠從吸附構件上確實地分離片狀樹脂，並且能夠抑制片狀樹脂部分性地捲曲而彎折或起皺。The adsorption member is configured to be capable of ejecting gas to the other surface of the adsorbed sheet-like resin, and it is desirable that in the resin supply step, the adsorption in the adsorption and holding step is released, and the other surface The gas is blown out to supply the sheet-shaped resin to the first molding die or the second molding die. With this configuration, the gas is injected to the other surface of the adsorbed sheet-like resin, so that the sheet-like resin can be reliably separated from the adsorption member, and the sheet-like resin can be prevented from being partially curled, bent, or wrinkled.

＜本發明的一實施方式＞ 以下，參照圖式，對本發明的樹脂成形裝置的一實施方式進行說明。此外，關於以下所示的任一圖，均為了容易理解，而適當省略或者誇張地示意性描繪。對於同一構成元件標注同一符號，且適當省略說明。<One embodiment of the present invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, any of the drawings shown below are easy to understand, and are schematically depicted in an appropriately omitted or exaggerated manner. The same symbols are attached to the same constituent elements, and the description is appropriately omitted.

＜樹脂成形裝置100的整體構成＞ 本實施方式的樹脂成形裝置100對於搭載有電子零件的基板W，將搭載有電子零件的零件搭載面以樹脂密封來製造樹脂成形品P。此外，基板例如可列舉：金屬基板、樹脂基板、玻璃基板、陶瓷基板、電路基板、半導體基板、引線框架等。<The overall structure of the resin molding apparatus 100> The resin molding apparatus 100 of this embodiment manufactures a resin molded product P by sealing the component mounting surface on which the electronic component is mounted with a resin for the substrate W on which the electronic component is mounted. In addition, examples of the substrate include metal substrates, resin substrates, glass substrates, ceramic substrates, circuit substrates, semiconductor substrates, lead frames, and the like.

此樹脂成形裝置100如圖1所示，分別包括基板供給收納模塊A、兩個樹脂成形模塊B、及樹脂供給模塊C來作為構成元件。各構成元件（各模塊A～模塊C）相對於各個構成元件而能夠裝卸且能夠更換。As shown in FIG. 1, this resin molding apparatus 100 includes a substrate supply storage module A, two resin molding modules B, and a resin supply module C as constituent elements, respectively. Each constituent element (each module A to module C) is detachable and replaceable with respect to each constituent element.

包括以下所示的各模塊A～模塊C的樹脂成形裝置100的運行控制例如是由設置於基板供給收納模塊A的控制部CTL來進行。此控制部CTL還可設置於基板供給收納模塊A以外的其他模塊B、模塊C。另外，控制部CTL也可分割為多個，而設置於基板供給收納模塊A、樹脂成形模塊B及樹脂供給模塊C中的至少兩個模塊。The operation control of the resin molding apparatus 100 including each of the modules A to C described below is performed by, for example, a control unit CTL provided in the substrate supply storage module A. This control unit CTL may also be provided in modules B and C other than the substrate supply storage module A. In addition, the control unit CTL may be divided into a plurality of modules and provided in at least two of the substrate supply storage module A, the resin molding module B, and the resin supply module C.

＜基板供給收納模塊A＞ 基板供給收納模塊A如圖1所示，包括：基板供給部11，供給密封前基板W；基板收納部12，收納密封完畢的基板W（樹脂成形品P）；基板載置部13，傳送密封前基板W及樹脂成形品P；以及基板搬送機構14，搬送密封前基板W及樹脂成形品P。基板載置部13在基板供給收納模塊A內，在對應於基板供給部11的位置與對應於基板收納部12的位置之間向Y方向移動。基板搬送機構14在基板供給收納模塊A以及各個樹脂成形模塊B內，向X方向及Y方向移動。＜Board supply storage module A＞ The substrate supply and storage module A, as shown in Figure 1, includes: a substrate supply portion 11, which supplies the substrate W before sealing; a substrate storage portion 12, which stores the sealed substrate W (resin molded product P); and a substrate placement portion 13, which conveys and seals The front substrate W and the resin molded product P; and the substrate transport mechanism 14 to transport the pre-sealed substrate W and the resin molded product P. The substrate placement section 13 moves in the Y direction between a position corresponding to the substrate supply section 11 and a position corresponding to the substrate storage section 12 in the substrate supply storage module A. The substrate transport mechanism 14 moves in the X direction and the Y direction in the substrate supply and storage module A and each resin molding module B.

＜樹脂成形模塊B＞ 各樹脂成形模塊B如圖1及圖2所示，包括作為形成有模腔15C的第一成形模的下模15、作為保持基板W的第二成形模的上模16、以及將下模15及上模16合模的合模機構17。＜Resin Molding Module B＞ As shown in FIGS. 1 and 2, each resin molding module B includes a lower mold 15 as a first mold in which a cavity 15C is formed, an upper mold 16 as a second mold for holding a substrate W, and a lower mold 15 Clamping mechanism 17 for clamping the upper mold 16 with the mold.

合模機構17如圖2所示，包括：安裝下模15的可動盤171、安裝上模16的上部固定盤172、以及用以使可動盤171升降移動的驅動機構173。As shown in FIG. 2, the mold clamping mechanism 17 includes a movable platen 171 to which the lower mold 15 is installed, an upper fixed plate 172 to which the upper mold 16 is installed, and a driving mechanism 173 for moving the movable platen 171 up and down.

可動盤171在其上表面安裝下模15，是以能夠利用立設於下部固定盤174的多個支柱部175而升降移動的方式得到支撐。The movable platen 171 has the lower mold 15 attached to the upper surface thereof, and is supported so as to be able to move up and down by a plurality of pillar portions 175 erected on the lower fixed plate 174.

上部固定盤172在其下表面安裝上模16，在多個支柱部175的上端部，以與可動盤171相向的方式得到固定。The upper fixed plate 172 has an upper mold 16 attached to its lower surface, and is fixed to the upper end of the plurality of pillar portions 175 so as to face the movable plate 171.

驅動機構173設置於可動盤171及下部固定盤174之間，藉由使可動盤171升降移動而將下模15及上模16合模，並且施加規定的成形壓。本實施方式的驅動機構173為直動方式，即，使用將伺服馬達等的旋轉轉變為直線移動的滾珠螺桿機構，傳遞至可動盤171；但也可為連杆方式，即，使用例如肘節連杆（toggle link）等連杆機構，將伺服馬達等的動力源傳遞至可動盤171。The driving mechanism 173 is provided between the movable platen 171 and the lower fixed plate 174, and by moving the movable platen 171 up and down, the lower mold 15 and the upper mold 16 are clamped, and a predetermined molding pressure is applied. The drive mechanism 173 of this embodiment is a linear motion method, that is, a ball screw mechanism that converts the rotation of a servo motor or the like into a linear motion is used, and is transmitted to the movable plate 171; however, it may also be a link method, that is, a toggle joint is used. A link mechanism such as a toggle link transmits a power source such as a servo motor to the movable plate 171.

而且，在下模15與可動盤171之間，設置有下模保持部176。此下模保持部176包括：加熱板176a，對下模15進行加熱；隔熱構件176b，設置於此加熱板176a的下表面；側壁構件176c，設置於加熱板176a的上表面，且包圍下模15的周圍；以及密封構件176d，設置於此側壁構件176c的上端。Furthermore, between the lower mold 15 and the movable platen 171, a lower mold holding portion 176 is provided. The lower mold holding portion 176 includes: a heating plate 176a for heating the lower mold 15; a heat insulating member 176b provided on the lower surface of the heating plate 176a; a side wall member 176c provided on the upper surface of the heating plate 176a and surrounding the lower surface Around the mold 15; and a sealing member 176d, which is provided on the upper end of the side wall member 176c.

在上模16與上部固定盤172之間，設置有上模保持部177。此上模保持部177包括：加熱板177a，對上模16進行加熱；隔熱構件177b，設置於此加熱板177a的上表面；側壁構件177c，設置於加熱板177a的下表面，且包圍上模16的周圍；以及密封構件177d，設置於此側壁構件177c的下端。而且，在利用驅動機構173進行合模時，側壁構件176c的密封構件176d以及側壁構件177c的密封構件177d密接，收容下模15及上模16的空間與外部氣體阻隔。此外，還可設為不設置密封構件176d或密封構件177d中的其中一者的構成。An upper mold holding portion 177 is provided between the upper mold 16 and the upper fixed disk 172. The upper mold holding portion 177 includes: a heating plate 177a for heating the upper mold 16; a heat insulating member 177b arranged on the upper surface of the heating plate 177a; a side wall member 177c arranged on the lower surface of the heating plate 177a and surrounding the upper surface Around the mold 16; and a sealing member 177d, which is provided at the lower end of the side wall member 177c. Moreover, when the mold is clamped by the drive mechanism 173, the sealing member 176d of the side wall member 176c and the sealing member 177d of the side wall member 177c are in close contact, and the space accommodating the lower mold 15 and the upper mold 16 is blocked from external air. In addition, it is also possible to provide a configuration in which either the sealing member 176d or the sealing member 177d is not provided.

上模16對基板W的背面加以吸附而保持。在上模16的下表面形成有吸附孔（未圖示），且在上模16的內部形成有抽吸流路（未圖示）。此抽吸流路與外部的抽吸裝置（未圖示）連接。The upper mold 16 sucks and holds the back surface of the substrate W. A suction hole (not shown) is formed on the lower surface of the upper mold 16, and a suction flow path (not shown) is formed in the upper mold 16. This suction flow path is connected to an external suction device (not shown).

在下模15，如圖2所示，形成有對搭載於基板W的電子零件及樹脂材料加以收容的模腔15C。具體而言，下模15包括：作為形成模腔15C的底面的單一構件的底面構件151；以及包圍此底面構件151的側面構件152。利用此底面構件151的上表面與側面構件152的內周面來形成模腔15C。本實施方式的底面構件151是俯視時形成矩形狀的平板，側面構件152在俯視時形成矩形框狀。另外，側面構件152設置為能夠相對於底面構件151而相對地上下移動。具體而言，對於下模15的底板153，利用螺旋彈簧等多個彈性構件154來支撐。As shown in FIG. 2, the lower mold 15 is formed with a cavity 15C that accommodates electronic components and resin materials mounted on the substrate W. Specifically, the lower mold 15 includes: a bottom surface member 151 as a single member forming the bottom surface of the cavity 15C; and a side member 152 surrounding the bottom surface member 151. The upper surface of the bottom surface member 151 and the inner peripheral surface of the side surface member 152 form a cavity 15C. The bottom surface member 151 of this embodiment is a flat plate formed in a rectangular shape in a plan view, and the side member 152 is formed in a rectangular frame shape in a plan view. In addition, the side member 152 is provided to be relatively movable up and down with respect to the bottom surface member 151. Specifically, the bottom plate 153 of the lower mold 15 is supported by a plurality of elastic members 154 such as coil springs.

＜樹脂供給模塊C＞ 樹脂供給模塊C如圖1所示，包括樹脂供給機構2，所述樹脂供給機構2將片狀樹脂J作為樹脂材料而供給至下模15。<Resin Supply Module C> As shown in FIG. 1, the resin supply module C includes a resin supply mechanism 2 that supplies the sheet-shaped resin J as a resin material to the lower mold 15.

此處，對片狀樹脂J進行說明，如圖3（a）所示，在片狀樹脂J的單面或兩面，設置有用以保護片狀樹脂J免受污垢或損傷等的保護膜PF，在供給至下模15之前需要剝離此保護膜PF。此外，圖3（a）中，例示出在片狀樹脂J的單面設置有保護膜PF。片狀樹脂J具有無法維持自身的形狀的厚度或柔軟性，若剝離保護膜PF，則如圖3（b）所示，容易彎折、起皺。Here, the sheet-like resin J will be described. As shown in FIG. 3(a), a protective film PF is provided on one or both sides of the sheet-like resin J to protect the sheet-like resin J from dirt or damage. This protective film PF needs to be peeled off before being supplied to the lower mold 15. In addition, in FIG. 3( a ), the protective film PF is provided on one side of the sheet-like resin J as an example. The sheet-like resin J has a thickness or flexibility that cannot maintain its own shape, and when the protective film PF is peeled off, as shown in FIG. 3(b), it is easy to bend and wrinkle.

具體而言，樹脂供給機構2如圖1所示，包括：吸附機構3，對在其中一面設置有保護膜PF的片狀樹脂J的另一面加以吸附；以及移動機構4，使此吸附機構3移動。Specifically, as shown in FIG. 1, the resin supply mechanism 2 includes: an adsorption mechanism 3 for adsorbing the other side of the sheet-like resin J with a protective film PF on one side; and a moving mechanism 4 for making this adsorption mechanism 3 move.

此外，片狀樹脂J的另一面為未設置保護膜PF的露出面，以下的說明中，將片狀樹脂J的另一面稱為露出面。In addition, the other surface of the sheet-like resin J is an exposed surface on which the protective film PF is not provided, and in the following description, the other surface of the sheet-like resin J is called an exposed surface.

吸附機構3如圖4～圖6所示，包括形成有吸附孔311的吸附構件31。此吸附構件31形成有對片狀樹脂J的露出面加以吸附的多個吸附孔311。具體而言，吸附構件31包括將片狀樹脂J吸附而保持的平面狀的吸附保持面31X，且在此吸附保持面31X開口有多個吸附孔311。多個吸附孔311例如形成彼此相同的開口形狀（例如圓形狀）。本實施方式的吸附構件31形成平板狀（板狀），其一面（上表面）成為吸附保持面31X。此吸附保持面31X中，多個吸附孔311例如在俯視時規則地配置，分別沿著彼此正交的方向（縱橫）而等間隔地配置（參照圖5）。As shown in FIGS. 4 to 6, the suction mechanism 3 includes a suction member 31 in which suction holes 311 are formed. This adsorption member 31 is formed with a plurality of adsorption holes 311 for adsorbing the exposed surface of the sheet-like resin J. Specifically, the suction member 31 includes a planar suction and holding surface 31X that sucks and holds the sheet-shaped resin J, and a plurality of suction holes 311 are opened on the suction and holding surface 31X. The plurality of suction holes 311 form, for example, the same opening shape (for example, a circular shape). The adsorption member 31 of this embodiment is formed in a flat plate shape (plate shape), and one surface (upper surface) becomes the adsorption|suction holding surface 31X. In this suction holding surface 31X, a plurality of suction holes 311 are arranged regularly in a plan view, for example, and are arranged at equal intervals along directions (vertical and horizontal) orthogonal to each other (see FIG. 5 ).

而且，在此吸附構件31中的與吸附保持面31X為相反側的面（下表面），設置有形成與多個吸附孔311連通的內部空間3S的空間形成構件32。在此空間形成構件32連接有包括真空噴射器的真空產生器33，所述真空噴射器經由內部空間3S，使吸附力從吸附孔311作用於片狀樹脂J的露出面。另外，此空間形成構件32與後述的旋轉軸構件37及支撐構件38連結。進而，真空產生器33設置為能夠與吸附構件31一起移動。In addition, a surface (lower surface) of the suction member 31 opposite to the suction holding surface 31X is provided with a space forming member 32 that forms an internal space 3S communicating with the plurality of suction holes 311. A vacuum generator 33 including a vacuum ejector is connected to the space forming member 32, and the vacuum ejector causes an adsorption force to act on the exposed surface of the sheet-like resin J from the adsorption hole 311 via the internal space 3S. In addition, this space forming member 32 is connected to a rotating shaft member 37 and a supporting member 38 which will be described later. Furthermore, the vacuum generator 33 is provided to be able to move together with the suction member 31.

另外，真空產生器33與內部空間3S是由抽吸流路34來連接。本實施方式中，設置有與多個吸附孔311連通的多個抽吸流路34。各抽吸流路34藉由與空間形成構件32連接而與內部空間3S連通。另外，各抽吸流路34是與設定於吸附保持面31X的多個吸附區域對應而連接。例如，在吸附保持面31X設定有：設定於中央的中央區域、以及設定於所述中央區域的周圍的多個周圍區域，考慮與這些各個區域對應而連接抽吸流路34。由此，與利用一個抽吸流路34來抽吸的情況相比，能夠使吸附保持面31X整體的吸附力均勻化。此外，多個抽吸流路34包括配管，可為將其一部分設為共通的配管而與真空產生器33連接的構成。另外，還可將由空間形成構件32所形成的內部空間3S分隔為與多個吸附區域對應的多個空間。In addition, the vacuum generator 33 and the internal space 3S are connected by a suction flow path 34. In this embodiment, a plurality of suction flow paths 34 communicating with the plurality of adsorption holes 311 are provided. Each suction channel 34 communicates with the internal space 3S by being connected to the space forming member 32. In addition, each suction flow path 34 is connected in correspondence with a plurality of suction regions set on the suction holding surface 31X. For example, the suction holding surface 31X is provided with a central area set at the center and a plurality of peripheral areas set at the periphery of the central area, and the suction flow path 34 is connected in consideration of corresponding to these respective areas. As a result, compared with the case where one suction flow path 34 is used for suction, the suction force of the entire suction holding surface 31X can be made uniform. In addition, the plurality of suction flow paths 34 include piping, and a part of the suction flow path 34 may be a common piping and connected to the vacuum generator 33. In addition, the internal space 3S formed by the space forming member 32 may be partitioned into a plurality of spaces corresponding to a plurality of adsorption regions.

進而，在吸附構件31的形成有吸附孔311的表面（吸附保持面31X），如圖7所示，形成有多個凹凸35。所述多個凹凸35例如藉由噴射（blast）加工而形成。藉由形成此種凹凸35，而在凹部與片狀樹脂J的露出面之間，產生與吸附孔311連通的間隙S。由此，來自吸附孔311的吸附力經由此間隙S，也作用於露出面中不與吸附孔311相向的部分。其結果為，片狀樹脂J不僅從吸附孔311中吸附，也從凹部中吸附，片狀樹脂J的受壓面積增大，能夠使片狀樹脂J確實地吸附於吸附構件31。此外，多個凹凸35並不限於藉由噴射加工而形成的凹凸，也可以是藉由其他的表面加工而形成的凹凸，還可以藉由使用表面粗糙度大的原材料而在吸附保持面31X形成有多個凹凸。Furthermore, as shown in FIG. 7, a plurality of irregularities 35 are formed on the surface of the suction member 31 on which the suction holes 311 are formed (the suction holding surface 31X). The plurality of irregularities 35 are formed by, for example, blast processing. By forming such unevenness 35, a gap S communicating with the suction hole 311 is formed between the recessed portion and the exposed surface of the sheet-like resin J. Accordingly, the suction force from the suction hole 311 also acts on the portion of the exposed surface that does not face the suction hole 311 via this gap S. As a result, the sheet-like resin J is not only adsorbed from the adsorption holes 311 but also from the recesses, the pressure-receiving area of the sheet-like resin J increases, and the sheet-like resin J can be reliably adsorbed to the adsorption member 31. In addition, the plurality of concavities and convexities 35 are not limited to the concavities and convexities formed by jet processing, but may be concavities and convexities formed by other surface processing, and can also be formed on the adsorption and holding surface 31X by using a material with a large surface roughness. There are multiple bumps.

另外，吸附構件31構成為能夠對所吸附的片狀樹脂J的露出面噴出氣體（例如空氣）。具體而言，在吸附構件31，形成有對所吸附的片狀樹脂J的露出面噴出氣體的氣體噴出孔。本實施方式中，多個吸附孔311兼用作氣體噴出孔。而且構成為：藉由將設置於抽吸流路34的切換閥（未圖示）進行切換，而使用真空產生器33，從多個吸附孔311中噴出氣體。例如構成為：利用包括抽吸流路34以及設置於抽吸流路34的切換閥的配管構成，來切換吸附用流體電路與噴出用流體電路，所述吸附用流體電路是真空產生器33內的真空噴射器的吸入端口與內部空間3S連接而成，所述噴出用流體電路是真空產生器33內的真空噴射器的排氣端口與內部空間3S連接而成。藉由如上所述對所吸附的片狀樹脂J的露出面噴射氣體，能夠從吸附構件31上確實地分離片狀樹脂J，並且能夠抑制分離後的片狀樹脂J部分性地捲曲而彎折或起皺。此外，也可將用以與真空噴射器分開而另行噴出氣體的壓縮空氣供給部連接於真空產生器33。作為壓縮空氣供給部，考慮使用壓縮機、配管於工廠內的壓縮空氣等。In addition, the adsorption member 31 is configured to be able to eject gas (for example, air) to the exposed surface of the adsorbed sheet-like resin J. Specifically, the adsorption member 31 is formed with a gas ejection hole that ejects gas to the exposed surface of the adsorbed sheet-like resin J. In this embodiment, the plurality of adsorption holes 311 also serve as gas ejection holes. Furthermore, it is configured to use a vacuum generator 33 to eject gas from the plurality of adsorption holes 311 by switching a switching valve (not shown) provided in the suction flow path 34. For example, it is configured to switch between the fluid circuit for adsorption and the fluid circuit for ejection by a piping configuration including the suction flow path 34 and a switching valve provided in the suction flow path 34, and the fluid circuit for adsorption is in the vacuum generator 33. The suction port of the vacuum ejector is connected to the internal space 3S, and the ejection fluid circuit is connected to the exhaust port of the vacuum ejector in the vacuum generator 33 and the internal space 3S. By spraying gas on the exposed surface of the adsorbed sheet-like resin J as described above, the sheet-like resin J can be reliably separated from the adsorption member 31, and the separated sheet-like resin J can be prevented from being partially curled and bent. Or wrinkles. In addition, a compressed air supply unit for separately ejecting gas from the vacuum ejector may be connected to the vacuum generator 33. As the compressed air supply unit, consider using a compressor, compressed air piped in a factory, and the like.

另外，在吸附構件31，如圖4及圖5所示，設置有用以將片狀樹脂J對準的標記部36。本實施方式的標記部36是設置於所述吸附保持面31X的多個刻度，在吸附保持面31X，沿著相互正交的方向而設置。此外，標記部36若成為用以將片狀樹脂J對準的標記，則未必需要為刻度，例如可使用每隔一定距離而設置的記號等各種標記。In addition, the suction member 31 is provided with a marking portion 36 for aligning the sheet-like resin J as shown in FIGS. 4 and 5. The marking portion 36 of the present embodiment is a plurality of scales provided on the suction and holding surface 31X, and is provided on the suction and holding surface 31X along directions orthogonal to each other. In addition, if the marking portion 36 is a mark for aligning the sheet-like resin J, it does not necessarily need to be a scale. For example, various marks such as marks provided at regular intervals can be used.

所述吸附構件31構成為能夠將吸附保持面31X上下反轉。具體而言，吸附構件31如圖4～圖6所示，利用與吸附保持面31X平行的旋轉軸構件37，以能夠旋轉的方式由支撐構件38來支撐，設為能夠圍繞此旋轉軸構件37而上下反轉。此處，旋轉軸構件37在吸附保持面31X的俯視時，以藉由吸附保持面31X的中心的方式來設置。本實施方式的旋轉軸構件37是藉由與空間形成構件32連接而支撐吸附構件31的構成，但也可設為與吸附構件31連接的構成。另外，吸附構件31的上下反轉動作是構成為利用設置於旋轉軸構件37的把手37H來手動進行，但也可設為使用馬達等而使其自動反轉的構成。The suction member 31 is configured to be able to invert the suction and holding surface 31X up and down. Specifically, as shown in FIGS. 4 to 6, the suction member 31 is rotatably supported by the support member 38 by a rotation shaft member 37 parallel to the suction and holding surface 31X, and is set to be able to surround the rotation shaft member 37 And reverse up and down. Here, the rotating shaft member 37 is installed so as to pass through the center of the suction-holding surface 31X in a plan view of the suction-holding surface 31X. The rotating shaft member 37 of the present embodiment is configured to support the suction member 31 by being connected to the space forming member 32, but may be configured to be connected to the suction member 31. In addition, the vertical reversal operation of the suction member 31 is configured to be manually performed using a handle 37H provided on the rotating shaft member 37, but it may be configured to be automatically reversed using a motor or the like.

吸附機構3的移動機構4如圖1所示，使吸附機構3在吸附構件31接收片狀樹脂J的接收位置、與從吸附構件31上將片狀樹脂J傳送至下模15的傳送位置之間移動，在樹脂供給模塊C以及各個樹脂成形模塊B內，構成為至少向X方向及Y方向移動。本實施方式的移動機構4構成為：使吸附保持片狀樹脂J的吸附構件31，移動至設定於下模15的上方的傳送位置。此傳送位置設定於開模的下模15的上方，是經吸附的片狀樹脂J成為下模15的模腔15C的正上方的位置。此外，圖1中，為了便於說明，移動機構4的移動路徑與基板搬送機構14的移動路徑設為一部分共通，但並不限於此。The moving mechanism 4 of the suction mechanism 3 is shown in FIG. 1, so that the suction mechanism 3 is at the receiving position of the suction member 31 to receive the sheet-shaped resin J, and the sheet-shaped resin J is transferred from the suction member 31 to the transfer position of the lower mold 15. In the resin supply module C and each resin molding module B, it is configured to move in the X direction and the Y direction at least. The moving mechanism 4 of the present embodiment is configured to move the suction member 31 sucking and holding the sheet-shaped resin J to a conveying position set above the lower mold 15. This transfer position is set above the lower mold 15 where the mold is opened, and the sucked sheet-like resin J becomes a position directly above the cavity 15C of the lower mold 15. In addition, in FIG. 1, for convenience of description, the movement path of the movement mechanism 4 and the movement path of the substrate transport mechanism 14 are partly shared, but it is not limited to this.

＜樹脂成形裝置100的運行＞ 參照圖8，對此樹脂成形裝置100中的樹脂成形（樹脂密封）的運行進行說明。<Operation of Resin Molding Device 100> 8, the operation of resin molding (resin sealing) in this resin molding apparatus 100 will be described.

首先，在基板供給收納模塊A中，從基板供給部11對基板載置部13送出密封前基板W。其次，使位於規定的待機位置的基板搬送機構14移動，從基板載置部13接收密封前基板W。接著，使基板搬送機構14移動至樹脂成形模塊B，將密封前基板W保持於經開模的上模16。然後，將基板搬送機構14返回至規定的待機位置。First, in the substrate supply storage module A, the substrate W before sealing is sent from the substrate supply section 11 to the substrate placement section 13. Next, the substrate transport mechanism 14 located at the predetermined standby position is moved, and the substrate W before sealing is received from the substrate mounting portion 13. Next, the substrate transport mechanism 14 is moved to the resin molding module B, and the substrate W before sealing is held in the opened upper mold 16. Then, the substrate transport mechanism 14 is returned to the predetermined standby position.

在樹脂供給模塊C中，使吸附機構3在規定的接收位置待機。接著，將在其中一面設置有保護膜PF的片狀樹脂J，以其露出面與吸附構件31的吸附保持面31X接觸的方式來載置（圖8的＜載置步驟＞）。此時，一邊看著設置於吸附保持面31X的刻度等標記部36，一邊將片狀樹脂J定位於吸附保持面31X中的所需位置。此處，在片狀樹脂J的其中一面設置有保護膜PF，因此片狀樹脂J不易變形，其操作容易。此外，在片狀樹脂J的兩面設置有保護膜PF的情況下，將單面的保護膜PF剝離後，以其露出面與吸附保持面31X接觸的方式來載置。In the resin supply module C, the suction mechanism 3 is made to stand by at a predetermined receiving position. Next, the sheet-like resin J provided with the protective film PF on one surface is placed so that its exposed surface is in contact with the adsorption holding surface 31X of the adsorption member 31 (<mounting step> in FIG. 8). At this time, while looking at the marking portion 36 such as a scale provided on the suction and holding surface 31X, the sheet-like resin J is positioned at a desired position on the suction and holding surface 31X. Here, since the protective film PF is provided on one surface of the sheet-like resin J, the sheet-like resin J is not easily deformed and its handling is easy. Moreover, when the protective film PF is provided on both surfaces of the sheet-like resin J, after peeling off the protective film PF of one side, it mounts so that the exposed surface may contact with the adsorption|suction holding surface 31X.

其次，使利用真空產生器33進行的抽吸動作開始，使片狀樹脂J的露出面吸附於吸附構件31，將片狀樹脂J吸附保持（圖8的＜吸附保持步驟＞）。此時，來自多個吸附孔311的吸附力作用於片狀樹脂J的露出面，並且在吸附保持面31X設置有凹凸35，因此所述吸附力經由凹部與片狀樹脂J之間的間隙S而傳遞至片狀樹脂J的露出面，露出面的整體吸附於吸附保持面31X。Next, the suction operation by the vacuum generator 33 is started, the exposed surface of the sheet-like resin J is adsorbed to the adsorption member 31, and the sheet-like resin J is adsorbed and held (<adsorption holding step> in FIG. 8). At this time, the adsorption force from the plurality of adsorption holes 311 acts on the exposed surface of the sheet-like resin J, and the adsorption holding surface 31X is provided with irregularities 35, so the adsorption force passes through the gap S between the recesses and the sheet-like resin J On the other hand, it is transferred to the exposed surface of the sheet-like resin J, and the entire exposed surface is adsorbed to the suction and holding surface 31X.

在如上所述將片狀樹脂J吸附保持於吸附構件31的狀態下，將設置於片狀樹脂J的其中一面（上表面）的保護膜PF手動或者自動地剝離（圖8的＜剝離步驟＞）。由此，成為從片狀樹脂J去除了保護膜PF的狀態。In the state where the sheet-like resin J is adsorbed and held by the adsorption member 31 as described above, the protective film PF provided on one side (upper surface) of the sheet-like resin J is manually or automatically peeled off (<Peeling Step> of FIG. 8) ). As a result, the protective film PF is removed from the sheet-like resin J.

繼而，使吸附有片狀樹脂J的吸附構件31圍繞旋轉軸構件37而旋轉180度，上下反轉，使得片狀樹脂J向下。成為此狀態後，利用移動機構4，使吸附機構3從樹脂供給模塊C移動至樹脂成形模塊B（圖8的＜移動步驟＞）。Then, the suction member 31 to which the sheet-like resin J is adsorbed is rotated 180 degrees around the rotating shaft member 37 and reversed up and down so that the sheet-like resin J faces downward. After being in this state, the moving mechanism 4 is used to move the suction mechanism 3 from the resin supply module C to the resin molding module B (<moving step> in FIG. 8).

此移動步驟中，利用移動機構4，使吸附機構3移動至將片狀樹脂J傳送至經開模的下模15的傳送位置。此處，本實施方式中，為了將吸附構件31相對於下模15而定位，而在吸附構件31設置有定位部39（參照圖4等）。定位部39例如為凸部，如圖9所示，構成為與凹部15M卡合，所述凹部15M設置於下模15或者與下模15一體的構件。因此，移動機構4在經開模的下模15的上方使吸附機構3向Z方向下降，使定位部39卡合於凹部15M，將吸附構件31相對於下模15而定位。所述經定位的狀態是吸附構件31將片狀樹脂J進行傳送的傳送位置。此外，也可使下模15向Z方向上升，使定位部39卡合於凹部15M。另外，也可在支撐構件38設置引導部，而設為如下構成：以引導部接觸下模15的一部分的面而滑動的方式來定位。In this moving step, the moving mechanism 4 is used to move the suction mechanism 3 to the conveying position where the sheet-shaped resin J is conveyed to the lower mold 15 with the opened mold. Here, in this embodiment, in order to position the adsorption member 31 with respect to the lower mold 15, the adsorption member 31 is provided with the positioning part 39 (refer FIG. 4 etc.). The positioning part 39 is, for example, a convex part, and as shown in FIG. Therefore, the moving mechanism 4 lowers the suction mechanism 3 in the Z direction above the opened lower mold 15, engages the positioning portion 39 with the recess 15M, and positions the suction member 31 with respect to the lower mold 15. The positioned state is a conveying position where the suction member 31 conveys the sheet-shaped resin J. In addition, the lower mold 15 may be raised in the Z direction, and the positioning portion 39 may be engaged with the concave portion 15M. In addition, a guide portion may be provided in the support member 38, and it may be configured to position the guide portion such that the guide portion contacts a part of the surface of the lower mold 15 and slides.

然後，使利用真空產生器33進行的抽吸動作停止，解除片狀樹脂J的吸附。另外，在解除此吸附後，將真空產生器33的排氣端口與內部空間3S連通而使利用真空產生器33進行的噴出動作開始，從吸附孔311對片狀樹脂J的露出面噴出氣體（空氣）。由此，片狀樹脂J從吸附保持面31X上剝離而落下，片狀樹脂J供給至下模15的模腔15C（圖8的＜樹脂供給步驟＞）。此外，也可在將片狀樹脂J供給至下模15的模腔15C之前，在下模15設置脫模膜。Then, the suction operation by the vacuum generator 33 is stopped, and the adsorption of the sheet-shaped resin J is released. In addition, after the adsorption is released, the exhaust port of the vacuum generator 33 is connected to the internal space 3S to start the ejection operation by the vacuum generator 33, and the gas is ejected from the adsorption hole 311 to the exposed surface of the sheet resin J ( Air). Thereby, the sheet-like resin J peels off from the adsorption holding surface 31X, and falls, and the sheet-like resin J is supplied to the cavity 15C of the lower mold 15 (<resin supply process> of FIG. 8). In addition, a release film may be provided in the lower mold 15 before the sheet-shaped resin J is supplied to the cavity 15C of the lower mold 15.

在供給片狀樹脂J後，吸附機構3利用移動機構4而移動至樹脂供給模塊C，返回至所述接收位置。返回至接收位置的吸附機構3的吸附構件31以吸附保持面31X朝上的方式再次上下反轉。After the sheet-shaped resin J is supplied, the suction mechanism 3 is moved to the resin supply module C by the moving mechanism 4, and returns to the receiving position. The suction member 31 of the suction mechanism 3 returned to the receiving position is again reversed up and down with the suction holding surface 31X facing upward.

在所述步驟之後，樹脂成形模塊B中，利用驅動機構173使可動盤171上升，使上模保持部177的密封構件177d與下模保持部176的密封構件176d密接，由此形成密閉空間。在此狀態下，利用未圖示的排氣機構將密閉空間設為真空狀態。After the above steps, in the resin molding module B, the movable platen 171 is raised by the drive mechanism 173, and the sealing member 177d of the upper mold holding portion 177 and the sealing member 176d of the lower mold holding portion 176 are brought into close contact, thereby forming a sealed space. In this state, the enclosed space is brought into a vacuum state by an exhaust mechanism not shown.

接著，利用驅動機構173，使可動盤171進一步上升，側面構件152按壓於上模16，彈性構件154壓縮變形，並且基板W的電子零件浸漬於作為樹脂材料的片狀樹脂J，而且基板W的零件搭載面由片狀樹脂J所被覆。在此狀態下，下模15與上模16利用規定的成形壓而合模（圖8的＜樹脂成形步驟＞）。經過規定時間後，利用合模機構17使下模15下降，將下模15與上模16進行開模。此外，也可在合模的中途，將密閉空間恢復至大氣壓。Next, the drive mechanism 173 is used to further raise the movable platen 171, the side member 152 is pressed against the upper mold 16, the elastic member 154 is compressed and deformed, and the electronic components of the substrate W are impregnated in the sheet-like resin J as a resin material, and the substrate W The part mounting surface is covered with sheet-like resin J. In this state, the lower mold 15 and the upper mold 16 are clamped by a predetermined molding pressure (<resin molding step> in FIG. 8). After a predetermined time has elapsed, the lower mold 15 is lowered by the mold clamping mechanism 17, and the lower mold 15 and the upper mold 16 are opened. In addition, it is also possible to restore the enclosed space to atmospheric pressure in the middle of mold clamping.

其次，使基板供給收納模塊A的基板搬送機構14移動，從經開模的上模16中接收密封完畢的基板W。使基板搬送機構14移動至基板載置部13，將密封完畢的基板W傳送至基板載置部13。從基板載置部13向基板收納部12收納密封完畢的基板W。如此一來，使用片狀樹脂J的樹脂密封結束。Next, the substrate transport mechanism 14 of the substrate supply and storage module A is moved, and the sealed substrate W is received from the opened upper mold 16. The substrate transport mechanism 14 is moved to the substrate placement section 13 and the sealed substrate W is transported to the substrate placement section 13. The sealed substrate W is accommodated from the substrate mounting portion 13 to the substrate accommodating portion 12. In this way, the resin sealing using the sheet-like resin J is completed.

＜本實施方式的效果＞ 根據本實施方式的樹脂成形裝置100，能夠以使在其中一面設置有保護膜PF的片狀樹脂J的露出面吸附於吸附構件31的狀態，從片狀樹脂J上剝離保護膜PF，因此在將保護膜PF剝離時或者剝離後能夠維持片狀樹脂J的形狀。由此，抑制片狀樹脂J的彎折或褶皺或者破損，能夠將片狀樹脂J供給至下模15。其結果為，能夠減少使用片狀樹脂J的樹脂成形的成形不良。 此外，由於使用片狀樹脂J來作為樹脂材料，故而與使用液狀樹脂或顆粒狀樹脂的情況相比，能夠使樹脂材料向下模15的模腔15C內的供給量均勻化，還能夠對應欲使樹脂成形品變薄等要求。<Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, the protective film PF can be peeled from the sheet resin J in a state where the exposed surface of the sheet resin J provided with the protective film PF on one surface is adsorbed to the adsorption member 31, so that The shape of the sheet-like resin J can be maintained during or after the protective film PF is peeled off. Thereby, bending, wrinkles, or breakage of the sheet-like resin J is suppressed, and the sheet-like resin J can be supplied to the lower mold 15. As a result, it is possible to reduce molding defects in resin molding using the sheet-like resin J. In addition, since the sheet-like resin J is used as the resin material, compared with the case of using liquid resin or granular resin, the supply amount of the resin material in the cavity 15C of the lower mold 15 can be made uniform, and it can also cope with It is required to make the resin molded product thinner.

＜其他的變形實施方式＞ 此外，本發明並不限於所述實施方式。<Other modified embodiments> In addition, the present invention is not limited to the described embodiments.

例如，所述實施方式的吸附構件31是具有對片狀樹脂J加以吸附的吸附孔311的平板狀的構件，但也可形成其他形狀。另外，作為吸附構件31，可使用包括多孔質材料料（多孔材料）的構件，在此情況下，多孔質材料所具有的多數個孔成為吸附孔311。For example, the suction member 31 of the above-mentioned embodiment is a flat member having suction holes 311 for adsorbing the sheet-shaped resin J, but may be formed in other shapes. In addition, as the adsorption member 31, a member including a porous material (porous material) can be used. In this case, the plurality of pores of the porous material become the adsorption pores 311.

另外，所述實施方式中，是利用移動機構4，使吸附機構3自動地移動至樹脂成形模塊B的構成，但在手動地使吸附機構3移動至樹脂成形模塊B的構成的情況下，也可以是不包括使吸附機構3移動的移動機構4的構成。In addition, in the above embodiment, the moving mechanism 4 is used to automatically move the suction mechanism 3 to the resin molding module B. However, the suction mechanism 3 is manually moved to the resin molding module B. It may be a configuration that does not include the moving mechanism 4 that moves the suction mechanism 3.

進而，在將所吸附的片狀樹脂J藉由自然落下而供給至下模15的構成的情況下，吸附構件31也可不構成為能夠噴出氣體（空氣）。另外，吸附機構3也可包括如下構成：藉由利用擠壓構件（未圖示）來機械性地按壓所吸附的片狀樹脂J，而將片狀樹脂J從吸附構件31分離。Furthermore, in the case of a configuration in which the adsorbed sheet-like resin J is supplied to the lower mold 15 by natural fall, the adsorption member 31 may not be configured to be able to eject gas (air). In addition, the adsorption mechanism 3 may include a configuration in which the sheet-like resin J is mechanically pressed by a pressing member (not shown) to separate the sheet-like resin J from the adsorption member 31.

所述實施方式的樹脂供給機構2將片狀樹脂J供給至下模15，但也可供給至上模16，若為一對成形模在與上下方向不同的方向上相向配置的情況，則也可供給至這些成形模的至少一者。The resin supply mechanism 2 of the above-mentioned embodiment supplies the sheet-like resin J to the lower mold 15, but may also be supplied to the upper mold 16. If a pair of molding dies are arranged facing each other in a direction different from the vertical direction, it may be It is supplied to at least one of these forming dies.

除此以外，多個吸附孔311的大小、配置、形狀並不限於所述實施方式。例如根據吸附保持面31X的不同區域（例如中央區域及周圍區域），可使吸附孔311的大小不同，也可使每單位面積的個數（粗密）不同。另外，多個吸附孔311未必需要沿著相互正交的方向而配置，例如也可配置為圓周狀或漩渦狀，也可不規則地配置。進而，吸附孔311並不限於圓形狀，也可適當變更為長孔形狀、橢圓形狀、四角形狀或多角形狀等。In addition, the size, arrangement, and shape of the plurality of suction holes 311 are not limited to the above-mentioned embodiment. For example, the size of the adsorption holes 311 can be different according to different regions (for example, the central region and the surrounding region) of the adsorption holding surface 31X, and the number (coarseness) per unit area can also be different. In addition, the plurality of suction holes 311 does not necessarily need to be arranged in directions orthogonal to each other, and may be arranged in a circular shape or a spiral shape, or may be arranged irregularly, for example. Furthermore, the suction hole 311 is not limited to a circular shape, and may be appropriately changed to a long hole shape, an elliptical shape, a quadrangular shape, a polygonal shape, or the like.

另外，所述實施方式中，吸附構件31為包括多個吸附孔311的構成，但也可為包括一個吸附孔311的構成。在此情況下，例如，藉由將吸附孔311設為曲折的長孔或漩渦狀的長孔等，能夠遍及廣大範圍來吸附片狀樹脂J。In addition, in the above-described embodiment, the adsorption member 31 has a configuration including a plurality of adsorption holes 311, but it may also be a configuration including one adsorption hole 311. In this case, for example, by forming the adsorption hole 311 as a zigzag long hole or a spiral long hole, etc., the sheet-like resin J can be adsorbed over a wide range.

所述實施方式中，是在吸附構件31設置空間形成構件32而形成內部空間3S的構成，但也可設為不設置空間形成構件32，而將抽吸流路34與吸附構件31的吸附孔311連接的構成。In the above-mentioned embodiment, the space forming member 32 is provided in the suction member 31 to form the internal space 3S. However, the space forming member 32 may not be provided, and the suction flow path 34 and the suction hole of the suction member 31 may be connected. 311 connection structure.

所述實施方式中，將吸附孔311也用作氣體噴出孔，但也可與吸附孔311分開而另外設置氣體噴出孔。In the above embodiment, the adsorption hole 311 is also used as a gas ejection hole, but it may be separated from the adsorption hole 311 and a gas ejection hole may be provided separately.

另外，所述實施方式中，使用包括真空噴射器的真空產生器33來作為從吸附孔311抽吸空氣的抽吸源，但也可使用真空泵。在使用真空泵的情況下，考慮利用柔性配管來構成與真空泵連接的抽吸流路34，構成為使泵不與吸附機構一起移動。In addition, in the above embodiment, the vacuum generator 33 including a vacuum ejector is used as a suction source for sucking air from the adsorption hole 311, but a vacuum pump may also be used. In the case of using a vacuum pump, it is considered that a flexible pipe is used to form the suction flow path 34 connected to the vacuum pump, so that the pump does not move together with the suction mechanism.

另外，除了使用真空產生器33來對氣體噴出孔（吸附孔311）供給氣體的構成以外，也可如圖10所示，設置對氣體噴出孔（吸附孔311）供給氣體的氣體供給部5。此氣體供給部5經由吸附構件31的內部空間3S而對吸附孔311供給氣體，包括空氣源51、以及將此空氣源51與內部空間3S連接的供給流路52。作為空氣源51，考慮使用真空噴射器、壓縮機、配管於工廠內的壓縮空氣等。此外，空氣源51可設置為能夠與吸附機構3一起移動，也可設置為與吸附機構3一起移動。另外，氣體供給部5也可與抽吸流路34同樣，為包括與多個氣體噴出孔連通的多個供給流路52的構成。In addition to the configuration in which the vacuum generator 33 is used to supply gas to the gas ejection hole (adsorption hole 311), as shown in FIG. 10, a gas supply unit 5 that supplies gas to the gas ejection hole (adsorption hole 311) may be provided. This gas supply part 5 supplies gas to the adsorption hole 311 via the internal space 3S of the adsorption member 31, and includes an air source 51 and a supply flow path 52 connecting the air source 51 and the internal space 3S. As the air source 51, it is considered to use a vacuum ejector, a compressor, compressed air piped in a factory, and the like. In addition, the air source 51 may be configured to be movable together with the suction mechanism 3 or may be configured to be movable together with the suction mechanism 3. In addition, the gas supply part 5 may also have a configuration including a plurality of supply flow paths 52 communicating with a plurality of gas ejection holes, similarly to the suction flow path 34.

所述實施方式中，在樹脂供給模塊C中將片狀樹脂J吸附於吸附構件31後即刻使吸附構件31上下反轉，但使吸附構件31上下反轉的時機若為將片狀樹脂J吸附保持而將保護膜PF剝離後、且將所述片狀樹脂J供給至成形模之前，則可適當變更。另外，例如在將片狀樹脂J供給至上模16的情況等，未必需要使吸附構件31旋轉。In the above embodiment, the sheet-like resin J is adsorbed to the adsorption member 31 in the resin supply module C, the adsorption member 31 is turned upside down immediately, but the timing of turning the adsorption member 31 up and down is to adsorb the sheet-like resin J After holding and peeling off the protective film PF and before supplying the sheet-like resin J to the forming mold, it can be appropriately changed. In addition, for example, when the sheet-like resin J is supplied to the upper mold 16, it is not necessary to rotate the adsorption member 31.

另外，為了將吸附保持於吸附構件31的片狀樹脂J高精度地供給至下模15，考慮在將片狀樹脂J的吸附解除之前，且在使吸附構件31或下模15中的至少一者在Z方向上升降移動而減小它們的距離之後，將片狀樹脂J的吸附解除。In addition, in order to supply the sheet-like resin J adsorbed and held by the adsorption member 31 to the lower mold 15 with high accuracy, it is considered that at least one of the adsorption member 31 or the lower mold 15 is removed before the adsorption of the sheet-like resin J is released. After the person moves up and down in the Z direction to reduce their distance, the sheet-like resin J is released from adsorption.

進而，在對下模15設置脫模膜的構成的情況下，考慮使此脫模膜或者吸附構件31中的至少一者升降移動而減小它們的距離後，將片狀樹脂J的吸附解除。藉由在將片狀樹脂J載置於脫模膜之後將脫模膜下降至下模15，能夠將片狀樹脂J高精度地供給至下模15。Furthermore, when a release film is provided to the lower mold 15, it is considered that at least one of the release film or the adsorption member 31 is moved up and down to reduce the distance between them, and then the adsorption of the sheet-like resin J is released. . By placing the sheet-shaped resin J on the release film and then lowering the release film to the lower mold 15, the sheet-shaped resin J can be supplied to the lower mold 15 with high accuracy.

所述實施方式中，是在基板供給收納模塊A與樹脂供給模塊C之間連接有兩個樹脂成形模塊B的構成，但也可設為將基板供給收納模塊A及樹脂供給模塊C設為一個模塊，對此模塊連接樹脂成形模塊B的構成。另外，樹脂成形裝置也可不如所述實施方式那樣模塊化為各模塊。In the above-mentioned embodiment, two resin molding modules B are connected between the substrate supply storage module A and the resin supply module C, but the substrate supply storage module A and the resin supply module C may be set to one Module, this module is connected with resin molded module B. In addition, the resin molding apparatus may not be modularized into modules as in the above-mentioned embodiment.

除此以外，本發明並不限於所述實施方式，當然可在不脫離其主旨的範圍內進行各種變形。In addition to this, the present invention is not limited to the above-mentioned embodiments, and of course various modifications can be made without departing from the gist of the present invention.

100:樹脂成形裝置 2:樹脂供給機構 3:吸附機構 4:移動機構 5:氣體供給部 51:空氣源 52:供給流路 11:基板供給部 12:基板收納部 13:基板載置部 14:基板搬送機構 15:第一成形模（下模） 15C:模腔 15M:凹部 151:底面構件 152:側面構件 153:底板 154:彈性構件 16:第二成形模（上模） 17:合模機構 171:可動盤 172:上部固定盤 173:驅動機構 174:下部固定盤 175:支柱部 176:下模保持部 177:上模保持部 176a、177a:加熱板 176b、177b:隔熱構件 176c、177c:側壁構件 176d、177d:密封構件 31:吸附構件 31X:吸附保持面 311:吸附孔（氣體噴出孔） 32:空間形成構件 3S:內部空間 33:真空產生器 34:抽吸流路 35:凹凸 36:標記部 37:旋轉軸構件 37H:把手 38:支撐構件 39:定位部 A:基板供給收納模塊 B:樹脂成形模塊 C:樹脂供給模塊 CTL:控制部 J:片狀樹脂 PF:保護膜 P:樹脂成形品 S:間隙 W:基板 X、Y、Z:方向100: Resin molding device 2: Resin supply mechanism 3: Adsorption mechanism 4: mobile agency 5: Gas supply department 51: Air source 52: supply flow path 11: Substrate supply department 12: Board storage section 13: Board placement section 14: Substrate transport mechanism 15: The first forming mold (lower mold) 15C: Mould cavity 15M: recess 151: Bottom surface member 152: Side member 153: bottom plate 154: Elastic member 16: The second forming mold (upper mold) 17: Clamping mechanism 171: Movable Disk 172: upper fixed plate 173: drive mechanism 174: Lower fixed plate 175: Pillar 176: Lower mold holding part 177: Upper die holding part 176a, 177a: heating plate 176b, 177b: Thermal insulation components 176c, 177c: side wall members 176d, 177d: sealing member 31: Adsorption component 31X: Adsorption holding surface 311: Adsorption hole (gas ejection hole) 32: Space forming component 3S: Internal space 33: Vacuum generator 34: Suction flow path 35: bump 36: marking department 37: Rotating shaft member 37H: handle 38: Supporting member 39: Positioning Department A: Board supply storage module B: Resin molding module C: Resin supply module CTL: Control Department J: flake resin PF: Protective film P: Resin molded product S: gap W: substrate X, Y, Z: direction

圖1是示意性表示本實施方式的樹脂成形裝置的構成的俯視圖。 圖2是示意性表示所述實施方式的樹脂成形模塊的構成的剖面圖。 圖3是示意性表示將片狀樹脂的（a）保護膜剝落之前的狀態及將（b）保護膜剝離而起皺的狀態的立體圖。 圖4是示意性表示所述實施方式的吸附機構的構成的立體圖。 圖5是示意性表示所述實施方式的吸附機構的構成的俯視圖。 圖6是示意性表示所述實施方式的吸附機構的構成的剖面圖。 圖7是示意性表示所述實施方式的吸附構件的表面的凹凸的部分放大剖面圖。 圖8是表示所述實施方式的樹脂成形的運行的示意圖。 圖9是示意性表示將所述實施方式的吸附構件定位於下模的狀態的剖面圖。 圖10是示意性表示變形實施方式的吸附機構的構成的剖面圖。FIG. 1 is a plan view schematically showing the configuration of the resin molding apparatus of this embodiment. Fig. 2 is a cross-sectional view schematically showing the structure of the resin molding module of the embodiment. Fig. 3 is a perspective view schematically showing a state before the (a) protective film of the sheet-like resin is peeled off, and a state in which the (b) protective film is peeled off and wrinkled. Fig. 4 is a perspective view schematically showing the configuration of the suction mechanism of the embodiment. Fig. 5 is a plan view schematically showing the configuration of the suction mechanism of the embodiment. Fig. 6 is a cross-sectional view schematically showing the configuration of the suction mechanism of the embodiment. Fig. 7 is a partially enlarged cross-sectional view schematically showing irregularities on the surface of the suction member of the embodiment. Fig. 8 is a schematic diagram showing the operation of the resin molding of the embodiment. Fig. 9 is a cross-sectional view schematically showing a state in which the suction member of the embodiment is positioned on a lower mold. Fig. 10 is a cross-sectional view schematically showing the configuration of a suction mechanism according to a modified embodiment.

3:吸附機構 3: Adsorption mechanism

31:吸附構件 31: Adsorption component

31X:吸附保持面 31X: Adsorption holding surface

311:吸附孔(氣體噴出孔) 311: Adsorption hole (gas ejection hole)

36:標記部 36: marking department

37:旋轉軸構件 37: Rotating shaft member

37H:把手 37H: handle

38:支撐構件 38: Supporting member

39:定位部 39: Positioning Department

Claims (8)

一種樹脂成形裝置，包括：彼此相向的第一成形模及第二成形模；合模機構，將所述第一成形模及所述第二成形模合模；以及樹脂供給機構，將片狀樹脂供給至所述第一成形模或所述第二成形模；並且所述樹脂供給機構包括吸附構件，所述吸附構件形成有對在其中一面設置有保護膜的所述片狀樹脂中的另一面加以吸附的吸附孔，在所述吸附構件的形成有所述吸附孔的表面形成有多個凹凸。 A resin molding device includes: a first molding die and a second molding die facing each other; a mold clamping mechanism for clamping the first molding mold and the second molding mold; and a resin supply mechanism for displacing a sheet of resin Is supplied to the first molding die or the second molding die; and the resin supply mechanism includes an adsorption member formed with a pair of the sheet-shaped resin provided with a protective film on one side of the other side The suction holes to be sucked are formed with a plurality of irregularities on the surface of the suction member where the suction holes are formed. 一種樹脂成形裝置，包括：彼此相向的第一成形模及第二成形模；合模機構，將所述第一成形模及所述第二成形模合模；以及樹脂供給機構，將片狀樹脂供給至所述第一成形模或所述第二成形模；並且所述樹脂供給機構包括吸附構件，所述吸附構件形成有對在其中一面設置有保護膜的所述片狀樹脂中的另一面加以吸附的吸附孔，在所述吸附構件形成有多個所述吸附孔，所述樹脂供給機構包括與多個所述吸附孔連通的多個抽吸流路。 A resin molding device includes: a first molding die and a second molding die facing each other; a mold clamping mechanism for clamping the first molding mold and the second molding mold; and a resin supply mechanism for displacing a sheet of resin Is supplied to the first molding die or the second molding die; and the resin supply mechanism includes an adsorption member formed with a pair of the sheet-shaped resin provided with a protective film on one side of the other side The adsorption hole to be adsorbed includes a plurality of the adsorption holes formed in the adsorption member, and the resin supply mechanism includes a plurality of suction flow paths communicating with the plurality of adsorption holes. 如請求項1或請求項2所述的樹脂成形裝置，其中，所述吸附構件構成為能夠對所吸附的所述片狀樹脂的所述另一面噴出氣體。 The resin molding apparatus according to claim 1 or 2, wherein the adsorption member is configured to be able to eject gas to the other surface of the adsorbed sheet-shaped resin. 如請求項3所述的樹脂成形裝置，其中，在所述吸附構件，形成有對所吸附的所述片狀樹脂的所述另一面噴出氣體的氣體噴出孔。 The resin molding apparatus according to claim 3, wherein the adsorbing member is formed with a gas ejection hole that ejects gas to the other surface of the adsorbed sheet-shaped resin. 如請求項4所述的樹脂成形裝置，其中，所述吸附孔兼用作所述氣體噴出孔。 The resin molding apparatus according to claim 4, wherein the adsorption hole also serves as the gas ejection hole. 如請求項1或請求項2所述的樹脂成形裝置，其中，所述吸附構件包括用以將所述片狀樹脂對準的標記部。 The resin molding apparatus according to claim 1 or claim 2, wherein the suction member includes a marking portion for aligning the sheet-shaped resin. 一種樹脂成形品的製造方法，使用如請求項1至請求項6中任一項所述的樹脂成形裝置製造樹脂成形品，所述樹脂成形品的製造方法包括：吸附保持步驟，使在其中一面設置有保護膜的片狀樹脂的另一面吸附於吸附構件，來保持所述片狀樹脂；剝離步驟，從吸附保持於所述吸附構件的所述片狀樹脂上剝離所述保護膜；樹脂供給步驟，將剝離了所述保護膜的所述片狀樹脂以吸附保持於所述吸附構件的狀態供給至所述第一成形模或所述第二成形模；以及樹脂成形步驟，將所述第一成形模及所述第二成形模合模，使用所述片狀樹脂來進行樹脂成形。 A method of manufacturing a resin molded product, using the resin molding apparatus according to any one of claims 1 to 6 to manufacture a resin molded product, the method of manufacturing the resin molded product includes: a step of adsorbing and holding The other side of the sheet-like resin provided with the protective film is adsorbed to the adsorption member to hold the sheet-like resin; the peeling step is to peel the protective film from the sheet-like resin adsorbed and held by the adsorption member; resin supply Step of supplying the sheet-shaped resin from which the protective film has been peeled to the first molding die or the second molding die in a state of being adsorbed and held by the adsorption member; and the resin molding step, the first molding die The first molding die and the second molding die are closed, and resin molding is performed using the sheet-shaped resin. 如請求項7所述的樹脂成形品的製造方法，其中，所述吸附構件構成為能夠對所吸附的所述片狀樹脂的所述另一面噴出氣體，並且在所述樹脂供給步驟中，解除所述吸附保持步驟中的吸附，對所述另一面噴出氣體，將所述片狀樹脂供給至所述第一成形模或所述第二成形模。 The method of manufacturing a resin molded article according to claim 7, wherein the adsorption member is configured to be capable of ejecting gas to the other surface of the adsorbed sheet-like resin, and in the resin supply step, release In the adsorption in the adsorption and holding step, gas is sprayed to the other surface, and the sheet-shaped resin is supplied to the first molding die or the second molding die.
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