TWI736296B - Chip-transferring system and chip-transferring method - Google Patents

Chip-transferring system and chip-transferring method Download PDF

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TWI736296B
TWI736296B TW109118185A TW109118185A TWI736296B TW I736296 B TWI736296 B TW I736296B TW 109118185 A TW109118185 A TW 109118185A TW 109118185 A TW109118185 A TW 109118185A TW I736296 B TWI736296 B TW I736296B
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carrier
wafer
chip
ejector pin
double
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TW109118185A
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TW202145403A (en
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廖建碩
莊國彬
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台灣愛司帝科技股份有限公司
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Priority to CN202010663143.6A priority patent/CN113745145B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a first chip carrier device, a second chip carrier device and a double-ended pin device. The first chip carrier device includes a first soft carrier body for carrying a plurality of first chips. The second chip carrier device includes a second soft carrier body for carrying a plurality of second chips. The double-ended pin device is disposed between the first chip carrier device and the second chip carrier device. The double-ended pin device includes a double-ended pin movably disposed between the first chip carrier device and the second chip carrier device. The double-ended pin includes a first pin portion for pushing against the first chip and a second pin portion for pushing against the second chip. Therefore, the first chips and the second chips are alternately transferred to a first chip carrier structure and a second chip carrier structure.

Description

晶片移轉系統以及晶片移轉方法Wafer transfer system and wafer transfer method

本發明涉及一種晶片移轉系統以及晶片移轉方法，特別是涉及一種發光二極體晶片移轉系統以及發光二極體晶片移轉方法。The invention relates to a wafer transfer system and a wafer transfer method, in particular to a light-emitting diode wafer transfer system and a light-emitting diode wafer transfer method.

現有技術中，發光二極體晶片可以透過吸嘴的取放動作或是頂針的頂抵動作，以從一承載體移轉到另一承載體上。In the prior art, the light-emitting diode chip can be transferred from one carrier to another through the pick-and-place action of the suction nozzle or the push action of the thimble.

本發明所要解決的技術問題在於，針對現有技術的不足提供一種晶片移轉系統以及晶片移轉方法。The technical problem to be solved by the present invention is to provide a wafer transfer system and a wafer transfer method for the deficiencies of the prior art.

為了解決上述的技術問題，本發明所採用的其中一技術方案是提供一種晶片移轉系統，其包括：一第一晶片承載裝置、一第二晶片承載裝置以及一雙頭頂針裝置。第一晶片承載裝置包括用於承載多個第一晶片的一第一軟性承載體。第二晶片承載裝置包括用於承載多個第二晶片的一第二軟性承載體。雙頭頂針裝置設置在第一晶片承載裝置與第二晶片承載裝置之間，雙頭頂針裝置包括接觸第一軟性承載體與第二軟性承載體的一頂推結構以及能活動地設置在頂推結構內的一雙頭頂針。其中，頂推結構包括接觸第一軟性承載體的一第一頂推部以及接觸第二軟性承載體的一第二頂推部，且雙頭頂針包括能活動地裸露在第一頂推部的外部的一第一頂針部以及能活動地裸露在第二頂推部的外部的一第二頂針部；其中，多個第一晶片依序透過雙頭頂針的第一頂針部的頂推，以從第一軟性承載體移轉到一第一晶片承載結構上；其中，多個第二晶片依序透過雙頭頂針的第二頂針部的頂推，以從第二軟性承載體移轉到一第二晶片承載結構上。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a wafer transfer system, which includes: a first wafer carrier device, a second wafer carrier device, and a double-headed ejector pin device. The first chip carrying device includes a first flexible carrier for carrying a plurality of first chips. The second chip carrying device includes a second flexible carrier for carrying a plurality of second chips. The double-headed ejector device is arranged between the first wafer carrying device and the second wafer carrying device. The double-headed ejector device includes an ejector structure contacting the first flexible carrier and the second flexible carrier, and is movably arranged on the ejector. A double-headed thimble inside the structure. Wherein, the pushing structure includes a first pushing portion contacting the first flexible carrier and a second pushing portion contacting the second flexible carrier, and the double-headed ejector pin includes a movably exposed first pushing portion. An outer first ejector pin portion and a second ejector pin portion movably exposed on the outside of the second ejector portion; wherein, a plurality of first chips sequentially push through the first ejector pin portion of the double-headed ejector pin to Transfer from the first flexible carrier to a first chip carrier structure; wherein, a plurality of second chips are sequentially pushed by the second ejector pin portion of the double-headed ejector pin to transfer from the second flexible carrier to a first chip carrier structure. On the second chip carrying structure.

為了解決上述的技術問題，本發明所採用的另外一技術方案是提供一種晶片移轉方法，其包括：透過一第一晶片承載裝置的一第一軟性承載體，以承載多個第一晶片；透過一第二晶片承載裝置的一第二軟性承載體，以承載多個第二晶片；執行步驟(A)：透過一雙頭頂針裝置的一雙頭頂針的一第一頂針部，以將其中一第一晶片從第一軟性承載體移轉到一第一晶片承載結構上；執行步驟(B)：透過雙頭頂針裝置的雙頭頂針的一第二頂針部，以將其中一第二晶片從第二軟性承載體移轉到一第二晶片承載結構上；以及，反覆執行步驟(A)與步驟(B)，以使得多個第一晶片與多個第二晶片被交替地移轉到第一晶片承載結構與第二晶片承載結構上。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a wafer transfer method, which includes: carrying a plurality of first wafers through a first flexible carrier of a first wafer carrying device; A second flexible carrier of a second chip carrier device is used to carry a plurality of second chips; step (A) is performed: a first ejector pin portion of a double-headed ejector pin of a double-headed ejector pin device is used to A first chip is transferred from the first flexible carrier to a first chip carrying structure; step (B) is performed: through a second ejector portion of the double-headed ejector pin of the double-headed ejector device to transfer one of the second chips Transfer from the second flexible carrier to a second chip carrier structure; and, repeat steps (A) and (B), so that the plurality of first chips and the plurality of second chips are alternately transferred to On the first chip carrying structure and the second chip carrying structure.

為了解決上述的技術問題，本發明所採用的另外再一技術方案是提供一種晶片移轉系統，其包括：一第一晶片承載裝置、一第二晶片承載裝置以及一雙頭頂針裝置。第一晶片承載裝置包括用於承載多個第一晶片的一第一軟性承載體。第二晶片承載裝置包括用於承載多個第二晶片的一第二軟性承載體。雙頭頂針裝置設置在第一晶片承載裝置與第二晶片承載裝置之間，雙頭頂針裝置包括能活動地設置在第一晶片承載裝置與第二晶片承載裝置之間的一雙頭頂針。其中，雙頭頂針包括用於頂推第一晶片的一第一頂針部以及用於頂推第二晶片的一第二頂針部。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a wafer transfer system, which includes: a first wafer carrier device, a second wafer carrier device, and a double-headed ejector pin device. The first chip carrying device includes a first flexible carrier for carrying a plurality of first chips. The second chip carrying device includes a second flexible carrier for carrying a plurality of second chips. The double-headed ejector pin device is arranged between the first wafer carrying device and the second wafer carrying device. The double-headed ejector pin device includes a double-headed ejector pin movably arranged between the first wafer carrying device and the second wafer carrying device. Wherein, the double-headed ejector pin includes a first ejector pin portion for pushing the first wafer and a second ejector pin portion for pushing the second wafer.

本發明的其中一有益效果在於，本發明所提供的晶片移轉系統，其能通過“雙頭頂針裝置設置在第一晶片承載裝置與第二晶片承載裝置之間”、“雙頭頂針裝置包括能活動地設置在第一晶片承載裝置與第二晶片承載裝置之間的一雙頭頂針”以及“雙頭頂針包括用於頂推第一晶片的一第一頂針部以及用於頂推第二晶片的一第二頂針部”的技術方案，以使得多個第一晶片與多個第二晶片能被交替地移轉到第一晶片承載結構與第二晶片承載結構上。One of the beneficial effects of the present invention is that the wafer transfer system provided by the present invention can be arranged between the first wafer carrier device and the second wafer carrier device through the "double-headed ejector pin device", and the "double-headed ejector pin device includes A double-headed ejector pin movably arranged between the first wafer carrier device and the second wafer carrier device" and the "double-headed ejector pin includes a first ejector pin part for pushing the first wafer and a second ejector pin for pushing the second wafer. The technical solution of "a second ejector pin part of the wafer" enables the first wafers and the second wafers to be alternately transferred to the first wafer supporting structure and the second wafer supporting structure.

本發明的其中一有益效果在於，本發明所提供的晶片移轉方法，其能通過“執行步驟(A)：透過一雙頭頂針裝置的一雙頭頂針的一第一頂針部，以將其中一第一晶片從第一軟性承載體移轉到一第一晶片承載結構上”、“執行步驟(B)：透過雙頭頂針裝置的雙頭頂針的一第二頂針部，以將其中一第二晶片從第二軟性承載體移轉到一第二晶片承載結構上”以及“反覆執行步驟(A)與步驟(B)”的技術方案，以使得多個第一晶片與多個第二晶片能被交替地移轉到第一晶片承載結構與第二晶片承載結構上。One of the beneficial effects of the present invention is that the wafer transfer method provided by the present invention can perform step (A): pass through a first ejector part of a double-headed ejector pin of a double-headed ejector device to transfer it A first chip is transferred from the first flexible carrier to a first chip carrying structure", "Execute step (B): pass through a second ejector part of the double-headed ejector pin of the double-headed ejector device to transfer one of the first The two chips are transferred from the second flexible carrier to a second chip carrier structure" and the technical solution of "repetitively performing steps (A) and (B)", so that a plurality of first chips and a plurality of second chips It can be alternately transferred to the first wafer carrying structure and the second wafer carrying structure.

為使能進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“晶片移轉系統以及晶片移轉方法”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以實行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不背離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is a specific embodiment to illustrate the implementation of the "wafer transfer system and wafer transfer method" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

請參閱圖1至圖11所示，本發明提供一種晶片移轉系統S，其包括：一第一晶片承載裝置1、一第二晶片承載裝置2以及一雙頭頂針裝置3。更進一步來說，第一晶片承載裝置1包括用於承載多個第一晶片C1的一第一軟性承載體11，並且第二晶片承載裝置2包括用於承載多個第二晶片C2的一第二軟性承載體21。另外，雙頭頂針裝置3設置在第一晶片承載裝置1與第二晶片承載裝置2之間，並且雙頭頂針裝置3包括能活動地設置在第一晶片承載裝置1與第二晶片承載裝置2之間的一雙頭頂針32。此外，雙頭頂針32包括用於頂推第一晶片C1的一第一頂針部321以及用於頂推第二晶片C2的一第二頂針部322。Please refer to FIG. 1 to FIG. 11, the present invention provides a wafer transfer system S, which includes: a first wafer carrier device 1, a second wafer carrier device 2 and a double-headed ejector pin device 3. Furthermore, the first chip carrying device 1 includes a first flexible carrier 11 for carrying a plurality of first chips C1, and the second chip carrying device 2 includes a first flexible carrier 11 for carrying a plurality of second chips C2. Two soft carrier 21. In addition, the double-headed ejector device 3 is arranged between the first wafer carrier device 1 and the second wafer carrier device 2, and the double-headed ejector device 3 includes movably installed on the first wafer carrier device 1 and the second wafer carrier device 2. Between a pair of head thimble 32. In addition, the double-headed ejector pin 32 includes a first ejector pin portion 321 for pushing the first chip C1 and a second ejector pin portion 322 for pushing the second chip C2.

[第一實施例][First Embodiment]

參閱圖1至圖5所示，本發明第一實施例提供一種晶片移轉方法，其包括：首先，配合圖1與圖2所示，透過一第一晶片承載裝置1的一第一軟性承載體11，以承載多個第一晶片C1，並且透過一第二晶片承載裝置2的一第二軟性承載體21，以承載多個第二晶片C2（步驟S100）；接著，配合圖1與圖2所示，執行步驟(A)：透過一雙頭頂針裝置3的一雙頭頂針32的一第一頂針部321，以將其中一第一晶片C1從第一軟性承載體11移轉到一第一晶片承載結構4上（步驟S102）；然後，配合圖1與圖3所示，執行步驟(B)：透過雙頭頂針裝置3的雙頭頂針32的一第二頂針部322，以將其中一第二晶片C2從第二軟性承載體21移轉到一第二晶片承載結構5上（步驟S104）；接下來，配合圖1、圖4與圖5所示，反覆執行步驟(A)與步驟(B)，以使得多個第一晶片C1與多個第二晶片C2被交替地移轉到第一晶片承載結構4與第二晶片承載結構5上（步驟S106）。1 to FIG. 5, the first embodiment of the present invention provides a wafer transfer method, which includes: first, in conjunction with FIG. 1 and FIG. 2, through a first flexible carrier of a first chip carrier device 1 The body 11 carries a plurality of first chips C1, and passes through a second flexible carrier 21 of a second chip carrier device 2 to carry a plurality of second chips C2 (step S100); As shown in Fig. 2, step (A) is performed: through a first ejector portion 321 of a double-headed ejector pin 32 of a double-headed ejector device 3 to transfer one of the first chips C1 from the first flexible carrier 11 to a On the first wafer carrying structure 4 (step S102); then, in conjunction with FIG. 1 and FIG. 3, perform step (B): pass through a second thimble portion 322 of the double-headed thimble 32 of the double-headed thimble device 3 to One of the second chips C2 is transferred from the second flexible carrier 21 to a second chip carrier structure 5 (step S104); next, as shown in FIGS. 1, 4 and 5, step (A) is repeated And step (B), so that the plurality of first wafers C1 and the plurality of second wafers C2 are alternately transferred to the first wafer carrying structure 4 and the second wafer carrying structure 5 (step S106).

舉例來說，配合圖2至圖5所示，第一軟性承載體11可為一第一藍膜或者任何具有黏著層的第一晶片承載膜，並且第一可移動承載體12可為用於承載第一藍膜的一第一藍膜承載件或者任何具有承載或者夾持功能的第一可移動承載件。另外，第二軟性承載體21可為一第二藍膜或者任何具有黏著層的第二晶片承載膜，並且第二可移動承載體22可為用於承載第二藍膜的一第二藍膜承載件或者任何具有承載或者夾持功能的第二可移動承載件。此外，第一晶片C1可為第一發光二極體晶片、第一IC晶片或者任何種類的第一電子元件，並且第二晶片C2可為第二發光二極體晶片、第二IC晶片或者任何種類的第二電子元件。值得注意的是，第一晶片承載結構4包括具有多個第一導電接點4100的一第一電路基板41以及分別設置在多個第一導電接點4100上的多個第一導電焊接材料42（例如錫球、錫膏或者任何種類的焊接材料），並且第二晶片承載結構5包括具有多個第二導電接點5100的一第二電路基板51以及分別設置在多個第二導電接點5100上的多個第二導電焊接材料52（例如錫球、錫膏或者任何種類的焊接材料）。然而，上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。For example, as shown in FIGS. 2 to 5, the first flexible carrier 11 can be a first blue film or any first chip carrier film with an adhesive layer, and the first movable carrier 12 can be used for A first blue film carrier bearing the first blue film or any first movable carrier with a bearing or clamping function. In addition, the second flexible carrier 21 can be a second blue film or any second chip carrier film with an adhesive layer, and the second movable carrier 22 can be a second blue film for carrying the second blue film. A carrier or any second movable carrier with a bearing or clamping function. In addition, the first chip C1 can be a first light-emitting diode chip, a first IC chip or any kind of first electronic component, and the second chip C2 can be a second light-emitting diode chip, a second IC chip, or any type of first electronic component. Kind of second electronic component. It is worth noting that the first chip carrying structure 4 includes a first circuit substrate 41 having a plurality of first conductive contacts 4100 and a plurality of first conductive soldering materials 42 respectively disposed on the plurality of first conductive contacts 4100 (Such as solder balls, solder paste or any kind of soldering materials), and the second chip carrying structure 5 includes a second circuit substrate 51 having a plurality of second conductive contacts 5100 and is respectively arranged on the plurality of second conductive contacts A plurality of second conductive soldering materials 52 (such as solder balls, solder paste, or any kind of soldering materials) on the 5100. However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

配合圖2至圖5所示，本發明第一實施例提供一種晶片移轉系統S，其包括：一第一晶片承載裝置1、一第二晶片承載裝置2以及一雙頭頂針裝置3。更進一步來說，第一晶片承載裝置1包括用於承載多個第一晶片C1的一第一軟性承載體11，並且第二晶片承載裝置2包括用於承載多個第二晶片C2的一第二軟性承載體21。再者，雙頭頂針裝置3設置在第一晶片承載裝置1與第二晶片承載裝置2之間，並且雙頭頂針裝置3包括直接或者間接接觸第一軟性承載體11與第二軟性承載體21的一頂推結構31以及能活動地設置在頂推結構31內的一雙頭頂針32。As shown in FIGS. 2 to 5, the first embodiment of the present invention provides a wafer transfer system S, which includes: a first wafer carrier device 1, a second wafer carrier device 2, and a double-headed ejector pin device 3. Furthermore, the first chip carrying device 1 includes a first flexible carrier 11 for carrying a plurality of first chips C1, and the second chip carrying device 2 includes a first flexible carrier 11 for carrying a plurality of second chips C2. Two soft carrier 21. Furthermore, the double-headed ejector device 3 is arranged between the first wafer carrying device 1 and the second wafer carrying device 2, and the double-headed ejector device 3 includes direct or indirect contact with the first flexible carrier 11 and the second flexible carrier 21 An ejector structure 31 and a double-headed ejector pin 32 movably arranged in the ejector structure 31.

舉例來說，配合圖2至圖5所示，頂推結構31包括直接或者間接接觸第一軟性承載體11的一第一頂推部311以及直接或者間接接觸第二軟性承載體21的一第二頂推部312，並且雙頭頂針32包括能活動地裸露在第一頂推部311的外部的一第一頂針部321以及能活動地裸露在第二頂推部312的外部的一第二頂針部322。更進一步來說，第一頂推部311包括用於裸露第一頂針部321的一第一頂針開口3111，並且第二頂推部312包括用於裸露第二頂針部322的一第二頂針開口3121。另外，雙頭頂針32可以在頂推結構31內進行上下往覆運動，以使得雙頭頂針32的第一頂針部321能選擇性地移動到第一頂推部311的內部或者第一頂推部311的外部，並且使得雙頭頂針32的第二頂針部322能選擇性地移動到第二頂推部312的內部或者第二頂推部312的外部。藉此，當雙頭頂針32的第一頂針部321被移動到第一頂推部311的外部時，第一頂針部321能刺穿第一軟性承載體11以頂推第一晶片C1。當雙頭頂針32的第二頂針部322被移動到第二頂推部312的外部時，第二頂針部322能刺穿第二軟性承載體21以頂推第二晶片C2。然而，上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。For example, as shown in FIGS. 2 to 5, the pushing structure 31 includes a first pushing portion 311 that directly or indirectly contacts the first flexible carrier 11, and a first pushing portion 311 that directly or indirectly contacts the second flexible carrier 21. Two ejector parts 312, and the double-headed ejector pin 32 includes a first ejector pin portion 321 movably exposed on the outside of the first ejector portion 311 and a second ejector pin portion 321 movably exposed on the outside of the second ejector portion 312 Thimbles 322. Furthermore, the first pushing portion 311 includes a first thimble opening 3111 for exposing the first thimble portion 321, and the second pushing portion 312 includes a second thimble opening for exposing the second thimble portion 322 3121. In addition, the double-headed ejector pin 32 can perform up and down movement in the ejector structure 31, so that the first ejector pin portion 321 of the double-headed ejector pin 32 can selectively move to the inside of the first ejector portion 311 or the first ejector The second ejector pin portion 322 of the double-headed ejector pin 32 can be selectively moved to the inside of the second ejector portion 312 or the outside of the second ejector portion 312. Thereby, when the first ejector pin portion 321 of the double-headed ejector pin 32 is moved to the outside of the first ejector portion 311, the first ejector pin portion 321 can pierce the first flexible carrier 11 to eject the first chip C1. When the second ejector pin portion 322 of the double-head ejector pin 32 is moved to the outside of the second ejector portion 312, the second ejector pin portion 322 can pierce the second flexible carrier 21 to eject the second chip C2. However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

舉例來說，配合圖2與圖4所示，多個第一晶片C1能依序透過雙頭頂針32的第一頂針部321的頂推，以從第一軟性承載體11移轉到一第一晶片承載結構4上，而使得每一第一晶片C1能被放置在第一晶片承載結構4的兩個相對應的第一導電焊接材料42上。另外，配合圖3與圖5所示，多個第二晶片C2能依序透過雙頭頂針32的第二頂針部322的頂推，以從第二軟性承載體21移轉到一第二晶片承載結構5上，而使得每一第二晶片C2能被放置在第二晶片承載結構5的兩個相對應的第二導電焊接材料52上。值得注意的是，配合圖2至圖5所示，第一晶片承載裝置1包括用於承載第一軟性承載體11的一第一可移動承載體12，並且每一第一晶片C1能透過第一可移動承載體12的移動而改變每一第一晶片C1相對於雙頭頂針32的第一頂針部321的位置。再者，第二晶片承載裝置2包括用於承載第二軟性承載體21的一第二可移動承載體22，並且每一第二晶片C2能透過第二可移動承載體22的移動而改變每一第二晶片C2相對於雙頭頂針32的第二頂針部322的位置。然而，上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。For example, as shown in FIG. 2 and FIG. 4, a plurality of first chips C1 can sequentially be pushed through the first ejector pin portion 321 of the double-headed ejector pin 32 to transfer from the first flexible carrier 11 to the first ejector pin portion 321. A chip carrying structure 4 so that each first chip C1 can be placed on two corresponding first conductive soldering materials 42 of the first chip carrying structure 4. In addition, as shown in FIGS. 3 and 5, a plurality of second chips C2 can sequentially be pushed through the second ejector pin portion 322 of the double-headed ejector pin 32 to transfer from the second flexible carrier 21 to a second chip. The supporting structure 5 allows each second chip C2 to be placed on two corresponding second conductive soldering materials 52 of the second chip supporting structure 5. It is worth noting that, as shown in FIGS. 2 to 5, the first chip carrying device 1 includes a first movable carrier 12 for carrying a first flexible carrier 11, and each first chip C1 can pass through the first flexible carrier 11 The movement of a movable carrier 12 changes the position of each first chip C1 relative to the first ejector pin portion 321 of the double-head ejector pin 32. Furthermore, the second chip carrying device 2 includes a second movable carrier 22 for carrying the second flexible carrier 21, and each second chip C2 can be changed by the movement of the second movable carrier 22. The position of a second chip C2 relative to the second ejector pin portion 322 of the double-head ejector pin 32. However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

藉此，配合圖1至圖5所示，雙頭頂針32的第一頂針部321與第二頂針部322能交替頂推第一晶片C1（如圖2與圖4所示）與第二晶片C2（如圖3與圖5所示），以使得多個第一晶片C1與多個第二晶片C2被交替地移轉到第一晶片承載結構4（如圖2與圖4所示）與第二晶片承載結構5（如圖3與圖5所示）。Thereby, as shown in FIGS. 1 to 5, the first ejector pin portion 321 and the second ejector pin portion 322 of the double-headed ejector pin 32 can alternately push the first chip C1 (shown in FIGS. 2 and 4) and the second chip C2 (shown in Figures 3 and 5), so that the plurality of first wafers C1 and the plurality of second wafers C2 are alternately transferred to the first wafer carrying structure 4 (shown in Figures 2 and 4) and The second wafer carrying structure 5 (as shown in FIG. 3 and FIG. 5).

[第二實施例][Second Embodiment]

參閱圖1以及圖6至圖9所示，本發明第二實施例提供一種晶片移轉系統S以及晶片移轉方法，並且晶片移轉系統S包括一第一晶片承載裝置1、一第二晶片承載裝置2以及一雙頭頂針裝置3。由圖6至圖9分別與圖2至圖5的比較可知，本發明第二實施例與第一實施例最大的差別在於：在第二實施例中，第一晶片承載結構4包括一第一承載基板43以及設置在第一承載基板43上的一第一晶片黏著層44，並且第二晶片承載結構5包括一第二承載基板53以及設置在第二承載基板53上的一第二晶片黏著層54。Referring to FIG. 1 and FIGS. 6-9, a second embodiment of the present invention provides a wafer transfer system S and a wafer transfer method, and the wafer transfer system S includes a first wafer carrier device 1 and a second wafer Carrying device 2 and a double-head thimble device 3. From the comparison of FIGS. 6 to 9 and FIGS. 2 to 5 respectively, the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the first wafer carrying structure 4 includes a first The carrier substrate 43 and a first chip adhesive layer 44 disposed on the first carrier substrate 43, and the second chip carrier structure 5 includes a second carrier substrate 53 and a second chip adhesive layer disposed on the second carrier substrate 53 Layer 54.

舉例來說，配合圖6與圖8所示，多個第一晶片C1能依序透過雙頭頂針32的第一頂針部321的頂推，以從第一軟性承載體11移轉到一第一晶片承載結構4上，而使得每一第一晶片C1能被黏附在第一晶片承載結構4的第一晶片黏著層44上。另外，配合圖7與圖9所示，多個第二晶片C2能依序透過雙頭頂針32的第二頂針部322的頂推，以從第二軟性承載體21移轉到一第二晶片承載結構5上，而使得每一第二晶片C2能被黏附在第二晶片承載結構5的第二晶片黏著層54上。For example, as shown in FIGS. 6 and 8, a plurality of first chips C1 can sequentially be pushed through the first ejector pin portion 321 of the double-headed ejector pin 32 to move from the first flexible carrier 11 to the first ejector pin portion 321. A chip carrier structure 4 so that each first chip C1 can be adhered to the first chip adhesive layer 44 of the first chip carrier structure 4. In addition, as shown in FIG. 7 and FIG. 9, a plurality of second chips C2 can sequentially be pushed through the second ejector pin portion 322 of the double-headed ejector pin 32 to transfer from the second flexible carrier 21 to a second chip. The supporting structure 5 allows each second chip C2 to be adhered to the second chip adhesive layer 54 of the second chip supporting structure 5.

藉此，配合圖1以及圖6至圖9所示，雙頭頂針32的第一頂針部321與第二頂針部322能交替頂推第一晶片C1（如圖6與圖8所示）與第二晶片C2（如圖7與圖9所示），以使得多個第一晶片C1與多個第二晶片C2被交替地移轉到第一晶片承載結構4（如圖6與圖8所示）與第二晶片承載結構5（如圖7與圖9所示）。Thereby, as shown in FIG. 1 and FIGS. 6-9, the first ejector pin portion 321 and the second ejector pin portion 322 of the double-headed ejector pin 32 can alternately push the first chip C1 (as shown in FIG. 6 and FIG. 8) and The second chip C2 (as shown in FIGS. 7 and 9), so that the plurality of first chips C1 and the plurality of second chips C2 are alternately transferred to the first chip carrier structure 4 (as shown in FIGS. 6 and 8) (Shown) and the second wafer carrying structure 5 (shown in Figures 7 and 9).

[第三實施例][Third Embodiment]

參閱圖1以及圖10至圖13所示，本發明第三實施例提供一種晶片移轉系統S以及晶片移轉方法，並且晶片移轉系統S包括一第一晶片承載裝置1、一第二晶片承載裝置2以及一雙頭頂針裝置3。由圖10至圖13分別與圖2至圖5的比較可知，本發明第三實施例與第一實施例最大的差別在於：在第三實施例中，第一頂推部311包括用於裸露第一頂針部321的一第一頂針開口3111以及圍繞第一頂針開口3111的多個第一吸氣口3112，並且第二頂推部312包括用於裸露第二頂針部322的一第二頂針開口3121以及圍繞第二頂針開口3121的多個第二吸氣口3122。Referring to FIG. 1 and FIG. 10 to FIG. 13, a third embodiment of the present invention provides a wafer transfer system S and a wafer transfer method, and the wafer transfer system S includes a first wafer carrier device 1 and a second wafer Carrying device 2 and a double-head thimble device 3. From the comparison of FIGS. 10 to 13 with FIGS. 2 to 5 respectively, the biggest difference between the third embodiment of the present invention and the first embodiment is that: in the third embodiment, the first pushing portion 311 includes an exposed portion A first thimble opening 3111 of the first thimble portion 321 and a plurality of first suction ports 3112 surrounding the first thimble opening 3111, and the second pushing portion 312 includes a second thimble for exposing the second thimble portion 322 An opening 3121 and a plurality of second suction ports 3122 surrounding the second thimble opening 3121.

舉例來說，配合圖第一頂針開口3111能大於、小於或者等於第一吸氣口3112，並且第一軟性承載體11因著被多個第一吸氣口3112所吸附而提升第一軟性承載體11的平整度，藉此雙頭頂針32的第一頂針部321能更準確地對準且頂推第一晶片C1，以使得第一晶片C1能更準確地被移轉到第一晶片承載結構4上。另外，第二頂針開口3121能大於、小於或者等於第二吸氣口3122，並且第二軟性承載體21因著被多個第二吸氣口3122所吸附而提升第二軟性承載體21的平整度，藉此雙頭頂針32的第二頂針部322能更準確地對準且頂推第二晶片C2，以使得第二晶片C2能更準確地被移轉到第二晶片承載結構5上。For example, the first thimble opening 3111 in the matching figure can be larger, smaller than or equal to the first suction port 3112, and the first flexible carrier 11 is adsorbed by the plurality of first suction ports 3112 to increase the first flexible carrier The flatness of the body 11, whereby the first ejector pin portion 321 of the double-headed ejector pin 32 can more accurately align and push the first chip C1, so that the first chip C1 can be more accurately transferred to the first chip carrier Structure 4. In addition, the second thimble opening 3121 can be larger, smaller than or equal to the second suction port 3122, and the second flexible carrier 21 is absorbed by the plurality of second suction ports 3122 to improve the flatness of the second flexible carrier 21 In this way, the second ejector pin portion 322 of the double-head ejector pin 32 can more accurately align and push the second chip C2, so that the second chip C2 can be transferred to the second chip carrier structure 5 more accurately.

藉此，配合圖1以及圖10至圖13所示，雙頭頂針32的第一頂針部321與第二頂針部322能交替頂推第一晶片C1（如圖10與圖12所示）與第二晶片C2（如圖11與圖13所示），以使得多個第一晶片C1與多個第二晶片C2被交替地移轉到第一晶片承載結構4（如圖10與圖12所示）與第二晶片承載結構5（如圖11與圖13所示）。Thereby, as shown in FIG. 1 and FIG. 10 to FIG. 13, the first ejector pin portion 321 and the second ejector pin portion 322 of the double-headed ejector pin 32 can alternately push the first chip C1 (as shown in FIG. 10 and FIG. 12) and The second chip C2 (as shown in FIGS. 11 and 13), so that the plurality of first chips C1 and the plurality of second chips C2 are alternately transferred to the first chip carrier structure 4 (as shown in FIGS. 10 and 12) (Shown) and the second wafer carrying structure 5 (shown in Figure 11 and Figure 13).

[實施例的有益效果][Beneficial effects of the embodiment]

本發明的其中一有益效果在於，本發明所提供的晶片移轉系統S，其能通過“雙頭頂針裝置3設置在第一晶片承載裝置1與第二晶片承載裝置2之間”、“雙頭頂針裝置3包括能活動地設置在第一晶片承載裝置1與第二晶片承載裝置2之間的一雙頭頂針32”以及“雙頭頂針32包括用於頂推第一晶片C1的一第一頂針部321以及用於頂推第二晶片C2的一第二頂針部322”的技術方案，以使得多個第一晶片C1與多個第二晶片C2能被交替地移轉到第一晶片承載結構4與第二晶片承載結構5上（也就是說，雙頭頂針32的第一頂針部321與第二頂針部322能交替頂推第一晶片C1與第二晶片C2，以使得多個第一晶片C1與多個第二晶片C2被交替地移轉到第一晶片承載結構4與第二晶片承載結構5上）。One of the beneficial effects of the present invention is that the wafer transfer system S provided by the present invention can be set between the first wafer carrier device 1 and the second wafer carrier device 2 through the "double-headed ejector device 3", "double The head ejector device 3 includes a double-headed ejector pin 32 movably arranged between the first wafer carrier device 1 and the second wafer carrier device 2" and the "double-headed ejector pin 32" includes a second ejector pin for pushing the first wafer C1. The technical solution of a thimble portion 321 and a second thimble portion 322" for pushing the second chip C2, so that the plurality of first chips C1 and the plurality of second chips C2 can be alternately transferred to the first chip The supporting structure 4 and the second chip supporting structure 5 (that is, the first ejector pin portion 321 and the second ejector pin portion 322 of the double-headed ejector pin 32 can alternately push the first chip C1 and the second chip C2, so that a plurality of The first chip C1 and the plurality of second chips C2 are alternately transferred to the first chip carrier structure 4 and the second chip carrier structure 5).

本發明的其中一有益效果在於，本發明所提供的晶片移轉方法，其能通過“執行步驟(A)：透過一雙頭頂針裝置3的一雙頭頂針32的一第一頂針部321，以將其中一第一晶片C1從第一軟性承載體11移轉到一第一晶片承載結構4上”、“執行步驟(B)：透過雙頭頂針裝置3的雙頭頂針32的一第二頂針部322，以將其中一第二晶片C2從第二軟性承載體21移轉到一第二晶片承載結構5上”以及“反覆執行步驟(A)與步驟(B)”的技術方案，以使得多個第一晶片C1與多個第二晶片C2能被交替地移轉到第一晶片承載結構4與第二晶片承載結構5上（也就是說，雙頭頂針32的第一頂針部321與第二頂針部322能交替頂推第一晶片C1與第二晶片C2，以使得多個第一晶片C1與多個第二晶片C2被交替地移轉到第一晶片承載結構4與第二晶片承載結構5上）。One of the beneficial effects of the present invention is that the wafer transfer method provided by the present invention can perform step (A): through a first thimble portion 321 of a double-headed thimble 32 of a double-headed thimble device 3, In order to transfer one of the first chips C1 from the first flexible carrier 11 to a first chip carrier structure 4", "Perform step (B): pass through a second pin 32 of the double-headed ejector device 3 The thimble portion 322 is used to transfer one of the second chips C2 from the second flexible carrier 21 to a second chip carrier structure 5" and the technical solution of "repeating steps (A) and (B)" to So that the plurality of first wafers C1 and the plurality of second wafers C2 can be alternately transferred to the first wafer carrier structure 4 and the second wafer carrier structure 5 (that is, the first ejector pin portion 321 of the double-head ejector pin 32 And the second ejector pin portion 322 can alternately push the first chip C1 and the second chip C2, so that the plurality of first chips C1 and the plurality of second chips C2 are alternately transferred to the first chip carrier structure 4 and the second chip carrier structure 4 and the second chip. The wafer carrying structure 5).

以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

S:晶片移轉系統S: Wafer Transfer System

1:第一晶片承載裝置1: The first chip carrying device

11:第一軟性承載體11: The first soft carrier

12:第一可移動承載體12: The first movable carrier

2:第二晶片承載裝置2: The second chip carrying device

21:第二軟性承載體21: The second soft carrier

22:第二可移動承載體22: The second movable carrier

3:雙頭頂針裝置3: Double-head thimble device

31:頂推結構31: Push structure

311:第一頂推部311: The first pushing part

3111:第一頂針開口3111: The first thimble opening

3112:第一吸氣口3112: First suction port

312:第二頂推部312: The second pushing part

3121:第二頂針開口3121: The second thimble opening

3122:第二吸氣口3122: second suction port

32:雙頭頂針32: Double-ended thimble

321:第一頂針部321: The first thimble part

322:第二頂針部322: The second thimble part

4:第一晶片承載結構4: The first chip carrying structure

41:第一電路基板41: The first circuit board

4100:第一導電接點4100: The first conductive contact

42:第一導電焊接材料42: The first conductive welding material

43:第一承載基板43: The first carrier substrate

44:第一晶片黏著層44: first chip adhesive layer

5:第二晶片承載結構5: The second chip carrying structure

51:第二電路基板51: second circuit board

5100:第二導電接點5100: second conductive contact

52:第二導電焊接材料52: The second conductive welding material

53:第二承載基板53: second carrier substrate

54:第二晶片黏著層54: second chip adhesive layer

C1:第一晶片C1: The first chip

C2:第二晶片C2: second chip

圖1為本發明所提供的晶片移轉方法的流程圖。FIG. 1 is a flowchart of a wafer transfer method provided by the present invention.

圖2為本發明第一實施例所提供的晶片移轉系統透過第一頂針部以將其中一第一晶片從第一軟性承載體移轉到第一晶片承載結構的示意圖。2 is a schematic diagram of the wafer transfer system provided by the first embodiment of the present invention to transfer one of the first wafers from the first flexible carrier to the first wafer carrier structure through the first ejector pin portion.

圖3為本發明第一實施例所提供的晶片移轉系統透過第二頂針部以將其中一第二晶片從第二軟性承載體移轉到第二晶片承載結構的示意圖。3 is a schematic diagram of the wafer transfer system provided by the first embodiment of the present invention to transfer one of the second wafers from the second flexible carrier to the second wafer carrier structure through the second ejector pin portion.

圖4為本發明第一實施例所提供的晶片移轉系統透過第一頂針部以將另外一第一晶片從第一軟性承載體移轉到第一晶片承載結構的示意圖。4 is a schematic diagram of the wafer transfer system provided by the first embodiment of the present invention to transfer another first wafer from the first flexible carrier to the first wafer carrier structure through the first ejector pin portion.

圖5為本發明第一實施例所提供的晶片移轉系統透過第二頂針部以將另外一第二晶片從第二軟性承載體移轉到第二晶片承載結構的示意圖。FIG. 5 is a schematic diagram of the wafer transfer system provided by the first embodiment of the present invention to transfer another second wafer from the second flexible carrier to the second wafer carrying structure through the second ejector part.

圖6為本發明第二實施例所提供的晶片移轉系統透過第一頂針部以將其中一第一晶片從第一軟性承載體移轉到第一晶片承載結構的示意圖。6 is a schematic diagram of the wafer transfer system provided by the second embodiment of the present invention to transfer one of the first wafers from the first flexible carrier to the first wafer carrying structure through the first ejector pin portion.

圖7為本發明第二實施例所提供的晶片移轉系統透過第二頂針部以將其中一第二晶片從第二軟性承載體移轉到第二晶片承載結構的示意圖。FIG. 7 is a schematic diagram of the wafer transfer system provided by the second embodiment of the present invention to transfer one of the second wafers from the second flexible carrier to the second wafer carrying structure through the second ejector pin portion.

圖8為本發明第二實施例所提供的晶片移轉系統透過第一頂針部以將另外一第一晶片從第一軟性承載體移轉到第一晶片承載結構的示意圖。FIG. 8 is a schematic diagram of the wafer transfer system provided by the second embodiment of the present invention to transfer another first wafer from the first flexible carrier to the first wafer carrier structure through the first ejector pin portion.

圖9為本發明第二實施例所提供的晶片移轉系統透過第二頂針部以將另外一第二晶片從第二軟性承載體移轉到第二晶片承載結構的示意圖。FIG. 9 is a schematic diagram of the wafer transfer system provided by the second embodiment of the present invention to transfer another second wafer from the second flexible carrier to the second wafer carrying structure through the second ejector pin portion.

圖10為本發明第三實施例所提供的晶片移轉系統透過第一頂針部以將其中一第一晶片從第一軟性承載體移轉到第一晶片承載結構的示意圖。10 is a schematic diagram of the wafer transfer system provided by the third embodiment of the present invention to transfer one of the first wafers from the first flexible carrier to the first wafer carrier structure through the first ejector pin portion.

圖11為本發明第三實施例所提供的晶片移轉系統透過第二頂針部以將其中一第二晶片從第二軟性承載體移轉到第二晶片承載結構的示意圖。11 is a schematic diagram of the wafer transfer system provided by the third embodiment of the present invention to transfer one of the second wafers from the second flexible carrier to the second wafer carrying structure through the second ejector pin portion.

圖12為本發明第三實施例所提供的晶片移轉系統透過第一頂針部以將另外一第一晶片從第一軟性承載體移轉到第一晶片承載結構的示意圖。12 is a schematic diagram of the wafer transfer system provided by the third embodiment of the present invention to transfer another first wafer from the first flexible carrier to the first wafer carrying structure through the first ejector pin portion.

圖13為本發明第三實施例所提供的晶片移轉系統透過第二頂針部以將另外一第二晶片從第二軟性承載體移轉到第二晶片承載結構的示意圖。13 is a schematic diagram of the wafer transfer system provided by the third embodiment of the present invention through the second ejector pin portion to transfer another second wafer from the second flexible carrier to the second wafer carrier structure.

S:晶片移轉系統 S: Wafer Transfer System

1:第一晶片承載裝置 1: The first chip carrying device

11:第一軟性承載體 11: The first soft carrier

12:第一可移動承載體 12: The first movable carrier

2:第二晶片承載裝置 2: The second chip carrying device

21:第二軟性承載體 21: The second soft carrier

22:第二可移動承載體 22: The second movable carrier

3:雙頭頂針裝置 3: Double-head thimble device

31:頂推結構 31: Push structure

311:第一頂推部 311: The first pushing part

3111:第一頂針開口 3111: The first thimble opening

312:第二頂推部 312: The second pushing part

3121:第二頂針開口 3121: The second thimble opening

32:雙頭頂針 32: Double-ended thimble

321:第一頂針部 321: The first thimble part

322:第二頂針部 322: The second thimble part

4:第一晶片承載結構 4: The first chip carrying structure

41:第一電路基板 41: The first circuit board

4100:第一導電接點 4100: The first conductive contact

42:第一導電焊接材料 42: The first conductive welding material

5:第二晶片承載結構 5: The second chip carrying structure

51:第二電路基板 51: second circuit board

5100:第二導電接點 5100: second conductive contact

52:第二導電焊接材料 52: The second conductive welding material

C1:第一晶片 C1: The first chip

C2:第二晶片 C2: second chip

Claims (9)

一種晶片移轉系統，其包括：一第一晶片承載裝置，所述第一晶片承載裝置用於透過一第一軟性承載體以承載多個第一晶片；一第二晶片承載裝置，所述第二晶片承載裝置用於透過一第二軟性承載體以承載多個第二晶片；以及一雙頭頂針裝置，所述雙頭頂針裝置設置在所述第一晶片承載裝置與所述第二晶片承載裝置之間，所述雙頭頂針裝置包括用於接觸所述第一軟性承載體與所述第二軟性承載體的一頂推結構以及能活動地設置在所述頂推結構內的一雙頭頂針；其中，所述頂推結構包括用於接觸所述第一軟性承載體的一第一頂推部以及用於接觸所述第二軟性承載體的一第二頂推部，且所述雙頭頂針包括能活動地裸露在所述第一頂推部的外部的一第一頂針部以及能活動地裸露在所述第二頂推部的外部的一第二頂針部；其中，當多個所述第一晶片依序透過所述雙頭頂針的所述第一頂針部的頂推時，多個所述第一晶片從所述第一軟性承載體移轉到一第一晶片承載結構上；其中，當多個所述第二晶片依序透過所述雙頭頂針的所述第二頂針部的頂推時，多個所述第二晶片從所述第二軟性承載體移轉到一第二晶片承載結構上。 A wafer transfer system, comprising: a first wafer carrying device, the first wafer carrying device is used to carry a plurality of first wafers through a first flexible carrier; a second wafer carrying device, the first wafer carrying device Two chip carrier devices are used to carry a plurality of second chips through a second flexible carrier; and a double-headed ejector pin device, the double-headed ejector pin device is arranged on the first chip carrier device and the second chip carrier Between the devices, the double-headed ejector device includes an ejector structure for contacting the first flexible carrier and the second flexible carrier, and a double-headed ejector movably arranged in the ejector structure. Needle; wherein, the pushing structure includes a first pushing portion for contacting the first flexible carrier and a second pushing portion for contacting the second flexible carrier, and the double The head thimble includes a first thimble part movably exposed on the outside of the first push part and a second thimble part movably exposed on the outside of the second push part; When the first chip sequentially pushes through the first ejector pin portion of the double-headed ejector pin, a plurality of the first chips are transferred from the first flexible carrier to a first chip carrier structure ; Wherein, when a plurality of the second wafers sequentially push through the second ejector pin portion of the double-headed ejector pin, the plurality of second wafers are transferred from the second flexible carrier to a On the second chip carrying structure. 如請求項1所述的晶片移轉系統，其中，所述第一晶片承載裝置包括用於承載所述第一軟性承載體的一第一可移動承載體，且每一所述第一晶片透過所述第一可移動承載體的移動而改變每一所述第一晶片相對於所述雙頭頂針的所述第一頂 針部的位置；其中，所述第二晶片承載裝置包括用於承載所述第二軟性承載體的一第二可移動承載體，且每一所述第二晶片透過所述第二可移動承載體的移動而改變每一所述第二晶片相對於所述雙頭頂針的所述第二頂針部的位置；其中，所述第一軟性承載體為一第一藍膜，且所述第一可移動承載體為用於承載所述第一藍膜的一第一藍膜承載件；其中，所述第二軟性承載體為一第二藍膜，且所述第二可移動承載體為用於承載所述第二藍膜的一第二藍膜承載件；其中，所述第一晶片承載結構包括具有多個第一導電接點的一第一電路基板以及分別設置在多個所述第一導電接點上的多個第一導電焊接材料，且所述第二晶片承載結構包括具有多個第二導電接點的一第二電路基板以及分別設置在多個所述第二導電接點上的多個第二導電焊接材料。 The wafer transfer system according to claim 1, wherein the first wafer carrying device includes a first movable carrier for carrying the first flexible carrier, and each of the first wafers penetrates The movement of the first movable carrier changes the first tip of each first wafer relative to the double-headed ejector pin. The position of the needle; wherein, the second chip carrying device includes a second movable carrier for carrying the second flexible carrier, and each of the second chips passes through the second movable carrier The movement of the body changes the position of each of the second chips relative to the second thimble portion of the double-headed thimble; wherein, the first flexible carrier is a first blue film, and the first The movable carrier is a first blue film carrier for carrying the first blue film; wherein, the second flexible carrier is a second blue film, and the second movable carrier is used On a second blue film carrier that carries the second blue film; wherein, the first chip carrier structure includes a first circuit substrate with a plurality of first conductive contacts and is respectively arranged on a plurality of the first circuit substrates A plurality of first conductive soldering materials on a conductive contact, and the second chip carrying structure includes a second circuit substrate having a plurality of second conductive contacts, and a plurality of second conductive contacts are respectively provided On the plurality of second conductive soldering materials. 如請求項1所述的晶片移轉系統，其中，所述第一頂推部包括用於裸露所述第一頂針部的一第一頂針開口以及圍繞所述第一頂針開口的多個第一吸氣口，所述第一頂針開口大於、小於或者等於所述第一吸氣口，且所述第一軟性承載體被多個所述第一吸氣口所吸附；其中，所述第二頂推部包括用於裸露所述第二頂針部的一第二頂針開口以及圍繞所述第二頂針開口的多個第二吸氣口，所述第二頂針開口大於、小於或者等於所述第二吸氣口，且所述第二軟性承載體被多個所述第二吸氣口所吸附；其中，所述雙頭頂針的所述第一頂針部與所述第二頂針部交替頂推所述第一晶片與所述第二晶片，以使得多個所述第一晶片與多個所述第二晶片被交替地移轉到所述第一晶片承載結構與所述第二晶片承載結構上；其中，所述第一晶片承載結構包括一第一承載基板以及設置在所述 第一承載基板上的一第一晶片黏著層，且所述第二晶片承載結構包括一第二承載基板以及設置在所述第二承載基板上的一第二晶片黏著層。 The wafer transfer system according to claim 1, wherein the first ejector portion includes a first ejector pin opening for exposing the first ejector pin portion, and a plurality of first ejector pin openings surrounding the first ejector pin opening. The suction port, the opening of the first thimble is greater than, smaller than or equal to the first suction port, and the first flexible carrier is adsorbed by a plurality of the first suction ports; wherein, the second The pushing part includes a second thimble opening for exposing the second thimble part and a plurality of second suction ports surrounding the second thimble opening, and the second thimble opening is larger than, smaller than or equal to the first thimble opening. Two suction ports, and the second flexible carrier is adsorbed by a plurality of second suction ports; wherein, the first thimble portion and the second thimble portion of the double-headed thimble are alternately pushed The first wafer and the second wafer such that a plurality of the first wafers and a plurality of the second wafers are alternately transferred to the first wafer carrying structure and the second wafer carrying structure On; wherein, the first chip carrying structure includes a first carrier substrate and disposed on the A first chip adhesive layer on the first carrier substrate, and the second chip carrier structure includes a second carrier substrate and a second chip adhesive layer disposed on the second carrier substrate. 一種晶片移轉方法，其包括：透過一第一軟性承載體，以承載多個第一晶片；透過一第二軟性承載體，以承載多個第二晶片；執行步驟(A)：透過一雙頭頂針裝置的一雙頭頂針的一第一頂針部，以將其中一所述第一晶片從所述第一軟性承載體移轉到一第一晶片承載結構上；執行步驟(B)：透過所述雙頭頂針裝置的所述雙頭頂針的一第二頂針部，以將其中一所述第二晶片從所述第二軟性承載體移轉到一第二晶片承載結構上；以及反覆執行所述步驟(A)與所述步驟(B)，以使得多個所述第一晶片與多個所述第二晶片被交替地移轉到所述第一晶片承載結構與所述第二晶片承載結構上。 A chip transfer method includes: carrying a plurality of first chips through a first flexible carrier; carrying a plurality of second chips through a second flexible carrier; performing step (A): through a double A first ejector part of a double-headed ejector pin of the head ejector device to transfer one of the first chips from the first flexible carrier to a first chip carrier structure; perform step (B): through A second ejector part of the double-headed ejector pin of the double-headed ejector pin device to transfer one of the second chips from the second flexible carrier to a second chip carrier structure; and repeatedly perform The step (A) and the step (B) are such that a plurality of the first wafers and a plurality of the second wafers are alternately transferred to the first wafer carrier structure and the second wafer Bearing structure. 如請求項4所述的晶片移轉方法，其中，所述雙頭頂針裝置設置在一第一晶片承載裝置與一第二晶片承載裝置之間，所述雙頭頂針裝置包括接觸所述第一軟性承載體與所述第二軟性承載體的一頂推結構，且所述雙頭頂針能活動地設置在所述頂推結構內；其中，所述頂推結構包括接觸所述第一軟性承載體的一第一頂推部以及接觸所述第二軟性承載體的一第二頂推部，所述第一頂針部能活動地裸露在所述第一頂推部的外部，且所述第二頂針部能活動地裸露在所述第二頂推部的外部。 The wafer transfer method according to claim 4, wherein the double-headed ejector pin device is disposed between a first wafer carrier device and a second wafer carrier device, and the double-headed ejector pin device includes contact with the first wafer carrier device. A push structure of the soft carrier and the second soft carrier, and the double-headed ejector pin can be movably arranged in the push structure; wherein, the push structure includes contact with the first soft carrier A first pushing portion of the body and a second pushing portion contacting the second flexible carrier body, the first pushing pin portion can be movably exposed outside the first pushing portion, and the first pushing portion The two thimble parts can be movably exposed on the outside of the second push part. 如請求項5所述的晶片移轉方法，其中，所述第一晶片承載裝置包括用於承載所述第一軟性承載體的一第一可移動承載體，且每一所述第一晶片透過所述第一可移動承載體的移動而改變每一所述第一晶片相對於所述雙頭頂針的所述第一頂針部的位置；其中，所述第二晶片承載裝置包括用於承載所述第二軟性承載體的一第二可移動承載體，且每一所述第二晶片透過所述第二可移動承載體的移動而改變每一所述第二晶片相對於所述雙頭頂針的所述第二頂針部的位置；其中，所述第一軟性承載體為一第一藍膜，且所述第一可移動承載體為用於承載所述第一藍膜的一第一藍膜承載件；其中，所述第二軟性承載體為一第二藍膜，且所述第二可移動承載體為用於承載所述第二藍膜的一第二藍膜承載件；其中，所述第一晶片承載結構包括具有多個第一導電接點的一第一電路基板以及分別設置在多個所述第一導電接點上的多個第一導電焊接材料，且所述第二晶片承載結構包括具有多個第二導電接點的一第二電路基板以及分別設置在多個所述第二導電接點上的多個第二導電焊接材料。 The wafer transfer method according to claim 5, wherein the first wafer carrying device includes a first movable carrier for carrying the first flexible carrier, and each of the first wafers penetrates The movement of the first movable carrier changes the position of each of the first wafers relative to the first ejector pin portion of the double-headed ejector pin; wherein, the second wafer carrier device includes a A second movable carrier of the second flexible carrier, and each of the second chips changes relative to the double-headed ejector pin through the movement of the second movable carrier The position of the second thimble part; wherein, the first flexible carrier is a first blue film, and the first movable carrier is a first blue film for carrying the first blue film Film carrier; wherein, the second flexible carrier is a second blue film, and the second movable carrier is a second blue film carrier for carrying the second blue film; wherein, The first chip carrying structure includes a first circuit substrate having a plurality of first conductive contacts and a plurality of first conductive soldering materials respectively arranged on the plurality of first conductive contacts, and the second The chip carrying structure includes a second circuit substrate with a plurality of second conductive contacts and a plurality of second conductive soldering materials respectively arranged on the plurality of second conductive contacts. 如請求項5所述的晶片移轉方法，其中，所述第一頂推部包括用於裸露所述第一頂針部的一第一頂針開口以及圍繞所述第一頂針開口的多個第一吸氣口，所述第一頂針開口大於、小於或者等於所述第一吸氣口，且所述第一軟性承載體被多個所述第一吸氣口所吸附；其中，所述第二頂推部包括用於裸露所述第二頂針部的一第二頂針開口以及圍繞所述第二頂針開口的多個第二吸氣口，所述第二頂針開口大於、小於或者等於所述第二吸氣口，且所述第二軟性承載體被多個所述第二吸氣口所吸附；其中，所述雙頭頂針的所述第一頂針部 與所述第二頂針部交替頂推所述第一晶片與所述第二晶片，以使得多個所述第一晶片與多個所述第二晶片被交替地移轉到所述第一晶片承載結構與所述第二晶片承載結構上；其中，所述第一晶片承載結構包括一第一承載基板以及設置在所述第一承載基板上的一第一晶片黏著層，且所述第二晶片承載結構包括一第二承載基板以及設置在所述第二承載基板上的一第二晶片黏著層。 The wafer transfer method according to claim 5, wherein the first ejector portion includes a first ejector pin opening for exposing the first ejector pin portion, and a plurality of first ejector pin openings surrounding the first ejector pin opening. The suction port, the opening of the first thimble is greater than, smaller than or equal to the first suction port, and the first flexible carrier is adsorbed by a plurality of the first suction ports; wherein, the second The pushing part includes a second thimble opening for exposing the second thimble part and a plurality of second suction ports surrounding the second thimble opening, and the second thimble opening is larger than, smaller than or equal to the first thimble opening. Two suction ports, and the second flexible carrier is adsorbed by a plurality of the second suction ports; wherein, the first thimble part of the double-headed thimble Alternately push the first wafer and the second wafer with the second ejector pin portion, so that a plurality of the first wafers and a plurality of the second wafers are alternately transferred to the first wafer A carrier structure and the second chip carrier structure; wherein, the first chip carrier structure includes a first carrier substrate and a first chip adhesive layer disposed on the first carrier substrate, and the second chip carrier structure The chip carrier structure includes a second carrier substrate and a second chip adhesive layer disposed on the second carrier substrate. 一種晶片移轉系統，其包括：一第一晶片承載裝置，所述第一晶片承載裝置用於透過一第一軟性承載體以承載多個第一晶片；一第二晶片承載裝置，所述第二晶片承載裝置用於透過一第二軟性承載體以承載多個第二晶片；以及一雙頭頂針裝置，所述雙頭頂針裝置設置在所述第一晶片承載裝置與所述第二晶片承載裝置之間，所述雙頭頂針裝置包括能活動地設置在所述第一晶片承載裝置與所述第二晶片承載裝置之間的一雙頭頂針；其中，所述雙頭頂針包括用於頂推所述第一晶片的一第一頂針部以及用於頂推所述第二晶片的一第二頂針部；其中，當所述雙頭頂針的所述第一頂針部與所述第二頂針部交替頂推所述第一晶片與所述第二晶片時，多個所述第一晶片與多個所述第二晶片被交替地移轉到所述第一晶片承載結構與所述第二晶片承載結構上；其中，所述第一晶片承載結構包括一第一承載基板以及設置在所述第一承載基板上的一第一晶片黏著層，且所述第二晶片承載結構包括一第二承載基板以及設置在所述第二承載基板上的一第二晶片黏著層。 A wafer transfer system, comprising: a first wafer carrying device, the first wafer carrying device is used to carry a plurality of first wafers through a first flexible carrier; a second wafer carrying device, the first wafer carrying device Two chip carrier devices are used to carry a plurality of second chips through a second flexible carrier; and a double-headed ejector pin device, the double-headed ejector pin device is arranged on the first chip carrier device and the second chip carrier Between the devices, the double-headed ejector pin device includes a double-headed ejector pin movably arranged between the first wafer carrier device and the second wafer carrier device; wherein, the double-headed ejector pin includes Push a first ejector pin portion of the first wafer and a second ejector pin portion for pushing the second wafer; wherein, when the first ejector pin portion and the second ejector pin of the double-headed ejector pin When the first wafer and the second wafer are alternately pushed by the part, the first wafers and the second wafers are alternately transferred to the first wafer supporting structure and the second wafer. On the chip carrier structure; wherein, the first chip carrier structure includes a first carrier substrate and a first chip adhesive layer disposed on the first carrier substrate, and the second chip carrier structure includes a second A carrier substrate and a second chip adhesive layer arranged on the second carrier substrate. 如請求項8所述的晶片移轉系統，其中，所述第一晶片承載裝置包括用於承載所述第一軟性承載體的一第一可移動承載體，且每一所述第一晶片透過所述第一可移動承載體的移動而改變每一所述第一晶片相對於所述雙頭頂針的所述第一頂針部的位置；其中，所述第二晶片承載裝置包括用於承載所述第二軟性承載體的一第二可移動承載體，且每一所述第二晶片透過所述第二可移動承載體的移動而改變每一所述第二晶片相對於所述雙頭頂針的所述第二頂針部的位置；其中，所述第一軟性承載體為一第一藍膜，且所述第一可移動承載體為用於承載所述第一藍膜的一第一藍膜承載件；其中，所述第二軟性承載體為一第二藍膜，且所述第二可移動承載體為用於承載所述第二藍膜的一第二藍膜承載件；其中，所述第一晶片承載結構包括具有多個第一導電接點的一第一電路基板以及分別設置在多個所述第一導電接點上的多個第一導電焊接材料，且所述第二晶片承載結構包括具有多個第二導電接點的一第二電路基板以及分別設置在多個所述第二導電接點上的多個第二導電焊接材料。The wafer transfer system according to claim 8, wherein the first wafer carrying device includes a first movable carrier for carrying the first flexible carrier, and each of the first wafers penetrates The movement of the first movable carrier changes the position of each of the first wafers relative to the first ejector pin portion of the double-headed ejector pin; wherein, the second wafer carrier device includes a A second movable carrier of the second flexible carrier, and each of the second chips changes relative to the double-headed ejector pin through the movement of the second movable carrier The position of the second thimble part; wherein, the first flexible carrier is a first blue film, and the first movable carrier is a first blue film for carrying the first blue film Film carrier; wherein, the second flexible carrier is a second blue film, and the second movable carrier is a second blue film carrier for carrying the second blue film; wherein, The first chip carrying structure includes a first circuit substrate having a plurality of first conductive contacts and a plurality of first conductive soldering materials respectively arranged on the plurality of first conductive contacts, and the second The chip carrying structure includes a second circuit substrate with a plurality of second conductive contacts and a plurality of second conductive soldering materials respectively arranged on the plurality of second conductive contacts.
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