TWI735699B - Breaking method and breaking device of brittle material substrate - Google Patents

Breaking method and breaking device of brittle material substrate Download PDF

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TWI735699B
TWI735699B TW106138639A TW106138639A TWI735699B TW I735699 B TWI735699 B TW I735699B TW 106138639 A TW106138639 A TW 106138639A TW 106138639 A TW106138639 A TW 106138639A TW I735699 B TWI735699 B TW I735699B
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brittle material
material substrate
breaking
support plate
elastic support
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TW201820440A (en
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村上健二
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日商三星鑽石工業股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

將脆性材料基板保持於切割環並載置於台上時防止基板的彎曲。 The brittle material substrate is held on the cutting ring and placed on the table to prevent the substrate from bending.

於貼附於切割環31之黏著帶32上保持藍寶石基板30。於分斷裝置之玻璃台12上設置彈性支承板40，於其上方固定切割環31。藉由將滾筒22按壓於藍寶石基板30並使其相對移動，使藍寶石基板30緊貼於彈性支承板40上。其次，以監測照相機確認劃線並從劃線正上方使裂斷桿下降，將脆性材料基板分離。 The sapphire substrate 30 is held on the adhesive tape 32 attached to the cutting ring 31. An elastic support plate 40 is arranged on the glass table 12 of the breaking device, and the cutting ring 31 is fixed above it. By pressing the roller 22 against the sapphire substrate 30 and moving it relatively, the sapphire substrate 30 is closely attached to the elastic support plate 40. Next, check the scribe line with a monitoring camera and lower the rupture bar from directly above the scribe line to separate the brittle material substrate.

Description

脆性材料基板之分斷方法及分斷裝置 Breaking method and breaking device of brittle material substrate

本發明係關於一種用以將較薄之脆性材料基板分斷之分斷方法及分斷裝置。 The present invention relates to a breaking method and breaking device for breaking a thin, brittle material substrate.

於分斷脆性材料基板時，例如，如專利文獻1所示，係預先於脆性材料基板形成劃線，透過切割環將基板保持於支承台上，藉由自上部將裂斷桿從劃線之正上方按壓而分斷。 When breaking a brittle material substrate, for example, as shown in Patent Document 1, a scribe line is formed on the brittle material substrate in advance, the substrate is held on a support table through a dicing ring, and the breaking bar is removed from the scribe line from the top Press directly above to break.

然而，於脆性材料基板較薄之情形時，基板之周邊部分容易翹曲。一旦脆性材料基板發生翹曲，則從下方辨識形成於基板上之劃線時，監測照相機之焦點難以對焦，從而會有難以正確地從劃線之正上方按壓裂斷桿而加以分斷之缺點。 However, when the brittle material substrate is thin, the peripheral portion of the substrate is likely to warp. Once the brittle material substrate is warped, when the scribe line formed on the substrate is recognized from below, the focus of the monitoring camera is difficult to focus, and it is difficult to correctly press the breaking rod from directly above the scribe line to break it. .

專利文獻2中提出一種加工裝置，即，於使用雷射光將半導體晶圓等基板分斷時，為了即使其端部向上部彎曲也可矯正此彎曲，係使空氣從半導體晶圓之上部流入凹部之空間內並按壓該晶圓從而將其矯正。 Patent Document 2 proposes a processing device that uses laser light to split a substrate such as a semiconductor wafer, in order to correct the curvature even if the end of the semiconductor wafer is bent upward, by allowing air to flow from the upper portion of the semiconductor wafer into the recessed portion. And press the wafer in the space to correct it.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2015-188968號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2015-188968

[專利文獻2]日本專利特開2010-29930號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2010-29930

於使用專利文獻2之裝置分斷脆性材料基板之情形時，由於係使空氣從基板上部流入凹部之空間內並從上部按壓該基板，因此必須先使凹部成為氣密狀態並需要使空氣流入之泵，而有構造變得複雜之問題點。 When the device of Patent Document 2 is used to break a brittle material substrate, since air flows from the upper part of the substrate into the space of the recess and presses the substrate from above, the recess must first be airtight and air must flow into it. Pump, but there is a problem that the structure becomes complicated.

本發明係著眼於此種問題點而完成者，其目的在於，即使係容易彎曲之較薄基板亦能將之緊貼於台上而正確地分斷。 The present invention has been accomplished by focusing on such problems, and its purpose is to make it possible to adhere to the stage and accurately break even if it is a thinner substrate that is easy to bend.

為解決此課題，本發明之一種脆性材料基板之分斷方法，其包含：使形成有劃線之脆性材料基板黏著於由框狀體保持之黏著帶上並保持；將透明之彈性支承板一體保持於透明台上；將前述脆性材料基板連同前述框狀體一起保持於前述彈性支承板上；藉由從保持於前述框狀體上之脆性材料基板之上部使滾筒滾動，以使前述脆性材料基板緊貼於前述彈性支承板上；以監測照相機檢測出緊貼於前述彈性支承板之前述脆性材料基板之劃線；以及藉由沿著以前述監測照相機檢測出之劃線，從前述脆性材料基板之上部使裂斷桿下降，沿著劃線分斷前述脆性材料基板。 In order to solve this problem, a method for breaking a brittle material substrate of the present invention includes: adhering and holding the brittle material substrate formed with scribe lines on an adhesive tape held by a frame-shaped body; and integrating a transparent elastic support plate Hold on a transparent table; hold the brittle material substrate together with the frame body on the elastic support plate; roll the roller from the upper part of the brittle material substrate held on the frame body to make the brittle material The substrate is in close contact with the elastic support plate; a monitoring camera detects the scribe line of the brittle material substrate close to the elastic support plate; and by following the scribe line detected by the monitoring camera, from the brittle material The upper part of the substrate lowers the breaking rod to break the aforementioned brittle material substrate along the scribe line.

為解決此課題，本發明之一種分斷裝置，用於脆性材料基板之分斷，其具備：框狀體，將形成有劃線之脆性材料基板保持於黏著帶上； 透明台；透明之彈性支承板，於前述台上保持前述框狀體；升降機構，相對於保持於前述彈性支承板之前述脆性材料基板之面使裂斷桿垂直地上下動；旋轉自如之滾筒，保持於前述台之上部，並具有與前述台之面平行之旋轉軸；相對移動手段，相對於前述裂斷桿及前述滾筒使前述台相對移動；以及監測照相機，從前述台之下方檢測出形成於前述脆性材料基板之劃線。 In order to solve this problem, a breaking device of the present invention is used for breaking a brittle material substrate, which includes: a frame-shaped body to hold the brittle material substrate with scribe lines on an adhesive tape; a transparent table; transparent elasticity The support plate holds the frame-shaped body on the table; the lifting mechanism moves the rupture rod vertically with respect to the surface of the brittle material substrate held on the elastic support plate; the freely rotating roller is held on the table The upper part has a rotating shaft parallel to the surface of the table; the relative movement means moves the table relative to the breaking rod and the roller; and a monitoring camera detects the substrate formed on the brittle material from the bottom of the table之线。 The underline.

藉由具有上述特徵之本發明，可將脆性材料基板保持於彈性支承板上，即使係容易彎曲之較薄基板亦可藉由以滾筒加以按壓來使其緊貼於彈性支承板。因此，藉由以監測照相機確認緊貼於彈性支承板上之基板，即能正確地進行裂斷桿之定位。藉由沿著劃線下壓裂斷桿而分斷，可獲得能將脆性材料基板正確地分斷之效果。 With the present invention having the above-mentioned features, the brittle material substrate can be held on the elastic support plate, and even a thinner substrate that is easily bent can be pressed by a roller to make it adhere to the elastic support plate. Therefore, by confirming the substrate tightly attached to the elastic support plate with the monitoring camera, the fracture rod can be positioned correctly. By fracturing the breaking rod along the scribe line to break, the effect of correctly breaking the brittle material substrate can be obtained.

10‧‧‧分斷裝置 10‧‧‧Disconnecting device

11‧‧‧基座 11‧‧‧Pedestal

12‧‧‧玻璃台 12‧‧‧Glass table

13‧‧‧Y軸移動機構 13‧‧‧Y-axis moving mechanism

14‧‧‧框狀固定構件 14‧‧‧Frame-shaped fixing member

15‧‧‧伺服馬達 15‧‧‧Servo motor

17‧‧‧水平固定構件 17‧‧‧Horizontal fixed component

18‧‧‧上移動構件 18‧‧‧Upper moving member

21‧‧‧下移動構件 21‧‧‧Moving component down

22‧‧‧滾筒 22‧‧‧Drum

23‧‧‧監測照相機 23‧‧‧Monitoring camera

24‧‧‧裂斷桿 24‧‧‧Break Rod

30‧‧‧藍寶石基板 30‧‧‧Sapphire substrate

31‧‧‧切割環 31‧‧‧Cut Ring

32‧‧‧黏著帶 32‧‧‧Adhesive tape

33‧‧‧保護膜 33‧‧‧Protective film

40‧‧‧彈性支承板 40‧‧‧Elastic support plate

41‧‧‧膜 41‧‧‧membrane

圖1係本發明之實施形態之分斷裝置之概略立體圖。 Fig. 1 is a schematic perspective view of a breaking device according to an embodiment of the present invention.

圖2係本發明之實施形態之分斷裝置之概略側視圖。 Fig. 2 is a schematic side view of the breaking device of the embodiment of the present invention.

圖3係表示玻璃台與保持於其上部之脆性材料基板之詳情之立體圖。 Fig. 3 is a perspective view showing the details of the glass table and the brittle material substrate held on the upper part thereof.

圖4係表示使用切割環將脆性材料基板保持於玻璃台上之彈性支承板上之狀態、及使其緊貼之狀態之側視圖。 Fig. 4 is a side view showing the state where the brittle material substrate is held on the elastic support plate on the glass table using the cutting ring and the state where it is in close contact.

其次，說明用於本實施形態之脆性材料基板之分斷之分斷裝 置10之概略。圖1係本發明之實施形態之分斷裝置之概略立體圖，圖2係其概略側視圖。分斷裝置10具有可於基座11上向y軸之正或負方向移動之透明之玻璃台12。於玻璃台12之下方，設有使玻璃台12沿著基座11之面向y軸方向移動，進而使其沿著基座11之面旋轉之Y軸移動機構13。於玻璃台12之上部，設有ㄈ字狀之框狀固定構件14，並於其上部保持有伺服馬達15。於伺服馬達15之旋轉軸直接連接滾珠螺桿16，滾珠螺桿16之下端以能旋轉之方式支承於水平固定構件17。上移動構件18於中央部具備與滾珠螺桿16螺合之螺母19，從其兩端部朝向下方具備支承軸20a,20b。支承軸20a,20b貫通水平固定構件17之一對貫通孔而連結於下移動構件21。於下移動構件21之下面，後述之裂斷桿24以升降自如之方式安裝於玻璃台12之面。如此，於藉由伺服馬達15使滾珠螺桿16旋轉之情形時，上移動構件18與下移動構件21係一體地上下動，裂斷桿亦同時上下動。又，滾筒22以旋轉自如之方式設於框狀固定構件14內側之下方。滾筒22之旋轉軸係與玻璃台12之面平行。又，較佳為以旋轉軸體於一定範圍內平行地上下動並施加向下之彈壓力之方式，作成以彈簧保持旋轉軸體並使其上下動自如。此處，Y軸移動機構13構成使玻璃台12相對於裂斷桿與滾筒22移動之相對移動手段，框狀固定構件14、伺服馬達15、水平固定構件17及上下之移動構件18,21構成使裂斷桿升降之升降機構。 Next, the outline of the breaking device 10 used for breaking the brittle material substrate of the present embodiment will be explained. Fig. 1 is a schematic perspective view of a cutting device according to an embodiment of the present invention, and Fig. 2 is a schematic side view thereof. The breaking device 10 has a transparent glass table 12 that can be moved on the base 11 in the positive or negative direction of the y-axis. Below the glass table 12, a Y-axis moving mechanism 13 is provided that moves the glass table 12 along the y-axis direction of the base 11 and then rotates it along the surface of the base 11. On the upper part of the glass table 12, a frame-shaped fixing member 14 in the shape of a U is provided, and a servo motor 15 is held on the upper part thereof. The rotating shaft of the servo motor 15 is directly connected to the ball screw 16, and the lower end of the ball screw 16 is rotatably supported by the horizontal fixing member 17. The upper moving member 18 is provided with a nut 19 screwed with the ball screw 16 in the center part, and is provided with support shafts 20a and 20b toward the downward direction from its both ends. The support shafts 20 a and 20 b penetrate through a pair of through holes of the horizontal fixing member 17 and are connected to the lower moving member 21. Below the lower moving member 21, the rupture rod 24 described later is mounted on the surface of the glass table 12 in a manner that can be raised and lowered freely. In this way, when the ball screw 16 is rotated by the servo motor 15, the upper moving member 18 and the lower moving member 21 move up and down together, and the breaking rod also moves up and down at the same time. In addition, the roller 22 is rotatably provided below the inner side of the frame-shaped fixing member 14. The rotation axis of the drum 22 is parallel to the surface of the glass table 12. Furthermore, it is preferable that the rotating shaft body is moved up and down in parallel within a certain range and a downward elastic force is applied, so that the rotating shaft body is held by a spring and moved up and down freely. Here, the Y-axis moving mechanism 13 constitutes a relative moving means for moving the glass table 12 with respect to the breaking rod and the roller 22, and the frame-shaped fixing member 14, the servo motor 15, the horizontal fixing member 17, and the up and down moving members 18, 21 are constituted. Lifting mechanism to lift the broken rod.

圖2係表示分斷裝置10之一部分之側視圖。如本圖所示，於基座11上部設有玻璃台12。又，於基座11內部，設有用以辨識載置於玻璃台12上之脆性材料基板之劃線之監測照相機23。又，安裝於下移動構件21之裂斷桿24係細長平板且前端之剖面為V字狀之金屬製構件，用於 按壓脆性材料基板以將其分斷。 FIG. 2 shows a side view of a part of the breaking device 10. As shown in this figure, a glass table 12 is provided on the upper part of the base 11. In addition, inside the base 11, a monitoring camera 23 for recognizing the scribe line of the brittle material substrate placed on the glass table 12 is provided. In addition, the breaking rod 24 attached to the lower moving member 21 is a metal member with an elongated flat plate and a V-shaped cross section at the front end, which is used to press the brittle material substrate to break it.

圖3係表示玻璃台12與保持於其上部之脆性材料基板之詳情之立體圖。本實施形態中，以藍寶石基板30作為成為分斷對象之脆性材料基板，為了保持此基板，係使用於將半導體晶圓分離成晶片時所使用之圓環框狀體即切割環31。如圖所示，於切割環31內側，貼附有朝上具有黏著材之黏著帶32。該黏著帶32係具有氯乙烯等之基材之層與於其上面具有黏著材之層之2層構造之帶。基材層例如厚度為80μm，黏著材之層厚度為20μm，合計厚度為100μm。又，於該黏著帶32之上面中央貼附有成為分斷對象之藍寶石基板30。本實施形態中，藍寶石基板30為0.05~1mm之厚度、此處例如係0.1mm厚度之基板。於該藍寶石基板30，矩陣狀地形成有例如1mm角之磊晶膜等IC電路，為了將各電路分離，將藍寶石基板30以高精度分斷成為1×1mm四方之多數個正方形晶片。於藍寶石基板30上面預先形成有格子狀之劃線。於藍寶石基板30上面貼附有用以保護藍寶石基板30之透明之保護膜33。 FIG. 3 is a perspective view showing the details of the glass table 12 and the brittle material substrate held on the upper part thereof. In this embodiment, the sapphire substrate 30 is used as a brittle material substrate to be a parting target. In order to hold this substrate, a dicing ring 31 which is a circular frame-shaped body used when separating a semiconductor wafer into wafers is used. As shown in the figure, on the inside of the cutting ring 31, an adhesive tape 32 with an adhesive material facing upward is attached. The adhesive tape 32 is a tape having a two-layer structure including a layer of a base material such as vinyl chloride and a layer of an adhesive material on the layer. The base layer has a thickness of, for example, 80 μm, the layer thickness of the adhesive material is 20 μm, and the total thickness is 100 μm. In addition, a sapphire substrate 30 to be divided is attached to the center of the upper surface of the adhesive tape 32. In this embodiment, the sapphire substrate 30 has a thickness of 0.05 to 1 mm, and here is a substrate of 0.1 mm thickness, for example. On the sapphire substrate 30, IC circuits such as an epitaxial film of 1 mm angle are formed in a matrix. In order to separate the circuits, the sapphire substrate 30 is divided into square wafers of 1×1 mm square with high precision. On the top surface of the sapphire substrate 30, grid-like scribe lines are formed in advance. A transparent protective film 33 for protecting the sapphire substrate 30 is pasted on the sapphire substrate 30.

本實施形態中，於將藍寶石基板30裂斷時使用透明之彈性支承板40。如圖3所示之立體圖，彈性支承板40係透明矽膠等具有彈性之例如圓形平板，並作成與玻璃台12相同或比其更小者。又，於分斷時為使藍寶石基板30之光滑性良好，從而保護彈性支承板40之表面，於彈性支承板40之上部一體設有與彈性支承板40同一形狀之透明膜41。可非常合適地使用PET作為膜41之材料。 In this embodiment, a transparent elastic support plate 40 is used when the sapphire substrate 30 is broken. As shown in the perspective view of FIG. 3, the elastic support plate 40 is a circular flat plate with elasticity such as transparent silicone, and is made the same as or smaller than the glass table 12. Furthermore, in order to improve the smoothness of the sapphire substrate 30 and protect the surface of the elastic support plate 40 during the breaking, a transparent film 41 having the same shape as the elastic support plate 40 is integrally provided on the upper part of the elastic support plate 40. PET can be used very suitably as the material of the film 41.

其次說明藍寶石基板30之分斷方法。首先，如圖4(a)所示，於前述分斷裝置10之玻璃台12上載置於上面固定有膜41之彈性支承 板40。又，以藍寶石基板30位於彈性支承板40上部之方式，使切割環31反轉而配置於玻璃台12上。此時，較薄之藍寶石基板30係彎曲成略微向上凸起。因此，於保護膜33與膜41之間存在些許之空隙。 Next, a method of dividing the sapphire substrate 30 will be described. First, as shown in Fig. 4(a), on the glass table 12 of the aforementioned breaking device 10, an elastic support plate 40 on which a film 41 is fixed is placed. In addition, the cutting ring 31 is inverted and arranged on the glass table 12 so that the sapphire substrate 30 is positioned on the upper portion of the elastic support plate 40. At this time, the thinner sapphire substrate 30 is bent to slightly bulge upward. Therefore, there are some gaps between the protective film 33 and the film 41.

其次如圖4(b)所示，使滾筒22接觸於黏著帶32之上面，藉由使玻璃台12移動，以滾筒22將藍寶石基板30按壓於彈性支承板40上。如此，如圖4(c)所示，可將保護膜33，膜41之間之空氣擠出，從而可使藍寶石基板30之所有部分緊貼於彈性支承板40及玻璃台12。 Next, as shown in FIG. 4( b ), the roller 22 is brought into contact with the upper surface of the adhesive tape 32, and by moving the glass table 12, the roller 22 presses the sapphire substrate 30 on the elastic support plate 40. In this way, as shown in FIG. 4( c ), the air between the protective film 33 and the film 41 can be squeezed out, so that all parts of the sapphire substrate 30 can be closely attached to the elastic support plate 40 and the glass table 12.

如此，由於即使藍寶石基板30彎曲，保護膜33之下面亦被吸附，因此如圖2所示，從監測照相機23監測藍寶石基板30時，能夠使焦點對焦。因此，於藍寶石基板30之所有部分，均能以監測照相機23正確地辨識劃線。 In this way, even if the sapphire substrate 30 is bent, the underside of the protective film 33 is adsorbed. Therefore, as shown in FIG. 2, when the sapphire substrate 30 is monitored from the monitoring camera 23, the focus can be focused. Therefore, in all parts of the sapphire substrate 30, the scribe line can be correctly identified by the monitoring camera 23.

其次以藍寶石基板30位於裂斷桿24正下方之方式，藉由Y軸移動機構13使玻璃台12移動。此時，由於玻璃台12與彈性支承板40皆為透明，因此，能夠以劃線正確地位於裂斷桿24下方之方式，使藍寶石基板30移動。 Next, the glass table 12 is moved by the Y-axis moving mechanism 13 in such a way that the sapphire substrate 30 is located directly below the breaking rod 24. At this time, since the glass table 12 and the elastic support plate 40 are both transparent, the sapphire substrate 30 can be moved in such a way that the scribe line is accurately located below the breaking rod 24.

其次，驅動伺服馬達15，使上移動構件18與下移動構件21同時下降，並使裂斷桿24相對於玻璃台12保持垂直緩慢下降。如此，藍寶石基板30受裂斷桿24擠壓而變形，下沉而使彈性支承板40略微變形為V字狀，龜裂沿著劃線往上方逐漸伸展。接著，藉由使裂斷桿24充分地下降，藍寶石基板30內之龜裂延伸而完成分斷。分斷完成後，使伺服馬達15反轉而使裂斷桿24上升。 Next, the servo motor 15 is driven to lower the upper moving member 18 and the lower moving member 21 at the same time, and the rupture rod 24 is kept vertical to the glass table 12 and lowered slowly. In this way, the sapphire substrate 30 is deformed by being squeezed by the breaking rod 24 and sinks to slightly deform the elastic support plate 40 into a V shape, and the cracks gradually extend upward along the scribe line. Then, by fully lowering the breaking rod 24, the cracks in the sapphire substrate 30 extend to complete the breaking. After the breaking is completed, the servo motor 15 is reversed and the breaking rod 24 is raised.

其次，藉由Y軸移動機構13以既定節距使玻璃台12向y 軸方向略微移動後，再次使裂斷桿24下降，以同樣方式反覆分斷。接著，於某一方向結束所有分斷後，藉由Y軸移動機構13使玻璃台12旋轉90°。此時，亦可使用滾筒22將藍寶石基板30再次壓接於彈性支承板40。接著，使裂斷桿24下降而分斷藍寶石基板30。進而，使玻璃台12於y軸方向移動劃線之節距之距離，並以同樣方式使裂斷桿24下降。如此，完成所有分斷而能將藍寶石基板30分斷為格子狀。 Next, after the glass table 12 is slightly moved in the y-axis direction by the Y-axis moving mechanism 13 at a predetermined pitch, the breaking rod 24 is lowered again, and the breaking is repeated in the same manner. Then, after finishing all the breaking in a certain direction, the glass table 12 is rotated by 90° by the Y-axis moving mechanism 13. At this time, the roller 22 may be used to press the sapphire substrate 30 to the elastic support plate 40 again. Next, the breaking rod 24 is lowered to break the sapphire substrate 30. Furthermore, the glass table 12 is moved in the y-axis direction by the pitch of the scribe line, and the breaking rod 24 is lowered in the same manner. In this way, all the divisions are completed, and the sapphire substrate 30 can be divided into a lattice shape.

此外，本實施形態中，雖以藍寶石基板作為分斷對象之脆性材料基板進行了說明，但即使係其他脆性材料基板，亦同樣地能適用本發明。 In addition, in this embodiment, although the sapphire substrate is described as the brittle material substrate to be broken, the present invention can be applied to other brittle material substrates in the same way.

進而，本實施形態中，雖將脆性材料基板保持於貼附在框狀切割環之黏著帶上，但由於只要是框狀體便已足夠，因此並不限定於切割環。 Furthermore, in this embodiment, although the brittle material substrate is held on the adhesive tape attached to the frame-shaped dicing ring, it is not limited to the dicing ring because it is sufficient as long as it is a frame-shaped body.

〔產業利用性〕 〔Industrial useability〕

由於本發明能使用分斷裝置正確地分斷脆性材料基板，因此非常合適於精密地分斷脆性材料基板之分斷裝置。 Since the present invention can use the breaking device to correctly break the brittle material substrate, it is very suitable for the breaking device for precisely breaking the brittle material substrate.

12‧‧‧玻璃台 12‧‧‧Glass table

22‧‧‧滾筒 22‧‧‧Drum

30‧‧‧藍寶石基板 30‧‧‧Sapphire substrate

31‧‧‧切割環 31‧‧‧Cut Ring

32‧‧‧黏著帶 32‧‧‧Adhesive tape

33‧‧‧保護膜 33‧‧‧Protective film

40‧‧‧彈性支承板 40‧‧‧Elastic support plate

41‧‧‧膜 41‧‧‧membrane

Claims (2)

一種脆性材料基板之分斷方法，其包含：使形成有劃線之脆性材料基板黏著於由框狀體保持之黏著帶上並保持；將透明之彈性支承板一體保持於透明台上；將前述脆性材料基板連同前述框狀體一起保持於前述彈性支承板上；藉由從保持於前述框狀體上之脆性材料基板之上部使滾筒滾動，以使前述脆性材料基板緊貼於前述彈性支承板上；以監測照相機檢測出緊貼於前述彈性支承板之前述脆性材料基板之劃線；以及藉由沿著以前述監測照相機檢測出之劃線，從前述脆性材料基板之上部使裂斷桿下降，沿著劃線分斷前述脆性材料基板。 A method for breaking a brittle material substrate, comprising: adhering and holding a brittle material substrate formed with scribe lines on an adhesive tape held by a frame-shaped body; holding a transparent elastic support plate integrally on a transparent table; The brittle material substrate is held on the elastic support plate together with the frame-shaped body; the roller is rolled from the upper portion of the brittle material substrate held on the frame-shaped body, so that the brittle material substrate is in close contact with the elastic support plate On; the monitoring camera detects the scribe line of the brittle material substrate close to the elastic support plate; and by following the scribe line detected by the monitoring camera, the rupture rod is lowered from the upper part of the brittle material substrate , Break the aforementioned brittle material substrate along the scribe line. 一種分斷裝置，用於脆性材料基板之分斷，其具備：框狀體，將形成有劃線之脆性材料基板保持於黏著帶上；透明台；透明之彈性支承板，於前述台上保持前述框狀體；升降機構，相對於保持於前述彈性支承板之前述脆性材料基板之面使裂斷桿垂直地上下動；旋轉自如之滾筒，保持於前述台之上部，並具有與前述台之面平行之旋轉軸；相對移動手段，相對於前述裂斷桿及前述滾筒使前述台相對移 動；以及監測照相機，從前述台之下方檢測出形成於前述脆性材料基板之劃線。 A breaking device for breaking a brittle material substrate, which is provided with: a frame-shaped body that holds the brittle material substrate with scribe lines on an adhesive tape; a transparent table; a transparent elastic support plate, which is held on the aforementioned table The frame-shaped body; the lifting mechanism, which moves the breaking rod vertically with respect to the surface of the brittle material substrate held on the elastic support plate; The rotating shaft is parallel to the surface; the relative movement means moves the stage relative to the rupture bar and the roller; and a monitoring camera detects the scribe line formed on the brittle material substrate from below the stage.
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US9310427B2 (en) * 2013-07-24 2016-04-12 Advantest Corporation High speed tester communication interface between test slice and trays

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