TWI734476B - Reinforcement method of thin-type pump - Google Patents
Reinforcement method of thin-type pump Download PDFInfo
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- TWI734476B TWI734476B TW109116102A TW109116102A TWI734476B TW I734476 B TWI734476 B TW I734476B TW 109116102 A TW109116102 A TW 109116102A TW 109116102 A TW109116102 A TW 109116102A TW I734476 B TWI734476 B TW I734476B
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Abstract
Description
本案關於一種薄型泵浦的補強方法,尤指一種對於製程中的公差造成性能不佳的薄型泵浦的補強方法。This case is about a method of reinforcing thin pumps, especially a method of reinforcing thin pumps that have poor performance due to tolerances in the manufacturing process.
隨著電子產品往輕薄方向發展,可應用於多種電子產品的薄型泵浦因應其需求而誕生,請參閱第1圖所示,目前的薄型泵浦100由進氣板101、共振片102、致動器103、第一絕緣框架104、導電框架105、第二絕緣框架106、集氣板107堆疊而成,由於薄型泵浦100的厚度極薄,且又是透過壓合、堆疊方式組合,於壓合過程中有時會因為偏移、公差等原因,造成共振片102、致動器103之間產生偏差或是距離過大,導致薄型泵浦100的性能下降。With the development of electronic products in the light and thin direction, thin pumps that can be applied to a variety of electronic products were born in response to their needs. The
有鑑於此,如何改善薄型泵浦100於製程中所產生其性能下降的問題,實乃目前需要解決之問題。In view of this, how to improve the performance degradation of the
本案之主要目的係提供一種薄型泵浦的補強方法,用於改善薄型泵浦於製程中導致性能下降的問題,且進一步降低薄型泵浦的不良率。The main purpose of this case is to provide a reinforcement method for the thin pump, which is used to improve the performance degradation of the thin pump during the manufacturing process, and to further reduce the defect rate of the thin pump.
本案之一廣義實施態樣為薄型泵浦的補強方法,包含: S1:驅動該薄型泵浦,取得一氣流資訊; S2:比對該氣流資訊是否低於一預設氣流值; S3:若該氣流資訊低於該預設氣流值,對該薄型泵浦下壓一補強距離。 One of the broad implementation aspects of this case is a reinforcement method for thin pumps, including: S1: Drive the thin pump to obtain air flow information; S2: Compare whether the airflow information is lower than a preset airflow value; S3: If the airflow information is lower than the preset airflow value, press down the thin pump for a reinforcement distance.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上當作說明之用,而非用以限制本案。Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and diagrams therein are essentially for illustrative purposes, rather than limiting the case.
請參閱第2圖所示,本案提供一種薄型泵浦200的補強方法,包含:S1:驅動薄型泵浦200,取得一氣流資訊;S2:比對氣流資訊是否低於一預設氣流值;以及S3:若氣流資訊低於預設氣流值,對薄型泵浦200下壓一補強距離。As shown in Figure 2, this case provides a method for reinforcing the
本案的薄型泵浦200的補強方法S1至S3皆可於一下壓平台300上進行,請參閱第3圖所示,下壓平台300包含一平台座302及一下壓工具301,平台座302可設有一驅動電源及一氣壓感測器(未圖示),將薄型泵浦200放置於平台座302上,遂執行步驟S1:於一檢測時間內以驅動電源驅動薄型泵浦200,並透過氣壓感測器檢測薄型泵浦200於檢測時間內的氣流資訊,其氣流資訊包含了氣體壓力及氣體流量。The reinforcement methods S1 to S3 of the
再執行步驟S2,將氣壓感測器所檢測到的氣流資訊與預設氣流值比對,確認薄型泵浦200於檢測時間內的氣體壓力及氣體流量是否低於預設氣流值,若氣流資訊低於預設氣流值,則執行步驟S3,而氣流資訊內的氣體壓力及氣體流量均達到預設氣流值標準的薄型泵浦200則無須再執行步驟S3進行補強。Step S2 is then executed to compare the airflow information detected by the air pressure sensor with the preset airflow value to confirm whether the gas pressure and gas flow rate of the
最後執行步驟S3,若薄型泵浦200於檢測時間內的氣流資訊低於預設氣流值,啟動下壓平台300的下壓工具301頂抵在薄型泵浦200的表面後,朝薄型泵浦200施力下壓補強距離;值得注意的是,於步驟S2中比對氣流資訊與預設氣流值,其比對結果與下壓的補強距離有相對關係,氣流資訊與預設氣流值之間的差值越大,其下壓的補強距離越大,反之,氣流資訊與預設氣流值之間的差值越小,其下壓的補強距離就越小,亦即氣流資訊與預設氣流值之間的差距與補強距離成正比。Finally, step S3 is executed. If the airflow information of the
完成步驟S3後,再次回到步驟S1,驅動薄型泵浦200並取得具有補強距離之薄型泵浦200的氣流資訊,並比對氣流資訊是否低於預設氣流值,當氣流資訊已達到預設氣流值,即可完成,若氣流資訊仍低於預設氣流值,再次對薄型泵浦200下壓補強距離,其下壓的補償距離仍與氣流資訊與預設氣流值之間的差值成正比,完成後,再度回到步驟S1至S3,直到氣流資訊達到預設氣流值為止。After completing step S3, go back to step S1 again, drive the
此外,取得氣流資訊及下壓補強距離可分開進行,於另一實施方式中,設有一測試平台(未圖示),測試平台具有驅動電源及氣壓感測器,於測試平台上進行步驟S1、S2;驅動薄型泵浦200及取得氣流資訊,並比對氣流資訊與預設氣流值的關係,若氣流資訊低於預設氣流值,將薄型泵浦200移至下壓平台300的平台座302上,再依據氣流資訊與預設氣流值之間的關係,確認補強距離,再由下壓平台300的下壓工具301頂抵於薄型泵浦200後,下壓其補強距離。In addition, obtaining airflow information and down-pressure reinforcement distance can be performed separately. In another embodiment, a test platform (not shown) is provided. The test platform has a driving power supply and an air pressure sensor. Steps S1 and S1 are performed on the test platform. S2: Drive the
本實施例完成步驟S3後,同樣回到步驟S1,再將薄型泵浦200設置於測試平台取得氣流資訊,並比較當前的氣流資訊與預設氣流值的關係,當氣流資訊達到預設氣流值的標準後,即可完成,反之,若氣流資訊仍低於預設氣流值,再將薄型泵浦200移至下壓平台300再次下壓補強距離至氣流資訊達到預設氣流值為止。After completing step S3 in this embodiment, the same goes back to step S1, and the
值得注意的是,前述的補強距離都會依據氣流資訊比對預設氣流值後才確認,補強距離的範圍介於0.01mm至0.5mm之間。It is worth noting that the aforementioned reinforcement distance will be confirmed after comparing the preset airflow value based on the airflow information. The range of the reinforcement distance is between 0.01mm and 0.5mm.
綜上所述,微型泵浦完成後,檢測微型泵浦的氣流資訊,並將氣流資訊與預設氣流值比對,並依據比對結果來調整下壓平台對薄型泵浦的補強距離,來提升薄型泵浦的良率,改善因堆疊所產生的公差導致薄型泵浦性能下降的問題,極具產業利用性及進步性。To sum up, after the micro pump is completed, the air flow information of the micro pump is detected, and the air flow information is compared with the preset air flow value, and the reinforcement distance of the lower pressure platform to the thin pump is adjusted according to the comparison result. Improve the yield of thin pumps and improve the performance of thin pumps due to tolerances caused by stacking. It is extremely industrially usable and progressive.
S1~S3:補強步驟
100、200:薄型泵浦
101:進氣板
102:共振片
103:致動器
104:第一絕緣框架
105:導電框架
106:絕緣框架
107:集氣板
300:下壓平台
301:下壓工具
302:平台座S1~S3:
第1圖為先前技術中薄型泵浦的示意圖。 第2圖為本案薄型泵浦補強方法之流程圖。 第3圖為本案下壓平台之立體示意圖。 Figure 1 is a schematic diagram of a thin pump in the prior art. Figure 2 is a flow chart of the thin pump reinforcement method in this case. Figure 3 is a three-dimensional schematic diagram of the pressing platform of this case.
S1~S3:補強步驟 S1~S3: Reinforcement steps
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US5543763A (en) * | 1992-09-07 | 1996-08-06 | Murata Manufacturing Co., Ltd. | Piezoelectric component for ladder type filter and method of manufacturing thereof |
US6060963A (en) * | 1998-05-11 | 2000-05-09 | Murata Manufacturing Co., Ltd. | Ladder-type piezoelectric filter with lid providing predetermined contact pressure and method of manufacturing same |
JP6489206B2 (en) * | 2015-03-27 | 2019-03-27 | 株式会社村田製作所 | Piezoelectric generator and piezoelectric generator |
TW201912939A (en) * | 2017-08-21 | 2019-04-01 | 研能科技股份有限公司 | Energy-saving control method for resonant piezoelectric gas pump |
JP2020043505A (en) * | 2018-09-12 | 2020-03-19 | 京セラ株式会社 | Piezoelectric device and method for manufacturing piezoelectric device |
CN110985359A (en) * | 2019-12-23 | 2020-04-10 | 中国电子科技集团公司第二十六研究所 | Surface-mounted piezoelectric micropump and manufacturing method thereof |
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Patent Citations (6)
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US5543763A (en) * | 1992-09-07 | 1996-08-06 | Murata Manufacturing Co., Ltd. | Piezoelectric component for ladder type filter and method of manufacturing thereof |
US6060963A (en) * | 1998-05-11 | 2000-05-09 | Murata Manufacturing Co., Ltd. | Ladder-type piezoelectric filter with lid providing predetermined contact pressure and method of manufacturing same |
JP6489206B2 (en) * | 2015-03-27 | 2019-03-27 | 株式会社村田製作所 | Piezoelectric generator and piezoelectric generator |
TW201912939A (en) * | 2017-08-21 | 2019-04-01 | 研能科技股份有限公司 | Energy-saving control method for resonant piezoelectric gas pump |
JP2020043505A (en) * | 2018-09-12 | 2020-03-19 | 京セラ株式会社 | Piezoelectric device and method for manufacturing piezoelectric device |
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