[發明欲解決之課題]
上述專利文獻1所記載的半導體裝置的組裝裝置中，電路組裝體和端子一側的樹脂外殼分別通過不同的路徑被實施處理，但最終在焊接/黏接部匯合，進行焊接和黏接。因此，即使想要提高生產量，也會被在焊接/黏接部的處理時間所限制，存在無法提高生產量這樣的問題。
另外，近年來，正在推進對能夠進行200℃以上的高溫動作的SiC功率半導體的開發和產品化。但是，當前多被用於晶片鍵合部的錫－銀(Sn－Ag)系、錫－銅(Sn－Cu)系的無鉛(Pb)焊料的熔點在220℃附近，因此，無法充分發揮SiC功率半導體的特徵。而且，雖然含Pb較多的焊料的熔點在290℃以上，熔點較高，但在考慮到對環境的影響的情況下，應避免對它的應用。而且，基於周圍構件的耐熱性和冷卻時的殘留應力的觀點，接合溫度優選為300℃以下。
於是，對使用耐熱性較高、能夠低溫接合、且導熱係數較高的銀納米顆粒做成的銀納米膏等接合材料進行開發和實際使用，並開始導入一種燒結裝置，該裝置通過燒結法(Sintering)對電子零部件進行接合，該燒結法是指：對通過在絕緣基板等基板上塗布接合材料並載置半導體晶片所做成的電子零部件進行加熱和加壓，來對電子零部件進行接合。
本發明的目的在於，提供一種電子零部件的燒結裝置，該電子零部件的燒結裝置能夠通過燒結法高效地對電子零部件進行接合，該電子零部件的燒結裝置能夠與生產量的增減和電子零部件的種類相應地靈活應對。
[解決課題之手段]
本發明的電子零部件的燒結裝置具有：供給部，其供給在基板上借助接合材料載置有半導體晶片的電子零部件；預熱部，其係對由供給部供給的電子零部件進行預熱；第1燒結加壓部，其係對預熱後的電子零部件進行燒結處理；冷卻部，其係對燒結處理後的電子零部件進行冷卻；收納部，其係對冷卻後的電子零部件進行收納；第1輸送部，其係將從供給部途經預熱部而輸送來的電子零部件朝向第1燒結加壓部進行輸送；以及第2輸送部，其係將途經第1燒結加壓部而輸送來的電子零部件朝向冷卻部進行輸送，在前述電子零部件的燒結裝置中能夠裝卸擴展單元，該擴展單元具有對預熱後的電子零部件進行燒結處理的第2燒結加壓部。
採用本發明的電子零部件的燒結裝置，將在基板上借助接合材料載置有半導體晶片的電子零部件從供給部向預熱部進行供給，在預熱部對該電子零部件進行預熱，將預熱後的電子零部件在第1燒結加壓部進行燒結處理，將燒結處理後的電子零部件在冷卻部進行冷卻，將被冷卻部冷卻後的電子零部件收納於收納部，在該電子零部件的燒結裝置中，通過連接擴展單元，能夠增設第2燒結加壓部。而且，在不需要第2燒結加壓部的情況下，能夠將擴展單元分離出去。
本發明的電子零部件的燒結裝置具有：第1單元，該第1單元具有供給部和預熱部，該供給部供給在基板上借助接合材料載置有半導體晶片的電子零部件，該預熱部對由供給部供給的電子零部件進行預熱；第2單元，其係相對於第1單元能夠裝卸，該第2單元具有冷卻部和收納部，該冷卻部對燒結處理後的電子零部件進行冷卻，該收納部對冷卻後的電子零部件進行收納；第1燒結加壓部，其係設於第1單元和第2單元中的至少任一者，對預熱後的電子零部件進行燒結處理；第1輸送部，其係將從供給部途經預熱部而輸送來的電子零部件朝向第1燒結加壓部進行輸送；以及第2輸送部，其係將途經第1燒結加壓部而輸送來的電子零部件朝向冷卻部進行輸送，在前述電子零部件的燒結裝置中能夠在第1單元與第2單元之間裝卸具有第2燒結加壓部和第3輸送部的擴展單元，該第2燒結加壓部對預熱後的電子零部件進行燒結處理，該第3輸送部將從第1單元側輸送來的電子零部件途經第2燒結加壓部而向第2單元側進行輸送。
採用本發明，是一種電子零部件的燒結裝置，該電子零部件的燒結裝置將在基板上借助接合材料載置有半導體晶片的電子零部件從供給部向預熱部進行供給，在預熱部對該電子零部件進行預熱，將預熱後的電子零部件在第1燒結加壓部進行燒結處理，將燒結處理後的電子零部件在冷卻部進行冷卻，將被冷卻部冷卻後的電子零部件收納於收納部，該電子零部件的燒結裝置中，通過使具有供給部和預熱部的第1單元和具有冷卻部和收納部的第2單元相互分開，並借助擴展單元將第1單元和第2單元連接起來，能夠增設第2燒結加壓部。該情況下，從第1單元側輸送來的電子零部件由第3輸送部途經第2燒結加壓部而向第2單元側進行輸送。而且，在不需要第2燒結加壓部的情況下，能夠將擴展單元分離出去。
理想的是，擴展單元具有在裝卸時進行定位的定位部。由此，在連接擴展單元時，能夠使擴展單元定位，因此容易擴展。
理想的是，供給部具有第4輸送部，該第4輸送部將電子零部件相對於預熱部沿與第1輸送部的輸送方向平行的方向進行輸送，預熱部為了向第1輸送部移交電子零部件而朝向第1輸送部進行進退動作。由此，能夠將預熱後的電子零部件不與第4輸送部相互干擾地向第1輸送部移交，能夠利用第1輸送部向第1燒結加壓部進行輸送。
理想的是，冷卻部具有第5輸送部，該第5輸送部將電子零部件相對於收納部沿與第2輸送部的輸送方向平行的方向進行輸送，並且冷卻部為了從第2輸送部接受電子零部件而朝向第2輸送部進行進退動作。由此，能夠將燒結處理後的電子零部件不與第5輸送部相互干擾地向冷卻部移交，能夠利用第5輸送部將冷卻後的電子零部件向收納部進行輸送。
[發明效果]
(1)電子零部件的燒結裝置具有：供給部，其係供給在基板上借助接合材料載置有半導體晶片的電子零部件；預熱部，其係對由供給部供給的電子零部件進行預熱；第1燒結加壓部，其係對預熱後的電子零部件進行燒結處理；冷卻部，其係對燒結處理後的電子零部件進行冷卻；收納部，其係對冷卻後的電子零部件進行收納；第1輸送部，其密將從供給部途經預熱部而輸送來的電子零部件朝向第1燒結加壓部進行輸送；以及第2輸送部，其係將途經第1燒結加壓部而輸送來的電子零部件朝向冷卻部進行輸送，在前述電子零部件的燒結裝置中能夠裝卸擴展單元，該擴展單元具有對預熱後的電子零部件進行燒結處理的第2燒結加壓部，採用該結構，能夠根據需要來連接擴展單元或將之分離出去，能夠對第2燒結加壓部進行增減，因此，能夠在不增加燒結裝置的台數的前提下容易地應對生產量的增減，成本較低，且能夠抑制裝置的設置面積。而且，即使針對不同種類的電子零部件的同時生產，也能夠通過增減各自所對應的第2燒結加壓部來應對。
(2)電子零部件的燒結裝置具有：第1單元，該第1單元具有供給部和預熱部，該供給部供給在基板上借助接合材料載置有半導體晶片的電子零部件，該預熱部對由供給部供給的電子零部件進行預熱；第2單元，其係相對於第1單元能夠裝卸，該第2單元具有冷卻部和收納部，該冷卻部對燒結處理後的電子零部件進行冷卻，該收納部對冷卻後的電子零部件進行收納；第1燒結加壓部，其係設於第1單元和第2單元中的至少任一者，對預熱後的電子零部件進行燒結處理；第1輸送部，其係將從供給部途經預熱部而輸送來的電子零部件朝向第1燒結加壓部進行輸送；及第2輸送部，其係將途經第1燒結加壓部而輸送來的電子零部件朝向冷卻部進行輸送，在前述電子零部件的燒結裝置中能夠在第1單元與第2單元之間裝卸具有第2燒結加壓部和第3輸送部的擴展單元，該第2燒結加壓部對預熱後的電子零部件進行燒結處理，該第3輸送部將從第1單元側輸送來的電子零部件途經第2燒結加壓部而向第2單元側進行輸送，採用該結構，能夠根據需要，在第1單元與第2單元之間連接擴展單元或將之分離出去，能夠對第2燒結加壓部進行增減，因此，能夠在不增加燒結裝置的台數的前提下容易地應對生產量的增減，成本較低，且能夠抑制裝置的設置面積。而且，即使針對不同種類的電子零部件的同時生產，也能夠通過增減各自所對應的第2燒結加壓部來應對。
(3)擴展單元具有在裝卸時進行定位的定位部，由此，在連接擴展單元時，能夠使擴展單元定位，因此，擴展作業較容易。
(4)供給部具有第4輸送部，該第4輸送部將電子零部件相對於預熱部沿與第1輸送部的輸送方向平行的方向進行輸送，預熱部為了向第1輸送部移交電子零部件而朝向第1輸送部進行進退動作，由此，能夠將預熱後的電子零部件不與第4輸送部相互干擾地向第1輸送部移交，並利用第1輸送部向第1燒結加壓部進行輸送，能夠使裝置的結構緊湊。
(5)冷卻部具有第5輸送部，該第5輸送部將電子零部件相對於收納部沿與第2輸送部的輸送方向平行的方向進行輸送，並且冷卻部為了從第2輸送部接受電子零部件而朝向第2輸送部進行進退動作，由此，能夠將燒結處理後的電子零部件不與第5輸送部相互干擾地向冷卻部移交，並利用第5輸送部將冷卻後的電子零部件向收納部進行輸送，能夠使裝置的結構緊湊。[The problem to be solved by the invention]
In the semiconductor device assembling apparatus described in Patent Document 1, the circuit assembly and the resin case on the terminal side are processed through different paths, but they are finally merged at the soldering/bonding part, and soldering and bonding are performed. Therefore, even if you want to increase the throughput, it is limited by the processing time in the welding/bonding part, and there is a problem that the throughput cannot be increased.
In addition, in recent years, the development and commercialization of SiC power semiconductors capable of operating at a high temperature of 200°C or higher has been advancing. However, tin-silver (Sn-Ag) and tin-copper (Sn-Cu)-based lead-free (Pb) solders, which are currently mostly used in die bonding, have a melting point near 220°C. Therefore, SiC cannot be fully utilized. Features of power semiconductors. Moreover, although the melting point of the solder containing more Pb is above 290°C and the melting point is higher, its application should be avoided in the case of considering the impact on the environment. Furthermore, from the viewpoint of the heat resistance of the surrounding members and the residual stress during cooling, the bonding temperature is preferably 300° C. or less.
Therefore, the development and practical use of bonding materials such as silver nanopaste made of silver nanoparticles with high heat resistance, low temperature bonding, and high thermal conductivity, and the introduction of a sintering device, the device adopts the sintering method ( Sintering) for bonding electronic components. This sintering method refers to heating and pressurizing electronic components made by coating a bonding material on a substrate such as an insulating substrate and placing a semiconductor wafer on the electronic components. Splice.
The object of the present invention is to provide an electronic component sintering device that can efficiently join electronic components by a sintering method, and the electronic component sintering device can cope with the increase or decrease in production volume. The types of electronic parts can be flexibly dealt with accordingly.
[Means to solve the problem]
The sintering device for electronic parts of the present invention has: a supply part which supplies electronic parts on which a semiconductor wafer is placed on a substrate via a bonding material; and a preheating part which preheats the electronic parts supplied from the supply part ; The first sintering and pressing part, which sinters the preheated electronic parts; the cooling part, which cools the sintered electronic parts; the receiving part, which is the cooled electronic parts For storage; the first conveying part, which conveys the electronic components that are conveyed from the supply part via the preheating part toward the first sintering and pressing part; and the second conveying part, which conveys the first sintering and pressing The electronic components transported from the electronic components are transported toward the cooling section. The expansion unit can be attached to and detached from the aforementioned electronic component sintering device. The expansion unit has a second sintering pressing section that sinters the preheated electronic components. .
According to the electronic component sintering device of the present invention, the electronic component on which the semiconductor wafer is placed on the substrate via the bonding material is supplied from the supply section to the preheating section, and the electronic component is preheated in the preheating section. The preheated electronic components are sintered in the first sintering and pressing section, the sintered electronic components are cooled in the cooling section, and the electronic components cooled by the cooling section are stored in the storage section. In the sintering device for electronic parts, a second sintering press can be added by connecting an expansion unit. Furthermore, when the second sintering and pressing part is not required, the expansion unit can be separated.
The sintering apparatus for electronic components of the present invention includes a first unit having a supply unit and a preheating unit, and the supply unit supplies electronic components on which a semiconductor wafer is placed on a substrate via a bonding material, and the preheating The part preheats the electronic parts supplied by the supply part; the second unit is detachable from the first unit, the second unit has a cooling part and a storage part, and the cooling part treats the sintered electronic parts For cooling, the accommodating section stores the cooled electronic components; the first sintering and pressing section, which is provided in at least one of the first unit and the second unit, performs the preheating of the electronic components Sintering process; the first conveying part, which conveys the electronic components conveyed from the supply part via the preheating part toward the first sintering and pressing part; and the second conveying part, which conveys the first sintering and pressing The electronic components transported from the sintering device are transported toward the cooling section. In the aforementioned electronic component sintering device, the expansion unit having the second sintering pressurizing section and the third transporting section can be detached between the first unit and the second unit. , The second sintering and pressing part performs a sintering process on the preheated electronic parts, and the third conveying part passes the electronic parts conveyed from the first unit side to the second unit side via the second sintering and pressing part Carry out transportation.
According to the present invention, a sintering device for electronic components is provided. The sintering device for electronic components supplies electronic components with semiconductor wafers placed on a substrate via a bonding material from a supply section to a preheating section. The electronic components are preheated, the preheated electronic components are sintered in the first sintering and pressing section, the sintered electronic components are cooled in the cooling section, and the electronic components cooled by the cooling section are cooled. The components are housed in the storage section. In the sintering device for electronic components, the first unit with the supply section and the preheating section and the second unit with the cooling section and the storage section are separated from each other, and the first unit is separated by the expansion unit. The unit and the second unit are connected, and a second sintering press part can be added. In this case, the electronic component conveyed from the side of the first unit is conveyed to the side of the second unit by the third conveying section, passing through the second sintering and pressing section. Furthermore, when the second sintering and pressing part is not required, the expansion unit can be separated.
It is desirable that the expansion unit has a positioning portion for positioning during attachment and detachment. As a result, when the expansion unit is connected, the expansion unit can be positioned, so it is easy to expand.
Ideally, the supply unit has a fourth conveying unit that conveys the electronic components relative to the preheating unit in a direction parallel to the conveying direction of the first conveying unit, and the preheating unit is for conveying to the first conveying unit. The electronic components are handed over and move forward and backward toward the first conveying unit. Thereby, the preheated electronic component can be transferred to the first conveying part without interfering with the fourth conveying part, and the first conveying part can be conveyed to the first sintering and pressing part.
Ideally, the cooling unit has a fifth conveying unit that conveys the electronic components relative to the storage unit in a direction parallel to the conveying direction of the second conveying unit, and the cooling unit is intended to be received from the second conveying unit. The electronic component advances and retracts toward the second conveying unit. Thereby, the electronic component after the sintering process can be transferred to the cooling unit without interfering with the fifth conveying unit, and the cooled electronic component can be conveyed to the storage unit by the fifth conveying unit.
[Effects of the invention]
(1) The sintering device for electronic parts has: a supply part which supplies electronic parts on which a semiconductor wafer is placed on a substrate via a bonding material; and a preheating part which preheats the electronic parts supplied by the supply part. Heat; the first sintering and pressing part, which sinters the preheated electronic parts; the cooling part, which cools the sintered electronic parts; the receiving part, which is the cooled electronic parts The components are accommodated; the first conveying part, which conveys the electronic components conveyed from the supply part via the preheating part towards the first sintering and pressing part; and the second conveying part, which conveys the electronic components passing through the first sintering and pressing part The electronic parts conveyed from the pressing part are conveyed toward the cooling part. The expansion unit can be attached to and detached from the aforementioned electronic part sintering device. The expansion unit has a second sintering press for sintering the preheated electronic parts. With this structure, the expansion unit can be connected or separated as needed, and the second sintering press part can be increased or decreased. Therefore, it is possible to easily cope with the production volume without increasing the number of sintering devices. The increase or decrease, the cost is low, and the installation area of the device can be suppressed. Moreover, even for the simultaneous production of different types of electronic components, it can be dealt with by increasing or decreasing the corresponding second sintering press part.
(2) The sintering device for electronic parts has: a first unit having a supply part and a preheating part, and the supply part supplies electronic parts on which a semiconductor wafer is placed on a substrate via a bonding material, and the preheating The part preheats the electronic parts supplied by the supply part; the second unit is detachable from the first unit, the second unit has a cooling part and a storage part, and the cooling part treats the sintered electronic parts For cooling, the accommodating section stores the cooled electronic components; the first sintering and pressing section, which is provided in at least one of the first unit and the second unit, performs the preheating of the electronic components Sintering process; the first conveying part, which conveys the electronic parts conveyed from the supply part via the preheating part toward the first sintering and pressing part; and the second conveying part, which conveys the first sintering and pressing The electronic components transported from the sintering device are transported toward the cooling section. In the aforementioned electronic component sintering device, the expansion unit having the second sintering pressurizing section and the third transporting section can be detached between the first unit and the second unit. , The second sintering and pressing part performs a sintering process on the preheated electronic parts, and the third conveying part passes the electronic parts conveyed from the first unit side to the second unit side via the second sintering and pressing part With this structure, the expansion unit can be connected or separated between the first unit and the second unit as needed, and the second sintering pressure part can be increased or decreased. Therefore, it is possible to increase or decrease the sintering device without adding a sintering device. Under the premise of the number of units, it is easy to cope with the increase or decrease in production, the cost is low, and the installation area of the device can be suppressed. Moreover, even for the simultaneous production of different types of electronic components, it can be dealt with by increasing or decreasing the corresponding second sintering press part.
(3) The expansion unit has a positioning portion for positioning during attachment and detachment. Therefore, when the expansion unit is connected, the expansion unit can be positioned. Therefore, the expansion operation is easier.
(4) The supply unit has a fourth conveying unit that conveys the electronic components relative to the preheating unit in a direction parallel to the conveying direction of the first conveying unit. The preheating unit is intended to be transferred to the first conveying unit. The electronic components advance and retreat toward the first conveying unit, whereby the preheated electronic components can be transferred to the first conveying unit without interfering with the fourth conveying unit, and the first conveying unit can be used to the first conveying unit. The sintering and pressing part carries out transportation, which can make the structure of the device compact.
(5) The cooling unit has a fifth conveying unit that conveys electronic components relative to the storage unit in a direction parallel to the conveying direction of the second conveying unit, and the cooling unit is designed to receive electrons from the second conveying unit. The components are moved forward and backward toward the second conveying section, whereby the sintered electronic components can be transferred to the cooling section without interfering with the fifth conveying section, and the cooled electronic components can be transferred to the cooling section by the fifth conveying section. The components are transported to the storage section, so that the structure of the device can be made compact.
圖1是表示本發明的實施方式的電子零部件的燒結裝置的概略結構的俯視圖，圖2是表示針對圖1中的燒結裝置增設擴展單元的情況的俯視圖，圖3是圖2中的情況的主視圖，圖4是表示增設擴展單元後的燒結裝置的概略結構的俯視圖。
圖1中，本發明的實施方式的電子零部件的燒結裝置1具有：供給部2，其供給電子零部件10；預熱部3，其對由供給部2供給的電子零部件10進行預熱；第1燒結加壓部4A，其對由預熱部3預熱後的電子零部件10進行燒結處理；冷卻部5，其對由第1燒結加壓部4A燒結處理後的電子零部件10進行冷卻；收納部6，其對由冷卻部5冷卻後的電子零部件10進行收納；及輸送部7，其將電子零部件10從供給部2沿輸送方向X途經預熱部3、第1燒結加壓部4A和冷卻部5輸送至收納部6。
燒結裝置1由第1單元1A和第2單元1B構成，第1單元1A具有供給部2、預熱部3和第1燒結加壓部4A，第2單元1B具有冷卻部5和收納部6。第1單元1A和第2單元1B能夠被安裝在一起且能夠被拆分開。而且，在該第1單元1A與第2單元1B之間，能夠像圖2～圖4所示那樣裝卸擴展單元1C，詳細內容將在後面敘述。
電子零部件10是通過在絕緣基板等基板上借助接合材料載置半導體晶片來做成的。接合材料為使用耐熱性較高、能夠低溫接合、且導熱係數較高的銀納米顆粒做成的銀納米膏等燒結(燒結法)用接合材料。半導體晶片為功率模組所用的功率半導體晶片。電子零部件以一個或多個被載置於托盤11上的狀態由輸送部7在燒結裝置1內進行輸送。
輸送部7由在第1單元1A內輸送電子零部件10的第1輸送部7A和在第2單元1B內輸送電子零部件10的第2輸送部7B構成。輸送部7例如由構成第1輸送部7A的直線狀軌道、構成第2輸送部7B的直線狀軌道、以及能夠跨第1輸送部7A和第2輸送部7B地移動的載體7F構成。在將第1單元1A和第2單元1B連接起來的狀態下，第1輸送部7A和第2輸送部7B在一條直線上連續地配置。
第1輸送部7A將從供給部2途經預熱部3後輸送來的電子零部件10朝向第1燒結加壓部4A進行輸送。第1輸送部7A將從供給部2搬出來的電子零部件10連同托盤11一起接受，沿輸送方向X進行輸送，向預熱部3移交。然後，第1輸送部7A將由預熱部3預熱後的電子零部件10連同托盤11一起接受，沿輸送方向X進行輸送，向第1燒結加壓部4A移交。然後，第1輸送部7A將由第1燒結加壓部4A燒結處理後的電子零部件10連同托盤11一起接受，沿輸送方向X向第2輸送部7B進行輸送。
第2輸送部7B將途經第1燒結加壓部4A後輸送來的電子零部件10朝向冷卻部5進行輸送。第2輸送部7B將從第1輸送部7A輸送來的電子零部件10沿輸送方向X進行輸送，連同托盤11一起向冷卻部5移交。然後，第2輸送部7B將由冷卻部5冷卻後的電子零部件10連同托盤11一起接受，沿輸送方向X進行輸送，向收納部6移交。
而且，如上所述，本實施方式的燒結裝置1能夠在第1單元1A與第2單元1B之間裝卸圖2～圖4所示的擴展單元1C。擴展單元1C具有：第2燒結加壓部4B，其對預熱後的電子零部件10進行燒結處理；及第3輸送部7C，其將從第1單元1A側輸送來的電子零部件10途經第2燒結加壓部4B向第2單元1B側進行輸送。
第3輸送部7C例如由直線狀軌道構成。在第1單元1A與第2單元1B之間連接有擴展單元1C的狀態下，第1輸送部7A、第3輸送部7C和第2輸送部7B在一條直線上連續地配置，且構成輸送部7。該情況下，載體7F變為能夠跨第1輸送部7A、第3輸送部7C和第2輸送部7B地移動。
而且，第1單元1A、第2單元1B和擴展單元1C均具有在相互間進行裝卸時進行定位的定位部12。定位部12例如由定位凹部12A和定位凸部12B構成，定位凹部12A分別形成在第1單元1A的靠第2單元1B那側以及第3單元1C的靠第2單元1B那側，定位凸部12B以與定位凹部12A相對應的方式，分別形成在第3單元1C的靠第1單元1A那側以及第2單元1B的靠第1單元1A那側。通過定位凸部12B嵌合於定位凹部12A或定位凸部12B從定位凹部12A中脫離，從而能夠在裝卸時使第1單元1A、第2單元1B和擴展單元1C相互定位。
在第1燒結加壓部4A中，對在預熱部3預熱過的電子零部件10以低於接合材料的熔點的燒結處理溫度進行加熱和加壓，來進行燒結處理。在第1燒結加壓部4A中，利用模框41，將由輸送部7從預熱部3輸送來的電子零部件10連同托盤11一起夾入，在腔室40內以規定的燒結處理溫度和規定的處理時間進行加熱和加壓。在接合材料為銀納米膏的情況下，以250℃～300℃的燒結處理溫度進行加熱，以5MPa～20MPa的壓力進行加壓。第2燒結加壓部4B也為同樣。
在預熱部3中，對電子零部件10以比上述燒結處理溫度還低的預熱溫度(下面稱為“第1預熱溫度”。)進行預熱。預熱部3具有將第1預熱溫度維持在規定溫度的加熱機構、溫度感測器和溫度控制部。在預熱部3中，對由輸送部7從供給部2輸送來的電子零部件10連同托盤11一起在腔室30內進行預熱。在接合材料為銀納米膏的情況下，以100℃左右(優選為80℃～120℃)的第1預熱溫度進行預熱。
在冷卻部5中，將電子零部件10冷卻至低於上述燒結處理溫度的冷卻溫度。冷卻部5具有將冷卻溫度維持在規定溫度的冷卻機構、溫度感測器和溫度控制部。在冷卻部5中，對由輸送部7從第1燒結加壓部4A輸送來的電子零部件10連同托盤11一起在腔室50內進行冷卻。冷卻溫度為100℃左右(優選為80℃～120℃)以下。在冷卻部5冷卻後的電子零部件10連同托盤11一起由輸送部7向收納部6進行輸送並被收納。
而且，本實施方式的燒結裝置1具有將非活性氣體分別向預熱部3、第1燒結加壓部4A和冷卻部5供給的管道(未圖示)。非活性氣體防止電子零部件10在預熱部3、第1燒結加壓部4A和冷卻部5中被氧化，例如能夠使用氮氣。通過將管道的溫度設定為與各預熱部3、第1燒結加壓部4A和冷卻部5的溫度相同的溫度，或設定為比預熱部3、第1燒結加壓部4A和冷卻部5的溫度高出或低出規定溫度的溫度，能夠避免帶來因與預熱部3、燒結加壓部4和冷卻部5之間的溫度差導致的不良影響。第2燒結加壓部4B也具有同樣的結構。
輸送部7能夠做成為具有以低於燒結處理溫度的第2預熱溫度進行預熱的預熱機構(未圖示)。第2預熱溫度與第1預熱溫度相同，在接合材料為銀納米膏的情況下，第2預熱溫度為100℃左右(優選為80℃～120℃)，但第2預熱溫度也能夠設為不同於第1預熱溫度的溫度。在輸送部7具有腔室(未圖示)的情況下，預熱機構在該腔室內對電子零部件10進行預熱。
而且，輸送部7能夠做成為具有向托盤11上的電子零部件10供給非活性氣體的非活性氣體供給機構(未圖示)。非活性氣體防止在輸送部7對電子零部件的輸送過程中電子零部件10被氧化，例如能夠使用氮氣。供給機構通過朝向托盤11上的電子零部件10噴射非活性氣體來進行供給，或者是在輸送部7具有腔室(未圖示)的情況下向該腔室內進行供給。此時，通過將非活性氣體的溫度設定為與第2預熱溫度相同的溫度，或設定為比第2預熱溫度高出或低出規定溫度的溫度，能夠避免帶來因與第2預熱溫度之間的溫度差導致的不良影響。
而且，本實施方式的燒結裝置1具有：表8，其中預先存儲有與包含接合材料在內的電子零部件10的材料種類相應的處理條件；及控制部9，其參照表8，與電子零部件的材料種類相應地對預熱部3、第1燒結加壓部4A、第2燒結加壓部4B和冷卻部5等的動作進行控制。
表8中，與包含接合材料在內的電子零部件的材料種類相應地，針對預熱部3、第1燒結加壓部4A、第2燒結加壓部4B和冷卻部5，預先存儲有下面各項目的處理條件。這些各處理條件能夠從燒結裝置1的監視畫面(未圖示)、或者有線或無線的遠端終端機(可擕式可程式設計終端、個人電腦、平板電腦等)(未圖示)進行設定。
[預熱部3]
・預熱：進行/不進行
・第1預熱溫度：規定溫度(100℃左右的範圍)
・非活性氣體：使用/不使用
・腔室：有/無
[第1燒結加壓部4A]
・燒結處理溫度：規定溫度(250℃～300℃左右)
・非活性氣體：使用/不使用
・腔室：有/無
[第2燒結加壓部4B]
・燒結處理溫度：規定溫度(250℃～300℃左右)
・非活性氣體：使用/不使用
・腔室：有/無
[冷卻部5]
・冷卻溫度：規定溫度(100℃左右的範圍)以下
・非活性氣體：使用/不使用
・腔室：有/無
[輸送部7]
・預熱：進行/不進行
・第2預熱溫度：規定溫度(100℃左右的範圍)
・非活性氣體：使用/不使用
・腔室：有/無
圖1所示的燒結裝置1中，在基板上借助接合材料載置有半導體晶片的電子零部件10由輸送部7從供給部2向預熱部3輸送。在預熱部3中，將該被輸送來的電子零部件10以100℃左右的規定的第1預熱溫度進行預熱。此時，控制部9參照表8，根據與電子零部件10的材料種類相應的處理條件控制預熱部3。第1預熱溫度是比低於接合材料的熔點的燒結處理溫度還低的溫度，該溫度不會促進接合材料的燒結，而能夠將接合材料中的水分和溶劑等去除。
另外，為了使生產效率最佳化，理想的是，使第1預熱溫度盡可能地接近燒結加壓部4A的燒結處理溫度，但是，以適當的溫度進行預熱，以避免在燒結加壓部4A的燒結處理的上一階段進行燒結。而且，在包含接合材料在內的電子零部件的材料為一旦被加熱就容易氧化的材料的情況下，能夠通過向預熱部3供給非活性氣體來防止氧化。
由預熱部3預熱過的電子零部件10由輸送部7向燒結加壓部4A進行輸送。在輸送部7具有預熱機構的情況下，能夠在從預熱部3至燒結加壓部4A的輸送途中對電子零部件10進行預熱，將電子零部件10的溫度維持在低於燒結處理溫度的第2預熱溫度，防止電子零部件10的溫度降低。此時，控制部9參照表8，根據與電子零部件10的材料種類相應的處理條件控制輸送部7的預熱機構。
在燒結加壓部4A中，該被輸送來的電子零部件10在250℃～300℃左右的規定的燒結處理溫度下被加熱規定時間，且以規定壓力被加壓，來進行燒結處理。此時，控制部9參照表8，根據與電子零部件10的材料種類相應的處理條件控制燒結加壓部4A。另外，即使在燒結處理過程中，也能夠通過向燒結加壓部4A供給非活性氣體來防止氧化。
由燒結加壓部4A燒結處理後的電子零部件10由輸送部7向冷卻部5進行輸送。在冷卻部5中，該經過燒結處理的電子零部件10被冷卻至低於燒結處理溫度的、100℃左右的規定的冷卻溫度以下。此時，控制部9參照表8，根據與電子零部件10的材料相應的處理條件控制冷卻部5。另外，即使在冷卻部5中，也能夠通過供給非活性氣體來防止氧化。由冷卻部5冷卻後的電子零部件10由輸送部7向收納部6進行輸送並被收納。
另外，在輸送部7具有向托盤11上的電子零部件10供給非活性氣體的非活性氣體供給機構的情況下，在由輸送部7對電子零部件10的輸送過程中，利用非活性氣體供給機構向托盤11上的電子零部件10供給非活性氣體。此時，控制部9參照表8，根據與電子零部件10的材料種類相應的處理條件控制輸送部7的非活性氣體供給機構。由此，能夠防止電子零部件10在輸送過程中因預熱和餘熱導致被氧化。
採用本實施方式的燒結裝置1，通過將在基板上借助接合材料載置有半導體晶片的電子零部件10在預熱部3中以比低於接合材料的熔點的燒結處理溫度還低的第1預熱溫度進行預熱，從而能夠在將接合材料中的水分和溶劑等去除之後進行燒結處理，因此能夠使燒結處理較穩定，電子零部件的品質能夠提高。而且，通過在燒結加壓部4A的上一階段進行預熱，能夠縮短在燒結加壓部4A中的加熱時間。
而且，在輸送部7具有預熱機構的情況下，能夠在從預熱部3至燒結加壓部4A的輸送途中對電子零部件10進行預熱，將電子零部件10的溫度維持在低於燒結處理溫度的第2預熱溫度，防止電子零部件10的溫度降低，因此，能夠使燒結處理更加穩定，電子零部件的品質能夠提高。特別是在因在裝置運轉過程中發生故障等使得輸送部7以保持著電子零部件10的狀態停止動作的狀態持續的情況下，是有效的。
而且，該燒結裝置1中，將在燒結加壓部4A中進行過燒結處理的電子零部件10在冷卻部5中冷卻至低於燒結處理溫度的冷卻溫度，因此，能夠防止因燒結處理後的餘熱導致的促進氧化，電子零部件的品質能夠進一步提高。而且，能夠使因熱膨脹變大的電子零部件等的尺寸儘快恢復到室溫尺寸，因此，能夠防止對之後的輸送、收納動作的影響。
而且，該燒結裝置1中，控制部9參照表8，與電子零部件10的材料種類相應地控制預熱部3和燒結加壓部4A等的動作，其中，該表8中預先存儲有包括與包含接合材料在內的電子零部件10的材料種類相應的燒結處理溫度和第1預熱溫度的處理條件，因此，能夠以與包含接合材料在內的電子零部件10的材料種類相應且適合生產的處理條件進行預熱和燒結處理等，生產效率能夠提高。
而且，該燒結裝置1中，在基板上借助接合材料載置有半導體晶片的電子零部件10以被載置在托盤11上的狀態連同托盤11一起由輸送部7進行輸送，因此，能夠使處理動作變得高效，電子零部件10的管理也較容易。而且，在輸送部7具有向托盤11上的電子零部件10供給非活性氣體的非活性氣體供給機構的情況下，在由輸送部7輸送電子零部件10的過程中供給非活性氣體，能夠防止電子零部件10在輸送過程中因預熱和餘熱導致被氧化，電子零部件的品質能夠進一步提高。
而且，該燒結裝置1中，通過使第1單元1A和第2單元1B相互分離，像圖2和圖3所示那樣地在第1單元1A與第2單元1B之間配置擴展單元1C，並像圖4所示那樣地借助擴展單元1C將第1單元1A和第2單元1B連接起來，能夠形成使第1輸送部7A、第3輸送部7C和第2輸送部7B在一條直線上連續的輸送部7，且能夠增設第2燒結加壓部4B。第2燒結加壓部4B與上述第1燒結加壓部4A同樣地發揮功能。而且，擴展單元1C也能夠以任意數量進行增減。
由此，能夠與電子零部件10的生產量相應地對第2燒結加壓部4B進行增減，因此，能夠在不增加燒結裝置1自身的台數的前提下容易地應對生產量的增減，成本較低，且能夠抑制裝置的設置面積。而且，即使針對不同種類的電子零部件10的同時生產，也能夠通過增減各自所對應的第2燒結加壓部4B來應對。而且，在不需要第2燒結加壓部4B的情況下，通過將第2燒結加壓部4B拆除，能夠利用最佳數量的燒結加壓部進行最佳生產。
而且，通過使高溫燒結處理所使用的第1燒結加壓部4A和第2燒結加壓部4B的加熱設備分別獨立，能夠利用控制部9細緻地進行控制，能夠抑制耗電量，能夠減少由燒結處理產生的排熱量。而且，能夠減少非活性氣體的使用量。
而且，在燒結處理時發生不良的情況下，通過僅使第1燒結加壓部4A和第2燒結加壓部4B不打開，而使它們以閉合的狀態待機，能夠避免接觸到外部氣體，並且通過向輸送部7噴射非活性氣體，能夠防止氧化。即，在發生多個加壓特有的問題時產生待機時間的情況下，也能夠確保產品的品質。
而且，本實施方式的燒結裝置1中，第1單元1A、第2單元1B和擴展單元1C均具有在相互間進行裝卸時進行定位的定位部12，因此，在將第1單元1A和第2單元1B分離並向第1單元1A與第2單元1B之間連接擴展單元1C時，第1單元1A、第2單元1B和擴展單元1C能夠相互定位，因此，擴展作業較容易。
接著，說明本發明的電子零部件的燒結裝置的另一實施方式。圖5是表示本發明的另一實施方式的電子零部件的燒結裝置的概略結構的俯視圖，圖6是圖5中的情況的主視圖。另外，圖5和圖6中，針對與上述燒結裝置1通用的結構要素標注相同的附圖標記，並省略其詳細的說明。
圖5和圖6所示的電子零部件的燒結裝置13中，供給部2具有將電子零部件10相對於預熱部3沿與第1輸送部7A的輸送方向X平行的方向進行輸送的第4輸送部7D。而且，供給部2具有升降機構20。第4輸送部7D由推桿7D1和驅動部7D2構成，推桿7D1從利用升降機構20進行升降後的供給部2中，將電子零部件10連同托盤11一起朝向預熱部3推送，驅動部7D2驅動推桿7D1。
預熱部3為了向第1輸送部7A移交電子零部件10，沿Y1方向朝第1輸送部7A進行進退動作。圖5中，Y1方向是與輸送方向X正交的方向。預熱部3具有：腔室升降機構31，其使上述腔室30進行升降；及預熱加熱器升降機構33，其使對電子零部件10進行預熱的預熱加熱器32進行升降。預熱部3朝向第1輸送部7A進行進退動作時，為了避免腔室30干擾，利用腔室升降機構31使腔室30升降來使腔室30退避，並且為了避免預熱加熱器31干擾，利用預熱加熱器升降機構33使預熱加熱器32升降來退避。
冷卻部5為了從第2輸送部7B接受電子零部件10，沿Y2方向朝第2輸送部7B進行進退動作。圖5中，Y2方向是與輸送方向X正交的方向。冷卻部5具有：腔室升降機構51，其使上述腔室50進行升降；及冷卻器升降機構53，其使對電子零部件10進行冷卻的冷卻器52進行升降。冷卻部5朝向第2輸送部7B進行進退動作時，為了避免腔室50干擾，利用腔室升降機構51使腔室50升降來使腔室50退避，並且為了避免冷卻器52干擾，利用冷卻器升降機構53使冷卻器52升降來退避。
而且，冷卻部5具有將電子零部件10相對於收納部6沿與第2輸送部7B的輸送方向X平行的方向進行輸送的第5輸送部7E。收納部6具有升降機構60。第5輸送部7E由推桿7E1和驅動部7E2構成，推桿7E1將電子零部件10連同托盤11一起，相對於利用升降機構60進行升降後的收納部6進行推送，驅動部7E2驅動推桿7E1。
即使為上述結構的燒結裝置13，也能夠與上述燒結裝置1同樣地，對配置在第1單元1A與第2單元1B之間的擴展單元1C進行增減，也能夠與電子零部件10的生產量相應地對第2燒結加壓部4B進行增減。
而且，該燒結裝置13中，供給部2具有將電子零部件10相對於預熱部3沿與第1輸送部7A的輸送方向X平行的方向進行輸送的第4輸送部7D，預熱部3為了向第1輸送部7A移交電子零部件10，朝向第1輸送部10進行進退動作，因此，能夠將預熱後的電子零部件10不與第4輸送部7D相互干擾地向第1輸送部7A移交，並利用第1輸送部7A向第1燒結加壓部4A進行輸送，能夠使裝置的結構緊湊。
而且，該燒結裝置13中，冷卻部5具有將電子零部件10相對於收納部6沿與第2輸送部7B的輸送方向X平行的方向進行輸送的第5輸送部7E，並且，冷卻部5為了從第2輸送部7B接受電子零部件10，朝向第2輸送部7B進行進退動作，從而能夠將燒結處理後的電子零部件10不與第5輸送部7E相互干擾地向冷卻部5移交，並利用第5輸送部7E將冷卻後的電子零部件10向收納部6進行輸送，能夠使裝置的結構緊湊。
另外，上述實施方式中，針對第1燒結加壓部4A設於第1單元1A的結構進行了說明，但也可以構成為第1燒結加壓部4A設於第2單元1B。而且，只要構成為第1燒結加壓部4A設於第1單元1A和第2單元1B中的至少任一者即可，也能夠構成為設於第1單元1A和第2單元1B這兩者。
接著，說明本發明的電子零部件的燒結裝置的又一實施方式。圖7是表示本發明的又一實施方式的電子零部件的燒結裝置的概略結構的俯視圖，圖8是省略了圖7中的一部分之後的主視圖。另外，圖7和圖8中，針對與上述燒結裝置1通用的結構要素標注相同的附圖標記，並省略其詳細的說明。
圖7和圖8所示的電子零部件的燒結裝置14具有：供給部2，其供給電子零部件10；預熱部3，其對由供給部2供給的電子零部件10進行預熱；第1燒結加壓部4A，其對由預熱部3預熱後的電子零部件10進行燒結處理；冷卻部5，其對由第1燒結加壓部4A燒結處理後的電子零部件10進行冷卻；及收納部6，其對由冷卻部5冷卻後的電子零部件10進行收納。
而且，該燒結裝置14具有：第1輸送部7A，其將從供給部2途經預熱部3後輸送來的電子零部件10朝向第1燒結加壓部4A進行輸送；及第2輸送部(未圖示)，其將途經第1燒結加壓部4A後輸送來的電子零部件10朝向冷卻部5進行輸送，電子零部件10從供給部2途經預熱部3、第1燒結加壓部4A和冷卻部5而被輸送至收納部6。
該燒結裝置14中，能夠在第1燒結加壓部4A側裝卸任意數量的擴展單元1C。在連接有該第1燒結加壓部4A的狀態下，第1輸送部7A和第3輸送部7C在一條直線上連續地配置，載體7F能夠跨第1輸送部7A和第3輸送部7C地移動，電子零部件10從供給部2途經預熱部3、第1燒結加壓部4A、第2燒結加壓部4B和冷卻部5而被輸送至收納部6。
即使為上述結構的燒結裝置14，也能夠對擴展單元1C進行增減，也能夠與電子零部件10的生產量相應地對第2燒結加壓部4B進行增減。
[產業上的可利用性]
本發明作為通過燒結法對電子零部件進行接合的電子零部件的燒結裝置是有效的，特別適用於能夠與生產量的增減、電子零部件的種類相應地靈活應對的燒結裝置。1 is a plan view showing a schematic structure of an electronic component sintering device according to an embodiment of the present invention, FIG. 2 is a plan view showing a case where an expansion unit is added to the sintering device in FIG. 1, and FIG. 3 is a situation in FIG. 2 Front view, FIG. 4 is a plan view showing the schematic structure of the sintering device after the expansion unit is added.
In FIG. 1, an electronic component sintering apparatus 1 according to an embodiment of the present invention has: a supply unit 2 which supplies electronic components 10; and a preheating unit 3 which preheats the electronic components 10 supplied by the supply unit 2. ; The first sintering and pressing section 4A, which sinters the electronic component 10 preheated by the preheating section 3; the cooling section 5, which sinters the electronic component 10 after the sintering process by the first sintering and pressing section 4A Perform cooling; the storage section 6, which stores the electronic components 10 cooled by the cooling section 5; and the transport section 7, which transports the electronic components 10 from the supply section 2 in the transport direction X through the preheating section 3 and the first The sintering press part 4A and the cooling part 5 are conveyed to the storage part 6.
The sintering device 1 is composed of a first unit 1A and a second unit 1B. The first unit 1A has a supply unit 2, a preheating unit 3 and a first sintering pressurizing unit 4A, and the second unit 1B has a cooling unit 5 and a storage unit 6. The first unit 1A and the second unit 1B can be installed together and can be separated. In addition, between the first unit 1A and the second unit 1B, the expansion unit 1C can be attached and detached as shown in FIGS. 2 to 4, and the details will be described later.
The electronic component 10 is manufactured by placing a semiconductor wafer on a substrate such as an insulating substrate via a bonding material. The bonding material is a bonding material for sintering (sintering method) such as silver nanopaste made of silver nanoparticles with high heat resistance, low temperature bonding, and high thermal conductivity. Semiconductor chips are power semiconductor chips used in power modules. The electronic components are conveyed in the sintering apparatus 1 by the conveying unit 7 in a state where one or more electronic components are placed on the tray 11.
The transport unit 7 is composed of a first transport unit 7A that transports the electronic component 10 in the first unit 1A, and a second transport unit 7B that transports the electronic component 10 in the second unit 1B. The conveying unit 7 is composed of, for example, a linear rail constituting the first conveying unit 7A, a linear rail constituting the second conveying unit 7B, and a carrier 7F that can move across the first conveying unit 7A and the second conveying unit 7B. In a state where the first unit 1A and the second unit 1B are connected, the first transport section 7A and the second transport section 7B are continuously arranged on a straight line.
The first conveying unit 7A conveys the electronic component 10 conveyed from the supply unit 2 through the preheating unit 3 toward the first sintering and pressing unit 4A. The first transport unit 7A receives the electronic component 10 carried out from the supply unit 2 together with the tray 11, transports it in the transport direction X, and transfers it to the preheating unit 3. Then, the first conveying unit 7A receives the electronic component 10 preheated by the preheating unit 3 together with the tray 11, conveys it in the conveying direction X, and delivers it to the first sintering pressurizing unit 4A. Then, the first conveying unit 7A receives the electronic component 10 sintered by the first sintering and pressing unit 4A together with the tray 11, and conveys it in the conveying direction X to the second conveying unit 7B.
The second conveying unit 7B conveys the electronic component 10 conveyed after passing through the first sintering and pressing unit 4A toward the cooling unit 5. The second conveying unit 7B conveys the electronic component 10 conveyed from the first conveying unit 7A in the conveying direction X, and delivers it to the cooling unit 5 together with the tray 11. Then, the second conveying unit 7B receives the electronic component 10 cooled by the cooling unit 5 together with the tray 11, conveys it in the conveying direction X, and delivers it to the storage unit 6.
Furthermore, as described above, the sintering apparatus 1 of the present embodiment can attach and detach the expansion unit 1C shown in FIGS. 2 to 4 between the first unit 1A and the second unit 1B. The expansion unit 1C has: a second sintering and pressing part 4B that sinters the preheated electronic component 10; and a third conveying part 7C that passes the electronic component 10 conveyed from the side of the first unit 1A The second sintering and pressing part 4B is conveyed to the second unit 1B side.
The 3rd conveyance part 7C is comprised by the linear rail, for example. With the expansion unit 1C connected between the first unit 1A and the second unit 1B, the first conveying unit 7A, the third conveying unit 7C, and the second conveying unit 7B are continuously arranged on a straight line and constitute a conveying unit 7. In this case, the carrier 7F can move across the first transport section 7A, the third transport section 7C, and the second transport section 7B.
Furthermore, each of the first unit 1A, the second unit 1B, and the expansion unit 1C has a positioning portion 12 for positioning when attaching and detaching each other. The positioning portion 12 is composed of, for example, a positioning concave portion 12A and a positioning convex portion 12B. The positioning concave portion 12A is respectively formed on the side of the first unit 1A on the side of the second unit 1B and the side of the third unit 1C on the side of the second unit 1B. 12B is formed on the side of the first unit 1A of the third unit 1C and the side of the second unit 1B on the side of the first unit 1A so as to correspond to the positioning recesses 12A. The positioning convex portion 12B is fitted into the positioning concave portion 12A or the positioning convex portion 12B is detached from the positioning concave portion 12A, so that the first unit 1A, the second unit 1B, and the expansion unit 1C can be mutually positioned during attachment and detachment.
In the first sintering and pressing section 4A, the electronic component 10 preheated in the preheating section 3 is heated and pressurized at a sintering process temperature lower than the melting point of the bonding material to perform a sintering process. In the first sintering and pressing section 4A, the mold frame 41 is used to sandwich the electronic components 10 conveyed from the preheating section 3 by the conveying section 7 together with the tray 11, and in the chamber 40 at a predetermined sintering temperature and Heat and pressurize for the specified processing time. When the bonding material is a silver nanopaste, heating is performed at a sintering temperature of 250° C. to 300° C., and pressure is applied at a pressure of 5 MPa to 20 MPa. The same applies to the second sintering pressing part 4B.
In the preheating section 3, the electronic component 10 is preheated at a preheating temperature (hereinafter referred to as "first preheating temperature") lower than the above-mentioned sintering processing temperature. The preheating unit 3 has a heating mechanism that maintains the first preheating temperature at a predetermined temperature, a temperature sensor, and a temperature control unit. In the preheating unit 3, the electronic component 10 transported from the supply unit 2 by the transport unit 7 is preheated in the chamber 30 together with the tray 11. When the bonding material is a silver nanopaste, it is preheated at a first preheating temperature of about 100°C (preferably 80°C to 120°C).
In the cooling section 5, the electronic component 10 is cooled to a cooling temperature lower than the above-mentioned sintering process temperature. The cooling unit 5 has a cooling mechanism that maintains a cooling temperature at a predetermined temperature, a temperature sensor, and a temperature control unit. In the cooling unit 5, the electronic component 10 transported from the first sintering and pressing unit 4A by the transport unit 7 is cooled in the chamber 50 together with the tray 11. The cooling temperature is about 100°C (preferably 80°C to 120°C) or lower. The electronic component 10 cooled by the cooling part 5 is conveyed by the conveyance part 7 to the accommodating part 6 together with the tray 11, and is accommodated.
Furthermore, the sintering apparatus 1 of the present embodiment has a pipe (not shown) for supplying inert gas to the preheating section 3, the first sintering pressurizing section 4A, and the cooling section 5, respectively. The inert gas prevents the electronic component 10 from being oxidized in the preheating part 3, the first sintering pressurizing part 4A, and the cooling part 5. For example, nitrogen gas can be used. By setting the temperature of the piping to the same temperature as the temperature of each of the preheating section 3, the first sintering pressing section 4A, and the cooling section 5, or setting it to be higher than the temperature of the preheating section 3, the first sintering pressing section 4A and the cooling section The temperature of 5 higher or lower than the predetermined temperature can avoid adverse effects caused by the temperature difference with the preheating part 3, the sintering press part 4, and the cooling part 5. The second sintering pressing part 4B also has the same structure.
The conveyance part 7 can be made into a preheating mechanism (not shown) which performs preheating at the 2nd preheating temperature lower than the sintering process temperature. The second preheating temperature is the same as the first preheating temperature. When the bonding material is silver nanopaste, the second preheating temperature is about 100°C (preferably 80°C to 120°C), but the second preheating temperature is also It can be set to a temperature different from the first preheating temperature. When the conveying unit 7 has a cavity (not shown), the preheating mechanism preheats the electronic component 10 in the cavity.
Furthermore, the conveying unit 7 can be configured to have an inert gas supply mechanism (not shown) for supplying inert gas to the electronic components 10 on the tray 11. The inert gas prevents the electronic components 10 from being oxidized during the transportation of the electronic components by the transportation unit 7, and for example, nitrogen gas can be used. The supply mechanism supplies an inert gas by spraying an inert gas toward the electronic component 10 on the tray 11, or supplies it into the chamber when the conveying unit 7 has a chamber (not shown). At this time, by setting the temperature of the inert gas to the same temperature as the second preheating temperature, or setting it to a temperature higher or lower than the second preheating temperature by a predetermined temperature, it is possible to avoid the cause and effect of the second preheating temperature. The adverse effect caused by the temperature difference between the hot temperatures.
Furthermore, the sintering apparatus 1 of the present embodiment has: a table 8 in which the processing conditions corresponding to the material type of the electronic component 10 including the bonding material are stored in advance; and a control unit 9, which refers to the table 8, and the electronic zero The operation of the preheating section 3, the first sintering pressing section 4A, the second sintering pressing section 4B, the cooling section 5, and the like are controlled according to the material type of the component.
In Table 8, corresponding to the material types of electronic components including bonding materials, the following preheating section 3, first sintering pressing section 4A, second sintering pressing section 4B, and cooling section 5 are pre-stored Treatment conditions for each item. These processing conditions can be set from the monitoring screen (not shown) of the sintering device 1, or a wired or wireless remote terminal (portable programmable terminal, personal computer, tablet computer, etc.) (not shown) .
[Preheating Section 3]
・Preheating: In progress/not in progress
・The first preheating temperature: a predetermined temperature (around 100°C range)
・Inert gas: use/not use
・Chamber: Yes/No
[The first sintering press part 4A]
・Sintering temperature: specified temperature (about 250℃～300℃)
・Inert gas: use/not use
・Chamber: Yes/No
[Second Sintering Pressing Section 4B]
・Sintering temperature: specified temperature (about 250℃～300℃)
・Inert gas: use/not use
・Chamber: Yes/No
[Cooling part 5]
・Cooling temperature: Below the specified temperature (around 100°C range)
・Inert gas: use/not use
・Chamber: Yes/No
[Transportation part 7]
・Preheating: In progress/not in progress
・Second preheating temperature: specified temperature (around 100°C range)
・Inert gas: use/not use
・Chamber: Yes/No
In the sintering apparatus 1 shown in FIG. 1, the electronic component 10 on which the semiconductor wafer is placed on the substrate via the bonding material is transported from the supply section 2 to the preheating section 3 by the transport section 7. In the preheating unit 3, the electronic component 10 that has been transported is preheated at a predetermined first preheating temperature of about 100°C. At this time, the control unit 9 refers to Table 8 and controls the preheating unit 3 according to the processing conditions corresponding to the material type of the electronic component 10. The first preheating temperature is a temperature lower than the sintering temperature lower than the melting point of the bonding material. This temperature does not promote the sintering of the bonding material, but can remove moisture, solvent, etc. in the bonding material.
In addition, in order to optimize production efficiency, it is desirable to make the first preheating temperature as close as possible to the sintering treatment temperature of the sintering press part 4A, but to perform preheating at an appropriate temperature to avoid the sintering press The sintering is performed in the previous stage of the sintering process of the part 4A. Furthermore, when the material of the electronic component including the bonding material is a material that is easily oxidized once heated, it is possible to prevent oxidation by supplying an inert gas to the preheating section 3.
The electronic component 10 preheated by the preheating part 3 is conveyed by the conveying part 7 to the sintering press part 4A. When the conveying section 7 has a preheating mechanism, the electronic component 10 can be preheated during the conveying from the preheating section 3 to the sintering pressing section 4A, and the temperature of the electronic component 10 can be maintained below the sintering process. The second preheating temperature of the temperature prevents the temperature of the electronic component 10 from decreasing. At this time, the control unit 9 refers to Table 8 and controls the preheating mechanism of the transport unit 7 according to the processing conditions corresponding to the material type of the electronic component 10.
In the sintering press section 4A, the transported electronic component 10 is heated at a predetermined sintering temperature of about 250° C. to 300° C. for a predetermined time, and is pressurized at a predetermined pressure to perform the sintering process. At this time, the control unit 9 refers to Table 8 and controls the sintering and pressing unit 4A according to the processing conditions corresponding to the material type of the electronic component 10. In addition, even during the sintering process, it is possible to prevent oxidation by supplying inert gas to the sintering pressurizing part 4A.
The electronic component 10 sintered by the sintering press section 4A is transported to the cooling section 5 by the transport section 7. In the cooling section 5, the electronic component 10 subjected to the sintering process is cooled to a predetermined cooling temperature of about 100° C. or lower, which is lower than the sintering process temperature. At this time, the control unit 9 refers to Table 8 and controls the cooling unit 5 based on processing conditions corresponding to the material of the electronic component 10. In addition, even in the cooling unit 5, it is possible to prevent oxidation by supplying an inert gas. The electronic component 10 cooled by the cooling unit 5 is transported to the storage unit 6 by the transport unit 7 and stored.
In addition, when the conveying unit 7 has an inert gas supply mechanism for supplying inert gas to the electronic components 10 on the tray 11, the inert gas is supplied during the conveying process of the electronic components 10 by the conveying unit 7 The mechanism supplies inert gas to the electronic components 10 on the tray 11. At this time, the control unit 9 refers to Table 8 and controls the inert gas supply mechanism of the transport unit 7 according to the processing conditions corresponding to the material type of the electronic component 10. As a result, it is possible to prevent the electronic component 10 from being oxidized due to preheating and residual heat during transportation.
According to the sintering apparatus 1 of this embodiment, the electronic component 10 on which the semiconductor wafer is placed on the substrate via the bonding material is placed in the preheating section 3 at a sintering temperature lower than the melting point of the bonding material. Preheating at the preheating temperature enables the sintering process to be performed after the moisture, solvent, etc. in the bonding material are removed. Therefore, the sintering process can be stabilized and the quality of electronic components can be improved. Furthermore, by performing preheating at the previous stage of the sintering and pressing part 4A, the heating time in the sintering and pressing part 4A can be shortened.
Furthermore, when the conveying section 7 has a preheating mechanism, the electronic component 10 can be preheated during the conveying from the preheating section 3 to the sintering press section 4A, and the temperature of the electronic component 10 can be maintained below The second preheating temperature of the sintering process temperature prevents the temperature of the electronic component 10 from lowering, and therefore, the sintering process can be stabilized and the quality of the electronic component can be improved. In particular, it is effective when the conveying unit 7 continues to stop operating while the electronic component 10 is being held due to a malfunction or the like during the operation of the device.
Furthermore, in this sintering apparatus 1, the electronic component 10 that has been sintered in the sintering press section 4A is cooled in the cooling section 5 to a cooling temperature lower than the sintering process temperature. Therefore, it is possible to prevent damage caused by the sintering process. The promotion of oxidation caused by waste heat can further improve the quality of electronic parts. Furthermore, the dimensions of electronic components, etc. that have increased due to thermal expansion can be restored to room temperature dimensions as quickly as possible, and therefore, it is possible to prevent the influence on subsequent transportation and storage operations.
In addition, in the sintering apparatus 1, the control unit 9 refers to Table 8 and controls the actions of the preheating unit 3 and the sintering pressurizing unit 4A according to the material type of the electronic component 10. The table 8 pre-stores including The processing conditions of the sintering temperature and the first preheating temperature corresponding to the material type of the electronic component 10 including the bonding material can be adapted and adapted to the material type of the electronic component 10 including the bonding material. The production processing conditions are preheated and sintered, and the production efficiency can be improved.
Furthermore, in this sintering apparatus 1, the electronic component 10 with the semiconductor wafer placed on the substrate via the bonding material is transported by the transport unit 7 together with the tray 11 in a state where it is placed on the tray 11. Therefore, it is possible to process The operation becomes more efficient, and the management of the electronic component 10 becomes easier. Furthermore, when the conveying section 7 has an inert gas supply mechanism for supplying inert gas to the electronic components 10 on the tray 11, the inert gas is supplied during the conveying of the electronic components 10 by the conveying section 7, which can prevent The electronic component 10 is oxidized due to preheating and residual heat during the transportation process, and the quality of the electronic component can be further improved.
Furthermore, in this sintering apparatus 1, by separating the first unit 1A and the second unit 1B from each other, as shown in FIGS. 2 and 3, an expansion unit 1C is arranged between the first unit 1A and the second unit 1B, and Connecting the first unit 1A and the second unit 1B with the expansion unit 1C as shown in FIG. 4 can form a continuous line with the first conveying section 7A, the third conveying section 7C, and the second conveying section 7B. The conveying part 7 can be additionally provided with a second sintering and pressing part 4B. The second sintering and pressing part 4B functions similarly to the above-mentioned first sintering and pressing part 4A. Furthermore, the expansion unit 1C can be increased or decreased by any number.
As a result, the second sintering pressurizing section 4B can be increased or decreased in accordance with the production volume of the electronic component 10. Therefore, it is possible to easily cope with the increase or decrease in the production volume without increasing the number of the sintering apparatus 1 itself. , The cost is low, and the installation area of the device can be suppressed. Furthermore, even if the electronic components 10 of different types are simultaneously produced, it can be dealt with by increasing or decreasing the corresponding second sintering and pressing parts 4B. Furthermore, when the second sintering press part 4B is not required, by removing the second sintering press part 4B, the optimum number of sintering press parts can be used for optimal production.
Furthermore, by making the heating equipment of the first sintering and pressing part 4A and the second sintering and pressing part 4B used in the high-temperature sintering treatment independent of each other, the control part 9 can be used to finely control the power consumption, and the power consumption can be reduced. Heat rejection from sintering process. Moreover, the amount of inert gas used can be reduced.
Furthermore, in the event of a failure during the sintering process, only the first sintering pressing portion 4A and the second sintering pressing portion 4B are not opened, and they are kept in a closed state for standby, thereby avoiding exposure to outside air, and By spraying the inert gas to the conveying part 7, oxidation can be prevented. That is, even in the case where a standby time occurs when multiple problems specific to pressurization occur, the quality of the product can be ensured.
Furthermore, in the sintering apparatus 1 of the present embodiment, the first unit 1A, the second unit 1B, and the expansion unit 1C all have the positioning portion 12 for positioning when attaching and detaching each other. Therefore, the first unit 1A and the second unit 1A When the unit 1B is separated and the expansion unit 1C is connected between the first unit 1A and the second unit 1B, the first unit 1A, the second unit 1B, and the expansion unit 1C can be positioned with each other, so the expansion work is easier.
Next, another embodiment of the sintering apparatus for electronic components of the present invention will be described. 5 is a plan view showing a schematic configuration of an electronic component sintering apparatus according to another embodiment of the present invention, and FIG. 6 is a front view of the situation in FIG. 5. In addition, in FIG. 5 and FIG. 6, the same reference numerals are given to structural elements common to the above-mentioned sintering apparatus 1, and detailed descriptions thereof are omitted.
In the electronic component sintering apparatus 13 shown in FIGS. 5 and 6, the supply unit 2 has a first conveying unit for conveying the electronic component 10 relative to the preheating unit 3 in a direction parallel to the conveying direction X of the first conveying unit 7A. 4 Conveying part 7D. Furthermore, the supply unit 2 has an elevating mechanism 20. The fourth conveying part 7D is composed of a push rod 7D1 and a driving part 7D2. The push rod 7D1 pushes the electronic components 10 together with the tray 11 from the supply part 2 raised and lowered by the lifting mechanism 20 toward the preheating part 3, and the driving part 7D2 drives the push rod 7D1.
In order to transfer the electronic components 10 to the first conveying section 7A, the preheating section 3 advances and retracts toward the first conveying section 7A in the Y1 direction. In FIG. 5, the Y1 direction is a direction orthogonal to the conveying direction X. The preheating unit 3 has a chamber raising and lowering mechanism 31 that raises and lowers the above-mentioned chamber 30 and a preheating heater raising and lowering mechanism 33 that raises and lowers the preheating heater 32 that preheats the electronic component 10. When the preheating part 3 advances and retreats toward the first conveying part 7A, in order to avoid the interference of the chamber 30, the chamber 30 is raised and lowered by the chamber elevating mechanism 31 to evacuate the chamber 30, and in order to avoid the interference of the preheating heater 31, The preheating heater 32 is raised and lowered by the preheating heater raising and lowering mechanism 33 to retreat.
In order to receive the electronic component 10 from the second conveying section 7B, the cooling unit 5 advances and retracts toward the second conveying section 7B in the Y2 direction. In FIG. 5, the Y2 direction is a direction orthogonal to the conveying direction X. The cooling unit 5 has a chamber raising and lowering mechanism 51 that raises and lowers the aforementioned chamber 50 and a cooler raising and lowering mechanism 53 that raises and lowers the cooler 52 that cools the electronic component 10. When the cooling part 5 advances and retracts toward the second conveying part 7B, in order to avoid interference of the chamber 50, the chamber 50 is raised and lowered by the chamber lifting mechanism 51 to evacuate the chamber 50, and in order to avoid the interference of the cooler 52, a cooler is used The elevating mechanism 53 elevates and retracts the cooler 52.
And the cooling part 5 has the 5th conveyance part 7E which conveys the electronic component 10 with respect to the accommodating part 6 in the direction parallel to the conveyance direction X of the 2nd conveyance part 7B. The storage section 6 has an elevating mechanism 60. The fifth conveying part 7E is composed of a push rod 7E1 and a driving part 7E2. The push rod 7E1 pushes the electronic components 10 together with the tray 11 to the storage part 6 which is raised and lowered by the lifting mechanism 60. The driving part 7E2 drives the push rod. 7E1.
Even with the sintering device 13 having the above structure, the expansion unit 1C arranged between the first unit 1A and the second unit 1B can be increased or decreased in the same way as the sintering device 1 described above. The amount is increased or decreased in the second sintering pressurizing part 4B accordingly.
Furthermore, in this sintering apparatus 13, the supply unit 2 has a fourth conveying unit 7D that conveys the electronic component 10 relative to the preheating unit 3 in a direction parallel to the conveying direction X of the first conveying unit 7A, and the preheating unit 3 In order to transfer the electronic component 10 to the first conveying unit 7A, the forward and backward movement is performed toward the first conveying unit 10. Therefore, the preheated electronic component 10 can be transferred to the first conveying unit without interfering with the fourth conveying unit 7D. 7A is handed over and transported to the first sintering and pressing section 4A by the first transport section 7A, so that the structure of the apparatus can be made compact.
Furthermore, in the sintering apparatus 13, the cooling unit 5 has a fifth conveying unit 7E that conveys the electronic component 10 relative to the storage unit 6 in a direction parallel to the conveying direction X of the second conveying unit 7B, and the cooling unit 5 In order to receive the electronic component 10 from the second conveying unit 7B, it is moved forward and backward toward the second conveying unit 7B, so that the sintered electronic component 10 can be transferred to the cooling unit 5 without interfering with the fifth conveying unit 7E. Furthermore, the cooled electronic component 10 is conveyed to the storage section 6 by the fifth conveying section 7E, so that the structure of the device can be made compact.
In addition, in the above-described embodiment, the configuration in which the first sintering and pressing part 4A is provided in the first unit 1A has been described, but it may be configured that the first sintering and pressing part 4A is provided in the second unit 1B. Moreover, it is only necessary that the first sintering pressing portion 4A is provided in at least one of the first unit 1A and the second unit 1B, and it can also be configured to be provided in both the first unit 1A and the second unit 1B. .
Next, another embodiment of the sintering apparatus for electronic components of the present invention will be described. FIG. 7 is a plan view showing a schematic configuration of a sintering apparatus for electronic components according to another embodiment of the present invention, and FIG. 8 is a front view in which a part of FIG. 7 is omitted. In addition, in FIG. 7 and FIG. 8, the same reference numerals are given to structural elements common to the above-mentioned sintering apparatus 1, and detailed descriptions thereof are omitted.
The electronic component sintering apparatus 14 shown in FIGS. 7 and 8 has: a supply unit 2 which supplies electronic components 10; a preheating unit 3 which preheats the electronic components 10 supplied by the supply unit 2; 1 Sintering and pressing section 4A, which sinters the electronic component 10 preheated by the preheating section 3; cooling section 5, which cools the electronic component 10 sintered by the first sintering and pressing section 4A And the storage section 6, which stores the electronic components 10 cooled by the cooling section 5.
Furthermore, this sintering apparatus 14 has: a first conveying section 7A that conveys the electronic components 10 conveyed from the supply section 2 through the preheating section 3 toward the first sintering and pressing section 4A; and a second conveying section ( (Not shown), which transports the electronic component 10 that has passed through the first sintering and pressing part 4A toward the cooling part 5, and the electronic component 10 passes through the preheating part 3 and the first sintering and pressing part from the supply part 2 4A and the cooling unit 5 are transported to the storage unit 6.
In this sintering apparatus 14, an arbitrary number of expansion units 1C can be attached to and detached from the side of the first sintering pressurizing part 4A. With the first sintering and pressing part 4A connected, the first conveying part 7A and the third conveying part 7C are continuously arranged in a straight line, and the carrier 7F can straddle the first conveying part 7A and the third conveying part 7C. When moving, the electronic component 10 is transported from the supply unit 2 to the storage unit 6 via the preheating unit 3, the first sintering pressing unit 4A, the second sintering pressing unit 4B, and the cooling unit 5.
Even with the sintering device 14 having the above-mentioned structure, the expansion unit 1C can be increased or decreased, and the second sintering pressurizing part 4B can be increased or decreased in accordance with the production volume of the electronic component 10.
[Industrial availability]
The present invention is effective as a sintering device for electronic components that joins electronic components by a sintering method, and is particularly suitable for a sintering device that can flexibly respond to increases or decreases in production volume and types of electronic components.
