TWI724899B - Capacitive element heat dissipation structure of controller - Google Patents
Capacitive element heat dissipation structure of controller Download PDFInfo
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- TWI724899B TWI724899B TW109116173A TW109116173A TWI724899B TW I724899 B TWI724899 B TW I724899B TW 109116173 A TW109116173 A TW 109116173A TW 109116173 A TW109116173 A TW 109116173A TW I724899 B TWI724899 B TW I724899B
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Abstract
一種控制器之電容元件散熱結構,控制器包含有一散熱底板,該散熱底板上設置有一控制電路板,該散熱底板上還設置有一功率電路板,該功率電路板位於該散熱底板與該控制電路板之間,且該功率電路板貼合於該散熱底板上;該控制器之電容元件散熱結構,包含有:複數個電容元件,設置於該控制電路板上,該複數個電容元件之間灌注有導熱材料,該複數個電容元件之間設置有一導熱元件。 A heat dissipation structure for a capacitive element of a controller. The controller includes a heat dissipation base plate on which a control circuit board is arranged, and the heat dissipation base plate is also arranged with a power circuit board, and the power circuit board is located between the heat dissipation base plate and the control circuit board. And the power circuit board is attached to the heat dissipation base plate; the capacitive element heat dissipation structure of the controller includes: a plurality of capacitive elements arranged on the control circuit board, and the plurality of capacitive elements are filled with A heat-conducting material, a heat-conducting element is arranged between the plurality of capacitive elements.
Description
本發明係關於一種控制器之電容元件散熱結構,尤指一種於電容元件之間增加導熱元件,能夠將電容元件所產生的熱能導引至散熱底板以快速散熱,增加電容元件的使用壽命的控制器之電容元件散熱結構。 The present invention relates to a heat dissipation structure for a capacitive element of a controller, in particular to a control that adds a heat-conducting element between the capacitive elements, which can guide the heat generated by the capacitive element to the heat dissipation base plate to quickly dissipate heat and increase the service life of the capacitive element The heat dissipation structure of the capacitor element of the device.
控制器包含有散熱底板、控制電路板及功率電路板等構件,控制電路板及功率電路板設置於散熱底板上,其中功率電路板貼合於散熱底板上,控制器還包含有電容元件,設置於控制電路板上。 The controller includes components such as a heat dissipation base plate, a control circuit board, and a power circuit board. The control circuit board and the power circuit board are arranged on the heat dissipation base plate. The power circuit board is attached to the heat dissipation base plate. The controller also includes capacitive elements. On the control circuit board.
進一步來說,功率電路板通常會產生熱能,功率電路板所產生的熱能能夠藉由散熱底板來快速散熱,電容元件也會因為大電流輸出而產生熱能,不過電容元件所產生的熱能只能自然散熱,散熱速度較慢,電容元件會因為長時間的大電流輸出而累積過多熱能,可能導致溫度過高而減少電容元件的壽命,甚至會造成機能失效,因此如何讓電容元件能夠快速散熱,以增加電容元件的使用壽命,是目前重要的課題。 Furthermore, power circuit boards usually generate heat. The heat generated by power circuit boards can be quickly dissipated by the heat dissipation base plate. Capacitive elements will also generate heat due to large current output, but the heat generated by capacitor elements can only be natural Heat dissipation, the heat dissipation speed is slow, the capacitor element will accumulate too much heat energy due to the long-term high current output, which may cause the temperature to be too high and reduce the life of the capacitor element, and even cause the function to fail. Therefore, how to make the capacitor element can quickly dissipate heat? Increasing the service life of capacitive elements is an important issue at present.
本發明人有鑑於此,乃積極研究,加以多年從事相關產品研發之經驗,並經不斷試驗及改良,終於發展出本發明。 In view of this, the inventors actively researched and developed the present invention after years of experience in research and development of related products, and after continuous experiments and improvements.
本發明之主要目的在於提供一種控制器之電容元件散熱結構,能夠將電容元件所產生的熱能導引至散熱底板以快速散熱,增加電容 元件的使用壽命。 The main purpose of the present invention is to provide a heat dissipation structure for the capacitive element of the controller, which can guide the heat generated by the capacitive element to the heat dissipation base plate to quickly dissipate heat and increase the capacitance. The service life of the component.
為了達成上述之目的,本發明係提供一種控制器之電容元件散熱結構,控制器包含有一散熱底板,該散熱底板上設置有一控制電路板,該散熱底板上還設置有一功率電路板,該功率電路板位於該散熱底板與該控制電路板之間,且該功率電路板貼合於該散熱底板上;該控制器之電容元件散熱結構,包含有:複數個電容元件,設置於該控制電路板上,該複數個電容元件之間灌注有導熱材料,該複數個電容元件之間設置有一導熱元件。 In order to achieve the above objective, the present invention provides a heat dissipation structure for a capacitive element of a controller. The controller includes a heat dissipation base plate, a control circuit board is arranged on the heat dissipation base plate, and a power circuit board is also arranged on the heat dissipation base plate. The board is located between the heat dissipation base plate and the control circuit board, and the power circuit board is attached to the heat dissipation base plate; the capacitive element heat dissipation structure of the controller includes: a plurality of capacitive elements arranged on the control circuit board A heat-conducting material is filled between the plurality of capacitive elements, and a heat-conducting element is arranged between the plurality of capacitive elements.
根據本發明的第一實施例,該導熱元件的一端位於該導熱材料內,該導熱元件的另一端位於該散熱底板上的凹槽中,該導熱元件與凹槽之間還灌注有該導熱材料。 According to the first embodiment of the present invention, one end of the heat-conducting element is located in the heat-conducting material, the other end of the heat-conducting element is located in the groove on the heat dissipation base plate, and the heat-conducting material is filled between the heat-conducting element and the groove .
根據本發明的第二實施例,該導熱元件與該散熱底板為一體成型,該導熱元件的一端位於該導熱材料內。 According to the second embodiment of the present invention, the heat-conducting element and the heat dissipation base plate are integrally formed, and one end of the heat-conducting element is located in the heat-conducting material.
根據本發明的第三實施例,該導熱元件的一端藉由鎖固件與該控制電路板鎖固連接,且該功率電路板延伸至該電容元件下方,該導熱元件位於該功率電路板上。 According to the third embodiment of the present invention, one end of the heat-conducting element is fixedly connected to the control circuit board by a fastener, and the power circuit board extends below the capacitive element, and the heat-conducting element is located on the power circuit board.
為讓本發明之目的、特徵和優點能使該領域具有通常知識者更易理解,下文舉一較佳實施例,並配合所附圖式,作詳細說明如下。 In order to make the purpose, features and advantages of the present invention easier to understand by those with ordinary knowledge in the field, a preferred embodiment is given below in conjunction with the accompanying drawings and described in detail as follows.
10:散熱底板 10: Cooling bottom plate
11:控制電路板 11: Control circuit board
12:功率電路板 12: Power circuit board
13:電容元件 13: Capacitive element
14:導熱材料 14: Thermally conductive material
15:導熱元件 15: Thermal element
圖1為本發明控制器之電容元件散熱結構的第一實施例與第二實施例的立體圖。 FIG. 1 is a perspective view of the first embodiment and the second embodiment of the heat dissipation structure of the capacitive element of the controller of the present invention.
圖2為圖1中沿2-2線所作的立體剖視圖。 Fig. 2 is a perspective cross-sectional view taken along line 2-2 in Fig. 1.
圖3為圖2的平面剖視圖。 Fig. 3 is a plan sectional view of Fig. 2.
圖4為圖1中沿2-2線所作的立體剖視圖。 Fig. 4 is a perspective cross-sectional view taken along line 2-2 in Fig. 1.
圖5為圖4的平面剖視圖。 Fig. 5 is a plan sectional view of Fig. 4.
圖6為本發明控制器之電容元件散熱結構的第三實施例的立體圖。 6 is a perspective view of the third embodiment of the heat dissipation structure of the capacitive element of the controller of the present invention.
圖7為圖6中沿7-7線所作的立體剖視圖。 Fig. 7 is a perspective sectional view taken along line 7-7 in Fig. 6;
圖8為圖7的平面剖視圖。 Fig. 8 is a plan sectional view of Fig. 7.
請參閱圖1至圖8所示,本發明係關於一種控制器之電容元件散熱結構,控制器包含有一散熱底板10,該散熱底板10上設置有一控制電路板11,該散熱底板10上還設置有一功率電路板12,該功率電路板12位於該散熱底板10與該控制電路板11之間,且該功率電路板12貼合於該散熱底板10上;該控制器之電容元件散熱結構,包含有:複數個電容元件13,設置於該控制電路板11上,該複數個電容元件13之間灌注有導熱材料14,該複數個電容元件13之間設置有一導熱元件15。
1 to 8, the present invention relates to a heat dissipation structure of a capacitive element of a controller. The controller includes a heat
請參閱圖1至圖3所示,為本發明的第一實施例的立體圖、立體剖視圖及平面剖視圖。根據本發明的第一實施例,該導熱元件15的一端位於該導熱材料14內,該導熱元件15的另一端位於該散熱底板10上的凹槽中,該導熱元件15與凹槽之間還灌注有該導熱材料14。
Please refer to FIGS. 1 to 3, which are a perspective view, a perspective cross-sectional view, and a plan cross-sectional view of the first embodiment of the present invention. According to the first embodiment of the present invention, one end of the heat-conducting
請參閱圖1、圖4及圖5所示,為本發明的第二實施例的立體圖、立體剖視圖及平面剖視圖。根據本發明的第二實施例,該導熱元件15與該散熱底板10為一體成型,該導熱元件15的一端位於該導熱材料14內,
該導熱元件15的另一端與該散熱底板10係一體成型。
Please refer to FIG. 1, FIG. 4, and FIG. 5, which are a perspective view, a perspective cross-sectional view, and a plan cross-sectional view of the second embodiment of the present invention. According to the second embodiment of the present invention, the heat-conducting
請參閱圖6至圖8所示,為本發明的第三實施例的立體圖、立體剖視圖及平面剖視圖。根據本發明的第三實施例,該導熱元件15的一端藉由鎖固件與該控制電路板11鎖固連接,且該功率電路板12延伸至該電容元件13下方,該導熱元件15位於該功率電路板12上。
Please refer to FIGS. 6 to 8, which are a perspective view, a perspective cross-sectional view, and a plan cross-sectional view of the third embodiment of the present invention. According to the third embodiment of the present invention, one end of the heat-conducting
接續上述實施例,其中,該導熱元件15係為熱導管,其具有快速均溫特性。
Following the above-mentioned embodiment, the
接續上述實施例,其中,該導熱元件15係為具有快速均溫特性的金屬材料所製成。
Following the above-mentioned embodiment, the heat-conducting
藉由本發明控制器之電容元件散熱結構,能夠將電容元件所產生的熱能導引至散熱底板以快速散熱,增加電容元件的使用壽命。 With the heat dissipation structure of the capacitor element of the controller of the present invention, the heat energy generated by the capacitor element can be guided to the heat dissipation base plate to quickly dissipate heat, thereby increasing the service life of the capacitor element.
雖然本發明已以較佳實施例揭露如上,然其並非用於限定本發明,任何熟習此技術者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed as above in the preferred embodiment, it is not intended to limit the present invention. Anyone familiar with this technology can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be subject to the scope of the attached patent application.
10:散熱底板 10: Cooling bottom plate
11:控制電路板 11: Control circuit board
12:功率電路板 12: Power circuit board
13:電容元件 13: Capacitive element
14:導熱材料 14: Thermally conductive material
15:導熱元件 15: Thermal element
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103930986A (en) * | 2011-12-09 | 2014-07-16 | 富士电机株式会社 | Power conversion apparatus |
CN104902730A (en) * | 2014-03-06 | 2015-09-09 | Hkr佐伊费尔汽车有限两合公司 | Cooling device and cooling arrangement including cooling device |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103930986A (en) * | 2011-12-09 | 2014-07-16 | 富士电机株式会社 | Power conversion apparatus |
CN104902730A (en) * | 2014-03-06 | 2015-09-09 | Hkr佐伊费尔汽车有限两合公司 | Cooling device and cooling arrangement including cooling device |
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