TWI722178B - 附有保護膜的半導體晶片的製造方法以及半導體裝置的製造方法 - Google Patents
附有保護膜的半導體晶片的製造方法以及半導體裝置的製造方法 Download PDFInfo
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- TWI722178B TWI722178B TW106113978A TW106113978A TWI722178B TW I722178 B TWI722178 B TW I722178B TW 106113978 A TW106113978 A TW 106113978A TW 106113978 A TW106113978 A TW 106113978A TW I722178 B TWI722178 B TW I722178B
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Images
Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2016092010 | 2016-04-28 | ||
JP2016-092010 | 2016-04-28 |
Publications (2)
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TW201812878A TW201812878A (zh) | 2018-04-01 |
TWI722178B true TWI722178B (zh) | 2021-03-21 |
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TW106113978A TWI722178B (zh) | 2016-04-28 | 2017-04-26 | 附有保護膜的半導體晶片的製造方法以及半導體裝置的製造方法 |
Country Status (5)
Country | Link |
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JP (1) | JP6837057B2 (ko) |
KR (1) | KR102410096B1 (ko) |
CN (1) | CN109075046B (ko) |
TW (1) | TWI722178B (ko) |
WO (1) | WO2017188218A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102018200656A1 (de) | 2018-01-16 | 2019-07-18 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009147277A (ja) * | 2007-12-18 | 2009-07-02 | Furukawa Electric Co Ltd:The | チップ保護用フィルム |
WO2016002080A1 (ja) * | 2014-07-04 | 2016-01-07 | リンテック株式会社 | 保護膜形成用フィルム |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5144433B1 (ko) | 1970-02-02 | 1976-11-29 | ||
JP4364508B2 (ja) * | 2002-12-27 | 2009-11-18 | リンテック株式会社 | チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法 |
EP2265682A1 (en) * | 2008-03-31 | 2010-12-29 | Henkel Corporation | Multilayer uv-curable adhesive film |
JP2010031183A (ja) | 2008-07-30 | 2010-02-12 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
JP2011204806A (ja) * | 2010-03-24 | 2011-10-13 | Nitto Denko Corp | ウエハの加工方法 |
US10190017B2 (en) * | 2014-03-28 | 2019-01-29 | Lintec Corporation | Protective film-forming film and method of manufacturing semiconductor chip with protective film |
EP3159914B1 (en) * | 2014-06-18 | 2019-07-24 | LINTEC Corporation | Dicing-sheet base film and dicing sheet |
-
2017
- 2017-04-25 KR KR1020187030455A patent/KR102410096B1/ko active IP Right Grant
- 2017-04-25 JP JP2018514607A patent/JP6837057B2/ja active Active
- 2017-04-25 CN CN201780025391.4A patent/CN109075046B/zh active Active
- 2017-04-25 WO PCT/JP2017/016287 patent/WO2017188218A1/ja active Application Filing
- 2017-04-26 TW TW106113978A patent/TWI722178B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009147277A (ja) * | 2007-12-18 | 2009-07-02 | Furukawa Electric Co Ltd:The | チップ保護用フィルム |
WO2016002080A1 (ja) * | 2014-07-04 | 2016-01-07 | リンテック株式会社 | 保護膜形成用フィルム |
Also Published As
Publication number | Publication date |
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CN109075046B (zh) | 2023-07-18 |
TW201812878A (zh) | 2018-04-01 |
WO2017188218A1 (ja) | 2017-11-02 |
KR20190003943A (ko) | 2019-01-10 |
KR102410096B1 (ko) | 2022-06-17 |
JPWO2017188218A1 (ja) | 2019-03-07 |
JP6837057B2 (ja) | 2021-03-03 |
CN109075046A (zh) | 2018-12-21 |
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