TWI718263B - 相位偏移光罩基底、相位偏移光罩及顯示裝置之製造方法 - Google Patents

相位偏移光罩基底、相位偏移光罩及顯示裝置之製造方法 Download PDF

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Publication number
TWI718263B
TWI718263B TW106106563A TW106106563A TWI718263B TW I718263 B TWI718263 B TW I718263B TW 106106563 A TW106106563 A TW 106106563A TW 106106563 A TW106106563 A TW 106106563A TW I718263 B TWI718263 B TW I718263B
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TW
Taiwan
Prior art keywords
phase shift
film
light
etching
pattern
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TW106106563A
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English (en)
Chinese (zh)
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TW201735161A (zh
Inventor
牛田正男
坪井誠治
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日商Ｈｏｙａ股份有限公司
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Publication of TW201735161A publication Critical patent/TW201735161A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)
TW106106563A 2016-03-24 2017-02-24 相位偏移光罩基底、相位偏移光罩及顯示裝置之製造方法 TWI718263B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP??2016-059487 2016-03-24
JP2016059487 2016-03-24
JP2017013100A JP2017182052A (ja) 2016-03-24 2017-01-27 位相シフトマスクブランク、位相シフトマスク及び表示装置の製造方法
JP??2017-013100 2017-01-27

Publications (2)

Publication Number Publication Date
TW201735161A TW201735161A (zh) 2017-10-01
TWI718263B true TWI718263B (zh) 2021-02-11

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TW106106563A TWI718263B (zh) 2016-03-24 2017-02-24 相位偏移光罩基底、相位偏移光罩及顯示裝置之製造方法

Country Status (3)

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JP (1) JP2017182052A (ko)
KR (1) KR20170113083A (ko)
TW (1) TWI718263B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7062377B2 (ja) * 2017-05-31 2022-05-16 アルバック成膜株式会社 位相シフトマスクの製造方法および位相シフトマスク
JP7154572B2 (ja) * 2018-09-12 2022-10-18 Hoya株式会社 マスクブランク、転写用マスク、及び半導体デバイスの製造方法
JP6756796B2 (ja) * 2018-10-09 2020-09-16 アルバック成膜株式会社 マスクブランクス、ハーフトーンマスク、製造方法
JP7217620B2 (ja) * 2018-11-22 2023-02-03 アルバック成膜株式会社 マスクブランクスおよびマスク
KR20200145954A (ko) 2019-06-21 2020-12-31 삼성디스플레이 주식회사 표시 장치
JP6987912B2 (ja) * 2020-03-16 2022-01-05 アルバック成膜株式会社 マスクブランクス、位相シフトマスク、製造方法
JP7511067B1 (ja) 2023-09-22 2024-07-04 株式会社エスケーエレクトロニクス フォトマスクの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201443550A (zh) * 2013-02-26 2014-11-16 Hoya Corp 相移光罩基底及其製造方法、相移光罩及其製造方法、與顯示裝置之製造方法
TW201510640A (zh) * 2013-08-30 2015-03-16 Hoya Corp 顯示裝置製造用光罩、該光罩之製造方法、圖案轉印方法及顯示裝置之製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6089604B2 (ja) * 2012-11-06 2017-03-08 大日本印刷株式会社 位相シフトマスクの製造方法
JP6324756B2 (ja) * 2013-03-19 2018-05-16 Hoya株式会社 位相シフトマスクブランク及びその製造方法、位相シフトマスクの製造方法、並びに表示装置の製造方法
JP6198238B2 (ja) * 2013-04-17 2017-09-20 アルバック成膜株式会社 位相シフトマスクの製造方法
KR101414556B1 (ko) * 2013-12-13 2014-07-01 주식회사 피케이엘 평판 디스플레이 소자의 해상력 및 생산성 향상을 위한 포토 마스크 및 그 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201443550A (zh) * 2013-02-26 2014-11-16 Hoya Corp 相移光罩基底及其製造方法、相移光罩及其製造方法、與顯示裝置之製造方法
TW201510640A (zh) * 2013-08-30 2015-03-16 Hoya Corp 顯示裝置製造用光罩、該光罩之製造方法、圖案轉印方法及顯示裝置之製造方法

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JP2017182052A (ja) 2017-10-05
KR20170113083A (ko) 2017-10-12
TW201735161A (zh) 2017-10-01

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