TWI717608B - Ultrasonic processing device - Google Patents

Ultrasonic processing device Download PDF

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Publication number
TWI717608B
TWI717608B TW107117697A TW107117697A TWI717608B TW I717608 B TWI717608 B TW I717608B TW 107117697 A TW107117697 A TW 107117697A TW 107117697 A TW107117697 A TW 107117697A TW I717608 B TWI717608 B TW I717608B
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ultrasonic
ultrasonic unit
guide
holder
processing device
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TW107117697A
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TW201900385A (en
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高崎光也
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日商日本磁性技術控股股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B35/00—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本發明之課題在於提供一種可提高對於被加工構件之細微加工的加工精度之超音波加工裝置。 該超音波加工裝置10之特徵為具有基座12、以基座12為基點而配置之載物台14、及支柱16，且具有：超音波單元18，其於沿著支柱16之方向產生微振動；及固持器20，其以沿著支柱16之狀態支持超音波單元18；且於固持器20具備引導超音波單元18沿著支柱16之立設方向振動之複數根導輥22，於複數根導輥22中之至少一根導輥(例如導輥22c)，附帶有產生朝向超音波單元18之軸心方向之彈推力之彈推機構36。The subject of the present invention is to provide an ultrasonic processing device that can improve the processing accuracy of the micro processing of the processed member. The ultrasonic processing device 10 is characterized by having a base 12, a stage 14 arranged with the base 12 as a base point, and a support 16, and it has an ultrasonic unit 18 that generates micro waves in the direction along the support 16. Vibration; and the holder 20, which supports the ultrasonic unit 18 in a state along the pillar 16; and the holder 20 is provided with a plurality of guide rollers 22 that guide the ultrasonic unit 18 to vibrate along the erecting direction of the pillar 16, in the plural At least one of the guide rollers 22 (for example, the guide roller 22c) is attached with an elastic pushing mechanism 36 that generates an elastic thrust toward the axis of the ultrasonic unit 18.

Description

超音波加工裝置Ultrasonic processing device

本發明係關於一種超音波加工裝置，尤其關於適用於高精度地進行於進行電漿處理時使用之噴頭之細微加工之情形時之超音波加工裝置。 The present invention relates to an ultrasonic processing device, and more particularly to an ultrasonic processing device suitable for high-precision processing of nozzles used in plasma processing.

作為於進行電漿處理時使用之噴頭之細微加工所使用之超音波加工裝置，已知例如專利文獻1與專利文獻2所揭示之構成者。 As the ultrasonic processing apparatus used for the microprocessing of the nozzle used for plasma processing, the structure disclosed in patent document 1 and patent document 2 is known, for example.

任一文獻所揭示之超音波加工裝置亦具備：基座，其用以載置被加工構件；支柱，其以該基座為基點而立設；及超音波單元，其沿著支柱配置並支持。且，於超音波單元之與被加工構件之對向部位，安裝有稱為焊頭之加工工具。 The ultrasonic processing device disclosed in any document also includes: a base for placing the processed member; a pillar that is erected with the base as a base point; and an ultrasonic unit that is arranged and supported along the pillar. In addition, a processing tool called a welding head is installed at the opposite part of the ultrasonic unit and the processed component.

於此種構成之超音波裝置中，對被加工構件按壓焊頭，並對焊頭附加超音波之微振動。於對焊頭賦予微振動時，藉由於被加工構件與焊頭抵接部間供給磨粒，切削被加工構件中之焊頭所抵接之部分，作成細微加工。 In the ultrasonic device with such a structure, the welding head is pressed against the processed member, and the micro vibration of the ultrasonic wave is applied to the welding head. When micro-vibration is applied to the welding head, by supplying abrasive grains between the workpiece abutting part and the welding head abutting part, the part of the workpiece abutting by the welding head is cut to make fine processing.

[先前技術文獻] [Prior Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2012-35374號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2012-35374

[專利文獻2]日本專利特開2014-14826號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2014-14826

如上述專利文獻所揭示之構成之超音波加工裝置係以可使超音波單元沿著支柱之立設方向移動予以支持，於由超音波使焊頭微振動時，超音波單元本身亦接受其反作用力而振動。於上述專利文獻所揭示之超音波加工裝置中，若加工所使用之磨粒等介入至超音波單元與支持部間，則會阻礙用以加工之微振動。因此，於超音波單元與支持部間，設置有不產生磨粒咬入程度之間隙，且因該間隙而於與產生之超音波單元之振動方向交叉之方向產生之抖動成為使對於被加工構件之細微加工之加工精度降低之要因。 The ultrasonic processing device constructed as disclosed in the above-mentioned patent documents is supported by the ultrasonic unit moving along the erection direction of the pillar. When the welding head is slightly vibrated by the ultrasonic, the ultrasonic unit itself also accepts its reaction. Force and vibrate. In the ultrasonic processing device disclosed in the above-mentioned patent document, if abrasive grains used for processing intervene between the ultrasonic unit and the support part, the micro vibration used for processing will be hindered. Therefore, between the ultrasonic unit and the supporting part, there is provided a gap that does not cause the abrasive grains to bite, and the jitter generated in the direction crossing the vibration direction of the generated ultrasonic unit due to the gap becomes a problem for the processed member The main reason for the reduction of the machining accuracy of the micro machining.

因此本發明之目的在於提供可解決上述問題並提高對於被加工構件之細微加工之加工精度的超音波加工裝置。 Therefore, the object of the present invention is to provide an ultrasonic processing device that can solve the above-mentioned problems and improve the processing accuracy of the micro processing of the processed member.

為了達成上述目的之本發明之超音波加工裝置特徵在於具有：基座；支柱，其以上述基座為基點而配置並立設於上述基座；超音波單元，其於沿著上述支柱之長邊方向產生微振動；及固持器，其以使得上述超音波單元可沿著上述支柱滑動的方式支持上述超音波單元；且，上述複數根第1導輥以上 述超音波單元之軸心為基點而配置為放射狀；上述複數根第1導輥包括牢固地固定於上述固持器之複數根導輥、以及至少1根導輥；且於上述至少1根導輥附帶有彈推機構，用於產生朝向上述超音波單元之軸心方向之彈推力，並將上述超音波單元按壓於被牢固地固定之上述導輥。 In order to achieve the above-mentioned object, the ultrasonic processing device of the present invention is characterized by having: a base; a support column arranged and standing on the base with the base as a base; an ultrasonic unit located along the long side of the support Micro-vibration in the direction; and a holder, which supports the ultrasonic unit in such a way that the ultrasonic unit can slide along the pillar; and, the plurality of first guide rollers or more The axis of the ultrasonic unit is the base point and is arranged radially; the plurality of first guide rollers include a plurality of guide rollers firmly fixed to the holder, and at least one guide roller; and the at least one guide roller is The roller is attached with an elastic pushing mechanism for generating an elastic pushing force toward the axis of the ultrasonic unit, and pressing the ultrasonic unit against the guide roller which is firmly fixed.

又，於具有上述特徵之超音波加工裝置可構成為，於將上述第1導輥之配置數設為偶數之情形時，各第1導輥以上述超音波單元之軸心作為基點而均等配置為放射狀，使對向配置之第1導輥中之任一者附帶上述彈推機構。藉由具有此種特徵，而與附帶彈推機構之第1導輥對向之第1導輥成為牢固地固定之導輥。因此，可使超音波單元之按壓狀態穩定，並可謀求加工精度之提高。 In addition, the ultrasonic processing device having the above-mentioned characteristics may be configured such that when the number of arrangement of the first guide rollers is an even number, the first guide rollers are equally arranged with the axis of the ultrasonic unit as the base point It is radial, and any one of the first guide rollers arranged oppositely is attached with the above-mentioned spring-pushing mechanism. By having this feature, the first guide roller facing the first guide roller with the elastic pushing mechanism becomes a firmly fixed guide roller. Therefore, the pressing state of the ultrasonic unit can be stabilized, and the processing accuracy can be improved.

又，於具有上述特徵之超音波加工裝置中之上述固持器亦可具備抑制上述超音波單元微振動時產生之繞軸線旋轉之止轉機構。藉由具有此種特徵，而可抑制超音波單元之旋轉，並提高被加工物之加工精度。 In addition, the holder in the ultrasonic processing device having the above-mentioned features may also be provided with a rotation stop mechanism that suppresses rotation around the axis when the ultrasonic unit is micro-vibrated. With this feature, the rotation of the ultrasonic unit can be suppressed, and the processing accuracy of the workpiece can be improved.

再者，具有上述特徵之超音波加工裝置之上述止轉機構可由以下而構成：導件，其固定於上述固持器或上述支柱；第2導輥，其固定於上述超音波單元，且對上述導件彈推。藉由具有此種特徵，而可將止轉之支持設為彈性。藉此，即使於導件與第2導輥間咬入細微之塵埃，亦可克服此而進行引導。 Furthermore, the anti-rotation mechanism of the ultrasonic processing device having the above-mentioned features may be constituted by the following: a guide member, which is fixed to the holder or the pillar; a second guide roller, which is fixed to the ultrasonic unit, and The guide spring pushes. With this feature, the support for stopping rotation can be made flexible. Thereby, even if fine dust is caught between the guide and the second guide roller, it can be overcome and guided.

根據具有上述特徵之超音波加工裝置，可提高對於被加工構件之細微加工之加工精度。 According to the ultrasonic processing device having the above-mentioned features, the processing accuracy of the micro processing of the processed member can be improved.

10:超音波加工裝置 10: Ultrasonic processing device

12:基座 12: Pedestal

14:載物台 14: Stage

16:支柱 16: Pillar

16a:導軌 16a: rail

16b:滑輪 16b: pulley

18:超音波單元 18: Ultrasonic unit

18a:焊頭 18a: welding head

20:固持器 20: Holder

20a:保持部 20a: Holding part

22:導輥 22: Guide roller

22a:導輥 22a: guide roller

22b:導輥 22b: guide roller

22c:導輥 22c: guide roller

22d:導輥 22d: guide roller

24:輥固持器 24: Roll holder

26:彈推機構 26: spring push mechanism

28:止轉構件 28: anti-rotation member

30:輥軸基座 30: Roller base

32:導件 32: guide

32a:引導基座 32a: Guide base

32b:導軌 32b: rail

34:導輥 34: guide roller

34a:導輥 34a: guide roller

34b:導輥 34b: guide roller

36:彈推機構 36: spring push mechanism

A-A:剖面 A-A: Section

B-B:剖面 B-B: Section

C-C:剖面 C-C: Section

D-D:剖面 D-D: Section

E-E:線頭 E-E: thread end

F-F:箭頭 F-F: Arrow

O-O:軸心 O-O: axis

圖1係顯示實施形態之超音波加工裝置之構成之側視圖。 Fig. 1 is a side view showing the structure of the ultrasonic processing device of the embodiment.

圖2係顯示圖1之A-A、及B-B剖面之超音波單元部分之圖。 Fig. 2 is a diagram showing the part of the ultrasonic unit in the A-A and B-B sections of Fig. 1.

圖3係用以說明圖2之構成之方塊圖。 FIG. 3 is a block diagram for explaining the structure of FIG. 2.

圖4係顯示圖1之C-C剖面之超音波單元部分之圖。 Fig. 4 is a diagram showing part of the ultrasonic unit in the C-C section of Fig. 1;

圖5係顯示圖4之D-D剖面之圖。 Fig. 5 is a diagram showing the D-D section of Fig. 4.

圖6係顯示第2實施形態之超音波加工裝置之防止抖動構造之構成之圖。 Fig. 6 is a diagram showing the structure of the anti-shake structure of the ultrasonic processing device of the second embodiment.

以下，對本發明之超音波加工裝置之實施形態，參照圖式進行詳細說明。另，於圖式中，圖1係顯示實施形態之超音波加工裝置之構成之側視圖。又，圖2係顯示圖1之A-A、及B-B剖面之超音波單元部分之圖，圖3係用以說明圖2之構成之方塊圖。又，圖4係顯示圖1之C-C剖面之超音波單元部分之圖，圖5係顯示圖4之D-D剖面之圖。 Hereinafter, the embodiment of the ultrasonic processing device of the present invention will be described in detail with reference to the drawings. In addition, in the drawings, FIG. 1 is a side view showing the configuration of the ultrasonic processing device of the embodiment. In addition, FIG. 2 is a diagram showing the part of the ultrasonic unit in the A-A and B-B sections of FIG. 1, and FIG. 3 is a block diagram for explaining the structure of FIG. 2. In addition, FIG. 4 is a diagram showing the part of the ultrasonic unit in the C-C section of FIG. 1, and FIG. 5 is a diagram showing the D-D section of FIG. 4.

[超音波加工裝置之基本構成] [Basic structure of ultrasonic processing device]

實施形態之超音波加工裝置10具備基座12；載物台14，其以該基座12作為基點配置；及支柱16；且設有超音波單元18，其由支柱16支持。基座12係 用以配置載物台14與支柱16之基礎。載物台14具備作為用以配置被加工構件之壓盤之作用，且構成為根據需要具備平面方向之移動軸(例如X軸與Y軸)即可。 The ultrasonic processing apparatus 10 of the embodiment includes a base 12; a stage 14 arranged with the base 12 as a base point; and a support 16; and an ultrasonic unit 18 supported by the support 16 is provided. Base 12 series It is used to configure the base of the stage 14 and the pillar 16. The stage 14 has a function as a pressure plate for arranging the workpiece to be processed, and may be configured to have a movement axis (for example, an X axis and a Y axis) in a plane direction as necessary.

支柱16係以基座12為基點而立設之支持構造物，且延伸設置於至少較載物台14高之位置。於實施形態之支柱16中，具備導軌16a；及固持器20，其可沿著該導軌16a滑動。導軌16a係沿著支柱16之長邊方向配置。固持器20係保持詳情後述之超音波單元18之要件，且藉由沿著導軌16a滑動，可調整超音波單元18之配置高度，並吸收由超音波產生之微振動之反作用力(微振動)。又，於實施形態之支柱16中具備滑輪16b，且構成為藉由未圖示之平衡器而可大致抵消超音波單元18之重量。 The pillar 16 is a support structure erected with the base 12 as a base point, and is extended to be at least higher than the stage 14. The pillar 16 of the embodiment is provided with a guide rail 16a; and a holder 20, which can slide along the guide rail 16a. The guide rail 16a is arranged along the longitudinal direction of the pillar 16. The holder 20 retains the essential elements of the ultrasonic unit 18 described in detail later, and by sliding along the guide rail 16a, the configuration height of the ultrasonic unit 18 can be adjusted, and the reaction force of the micro vibration (micro vibration) generated by the ultrasonic wave can be absorbed. . In addition, the pillar 16 of the embodiment is provided with a pulley 16b, and is configured to be able to substantially offset the weight of the ultrasonic unit 18 by a balancer not shown.

超音波單元18係具備未圖示詳情之超音波產生裝置之單元。超音波單元18構成為於由上述之固持器20支持，並經由滑輪16b而由平衡器懸掛，且載物台14位於其下端部之對向位置。又，於超音波單元18之下端部，安裝有稱為焊頭18a之加工工具，構成為將超音波產生裝置之超音波振動傳遞至焊頭18a。 The ultrasonic unit 18 is a unit provided with an ultrasonic generating device not shown in detail. The ultrasonic unit 18 is configured to be supported by the above-mentioned holder 20 and suspended by a balancer via a pulley 16b, and the stage 14 is located at the opposite position of its lower end. In addition, a processing tool called a welding head 18a is installed at the lower end of the ultrasonic unit 18, and is configured to transmit the ultrasonic vibration of the ultrasonic generating device to the welding head 18a.

[抖動防止構造：第1形態] [Jitter prevention structure: First form]

於具有此種基本構成之實施形態之超音波加工裝置10中，如圖2中顯示圖1之A-A、B-B剖面(僅超音波單元部分)，藉由固持器20之保持部20a所具備之 導輥(第1導輥)22(22a~22c)而支持超音波單元18。因由導輥22支持超音波單元18，而於超音波單元18向軸線方向微振動時，可追隨於此進行支持。 In the ultrasonic processing apparatus 10 of the embodiment having such a basic structure, the A-A and B-B cross-sections (only the ultrasonic unit part) of FIG. 1 are shown in FIG. 2, and the holding portion 20a of the holder 20 is provided with The guide roller (first guide roller) 22 (22a-22c) supports the ultrasonic unit 18. Since the ultrasonic unit 18 is supported by the guide roller 22, when the ultrasonic unit 18 vibrates slightly in the axial direction, it can follow this for support.

又，實施形態之情形構成為，於形成為圓柱狀之超音波單元18之外周，配置複數根(圖2所示之例為3個)導輥22a~22c，且由該等複數根導輥22a~22c進行支持。數個導輥22a~22c係以超音波單元18之軸心O為基點，以成等間距之方式配置於其周圍。導輥22基本上以保持部20a為基點而牢固地固定，但複數根導輥22中之至少1根導輥(於圖2所示之例之情形時，為導輥22c)係以產生對於超音波單元18之彈推力之方式而彈性地被固定。 In addition, in the case of the embodiment, a plurality of guide rollers 22a-22c (three in the example shown in FIG. 2) are arranged on the outer circumference of the cylindrical ultrasonic unit 18, and the plurality of guide rollers Support from 22a~22c. Several guide rollers 22a-22c are based on the axis O of the ultrasonic unit 18 and are arranged at equal intervals around it. The guide roller 22 is basically firmly fixed with the holding portion 20a as the base point, but at least one of the plurality of guide rollers 22 (in the case of the example shown in FIG. 2 is the guide roller 22c) is to produce The elastic thrust of the ultrasonic unit 18 is elastically fixed.

具體而言，將保持導輥22c之輥固持器24配置為可相對於保持部20a滑動。此處，輥固持器24之滑動方向係如圖3之方塊圖所示，構成為相對於通過導輥22c對於超音波單元18之接觸點之切線正交之方向(以箭頭E表示之方向)。且，構成為於保持部20a與輥固持器24間介置彈簧等之彈推機構26而將導輥22c向超音波單元18側按壓即可。 Specifically, the roller holder 24 holding the guide roller 22c is arranged to be slidable with respect to the holding portion 20a. Here, the sliding direction of the roller holder 24 is shown in the block diagram of FIG. 3, and is configured to be a direction perpendicular to the tangent line passing through the contact point of the guide roller 22c to the ultrasonic unit 18 (the direction indicated by arrow E) . In addition, the structure may be configured such that an elastic pushing mechanism 26 such as a spring is interposed between the holding portion 20a and the roller holder 24 to press the guide roller 22c toward the ultrasonic unit 18 side.

藉由此種構成，超音波單元18由於維持按壓於被牢固地固定之導輥22a、22b之狀態，故可抑制因微振動產生之抖動。又，由於導輥22c對超音波單元18彈性地按壓，故於導輥22a~22c與超音波單元18間即使咬入細微塵埃(例如磨粒)，亦可克服此而進行引導。 With this structure, the ultrasonic unit 18 maintains the state of being pressed against the firmly fixed guide rollers 22a and 22b, and therefore, it is possible to suppress shaking due to micro vibration. Moreover, since the guide roller 22c elastically presses the ultrasonic unit 18, even if fine dust (for example, abrasive grains) bites between the guide roller 22a-22c and the ultrasonic unit 18, it can overcome this and guide.

[扭曲防止構造] [Twisting prevention structure]

又，實施形態之超音波加工裝置10具備用以防止由微振動引起之超音波單元18繞軸心O之旋轉(扭曲)之止轉構件28。止轉構件28如圖4中顯示圖1之C-C剖面(僅超音波單元部分)，具備輥基座30與導件32。輥基座30係固定於超音波單元18之基座，且具備導輥(第2導輥)34(34a，34b)。導輥34係以滾動方向成為沿著超音波單元18之軸線方向之方式配置。又，導輥34係以可將詳情後述之導件32夾入之方式，使輥面對向而成對設置。 In addition, the ultrasonic processing apparatus 10 of the embodiment is provided with a rotation stop member 28 for preventing the ultrasonic unit 18 from rotating (twisting) around the axis O caused by micro vibration. The anti-rotation member 28 shows the C-C section of FIG. 1 as shown in FIG. 4 (only the ultrasonic unit part), and includes a roller base 30 and a guide 32. The roller base 30 is fixed to the base of the ultrasonic unit 18, and includes guide rollers (second guide rollers) 34 (34a, 34b). The guide roller 34 is arranged so that the rolling direction is along the axial direction of the ultrasonic unit 18. In addition, the guide rollers 34 are arranged in pairs with the roller faces facing each other so that the guide 32 described in detail can be sandwiched.

成對之導輥34係構成為一導輥34a固定於輥基座30，另一導輥34b沿著輥基座30之安裝面而可向以箭頭F表示之方向滑動。於一導輥34a與另一導輥34b間，配置由彈簧等構成之彈推機構36，且以對於一導輥34a拉近另一導輥34b之方式構成。 The pair of guide rollers 34 are configured such that one guide roller 34a is fixed to the roller base 30, and the other guide roller 34b is slidable in the direction indicated by arrow F along the mounting surface of the roller base 30. Between one guide roller 34a and the other guide roller 34b, an elastic pushing mechanism 36 composed of a spring or the like is arranged, and is configured to draw one guide roller 34a closer to the other guide roller 34b.

導件32係使導輥34滾動之要件，且具有：引導基座32a，其固定於上述固持器20或支柱16；及導軌32b，其連接於引導基座32a，且沿著超音波單元18之軸線方向配置。無論引導基座32a及導軌32b之具體構成為何，對於導軌32b，至少於兩側面具備導輥34之滾動面。 The guide 32 is an essential element for rolling the guide roller 34, and has: a guide base 32a, which is fixed to the holder 20 or the support 16; and a guide rail 32b, which is connected to the guide base 32a and runs along the ultrasonic unit 18. The axis direction configuration. Regardless of the specific configurations of the guide base 32a and the guide rail 32b, the guide rail 32b has at least the rolling surfaces of the guide rollers 34 on both side surfaces.

藉由此種構成，藉由與超音波單元18一起微振動之導輥34a、34b，而夾持固定於固持器20等之導軌32b。藉此，使超音波單元18產生相對於繞軸心O旋轉之力之反作用力，可防止超音波單元18旋轉。又，成對之導輥34a、34b由於藉由彈推機構36對導軌32b彈推，故即使於滾動面附著磨粒等之塵埃，亦可克服此而動作。 With this structure, the guide rollers 34a and 34b which vibrate slightly together with the ultrasonic unit 18 clamp and fix the guide rail 32b of the holder 20 and the like. Thereby, the ultrasonic unit 18 is caused to generate a reaction force with respect to the force rotating around the axis O, and the ultrasonic unit 18 can be prevented from rotating. In addition, since the pair of guide rollers 34a and 34b are pushed against the guide rail 32b by the elastic pushing mechanism 36, even if dust such as abrasive grains adheres to the rolling surface, it can be operated against this.

[作用/效果] [Effect]

根據此種構成之超音波加工裝置10，可抑制由超音波之微振動引起之超音波單元18之抖動或旋轉。因此，可提高對於被加工構件之細微加工之加工精度。 According to the ultrasonic processing device 10 having such a structure, the vibration or rotation of the ultrasonic unit 18 caused by the micro vibration of the ultrasonic wave can be suppressed. Therefore, it is possible to improve the processing accuracy of the fine processing of the processed component.

[第2形態] [Second form]

於上述實施形態中，旨在針對支持超音波單元18之構造，說明將固持器20之保持部20a中具備之導輥22設為3根，於其中1根(導輥22c)具備對於超音波單元18之彈推機構26之構成。 In the above-mentioned embodiment, aiming at the structure supporting the ultrasonic unit 18, the guide roller 22 provided in the holding portion 20a of the holder 20 is set to three, and one of them (guide roller 22c) is The structure of the spring push mechanism 26 of the unit 18.

然而，支持超音波單元18之導輥22並不限定於3根。如例如圖6所示，亦可將導輥22設為4根(導輥22a~22d)。於成此種構成之情形時，亦可構成為以超音波單元18之軸心O為基點均等地配置4根導輥22，且相鄰之2根導輥22(圖6所示之例中，為導輥22c、22d)具備彈推機構26。 However, the guide rollers 22 supporting the ultrasonic unit 18 are not limited to three. As shown in, for example, FIG. 6, the guide roller 22 may be four (guide roller 22a-22d). In the case of such a configuration, it can also be configured that four guide rollers 22 are equally arranged based on the axis O of the ultrasonic unit 18, and two adjacent guide rollers 22 (in the example shown in FIG. 6 , The guide rollers 22c, 22d) are equipped with an elastic pushing mechanism 26.

藉由此種構成，於與相對於保持部20a而牢固地固定之導輥22(圖6所示之例中，為導輥22a、22b)對應之導輥22(圖6所示之例中，為導輥22c、22d)中具備彈推機構26。藉此，使超音波單元18之按壓穩定，可更有效地抑制微振動所致之抖動。即使將抖動防止構造設為此種構成之情形時，亦可獲得與上述實施形態同樣之效果。 With this configuration, the guide roller 22 (in the example shown in FIG. 6) corresponding to the guide roller 22 (in the example shown in FIG. 6, the guide rollers 22a, 22b) that is firmly fixed to the holding portion 20a , The guide rollers 22c, 22d) are equipped with an elastic pushing mechanism 26. Thereby, the pressing of the ultrasonic unit 18 is stabilized, and the jitter caused by the micro vibration can be suppressed more effectively. Even when the jitter prevention structure is such a structure, the same effect as the above-mentioned embodiment can be obtained.

10‧‧‧超音波加工裝置 10‧‧‧Ultrasonic processing device

12‧‧‧基座 12‧‧‧Base

14‧‧‧載物台 14‧‧‧Stage

16‧‧‧支柱 16‧‧‧Pillars

16a‧‧‧導軌 16a‧‧‧Guide

16b‧‧‧滑輪 16b‧‧‧Pulley

18‧‧‧超音波單元 18‧‧‧Ultrasonic unit

18a‧‧‧焊頭 18a‧‧‧welding head

20‧‧‧固持器 20‧‧‧ Holder

20a‧‧‧保持部 20a‧‧‧Retention Department

28‧‧‧止轉構件 28‧‧‧Stopping member

A-A‧‧‧剖面 Section A-A‧‧‧

B-B‧‧‧剖面 Section B-B‧‧‧

C-C‧‧‧剖面 Section C-C‧‧‧

D-D‧‧‧剖面 Section D-D‧‧‧

Claims (4)

一種超音波加工裝置，其特徵在於具有：基座；支柱，其以上述基座為基點而配置並立設於上述基座；超音波單元，其於沿著上述支柱之長邊方向產生微振動；及固持器，其以使得上述超音波單元可沿著上述支柱滑動的方式支持上述超音波單元，且於上述固持器具備複數根第1導輥，其等引導上述超音波單元沿著上述支柱之立設方向振動；且上述複數根第1導輥以上述超音波單元之軸心為基點而配置為放射狀；上述複數根第1導輥包括牢固地固定於上述固持器之複數根導輥、以及至少1根導輥；且於上述至少1根導輥附帶有彈推機構，用於產生朝向上述超音波單元之軸心方向之彈推力，並將上述超音波單元按壓於被牢固地固定之上述導輥。 An ultrasonic processing device, characterized in that it has: a base; a pillar, which is arranged with the base as a base point and is erected on the base; an ultrasonic unit, which generates micro vibrations along the long side of the pillar; And a holder, which supports the ultrasonic unit in such a way that the ultrasonic unit can slide along the pillar, and the holder is provided with a plurality of first guide rollers that guide the ultrasonic unit along the pillar The vertical direction vibrates; and the plurality of first guide rollers are arranged radially based on the axis of the ultrasonic unit; the plurality of first guide rollers include a plurality of guide rollers firmly fixed to the holder, And at least one guide roller; and at least one guide roller is attached with an elastic pushing mechanism for generating elastic thrust toward the axis of the ultrasonic unit, and pressing the ultrasonic unit against the firmly fixed The aforementioned guide roller. 如請求項1之超音波加工裝置，其中於將上述第1導輥之配置數設為偶數之情形時，各第1導輥係以上述超音波單元之軸心為基點而均等配置為放射狀，且使對向配置之第1導輥中之任一者附帶上述彈推機構。 Such as the ultrasonic processing device of claim 1, wherein when the arrangement number of the first guide rollers is set to an even number, the first guide rollers are equally arranged radially with the axis of the ultrasonic unit as the base point , And make any one of the first guide rollers arranged opposite to the above-mentioned spring push mechanism. 如請求項1或2之超音波加工裝置，其中於上述固持器中，具備用以抑制上述超音波單元微振動時產生之繞軸線旋轉之止轉機構。 The ultrasonic processing device of claim 1 or 2, wherein the holder is provided with a rotation stop mechanism for suppressing the rotation around the axis when the ultrasonic unit is micro-vibrated. 如請求項3之超音波加工裝置，其中上述止轉機構包含以下而構成：導件，其固定於上述固持器或上述支柱；及第2導輥，其固定於上述超音波單元，且對上述導件彈推。 According to the ultrasonic processing device of claim 3, wherein the anti-rotation mechanism includes the following: a guide, which is fixed to the holder or the pillar; and a second guide roller, which is fixed to the ultrasonic unit, and The guide spring pushes.
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