TWI712763B - Temperature sensing structure of induction cooker and assembling method thereof - Google Patents

Temperature sensing structure of induction cooker and assembling method thereof Download PDF

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TWI712763B
TWI712763B TW108136255A TW108136255A TWI712763B TW I712763 B TWI712763 B TW I712763B TW 108136255 A TW108136255 A TW 108136255A TW 108136255 A TW108136255 A TW 108136255A TW I712763 B TWI712763 B TW I712763B
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temperature probe
temperature
cover
probe
cavity
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TW108136255A
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TW202115350A (en
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湛雍南
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湛雍南
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Abstract

本發明涉及電磁爐測溫技術領域,本發明的技術方案為:一種電磁爐溫度感測結構,包括機蓋以及與所述機蓋相連接的機座,所述機蓋包括機蓋蓋體以及安裝於所述機蓋蓋體處的黑晶板,所述黑晶板的上方設置高導熱金屬片,所述黑晶板的下方貼附導熱墊;所述機座包括機座殼體以及固定於所述機座殼體內的線圈盤。本方案設計新穎巧妙,對溫度測量精確度高。The present invention relates to the technical field of electromagnetic oven temperature measurement. The technical solution of the present invention is: an electromagnetic oven temperature sensing structure, including a cover and a base connected to the cover, the cover including a cover body and a For the black crystal plate at the cover body of the machine cover, a high thermal conductivity metal sheet is arranged above the black crystal plate, and a thermally conductive pad is attached under the black crystal plate; the base includes a base shell and is fixed to the base The coil disc in the housing of the machine base. The design of this scheme is novel and clever, and the temperature measurement accuracy is high.

Description

電磁爐溫度感測結構及其組裝方法Temperature sensing structure of induction cooker and assembling method thereof

本發明是有關於一種電磁爐測溫技術領域,特別是指一種電磁爐溫度感測結構及其組裝方法。 The invention relates to the technical field of temperature measurement of an induction cooker, in particular to an induction cooker temperature sensing structure and an assembly method thereof.

目前,在某些商用加熱設備上,因販賣的商品必須符合食品衛生法規,且要儘量延長商品壽命,因此準確的控溫成為必要條件,而傳統電磁加熱設備的溫度感測器放在黑晶板底部,因晶板底部不平整與機內流動的氣流,使得準確性不足。 At present, in some commercial heating equipment, the products sold must comply with food hygiene regulations and the product life should be extended as much as possible. Therefore, accurate temperature control becomes a necessary condition. The temperature sensor of traditional electromagnetic heating equipment is placed on the black crystal. At the bottom of the board, the accuracy is insufficient due to the uneven bottom of the crystal board and the airflow flowing in the machine.

傳統電磁爐對於溫度的偵測是極為粗略的,以軟膠或軟質發泡材料頂著溫度感測器向上觸碰在黑晶板底部,不僅鍋具與黑晶板接觸狀況無法被控制,且不平整的黑晶板底部與溫度感測器的接觸也得不到良好的保障,更還有機殼內的風扇影響溫度感測器的感溫;因一般用途,並不需要精准的溫度控制,因此我們使用傳統電磁爐加熱食材時,火力永遠也調不到適當的位置。 The traditional induction cooker is very rough for temperature detection. It uses soft rubber or soft foaming material to touch the temperature sensor up to the bottom of the black crystal plate. Not only the contact status of the pot and the black crystal plate cannot be controlled, but also The contact between the bottom of the flat black crystal plate and the temperature sensor is not guaranteed, and the fan in the case affects the temperature of the temperature sensor; for general use, precise temperature control is not required. Therefore, when we use traditional induction cookers to heat food, the firepower will never be adjusted to the proper position.

針對這個問題,當然也有商用設備改善這現象,但還是有出現其他不良現象,例如溫度感測器放在角落,導致測溫不准,或是溫度感測器穿過黑晶板,雖然能得到準確的溫度訊息,但黑晶板中間穿孔導致強度不足,極易發生破損等問題。 To solve this problem, of course there are commercial equipment to improve this phenomenon, but there are still other undesirable phenomena. For example, the temperature sensor is placed in the corner, resulting in inaccurate temperature measurement, or the temperature sensor passes through the black crystal board, although it can be obtained Accurate temperature information, but the perforation in the middle of the black crystal plate leads to insufficient strength and is prone to breakage.

參見圖9所示,圖9為現有技術溫度探頭的設計一,該溫度探頭凸 出黑晶板,能準確得知溫度資訊,但溫度探頭能夠上下活動,表示溫度探頭與黑晶板之間有縫隙,水會滲進來,雖然結構中有導水的設計,但油垢會卡在間隙中,將活動的溫度探頭給堵死。 Refer to Figure 9, which is the first design of a temperature probe in the prior art. The black crystal board can accurately know the temperature information, but the temperature probe can move up and down, indicating that there is a gap between the temperature probe and the black crystal board, and water will leak in. Although the structure has a water-conducting design, the grease will get stuck in the gap , Block the active temperature probe.

參見圖10,圖10為現有技術溫度探頭的設計二,該溫度探頭與彈性體結合,彈性體再結合黑晶板,溫度探頭能上下活動,整個結構也不會漏水,但彈性體要保持彈性,厚度就不可能太大,而這是廚具,每日清潔是不可少的,彈性體在每日清理中破損的機會很大。 Refer to Figure 10, Figure 10 is the second design of the prior art temperature probe. The temperature probe is combined with an elastic body, and the elastic body is combined with a black crystal plate. The temperature probe can move up and down, and the entire structure will not leak water, but the elastic body must remain elastic , The thickness can not be too large, and this is kitchenware, daily cleaning is indispensable, the chance of damage to the elastomer in the daily cleaning is great.

相較於圖9、圖10,前述之溫度探頭是市面最常見的設計,算是最傳統的結構,溫度探頭直接放黑晶板底下,既沒有良好的接觸,又受機內風機幹擾。 Compared with Figures 9 and 10, the aforementioned temperature probe is the most common design on the market, and it is considered the most traditional structure. The temperature probe is directly placed under the black crystal plate, which has no good contact and is interfered by the fan inside the machine.

因此,我們有必要對這樣一種結構進行改善,以克服上述缺陷。 Therefore, it is necessary for us to improve such a structure to overcome the above-mentioned defects.

因此,本發明之其中一目的,即在提供一種能解決前述問題的電磁爐溫度感測結構。 Therefore, one of the objectives of the present invention is to provide a temperature sensing structure for an induction cooker that can solve the aforementioned problems.

本發明的上述技術目的是透過以下技術方案實現的:一種電磁爐溫度感測結構,包括機蓋以及與所述機蓋相連接的機座,所述機蓋包括機蓋蓋體以及安裝於所述機蓋蓋體處的黑晶板,所述黑晶板的上方設置高導熱金屬片,所述黑晶板的下方貼附導熱墊。 The above technical objectives of the present invention are achieved through the following technical solutions: an induction cooker temperature sensing structure, including a cover and a base connected to the cover, the cover including a cover body and a cover mounted on the cover A black crystal plate at the cover body of the machine cover, a high thermal conductivity metal sheet is arranged above the black crystal plate, and a thermal pad is attached under the black crystal plate.

所述機座包括機座殼體以及固定於所述機座殼體內的線圈盤,所述線圈盤的下方具有第一腔體,所述第一腔體內設有溫度探頭和壓縮彈簧二, 探頭蓋板固定於所述線圈盤的下表面並且將所述第一腔體蓋住,所述溫度探頭延伸至所述線圈盤的上方,所述線圈盤的中央上方固定橡膠保溫管,所述橡膠保溫管位於所述溫度探頭的外側,所述橡膠保溫管與所述溫度探頭之間形成第二腔體。 The base includes a base housing and a coil disk fixed in the base housing, a first cavity is provided below the coil disk, and a temperature probe and a compression spring are provided in the first cavity; The probe cover plate is fixed on the lower surface of the coil disk and covers the first cavity, the temperature probe extends above the coil disk, and a rubber insulation tube is fixed above the center of the coil disk. The rubber insulation tube is located outside the temperature probe, and a second cavity is formed between the rubber insulation tube and the temperature probe.

本發明的進一步設置為:所述溫度探頭為底部具有開口的中空圓柱體,溫度感測器設置於所述溫度探頭的內部頂端,所述溫度探頭的外部凸出有圓盤;所述圓盤位於所述第一腔體內,所述壓縮彈簧二分別與所述圓盤和探頭蓋板相接觸。 The present invention is further provided as follows: the temperature probe is a hollow cylinder with an opening at the bottom, the temperature sensor is arranged at the inner top of the temperature probe, and a disc protrudes from the outside of the temperature probe; the disc; Located in the first cavity, the second compression spring is in contact with the disc and the probe cover respectively.

本發明的進一步設置為:所述機座殼體內部還凸出有若干連接座,所述連接座的上端外部套設有壓縮彈簧一,所述線圈盤設置於所述連接座的上端,所述壓縮彈簧一分別與所述線圈盤和連接座相接觸。 The present invention is further provided as follows: a plurality of connecting seats protrude from the inside of the housing of the base, a compression spring 1 is sleeved on the upper end of the connecting seat, and the coil disk is arranged on the upper end of the connecting seat, so The first compression spring is in contact with the coil disk and the connecting seat respectively.

本發明的進一步設置為:所述線圈盤的下方具有一開口向下的圓錐檯面,所述圓錐檯面中心具有第一通孔,所述探頭蓋板鎖合固定於所述圓錐檯面下方從而將圓錐檯面封閉形成所述第一腔體,所述探頭蓋板的中心具有第二通孔,所述第二通孔與所述第一通孔相適應;所述壓縮彈簧二的下方抵靠探頭蓋板,所述壓縮彈簧二的上方支撐在所述溫度探頭的圓盤下方,將溫度探頭向上頂,使得溫度探頭的上部伸出線圈盤的第一通孔上方,所述第一通孔的外側設置橡膠保溫管。 A further arrangement of the present invention is that: the bottom of the coil disc is provided with a truncated conical surface with a downward opening, the center of the truncated conical surface has a first through hole, and the probe cover is locked and fixed under the truncated conical surface to secure the cone The mesa is closed to form the first cavity, the center of the probe cover has a second through hole, and the second through hole is compatible with the first through hole; the lower part of the second compression spring abuts the probe cover The upper part of the second compression spring is supported under the disc of the temperature probe, and the temperature probe is pushed up so that the upper part of the temperature probe extends above the first through hole of the coil disc, and the outer side of the first through hole Set up rubber insulation pipes.

本發明的進一步設置為:所述高導熱金屬片與所述導熱墊分別位於所述黑晶板上下兩面的同一位置。 A further arrangement of the present invention is that the high thermal conductivity metal sheet and the thermal pad are respectively located at the same position on the upper and lower sides of the black crystal board.

本發明的進一步設置為:所述高導熱金屬片、黑晶板、導熱墊、溫度探頭和溫度感測器位於同一直線上,所述機蓋與所述機座連接時,溫度探頭向上壓迫至導熱墊的下方。 A further arrangement of the present invention is that the high thermal conductivity metal sheet, the black crystal plate, the thermal pad, the temperature probe and the temperature sensor are located on the same straight line, and when the cover is connected to the base, the temperature probe is pressed upward to Below the thermal pad.

本發明的進一步設置為:所述機座還包括固定於所述機座殼體內部的電路板以及設置於所述電路板一側的散熱風扇,所述電路板與所述散熱風扇、溫度感測器和線圈盤電連接,所述電路板還通過電源線連接有插頭,所述插頭位於所述機座的外側。 A further arrangement of the present invention is that: the base further includes a circuit board fixed inside the base housing and a heat dissipation fan arranged on one side of the circuit board, the circuit board and the heat dissipation fan, temperature sensor The detector is electrically connected with the coil plate, and the circuit board is also connected with a plug through a power cord, and the plug is located outside the base.

一種電磁爐溫度感測結構的組裝方法,包括如下步驟:1)所述機蓋在由上往下與所述機座結合時,具可撓性的導熱墊壓迫在所述溫度探頭的頂部平面,使溫度探頭與所述導熱墊緊密結合,所述溫度探頭被壓迫從而下沉,壓縮彈簧二向下壓縮,使溫度探頭的下半圓柱懸浮在第一腔體內;2)所述溫度探頭的上半圓柱外部的橡膠保溫管因黑晶板的壓迫而變形,從而將黑晶板和線圈盤之間,溫度探頭上半圓柱外部的空間完全隔離,形成第二腔體;3)在機蓋和機座組合後,第一腔體和第二腔體通過線圈盤的第一通孔相連通,貫穿成一個不受外氣干擾的空間,溫度探頭在其間不會受到外氣影響。 A method for assembling a temperature sensing structure of an induction cooker includes the following steps: 1) When the cover is combined with the base from top to bottom, a flexible thermal pad is pressed against the top plane of the temperature probe, The temperature probe is tightly combined with the thermal pad, the temperature probe is forced to sink, and the second compression spring compresses downward, so that the lower half cylinder of the temperature probe is suspended in the first cavity; 2) the upper part of the temperature probe The rubber insulation tube outside the semi-cylinder is deformed due to the compression of the black crystal plate, thereby completely isolating the space between the black crystal plate and the coil disk, and the space outside the semi-cylinder on the temperature probe, forming a second cavity; 3) in the cover and After the base is assembled, the first cavity and the second cavity are connected through the first through hole of the coil disc, and penetrate into a space that is not interfered by external air, and the temperature probe will not be affected by external air.

根據上述方法完成電磁爐溫度感測結構的組裝後,在對鍋具進行溫度檢測時,其溫度傳遞方式為鍋具→高導熱金屬片→導熱膠→黑晶板→導熱 墊→溫度探頭→溫度感測器,從而對溫度信號進行採集,採集到的資訊由電路板回饋至顯示幕處進行顯示。 After completing the assembly of the temperature sensing structure of the induction cooker according to the above method, when detecting the temperature of the pot, the temperature transmission method is pot → high thermal conductivity metal sheet → thermal glue → black crystal plate → heat transfer Pad→temperature probe→temperature sensor to collect the temperature signal, and the collected information is fed back to the display screen by the circuit board for display.

綜上所述,本發明具有以下有益效果:1)一般鍋具的鍋底,在沒有加厚的情況下,要保持完全平整,是很困難的,而加厚的鍋底不僅重量增加,不利使用,且成本提高也不受商家歡迎,而不平整的鍋底,又無法保證鍋具與黑晶板接觸位置下方的溫度感測器相接觸,本發明通過在黑晶板中央上方黏合固定高導熱金屬片,且該高導熱金屬片高凸於黑晶板,使鍋具置放於電磁爐上,第一個接觸鍋底的部份就是高導熱金屬片,便於對鍋具底部溫度資訊進行採集;2)高導熱金屬片採用為質地較軟的材質,本實施例中的材質為紅銅,從而可以分散鍋具所帶來的重量;3)黑晶板本身就是高導熱材質,其中一面是平整的,當作面材使用,另一面並非平整的,多有壓花印痕,溫度感測器直接接觸,就算有導熱矽脂,也不易完整傳達溫度訊息;本方案採用導熱性高的可撓性導熱墊,貼附在黑晶板底面,當溫度探頭向上壓迫時,可撓性導熱墊會將黑晶板縫隙填滿,使得高導熱金屬片接收到鍋底的溫度,經由黑晶板、可撓性導熱墊、溫度探頭從而達到溫度感測器,最大限度的將溫度訊息傳遞給電路板;4)由於電路板必要的散熱要求,主機殼內的風扇會連續或間歇性運轉,也使用主機殼內充滿不定向氣流,溫度感測器所接收到的溫度訊息,可靠性大有問題;本發明在溫度探頭以壓縮彈簧二懸浮安裝在線圈盤與探頭蓋 板所型成的第一腔體中,並以管狀撓性保溫材料(即橡膠保溫管)包圍在線圈盤與黑晶板之間的溫度探頭外,使得溫度探頭完全不受機蓋與機座內流動氣流的影響,得以將鍋具傳來的溫度訊息,準確傳遞給電路板。 In summary, the present invention has the following beneficial effects: 1) It is very difficult for the bottom of general pots and pans to be completely flat without being thickened. The thickened bottom of the pot not only increases the weight and is unfavorable to use, Moreover, the increase in cost is not welcomed by merchants, and the uneven bottom of the pot cannot ensure that the pot is in contact with the temperature sensor below the contact position of the black crystal plate. , And the high thermal conductivity metal sheet is high on the black crystal plate, so that the pot is placed on the induction cooker. The first part that touches the bottom of the pot is the high thermal conductivity metal sheet, which is convenient for collecting temperature information on the bottom of the pot; 2) High The thermal conductive metal sheet is made of a softer material. The material in this embodiment is red copper, which can disperse the weight of the cookware; 3) The black crystal plate itself is a material with high thermal conductivity, one of which is flat. Used as a surface material, the other side is not flat. There are many embossed marks. The temperature sensor is in direct contact. Even with thermal grease, it is not easy to completely convey the temperature information; this solution uses a flexible thermal pad with high thermal conductivity. Attached to the bottom surface of the black crystal plate, when the temperature probe is pressed upward, the flexible thermal pad will fill the gaps of the black crystal plate, so that the high thermal conductivity metal sheet receives the temperature of the bottom of the pot, and passes through the black crystal plate and the flexible thermal pad , The temperature probe can reach the temperature sensor and transmit the temperature information to the circuit board to the greatest extent; 4) Due to the necessary heat dissipation requirements of the circuit board, the fan in the main chassis will run continuously or intermittently, and also use the main chassis The temperature information received by the temperature sensor is full of non-directional airflow, and the reliability is very problematic; in the present invention, the temperature probe is mounted on the coil disk and the probe cover with two compression springs. In the first cavity formed by the board, the temperature probe between the coil disk and the black crystal board is surrounded by a tubular flexible insulation material (ie rubber insulation tube), so that the temperature probe is completely free from the cover and the base. The influence of the airflow flowing inside can accurately transmit the temperature information from the pot to the circuit board.

10:機蓋 10: Machine cover

20:機座 20: Base

30:電源線 30: Power cord

101:機蓋蓋體 101: machine cover body

102:黑晶板 102: Black Crystal Board

103:高導熱金屬片 103: High thermal conductivity metal sheet

104:導熱墊 104: Thermal pad

201:機座殼體 201: base shell

202:電路板 202: circuit board

203:散熱風扇 203: cooling fan

204:線圈盤 204: Coil Disk

205:第一腔體 205: first cavity

206:溫度探頭 206: temperature probe

207:壓縮彈簧二 207: Compression spring 2

208:探頭蓋板 208: Probe cover

209:第二腔體 209: The second cavity

210:橡膠保溫管 210: Rubber insulation tube

211:連接座 211: connecting seat

212:壓縮彈簧一 212: Compression spring one

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是本發明的結構示意圖。 Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic diagram of the structure of the present invention.

圖2是機蓋的結構示意圖一,用於表現高導熱金屬片。 Figure 2 is a schematic diagram of the structure of the machine cover, used to show high thermal conductivity metal sheet.

圖3是機蓋的結構示意圖二,用於表現導熱墊。 Figure 3 is the second structural diagram of the machine cover, used to represent the thermal pad.

圖4是機座的結構示意圖一。 Figure 4 is a structural diagram of the machine base.

圖5是機座的結構示意圖二。 Figure 5 is the second structural diagram of the machine base.

圖6是機座的結構示意圖三。 Figure 6 is the third structural diagram of the machine base.

圖7是本發明的安裝示意圖。 Figure 7 is a schematic diagram of the installation of the present invention.

圖8是圖7之圈選A處的放大圖。 Fig. 8 is an enlarged view of the circled A in Fig. 7;

圖9是現有技術溫度探頭的設計結構一。 Figure 9 is the first design structure of a temperature probe in the prior art.

圖10是現有技術溫度探頭的設計結構二。 Fig. 10 is the second design structure of the prior art temperature probe.

為了使本發明實現的技術手段、創作特徵、達成目的與功效易於明白瞭解,下面結合圖示與具體實施例,進一步闡述本發明。 In order to make it easy to understand the technical means, creative features, goals and effects achieved by the present invention, the present invention will be further explained below in conjunction with the drawings and specific embodiments.

結合圖1至圖8所示,本發明提出的一種電磁爐溫度感測結構,包 括機蓋10以及與所述機蓋10相連接的機座20,其特徵在於,所述機蓋10包括機蓋蓋體101以及安裝於所述機蓋蓋體101處的黑晶板102,所述黑晶板102的中央上方通過導熱膠黏合固定高導熱金屬片103,所述黑晶板102的中央下方貼附導熱墊104。 With reference to Figures 1 to 8, the present invention proposes an induction cooker temperature sensing structure, including It includes a machine cover 10 and a machine base 20 connected to the machine cover 10, wherein the machine cover 10 includes a machine cover body 101 and a black crystal plate 102 installed at the machine cover body 101, The high thermal conductivity metal sheet 103 is fixed to the upper center of the black crystal plate 102 by thermally conductive adhesive, and the thermal conductive pad 104 is attached to the lower center of the black crystal plate 102.

所述機座20包括機座殼體201、固定於所述機座殼體201內部的電路板202、設置於所述電路板202一側的散熱風扇203以及固定於所述機座殼體201內且位於所述電路板202上方的線圈盤204,所述線圈盤204的中央下方具有第一腔體205,所述第一腔體205內設有溫度探頭206和壓縮彈簧二207,探頭蓋板208固定於所述線圈盤204的下表面並且將所述第一腔體205蓋住,所述溫度探頭206延伸至所述線圈盤204的上方,所述線圈盤204的中央上方固定橡膠保溫管210,所述橡膠保溫管210位於所述溫度探頭206的外側,所述橡膠保溫管210與所述溫度探頭206之間形成第二腔體209。 The base 20 includes a base housing 201, a circuit board 202 fixed inside the base housing 201, a heat dissipation fan 203 provided on one side of the circuit board 202, and a base housing 201 fixed to the base housing 201. Inside and above the circuit board 202, the coil disk 204 has a first cavity 205 below the center of the coil disk 204. The first cavity 205 is provided with a temperature probe 206 and a second compression spring 207, a probe cover The plate 208 is fixed on the lower surface of the coil disk 204 and covers the first cavity 205, the temperature probe 206 extends above the coil disk 204, and the upper center of the coil disk 204 is fixed with rubber insulation The rubber insulation tube 210 is located outside the temperature probe 206, and a second cavity 209 is formed between the rubber insulation tube 210 and the temperature probe 206.

通過採用上述技術方案:所述高導熱金屬片103採用紅銅材質,通過其與鍋底直接接觸進行熱傳遞,其質地較軟,可以起到很好地分散力的作用,所述高導熱金屬片103高凸於所述黑晶板102;在黑晶板102中央下放貼附的導熱墊104為導熱撓性體,該導熱墊104為導熱膠墊,其本身具備一定彈性而且導熱性好,絕緣性也好,導熱墊104與橡膠保溫管210緊密接觸從而形成一個密閉的第二腔體209,便於溫度感測器進行精確測量;溫度探頭206彈性設置於所述第一腔體205內部,壓縮彈簧二207的彈力可以壓迫溫度探頭206從而使得溫度探頭206與導熱墊104緊密接觸,同時,橡膠保溫管210與導熱墊104的接觸 會將黑晶板102的縫隙填滿,從而提高溫度檢測精確度。 By adopting the above technical solution: the high thermal conductivity metal sheet 103 is made of red copper, and the heat transfer is carried out through direct contact with the bottom of the pot, and its texture is soft and can play a role in dispersing force well. 103 is highly convex on the black crystal plate 102; the thermally conductive pad 104 attached under the center of the black crystal plate 102 is a thermally conductive flexible body, and the thermally conductive pad 104 is a thermally conductive rubber pad, which has certain elasticity and good thermal conductivity, and is insulated The thermal conductivity pad 104 is in close contact with the rubber insulation tube 210 to form a closed second cavity 209, which is convenient for the temperature sensor to perform accurate measurement; the temperature probe 206 is elastically arranged inside the first cavity 205 and compressed The elastic force of the second spring 207 can compress the temperature probe 206 so that the temperature probe 206 is in close contact with the thermal pad 104, and at the same time, the rubber insulation tube 210 is in contact with the thermal pad 104 The gap of the black crystal plate 102 will be filled, thereby improving the accuracy of temperature detection.

結合圖5至圖8所示,所述溫度探頭206為底部具有開口的中空圓柱體,溫度感測器(圖中未繪製)通過環氧樹脂密封設置於所述溫度探頭206的內部頂端,所述溫度探頭206的外部凸出有圓盤;所述圓盤位於所述第一腔體205內,所述壓縮彈簧二207分別與所述圓盤和探頭蓋板208相接觸。 As shown in FIGS. 5 to 8, the temperature probe 206 is a hollow cylinder with an opening at the bottom, and a temperature sensor (not shown in the figure) is sealed on the inner top of the temperature probe 206 by epoxy resin. A disc protrudes from the outside of the temperature probe 206; the disc is located in the first cavity 205, and the second compression spring 207 is in contact with the disc and the probe cover 208, respectively.

通過採用上述技術方案:所述溫度感測器位於所述溫度探頭206內部頂端,在機蓋10與機座20安裝完成後,溫度探頭206會與導熱墊104直接接觸,便於進行溫度檢測;在溫度探頭206的外部中間部位凸出圓盤,該圓盤於第一腔體205內限位上下移動,確保溫度探頭206以及溫度感測器可以與導熱墊104相接觸;壓縮彈簧二207分別與圓盤和探頭蓋板208相接觸,壓縮彈簧二207的上下兩邊均受到彈性力的作用。 By adopting the above technical solution: the temperature sensor is located at the top of the temperature probe 206, after the cover 10 and the base 20 are installed, the temperature probe 206 will directly contact the thermal pad 104 to facilitate temperature detection; The outer middle part of the temperature probe 206 protrudes from a disc, and the disc moves up and down within the limit in the first cavity 205 to ensure that the temperature probe 206 and the temperature sensor can contact the thermal pad 104; the second compression spring 207 respectively The disc is in contact with the probe cover 208, and the upper and lower sides of the second compression spring 207 are subjected to elastic force.

結合圖4和圖5所示,所述機座殼體201內部還凸出有若干連接座211,所述連接座211的上端外部套設有壓縮彈簧一212,所述線圈盤204通過螺栓緊固於所述連接座211的上端,所述壓縮彈簧一212分別與所述線圈盤204和連接座211相接觸。 As shown in FIG. 4 and FIG. 5, a number of connecting seats 211 protrude from the inside of the base housing 201. The upper end of the connecting seat 211 is sleeved with a compression spring 212, and the coil disk 204 is tightened by bolts. Fixed to the upper end of the connecting seat 211, the compression spring 212 is in contact with the coil disk 204 and the connecting seat 211 respectively.

通過採用上述技術方案:連接座211的設置便於對線圈盤204進行安裝,在本發明中,壓縮彈簧一212的設置使得線圈盤204不是固定安裝,其可以隨著內部環境以及壓縮彈簧一212的彈力進行限位上下移動,更加確保線圈盤204、橡膠保溫管210以及導熱墊104之間不會出現縫隙,從而提高溫度檢測精確度。 By adopting the above technical solution: the arrangement of the connecting seat 211 facilitates the installation of the coil disc 204. In the present invention, the arrangement of the compression spring 212 makes the coil disc 204 not fixedly installed, which can follow the internal environment and the compression spring 212 The elastic force moves up and down to limit the position, which further ensures that there will be no gaps between the coil disk 204, the rubber insulation tube 210, and the thermal pad 104, thereby improving the accuracy of temperature detection.

結合圖4-圖8所示,所述線圈盤204的中央下方具有一開口向下的圓錐檯面,所述圓錐檯面中心具有第一通孔,所述探頭蓋板208鎖合固定於所述圓錐檯面下方從而將圓錐檯面封閉形成所述第一腔體205,所述探頭蓋板208的中心具有第二通孔,所述第二通孔與所述第一通孔相適應;所述壓縮彈簧二207的下方抵靠探頭蓋板208,所述壓縮彈簧二207的上方支撐在所述溫度探頭206的圓盤下方,將溫度探頭206向上頂,使得溫度探頭206的上部伸出線圈盤204的第一通孔上方,所述第一通孔的外側設置橡膠保溫管210;值得注意的是,所述探頭蓋板208處的第二通孔與溫度探頭206的外壁相適應,所述溫度探頭206的底部還具有供導線引出的第三通孔,溫度感測器通過該導線與電路板202相連接,同時,在第三通孔與導線的接觸端面通過環氧樹脂密封設置,確保其密封性。 As shown in FIGS. 4-8, the center of the coil disk 204 has a truncated cone with a downward opening, the center of the truncated cone has a first through hole, and the probe cover 208 is locked and fixed to the cone. The first cavity 205 is formed under the table surface to close the conical table surface, the center of the probe cover plate 208 has a second through hole, and the second through hole is adapted to the first through hole; the compression spring The lower part of the second 207 abuts the probe cover 208, the upper part of the second compression spring 207 is supported under the disc of the temperature probe 206, and the temperature probe 206 is pushed up so that the upper part of the temperature probe 206 extends out of the coil disc 204 Above the first through hole, the outer side of the first through hole is provided with a rubber insulation tube 210; it is worth noting that the second through hole at the probe cover 208 is adapted to the outer wall of the temperature probe 206, and the temperature probe The bottom of the 206 also has a third through hole for the lead wire. The temperature sensor is connected to the circuit board 202 through the wire. At the same time, the contact end surface of the third through hole and the wire is sealed by epoxy resin to ensure its sealing. Sex.

通過採用上述技術方案:所述線圈盤204的中央具有第一通孔,所述第一通孔的上方設置有限位環,所述限位環為環狀結構,所述橡膠保溫管210固定於該限位環並且與限位環的內壁相抵接,所述第一通孔的下方具有圓錐檯面,該圓錐檯面內部中空,探頭蓋板208鎖合固定於圓錐檯面的下端從而形成第一腔體205,提高第一腔體205的密封性。 By adopting the above technical solution: the center of the coil disk 204 has a first through hole, a limit ring is arranged above the first through hole, the limit ring is of a ring structure, and the rubber insulation tube 210 is fixed to The limit ring abuts against the inner wall of the limit ring, the lower part of the first through hole has a truncated conical surface, and the inside of the conical conical surface is hollow. The probe cover 208 is locked and fixed to the lower end of the conical surface to form a first cavity The body 205 improves the sealing performance of the first cavity 205.

通過圖2-圖8所示,所述高導熱金屬片103與所述導熱墊104分別位於所述黑晶板102上下兩面的同一位置;所述高導熱金屬片103、黑晶板102、導熱墊104、溫度探頭206和溫度感測器位於同一直線上,所述機蓋10與所述機座20連接時,溫度探頭206向上壓迫至導熱墊104的下方。 2-8, the high thermal conductivity metal sheet 103 and the thermal pad 104 are respectively located at the same position on the upper and lower sides of the black crystal plate 102; the high thermal conductivity metal sheet 103, the black crystal plate 102, and the thermal conductivity The pad 104, the temperature probe 206 and the temperature sensor are located on the same straight line. When the cover 10 is connected to the base 20, the temperature probe 206 is pressed upward to below the thermal pad 104.

通過採用上述技術方案:上述所有零件均在一條直線上,其溫度傳遞方向為鍋具→高導熱金屬片103→導熱膠→黑晶板102→導熱墊104→溫度探頭206→溫度感測器,便於對溫度信號進行採集。 By adopting the above-mentioned technical solution: all the above-mentioned parts are in a straight line, and the temperature transmission direction is pot → high thermal conductivity metal sheet 103 → thermal conductive glue → black crystal plate 102 → thermal pad 104 → temperature probe 206 → temperature sensor, It is convenient to collect temperature signals.

所述電路板202與所述散熱風扇203、溫度感測器和線圈盤204電連接,所述電路板202還通過電源線30連接有插頭,所述插頭位於所述機座20的外側。 The circuit board 202 is electrically connected to the cooling fan 203, the temperature sensor and the coil plate 204, and the circuit board 202 is also connected to a plug through the power cord 30, and the plug is located outside the base 20.

一種電磁爐溫度感測結構的組裝方法,包括如下步驟:1)所述機蓋10在由上往下與所述機座20結合時,可撓性導熱墊104壓迫在所述溫度探頭206的頂部平面,使溫度探頭206與所述導熱墊104緊密結合,所述溫度探頭206被壓迫從而下沉,壓縮彈簧二207向下壓縮,使溫度探頭206的下半圓柱懸浮在第一腔體205內;2)所述溫度探頭206的上半圓柱外部的橡膠保溫管210因黑晶板102的壓迫而變形,從而將黑晶板102和線圈盤204之間,溫度探頭206上半圓柱外部的空間完全隔離,形成第二腔體209;3)在機蓋10和機座20組合後,第一腔體205和第二腔體209通過線圈盤204的第一通孔相連通,貫穿成一個不受外氣幹擾的空間,溫度探頭206在其間不會受到外氣影響;根據上述方法完成電磁爐溫度感測結構的組裝後,在對鍋具進行溫度檢測時,其溫度傳遞方式為鍋具→高導熱金屬片103→導熱膠→黑晶板102→導熱墊104→溫度探頭206→溫度感測器,從而對溫度信號進行採集,採 集到的資訊由電路板202回饋至顯示幕處進行顯示。 A method for assembling a temperature sensing structure of an induction cooker includes the following steps: 1) When the cover 10 is combined with the base 20 from top to bottom, a flexible thermal pad 104 is pressed on the top of the temperature probe 206 Plane, so that the temperature probe 206 is tightly combined with the thermal pad 104, the temperature probe 206 is pressed to sink, the second compression spring 207 is compressed downward, so that the lower semi-cylinder of the temperature probe 206 is suspended in the first cavity 205 2) The rubber insulation tube 210 outside the upper semi-cylinder of the temperature probe 206 is deformed due to the compression of the black crystal plate 102, thereby reducing the space outside the upper semi-cylinder of the temperature probe 206 between the black crystal plate 102 and the coil disk 204 Completely isolated to form a second cavity 209; 3) After the machine cover 10 and the machine base 20 are combined, the first cavity 205 and the second cavity 209 are connected through the first through hole of the coil disk 204, which penetrates into a In the space disturbed by the outside air, the temperature probe 206 will not be affected by the outside air; after the temperature sensing structure of the induction cooker is assembled according to the above method, when the temperature of the pot is detected, the temperature transmission method is pot→high Thermally conductive metal sheet 103 → thermally conductive glue → black crystal plate 102 → thermally conductive pad 104 → temperature probe 206 → temperature sensor, so as to collect the temperature signal. The collected information is fed back to the display screen by the circuit board 202 for display.

通過上述實施方式可知,在進行溫度檢測時,本發明通過導熱墊104、第二腔體209、第一通孔、第一腔體205和探頭蓋板208形成的一個密閉且不受外氣干擾的腔體,從而令溫度感測器可以不受幹擾的進行溫度檢測,提高溫度檢測精確度,並且可以即時反映至顯示幕處從而便於人們直觀的瞭解當前溫度,也便於人們控制電磁爐從而達到自動想要的溫度。 It can be seen from the above-mentioned embodiments that when performing temperature detection, the present invention uses the thermally conductive pad 104, the second cavity 209, the first through hole, the first cavity 205 and the probe cover 208 to form a closed and free from external air interference. In this way, the temperature sensor can detect the temperature without interference, improve the accuracy of temperature detection, and can instantly reflect to the display screen so that people can intuitively understand the current temperature, and it is also convenient for people to control the induction cooker to achieve automatic The desired temperature.

值得注意的是,本發明還包括一操作面板(圖中未繪製),該操作面板一側具有顯示幕,操作面板和顯示幕均與電路板202相連接;並且,本電磁爐溫度感測結構包括的電路板202、溫度感應器、黑晶板102、電源線30、操作面板和顯示幕均為現有技術,本領域技術人員可根據實際需求選用;同時,電磁爐本身還包括未圖示的整流橋堆、濾波電容、諧振電容、電感線圈、熱敏電阻、功率管、IC控制晶片等等也均為現有技術。 It is worth noting that the present invention also includes an operation panel (not drawn in the figure). The operation panel has a display screen on one side, and both the operation panel and the display screen are connected to the circuit board 202; and the temperature sensing structure of the induction cooker includes The circuit board 202, the temperature sensor, the black crystal board 102, the power cord 30, the operation panel and the display screen are all existing technologies, and those skilled in the art can choose according to actual needs; at the same time, the induction cooker itself also includes a rectifier bridge not shown Stacks, filter capacitors, resonant capacitors, inductors, thermistors, power tubes, IC control chips, etc. are all existing technologies.

更值得注意的是,本發明所提出的一種電磁爐溫度感測結構,其主要是提出了一種提高溫度測量精確度的結構設計方案,至於電磁爐本身所包含的元件並非本發明所需要限制的內容。 What is more noteworthy is that the temperature sensing structure of the induction cooker proposed in the present invention mainly proposes a structural design solution to improve the accuracy of temperature measurement. As for the components contained in the induction cooker itself, it is not the content that the present invention needs to limit.

以上顯示和描述了本發明的基本原理、主要特徵和本發明的優點。本行業的技術人員應該瞭解,本發明不受上述實施例的限制,上述實施例和說明書中描述的只是說明本發明的原理,在不脫離本發明精神和範圍的前提下本發明還會有各種變化和改進,這些變化和改進都落入要求保護的本發明範圍內。本發明要求保護範圍由申請專利範圍及其等同物界定。 The basic principles, main features and advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments. The above-mentioned embodiments and the description only illustrate the principles of the present invention. The present invention will have various options without departing from the spirit and scope of the present invention. Changes and improvements, these changes and improvements fall within the scope of the claimed invention. The scope of protection claimed by the present invention is defined by the scope of the patent application and its equivalents.

102:黑晶板 102: Black Crystal Board

103:高導熱金屬片 103: High thermal conductivity metal sheet

204:線圈盤 204: Coil Disk

205:第一腔體 205: first cavity

206:溫度探頭 206: temperature probe

207:壓縮彈簧二 207: Compression spring 2

208:探頭蓋板 208: Probe cover

209:第二腔體 209: The second cavity

210:橡膠保溫管 210: Rubber insulation tube

Claims (8)

一種電磁爐溫度感測結構,包含:機蓋,包括機蓋蓋體以及安裝於所述機蓋蓋體處的黑晶板,所述黑晶板的上方設置高導熱金屬片,所述黑晶板的下方貼附導熱墊;及機座,與所述機蓋相連接,所述機座包括機座殼體以及固定於所述機座殼體內的線圈盤,所述線圈盤的下方具有第一腔體,所述第一腔體內設有溫度探頭和壓縮彈簧二,探頭蓋板固定於所述線圈盤的下表面並且將所述第一腔體蓋住,所述溫度探頭延伸至所述線圈盤的上方,溫度感測器設置於所述溫度探頭的內部頂端,所述溫度探頭的外部凸出有圓盤,所述圓盤位於所述第一腔體內,所述壓縮彈簧二分別與所述圓盤和探頭蓋板相接觸而使溫度探頭與導熱墊底側緊密接觸,所述線圈盤的上方固定橡膠保溫管,所述橡膠保溫管位於所述溫度探頭的外側並與導熱墊的底側緊密接觸,所述橡膠保溫管與所述溫度探頭之間形成密閉的第二腔體。 A temperature sensing structure for an induction cooker, comprising: a cover, including a cover body and a black crystal plate installed at the cover body, a high thermal conductivity metal sheet is arranged above the black crystal plate, and the black crystal plate A thermally conductive pad is attached to the lower part of the base; and a base connected to the cover, the base includes a base housing and a coil disk fixed in the base housing, the coil disk has a first A cavity, a temperature probe and two compression springs are arranged in the first cavity, a probe cover plate is fixed on the lower surface of the coil disk and covers the first cavity, and the temperature probe extends to the coil Above the disk, a temperature sensor is provided on the inner top end of the temperature probe. A disk protrudes from the outside of the temperature probe. The disk is located in the first cavity. The disc is in contact with the probe cover so that the temperature probe is in close contact with the bottom side of the thermal pad. A rubber insulation tube is fixed above the coil disk. The rubber insulation tube is located outside the temperature probe and is connected to the bottom side of the thermal pad. In close contact, a closed second cavity is formed between the rubber insulation tube and the temperature probe. 如請求項1所述的電磁爐溫度感測結構,其中,所述溫度探頭為底部具有開口的中空圓柱體。 The temperature sensing structure of the induction cooker according to claim 1, wherein the temperature probe is a hollow cylinder with an opening at the bottom. 如請求項1所述的電磁爐溫度感測結構,其中,所述機座殼體內部還凸出有若干連接座,所述連接座的上端外部套設有壓縮彈簧一,所述線圈盤設置於所述連接座的上端,所述壓縮彈簧一分別與所述線圈盤和連接座相接觸。 The temperature sensing structure of the induction cooker according to claim 1, wherein a number of connecting seats protrude from the inside of the base housing, and the upper end of the connecting seat is sheathed with a compression spring one, and the coil disk is arranged at On the upper end of the connecting seat, the compression spring 1 is in contact with the coil disk and the connecting seat respectively. 如請求項1所述的電磁爐溫度感測結構,其中,所述線圈盤的下方具有一開口向下的圓錐檯面,所述圓錐檯面中心具有第一通孔,所述探頭蓋板鎖合固定於所述圓錐檯面下方從而將圓錐檯面封閉形成所 述第一腔體,所述探頭蓋板的中心具有第二通孔,所述第二通孔與所述第一通孔相適應;所述壓縮彈簧二的下方抵靠探頭蓋板,所述壓縮彈簧二的上方支撐在所述溫度探頭的圓盤下方,將溫度探頭向上頂,使得溫度探頭的上部伸出線圈盤的第一通孔上方,所述第一通孔的外側設置橡膠保溫管。 The temperature sensing structure of the induction cooker according to claim 1, wherein the bottom of the coil disk has a truncated cone with a downward opening, the center of the truncated cone has a first through hole, and the probe cover is locked and fixed to The bottom of the truncated conical surface is thus enclosed to form a In the first cavity, the center of the probe cover has a second through hole, and the second through hole is compatible with the first through hole; the lower part of the second compression spring abuts the probe cover, The upper part of the second compression spring is supported under the disc of the temperature probe, and the temperature probe is pushed up so that the upper part of the temperature probe protrudes above the first through hole of the coil disc, and a rubber insulation tube is arranged outside the first through hole . 如請求項1所述的電磁爐溫度感測結構,其中,所述高導熱金屬片與所述導熱墊分別位於所述黑晶板上下兩面的同一位置。 The temperature sensing structure of the induction cooker according to claim 1, wherein the high thermal conductivity metal sheet and the thermal pad are respectively located at the same position on the upper and lower sides of the black crystal plate. 如請求項2所述的電磁爐溫度感測結構,其中,所述高導熱金屬片、黑晶板、導熱墊、溫度探頭和溫度感測器位於同一直線上,所述機蓋與所述機座連接時,溫度探頭向上壓迫至導熱墊的下方。 The temperature sensing structure of the induction cooker according to claim 2, wherein the high thermal conductivity metal sheet, the black crystal plate, the thermal pad, the temperature probe, and the temperature sensor are located on the same straight line, and the cover and the base When connecting, the temperature probe is pressed upward to below the thermal pad. 如請求項1所述的電磁爐溫度感測結構,其中,所述機座還包括固定於所述機座殼體內部的電路板以及設置於所述電路板一側的散熱風扇,所述電路板與所述散熱風扇、溫度感測器和線圈盤電連接,所述電路板還通過電源線連接有插頭,所述插頭位於所述機座的外側。 The temperature sensing structure of the induction cooker according to claim 1, wherein the base further includes a circuit board fixed inside the base housing and a heat dissipation fan provided on one side of the circuit board, and the circuit board It is electrically connected with the cooling fan, the temperature sensor and the coil plate, and the circuit board is also connected with a plug through a power cord, and the plug is located outside the base. 一種組裝方法,適用於請求項1-7中任一項所述的電磁爐溫度感測結構,包括如下步驟:1)所述機蓋在由上往下與所述機座結合時,具可撓性的導熱墊壓迫在所述溫度探頭的頂部平面,使溫度探頭與所述導熱墊緊密結合,所述溫度探頭被壓迫從而下沉,壓縮彈簧二向下壓縮,使溫度探頭的下半圓柱懸浮在第一腔體內;2)所述溫度探頭的上半圓柱外部的橡膠保溫管因黑晶板的壓迫而變形,從而將黑晶板和線圈盤之間,溫度探頭上半圓柱外部的空間完全隔離,形成第二腔體;3)在機蓋和機座組合後,第一腔體和第二腔體通過線圈盤的第 一通孔相連通,貫穿成一個不受外氣干擾的空間,溫度探頭在其間不會受到外氣影響。 An assembly method, suitable for the temperature sensing structure of the induction cooker described in any one of claims 1-7, comprising the following steps: 1) The cover is flexible when combined with the base from top to bottom The thermal conductive pad is pressed on the top plane of the temperature probe, so that the temperature probe is tightly combined with the thermal pad, the temperature probe is pressed and sinks, and the second compression spring compresses downwards to suspend the lower half cylinder of the temperature probe In the first cavity; 2) The rubber insulation tube outside the upper semi-cylinder of the temperature probe is deformed due to the compression of the black crystal plate, so that the space between the black crystal plate and the coil disk, and the outer space of the upper half cylinder of the temperature probe is completely Isolated to form a second cavity; 3) After the cover and the base are combined, the first cavity and the second cavity pass through the first cavity of the coil disc A through hole is connected to form a space that is not interfered by external air, and the temperature probe will not be affected by external air.
TW108136255A 2019-10-07 2019-10-07 Temperature sensing structure of induction cooker and assembling method thereof TWI712763B (en)

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Citations (4)

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Publication number Priority date Publication date Assignee Title
CN201359305Y (en) * 2009-03-02 2009-12-09 余俊忠 Electromagnetic oven
EP2775788A1 (en) * 2013-03-04 2014-09-10 Miele & Cie. KG Cooking device
CN204494530U (en) * 2015-01-21 2015-07-22 九阳股份有限公司 A kind of electromagnetic oven
CN208332357U (en) * 2018-06-14 2019-01-04 广东顺德锐椒电器有限公司 A kind of temperature control device of electromagnetic oven and electromagnetic oven including it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201359305Y (en) * 2009-03-02 2009-12-09 余俊忠 Electromagnetic oven
EP2775788A1 (en) * 2013-03-04 2014-09-10 Miele & Cie. KG Cooking device
CN204494530U (en) * 2015-01-21 2015-07-22 九阳股份有限公司 A kind of electromagnetic oven
CN208332357U (en) * 2018-06-14 2019-01-04 广东顺德锐椒电器有限公司 A kind of temperature control device of electromagnetic oven and electromagnetic oven including it

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