CN116847494A - Temperature detection structure capable of measuring temperature rapidly - Google Patents
Temperature detection structure capable of measuring temperature rapidly Download PDFInfo
- Publication number
- CN116847494A CN116847494A CN202211177024.5A CN202211177024A CN116847494A CN 116847494 A CN116847494 A CN 116847494A CN 202211177024 A CN202211177024 A CN 202211177024A CN 116847494 A CN116847494 A CN 116847494A
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- hole
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- 238000001514 detection method Methods 0.000 title claims abstract description 22
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 11
- 238000009434 installation Methods 0.000 claims description 46
- 239000003292 glue Substances 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 19
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 9
- 239000004519 grease Substances 0.000 claims description 3
- 239000013464 silicone adhesive Substances 0.000 claims description 3
- 230000006698 induction Effects 0.000 abstract description 14
- 230000008859 change Effects 0.000 abstract description 6
- 238000010411 cooking Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000005389 magnetism Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/06—Control, e.g. of temperature, of power
- H05B6/062—Control, e.g. of temperature, of power for cooking plates or the like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/12—Cooking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Cookers (AREA)
Abstract
The application relates to the technical field of electromagnetic cooking appliances and discloses a temperature detection structure capable of rapidly measuring temperature, which comprises a panel, a temperature sensor and a bottom plate, wherein the bottom of the panel is provided with the bottom plate, the top of the panel is provided with a plurality of step holes with the shape of big top and small bottom, the inside of each step hole is provided with a mounting cap, and the top surface of each mounting cap is not lower than the top surface of the panel. This temperature detection structure of quick temperature measurement possesses advantages such as sensitive to temperature sensing, has solved current common electromagnetism stove and can install temperature sensing device in the panel below, when using, can heat the pot body through the magnetism induction coil, the heat of the pot body is passed through the panel by the panel again and is passed inside the sensor to lead to in the use, not only need wait for the heat that the pot body gives off to pass through the panel and transmit to temperature sensing device, thereby make temperature sensing have corresponding delay, there is delay error, make it inaccurate problem to the real-time change control of the pot body.
Description
Technical Field
The application relates to the technical field of electromagnetic cooking appliances, in particular to a temperature detection structure capable of rapidly detecting temperature.
Background
The induction cooker is an electric cooking appliance manufactured by utilizing an electromagnetic induction heating principle. When the cooker is used, alternating current is introduced into the heating coil, an alternating magnetic field is generated around the coil, most of magnetic force lines of the alternating magnetic field pass through the metal cooker body, and a large amount of eddy current is generated in the cooker bottom, so that heat required by cooking is generated.
At present, a common induction cooker is arranged below a panel, a cooker body is heated through a magnetic induction coil when the induction cooker is used, heat of the cooker body is transmitted to the inside of a sensor through the panel, and therefore, in the use process, the heat emitted by the cooker body needs to be transmitted to the temperature induction device through the panel, so that temperature induction is delayed correspondingly, delay errors exist, and the temperature induction is inaccurate in monitoring of real-time change of the cooker body, and therefore, the temperature detection structure capable of measuring temperature rapidly is provided to solve the problems.
Disclosure of Invention
The application aims to provide a temperature detection structure capable of rapidly measuring temperature so as to solve the problems.
To achieve the purpose, the application adopts the following technical scheme:
the utility model provides a temperature detection structure of quick temperature measurement, includes panel and temperature sensor, the step hole of big-end-up is seted up for a plurality of shape at the top of panel, the inside in step hole is equipped with the installation cap, the top surface of installation cap is not less than the top surface of panel, the mounting hole has been seted up to the inside of installation cap, the top of mounting hole is the arc setting, the top intercommunication of mounting hole top and installation cap, the inside of mounting hole is equipped with temperature sensor, the intussuseption of mounting hole is filled with heat-conducting medium, the top of installation cap is equipped with the metal covering.
Preferably, the top surface of the installation cap is higher than the top surface of the panel, the outer side of the installation cap higher than the top of the panel is in a chamfer angle or arc shape, and the bevel angle bottom surface or the arc bottom surface of the installation cap is connected with the top of the step hole.
Preferably, the metal cover comprises a plane and an annular surface, the plane is bonded with the top surface of the installation cap in a fitting way, the annular surface is arranged on the outer side of the plane, a gap is reserved between the bottom surface of the annular surface and the first step surface of the step hole, and a glue overflow area is arranged between the annular surface and the outer side of the top of the installation cap.
Preferably, a bottom plate is arranged at the bottom of the panel, and a sealing gasket is arranged between the bottom side of the mounting cap and the bottom plate.
Preferably, the shape of the outer side of the mounting cap is matched with the shape of the step hole, temperature-resistant glue is arranged on the inner wall of the step hole, the panel is bonded with the mounting cap through the temperature-resistant glue, and a gasket is arranged between the step surface of the step hole and the mounting cap.
Preferably, the heat conducting medium is one or more of heat conducting silicone grease or silicone adhesive.
Preferably, the temperature sensor is provided with a wire, the bottom plate is provided with a through hole for the wire to pass through, the wire is bonded with the through hole, and the outer side of the root of the wire is provided with a silicone tube.
Preferably, the bottom of bottom plate is equipped with the concentrator, the bottom of wire is connected with the first terminal wire that the other end is connected with the concentrator, the outside of concentrator is connected with the second terminal wire, the bottom fixed mounting of bottom plate has a plurality of and is the card line piece that the transverse array distributes in the concentrator outside that is located.
Preferably, the step hole is a double-layer step hole;
preferably, the outer side shape of the mounting cap is matched with the shape of the double-layer step hole, the step surface of the double-layer step hole is provided with temperature-resistant glue, the mounting cap is adhered to the panel through the temperature-resistant glue, and the lower step surface of the double-layer step hole is provided with a sealing gasket.
An electromagnetic cooking appliance using a panel integrated with a temperature detecting device as described above.
The beneficial effects of one of the embodiments of the application are as follows:
1. the magnetic induction coil heats the pot body and simultaneously conducts heat to the temperature sensor in a short distance, so that the pot has the advantage of more sensitivity to temperature induction;
2. when the cooker is placed on the panel, the cooker is contacted with the metal cover, so that the cooker is prevented from being contacted with the panel, and the cooker has the advantages of good wear resistance, wider selectable use range of materials of the panel and reduced production cost;
3. an air film is arranged between the pot body and the panel when the pot body is used, so that the temperature change transmitted to the panel is reduced to be buffered when the temperature suddenly changes;
4. the redundant colloid can flow at the top of the mounting cap, so that the redundant colloid can flow into the overflow area to prevent the colloid from overflowing;
5. the water on the panel is prevented from flowing below the bottom plate, and when the cooker is placed above the mounting cap, the generated impact force can be deformed through the sealing gasket, so that the impact force is buffered;
6. the tightness of the panel is better, and the heat transfer is enhanced, so that the temperature sensor is more sensitive to the temperature;
7. the first terminal wire and the second terminal wire are far away from the magnetic induction coil, the temperature sensor is connected with the main control circuit board through the second terminal wire, the first terminal wire and the second terminal wire are far away from the magnetic induction coil, and the temperature sensor is connected with the main control circuit board through the second terminal wire.
Drawings
The present application is further illustrated by the accompanying drawings, which are not to be construed as limiting the application in any way.
FIG. 1 is a schematic diagram of the structure of the present application;
FIG. 2 is a schematic view of a two-layer stepped hole of the structure of the present application;
FIG. 3 is a top view of the structure of the present application;
FIG. 4 is an enlarged view of the structure of the present application at A;
fig. 5 is a structural view of the mounting cap of the present application in a plate shape.
In the accompanying drawings: 1-panel, 2-temperature sensor, 21-wire, 3-bottom plate, 31-perforation, 4-step hole, 5-installation cap, 6-installation hole, 7-metal cover, 71-plane, 72-annular surface, 8-sealing gasket, 9-glue overflow area, 10-temperature resistant glue, 11-gasket, 12-heat conducting medium, 13-silicone tube, 14-concentrator, 15-first terminal wire, 16-second terminal wire, 17-card line block.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" means two or more, and the meaning of "a number" means one or more, unless specifically defined otherwise.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The technical scheme of the application is further described below by the specific embodiments with reference to the accompanying drawings.
The panel with the integrated temperature detecting device of the embodiment is shown in fig. 1-5, wherein a bottom plate 3 is arranged at the bottom of the panel 1, a plurality of step holes 4 with the shape of big top and small bottom are formed in the top of the panel 1, a mounting cap 5 is arranged in the step holes 4, the top surface of the mounting cap 5 is not lower than the top surface of the panel 1, mounting holes 6 are formed in the mounting cap 5, the top of the mounting holes 6 are arc-shaped, the top ends of the mounting holes 6 are communicated with the top surface of the mounting cap 5, the temperature sensor 2 is arranged in the mounting holes 6, a heat conducting medium 12 is filled in the mounting holes 6, and a metal cover 7 is arranged at the top of the mounting cap 5.
According to the application, the top of the panel 1 is provided with the plurality of step holes 4, the mounting caps 5 are arranged in the step holes 4, the plurality of mounting caps 5 can enable the cookware to be placed on the top of the panel 1, and the bottom surface of the cookware is contacted with the plurality of mounting caps 5 as much as possible, so that the cookware can be placed more stably.
In addition, the shape of the step hole 4 is adapted to that of the mounting cap 5, and the mounting cap 5 is mounted on the step hole 4 under the action of gravity, so that the mounting cap 5 can be preliminarily fixed.
Moreover, the mounting cap 5 is internally provided with the mounting hole 6 for accommodating the temperature sensor 2, so that the position of the temperature sensor 2 is closer to the cooker, the top surface of the mounting cap 5 is not lower than the top surface of the panel 1, the plane height of the temperature sensor 2 can be positioned near or even above the top surface of the panel 1, the distance between the temperature sensor 2 and the bottom of a pan can be directly shortened, the temperature of the bottom of the pan can be sensed by the temperature sensor 2 faster, and compared with the traditional mode of mounting the temperature sensor 2 below the panel 1 for measuring the temperature, the temperature sensor 2 is more sensitive to real-time temperature monitoring of the pan body.
In addition, design mounting hole 6 top is the arc setting and with the top surface intercommunication of installation cap 5, temperature sensor 2 can hug closely the top arc of mounting hole 6 and install, can make temperature sensor 2's top see through the top surface of installation cap 5 just and hug closely in metal cover 7 and carry out heat conduction detection, its conduction distance is shortest, detection efficiency is faster, set up metal cover 7 on installation cap 5, utilize metal cover 7 direct and pan contact, because metal cover 7's hardness is big and more wear-resisting, can make the pan can not produce the friction to installation cap 5 and panel 1. In addition, because the top of mounting hole 6 is arc structure, consequently except the penetrating part that is similar to punctiform at top, its all around is to have certain thickness, so can realize that even make temperature sensor's top can hug closely metal lid 7 in order to reach faster temperature detection speed, can utilize mounting cap 5 to protect temperature sensor again, avoid the metal lid to crush temperature sensor because of the deformation is direct.
In the electromagnetic heating process, the metal cover 7 can be heated, heat of the metal cover can be directly transmitted to the temperature sensor 2 through the top hole of the mounting cap 5, and the metal cover 7 with good temperature conduction and heat conductivity can also be directly transmitted to the inside, so that the sensitive temperature sensing effect of the temperature sensor 2 is realized.
Moreover, through the height that metal lid 7 is higher than the top surface of panel 1, can make the pot body exist the one deck air film when using with panel 1 to reduce when the temperature suddenly changes, the temperature change that conveys to panel 1 buffers, thereby make panel 1's temperature change comparatively steady, can prevent its damage to its inside owing to the deformation that temperature change produced.
Further, the top surface of the installation cap 5 is higher than the top surface of the panel 1, the outer side of the installation cap 5 higher than the top of the panel 1 is in a chamfer angle or arc shape, and the bottom surface of the chamfer angle or the arc-shaped bottom surface of the installation cap 5 is connected with the top of the step hole 4.
The position of the installation cap 5 is higher than the panel 1 by a certain distance, so that a certain gap exists between the pan bottom and the panel 1, a certain protection effect is achieved on the panel 1, the heat-resistant effect of the panel 1 can be correspondingly adjusted, the position of the temperature sensor 2 is closer to the pan bottom, the bevel bottom or the arc bottom of the installation cap 5 is connected with the top of the panel 1, the installation cap 5 can be prevented from being taken out of the panel 1 manually and easily, a certain protection effect is achieved on the installation cap 5, and the cleaning operation of users is also facilitated.
Further, the metal cover 7 comprises a plane 71 and an annular surface 72, the plane 71 is adhered to the top surface of the mounting cap 5, the annular surface 72 is arranged on the outer side of the plane 71, a gap is reserved between the bottom surface of the annular surface 72 and the first step surface of the step hole 4, and a glue overflow area 9 is arranged between the annular surface 72 and the outer side of the top of the mounting cap 5.
The installation cap 5 is fixed through the temperature-resistant glue, the installation mode is simple, the cost is lower, and in the installation process, in order to ensure that heat of a cooker can be stably conducted to the temperature sensor 2, gaps or larger thickness are avoided as much as possible in the vertical direction between the installation cap 5 and the installation cap 1, therefore, the top of the installation cap 5 is designed to be a plane 71 structure, the installation cap can be attached to the top of the installation cap 1 without gaps, the heat can be stably conducted to the temperature sensor 2 in the installation cap 1 in the process of heating and using the cooker, the annular surface 72 is designed, the glue overflowing area 9 can be reserved, redundant glue can flow into the glue overflowing area 9 between the annular surface 72 and the installation cap 1 in the process of attaching the plane 71 to the top of the installation cap 1, and the attaching flatness of the plane 71 and the top of the installation cap 1 is ensured.
Further, the bottom of the panel 1 is provided with a bottom plate 3, and a sealing gasket 8 is arranged between the bottom side of the mounting cap 5 and the bottom plate 3.
Through the tight face laminating of sealed pad 8 with bottom plate 3, can make when using, when the rivers are in panel 1 top, prevent that the water on the panel 1 from flowing into bottom plate 3 below through the gap between installation cap 5 and the panel 1, when the pan was placed in the installation cap top, produced impact force can take place deformation through sealed pad to with impact force buffering.
Further, the outer side shape of the mounting cap 5 is matched with the shape of the step hole 4, the inner wall of the step hole 4 is provided with temperature-resistant glue 10, the panel 1 is bonded with the mounting cap 5 through the temperature-resistant glue 10, and a gasket 11 is arranged between the step surface of the step hole 4 and the mounting cap 5.
The temperature-resistant glue 10 is arranged, and the prior art can be found by hundred-degree retrieval that the temperature-resistant glue 10 has high temperature resistance and can keep the strength actually required, and the temperature-resistant glue 10 is in a fluid state when not dried, so that gaps between the mounting cap 5 and the step hole 4 can be filled, the step hole 4 and the mounting cap 5 can be tightly fixed, the mounting cap 5 is prevented from shaking in the step hole 4 due to vibration generated by heating in use, and the tightness of the panel 1 can be better.
Further, the heat conducting medium 12 is one or more of heat conducting silicone grease or silicone adhesive.
The heat conducting medium 12 is filled in the mounting hole 6, and due to poor heat conductivity of air, only the temperature sensor 2 is placed in the mounting hole 6, so that the periphery of the temperature sensor 2 is filled with air, the temperature on the mounting cap 5 is high, the temperature sensed by the temperature sensor 2 is greatly different from the temperature in the pot, no air exists between the mounting hole 6 and the temperature sensor 2 by filling the heat conducting medium 12 into the mounting hole, the temperature on the mounting cap 5 is conducted on the temperature sensor 2 through the heat conducting medium 12, accurate detection is performed, and the heat conducting medium 12 can have viscosity characteristics, so that the effect of fixed adhesion to the temperature sensor 2 is realized.
Further, a wire 21 is arranged on the temperature sensor 2, a through hole 31 for the wire 21 to pass through is arranged on the bottom plate 3, the wire 21 is adhered to the through hole 31, and a silicone tube 13 is arranged at the outer side of the root of the wire 21;
the wire 21 can penetrate into the outside of the silicone tube 13, so that the silicone tube 13 can be wrapped on the outer surface of the wire 21, and under the condition that the silicone tube 13 is not wrapped, the two wires 21 can be contacted to cause short circuit, so that the silicone tube 13 is wrapped on the outer surface of the wire 21 to protect the wire 21, and the short circuit is avoided.
Further, a hub 14 is arranged at the bottom of the bottom plate 3, a first terminal wire 15 with the other end connected with the hub 14 is connected to the bottom of the wire 21, a second terminal wire 16 is connected to the outer side of the hub 14, and a plurality of wire clamping blocks 17 which are arranged at the bottom of the bottom plate 3 and distributed in a transverse array are fixedly arranged at the outer side of the hub 14;
the bottom plate 3 is a circuit board or a common plastic plate;
wherein the bottom plate 3 is a circuit board, and the lead wires 21 of the temperature sensor 2 and the circuit board are welded by a tin spraying process.
The first terminal wire 15 and the second terminal wire 16 are fixed in the clamping block 17, and the first terminal wire 15 and the second terminal wire 16 are far away from the magnetic induction coil due to a certain distance between the bottom plate 3 and the magnetic induction coil, and then the temperature sensor 2 is connected with the total control circuit board through the first terminal wire 15 and the second terminal wire 16.
Further, the step hole 4 is a double-layer step hole;
further, the outer side shape of the mounting cap 5 is matched with the shape of a double-layer step hole, the step surface of the double-layer step hole is provided with temperature-resistant glue, the mounting cap 5 is bonded with the panel 1 through the temperature-resistant glue, and the lower step surface of the double-layer step hole is provided with a sealing gasket;
the mounting cap 5 is T-shaped or plate-shaped.
The fixing and waterproof effects of the mounting cap 5 and the step hole 4 can be increased when the first step surface is provided with the adhesive, and the waterproof effect can be further enhanced by the second step surface provided with the sealing gasket.
In the description of the present specification, the descriptions of the terms "example," "an embodiment," "certain embodiments," "an exemplary embodiment," "an example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The technical principle of the present application is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the application and should not be taken in any way as limiting the scope of the application. Other embodiments of the application will occur to those skilled in the art from consideration of this specification without the exercise of inventive faculty, and such equivalent modifications and alternatives are intended to be included within the scope of the application as defined in the claims.
Claims (10)
1. The utility model provides a temperature detection structure of quick temperature measurement, includes panel and temperature sensor, its characterized in that: the top of panel has been seted up a plurality of shape and has been big-end-up's step hole, the inside in step hole is equipped with the installation cap, the top surface of installation cap is not less than the top surface of panel, the mounting hole has been seted up to the inside of installation cap, the top of mounting hole is the arc setting, the top intercommunication of mounting hole top and installation cap, the inside of mounting hole is equipped with temperature sensor, the intussuseption of mounting hole is filled with heat-conducting medium, the top of installation cap is equipped with the metal covering.
2. A rapid temperature measurement temperature detection structure according to claim 1, wherein: the top surface of the installation cap is higher than the top surface of the panel, the outer side of the installation cap higher than the top of the panel is in a chamfer angle or arc-shaped arrangement, and the bevel angle bottom surface or the arc-shaped bottom surface of the installation cap is connected with the top of the step hole.
3. A rapid temperature measurement temperature detection structure according to claim 1, wherein: the metal cover comprises a plane and an annular surface, the plane is bonded with the top surface of the installation cap in a bonding mode, the annular surface is arranged on the outer side of the plane, a gap is reserved between the bottom surface of the annular surface and the first step surface of the step hole, and a glue overflow area is arranged between the annular surface and the outer side of the top of the installation cap.
4. A rapid temperature measurement temperature detection structure according to claim 1, wherein: the bottom of the panel is provided with a bottom plate, and a sealing gasket is arranged between the bottom side of the mounting cap and the bottom plate.
5. A rapid temperature measurement temperature detection structure according to claim 1, wherein: the outer side shape of the mounting cap is matched with the shape of the step hole, temperature-resistant glue is arranged on the inner wall of the step hole, the panel is bonded with the mounting cap through the temperature-resistant glue, and a gasket is arranged between the step surface of the step hole and the mounting cap.
6. A rapid temperature measurement temperature detection structure according to claim 1, wherein: the heat conducting medium is one or more of heat conducting silicone grease or silicone adhesive.
7. The rapid temperature measurement temperature detection structure according to claim 4, wherein: the temperature sensor is provided with a wire, the bottom plate is provided with a through hole for the wire to pass through, the wire is bonded with the through hole, and the outside of the root of the wire is sleeved with a silicone tube.
8. The rapid temperature measurement temperature detection structure according to claim 7, wherein: the bottom of bottom plate is equipped with the concentrator, the bottom of wire is connected with the first terminal wire that the other end is connected with the concentrator, the outside of concentrator is connected with the second terminal wire, the bottom fixed mounting of bottom plate has a plurality of and is the card line piece that the transverse array distributes in the concentrator outside.
9. A rapid thermal temperature detection structure according to any one of claims 1-8, characterized in that: the step hole is a double-layer step hole.
10. The rapid temperature measurement temperature detection structure according to claim 9, wherein: the outer side shape of the mounting cap is matched with the shape of the double-layer step hole, the step surface of the double-layer step hole is provided with temperature-resistant glue, the mounting cap is bonded with the panel through the temperature-resistant glue, and the lower step surface of the double-layer step hole is provided with a sealing gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211177024.5A CN116847494A (en) | 2022-09-26 | 2022-09-26 | Temperature detection structure capable of measuring temperature rapidly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211177024.5A CN116847494A (en) | 2022-09-26 | 2022-09-26 | Temperature detection structure capable of measuring temperature rapidly |
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| CN116847494A true CN116847494A (en) | 2023-10-03 |
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| CN202211177024.5A Pending CN116847494A (en) | 2022-09-26 | 2022-09-26 | Temperature detection structure capable of measuring temperature rapidly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117129101A (en) * | 2022-09-26 | 2023-11-28 | 佛山大匠流体科技有限公司 | Temperature sensing structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203880779U (en) * | 2014-04-24 | 2014-10-15 | 苏州西顿家用自动化有限公司 | Temperature measuring structure of electromagnetic oven |
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| CN117129101A (en) * | 2022-09-26 | 2023-11-28 | 佛山大匠流体科技有限公司 | Temperature sensing structure |
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| CN117129101A (en) * | 2022-09-26 | 2023-11-28 | 佛山大匠流体科技有限公司 | Temperature sensing structure |
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