TWI711644B - 複合樹脂組合物及該複合樹脂組合物成形的電子構件 - Google Patents

複合樹脂組合物及該複合樹脂組合物成形的電子構件 Download PDF

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Publication number
TWI711644B
TWI711644B TW106133902A TW106133902A TWI711644B TW I711644 B TWI711644 B TW I711644B TW 106133902 A TW106133902 A TW 106133902A TW 106133902 A TW106133902 A TW 106133902A TW I711644 B TWI711644 B TW I711644B
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TW
Taiwan
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constituent unit
resin composition
composite resin
total
mol
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TW106133902A
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English (en)
Chinese (zh)
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TW201827483A (zh
Inventor
深津博樹
瀧智弘
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日商寶理塑料股份有限公司
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Publication of TW201827483A publication Critical patent/TW201827483A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/66—Polyesters containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/68—Polyesters containing atoms other than carbon, hydrogen and oxygen
    • C08G63/685—Polyesters containing atoms other than carbon, hydrogen and oxygen containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
TW106133902A 2016-10-07 2017-09-30 複合樹脂組合物及該複合樹脂組合物成形的電子構件 TWI711644B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016199061 2016-10-07
JP2016-199061 2016-10-07

Publications (2)

Publication Number Publication Date
TW201827483A TW201827483A (zh) 2018-08-01
TWI711644B true TWI711644B (zh) 2020-12-01

Family

ID=61831302

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106133902A TWI711644B (zh) 2016-10-07 2017-09-30 複合樹脂組合物及該複合樹脂組合物成形的電子構件

Country Status (5)

Country Link
JP (1) JP6345376B1 (ko)
KR (1) KR102058121B1 (ko)
CN (1) CN109790379B (ko)
TW (1) TWI711644B (ko)
WO (1) WO2018066416A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6898163B2 (ja) 2017-07-04 2021-07-07 住友化学株式会社 液晶ポリエステル樹脂組成物および成形体
US10829634B2 (en) 2017-12-05 2020-11-10 Ticona Llc Aromatic polymer composition for use in a camera module
JP7461959B2 (ja) 2019-03-20 2024-04-04 ティコナ・エルエルシー カメラモジュールのためのアクチュエータアセンブリ
US11086200B2 (en) 2019-03-20 2021-08-10 Ticona Llc Polymer composition for use in a camera module
KR20220095185A (ko) * 2019-10-31 2022-07-06 스미또모 가가꾸 가부시끼가이샤 액정 폴리에스테르 분말, 및 액정 폴리에스테르 용액 조성물의 제조 방법
WO2021229931A1 (ja) * 2020-05-13 2021-11-18 ポリプラスチックス株式会社 表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー
JP7281023B2 (ja) * 2021-02-05 2023-05-24 ポリプラスチックス株式会社 ファンインペラ用液晶性樹脂組成物及びそれを用いたファンインペラ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425455A (zh) * 2012-12-20 2014-07-01 Samsung Electro Mech 用於印刷電路板的樹脂組合物、絕緣膜、預浸材料及印刷電路板
TW201431949A (zh) * 2012-09-26 2014-08-16 Polyplastics Co 電子元件用複合樹脂組合物以及由該複合樹脂組合物形成之電子元件
TW201634572A (zh) * 2014-12-05 2016-10-01 Polyplastics Co 複合樹脂組合物以及平面狀連結器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0919363A4 (en) * 1997-06-13 2002-04-17 Nippon Petrochemicals Co Ltd COMPOSITE STRUCTURE AND SEALING MATERIAL FOR USE IN THE SAME
TWI472574B (zh) 2006-08-24 2015-02-11 Polyplastics Co 非對稱電子零件
JP5325442B2 (ja) * 2008-03-28 2013-10-23 Ｊｘ日鉱日石エネルギー株式会社 カメラモジュール用液晶ポリエステル樹脂組成物
MY166937A (en) * 2011-04-01 2018-07-25 Polyplastics Co Wholly Aromatic Polyester and Polyester Resin Composition
US8932483B2 (en) * 2011-11-15 2015-01-13 Ticona Llc Low naphthenic liquid crystalline polymer composition
JP2016124947A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 成形品の製造方法及び複合樹脂組成物
WO2017068869A1 (ja) * 2015-10-21 2017-04-27 ポリプラスチックス株式会社 全芳香族ポリエステルアミド及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201431949A (zh) * 2012-09-26 2014-08-16 Polyplastics Co 電子元件用複合樹脂組合物以及由該複合樹脂組合物形成之電子元件
TW201425455A (zh) * 2012-12-20 2014-07-01 Samsung Electro Mech 用於印刷電路板的樹脂組合物、絕緣膜、預浸材料及印刷電路板
TW201634572A (zh) * 2014-12-05 2016-10-01 Polyplastics Co 複合樹脂組合物以及平面狀連結器

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Publication number Publication date
JP6345376B1 (ja) 2018-06-20
CN109790379A (zh) 2019-05-21
CN109790379B (zh) 2020-04-07
KR102058121B1 (ko) 2019-12-20
WO2018066416A1 (ja) 2018-04-12
KR20190026037A (ko) 2019-03-12
JPWO2018066416A1 (ja) 2018-10-04
TW201827483A (zh) 2018-08-01

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