TWI711109B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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TWI711109B
TWI711109B TW108115982A TW108115982A TWI711109B TW I711109 B TWI711109 B TW I711109B TW 108115982 A TW108115982 A TW 108115982A TW 108115982 A TW108115982 A TW 108115982A TW I711109 B TWI711109 B TW I711109B
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metal
substrate
liquid
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TW202006855A (en
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春本将彦
浅井正也
金山幸司
田中裕二
中山知佐世
有澤洋
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日商斯庫林集團股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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Abstract

以覆蓋下層膜之方式於基板之被處理面形成外周部經曝光之感光性抗蝕膜，於感光性抗蝕膜上形成含金屬抗蝕膜。將含金屬抗蝕膜之外周部去除後，將感光性抗蝕膜之外周部去除。或者，以覆蓋下層膜之方式於基板之被處理面形成外周部經曝光之第1感光性抗蝕膜，於第1感光性抗蝕膜上形成外周部經曝光之第2感光性抗蝕膜，於第2感光性抗蝕膜上形成含金屬抗蝕膜。將含金屬抗蝕膜之外周部去除後，將第2感光性抗蝕膜之外周部去除。於含金屬抗蝕膜之顯影後，將第1感光性抗蝕膜之外周部去除。A photosensitive resist film with exposed peripheral portion is formed on the processed surface of the substrate to cover the underlying film, and a metal-containing resist film is formed on the photosensitive resist film. After removing the outer periphery of the metal-containing resist film, the outer periphery of the photosensitive resist film is removed. Alternatively, a first photosensitive resist film with exposed peripheral portion is formed on the processed surface of the substrate so as to cover the underlayer film, and a second photosensitive resist film with exposed peripheral portion is formed on the first photosensitive resist film , Forming a metal-containing resist film on the second photosensitive resist film. After removing the outer peripheral portion of the metal-containing resist film, the outer peripheral portion of the second photosensitive resist film is removed. After the development of the metal-containing resist film, the outer periphery of the first photosensitive resist film is removed.

Description

基板處理裝置及基板處理方法Substrate processing device and substrate processing method

本發明係關於一種對基板進行處理之基板處理裝置及基板處理方法。The present invention relates to a substrate processing device and a substrate processing method for processing substrates.

於半導體元件等之製造中之微影製程中，藉由對基板之上表面噴出塗佈液來形成塗佈膜。此處，若於基板周緣部存在塗佈膜，則於搬送基板之搬送機構固持基板周緣部時，塗佈膜之一部分會剝離而成為顆粒。因此，藉由對基板周緣部噴出有機溶劑來將基板周緣部之塗佈膜溶解。藉此，將基板周緣部之塗佈膜去除。In the lithography process in the manufacture of semiconductor devices, etc., a coating film is formed by spraying a coating liquid on the upper surface of the substrate. Here, if there is a coating film on the peripheral edge of the substrate, when the substrate peripheral is held by the transport mechanism that transports the substrate, a part of the coating film will peel off and become particles. Therefore, the coating film on the peripheral edge of the substrate is dissolved by spraying the organic solvent to the peripheral edge of the substrate. Thereby, the coating film on the periphery of the substrate is removed.

近年來一直在研究，為了形成更微細之圖案，而於基板上形成含有金屬之含金屬塗佈膜作為塗佈膜。於該構成中，確認到，即便於對基板周緣部噴出有機溶劑之情形時，含金屬塗佈膜之金屬成分亦無法被去除而是殘留於基板周緣部上。因此，殘留於基板周緣部之金屬成分會導致基板處理裝置及其他曝光裝置等污染。In recent years, it has been studied to form a metal-containing coating film containing a metal on a substrate as a coating film in order to form a finer pattern. In this configuration, it was confirmed that even when the organic solvent was sprayed on the peripheral edge of the substrate, the metal component of the metal-containing coating film could not be removed but remained on the peripheral edge of the substrate. Therefore, the metal components remaining on the periphery of the substrate may cause contamination of the substrate processing equipment and other exposure equipment.

於專利文獻1中，記載有將不同於含金屬塗佈膜但含有金屬之硬質遮罩膜去除之塗佈處理方法。於該方法中，於基板周緣部形成由負型光阻液構成之遮蔽膜。然後，於基板表面形成硬質遮罩膜。繼而，利用包含有機溶劑之硬質遮罩膜去除液將基板周緣部之硬質遮罩膜去除。其後，利用溶解負型光阻之遮蔽膜去除液將遮蔽膜去除。Patent Document 1 describes a coating treatment method for removing a hard mask film that is different from a metal-containing coating film but contains a metal. In this method, a shielding film made of negative photoresist liquid is formed on the periphery of the substrate. Then, a hard mask film is formed on the surface of the substrate. Then, the hard mask film on the periphery of the substrate is removed by a hard mask film removing solution containing an organic solvent. After that, the masking film is removed with a masking film removing solution that dissolves the negative photoresist.

[專利文獻1]日本專利特開2014-45171號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-45171

[發明所欲解決之問題][The problem to be solved by the invention]

可藉由使用專利文獻1中記載之塗佈處理方法來將基板周緣部之金屬成分更確實地去除。然而，於該塗佈處理方法中，含金屬塗佈膜形成為於基板周緣部附近***之形狀。因此，無法有效利用基板周緣部附近之含金屬塗佈膜之區域，而使良率下降。The metal component of the peripheral portion of the substrate can be removed more reliably by using the coating treatment method described in Patent Document 1. However, in this coating treatment method, the metal-containing coating film is formed in a shape that is raised near the peripheral edge of the substrate. Therefore, the area of the metal-containing coating film near the peripheral edge of the substrate cannot be effectively used, and the yield is reduced.

本發明之目的在於提供一種可防止產生金屬污染、並且於基板上形成具有均勻膜厚之含金屬塗佈膜的基板處理裝置及基板處理方法。 [解決問題之技術手段]The object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can prevent metal contamination and form a metal-containing coating film with a uniform film thickness on the substrate. [Technical means to solve the problem]

(1)本發明之一態樣之基板處理裝置具備：感光性塗佈液供給部，其藉由對具有形成有被處理膜之被處理面之基板供給感光性塗佈液，而以將被處理膜覆蓋之方式於基板之被處理面形成感光性塗佈膜；邊緣曝光部，其將重疊於基板之被處理面之周緣部上之感光性塗佈膜之外周部曝光；含金屬塗佈液供給部，其藉由將含有金屬之塗佈液作為含金屬塗佈液供給至感光性塗佈膜上，而於感光性塗佈膜上形成含金屬塗佈膜；第1去除液供給部，其對含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之含金屬塗佈膜之外周部去除；及第2去除液供給部，其於含金屬塗佈膜之外周部被去除後，對感光性塗佈膜供給第2去除液，以將感光性塗佈膜之經曝光之外周部去除。(1) A substrate processing apparatus according to one aspect of the present invention includes a photosensitive coating liquid supply unit that supplies a photosensitive coating liquid to a substrate having a surface to be processed on which a film to be processed is formed, thereby The processing film covering method forms a photosensitive coating film on the processed surface of the substrate; the edge exposure section exposes the outer periphery of the photosensitive coating film overlapping on the peripheral portion of the processed surface of the substrate; metal-containing coating A liquid supply section for forming a metal-containing coating film on the photosensitive coating film by supplying a metal-containing coating liquid as a metal-containing coating liquid onto the photosensitive coating film; a first removing liquid supply section , Which supplies the first removal solution to the metal-containing coating film to remove the outer peripheral portion of the metal-containing coating film that overlaps the peripheral portion of the processed surface of the substrate; and the second removal solution supply portion, which is applied to the metal-containing coating film After the outer peripheral portion of the cloth film is removed, the second removing liquid is supplied to the photosensitive coating film to remove the exposed outer peripheral portion of the photosensitive coating film.

於該基板處理裝置中，藉由利用感光性塗佈液供給部對基板供給感光性塗佈液，而於基板之被處理面形成感光性塗佈膜。利用邊緣曝光部將感光性塗佈膜之外周部曝光。藉由利用含金屬塗佈液供給部對感光性塗佈膜上供給含金屬塗佈液，而於感光性塗佈膜上形成含金屬塗佈膜。藉由利用第1去除液供給部對含金屬塗佈膜供給第1去除液，而將含金屬塗佈膜之外周部去除。於含金屬塗佈膜之外周部被去除後，利用第2去除液供給部對感光性塗佈膜供給第2去除液，藉此將感光性塗佈膜之經曝光之外周部去除。In this substrate processing apparatus, by supplying the photosensitive coating liquid to the substrate by the photosensitive coating liquid supply unit, a photosensitive coating film is formed on the processed surface of the substrate. The outer peripheral part of the photosensitive coating film is exposed by the edge exposure part. The metal-containing coating liquid is supplied onto the photosensitive coating film by the metal-containing coating liquid supply unit to form a metal-containing coating film on the photosensitive coating film. The outer periphery of the metal-containing coating film is removed by supplying the first removing liquid to the metal-containing coating film by the first removing liquid supply part. After the outer peripheral portion of the metal-containing coating film is removed, the second removing liquid is supplied to the photosensitive coating film by the second removing liquid supply unit, thereby removing the exposed outer peripheral portion of the photosensitive coating film.

根據該構成，感光性塗佈膜以將被處理膜覆蓋之方式形成於基板之被處理面之整個面而非僅形成於基板周緣部。因此，含金屬塗佈膜不會於基板周緣部附近***，而以均勻厚度形成於感光性塗佈膜上。又，於將含金屬塗佈膜之外周部去除時，即便於含金屬塗佈膜之金屬成分殘留於感光性塗佈膜之外周部之情形時，該金屬成分亦會連同感光性塗佈膜之外周部一起被去除。因此，即便於搬送機構保持基板周緣部之情形時，金屬成分亦不會附著於搬送機構。其結果，可防止產生金屬污染，並且於基板上形成具有均勻膜厚之含金屬塗佈膜。According to this configuration, the photosensitive coating film is formed on the entire surface of the substrate to be processed so as to cover the processed film, not only on the peripheral edge of the substrate. Therefore, the metal-containing coating film does not swell near the peripheral edge of the substrate, but is formed on the photosensitive coating film with a uniform thickness. In addition, when the outer peripheral portion of the metal-containing coating film is removed, even when the metal component of the metal-containing coating film remains on the outer peripheral portion of the photosensitive coating film, the metal component will be combined with the photosensitive coating film The outer periphery is removed together. Therefore, even when the transport mechanism holds the peripheral edge of the substrate, the metal component does not adhere to the transport mechanism. As a result, metal contamination can be prevented, and a metal-containing coating film having a uniform film thickness can be formed on the substrate.

(2)亦可為，第1去除液為使含金屬塗佈膜溶解且不使感光性塗佈膜溶解之液體，第2去除液為使感光性塗佈膜溶解且不使含金屬塗佈膜溶解之液體。於該情形時，可選擇性地且容易地將含金屬塗佈膜及感光性塗佈膜之外周部依序去除。(2) It may also be that the first removal liquid is a liquid that dissolves the metal-containing coating film and does not dissolve the photosensitive coating film, and the second removal liquid is a liquid that dissolves the photosensitive coating film and does not apply the metal-containing coating Liquid in which the membrane is dissolved. In this case, the outer peripheral portion of the metal-containing coating film and the photosensitive coating film can be removed sequentially and selectively.

(3)亦可為，第1去除液包含有機溶劑，第2去除液包含進行正型顯影之顯影液。於該情形時，可利用第1去除液於不使感光性塗佈膜溶解之情況下使含金屬塗佈膜溶解。可利用第2去除液於不使含金屬塗佈膜溶解之情況下使感光性塗佈膜溶解。(3) The first removal liquid may contain an organic solvent, and the second removal liquid may contain a developer for positive development. In this case, the first removing liquid can be used to dissolve the metal-containing coating film without dissolving the photosensitive coating film. The second removing liquid can be used to dissolve the photosensitive coating film without dissolving the metal-containing coating film.

(4)本發明之另一態樣之基板處理裝置係使用將基板曝光之曝光裝置者，且具備：第1感光性塗佈液供給部，其藉由對具有形成有被處理膜之被處理面之基板供給第1感光性塗佈液，而以將被處理膜覆蓋之方式於基板之被處理面形成第1感光性塗佈膜；第2感光性塗佈液供給部，其藉由對第1感光性塗佈膜上供給感光波長分佈不同於第1感光性塗佈液之第2感光性塗佈液，而於第1感光性塗佈膜上形成第2感光性塗佈膜；第1邊緣曝光部，其將重疊於基板之被處理面之周緣部上之第2感光性塗佈膜之外周部曝光；含金屬塗佈液供給部，其藉由將含有金屬之塗佈液作為含金屬塗佈液供給至第2感光性塗佈膜上，而於第2感光性塗佈膜上形成含金屬塗佈膜；第1去除液供給部，其對含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之含金屬塗佈膜之外周部去除；第2去除液供給部，其於含金屬塗佈膜之外周部被去除後，對第2感光性塗佈膜供給第2去除液，以將第2感光性塗佈膜之經曝光之外周部去除；第2邊緣曝光部，其將重疊於基板之被處理面之周緣部之第1感光性塗佈膜之外周部曝光；顯影液供給部，其對含金屬塗佈膜供給顯影液，以使利用曝光裝置曝光成特定圖案之含金屬塗佈膜顯影；及第3去除液供給部，其於含金屬塗佈膜顯影後，對第1感光性塗佈膜供給第3去除液，以將第1感光性塗佈膜之經曝光之外周部去除。(4) A substrate processing apparatus of another aspect of the present invention uses an exposure device that exposes a substrate, and is provided with: a first photosensitive coating liquid supply part, which is processed by having a film to be processed The first photosensitive coating liquid is supplied to the substrate on the surface, and the first photosensitive coating film is formed on the processed surface of the substrate so as to cover the processed film; the second photosensitive coating liquid supply part is used for The first photosensitive coating film is supplied with a second photosensitive coating liquid having a photosensitive wavelength distribution different from the first photosensitive coating liquid, and a second photosensitive coating film is formed on the first photosensitive coating film; 1 Edge exposure part, which exposes the outer periphery of the second photosensitive coating film superimposed on the peripheral part of the processed surface of the substrate; metal-containing coating liquid supply part, which uses a metal-containing coating liquid as The metal-containing coating liquid is supplied to the second photosensitive coating film, and the metal-containing coating film is formed on the second photosensitive coating film; the first removal liquid supply part supplies the first metal-containing coating film The removal liquid is used to remove the outer periphery of the metal-containing coating film overlapping on the periphery of the processed surface of the substrate; the second removal liquid supply part, after the outer periphery of the metal-containing coating film is removed, is applied to the second The photosensitive coating film is supplied with a second removing solution to remove the exposed outer peripheral portion of the second photosensitive coating film; the second edge exposure portion will overlap the first photosensitive portion of the peripheral portion of the processed surface of the substrate Exposure of the outer peripheral portion of the flexible coating film; a developer supply part that supplies a developer to the metal-containing coating film to develop the metal-containing coating film exposed to a specific pattern by the exposure device; and a third removal liquid supply part, After the metal-containing coating film is developed, a third removing solution is supplied to the first photosensitive coating film to remove the exposed outer peripheral portion of the first photosensitive coating film.

於該基板處理裝置中，藉由利用第1感光性塗佈液供給部對基板供給第1感光性塗佈液，而於基板之被處理面形成第1感光性塗佈膜。藉由利用第2感光性塗佈液供給部對第1感光性塗佈膜上供給第2感光性塗佈液，而於第1感光性塗佈膜上形成第2感光性塗佈膜。利用第1邊緣曝光部將第2感光性塗佈膜之外周部曝光。藉由利用含金屬塗佈液供給部對第2感光性塗佈膜上供給含金屬塗佈液，而於第2感光性塗佈膜上形成含金屬塗佈膜。In this substrate processing apparatus, by supplying the first photosensitive coating liquid to the substrate by the first photosensitive coating liquid supply unit, the first photosensitive coating film is formed on the processed surface of the substrate. By supplying the second photosensitive coating liquid onto the first photosensitive coating film by the second photosensitive coating liquid supply unit, the second photosensitive coating film is formed on the first photosensitive coating film. The outer periphery of the second photosensitive coating film is exposed by the first edge exposure section. The metal-containing coating liquid is supplied onto the second photosensitive coating film by the metal-containing coating liquid supply unit to form a metal-containing coating film on the second photosensitive coating film.

藉由利用第1去除液供給部對含金屬塗佈膜供給第1去除液，而將含金屬塗佈膜之外周部去除。於含金屬塗佈膜之外周部被去除後，利用第2去除液供給部對第2感光性塗佈膜供給第2去除液，藉此將第2感光性塗佈膜之經曝光之外周部去除。利用第2邊緣曝光部將第1感光性塗佈膜之外周部曝光。藉由利用顯影液供給部對含金屬塗佈膜供給顯影液，而使利用曝光裝置曝光成特定圖案之含金屬塗佈膜顯影。於含金屬塗佈膜顯影後，利用第3去除液供給部對第1感光性塗佈膜供給第3去除液，藉此將第1感光性塗佈膜之經曝光之外周部去除。The outer periphery of the metal-containing coating film is removed by supplying the first removing liquid to the metal-containing coating film by the first removing liquid supply part. After the outer peripheral part of the metal-containing coating film is removed, the second removing liquid is supplied to the second photosensitive coating film by the second removing liquid supply part, thereby exposing the exposed outer peripheral part of the second photosensitive coating film Remove. The outer periphery of the first photosensitive coating film is exposed by the second edge exposure section. By supplying a developer to the metal-containing coating film by the developer supply part, the metal-containing coating film exposed to a specific pattern by the exposure device is developed. After the metal-containing coating film is developed, the third removing liquid is supplied to the first photosensitive coating film by the third removing liquid supply unit, thereby removing the exposed outer peripheral portion of the first photosensitive coating film.

根據該構成，第1感光性塗佈膜以將被處理膜覆蓋之方式形成於基板之被處理面之整個面而非僅形成於基板周緣部，第2感光性塗佈膜係形成於第1感光性塗佈膜上。因此，含金屬塗佈膜不會於基板周緣部附近***，而以均勻厚度形成於第2感光性塗佈膜上。又，於將含金屬塗佈膜之外周部去除時，即便於含金屬塗佈膜之金屬成分殘留於第2感光性塗佈膜之外周部之情形時，該金屬成分亦會連同第2感光性塗佈膜之外周部一起被去除。進而，於使含金屬塗佈膜顯影時，即便於含金屬塗佈膜之金屬成分殘留於第1感光性塗佈膜之外周部之情形時，該金屬成分亦會連同第1感光性塗佈膜之外周部一起被去除。因此，即便於搬送機構保持基板周緣部之情形時，金屬成分亦不會附著於搬送機構。其結果，可防止產生金屬污染，並且於基板上形成具有均勻膜厚之含金屬塗佈膜。According to this structure, the first photosensitive coating film is formed on the entire surface of the substrate to be processed so as to cover the processed film, not only on the peripheral edge of the substrate, and the second photosensitive coating film is formed on the first On the photosensitive coating film. Therefore, the metal-containing coating film does not swell in the vicinity of the peripheral edge of the substrate, but is formed on the second photosensitive coating film with a uniform thickness. In addition, when the outer peripheral portion of the metal-containing coating film is removed, even if the metal component of the metal-containing coating film remains on the outer peripheral portion of the second photosensitive coating film, the metal component will be combined with the second photosensitive coating film. The outer periphery of the sexual coating film is removed together. Furthermore, when the metal-containing coating film is developed, even when the metal component of the metal-containing coating film remains on the outer periphery of the first photosensitive coating film, the metal component will be combined with the first photosensitive coating film. The outer periphery of the membrane is removed together. Therefore, even when the transport mechanism holds the peripheral edge of the substrate, the metal component does not adhere to the transport mechanism. As a result, metal contamination can be prevented, and a metal-containing coating film having a uniform film thickness can be formed on the substrate.

(5)亦可為，第1去除液為使含金屬塗佈膜溶解且不使第1及第2感光性塗佈膜溶解之液體，第2去除液為使第2感光性塗佈膜溶解且不使含金屬塗佈膜溶解之液體，第3去除液為使第1感光性塗佈膜溶解且不使含金屬塗佈膜溶解之液體，顯影液為使含金屬塗佈膜溶解且不使第1及第2感光性塗佈膜溶解之液體。於該情形時，可選擇性地且容易地將含金屬塗佈膜、第2感光性塗佈膜及第1感光性塗佈膜之外周部依序去除並且使含金屬塗佈膜顯影。(5) It can also be that the first removing liquid is a liquid that dissolves the metal-containing coating film without dissolving the first and second photosensitive coating films, and the second removing liquid is a liquid that dissolves the second photosensitive coating film The liquid that does not dissolve the metal-containing coating film, the third removal solution is a liquid that dissolves the first photosensitive coating film and does not dissolve the metal-containing coating film, and the developer is a liquid that dissolves the metal-containing coating film without dissolving Liquid to dissolve the first and second photosensitive coating films. In this case, the outer peripheral portions of the metal-containing coating film, the second photosensitive coating film, and the first photosensitive coating film can be selectively and easily removed in order, and the metal-containing coating film can be developed.

(6)亦可為，第1去除液包含有機溶劑，第2去除液包含進行正型顯影之顯影液，第3去除液包含進行正型顯影之顯影液，顯影液包含進行負型顯影之顯影液。(6) It can also be that the first removal liquid contains an organic solvent, the second removal liquid contains a developer for positive development, the third removal liquid contains a developer for positive development, and the developer contains a developer for negative development. liquid.

於該情形時，可利用第1去除液於不使第1及第2感光性塗佈膜溶解之情況下使含金屬塗佈膜溶解。可利用第2去除液於不使含金屬塗佈膜溶解之情況下使第2感光性塗佈膜溶解。可利用第3去除液於不使含金屬塗佈膜溶解之情況下使第1感光性塗佈膜溶解。可利用顯影液於不使第1及第2感光性塗佈膜溶解之情況下使含金屬塗佈膜溶解。In this case, the first removing liquid can be used to dissolve the metal-containing coating film without dissolving the first and second photosensitive coating films. The second removing liquid can be used to dissolve the second photosensitive coating film without dissolving the metal-containing coating film. The third removing liquid can be used to dissolve the first photosensitive coating film without dissolving the metal-containing coating film. The developer can be used to dissolve the metal-containing coating film without dissolving the first and second photosensitive coating films.

(7)亦可為，第1感光性塗佈膜包含i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之任一種抗蝕膜，第2感光性塗佈膜包含i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之其他抗蝕膜。於該情形時，可容易地形成感光波長分佈互不相同之第1感光性塗佈膜及第2感光性塗佈膜。(7) The first photosensitive coating film may include any one of i-ray resist film, krypton fluoride resist film, and argon fluoride resist film, and the second photosensitive coating film may include i Light resist film, krypton fluoride resist film and other resist film among argon fluoride resist film. In this case, the first photosensitive coating film and the second photosensitive coating film having different photosensitive wavelength distributions can be easily formed.

(8)本發明之又一態樣之基板處理方法包括如下步驟：藉由利用感光性塗佈液供給部對具有形成有被處理膜之被處理面之基板供給感光性塗佈液，而以將被處理膜覆蓋之方式於基板之被處理面形成感光性塗佈膜；利用邊緣曝光部將重疊於基板之被處理面之周緣部上之感光性塗佈膜之外周部曝光；藉由利用含金屬塗佈液供給部將含有金屬之塗佈液作為含金屬塗佈液供給至感光性塗佈膜上，而於感光性塗佈膜上形成含金屬塗佈膜；利用第1去除液供給部對含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之含金屬塗佈膜之外周部去除；以及於含金屬塗佈膜之外周部被去除後，利用第2去除液供給部對感光性塗佈膜供給第2去除液，以將感光性塗佈膜之經曝光之外周部去除。(8) A substrate processing method of another aspect of the present invention includes the steps of: supplying a photosensitive coating liquid to a substrate having a processed surface on which a film to be processed is formed by using a photosensitive coating liquid supply part to Cover the processed film to form a photosensitive coating film on the processed surface of the substrate; use the edge exposure section to expose the outer peripheral portion of the photosensitive coating film overlapping on the peripheral edge of the processed surface of the substrate; The metal-containing coating liquid supply unit supplies the metal-containing coating liquid as the metal-containing coating liquid onto the photosensitive coating film to form the metal-containing coating film on the photosensitive coating film; supplying the first removing liquid The part supplies the first removing liquid to the metal-containing coating film to remove the outer periphery of the metal-containing coating film overlapping the peripheral portion of the processed surface of the substrate; and after the outer periphery of the metal-containing coating film is removed, The second removing liquid is supplied to the photosensitive coating film by the second removing liquid supply unit to remove the exposed outer peripheral portion of the photosensitive coating film.

根據該基板處理方法，含金屬塗佈膜不會於基板周緣部附近***，而以均勻厚度形成於感光性塗佈膜上。又，於將含金屬塗佈膜之外周部去除時，即便於含金屬塗佈膜之金屬成分殘留於感光性塗佈膜之外周部之情形時，該金屬成分亦會連同感光性塗佈膜之外周部一起被去除。因此，即便於搬送機構保持基板周緣部之情形時，金屬成分亦不會附著於搬送機構。其結果，可防止產生金屬污染，並且於基板上形成具有均勻膜厚之含金屬塗佈膜。According to this substrate processing method, the metal-containing coating film does not swell in the vicinity of the peripheral edge of the substrate, but is formed on the photosensitive coating film with a uniform thickness. In addition, when the outer peripheral portion of the metal-containing coating film is removed, even when the metal component of the metal-containing coating film remains on the outer peripheral portion of the photosensitive coating film, the metal component will be combined with the photosensitive coating film The outer periphery is removed together. Therefore, even when the transport mechanism holds the peripheral edge of the substrate, the metal component does not adhere to the transport mechanism. As a result, metal contamination can be prevented, and a metal-containing coating film having a uniform film thickness can be formed on the substrate.

(9)亦可為，供給第1去除液之步驟包括供給使含金屬塗佈膜溶解且不使感光性塗佈膜溶解之液體，供給第2去除液之步驟包括供給使感光性塗佈膜溶解且不使含金屬塗佈膜溶解之液體。於該情形時，可選擇性地且容易地將含金屬塗佈膜及感光性塗佈膜之外周部依序去除。(9) The step of supplying the first removing solution may include supplying a liquid that dissolves the metal-containing coating film and does not dissolve the photosensitive coating film, and the step of supplying the second removing solution includes supplying the photosensitive coating film Liquid that dissolves and does not dissolve the metal-containing coating film. In this case, the outer peripheral portion of the metal-containing coating film and the photosensitive coating film can be removed sequentially and selectively.

(10)亦可為，供給第1去除液之步驟包括供給有機溶劑，供給第2去除液之步驟包括藉由供給顯影液進行正型顯影。於該情形時，可利用第1去除液於不使感光性塗佈膜溶解之情況下使含金屬塗佈膜溶解。可利用第2去除液於不使含金屬塗佈膜溶解之情況下使感光性塗佈膜溶解。(10) The step of supplying the first removing solution may include supplying an organic solvent, and the step of supplying the second removing solution may include performing positive development by supplying a developing solution. In this case, the first removing liquid can be used to dissolve the metal-containing coating film without dissolving the photosensitive coating film. The second removing liquid can be used to dissolve the photosensitive coating film without dissolving the metal-containing coating film.

(11)本發明之又一態樣之基板處理方法係使用將基板曝光之曝光裝置者，包括如下步驟：藉由利用第1感光性塗佈液供給部對具有形成有被處理膜之被處理面之基板供給第1感光性塗佈液，而以將被處理膜覆蓋之方式於基板之被處理面形成第1感光性塗佈膜；藉由利用第2感光性塗佈液供給部對第1感光性塗佈膜上供給感光波長分佈不同於第1感光性塗佈液之第2感光性塗佈液，而於第1感光性塗佈膜上形成第2感光性塗佈膜；利用第1邊緣曝光部將重疊於基板之被處理面之周緣部上之第2感光性塗佈膜之外周部曝光；藉由利用含金屬塗佈液供給部將含有金屬之塗佈液作為含金屬塗佈液供給至第2感光性塗佈膜上，而於第2感光性塗佈膜上形成含金屬塗佈膜；利用第1去除液供給部對含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之含金屬塗佈膜之外周部去除；於含金屬塗佈膜之外周部被去除後，利用第2去除液供給部對第2感光性塗佈膜供給第2去除液，以將第2感光性塗佈膜之經曝光之外周部去除；利用第2邊緣曝光部將重疊於基板之被處理面之周緣部之第1感光性塗佈膜之外周部曝光；利用顯影液供給部對含金屬塗佈膜供給顯影液，以使利用曝光裝置曝光成特定圖案之含金屬塗佈膜顯影；以及於含金屬塗佈膜顯影後，利用第3去除液供給部對第1感光性塗佈膜供給第3去除液，以將第1感光性塗佈膜之經曝光之外周部去除。(11) A substrate processing method of another aspect of the present invention uses an exposure device for exposing a substrate, and includes the following steps: by using the first photosensitive coating liquid supply part to process the film to be processed The first photosensitive coating liquid is supplied to the substrate on the surface, and the first photosensitive coating film is formed on the processed surface of the substrate so as to cover the processed film; the second photosensitive coating liquid 1 Supply a second photosensitive coating liquid with a photosensitive wavelength distribution different from the first photosensitive coating liquid on the photosensitive coating film, and form a second photosensitive coating film on the first photosensitive coating film; 1 The edge exposure part exposes the outer peripheral part of the second photosensitive coating film superimposed on the peripheral part of the processed surface of the substrate; by using the metal-containing coating liquid supply part, the metal-containing coating liquid is used as the metal-containing coating The cloth liquid is supplied to the second photosensitive coating film, and the metal-containing coating film is formed on the second photosensitive coating film; the first removing liquid is supplied to the metal-containing coating film by the first removing liquid supply part to The outer periphery of the metal-containing coating film overlapped on the periphery of the processed surface of the substrate is removed; after the outer periphery of the metal-containing coating film is removed, the second photosensitive coating film is applied by the second removing liquid supply part Supply the second removing liquid to remove the exposed outer periphery of the second photosensitive coating film; use the second edge exposure section to overlap the outer periphery of the first photosensitive coating film on the periphery of the substrate to be processed Partial exposure; use the developer supply part to supply the metal-containing coating film with a developer solution to develop the metal-containing coating film exposed to a specific pattern by the exposure device; and after the metal-containing coating film is developed, use the third removing solution The supply unit supplies the third removing liquid to the first photosensitive coating film to remove the exposed outer peripheral portion of the first photosensitive coating film.

根據該基板處理方法，含金屬塗佈膜不會於基板周緣部附近***，而以均勻厚度形成於第2感光性塗佈膜上。又，於將含金屬塗佈膜之外周部去除時，即便於含金屬塗佈膜之金屬成分殘留於第2感光性塗佈膜之外周部之情形時，該金屬成分亦會連同第2感光性塗佈膜之外周部一起被去除。進而，於使含金屬塗佈膜顯影時，即便於含金屬塗佈膜之金屬成分殘留於第1感光性塗佈膜之外周部之情形時，該金屬成分亦會連同第1感光性塗佈膜之外周部一起被去除。因此，即便於搬送機構保持基板周緣部之情形時，金屬成分亦不會附著於搬送機構。其結果，可防止產生金屬污染，並且於基板上形成具有均勻膜厚之含金屬塗佈膜。According to this substrate processing method, the metal-containing coating film is formed on the second photosensitive coating film with a uniform thickness without swelling near the periphery of the substrate. In addition, when the outer peripheral portion of the metal-containing coating film is removed, even if the metal component of the metal-containing coating film remains on the outer peripheral portion of the second photosensitive coating film, the metal component will be combined with the second photosensitive coating film. The outer periphery of the sexual coating film is removed together. Furthermore, when the metal-containing coating film is developed, even when the metal component of the metal-containing coating film remains on the outer periphery of the first photosensitive coating film, the metal component will be combined with the first photosensitive coating film. The outer periphery of the membrane is removed together. Therefore, even when the transport mechanism holds the peripheral edge of the substrate, the metal component does not adhere to the transport mechanism. As a result, metal contamination can be prevented, and a metal-containing coating film having a uniform film thickness can be formed on the substrate.

(12)亦可為，供給第1去除液之步驟包括供給使含金屬塗佈膜溶解且不使第1及第2感光性塗佈膜溶解之液體，供給第2去除液之步驟包括供給使第2感光性塗佈膜溶解且不使含金屬塗佈膜溶解之液體，供給顯影液之步驟包括供給使含金屬塗佈膜溶解且不使第1及第2感光性塗佈膜溶解之液體，供給第3去除液之步驟包括供給使第1感光性塗佈膜溶解且不使含金屬塗佈膜溶解之液體。於該情形時，可選擇性地且容易地將含金屬塗佈膜、第2感光性塗佈膜及第1感光性塗佈膜之外周部依序去除並且使含金屬塗佈膜顯影。(12) The step of supplying the first removal solution may include supplying a liquid that dissolves the metal-containing coating film without dissolving the first and second photosensitive coating films, and the step of supplying the second removal solution includes supplying The liquid that dissolves the second photosensitive coating film and does not dissolve the metal-containing coating film. The step of supplying the developer solution includes supplying a liquid that dissolves the metal-containing coating film without dissolving the first and second photosensitive coating films The step of supplying the third removing liquid includes supplying a liquid that dissolves the first photosensitive coating film and does not dissolve the metal-containing coating film. In this case, the outer peripheral portions of the metal-containing coating film, the second photosensitive coating film, and the first photosensitive coating film can be selectively and easily removed in order, and the metal-containing coating film can be developed.

(13)亦可為，供給第1去除液之步驟包括供給有機溶劑，供給第2去除液之步驟包括藉由供給顯影液進行正型顯影，供給顯影液之步驟包括藉由供給顯影液進行負型顯影，供給第3去除液之步驟包括藉由供給顯影液進行正型顯影。(13) Alternatively, the step of supplying the first removing solution includes supplying an organic solvent, the step of supplying the second removing solution includes performing positive development by supplying a developing solution, and the step of supplying developing solution includes performing negative development by supplying a developing solution. In type development, the step of supplying the third removing solution includes performing positive type development by supplying a developer solution.

於該情形時，可利用第1去除液於不使第1及第2感光性塗佈膜溶解之情況下使含金屬塗佈膜溶解。可利用第2去除液於不使含金屬塗佈膜溶解之情況下使第2感光性塗佈膜溶解。可利用顯影液於不使第1及第2感光性塗佈膜溶解之情況下使含金屬塗佈膜溶解。可利用第3去除液於不使含金屬塗佈膜溶解之情況下使第1感光性塗佈膜溶解。In this case, the first removing liquid can be used to dissolve the metal-containing coating film without dissolving the first and second photosensitive coating films. The second removing liquid can be used to dissolve the second photosensitive coating film without dissolving the metal-containing coating film. The developer can be used to dissolve the metal-containing coating film without dissolving the first and second photosensitive coating films. The third removing liquid can be used to dissolve the first photosensitive coating film without dissolving the metal-containing coating film.

(14)亦可為，形成第1感光性塗佈膜之步驟包括形成i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之任一種抗蝕膜，形成第2感光性塗佈膜之步驟包括形成i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之其他抗蝕膜。於該情形時，可容易地形成感光波長分佈互不相同之第1感光性塗佈膜及第2感光性塗佈膜。 [發明之效果](14) Alternatively, the step of forming the first photosensitive coating film includes forming any one of i-ray resist film, krypton fluoride resist film and argon fluoride resist film to form the second photosensitive coating film. The step of the flexible coating film includes forming other resist films among i-light resist film, krypton fluoride resist film and argon fluoride resist film. In this case, the first photosensitive coating film and the second photosensitive coating film having different photosensitive wavelength distributions can be easily formed. [Effects of Invention]

根據本發明，可防止產生金屬污染，並且於基板上形成具有均勻膜厚之含金屬塗佈膜。According to the present invention, metal contamination can be prevented, and a metal-containing coating film having a uniform film thickness can be formed on the substrate.

以下，使用圖式對本發明之一實施形態之基板處理裝置及基板處理方法進行說明。再者，於以下說明中，基板係指半導體基板、液晶顯示裝置或有機EL(Electro Luminescence，電致發光)顯示裝置等FPD(Flat Panel Display平面顯示器)用基板、光碟用基板、磁碟用基板、光磁碟用基板、光罩用基板、陶瓷基板或太陽電池用基板等。Hereinafter, a substrate processing apparatus and a substrate processing method according to an embodiment of the present invention will be described using drawings. In addition, in the following description, the substrate refers to a semiconductor substrate, a liquid crystal display device, or an organic EL (Electro Luminescence, electroluminescence) display device and other FPD (Flat Panel Display) substrates, optical disk substrates, magnetic disk substrates , Optical magnetic disk substrate, photomask substrate, ceramic substrate or solar cell substrate, etc.

[1]第1實施形態 (1)基板處理裝置 圖1係本發明之第1實施形態之基板處理裝置之模式性俯視圖。如圖1所示，基板處理裝置100具備導引區塊11及塗佈區塊12。[1] The first embodiment (1) Substrate processing equipment Fig. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 100 includes a guide block 11 and a coating block 12.

導引區塊11包含複數個載具載置部111及搬送部112。於各載具載置部111載置將複數個基板W多段收納之載具113。於搬送部112設置控制部114及搬送裝置115。控制部114控制基板處理裝置100之各種構成要素。搬送裝置115一面保持基板W，一面搬送該基板W。The guiding block 11 includes a plurality of carrier placing parts 111 and conveying parts 112. A carrier 113 for storing a plurality of substrates W in multiple stages is placed on each carrier placing portion 111. The conveying unit 112 is provided with a control unit 114 and a conveying device 115. The control unit 114 controls various components of the substrate processing apparatus 100. While holding the substrate W, the conveying device 115 conveys the substrate W.

塗佈區塊12包含塗佈處理部121、搬送部122及熱處理部123。塗佈處理部121及熱處理部123係以隔著搬送部122對向之方式設置。The coating block 12 includes a coating processing part 121, a conveying part 122 and a heat treatment part 123. The coating processing part 121 and the heat treatment part 123 are provided so as to face each other across the conveying part 122.

圖2係主要表示圖1之塗佈處理部121之基板處理裝置100之模式性側視圖。如圖2所示，於塗佈處理部121設置複數個塗佈處理單元(旋轉塗佈機)20。各塗佈處理單元20具備複數個旋轉吸盤21、複數個護罩22、複數個塗佈噴嘴23、移動機構24、複數個邊緣清洗噴嘴25及複數個斜面清洗噴嘴26(參照下述圖6(b))。複數個護罩22與複數個旋轉吸盤21分別對應，以將對應之旋轉吸盤21之周圍覆蓋之方式設置。FIG. 2 is a schematic side view mainly showing the substrate processing apparatus 100 of the coating processing section 121 of FIG. 1. As shown in FIG. 2, a plurality of coating processing units (spin coaters) 20 are provided in the coating processing section 121. Each coating processing unit 20 is equipped with a plurality of rotary suction cups 21, a plurality of shields 22, a plurality of coating nozzles 23, a moving mechanism 24, a plurality of edge cleaning nozzles 25, and a plurality of bevel cleaning nozzles 26 (refer to Figure 6 ( b)). The plurality of shields 22 correspond to the plurality of rotary suction cups 21 respectively, and are arranged in a manner of covering the surroundings of the corresponding rotary suction cups 21.

於塗佈處理單元20中，旋轉吸盤21將基板W以水平姿勢吸附保持並使其旋轉。於該狀態下，任一塗佈噴嘴23利用移動機構24移動至基板W之上方，自該塗佈噴嘴23噴出塗佈液。藉此，將塗佈液塗佈於基板W之被處理面上，而於基板W之被處理面上形成塗佈液之膜(以下稱作塗佈膜)。此處，被處理面係指供形成電路圖案等各種圖案之基板W之面。In the coating processing unit 20, the rotary chuck 21 sucks and holds the substrate W in a horizontal posture and rotates it. In this state, any coating nozzle 23 is moved above the substrate W by the moving mechanism 24, and the coating liquid is ejected from the coating nozzle 23. Thereby, the coating liquid is applied to the processed surface of the substrate W, and a film of the coating liquid (hereinafter referred to as a coating film) is formed on the processed surface of the substrate W. Here, the processed surface refers to the surface of the substrate W on which various patterns such as circuit patterns are formed.

複數個塗佈噴嘴23之各者可噴出該塗佈噴嘴23所固有之種類之塗佈液。於以下說明中，於將複數個塗佈噴嘴23加以區分之情形時，將複數個塗佈噴嘴23分別稱作塗佈噴嘴23a、23b、23c……。Each of the plurality of coating nozzles 23 can eject the coating liquid of the type unique to the coating nozzle 23. In the following description, when a plurality of coating nozzles 23 are distinguished, the plurality of coating nozzles 23 are respectively referred to as coating nozzles 23a, 23b, 23c....

又，自任一邊緣清洗噴嘴25向基板W之周緣部噴出清洗液。基板W之周緣部係指基板W之被處理面中沿基板W之外周部之固定寬度之區域。藉此，將附著於基板W之周緣部之塗佈液去除。複數個邊緣清洗噴嘴25之各者可噴出對該邊緣清洗噴嘴25所固有之種類之去除液。於以下說明中，於將複數個邊緣清洗噴嘴25加以區分之情形時，將複數個邊緣清洗噴嘴25分別稱作邊緣清洗噴嘴25a、25b、25c……。In addition, the cleaning liquid is sprayed to the peripheral edge of the substrate W from any edge cleaning nozzle 25. The peripheral portion of the substrate W refers to an area of a fixed width along the outer periphery of the substrate W in the processed surface of the substrate W. Thereby, the coating liquid adhering to the peripheral portion of the substrate W is removed. Each of the plurality of edge cleaning nozzles 25 can spray a kind of removal liquid peculiar to the edge cleaning nozzle 25. In the following description, when a plurality of edge cleaning nozzles 25 are distinguished, the plurality of edge cleaning nozzles 25 are respectively referred to as edge cleaning nozzles 25a, 25b, 25c....

進而，自斜面清洗噴嘴26向基板W之斜面部噴出清洗液。斜面部係指自基板W之被處理面之外周部朝向基板W之最外周部傾斜之部分及自基板W之背面之外周部朝向基板W之最外周部傾斜之部分。背面係指與基板W之被處理面為相反側之面。藉此，將附著於基板W之斜面部之塗佈液去除。Furthermore, the cleaning liquid is sprayed from the inclined surface cleaning nozzle 26 to the inclined surface portion of the substrate W. The inclined portion refers to a portion inclined from the outer periphery of the processed surface of the substrate W to the outermost periphery of the substrate W and a portion inclined from the outer periphery of the back surface of the substrate W to the outermost periphery of the substrate W. The back surface refers to the surface opposite to the processed surface of the substrate W. Thereby, the coating liquid adhering to the inclined surface portion of the substrate W is removed.

圖3係主要表示圖1之熱處理部123之基板處理裝置100之模式性側視圖。如圖3所示，熱處理部123具有上段熱處理部101及下段熱處理部102。於上段熱處理部101及下段熱處理部102之各者設置複數個加熱單元PHP、複數個冷卻單元CP及邊緣曝光部40。於加熱單元PHP中，進行基板W之加熱處理。於冷卻單元CP中，進行基板W之冷卻處理。FIG. 3 is a schematic side view of the substrate processing apparatus 100 mainly showing the heat treatment section 123 of FIG. 1. As shown in FIG. 3, the heat treatment part 123 has an upper heat treatment part 101 and a lower heat treatment part 102. A plurality of heating units PHP, a plurality of cooling units CP, and an edge exposure unit 40 are provided in each of the upper heat treatment part 101 and the lower heat treatment part 102. In the heating unit PHP, the substrate W is heated. In the cooling unit CP, cooling processing of the substrate W is performed.

邊緣曝光部40具備旋轉吸盤41及光源42。光源42例如包括高壓水銀燈，出射具有365 nm之峰值波長之光(i光線)作為曝光光。於邊緣曝光部40，旋轉吸盤41將基板W以水平姿勢吸附保持並使其旋轉。於該狀態下，自光源42對基板W之周緣部之固定寬度之區域照射i光線。藉此，對基板W上之周緣部中之固定寬度之區域進行曝光處理(邊緣曝光處理)。The edge exposure unit 40 includes a rotary chuck 41 and a light source 42. The light source 42 includes, for example, a high-pressure mercury lamp, and emits light (i-ray) having a peak wavelength of 365 nm as exposure light. In the edge exposure section 40, the rotary chuck 41 sucks and holds the substrate W in a horizontal posture and rotates it. In this state, the light source 42 irradiates the area of the fixed width of the peripheral edge of the substrate W with i-rays. In this way, an exposure process (edge exposure process) is performed on a region of a fixed width in the peripheral portion on the substrate W.

圖4係主要表示圖1之搬送部122之側視圖。如圖4所示，搬送部122具有上段搬送室125及下段搬送室126。於上段搬送室125設置搬送裝置(搬送機械手)127，於下段搬送室126設置搬送裝置128。搬送裝置127、128之各者一面保持基板W，一面搬送該基板W。於搬送部112與上段搬送室125之間，設置基板載置部P1、P2，於搬送部112與下段搬送室126之間，設置基板載置部P3、P4。Fig. 4 is a side view mainly showing the conveying unit 122 of Fig. 1. As shown in FIG. 4, the conveying unit 122 has an upper conveying chamber 125 and a lower conveying chamber 126. A conveying device (transport robot) 127 is installed in the upper conveying chamber 125, and a conveying device 128 is installed in the lower conveying chamber 126. Each of the conveying devices 127 and 128 holds the substrate W while conveying the substrate W. Between the conveying part 112 and the upper-stage conveying chamber 125, the board|substrate placing parts P1, P2 are provided, and between the conveying part 112 and the lower-stage conveying chamber 126, the board|substrate placing parts P3 and P4 are provided.

(2)基板處理 圖5～圖7係供進行處理之基板W之局部放大縱剖視圖。圖5(a)表示例如由矽形成之未處理之基板W。圖5(a)之基板W自圖1之導引區塊11被搬送至塗佈區塊12之熱處理部123，利用冷卻單元CP對基板W進行冷卻處理。(2) Substrate processing 5 to 7 are partial enlarged longitudinal cross-sectional views of the substrate W for processing. Fig. 5(a) shows an untreated substrate W made of silicon, for example. The substrate W of FIG. 5(a) is transported from the guide block 11 of FIG. 1 to the heat treatment part 123 of the coating block 12, and the substrate W is cooled by the cooling unit CP.

冷卻處理後，基板W被搬送至圖1之塗佈處理部121之任一塗佈處理單元20，藉由旋轉吸盤21被保持及進行旋轉。於該狀態下，如圖5(b)所示，利用塗佈噴嘴23a向基板W之被處理面之大致中央部噴出塗佈液。藉此，於基板W之被處理面形成下層膜F1作為塗佈膜。After the cooling process, the substrate W is transported to any coating processing unit 20 of the coating processing section 121 in FIG. 1, and is held and rotated by the spin chuck 21. In this state, as shown in FIG. 5(b), the coating liquid is sprayed toward the substantially central portion of the processed surface of the substrate W by the coating nozzle 23a. Thereby, the underlayer film F1 is formed as a coating film on the processed surface of the substrate W.

又，如圖5(c)所示，利用邊緣清洗噴嘴25a對基板W之周緣部噴出清洗液。藉此，進行邊緣清洗處理，而將附著於基板W之周緣部之塗佈液去除。作為圖5(c)之清洗液，例如可為有機溶劑，亦可為純水或水溶液。邊緣清洗處理後，基板W被搬送至熱處理部123，利用圖1之加熱單元PHP或冷卻單元CP對基板W進行特定熱處理(包括冷卻處理)。Furthermore, as shown in FIG. 5(c), the edge cleaning nozzle 25a sprays the cleaning liquid onto the peripheral edge of the substrate W. Thereby, the edge cleaning process is performed, and the coating liquid adhering to the peripheral edge of the substrate W is removed. As the cleaning liquid of FIG. 5(c), for example, it may be an organic solvent, pure water or an aqueous solution. After the edge cleaning process, the substrate W is transported to the heat treatment unit 123, and the substrate W is subjected to specific heat treatment (including cooling process) by the heating unit PHP or the cooling unit CP in FIG. 1.

於本實施形態中，下層膜F1具有交替積層有無機性之塗佈膜及有機性之塗佈膜之構成。於該情形時，每當於塗佈處理部121中於基板W形成一個塗佈膜並進行邊緣清洗處理後，便於熱處理部123中對基板W進行熱處理。於圖5(d)之例中，下層膜F1具有於基板W上依序積層有塗佈膜Fa、Fb、Fc之構成。In this embodiment, the lower layer film F1 has a structure in which an inorganic coating film and an organic coating film are alternately laminated. In this case, each time a coating film is formed on the substrate W in the coating processing section 121 and the edge cleaning process is performed, it is convenient to heat the substrate W in the thermal processing section 123. In the example of FIG. 5(d), the lower film F1 has a configuration in which the coating films Fa, Fb, and Fc are sequentially laminated on the substrate W.

塗佈膜Fa例如為氮化矽膜、氧化矽膜或多晶矽膜，且係於本實施形態中之基板處理結束後成為利用未圖示之外部之蝕刻裝置進行蝕刻之對象之膜。塗佈膜Fb例如為SOC(Spin On Carbon，旋塗碳)膜。塗佈膜Fc例如為SOG(Spin On Glass，旋轉塗佈玻璃)膜或SiARC(Si-rich Anti Reflective Coating，富矽抗反射塗層)膜。塗佈膜Fb、Fc係用作用於塗佈膜Fa之蝕刻之遮罩。The coating film Fa is, for example, a silicon nitride film, a silicon oxide film, or a polysilicon film, and is a film to be etched by an external etching device (not shown) after the substrate processing in this embodiment is completed. The coating film Fb is, for example, an SOC (Spin On Carbon) film. The coating film Fc is, for example, a SOG (Spin On Glass) film or a SiARC (Si-rich Anti Reflective Coating) film. The coating films Fb and Fc are used as masks for etching of the coating film Fa.

於本實施形態中，下層膜F1包含塗佈膜Fa～Fc，但本發明並不限定於此。塗佈膜Fc係用於使塗佈膜Fa之蝕刻速率擴增。因此，於能夠以足夠大之蝕刻速率對塗佈膜Fa進行蝕刻之情形時，下層膜F1亦可包含塗佈膜Fa、Fb而不含塗佈膜Fc。或者，下層膜F1亦可包含塗佈膜Fa而不含塗佈膜Fb、Fc。In this embodiment, the lower layer film F1 includes the coating films Fa to Fc, but the present invention is not limited to this. The coating film Fc is used to amplify the etching rate of the coating film Fa. Therefore, when the coating film Fa can be etched at a sufficiently large etching rate, the lower layer film F1 may include the coating films Fa and Fb without the coating film Fc. Alternatively, the lower layer film F1 may include the coating film Fa without excluding the coating films Fb and Fc.

其後，基板W被搬送至塗佈處理部121之任一塗佈處理單元20，藉由旋轉吸盤21被保持及進行旋轉。於該狀態下，如圖6(a)所示，利用塗佈噴嘴23b將感光性之光阻液作為塗佈液噴出至基板W之被處理面之大致中央部。藉此，以覆蓋下層膜F1之方式於基板W之被處理面形成感光性抗蝕膜F2作為塗佈膜。感光性抗蝕膜F2例如為藉由i光線感光之i光線抗蝕膜。After that, the substrate W is transported to any coating processing unit 20 of the coating processing section 121, and is held and rotated by the spin chuck 21. In this state, as shown in FIG. 6(a), the photosensitive resist liquid is ejected as the coating liquid to the substantially central portion of the processed surface of the substrate W by the application nozzle 23b. Thereby, a photosensitive resist film F2 is formed as a coating film on the processed surface of the substrate W so as to cover the lower layer film F1. The photosensitive resist film F2 is, for example, an i-ray resist film that is sensitized by i-ray light.

又，如圖6(b)所示，利用斜面清洗噴嘴26向基板W之斜面部噴出清洗液。藉此，進行斜面清洗處理，而將附著於基板W之斜面部之光阻液去除。圖6(b)之清洗液亦可為與圖5(c)相同之清洗液體。Furthermore, as shown in FIG. 6(b), the cleaning liquid is sprayed to the slope surface of the substrate W by the slope cleaning nozzle 26. Thereby, the inclined surface cleaning process is performed, and the photoresist liquid adhering to the inclined surface of the substrate W is removed. The cleaning liquid of Fig. 6(b) can also be the same cleaning liquid as that of Fig. 5(c).

斜面清洗處理後，基板W被搬送至熱處理部123，利用加熱單元PHP或冷卻單元CP對基板W進行特定熱處理。熱處理後，基板W於圖3之邊緣曝光部40中藉由旋轉吸盤41被保持及進行旋轉。於該狀態下，如圖6(c)所示，自光源42對基板W之周緣部之固定寬度之區域照射曝光光。藉此，對基板W上之周緣部中之感光性抗蝕膜F2之固定寬度之區域進行邊緣曝光處理。邊緣曝光處理後，利用冷卻單元CP對基板W進行冷卻處理。After the slope cleaning process, the substrate W is transported to the heat treatment unit 123, and the substrate W is subjected to specific heat treatment by the heating unit PHP or the cooling unit CP. After the heat treatment, the substrate W is held and rotated by the rotary chuck 41 in the edge exposure part 40 of FIG. 3. In this state, as shown in FIG. 6(c), the light source 42 irradiates a region of a fixed width on the peripheral edge of the substrate W with exposure light. Thereby, edge exposure processing is performed on the fixed width area of the photosensitive resist film F2 in the peripheral portion on the substrate W. After the edge exposure processing, the substrate W is cooled by the cooling unit CP.

再者，於本實施形態中，感光性抗蝕膜F2為i光線抗蝕膜，但本發明並不限定於此。感光性抗蝕膜F2亦可為其他感光性抗蝕膜。例如，感光性抗蝕膜F2亦可為藉由具有248 nm之峰值波長之光而感光之KrF(氟化氪)抗蝕膜。於該情形時，光源42包含KrF準分子雷射器。或者，感光性抗蝕膜F2亦可為藉由具有193 nm之峰值波長之光而感光之ArF(氟化氬)抗蝕膜。於該情形時，光源42包含ArF準分子雷射器。In addition, in this embodiment, the photosensitive resist film F2 is an i-ray resist film, but this invention is not limited to this. The photosensitive resist film F2 may be another photosensitive resist film. For example, the photosensitive resist film F2 may be a KrF (krypton fluoride) resist film that is photosensitive by light having a peak wavelength of 248 nm. In this case, the light source 42 includes a KrF excimer laser. Alternatively, the photosensitive resist film F2 may be an ArF (argon fluoride) resist film that is photosensitive by light having a peak wavelength of 193 nm. In this case, the light source 42 includes an ArF excimer laser.

其後，基板W被搬送至塗佈處理部121之任一塗佈處理單元20，藉由旋轉吸盤21被保持及進行旋轉。於該狀態下，如圖7(a)所示，將含有用於高效吸收EUV (Extreme Ultra Violet，超紫外線)之金屬成分或金屬氧化物等金屬成分作為組合物之含金屬抗蝕液作為塗佈液利用塗佈噴嘴23c向基板W之被處理面之大致中央部噴出。EUV之波長為13 nm以上14 nm以下。金屬成分例如包含Sn(錫)、HfO2 (氧化鉿)或ZrO2 (二氧化鋯)。藉此，以覆蓋感光性抗蝕膜F2之方式於基板W之被處理面形成含金屬抗蝕膜F4作為塗佈膜。After that, the substrate W is transported to any coating processing unit 20 of the coating processing section 121, and is held and rotated by the spin chuck 21. In this state, as shown in Figure 7(a), a metal-containing resist containing a metal component for highly effective absorption of EUV (Extreme Ultra Violet) or a metal component such as a metal oxide as a composition is used as a coating The cloth liquid is sprayed toward the substantially central portion of the surface to be processed of the substrate W by the application nozzle 23c. The wavelength of EUV is above 13 nm and below 14 nm. The metal component includes, for example, Sn (tin), HfO 2 (hafnium oxide), or ZrO 2 (zirconium dioxide). Thereby, a metal-containing resist film F4 is formed as a coating film on the processed surface of the substrate W so as to cover the photosensitive resist film F2.

又，如圖7(b)所示，利用邊緣清洗噴嘴25b對基板W之周緣部噴出清洗液。作為圖7(b)之清洗液，使用使含金屬抗蝕膜F4溶解且不使感光性抗蝕膜F2溶解之液體。具體而言，作為清洗液，例如使用MIBC(methyl isobutyl carbinol，甲基異丁基甲醇)或MIBK(methyl isobutyl ketone，甲基異丁基酮)等溶解性較低之有機溶劑。藉此，進行邊緣清洗處理，而將附著於基板W之周緣部之含金屬抗蝕液去除。Furthermore, as shown in FIG. 7(b), the edge cleaning nozzle 25b sprays the cleaning liquid onto the peripheral edge of the substrate W. As the cleaning liquid of FIG. 7(b), a liquid that dissolves the metal-containing resist film F4 and does not dissolve the photosensitive resist film F2 is used. Specifically, as the cleaning liquid, for example, MIBC (methyl isobutyl carbinol) or MIBK (methyl isobutyl ketone, methyl isobutyl ketone) and other organic solvents with relatively low solubility are used. By this, the edge cleaning process is performed, and the metal-containing resist attached to the peripheral edge of the substrate W is removed.

進而，如圖7(c)所示，利用邊緣清洗噴嘴25c對基板W之周緣部噴出清洗液。作為圖7(c)之清洗液，使用使感光性抗蝕膜F2溶解且不使含金屬抗蝕膜F4溶解之液體。具體而言，作為清洗液，使用例如包含TMAH(tetra methyl ammonium hydroxide，氫氧化四甲基銨)或KOH(potassium hydroxide，氫氧化鈉)之鹼性水溶液等顯影液。藉此，進行邊緣清洗處理，而將殘留於基板W之周緣部之感光性抗蝕膜F2藉由正型顯影去除。Furthermore, as shown in FIG. 7(c), the edge cleaning nozzle 25c sprays the cleaning liquid onto the peripheral edge of the substrate W. As the cleaning liquid of FIG. 7(c), a liquid which dissolves the photosensitive resist film F2 and does not dissolve the metal-containing resist film F4 is used. Specifically, as the cleaning solution, a developer solution such as an alkaline aqueous solution containing TMAH (tetra methyl ammonium hydroxide) or KOH (potassium hydroxide) is used. Thereby, the edge cleaning process is performed, and the photosensitive resist film F2 remaining on the peripheral edge of the substrate W is removed by positive development.

上述兩個階段之邊緣清洗處理後，基板W被搬送至熱處理部123，利用加熱單元PHP或冷卻單元CP對基板W進行特定熱處理。其後，基板W自塗佈區塊12被搬送至導引區塊11，基板處理結束。After the above two stages of edge cleaning processing, the substrate W is transported to the heat treatment section 123, and the substrate W is subjected to specific heat treatment by the heating unit PHP or the cooling unit CP. After that, the substrate W is transported from the coating block 12 to the guide block 11, and the substrate processing ends.

(3)基板處理裝置之動作 一面參照圖1～圖7，一面對基板處理裝置100之動作進行說明。再者，於以下說明中，將圖2之積層於塗佈處理部121之複數個塗佈處理單元20中配置於上部之一半塗佈處理單元20稱作上段之塗佈處理單元20，另一方面，將配置於下部之剩餘一半塗佈處理單元20稱作下段之塗佈處理單元20。(3) Operation of substrate processing equipment 1 to FIG. 7, and the operation of the substrate processing apparatus 100 will be described. Furthermore, in the following description, one half of the coating treatment unit 20 of the plurality of coating treatment units 20 layered on the coating treatment section 121 of FIG. 2 is called the upper coating treatment unit 20, and the other On the other hand, the remaining half of the coating processing unit 20 arranged in the lower part is referred to as the coating processing unit 20 in the lower stage.

於導引區塊11之載具載置部111(圖1)載置收容有未處理之基板W之載具113。搬送裝置115自載具113向基板載置部P1、P3(圖4)搬送未處理之基板W。又，搬送裝置115將載置於基板載置部P2、P4(圖4)之已處理之基板W搬送至載具113。The carrier 113 containing the unprocessed substrate W is placed on the carrier placing portion 111 (FIG. 1) of the guide block 11. The conveying device 115 conveys the unprocessed substrate W from the carrier 113 to the substrate placing parts P1 and P3 (FIG. 4 ). In addition, the conveying device 115 conveys the processed substrate W placed on the substrate placing portions P2 and P4 (FIG. 4) to the carrier 113.

於塗佈區塊12，搬送裝置127將載置於基板載置部P1之基板W依序搬送至上段熱處理部101(圖3)之冷卻單元CP及塗佈處理部121(圖2)之上段之任一塗佈處理單元20。於該情形時，於冷卻單元CP中，將基板W冷卻至適於形成下層膜F1之溫度。又，於塗佈處理單元20中，如圖5(b)所示般於基板W上形成下層膜F1，如圖5(c)所示般對基板W進行邊緣清洗處理。In the coating block 12, the conveying device 127 sequentially conveys the substrate W placed on the substrate placing part P1 to the upper stage of the cooling unit CP of the upper heat treatment part 101 (FIG. 3) and the coating treatment part 121 (FIG. 2)的 Any coating processing unit 20. In this case, in the cooling unit CP, the substrate W is cooled to a temperature suitable for forming the lower film F1. In addition, in the coating processing unit 20, the underlayer film F1 is formed on the substrate W as shown in FIG. 5(b), and the edge cleaning process is performed on the substrate W as shown in FIG. 5(c).

然後，搬送裝置127將利用塗佈處理單元20形成有下層膜F1之基板W依序搬送至上段熱處理部101之加熱單元PHP及冷卻單元CP。於該情形時，於加熱單元PHP中，將基板W加熱至150℃～400℃後，於冷卻單元CP中進行冷卻。如圖5(d)所示，於下層膜F1包含複數個塗佈膜Fa～Fc之情形時，搬送裝置127於塗佈處理單元20與加熱單元PHP及冷卻單元CP之間反覆進行上述基板W之搬送。Then, the conveying device 127 sequentially conveys the substrate W on which the lower layer film F1 is formed by the coating processing unit 20 to the heating unit PHP and the cooling unit CP of the upper heat treatment unit 101. In this case, after heating the substrate W to 150°C to 400°C in the heating unit PHP, it is cooled in the cooling unit CP. As shown in FIG. 5(d), when the lower film F1 includes a plurality of coating films Fa to Fc, the conveying device 127 repeatedly performs the substrate W between the coating processing unit 20 and the heating unit PHP and the cooling unit CP. The transfer.

其後，搬送裝置127將基板W依序搬送至塗佈處理部121之上段之任一塗佈處理單元20、上段熱處理部101之加熱單元PHP、冷卻單元CP、邊緣曝光部40及冷卻單元CP。於該情形時，於塗佈處理單元20中，如圖6(a)所示般於基板W上形成感光性抗蝕膜F2，如圖6(b)所示般對基板W進行斜面清洗處理。又，於加熱單元PHP中，將基板W加熱至90℃～130℃後，於冷卻單元CP中進行冷卻。其次，於邊緣曝光部40中，如圖6(c)所示般對基板W進行邊緣曝光處理，於冷卻單元CP中將基板W冷卻。After that, the conveying device 127 sequentially conveys the substrate W to any one of the coating processing unit 20 of the upper stage of the coating processing section 121, the heating unit PHP, the cooling unit CP, the edge exposure section 40, and the cooling unit CP of the upper heat treatment section 101 . In this case, in the coating processing unit 20, a photosensitive resist film F2 is formed on the substrate W as shown in FIG. 6(a), and the substrate W is subjected to a slope cleaning process as shown in FIG. 6(b) . In addition, after heating the substrate W to 90°C to 130°C in the heating unit PHP, it is cooled in the cooling unit CP. Next, in the edge exposure section 40, the substrate W is subjected to edge exposure processing as shown in FIG. 6(c), and the substrate W is cooled in the cooling unit CP.

其後，搬送裝置127將基板W依序搬送至塗佈處理部121之上段之任一塗佈處理單元20、上段熱處理部101之加熱單元PHP及冷卻單元CP。於該情形時，於塗佈處理單元20中，如圖7(a)所示般於基板W上形成含金屬抗蝕膜F4後，如圖7(b)及圖7(c)所示般對基板W進行兩個階段之邊緣清洗處理。又，於加熱單元PHP中，將基板W加熱至90℃～200℃後，於冷卻單元CP中進行冷卻。最後，搬送裝置127將冷卻後之基板W搬送至基板載置部P2。After that, the conveying device 127 sequentially conveys the substrate W to any one of the coating processing unit 20 of the upper stage of the coating processing section 121, the heating unit PHP and the cooling unit CP of the upper heat treatment section 101. In this case, in the coating processing unit 20, after the metal-containing resist film F4 is formed on the substrate W as shown in FIG. 7(a), as shown in FIGS. 7(b) and 7(c) The substrate W is subjected to a two-stage edge cleaning process. In addition, after heating the substrate W to 90 to 200°C in the heating unit PHP, it is cooled in the cooling unit CP. Finally, the transfer device 127 transfers the cooled substrate W to the substrate placement portion P2.

搬送裝置128將載置於基板載置部P3之基板W依序搬送至下段熱處理部102(圖3)之冷卻單元CP及塗佈處理部121(圖2)之下段之任一塗佈處理單元20。其次，搬送裝置128將基板W依序搬送至下段熱處理部102之加熱單元PHP及冷卻單元CP。於下層膜F1包含複數個塗佈膜之情形時，搬送裝置128於塗佈處理單元20與加熱單元PHP及冷卻單元CP之間反覆進行上述基板W之搬送。The conveying device 128 sequentially conveys the substrate W placed on the substrate placement part P3 to the cooling unit CP of the lower heat treatment part 102 (FIG. 3) and any coating treatment unit in the lower part of the coating treatment part 121 (FIG. 2) 20. Next, the conveying device 128 sequentially conveys the substrate W to the heating unit PHP and the cooling unit CP of the lower heat treatment section 102. When the lower film F1 includes a plurality of coating films, the transport device 128 repeatedly transports the substrate W between the coating processing unit 20 and the heating unit PHP and the cooling unit CP.

繼而，搬送裝置128將基板W依序搬送至塗佈處理部121之下段之任一塗佈處理單元20、下段熱處理部102之邊緣曝光部40、加熱單元PHP及冷卻單元CP。其後，搬送裝置128將基板W依序搬送至塗佈處理部121之下段之任一塗佈處理單元20、下段熱處理部102之加熱單元PHP、冷卻單元CP及基板載置部P2。下段之塗佈處理單元20及下段熱處理部102中之基板W之處理內容與上段之塗佈處理單元20及上段熱處理部101中之基板W之處理內容分別相同。Then, the conveying device 128 sequentially conveys the substrate W to any one of the coating processing units 20 at the lower stage of the coating processing section 121, the edge exposure section 40 of the lower heat treatment section 102, the heating unit PHP, and the cooling unit CP. After that, the conveying device 128 sequentially conveys the substrate W to any one of the coating processing units 20 in the lower stage of the coating processing section 121, the heating unit PHP, the cooling unit CP, and the substrate placing section P2 of the lower thermal processing section 102. The processing content of the substrate W in the lower coating processing unit 20 and the lower heat treatment unit 102 is the same as the processing content of the substrate W in the upper coating processing unit 20 and the upper heat treatment unit 101, respectively.

(4)效果 於本實施形態之基板處理裝置100中，感光性抗蝕膜F2以覆蓋下層膜F1之方式形成於基板W之被處理面之整個面而非僅形成於基板W之周緣部。因此，含金屬抗蝕膜F4不會於基板W之周緣部附近***，而以均勻厚度形成於感光性抗蝕膜F2上。又，於將含金屬抗蝕膜F4之外周部去除時，即便於含金屬抗蝕膜F4之金屬成分殘留於感光性抗蝕膜F2之外周部之情形時，該金屬成分亦會連同感光性抗蝕膜F2之外周部一起被去除。(4) Effect In the substrate processing apparatus 100 of this embodiment, the photosensitive resist film F2 is formed on the entire surface of the substrate W to be processed so as to cover the underlying film F1, not only on the peripheral edge of the substrate W. Therefore, the metal-containing resist film F4 does not swell near the peripheral edge of the substrate W, and is formed on the photosensitive resist film F2 with a uniform thickness. In addition, when the outer periphery of the metal-containing resist film F4 is removed, even when the metal component of the metal-containing resist film F4 remains on the outer periphery of the photosensitive resist film F2, the metal component will be combined with the photosensitive film F2. The outer periphery of the resist film F2 is removed together.

因此，即便於搬送裝置115、127、128保持基板W之周緣部之情形時，金屬成分亦不會附著於搬送裝置115、127、128。藉此，可防止產生金屬污染，並且於基板W上形成具有均勻膜厚之含金屬抗蝕膜F4。其結果，可有效利用基板W之周緣部附近之含金屬抗蝕膜F4之區域，而可防止良率下降。Therefore, even when the conveying devices 115, 127, and 128 hold the peripheral edge portion of the substrate W, the metal component does not adhere to the conveying devices 115, 127, and 128. Thereby, the occurrence of metal contamination can be prevented, and the metal-containing resist film F4 having a uniform film thickness can be formed on the substrate W. As a result, the area of the metal-containing resist film F4 near the peripheral edge of the substrate W can be effectively used, and the yield can be prevented from decreasing.

[2]第2實施形態 (1)基板處理裝置 針對第2實施形態之基板處理裝置，對與第1實施形態之基板處理裝置100不同之方面進行說明。圖8係本發明之第2實施形態之基板處理裝置之模式性俯視圖。如圖8所示，基板處理裝置100除導引區塊11及塗佈區塊12以外，進而具備顯影區塊13、洗淨乾燥處理區塊14A及搬入搬出區塊14B。利用洗淨乾燥處理區塊14A及搬入搬出區塊14B構成傳遞區塊14。利用EUV對基板W進行曝光處理之曝光裝置15以與搬入搬出區塊14B相鄰之方式配置。[2] The second embodiment (1) Substrate processing equipment With regard to the substrate processing apparatus of the second embodiment, points different from the substrate processing apparatus 100 of the first embodiment will be described. Fig. 8 is a schematic plan view of a substrate processing apparatus according to a second embodiment of the present invention. As shown in FIG. 8, in addition to the guide block 11 and the coating block 12, the substrate processing apparatus 100 further includes a developing block 13, a washing and drying processing block 14A, and a carry-in and carry-out block 14B. The transfer block 14 is constituted by the washing and drying processing block 14A and the carry-in and carry-out block 14B. The exposure device 15 that uses EUV to expose the substrate W is arranged so as to be adjacent to the carry-in and carry-out block 14B.

顯影區塊13包含顯影處理部131、搬送部132及熱處理部133。顯影處理部131及熱處理部133以隔著搬送部132對向之方式設置。洗淨乾燥處理區塊14A包含洗淨乾燥處理部161、162及搬送部163。洗淨乾燥處理部161、162以隔著搬送部163對向之方式設置。於搬送部163設置搬送裝置141、142。於搬入搬出區塊14B設置搬送裝置143。搬送裝置143將基板W相對於曝光裝置15搬入及搬出。The development block 13 includes a development processing part 131, a conveying part 132 and a heat treatment part 133. The development processing unit 131 and the heat treatment unit 133 are provided so as to face each other across the conveying unit 132. The washing and drying processing block 14A includes washing and drying processing sections 161 and 162 and a conveying section 163. The washing and drying processing units 161 and 162 are provided so as to face each other across the conveying unit 163. The conveying unit 163 is provided with conveying devices 141 and 142. A conveying device 143 is installed in the carry-in and carry-out block 14B. The transfer device 143 transfers the substrate W into and out of the exposure device 15.

圖9係主要表示圖8之塗佈處理部121、顯影處理部131及洗淨乾燥處理部161之基板處理裝置100之模式性側視圖。如圖9所示，於顯影處理部131設置複數個顯影處理單元(自旋顯影機)30。各顯影處理單元30與塗佈處理單元20同樣地具備複數個旋轉吸盤31及複數個護罩32。又，各顯影處理單元30具備噴出顯影液之複數個顯影噴嘴33、使各顯影噴嘴33於一方向移動之移動機構34及邊緣清洗噴嘴35。9 is a schematic side view of the substrate processing apparatus 100 mainly showing the coating processing section 121, the developing processing section 131, and the washing and drying processing section 161 of FIG. 8. As shown in FIG. 9, a plurality of development processing units (spin developing machines) 30 are provided in the development processing section 131. Each development processing unit 30 includes a plurality of rotary chucks 31 and a plurality of guards 32 similarly to the coating processing unit 20. In addition, each development processing unit 30 includes a plurality of development nozzles 33 that eject the developer solution, a moving mechanism 34 that moves each development nozzle 33 in one direction, and an edge cleaning nozzle 35.

於顯影處理單元30中，旋轉吸盤31將基板W以水平姿勢吸附保持並使其旋轉。於該狀態下，一面利用移動機構34使各顯影噴嘴33於一方向移動，一面對各基板W供給顯影液。藉此，進行基板W之顯影處理。又，自邊緣清洗噴嘴35對顯影處理後之基板W之周緣部噴出清洗液。In the development processing unit 30, the rotary chuck 31 sucks and holds the substrate W in a horizontal posture and rotates it. In this state, while each developing nozzle 33 is moved in one direction by the moving mechanism 34, while facing each substrate W, the developing solution is supplied. In this way, the development process of the substrate W is performed. In addition, the edge cleaning nozzle 35 sprays a cleaning liquid on the peripheral edge of the substrate W after the development process.

於洗淨乾燥處理部161設置複數個洗淨乾燥處理單元SD1。於洗淨乾燥處理單元SD1中，進行曝光處理前之基板W之洗淨及乾燥處理。A plurality of washing and drying processing units SD1 are provided in the washing and drying processing section 161. In the washing and drying processing unit SD1, the washing and drying processing of the substrate W before the exposure processing is performed.

圖10係主要表示圖8之熱處理部123、133及洗淨乾燥處理部162之基板處理裝置100之模式性側視圖。如圖10所示，於本實施形態中，於熱處理部123之上段熱處理部101及下段熱處理部102之各者設置2個邊緣曝光部40。於以下說明中，將一邊緣曝光部40稱作邊緣曝光部40a，將另一邊緣曝光部40稱作邊緣曝光部40b。FIG. 10 is a schematic side view of the substrate processing apparatus 100 mainly showing the heat treatment units 123 and 133 and the washing and drying processing unit 162 of FIG. 8. As shown in FIG. 10, in this embodiment, two edge exposure parts 40 are provided in each of the upper heat treatment part 101 and the lower heat treatment part 102 of the heat treatment part 123. In the following description, one edge exposure part 40 is called an edge exposure part 40a, and the other edge exposure part 40 is called an edge exposure part 40b.

邊緣曝光部40a與邊緣曝光部40b除光源42不同這方面以外，具有同一構成。於本實施形態中，邊緣曝光部40a之光源42例如包括高壓水銀燈，出射具有365 nm之峰值波長之光(i光線)作為曝光光。邊緣曝光部40b之光源42例如包括KrF準分子雷射器，出射具有248 nm之峰值波長之光作為曝光光。The edge exposure part 40a and the edge exposure part 40b have the same structure except the point that the light source 42 is different. In this embodiment, the light source 42 of the edge exposure unit 40a includes, for example, a high-pressure mercury lamp, and emits light (i-ray) with a peak wavelength of 365 nm as exposure light. The light source 42 of the edge exposure part 40b includes, for example, a KrF excimer laser, and emits light having a peak wavelength of 248 nm as exposure light.

熱處理部133具有上段熱處理部103及下段熱處理部104。於上段熱處理部103及下段熱處理部104設置複數個加熱單元PHP及冷卻單元CP。於上段熱處理部103及下段熱處理部104，以與洗淨乾燥處理區塊14A相鄰之方式設置之加熱單元PHP係以能夠自洗淨乾燥處理區塊14A搬入基板W之方式構成。The heat treatment part 133 has an upper heat treatment part 103 and a lower heat treatment part 104. A plurality of heating units PHP and cooling units CP are provided in the upper heat treatment section 103 and the lower heat treatment section 104. In the upper heat treatment section 103 and the lower heat treatment section 104, the heating unit PHP provided adjacent to the cleaning and drying treatment block 14A is configured to be able to carry the substrate W from the cleaning and drying treatment block 14A.

於洗淨乾燥處理部162設置複數個洗淨乾燥處理單元SD2。於洗淨乾燥處理單元SD2中，進行曝光處理前之基板W之洗淨及乾燥處理。A plurality of washing and drying processing units SD2 are provided in the washing and drying processing section 162. In the washing and drying processing unit SD2, washing and drying processing of the substrate W before exposure processing is performed.

圖11係主要表示圖8之搬送部122、132、163之側視圖。如圖11所示，搬送部132具有上段搬送室135及下段搬送室136。又，於上段搬送室135設置搬送裝置137，於下段搬送室136設置搬送裝置138。搬送裝置137、138之各者一面保持基板W，一面搬送該基板W。Fig. 11 is a side view mainly showing the conveying parts 122, 132, and 163 of Fig. 8. As shown in FIG. 11, the conveying unit 132 has an upper conveying chamber 135 and a lower conveying chamber 136. In addition, a conveying device 137 is installed in the upper conveying chamber 135, and a conveying device 138 is installed in the lower conveying chamber 136. Each of the conveying devices 137 and 138 conveys the substrate W while holding the substrate W.

於上段搬送室125與上段搬送室135之間設置基板載置部P5、P6，於下段搬送室126與下段搬送室136之間設置基板載置部P7、P8。於上段搬送室135與搬送部163之間設置載置兼緩衝部PB1，於下段搬送室136與搬送部163之間設置載置兼緩衝部PB2。以於搬送部163與搬入搬出區塊14B相鄰之方式設置基板載置部P9及複數個載置兼冷卻部PCP。The substrate placement portions P5 and P6 are provided between the upper transfer chamber 125 and the upper transfer chamber 135, and the substrate placement portions P7 and P8 are provided between the lower transfer chamber 126 and the lower transfer chamber 136. A placing and buffering section PB1 is provided between the upper transfer chamber 135 and the conveying section 163, and a placing and buffering section PB2 is provided between the lower transfer chamber 136 and the conveying section 163. The substrate placing section P9 and the plurality of placing and cooling sections PCP are provided so as to be adjacent to the transport section 163 and the carry-in/out block 14B.

(2)基板處理 圖12～圖14係第2實施形態中之供進行處理之基板W之局部放大縱剖視圖。於本實施形態中，對基板W進行與第1實施形態中之圖5(a)～圖6(b)之處理相同之處理。再者，於本實施形態中，於圖6(a)之處理中，將感光性之第1光阻液用作塗佈液。藉此，於基板W之被處理面形成感光性抗蝕膜F2。感光性抗蝕膜F2例如為藉由具有248 nm之峰值波長之光而感光之KrF抗蝕膜。(2) Substrate processing 12 to 14 are partial enlarged longitudinal cross-sectional views of the substrate W for processing in the second embodiment. In this embodiment, the substrate W is subjected to the same treatment as the treatment in Figs. 5(a) to 6(b) in the first embodiment. Furthermore, in this embodiment, in the process of FIG. 6(a), the photosensitive first photoresist liquid is used as the coating liquid. Thereby, a photosensitive resist film F2 is formed on the processed surface of the substrate W. The photosensitive resist film F2 is, for example, a KrF resist film that is photosensitive by light having a peak wavelength of 248 nm.

又，圖6(b)之處理後，基板W被搬送至塗佈處理部121之任一塗佈處理單元20，藉由旋轉吸盤21被保持及進行旋轉。於該狀態下，如圖12(a)所示，利用塗佈噴嘴23d將感光性之第2光阻液作為塗佈液向基板W之被處理面之大致中央部噴出。藉此，以覆蓋感光性抗蝕膜F2之方式於基板W之被處理面形成感光性抗蝕膜F3作為塗佈膜。感光性抗蝕膜F3例如為藉由具有365 nm之峰值波長之光而感光之i光線抗蝕膜。In addition, after the processing in FIG. 6( b ), the substrate W is transported to any coating processing unit 20 of the coating processing section 121, and is held and rotated by the spin chuck 21. In this state, as shown in FIG. 12(a), the photosensitive second photoresist liquid is ejected as a coating liquid onto the substantially central portion of the processed surface of the substrate W by the application nozzle 23d. Thereby, a photosensitive resist film F3 is formed as a coating film on the processed surface of the substrate W so as to cover the photosensitive resist film F2. The photosensitive resist film F3 is, for example, an i-ray resist film that is sensitized by light having a peak wavelength of 365 nm.

於本實施形態中，感光性抗蝕膜F2為KrF抗蝕膜，感光性抗蝕膜F3為i光線抗蝕膜，但本發明並不限定於此。感光性抗蝕膜F2、F3亦可為其他抗蝕膜，只要具有互不相同之感光波長分佈即可。因此，亦可為，感光性抗蝕膜F2例如為i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之任一種抗蝕膜，感光性抗蝕膜F3為其他抗蝕膜。In this embodiment, the photosensitive resist film F2 is a KrF resist film, and the photosensitive resist film F3 is an i-ray resist film, but the present invention is not limited to this. The photosensitive resist films F2 and F3 may be other resist films as long as they have different photosensitive wavelength distributions. Therefore, the photosensitive resist film F2 may be any one of an i-ray resist film, a krypton fluoride resist film, and an argon fluoride resist film, and the photosensitive resist film F3 may be another resist film. Erosion film.

又，如圖12(b)所示，利用斜面清洗噴嘴26向基板W之斜面部噴出清洗液。藉此，進行斜面清洗處理，而將附著於基板W之斜面部之第2光阻液去除。圖12(b)之清洗液亦可為與圖6(b)相同之清洗液體。斜面清洗處理後，利用加熱單元PHP或冷卻單元CP對基板W進行特定熱處理。Furthermore, as shown in FIG. 12(b), the cleaning liquid is sprayed to the slope surface of the substrate W by the slope cleaning nozzle 26. Thereby, the inclined surface cleaning process is performed, and the second photoresist liquid adhering to the inclined surface portion of the substrate W is removed. The cleaning liquid of Fig. 12(b) can also be the same cleaning liquid as that of Fig. 6(b). After the slope cleaning process, the substrate W is subjected to specific heat treatment by the heating unit PHP or the cooling unit CP.

斜面清洗處理後，基板W被搬送至圖8之熱處理部123，利用加熱單元PHP或冷卻單元CP對基板W進行特定熱處理。熱處理後，基板W於圖10之邊緣曝光部40a，藉由旋轉吸盤41被保持及進行旋轉。於該狀態下，如圖12(c)所示，自光源42對基板W之周緣部之固定寬度之區域照射曝光光。藉此，對基板W上之周緣部中之感光性抗蝕膜F3之固定寬度之區域進行邊緣曝光處理。邊緣曝光處理後，利用冷卻單元CP對基板W進行冷卻處理。After the slope cleaning process, the substrate W is transported to the heat treatment unit 123 in FIG. 8, and the substrate W is subjected to specific heat treatment by the heating unit PHP or the cooling unit CP. After the heat treatment, the substrate W is held and rotated by the rotary chuck 41 in the edge exposure part 40a of FIG. 10. In this state, as shown in FIG. 12(c), the light source 42 irradiates a region of a fixed width on the peripheral edge of the substrate W with exposure light. Thereby, edge exposure processing is performed on the fixed width area of the photosensitive resist film F3 in the peripheral portion on the substrate W. After the edge exposure processing, the substrate W is cooled by the cooling unit CP.

其後，基板W被搬送至塗佈處理部121之任一塗佈處理單元20，藉由旋轉吸盤21被保持及進行旋轉。於該狀態下，如圖13(a)所示，利用塗佈噴嘴23c將含金屬抗蝕液作為塗佈液向基板W之被處理面之大致中央部噴出。藉此，以將感光性抗蝕膜F3覆蓋之方式於基板W之被處理面形成含金屬抗蝕膜F4作為塗佈膜。After that, the substrate W is transported to any coating processing unit 20 of the coating processing section 121, and is held and rotated by the spin chuck 21. In this state, as shown in FIG. 13(a), the metal-containing resist liquid is sprayed as a coating liquid toward the substantially central portion of the processed surface of the substrate W using the coating nozzle 23c. Thereby, a metal-containing resist film F4 is formed as a coating film on the processed surface of the substrate W so as to cover the photosensitive resist film F3.

又，如圖13(b)所示，利用邊緣清洗噴嘴25b對基板W之周緣部噴出清洗液。作為圖13(b)之清洗液，使用使含金屬抗蝕膜F4溶解且不使感光性抗蝕膜F2、F3溶解之液體。具體而言，作為清洗液，使用例如MIBC或MIBK等溶解性較低之有機溶劑。藉此，進行邊緣清洗處理，而將附著於基板W之周緣部之含金屬抗蝕液去除。In addition, as shown in FIG. 13(b), the edge cleaning nozzle 25b sprays the cleaning liquid onto the peripheral edge of the substrate W. As the cleaning liquid of FIG. 13(b), a liquid that dissolves the metal-containing resist film F4 and does not dissolve the photosensitive resist films F2 and F3 is used. Specifically, as the cleaning liquid, organic solvents with low solubility such as MIBC or MIBK are used. By this, the edge cleaning process is performed, and the metal-containing resist attached to the peripheral edge of the substrate W is removed.

進而，如圖13(c)所示，利用邊緣清洗噴嘴25c對基板W之周緣部噴出清洗液。作為圖13(c)之清洗液，使用使感光性抗蝕膜F3溶解且不使含金屬抗蝕膜F4溶解之液體。具體而言，作為清洗液，使用例如包含TMAH或KOH之鹼性水溶液等顯影液。藉此，進行邊緣清洗處理，將殘留於基板W之周緣部之感光性抗蝕膜F3藉由正型顯影去除。Furthermore, as shown in FIG. 13(c), the edge cleaning nozzle 25c sprays the cleaning liquid onto the peripheral edge of the substrate W. As the cleaning liquid of FIG. 13(c), a liquid which dissolves the photosensitive resist film F3 and does not dissolve the metal-containing resist film F4 is used. Specifically, as the cleaning liquid, a developer such as an alkaline aqueous solution containing TMAH or KOH is used. Thereby, the edge cleaning process is performed, and the photosensitive resist film F3 remaining on the peripheral edge of the substrate W is removed by positive development.

上述兩個階段之邊緣清洗處理後，基板W被搬送至熱處理部123，利用加熱單元PHP或冷卻單元CP對基板W進行特定熱處理。其後，基板W被搬送至圖10之邊緣曝光部40b，藉由旋轉吸盤41被保持及進行旋轉。於該狀態下，如圖14(a)所示，自光源42對基板W之周緣部之固定寬度之區域照射曝光光。藉此，對基板W上之周緣部中之感光性抗蝕膜F2之固定寬度之區域進行邊緣曝光處理。邊緣曝光處理後，利用冷卻單元CP對基板W進行冷卻處理。After the above two stages of edge cleaning processing, the substrate W is transported to the heat treatment section 123, and the substrate W is subjected to specific heat treatment by the heating unit PHP or the cooling unit CP. After that, the substrate W is transported to the edge exposure section 40b of FIG. 10, and is held and rotated by the spin chuck 41. In this state, as shown in FIG. 14(a), the light source 42 irradiates the area of the peripheral edge of the substrate W with exposure light. Thereby, edge exposure processing is performed on the fixed width area of the photosensitive resist film F2 in the peripheral portion on the substrate W. After the edge exposure processing, the substrate W is cooled by the cooling unit CP.

其後，基板W被搬送至圖8之曝光裝置15，對基板W進行曝光處理。藉此，使含金屬抗蝕膜F4曝光成特定圖案。利用曝光裝置15進行曝光處理後，基板W被搬送至熱處理部133，利用加熱單元PHP或冷卻單元CP對基板W進行包括曝光後烘烤(PEB)處理之特定熱處理。After that, the substrate W is transported to the exposure device 15 of FIG. 8, and the substrate W is subjected to exposure processing. Thereby, the metal-containing resist film F4 is exposed to a specific pattern. After the exposure process is performed by the exposure device 15, the substrate W is transported to the heat treatment section 133, and the substrate W is subjected to a specific heat treatment including post-exposure bake (PEB) treatment by the heating unit PHP or the cooling unit CP.

PEB處理後，基板W被搬送至圖9之顯影處理部131，藉由旋轉吸盤31被保持及進行旋轉。於該狀態下，如圖14(b)所示，自顯影噴嘴33向基板W之被處理面噴出顯影液。作為顯影液，使用使含金屬抗蝕膜F4溶解且不使感光性抗蝕膜F2、F3溶解之液體。具體而言，作為顯影液，使用例如包含nBA(乙酸正丁酯，n-butyl acetate)或2-庚酮(2-Heptanone)之有機溶劑等顯影液。藉此，進行負型顯影處理，而使含金屬抗蝕膜F4形成為特定圖案。After the PEB processing, the substrate W is transported to the development processing section 131 of FIG. 9, and is held and rotated by the rotary chuck 31. In this state, as shown in FIG. 14(b), the developing nozzle 33 ejects the developer to the processed surface of the substrate W. As the developer, a liquid that dissolves the metal-containing resist film F4 and does not dissolve the photosensitive resist films F2 and F3 is used. Specifically, as the developer, a developer such as an organic solvent containing nBA (n-butyl acetate) or 2-Heptanone (2-Heptanone) is used. Thereby, a negative type development process is performed, and the metal containing resist film F4 is formed in a specific pattern.

顯影處理後，基板W係如圖14(c)所示般利用邊緣清洗噴嘴35向由旋轉吸盤31旋轉之基板W之周緣部噴出清洗液。作為圖14(c)之清洗液，使用使感光性抗蝕膜F2溶解且不使含金屬抗蝕膜F4溶解之液體。具體而言，作為清洗液，使用例如包含TMAH或KOH之鹼性水溶液等顯影液。藉此，進行邊緣清洗處理，將殘留於基板W之周緣部之感光性抗蝕膜F2藉由正型顯影去除。其後，基板W自顯影區塊13被搬送至導引區塊11，基板處理結束。After the development process, the substrate W uses the edge cleaning nozzle 35 to spray the cleaning liquid onto the peripheral edge of the substrate W rotated by the spin chuck 31 as shown in FIG. 14(c). As the cleaning liquid of FIG. 14(c), a liquid which dissolves the photosensitive resist film F2 and does not dissolve the metal-containing resist film F4 is used. Specifically, as the cleaning liquid, a developer such as an alkaline aqueous solution containing TMAH or KOH is used. By this, the edge cleaning process is performed, and the photosensitive resist film F2 remaining on the peripheral edge of the substrate W is removed by positive development. After that, the substrate W is transported from the development block 13 to the guide block 11, and the substrate processing ends.

(3)基板處理裝置之動作 一面參照圖8～圖14，一面對基板處理裝置100之動作進行說明。再者，於以下說明中，將圖9之積層於顯影處理部131之複數個顯影處理單元30中配置於上部之一半顯影處理單元30稱作上段之顯影處理單元30，另一方面，將配置於下部之剩餘一半顯影處理單元30稱作下段之顯影處理單元30。(3) Operation of substrate processing equipment With reference to FIGS. 8 to 14, the operation of the substrate processing apparatus 100 will be described. Furthermore, in the following description, among the plurality of development processing units 30 stacked in the development processing section 131, the development processing unit 30 arranged in the upper half of the development processing unit 30 is referred to as the upper development processing unit 30. On the other hand, the arrangement The remaining half of the development processing unit 30 in the lower part is called the development processing unit 30 of the lower stage.

導引區塊11之各部之動作與第1實施形態中之導引區塊11之各部之動作分別相同。又，對基板W進行圖5(a)～圖6(b)之處理後，進行特定熱處理前之塗佈區塊12之各部之動作與第1實施形態中之塗佈區塊12之各部之動作分別相同。The operation of each part of the guide block 11 is the same as the operation of each part of the guide block 11 in the first embodiment. In addition, after the substrate W is processed in FIGS. 5(a) to 6(b), the operations of the various parts of the coating block 12 before the specific heat treatment are the same as those of the coating block 12 in the first embodiment. The actions are the same.

其後，於塗佈區塊12，搬送裝置127將基板W依序搬送至塗佈處理部121之上段之任一塗佈處理單元20、上段熱處理部101之加熱單元PHP及冷卻單元CP。於該情形時，於塗佈處理單元20中，如圖12(a)所示般於基板W上形成感光性抗蝕膜F3，如圖12(b)所示般對基板W進行斜面清洗處理。又，於加熱單元PHP中，將基板W加熱至90℃～130℃後，於冷卻單元CP中進行冷卻。After that, in the coating block 12, the conveying device 127 sequentially conveys the substrate W to any one of the coating processing units 20 in the upper stage of the coating processing section 121, the heating unit PHP and the cooling unit CP of the upper heat treatment section 101. In this case, in the coating processing unit 20, a photosensitive resist film F3 is formed on the substrate W as shown in FIG. 12(a), and the substrate W is subjected to a slope cleaning process as shown in FIG. 12(b) . In addition, after heating the substrate W to 90°C to 130°C in the heating unit PHP, it is cooled in the cooling unit CP.

其後，搬送裝置127將基板W依序搬送至上段熱處理部101之邊緣曝光部40a及冷卻單元CP。於該情形時，於邊緣曝光部40a，如圖12(c)所示般對基板W進行邊緣曝光處理，於冷卻單元CP中將基板W冷卻。After that, the conveying device 127 sequentially conveys the substrate W to the edge exposure section 40 a of the upper heat treatment section 101 and the cooling unit CP. In this case, in the edge exposure part 40a, the edge exposure process is performed on the board|substrate W as shown in FIG. 12(c), and the board|substrate W is cooled in the cooling unit CP.

其後，搬送裝置127將基板W依序搬送至塗佈處理部121之上段之任一塗佈處理單元20、上段熱處理部101之加熱單元PHP及冷卻單元CP。於該情形時，於塗佈處理單元20中，如圖13(a)所示，於基板W上形成含金屬抗蝕膜F4後，如圖13(b)及圖13(c)所示，對基板W進行兩個階段之邊緣清洗處理。又，於加熱單元PHP中，將基板W加熱至90℃～200℃後，於冷卻單元CP中進行冷卻。After that, the conveying device 127 sequentially conveys the substrate W to any one of the coating processing unit 20 of the upper stage of the coating processing section 121, the heating unit PHP and the cooling unit CP of the upper heat treatment section 101. In this case, in the coating processing unit 20, as shown in FIG. 13(a), after the metal-containing resist film F4 is formed on the substrate W, as shown in FIGS. 13(b) and 13(c), The substrate W is subjected to a two-stage edge cleaning process. In addition, after heating the substrate W to 90 to 200°C in the heating unit PHP, it is cooled in the cooling unit CP.

其後，搬送裝置127將基板W依序搬送至上段熱處理部101之邊緣曝光部40b及冷卻單元CP。於該情形時，於邊緣曝光部40b中，如圖14(a)所示般對基板W進行邊緣曝光處理，於冷卻單元CP中，將基板W冷卻。最後，搬送裝置127將冷卻後之基板W搬送至基板載置部P5(圖11)。又，搬送裝置127將載置於基板載置部P6(圖11)之顯影處理後之基板W搬送至基板載置部P2(圖11)。After that, the conveying device 127 sequentially conveys the substrate W to the edge exposure section 40 b of the upper heat treatment section 101 and the cooling unit CP. In this case, in the edge exposure part 40b, the edge exposure process is performed on the substrate W as shown in FIG. 14(a), and the substrate W is cooled in the cooling unit CP. Finally, the transfer device 127 transfers the cooled substrate W to the substrate placement portion P5 (FIG. 11). In addition, the transport device 127 transports the substrate W after the development process placed on the substrate placement portion P6 (FIG. 11) to the substrate placement portion P2 (FIG. 11 ).

同樣地，對基板W進行圖5(a)～圖6(b)之處理後，搬送裝置128(圖11)將基板W依序搬送至塗佈處理部121之下段之任一塗佈處理單元20、下段熱處理部102(圖10)之加熱單元PHP及冷卻單元CP。其次，搬送裝置128將基板W依序搬送至塗佈處理部121之下段之任一塗佈處理單元20、下段熱處理部102之加熱單元PHP及冷卻單元CP。Similarly, after the substrate W is processed in FIGS. 5(a) to 6(b), the transport device 128 (FIG. 11) sequentially transports the substrate W to any coating processing unit at the lower stage of the coating processing section 121 20. The heating unit PHP and the cooling unit CP of the lower heat treatment section 102 (Figure 10). Next, the conveying device 128 sequentially conveys the substrate W to any one of the coating processing unit 20 at the lower stage of the coating processing section 121, the heating unit PHP and the cooling unit CP of the lower thermal processing section 102.

繼而，搬送裝置128將基板W依序搬送至下段熱處理部102之邊緣曝光部40a、冷卻單元CP、塗佈處理部121之下段之任一塗佈處理單元20、下段熱處理部102之加熱單元PHP及冷卻單元CP。其後，搬送裝置128將基板W依序搬送至下段熱處理部102之邊緣曝光部40b、冷卻單元CP及基板載置部P7(圖11)。又，搬送裝置128將載置於基板載置部P8(圖11)之顯影處理後之基板W搬送至基板載置部P4(圖11)。Then, the conveying device 128 sequentially conveys the substrate W to the edge exposure part 40a of the lower heat treatment part 102, the cooling unit CP, any coating treatment unit 20 of the lower part of the coating treatment part 121, and the heating unit PHP of the lower heat treatment part 102 And the cooling unit CP. After that, the conveying device 128 sequentially conveys the substrate W to the edge exposure section 40b of the lower heat treatment section 102, the cooling unit CP, and the substrate placement section P7 (FIG. 11). In addition, the transport device 128 transports the substrate W after the development process placed on the substrate placement portion P8 (FIG. 11) to the substrate placement portion P4 (FIG. 11 ).

於顯影區塊13，搬送裝置137(圖11)將載置於基板載置部P5之基板W搬送至載置兼緩衝部PB1(圖11)。In the developing block 13, the transfer device 137 (FIG. 11) transfers the substrate W placed on the substrate placement portion P5 to the placement and buffer portion PB1 (FIG. 11).

此處，於與洗淨乾燥處理區塊14A相鄰之上段熱處理部103(圖10)之加熱單元PHP，載置有經曝光裝置15曝光處理後且熱處理(PEB處理)後之基板W。搬送裝置137將載置於加熱單元PHP之基板W依序搬送至冷卻單元CP及上段之任一顯影處理單元30(圖9)。於該情形時，於冷卻單元CP中，將基板W冷卻至適於顯影處理之溫度。又，於顯影處理單元30中，如圖14(b)所示般對基板W進行顯影處理，如圖14(c)所示般對基板W進行邊緣清洗處理。最後，搬送裝置137將顯影及邊緣清洗處理後之基板W搬送至基板載置部P6。Here, in the heating unit PHP of the upper heat treatment section 103 (FIG. 10) adjacent to the cleaning and drying treatment block 14A, the substrate W after exposure treatment by the exposure device 15 and heat treatment (PEB treatment) is placed. The conveying device 137 sequentially conveys the substrate W placed on the heating unit PHP to the cooling unit CP and any development processing unit 30 on the upper stage (FIG. 9 ). In this case, in the cooling unit CP, the substrate W is cooled to a temperature suitable for development processing. Moreover, in the development processing unit 30, the substrate W is developed as shown in FIG. 14(b), and the edge cleaning processing is performed on the substrate W as shown in FIG. 14(c). Finally, the conveying device 137 conveys the substrate W after the development and edge cleaning processes to the substrate placing portion P6.

同樣地，搬送裝置138(圖11)將載置於基板載置部P7之基板W搬送至載置兼緩衝部PB2(圖11)。又，搬送裝置138將載置於與洗淨乾燥處理區塊14A相鄰之下段熱處理部104(圖10)之加熱單元PHP之曝光處理後且熱處理(PEB處理)後之基板W依序搬送至冷卻單元CP、下段之任一顯影處理單元30(圖9)及基板載置部P8。下段之顯影處理單元30及下段熱處理部104中之基板W之處理內容與上段之顯影處理單元30及上段熱處理部103中之基板W之處理內容分別相同。Similarly, the transfer device 138 (FIG. 11) transfers the substrate W placed on the substrate placement portion P7 to the placement and buffer portion PB2 (FIG. 11 ). In addition, the conveying device 138 sequentially conveys the substrates W after the exposure treatment and the heat treatment (PEB treatment) of the heating unit PHP placed in the lower heat treatment section 104 (FIG. 10) adjacent to the cleaning and drying treatment block 14A to The cooling unit CP, any one of the development processing units 30 (FIG. 9) in the lower stage, and the substrate placing portion P8. The processing contents of the substrate W in the development processing unit 30 and the lower heat treatment section 104 in the lower stage are the same as the processing contents of the substrate W in the development processing unit 30 and the upper heat treatment section 103 in the upper stage, respectively.

於洗淨乾燥處理區塊14A，搬送裝置141(圖8)將載置於載置兼緩衝部PB1、PB2(圖11)之基板W搬送至洗淨乾燥處理部161之洗淨乾燥處理單元SD1(圖9)。繼而，搬送裝置141將基板W自洗淨乾燥處理單元SD1搬送至載置兼冷卻部PCP(圖11)。於該情形時，於洗淨乾燥處理單元SD1中，進行基板W之洗淨及乾燥處理後，於載置兼冷卻部PCP中，將基板W冷卻至適於曝光裝置15(圖8)中之曝光處理之溫度。In the washing and drying processing block 14A, the transport device 141 (Figure 8) transports the substrate W placed on the placement and buffering parts PB1 and PB2 (Figure 11) to the cleaning and drying processing unit SD1 of the cleaning and drying processing part 161 (Figure 9). Then, the conveying device 141 conveys the substrate W from the washing and drying processing unit SD1 to the placing and cooling unit PCP (FIG. 11 ). In this case, after washing and drying the substrate W in the washing and drying processing unit SD1, the substrate W is cooled in the placing and cooling part PCP to a temperature suitable for the exposure device 15 (FIG. 8) The temperature of the exposure treatment.

搬送裝置142(圖8)將載置於基板載置部P9之曝光處理後之基板W搬送至洗淨乾燥處理部162之洗淨乾燥處理單元SD2(圖10)。又，搬送裝置142將洗淨及乾燥處理後之基板W自洗淨乾燥處理單元SD2搬送至上段熱處理部103之加熱單元PHP或下段熱處理部104之加熱單元PHP。於該加熱單元PHP中，將基板W加熱至100℃～200℃，藉此對基板W進行PEB處理。The conveying device 142 (FIG. 8) conveys the substrate W after the exposure processing placed on the substrate placing portion P9 to the cleaning and drying processing unit SD2 of the cleaning and drying processing portion 162 (FIG. 10 ). In addition, the conveying device 142 conveys the substrate W after washing and drying from the washing and drying processing unit SD2 to the heating unit PHP of the upper heat treatment unit 103 or the heating unit PHP of the lower heat treatment unit 104. In the heating unit PHP, the substrate W is heated to 100° C. to 200° C., thereby performing PEB processing on the substrate W.

於搬入搬出區塊14B，搬送裝置143(圖8)將載置於載置兼冷卻部PCP之曝光處理前之基板W搬送至曝光裝置15。又，搬送裝置143自曝光裝置15取出曝光處理後之基板W，並將該基板W搬送至基板載置部P9。In the carry-in and carry-out block 14B, the transport device 143 (FIG. 8) transports the substrate W placed on the placement and cooling part PCP before the exposure processing to the exposure device 15. In addition, the transfer device 143 takes out the substrate W after the exposure processing from the exposure device 15 and transfers the substrate W to the substrate placement portion P9.

(4)效果 於本實施形態之基板處理裝置100中，感光性抗蝕膜F2以覆蓋下層膜F1之方式形成於基板W之被處理面之整個面而非僅形成於基板W之周緣部，感光性抗蝕膜F3形成於感光性抗蝕膜F2上。因此，含金屬抗蝕膜F4不會於基板W之周緣部附近***，而以均勻厚度形成於感光性抗蝕膜F3上。(4) Effect In the substrate processing apparatus 100 of this embodiment, the photosensitive resist film F2 is formed on the entire surface of the processed surface of the substrate W so as to cover the underlying film F1, not only on the periphery of the substrate W. The film F3 is formed on the photosensitive resist film F2. Therefore, the metal-containing resist film F4 does not swell near the periphery of the substrate W, but is formed on the photosensitive resist film F3 with a uniform thickness.

又，於將含金屬抗蝕膜F4之外周部去除時，即便於含金屬抗蝕膜F4之金屬成分殘留於感光性抗蝕膜F3之外周部之情形時，該金屬成分亦會連同感光性抗蝕膜F3之外周部一起被去除。進而，於使含金屬抗蝕膜F4顯影時，即便於含金屬抗蝕膜F4之金屬成分殘留於感光性抗蝕膜F2之外周部之情形時，該金屬成分亦會連同感光性抗蝕膜F2之外周部一起被去除。In addition, when the outer periphery of the metal-containing resist film F4 is removed, even if the metal component of the metal-containing resist film F4 remains on the outer periphery of the photosensitive resist film F3, the metal component will be combined with the photosensitive film F3. The outer periphery of the resist film F3 is removed together. Furthermore, when the metal-containing resist film F4 is developed, even if the metal component of the metal-containing resist film F4 remains on the outer periphery of the photosensitive resist film F2, the metal component will be combined with the photosensitive resist film. The outer periphery of F2 is removed together.

因此，即便於搬送裝置115、127、128、137、138、141～143保持基板W之周緣部之情形時，金屬成分亦不會附著於搬送裝置115、127、128，137、138、141～143。藉此，可防止產生金屬污染，並且於基板W上形成具有均勻膜厚之含金屬抗蝕膜F4。其結果，可有效利用基板W之周緣部附近之含金屬抗蝕膜F4之區域，而可防止良率下降。Therefore, even when the conveying devices 115, 127, 128, 137, 138, 141 to 143 hold the peripheral portion of the substrate W, the metal component does not adhere to the conveying devices 115, 127, 128, 137, 138, 141 to 143. Thereby, the occurrence of metal contamination can be prevented, and the metal-containing resist film F4 having a uniform film thickness can be formed on the substrate W. As a result, the area of the metal-containing resist film F4 near the peripheral edge of the substrate W can be effectively used, and the yield can be prevented from decreasing.

[3]其他實施形態 (1)於上述實施形態中，將未處理之基板W搬入至基板處理裝置100，利用基板處理裝置100於基板W之被處理面形成下層膜F1，但本發明並不限定於此。亦可將利用其他裝置於被處理面形成有下層膜F1之基板W搬入至基板處理裝置100。於該情形時，不利用基板處理裝置100形成下層膜F1。因此，塗佈處理單元20亦可不含用於形成下層膜F1之塗佈噴嘴23a。[3] Other implementation forms (1) In the above embodiment, the unprocessed substrate W is carried into the substrate processing apparatus 100, and the substrate processing apparatus 100 is used to form the underlayer film F1 on the processed surface of the substrate W, but the present invention is not limited to this. The substrate W on which the underlayer film F1 is formed on the surface to be processed by another apparatus may be carried into the substrate processing apparatus 100. In this case, the substrate processing apparatus 100 is not used to form the underlayer film F1. Therefore, the coating processing unit 20 may not include the coating nozzle 23a for forming the lower layer film F1.

(2)於上述實施形態中，基板處理亦可以其他順序進行。例如，於第1實施形態中，圖6(c)之邊緣曝光處理亦可於圖7(b)之邊緣清洗處理與圖7(c)之邊緣清洗處理之間進行。於第2實施形態中，圖12(c)之邊緣曝光處理亦可於圖13(a)之邊緣清洗處理與圖13(b)之邊緣清洗處理之間進行。(2) In the above embodiment, the substrate processing can also be performed in other order. For example, in the first embodiment, the edge exposure treatment of FIG. 6(c) can also be performed between the edge cleaning treatment of FIG. 7(b) and the edge cleaning treatment of FIG. 7(c). In the second embodiment, the edge exposure process of FIG. 12(c) can also be performed between the edge cleaning process of FIG. 13(a) and the edge cleaning process of FIG. 13(b).

(3)於上述實施形態中，塗佈處理單元20包含複數個塗佈噴嘴23，但本發明並不限定於此。亦可構成為塗佈處理單元20包含單個塗佈噴嘴23且該塗佈噴嘴23可噴出複數種塗佈液。(3) In the above embodiment, the coating processing unit 20 includes a plurality of coating nozzles 23, but the present invention is not limited to this. It may also be configured that the coating processing unit 20 includes a single coating nozzle 23 and the coating nozzle 23 can eject a plurality of coating liquids.

同樣地，於上述實施形態中，塗佈處理單元20包含複數個邊緣清洗噴嘴25，但本發明並不限定於此。亦可構成為塗佈處理單元20包含單個邊緣清洗噴嘴25且該邊緣清洗噴嘴25可噴出複數種清洗液。Similarly, in the above embodiment, the coating processing unit 20 includes a plurality of edge cleaning nozzles 25, but the present invention is not limited to this. It may also be configured that the coating processing unit 20 includes a single edge cleaning nozzle 25 and the edge cleaning nozzle 25 can spray a plurality of cleaning liquids.

(4)於上述實施形態中，於塗佈區塊12將不同種類之處理液(例如有機溶劑及水溶液)用作清洗液。因此，亦可於塗佈區塊12設置用於將包含有機溶劑之清洗液與包含水溶液之清洗液分離回收之機構。(4) In the above embodiment, different types of processing liquids (such as organic solvents and aqueous solutions) are used as cleaning liquids in the coating block 12. Therefore, a mechanism for separating and recovering the cleaning liquid containing an organic solvent and the cleaning liquid containing an aqueous solution may also be provided in the coating block 12.

同樣地，於第2實施形態中，於顯影區塊13將不同種類之處理液用作顯影液及清洗液。因此，亦可於顯影區塊13設置用於將顯影液與清洗液分離回收之機構。於該等情形時，可降低處理液之廢棄成本。Similarly, in the second embodiment, different types of processing liquids are used as the developer and the cleaning liquid in the development block 13. Therefore, it is also possible to provide a mechanism for separating and recovering the developer and the cleaning liquid in the development block 13. Under these circumstances, the disposal cost of the treatment liquid can be reduced.

[4]技術方案之各構成要素與實施形態之各要素之對應關係 以下，對技術方案之各構成要素與實施形態之各要素之對應之例進行說明，但本發明並不限定於下述例。作為技術方案之各構成要素，亦可使用具有技術方案中記載之構成或功能之其他各種要素。[4] Correspondence between each component of the technical plan and each element of the implementation form Hereinafter, an example of the correspondence between each component of the technical solution and each element of the embodiment will be described, but the present invention is not limited to the following examples. As each constituent element of the technical solution, various other elements having the configuration or function described in the technical solution can also be used.

於上述實施形態中，下層膜F1係被處理膜之例，感光性抗蝕膜F2係感光性塗佈膜或第1感光性塗佈膜之例，感光性抗蝕膜F3係第2感光性塗佈膜之例，含金屬抗蝕膜F4係含金屬塗佈液之例。塗佈噴嘴23b係感光性塗佈液供給部或第1感光性塗佈液供給部之例，塗佈噴嘴23c係含金屬塗佈液供給部之例，塗佈噴嘴23d係第2感光性塗佈液供給部之例。In the above embodiment, the underlayer film F1 is an example of the film to be processed, the photosensitive resist film F2 is an example of a photosensitive coating film or a first photosensitive coating film, and the photosensitive resist film F3 is an example of the second photosensitive film. As an example of the coating film, the metal-containing resist film F4 is an example of a metal-containing coating liquid. The coating nozzle 23b is an example of a photosensitive coating liquid supply part or a first photosensitive coating liquid supply part, the coating nozzle 23c is an example of a metal-containing coating liquid supply part, and the coating nozzle 23d is an example of a second photosensitive coating liquid supply part. An example of the liquid supply unit.

邊緣曝光部40係邊緣曝光部之例，邊緣曝光部40a、40b分別為第1及第2邊緣曝光部之例，邊緣清洗噴嘴25b、25c、35分別為第1～第3去除液供給部之例。基板處理裝置100係基板處理裝置之例，曝光裝置15係曝光裝置之例，顯影噴嘴33係顯影液供給部之例。The edge exposure section 40 is an example of the edge exposure section, the edge exposure sections 40a and 40b are examples of the first and second edge exposure sections, respectively, and the edge cleaning nozzles 25b, 25c, and 35 are respectively the first to third removal liquid supply sections. example. The substrate processing apparatus 100 is an example of a substrate processing apparatus, the exposure apparatus 15 is an example of an exposure apparatus, and the developing nozzle 33 is an example of a developer supply part.

11‧‧‧導引區塊 12‧‧‧塗佈區塊 13‧‧‧顯影區塊 14‧‧‧傳遞區塊 14A‧‧‧洗淨乾燥處理區塊 14B‧‧‧搬入搬出區塊 15‧‧‧曝光裝置 20‧‧‧塗佈處理單元 21‧‧‧旋轉吸盤 22‧‧‧護罩 23‧‧‧塗佈噴嘴 23a‧‧‧塗佈噴嘴 23b‧‧‧塗佈噴嘴 23c‧‧‧塗佈噴嘴 23d‧‧‧塗佈噴嘴 24‧‧‧移動機構 25‧‧‧邊緣清洗噴嘴 25a‧‧‧邊緣清洗噴嘴 25b‧‧‧邊緣清洗噴嘴 25c‧‧‧邊緣清洗噴嘴 26‧‧‧斜面清洗噴嘴 30‧‧‧顯影處理單元(自旋顯影機) 31‧‧‧旋轉吸盤 32‧‧‧護罩 33‧‧‧顯影噴嘴 34‧‧‧移動機構 35‧‧‧邊緣清洗噴嘴 40‧‧‧邊緣曝光部 40a‧‧‧邊緣曝光部 40b‧‧‧邊緣曝光部 41‧‧‧旋轉吸盤 42‧‧‧光源 100‧‧‧基板處理裝置 101‧‧‧上段熱處理部 102‧‧‧下段熱處理部 103‧‧‧上段熱處理部 104‧‧‧下段熱處理部 111‧‧‧載具載置部 112‧‧‧搬送部 113‧‧‧載具 114‧‧‧控制部 115‧‧‧搬送裝置 121‧‧‧塗佈處理部 122‧‧‧搬送部 123‧‧‧熱處理部 125‧‧‧上段搬送室 126‧‧‧下段搬送室 127‧‧‧搬送裝置 128‧‧‧搬送裝置 131‧‧‧顯影處理部 132‧‧‧搬送部 133‧‧‧熱處理部 135‧‧‧上段搬送室 136‧‧‧下段搬送室 137‧‧‧搬送裝置 138‧‧‧搬送裝置 141‧‧‧搬送裝置 142‧‧‧搬送裝置 143‧‧‧搬送裝置 161‧‧‧洗淨乾燥處理部 162‧‧‧洗淨乾燥處理部 163‧‧‧搬送部 CP‧‧‧冷卻單元 F1‧‧‧下層膜 F2‧‧‧感光性抗蝕膜 F3‧‧‧感光性抗蝕膜 F4‧‧‧含金屬抗蝕膜 Fa‧‧‧塗佈膜 Fb‧‧‧塗佈膜 Fc‧‧‧塗佈膜 P1‧‧‧基板載置部 P2‧‧‧基板載置部 P3‧‧‧基板載置部 P4‧‧‧基板載置部 P5‧‧‧基板載置部 P6‧‧‧基板載置部 P7‧‧‧基板載置部 P8‧‧‧基板載置部 P9‧‧‧基板載置部 PB1‧‧‧載置兼緩衝部 PB2‧‧‧載置兼緩衝部 PCP‧‧‧載置兼冷卻部 PHP‧‧‧加熱單元 SD1‧‧‧洗淨乾燥處理單元 SD2‧‧‧洗淨乾燥處理單元 W‧‧‧基板11‧‧‧Guide block 12‧‧‧Coating block 13‧‧‧Development block 14‧‧‧Pass block 14A‧‧‧Washing and drying treatment block 14B‧‧‧Move in and out block 15‧‧‧Exposure device 20‧‧‧Coating Processing Unit 21‧‧‧Rotating Suction Cup 22‧‧‧Shield 23‧‧‧Coating nozzle 23a‧‧‧Coating nozzle 23b‧‧‧Coating nozzle 23c‧‧‧Coating nozzle 23d‧‧‧Coating nozzle 24‧‧‧Mobile Organization 25‧‧‧Edge cleaning nozzle 25a‧‧‧Edge cleaning nozzle 25b‧‧‧Edge cleaning nozzle 25c‧‧‧Edge cleaning nozzle 26‧‧‧Slope cleaning nozzle 30‧‧‧Development processing unit (spin developing machine) 31‧‧‧Rotating suction cup 32‧‧‧Shield 33‧‧‧Developing nozzle 34‧‧‧Mobile mechanism 35‧‧‧Edge cleaning nozzle 40‧‧‧Edge Exposure Department 40a‧‧‧Edge Exposure 40b‧‧‧Edge Exposure 41‧‧‧Rotating Suction Cup 42‧‧‧Light source 100‧‧‧Substrate processing equipment 101‧‧‧Upper heat treatment department 102‧‧‧Lower heat treatment department 103‧‧‧Upper section heat treatment department 104‧‧‧Lower heat treatment department 111‧‧‧Vehicle Placement Department 112‧‧‧Transportation Department 113‧‧‧vehicle 114‧‧‧Control Department 115‧‧‧Conveying device 121‧‧‧Coating Processing Department 122‧‧‧Transportation Department 123‧‧‧Heat Treatment Department 125‧‧‧Upper transfer room 126‧‧‧ Lower transfer room 127‧‧‧Conveying device 128‧‧‧Conveying device 131‧‧‧Development processing department 132‧‧‧Transportation Department 133‧‧‧Heat Treatment Department 135‧‧‧Upper transfer room 136‧‧‧ Lower transfer room 137‧‧‧Conveying device 138‧‧‧Conveying device 141‧‧‧Conveying device 142‧‧‧Conveying device 143‧‧‧Conveying device 161‧‧‧Washing and drying treatment section 162‧‧‧Washing and drying treatment section 163‧‧‧Transportation Department CP‧‧‧Cooling Unit F1‧‧‧Underlayer film F2‧‧‧Photosensitive resist film F3‧‧‧Photosensitive resist film F4‧‧‧Metal-containing resist film Fa‧‧‧Coating film Fb‧‧‧Coating film Fc‧‧‧coating film P1‧‧‧Board placement part P2‧‧‧Substrate placement part P3‧‧‧Substrate placement part P4‧‧‧Substrate placement part P5‧‧‧Substrate placement part P6‧‧‧Substrate placement part P7‧‧‧Substrate placement part P8‧‧‧Substrate placement part P9‧‧‧Board placement part PB1‧‧‧Placement and buffer PB2‧‧‧Placement and buffer PCP‧‧‧Placement and cooling part PHP‧‧‧Heating Unit SD1‧‧‧Washing and drying unit SD2‧‧‧Washing and drying unit W‧‧‧Substrate

圖1係本發明之第1實施形態之基板處理裝置之模式性俯視圖。 圖2係主要表示圖1之塗佈處理部之基板處理裝置之模式性側視圖。 圖3係主要表示圖1之熱處理部之基板處理裝置之模式性側視圖。 圖4係主要表示圖1之搬送部之側視圖。 圖5(a)～(d)係供進行處理之基板之局部放大縱剖視圖。 圖6(a)～(c)係供進行處理之基板之局部放大縱剖視圖。 圖7(a)～(c)係供進行處理之基板之局部放大縱剖視圖。 圖8係本發明之第2實施形態之基板處理裝置之模式性俯視圖。 圖9係主要表示圖8之塗佈處理部、顯影處理部及洗淨乾燥處理部之基板處理裝置之模式性側視圖。 圖10係主要表示圖8之熱處理部及洗淨乾燥處理部之基板處理裝置之模式性側視圖。 圖11係主要表示圖8之搬送部之側視圖。 圖12(a)～(c)係第2實施形態中之供進行處理之基板之局部放大縱剖視圖。 圖13(a)～(c)係第2實施形態中之供進行處理之基板之局部放大縱剖視圖。 圖14(a)～(c)係第2實施形態中之供進行處理之基板之局部放大縱剖視圖。Fig. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic side view mainly showing the substrate processing apparatus of the coating processing section of Fig. 1. Fig. 3 is a schematic side view of the substrate processing apparatus mainly showing the heat treatment section of Fig. 1. Fig. 4 is a side view mainly showing the conveying part of Fig. 1. Figures 5(a) to (d) are partial enlarged longitudinal sectional views of a substrate for processing. Figure 6 (a) to (c) are partial enlarged longitudinal cross-sectional views of a substrate for processing. Figures 7(a) to (c) are partial enlarged longitudinal sectional views of a substrate for processing. Fig. 8 is a schematic plan view of a substrate processing apparatus according to a second embodiment of the present invention. FIG. 9 is a schematic side view of the substrate processing apparatus mainly showing the coating processing section, the developing processing section, and the washing and drying processing section of FIG. 8. Fig. 10 is a schematic side view of the substrate processing apparatus mainly showing the heat treatment part and the washing and drying treatment part of Fig. 8. Fig. 11 is a side view mainly showing the conveying section of Fig. 8. 12(a) to (c) are partial enlarged longitudinal cross-sectional views of a substrate for processing in the second embodiment. 13(a) to (c) are partial enlarged longitudinal cross-sectional views of a substrate for processing in the second embodiment. 14(a) to (c) are partial enlarged longitudinal cross-sectional views of a substrate to be processed in the second embodiment.

23‧‧‧塗佈噴嘴 23‧‧‧Coating nozzle

23c‧‧‧塗佈噴嘴 23c‧‧‧Coating nozzle

25‧‧‧邊緣清洗噴嘴 25‧‧‧Edge cleaning nozzle

25b‧‧‧邊緣清洗噴嘴 25b‧‧‧Edge cleaning nozzle

25c‧‧‧邊緣清洗噴嘴 25c‧‧‧Edge cleaning nozzle

F1‧‧‧下層膜 F1‧‧‧Underlayer film

F2‧‧‧感光性抗蝕膜 F2‧‧‧Photosensitive resist film

F4‧‧‧含金屬抗蝕膜 F4‧‧‧Metal-containing resist film

W‧‧‧基板 W‧‧‧Substrate

Claims (13)

一種基板處理裝置，其具備：感光性塗佈液供給部，其藉由對具有形成有被處理膜之被處理面之基板供給感光性塗佈液，而以將上述被處理膜覆蓋之方式於基板之被處理面形成感光性塗佈膜；邊緣曝光部，其將重疊於基板之被處理面之周緣部上之上述感光性塗佈膜之外周部曝光；含金屬塗佈液供給部，其藉由將含有金屬之塗佈液作為含金屬塗佈液供給至上述感光性塗佈膜上，而於上述感光性塗佈膜上形成含金屬塗佈膜；第1去除液供給部，其對上述含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之上述含金屬塗佈膜之外周部去除；及第2去除液供給部，其於上述含金屬塗佈膜之外周部被去除後，對上述感光性塗佈膜供給第2去除液，以將上述感光性塗佈膜之經曝光之外周部去除，上述第1去除液係使上述含金屬塗佈膜溶解且不使上述感光性塗佈膜溶解之液體，且上述第2去除液係使上述感光性塗佈膜溶解且不使上述含金屬塗佈膜溶解之液體。 A substrate processing apparatus includes: a photosensitive coating liquid supply unit that supplies a photosensitive coating liquid to a substrate having a surface to be processed on which a film to be processed is formed, thereby covering the film to be processed A photosensitive coating film is formed on the processed surface of the substrate; an edge exposure part that exposes the outer peripheral part of the photosensitive coating film superimposed on the peripheral part of the processed surface of the substrate; a metal-containing coating liquid supply part, which By supplying a metal-containing coating liquid as a metal-containing coating liquid onto the photosensitive coating film, a metal-containing coating film is formed on the photosensitive coating film; The metal-containing coating film is supplied with a first removing solution to remove the outer peripheral portion of the metal-containing coating film overlapping on the peripheral portion of the processed surface of the substrate; and a second removing solution supply portion is applied to the metal-containing coating After the outer periphery of the cloth film is removed, a second removing solution is supplied to the photosensitive coating film to remove the exposed outer periphery of the photosensitive coating film. The first removing solution is to coat the metal-containing A liquid that dissolves the film and does not dissolve the photosensitive coating film, and the second removing liquid is a liquid that dissolves the photosensitive coating film and does not dissolve the metal-containing coating film. 如請求項1之基板處理裝置，其中上述第1去除液包含有機溶劑，且上述第2去除液包含進行正型顯影之顯影液。 The substrate processing apparatus of claim 1, wherein the first removal liquid contains an organic solvent, and the second removal liquid contains a developer for positive development. 一種基板處理裝置，其係使用將基板曝光之曝光裝置者，且具備：第1感光性塗佈液供給部，其藉由對具有形成有被處理膜之被處理面之基板供給第1感光性塗佈液，而以將上述被處理膜覆蓋之方式於基板之被處理面形成第1感光性塗佈膜；第2感光性塗佈液供給部，其藉由對上述第1感光性塗佈膜上供給感光波長分佈不同於上述第1感光性塗佈液之第2感光性塗佈液，而於上述第1感光性塗佈膜上形成第2感光性塗佈膜；第1邊緣曝光部，其將重疊於基板之被處理面之周緣部上之上述第2感光性塗佈膜之外周部曝光；含金屬塗佈液供給部，其藉由將含有金屬之塗佈液作為含金屬塗佈液供給至上述第2感光性塗佈膜上，而於上述第2感光性塗佈膜上形成含金屬塗佈膜；第1去除液供給部，其對上述含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之上述含金屬塗佈膜之外周部去除；第2去除液供給部，其於上述含金屬塗佈膜之外周部被去除後，對上述第2感光性塗佈膜供給第2去除液，以將上述第2感光性塗佈膜之經曝光之外周部去除；第2邊緣曝光部，其將重疊於基板之被處理面之周緣部之上述第1感光性塗佈膜之外周部曝光；顯影液供給部，其對上述含金屬塗佈膜供給顯影液，以使利用上述曝光裝置曝光成特定圖案之上述含金屬塗佈膜顯影；及第3去除液供給部，其於上述含金屬塗佈膜顯影後，對上述第1感光 性塗佈膜供給第3去除液，以將上述第1感光性塗佈膜之經曝光之外周部去除。 A substrate processing apparatus that uses an exposure device for exposing a substrate, and includes: a first photosensitive coating liquid supply part that supplies the first photosensitive coating liquid to a substrate having a processed surface on which a processed film is formed Coating liquid, and the first photosensitive coating film is formed on the processed surface of the substrate so as to cover the above-mentioned processed film; the second photosensitive coating liquid supply part is applied to the first photosensitive coating A second photosensitive coating liquid having a photosensitive wavelength distribution different from the above-mentioned first photosensitive coating liquid is supplied on the film, and a second photosensitive coating film is formed on the above-mentioned first photosensitive coating film; first edge exposure part , Which exposes the outer peripheral portion of the second photosensitive coating film superimposed on the peripheral portion of the processed surface of the substrate; a metal-containing coating liquid supply part, which uses a metal-containing coating liquid as a metal-containing coating The cloth liquid is supplied to the second photosensitive coating film to form a metal-containing coating film on the second photosensitive coating film; a first removal liquid supply section which supplies the first metal-containing coating film to the metal-containing coating film. Removal liquid to remove the outer periphery of the metal-containing coating film overlapping on the periphery of the processed surface of the substrate; the second removal liquid supply part, which is used to remove the outer periphery of the metal-containing coating film The second photosensitive coating film is supplied with a second removing liquid to remove the exposed outer peripheral portion of the second photosensitive coating film; the second edge exposure portion will overlap the peripheral portion of the processed surface of the substrate Exposure of the outer peripheral portion of the first photosensitive coating film; a developer supply section that supplies a developer to the metal-containing coating film to develop the metal-containing coating film exposed to a specific pattern by the exposure device; And a third removal liquid supply part which, after the development of the metal-containing coating film, irradiates the first photosensitive The third removing liquid is supplied to the flexible coating film to remove the exposed outer peripheral portion of the first photosensitive coating film. 如請求項3之基板處理裝置，其中上述第1去除液係使上述含金屬塗佈膜溶解且不使上述第1及第2感光性塗佈膜溶解之液體，且上述第2去除液係使上述第2感光性塗佈膜溶解且不使上述含金屬塗佈膜溶解之液體，上述第3去除液係使上述第1感光性塗佈膜溶解且不使上述含金屬塗佈膜溶解之液體，上述顯影液係使上述含金屬塗佈膜溶解且不使上述第1及第2感光性塗佈膜溶解之液體。 The substrate processing apparatus of claim 3, wherein the first removing liquid is a liquid that dissolves the metal-containing coating film without dissolving the first and second photosensitive coating films, and the second removing liquid is A liquid that dissolves the second photosensitive coating film without dissolving the metal-containing coating film, and the third removing liquid is a liquid that dissolves the first photosensitive coating film without dissolving the metal-containing coating film The developer is a liquid that dissolves the metal-containing coating film and does not dissolve the first and second photosensitive coating films. 如請求項4之基板處理裝置，其中上述第1去除液包含有機溶劑，且上述第2去除液包含進行正型顯影之顯影液，上述第3去除液包含進行正型顯影之顯影液，上述顯影液包含進行負型顯影之顯影液。 The substrate processing apparatus of claim 4, wherein the first removing liquid contains an organic solvent, and the second removing liquid contains a developer for positive-type development, and the third removing liquid contains a developer for positive-type development. The liquid includes a developer for negative-tone development. 如請求項3至5中任一項之基板處理裝置，其中上述第1感光性塗佈膜包含i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之任一種抗蝕膜，且上述第2感光性塗佈膜包含i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之其他抗蝕膜。 The substrate processing apparatus according to any one of claims 3 to 5, wherein the first photosensitive coating film includes any one of an i-ray resist film, a krypton fluoride resist film, and an argon fluoride resist film The above-mentioned second photosensitive coating film includes other resist films among i-ray resist films, krypton fluoride resist films, and argon fluoride resist films. 一種基板處理方法，其包括如下步驟： 藉由利用感光性塗佈液供給部對具有形成有被處理膜之被處理面之基板供給感光性塗佈液，而以將上述被處理膜覆蓋之方式於基板之被處理面形成感光性塗佈膜；利用邊緣曝光部將重疊於基板之被處理面之周緣部上之上述感光性塗佈膜之外周部曝光；藉由利用含金屬塗佈液供給部將含有金屬之塗佈液作為含金屬塗佈液供給至上述感光性塗佈膜上，而於上述感光性塗佈膜上形成含金屬塗佈膜；利用第1去除液供給部對上述含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之上述含金屬塗佈膜之外周部去除；以及於上述含金屬塗佈膜之外周部被去除後，利用第2去除液供給部對上述感光性塗佈膜供給第2去除液，以將上述感光性塗佈膜之經曝光之外周部去除。 A substrate processing method, which includes the following steps: The photosensitive coating liquid is supplied to the substrate having the processed surface on which the processed film is formed by the photosensitive coating liquid supply unit, and the photosensitive coating is formed on the processed surface of the substrate in such a manner as to cover the processed film. Cloth film; use the edge exposure section to expose the outer periphery of the above-mentioned photosensitive coating film superimposed on the peripheral section of the processed surface of the substrate; use the metal-containing coating liquid supply section to use the metal-containing coating liquid as the containing The metal coating liquid is supplied to the photosensitive coating film to form a metal-containing coating film on the photosensitive coating film; the first removing liquid is supplied to the metal-containing coating film by a first removing liquid supply unit, To remove the outer peripheral portion of the metal-containing coating film overlapping on the peripheral portion of the processed surface of the substrate; and after the outer peripheral portion of the metal-containing coating film is removed, the second removing liquid supply unit is used to treat the photosensitive The second removing liquid is supplied to the coating film to remove the exposed outer peripheral portion of the photosensitive coating film. 如請求項7之基板處理方法，其中供給上述第1去除液之步驟包括供給使上述含金屬塗佈膜溶解且不使上述感光性塗佈膜溶解之液體，且供給上述第2去除液之步驟包括供給使上述感光性塗佈膜溶解且不使上述含金屬塗佈膜溶解之液體。 The substrate processing method of claim 7, wherein the step of supplying the first removing solution includes the step of supplying a liquid that dissolves the metal-containing coating film and does not dissolve the photosensitive coating film, and supplying the second removing solution It includes supplying a liquid that dissolves the photosensitive coating film and does not dissolve the metal-containing coating film. 如請求項8之基板處理方法，其中供給上述第1去除液之步驟包括供給有機溶劑，且供給上述第2去除液之步驟包括藉由供給顯影液進行正型顯影。 The substrate processing method of claim 8, wherein the step of supplying the first removing solution includes supplying an organic solvent, and the step of supplying the second removing solution includes performing positive development by supplying a developing solution. 一種基板處理方法，其係使用將基板曝光之曝光裝置者，且包括如下步驟：藉由利用第1感光性塗佈液供給部對具有形成有被處理膜之被處理面之基板供給第1感光性塗佈液，而以將上述被處理膜覆蓋之方式於基板之被處理面形成第1感光性塗佈膜；藉由利用第2感光性塗佈液供給部對上述第1感光性塗佈膜上供給感光波長分佈不同於上述第1感光性塗佈液之第2感光性塗佈液，而於上述第1感光性塗佈膜上形成第2感光性塗佈膜；利用第1邊緣曝光部將重疊於基板之被處理面之周緣部上之上述第2感光性塗佈膜之外周部曝光；藉由利用含金屬塗佈液供給部將含有金屬之塗佈液作為含金屬塗佈液供給至上述第2感光性塗佈膜上，而於上述第2感光性塗佈膜上形成含金屬塗佈膜；利用第1去除液供給部對上述含金屬塗佈膜供給第1去除液，以將重疊於基板之被處理面之周緣部之上述含金屬塗佈膜之外周部去除；於上述含金屬塗佈膜之外周部被去除後，利用第2去除液供給部對上述第2感光性塗佈膜供給第2去除液，以將上述第2感光性塗佈膜之經曝光之外周部去除；利用第2邊緣曝光部將重疊於基板之被處理面之周緣部之上述第1感光性塗佈膜之外周部曝光；利用顯影液供給部對上述含金屬塗佈膜供給顯影液，以使利用上述曝光裝置曝光成特定圖案之上述含金屬塗佈膜顯影；以及於上述含金屬塗佈膜顯影後，利用第3去除液供給部對上述第1感光 性塗佈膜供給第3去除液，以將上述第1感光性塗佈膜之經曝光之外周部去除。 A substrate processing method that uses an exposure device that exposes a substrate and includes the steps of: supplying a first photosensitive coating liquid to a substrate having a processed surface on which a processed film is formed by using a first photosensitive coating liquid supply unit The first photosensitive coating film is formed on the processed surface of the substrate so as to cover the film to be processed; the first photosensitive coating film is applied by the second photosensitive coating liquid supply part Supply a second photosensitive coating liquid on the film with a different photosensitive wavelength distribution from the first photosensitive coating liquid, and form a second photosensitive coating film on the first photosensitive coating film; use the first edge exposure The part exposes the outer peripheral part of the second photosensitive coating film overlapped on the peripheral part of the processed surface of the substrate; the metal-containing coating liquid is used as the metal-containing coating liquid by using the metal-containing coating liquid supply part Is supplied onto the second photosensitive coating film, and a metal-containing coating film is formed on the second photosensitive coating film; the first removing liquid is supplied to the metal-containing coating film by the first removing liquid supply unit, To remove the outer peripheral portion of the metal-containing coating film overlapping on the peripheral portion of the processed surface of the substrate; after the outer peripheral portion of the metal-containing coating film is removed, the second removing liquid supply portion is used to apply the second light Supply the second removing liquid to the second photosensitive coating film to remove the exposed outer periphery of the second photosensitive coating film; use the second edge exposure section to overlap the first photosensitive film on the periphery of the substrate to be processed Exposure of the outer peripheral portion of the flexible coating film; supplying a developer solution to the metal-containing coating film by the developer supply unit to develop the metal-containing coating film exposed to a specific pattern by the exposure device; and applying the metal-containing coating film to the metal-containing coating film. After the cloth film is developed, use the third removing liquid supply unit to The third removing liquid is supplied to the flexible coating film to remove the exposed outer peripheral portion of the first photosensitive coating film. 如請求項10之基板處理方法，其中供給上述第1去除液之步驟包括供給使上述含金屬塗佈膜溶解且不使上述第1及第2感光性塗佈膜溶解之液體，且供給上述第2去除液之步驟包括供給使上述第2感光性塗佈膜溶解且不使上述含金屬塗佈膜溶解之液體，供給上述顯影液之步驟包括供給使上述含金屬塗佈膜溶解且不使上述第1及第2感光性塗佈膜溶解之液體，供給上述第3去除液之步驟包括供給使上述第1感光性塗佈膜溶解且不使上述含金屬塗佈膜溶解之液體。 The substrate processing method of claim 10, wherein the step of supplying the first removing liquid includes supplying a liquid that dissolves the metal-containing coating film and does not dissolve the first and second photosensitive coating films, and supplying the first 2 The step of removing the liquid includes supplying a liquid that dissolves the second photosensitive coating film without dissolving the metal-containing coating film, and the step of supplying the developer solution includes supplying the liquid that dissolves the metal-containing coating film without causing the The step of supplying the liquid in which the first and second photosensitive coating films are dissolved, and supplying the third removal liquid includes supplying a liquid that dissolves the first photosensitive coating film and does not dissolve the metal-containing coating film. 如請求項11之基板處理方法，其中供給上述第1去除液之步驟包括供給有機溶劑，且供給上述第2去除液之步驟包括藉由供給顯影液進行正型顯影，供給上述顯影液之步驟包括藉由供給顯影液進行負型顯影，供給上述第3去除液之步驟包括藉由供給顯影液進行正型顯影。 The substrate processing method of claim 11, wherein the step of supplying the first removing solution includes supplying an organic solvent, and the step of supplying the second removing solution includes performing positive development by supplying a developing solution, and the step of supplying the developing solution includes The negative-type development is performed by supplying the developer, and the step of supplying the third removing liquid includes the positive-type development by the supply of the developer. 如請求項10至12中任一項之基板處理方法，其中形成上述第1感光性塗佈膜之步驟包括形成i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之任一種抗蝕膜，且形成上述第2感光性塗佈膜之步驟包括形成i光線抗蝕膜、氟化氪抗蝕膜及氟化氬抗蝕膜中之其他抗蝕膜。 The substrate processing method according to any one of claims 10 to 12, wherein the step of forming the first photosensitive coating film includes forming one of an i-ray resist film, a krypton fluoride resist film, and an argon fluoride resist film Any kind of resist film, and the step of forming the second photosensitive coating film includes forming other resist films among i-ray resist films, krypton fluoride resist films, and argon fluoride resist films.
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