TWI708441B - Inspection fixture - Google Patents
Inspection fixture Download PDFInfo
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- TWI708441B TWI708441B TW108139674A TW108139674A TWI708441B TW I708441 B TWI708441 B TW I708441B TW 108139674 A TW108139674 A TW 108139674A TW 108139674 A TW108139674 A TW 108139674A TW I708441 B TWI708441 B TW I708441B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
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- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
本發明提供一種可連接電線的導體部的探針銷。探針銷包括:彈性部,可沿著第一方向進行彈性變形;以及連接部,設置於彈性部的第一方向的一端,可連接電線的導體部。 The invention provides a probe pin which can be connected to a conductor part of an electric wire. The probe pin includes: an elastic part that can be elastically deformed along a first direction; and a connecting part, which is provided at one end of the elastic part in the first direction, and can be connected to a conductor part of an electric wire.
Description
本揭示是有關於一種探針銷以及檢查治具。 This disclosure relates to a probe pin and an inspection jig.
於電子零件模組中,通常於其製造步驟中進行導通檢查及動作特性檢查等。該些檢查藉由使用探針銷,將用於與設置於電子零件模組的本體基板連接的端子與檢查裝置的端子連接來進行。 In electronic component modules, continuity inspections and operating characteristics inspections are usually performed in the manufacturing steps. These inspections are performed by using probe pins to connect the terminals for connection with the main body substrate provided in the electronic component module to the terminals of the inspection device.
作為此種探針銷,有專利文獻1中所記載的探針銷。該探針銷包括:一對接頭,可與電子零件的電極端子及被連接電子零件的電極端子分別接觸;以及蜿蜒部,介於一對接頭間並將一對接頭連接。於所述探針銷中,以如下的方式構成:蜿蜒部沿著將一對接頭連結的排列方向進行伸縮,各接頭沿著所述排列方向進行往返移動。
As such a probe pin, there is a probe pin described in
[現有技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本專利特開2002-134202號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2002-134202
然而,伴隨近年來的檢查裝置及檢查對象物的多樣化,於檢查裝置及檢查對象物中,存在以經由電線的導體部而與探針銷連接的方式構成者。However, with the diversification of inspection apparatuses and inspection objects in recent years, there are inspection apparatuses and inspection objects that are configured to be connected to probe pins via conductor portions of electric wires.
所述探針銷以如下的方式構成:各接頭於排列方向上與電磁零件的電極端子及被連接電子零件的電極端子接觸,藉此將電磁零件與被連接電子零件連接。因此,例如當電磁零件及被連接電子零件的一者或兩者以若不經由電線的導體部則無法與探針銷連接的方式構成時,若使用所述探針銷,則存在無法將電磁零件與被連接電子零件連接的情況。The probe pin is configured in such a way that each connector contacts the electrode terminal of the electromagnetic component and the electrode terminal of the connected electronic component in the arrangement direction, thereby connecting the electromagnetic component and the connected electronic component. Therefore, for example, when one or both of the electromagnetic component and the connected electronic component are configured such that they cannot be connected to the probe pin without passing through the conductor portion of the wire, if the probe pin is used, the electromagnetic component cannot be The connection between the part and the connected electronic part.
本揭示的目的在於提供一種可連接電線的導體部的探針銷以及包括該探針銷的檢查治具。The purpose of the present disclosure is to provide a probe pin that can be connected to a conductor part of an electric wire and an inspection jig including the probe pin.
本揭示的一例的探針銷包括: 彈性部,可沿著第一方向進行彈性變形;以及 連接部,設置於所述彈性部的所述第一方向的一端,可連接電線的導體部。The probe pin of an example of this disclosure includes: The elastic part can be elastically deformed along the first direction; and The connecting part is provided at one end of the elastic part in the first direction and can be connected to the conductor part of the electric wire.
另外,本揭示的一例的檢查治具包括: 所述探針銷;以及 殼體,具有以所述連接部露出至外部的方式***述探針銷的收容部。In addition, the inspection fixture of an example of this disclosure includes: The probe pin; and The housing has a receiving portion for receiving the probe pin so that the connecting portion is exposed to the outside.
根據所述探針銷,包括:彈性部,可沿著第一方向進行彈性變形;及連接部,設置於該彈性部的第一方向的一端並可連接電線的導體部。藉由該連接部,可實現能夠連接電線的導體部的探針銷。According to the probe pin, the probe pin includes: an elastic part that can be elastically deformed along the first direction; and a connecting part provided at one end of the elastic part in the first direction and connectable to the conductor part of the wire. With this connection part, a probe pin that can connect the conductor part of the electric wire can be realized.
根據所述檢查治具,藉由所述探針銷,即便檢查裝置及檢查對象物的一者或兩者以若不經由電線的導體部則無法連接的方式構成,亦可實現能夠連接檢查裝置及檢查對象物的檢查治具。According to the inspection jig, with the probe pin, even if one or both of the inspection device and the inspection target are configured so that they cannot be connected without passing through the conductor portion of the wire, it is possible to realize the connection of the inspection device And the inspection jig of the inspection object.
以下,按照隨附圖式對本揭示的一例進行說明。再者,於以下的說明中,視需要使用表示特定的方向或位置的用語(例如包含「上」、「下」、「右」、「左」的用語),但該些用語的使用是為了使參照圖式的本揭示的理解變得容易,本揭示的技術範圍並不由該些用語的含義來限定。另外,以下的說明本質上只不過是例示,並不意圖限制本揭示、其適用物、或其用途。進而,圖式是示意性的圖,各尺寸的比率等未必與現實者一致。Hereinafter, an example of the present disclosure will be described in accordance with the accompanying drawings. Furthermore, in the following description, terms that indicate a specific direction or position (for example, terms including "up", "down", "right", and "left") are used as necessary, but these terms are used for It is easy to understand the present disclosure with reference to the drawings, and the technical scope of the present disclosure is not limited by the meaning of these terms. In addition, the following description is merely an illustration in nature, and is not intended to limit the present disclosure, its application, or its use. Furthermore, the drawing is a schematic drawing, and the ratio of each size, etc., does not necessarily match the actual one.
(第一實施方式)
例如,如圖1及圖2所示,本揭示的第一實施方式的探針銷10於已收容於殼體100的狀態下使用,並與殼體100一同構成檢查治具1。作為一例,於該檢查治具1收容有多個細長的薄板狀的導電性的探針銷10。(First Embodiment)
For example, as shown in FIGS. 1 and 2, the
如圖1所示,作為一例,殼體100具有大致四角柱狀。如圖2所示,於該殼體100的內部設置有收容部110,所述收容部110可於後述的探針銷10的連接部30已露出至殼體100的外部的狀態下收容探針銷10。各收容部110沿著第一方向(即,Y方向)延長,並且於已收容的探針銷10的板厚方向(即,X方向)上空開間隔來並排配置。於第一實施方式中,包含於已收容的探針銷10的板厚方向上並排配置的四個收容部110的行在與四個收容部110的行的排列方向正交的方向(即,Z方向)上空開間隔而設置有兩行。As shown in FIG. 1, as an example, the
於各收容部110的第一方向的兩端部,分別設置有第一開口部111及第二開口部112。第一開口部111於第一面101開口,所述第一面101為殼體100的在Y方向上相對的一對面的其中一者。探針銷10的連接部30經由該第一開口部111而露出至殼體100的外部。A
另外,於殼體100的內部,設置有端子孔120,所述端子孔120自Y方向上的第一面101的相反側的第二面102起沿著Y方向延長。第二開口部112於該端子孔120的底面121開口。後述的探針銷10的接觸部40經由該第二開口部112而朝端子孔120的內部突出,例如以可接觸已***端子孔120的檢查裝置的連接端子300(參照圖4)的方式配置。In addition, a
如圖3所示,各探針銷10為板狀,且包括:彈性部20,可沿著Y方向(第一方向的一例)進行彈性變形;以及連接部30及接觸部40,分別設置於該彈性部20的Y方向的兩端。各探針銷例如藉由電鑄法來形成,彈性部20、連接部30及接觸部40沿著Y方向串聯地配置且一體地構成。As shown in FIG. 3, each
如圖4所示,彈性部20具有相互空開間隙來配置的多個帶狀彈性片(於第一實施方式中,四個帶狀彈性片)21、帶狀彈性片22、帶狀彈性片23、帶狀彈性片24。如圖4所示,各帶狀彈性片21、帶狀彈性片22、帶狀彈性片23、帶狀彈性片24為細長的帶狀,具有與連接部30及接觸部40分別連接的兩個直線部201、直線部202,以及與兩個直線部201、直線部202連接的一個彎曲部203。作為一例,各帶狀彈性片21、帶狀彈性片22、帶狀彈性片23、帶狀彈性片24具有大致相同的剖面形狀。As shown in FIG. 4, the
如圖4所示,連接部30以可連接電線的導體部200的方式構成。詳細而言,連接部30具有:本體部31,於Y方向上延長;以及一對彈性夾持片32、彈性夾持片33,自該本體部31的Y方向的另一端起沿著第一方向(即,Y方向)延長,並可朝相互分離的方向(即,Z方向)進行彈性變形。本體部31的Y方向的一端與彈性部20連接。各彈性夾持片32、彈性夾持片33在與第一方向正交的第二方向(即,Z方向)上相互空開間隙34來配置。將電線的導體部200***該間隙34,藉此電線的導體部200由各彈性夾持片32、彈性夾持片33夾持。即,連接部30具有可夾持電線的導體部200的一對彈性夾持片32、彈性夾持片33。As shown in FIG. 4, the
另外,連接部30具有於連接部30的板厚方向上貫穿連接部30的大致C字狀的貫穿孔36。間隙34的本體部31側的端部341自板厚方向(即,X方向)觀察,具有大致圓形狀。貫穿孔36環繞該間隙34的本體部31側的端部341來配置。藉由該貫穿孔36,而使各彈性夾持片32、彈性夾持片33的於Z方向上的彈性變形變得容易。In addition, the
如圖4所示,接觸部40具有:本體部41,於Y方向上延長,並且Y方向的一端與彈性部20連接;一對腳部42、腳部43,自該本體部41的Y方向的另一端起於Y方向上延長,並可朝相互分離的方向(即,Z方向)彎曲;以及一對接點部421、接點部431,以可接觸檢查對象物的凸接點的方式配置於一對腳部42、腳部43的前端。於各腳部42、腳部43的相互相向的相向面分別設置有止動部44。各止動部44自各腳部42、腳部43的相向面朝相互接近的方向突出。藉由該止動部44,例如可防止檢查裝置的連接端子300的過度***。As shown in FIG. 4, the
另外,於連接部30及接觸部40分別設置有支持部50。各支持部50自本體部31、本體部41起於Z方向上延長,如圖2所示,當探針銷10已被收容於殼體100的收容部110時,以抵接於收容部110的內周面的方式配置。即,藉由各支持部50來將探針銷10保持於收容部110。In addition, a supporting
根據第一實施方式的探針銷10,包括:彈性部20,可沿著Y方向進行彈性變形;及連接部30,設置於該彈性部20的Y方向的一端並可連接電線的導體部200。藉由該連接部30,可實現能夠連接電線的導體部200的探針銷10。The
於第一實施方式中,連接部30具有一對彈性夾持片32、彈性夾持片33,所述一對彈性夾持片32、彈性夾持片33沿著Y方向延長,並且朝相互分離的方向進行彈性變形,可夾持電線的導體部200。藉由一對彈性夾持片32、彈性夾持片33,可夾持電線的導體部200,因此可實現能夠藉由壓接來連接電線的導體部200的探針銷10。In the first embodiment, the connecting
另外,根據檢查治具1,藉由探針銷10,即便檢查裝置及檢查對象物的一者或兩者以若不經由電線的導體部200則無法連接的方式構成,亦可實現能夠連接檢查裝置及檢查對象物的檢查治具1。In addition, according to the
再者,收容於殼體100的各收容部110的探針銷10並不限定於一個,亦可為多個。例如,如圖5所示,於各收容部110可收容探針銷積層體2,所述探針銷積層體2是由多個探針銷10(於圖5中,三個探針銷10)以相互接觸的狀態於板厚方向上積層,並連接一個電線的導體部200。如此,藉由使用探針銷積層體2,例如與收容保持有一個探針銷10的檢查治具1相比,可獲得能夠流通大的電流的檢查治具1。Moreover, the
另外,如圖6所示,各收容部110例如可於已收容的探針銷10的板厚方向(即,X方向)上空開間隔來並排配置,並且於Z方向上配置成連接部30交替地錯開的千鳥狀。如此,各收容部110可對應於已收容的探針銷10的形狀及大小、或檢查裝置及檢查對象物的連接端子的配置等,變更其形狀、大小及配置。In addition, as shown in FIG. 6, the
檢查治具1只要包括至少一個探針銷10、及於內部收容該探針銷10的殼體100即可。The
(第二實施方式)
本揭示的第二實施方式的探針銷10如圖7~圖10所示,連接部30以具有可藉由焊接來連接電線的導體部200的焊接部35的方式構成,這一方面與第一實施方式不同。於第二實施方式中,對與第一實施方式相同的部分賦予同一參照編號並省略說明,對與第一實施方式不同的方面進行說明。(Second Embodiment)
The
如圖7及圖8所示,於第二實施方式中,檢查治具1包括沿著第一方向(即,Y方向)的剖面為大致L字狀的殼體100。於該殼體100,十五個收容部110於已收容的探針銷10的板厚方向上空開間隔來並排配置成一行。As shown in FIGS. 7 and 8, in the second embodiment, the
如圖10所示,各探針銷10的彈性部20包含相互空開間隔來配置的多個帶狀彈性片(於該實施方式中,兩個帶狀彈性片)25、帶狀彈性片26。各帶狀彈性片25、帶狀彈性片26具有蜿蜒形狀,所述蜿蜒形狀是於Z方向上延長的多個直線帶部28(於第二實施方式中,十個直線帶部28)、及與直線帶部28連接的多個彎曲帶部27(於第二實施方式中,九個彎曲帶部27)沿著Z方向交替地連接而成的形狀,Y方向的兩端的直線帶部28分別與連接部30的本體部31及接觸部40的本體部41連接。As shown in FIG. 10, the
如圖10所示,各探針銷10的連接部30具有:本體部31,於Y方向上延長,並且Y方向的一端與彈性部20連接;以及焊接部35,與該本體部31的Y方向的另一端連接。該焊接部35自探針銷10的板厚方向(即,X方向)觀察,具有大致四角環狀。於第二實施方式中,如圖8所示,各探針銷10的連接部30的焊接部35經由收容部110的第一開口部111而朝殼體100的外部突出。As shown in FIG. 10, the connecting
如圖10所示,各探針銷10的接觸部40具有:本體部41,於Y方向上延長,並且Y方向的一端與彈性部20連接;以及一對接點部421、接點部431,自該本體部41的Y方向的另一端朝Y方向突出。As shown in FIG. 10, the
根據第二實施方式的探針銷10,連接部30具有可藉由焊接來連接電線的導體部200的焊接部35。藉由該焊接部35,可實現能夠藉由焊接來連接電線的導體部200的探針銷10。According to the
再者,焊接部35並不限定於第二實施方式,只要可藉由焊接來連接電線的導體部200,則可採用任意的結構。In addition, the
連接部30並不限定於第一實施方式及第二實施方式,亦可採用能夠連接電線的導體部200的其他結構。The connecting
以上,參照圖式對本揭示的各種實施方式進行了詳細說明,最後對本揭示的各種形態進行說明。再者,於以下的說明中,作為一例,亦添加參照符號來記載。Above, various embodiments of the present disclosure have been described in detail with reference to the drawings, and finally, various forms of the present disclosure have been described. In addition, in the following description, as an example, reference signs are also added and described.
本揭示的第一形態的探針銷10包括:
彈性部20,可沿著第一方向進行彈性變形;以及
連接部30,設置於所述彈性部20的所述第一方向的一端,可連接電線的導體部200。The
根據第一形態的探針銷10,藉由連接部30,可實現能夠連接電線的導體部200的探針銷10。According to the
本揭示的第二形態的探針銷10中,
所述連接部30具有一對彈性夾持片32、彈性夾持片33,所述一對彈性夾持片32、彈性夾持片33沿著所述第一方向延長,並且朝相互分離的方向進行彈性變形,可夾持所述導體部200。In the
根據第二形態的探針銷10,藉由一對彈性夾持片32、彈性夾持片33,可夾持電線的導體部200,因此可實現能夠藉由壓接來連接電線的導體部200的探針銷10。According to the
本揭示的第三形態的探針銷10中,
所述連接部30具有可藉由焊接來連接所述導體部200的焊接部35。In the
根據第三形態的探針銷10,藉由該焊接部35,可實現能夠藉由焊接來連接電線的導體部200的探針銷10。According to the
本揭示的第四形態的檢查治具1包括:
所述形態的探針銷10;以及
殼體100,具有以所述連接部30露出至外部的方式***述探針銷10的收容部110。The
根據第四形態的檢查治具1,藉由探針銷10,即便檢查裝置及檢查對象物的一者或兩者以若不經由電線的導體部200則無法連接的方式構成,亦可實現能夠連接檢查裝置及檢查對象物的檢查治具1。According to the
本揭示的第五形態的檢查治具1中,
所述探針銷10是探針銷積層體2,所述探針銷積層體2是由多個所述探針銷10以相互接觸的狀態於板厚方向上積層,並連接一個所述電線的所述導體部200,且
所述收容部110可***述探針銷積層體2。In the
根據第五形態的檢查治具1,藉由探針銷積層體2,例如與收容保持有一個探針銷10的檢查治具1相比,可獲得能夠流通大的電流的檢查治具1。According to the
本揭示的第六形態的檢查治具1中,
所述探針銷10是多個所述探針銷10,
所述收容部110是分別可收容至少一個所述探針銷10的多個所述收容部110,
所述收容部110的各個於已收容的所述探針銷10的板厚方向上空開間隔來並排配置,並且自所述第一方向觀察,在與所述板厚方向交叉的第二方向上配置成所述連接部30交替地錯開的千鳥狀。In the
再者,藉由將所述各種實施方式或變形例中的任意的實施方式或變形例適宜組合,可取得各自所具有的效果。另外,可進行實施方式彼此的組合、或實施例彼此的組合、或實施方式與實施例的組合,並且亦可進行不同的實施方式或實施例中的特徵彼此的組合。 [產業上之可利用性]Furthermore, by appropriately combining any of the aforementioned various embodiments or modifications, the effects possessed by each can be obtained. In addition, a combination of embodiments, a combination of embodiments, or a combination of embodiments and examples can be performed, and a combination of features in different embodiments or examples can also be performed. [Industrial availability]
本揭示的探針銷例如可應用於如下的檢查治具,所述檢查治具用於相機元件、通用串列匯流排(Universal Serial Bus,USB)元件、或方形扁平無引腳封裝(Quad Flat No-lead Package,QFN)元件及小外形無引腳封裝(Small Outline No-lead Package,SON)元件等半導體的檢查。The probe pin of the present disclosure can be applied to the following inspection jigs, for example, the inspection jigs are used for camera components, universal serial bus (Universal Serial Bus, USB) components, or quad flat no-lead packages (Quad Flat Inspection of semiconductors such as No-lead Package (QFN) components and Small Outline No-lead Package (SON) components.
本揭示的檢查治具例如可應用於如下的檢查裝置,所述檢查裝置用於相機元件、USB元件、或QFN元件及SON元件等半導體的檢查。The inspection jig of the present disclosure can be applied to, for example, an inspection device used for inspection of semiconductors such as camera devices, USB devices, or QFN devices and SON devices.
1:檢查治具
2:探針銷積層體
10:探針銷
20:彈性部
201、202:直線部
203:彎曲部
21、22、23、24:帶狀彈性片
25、26:帶狀彈性片
27:彎曲帶部
28:直線帶部
30:連接部
31:本體部
32、33:彈性夾持片
34:間隙
341:端部
35:焊接部
36:貫穿孔
40:接觸部
41:本體部
42、43:腳部
44:止動部
50:支持部
100:殼體
101:第一面
102:第二面
110:收容部
111:第一開口部
112:第二開口部
120:端子孔
121:底面
200:導體部
300:連接端子
421、431:接點部
X、Y、Z:方向1: Check the fixture
2: Probe pin laminated body
10: Probe pin
20:
圖1是表示本揭示的第一實施方式的檢查治具的立體圖。 圖2是沿著圖1的II-II線的剖面圖。 圖3是表示本揭示的第一實施方式的探針銷的立體圖。 圖4是圖3的探針銷的平面圖。 圖5是表示圖1的檢查治具的第一變形例的平面圖。 圖6是表示圖1的檢查治具的第二變形例的平面圖。 圖7是表示本揭示的第二實施方式的檢查治具的立體圖。 圖8是沿著圖7的VIII-VIII線的剖面圖。 圖9是表示本揭示的第二實施方式的探針銷的立體圖。 圖10是圖9的探針銷的平面圖。Fig. 1 is a perspective view showing an inspection jig according to a first embodiment of the present disclosure. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a perspective view showing the probe pin of the first embodiment of the present disclosure. Fig. 4 is a plan view of the probe pin of Fig. 3. Fig. 5 is a plan view showing a first modification of the inspection jig of Fig. 1. Fig. 6 is a plan view showing a second modification of the inspection jig of Fig. 1. Fig. 7 is a perspective view showing an inspection jig according to a second embodiment of the present disclosure. Fig. 8 is a cross-sectional view taken along the line VIII-VIII in Fig. 7. Fig. 9 is a perspective view showing a probe pin according to a second embodiment of the present disclosure. Fig. 10 is a plan view of the probe pin of Fig. 9.
10:探針銷 10: Probe pin
20:彈性部 20: Elastic part
30:連接部 30: Connection part
40:接觸部 40: Contact
X、Y、Z:方向 X, Y, Z: direction
Claims (4)
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JP2018210797A JP7354534B2 (en) | 2018-11-08 | 2018-11-08 | Probe pins and inspection fixtures |
JP2018-210797 | 2018-11-08 |
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TW202019031A TW202019031A (en) | 2020-05-16 |
TWI708441B true TWI708441B (en) | 2020-10-21 |
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KR (1) | KR102600799B1 (en) |
CN (1) | CN112955754A (en) |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI513114B (en) * | 2011-09-05 | 2015-12-11 | Nidec Read Corp | Connection terminal and manufacturing method thereof |
WO2017169318A1 (en) * | 2016-03-31 | 2017-10-05 | 日新製鋼株式会社 | Automotive terminal |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2790074B2 (en) * | 1995-03-31 | 1998-08-27 | 日本電気株式会社 | Probe device |
JP2002134202A (en) | 2000-10-27 | 2002-05-10 | Otax Co Ltd | Receptacle for electronic parts |
JP2004138405A (en) * | 2002-10-15 | 2004-05-13 | Renesas Technology Corp | Probe for measuring semiconductor device |
WO2008133089A1 (en) * | 2007-04-20 | 2008-11-06 | Nhk Spring Co., Ltd. | Conductive contact unit |
JP4854612B2 (en) * | 2007-07-09 | 2012-01-18 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | Socket adapter |
JP2009052913A (en) * | 2007-08-23 | 2009-03-12 | Yamaichi Electronics Co Ltd | Coaxial contact and coaxial multiconductor connector |
JP2010025844A (en) * | 2008-07-23 | 2010-02-04 | Unitechno Inc | Contact probe and inspection socket |
JP5597108B2 (en) * | 2010-11-29 | 2014-10-01 | 株式会社精研 | Contact inspection jig |
US8970238B2 (en) * | 2011-06-17 | 2015-03-03 | Electro Scientific Industries, Inc. | Probe module with interleaved serpentine test contacts for electronic device testing |
JP5879906B2 (en) * | 2011-10-14 | 2016-03-08 | オムロン株式会社 | Contact and probe using the same |
JP6641772B2 (en) * | 2015-08-07 | 2020-02-05 | オムロン株式会社 | Probe pin and inspection jig equipped with this |
JP2017130421A (en) * | 2016-01-22 | 2017-07-27 | 山一電機株式会社 | Contact terminal, contact support, and connection device including the same |
KR101672826B1 (en) * | 2016-02-03 | 2016-11-07 | 주식회사 프로이천 | Needle type pin board |
JP6740630B2 (en) * | 2016-02-15 | 2020-08-19 | オムロン株式会社 | Probe pin and inspection device using the same |
JP6515877B2 (en) * | 2016-06-17 | 2019-05-22 | オムロン株式会社 | Probe pin |
JP6737002B2 (en) * | 2016-06-17 | 2020-08-05 | オムロン株式会社 | Probe pin |
KR101938387B1 (en) * | 2017-02-16 | 2019-01-14 | (주)에이피텍 | Test pin and test apparatus having the same |
JP6806269B2 (en) * | 2018-01-11 | 2021-01-06 | オムロン株式会社 | Probe pins, inspection jigs, inspection units and inspection equipment |
JP6908133B2 (en) * | 2018-01-11 | 2021-07-21 | オムロン株式会社 | Probe pins, inspection jigs, inspection units and inspection equipment |
-
2018
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-
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI513114B (en) * | 2011-09-05 | 2015-12-11 | Nidec Read Corp | Connection terminal and manufacturing method thereof |
WO2017169318A1 (en) * | 2016-03-31 | 2017-10-05 | 日新製鋼株式会社 | Automotive terminal |
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KR102600799B1 (en) | 2023-11-10 |
JP7354534B2 (en) | 2023-10-03 |
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JP2020076666A (en) | 2020-05-21 |
CN112955754A (en) | 2021-06-11 |
WO2020095679A1 (en) | 2020-05-14 |
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