TWI705092B - 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置 - Google Patents
軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置 Download PDFInfo
- Publication number
- TWI705092B TWI705092B TW107147486A TW107147486A TWI705092B TW I705092 B TWI705092 B TW I705092B TW 107147486 A TW107147486 A TW 107147486A TW 107147486 A TW107147486 A TW 107147486A TW I705092 B TWI705092 B TW I705092B
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- Taiwan
- Prior art keywords
- monomer
- polyimide film
- mol
- diamine
- dianhydride
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170182060A KR102055630B1 (ko) | 2017-12-28 | 2017-12-28 | 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판 |
KR10-2017-0182060 | 2017-12-28 | ||
??10-2017-0182060 | 2017-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201930403A TW201930403A (zh) | 2019-08-01 |
TWI705092B true TWI705092B (zh) | 2020-09-21 |
Family
ID=67067716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107147486A TWI705092B (zh) | 2017-12-28 | 2018-12-27 | 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102055630B1 (ko) |
CN (1) | CN111491988B (ko) |
TW (1) | TWI705092B (ko) |
WO (1) | WO2019132184A1 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102362385B1 (ko) * | 2019-11-13 | 2022-02-15 | 피아이첨단소재 주식회사 | 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법 |
KR102346587B1 (ko) * | 2019-11-13 | 2022-01-05 | 피아이첨단소재 주식회사 | 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 |
CN111154125B (zh) * | 2020-01-16 | 2022-09-27 | 东莞东阳光科研发有限公司 | 一种黑色聚酰亚胺薄膜及其制备方法 |
KR102652586B1 (ko) * | 2021-09-30 | 2024-04-01 | 피아이첨단소재 주식회사 | 기계적 강도 및 내열성이 향상된 폴리이미드 필름 및 이의 제조방법 |
JP2023091730A (ja) * | 2021-12-20 | 2023-06-30 | エスケーマイクロワークス 株式会社 | フィルム、多層電子装備及びフィルムの製造方法 |
CN114573811B (zh) * | 2021-12-29 | 2023-12-22 | 宁波博雅聚力新材料科技有限公司 | 一种酰亚胺浆料、其合成方法以及含有该酰亚胺浆料的组合物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001261822A (ja) * | 2000-03-17 | 2001-09-26 | Hitachi Cable Ltd | ポリイミドおよびその製造方法 |
TW200738449A (en) * | 2006-03-06 | 2007-10-16 | Lg Chemical Ltd | Metallic laminate and method for preparing the same |
KR20120067645A (ko) * | 2010-12-16 | 2012-06-26 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 |
CN103890042A (zh) * | 2011-09-20 | 2014-06-25 | 罗地亚经营管理公司 | 热塑性聚酰亚胺 |
US20170233575A1 (en) * | 2014-06-30 | 2017-08-17 | Kolon Industries, Inc. | High heat-resistant polyamic acid solution and polyimide film |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1149856A (ja) * | 1997-08-04 | 1999-02-23 | Mitsui Chem Inc | ポリイミド共重合体 |
TWI327521B (en) | 2005-07-27 | 2010-07-21 | Lg Chemical Ltd | Metallic laminate and method of manufacturing the same |
KR20070090425A (ko) * | 2006-03-02 | 2007-09-06 | 주식회사 엘지화학 | 금속적층판 및 그의 제조방법 |
-
2017
- 2017-12-28 KR KR1020170182060A patent/KR102055630B1/ko active IP Right Grant
-
2018
- 2018-09-27 CN CN201880081644.4A patent/CN111491988B/zh active Active
- 2018-09-27 WO PCT/KR2018/011398 patent/WO2019132184A1/ko active Application Filing
- 2018-12-27 TW TW107147486A patent/TWI705092B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001261822A (ja) * | 2000-03-17 | 2001-09-26 | Hitachi Cable Ltd | ポリイミドおよびその製造方法 |
TW200738449A (en) * | 2006-03-06 | 2007-10-16 | Lg Chemical Ltd | Metallic laminate and method for preparing the same |
KR20120067645A (ko) * | 2010-12-16 | 2012-06-26 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 |
CN103890042A (zh) * | 2011-09-20 | 2014-06-25 | 罗地亚经营管理公司 | 热塑性聚酰亚胺 |
US20170233575A1 (en) * | 2014-06-30 | 2017-08-17 | Kolon Industries, Inc. | High heat-resistant polyamic acid solution and polyimide film |
Also Published As
Publication number | Publication date |
---|---|
CN111491988A (zh) | 2020-08-04 |
TW201930403A (zh) | 2019-08-01 |
KR102055630B1 (ko) | 2019-12-16 |
WO2019132184A1 (ko) | 2019-07-04 |
KR20190079944A (ko) | 2019-07-08 |
CN111491988B (zh) | 2023-02-17 |
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