TWI705092B - 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置 - Google Patents

軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置 Download PDF

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Publication number
TWI705092B
TWI705092B TW107147486A TW107147486A TWI705092B TW I705092 B TWI705092 B TW I705092B TW 107147486 A TW107147486 A TW 107147486A TW 107147486 A TW107147486 A TW 107147486A TW I705092 B TWI705092 B TW I705092B
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TW
Taiwan
Prior art keywords
monomer
polyimide film
mol
diamine
dianhydride
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TW107147486A
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English (en)
Chinese (zh)
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TW201930403A (zh
Inventor
白承烈
李吉男
林鉉才
Original Assignee
南韓商聚酰亞胺先端材料有限公司
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Publication of TW201930403A publication Critical patent/TW201930403A/zh
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Publication of TWI705092B publication Critical patent/TWI705092B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
TW107147486A 2017-12-28 2018-12-27 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置 TWI705092B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020170182060A KR102055630B1 (ko) 2017-12-28 2017-12-28 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판
KR10-2017-0182060 2017-12-28
??10-2017-0182060 2017-12-28

Publications (2)

Publication Number Publication Date
TW201930403A TW201930403A (zh) 2019-08-01
TWI705092B true TWI705092B (zh) 2020-09-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW107147486A TWI705092B (zh) 2017-12-28 2018-12-27 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置

Country Status (4)

Country Link
KR (1) KR102055630B1 (ko)
CN (1) CN111491988B (ko)
TW (1) TWI705092B (ko)
WO (1) WO2019132184A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102362385B1 (ko) * 2019-11-13 2022-02-15 피아이첨단소재 주식회사 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법
KR102346587B1 (ko) * 2019-11-13 2022-01-05 피아이첨단소재 주식회사 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법
CN111154125B (zh) * 2020-01-16 2022-09-27 东莞东阳光科研发有限公司 一种黑色聚酰亚胺薄膜及其制备方法
KR102652586B1 (ko) * 2021-09-30 2024-04-01 피아이첨단소재 주식회사 기계적 강도 및 내열성이 향상된 폴리이미드 필름 및 이의 제조방법
JP2023091730A (ja) * 2021-12-20 2023-06-30 エスケーマイクロワークス 株式会社 フィルム、多層電子装備及びフィルムの製造方法
CN114573811B (zh) * 2021-12-29 2023-12-22 宁波博雅聚力新材料科技有限公司 一种酰亚胺浆料、其合成方法以及含有该酰亚胺浆料的组合物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261822A (ja) * 2000-03-17 2001-09-26 Hitachi Cable Ltd ポリイミドおよびその製造方法
TW200738449A (en) * 2006-03-06 2007-10-16 Lg Chemical Ltd Metallic laminate and method for preparing the same
KR20120067645A (ko) * 2010-12-16 2012-06-26 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
CN103890042A (zh) * 2011-09-20 2014-06-25 罗地亚经营管理公司 热塑性聚酰亚胺
US20170233575A1 (en) * 2014-06-30 2017-08-17 Kolon Industries, Inc. High heat-resistant polyamic acid solution and polyimide film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1149856A (ja) * 1997-08-04 1999-02-23 Mitsui Chem Inc ポリイミド共重合体
TWI327521B (en) 2005-07-27 2010-07-21 Lg Chemical Ltd Metallic laminate and method of manufacturing the same
KR20070090425A (ko) * 2006-03-02 2007-09-06 주식회사 엘지화학 금속적층판 및 그의 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261822A (ja) * 2000-03-17 2001-09-26 Hitachi Cable Ltd ポリイミドおよびその製造方法
TW200738449A (en) * 2006-03-06 2007-10-16 Lg Chemical Ltd Metallic laminate and method for preparing the same
KR20120067645A (ko) * 2010-12-16 2012-06-26 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
CN103890042A (zh) * 2011-09-20 2014-06-25 罗地亚经营管理公司 热塑性聚酰亚胺
US20170233575A1 (en) * 2014-06-30 2017-08-17 Kolon Industries, Inc. High heat-resistant polyamic acid solution and polyimide film

Also Published As

Publication number Publication date
CN111491988A (zh) 2020-08-04
TW201930403A (zh) 2019-08-01
KR102055630B1 (ko) 2019-12-16
WO2019132184A1 (ko) 2019-07-04
KR20190079944A (ko) 2019-07-08
CN111491988B (zh) 2023-02-17

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