TWI704063B

TWI704063B - Decoration assembly

Info

Publication number: TWI704063B
Application number: TW107136597A
Authority: TW
Inventors: 鄭宗楷; 林修宇
Original assignee: 正美企業股份有限公司
Priority date: 2018-10-17
Filing date: 2018-10-17
Publication date: 2020-09-11
Also published as: TW202015926A

Abstract

A decoration assembly includes a circuit board, a light source, a light guiding plate and a decoration component. The circuit board includes a plate, a first printed circuit, a second printed circuit and two electrically conductive pads. A part of the first printed circuit and a part of the second printed circuit are located on a first surface of the plate, and the other part of the first printed circuit and the other part of the second printed circuit are respectively located in two through holes of the circuit board. The electrically conductive pads are disposed on a second surface of the circuit board and respectively and electrically connected to the first printed circuit and the second printed circuit in the two through holes. The light source is disposed on the first surface of the plate and electrically connected to the first printed circuit and the second printed circuit. The light guiding plate is disposed on the first surface of the plate, and the incident surface of the light guiding surface corresponds to a light-emitting surface of the light source. The decoration component is stacked on a side of the light guiding plate away from the circuit board. The decoration component has a pattern structure, and the pattern structure corresponds to an illuminating surface of the light guiding plate.

Description

裝飾組件Decoration components

本發明係關於一種裝飾組件，特別是一種裝飾件有圖案結構的裝飾組件。The invention relates to a decorative component, particularly a decorative component with a pattern structure.

隨著電子裝置(例如筆記型電腦、平板電腦及智慧型手機)的普及，社會大眾除了追求電子裝置之效能及功能上的增進之外，電子裝置外表亦是社會大眾所關注的重點之一。因此，製造商常於智慧型手機的背蓋上設置圖案，來達到吸引消費者購買電子裝置的目的。一般而言，設置於電子裝置之背蓋上的圖案分成會發光的光學圖案與不發光的油墨圖案。With the popularization of electronic devices (such as notebook computers, tablet computers, and smart phones), the general public is not only pursuing the enhancement of the performance and functions of the electronic devices, the appearance of the electronic devices is also one of the focuses of the public. Therefore, manufacturers often set patterns on the back covers of smart phones to attract consumers to purchase electronic devices. Generally speaking, the patterns provided on the back cover of the electronic device are divided into luminous optical patterns and non-luminous ink patterns.

由於會發光的光學圖案在視覺效果上較不發光的油墨圖案炫麗，故製造商在設計部分電子裝置，如高階機種時，傾向採用具有光學圖案的背蓋。Since luminous optical patterns are less dazzling in terms of visual effects than non-luminous ink patterns, manufacturers tend to use back covers with optical patterns when designing some electronic devices, such as high-end models.

然而，在具光學圖案的背蓋中，電路板外側與內側會分別設置供光源與供電子裝置內部電源電性連接的外導電電路與內導電電路，且外導電電路與內導電電路透過電路板上之電鍍通孔相連接。然而，由於電路板之板厚需保持一定厚度之上，才能夠維持電鍍通孔之電鍍品質，故具電鍍通孔之電路板一般會受到電鍍通孔之製程限制而難以進一步薄化。如此一來，將會影響到電子裝置的薄化的程度。However, in a back cover with an optical pattern, an outer conductive circuit and an inner conductive circuit for electrically connecting the light source and the internal power supply of the electronic device are provided on the outer and inner sides of the circuit board, and the outer conductive circuit and the inner conductive circuit pass through the circuit board. The upper plated through holes are connected. However, since the thickness of the circuit board must be kept above a certain thickness to maintain the plating quality of the plated through holes, the circuit board with plated through holes is generally limited by the process of plated through holes and is difficult to further thin. As a result, it will affect the degree of thinning of the electronic device.

本發明在於提供一種裝飾組件，藉以解決先前技術中具會發光之光學圖案之背蓋不利於薄形化整體電子裝置的問題。The present invention is to provide a decorative component to solve the problem that the back cover with the luminous optical pattern in the prior art is not conducive to the thinning of the overall electronic device.

本發明之一實施例所揭露之一種裝飾組件，適於電性接觸二導電件。裝飾組件包含一線路板、一發光件、一導光板及一裝飾件。線路板包含一板體、一第一印刷電路、一第二印刷電路、一第一導電墊及一第二導電墊。板體具有一第一面、一第二面、至少一第一通孔及至少一第二通孔。第一通孔及第二通孔貫穿板體的第一面及第二面。第一印刷電路及第二印刷電路印刷於版體。第一印刷電路的一部分位於第一面，且第一印刷電路的另一部分位於第一通孔內。第二印刷電路的一部分位於第一面，且第二印刷電路的另一部分位於第二通孔內。第一導電墊及第二導電墊皆設置於第二面，且第一導電墊及第二導電墊分別電性連接位於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路。發光件設置於板體的第一面，且發光件電性連接於第一印刷電路及第二印刷電路。發光件具有一發光面。導光板疊設於板體的第一面，且導光板具有一入光面及一出光面。入光面對應於發光面。裝飾件疊設於導光板遠離線路板之一側。裝飾件具有一圖案結構，且圖案結構對應於導光板的出光面。The decoration element disclosed in an embodiment of the present invention is suitable for electrically contacting two conductive elements. The decoration component includes a circuit board, a light emitting part, a light guide plate and a decoration part. The circuit board includes a board body, a first printed circuit, a second printed circuit, a first conductive pad and a second conductive pad. The board has a first surface, a second surface, at least one first through hole and at least one second through hole. The first through hole and the second through hole penetrate the first surface and the second surface of the board. The first printed circuit and the second printed circuit are printed on the plate body. A part of the first printed circuit is located on the first surface, and another part of the first printed circuit is located in the first through hole. A part of the second printed circuit is located on the first surface, and another part of the second printed circuit is located in the second through hole. The first conductive pad and the second conductive pad are both disposed on the second surface, and the first conductive pad and the second conductive pad are respectively electrically connected to the first printed circuit in the first through hole and the second in the second through hole Printed circuit. The light emitting element is arranged on the first surface of the board, and the light emitting element is electrically connected to the first printed circuit and the second printed circuit. The light emitting element has a light emitting surface. The light guide plate is stacked on the first surface of the board body, and the light guide plate has a light incident surface and a light exit surface. The light incident surface corresponds to the light emitting surface. The decoration piece is stacked on the side of the light guide plate away from the circuit board. The decoration has a pattern structure, and the pattern structure corresponds to the light-emitting surface of the light guide plate.

根據上述實施例所揭露的裝飾組件，由於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路是經由印刷的方式形成，故線路板的板體可為厚度較薄之板材，以利於縮減裝飾組件整體的厚度。因此，當裝飾組件作為電子裝置的背蓋時，可確保整體電子裝置維持薄形化的效果。According to the decoration component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The board is beneficial to reduce the overall thickness of the decorative components. Therefore, when the decorative component is used as the back cover of the electronic device, it can ensure that the overall electronic device maintains the thinning effect.

此外，透過發光件及導光板之設置，可讓發光件所發出的光經由導光板而照射於裝飾件的圖案結構。因此，當裝飾組件作為電子裝置的背蓋時，被照射的圖案結構可增加整體電子裝置的美觀性。In addition, through the arrangement of the light-emitting element and the light guide plate, the light emitted by the light-emitting element can be irradiated on the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component is used as the back cover of the electronic device, the illuminated pattern structure can increase the aesthetics of the overall electronic device.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理，並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

請參閱圖1至圖3。圖1為根據本發明第一實施例所揭露的裝飾組件的立體示意圖。圖2為圖1的分解示意圖。圖3為圖2之線路板沿割面線3-3的剖視示意圖。Please refer to Figure 1 to Figure 3. FIG. 1 is a three-dimensional schematic diagram of a decoration component according to the first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Fig. 3 is a schematic cross-sectional view of the circuit board of Fig. 2 along the cut line 3-3.

本實施例的裝飾組件1例如為智慧型手機的背蓋。裝飾組件1包含一線路板10、一發光件20、一導光板30及一裝飾件40。The decoration component 1 of this embodiment is, for example, the back cover of a smart phone. The decoration component 1 includes a circuit board 10, a light emitting element 20, a light guide plate 30 and a decoration element 40.

線路板10的厚度T介於0.05公釐至0.1公釐之間，且線路板10包含一板體11、一第一印刷電路12、一第二印刷電路13、一第一導電墊14及一第二導電墊15。The thickness T of the circuit board 10 is between 0.05 mm and 0.1 mm, and the circuit board 10 includes a board body 11, a first printed circuit 12, a second printed circuit 13, a first conductive pad 14 and a The second conductive pad 15.

線路板10的板體11具有一第一面111、一第二面112、多個第一通孔113及多個第二通孔114。每一第一通孔113的直徑R1及每一第二通孔114的直徑R2皆介於0.4公釐至2公釐之間，且這些第一通孔113及這些第二通孔114貫穿板體的第一面111及第二面112。The board body 11 of the circuit board 10 has a first surface 111, a second surface 112, a plurality of first through holes 113 and a plurality of second through holes 114. The diameter R1 of each first through hole 113 and the diameter R2 of each second through hole 114 are between 0.4 mm and 2 mm, and the first through holes 113 and the second through holes 114 penetrate the board The first surface 111 and the second surface 112 of the body.

第一印刷電路12印刷於板體11，且部分的第一印刷電路12位於板體11的第一面111，另一部分的第一印刷電路12位於這些第一通孔113內。第二印刷電路13印刷於板體11，且部分的第二印刷電路13位於板體11的第一面111，另一部分的第二印刷電路13位於這些第二通孔114內。詳細來說，位於第一通孔113內的第一印刷電路12例如是沿著環繞第一通孔113的壁面延伸至板體11的第二面112，且位於第一通孔113內的第一印刷電路12覆蓋部分環繞第一通孔113的壁面。位於第二通孔114內的第二印刷電路13例如是沿著環繞第二通孔114的壁面延伸至板體11的第二面112，且位於第二通孔114內的第二印刷電路13覆蓋部分環繞第二通孔114的壁面。第一導電墊14設置於板體11的第二面112，並與位於第一通孔113內且延伸至第二面112的第一印刷電路12電性連接。第二導電墊15設置於板體11的第二面112，並與位於第二通孔114內且延伸至第二面112的第二印刷電路13電性連接。第一導電墊14及第二導電墊15例如用以與一電源之pogo pin接頭(未繪示)或導電彈片電性接觸。The first printed circuit 12 is printed on the board 11, and a part of the first printed circuit 12 is located on the first surface 111 of the board 11, and another part of the first printed circuit 12 is located in the first through holes 113. The second printed circuit 13 is printed on the board 11, and a part of the second printed circuit 13 is located on the first surface 111 of the board 11, and another part of the second printed circuit 13 is located in the second through holes 114. In detail, the first printed circuit 12 located in the first through hole 113, for example, extends along the wall surface surrounding the first through hole 113 to the second surface 112 of the board 11, and is located in the first through hole 113. A printed circuit 12 covers a part of the wall surface surrounding the first through hole 113. The second printed circuit 13 located in the second through hole 114 is, for example, the second printed circuit 13 extending along the wall surrounding the second through hole 114 to the second surface 112 of the board 11 and located in the second through hole 114 The covering part surrounds the wall surface of the second through hole 114. The first conductive pad 14 is disposed on the second surface 112 of the board 11 and is electrically connected to the first printed circuit 12 located in the first through hole 113 and extending to the second surface 112. The second conductive pad 15 is disposed on the second surface 112 of the board 11 and is electrically connected to the second printed circuit 13 located in the second through hole 114 and extending to the second surface 112. The first conductive pad 14 and the second conductive pad 15 are, for example, used to electrically contact a pogo pin (not shown) of a power source or a conductive spring sheet.

在本實施例中，位於第一通孔113內的第一印刷電路12覆蓋部分環繞第一通孔113的壁面之設置，並非用以限定本發明。在其他實施例中，位於第一通孔內的第一印刷電路可覆蓋整個圍繞第一通孔的壁面。同理地，在其他實施例中，位於第二通孔內的第二印刷電路可覆蓋整個圍繞第二通孔的壁面。In this embodiment, the arrangement of the first printed circuit 12 located in the first through hole 113 covering a portion of the wall surface of the first through hole 113 is not intended to limit the present invention. In other embodiments, the first printed circuit located in the first through hole may cover the entire wall surface surrounding the first through hole. Similarly, in other embodiments, the second printed circuit located in the second through hole may cover the entire wall surface surrounding the second through hole.

此外，從圖3中可知，第一印刷電路12並未填滿整個第一通孔113，但並不以此為限。在其他實施例中，第一印刷電路可填滿整個第一通孔。同理地，在其他實施例中，第二印刷電路亦可填滿整個第二通孔。In addition, it can be seen from FIG. 3 that the first printed circuit 12 does not fill the entire first through hole 113, but it is not limited to this. In other embodiments, the first printed circuit may fill the entire first through hole. Similarly, in other embodiments, the second printed circuit can also fill the entire second through hole.

發光件20例如為白光LED燈。發光件20設置於板體11的第一面111，且發光件20電性連接於第一印刷電路12及第二印刷電路13。如此一來，發光件20即透過第一印刷電路12、第二印刷電路13、第一導電墊14及第二導電墊15與電源形成迴路。因此，當第一導電墊14及第二導電墊15電性連接於電源時，發光件20即可發光。The light emitting element 20 is, for example, a white light LED lamp. The light emitting element 20 is disposed on the first surface 111 of the board 11, and the light emitting element 20 is electrically connected to the first printed circuit 12 and the second printed circuit 13. In this way, the light-emitting element 20 forms a loop with the power source through the first printed circuit 12, the second printed circuit 13, the first conductive pad 14 and the second conductive pad 15. Therefore, when the first conductive pad 14 and the second conductive pad 15 are electrically connected to the power source, the light emitting element 20 can emit light.

在本實施例中，多個第一通孔113可讓位於板體11之第一面111的第一印刷電路12與位於第二面112的第一導電墊14之間有多個電性連接之處，以提升位於板體11之第一面111的第一印刷電路12與第一導電墊14之間的電性連接品質。同理地，多個第二通孔114亦可提升位於板體11之第一面111的第二印刷電路13與第二導電墊15之間的電性連接品質。然而，第一通孔113及第二通孔114的數量並非以多個為限。在其他實施例中，第一通孔及第二通孔可皆為一個。In this embodiment, the plurality of first through holes 113 can allow a plurality of electrical properties between the first printed circuit 12 on the first side 111 of the board 11 and the first conductive pad 14 on the second side 112. The connection point is used to improve the electrical connection quality between the first printed circuit 12 on the first surface 111 of the board body 11 and the first conductive pad 14. Similarly, the plurality of second through holes 114 can also improve the electrical connection quality between the second printed circuit 13 and the second conductive pad 15 on the first surface 111 of the board body 11. However, the number of the first through holes 113 and the second through holes 114 is not limited to multiple. In other embodiments, both the first through hole and the second through hole may be one.

此外，本實施例的裝飾組件1更包含一晶片電阻50。晶片電阻50設置於板體11的第一面111，並電性連接第一印刷電路12。晶片電阻50是用來調整通過發光件20的電流，以避免發光件20過載。In addition, the decoration device 1 of this embodiment further includes a chip resistor 50. The chip resistor 50 is disposed on the first surface 111 of the board body 11 and is electrically connected to the first printed circuit 12. The chip resistor 50 is used to adjust the current passing through the light-emitting element 20 to avoid overload of the light-emitting element 20.

接著，請一併參閱圖2及圖4，圖4為圖2的裝飾組件的部分剖視示意圖。Next, please refer to FIGS. 2 and 4 together. FIG. 4 is a partial cross-sectional view of the decoration assembly of FIG. 2.

發光件20具有一發光面21。導光板30疊設於板體11的第一面111，且導光板30具有一入光面31、一出光面32及多個導光結構33。導光板30之入光面31對應於發光件20之發光面21。每一導光結構33的形狀例如為點狀，且這些導光結構33例如是透過印刷的方式印刷於導光板30之出光面32上。The light emitting element 20 has a light emitting surface 21. The light guide plate 30 is stacked on the first surface 111 of the board 11, and the light guide plate 30 has a light incident surface 31, a light output surface 32 and a plurality of light guide structures 33. The light incident surface 31 of the light guide plate 30 corresponds to the light emitting surface 21 of the light emitting element 20. The shape of each light guide structure 33 is, for example, a dot shape, and these light guide structures 33 are printed on the light-emitting surface 32 of the light guide plate 30 through printing, for example.

在本實施例中，導光結構33的數量為多個，且導光結構33的形狀為點狀之設置，並非用以限定本發明。在其他實施例中，導光結構的數量可僅為一個，且此導光結構的形狀可為方格狀。In this embodiment, the number of the light guide structure 33 is multiple, and the shape of the light guide structure 33 is a dot-like arrangement, which is not intended to limit the present invention. In other embodiments, the number of the light guide structure may be only one, and the shape of the light guide structure may be a grid.

裝飾件40包含一基材層41、一遮蔽層42及一透光層43。基材層41例如為透明片，且遮蔽層42設置於基材層41。遮蔽層42具有一遮光部421及一透光部422。遮光部421例如為黑色油墨印刷的部分，且遮光部421為不可透光。透光部422例如為油墨未印刷的部分，且透光部422為可透光。遮光部421及透光部422共同形成一圖案結構423，且圖案結構423顯露於基材層41。透光層43的透光率例如介於20%至50%之間，且透光層43包含一鍍膜部431及一柔光部432。鍍膜部431的顏色例如為銀色，且鍍膜部431設置於遮蔽層42遠離基材層41之一側。柔光部432的顏色例如為白色，且柔光部432設置於鍍膜部431遠離遮蔽層42之一側。柔光部432疊設於導光板30的出光面32，且遮蔽層42之透光部422對應於導光板30的這些導光結構33。The decoration 40 includes a substrate layer 41, a shielding layer 42 and a light-transmitting layer 43. The base layer 41 is, for example, a transparent sheet, and the shielding layer 42 is provided on the base layer 41. The shielding layer 42 has a light shielding portion 421 and a light transmitting portion 422. The light-shielding part 421 is, for example, a part printed with black ink, and the light-shielding part 421 is not light-transmissive. The light-transmitting portion 422 is, for example, a portion not printed by ink, and the light-transmitting portion 422 is light-transmissive. The light shielding portion 421 and the light transmitting portion 422 jointly form a pattern structure 423, and the pattern structure 423 is exposed on the base layer 41. The light transmittance of the light-transmitting layer 43 is, for example, between 20% and 50%, and the light-transmitting layer 43 includes a coating portion 431 and a soft light portion 432. The color of the coating portion 431 is, for example, silver, and the coating portion 431 is disposed on a side of the shielding layer 42 away from the base layer 41. The color of the soft light portion 432 is, for example, white, and the soft light portion 432 is disposed on a side of the coating portion 431 away from the shielding layer 42. The soft light portion 432 is stacked on the light emitting surface 32 of the light guide plate 30, and the light transmission portion 422 of the shielding layer 42 corresponds to the light guide structures 33 of the light guide plate 30.

當發光件20發光時，光會從導光板30的入光面31進入導光板30，接著位於出光面32的這些導光結構33會將光導向柔光部432，以令光進入柔光部432。接著，光會穿透柔光部432、鍍膜部431、遮蔽層42的透光部422及基材層41射出，而讓裝飾件40的圖案結構423受到光的照射。因此，當裝飾組件1作為智慧型手機的背蓋時，受到光照射的圖案結構423可提升智慧型手機之外觀的美觀性。When the light emitting element 20 emits light, the light enters the light guide plate 30 from the light entrance surface 31 of the light guide plate 30, and then the light guide structures 33 on the light exit surface 32 guide the light to the soft light portion 432, so that the light enters the soft light portion 432. Then, the light will penetrate the soft light part 432, the coating part 431, the light transmitting part 422 of the shielding layer 42, and the base material layer 41 to be emitted, so that the pattern structure 423 of the decoration member 40 is irradiated by light. Therefore, when the decorative component 1 is used as the back cover of a smart phone, the pattern structure 423 irradiated by light can improve the appearance of the smart phone.

在本實施例中，柔光部432之設置可遮蔽導光板30的這些導光結構33，以避免這些導光結構33經由遮蔽層42的透光部422顯露於外，而可維持整體裝飾組件1的美觀性。In this embodiment, the arrangement of the soft light portion 432 can shield the light guide structures 33 of the light guide plate 30, so as to prevent the light guide structures 33 from being exposed through the light-transmitting portion 422 of the shielding layer 42, and maintain the overall decoration assembly 1. The aesthetics.

此外，柔光部432可柔化發光件20所發出的光，故可提升觀看者的視覺舒適度。In addition, the soft light portion 432 can soften the light emitted by the light emitting element 20, so that the visual comfort of the viewer can be improved.

柔光部432的顏色與發光件20的顏色並不以皆為白色為限。在其他實施例中，柔光部的顏色與發光件的顏色可為其他顏色，例如皆為藍色。再者，柔光部432的顏色與發光件20的顏色相同之設置，並非用以限定本發明。在其他實施例中，柔光部的顏色與發光件的顏色可不相同。The color of the soft light part 432 and the color of the light emitting element 20 are not limited to both being white. In other embodiments, the color of the soft light portion and the color of the light emitting element may be other colors, for example, both are blue. Furthermore, the arrangement that the color of the soft light portion 432 is the same as the color of the light emitting element 20 is not intended to limit the present invention. In other embodiments, the color of the soft light part and the color of the light-emitting element may be different.

再者，柔光部432疊設於鍍膜部431之設置，可提供鍍膜部431與外界隔絕的效果，以避免鍍膜部431與外界接觸而氧化，而可有效地降低鍍膜部431從遮蔽層42剝落的機率。Furthermore, the arrangement where the soft light portion 432 is superimposed on the coating portion 431 can provide the effect of isolating the coating portion 431 from the outside, so as to prevent the coating portion 431 from contacting the outside and oxidizing, and can effectively reduce the coating portion 431 from the shielding layer 42 Probability of peeling.

另外，鍍膜部431之設置可確保在柔光部432遮蔽這些導光結構33之前提下，維持穿透過鍍膜部431的光的亮度。In addition, the arrangement of the coating portion 431 can ensure that the light guiding structure 33 is lifted down before the light guide structure 33 is shielded by the soft portion 432, and the brightness of the light passing through the coating portion 431 is maintained.

在本實施例中，透光層43同時有鍍膜部431及柔光部432的設置，並非用以限定本發明。在其他實施例中，透光層可僅有鍍膜部，或是透光層僅有柔光部。In this embodiment, the transparent layer 43 is provided with the coating portion 431 and the soft light portion 432 at the same time, which is not intended to limit the present invention. In other embodiments, the light-transmitting layer may only have a coating portion, or the light-transmitting layer may only have a soft light portion.

由於第一通孔113內的第一印刷電路12及第二通孔114內的第二印刷電路13是經由印刷的方式形成，故線路板10的板體11可為厚度較薄之板材，以利於將裝飾組件1整體的厚度縮減至1公釐。因此，當裝飾組件1作為智慧型手機的背蓋時，可確保整體智慧型手機維持薄形化的效果。Since the first printed circuit 12 in the first through hole 113 and the second printed circuit 13 in the second through hole 114 are formed by printing, the board body 11 of the circuit board 10 can be a thinner plate. It is beneficial to reduce the overall thickness of the decoration element 1 to 1 mm. Therefore, when the decorative component 1 is used as the back cover of a smart phone, it can ensure that the overall smart phone maintains the thinning effect.

在前述實施例中，裝飾件40是由基材層41、遮蔽層42及透光層43依序堆疊而成，但並不以此為限。請參閱圖5，圖5為根據本發明第二實施例所揭露的裝飾組件的裝飾件的部分剖視示意圖。In the foregoing embodiment, the decoration member 40 is formed by sequentially stacking the base layer 41, the shielding layer 42, and the light-transmitting layer 43, but it is not limited to this. Please refer to FIG. 5. FIG. 5 is a schematic partial cross-sectional view of the decoration element of the decoration assembly according to the second embodiment of the present invention.

本實施例的裝飾組件1a類似於圖1之裝飾組件1，以下僅針對差異之處進行說明。The decoration component 1a of this embodiment is similar to the decoration component 1 of FIG. 1, and only the differences will be described below.

本實施例的裝飾件40a包含一基材層41a、一轉印層42a、一透光層43a及一遮蔽層44a。轉印層42a例如是透過奈米轉印技術設置於基材層41a，且轉印層42a是例如是透過紫外光硬化。透光層43a包含一鍍膜部431a及一柔光部432a。鍍膜部431a疊設於轉印層42a遠離基材層41a之一側，且遮蔽層44a疊設於鍍膜部431a遠離轉印層42a之一側。柔光部432a設置於遮蔽層44a遠離鍍膜部431a之一側，且柔光部432a疊設於導光板30a的出光面32a。The decoration 40a of this embodiment includes a base material layer 41a, a transfer layer 42a, a light-transmitting layer 43a, and a shielding layer 44a. The transfer layer 42a is disposed on the base material layer 41a by, for example, nano transfer technology, and the transfer layer 42a is cured by, for example, ultraviolet light. The light-transmitting layer 43a includes a coating portion 431a and a soft light portion 432a. The coating portion 431a is stacked on the side of the transfer layer 42a away from the base layer 41a, and the shielding layer 44a is stacked on the side of the coating portion 431a away from the transfer layer 42a. The soft light portion 432a is disposed on a side of the shielding layer 44a away from the coating portion 431a, and the soft light portion 432a is stacked on the light emitting surface 32a of the light guide plate 30a.

在本實施例中，裝飾件40a之轉印層42a可透過奈米轉印及紫外光硬化技術印製而被印製為髮絲紋或卡夢紋等紋路。因此，當光穿透柔光部432a、遮蔽層44a的透光部442a、鍍膜部431a、轉印層42a及基材層41a時，會從裝飾組件1a上光透出之區域觀察到對應之紋路及光澤的效果，使得裝有裝飾組件1a之智慧型手機的美觀性更為提升。In this embodiment, the transfer layer 42a of the decorative element 40a can be printed with a hairline pattern or a card dream pattern through nano transfer printing and UV hardening technology printing. Therefore, when light penetrates the soft light portion 432a, the light-transmitting portion 442a of the shielding layer 44a, the coating portion 431a, the transfer layer 42a, and the base layer 41a, it will be observed from the area where the light passes through the decoration element 1a. The effect of texture and gloss enhances the aesthetics of the smartphone equipped with the decorative component 1a.

根據上述實施例所揭露的裝飾組件，由於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路是經由印刷的方式形成，故線路板的板體可為厚度較薄之板材，以利於縮減裝飾組件的整體厚度。因此，當裝飾組件作為智慧型手機的背蓋時，可確保整體智慧型手機維持薄形化的效果。According to the decoration component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The board is beneficial to reduce the overall thickness of the decorative components. Therefore, when the decorative component is used as the back cover of a smart phone, it can ensure that the overall smart phone maintains the thinning effect.

此外，透過發光件及導光板之設置，可讓發光件所發出的光經由導光板而照射於裝飾件的圖案結構。因此，當裝飾組件作為智慧型手機的背蓋時，被照射的圖案結構可增加智慧型手機的美觀性。In addition, through the arrangement of the light-emitting element and the light guide plate, the light emitted by the light-emitting element can be irradiated on the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component is used as the back cover of a smart phone, the illuminated pattern structure can increase the aesthetics of the smart phone.

雖然本發明以前述之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed in the foregoing preferred embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

1、1a:裝飾組件10:線路板11:板體111:第一面112:第二面113:第一通孔114:第二通孔12:第一印刷電路13:第二印刷電路14:第一導電墊15:第二導電墊20:發光件21:發光面30、30a:導光板31:入光面32、32a:出光面33:導光結構40、40a:裝飾件41、41a:基材層42、44a:遮蔽層42a:轉印層421:遮光部422、442a:透光部423:圖案結構43、43a:透光層431、431a:鍍膜部432、432a:柔光部50:晶片電阻R1、R2:直徑T:厚度1. 1a: decorative component 10: circuit board 11: board body 111: first side 112: second side 113: first through hole 114: second through hole 12: first printed circuit 13: second printed circuit 14: The first conductive pad 15: the second conductive pad 20: the light emitting element 21: the light emitting surface 30, 30a: the light guide plate 31: the light incident surface 32, 32a: the light exit surface 33: the light guide structure 40, 40a: the decorative element 41, 41a: Base material layer 42, 44a: shielding layer 42a: transfer layer 421: light shielding part 422, 442a: light transmitting part 423: pattern structure 43, 43a: light transmitting layer 431, 431a: coating part 432, 432a: soft light part 50 : Chip resistance R1, R2: Diameter T: Thickness

圖1為根據本發明第一實施例所揭露的裝飾組件的立體示意圖。圖2為圖1的分解示意圖。圖3為圖2之線路板沿割面線3-3的剖視示意圖。圖4為圖2的裝飾組件的部分剖視示意圖。圖5為根據本發明第二實施例所揭露的裝飾組件的裝飾件的部分剖視示意圖。FIG. 1 is a three-dimensional schematic diagram of a decoration component according to the first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Fig. 3 is a schematic cross-sectional view of the circuit board of Fig. 2 along the cut line 3-3. Fig. 4 is a schematic partial cross-sectional view of the decoration assembly of Fig. 2. FIG. 5 is a schematic partial cross-sectional view of a decorative element of a decorative component according to a second embodiment of the present invention.

10:線路板 10: circuit board

11:板體 11: Board body

111:第一面 111: The first side

112:第二面 112: second side

113:第一通孔 113: first through hole

114:第二通孔 114: second through hole

12:第一印刷電路 12: The first printed circuit

13:第二印刷電路 13: The second printed circuit

20:發光件 20: luminous parts

30:導光板 30: Light guide plate

32:出光面 32: Glossy surface

33:導光結構 33: Light guide structure

40:裝飾件 40: decorative pieces

421:遮光部 421: Shading part

422:透光部 422: Translucent part

423:圖案結構 423: pattern structure

50:晶片電阻 50: chip resistance

Claims

一種裝飾組件，包含：一線路板，包含一板體、一第一印刷電路、一第二印刷電路、一第一導電墊及一第二導電墊，該板體具有一第一面、一第二面、至少一第一通孔及至少一第二通孔，該至少一第一通孔及該至少一第二通孔貫穿該板體的該第一面及該第二面，該第一印刷電路及該第二印刷電路印刷於該板體，該第一印刷電路的一部分位於該第一面，該第一印刷電路的另一部分位於該至少一第一通孔內，該第二印刷電路的一部分位於該第一面，該第二印刷電路的另一部分位於該至少一第二通孔內，該第一導電墊及該第二導電墊皆設置於該第二面，且該第一導電墊及該第二導電墊分別電性連接位於該至少一第一通孔內的該第一印刷電路及該至少一第二通孔內的該第二印刷電路；一發光件，設置於該板體的該第一面，且該發光件電性連接於該第一印刷電路及該第二印刷電路，該發光件具有一發光面；一導光板，疊設於該板體的該第一面，且該導光板具有一入光面及一出光面，該入光面對應於該發光面；以及一裝飾件，疊設於該導光板遠離該線路板之一側，該裝飾件具有一圖案結構，該圖案結構對應於該導光板的該出光面；其中，該至少一第一通孔及該至少一第二通孔的直徑皆介於0.4公釐至2公釐之間，該線路板的厚度介於0.05公釐至0.1公釐之間。 A decorative component includes: a circuit board, including a board body, a first printed circuit, a second printed circuit, a first conductive pad, and a second conductive pad. The board has a first surface and a second conductive pad. Two sides, at least one first through hole and at least one second through hole, the at least one first through hole and the at least one second through hole penetrate the first and second sides of the board, the first A printed circuit and the second printed circuit are printed on the board, a part of the first printed circuit is located on the first surface, another part of the first printed circuit is located in the at least one first through hole, and the second printed circuit A part of the second printed circuit is located on the first surface, the other part of the second printed circuit is located in the at least one second through hole, the first conductive pad and the second conductive pad are both disposed on the second surface, and the first conductive The pad and the second conductive pad are respectively electrically connected to the first printed circuit in the at least one first through hole and the second printed circuit in the at least one second through hole; a light emitting element is disposed on the board The first surface of the body, and the light-emitting element is electrically connected to the first printed circuit and the second printed circuit, the light-emitting element has a light-emitting surface; a light guide plate stacked on the first surface of the board , And the light guide plate has a light-incident surface and a light-emitting surface, the light-incident surface corresponds to the light-emitting surface; and a decorative element stacked on a side of the light-guide plate away from the circuit board, the decorative element has a pattern Structure, the pattern structure corresponds to the light emitting surface of the light guide plate; wherein the diameters of the at least one first through hole and the at least one second through hole are both between 0.4 mm and 2 mm, the circuit board The thickness is between 0.05 mm and 0.1 mm.

如申請專利範圍第1項所述之裝飾組件，其中該導光板更具有至少一導光結構，該至少一導光結構位於該導光板的該出光面上，且該裝飾件的該圖案結構對應於該至少一導光結構。 According to the decorative component described in claim 1, wherein the light guide plate further has at least one light guide structure, the at least one light guide structure is located on the light emitting surface of the light guide plate, and The pattern structure of the decorative piece corresponds to the at least one light guide structure.

如申請專利範圍第2項所述之裝飾組件，其中該至少一導光結構的數量為多個，且每一該導光結構的形狀為點狀。 According to the decoration device described in item 2 of the scope of patent application, the number of the at least one light guide structure is multiple, and the shape of each light guide structure is dot-shaped.

如申請專利範圍第1項所述之裝飾組件，其中該裝飾件包含一基材層、一遮蔽層及一透光層，該遮蔽層設置於該基材層，該遮蔽層具有一遮光部及一透光部，該遮光部為不可透光，該透光部為可透光，該遮光部及該透光部共同形成該圖案結構，該圖案結構顯露於該基材層，該透光層包含一柔光部，該柔光部設置於該遮蔽層遠離該基材層之一側，且該柔光部疊設於該導光板的該出光面。 According to the decorative element described in claim 1, wherein the decorative element comprises a substrate layer, a shielding layer and a light-transmitting layer, the shielding layer is disposed on the substrate layer, and the shielding layer has a light-shielding portion and A light-transmitting part, the light-shielding part is not light-transmissive, the light-transmitting part is light-transmissive, the light-shielding part and the light-transmitting part jointly form the pattern structure, the pattern structure is exposed on the substrate layer, and the light-transmitting layer It comprises a soft light part, the soft light part is arranged on a side of the shielding layer away from the base material layer, and the soft light part is laminated on the light emitting surface of the light guide plate.

如申請專利範圍第4項所述之裝飾組件，其中該透光層的透光率介於20%至50%之間。 According to the decoration device described in item 4 of the scope of patent application, the light transmittance of the light-transmitting layer is between 20% and 50%.

如申請專利範圍第4項所述之裝飾組件，其中該柔光部的顏色與該發光件的發光顏色相同。 According to the decoration component described in item 4 of the scope of patent application, the color of the soft light part is the same as the light-emitting color of the light-emitting element.

如申請專利範圍第4項所述之裝飾組件，其中該透光層更含一鍍膜部，該鍍膜部設置於該柔光部及該遮蔽層之間。 According to the decoration device described in item 4 of the scope of patent application, the light-transmitting layer further includes a coating part, and the coating part is disposed between the soft light part and the shielding layer.

如申請專利範圍第4項所述之裝飾組件，其中該裝飾件更包含一轉印層，且該透光層更包含一鍍膜部，該轉印層疊設於該基材層，該鍍膜部疊設於該轉印層遠離該基材層之一側，該遮蔽層疊設於該鍍膜部遠離該轉印層之一側，且該柔光部疊設於該遮蔽層遠離該鍍膜部之一側。 The decoration device according to claim 4, wherein the decoration further includes a transfer layer, and the light-transmitting layer further includes a coating portion, the transfer layer is disposed on the substrate layer, and the coating portion is stacked Located on the side of the transfer layer away from the substrate layer, the shielding layer is stacked on the side of the coating part away from the transfer layer, and the soft part is stacked on the side of the shielding layer away from the coating part .

如申請專利範圍第8項所述之裝飾組件，其中該轉印層是透過紫外光固化轉印技術形成。 According to the decorative device described in item 8 of the scope of patent application, the transfer layer is formed by ultraviolet curing transfer technology.

如申請專利範圍第1項所述之裝飾組件，其中該至少一第一通孔及該至少一第二通孔的數量皆為多個，該第一印刷電路的部分位於該些第一通孔內，且該第二印刷電路的部分位於該些第二通孔內。 Such as the decorative component described in item 1 of the scope of patent application, wherein the at least one The numbers of a through hole and the at least one second through hole are both multiple, the part of the first printed circuit is located in the first through holes, and the part of the second printed circuit is located in the second through holes.