TW202015926A - Decoration assembly - Google Patents
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Abstract
Description
本發明係關於一種裝飾組件,特別是一種裝飾件有圖案結構的裝飾組件。The invention relates to a decorative component, in particular to a decorative component having a decorative structure with a pattern structure.
隨著電子裝置(例如筆記型電腦、平板電腦及智慧型手機)的普及,社會大眾除了追求電子裝置之效能及功能上的增進之外,電子裝置外表亦是社會大眾所關注的重點之一。因此,製造商常於智慧型手機的背蓋上設置圖案,來達到吸引消費者購買電子裝置的目的。一般而言,設置於電子裝置之背蓋上的圖案分成會發光的光學圖案與不發光的油墨圖案。With the popularization of electronic devices (such as notebook computers, tablet computers, and smart phones), in addition to the improvement of the performance and functions of electronic devices, the appearance of electronic devices is also one of the focuses of the public. Therefore, manufacturers often set patterns on the back cover of smartphones to attract consumers to purchase electronic devices. Generally speaking, the pattern provided on the back cover of the electronic device is divided into an optical pattern that emits light and an ink pattern that does not emit light.
由於會發光的光學圖案在視覺效果上較不發光的油墨圖案炫麗,故製造商在設計部分電子裝置,如高階機種時,傾向採用具有光學圖案的背蓋。Since the optical pattern that emits light is more visually bright than the ink pattern that does not emit light, manufacturers tend to use a back cover with an optical pattern when designing some electronic devices, such as high-end models.
然而,在具光學圖案的背蓋中,電路板外側與內側會分別設置供光源與供電子裝置內部電源電性連接的外導電電路與內導電電路,且外導電電路與內導電電路透過電路板上之電鍍通孔相連接。然而,由於電路板之板厚需保持一定厚度之上,才能夠維持電鍍通孔之電鍍品質,故具電鍍通孔之電路板一般會受到電鍍通孔之製程限制而難以進一步薄化。如此一來,將會影響到電子裝置的薄化的程度。However, in the back cover with optical patterns, the outer and inner sides of the circuit board are provided with an outer conductive circuit and an inner conductive circuit for electrically connecting the light source and the internal power supply of the power supply device, and the outer conductive circuit and the inner conductive circuit pass through the circuit board The upper plated through holes are connected. However, since the thickness of the circuit board needs to be kept above a certain thickness in order to maintain the plating quality of the plated through holes, circuit boards with plated through holes are generally limited by the manufacturing process of the plated through holes and are difficult to be further thinned. In this way, the degree of thinning of the electronic device will be affected.
本發明在於提供一種裝飾組件,藉以解決先前技術中具會發光之光學圖案之背蓋不利於薄形化整體電子裝置的問題。The present invention is to provide a decorative component to solve the problem that the back cover with the optical pattern that emits light in the prior art is not conducive to thinning the overall electronic device.
本發明之一實施例所揭露之一種裝飾組件,適於電性接觸二導電件。裝飾組件包含一線路板、一發光件、一導光板及一裝飾件。線路板包含一板體、一第一印刷電路、一第二印刷電路、一第一導電墊及一第二導電墊。板體具有一第一面、一第二面、至少一第一通孔及至少一第二通孔。第一通孔及第二通孔貫穿板體的第一面及第二面。第一印刷電路及第二印刷電路印刷於版體。第一印刷電路的一部分位於第一面,且第一印刷電路的另一部分位於第一通孔內。第二印刷電路的一部分位於第一面,且第二印刷電路的另一部分位於第二通孔內。第一導電墊及第二導電墊皆設置於第二面,且第一導電墊及第二導電墊分別電性連接位於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路。發光件設置於板體的第一面,且發光件電性連接於第一印刷電路及第二印刷電路。發光件具有一發光面。導光板疊設於板體的第一面,且導光板具有一入光面及一出光面。入光面對應於發光面。裝飾件疊設於導光板遠離線路板之一側。裝飾件具有一圖案結構,且圖案結構對應於導光板的出光面。A decorative component disclosed in an embodiment of the present invention is suitable for electrically contacting two conductive members. The decoration component includes a circuit board, a light-emitting part, a light guide plate and a decoration part. The circuit board includes a board body, a first printed circuit, a second printed circuit, a first conductive pad and a second conductive pad. The board body has a first surface, a second surface, at least one first through hole and at least one second through hole. The first through hole and the second through hole penetrate the first surface and the second surface of the plate body. The first printed circuit and the second printed circuit are printed on the plate body. A part of the first printed circuit is located on the first surface, and another part of the first printed circuit is located in the first through hole. A part of the second printed circuit is located on the first surface, and another part of the second printed circuit is located in the second through hole. The first conductive pad and the second conductive pad are both disposed on the second surface, and the first conductive pad and the second conductive pad are electrically connected to the first printed circuit in the first through hole and the second in the second through hole, respectively Printed circuit. The light emitting element is disposed on the first surface of the board, and the light emitting element is electrically connected to the first printed circuit and the second printed circuit. The light-emitting element has a light-emitting surface. The light guide plate is stacked on the first surface of the plate body, and the light guide plate has a light incident surface and a light exit surface. The light incident surface corresponds to the light emitting surface. The decoration piece is stacked on one side of the light guide plate away from the circuit board. The decorative part has a pattern structure, and the pattern structure corresponds to the light exit surface of the light guide plate.
根據上述實施例所揭露的裝飾組件,由於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路是經由印刷的方式形成,故線路板的板體可為厚度較薄之板材,以利於縮減裝飾組件整體的厚度。因此,當裝飾組件作為電子裝置的背蓋時,可確保整體電子裝置維持薄形化的效果。According to the decorative component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The plate is used to reduce the thickness of the entire decorative component. Therefore, when the decoration component is used as the back cover of the electronic device, it can ensure that the overall electronic device maintains the effect of thinning.
此外,透過發光件及導光板之設置,可讓發光件所發出的光經由導光板而照射於裝飾件的圖案結構。因此,當裝飾組件作為電子裝置的背蓋時,被照射的圖案結構可增加整體電子裝置的美觀性。In addition, through the arrangement of the light emitting element and the light guide plate, the light emitted by the light emitting element can be irradiated to the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component serves as the back cover of the electronic device, the illuminated pattern structure can increase the aesthetics of the overall electronic device.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.
請參閱圖1至圖3。圖1為根據本發明第一實施例所揭露的裝飾組件的立體示意圖。圖2為圖1的分解示意圖。圖3為圖2之線路板沿割面線3-3的剖視示意圖。Please refer to Figure 1 to Figure 3. FIG. 1 is a schematic perspective view of the decorative component disclosed according to the first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1. FIG. 3 is a schematic cross-sectional view of the circuit board of FIG. 2 along cutting plane line 3-3.
本實施例的裝飾組件1例如為智慧型手機的背蓋。裝飾組件1包含一線路板10、一發光件20、一導光板30及一裝飾件40。The
線路板10的厚度T介於0.05公釐至0.1公釐之間,且線路板10包含一板體11、一第一印刷電路12、一第二印刷電路13、一第一導電墊14及一第二導電墊15。The thickness T of the
線路板10的板體11具有一第一面111、一第二面112、多個第一通孔113及多個第二通孔114。每一第一通孔113的直徑R1及每一第二通孔114的直徑R2皆介於0.4公釐至2公釐之間,且這些第一通孔113及這些第二通孔114貫穿板體的第一面111及第二面112。The
第一印刷電路12印刷於板體11,且部分的第一印刷電路12位於板體11的第一面111,另一部分的第一印刷電路12位於這些第一通孔113內。第二印刷電路13印刷於板體11,且部分的第二印刷電路13位於板體11的第一面111,另一部分的第二印刷電路13位於這些第二通孔114內。詳細來說,位於第一通孔113內的第一印刷電路12例如是沿著環繞第一通孔113的壁面延伸至板體11的第二面112,且位於第一通孔113內的第一印刷電路12覆蓋部分環繞第一通孔113的壁面。位於第二通孔114內的第二印刷電路13例如是沿著環繞第二通孔114的壁面延伸至板體11的第二面112,且位於第二通孔114內的第二印刷電路13覆蓋部分環繞第二通孔114的壁面。第一導電墊14設置於板體11的第二面112,並與位於第一通孔113內且延伸至第二面112的第一印刷電路12電性連接。第二導電墊15設置於板體11的第二面112,並與位於第二通孔114內且延伸至第二面112的第二印刷電路13電性連接。第一導電墊14及第二導電墊15例如用以與一電源之pogo pin接頭(未繪示)或導電彈片電性接觸。The first printed
在本實施例中,位於第一通孔113內的第一印刷電路12覆蓋部分環繞第一通孔113的壁面之設置,並非用以限定本發明。在其他實施例中,位於第一通孔內的第一印刷電路可覆蓋整個圍繞第一通孔的壁面。同理地,在其他實施例中,位於第二通孔內的第二印刷電路可覆蓋整個圍繞第二通孔的壁面。In the present embodiment, the arrangement of the first printed
此外,從圖3中可知,第一印刷電路12並未填滿整個第一通孔113,但並不以此為限。在其他實施例中,第一印刷電路可填滿整個第一通孔。同理地,在其他實施例中,第二印刷電路亦可填滿整個第二通孔。In addition, as can be seen from FIG. 3, the first printed
發光件20例如為白光LED燈。發光件20設置於板體11的第一面111,且發光件20電性連接於第一印刷電路12及第二印刷電路13。如此一來,發光件20即透過第一印刷電路12、第二印刷電路13、第一導電墊14及第二導電墊15與電源形成迴路。因此,當第一導電墊14及第二導電墊15電性連接於電源時,發光件20即可發光。The
在本實施例中,多個第一通孔113可讓位於板體11之第一面111的第一印刷電路12與位於第二面112的第一導電墊14之間有多個電性連接之處,以提升位於板體11之第一面111的第一印刷電路12與第一導電墊14之間的電性連接品質。同理地,多個第二通孔114亦可提升位於板體11之第一面111的第二印刷電路13與第二導電墊15之間的電性連接品質。然而,第一通孔113及第二通孔114的數量並非以多個為限。在其他實施例中,第一通孔及第二通孔可皆為一個。In this embodiment, the plurality of first through
此外,本實施例的裝飾組件1更包含一晶片電阻50。晶片電阻50設置於板體11的第一面111,並電性連接第一印刷電路12。晶片電阻50是用來調整通過發光件20的電流,以避免發光件20過載。In addition, the
接著,請一併參閱圖2及圖4,圖4為圖2的裝飾組件的部分剖視示意圖。Next, please refer to FIG. 2 and FIG. 4 together. FIG. 4 is a schematic partial cross-sectional view of the decoration component of FIG. 2.
發光件20具有一發光面21。導光板30疊設於板體11的第一面111,且導光板30具有一入光面31、一出光面32及多個導光結構33。導光板30之入光面31對應於發光件20之發光面21。每一導光結構33的形狀例如為點狀,且這些導光結構33例如是透過印刷的方式印刷於導光板30之出光面32上。The
在本實施例中,導光結構33的數量為多個,且導光結構33的形狀為點狀之設置,並非用以限定本發明。在其他實施例中,導光結構的數量可僅為一個,且此導光結構的形狀可為方格狀。In this embodiment, the number of the
裝飾件40包含一基材層41、一遮蔽層42及一透光層43。基材層41例如為透明片,且遮蔽層42設置於基材層41。遮蔽層42具有一遮光部421及一透光部422。遮光部421例如為黑色油墨印刷的部分,且遮光部421為不可透光。透光部422例如為油墨未印刷的部分,且透光部422為可透光。遮光部421及透光部422共同形成一圖案結構423,且圖案結構423顯露於基材層41。透光層43的透光率例如介於20%至50%之間,且透光層43包含一鍍膜部431及一柔光部432。鍍膜部431的顏色例如為銀色,且鍍膜部431設置於遮蔽層42遠離基材層41之一側。柔光部432的顏色例如為白色,且柔光部432設置於鍍膜部431遠離遮蔽層42之一側。柔光部432疊設於導光板30的出光面32,且遮蔽層42之透光部422對應於導光板30的這些導光結構33。The
當發光件20發光時,光會從導光板30的入光面31進入導光板30,接著位於出光面32的這些導光結構33會將光導向柔光部432,以令光進入柔光部432。接著,光會穿透柔光部432、鍍膜部431、遮蔽層42的透光部422及基材層41射出,而讓裝飾件40的圖案結構423受到光的照射。因此,當裝飾組件1作為智慧型手機的背蓋時,受到光照射的圖案結構423可提升智慧型手機之外觀的美觀性。When the
在本實施例中,柔光部432之設置可遮蔽導光板30的這些導光結構33,以避免這些導光結構33經由遮蔽層42的透光部422顯露於外,而可維持整體裝飾組件1的美觀性。In this embodiment, the arrangement of the soft
此外,柔光部432可柔化發光件20所發出的光,故可提升觀看者的視覺舒適度。In addition, the soft
柔光部432的顏色與發光件20的顏色並不以皆為白色為限。在其他實施例中,柔光部的顏色與發光件的顏色可為其他顏色,例如皆為藍色。再者,柔光部432的顏色與發光件20的顏色相同之設置,並非用以限定本發明。在其他實施例中,柔光部的顏色與發光件的顏色可不相同。The color of the soft
再者,柔光部432疊設於鍍膜部431之設置,可提供鍍膜部431與外界隔絕的效果,以避免鍍膜部431與外界接觸而氧化,而可有效地降低鍍膜部431從遮蔽層42剝落的機率。Furthermore, the arrangement of the soft
另外,鍍膜部431之設置可確保在柔光部432遮蔽這些導光結構33之前提下,維持穿透過鍍膜部431的光的亮度。In addition, the provision of the
在本實施例中,透光層43同時有鍍膜部431及柔光部432的設置,並非用以限定本發明。在其他實施例中,透光層可僅有鍍膜部,或是透光層僅有柔光部。In this embodiment, the light-transmitting
由於第一通孔113內的第一印刷電路12及第二通孔114內的第二印刷電路13是經由印刷的方式形成,故線路板10的板體11可為厚度較薄之板材,以利於將裝飾組件1整體的厚度縮減至1公釐。因此,當裝飾組件1作為智慧型手機的背蓋時,可確保整體智慧型手機維持薄形化的效果。Since the first printed
在前述實施例中,裝飾件40是由基材層41、遮蔽層42及透光層43依序堆疊而成,但並不以此為限。請參閱圖5,圖5為根據本發明第二實施例所揭露的裝飾組件的裝飾件的部分剖視示意圖。In the foregoing embodiment, the
本實施例的裝飾組件1a類似於圖1之裝飾組件1,以下僅針對差異之處進行說明。The decorative component 1a of this embodiment is similar to the
本實施例的裝飾件40a包含一基材層41a、一轉印層42a、一透光層43a及一遮蔽層44a。轉印層42a例如是透過奈米轉印技術設置於基材層41a,且轉印層42a是例如是透過紫外光硬化。透光層43a包含一鍍膜部431a及一柔光部432a。鍍膜部431a疊設於轉印層42a遠離基材層41a之一側,且遮蔽層44a疊設於鍍膜部431a遠離轉印層42a之一側。柔光部432a設置於遮蔽層44a遠離鍍膜部431a之一側,且柔光部432a疊設於導光板30a的出光面32a。The decoration 40a of this embodiment includes a
在本實施例中,裝飾件40a之轉印層42a可透過奈米轉印及紫外光硬化技術印製而被印製為髮絲紋或卡夢紋等紋路。因此,當光穿透柔光部432a、遮蔽層44a的透光部442a、鍍膜部431a、轉印層42a及基材層41a時,會從裝飾組件1a上光透出之區域觀察到對應之紋路及光澤的效果,使得裝有裝飾組件1a之智慧型手機的美觀性更為提升。In this embodiment, the
根據上述實施例所揭露的裝飾組件,由於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路是經由印刷的方式形成,故線路板的板體可為厚度較薄之板材,以利於縮減裝飾組件的整體厚度。因此,當裝飾組件作為智慧型手機的背蓋時,可確保整體智慧型手機維持薄形化的效果。According to the decorative component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The sheet material helps to reduce the overall thickness of the decorative component. Therefore, when the decorative component is used as the back cover of the smartphone, it can ensure that the overall smartphone maintains the effect of thinning.
此外,透過發光件及導光板之設置,可讓發光件所發出的光經由導光板而照射於裝飾件的圖案結構。因此,當裝飾組件作為智慧型手機的背蓋時,被照射的圖案結構可增加智慧型手機的美觀性。In addition, through the arrangement of the light emitting element and the light guide plate, the light emitted by the light emitting element can be irradiated to the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component is used as the back cover of the smartphone, the illuminated pattern structure can increase the aesthetics of the smartphone.
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed as the above preferred embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.
1、1a:裝飾組件10:線路板11:板體111:第一面112:第二面113:第一通孔114:第二通孔12:第一印刷電路13:第二印刷電路14:第一導電墊15:第二導電墊20:發光件21:發光面30、30a:導光板31:入光面32、32a:出光面33:導光結構40、40a:裝飾件41、41a:基材層42、44a:遮蔽層42a:轉印層421:遮光部422、442a:透光部423:圖案結構43、43a:透光層431、431a:鍍膜部432、432a:柔光部50:晶片電阻R1、R2:直徑T:厚度1. 1a: decorative component 10: circuit board 11: board body 111: first side 112: second side 113: first through hole 114: second through hole 12: first printed circuit 13: second printed circuit 14: First conductive pad 15: Second conductive pad 20: Light emitting member 21:
圖1為根據本發明第一實施例所揭露的裝飾組件的立體示意圖。 圖2為圖1的分解示意圖。 圖3為圖2之線路板沿割面線3-3的剖視示意圖。 圖4為圖2的裝飾組件的部分剖視示意圖。 圖5為根據本發明第二實施例所揭露的裝飾組件的裝飾件的部分剖視示意圖。FIG. 1 is a schematic perspective view of the decorative component disclosed according to the first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1. FIG. 3 is a schematic cross-sectional view of the circuit board of FIG. 2 along cutting plane line 3-3. 4 is a schematic partial cross-sectional view of the decorative component of FIG. 2. FIG. 5 is a schematic partial cross-sectional view of the decorative component of the decorative component disclosed according to the second embodiment of the present invention.
10:線路板 10: circuit board
11:板體 11: Board body
111:第一面 111: first side
112:第二面 112: second side
113:第一通孔 113: first through hole
114:第二通孔 114: Second through hole
12:第一印刷電路 12: First printed circuit
13:第二印刷電路 13: Second printed circuit
20:發光件 20: Light emitting parts
30:導光板 30: light guide plate
32:出光面 32: Light side
33:導光結構 33: light guide structure
40:裝飾件 40: Decoration
421:遮光部 421: Shade
422:透光部 422: Light transmission part
423:圖案結構 423: Pattern structure
50:晶片電阻 50: Chip resistance
Claims (12)
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TW107136597A TWI704063B (en) | 2018-10-17 | 2018-10-17 | Decoration assembly |
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TW107136597A TWI704063B (en) | 2018-10-17 | 2018-10-17 | Decoration assembly |
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TWI704063B TWI704063B (en) | 2020-09-11 |
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CN2620344Y (en) * | 2003-06-06 | 2004-06-09 | 赵景泉 | Bill board using LED as light source |
TWI430218B (en) * | 2010-05-07 | 2014-03-11 | Hou Ching Chin | Top view lighting module |
KR20140011637A (en) * | 2012-07-18 | 2014-01-29 | 현대모비스 주식회사 | Plane light source apparatus |
CN202855236U (en) * | 2012-09-24 | 2013-04-03 | 惠州市粤泰翔科技有限公司 | Light-Emitting Diode (LED) luminous signboard |
TWM470351U (en) * | 2013-10-03 | 2014-01-11 | Cinnati Entpr Co Ltd | Dynamic lamp box structure |
TWM500966U (en) * | 2015-02-12 | 2015-05-11 | President Chain Store Corp | Advertisement lamp box structure |
TW201705549A (en) * | 2015-07-23 | 2017-02-01 | 晶元光電股份有限公司 | Light-emitting device |
CN106813161B (en) * | 2017-03-01 | 2019-05-17 | 维沃移动通信有限公司 | A kind of luminescence component and mobile terminal |
CN207663759U (en) * | 2018-02-09 | 2018-07-27 | 深圳市蓝禾技术有限公司 | Schematic structure, shell and electronic equipment with schematic structure |
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