TW202015926A

TW202015926A - Decoration assembly

Info

Publication number: TW202015926A
Application number: TW107136597A
Authority: TW
Inventors: 鄭宗楷; 林修宇
Original assignee: 正美企業股份有限公司
Priority date: 2018-10-17
Filing date: 2018-10-17
Publication date: 2020-05-01
Also published as: TWI704063B

Abstract

A decoration assembly includes a circuit board, a light source, a light guiding plate and a decoration component. The circuit board includes a plate, a first printed circuit, a second printed circuit and two electrically conductive pads. A part of the first printed circuit and a part of the second printed circuit are located on a first surface of the plate, and the other part of the first printed circuit and the other part of the second printed circuit are respectively located in two through holes of the circuit board. The electrically conductive pads are disposed on a second surface of the circuit board and respectively and electrically connected to the first printed circuit and the second printed circuit in the two through holes. The light source is disposed on the first surface of the plate and electrically connected to the first printed circuit and the second printed circuit. The light guiding plate is disposed on the first surface of the plate, and the incident surface of the light guiding surface corresponds to a light-emitting surface of the light source. The decoration component is stacked on a side of the light guiding plate away from the circuit board. The decoration component has a pattern structure, and the pattern structure corresponds to an illuminating surface of the light guiding plate.

Description

裝飾組件Decoration components

本發明係關於一種裝飾組件，特別是一種裝飾件有圖案結構的裝飾組件。The invention relates to a decorative component, in particular to a decorative component having a decorative structure with a pattern structure.

隨著電子裝置(例如筆記型電腦、平板電腦及智慧型手機)的普及，社會大眾除了追求電子裝置之效能及功能上的增進之外，電子裝置外表亦是社會大眾所關注的重點之一。因此，製造商常於智慧型手機的背蓋上設置圖案，來達到吸引消費者購買電子裝置的目的。一般而言，設置於電子裝置之背蓋上的圖案分成會發光的光學圖案與不發光的油墨圖案。With the popularization of electronic devices (such as notebook computers, tablet computers, and smart phones), in addition to the improvement of the performance and functions of electronic devices, the appearance of electronic devices is also one of the focuses of the public. Therefore, manufacturers often set patterns on the back cover of smartphones to attract consumers to purchase electronic devices. Generally speaking, the pattern provided on the back cover of the electronic device is divided into an optical pattern that emits light and an ink pattern that does not emit light.

由於會發光的光學圖案在視覺效果上較不發光的油墨圖案炫麗，故製造商在設計部分電子裝置，如高階機種時，傾向採用具有光學圖案的背蓋。Since the optical pattern that emits light is more visually bright than the ink pattern that does not emit light, manufacturers tend to use a back cover with an optical pattern when designing some electronic devices, such as high-end models.

然而，在具光學圖案的背蓋中，電路板外側與內側會分別設置供光源與供電子裝置內部電源電性連接的外導電電路與內導電電路，且外導電電路與內導電電路透過電路板上之電鍍通孔相連接。然而，由於電路板之板厚需保持一定厚度之上，才能夠維持電鍍通孔之電鍍品質，故具電鍍通孔之電路板一般會受到電鍍通孔之製程限制而難以進一步薄化。如此一來，將會影響到電子裝置的薄化的程度。However, in the back cover with optical patterns, the outer and inner sides of the circuit board are provided with an outer conductive circuit and an inner conductive circuit for electrically connecting the light source and the internal power supply of the power supply device, and the outer conductive circuit and the inner conductive circuit pass through the circuit board The upper plated through holes are connected. However, since the thickness of the circuit board needs to be kept above a certain thickness in order to maintain the plating quality of the plated through holes, circuit boards with plated through holes are generally limited by the manufacturing process of the plated through holes and are difficult to be further thinned. In this way, the degree of thinning of the electronic device will be affected.

本發明在於提供一種裝飾組件，藉以解決先前技術中具會發光之光學圖案之背蓋不利於薄形化整體電子裝置的問題。The present invention is to provide a decorative component to solve the problem that the back cover with the optical pattern that emits light in the prior art is not conducive to thinning the overall electronic device.

本發明之一實施例所揭露之一種裝飾組件，適於電性接觸二導電件。裝飾組件包含一線路板、一發光件、一導光板及一裝飾件。線路板包含一板體、一第一印刷電路、一第二印刷電路、一第一導電墊及一第二導電墊。板體具有一第一面、一第二面、至少一第一通孔及至少一第二通孔。第一通孔及第二通孔貫穿板體的第一面及第二面。第一印刷電路及第二印刷電路印刷於版體。第一印刷電路的一部分位於第一面，且第一印刷電路的另一部分位於第一通孔內。第二印刷電路的一部分位於第一面，且第二印刷電路的另一部分位於第二通孔內。第一導電墊及第二導電墊皆設置於第二面，且第一導電墊及第二導電墊分別電性連接位於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路。發光件設置於板體的第一面，且發光件電性連接於第一印刷電路及第二印刷電路。發光件具有一發光面。導光板疊設於板體的第一面，且導光板具有一入光面及一出光面。入光面對應於發光面。裝飾件疊設於導光板遠離線路板之一側。裝飾件具有一圖案結構，且圖案結構對應於導光板的出光面。A decorative component disclosed in an embodiment of the present invention is suitable for electrically contacting two conductive members. The decoration component includes a circuit board, a light-emitting part, a light guide plate and a decoration part. The circuit board includes a board body, a first printed circuit, a second printed circuit, a first conductive pad and a second conductive pad. The board body has a first surface, a second surface, at least one first through hole and at least one second through hole. The first through hole and the second through hole penetrate the first surface and the second surface of the plate body. The first printed circuit and the second printed circuit are printed on the plate body. A part of the first printed circuit is located on the first surface, and another part of the first printed circuit is located in the first through hole. A part of the second printed circuit is located on the first surface, and another part of the second printed circuit is located in the second through hole. The first conductive pad and the second conductive pad are both disposed on the second surface, and the first conductive pad and the second conductive pad are electrically connected to the first printed circuit in the first through hole and the second in the second through hole, respectively Printed circuit. The light emitting element is disposed on the first surface of the board, and the light emitting element is electrically connected to the first printed circuit and the second printed circuit. The light-emitting element has a light-emitting surface. The light guide plate is stacked on the first surface of the plate body, and the light guide plate has a light incident surface and a light exit surface. The light incident surface corresponds to the light emitting surface. The decoration piece is stacked on one side of the light guide plate away from the circuit board. The decorative part has a pattern structure, and the pattern structure corresponds to the light exit surface of the light guide plate.

根據上述實施例所揭露的裝飾組件，由於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路是經由印刷的方式形成，故線路板的板體可為厚度較薄之板材，以利於縮減裝飾組件整體的厚度。因此，當裝飾組件作為電子裝置的背蓋時，可確保整體電子裝置維持薄形化的效果。According to the decorative component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The plate is used to reduce the thickness of the entire decorative component. Therefore, when the decoration component is used as the back cover of the electronic device, it can ensure that the overall electronic device maintains the effect of thinning.

此外，透過發光件及導光板之設置，可讓發光件所發出的光經由導光板而照射於裝飾件的圖案結構。因此，當裝飾組件作為電子裝置的背蓋時，被照射的圖案結構可增加整體電子裝置的美觀性。In addition, through the arrangement of the light emitting element and the light guide plate, the light emitted by the light emitting element can be irradiated to the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component serves as the back cover of the electronic device, the illuminated pattern structure can increase the aesthetics of the overall electronic device.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理，並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.

請參閱圖1至圖3。圖1為根據本發明第一實施例所揭露的裝飾組件的立體示意圖。圖2為圖1的分解示意圖。圖3為圖2之線路板沿割面線3-3的剖視示意圖。Please refer to Figure 1 to Figure 3. FIG. 1 is a schematic perspective view of the decorative component disclosed according to the first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1. FIG. 3 is a schematic cross-sectional view of the circuit board of FIG. 2 along cutting plane line 3-3.

本實施例的裝飾組件1例如為智慧型手機的背蓋。裝飾組件1包含一線路板10、一發光件20、一導光板30及一裝飾件40。The decorative component 1 of this embodiment is, for example, a back cover of a smartphone. The decorative component 1 includes a circuit board 10, a light emitting element 20, a light guide plate 30 and a decorative element 40.

線路板10的厚度T介於0.05公釐至0.1公釐之間，且線路板10包含一板體11、一第一印刷電路12、一第二印刷電路13、一第一導電墊14及一第二導電墊15。The thickness T of the circuit board 10 is between 0.05 mm and 0.1 mm, and the circuit board 10 includes a board body 11, a first printed circuit 12, a second printed circuit 13, a first conductive pad 14 and a Second conductive pad 15.

線路板10的板體11具有一第一面111、一第二面112、多個第一通孔113及多個第二通孔114。每一第一通孔113的直徑R1及每一第二通孔114的直徑R2皆介於0.4公釐至2公釐之間，且這些第一通孔113及這些第二通孔114貫穿板體的第一面111及第二面112。The board body 11 of the circuit board 10 has a first surface 111, a second surface 112, a plurality of first through holes 113 and a plurality of second through holes 114. The diameter R1 of each first through hole 113 and the diameter R2 of each second through hole 114 are between 0.4 mm and 2 mm, and the first through holes 113 and the second through holes 114 penetrate the board The first surface 111 and the second surface 112 of the body.

第一印刷電路12印刷於板體11，且部分的第一印刷電路12位於板體11的第一面111，另一部分的第一印刷電路12位於這些第一通孔113內。第二印刷電路13印刷於板體11，且部分的第二印刷電路13位於板體11的第一面111，另一部分的第二印刷電路13位於這些第二通孔114內。詳細來說，位於第一通孔113內的第一印刷電路12例如是沿著環繞第一通孔113的壁面延伸至板體11的第二面112，且位於第一通孔113內的第一印刷電路12覆蓋部分環繞第一通孔113的壁面。位於第二通孔114內的第二印刷電路13例如是沿著環繞第二通孔114的壁面延伸至板體11的第二面112，且位於第二通孔114內的第二印刷電路13覆蓋部分環繞第二通孔114的壁面。第一導電墊14設置於板體11的第二面112，並與位於第一通孔113內且延伸至第二面112的第一印刷電路12電性連接。第二導電墊15設置於板體11的第二面112，並與位於第二通孔114內且延伸至第二面112的第二印刷電路13電性連接。第一導電墊14及第二導電墊15例如用以與一電源之pogo pin接頭(未繪示)或導電彈片電性接觸。The first printed circuit 12 is printed on the board body 11, and a part of the first printed circuit 12 is located on the first surface 111 of the board body 11, and another part of the first printed circuit 12 is located in the first through holes 113. The second printed circuit 13 is printed on the board body 11, and a part of the second printed circuit 13 is located on the first surface 111 of the board body 11, and another part of the second printed circuit 13 is located in the second through holes 114. In detail, the first printed circuit 12 located in the first through hole 113 extends to the second surface 112 of the board 11 along the wall surface surrounding the first through hole 113, and is located in the first through hole 113. A printed circuit 12 covers a part of the wall surface surrounding the first through hole 113. The second printed circuit 13 located in the second through hole 114 extends to the second surface 112 of the board 11 along the wall surface surrounding the second through hole 114, and is located in the second through hole 114 The covering part surrounds the wall surface of the second through hole 114. The first conductive pad 14 is disposed on the second surface 112 of the board 11 and electrically connected to the first printed circuit 12 located in the first through hole 113 and extending to the second surface 112. The second conductive pad 15 is disposed on the second surface 112 of the board 11 and electrically connected to the second printed circuit 13 located in the second through hole 114 and extending to the second surface 112. The first conductive pad 14 and the second conductive pad 15 are used for electrical contact with a pogo pin connector (not shown) of a power supply or a conductive spring, for example.

在本實施例中，位於第一通孔113內的第一印刷電路12覆蓋部分環繞第一通孔113的壁面之設置，並非用以限定本發明。在其他實施例中，位於第一通孔內的第一印刷電路可覆蓋整個圍繞第一通孔的壁面。同理地，在其他實施例中，位於第二通孔內的第二印刷電路可覆蓋整個圍繞第二通孔的壁面。In the present embodiment, the arrangement of the first printed circuit 12 in the first through hole 113 covering part of the wall surface surrounding the first through hole 113 is not intended to limit the present invention. In other embodiments, the first printed circuit located in the first through hole may cover the entire wall surface surrounding the first through hole. Similarly, in other embodiments, the second printed circuit located in the second through hole may cover the entire wall surrounding the second through hole.

此外，從圖3中可知，第一印刷電路12並未填滿整個第一通孔113，但並不以此為限。在其他實施例中，第一印刷電路可填滿整個第一通孔。同理地，在其他實施例中，第二印刷電路亦可填滿整個第二通孔。In addition, as can be seen from FIG. 3, the first printed circuit 12 does not fill the entire first through hole 113, but it is not limited to this. In other embodiments, the first printed circuit may fill the entire first through hole. Similarly, in other embodiments, the second printed circuit may also fill the entire second through hole.

發光件20例如為白光LED燈。發光件20設置於板體11的第一面111，且發光件20電性連接於第一印刷電路12及第二印刷電路13。如此一來，發光件20即透過第一印刷電路12、第二印刷電路13、第一導電墊14及第二導電墊15與電源形成迴路。因此，當第一導電墊14及第二導電墊15電性連接於電源時，發光件20即可發光。The light emitting element 20 is, for example, a white LED lamp. The light emitting element 20 is disposed on the first surface 111 of the board 11, and the light emitting element 20 is electrically connected to the first printed circuit 12 and the second printed circuit 13. In this way, the light emitting element 20 forms a loop with the power source through the first printed circuit 12, the second printed circuit 13, the first conductive pad 14 and the second conductive pad 15. Therefore, when the first conductive pad 14 and the second conductive pad 15 are electrically connected to the power source, the light emitting element 20 can emit light.

在本實施例中，多個第一通孔113可讓位於板體11之第一面111的第一印刷電路12與位於第二面112的第一導電墊14之間有多個電性連接之處，以提升位於板體11之第一面111的第一印刷電路12與第一導電墊14之間的電性連接品質。同理地，多個第二通孔114亦可提升位於板體11之第一面111的第二印刷電路13與第二導電墊15之間的電性連接品質。然而，第一通孔113及第二通孔114的數量並非以多個為限。在其他實施例中，第一通孔及第二通孔可皆為一個。In this embodiment, the plurality of first through holes 113 allows for multiple electrical properties between the first printed circuit 12 located on the first surface 111 of the board 11 and the first conductive pad 14 located on the second surface 112 The connection point is to improve the quality of the electrical connection between the first printed circuit 12 and the first conductive pad 14 on the first surface 111 of the board body 11. Similarly, the plurality of second through holes 114 can also improve the quality of the electrical connection between the second printed circuit 13 and the second conductive pad 15 on the first surface 111 of the board 11. However, the number of the first through holes 113 and the second through holes 114 is not limited to a plurality. In other embodiments, the first through hole and the second through hole may both be one.

此外，本實施例的裝飾組件1更包含一晶片電阻50。晶片電阻50設置於板體11的第一面111，並電性連接第一印刷電路12。晶片電阻50是用來調整通過發光件20的電流，以避免發光件20過載。In addition, the decoration device 1 of this embodiment further includes a chip resistor 50. The chip resistor 50 is disposed on the first surface 111 of the board 11 and electrically connected to the first printed circuit 12. The chip resistor 50 is used to adjust the current passing through the light emitting element 20 to avoid overloading the light emitting element 20.

接著，請一併參閱圖2及圖4，圖4為圖2的裝飾組件的部分剖視示意圖。Next, please refer to FIG. 2 and FIG. 4 together. FIG. 4 is a schematic partial cross-sectional view of the decoration component of FIG. 2.

發光件20具有一發光面21。導光板30疊設於板體11的第一面111，且導光板30具有一入光面31、一出光面32及多個導光結構33。導光板30之入光面31對應於發光件20之發光面21。每一導光結構33的形狀例如為點狀，且這些導光結構33例如是透過印刷的方式印刷於導光板30之出光面32上。The light emitting element 20 has a light emitting surface 21. The light guide plate 30 is stacked on the first surface 111 of the plate body 11, and the light guide plate 30 has a light entrance surface 31, a light exit surface 32 and a plurality of light guide structures 33. The light incident surface 31 of the light guide plate 30 corresponds to the light emitting surface 21 of the light emitting element 20. The shape of each light guide structure 33 is, for example, a dot shape, and the light guide structures 33 are printed on the light exit surface 32 of the light guide plate 30 by printing, for example.

在本實施例中，導光結構33的數量為多個，且導光結構33的形狀為點狀之設置，並非用以限定本發明。在其他實施例中，導光結構的數量可僅為一個，且此導光結構的形狀可為方格狀。In this embodiment, the number of the light guide structure 33 is plural, and the shape of the light guide structure 33 is a dot-like arrangement, which is not intended to limit the present invention. In other embodiments, the number of the light guide structure may be only one, and the shape of the light guide structure may be a checkered shape.

裝飾件40包含一基材層41、一遮蔽層42及一透光層43。基材層41例如為透明片，且遮蔽層42設置於基材層41。遮蔽層42具有一遮光部421及一透光部422。遮光部421例如為黑色油墨印刷的部分，且遮光部421為不可透光。透光部422例如為油墨未印刷的部分，且透光部422為可透光。遮光部421及透光部422共同形成一圖案結構423，且圖案結構423顯露於基材層41。透光層43的透光率例如介於20%至50%之間，且透光層43包含一鍍膜部431及一柔光部432。鍍膜部431的顏色例如為銀色，且鍍膜部431設置於遮蔽層42遠離基材層41之一側。柔光部432的顏色例如為白色，且柔光部432設置於鍍膜部431遠離遮蔽層42之一側。柔光部432疊設於導光板30的出光面32，且遮蔽層42之透光部422對應於導光板30的這些導光結構33。The decoration member 40 includes a base material layer 41, a shielding layer 42 and a light-transmitting layer 43. The base layer 41 is, for example, a transparent sheet, and the shielding layer 42 is provided on the base layer 41. The shielding layer 42 has a light-shielding portion 421 and a light-transmitting portion 422. The light blocking portion 421 is, for example, a portion printed with black ink, and the light blocking portion 421 is opaque. The light transmitting portion 422 is, for example, a portion where ink is not printed, and the light transmitting portion 422 can transmit light. The light-shielding portion 421 and the light-transmitting portion 422 jointly form a pattern structure 423, and the pattern structure 423 is exposed on the substrate layer 41. The light transmittance of the light-transmitting layer 43 is, for example, between 20% and 50%, and the light-transmitting layer 43 includes a coating portion 431 and a soft light portion 432. The color of the plated portion 431 is, for example, silver, and the plated portion 431 is provided on the side of the shielding layer 42 away from the base material layer 41. The color of the soft light portion 432 is, for example, white, and the soft light portion 432 is disposed on the side of the plating portion 431 away from the shielding layer 42. The soft light portion 432 is superposed on the light exit surface 32 of the light guide plate 30, and the light transmitting portion 422 of the shielding layer 42 corresponds to the light guide structures 33 of the light guide plate 30.

當發光件20發光時，光會從導光板30的入光面31進入導光板30，接著位於出光面32的這些導光結構33會將光導向柔光部432，以令光進入柔光部432。接著，光會穿透柔光部432、鍍膜部431、遮蔽層42的透光部422及基材層41射出，而讓裝飾件40的圖案結構423受到光的照射。因此，當裝飾組件1作為智慧型手機的背蓋時，受到光照射的圖案結構423可提升智慧型手機之外觀的美觀性。When the light emitting element 20 emits light, light will enter the light guide plate 30 from the light incident surface 31 of the light guide plate 30, and then the light guide structures 33 located on the light exit surface 32 will guide the light to the soft light portion 432, so that the light enters the soft light portion 432. Then, the light passes through the soft light part 432, the coating part 431, the light transmitting part 422 of the shielding layer 42 and the base material layer 41, and the pattern structure 423 of the decoration 40 is irradiated with light. Therefore, when the decorative component 1 is used as a back cover of a smartphone, the pattern structure 423 exposed to light can enhance the appearance of the smartphone.

在本實施例中，柔光部432之設置可遮蔽導光板30的這些導光結構33，以避免這些導光結構33經由遮蔽層42的透光部422顯露於外，而可維持整體裝飾組件1的美觀性。In this embodiment, the arrangement of the soft light portion 432 can shield the light guide structures 33 of the light guide plate 30 to prevent the light guide structures 33 from being exposed to the outside through the light transmitting portion 422 of the shielding layer 42 and maintain the overall decoration component 1. The aesthetics.

此外，柔光部432可柔化發光件20所發出的光，故可提升觀看者的視覺舒適度。In addition, the soft light portion 432 can soften the light emitted by the light emitting member 20, so that the visual comfort of the viewer can be improved.

柔光部432的顏色與發光件20的顏色並不以皆為白色為限。在其他實施例中，柔光部的顏色與發光件的顏色可為其他顏色，例如皆為藍色。再者，柔光部432的顏色與發光件20的顏色相同之設置，並非用以限定本發明。在其他實施例中，柔光部的顏色與發光件的顏色可不相同。The color of the soft light portion 432 and the color of the light emitting element 20 are not limited to being white. In other embodiments, the color of the soft light part and the color of the light-emitting member may be other colors, for example, both are blue. Furthermore, the arrangement of the color of the soft light portion 432 and the color of the light emitting element 20 is not intended to limit the present invention. In other embodiments, the color of the soft light part and the color of the light emitting member may be different.

再者，柔光部432疊設於鍍膜部431之設置，可提供鍍膜部431與外界隔絕的效果，以避免鍍膜部431與外界接觸而氧化，而可有效地降低鍍膜部431從遮蔽層42剝落的機率。Furthermore, the arrangement of the soft light portion 432 stacked on the coating portion 431 can provide the effect of isolating the coating portion 431 from the outside, so as to prevent the coating portion 431 from contacting the outside and oxidizing, and can effectively reduce the coating portion 431 from the shielding layer 42 The probability of flaking.

另外，鍍膜部431之設置可確保在柔光部432遮蔽這些導光結構33之前提下，維持穿透過鍍膜部431的光的亮度。In addition, the provision of the coating portion 431 can ensure that the light guide structure 33 is lifted before the soft light portion 432 shields these light guiding structures 33, and the brightness of the light passing through the coating portion 431 is maintained.

在本實施例中，透光層43同時有鍍膜部431及柔光部432的設置，並非用以限定本發明。在其他實施例中，透光層可僅有鍍膜部，或是透光層僅有柔光部。In this embodiment, the light-transmitting layer 43 is provided with the coating portion 431 and the soft light portion 432 at the same time, which is not intended to limit the present invention. In other embodiments, the light-transmitting layer may only have a plated portion, or the light-transmitting layer may only have a soft portion.

由於第一通孔113內的第一印刷電路12及第二通孔114內的第二印刷電路13是經由印刷的方式形成，故線路板10的板體11可為厚度較薄之板材，以利於將裝飾組件1整體的厚度縮減至1公釐。因此，當裝飾組件1作為智慧型手機的背蓋時，可確保整體智慧型手機維持薄形化的效果。Since the first printed circuit 12 in the first through hole 113 and the second printed circuit 13 in the second through hole 114 are formed by printing, the board body 11 of the circuit board 10 may be a thin plate material, It is advantageous to reduce the thickness of the whole decorative component 1 to 1 mm. Therefore, when the decorative component 1 is used as a back cover of a smartphone, it can ensure that the overall smartphone maintains the effect of being thin.

在前述實施例中，裝飾件40是由基材層41、遮蔽層42及透光層43依序堆疊而成，但並不以此為限。請參閱圖5，圖5為根據本發明第二實施例所揭露的裝飾組件的裝飾件的部分剖視示意圖。In the foregoing embodiment, the decoration member 40 is formed by sequentially stacking the base material layer 41, the shielding layer 42 and the light-transmitting layer 43, but it is not limited thereto. Please refer to FIG. 5. FIG. 5 is a schematic partial cross-sectional view of the decorative component of the decorative component according to the second embodiment of the present invention.

本實施例的裝飾組件1a類似於圖1之裝飾組件1，以下僅針對差異之處進行說明。The decorative component 1a of this embodiment is similar to the decorative component 1 of FIG. 1, and only the differences will be described below.

本實施例的裝飾件40a包含一基材層41a、一轉印層42a、一透光層43a及一遮蔽層44a。轉印層42a例如是透過奈米轉印技術設置於基材層41a，且轉印層42a是例如是透過紫外光硬化。透光層43a包含一鍍膜部431a及一柔光部432a。鍍膜部431a疊設於轉印層42a遠離基材層41a之一側，且遮蔽層44a疊設於鍍膜部431a遠離轉印層42a之一側。柔光部432a設置於遮蔽層44a遠離鍍膜部431a之一側，且柔光部432a疊設於導光板30a的出光面32a。The decoration 40a of this embodiment includes a base layer 41a, a transfer layer 42a, a light-transmitting layer 43a, and a shielding layer 44a. The transfer layer 42a is provided on the base material layer 41a by nano transfer technology, for example, and the transfer layer 42a is hardened by ultraviolet light, for example. The light-transmitting layer 43a includes a plated portion 431a and a soft light portion 432a. The plated portion 431a is stacked on the side of the transfer layer 42a away from the base material layer 41a, and the shielding layer 44a is stacked on the side of the plated portion 431a away from the transfer layer 42a. The soft light portion 432a is disposed on a side of the shielding layer 44a away from the plating portion 431a, and the soft light portion 432a is stacked on the light exit surface 32a of the light guide plate 30a.

在本實施例中，裝飾件40a之轉印層42a可透過奈米轉印及紫外光硬化技術印製而被印製為髮絲紋或卡夢紋等紋路。因此，當光穿透柔光部432a、遮蔽層44a的透光部442a、鍍膜部431a、轉印層42a及基材層41a時，會從裝飾組件1a上光透出之區域觀察到對應之紋路及光澤的效果，使得裝有裝飾組件1a之智慧型手機的美觀性更為提升。In this embodiment, the transfer layer 42a of the decorative member 40a can be printed by nano transfer and ultraviolet curing technology to be printed as a hairline or card dream pattern. Therefore, when the light passes through the soft light portion 432a, the light-transmitting portion 442a of the shielding layer 44a, the coating portion 431a, the transfer layer 42a, and the base material layer 41a, the corresponding area is observed from the light-transmitting area on the decorative component 1a The effect of texture and gloss enhances the aesthetics of the smartphone equipped with the decorative component 1a.

根據上述實施例所揭露的裝飾組件，由於第一通孔內的第一印刷電路及第二通孔內的第二印刷電路是經由印刷的方式形成，故線路板的板體可為厚度較薄之板材，以利於縮減裝飾組件的整體厚度。因此，當裝飾組件作為智慧型手機的背蓋時，可確保整體智慧型手機維持薄形化的效果。According to the decorative component disclosed in the above embodiment, since the first printed circuit in the first through hole and the second printed circuit in the second through hole are formed by printing, the board body of the circuit board can be thinner The sheet material helps to reduce the overall thickness of the decorative component. Therefore, when the decorative component is used as the back cover of the smartphone, it can ensure that the overall smartphone maintains the effect of thinning.

此外，透過發光件及導光板之設置，可讓發光件所發出的光經由導光板而照射於裝飾件的圖案結構。因此，當裝飾組件作為智慧型手機的背蓋時，被照射的圖案結構可增加智慧型手機的美觀性。In addition, through the arrangement of the light emitting element and the light guide plate, the light emitted by the light emitting element can be irradiated to the pattern structure of the decorative element through the light guide plate. Therefore, when the decorative component is used as the back cover of the smartphone, the illuminated pattern structure can increase the aesthetics of the smartphone.

雖然本發明以前述之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed as the above preferred embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

1、1a:裝飾組件10:線路板11:板體111:第一面112:第二面113:第一通孔114:第二通孔12:第一印刷電路13:第二印刷電路14:第一導電墊15:第二導電墊20:發光件21:發光面30、30a:導光板31:入光面32、32a:出光面33:導光結構40、40a:裝飾件41、41a:基材層42、44a:遮蔽層42a:轉印層421:遮光部422、442a:透光部423:圖案結構43、43a:透光層431、431a:鍍膜部432、432a:柔光部50:晶片電阻R1、R2:直徑T:厚度1. 1a: decorative component 10: circuit board 11: board body 111: first side 112: second side 113: first through hole 114: second through hole 12: first printed circuit 13: second printed circuit 14: First conductive pad 15: Second conductive pad 20: Light emitting member 21: Light emitting surface 30, 30a: Light guide plate 31: Light incident surface 32, 32a: Light emitting surface 33: Light guide structure 40, 40a: Decoration 41, 41a: Base material layers 42, 44a: masking layer 42a: transfer layer 421: light-shielding portions 422, 442a: light-transmitting portion 423: pattern structure 43, 43a: light-transmitting layers 431, 431a: coating portions 432, 432a: soft light portion 50 : Chip resistance R1, R2: Diameter T: Thickness

圖1為根據本發明第一實施例所揭露的裝飾組件的立體示意圖。圖2為圖1的分解示意圖。圖3為圖2之線路板沿割面線3-3的剖視示意圖。圖4為圖2的裝飾組件的部分剖視示意圖。圖5為根據本發明第二實施例所揭露的裝飾組件的裝飾件的部分剖視示意圖。FIG. 1 is a schematic perspective view of the decorative component disclosed according to the first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1. FIG. 3 is a schematic cross-sectional view of the circuit board of FIG. 2 along cutting plane line 3-3. 4 is a schematic partial cross-sectional view of the decorative component of FIG. 2. FIG. 5 is a schematic partial cross-sectional view of the decorative component of the decorative component disclosed according to the second embodiment of the present invention.

10:線路板 10: circuit board

11:板體 11: Board body

111:第一面 111: first side

112:第二面 112: second side

113:第一通孔 113: first through hole

114:第二通孔 114: Second through hole

12:第一印刷電路 12: First printed circuit

13:第二印刷電路 13: Second printed circuit

20:發光件 20: Light emitting parts

30:導光板 30: light guide plate

32:出光面 32: Light side

33:導光結構 33: light guide structure

40:裝飾件 40: Decoration

421:遮光部 421: Shade

422:透光部 422: Light transmission part

423:圖案結構 423: Pattern structure

50:晶片電阻 50: Chip resistance

Claims

一種裝飾組件，包含：一線路板，包含一板體、一第一印刷電路、一第二印刷電路、一第一導電墊及一第二導電墊，該板體具有一第一面、一第二面、至少一第一通孔及至少一第二通孔，該至少一第一通孔及該至少一第二通孔貫穿該板體的該第一面及該第二面，該第一印刷電路及該第二印刷電路印刷於該板體，該第一印刷電路的一部分位於該第一面，該第一印刷電路的另一部分位於該至少一第一通孔內，該第二印刷電路的一部分位於該第一面，該第二印刷電路的另一部分位於該至少一第二通孔內，該第一導電墊及該第二導電墊皆設置於該第二面，且該第一導電墊及該第二導電墊分別電性連接位於該至少一第一通孔內的該第一印刷電路及該至少一第二通孔內的該第二印刷電路；一發光件，設置於該板體的該第一面，且該發光件電性連接於該第一印刷電路及該第二印刷電路，該發光件具有一發光面；一導光板，疊設於該板體的該第一面，且該導光板具有一入光面及一出光面，該入光面對應於該發光面；以及一裝飾件，疊設於該導光板遠離該線路板之一側，該裝飾件具有一圖案結構，該圖案結構對應於該導光板的該出光面。A decorative component includes: a circuit board, including a board body, a first printed circuit, a second printed circuit, a first conductive pad and a second conductive pad, the board body has a first surface, a first Two sides, at least one first through hole and at least one second through hole, the at least one first through hole and the at least one second through hole penetrate the first surface and the second surface of the plate body, the first The printed circuit and the second printed circuit are printed on the board, a part of the first printed circuit is located on the first surface, another part of the first printed circuit is located in the at least one first through hole, the second printed circuit Of the second printed circuit is located in the at least one second through hole, the first conductive pad and the second conductive pad are both disposed on the second surface, and the first conductive The pad and the second conductive pad are electrically connected to the first printed circuit located in the at least one first through hole and the second printed circuit located in the at least one second through hole, respectively; a light emitting element is disposed on the board The first surface of the body, and the light-emitting element is electrically connected to the first printed circuit and the second printed circuit, the light-emitting element has a light-emitting surface; a light guide plate is stacked on the first surface of the plate body , And the light guide plate has a light incident surface and a light exit surface, the light incident surface corresponds to the light emitting surface; and a decorative element, stacked on the side of the light guide plate away from the circuit board, the decorative element has a pattern The structure, the pattern structure corresponds to the light exit surface of the light guide plate.

如申請專利範圍第1項所述之裝飾組件，其中該至少一第一通孔及該至少一第二通孔的直徑皆介於0.4公釐至2公釐之間。The decorative component as described in item 1 of the patent application scope, wherein the diameter of the at least one first through hole and the at least one second through hole is between 0.4 mm and 2 mm.

如申請專利範圍第1項所述之裝飾組件，其中該線路板的厚度介於0.05公釐至0.1公釐之間。The decorative component as described in item 1 of the patent application scope, wherein the thickness of the circuit board is between 0.05 mm and 0.1 mm.

如申請專利範圍第1項所述之裝飾組件，其中該導光板更具有至少一導光結構，該至少一導光結構位於該導光板的該出光面上，且該裝飾件的該圖案結構對應於該至少一導光結構。The decorative component as described in item 1 of the patent application range, wherein the light guide plate further has at least one light guide structure, the at least one light guide structure is located on the light exit surface of the light guide plate, and the pattern structure of the decorative member corresponds to The at least one light guide structure.

如申請專利範圍第4項所述之裝飾組件，其中該至少一導光結構的數量為多個，且每一該導光結構的形狀為點狀。The decorative component as described in item 4 of the patent application scope, wherein the number of the at least one light guide structure is plural, and the shape of each of the light guide structures is dot-shaped.

如申請專利範圍第1項所述之裝飾組件，其中該裝飾件包含一基材層、一遮蔽層及一透光層，該遮蔽層設置於該基材層，該遮蔽層具有一遮光部及一透光部，該遮光部為不可透光，該透光部為可透光，該遮光部及該透光部共同形成該圖案結構，該圖案結構顯露於該基材層，該透光層包含一柔光部，該柔光部設置於該遮蔽層遠離該基材層之一側，且該柔光部疊設於該導光板的該出光面。The decorative component as described in item 1 of the patent application scope, wherein the decorative element comprises a substrate layer, a shielding layer and a light-transmitting layer, the shielding layer is disposed on the substrate layer, the shielding layer has a shielding portion and A light-transmitting portion, the light-shielding portion is opaque, the light-transmitting portion is light-transmissive, the light-shielding portion and the light-transmitting portion jointly form the pattern structure, the pattern structure is exposed to the substrate layer, the light-transmitting layer A soft light part is included. The soft light part is disposed on a side of the shielding layer away from the substrate layer, and the soft light part is stacked on the light exit surface of the light guide plate.

如申請專利範圍第6項所述之裝飾組件，其中該透光層的透光率介於20%至50%之間。The decorative component as described in item 6 of the patent application scope, wherein the light transmittance of the light-transmitting layer is between 20% and 50%.

如申請專利範圍第6項所述之裝飾組件，其中該柔光部的顏色與該發光件的發光顏色相同。The decorative component as described in item 6 of the patent application scope, wherein the color of the soft light portion is the same as the light emitting color of the light emitting member.

如申請專利範圍第6項所述之裝飾組件，其中該透光層更含一鍍膜部，該鍍膜部設置於該柔光部及該遮蔽層之間。The decorative component as described in item 6 of the patent application range, wherein the light-transmitting layer further includes a coating portion, and the coating portion is disposed between the soft light portion and the shielding layer.

如申請專利範圍第6項所述之裝飾組件，其中該裝飾件更包含一轉印層，且該透光層更包含一鍍膜部，該轉印層疊設於該基材層，該鍍膜部疊設於該轉印層遠離該基材層之一側，該遮蔽層疊設於該鍍膜部遠離該轉印層之一側，且該柔光部疊設於該遮蔽層遠離該鍍膜部之一側。The decorative component as described in item 6 of the patent application scope, wherein the decorative member further includes a transfer layer, and the light-transmitting layer further includes a plated portion, the transfer layer is disposed on the substrate layer, and the plated portion is stacked Located on the side of the transfer layer away from the substrate layer, the shielding layer is disposed on the side of the plated film portion away from the transfer layer, and the soft light portion is stacked on the side of the shielding layer away from the plated film portion .

如申請專利範圍第10項所述之裝飾組件，其中該轉印層是透過紫外光固化轉印技術形成。The decorative component as described in item 10 of the patent application range, wherein the transfer layer is formed by ultraviolet light curing transfer technology.

如申請專利範圍第1項所述之裝飾組件，其中該至少一第一通孔及該至少一第二通孔的數量皆為多個，該第一印刷電路的部分位於該些第一通孔內，且該第二印刷電路的部分位於該些第二通孔內。The decorative component as described in item 1 of the patent application scope, wherein the number of the at least one first through hole and the at least one second through hole are both plural, and the part of the first printed circuit is located in the first through holes And the part of the second printed circuit is located in the second through holes.