TWI699278B

TWI699278B - Circuit board and an electrical connector assembly

Info

Publication number: TWI699278B
Application number: TW108108601A
Authority: TW
Inventors: 陳億昌
Original assignee: 凡甲科技股份有限公司
Priority date: 2018-06-07
Filing date: 2019-03-14
Publication date: 2020-07-21
Also published as: TWI778246B; TWM594791U; TWI746940B; TW202000450A; TWI784149B; TWM594788U; TWI774945B; TW202001933A; TW202001936A; TW202001934A; TWM594792U; TW202001935A; TWM594843U

Abstract

The present invention relates to a circuit board and an electrical connector assembly. The electrical connector assembly has said circuit board and a flat data transmission cable solded on the circuit board. The circuit board has a base board and a plurality circuit designed on the base board. The base board has a soldering area and a circuit area connecting with the soldering area. The circuit includes a number of wiring pads provided on the soldering area and a plurality of electrical lines in the circuit area. The wiring pads are arranged side by side. Each wiring pad has a width along a direction of there are arranged and a length in a perpendicular direction. The length of the wiring pads being less than 1.5 mm.

Description

線路板及具有該線路板之電連接組件 Circuit board and electrical connection assembly with the circuit board

本發明涉及電連接技術領域，尤其涉及一種可提高訊號傳輸穩定性之線路板和具有該線路板之電連接組件。 The present invention relates to the field of electrical connection technology, and more particularly to a circuit board capable of improving the stability of signal transmission and an electrical connection assembly with the circuit board.

線路板通常設置於電子設備中，以進行電子元件的焊接和電性連接。一般情形下，電路板上會設置複數金手指或焊盤、並且與電路板內部具有與金手指或焊盤電性連接之佈線設計，藉由金手指或焊盤與電連接器或導線進行焊接，進而達成電連接器或導線端輸入或輸出訊號之傳輸或處理工作。惟，習知電路板與導線連接部位不對應，需將導線外層進行剝離並進行彎曲拉線連接，導致阻抗在該部位發生變化，且上述習知連接方案剝線裸露較多，導致阻抗不連續長度較長，進而影響訊號傳輸之穩定性。 Circuit boards are usually installed in electronic equipment for soldering and electrical connection of electronic components. Under normal circumstances, multiple gold fingers or pads are provided on the circuit board, and there is a wiring design that is electrically connected to the gold fingers or pads inside the circuit board, and the gold fingers or pads are welded to the electrical connectors or wires. , And then achieve the transmission or processing of the input or output signal of the electrical connector or the wire end. However, the conventional circuit board does not correspond to the connection part of the wire, and the outer layer of the wire needs to be stripped and connected by bending the wire, which causes the impedance to change at this part, and the above-mentioned conventional connection scheme has more stripped wires exposed, resulting in discontinuous impedance The longer length will affect the stability of signal transmission.

有鑒於此，確有必要對習知電路板作進一步改進，以解決上述問題。 In view of this, it is indeed necessary to further improve the conventional circuit board to solve the above-mentioned problems.

本發明之目的在於提供一種可提高訊號傳輸穩定性之線路板和具有該線路板之電連接組件。 The object of the present invention is to provide a circuit board that can improve the stability of signal transmission and an electrical connection assembly with the circuit board.

為實現上述目的，本發明提供一種線路板，包括基板，基板具有焊接區和連接焊接區的佈線區；線路結構，設置於基板上，所述線路結構具有複數設置於基板之焊接區以連接導線的接線焊盤、設置於焊接區和佈線區內並電性連接接線焊盤的導電線路；其中，所述接線焊盤呈並排設置，並且具有沿其排布方向延伸之寬度和沿與垂直排布方向之方向延伸之長度，所述接線焊盤之長度小於1.5mm。 In order to achieve the above object, the present invention provides a circuit board, including a substrate, the substrate has a soldering area and a wiring area connecting the soldering area; a circuit structure is arranged on the substrate, and the circuit structure has A plurality of wiring pads arranged in the welding area of the substrate to connect the wires, and conductive lines arranged in the welding area and the wiring area and electrically connected to the wiring pads; wherein the wiring pads are arranged side by side and have rows along the The width of the extension in the layout direction and the length of the extension in the direction perpendicular to the layout direction, the length of the wiring pad is less than 1.5mm.

作為本發明之進一步改進，其中每一所述接線焊盤佔據焊接區之面積均小於0.39mm²。 As a further improvement of the present invention, the area occupied by each of the bonding pads is less than 0.39 mm ² .

作為本發明之進一步改進，其中每一所述接線焊盤之長度與寬度之比值小於5.8。 As a further improvement of the present invention, the ratio of the length to the width of each of the wiring pads is less than 5.8.

為實現上述目的，本發明還提供一種線路板，包括：基板，基板具有焊接區和連接焊接區的佈線區；線路結構，設置於基板上，所述線路結構具有複數設置於基板之焊接區以連接導線的接線焊盤、設置於焊接區和佈線區內並電性連接接線焊盤的導電線路；其中所述焊接區與佈線區於接線焊盤之長度方向上相鄰設置；於所述接線焊盤之長度方向上，所述接線焊盤具有靠近佈線區之第一邊緣和遠離佈線區之第二邊緣，所述第二邊緣與焊接區遠離佈線區之基板邊緣之距離小於1mm。 In order to achieve the above object, the present invention also provides a circuit board, including: a substrate, the substrate has a soldering area and a wiring area connecting the soldering areas; a circuit structure is arranged on the substrate, and the circuit structure has a plurality of soldering areas arranged on the substrate. Wiring pads for connecting wires, conductive lines that are arranged in the welding area and the wiring area and electrically connected to the wiring pads; wherein the welding area and the wiring area are adjacently arranged in the length direction of the wiring pad; In the length direction of the pad, the wiring pad has a first edge close to the wiring area and a second edge away from the wiring area, and the distance between the second edge and the substrate edge of the bonding area away from the wiring area is less than 1 mm.

作為本發明之進一步改進，其中於所述接線焊盤之長度方向上，所述接線焊盤之第一邊緣至焊接區遠離佈線區之基板邊緣之長度不大於2mm。 As a further improvement of the present invention, in the length direction of the wiring pad, the length from the first edge of the wiring pad to the edge of the substrate where the bonding area is away from the wiring area is not more than 2 mm.

為實現上述目的，本發明還提供一種電連接組件，包括：線路板，所述線路板具有基板和設置於基板上的線路結構，所述基板具有焊接區和連接焊接區的佈線區；所述線路結構具有複數設置於基板之焊接區以連接導線的接線焊盤、設置於焊接區和佈線區內並電性連接接線焊盤的導電線路；數據傳輸線纜，與所述線路板相焊接，所述數據傳輸線纜具有複數並排設置之導線、一體包覆複數所述導線之塑膠層和採用金屬料帶呈螺旋纏繞設置於所述塑膠層外側而形成的金屬層；每一所述導線具有一導體，所述金屬層至少具有鋁箔層和設置於鋁箔層朝向塑膠層一側的黏結層，所述金屬層藉由所述黏結層熱熔後黏結固定於塑膠層外側；其中，所述導線與接線焊盤一一對應連接，並且相鄰導線之中心間距與對應的相鄰接線焊盤之中心間距相同。 To achieve the above object, the present invention also provides an electrical connection assembly, including: a circuit board having a substrate and a circuit structure arranged on the substrate, the substrate having a soldering area and a wiring area connecting the soldering area; The circuit structure has a plurality of wiring pads arranged in the welding area of the substrate to connect the wires, and conductive lines arranged in the welding area and the wiring area and electrically connected to the wiring pads; a data transmission cable is welded to the circuit board, so The data transmission cable has a plurality of wires arranged side by side, one The plastic layer covering a plurality of the wires and a metal layer formed by spirally winding a metal strip on the outside of the plastic layer; each wire has a conductor, and the metal layer has at least an aluminum foil layer and a metal layer The adhesive layer on the side of the aluminum foil layer facing the plastic layer, the metal layer is bonded and fixed to the outside of the plastic layer by heat fusion of the adhesive layer; wherein the wires are connected to the wiring pads in a one-to-one correspondence, and adjacent wires The center spacing is the same as the center spacing of the corresponding adjacent wiring pads.

作為本發明之進一步改進，其中，於所述接線焊盤之長度方向上，所述接線焊盤具有靠近佈線區之第一邊緣和遠離佈線區之第二邊緣，所述數據傳輸線纜具有露出導體而使導體與接線焊盤相焊接之對接部分，所述對接部分之長度與所述接線焊盤之第一邊緣至焊接區遠離佈線區之邊緣的長度相匹配，均設置為不大於2mm。 As a further improvement of the present invention, in the length direction of the wiring pad, the wiring pad has a first edge close to the wiring area and a second edge away from the wiring area, and the data transmission cable has an exposed conductor For the butt portion where the conductor and the wiring pad are welded, the length of the butt portion matches the length from the first edge of the wiring pad to the edge of the bonding area away from the wiring area, and is set to be not greater than 2 mm.

作為本發明之進一步改進，其中所述導體外徑採用31至34美國線規，所述接線焊盤和導線於其排布方向上均為等間距設置，並且相鄰接線焊盤和相鄰導線之中心間距均設置在0.30mm至0.42mm之間。 As a further improvement of the present invention, the outer diameter of the conductor adopts 31 to 34 U.S. wire gauges, the wiring pads and wires are arranged at equal intervals in their arrangement direction, and adjacent wiring pads and adjacent wires The center spacing is set between 0.30mm to 0.42mm.

作為本發明之進一步改進，其中每一所述接線焊盤之寬度小於0.28mm。 As a further improvement of the present invention, the width of each of the wiring pads is less than 0.28 mm.

作為本發明之進一步改進，其中相鄰兩個所述接線焊盤之間之距離不小於0.13mm。 As a further improvement of the present invention, the distance between two adjacent wiring pads is not less than 0.13 mm.

習知接線焊盤之長度設置通常為2mm以上，使得阻抗不連續而導致之訊號傳輸穩定性難以得到有效提升，本發明一種方案藉由將所述接線焊盤之長度設置為不大於1.5mm，另一種方案減少接線焊盤邊緣至線路板基板邊緣之距離，再一方案為使接線焊盤與導線一一對應，即間距對應相同，進而無需彎曲拉線連接，即藉由上述各項方案盡可能縮短外露對接導線的導體長度，進而減少阻抗不連續之距離，提高訊號傳輸之穩定性，特別係在進行高頻訊號傳輸時，可進一步使得阻抗不連續處縮短，高頻特性更加穩定。 The length of the conventional wiring pad is usually set to 2mm or more, which makes it difficult to effectively improve the signal transmission stability caused by impedance discontinuity. A solution of the present invention is to set the length of the wiring pad to not greater than 1.5mm. Another solution is to reduce the distance between the edge of the wiring pad and the edge of the circuit board substrate. Another solution is to make the wiring pad and the wire correspond to each other, that is, the pitch corresponds to the same, and there is no need to bend the cable connection, that is, through the above solutions May shorten the conductor length of the exposed butt And reduce the distance of impedance discontinuity, improve the stability of signal transmission, especially when high-frequency signal transmission, can further shorten the impedance discontinuity, and the high-frequency characteristics are more stable.

100、100’、300:線路板 100, 100’, 300: circuit board

1:基板 1: substrate

11:焊接區 11: Welding area

12:佈線區 12: Wiring area

13:連接區 13: Connection area

121:定位凹槽 121: positioning groove

21、21’、41:接線焊盤 21, 21’, 41: Wiring pad

22、22’、42:金手指 22, 22’, 42: Golden Finger

G:地線焊盤 G: Ground pad

S:訊號焊盤 S: signal pad

800:數據傳輸線纜 800: data transmission cable

801:導線 801: Wire

802:塑膠層 802: Plastic layer

803:金屬層 803: metal layer

8011:導體 8011: Conductor

8012:包覆層 8012: Cladding

第一圖係本發明線路板之第一較佳實施例之俯視圖；第二圖係本發明線路板之第二較佳實施例之俯視圖；第三圖係本發明線路板之第三較佳實施例之俯視圖；第四圖係與本發明線路板連接之數據傳輸線纜之立體圖；第五圖係第四圖所示數據傳輸線纜之前視圖。 The first figure is a plan view of the first preferred embodiment of the circuit board of the present invention; the second figure is a plan view of the second preferred embodiment of the circuit board of the present invention; the third figure is a third preferred embodiment of the circuit board of the present invention The top view of the example; the fourth figure is a three-dimensional view of the data transmission cable connected with the circuit board of the present invention; the fifth figure is a front view of the data transmission cable shown in the fourth figure.

本發明主要涉及一種線路板，該線路板可應用於電腦、交換機、充電裝置等各類電子設備上，主要用於進行電信號之傳輸。 The present invention mainly relates to a circuit board, which can be applied to various electronic devices such as computers, switches, charging devices, etc., and is mainly used for transmission of electric signals.

如第一圖所示，本實施例中線路板100具有基板1和設置於基板1上的線路結構。 As shown in the first figure, the circuit board 100 in this embodiment has a substrate 1 and a circuit structure arranged on the substrate 1.

其中，所述基板1厚度為0.5至1.7mm。所述基板1至少具有焊接區11和連接於焊接區11的佈線區12。所述焊接區11和佈線區12於基板1之長度方向上相鄰設置。於本實施例中，於所述基板1之長度方向上，所述基板1還具有設置於佈線區12遠離焊接區11一側之連接區13。所述佈線區12兩側分別設置有複數定位凹槽121，以對本發明線路板100或其他電子元件(未圖示)進行限位。 Wherein, the thickness of the substrate 1 is 0.5 to 1.7 mm. The substrate 1 has at least a soldering area 11 and a wiring area 12 connected to the soldering area 11. The bonding area 11 and the wiring area 12 are arranged adjacent to each other in the length direction of the substrate 1. In this embodiment, in the length direction of the substrate 1, the substrate 1 further has a connection area 13 disposed on the side of the wiring area 12 away from the soldering area 11. A plurality of positioning grooves 121 are respectively provided on both sides of the wiring area 12 to limit the position of the circuit board 100 or other electronic components (not shown) of the present invention.

結合第四圖所示，所述佈線結構至少包括有設置於所述焊接區11以連接導線801之接線焊盤21、設置於焊接區11和佈線區12內並電性連接接線焊盤21的導電線路(未圖示)。於本實施例中，所述佈線結構還包括設置於所述連接區13的金手指22。本實施例中，設置有金手指22的連接區13可以直接形成為一連接器(未圖示)之舌片，即直接藉由該連接區13與一對接連接器進行插接配合，來實現與對接連接器之間之訊號傳輸。當然，也可將所述金手指22與一連接器之導電端子(未圖示)進行焊接，進而實現前述導線801與連接器之電性連接和訊號傳輸與處理。 As shown in the fourth figure, the wiring structure includes at least a wiring pad 21 arranged in the welding area 11 to connect to the wire 801, and a wiring pad 21 arranged in the welding area 11 and the wiring area 12 and electrically connected to the wiring pad 21 Conductive circuit (not shown). In this embodiment, the wiring structure further includes The golden finger 22 of the connection area 13. In this embodiment, the connection area 13 provided with the golden fingers 22 can be directly formed as a tongue of a connector (not shown), that is, the connection area 13 is directly mated with a mating connector to achieve Signal transmission between and docking connector. Of course, the golden finger 22 can also be welded to a conductive terminal (not shown) of a connector, so as to realize the electrical connection between the wire 801 and the connector, as well as signal transmission and processing.

如第四圖所示，與本發明上述線路板100相焊接之數據傳輸線纜800包括複數並排設置之導線801，一體包覆複數所述導線801的塑膠層802、採用金屬料帶呈螺旋纏繞設置於所述塑膠層802外側而形成的金屬層803。所述金屬層803至少具有鋁箔層8031和設置於鋁箔層8031朝向塑膠層802一側的黏結層，所述金屬層803藉由所述黏結層熱熔後黏結固定於塑膠層802外側；一方面，可實現金屬層803與塑膠層802之間的緊密纏繞貼合；另一方面，於金屬層803朝向塑膠層802的一側設置黏結層，不僅可直接藉由黏結的方式將金屬層803固定於塑膠層802外側，使得整個線纜可以做得更薄，更柔軟；而且於黏結時還可將空氣排出，又因為黏結固定，使得排出的空氣無法進入，達到密實的效果，進而達到緊密包覆，高頻傳輸性能佳且柔軟輕薄的效果。 As shown in the fourth figure, the data transmission cable 800 welded to the above-mentioned circuit board 100 of the present invention includes a plurality of wires 801 arranged side by side, integrally covering the plastic layer 802 of the plurality of wires 801, and a metal strip is spirally wound. A metal layer 803 formed on the outside of the plastic layer 802. The metal layer 803 has at least an aluminum foil layer 8031 and an adhesive layer disposed on the side of the aluminum foil layer 8031 facing the plastic layer 802. The metal layer 803 is bonded and fixed to the outside of the plastic layer 802 by the adhesive layer; , It can realize the tight winding and bonding between the metal layer 803 and the plastic layer 802; on the other hand, an adhesive layer is provided on the side of the metal layer 803 facing the plastic layer 802, which can not only directly fix the metal layer 803 by bonding On the outside of the plastic layer 802, the entire cable can be made thinner and softer; and the air can be discharged during bonding, and because the bonding is fixed, the discharged air cannot enter, achieving a dense effect, thereby achieving a tight package Cover, good high frequency transmission performance and soft and thin effect.

所述導線801與接線焊盤21一一對應連接，並且相鄰導線801之中心間距與對應的相鄰接線焊盤21之中心間距相同；即，使得進行連接的兩者間距對應相同，從而無需進行彎曲拉線連接，縮短剝線長度，進而減少阻抗不連續之距離，提高訊號傳輸之穩定性，特別係在進行高頻訊號傳輸時，可進一步使得阻抗不連續處縮短，高頻特性更加穩定。 The wires 801 are connected to the wiring pads 21 in a one-to-one correspondence, and the center spacing of adjacent wires 801 is the same as the center spacing of the corresponding adjacent wiring pads 21; Make a bend cable connection to shorten the stripping length, thereby reducing the distance between impedance discontinuities and improving the stability of signal transmission. Especially when high-frequency signal transmission, it can further shorten the impedance discontinuity and make the high-frequency characteristics more stable. .

優選地，將複數所述導線801等間距排列設置，並且使得所述導線801之外徑等於相鄰導線801之中心間距。每一導線801分別具有一導體8011和包覆導體8011之絕緣包覆層8012；當然，所述導線801也可不設置所述包覆層8012，直接由所述塑膠層802進行絕緣包覆，也可實現相同的目的。所述包覆層8012和塑膠層802採用相同或相近之材料製成，優選採用高密度聚乙烯製成，以保證所述數據傳輸線纜800之相鄰層間之結合強度和整體柔韌性；另，優選採用介電係數接近空氣的塑膠材料製成，藉此可使得包覆層8012和塑膠層802之阻抗較小，從而可提供導體8011較好的訊號傳輸環境，減少訊號的傳播延遲，降低訊號之間的串擾，保證訊號的高速有效傳輸，減小訊號衰減。本發明中所述導體8011外徑採用31至34美國線規，相鄰導線801之中心間距與所述導體8011外徑的比值在1.4至2.8之間。 Preferably, a plurality of the wires 801 are arranged at equal intervals, and the outer diameter of the wires 801 is equal to the center distance between adjacent wires 801. Each wire 801 has a conductor 8011 and The insulating coating layer 8012 covering the conductor 8011; of course, the wire 801 may not be provided with the coating layer 8012, and the plastic layer 802 can be directly insulated and coated to achieve the same purpose. The covering layer 8012 and the plastic layer 802 are made of the same or similar materials, preferably made of high-density polyethylene, to ensure the bonding strength and overall flexibility of the adjacent layers of the data transmission cable 800; It is preferably made of a plastic material with a dielectric coefficient close to air, so that the impedance of the coating layer 8012 and the plastic layer 802 can be made smaller, thereby providing a better signal transmission environment for the conductor 8011, reducing signal propagation delay, and reducing the signal The crosstalk between them ensures high-speed and effective signal transmission and reduces signal attenuation. In the present invention, the outer diameter of the conductor 8011 adopts 31 to 34 US wire gauge, and the ratio of the center distance between adjacent wires 801 to the outer diameter of the conductor 8011 is between 1.4 and 2.8.

進一步地，本發明中所述接線焊盤21呈並排設置，於接線焊盤21之排布方向上，所述接線焊盤21具有至少兩個用以連接地線的地線焊盤G和設置於兩個地線焊盤G之間的訊號焊盤S；藉此，使得可藉由地線焊盤G排除訊號焊盤S周圍之雜訊，保證訊號焊盤S之訊號傳輸，進而提高訊號傳輸和處理效率。 Further, in the present invention, the wiring pads 21 are arranged side by side. In the arrangement direction of the wiring pads 21, the wiring pads 21 have at least two ground pads G for connecting ground wires and The signal pad S between the two ground wire pads G; thereby, the ground wire pad G can eliminate the noise around the signal pad S, ensure the signal transmission of the signal pad S, and improve the signal Transmission and processing efficiency.

另，所述金手指22也呈與所述接線焊盤21排布方向平行之並排設置。所述接線焊盤21和金手指22均具有沿其排布方向延伸之寬度和沿垂直排布方向之方向延伸之長度。所述焊接區11、佈線區12和連接區13係沿所述接線焊盤21和金手指22之長度方向依次排列設置。 In addition, the golden fingers 22 are also arranged side by side parallel to the arrangement direction of the wiring pads 21. The wiring pad 21 and the golden finger 22 each have a width extending along the arrangement direction and a length extending along the vertical arrangement direction. The bonding area 11, the wiring area 12 and the connection area 13 are arranged in sequence along the length direction of the wiring pad 21 and the golden finger 22.

如第一圖所示，於本實施例中，所述訊號焊盤S於相鄰兩個地線焊盤G之間之數量僅設置有兩個，並且，設置於相鄰兩個地線焊盤G之間的兩個所述訊號焊盤S構成用於傳輸差分訊號的訊號焊盤組。進一步地，所述接線焊盤21僅具有地線焊盤G和訊號焊盤組，並且所述地線焊盤G之數量比訊號焊盤組之數量多一。更進一步地，於本實施例中，於接線焊盤21之排布方向上，位於兩側緣之接線焊盤21為地線焊盤G，並且每相鄰兩個地線焊盤G之間具有一组所述訊號焊盤組。結合第一圖所示，本實施例所述接線焊盤21具有7個地線焊盤G和6組訊號焊盤組，所述金手指22端之訊號排布設計與所述接線焊盤21相匹配，從而可使本實施例中所述線路板100適用於Slimline SAS之標準規格，進而適用於進行相應訊號之傳輸。 As shown in the first figure, in this embodiment, the number of the signal pad S between two adjacent ground pads G is only set to two, and the number of the signal pads S between two adjacent ground wire pads The two signal pads S between the disks G constitute a signal pad group for transmitting differential signals. Further, the wiring pad 21 only has a ground pad G and a signal pad group, and the number of the ground pad G is one more than the number of the signal pad group. Furthermore, in this embodiment, in the arrangement direction of the wiring pads 21, two The wiring pad 21 on the side edge is a ground pad G, and there is a group of the signal pad groups between every two adjacent ground pads G. As shown in the first figure, the wiring pad 21 of this embodiment has 7 ground pads G and 6 signal pad groups. The signal arrangement design of the golden finger 22 is similar to the wiring pad 21 Therefore, the circuit board 100 described in this embodiment can be adapted to the standard specifications of Slimline SAS, and further suitable for the transmission of corresponding signals.

進一步地，習知接線焊盤之長度設置通常為2mm以上；而於本發明中，每一所述接線焊盤21設置為使其於垂直於其排布方向之方向上之長度不大於1.5mm，優選為小於1.3mm，進一步優選設置為小於1.1mm，即使得所述接線焊盤21之長度盡可能縮短，從而減小相應導線801剝離長度和導線801剝離後與接線焊盤21的焊接長度，進而在進行高頻訊號傳輸時，可進一步使得阻抗不連續處縮短，高頻特性更加穩定。 Further, the length of the conventional wiring pads is usually set to 2mm or more; and in the present invention, each of the wiring pads 21 is set such that the length in the direction perpendicular to its arrangement direction is not greater than 1.5mm , Preferably less than 1.3mm, and further preferably set to less than 1.1mm, that is, the length of the wiring pad 21 is shortened as much as possible, thereby reducing the stripped length of the corresponding wire 801 and the welding length of the wire 801 with the wiring pad 21 after stripping , In addition, during high-frequency signal transmission, the impedance discontinuity can be further shortened, and the high-frequency characteristics are more stable.

優選地，本發明中，每一所述接線焊盤21佔據焊接區11之面積小於0.39mm2；優選地，所述接線焊盤21具有於其排布方向上之寬度，每一所述接線焊盤21之長度與寬度之比值小於5.8，即在同等面積下，盡量減小接線焊盤21之長度與寬度之比值，使得接線焊盤21接近正方形設置，從而長度減小，進一步減小阻抗不連續之距離，而寬度適當，可保證與導線焊接之穩定性。 Preferably, in the present invention, each of the wiring pads 21 occupies an area of less than 0.39 mm2 in the bonding area 11; preferably, the wiring pads 21 have a width in the arrangement direction, and each of the wiring pads The ratio of the length to the width of the disk 21 is less than 5.8, that is, under the same area, try to reduce the ratio of the length to the width of the wiring pad 21, so that the wiring pad 21 is arranged close to a square, thereby reducing the length and further reducing the impedance. The continuous distance and proper width can ensure the stability of welding with the wire.

於本發明中，每一所述接線焊盤21之寬度小於0.28mm，以保證相鄰接線焊盤21之間距設置空間；優選地，該寬度大於上述導體8011之外徑。本發明中相鄰兩個所述接線焊盤21之間之距離不小於0.13mm；藉此方便相鄰導線之焊接，避免因間距較小而發生相互黏結或焊接短路等問題。 In the present invention, the width of each of the bonding pads 21 is less than 0.28 mm to ensure a space between adjacent bonding pads 21; preferably, the width is greater than the outer diameter of the conductor 8011. In the present invention, the distance between two adjacent bonding pads 21 is not less than 0.13mm; this facilitates the welding of adjacent wires, and avoids problems such as mutual adhesion or welding short circuit due to the small distance.

於本實施例中，所述接線焊盤21於其排布方向上為等間距設置，且相鄰接線焊盤21之中心間距在0.30mm至0.42mm之間；該種設置匹配所述數據傳輸線纜800之間距設置，從而無需對導線所述數據傳輸線纜800內之導線801進行拉伸或折彎處理，即可直接進行一一對接焊接，方便兩者之連接，進一步減小導線801所需之剝離長度，進一步使得阻抗不連續處縮短，高頻特性更加穩定。 In this embodiment, the wiring pads 21 are arranged at equal intervals in the arrangement direction, and the center distance between adjacent wiring pads 21 is between 0.30mm and 0.42mm; this arrangement matches the data The distance between the transmission cables 800 is set so that the wires 801 in the data transmission cable 800 do not need to be stretched or bent, and one-to-one welding can be directly performed to facilitate the connection between the two and further reduce the number of wires 801. The required stripping length further shortens the impedance discontinuity and makes the high frequency characteristics more stable.

另，於所述接線焊盤21之長度方向上，所述接線焊盤21具有靠近佈線區12之第一邊緣和遠離佈線區12之第二邊緣，所述第二邊緣與焊接區11遠離佈線區12之基板1邊緣之距離小於1mm；即盡量減少非必要區域之長度，進而縮短導線801所需之剝離長度，使得阻抗不連續處縮短，高頻特性更加穩定。 In addition, in the length direction of the wiring pad 21, the wiring pad 21 has a first edge close to the wiring area 12 and a second edge away from the wiring area 12, and the second edge and the bonding area 11 are far away from the wiring. The distance between the edge of the substrate 1 in zone 12 is less than 1mm; that is, minimize the length of unnecessary areas, thereby shortening the stripping length of the wire 801, so that the impedance discontinuity is shortened, and the high frequency characteristics are more stable.

進一步地，於所述接線焊盤之長度方向上，優選使所述接線焊盤21之第一邊緣至焊接區11遠離佈線區12之基板11邊緣之長度不大於2mm；可進一步限制影響阻抗不連續之距離，保證高頻訊號傳輸時之高頻特性之穩定性。 Further, in the length direction of the wiring pad, it is preferable that the length from the first edge of the wiring pad 21 to the edge of the substrate 11 where the bonding area 11 is far from the wiring area 12 is not more than 2 mm; The continuous distance ensures the stability of the high-frequency characteristics during high-frequency signal transmission.

如上為本發明線路板100之第一較佳實施例之整體佈局設計，藉由該種設置不僅可有效排除訊號焊盤S周圍之雜訊，保證訊號焊盤S之訊號傳輸，進而提高訊號傳輸和處理效率。 The above is the overall layout design of the first preferred embodiment of the circuit board 100 of the present invention. This configuration can not only effectively eliminate the noise around the signal pad S, but also ensure the signal transmission of the signal pad S, thereby improving signal transmission. And processing efficiency.

另，上述實施例中，接線焊盤21之尺寸設置、接線焊盤21第二邊緣與基板1邊緣之距離設置、以及接線焊盤21與導線801一一對應之相關設置，均可單獨作為縮短阻抗不連續之距離之技術方案，當然也可兩者或三者共存設置，以保證進行高頻訊號傳輸之高頻特性之穩定性。 In addition, in the above-mentioned embodiment, the size setting of the wiring pad 21, the distance setting between the second edge of the wiring pad 21 and the edge of the substrate 1, and the related setting of the wiring pad 21 and the wire 801 in one-to-one correspondence can be individually shortened. The technical solution for the distance of discontinuous impedance, of course, can also be set with two or three coexistence to ensure the stability of the high-frequency characteristics of high-frequency signal transmission.

請參閱第二圖所示為本發明線路板100’之第二較佳實施例，該線路板100’之整體設置方式與上述第一較佳實施例較為相近，僅有如下不同之處。 Please refer to the second figure which shows the second preferred embodiment of the circuit board 100' of the present invention. The overall arrangement of the circuit board 100' is similar to the above-mentioned first preferred embodiment, except for the following differences.

於該實施例中，所述接線焊盤21’和金手指22’之數量設置與第一較佳實施例不同，具體地，所述訊號焊盤S之數量係地線焊盤G數量之兩倍。進一步地，所述訊號焊盤S除包括設置於相鄰地線焊盤G之間以傳輸差分訊號之訊號焊盤組之外，還具有設置於所述地線焊盤G外側之其他單端訊號焊盤，並且於接線焊盤21’之排布方向上，位於兩側緣之接線焊盤21’為訊號焊盤S。 In this embodiment, the number of the wiring pads 21' and gold fingers 22' is different from that of the first preferred embodiment. Specifically, the number of the signal pads S is two of the number of the ground pads G Times. Further, the signal pad S not only includes a signal pad group arranged between adjacent ground pads G to transmit differential signals, but also has other single ends arranged outside the ground pad G The signal pads, and in the arrangement direction of the wire pads 21', the wire pads 21' located on both sides of the edge are the signal pads S.

請參閱第三圖所示為本發明線路板300之第三較佳實施例，該線路板300之整體設置方式與上述第一較佳實施例較為相近，僅有如下不同之處。 Please refer to the third figure which shows the third preferred embodiment of the circuit board 300 of the present invention. The overall arrangement of the circuit board 300 is similar to the above-mentioned first preferred embodiment, except for the following differences.

於該實施例中，所述接線焊盤41和金手指42之數量設置與第一較佳實施例不同，具體地，本實施例中所述地線焊盤G之數量比訊號焊盤S之數量多一。進一步地，所述訊號焊盤S僅包括單端訊號焊盤，並且訊號焊盤S和地線焊盤G交錯排布。進一步地，於接線焊盤41之排布方向上，位於兩側緣之接線焊盤41為地線焊盤G。 In this embodiment, the number of wiring pads 41 and gold fingers 42 is different from that of the first preferred embodiment. Specifically, the number of ground pads G in this embodiment is greater than that of signal pads S. One more quantity. Further, the signal pads S only include single-ended signal pads, and the signal pads S and the ground pads G are arranged alternately. Further, in the arrangement direction of the wiring pads 41, the wiring pads 41 located on the two side edges are the ground pads G.

綜合上述說明可知，本發明還涉及一種電連接組件，其包括所述線路板100、100’、300和與該線路板100、100’、300相焊接的數據傳輸線纜800，所述數據傳輸線纜800中之導線801之訊號排布設計與所述線路板100、100’、300上各接線焊盤21、21’、41分別對應匹配，並且所述數據傳輸線纜800具有與接線焊盤21、21’、41相焊接之對接部分，所述對接部分係將所述金屬層803、塑膠層802和包覆層8012去除，露出導體8011部分，從而藉由導體8011與接線焊盤21、21’、41進行焊接。 Based on the above description, the present invention also relates to an electrical connection assembly, which includes the circuit board 100, 100', 300 and a data transmission cable 800 welded to the circuit board 100, 100', 300, the data transmission cable The signal arrangement design of the wire 801 in the 800 corresponds to the wiring pads 21, 21', 41 on the circuit boards 100, 100', 300, respectively, and the data transmission cable 800 has the same wiring pads 21, 21', 41 are welded to the butt part, the butt part is to remove the metal layer 803, the plastic layer 802 and the cladding layer 8012, exposing the conductor 8011 part, so that the conductor 8011 and the wiring pad 21, 21' , 41 for welding.

結合上述接線焊盤21、21’、41之設置，本發明中可使得所述數據傳輸線纜800去除所述金屬層803、塑膠層802和包覆層8012之對接部分之長度有效縮短。進一步地，相鄰導線801之中心間距設置為與所述接線焊盤21、21’、41之中心間距相匹配，即設置為在0.30至0.42mm之間，還使得數據傳輸線纜800之導線801與接線焊盤21、21’、41可進行直接對位焊接，該等均可限制影響阻抗不連續之距離，保證高頻訊號傳輸時之高頻特性之穩定性。 In combination with the above-mentioned arrangement of the wiring pads 21, 21', 41, the length of the mating part of the data transmission cable 800 after removing the metal layer 803, the plastic layer 802 and the covering layer 8012 can be effectively shortened in the present invention. Further, the center spacing of adjacent wires 801 is set to match the center spacing of the wiring pads 21, 21', 41, that is, set to be between 0.30 to 0.42 mm, so that the wires 801 of the data transmission cable 800 It can be directly welded with the wiring pads 21, 21', 41, which can limit the influence of resistance The anti-discontinuity distance ensures the stability of high-frequency characteristics during high-frequency signal transmission.

特別需要指出，對於本領域之普通技藝人員來說，在本發明之教導下所作之針對本發明之等效變化，仍應包含在本發明申請專利範圍所主張之範圍中。 In particular, it should be pointed out that for those of ordinary skill in the art, equivalent changes made to the present invention under the teaching of the present invention should still be included in the claimed scope of the patent application of the present invention.

100:線路板 100: circuit board

1:基板 1: substrate

11:焊接區 11: Welding area

12:佈線區 12: Wiring area

13:連接區 13: Connection area

121:定位凹槽 121: positioning groove

21:接線焊盤 21: Wiring pad

22:金手指 22: Golden Finger

G:地線焊盤 G: Ground pad

S:訊號焊盤 S: signal pad

Claims

一種線路板，包括：基板，基板具有焊接區和連接焊接區的佈線區；線路結構，設置於基板上，所述線路結構具有複數設置於基板之焊接區以連接導線的接線焊盤、設置於焊接區和佈線區內並電性連接接線焊盤的導電線路，所述焊接區與佈線區於接線焊盤之長度方向上相鄰設置，於所述接線焊盤之長度方向上，所述接線焊盤具有靠近佈線區之第一邊緣和遠離佈線區之第二邊緣；其中，所述接線焊盤呈並排設置，並且具有沿其排布方向延伸之寬度和沿與垂直排布方向之方向延伸之長度，所述接線焊盤之長度小於1.5mm。 A circuit board includes: a substrate with a welding area and a wiring area connected to the welding area; a circuit structure arranged on the substrate, the circuit structure having a plurality of wiring pads arranged on the welding area of the substrate for connecting wires, and The bonding area and the wiring area are electrically connected to the conductive lines of the wiring pad. The bonding area and the wiring area are arranged adjacently in the length direction of the wiring pad. In the length direction of the wiring pad, the wiring The pad has a first edge close to the wiring area and a second edge far from the wiring area; wherein the wiring pads are arranged side by side, and have a width extending along the arrangement direction and a direction perpendicular to the arrangement direction The length of the wiring pad is less than 1.5mm.

如申請專利範圍第1項所述之線路板，其中每一所述接線焊盤佔據焊接區之面積均小於0.39mm²。 As for the circuit board described in item 1 of the scope of patent application, the area occupied by each of the bonding pads is less than 0.39 mm ² .

如申請專利範圍第2項所述之線路板，其中每一所述接線焊盤之長度與寬度之比值小於5.8。 As for the circuit board described in item 2 of the scope of patent application, the ratio of the length to the width of each of the wiring pads is less than 5.8.

一種線路板，包括：基板，基板具有焊接區和連接焊接區的佈線區；線路結構，設置於基板上，所述線路結構具有複數設置於基板之焊接區以連接導線的接線焊盤、設置於焊接區和佈線區內並電性連接接線焊盤的導電線路；其中所述焊接區與佈線區於接線焊盤之長度方向上相鄰設置；於所述接線焊盤之長度方向上，所述接線焊盤具有靠近佈線區之第一邊緣和遠離佈線區之第二邊緣，所述第二邊緣與焊接區遠離佈線區之基板邊緣之距離小於1mm。 A circuit board includes: a substrate with a welding area and a wiring area connected to the welding area; a circuit structure arranged on the substrate, the circuit structure having a plurality of wiring pads arranged on the welding area of the substrate for connecting wires, and The bonding area and the wiring area are electrically connected to the conductive circuit of the wiring pad; wherein the bonding area and the wiring area are arranged adjacently in the length direction of the wiring pad; in the length direction of the wiring pad, the The wiring pad has a first edge close to the wiring area and a second edge away from the wiring area. The distance between the second edge and the edge of the substrate where the bonding area is far from the wiring area is less than 1 mm.

如申請專利範圍第1項或第4項所述之線路板，其中於所述接線焊盤之長度方向上，所述接線焊盤之第一邊緣至焊接區遠離佈線區之基板邊緣之長度不大於2mm。 The circuit board described in item 1 or item 4 of the scope of patent application, wherein in the length direction of the bonding pad, the length from the first edge of the bonding pad to the edge of the substrate where the bonding area is far from the wiring area is not More than 2mm.

一種電連接組件，包括：線路板，所述線路板具有基板和設置於基板上的線路結構，所述基板具有焊接區和連接焊接區的佈線區；所述線路結構具有複數設置於基板之焊接區以連接導線的接線焊盤、設置於焊接區和佈線區內並電性連接接線焊盤的導電線路；數據傳輸線纜，與所述線路板相焊接，所述數據傳輸線纜具有複數並排設置之導線、一體包覆複數所述導線之塑膠層和採用金屬料帶呈螺旋纏繞設置於所述塑膠層外側而形成的金屬層；每一所述導線具有一導體，所述金屬層至少具有鋁箔層和設置於鋁箔層朝向塑膠層一側的黏結層，所述金屬層藉由所述黏結層熱熔後黏結固定於塑膠層外側；其中，所述導線與接線焊盤一一對應連接，並且相鄰導線之中心間距與對應的相鄰接線焊盤之中心間距相同。 An electrical connection assembly includes: a circuit board having a substrate and a circuit structure arranged on the substrate, the substrate having a welding area and a wiring area connected to the welding area; the circuit structure has a plurality of weldings arranged on the substrate The area consists of wiring pads for connecting wires, conductive lines arranged in the welding area and the wiring area and electrically connected to the wiring pads; data transmission cables are soldered to the circuit board, and the data transmission cables have a plurality of side by side Conductors, plastic layers integrally covering a plurality of the conductors, and metal layers formed by spirally winding metal strips on the outside of the plastic layer; each of the conductors has a conductor, and the metal layer has at least an aluminum foil layer And a bonding layer disposed on the side of the aluminum foil layer facing the plastic layer, the metal layer is bonded and fixed to the outside of the plastic layer by the bonding layer after heat fusion; wherein, the wires and the wiring pads are connected in a one-to-one correspondence and are connected The center spacing of adjacent wires is the same as the center spacing of the corresponding adjacent wiring pads.

如申請專利範圍第6項所述之電連接組件，其中，於所述接線焊盤之長度方向上，所述接線焊盤具有靠近佈線區之第一邊緣和遠離佈線區之第二邊緣，所述數據傳輸線纜具有露出導體而使導體與接線焊盤相焊接之對接部分，所述對接部分之長度與所述接線焊盤之第一邊緣至焊接區遠離佈線區之邊緣的長度相匹配，均設置為不大於2mm。 The electrical connection assembly described in item 6 of the scope of patent application, wherein, in the length direction of the wiring pad, the wiring pad has a first edge close to the wiring area and a second edge away from the wiring area, so The data transmission cable has a butt portion where the conductor is exposed to weld the conductor and the wiring pad, and the length of the butt portion matches the length from the first edge of the wiring pad to the edge of the bonding area away from the wiring area. Set to not more than 2mm.

如申請專利範圍第6項所述之電連接組件，其中所述導體外徑採用31至34美國線規，所述接線焊盤和導線於其排布方向上均為等間距設置，並且相鄰接線焊盤和相鄰導線之中心間距均設置在0.30mm至0.42mm之間。 The electrical connection assembly as described in item 6 of the scope of patent application, wherein the outer diameter of the conductor adopts 31 to 34 U.S. wire gauge, and the wiring pads and wires are arranged at equal intervals in the arrangement direction, and And the center distance between adjacent wiring pads and adjacent wires is set between 0.30mm and 0.42mm.

如申請專利範圍第6項所述之電連接組件，其中每一所述接線焊盤之寬度小於0.28mm。 According to the electrical connection assembly described in item 6 of the scope of patent application, the width of each of the wiring pads is less than 0.28 mm.

如申請專利範圍第6項所述之電連接組件，其中相鄰兩個所述接線焊盤之間之距離不小於0.13mm。 According to the electrical connection assembly described in item 6 of the scope of patent application, the distance between two adjacent wiring pads is not less than 0.13mm.