CN110557888A - circuit board and electric connection assembly - Google Patents
circuit board and electric connection assembly Download PDFInfo
- Publication number
- CN110557888A CN110557888A CN201910195813.3A CN201910195813A CN110557888A CN 110557888 A CN110557888 A CN 110557888A CN 201910195813 A CN201910195813 A CN 201910195813A CN 110557888 A CN110557888 A CN 110557888A
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- wiring
- pads
- substrate
- area
- pad
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- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 19
- 239000004033 plastic Substances 0.000 claims description 21
- 229920003023 plastic Polymers 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 41
- 230000008054 signal transmission Effects 0.000 description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 12
- 239000010931 gold Substances 0.000 description 12
- 229910052737 gold Inorganic materials 0.000 description 12
- 210000001503 joint Anatomy 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
- H01B7/0216—Two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
- H01B7/0225—Three or more layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0823—Parallel wires, incorporated in a flat insulating profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0861—Flat or ribbon cables comprising one or more screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
Landscapes
- Insulated Conductors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Communication Cables (AREA)
Abstract
The invention provides a circuit board and an electrical connection assembly. The electric connector assembly comprises the circuit board and a data transmission cable welded with the circuit board. The circuit board comprises a substrate and a circuit structure arranged on the substrate. The substrate has a land and a wiring region connecting the lands. The circuit structure is provided with a plurality of wiring pads which are arranged on the welding area of the substrate and are connected with the conducting wires, and conducting circuits which are arranged in the welding area and the wiring area and are electrically connected with the wiring pads. The terminal pad is the setting side by side to have the width that extends along its direction of arranging and the length that extends along the direction of arranging perpendicularly, the length of terminal pad is less than 1.5 mm.
Description
Technical Field
The invention relates to the technical field of electric connection, in particular to a circuit board and an electric connection assembly capable of improving signal transmission stability.
Background
Circuit boards are commonly provided in electronic devices to perform soldering and electrical connection of electronic components. Generally, a plurality of gold fingers or pads are disposed on the circuit board, and a wiring design electrically connected to the gold fingers or pads is disposed inside the circuit board, and the gold fingers or pads are soldered to an electrical connector or a wire, so as to achieve transmission or processing of input or output signals at the end of the electrical connector or the wire. However, the conventional circuit board does not correspond to the connection portion of the lead, the outer layer of the lead needs to be peeled off and the lead needs to be bent and connected, so that the impedance changes at the connection portion, and the conventional connection scheme has more exposed wire stripping, so that the impedance discontinuity length is longer, and the stability of signal transmission is affected.
Therefore, there is a need for improvement of the prior art to overcome the above technical problems.
Disclosure of Invention
The invention aims to provide a circuit board and an electric connection assembly capable of improving signal transmission stability.
To achieve the above object, the present invention provides a wiring board including a substrate having a land and a wiring region connecting the lands; the circuit structure is arranged on the substrate and is provided with a plurality of wiring pads which are arranged on the welding area of the substrate and are connected with the conducting wires, and conducting circuits which are arranged in the welding area and the wiring area and are electrically connected with the wiring pads; the wiring pad is arranged side by side and has a width extending along the arrangement direction of the wiring pad and a length extending along the direction perpendicular to the arrangement direction, and the length of the wiring pad is smaller than 1.5 mm.
As a further improvement of the present invention, each of the terminal pads occupies a land area of less than 0.39mm 2.
As a further improvement of the present invention, wherein the ratio of the length to the width of each of said terminal pads is less than 5.8.
In order to achieve the above object, the present invention also provides a circuit board, including: a substrate having a land and a wiring region connecting the lands; the circuit structure is arranged on the substrate and is provided with a plurality of wiring pads which are arranged on the welding area of the substrate and are connected with the conducting wires, and conducting circuits which are arranged in the welding area and the wiring area and are electrically connected with the wiring pads; wherein the bonding area and the wiring area are adjacently arranged in the length direction of the wiring pad; in the length direction of the wiring pad, the wiring pad has a first edge close to the wiring area and a second edge far from the wiring area, and the distance between the second edge and the edge of the substrate of the welding area far from the wiring area is less than 1 mm.
As a further improvement of the present invention, wherein a length from the first edge of the terminal pad to an edge of the substrate where the land is away from the wiring area is not more than 2mm in a length direction of the terminal pad.
To achieve the above object, the present invention also provides an electrical connection assembly, comprising: a wiring board having a substrate and a wiring structure provided on the substrate, the substrate having a land and a wiring region connecting the lands; the circuit structure is provided with a plurality of wiring pads which are arranged on the welding area of the substrate and are connected with the conducting wires, and conducting circuits which are arranged in the welding area and the wiring area and are electrically connected with the wiring pads; the data transmission cable is welded with the circuit board and is provided with a plurality of wires arranged side by side, a plastic layer integrally coating the wires and a metal layer formed by spirally winding a metal material belt on the outer side of the plastic layer; each lead is provided with a conductor, the metal layer at least comprises an aluminum foil layer and a bonding layer arranged on one side of the aluminum foil layer facing to the plastic layer, and the metal layer is fixed on the outer side of the plastic layer in a bonding mode after being subjected to hot melting through the bonding layer; the wires are connected with the wiring pads in a one-to-one correspondence mode, and the center distance between every two adjacent wires is the same as the center distance between every two corresponding adjacent wiring pads.
As a further improvement of the present invention, wherein the land has a first edge close to the wiring area and a second edge far from the wiring area in a length direction of the land, the data transmission cable has a butt joint portion exposing the conductor to solder the conductor to the land, and a length of the butt joint portion matches a length from the first edge of the land to the edge of the land far from the wiring area, and is set to be not more than 2 mm.
as a further improvement of the invention, the conductor outer diameter adopts a wire gauge of 31-34 American, the wiring pads and the wires are arranged at equal intervals in the arrangement direction, and the center intervals of the adjacent wiring pads and the adjacent wires are arranged between 0.30mm and 0.42 mm.
As a further improvement of the present invention, wherein each of the terminal pads has a width of less than 0.28 mm.
As a further improvement of the present invention, a distance between adjacent two of the terminal pads is not less than 0.13 mm.
the invention has the beneficial effects that: the length of the conventional wiring pad is usually set to be more than 2mm, so that the signal transmission stability caused by impedance discontinuity is difficult to effectively improve, the length of the wiring pad is set to be not more than 1.5mm, the distance from the edge of the wiring pad to the edge of a circuit board substrate is reduced, the wiring pads and the wires are in one-to-one correspondence, namely, the distances are the same, and further, the connection of pull wires does not need to be bent, namely, the conductor length of the exposed butt joint wires is shortened as much as possible through the schemes, so that the impedance discontinuity distance is reduced, the signal transmission stability is improved, particularly, when high-frequency signal transmission is carried out, the impedance discontinuity can be further shortened, and the high-frequency characteristic is more stable.
Drawings
FIG. 1 is a top view of a first preferred embodiment of the wiring board of the present invention;
FIG. 2 is a top view of a second preferred embodiment of the wiring board of the present invention;
FIG. 3 is a top view of a third preferred embodiment of the wiring board of the present invention;
FIG. 4 is a perspective view of a data transmission cable connected to the circuit board of the present invention;
Fig. 5 is a front view of the data transmission cable shown in fig. 4.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.
The invention mainly relates to a circuit board which can be applied to various electronic equipment such as computers, exchangers, charging devices and the like and is mainly used for transmitting electric signals.
As shown in fig. 1, the circuit board 100 of the present embodiment has a substrate 1 and a circuit structure disposed on the substrate 1.
Wherein the thickness of the substrate 1 is 0.5 to 1.7 mm. The substrate 1 has at least a land 11 and a wiring region 12 connected to the land 11. The land 11 and the wiring region 12 are adjacently disposed in the longitudinal direction of the substrate 1. In the present embodiment, the substrate 1 further has a connection region 13 provided on the side of the wiring region 12 away from the land 11 in the length direction of the basic substrate 1. A plurality of positioning grooves 121 are respectively disposed on two sides of the wiring region 12 for limiting the circuit board 100 or other electronic components (not shown).
As shown in fig. 4, the wiring structure at least includes a bonding pad 21 disposed on the bonding pad 11 to connect with the conductive line 801, and a conductive trace (not shown) disposed in the bonding pad 11 and the wiring region 12 and electrically connected to the bonding pad 21. In this embodiment, the wiring structure further includes a gold finger 22 disposed on the connection region 13. In this embodiment, the connection area 13 provided with the gold finger 22 may be directly formed as a tongue piece of a connector (not shown), that is, the connection area 13 is directly inserted into and matched with a mating connector to realize signal transmission with the mating connector. Of course, the gold finger 22 may be soldered to a conductive terminal (not shown) of a connector, so as to electrically connect the conductive wire 801 and the connector and transmit and process signals.
As shown in fig. 4, the data transmission cable 800 welded to the circuit board 100 of the present invention includes a plurality of wires 801 arranged side by side, a plastic layer 802 integrally covering the plurality of wires 801, and a metal layer 803 formed by spirally winding a metal strip around the plastic layer 802. The metal layer 803 at least comprises an aluminum foil layer 8031 and an adhesive layer arranged on one side of the aluminum foil layer 8031 facing the plastic layer 802, and the metal layer 803 is fixed on the outer side of the plastic layer 802 by the adhesive layer after being hot-melted; on one hand, the metal layer 803 can be tightly wound and attached to the plastic layer 802; on the other hand, the bonding layer is arranged on the side of the metal layer 803 facing the plastic layer 802, so that the metal layer 803 can be directly fixed on the outer side of the plastic layer 802 in a bonding manner, and the whole cable can be thinner and more flexible; and still can discharge the air when bonding, because the bonding is fixed again for discharged air can't get into, reaches closely knit effect, and then reaches inseparable cladding, and high frequency transmission performance is good and soft frivolous effect.
The wires 801 are connected with the wiring pads 21 in a one-to-one correspondence manner, and the center distance between adjacent wires 801 is the same as the center distance between corresponding adjacent wiring pads 21; namely, the distance between the two parts to be connected is correspondingly the same, so that the connection of a bent pull wire is not needed, the length of the wire stripping is shortened, the discontinuous distance of impedance is reduced, the stability of signal transmission is improved, particularly, when high-frequency signal transmission is carried out, the discontinuous part of the impedance can be further shortened, and the high-frequency characteristic is more stable.
Preferably, a plurality of the wires 801 are arranged at equal intervals, and the outer diameter of each wire 801 is equal to the center-to-center distance between adjacent wires 801. Each conducting wire 801 is provided with a conductor 8011 and an insulating coating 8012 coating the conductor 8011; of course, the lead 801 may not be provided with the covering layer 8012, and may be directly insulated and covered by the plastic layer 802, which may also achieve the same purpose. The covering layer 8012 and the plastic layer 802 are made of the same or similar materials, preferably high-density polyethylene, so as to ensure the bonding strength and the overall flexibility of adjacent layers of the data transmission cable 800; in addition, the plastic material with a dielectric coefficient close to air is preferably used for manufacturing, so that the impedances of the cladding layer 8012 and the plastic layer 802 are smaller, a better signal transmission environment of the conductor 8011 can be provided, the propagation delay of signals is reduced, the crosstalk between the signals is reduced, the high-speed effective transmission of the signals is ensured, and the signal attenuation is reduced. The outer diameter of the conductor 8011 is 31-34 American wire gauge, and the ratio of the outer diameter of the conductor 8011 to the center-to-center distance between adjacent wires 801 is 1.4-2.8.
Further, in the present invention, the wiring pads 21 are arranged side by side, and in the arrangement direction of the wiring pads 21, the wiring pads 21 have at least two ground pads G for connecting a ground line and a signal pad S disposed between the two ground pads G; therefore, noise around the signal bonding pad S can be eliminated through the ground wire bonding pad G, signal transmission of the signal bonding pad S is guaranteed, and signal transmission and processing efficiency is improved.
In addition, the gold fingers 22 are also arranged side by side in parallel with the arrangement direction of the bonding pads 21. The terminal pads 21 and the gold fingers 22 each have a width extending in the direction of arrangement thereof and a length extending in the direction perpendicular to the direction of arrangement. The land 11, the wiring region 12 and the connection region 13 are arranged in this order along the longitudinal direction of the land pad 21 and the gold finger 22.
As shown in fig. 1, in the present embodiment, the number of the signal pads S between two adjacent ground pads G is only two, and two of the signal pads S disposed between two adjacent ground pads G constitute a signal pad group for transmitting a differential signal. Further, the wiring pad 21 has only the ground pad G and the signal pad group, and the number of the ground pad G is one more than the number of the signal pad group. Further, in the present embodiment, in the arrangement direction of the wiring pads 21, the wiring pads 21 located at both side edges are the ground pads G, and there is a pair of signal pad groups between every adjacent two ground pads G. Referring to fig. 1, the connection pad 21 of this embodiment has 7 ground pads G and 6 signal pad groups, and the signal arrangement design at the end of the gold finger 22 is matched with the connection pad 21, so that the circuit board 100 of this embodiment is suitable for standard specification of slim SAS, and is further suitable for transmission of corresponding signals.
Further, the length setting of the conventional terminal pad is generally 2mm or more; in the present invention, each of the bonding pads 21 is set such that the length in the direction perpendicular to the arrangement direction thereof is not more than 1.5mm, preferably less than 1.3mm, and more preferably less than 1.1mm, i.e., the length of the bonding pad 21 is made as short as possible, thereby reducing the peeling length of the corresponding wire 801 and the bonding length between the wire 801 and the bonding pad 21 after peeling, and further, when transmitting a high-frequency signal, the impedance discontinuity can be further shortened, and the high-frequency characteristic is more stable.
In the present invention, it is preferable that the area of the land 11 occupied by each of the terminal pads 21 is less than 0.39mm 2, and it is preferable that the terminal pads 21 have a width in the arrangement direction thereof, and the ratio of the length to the width of each of the terminal pads 21 is less than 5.8, that is, in the same area, the ratio of the length to the width of the terminal pad 21 is minimized so that the terminal pad 21 is disposed in a nearly square shape, thereby reducing the length, further reducing the distance of impedance discontinuity, and having a proper width, which can ensure the stability of the bonding with the wire.
in the invention, the width of each wiring pad 21 is less than 0.28mm, so as to ensure the space for arranging the distance between the adjacent wiring pads 21; preferably, the width is greater than the outer diameter of the conductor 8011. The distance between two adjacent wiring pads 21 is not less than 0.13 mm; therefore, the welding of the adjacent leads is convenient, and the problems of mutual adhesion or welding short circuit and the like caused by small distance are avoided.
in the present embodiment, the bonding pads 21 are arranged at equal intervals in the arrangement direction, and the center-to-center interval between adjacent bonding pads 21 is between 0.30mm and 0.42 mm; this kind of setting matching data transmission cable 800's interval sets up to need not to the wire 801 in the data transmission cable 800 is stretched or is bent the processing, can directly carry out butt joint welding one by one, makes things convenient for connection between them, further reduces the required length of peeling off of wire 801, further makes impedance discontinuity department shorten, and the high frequency characteristic is more stable.
In addition, in the length direction of the terminal pad 21, the terminal pad 21 has a first edge close to the wiring region 12 and a second edge distant from the wiring region 12, the second edge being less than 1mm from the edge of the substrate 1 where the land 11 is distant from the wiring region 12; that is, the length of the unnecessary region is reduced as much as possible, and the peeling length required for the conductive wire 801 is further reduced, so that the impedance discontinuity is reduced, and the high-frequency characteristics are more stable.
Further, in the length direction of the wire pad, it is preferable that the length from the first edge of the wire pad 21 to the edge of the substrate 11 where the land 11 is away from the wiring region 12 is not more than 2 mm; the distance influencing impedance discontinuity can be further limited, and the stability of high-frequency characteristics during high-frequency signal transmission is ensured.
As described above, the overall layout design of the first preferred embodiment of the circuit board 100 of the present invention can effectively eliminate the noise around the signal pad S, ensure the signal transmission of the signal pad S, and further improve the signal transmission and processing efficiency.
in addition, in the above embodiment, the size of the connection pad 21, the distance between the second edge of the connection pad 21 and the edge of the substrate 1, and the one-to-one correspondence between the connection pad 21 and the conductive wire 801 may be individually used as a technical solution for shortening the impedance discontinuity distance, or of course, two or three of them may be arranged together to ensure the stability of the high frequency characteristic of the high frequency signal transmission.
Referring to fig. 2, a second preferred embodiment of the circuit board 100 'of the present invention is shown, the overall configuration of the circuit board 100' is similar to that of the first preferred embodiment, and there are only the following differences.
In this embodiment, the number of the terminal pads 21 'and the gold fingers 22' is set differently from the first preferred embodiment, and specifically, the number of the signal pads S is twice the number of the ground pads G. Further, the signal pads S include signal pad groups that are disposed between adjacent ground pads G to transmit differential signals, and also have other single-ended signal pads disposed outside the ground pads G, and in the arrangement direction of the connection pads 21 ', the connection pads 21' on both side edges are the signal pads S.
Referring to fig. 3, a third preferred embodiment of the circuit board 300 of the present invention is shown, the overall configuration of the circuit board 300 is similar to that of the first preferred embodiment, and there are only the following differences.
In this embodiment, the number of the wiring pads 41 and the gold fingers 42 is set differently from the first preferred embodiment, and specifically, the number of the ground pads G is one more than the number of the signal pads S in this embodiment. Further, the signal pads S include only single-ended signal pads, and the signal pads S and the ground pads G are arranged in a staggered manner. Further, in the arrangement direction of the wiring pads 41, the wiring pads 41 at both side edges are ground pads G.
as can be seen from the above description, the present invention further relates to an electrical connection assembly, which includes the circuit board 100, 100 ', 300 and a data transmission cable 800 soldered to the circuit board 100, 100', 300, wherein the signal arrangement design of the conductive wires 801 in the data transmission cable 800 is respectively matched with the wiring pads 21, 21 ', 41 on the circuit board 100, 100', 300, and the data transmission cable 800 has a butt joint portion soldered to the wiring pads 21, 21 ', 41, and the butt joint portion is formed by removing the metal layer 803, the plastic layer 802 and the covering layer 8012 to expose the conductor 8011, so that the conductor 8011 is soldered to the wiring pads 21, 21', 41.
In combination with the arrangement of the bonding pads 21, 21', 41, the length of the data transmission cable 800 without the abutting portion of the metal layer 803, the plastic layer 802 and the covering layer 8012 can be effectively shortened. Further, the center-to-center distance between the adjacent conductive wires 801 is set to match the center-to-center distance between the connection pads 21, 21 ', 41, that is, set to be between 0.30 and 0.42mm, so that the conductive wires 801 and the connection pads 21, 21', 41 of the data transmission cable 800 can be directly aligned and welded, and the distances affecting impedance discontinuity can be limited, thereby ensuring the stability of high-frequency characteristics during high-frequency signal transmission.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. A circuit board, comprising:
A substrate having a land and a wiring region connecting the lands;
The circuit structure is arranged on the substrate and is provided with a plurality of wiring pads which are arranged on the welding area of the substrate and are connected with the conducting wires, and conducting circuits which are arranged in the welding area and the wiring area and are electrically connected with the wiring pads;
The wiring pad is arranged side by side and has a width extending along the arrangement direction of the wiring pad and a length extending along the direction perpendicular to the arrangement direction, and the length of the wiring pad is smaller than 1.5 mm.
2. The wiring board of claim 1, wherein each of said terminal pads occupies a land area of less than 0.39mm 2.
3. The wiring board of claim 2, wherein: the ratio of the length to the width of each of the wire bonding pads is less than 5.8.
4. A circuit board, comprising:
a substrate having a land and a wiring region connecting the lands;
the circuit structure is arranged on the substrate and is provided with a plurality of wiring pads which are arranged on the welding area of the substrate and are connected with the conducting wires, and conducting circuits which are arranged in the welding area and the wiring area and are electrically connected with the wiring pads;
Wherein the bonding area and the wiring area are adjacently arranged in the length direction of the wiring pad; in the length direction of the wiring pad, the wiring pad has a first edge close to the wiring area and a second edge far from the wiring area, and the distance between the second edge and the edge of the substrate of the welding area far from the wiring area is less than 1 mm.
5. The wiring board of claim 1 or 4, wherein: the length from the first edge of the terminal pad to the edge of the substrate where the land is away from the wiring area is not more than 2mm in the length direction of the terminal pad.
6. An electrical connection assembly, comprising:
a wiring board having a substrate and a wiring structure provided on the substrate, the substrate having a land and a wiring region connecting the lands; the circuit structure is provided with a plurality of wiring pads which are arranged on the welding area of the substrate and are connected with the conducting wires, and conducting circuits which are arranged in the welding area and the wiring area and are electrically connected with the wiring pads;
The data transmission cable is welded with the circuit board and is provided with a plurality of wires arranged side by side, a plastic layer integrally coating the wires and a metal layer formed by spirally winding a metal material belt on the outer side of the plastic layer; each lead is provided with a conductor, the metal layer at least comprises an aluminum foil layer and a bonding layer arranged on one side of the aluminum foil layer facing to the plastic layer, and the metal layer is fixed on the outer side of the plastic layer in a bonding mode after being subjected to hot melting through the bonding layer;
The wires are connected with the wiring pads in a one-to-one correspondence mode, and the center distance between every two adjacent wires is the same as the center distance between every two corresponding adjacent wiring pads.
7. the electrical connection assembly of claim 6, wherein: the data transmission cable has a butting portion exposing the conductor to solder the conductor to the land, and the length of the butting portion matches with the length from the first edge of the land to the edge of the land away from the wiring region, and both are set to be not more than 2 mm.
8. The electrical connection assembly of claim 6, wherein: the outer diameter of the conductor adopts a wire gauge from 31 to 34 American, the wiring pads and the wires are arranged at equal intervals in the arrangement direction, and the center intervals of the adjacent wiring pads and the adjacent wires are arranged between 0.30mm and 0.42 mm.
9. The electrical connection assembly of claim 6, wherein: the width of each of the wire bonding pads is less than 0.28 mm.
10. The electrical connection assembly of claim 6, wherein: the distance between two adjacent wiring pads is not less than 0.13 mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018105569820 | 2018-06-01 | ||
| CN201810556982 | 2018-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110557888A true CN110557888A (en) | 2019-12-10 |
Family
ID=68672362
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821732521.6U Expired - Fee Related CN209729555U (en) | 2018-06-01 | 2018-10-24 | Flat data transmission cable |
| CN201910195856.1A Pending CN110556205A (en) | 2018-06-01 | 2019-03-15 | Flat data transmission cable |
| CN201920328078.4U Active CN209747165U (en) | 2018-06-01 | 2019-03-15 | Flat data transmission cable |
| CN201910195814.8A Active CN110556204B (en) | 2018-06-01 | 2019-03-15 | Flat data transmission cable |
| CN201910195813.3A Pending CN110557888A (en) | 2018-06-01 | 2019-03-15 | circuit board and electric connection assembly |
Family Applications Before (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821732521.6U Expired - Fee Related CN209729555U (en) | 2018-06-01 | 2018-10-24 | Flat data transmission cable |
| CN201910195856.1A Pending CN110556205A (en) | 2018-06-01 | 2019-03-15 | Flat data transmission cable |
| CN201920328078.4U Active CN209747165U (en) | 2018-06-01 | 2019-03-15 | Flat data transmission cable |
| CN201910195814.8A Active CN110556204B (en) | 2018-06-01 | 2019-03-15 | Flat data transmission cable |
Country Status (1)
| Country | Link |
|---|---|
| CN (5) | CN209729555U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111881075A (en) * | 2020-08-03 | 2020-11-03 | 恒为科技（上海）股份有限公司 | PCIE (peripheral component interface express) golden finger and design method thereof |
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| CN209729555U (en) * | 2018-06-01 | 2019-12-03 | 凡甲电子(苏州)有限公司 | Flat data transmission cable |
| CN113674916B (en) * | 2020-05-14 | 2023-04-28 | 华为技术有限公司 | Data transmission cable and related equipment |
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| CN111881075B (en) * | 2020-08-03 | 2022-08-26 | 恒为科技（上海）股份有限公司 | PCIE (peripheral component interface express) golden finger and design method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110556204A (en) | 2019-12-10 |
| CN110556205A (en) | 2019-12-10 |
| CN209729555U (en) | 2019-12-03 |
| CN110556204B (en) | 2021-07-30 |
| CN209747165U (en) | 2019-12-06 |
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