TWI697394B - Resin molding apparatus and method of manufacturing resin molded product - Google Patents
Resin molding apparatus and method of manufacturing resin molded product Download PDFInfo
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- TWI697394B TWI697394B TW108110368A TW108110368A TWI697394B TW I697394 B TWI697394 B TW I697394B TW 108110368 A TW108110368 A TW 108110368A TW 108110368 A TW108110368 A TW 108110368A TW I697394 B TWI697394 B TW I697394B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
本發明是有關於一種樹脂成形裝置及樹脂成形品的製造方法。The present invention relates to a resin molding device and a method of manufacturing a resin molded product.
以往,基板上所安裝的半導體晶片例如是使用包括矽酮樹脂或環氧樹脂等熱硬化性樹脂的液狀樹脂來進行樹脂密封。作為進行樹脂密封的技術,使用壓縮成形、轉注成形等樹脂成形技術。在使用液狀樹脂的樹脂成形中,是通過使作為硬化劑等輔助劑的液狀樹脂混合於作為主劑的液狀樹脂中,並對混合後的液狀樹脂進行加熱來進行樹脂成形。Conventionally, a semiconductor wafer mounted on a substrate is resin-sealed using liquid resin including thermosetting resin such as silicone resin or epoxy resin, for example. As a technique for resin sealing, resin molding techniques such as compression molding and transfer molding are used. In resin molding using a liquid resin, resin molding is performed by mixing a liquid resin as an auxiliary agent such as a curing agent with a liquid resin as a main agent, and heating the mixed liquid resin.
在使用所述液狀樹脂的樹脂密封中,將噴出液狀樹脂的噴嘴***至上模具與下模具之間,對下模具中所形成的腔室供給液狀樹脂。此處,因液狀樹脂隨著其溫度上升而黏度變低,所以為了使液狀樹脂容易從噴嘴噴出而對液狀樹脂進行了加熱。In the resin sealing using the liquid resin, a nozzle for ejecting the liquid resin is inserted between the upper mold and the lower mold, and the liquid resin is supplied to the cavity formed in the lower mold. Here, since the viscosity of the liquid resin decreases as its temperature rises, the liquid resin is heated in order to make it easy to eject the liquid resin from the nozzle.
作為對液狀樹脂進行加熱者,考慮如專利文獻1所示,在一體形成有輸液管的噴嘴中,在所述輸液管的外周設置螺旋狀的配管而構成了溫度調節器者。並且,通過所述溫度調節器而使熱硬化性樹脂成為具有流動性的程度(level)的液狀樹脂。As a person who heats the liquid resin, as shown in
然而,在對一體形成於噴嘴的輸液管設置所述溫度調節器的構成中,噴嘴的結構變複雜,伴隨於此,噴嘴更換的作業性也變差。 [現有技術文獻] [專利文獻]However, in the configuration in which the temperature regulator is provided to the infusion tube integrally formed with the nozzle, the structure of the nozzle becomes complicated, and accordingly, the workability of nozzle replacement also deteriorates. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利特開2012-232437號公報[Patent Document 1] Japanese Patent Laid-Open No. 2012-232437
[發明所要解決的問題] 因此,本發明是為了解決所述問題點而成,其主要課題在於不會使噴嘴更換的作業性變差且使液狀樹脂的黏度降低。 [解決問題的技術手段][The problem to be solved by the invention] Therefore, the present invention was made to solve the above-mentioned problems, and its main problem is to reduce the viscosity of the liquid resin without deteriorating the workability of nozzle replacement. [Technical means to solve the problem]
即本發明的樹脂成形裝置是將液狀樹脂供給至噴出對象物來進行樹脂成形的樹脂成形裝置,其特徵在於包括:噴嘴,將所述液狀樹脂噴出至所述噴出對象物;加熱部,與所述噴嘴接觸而對所述噴嘴進行加熱;以及切換機構,對所述噴嘴及所述加熱部彼此接觸的接觸狀態與所述噴嘴及所述加熱部彼此分離的分離狀態進行切換。 本發明的樹脂成形品的製造方法是將液狀樹脂從噴嘴噴出至噴出對象物,並使用所噴出的液狀樹脂進行樹脂成形來製造樹脂成形品的樹脂成形品的製造方法,其中:使所述噴嘴與相對於所述噴嘴而能夠接觸、分離地設置的加熱部接觸以進行加熱後,對所述噴出對象物噴出液狀樹脂。 [發明的效果]That is, the resin molding apparatus of the present invention is a resin molding apparatus that supplies liquid resin to an ejection object to perform resin molding, and is characterized by including: a nozzle for ejecting the liquid resin to the ejection object; a heating unit, The nozzle is brought into contact with the nozzle to heat the nozzle; and a switching mechanism that switches the contact state in which the nozzle and the heating portion are in contact with each other and the separation state in which the nozzle and the heating portion are separated from each other. The method of manufacturing a resin molded product of the present invention is a method of manufacturing a resin molded product in which a liquid resin is ejected from a nozzle to an object to be ejected, and the ejected liquid resin is used for resin molding to produce a resin molded product, wherein: After the nozzle is brought into contact with and heated by a heating unit provided so as to be able to contact and separate from the nozzle, the liquid resin is discharged to the discharge target. [Effects of the invention]
根據如此構成的本發明,可不使噴嘴更換的作業性變差且使液狀樹脂的黏度降低。According to the present invention thus constituted, it is possible to reduce the viscosity of the liquid resin without deteriorating the workability of nozzle replacement.
接著,針對本發明,列舉示例來進一步詳細說明。但是,本發明並不受以下說明限定。Next, with regard to the present invention, examples are given to further explain in detail. However, the present invention is not limited by the following description.
如上所述,本發明的樹脂成形裝置是將液狀樹脂供給至噴出對象物來進行樹脂成形的樹脂成形裝置,其特徵在於包括:噴嘴,將所述液狀樹脂噴出至所述噴出對象物;加熱部,與所述噴嘴接觸而對所述噴嘴進行加熱;以及切換機構,對所述噴嘴及所述加熱部彼此接觸的接觸狀態與所述噴嘴及所述加熱部彼此分離的分離狀態進行切換。 若為所述樹脂成形裝置,則可對噴嘴及加熱部彼此接觸的接觸狀態與噴嘴及加熱部彼此分離的分離狀態進行切換,因此無需在噴嘴中設置加熱部。結果,可不使噴嘴的結構複雜化而在噴嘴中對液狀樹脂進行加熱。因噴嘴的結構不被複雜化,所以也不會使噴嘴更換的作業性變差。而且,液狀樹脂受到加熱而液狀樹脂的黏度變低,容易從噴嘴噴出,可使噴出量的精度提高,從而可儘早解除噴出後的拉絲狀態。As described above, the resin molding apparatus of the present invention is a resin molding apparatus that supplies a liquid resin to an ejection object to perform resin molding, and is characterized by including a nozzle for ejecting the liquid resin to the ejection object; A heating unit that is in contact with the nozzle to heat the nozzle; and a switching mechanism that switches the contact state in which the nozzle and the heating unit are in contact with each other and the separation state in which the nozzle and the heating unit are separated from each other . In the case of the resin molding apparatus, the contact state in which the nozzle and the heating part are in contact with each other and the separation state in which the nozzle and the heating part are separated from each other can be switched, so there is no need to provide a heating part in the nozzle. As a result, the liquid resin can be heated in the nozzle without complicating the structure of the nozzle. Since the structure of the nozzle is not complicated, the workability of nozzle replacement is not deteriorated. Furthermore, the liquid resin is heated and the viscosity of the liquid resin becomes low, and it is easily ejected from the nozzle, the accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.
為了能夠在不使噴嘴的結構複雜化的情況下積極地對噴嘴進行冷卻,理想的是包括與所述噴嘴接觸而對所述噴嘴進行冷卻的冷卻部,且所述切換機構對所述噴嘴及所述冷卻部彼此接觸的接觸狀態與所述噴嘴及所述冷卻部彼此分離的分離狀態進行切換。 若為所述構成,則可降低對液狀樹脂的不良影響(例如不必要的熱硬化)。而且,通過使噴嘴冷卻可提高液狀樹脂的黏度,從而可防止在不噴出液狀樹脂的待機狀態下液狀樹脂從噴嘴滴落。In order to be able to actively cool the nozzle without complicating the structure of the nozzle, it is desirable to include a cooling unit that contacts the nozzle to cool the nozzle, and the switching mechanism controls the nozzle and The contact state in which the cooling portions are in contact with each other is switched with the separation state in which the nozzle and the cooling portion are separated from each other. With this configuration, it is possible to reduce adverse effects on the liquid resin (for example, unnecessary thermal curing). Furthermore, by cooling the nozzle, the viscosity of the liquid resin can be increased, so that the liquid resin can be prevented from dripping from the nozzle in a standby state where the liquid resin is not ejected.
為了能夠對噴嘴的溫度進行管理,理想的是包括對所述噴嘴的溫度進行檢測的溫度感測器、以及基於所述溫度感測器的檢測溫度來對所述切換機構進行控制的控制部。In order to be able to manage the temperature of the nozzle, it is desirable to include a temperature sensor that detects the temperature of the nozzle and a control unit that controls the switching mechanism based on the temperature detected by the temperature sensor.
為了使經加熱的噴嘴的溫度不易降低,理想的是包括保溫構件,所述保溫構件設置於所述噴嘴的外表面,且熱容量大於所述噴嘴。In order to make the temperature of the heated nozzle not easy to decrease, it is desirable to include a heat-insulating member, which is provided on the outer surface of the nozzle and has a larger heat capacity than the nozzle.
理想的是對所述噴嘴的表面的至少一部分實施了黑化處理。 若為所述構成,則容易吸收例如成形模具等的來自噴嘴外部的熱輻射,可利用所述熱輻射來對噴嘴進行加熱或防止溫度降低。It is desirable that at least a part of the surface of the nozzle is blackened. With this configuration, it is easy to absorb heat radiation from the outside of the nozzle, such as a molding die, and the heat radiation can be used to heat the nozzle or prevent a temperature drop.
樹脂成形裝置包括:分配器,具有所述噴嘴,且從所述噴嘴噴出液狀樹脂;以及供給模組,在所述分配器待機的同時對所述分配器供給液狀樹脂。在所述構成中,所述加熱部理想的是設置於所述供給模組中。 因如此般在供給模組中設置有加熱部,因此可對待機狀態的噴嘴進行加熱。結果,可在噴出液狀樹脂之前將噴嘴充分加熱。The resin molding apparatus includes: a dispenser that has the nozzle and ejects liquid resin from the nozzle; and a supply module that supplies the liquid resin to the dispenser while the dispenser is on standby. In the above configuration, the heating unit is desirably provided in the supply module. Because the heating part is provided in the supply module in this way, the nozzle in the standby state can be heated. As a result, the nozzle can be sufficiently heated before the liquid resin is discharged.
樹脂成形裝置的所述噴出對象物為成形模具,且樹脂成形裝置包括成形模組,所述成形模組具有所述成形模具及對所述成形模具進行合模的合模機構。在所述構成中,所述加熱部理想的是設置於所述成形模組中。 因如此般在成形模組中設置有加熱部,因此可在即將噴出液狀樹脂之前將噴嘴加熱。結果,可在經加熱的噴嘴的溫度降低之前噴出液狀樹脂。The ejected object of the resin molding apparatus is a molding die, and the resin molding apparatus includes a molding module having the molding die and a mold clamping mechanism for clamping the molding die. In the above configuration, the heating unit is preferably provided in the molding die set. Since the heating part is provided in the molding die in this way, the nozzle can be heated just before the liquid resin is discharged. As a result, the liquid resin can be ejected before the temperature of the heated nozzle decreases.
所述加熱部理想的是經由所述切換機構而設置於從所述噴嘴噴出液狀樹脂的分配器中。 若為所述構成,則可在從噴嘴噴出液狀樹脂的過程中對噴嘴進行加熱。The heating part is desirably provided in a dispenser that ejects liquid resin from the nozzle via the switching mechanism. With the above configuration, the nozzle can be heated while the liquid resin is ejected from the nozzle.
而且,本發明的樹脂成形品的製造方法是將液狀樹脂從噴嘴噴出至噴出對象物,並使用所噴出的液狀樹脂進行樹脂成形來製造樹脂成形品的樹脂成形品的製造方法,其特徵在於:使所述噴嘴與相對於所述噴嘴而能夠接觸・分離地設置的加熱部接觸以進行加熱後,對所述噴出對象物噴出液狀樹脂。 若為所述樹脂成形品的製造方法,則因使用相對於噴嘴而能夠接觸・分離地設置的加熱部對噴嘴進行加熱,所以無需在噴嘴中設置加熱部。結果,可不使噴嘴的結構複雜化而在噴嘴中對液狀樹脂進行加熱。因噴嘴的結構不被複雜化,所以也不會使噴嘴更換的作業性變差。而且,液狀樹脂受到加熱而液狀樹脂的黏度變低,容易從噴嘴噴出,可使噴出量的精度提高,從而可儘早解除噴出後的拉絲狀態。In addition, the method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product in which a liquid resin is ejected from a nozzle to an object to be ejected, and the ejected liquid resin is used to perform resin molding to produce a resin molded product. The method is that after the nozzle is brought into contact with a heating unit provided so as to be able to contact and separate from the nozzle to be heated, the liquid resin is discharged to the discharge target. In the case of the above-mentioned method of manufacturing a resin molded product, since the nozzle is heated by a heating unit provided so as to be able to contact and separate from the nozzle, it is not necessary to provide a heating unit in the nozzle. As a result, the liquid resin can be heated in the nozzle without complicating the structure of the nozzle. Since the structure of the nozzle is not complicated, the workability of nozzle replacement is not deteriorated. Furthermore, the liquid resin is heated and the viscosity of the liquid resin becomes low, and it is easily ejected from the nozzle, the accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.
理想的是在對所述噴出對象物噴出液狀樹脂後,使所述噴嘴與相對於所述噴嘴而能夠接觸・分離地設置的冷卻部接觸以進行冷卻。 若為所述構成,則可降低對液狀樹脂的不良影響(例如不必要的熱硬化)。而且,通過使噴嘴冷卻可提高液狀樹脂的黏度,從而可防止在噴出後液狀樹脂從噴嘴滴落。It is desirable that after the liquid resin is sprayed to the spray target, the nozzle is brought into contact with a cooling unit provided so as to be able to contact and be separated from the nozzle to cool it. With this configuration, it is possible to reduce adverse effects on the liquid resin (for example, unnecessary thermal curing). Furthermore, by cooling the nozzle, the viscosity of the liquid resin can be increased, so that the liquid resin can be prevented from dripping from the nozzle after ejection.
<本發明的實施方式> 以下,參照圖式對本發明的樹脂成形裝置的實施方式進行說明。另外,關於以下所示的任一圖,為了便於理解,均適當省略或誇張來示意性地進行了描繪。針對相同的構成要素,標注相同的符號並適當省略說明。另外,在本申請書類中,「液狀」這一用語是指常溫下為液狀而具有流動性,並且不論流動性的高低,換句話說黏度的程度。而且,在本申請書類中,所謂「樹脂成形品」是指至少包括經樹脂成形的樹脂部分的產品,是包括後述那樣的將安裝在基板上的晶片通過成形模具進行樹脂成形並進行樹脂密封的形態的密封後基板的概念的表達。<Embodiments of the present invention> Hereinafter, embodiments of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, in order to facilitate understanding, any of the drawings shown below are schematically depicted with appropriate omissions or exaggerations. The same components are denoted by the same symbols and their descriptions are appropriately omitted. In addition, in this application, the term "liquid" means that it is liquid at room temperature and has fluidity, regardless of the level of fluidity, in other words the degree of viscosity. In addition, in this application, the term "resin molded product" refers to a product that includes at least a resin portion molded by resin, and includes a wafer mounted on a substrate that is resin-molded through a molding die and resin-sealed as described later. The expression of the concept of the substrate after the morphology is sealed.
參照圖1對本實施方式的樹脂成形裝置1的構成進行說明。圖1所示的樹脂成形裝置1是使用壓縮成形法的樹脂成形裝置。在本實施方式中,表示例如以安裝有半導體晶片的基板為進行樹脂成形的對象,使用流動性樹脂即液狀樹脂作為樹脂材料的情況。另外,作為「基板」,可列舉玻璃環氧基板、陶瓷基板、樹脂基板、金屬基板等一般性基板及引線框架(lead frame)等。The configuration of the
具體來說,樹脂成形裝置1如圖1所示,包括基板供給・收納模組2、四個成形模組3A、3B、3C、3D及供給模組4分別作為構成要素。作為構成要素的基板供給・收納模組2、成形模組3A~3D及供給模組4分別可相對於其他構成要素相互進行拆裝,並且可更換。Specifically, the
在基板供給・收納模組2中設置供給密封前基板5的密封前基板供給部6及收納密封後基板7的密封後基板收納部8。對密封前基板5例如安裝作為光元件的發光二極體(light-emitting diode,LED)晶片等。在基板供給・收納模組2中設置裝載機(loader)9及卸載機(unloader)10,對裝載機9及卸載機10進行支持的軌道11沿著X方向而設。裝載機9及卸載機10沿著軌道11在X方向上移動。The substrate supply and
由軌道11支持的裝載機9及卸載機10在基板供給・收納模組2、各成形模組3A、3B、3C、3D與供給模組4之間在X方向上移動。對裝載機9中設置用以在各成形模組3A、3B、3C、3D中將密封前基板5供給至上模具的移動機構12。在各成形模組中,移動機構12在Y方向上移動。對卸載機10設置用以在各成形模組3A、3B、3C、3D中從上模具接收密封後基板7的移動機構13。在各成形模組3A、3B、3C、3D中,移動機構13在Y方向上移動。The
在各成形模組3A、3B、3C、3D中設有彼此相向的一對成形模具。本實施方式的一對成形模具是能夠升降的下模具14及與下模具14彼此相向配置的上模具(未圖示,參照圖2(1))。各成形模組3A、3B、3C、3D具有對上模具與下模具14進行合模及開模的合模機構15。作為收容液狀樹脂進行硬化的空間的腔室16形成於下模具14。換句話說,腔室16是收容液狀樹脂的收容部。腔室16的模具面由脫模膜17包覆。A pair of forming dies facing each other are provided in each forming
在供給模組4中設置對作為噴出對象物的下模具14的腔室16供給液狀樹脂的樹脂供給機構18。樹脂供給機構18由軌道11支持,並通過移動機構20而沿著軌道11在X方向上移動。對樹脂供給機構18設置作為液狀樹脂的噴出機構的分配器(dispenser)19。在各成形模組3A、3B、3C、3D中,分配器19通過移動機構20而在Y方向上移動,對腔室16噴出液狀樹脂。圖1所示的分配器19是使用預先混合主劑及硬化劑而成的液狀樹脂的一液型分配器。作為主劑,使用具有熱硬化性及透光性的矽酮樹脂或環氧樹脂等。The
在供給模組4中設置抽真空機構21。抽真空機構21在各成形模組3A、3B、3C、3D中在即將對上模具與下模具14進行合模前從腔室16強制性地抽吸空氣而將其排出。而且,在供給模組4中設置對樹脂成形裝置1整體的動作進行控制的控制部22。在圖1中,示出了將抽真空機構21及控制部22設置於供給模組4的情況。並不限於此,也可以將抽真空機構21及控制部22設置於其他模組。另外,控制部22例如包括具有中央處理單元(central processing unit,CPU)、內部記憶體、模數(analog digital,AD)轉換器、輸入輸出反相器(inverter)等的專用或通用電腦。A
參照圖1及圖2(1)、圖2(2),對樹脂供給機構18對設置於下模具14中的腔室16供給液狀樹脂30(參照圖2(1)、圖2(2))的機構進行說明。如圖2(1)所示,在各成形模組3A、3B、3C、3D(參照圖1)中設置上模具23、下模具14及膜按壓構件24。1 and 2(1), 2(2), the
脫模膜17包覆腔室16的模具面及其周圍的模具面。膜按壓構件24是用以在腔室16的周圍將脫模膜17按壓並固定至下模具14的模具面的構件。膜按壓構件24在中央部具有開口,成形模具位於所述開口的內部。在上模具23中例如通過吸附或卡夾(clamp)等而固定、配置安裝有LED晶片25等的密封前基板5。在腔室16的內部設置對應於各LED晶片25的獨立腔室26。The
以覆蓋腔室16的整個面的方式供給脫模膜17。通過設置於下模具14的加熱器(未圖示)對脫模膜17進行加熱。經加熱的脫模膜17軟化而伸長。在腔室16的周圍,通過膜按壓構件24,軟化的脫模膜17被按壓並固定至下模具14的模具面。以沿著各獨立腔室26的模具面的方式吸附軟化的脫模膜17。另外,在圖2(1)中,示出了使用膜按壓構件24的情況。並不限於此,也可以不使用脫模膜17及膜按壓構件24。The
如圖2(1)、圖2(2)所示,分配器19具有送出規定量的液狀樹脂30的送出機構27、貯存液狀樹脂30的注射器(syringe)28及噴出液狀樹脂30的噴嘴29。在分配器19中,送出機構27、注射器28及噴嘴29連接而構成為一體。因此,可將各構成要素(送出機構27、注射器28、噴嘴29)彼此拆裝,可將各構成要素單元更換為同種但不同的構成單元。例如,可將具有不同材料或不同黏度等的液狀樹脂30預先貯存保管在多個注射器28中,根據產品而將需要的注射器28安裝至分配器19來使用。另外,可選擇容量不同的注射器28來使用。As shown in Figure 2 (1) and Figure 2 (2), the
通過更換噴嘴29,可將液狀樹脂30的噴出方向設定為正下方、正側方、斜下方等任意的方向。另外,可根據液狀樹脂30的黏度來變更噴嘴29的噴出口的口徑。進而,可在注射器28與噴嘴29之間設置靜態混合器(Static mixer)。例如,即使在對液狀樹脂30添加了螢光體等作為添加劑的情況下,通過由靜態混合器對液狀樹脂30進行攪拌,仍可在螢光體不沉澱的均勻狀態下噴出液狀樹脂30。By replacing the
也可使分配器19在上下方向(Z方向)上移動。可使圖2(1)所示的分配器19以在鉛垂面內(包括Y軸及Z軸的面內)或水平面內(包括X軸及Y軸的面內),以某一點為中心局部地旋轉的方式往返運動。在所述情況下,以分配器19的前端部描繪圓弧的一部分的方式進行往返運動。The
參照圖1及圖2(1)、圖2(2)對作為樹脂成形裝置1的動作而使用成形模組3C的情況進行說明。首先,例如,將安裝有LED晶片25的密封前基板5以安裝有LED晶片25的面朝下的方式從密封前基板供給部6移交給裝載機9。接著,使裝載機9從基板供給・收納模組2沿著軌道11在+X方向上移動至成形模組3C。The case where the molding die set 3C is used as the operation of the
接著,在成形模組3C中,使用移動機構12,使裝載機9在-Y方向上移動至下模具14與上模具23(參照圖2(1))之間的規定位置。將安裝有LED晶片25的面朝下的密封前基板5通過吸附或夾持而固定於上模具23的下表面。在將密封前基板5配置於上模具的下表面之後,使裝載機9移動至基板供給・收納模組2中的原位置。Next, in the
接著,使用樹脂供給機構18,使分配器19從供給模組4中的待機位置沿著軌道11在-X方向上移動至成形模組3C。由此,使樹脂供給機構18移動至模組3C中的下模具14的附近的規定位置。使用移動機構20,使分配器19移動至下模具14的上方的規定位置。Next, the
接著,如圖2(1)所示,從分配器19的噴嘴29噴出液狀樹脂30。具體來說,從分配器19的噴嘴29朝設置於下模具14的腔室16噴出液狀樹脂30。由此,對腔室16供給液狀樹脂30。Next, as shown in FIG. 2( 1 ), the
接著,在將液狀樹脂30供給至腔室16之後,使用移動機構20使分配器19後退至樹脂供給機構18。使樹脂供給機構18移動至供給模組4中的原待機位置。Next, after the
接著,在成形模組3C中,使用合模機構15使下模具14上升,由此對上模具23與下模具14進行合模。通過進行合模,使安裝於密封前基板5上的LED晶片25浸漬於供給至腔室16的液狀樹脂30中。此時,可使用設置於下模具14的腔室底面構件(未圖示)對腔室16內的液狀樹脂30施加規定的樹脂壓力。Next, in the molding die set 3C, the
另外,也可以在進行合模的過程中,使用抽真空機構21對腔室16內進行抽吸。由此,將殘留在腔室16內的空氣或液狀樹脂30中所含的氣泡等排出至成形模具的外部。另外,將腔室16內設定為規定的真空度。In addition, in the process of clamping the mold, the
接著,使用設置於下模具14的加熱器(未圖示),以使液狀樹脂30硬化所需的時間對液狀樹脂30進行加熱。由此,使液狀樹脂30硬化而形成硬化樹脂。由此,通過對應於腔室16的形狀而形成的硬化樹脂將安裝於密封前基板5的LED晶片25予以樹脂密封。在使液狀樹脂30硬化之後,使用合模機構15對上模具23與下模具14進行開模。Next, a heater (not shown) provided in the
接著,使裝載機9退避至不會妨礙卸載機10移動至成形模組3C的適當位置。例如,使裝載機9從基板供給・收納模組2退避至成形模組3D或供給模組4中的適當位置。之後,使卸載機10從基板供給・收納模組2沿著軌道11在+X方向上移動至成形模組3C。Next, the
接著,在成形模組3C中,使移動機構13在-Y方向上移動至下模具14與上模具23之間的規定位置之後,移動機構13從上模具23接收密封後基板7。在接收密封後基板7後,使移動機構13返回至卸載機10。使卸載機10返回至基板供給・收納模組2之後,將密封後基板7收納至密封後基板收納部8。此時,第一個密封前基板5的樹脂密封結束,從而完成第一個密封後基板7。Next, in the
接著,使退避至成形模組3D或供給模組4中的適當位置的裝載機9移動至基板供給・收納模組2。自密封前基板供給部6對裝載機9移交下一密封前基板5。如上所述反復進行樹脂密封。Next, the
另外,在本實施方式中,密封前基板5的供給、樹脂供給機構18及分配器19的移動、液狀樹脂30的噴出、上模具23與下模具14的合模及開模、密封後基板7的收納等動作由控制部22控制。In addition, in this embodiment, the supply of the
<噴嘴29的溫度調節機構>
並且,本實施形態的樹脂成形裝置1具有溫度調節機構,所述溫度調節機構與噴嘴29獨立地設置,對噴嘴29的溫度進行調整。<Temperature adjustment mechanism of
具體來說,如圖1、圖3(1)、圖3(2)及圖4(1)、圖4(2)所示,樹脂成形裝置1包括:與噴嘴29接觸而對噴嘴29進行加熱的加熱部31、與噴嘴29接觸而對噴嘴29進行冷卻的冷卻部32、對噴嘴29的溫度進行檢測的溫度感測器33、以及對噴嘴29與加熱部31或冷卻部32的接觸/非接觸進行切換的切換機構34。Specifically, as shown in FIGS. 1, 3 (1), 3 (2), 4 (1), and 4 (2), the
本實施方式的加熱部31、冷卻部32及溫度感測器33設置於供給模組4中。The
如圖3(1)、圖3(2)所示,加熱部31是在內部內置有加熱器(未圖示)的例如金屬制的塊體311(以下也稱為加熱塊311)。加熱部31固定於供給模組4中,且具有與噴嘴29的外表面接觸以進行加熱的接觸加熱面311a。本實施方式的接觸加熱面311a是與噴嘴29的前端面29a接觸的面。噴嘴29的前端面29a為平坦面,因此接觸加熱面311a也形成為平坦面。加熱器例如為放熱電阻器。As shown in FIGS. 3(1) and 3(2), the
如圖4(1)、圖4(2)所示,冷卻部32例如為金屬制的塊體321(以下也稱為冷卻塊321)。冷卻部32固定於供給模組4中,且具有與噴嘴29的外表面接觸以進行冷卻的接觸冷卻面321a。本實施方式的接觸冷卻面321a與所述接觸加熱面311a同樣地,是與噴嘴29的前端面29a接觸的面。噴嘴29的前端面29a為平坦面,因此接觸冷卻面321a也形成為平坦面。另外,冷卻部32也可在冷卻塊321的內部內置有冷卻器。作為冷卻器,考慮使用珀爾帖(Peltier)元件、流動有氣體或液體的冷卻介質的冷卻配管。As shown in FIGS. 4(1) and 4(2), the cooling
加熱部31及冷卻部32例如沿X方向(軌道11的延伸方向)並列設置。而且,加熱部31的接觸加熱面311a及冷卻部32的接觸冷卻面321a以與通過移動機構20而在Y方向上移動的噴嘴29的前端面29a接觸的方式朝向Y方向設置。The
切換機構34對噴嘴29及加熱部31彼此接觸的接觸狀態與噴嘴29及加熱部31彼此分離的分離狀態進行切換,並且對噴嘴29及冷卻部32彼此接觸的接觸狀態與噴嘴29及冷卻部32彼此分離的分離狀態進行切換。The
本實施方式的切換機構34包含移動機構20。利用所述移動機構20使分配器19在X方向及Y方向上移動,由此對噴嘴29及加熱部31的接觸/非接觸、以及噴嘴29及冷卻部32的接觸/非接觸進行切換。利用所述移動機構20進行的接觸/非接觸的切換由控制部22控制。The
溫度感測器33例如為紅外線感測器等非接觸感測器。所述溫度感測器33在供給模組4中設置於可對與加熱部31及冷卻部32接觸的噴嘴29的溫度進行檢測的位置(參照圖3(1)、圖3(2)及圖4(1)、圖4(2))。在本實施方式中,從側方對處於接觸狀態的噴嘴29進行溫度檢測,但也可從上方或下方進行溫度檢測。而且,在圖1等中構成為利用一個溫度感測器33來檢測加熱溫度及冷卻溫度這兩者,但也可在加熱部31及冷卻部32中分別設置各一個溫度感測器33。所述溫度感測器33的檢測信號被發送至控制部22,並利用移動機構20來控制切換動作。The
接著,對液狀樹脂的的噴出前後的分配器19的動作簡單進行說明。Next, the operation of the
將液狀樹脂30噴出至作為噴出對象部的下模具14之前的分配器19在供給模組4處待機。此時,控制部22對移動機構20進行控制,使噴嘴29的前端面29a接觸加熱塊311的接觸加熱面311a(參照圖3(1)、圖3(2))。當進行所述噴嘴加熱時,使用溫度感測器33來檢測噴嘴溫度,並進行加熱至噴嘴溫度成為規定的設定加熱溫度(例如25℃~40℃)為止。在超過設定加熱溫度的情況下,控制部22對移動機構20進行控制,使噴嘴29與冷卻塊321接觸以進行冷卻,從而也可成為設定加熱溫度。也可僅通過使噴嘴29與加熱塊311分離而成為設定加熱溫度。The
在如此般對噴嘴29進行加熱後,控制部22對移動機構20進行控制,使分配器19移動至成形模組3A~成形模組3D,從噴嘴29噴出液狀樹脂30而對下模具14供給液狀樹脂30。After the
在供給液狀樹脂後,控制部22對移動機構20進行控制,使分配器19返回至供給模組4。此時,控制部22對移動機構20進行控制,使噴嘴29的前端面29a接觸冷卻塊321的接觸冷卻面321a(參照圖4(1)、圖4(2))。當進行所述噴嘴冷卻時,使用溫度感測器33來檢測噴嘴溫度,並進行冷卻至噴嘴溫度成為規定的設定冷卻溫度(例如小於20℃)為止。並且,在成為設定冷卻溫度以下的情況下,控制部22對移動機構20進行控制,使噴嘴29與冷卻塊321分離。而且,也可維持使噴嘴29與冷卻塊321接觸的狀態直至伴隨下一次液狀樹脂30的供給的加熱動作。After the liquid resin is supplied, the
<本實施方式的效果>
根據本實施方式的樹脂成形裝置1,因對噴嘴29及加熱部31彼此接觸的接觸狀態與噴嘴29及加熱部31彼此分離的分離狀態進行切換,所以無需在噴嘴29中設置加熱部31。結果,可不使噴嘴29的結構複雜化而在噴嘴29中對液狀樹脂30進行加熱。因噴嘴29的結構不被複雜化,所以也不會使噴嘴更換的作業性變差。而且,液狀樹脂30受到加熱而液狀樹脂30的黏度變低,容易從噴嘴29噴出,可使噴出量的精度提高,從而可儘早解除噴出後的拉絲狀態。<Effects of this embodiment>
According to the
而且,在本實施形態中,因對噴嘴29及冷卻部32彼此接觸的接觸狀態與噴嘴29及冷卻部32彼此分離的分離狀態進行切換,所以無需在噴嘴29中設置冷卻部32。結果,可不使噴嘴29的結構複雜化而積極地使噴嘴29冷卻,可降低對液狀樹脂30的不良影響(例如不必要的熱硬化)。通過使噴嘴29冷卻可提高液狀樹脂30的黏度,從而可防止在供給模組4中的待機狀態下液狀樹脂30從噴嘴29滴落。Furthermore, in this embodiment, since the contact state in which the
進而,在本實施方式中,將加熱部31設置於供給模組4中,因此可對噴出前的待機狀態下的噴嘴29進行加熱。結果,可在噴出液狀樹脂30之前將噴嘴29充分加熱。此外,將冷卻部32設置於供給模組4中,因此可對噴出後的待機狀態下的噴嘴29進行冷卻。結果,可在噴出液狀樹脂30後充分將噴嘴29冷卻,從而可提高液狀樹脂30的黏度,使液狀樹脂30不易從噴嘴29滴落。Furthermore, in this embodiment, since the
<其他實施方式>
在所述實施方式中,將加熱部31設置於供給模組4中,但也可如圖5所示般設置於成型模組3A~成形模組3D中。在圖5中,構成為包括四個成形模組3A~成形模組3D,且示出了在各成形模組3A~成形模組3D中設置有加熱部31的例子。在具有多個成形模組3A~成形模組3D的構成的情況下,可構成為在所述成形模組3A~成形模組3D的至少一者中設置加熱部31。在這些情況下,例如在成形模組3A~成形模組3D中使加熱部31或分配器19的至少一者移動以對接觸/非接觸進行切換。<Other embodiments>
In the above embodiment, the
在所述實施方式中,構成為加熱塊311的接觸加熱面311a及冷卻塊321的接觸冷卻面321a與噴嘴29的前端面29a接觸,但也可為噴嘴29的例如上表面或側面等其他外表面。In the above-mentioned embodiment, the
在所述實施方式中,構成為通過分配器19移動而與加熱部31及冷卻部32接觸的構成,但也可設置使加熱部31及冷卻部32移動以對接觸/非接觸進行切換的切換機構34。在所述情況下,例如相對於在供給模組4中處於待機狀態的分配器19而使加熱部31及冷卻部32移動來進行接觸。In the above-mentioned embodiment, the configuration is configured to be in contact with the
在所述實施方式中,使用溫度感測器33的檢測溫度對接觸/非接觸進行切換,但也可不使用溫度感測器33的檢測溫度而利用接觸時間來對接觸/非接觸進行切換(進行時序控制)。In the above embodiment, the detection temperature of the
而且,也可構成為將加熱部31設置於分配器19中。即,加熱部31也與分配器19一體地移動。在所述情況下,加熱部31經由切換機構34而設置於分配器19中。如圖6(1)、圖6(2)所示,所述切換機構34具有:支撐構件35,對加熱部31進行支撐,並且設置為可在加熱部31與噴嘴29接觸的接觸位置P和加熱部31與噴嘴29分離的分離位置Q之間旋轉;以及致動器(未圖示),使所述支撐構件35旋轉。在圖6(1)、圖6(2)中,構成為在噴嘴29的左右兩側設置加熱部31而與噴嘴29的左右側面接觸,但也可構成為與噴嘴29的上表面接觸。另外,也可不設置致動器而例如構成為與分配器19的移動連動地,支撐構件35通過接觸外部的構件而進行旋轉。關於冷卻部32,也可與加熱部31同樣地構成為設置於分配器19中。Furthermore, the
進而,也可如圖7(1)、圖7(2)所示,在噴嘴29的外表面設置保溫構件36。所述保溫構件36具有比噴嘴29的熱容量大的熱容量。在圖7(1)、圖7(2)中示出了以覆蓋噴嘴29的左右側面及上表面的方式設置有保溫構件36的例子,但並不限定於此,只要覆蓋噴嘴29的外表面的至少一部分即可。而且,保溫構件36構成為相對於噴嘴29而可拆裝。在圖7(1)、圖7(2)中示出了嵌入式的保溫構件36。通過如此般設置保溫構件36,可抑制經加熱的噴嘴29的溫度降低。而且,可抑制因液狀樹脂30通過噴嘴29中而造成的噴嘴29的溫度降低。進而,通過以可拆裝的方式構成保溫構件36,不會使噴嘴更換的作業性變差。Furthermore, as shown in FIGS. 7( 1) and 7 (2 ), a
在所述實施方式中,加熱塊311及冷卻塊321的一個平面與噴嘴的一個平面接觸,但也可如圖8(1)、圖8(2)所示,例如在加熱塊311及冷卻塊321中形成凹部M,且構成為在該凹部M的內表面中使噴嘴29與接觸加熱面311a及接觸冷卻面321a接觸。另外,也可在噴嘴29中形成凹部M。即,也可構成為加熱塊311及冷卻塊321與噴嘴29以多個面接觸。若如此,則可增大熱交換面積,從而可有效率地進行噴嘴29的溫度調節。In the described embodiment, one plane of the
此外,也可對噴嘴29的表面的至少一部分實施黑化處理。此處,黑化處理是為了使噴嘴29的表面容易吸收紅外線而使所述表面黑色化的處理,例如可使用黑色鉻鍍敷、黑色鋅鍍敷、低溫黑色鉻酸處理、黑色非電解鎳鍍敷、發黑、黑色耐酸鋁(Alumite)處理、鋅鍍敷後的黑色鉻酸鹽處理、離子鍍(ion plating)等。所述黑化處理根據噴嘴29的材質(例如,鐵、不銹鋼、銅、鋁等)來適當選擇。In addition, at least a part of the surface of the
在所述實施方式的樹脂成形裝置1中,在將脫模膜固定於成形模具之後對所述成形模具供給液狀樹脂30,從而噴出對象物為成形模具14,但當在將脫模膜17固定於成形模具14之前對脫模膜17供給液狀樹脂30的情況下,噴出對象物變為脫模膜17。In the
此外,本發明並不限於所述實施方式,當然可在不脫離其主旨的範圍內進行各種變形。In addition, the present invention is not limited to the above-described embodiments, and of course various modifications can be made without departing from the spirit thereof.
1‧‧‧樹脂成形裝置 2‧‧‧基板供給・收納模組 3A、3B、3C、3D‧‧‧成形模組 4‧‧‧供給模組 5‧‧‧密封前基板 6‧‧‧密封前基板供給部 7‧‧‧密封後基板(樹脂成形品) 8‧‧‧密封後基板收納部 9‧‧‧裝載機 10‧‧‧卸載機 11‧‧‧軌道 12、13、20‧‧‧移動機構 14‧‧‧下模具(成形模具) 15‧‧‧合模機構 16‧‧‧腔室 17‧‧‧脫模膜 18‧‧‧樹脂供給機構 19‧‧‧分配器 21‧‧‧抽真空機構 22‧‧‧控制部 23‧‧‧上模具(成形模具) 24‧‧‧膜按壓構件 25‧‧‧LED晶片 26‧‧‧獨立腔室 27‧‧‧送出機構 28‧‧‧注射器 29‧‧‧噴嘴(噴出部) 29a‧‧‧前端面 30‧‧‧液狀樹脂 31‧‧‧加熱部 311‧‧‧加熱塊/塊體 311a‧‧‧接觸加熱面 32‧‧‧冷卻部 321‧‧‧冷卻塊/塊體 321a‧‧‧接觸冷卻面 33‧‧‧溫度感測器 34‧‧‧切換機構 35‧‧‧支撐構件 36‧‧‧保溫構件 M‧‧‧凹部 P‧‧‧接觸位置 Q‧‧‧分離位置 X、Y、Z‧‧‧方向1‧‧‧Resin molding device 2‧‧‧Board supply and storage module 3A, 3B, 3C, 3D‧‧‧forming module 4‧‧‧Supply Module 5‧‧‧Seal the front substrate 6‧‧‧Substrate supply part before sealing 7‧‧‧Substrate after sealing (resin molded product) 8‧‧‧Substrate storage part after sealing 9‧‧‧Loader 10‧‧‧Unloader 11‧‧‧Orbit 12, 13, 20‧‧‧Mobile mechanism 14‧‧‧Lower mold (forming mold) 15‧‧‧Clamping mechanism 16‧‧‧ Chamber 17‧‧‧Release film 18‧‧‧Resin Supply Mechanism 19‧‧‧Distributor 21‧‧‧Vacuum mechanism 22‧‧‧Control Department 23‧‧‧Upper mold (forming mold) 24‧‧‧Membrane pressing member 25‧‧‧LED chip 26‧‧‧Independent chamber 27‧‧‧Sending organization 28‧‧‧Syringe 29‧‧‧Nozzle (spout part) 29a‧‧‧Front face 30‧‧‧Liquid resin 31‧‧‧Heating section 311‧‧‧Heating block/block 311a‧‧‧Contact heating surface 32‧‧‧Cooling Department 321‧‧‧Cooling block/block 321a‧‧‧Contact cooling surface 33‧‧‧Temperature sensor 34‧‧‧Switching mechanism 35‧‧‧Supporting member 36‧‧‧Insulation components M‧‧‧Recess P‧‧‧Contact position Q‧‧‧Separation position X, Y, Z‧‧‧direction
圖1是示意性表示本實施方式的樹脂成形裝置的構成的圖。 圖2(1)、圖2(2)是表示本實施方式的樹脂供給機構的概略圖,圖2(1)是表示樹脂供給機構將液狀樹脂供給至下模具的腔室的狀態的概略圖,圖2(2)是表示樹脂供給機構的概略平面圖。 圖3(1)、圖3(2)是表示噴嘴加熱時的狀態(接觸狀態)的概略圖,圖3(1)是主要部分平面圖,圖3(2)是主要部分側面圖。 圖4(1)、圖4(2)是表示噴嘴冷卻時的狀態(接觸狀態)的概略圖,圖4(1)是主要部分平面圖,圖4(2)是主要部分側面圖。 圖5是示意性表示變形實施方式的樹脂成形裝置的構成的圖。 圖6(1)、圖6(2)是表示加熱部及切換機構的變形例的概略圖,圖6(1)是主要部分平面圖,圖6(2)是主要部分側面圖。 圖7(1)、圖7(2)是表示變形實施方式的主要部分的概略圖,圖7(1)是主要部分正面圖,圖7(2)是主要部分側面圖。 圖8(1)、圖8(2)是表示變形實施方式的加熱部的概略圖,圖8(1)是表示非接觸狀態的主要部分側面圖,圖8(2)是表示接觸狀態的主要部分側面圖。FIG. 1 is a diagram schematically showing the configuration of a resin molding apparatus according to this embodiment. 2(1) and 2(2) are schematic views showing the resin supply mechanism of this embodiment, and FIG. 2(1) is a schematic view showing the state in which the resin supply mechanism supplies liquid resin to the cavity of the lower mold , Figure 2 (2) is a schematic plan view showing the resin supply mechanism. 3(1) and 3(2) are schematic views showing the state (contact state) when the nozzle is heated, FIG. 3(1) is a plan view of the main part, and FIG. 3(2) is a side view of the main part. 4(1) and 4(2) are schematic views showing the state (contact state) of the nozzle when cooling, FIG. 4(1) is a plan view of the main part, and FIG. 4(2) is a side view of the main part. Fig. 5 is a diagram schematically showing the configuration of a resin molding apparatus according to a modified embodiment. 6(1) and 6(2) are schematic diagrams showing a modification of the heating unit and the switching mechanism. FIG. 6(1) is a plan view of the main part, and FIG. 6(2) is a side view of the main part. 7(1) and 7(2) are schematic views showing the main parts of the modified embodiment, FIG. 7(1) is a front view of the main parts, and FIG. 7(2) is a side view of the main parts. Figures 8(1) and 8(2) are schematic views showing the heating part of the modified embodiment, Figure 8(1) is a side view of the main part showing the non-contact state, and Figure 8(2) is the main part showing the contact state Partial side view.
5‧‧‧密封前基板 5‧‧‧Seal the front substrate
14‧‧‧下模具(成形模具) 14‧‧‧Lower mold (forming mold)
16‧‧‧腔室 16‧‧‧ Chamber
17‧‧‧脫模膜 17‧‧‧Release film
18‧‧‧樹脂供給機構 18‧‧‧Resin Supply Mechanism
19‧‧‧分配器 19‧‧‧Distributor
20‧‧‧移動機構 20‧‧‧Mobile Organization
23‧‧‧上模具(成形模具) 23‧‧‧Upper mold (forming mold)
24‧‧‧膜按壓構件 24‧‧‧Membrane pressing member
25‧‧‧LED晶片 25‧‧‧LED chip
26‧‧‧獨立腔室 26‧‧‧Independent chamber
27‧‧‧送出機構 27‧‧‧Sending organization
28‧‧‧注射器 28‧‧‧Syringe
29‧‧‧噴嘴(噴出部) 29‧‧‧Nozzle (spout part)
30‧‧‧液狀樹脂 30‧‧‧Liquid resin
X、Y、Z‧‧‧方向 X, Y, Z‧‧‧direction
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CN107415249A (en) * | 2017-08-03 | 2017-12-01 | 金华市瑞意电气科技有限公司 | A kind of melting control device and method for 3D printing |
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JPS5848505B2 (en) * | 1976-02-26 | 1983-10-28 | 東北大学金属材料研究所長 | Method for manufacturing a silicon carbide molded body mainly composed of SIC |
JPH0364724U (en) * | 1989-10-27 | 1991-06-24 | ||
JP3268491B2 (en) * | 1997-12-17 | 2002-03-25 | 株式会社名機製作所 | Injection molding machine and injection molding method |
JP2006334496A (en) * | 2005-06-01 | 2006-12-14 | Nok Corp | Apparatus for mixing and ejecting two liquids |
JP5261261B2 (en) * | 2009-03-31 | 2013-08-14 | Towa株式会社 | Liquid resin material supply method and apparatus used for compression resin sealing molding |
JP2012232437A (en) | 2011-04-28 | 2012-11-29 | Sodick Co Ltd | Liquid resin supply mechanism, and compression molding device equipped with the same |
JP6104787B2 (en) * | 2013-12-18 | 2017-03-29 | Towa株式会社 | Resin molding apparatus and resin molding method |
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CN1275756C (en) * | 2000-09-26 | 2006-09-20 | 东丽株式会社 | Sheet material making method and jet nozzle for making said sheet material |
CN101316692A (en) * | 2005-11-30 | 2008-12-03 | 株式会社东海理化电机制作所 | Temperature regulation means for injection molding machine |
CN107415249A (en) * | 2017-08-03 | 2017-12-01 | 金华市瑞意电气科技有限公司 | A kind of melting control device and method for 3D printing |
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JP6986478B2 (en) | 2021-12-22 |
KR102237172B1 (en) | 2021-04-07 |
TW201941896A (en) | 2019-11-01 |
CN110315663A (en) | 2019-10-11 |
JP2019177581A (en) | 2019-10-17 |
KR20190114753A (en) | 2019-10-10 |
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