TWI697394B - Resin molding apparatus and method of manufacturing resin molded product - Google Patents

Resin molding apparatus and method of manufacturing resin molded product Download PDF

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Publication number
TWI697394B
TWI697394B TW108110368A TW108110368A TWI697394B TW I697394 B TWI697394 B TW I697394B TW 108110368 A TW108110368 A TW 108110368A TW 108110368 A TW108110368 A TW 108110368A TW I697394 B TWI697394 B TW I697394B
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nozzle
resin
contact
liquid resin
heating
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TW108110368A
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Chinese (zh)
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TW201941896A (en
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後藤智行
岩田康弘
花坂周邦
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/38—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/44—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/78—Measuring, controlling or regulating of temperature

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention provides a resin molding apparatus 1 which reduces the viscosity of a liquid resin without deteriorating the workability of nozzle replacement. The resin molding apparatus 1 supplies a liquid resin 30 to a discharge object 14 to perform resin molding, and the resin molding apparatus 1 includes a nozzle 29 for discharging the liquid resin 30 to the discharge object 14, a heating part 31 for heating the nozzle 29 in contact with the nozzle 29, and a switching mechanism 34 for switching between a contact state in which the nozzle 29 and the heating part 31 are in contact with each other and a separation state in which the nozzle 29 and the heating part 31 are separated from each other.

Description

樹脂成形裝置及樹脂成形品的製造方法Resin molding device and manufacturing method of resin molded product

本發明是有關於一種樹脂成形裝置及樹脂成形品的製造方法。The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

以往，基板上所安裝的半導體晶片例如是使用包括矽酮樹脂或環氧樹脂等熱硬化性樹脂的液狀樹脂來進行樹脂密封。作為進行樹脂密封的技術，使用壓縮成形、轉注成形等樹脂成形技術。在使用液狀樹脂的樹脂成形中，是通過使作為硬化劑等輔助劑的液狀樹脂混合於作為主劑的液狀樹脂中，並對混合後的液狀樹脂進行加熱來進行樹脂成形。Conventionally, a semiconductor wafer mounted on a substrate is resin-sealed using liquid resin including thermosetting resin such as silicone resin or epoxy resin, for example. As a technique for resin sealing, resin molding techniques such as compression molding and transfer molding are used. In resin molding using a liquid resin, resin molding is performed by mixing a liquid resin as an auxiliary agent such as a curing agent with a liquid resin as a main agent, and heating the mixed liquid resin.

在使用所述液狀樹脂的樹脂密封中，將噴出液狀樹脂的噴嘴***至上模具與下模具之間，對下模具中所形成的腔室供給液狀樹脂。此處，因液狀樹脂隨著其溫度上升而黏度變低，所以為了使液狀樹脂容易從噴嘴噴出而對液狀樹脂進行了加熱。In the resin sealing using the liquid resin, a nozzle for ejecting the liquid resin is inserted between the upper mold and the lower mold, and the liquid resin is supplied to the cavity formed in the lower mold. Here, since the viscosity of the liquid resin decreases as its temperature rises, the liquid resin is heated in order to make it easy to eject the liquid resin from the nozzle.

作為對液狀樹脂進行加熱者，考慮如專利文獻1所示，在一體形成有輸液管的噴嘴中，在所述輸液管的外周設置螺旋狀的配管而構成了溫度調節器者。並且，通過所述溫度調節器而使熱硬化性樹脂成為具有流動性的程度（level）的液狀樹脂。As a person who heats the liquid resin, as shown in Patent Document 1, in a nozzle integrally formed with an infusion tube, a spiral piping is provided on the outer periphery of the infusion tube to form a temperature regulator. In addition, the thermosetting resin is made into a liquid resin having a fluidity level by the temperature regulator.

然而，在對一體形成於噴嘴的輸液管設置所述溫度調節器的構成中，噴嘴的結構變複雜，伴隨於此，噴嘴更換的作業性也變差。 [現有技術文獻] [專利文獻]However, in the configuration in which the temperature regulator is provided to the infusion tube integrally formed with the nozzle, the structure of the nozzle becomes complicated, and accordingly, the workability of nozzle replacement also deteriorates. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2012-232437號公報[Patent Document 1] Japanese Patent Laid-Open No. 2012-232437

[發明所要解決的問題] 因此，本發明是為了解決所述問題點而成，其主要課題在於不會使噴嘴更換的作業性變差且使液狀樹脂的黏度降低。 [解決問題的技術手段][The problem to be solved by the invention] Therefore, the present invention was made to solve the above-mentioned problems, and its main problem is to reduce the viscosity of the liquid resin without deteriorating the workability of nozzle replacement. [Technical means to solve the problem]

即本發明的樹脂成形裝置是將液狀樹脂供給至噴出對象物來進行樹脂成形的樹脂成形裝置，其特徵在於包括：噴嘴，將所述液狀樹脂噴出至所述噴出對象物；加熱部，與所述噴嘴接觸而對所述噴嘴進行加熱；以及切換機構，對所述噴嘴及所述加熱部彼此接觸的接觸狀態與所述噴嘴及所述加熱部彼此分離的分離狀態進行切換。 本發明的樹脂成形品的製造方法是將液狀樹脂從噴嘴噴出至噴出對象物，並使用所噴出的液狀樹脂進行樹脂成形來製造樹脂成形品的樹脂成形品的製造方法，其中：使所述噴嘴與相對於所述噴嘴而能夠接觸、分離地設置的加熱部接觸以進行加熱後，對所述噴出對象物噴出液狀樹脂。 [發明的效果]That is, the resin molding apparatus of the present invention is a resin molding apparatus that supplies liquid resin to an ejection object to perform resin molding, and is characterized by including: a nozzle for ejecting the liquid resin to the ejection object; a heating unit, The nozzle is brought into contact with the nozzle to heat the nozzle; and a switching mechanism that switches the contact state in which the nozzle and the heating portion are in contact with each other and the separation state in which the nozzle and the heating portion are separated from each other. The method of manufacturing a resin molded product of the present invention is a method of manufacturing a resin molded product in which a liquid resin is ejected from a nozzle to an object to be ejected, and the ejected liquid resin is used for resin molding to produce a resin molded product, wherein: After the nozzle is brought into contact with and heated by a heating unit provided so as to be able to contact and separate from the nozzle, the liquid resin is discharged to the discharge target. [Effects of the invention]

根據如此構成的本發明，可不使噴嘴更換的作業性變差且使液狀樹脂的黏度降低。According to the present invention thus constituted, it is possible to reduce the viscosity of the liquid resin without deteriorating the workability of nozzle replacement.

接著，針對本發明，列舉示例來進一步詳細說明。但是，本發明並不受以下說明限定。Next, with regard to the present invention, examples are given to further explain in detail. However, the present invention is not limited by the following description.

如上所述，本發明的樹脂成形裝置是將液狀樹脂供給至噴出對象物來進行樹脂成形的樹脂成形裝置，其特徵在於包括：噴嘴，將所述液狀樹脂噴出至所述噴出對象物；加熱部，與所述噴嘴接觸而對所述噴嘴進行加熱；以及切換機構，對所述噴嘴及所述加熱部彼此接觸的接觸狀態與所述噴嘴及所述加熱部彼此分離的分離狀態進行切換。 若為所述樹脂成形裝置，則可對噴嘴及加熱部彼此接觸的接觸狀態與噴嘴及加熱部彼此分離的分離狀態進行切換，因此無需在噴嘴中設置加熱部。結果，可不使噴嘴的結構複雜化而在噴嘴中對液狀樹脂進行加熱。因噴嘴的結構不被複雜化，所以也不會使噴嘴更換的作業性變差。而且，液狀樹脂受到加熱而液狀樹脂的黏度變低，容易從噴嘴噴出，可使噴出量的精度提高，從而可儘早解除噴出後的拉絲狀態。As described above, the resin molding apparatus of the present invention is a resin molding apparatus that supplies a liquid resin to an ejection object to perform resin molding, and is characterized by including a nozzle for ejecting the liquid resin to the ejection object; A heating unit that is in contact with the nozzle to heat the nozzle; and a switching mechanism that switches the contact state in which the nozzle and the heating unit are in contact with each other and the separation state in which the nozzle and the heating unit are separated from each other . In the case of the resin molding apparatus, the contact state in which the nozzle and the heating part are in contact with each other and the separation state in which the nozzle and the heating part are separated from each other can be switched, so there is no need to provide a heating part in the nozzle. As a result, the liquid resin can be heated in the nozzle without complicating the structure of the nozzle. Since the structure of the nozzle is not complicated, the workability of nozzle replacement is not deteriorated. Furthermore, the liquid resin is heated and the viscosity of the liquid resin becomes low, and it is easily ejected from the nozzle, the accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.

為了能夠在不使噴嘴的結構複雜化的情況下積極地對噴嘴進行冷卻，理想的是包括與所述噴嘴接觸而對所述噴嘴進行冷卻的冷卻部，且所述切換機構對所述噴嘴及所述冷卻部彼此接觸的接觸狀態與所述噴嘴及所述冷卻部彼此分離的分離狀態進行切換。 若為所述構成，則可降低對液狀樹脂的不良影響（例如不必要的熱硬化）。而且，通過使噴嘴冷卻可提高液狀樹脂的黏度，從而可防止在不噴出液狀樹脂的待機狀態下液狀樹脂從噴嘴滴落。In order to be able to actively cool the nozzle without complicating the structure of the nozzle, it is desirable to include a cooling unit that contacts the nozzle to cool the nozzle, and the switching mechanism controls the nozzle and The contact state in which the cooling portions are in contact with each other is switched with the separation state in which the nozzle and the cooling portion are separated from each other. With this configuration, it is possible to reduce adverse effects on the liquid resin (for example, unnecessary thermal curing). Furthermore, by cooling the nozzle, the viscosity of the liquid resin can be increased, so that the liquid resin can be prevented from dripping from the nozzle in a standby state where the liquid resin is not ejected.

為了能夠對噴嘴的溫度進行管理，理想的是包括對所述噴嘴的溫度進行檢測的溫度感測器、以及基於所述溫度感測器的檢測溫度來對所述切換機構進行控制的控制部。In order to be able to manage the temperature of the nozzle, it is desirable to include a temperature sensor that detects the temperature of the nozzle and a control unit that controls the switching mechanism based on the temperature detected by the temperature sensor.

為了使經加熱的噴嘴的溫度不易降低，理想的是包括保溫構件，所述保溫構件設置於所述噴嘴的外表面，且熱容量大於所述噴嘴。In order to make the temperature of the heated nozzle not easy to decrease, it is desirable to include a heat-insulating member, which is provided on the outer surface of the nozzle and has a larger heat capacity than the nozzle.

理想的是對所述噴嘴的表面的至少一部分實施了黑化處理。 若為所述構成，則容易吸收例如成形模具等的來自噴嘴外部的熱輻射，可利用所述熱輻射來對噴嘴進行加熱或防止溫度降低。It is desirable that at least a part of the surface of the nozzle is blackened. With this configuration, it is easy to absorb heat radiation from the outside of the nozzle, such as a molding die, and the heat radiation can be used to heat the nozzle or prevent a temperature drop.

樹脂成形裝置包括：分配器，具有所述噴嘴，且從所述噴嘴噴出液狀樹脂；以及供給模組，在所述分配器待機的同時對所述分配器供給液狀樹脂。在所述構成中，所述加熱部理想的是設置於所述供給模組中。 因如此般在供給模組中設置有加熱部，因此可對待機狀態的噴嘴進行加熱。結果，可在噴出液狀樹脂之前將噴嘴充分加熱。The resin molding apparatus includes: a dispenser that has the nozzle and ejects liquid resin from the nozzle; and a supply module that supplies the liquid resin to the dispenser while the dispenser is on standby. In the above configuration, the heating unit is desirably provided in the supply module. Because the heating part is provided in the supply module in this way, the nozzle in the standby state can be heated. As a result, the nozzle can be sufficiently heated before the liquid resin is discharged.

樹脂成形裝置的所述噴出對象物為成形模具，且樹脂成形裝置包括成形模組，所述成形模組具有所述成形模具及對所述成形模具進行合模的合模機構。在所述構成中，所述加熱部理想的是設置於所述成形模組中。 因如此般在成形模組中設置有加熱部，因此可在即將噴出液狀樹脂之前將噴嘴加熱。結果，可在經加熱的噴嘴的溫度降低之前噴出液狀樹脂。The ejected object of the resin molding apparatus is a molding die, and the resin molding apparatus includes a molding module having the molding die and a mold clamping mechanism for clamping the molding die. In the above configuration, the heating unit is preferably provided in the molding die set. Since the heating part is provided in the molding die in this way, the nozzle can be heated just before the liquid resin is discharged. As a result, the liquid resin can be ejected before the temperature of the heated nozzle decreases.

所述加熱部理想的是經由所述切換機構而設置於從所述噴嘴噴出液狀樹脂的分配器中。 若為所述構成，則可在從噴嘴噴出液狀樹脂的過程中對噴嘴進行加熱。The heating part is desirably provided in a dispenser that ejects liquid resin from the nozzle via the switching mechanism. With the above configuration, the nozzle can be heated while the liquid resin is ejected from the nozzle.

而且，本發明的樹脂成形品的製造方法是將液狀樹脂從噴嘴噴出至噴出對象物，並使用所噴出的液狀樹脂進行樹脂成形來製造樹脂成形品的樹脂成形品的製造方法，其特徵在於：使所述噴嘴與相對於所述噴嘴而能夠接觸･分離地設置的加熱部接觸以進行加熱後，對所述噴出對象物噴出液狀樹脂。 若為所述樹脂成形品的製造方法，則因使用相對於噴嘴而能夠接觸･分離地設置的加熱部對噴嘴進行加熱，所以無需在噴嘴中設置加熱部。結果，可不使噴嘴的結構複雜化而在噴嘴中對液狀樹脂進行加熱。因噴嘴的結構不被複雜化，所以也不會使噴嘴更換的作業性變差。而且，液狀樹脂受到加熱而液狀樹脂的黏度變低，容易從噴嘴噴出，可使噴出量的精度提高，從而可儘早解除噴出後的拉絲狀態。In addition, the method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product in which a liquid resin is ejected from a nozzle to an object to be ejected, and the ejected liquid resin is used to perform resin molding to produce a resin molded product. The method is that after the nozzle is brought into contact with a heating unit provided so as to be able to contact and separate from the nozzle to be heated, the liquid resin is discharged to the discharge target. In the case of the above-mentioned method of manufacturing a resin molded product, since the nozzle is heated by a heating unit provided so as to be able to contact and separate from the nozzle, it is not necessary to provide a heating unit in the nozzle. As a result, the liquid resin can be heated in the nozzle without complicating the structure of the nozzle. Since the structure of the nozzle is not complicated, the workability of nozzle replacement is not deteriorated. Furthermore, the liquid resin is heated and the viscosity of the liquid resin becomes low, and it is easily ejected from the nozzle, the accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.

理想的是在對所述噴出對象物噴出液狀樹脂後，使所述噴嘴與相對於所述噴嘴而能夠接觸･分離地設置的冷卻部接觸以進行冷卻。 若為所述構成，則可降低對液狀樹脂的不良影響（例如不必要的熱硬化）。而且，通過使噴嘴冷卻可提高液狀樹脂的黏度，從而可防止在噴出後液狀樹脂從噴嘴滴落。It is desirable that after the liquid resin is sprayed to the spray target, the nozzle is brought into contact with a cooling unit provided so as to be able to contact and be separated from the nozzle to cool it. With this configuration, it is possible to reduce adverse effects on the liquid resin (for example, unnecessary thermal curing). Furthermore, by cooling the nozzle, the viscosity of the liquid resin can be increased, so that the liquid resin can be prevented from dripping from the nozzle after ejection.

＜本發明的實施方式＞ 以下，參照圖式對本發明的樹脂成形裝置的實施方式進行說明。另外，關於以下所示的任一圖，為了便於理解，均適當省略或誇張來示意性地進行了描繪。針對相同的構成要素，標注相同的符號並適當省略說明。另外，在本申請書類中，「液狀」這一用語是指常溫下為液狀而具有流動性，並且不論流動性的高低，換句話說黏度的程度。而且，在本申請書類中，所謂「樹脂成形品」是指至少包括經樹脂成形的樹脂部分的產品，是包括後述那樣的將安裝在基板上的晶片通過成形模具進行樹脂成形並進行樹脂密封的形態的密封後基板的概念的表達。<Embodiments of the present invention> Hereinafter, embodiments of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, in order to facilitate understanding, any of the drawings shown below are schematically depicted with appropriate omissions or exaggerations. The same components are denoted by the same symbols and their descriptions are appropriately omitted. In addition, in this application, the term "liquid" means that it is liquid at room temperature and has fluidity, regardless of the level of fluidity, in other words the degree of viscosity. In addition, in this application, the term "resin molded product" refers to a product that includes at least a resin portion molded by resin, and includes a wafer mounted on a substrate that is resin-molded through a molding die and resin-sealed as described later. The expression of the concept of the substrate after the morphology is sealed.

參照圖1對本實施方式的樹脂成形裝置1的構成進行說明。圖1所示的樹脂成形裝置1是使用壓縮成形法的樹脂成形裝置。在本實施方式中，表示例如以安裝有半導體晶片的基板為進行樹脂成形的對象，使用流動性樹脂即液狀樹脂作為樹脂材料的情況。另外，作為「基板」，可列舉玻璃環氧基板、陶瓷基板、樹脂基板、金屬基板等一般性基板及引線框架（lead frame）等。The configuration of the resin molding apparatus 1 of this embodiment will be described with reference to FIG. 1. The resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using a compression molding method. In the present embodiment, for example, a case where a substrate on which a semiconductor wafer is mounted is used as an object for resin molding, and liquid resin, which is a fluid resin, is used as a resin material. In addition, examples of the "substrate" include general substrates such as glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates, lead frames, and the like.

具體來說，樹脂成形裝置1如圖1所示，包括基板供給･收納模組2、四個成形模組3A、3B、3C、3D及供給模組4分別作為構成要素。作為構成要素的基板供給･收納模組2、成形模組3A～3D及供給模組4分別可相對於其他構成要素相互進行拆裝，並且可更換。Specifically, the resin molding apparatus 1 as shown in FIG. 1 includes a substrate supply and storage module 2, four molding modules 3A, 3B, 3C, 3D, and a supply module 4 as constituent elements, respectively. The substrate supply and storage module 2, the forming modules 3A to 3D, and the supply module 4 as the constituent elements can be detached from and detached from other constituent elements, and can be replaced.

在基板供給･收納模組2中設置供給密封前基板5的密封前基板供給部6及收納密封後基板7的密封後基板收納部8。對密封前基板5例如安裝作為光元件的發光二極體（light-emitting diode，LED）晶片等。在基板供給･收納模組2中設置裝載機（loader）9及卸載機（unloader）10，對裝載機9及卸載機10進行支持的軌道11沿著X方向而設。裝載機9及卸載機10沿著軌道11在X方向上移動。The substrate supply and storage module 2 is provided with a pre-seal substrate supply portion 6 that supplies the pre-seal substrate 5 and a post-seal substrate storage portion 8 that accommodates the sealed substrate 7. For example, a light-emitting diode (LED) wafer or the like as an optical element is mounted on the substrate 5 before sealing. A loader 9 and an unloader 10 are provided in the substrate supply and storage module 2, and a rail 11 supporting the loader 9 and the unloader 10 is provided along the X direction. The loader 9 and the unloader 10 move in the X direction along the rail 11.

由軌道11支持的裝載機9及卸載機10在基板供給･收納模組2、各成形模組3A、3B、3C、3D與供給模組4之間在X方向上移動。對裝載機9中設置用以在各成形模組3A、3B、3C、3D中將密封前基板5供給至上模具的移動機構12。在各成形模組中，移動機構12在Y方向上移動。對卸載機10設置用以在各成形模組3A、3B、3C、3D中從上模具接收密封後基板7的移動機構13。在各成形模組3A、3B、3C、3D中，移動機構13在Y方向上移動。The loader 9 and the unloader 10 supported by the rail 11 move in the X direction between the substrate supply and storage module 2, the respective forming modules 3A, 3B, 3C, 3D, and the supply module 4. The loader 9 is provided with a moving mechanism 12 for supplying the pre-sealing substrate 5 to the upper mold in each of the molding modules 3A, 3B, 3C, and 3D. In each forming module, the moving mechanism 12 moves in the Y direction. The unloader 10 is provided with a moving mechanism 13 for receiving the sealed substrate 7 from the upper mold in the respective forming modules 3A, 3B, 3C, and 3D. In each of the forming modules 3A, 3B, 3C, and 3D, the moving mechanism 13 moves in the Y direction.

在各成形模組3A、3B、3C、3D中設有彼此相向的一對成形模具。本實施方式的一對成形模具是能夠升降的下模具14及與下模具14彼此相向配置的上模具（未圖示，參照圖2（1））。各成形模組3A、3B、3C、3D具有對上模具與下模具14進行合模及開模的合模機構15。作為收容液狀樹脂進行硬化的空間的腔室16形成於下模具14。換句話說，腔室16是收容液狀樹脂的收容部。腔室16的模具面由脫模膜17包覆。A pair of forming dies facing each other are provided in each forming module 3A, 3B, 3C, and 3D. The pair of forming molds in the present embodiment are a lower mold 14 that can be raised and lowered, and an upper mold (not shown, refer to FIG. 2(1)) that is arranged opposite to the lower mold 14. Each forming module 3A, 3B, 3C, 3D has a mold clamping mechanism 15 for clamping and opening the upper mold and the lower mold 14. A cavity 16 as a space in which liquid resin is stored and cured is formed in the lower mold 14. In other words, the cavity 16 is a storage portion that contains liquid resin. The mold surface of the cavity 16 is covered with a release film 17.

在供給模組4中設置對作為噴出對象物的下模具14的腔室16供給液狀樹脂的樹脂供給機構18。樹脂供給機構18由軌道11支持，並通過移動機構20而沿著軌道11在X方向上移動。對樹脂供給機構18設置作為液狀樹脂的噴出機構的分配器（dispenser）19。在各成形模組3A、3B、3C、3D中，分配器19通過移動機構20而在Y方向上移動，對腔室16噴出液狀樹脂。圖1所示的分配器19是使用預先混合主劑及硬化劑而成的液狀樹脂的一液型分配器。作為主劑，使用具有熱硬化性及透光性的矽酮樹脂或環氧樹脂等。The supply module 4 is provided with a resin supply mechanism 18 that supplies liquid resin to the cavity 16 of the lower mold 14 as the ejection target. The resin supply mechanism 18 is supported by the rail 11 and moves in the X direction along the rail 11 by the moving mechanism 20. The resin supply mechanism 18 is provided with a dispenser 19 as a liquid resin ejection mechanism. In each of the molding modules 3A, 3B, 3C, and 3D, the distributor 19 is moved in the Y direction by the moving mechanism 20 to eject the liquid resin into the cavity 16. The dispenser 19 shown in FIG. 1 is a one-liquid type dispenser using a liquid resin prepared by mixing a main agent and a hardening agent in advance. As the main agent, silicone resin or epoxy resin having thermosetting and translucent properties is used.

在供給模組4中設置抽真空機構21。抽真空機構21在各成形模組3A、3B、3C、3D中在即將對上模具與下模具14進行合模前從腔室16強制性地抽吸空氣而將其排出。而且，在供給模組4中設置對樹脂成形裝置1整體的動作進行控制的控制部22。在圖1中，示出了將抽真空機構21及控制部22設置於供給模組4的情況。並不限於此，也可以將抽真空機構21及控制部22設置於其他模組。另外，控制部22例如包括具有中央處理單元（central processing unit，CPU）、內部記憶體、模數（analog digital，AD）轉換器、輸入輸出反相器（inverter）等的專用或通用電腦。A vacuuming mechanism 21 is provided in the supply module 4. The vacuum mechanism 21 forcibly sucks air from the cavity 16 and discharges it immediately before clamping the upper mold and the lower mold 14 in each of the molding modules 3A, 3B, 3C, and 3D. In addition, the supply module 4 is provided with a control unit 22 that controls the entire operation of the resin molding apparatus 1. In FIG. 1, a case where the vacuuming mechanism 21 and the control unit 22 are installed in the supply module 4 is shown. It is not limited to this, and the vacuum mechanism 21 and the control unit 22 may be provided in other modules. In addition, the control unit 22 includes, for example, a dedicated or general-purpose computer having a central processing unit (CPU), an internal memory, an analog digital (AD) converter, an input/output inverter (inverter), and the like.

參照圖1及圖2（1）、圖2（2），對樹脂供給機構18對設置於下模具14中的腔室16供給液狀樹脂30（參照圖2（1）、圖2（2））的機構進行說明。如圖2（1）所示，在各成形模組3A、3B、3C、3D（參照圖1）中設置上模具23、下模具14及膜按壓構件24。1 and 2(1), 2(2), the resin supply mechanism 18 supplies the liquid resin 30 to the cavity 16 provided in the lower mold 14 (see FIGS. 2(1) and 2(2)) ) To explain the organization. As shown in FIG. 2(1), the upper mold 23, the lower mold 14, and the film pressing member 24 are provided in each of the molding modules 3A, 3B, 3C, and 3D (see FIG. 1).

脫模膜17包覆腔室16的模具面及其周圍的模具面。膜按壓構件24是用以在腔室16的周圍將脫模膜17按壓並固定至下模具14的模具面的構件。膜按壓構件24在中央部具有開口，成形模具位於所述開口的內部。在上模具23中例如通過吸附或卡夾（clamp）等而固定、配置安裝有LED晶片25等的密封前基板5。在腔室16的內部設置對應於各LED晶片25的獨立腔室26。The mold release film 17 covers the mold surface of the cavity 16 and the surrounding mold surface. The film pressing member 24 is a member to press and fix the release film 17 to the mold surface of the lower mold 14 around the cavity 16. The film pressing member 24 has an opening in the center portion, and the forming die is located inside the opening. In the upper mold 23, the pre-sealing substrate 5 on which the LED chip 25 and the like are mounted is fixed and arranged by, for example, suction or clamping. An independent cavity 26 corresponding to each LED chip 25 is provided inside the cavity 16.

以覆蓋腔室16的整個面的方式供給脫模膜17。通過設置於下模具14的加熱器（未圖示）對脫模膜17進行加熱。經加熱的脫模膜17軟化而伸長。在腔室16的周圍，通過膜按壓構件24，軟化的脫模膜17被按壓並固定至下模具14的模具面。以沿著各獨立腔室26的模具面的方式吸附軟化的脫模膜17。另外，在圖2（1）中，示出了使用膜按壓構件24的情況。並不限於此，也可以不使用脫模膜17及膜按壓構件24。The release film 17 is supplied so as to cover the entire surface of the cavity 16. The release film 17 is heated by a heater (not shown) provided in the lower mold 14. The heated release film 17 is softened and stretched. Around the cavity 16, the softened release film 17 is pressed and fixed to the mold surface of the lower mold 14 by the film pressing member 24. The softened mold release film 17 is adsorbed along the mold surface of each independent cavity 26. In addition, in FIG. 2( 1 ), a case where the film pressing member 24 is used is shown. It is not limited to this, and the release film 17 and the film pressing member 24 may not be used.

如圖2（1）、圖2（2）所示，分配器19具有送出規定量的液狀樹脂30的送出機構27、貯存液狀樹脂30的注射器（syringe）28及噴出液狀樹脂30的噴嘴29。在分配器19中，送出機構27、注射器28及噴嘴29連接而構成為一體。因此，可將各構成要素（送出機構27、注射器28、噴嘴29）彼此拆裝，可將各構成要素單元更換為同種但不同的構成單元。例如，可將具有不同材料或不同黏度等的液狀樹脂30預先貯存保管在多個注射器28中，根據產品而將需要的注射器28安裝至分配器19來使用。另外，可選擇容量不同的注射器28來使用。As shown in Figure 2 (1) and Figure 2 (2), the dispenser 19 has a delivery mechanism 27 that delivers a predetermined amount of liquid resin 30, a syringe 28 that stores the liquid resin 30, and a device that ejects the liquid resin 30. Nozzle 29. In the dispenser 19, the delivery mechanism 27, the syringe 28, and the nozzle 29 are connected to form a single body. Therefore, the respective constituent elements (the delivery mechanism 27, the syringe 28, and the nozzle 29) can be detached from each other, and the constituent element units can be replaced with the same but different constituent units. For example, liquid resins 30 having different materials or different viscosities can be stored in a plurality of syringes 28 in advance, and the required syringes 28 can be attached to the dispenser 19 for use depending on the product. In addition, syringes 28 with different capacities can be selected for use.

通過更換噴嘴29，可將液狀樹脂30的噴出方向設定為正下方、正側方、斜下方等任意的方向。另外，可根據液狀樹脂30的黏度來變更噴嘴29的噴出口的口徑。進而，可在注射器28與噴嘴29之間設置靜態混合器（Static mixer）。例如，即使在對液狀樹脂30添加了螢光體等作為添加劑的情況下，通過由靜態混合器對液狀樹脂30進行攪拌，仍可在螢光體不沉澱的均勻狀態下噴出液狀樹脂30。By replacing the nozzle 29, the ejection direction of the liquid resin 30 can be set to any direction such as directly below, front side, and diagonally below. In addition, the diameter of the ejection port of the nozzle 29 can be changed according to the viscosity of the liquid resin 30. Furthermore, a static mixer (Static mixer) may be provided between the syringe 28 and the nozzle 29. For example, even when a phosphor or the like is added as an additive to the liquid resin 30, by stirring the liquid resin 30 with a static mixer, the liquid resin can be ejected in a uniform state where the phosphor does not settle. 30.

也可使分配器19在上下方向（Z方向）上移動。可使圖2（1）所示的分配器19以在鉛垂面內（包括Y軸及Z軸的面內）或水平面內（包括X軸及Y軸的面內），以某一點為中心局部地旋轉的方式往返運動。在所述情況下，以分配器19的前端部描繪圓弧的一部分的方式進行往返運動。The distributor 19 can also be moved in the vertical direction (Z direction). The distributor 19 shown in Figure 2 (1) can be centered on a vertical plane (in the plane including the Y axis and Z axis) or in the horizontal plane (in the plane including the X axis and Y axis) Partially rotate back and forth. In this case, the reciprocating motion is performed such that the front end portion of the distributor 19 draws a part of the arc.

參照圖1及圖2（1）、圖2（2）對作為樹脂成形裝置1的動作而使用成形模組3C的情況進行說明。首先，例如，將安裝有LED晶片25的密封前基板5以安裝有LED晶片25的面朝下的方式從密封前基板供給部6移交給裝載機9。接著，使裝載機9從基板供給･收納模組2沿著軌道11在+X方向上移動至成形模組3C。The case where the molding die set 3C is used as the operation of the resin molding apparatus 1 will be described with reference to FIGS. 1 and 2 (1) and 2 (2 ). First, for example, the pre-seal substrate 5 on which the LED chip 25 is mounted is transferred from the pre-seal substrate supply unit 6 to the loader 9 with the surface on which the LED chip 25 is mounted faces downward. Next, the loader 9 is moved from the substrate supply and storage module 2 along the rail 11 in the +X direction to the forming module 3C.

接著，在成形模組3C中，使用移動機構12，使裝載機9在-Y方向上移動至下模具14與上模具23（參照圖2（1））之間的規定位置。將安裝有LED晶片25的面朝下的密封前基板5通過吸附或夾持而固定於上模具23的下表面。在將密封前基板5配置於上模具的下表面之後，使裝載機9移動至基板供給･收納模組2中的原位置。Next, in the molding module 3C, the moving mechanism 12 is used to move the loader 9 in the -Y direction to a predetermined position between the lower mold 14 and the upper mold 23 (see FIG. 2(1)). The front-sealing substrate 5 on which the LED chip 25 is mounted facing downward is fixed to the lower surface of the upper mold 23 by suction or clamping. After the pre-sealing substrate 5 is placed on the lower surface of the upper mold, the loader 9 is moved to the original position in the substrate supply and storage module 2.

接著，使用樹脂供給機構18，使分配器19從供給模組4中的待機位置沿著軌道11在-X方向上移動至成形模組3C。由此，使樹脂供給機構18移動至模組3C中的下模具14的附近的規定位置。使用移動機構20，使分配器19移動至下模具14的上方的規定位置。Next, the resin supply mechanism 18 is used to move the distributor 19 from the standby position in the supply module 4 along the rail 11 in the −X direction to the molding module 3C. As a result, the resin supply mechanism 18 is moved to a predetermined position in the vicinity of the lower mold 14 in the die set 3C. The moving mechanism 20 is used to move the distributor 19 to a predetermined position above the lower mold 14.

接著，如圖2（1）所示，從分配器19的噴嘴29噴出液狀樹脂30。具體來說，從分配器19的噴嘴29朝設置於下模具14的腔室16噴出液狀樹脂30。由此，對腔室16供給液狀樹脂30。Next, as shown in FIG. 2( 1 ), the liquid resin 30 is ejected from the nozzle 29 of the distributor 19. Specifically, the liquid resin 30 is ejected from the nozzle 29 of the distributor 19 toward the cavity 16 provided in the lower mold 14. Thus, the liquid resin 30 is supplied to the cavity 16.

接著，在將液狀樹脂30供給至腔室16之後，使用移動機構20使分配器19後退至樹脂供給機構18。使樹脂供給機構18移動至供給模組4中的原待機位置。Next, after the liquid resin 30 is supplied to the chamber 16, the moving mechanism 20 is used to retract the dispenser 19 to the resin supply mechanism 18. The resin supply mechanism 18 is moved to the original standby position in the supply module 4.

接著，在成形模組3C中，使用合模機構15使下模具14上升，由此對上模具23與下模具14進行合模。通過進行合模，使安裝於密封前基板5上的LED晶片25浸漬於供給至腔室16的液狀樹脂30中。此時，可使用設置於下模具14的腔室底面構件（未圖示）對腔室16內的液狀樹脂30施加規定的樹脂壓力。Next, in the molding die set 3C, the lower mold 14 is raised using the mold clamping mechanism 15 to thereby clamp the upper mold 23 and the lower mold 14. By performing mold clamping, the LED chip 25 mounted on the substrate 5 before sealing is immersed in the liquid resin 30 supplied to the cavity 16. At this time, a cavity bottom surface member (not shown) provided in the lower mold 14 can be used to apply a predetermined resin pressure to the liquid resin 30 in the cavity 16.

另外，也可以在進行合模的過程中，使用抽真空機構21對腔室16內進行抽吸。由此，將殘留在腔室16內的空氣或液狀樹脂30中所含的氣泡等排出至成形模具的外部。另外，將腔室16內設定為規定的真空度。In addition, in the process of clamping the mold, the vacuum mechanism 21 may be used to suck the inside of the cavity 16. As a result, air remaining in the cavity 16 or air bubbles contained in the liquid resin 30 are discharged to the outside of the molding die. In addition, the inside of the chamber 16 is set to a predetermined degree of vacuum.

接著，使用設置於下模具14的加熱器（未圖示），以使液狀樹脂30硬化所需的時間對液狀樹脂30進行加熱。由此，使液狀樹脂30硬化而形成硬化樹脂。由此，通過對應於腔室16的形狀而形成的硬化樹脂將安裝於密封前基板5的LED晶片25予以樹脂密封。在使液狀樹脂30硬化之後，使用合模機構15對上模具23與下模具14進行開模。Next, a heater (not shown) provided in the lower mold 14 is used to heat the liquid resin 30 for the time required to harden the liquid resin 30. As a result, the liquid resin 30 is cured to form a cured resin. As a result, the LED chip 25 mounted on the pre-sealing substrate 5 is resin-sealed by the cured resin formed corresponding to the shape of the cavity 16. After the liquid resin 30 is cured, the upper mold 23 and the lower mold 14 are opened using the mold clamping mechanism 15.

接著，使裝載機9退避至不會妨礙卸載機10移動至成形模組3C的適當位置。例如，使裝載機9從基板供給･收納模組2退避至成形模組3D或供給模組4中的適當位置。之後，使卸載機10從基板供給･收納模組2沿著軌道11在+X方向上移動至成形模組3C。Next, the loader 9 is retracted to an appropriate position where the unloader 10 is not prevented from moving to the forming module 3C. For example, the loader 9 is retracted from the substrate supply and storage module 2 to an appropriate position in the forming module 3D or the supply module 4. After that, the unloader 10 is moved from the substrate supply and storage module 2 along the rail 11 in the +X direction to the forming module 3C.

接著，在成形模組3C中，使移動機構13在-Y方向上移動至下模具14與上模具23之間的規定位置之後，移動機構13從上模具23接收密封後基板7。在接收密封後基板7後，使移動機構13返回至卸載機10。使卸載機10返回至基板供給･收納模組2之後，將密封後基板7收納至密封後基板收納部8。此時，第一個密封前基板5的樹脂密封結束，從而完成第一個密封後基板7。Next, in the molding module 3C, after the moving mechanism 13 is moved in the −Y direction to a predetermined position between the lower mold 14 and the upper mold 23, the moving mechanism 13 receives the sealed substrate 7 from the upper mold 23. After receiving the sealed substrate 7, the moving mechanism 13 is returned to the unloader 10. After returning the unloader 10 to the substrate supply and storage module 2, the sealed substrate 7 is stored in the sealed substrate storage section 8. At this time, the resin sealing of the first pre-sealed substrate 5 is completed, and the first post-sealed substrate 7 is completed.

接著，使退避至成形模組3D或供給模組4中的適當位置的裝載機9移動至基板供給･收納模組2。自密封前基板供給部6對裝載機9移交下一密封前基板5。如上所述反復進行樹脂密封。Next, the loader 9 retreated to an appropriate position in the forming module 3D or the supply module 4 is moved to the substrate supply/storage module 2. The next pre-sealing substrate 5 is transferred from the pre-sealing substrate supply unit 6 to the loader 9. The resin sealing is repeated as described above.

另外，在本實施方式中，密封前基板5的供給、樹脂供給機構18及分配器19的移動、液狀樹脂30的噴出、上模具23與下模具14的合模及開模、密封後基板7的收納等動作由控制部22控制。In addition, in this embodiment, the supply of the substrate 5 before sealing, the movement of the resin supply mechanism 18 and the distributor 19, the ejection of the liquid resin 30, the clamping and opening of the upper mold 23 and the lower mold 14, and the substrate after sealing Operations such as storage of 7 are controlled by the control unit 22.

＜噴嘴29的溫度調節機構＞ 並且，本實施形態的樹脂成形裝置1具有溫度調節機構，所述溫度調節機構與噴嘴29獨立地設置，對噴嘴29的溫度進行調整。＜Temperature adjustment mechanism of nozzle 29＞ In addition, the resin molding apparatus 1 of the present embodiment has a temperature adjustment mechanism that is provided independently of the nozzle 29 and adjusts the temperature of the nozzle 29.

具體來說，如圖1、圖3（1）、圖3（2）及圖4（1）、圖4（2）所示，樹脂成形裝置1包括：與噴嘴29接觸而對噴嘴29進行加熱的加熱部31、與噴嘴29接觸而對噴嘴29進行冷卻的冷卻部32、對噴嘴29的溫度進行檢測的溫度感測器33、以及對噴嘴29與加熱部31或冷卻部32的接觸/非接觸進行切換的切換機構34。Specifically, as shown in FIGS. 1, 3 (1), 3 (2), 4 (1), and 4 (2), the resin molding apparatus 1 includes: contacting the nozzle 29 to heat the nozzle 29 The heating part 31 that contacts the nozzle 29 to cool the nozzle 29, the temperature sensor 33 that detects the temperature of the nozzle 29, and the contact/non-contact between the nozzle 29 and the heating part 31 or the cooling part 32 Touch the switching mechanism 34 for switching.

本實施方式的加熱部31、冷卻部32及溫度感測器33設置於供給模組4中。The heating unit 31, the cooling unit 32 and the temperature sensor 33 of this embodiment are provided in the supply module 4.

如圖3（1）、圖3（2）所示，加熱部31是在內部內置有加熱器（未圖示）的例如金屬制的塊體311（以下也稱為加熱塊311）。加熱部31固定於供給模組4中，且具有與噴嘴29的外表面接觸以進行加熱的接觸加熱面311a。本實施方式的接觸加熱面311a是與噴嘴29的前端面29a接觸的面。噴嘴29的前端面29a為平坦面，因此接觸加熱面311a也形成為平坦面。加熱器例如為放熱電阻器。As shown in FIGS. 3(1) and 3(2), the heating unit 31 is, for example, a metal block 311 (hereinafter also referred to as a heating block 311) with a heater (not shown) built therein. The heating part 31 is fixed in the supply module 4 and has a contact heating surface 311a that is in contact with the outer surface of the nozzle 29 for heating. The contact heating surface 311a of the present embodiment is a surface in contact with the tip surface 29a of the nozzle 29. The tip surface 29a of the nozzle 29 is a flat surface, so the contact heating surface 311a is also formed as a flat surface. The heater is, for example, a heat-releasing resistor.

如圖4（1）、圖4（2）所示，冷卻部32例如為金屬制的塊體321（以下也稱為冷卻塊321）。冷卻部32固定於供給模組4中，且具有與噴嘴29的外表面接觸以進行冷卻的接觸冷卻面321a。本實施方式的接觸冷卻面321a與所述接觸加熱面311a同樣地，是與噴嘴29的前端面29a接觸的面。噴嘴29的前端面29a為平坦面，因此接觸冷卻面321a也形成為平坦面。另外，冷卻部32也可在冷卻塊321的內部內置有冷卻器。作為冷卻器，考慮使用珀爾帖（Peltier）元件、流動有氣體或液體的冷卻介質的冷卻配管。As shown in FIGS. 4(1) and 4(2), the cooling part 32 is, for example, a metal block 321 (hereinafter also referred to as a cooling block 321). The cooling part 32 is fixed in the supply module 4 and has a contact cooling surface 321 a that contacts the outer surface of the nozzle 29 for cooling. The contact cooling surface 321a of the present embodiment is a surface that is in contact with the tip surface 29a of the nozzle 29, like the contact heating surface 311a. The tip surface 29a of the nozzle 29 is a flat surface, so the contact cooling surface 321a is also formed as a flat surface. In addition, the cooling unit 32 may have a cooler built in the cooling block 321. As the cooler, a Peltier element and a cooling pipe in which a gas or liquid cooling medium flows are considered.

加熱部31及冷卻部32例如沿X方向（軌道11的延伸方向）並列設置。而且，加熱部31的接觸加熱面311a及冷卻部32的接觸冷卻面321a以與通過移動機構20而在Y方向上移動的噴嘴29的前端面29a接觸的方式朝向Y方向設置。The heating unit 31 and the cooling unit 32 are arranged side by side in the X direction (the extension direction of the rail 11), for example. The heating contact surface 311 a of the heating unit 31 and the cooling contact surface 321 a of the cooling unit 32 are provided in the Y direction so as to contact the tip surface 29 a of the nozzle 29 moved in the Y direction by the moving mechanism 20.

切換機構34對噴嘴29及加熱部31彼此接觸的接觸狀態與噴嘴29及加熱部31彼此分離的分離狀態進行切換，並且對噴嘴29及冷卻部32彼此接觸的接觸狀態與噴嘴29及冷卻部32彼此分離的分離狀態進行切換。The switching mechanism 34 switches the contact state in which the nozzle 29 and the heating portion 31 are in contact with each other and the separation state in which the nozzle 29 and the heating portion 31 are separated from each other, and the contact state in which the nozzle 29 and the cooling portion 32 are in contact with each other and the nozzle 29 and the cooling portion 32 The separated state is switched.

本實施方式的切換機構34包含移動機構20。利用所述移動機構20使分配器19在X方向及Y方向上移動，由此對噴嘴29及加熱部31的接觸/非接觸、以及噴嘴29及冷卻部32的接觸/非接觸進行切換。利用所述移動機構20進行的接觸/非接觸的切換由控制部22控制。The switching mechanism 34 of this embodiment includes a moving mechanism 20. The moving mechanism 20 moves the dispenser 19 in the X direction and the Y direction, thereby switching the contact/non-contact between the nozzle 29 and the heating unit 31 and the contact/non-contact between the nozzle 29 and the cooling unit 32. The contact/non-contact switching performed by the moving mechanism 20 is controlled by the control unit 22.

溫度感測器33例如為紅外線感測器等非接觸感測器。所述溫度感測器33在供給模組4中設置於可對與加熱部31及冷卻部32接觸的噴嘴29的溫度進行檢測的位置（參照圖3（1）、圖3（2）及圖4（1）、圖4（2））。在本實施方式中，從側方對處於接觸狀態的噴嘴29進行溫度檢測，但也可從上方或下方進行溫度檢測。而且，在圖1等中構成為利用一個溫度感測器33來檢測加熱溫度及冷卻溫度這兩者，但也可在加熱部31及冷卻部32中分別設置各一個溫度感測器33。所述溫度感測器33的檢測信號被發送至控制部22，並利用移動機構20來控制切換動作。The temperature sensor 33 is, for example, a non-contact sensor such as an infrared sensor. The temperature sensor 33 is provided in the supply module 4 at a position capable of detecting the temperature of the nozzle 29 in contact with the heating part 31 and the cooling part 32 (refer to FIGS. 3(1), 3(2) and 4 (1), Figure 4 (2)). In the present embodiment, the temperature of the nozzle 29 in the contact state is detected from the side, but the temperature may be detected from above or below. In addition, in FIG. 1 and the like, it is configured to use one temperature sensor 33 to detect both the heating temperature and the cooling temperature, but one temperature sensor 33 may be provided in each of the heating unit 31 and the cooling unit 32. The detection signal of the temperature sensor 33 is sent to the control unit 22, and the movement mechanism 20 is used to control the switching operation.

接著，對液狀樹脂的的噴出前後的分配器19的動作簡單進行說明。Next, the operation of the dispenser 19 before and after the discharge of the liquid resin will be briefly described.

將液狀樹脂30噴出至作為噴出對象部的下模具14之前的分配器19在供給模組4處待機。此時，控制部22對移動機構20進行控制，使噴嘴29的前端面29a接觸加熱塊311的接觸加熱面311a（參照圖3（1）、圖3（2））。當進行所述噴嘴加熱時，使用溫度感測器33來檢測噴嘴溫度，並進行加熱至噴嘴溫度成為規定的設定加熱溫度（例如25℃～40℃）為止。在超過設定加熱溫度的情況下，控制部22對移動機構20進行控制，使噴嘴29與冷卻塊321接觸以進行冷卻，從而也可成為設定加熱溫度。也可僅通過使噴嘴29與加熱塊311分離而成為設定加熱溫度。The dispenser 19 before ejecting the liquid resin 30 to the lower mold 14 as the ejection target portion waits at the supply module 4. At this time, the control unit 22 controls the moving mechanism 20 so that the tip surface 29a of the nozzle 29 contacts the contact heating surface 311a of the heating block 311 (see FIGS. 3(1) and 3(2)). When the nozzle heating is performed, the temperature sensor 33 is used to detect the nozzle temperature, and heating is performed until the nozzle temperature reaches a predetermined set heating temperature (for example, 25° C. to 40° C.). When the set heating temperature is exceeded, the control unit 22 controls the moving mechanism 20 so that the nozzle 29 is brought into contact with the cooling block 321 for cooling, so that the set heating temperature may be reached. It is also possible to set the heating temperature only by separating the nozzle 29 from the heating block 311.

在如此般對噴嘴29進行加熱後，控制部22對移動機構20進行控制，使分配器19移動至成形模組3A～成形模組3D，從噴嘴29噴出液狀樹脂30而對下模具14供給液狀樹脂30。After the nozzle 29 is heated in this way, the control unit 22 controls the moving mechanism 20 to move the distributor 19 to the molding module 3A to the molding module 3D, and ejects the liquid resin 30 from the nozzle 29 to supply the lower mold 14. Liquid resin 30.

在供給液狀樹脂後，控制部22對移動機構20進行控制，使分配器19返回至供給模組4。此時，控制部22對移動機構20進行控制，使噴嘴29的前端面29a接觸冷卻塊321的接觸冷卻面321a（參照圖4（1）、圖4（2））。當進行所述噴嘴冷卻時，使用溫度感測器33來檢測噴嘴溫度，並進行冷卻至噴嘴溫度成為規定的設定冷卻溫度（例如小於20℃）為止。並且，在成為設定冷卻溫度以下的情況下，控制部22對移動機構20進行控制，使噴嘴29與冷卻塊321分離。而且，也可維持使噴嘴29與冷卻塊321接觸的狀態直至伴隨下一次液狀樹脂30的供給的加熱動作。After the liquid resin is supplied, the control unit 22 controls the moving mechanism 20 to return the dispenser 19 to the supply module 4. At this time, the control unit 22 controls the moving mechanism 20 so that the tip surface 29a of the nozzle 29 contacts the contact cooling surface 321a of the cooling block 321 (refer to FIGS. 4(1) and 4(2)). When performing the nozzle cooling, the temperature sensor 33 is used to detect the nozzle temperature, and cooling is performed until the nozzle temperature reaches a predetermined set cooling temperature (for example, less than 20° C.). In addition, when the temperature becomes equal to or lower than the set cooling temperature, the control unit 22 controls the moving mechanism 20 to separate the nozzle 29 from the cooling block 321. Furthermore, the state in which the nozzle 29 is brought into contact with the cooling block 321 may be maintained until the heating operation accompanying the supply of the liquid resin 30 next time.

＜本實施方式的效果＞ 根據本實施方式的樹脂成形裝置1，因對噴嘴29及加熱部31彼此接觸的接觸狀態與噴嘴29及加熱部31彼此分離的分離狀態進行切換，所以無需在噴嘴29中設置加熱部31。結果，可不使噴嘴29的結構複雜化而在噴嘴29中對液狀樹脂30進行加熱。因噴嘴29的結構不被複雜化，所以也不會使噴嘴更換的作業性變差。而且，液狀樹脂30受到加熱而液狀樹脂30的黏度變低，容易從噴嘴29噴出，可使噴出量的精度提高，從而可儘早解除噴出後的拉絲狀態。<Effects of this embodiment> According to the resin molding apparatus 1 of the present embodiment, the contact state in which the nozzle 29 and the heating portion 31 are in contact with each other and the separation state in which the nozzle 29 and the heating portion 31 are separated from each other are switched, so there is no need to provide the heating portion 31 in the nozzle 29. As a result, the liquid resin 30 can be heated in the nozzle 29 without complicating the structure of the nozzle 29. Since the structure of the nozzle 29 is not complicated, the workability of nozzle replacement does not deteriorate. In addition, the liquid resin 30 is heated to lower the viscosity of the liquid resin 30 and is easily ejected from the nozzle 29. The accuracy of the ejection amount can be improved, and the wire drawing state after ejection can be released as soon as possible.

而且，在本實施形態中，因對噴嘴29及冷卻部32彼此接觸的接觸狀態與噴嘴29及冷卻部32彼此分離的分離狀態進行切換，所以無需在噴嘴29中設置冷卻部32。結果，可不使噴嘴29的結構複雜化而積極地使噴嘴29冷卻，可降低對液狀樹脂30的不良影響（例如不必要的熱硬化）。通過使噴嘴29冷卻可提高液狀樹脂30的黏度，從而可防止在供給模組4中的待機狀態下液狀樹脂30從噴嘴29滴落。Furthermore, in this embodiment, since the contact state in which the nozzle 29 and the cooling portion 32 are in contact with each other and the separation state in which the nozzle 29 and the cooling portion 32 are separated from each other are switched, there is no need to provide the cooling portion 32 in the nozzle 29. As a result, the nozzle 29 can be actively cooled without complicating the structure of the nozzle 29, and adverse effects on the liquid resin 30 (for example, unnecessary thermal curing) can be reduced. By cooling the nozzle 29, the viscosity of the liquid resin 30 can be increased, and the liquid resin 30 can be prevented from dripping from the nozzle 29 in the standby state in the supply module 4.

進而，在本實施方式中，將加熱部31設置於供給模組4中，因此可對噴出前的待機狀態下的噴嘴29進行加熱。結果，可在噴出液狀樹脂30之前將噴嘴29充分加熱。此外，將冷卻部32設置於供給模組4中，因此可對噴出後的待機狀態下的噴嘴29進行冷卻。結果，可在噴出液狀樹脂30後充分將噴嘴29冷卻，從而可提高液狀樹脂30的黏度，使液狀樹脂30不易從噴嘴29滴落。Furthermore, in this embodiment, since the heating unit 31 is provided in the supply module 4, the nozzle 29 in the standby state before ejection can be heated. As a result, the nozzle 29 can be sufficiently heated before the liquid resin 30 is discharged. In addition, since the cooling unit 32 is provided in the supply module 4, the nozzle 29 in the standby state after ejection can be cooled. As a result, the nozzle 29 can be sufficiently cooled after the liquid resin 30 is ejected, so that the viscosity of the liquid resin 30 can be increased, and the liquid resin 30 cannot easily drip from the nozzle 29.

＜其他實施方式＞ 在所述實施方式中，將加熱部31設置於供給模組4中，但也可如圖5所示般設置於成型模組3A～成形模組3D中。在圖5中，構成為包括四個成形模組3A～成形模組3D，且示出了在各成形模組3A～成形模組3D中設置有加熱部31的例子。在具有多個成形模組3A～成形模組3D的構成的情況下，可構成為在所述成形模組3A～成形模組3D的至少一者中設置加熱部31。在這些情況下，例如在成形模組3A～成形模組3D中使加熱部31或分配器19的至少一者移動以對接觸/非接觸進行切換。<Other embodiments> In the above embodiment, the heating unit 31 is provided in the supply module 4, but it may also be provided in the molding module 3A to the molding module 3D as shown in FIG. 5. In FIG. 5, it is configured to include four molding modules 3A to 3D, and an example in which the heating unit 31 is provided in each of the molding modules 3A to 3D is shown. In the case of a configuration having a plurality of molding modules 3A to 3D, it may be configured to provide a heating unit 31 in at least one of the molding modules 3A to 3D. In these cases, for example, in the molding module 3A to the molding module 3D, at least one of the heating unit 31 or the distributor 19 is moved to switch between contact and non-contact.

在所述實施方式中，構成為加熱塊311的接觸加熱面311a及冷卻塊321的接觸冷卻面321a與噴嘴29的前端面29a接觸，但也可為噴嘴29的例如上表面或側面等其他外表面。In the above-mentioned embodiment, the heating block 311 contact heating surface 311a and the cooling block 321 contact cooling surface 321a are in contact with the tip surface 29a of the nozzle 29, but it may also be the upper surface or side surface of the nozzle 29. surface.

在所述實施方式中，構成為通過分配器19移動而與加熱部31及冷卻部32接觸的構成，但也可設置使加熱部31及冷卻部32移動以對接觸/非接觸進行切換的切換機構34。在所述情況下，例如相對於在供給模組4中處於待機狀態的分配器19而使加熱部31及冷卻部32移動來進行接觸。In the above-mentioned embodiment, the configuration is configured to be in contact with the heating portion 31 and the cooling portion 32 by the movement of the distributor 19, but a switch that allows the heating portion 31 and the cooling portion 32 to move to switch between contact and non-contact may be provided. Agency 34. In this case, for example, the heating unit 31 and the cooling unit 32 are moved and brought into contact with the distributor 19 in the standby state in the supply module 4.

在所述實施方式中，使用溫度感測器33的檢測溫度對接觸/非接觸進行切換，但也可不使用溫度感測器33的檢測溫度而利用接觸時間來對接觸/非接觸進行切換（進行時序控制）。In the above embodiment, the detection temperature of the temperature sensor 33 is used to switch between contact and non-contact, but the detection temperature of the temperature sensor 33 may not be used and the contact time may be used to switch between contact and non-contact (perform Timing control).

而且，也可構成為將加熱部31設置於分配器19中。即，加熱部31也與分配器19一體地移動。在所述情況下，加熱部31經由切換機構34而設置於分配器19中。如圖6（1）、圖6（2）所示，所述切換機構34具有：支撐構件35，對加熱部31進行支撐，並且設置為可在加熱部31與噴嘴29接觸的接觸位置P和加熱部31與噴嘴29分離的分離位置Q之間旋轉；以及致動器（未圖示），使所述支撐構件35旋轉。在圖6（1）、圖6（2）中，構成為在噴嘴29的左右兩側設置加熱部31而與噴嘴29的左右側面接觸，但也可構成為與噴嘴29的上表面接觸。另外，也可不設置致動器而例如構成為與分配器19的移動連動地，支撐構件35通過接觸外部的構件而進行旋轉。關於冷卻部32，也可與加熱部31同樣地構成為設置於分配器19中。Furthermore, the heating unit 31 may be provided in the distributor 19. That is, the heating unit 31 also moves integrally with the dispenser 19. In this case, the heating part 31 is provided in the dispenser 19 via the switching mechanism 34. As shown in Figures 6(1) and 6(2), the switching mechanism 34 has: a support member 35 for supporting the heating part 31, and is set to be able to contact the heating part 31 and the nozzle 29 at the contact position P and The heating part 31 rotates between the separation position Q where the nozzle 29 is separated; and an actuator (not shown) rotates the support member 35. In FIGS. 6( 1) and 6 (2 ), the heating unit 31 is provided on the left and right sides of the nozzle 29 to be in contact with the left and right side surfaces of the nozzle 29, but it may be configured to be in contact with the upper surface of the nozzle 29. In addition, an actuator may not be provided, and for example, the support member 35 may be configured to rotate by contacting an external member in conjunction with the movement of the dispenser 19. The cooling unit 32 may be configured to be provided in the distributor 19 in the same manner as the heating unit 31.

進而，也可如圖7（1）、圖7（2）所示，在噴嘴29的外表面設置保溫構件36。所述保溫構件36具有比噴嘴29的熱容量大的熱容量。在圖7（1）、圖7（2）中示出了以覆蓋噴嘴29的左右側面及上表面的方式設置有保溫構件36的例子，但並不限定於此，只要覆蓋噴嘴29的外表面的至少一部分即可。而且，保溫構件36構成為相對於噴嘴29而可拆裝。在圖7（1）、圖7（2）中示出了嵌入式的保溫構件36。通過如此般設置保溫構件36，可抑制經加熱的噴嘴29的溫度降低。而且，可抑制因液狀樹脂30通過噴嘴29中而造成的噴嘴29的溫度降低。進而，通過以可拆裝的方式構成保溫構件36，不會使噴嘴更換的作業性變差。Furthermore, as shown in FIGS. 7( 1) and 7 (2 ), a heat insulating member 36 may be provided on the outer surface of the nozzle 29. The heat insulating member 36 has a heat capacity larger than that of the nozzle 29. 7(1) and 7(2) show an example in which the thermal insulation member 36 is provided so as to cover the left and right sides and upper surface of the nozzle 29, but it is not limited to this, as long as the outer surface of the nozzle 29 is covered At least part of it. In addition, the heat insulating member 36 is configured to be detachable from the nozzle 29. The embedded thermal insulation member 36 is shown in FIG. 7 (1) and FIG. 7 (2). By providing the heat insulating member 36 in this way, it is possible to suppress a decrease in the temperature of the heated nozzle 29. Furthermore, the temperature drop of the nozzle 29 due to the liquid resin 30 passing through the nozzle 29 can be suppressed. Furthermore, by configuring the heat-retaining member 36 in a removable manner, the workability of nozzle replacement does not deteriorate.

在所述實施方式中，加熱塊311及冷卻塊321的一個平面與噴嘴的一個平面接觸，但也可如圖8（1）、圖8（2）所示，例如在加熱塊311及冷卻塊321中形成凹部M，且構成為在該凹部M的內表面中使噴嘴29與接觸加熱面311a及接觸冷卻面321a接觸。另外，也可在噴嘴29中形成凹部M。即，也可構成為加熱塊311及冷卻塊321與噴嘴29以多個面接觸。若如此，則可增大熱交換面積，從而可有效率地進行噴嘴29的溫度調節。In the described embodiment, one plane of the heating block 311 and the cooling block 321 is in contact with one plane of the nozzle, but it can also be shown in Figure 8 (1) and Figure 8 (2), for example, in the heating block 311 and the cooling block A recess M is formed in 321, and the nozzle 29 is configured to contact the heating contact surface 311a and the contact cooling surface 321a in the inner surface of the recess M. In addition, the recess M may be formed in the nozzle 29. In other words, the heating block 311 and the cooling block 321 and the nozzle 29 may be in contact with multiple surfaces. If so, the heat exchange area can be increased, and the temperature of the nozzle 29 can be adjusted efficiently.

此外，也可對噴嘴29的表面的至少一部分實施黑化處理。此處，黑化處理是為了使噴嘴29的表面容易吸收紅外線而使所述表面黑色化的處理，例如可使用黑色鉻鍍敷、黑色鋅鍍敷、低溫黑色鉻酸處理、黑色非電解鎳鍍敷、發黑、黑色耐酸鋁（Alumite）處理、鋅鍍敷後的黑色鉻酸鹽處理、離子鍍（ion plating）等。所述黑化處理根據噴嘴29的材質（例如，鐵、不銹鋼、銅、鋁等）來適當選擇。In addition, at least a part of the surface of the nozzle 29 may be blackened. Here, the blackening treatment is a treatment for making the surface of the nozzle 29 easy to absorb infrared rays and blackening the surface. For example, black chrome plating, black zinc plating, low temperature black chromic acid treatment, black electroless nickel plating can be used. Coating, blackening, black alumite treatment, black chromate treatment after zinc plating, ion plating, etc. The blackening treatment is appropriately selected according to the material of the nozzle 29 (for example, iron, stainless steel, copper, aluminum, etc.).

在所述實施方式的樹脂成形裝置1中，在將脫模膜固定於成形模具之後對所述成形模具供給液狀樹脂30，從而噴出對象物為成形模具14，但當在將脫模膜17固定於成形模具14之前對脫模膜17供給液狀樹脂30的情況下，噴出對象物變為脫模膜17。In the resin molding apparatus 1 of the above embodiment, after the release film is fixed to the molding die, the liquid resin 30 is supplied to the molding die, so that the ejection target is the molding die 14, but when the release film 17 is When the liquid resin 30 is supplied to the release film 17 before being fixed to the mold 14, the ejection target becomes the release film 17.

此外，本發明並不限於所述實施方式，當然可在不脫離其主旨的範圍內進行各種變形。In addition, the present invention is not limited to the above-described embodiments, and of course various modifications can be made without departing from the spirit thereof.

1‧‧‧樹脂成形裝置 2‧‧‧基板供給･收納模組 3A、3B、3C、3D‧‧‧成形模組 4‧‧‧供給模組 5‧‧‧密封前基板 6‧‧‧密封前基板供給部 7‧‧‧密封後基板（樹脂成形品） 8‧‧‧密封後基板收納部 9‧‧‧裝載機 10‧‧‧卸載機 11‧‧‧軌道 12、13、20‧‧‧移動機構 14‧‧‧下模具（成形模具） 15‧‧‧合模機構 16‧‧‧腔室 17‧‧‧脫模膜 18‧‧‧樹脂供給機構 19‧‧‧分配器 21‧‧‧抽真空機構 22‧‧‧控制部 23‧‧‧上模具（成形模具） 24‧‧‧膜按壓構件 25‧‧‧LED晶片 26‧‧‧獨立腔室 27‧‧‧送出機構 28‧‧‧注射器 29‧‧‧噴嘴（噴出部） 29a‧‧‧前端面 30‧‧‧液狀樹脂 31‧‧‧加熱部 311‧‧‧加熱塊/塊體 311a‧‧‧接觸加熱面 32‧‧‧冷卻部 321‧‧‧冷卻塊/塊體 321a‧‧‧接觸冷卻面 33‧‧‧溫度感測器 34‧‧‧切換機構 35‧‧‧支撐構件 36‧‧‧保溫構件 M‧‧‧凹部 P‧‧‧接觸位置 Q‧‧‧分離位置 X、Y、Z‧‧‧方向1‧‧‧Resin molding device 2‧‧‧Board supply and storage module 3A, 3B, 3C, 3D‧‧‧forming module 4‧‧‧Supply Module 5‧‧‧Seal the front substrate 6‧‧‧Substrate supply part before sealing 7‧‧‧Substrate after sealing (resin molded product) 8‧‧‧Substrate storage part after sealing 9‧‧‧Loader 10‧‧‧Unloader 11‧‧‧Orbit 12, 13, 20‧‧‧Mobile mechanism 14‧‧‧Lower mold (forming mold) 15‧‧‧Clamping mechanism 16‧‧‧ Chamber 17‧‧‧Release film 18‧‧‧Resin Supply Mechanism 19‧‧‧Distributor 21‧‧‧Vacuum mechanism 22‧‧‧Control Department 23‧‧‧Upper mold (forming mold) 24‧‧‧Membrane pressing member 25‧‧‧LED chip 26‧‧‧Independent chamber 27‧‧‧Sending organization 28‧‧‧Syringe 29‧‧‧Nozzle (spout part) 29a‧‧‧Front face 30‧‧‧Liquid resin 31‧‧‧Heating section 311‧‧‧Heating block/block 311a‧‧‧Contact heating surface 32‧‧‧Cooling Department 321‧‧‧Cooling block/block 321a‧‧‧Contact cooling surface 33‧‧‧Temperature sensor 34‧‧‧Switching mechanism 35‧‧‧Supporting member 36‧‧‧Insulation components M‧‧‧Recess P‧‧‧Contact position Q‧‧‧Separation position X, Y, Z‧‧‧direction

圖1是示意性表示本實施方式的樹脂成形裝置的構成的圖。 圖2（1）、圖2（2）是表示本實施方式的樹脂供給機構的概略圖，圖2（1）是表示樹脂供給機構將液狀樹脂供給至下模具的腔室的狀態的概略圖，圖2（2）是表示樹脂供給機構的概略平面圖。 圖3（1）、圖3（2）是表示噴嘴加熱時的狀態（接觸狀態）的概略圖，圖3（1）是主要部分平面圖，圖3（2）是主要部分側面圖。 圖4（1）、圖4（2）是表示噴嘴冷卻時的狀態（接觸狀態）的概略圖，圖4（1）是主要部分平面圖，圖4（2）是主要部分側面圖。 圖5是示意性表示變形實施方式的樹脂成形裝置的構成的圖。 圖6（1）、圖6（2）是表示加熱部及切換機構的變形例的概略圖，圖6（1）是主要部分平面圖，圖6（2）是主要部分側面圖。 圖7（1）、圖7（2）是表示變形實施方式的主要部分的概略圖，圖7（1）是主要部分正面圖，圖7（2）是主要部分側面圖。 圖8（1）、圖8（2）是表示變形實施方式的加熱部的概略圖，圖8（1）是表示非接觸狀態的主要部分側面圖，圖8（2）是表示接觸狀態的主要部分側面圖。FIG. 1 is a diagram schematically showing the configuration of a resin molding apparatus according to this embodiment. 2(1) and 2(2) are schematic views showing the resin supply mechanism of this embodiment, and FIG. 2(1) is a schematic view showing the state in which the resin supply mechanism supplies liquid resin to the cavity of the lower mold , Figure 2 (2) is a schematic plan view showing the resin supply mechanism. 3(1) and 3(2) are schematic views showing the state (contact state) when the nozzle is heated, FIG. 3(1) is a plan view of the main part, and FIG. 3(2) is a side view of the main part. 4(1) and 4(2) are schematic views showing the state (contact state) of the nozzle when cooling, FIG. 4(1) is a plan view of the main part, and FIG. 4(2) is a side view of the main part. Fig. 5 is a diagram schematically showing the configuration of a resin molding apparatus according to a modified embodiment. 6(1) and 6(2) are schematic diagrams showing a modification of the heating unit and the switching mechanism. FIG. 6(1) is a plan view of the main part, and FIG. 6(2) is a side view of the main part. 7(1) and 7(2) are schematic views showing the main parts of the modified embodiment, FIG. 7(1) is a front view of the main parts, and FIG. 7(2) is a side view of the main parts. Figures 8(1) and 8(2) are schematic views showing the heating part of the modified embodiment, Figure 8(1) is a side view of the main part showing the non-contact state, and Figure 8(2) is the main part showing the contact state Partial side view.

5‧‧‧密封前基板 5‧‧‧Seal the front substrate

14‧‧‧下模具(成形模具) 14‧‧‧Lower mold (forming mold)

16‧‧‧腔室 16‧‧‧ Chamber

17‧‧‧脫模膜 17‧‧‧Release film

18‧‧‧樹脂供給機構 18‧‧‧Resin Supply Mechanism

19‧‧‧分配器 19‧‧‧Distributor

20‧‧‧移動機構 20‧‧‧Mobile Organization

23‧‧‧上模具(成形模具) 23‧‧‧Upper mold (forming mold)

24‧‧‧膜按壓構件 24‧‧‧Membrane pressing member

25‧‧‧LED晶片 25‧‧‧LED chip

26‧‧‧獨立腔室 26‧‧‧Independent chamber

27‧‧‧送出機構 27‧‧‧Sending organization

28‧‧‧注射器 28‧‧‧Syringe

29‧‧‧噴嘴(噴出部) 29‧‧‧Nozzle (spout part)

30‧‧‧液狀樹脂 30‧‧‧Liquid resin

X、Y、Z‧‧‧方向 X, Y, Z‧‧‧direction

Claims (10)

一種樹脂成形裝置，將具有熱硬化性的液狀樹脂供給至噴出對象物來進行樹脂成形，包括：噴嘴，將所述液狀樹脂噴出至所述噴出對象物；加熱部，與所述噴嘴接觸而對所述噴嘴進行加熱；以及切換機構，對所述噴嘴及所述加熱部彼此接觸的接觸狀態與所述噴嘴及所述加熱部彼此分離的分離狀態進行切換，所述加熱部是與所述噴嘴分開且被固定，所述切換機構通過使所述噴嘴相對於被固定的所述加熱部而移動，對所述接觸狀態與所述分離狀態進行切換。 A resin molding apparatus for supplying a thermosetting liquid resin to an ejection object to perform resin molding, including: a nozzle for ejecting the liquid resin to the ejection object; and a heating part in contact with the nozzle And heating the nozzle; and a switching mechanism for switching the contact state where the nozzle and the heating part are in contact with each other and the separation state where the nozzle and the heating part are separated from each other, and the heating part is in contact with each other. The nozzle is separated and fixed, and the switching mechanism switches the contact state and the separated state by moving the nozzle with respect to the fixed heating part. 如申請專利範圍第1項所述的樹脂成形裝置，包括：冷卻部，與所述噴嘴接觸而對所述噴嘴進行冷卻，所述冷卻部是與所述噴嘴分開且被固定，且所述切換機構通過使所述噴嘴相對於被固定的所述冷卻部而移動，對所述噴嘴及所述冷卻部彼此接觸的接觸狀態與所述噴嘴及所述冷卻部彼此分離的分離狀態進行切換。 The resin molding apparatus described in claim 1 includes a cooling portion that cools the nozzle in contact with the nozzle, the cooling portion is separated and fixed from the nozzle, and the switching The mechanism switches the contact state where the nozzle and the cooling section are in contact with each other and the separation state where the nozzle and the cooling section are separated from each other by moving the nozzle with respect to the fixed cooling section. 如申請專利範圍第1項所述的樹脂成形裝置，所述切換機構包含使所述噴嘴移動的移動機構。 In the resin molding apparatus described in claim 1, wherein the switching mechanism includes a moving mechanism that moves the nozzle. 如申請專利範圍第1項所述的樹脂成形裝置，包括：溫度感測器，對所述噴嘴的溫度進行檢測；以及控制部，基於所述溫度感測器的檢測溫度來對所述切換機構進行控制。 The resin molding apparatus described in the first item of the patent application includes: a temperature sensor that detects the temperature of the nozzle; and a control unit that controls the switching mechanism based on the temperature detected by the temperature sensor Take control. 如申請專利範圍第1項所述的樹脂成形裝置，包括：保溫構件，設置於所述噴嘴的外表面，且熱容量大於所述噴嘴。 The resin molding device described in the first item of the scope of patent application includes: a heat-preserving member arranged on the outer surface of the nozzle and having a larger heat capacity than the nozzle. 如申請專利範圍第1項所述的樹脂成形裝置，其中：對所述噴嘴的表面的至少一部分實施了黑化處理。 The resin molding apparatus according to the first item of the scope of patent application, wherein at least a part of the surface of the nozzle is blackened. 如申請專利範圍第1項至第6項中任一項所述的樹脂成形裝置，包括：分配器，具有所述噴嘴，且從所述噴嘴噴出所述液狀樹脂；以及供給模組，在所述分配器待機的同時對所述分配器供給所述液狀樹脂，且所述加熱部設置於所述供給模組中。 The resin molding apparatus according to any one of the claims 1 to 6 of the scope of patent application, including: a distributor having the nozzle and ejecting the liquid resin from the nozzle; and a supply module The dispenser is on standby while supplying the liquid resin to the dispenser, and the heating unit is provided in the supply module. 如申請專利範圍第1項至第6項中任一項所述的樹脂成形裝置，其中：所述噴出對象物為成形模具，所述樹脂成形裝置包括成形模組，所述成形模組具有所述成形模具及對所述成形模具進行合模的合模機構，所述加熱部設置於所述成形模組中。 The resin molding apparatus according to any one of claims 1 to 6, wherein: the ejected object is a molding die, and the resin molding apparatus includes a molding module, and the molding module has The forming mold and a mold clamping mechanism for clamping the forming mold, and the heating part is provided in the forming module. 一種樹脂成形品的製造方法，將具有熱硬化性的液狀樹脂從噴嘴噴出至噴出對象物，並使用所噴出的所述液狀樹脂進行樹脂成形來製造樹脂成形品，其中：移動所述噴嘴至與所述噴嘴分開且被固定的加熱部，使所述噴嘴與所述加熱部接觸以進行加熱後，對所述噴出對象物噴出所述液狀樹脂。 A method for manufacturing a resin molded product, in which a liquid resin having thermosetting properties is ejected from a nozzle to an object to be ejected, and the ejected liquid resin is used for resin molding to produce a resin molded product, wherein: the nozzle is moved To the heating part which is separated from the nozzle and fixed, the nozzle is brought into contact with the heating part for heating, and then the liquid resin is ejected to the ejection target. 如申請專利範圍第9項所述的樹脂成形品的製造方法，其中：在對所述噴出對象物噴出所述液狀樹脂後，移動所述噴嘴至與所述噴嘴分開且被固定的冷卻部，使所述噴嘴與所述冷卻部接觸以進行冷卻。 The method of manufacturing a resin molded product according to claim 9, wherein: after the liquid resin is sprayed to the spray target, the nozzle is moved to a cooling portion that is separated from the nozzle and fixed , The nozzle is brought into contact with the cooling part for cooling.
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