TWI694958B - Powder and granule supply device, resin molding device, powder and granule supply method, and method for manufacturing resin molded product - Google Patents

Powder and granule supply device, resin molding device, powder and granule supply method, and method for manufacturing resin molded product Download PDF

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TWI694958B
TWI694958B TW108112562A TW108112562A TWI694958B TW I694958 B TWI694958 B TW I694958B TW 108112562 A TW108112562 A TW 108112562A TW 108112562 A TW108112562 A TW 108112562A TW I694958 B TWI694958 B TW I694958B
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powder
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resin material
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TW201943611A (en
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法兼一貴
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

本發明提供一種粉粒體供給裝置，其通過使存在粉粒體的粉粒體供給路振動而使粉粒體移動並自設置於粉粒體供給路的噴出口對供給對象物供給粉粒體。本發明又提供一種樹脂成形裝置、粉粒體供給方法、及樹脂成形品的製造方法。粉粒體供給裝置包括：振動部，使粉粒體供給路振動；測量部，測量粉粒體對供給對象物的供給量；以及控制部，以供給量成為所指定的目標量的方式控制振動部的振動。控制部在供給開始後的第1階段中以連續地供給粉粒體的方式控制振動部，並且在第1階段之後的第2階段中以間歇地供給粉粒體的方式控制振動部。The present invention provides a powder and granular material supply device that supplies powder and granular material to an object to be supplied from an ejection port provided in the powder and granular material supply channel by vibrating the powder and granular material supply channel in which the powder and granular material exists. . The present invention also provides a resin molding apparatus, a powder and granular material supply method, and a method of manufacturing a resin molded product. The powder and granular material supply device includes: a vibrating portion that vibrates the powder and granular material supply path; a measuring portion that measures the supply amount of the powder and granular material to the supply target; and a control portion that controls the vibration so that the supply amount becomes the specified target amount Department of vibration. The control unit controls the vibrating unit to continuously supply the powder and granules in the first stage after the start of the supply, and controls the vibrating unit to intermittently supply the powder and granules in the second stage after the first stage.

Description

粉粒體供給裝置、樹脂成形裝置、粉粒體供給方法、及樹脂成形品的製造方法Powder and granule supply device, resin molding device, powder and granule supply method, and method for manufacturing resin molded product

本發明是有關於一種供給粉粒體的粉粒體供給裝置、使用所述粉粒體供給裝置的樹脂成形裝置、所述粉粒體供給裝置中的粉粒體供給方法、及使用所述粉粒體供給方法的樹脂成形品的製造方法。The present invention relates to a powder and granule supply device for supplying powder and granules, a resin molding apparatus using the powder and granule supply device, a powder and granule supply method in the powder and granule supply device, and use of the powder A method of manufacturing a resin molded product in the granular supply method.

為了保護積體電路（Integrated Circuit，IC）等電子零件免受光、熱、濕氣等環境的影響，電子零件通常由樹脂密封。再者，也將密封電子零件的樹脂部分（樹脂密封部）稱為「封裝（package）部」。In order to protect integrated circuits (Integrated Circuit, IC) and other electronic components from light, heat, moisture and other environmental influences, electronic components are usually sealed with resin. In addition, the resin portion (resin sealing portion) that seals the electronic component is also referred to as a “package portion”.

作為樹脂密封的典型的方法，有使用包含下模與上模的成形模的壓縮成形法。更具體而言，對下模的空腔（cavity）供給顆粒狀的樹脂材料並對上模裝配裝設有電子零件的基板，之後，對下模及上模進行加熱並使兩者合模，由此進行成形。As a typical method of resin sealing, there is a compression molding method using a molding die including a lower die and an upper die. More specifically, a granular resin material is supplied to the cavity of the lower mold, and the upper mold is mounted with a substrate on which electronic parts are mounted. Thereafter, the lower mold and the upper mold are heated and the two molds are closed. Thereby, forming is performed.

作為用於此種樹脂密封的供給樹脂材料的技術，例如，日本專利特開2013-042017號公報中揭示有一種包括樹脂供給部的樹脂成型（mold）裝置，所述樹脂供給部供給用於對自工件供給部取出的工件進行樹脂成型的樹脂。更具體而言，樹脂投入部52包括：料槽（trough）53，接受由料斗（hopper）51供給的顆粒樹脂；以及電磁給料器（electromagnetic feeder）54，使所述料槽53振動而將顆粒樹脂向工件W輸送。電磁給料器54形成為：使一對振動板在規定方向上振動並在料槽53內輸送顆粒樹脂。樹脂投入部52形成為：利用電磁給料器54使料槽53在規定方向上振動並輸送顆粒樹脂，且工件載置部55所具備的電子天平56在計量到比樹脂供給量少的規定重量時，停止電磁給料器54的驅動。此處，規定重量是將電磁給料器54停止後自料槽53落下至工件W的樹脂量估計在內來設定。由此，可在規定誤差範圍內計量由樹脂投入部52供給至工件W的顆粒樹脂的供給量並穩定地進行供給（參照日本專利特開2013-042017號公報的[0051]、[0052]、[0058]及圖8等）。As a technique for supplying a resin material for such a resin seal, for example, Japanese Patent Laid-Open No. 2013-042017 discloses a resin molding device including a resin supply section for supplying Resin for resin molding of the work taken out from the work supply part. More specifically, the resin input part 52 includes: a trough 53 that receives the granular resin supplied by the hopper 51; and an electromagnetic feeder 54 that vibrates the trough 53 to separate the particles The resin is conveyed to the workpiece W. The electromagnetic feeder 54 is formed such that it vibrates a pair of vibration plates in a predetermined direction and conveys granular resin in the tank 53. The resin input portion 52 is formed such that the electromagnetic feeder 54 vibrates the chute 53 in a predetermined direction and conveys the granular resin, and the electronic balance 56 included in the workpiece mounting portion 55 measures a predetermined weight less than the resin supply amount , The drive of the electromagnetic feeder 54 is stopped. Here, the predetermined weight is set by estimating the amount of resin falling from the chute 53 to the workpiece W after the electromagnetic feeder 54 is stopped. Thereby, the supply amount of the granular resin supplied to the workpiece W by the resin input section 52 can be measured within a predetermined error range and can be stably supplied (refer to [0051], [0052] of Japanese Patent Laid-Open No. 2013-042017, [0058] and FIG. 8 etc.).

另外，雖然並非面向用於對電子零件進行樹脂密封的技術的技術，但例如日本專利特開平11-160138號公報中揭示有一種用於以固定流量跨及長時間供給粉體的技術。更具體而言，揭示有一種在調整粉體搬送量（切削量）、或調整粉體流量時調整以共振頻率驅動的時間比例、即、使占空比（duty ratio）變化的構成。自驅動電路60對振子10間歇地施加驅動電壓、驅動電流（參照日本專利特開平11-160138號公報的[0029]、[0033]、[0034]等）。In addition, although it is not a technology for a technology for resin sealing an electronic component, for example, Japanese Patent Laid-Open No. 11-160138 discloses a technology for supplying powder at a fixed flow rate over a long period of time. More specifically, there is disclosed a configuration that adjusts the time ratio driven by the resonance frequency, that is, changes the duty ratio when adjusting the powder transport amount (cutting amount) or the powder flow rate. The self-driving circuit 60 intermittently applies a driving voltage and a driving current to the vibrator 10 (see Japanese Patent Laid-Open No. 11-160138 [0029], [0033], [0034], etc.).

為了提高成品中的電子零件的封裝效率，要求減低電子零件的封裝部（樹脂密封部）的厚度。對於此種要求，需要以更高的精度來控制樹脂材料對空腔的供給量。In order to improve the packaging efficiency of electronic parts in the finished product, it is required to reduce the thickness of the packaging part (resin sealing part) of the electronic parts. For such requirements, it is necessary to control the supply amount of the resin material to the cavity with higher accuracy.

所述日本專利特開2013-042017號公報中所揭示的樹脂成型裝置將電磁給料器54停止後落下的樹脂量估計在內而對電磁給料器54的停止時間點（timing）進行控制，難以提高供給量的控制精度。The resin molding apparatus disclosed in Japanese Patent Laid-Open No. 2013-042017 estimates the amount of resin that falls after the electromagnetic feeder 54 stops, and controls the timing of the electromagnetic feeder 54 to stop, which is difficult to improve Control accuracy of supply volume.

另外，日本專利特開平11-160138號公報面向用於以固定流量跨及長時間供給粉體的技術，在批次處理中，絲毫未設想對供給量進行控制。In addition, Japanese Patent Laid-Open No. 11-160138 is directed to a technology for supplying powder at a fixed flow rate over a long period of time, and in batch processing, it is not envisaged to control the supply amount.

粉粒體的供給量的高精度化不僅是為了減低電子零件的封裝部（樹脂密封部）的厚度，而且在其以外的許多領域中也要求如此。The high accuracy of the supply amount of powders and granules is not only for reducing the thickness of the packaging part (resin sealing part) of the electronic parts, but also required in many fields other than this.

本發明以解決此種課題為目的，且提供一種可以更高的精度控制顆粒狀的樹脂材料等粉粒體的供給量的裝置及方法。The present invention aims to solve such a problem, and provides an apparatus and method that can control the supply amount of powder and granular materials such as granular resin materials with higher accuracy.

根據本發明的一方面而提供一種粉粒體供給裝置，其通過使存在粉粒體的粉粒體供給路振動而使粉粒體移動並自設置於粉粒體供給路的噴出口對供給對象物供給粉粒體。粉粒體供給裝置包括：振動部，使粉粒體供給路振動；測量部，測量粉粒體對供給對象物的供給量；以及控制部，以供給量成為所指定的目標量的方式控制振動部的振動。控制部在供給開始後的第1階段中以連續地供給粉粒體的方式控制振動部，並且在第1階段之後的第2階段中以間歇地供給粉粒體的方式控制振動部。According to an aspect of the present invention, there is provided a powder and granular material supply device which moves a powder and granular material by vibrating the powder and granular material supply path in which the powder and granular material are present, and supplies it to a supply object from a discharge port provided in the powder and granular material supply path Supplies powder and granules. The powder and granular material supply device includes: a vibrating portion that vibrates the powder and granular material supply path; a measuring portion that measures the supply amount of the powder and granular material to the supply target; and a control portion that controls the vibration so that the supply amount becomes the specified target amount Department of vibration. The control unit controls the vibrating unit to continuously supply the powder and granules in the first stage after the start of the supply, and controls the vibrating unit to intermittently supply the powder and granules in the second stage after the first stage.

根據本發明的另一方面的樹脂成形裝置包括：所述粉粒體供給裝置；以及壓縮成形部，使用由粉粒體供給裝置供給的粉粒體即顆粒狀的樹脂材料進行壓縮成形。A resin molding apparatus according to another aspect of the present invention includes: the powder and granular material supply device; and a compression molding unit that performs compression molding using a granular resin material that is the powder and granular material supplied by the powder and granular material supply device.

根據本發明的又一方面而提供一種粉粒體供給方法，其通過使存在粉粒體的粉粒體供給路振動而使粉粒體移動並自設置於粉粒體供給路的噴出口對供給對象物供給所指定的目標量的粉粒體。粉粒體供給方法包括：在供給開始後的第1階段中，以連續地供給粉粒體的方式使與粉粒體供給路相關聯的振動部振動的步驟；以及在第1階段之後的第2階段中，以間歇地供給粉粒體的方式使振動部振動直至粉粒體對供給對象物的供給量到達目標量為止的步驟。According to still another aspect of the present invention, there is provided a method for supplying powders and granules, which vibrates a powder and granule supply path in which powders and granules are present, moves the powder and granules, and supplies the powder and granules from a discharge port provided in the powder and granule supply path The target object supplies the specified amount of powder and granules. The method of supplying powders and granules includes the steps of vibrating the vibrating portion associated with the supply path of powders and granules so that the powders and granules are continuously supplied in the first stage after the start of supply; and the first stage after the first stage In the 2nd stage, the step of vibrating the vibrating portion so as to intermittently supply powder and granules until the supply amount of the powder and granules to the supply target reaches the target amount.

根據本發明的又一方面的樹脂成形品的製造方法包括：所述粉粒體供給方法的步驟；以及使用所供給的粉粒體即顆粒狀的樹脂材料進行壓縮成形的步驟。A method of manufacturing a resin molded article according to still another aspect of the present invention includes: the step of the powder and granular material supply method; and the step of performing compression molding using the supplied powder or granular material, that is, a particulate resin material.

本發明的所述及其他目的、特徵、方面及優點可由與隨附的圖式關聯地理解的本發明相關的如下的詳細說明而明瞭。The above and other objects, features, aspects, and advantages of the present invention will be apparent from the following detailed description related to the present invention understood in association with the accompanying drawings.

關於本發明的實施形態，一邊參照圖式一邊進行詳細說明。再者，關於圖中的相同或相當部分，標註相同符號而不重複其說明。The embodiments of the present invention will be described in detail while referring to the drawings. In addition, about the same or corresponding parts in the figure, the same symbols are marked without repeating the description.

在本說明書中，「粉粒體」這一用語為包含具有任意粒徑的物體的集聚體的用語。「粉粒體」為包含「粉體」的概念，且作為集聚體而具有流體那樣的特性。即，在本說明書中，「粉粒體」這一用語包含接受到任意外力而產生移動或變形的集聚體。In this specification, the term "powder and granules" is a term that includes an aggregate of objects having an arbitrary particle size. "Powder" is a concept that includes "powder" and has fluid-like properties as an aggregate. That is, in this specification, the term "powder and granules" includes aggregates that move or deform by receiving any external force.

在以下的說明中，作為粉粒體的典型例，設想顆粒狀的樹脂材料，作為粉粒體供給裝置的典型例，設想僅以預先指定的重量供給顆粒狀的樹脂材料的樹脂材料供給裝置。其中，本發明的粉粒體供給裝置所供給的粉粒體並不限於顆粒狀的樹脂材料，可應用於任意材料或物質。In the following description, a granular resin material is assumed as a typical example of powder and granules, and a resin material supply apparatus that supplies granular resin materials only at a predetermined weight is assumed as a typical example of the powder and granule supply device. Among them, the powder and granules supplied by the powder and granule supplying device of the present invention are not limited to granular resin materials, and can be applied to any materials or substances.

＜A. 樹脂成形裝置1的整體構成例＞ 首先，對包含根據本實施形態的樹脂材料供給裝置10的樹脂成形裝置1的整體構成例進行說明。典型而言，根據本實施形態的樹脂成形裝置1是通過在配置有電子零件的基板的露出面將樹脂成形，而作為對電子零件進行樹脂密封的裝置來利用。樹脂成形裝置1也可作為電子零件的製造裝置的一部分來構成。<A. Example of overall configuration of resin molding apparatus 1> First, an overall configuration example of the resin molding apparatus 1 including the resin material supply apparatus 10 according to this embodiment will be described. Typically, the resin molding apparatus 1 according to the present embodiment is used as a device for resin-sealing an electronic component by molding the resin on the exposed surface of the substrate on which the electronic component is disposed. The resin molding apparatus 1 may be configured as a part of an electronic component manufacturing apparatus.

圖1是表示根據本實施形態的樹脂成形裝置1的整體構成的一例的示意圖。參照圖1，樹脂成形裝置1自外部接收成為樹脂成形的對象的基板S、及作為將樹脂成形的材料的顆粒狀的樹脂材料P，並且將成形有樹脂的基板S即樹脂成形品T向下一步驟供給。FIG. 1 is a schematic diagram showing an example of the overall configuration of a resin molding apparatus 1 according to this embodiment. Referring to FIG. 1, a resin molding apparatus 1 receives a substrate S that is a target for resin molding and a granular resin material P that is a resin molding material from the outside, and the resin molded product T that is a resin molded substrate S is downward One step supply.

更具體而言，樹脂成形裝置1包括：接收模組31、一個或多個成形模組32、以及交付模組33。樹脂成形裝置1進而包括以貫穿接收模組31、一個或多個成形模組32、以及交付模組33的方式配置的主搬送裝置36。主搬送裝置36搬送基板S、樹脂材料搬送部20、以及樹脂成形品T。More specifically, the resin molding apparatus 1 includes a receiving module 31, one or more molding modules 32, and a delivery module 33. The resin molding apparatus 1 further includes a main conveying device 36 arranged so as to penetrate the receiving module 31, one or more molding modules 32, and the delivery module 33. The main conveying device 36 conveys the substrate S, the resin material conveying section 20, and the resin molded product T.

在接收模組31、一個或多個成形模組32、以及交付模組33各者上設置有在與主搬送裝置36垂直的方向上延伸的副搬送裝置37。在主搬送裝置36與各副搬送裝置37的交點處，基板S、樹脂材料搬送部20、及樹脂成形品T可改變搬送方向。The receiving module 31, the one or more forming modules 32, and the delivery module 33 are each provided with a sub-transport device 37 that extends in a direction perpendicular to the main transport device 36. At the intersection of the main transfer device 36 and each sub-transfer device 37, the substrate S, the resin material transfer section 20, and the resin molded product T can change the transfer direction.

接收模組31自外部接收基板S及樹脂材料P並供給至成形模組32。接收模組31具有：基板接收部311，用於接收基板S；以及樹脂材料供給裝置10，用於自外部接收樹脂材料P，並且將所接收的樹脂材料P供給至樹脂材料搬送部20。The receiving module 31 receives the substrate S and the resin material P from the outside and supplies it to the molding module 32. The receiving module 31 has a substrate receiving portion 311 for receiving the substrate S, and a resin material supply device 10 for receiving the resin material P from the outside and supplying the received resin material P to the resin material conveying portion 20.

樹脂材料供給裝置10自噴出口121供給預先指定的重量的樹脂材料P。在以下的說明中，也將預先指定的重量稱為「目標量」。目標量是根據成為樹脂成形的對象的基板S的品種等由未圖示的管理裝置等指定。另外，在各供給動作中，也將供給至供給對象的樹脂材料P的重量稱為「供給量」。即，樹脂材料供給裝置10以供給量成為目標值的方式調整自噴出口121的樹脂材料P的噴出量。再者，所謂「供給量成為目標值」並非僅是指供給量與目標值嚴格地一致的情況，也可包含供給量相對於目標值而成為實質上無問題的程度的範圍內的情況。The resin material supply device 10 supplies the resin material P of a predetermined weight from the discharge port 121. In the following description, the weight specified in advance is also referred to as "target amount". The target amount is specified by a management device or the like (not shown) according to the type and the like of the substrate S to be molded by the resin. In addition, in each supply operation, the weight of the resin material P supplied to the supply target is also referred to as "supply amount". That is, the resin material supply device 10 adjusts the discharge amount of the resin material P from the discharge port 121 so that the supply amount becomes the target value. In addition, the "supply amount becomes the target value" does not only mean that the supply amount and the target value strictly match, but may also include the case where the supply amount becomes substantially problem-free with respect to the target value.

在樹脂材料搬送部20配置有在平坦面上具有與基板S的大小相應的凹部151的樹脂材料搬送托盤15。樹脂材料搬送托盤15為自樹脂材料供給裝置10供給樹脂材料P的供給對象物的一例。樹脂材料搬送部20以自樹脂材料供給裝置10的噴出口121落下的樹脂材料P均勻地鋪滿樹脂材料搬送托盤15的凹部151內的方式相對於樹脂材料供給裝置10的噴出口121進行相對移動。樹脂材料搬送部20在樹脂材料P對樹脂材料搬送托盤15的凹部151的裝填完成時，被向成形模組32搬送。The resin material conveying portion 20 is provided with a resin material conveying tray 15 having a concave portion 151 corresponding to the size of the substrate S on a flat surface. The resin material conveyance tray 15 is an example of a supply target that supplies the resin material P from the resin material supply device 10. The resin material conveying portion 20 moves relative to the ejection outlet 121 of the resin material supply apparatus 10 so that the resin material P dropped from the ejection outlet 121 of the resin material supply apparatus 10 evenly covers the concave portion 151 of the resin material conveying tray 15. . The resin material conveying portion 20 is conveyed to the molding module 32 when the resin material P is completely loaded into the concave portion 151 of the resin material conveying tray 15.

各成形模組32具有用於在基板S將樹脂成形的壓縮成形部30。壓縮成形部30使用由樹脂材料供給裝置10供給的粉粒體即顆粒狀的樹脂材料P進行壓縮成形。Each molding module 32 has a compression molding portion 30 for molding resin on the substrate S. The compression molding section 30 performs compression molding using the granular resin material P, which is a powder or granule supplied from the resin material supply device 10.

更具體而言，壓縮成形部30具有包含下模與上模的成形模。在壓縮成形部30的下模，由樹脂材料供給裝置10供給有樹脂材料P，在壓縮成形部30的上模，由基板搬送部（並未圖示）裝配有基板S。而且，壓縮成形部30通過對下模及上模進行加熱並使兩者合模而在基板S將樹脂成形。即，通過合模來製造樹脂成形品T。More specifically, the compression molding section 30 has a molding die including a lower die and an upper die. The resin material P is supplied to the lower mold of the compression molding unit 30 by the resin material supply device 10, and the substrate S is mounted to the upper mold of the compression molding unit 30 by a substrate conveying unit (not shown). Then, the compression molding unit 30 heats the lower mold and the upper mold and molds the two to mold the resin on the substrate S. That is, the resin molded product T is manufactured by mold clamping.

交付模組33保持由成形模組32製造的樹脂成形品T。更具體而言，交付模組33具有用於保持樹脂成形品T的樹脂成形品保持部331。樹脂成形品保持部331根據來自下一步驟的要求等而將保持的樹脂成形品T向下一步驟等提供。The delivery module 33 holds the resin molded product T manufactured by the molding module 32. More specifically, the delivery module 33 has a resin molded product holding portion 331 for holding the resin molded product T. The resin molded product holding portion 331 supplies the held resin molded product T to the next step or the like in accordance with a request from the next step or the like.

圖1中，例示了包含三個成形模組32的樹脂成形裝置1，但成形模組32的數量可根據樹脂成形裝置1所要求的性能等而任意決定。尤其是，根據本實施形態的樹脂成形裝置1針對每一功能而經模組化，因此，即便在組裝樹脂成形裝置1並開始製造樹脂成形品T後，也可任意增減成形模組32。In FIG. 1, a resin molding apparatus 1 including three molding modules 32 is illustrated. However, the number of molding modules 32 can be arbitrarily determined according to the performance required by the resin molding apparatus 1. In particular, since the resin molding apparatus 1 according to the present embodiment is modularized for each function, even after the resin molding apparatus 1 is assembled and the production of the resin molded product T is started, the molding module 32 can be arbitrarily increased or decreased.

＜B. 樹脂材料供給裝置10的構成例＞ 其次，對構成根據本實施形態的樹脂成形裝置1的樹脂材料供給裝置10的整體構成例進行說明。<B. Configuration example of resin material supply device 10> Next, an example of the overall configuration of the resin material supply device 10 constituting the resin molding device 1 according to this embodiment will be described.

圖2是表示構成根據本實施形態的樹脂成形裝置1的樹脂材料供給裝置10的整體構成的一例的示意圖。參照圖2，樹脂材料供給裝置10具有：儲料器（stocker）17，自外部接收粉粒體的樹脂材料P；斜料槽（trough chute）11，配置於儲料器17的下部；以及料槽12，與斜料槽11連通。FIG. 2 is a schematic diagram showing an example of the overall configuration of the resin material supply device 10 constituting the resin molding device 1 according to this embodiment. Referring to FIG. 2, the resin material supply device 10 includes: a stocker 17 that receives the resin material P of powder and granules from the outside; a trough chute 11 disposed at a lower portion of the stocker 17; The tank 12 communicates with the inclined feed tank 11.

儲料器17收容自外部供給的樹脂材料P。在儲料器17的下部設置有對斜料槽11供給樹脂材料P的孔即供給口171、以及使儲料器17振動的儲料器給料器（stocker feeder）172。依照來自控制部100的指令，儲料器給料器172振動，由此對儲料器17內的樹脂材料P給予振動，結果，儲料器17內的樹脂材料P的一部分通過供給口171而被供給至斜料槽11。The stocker 17 accommodates the resin material P supplied from the outside. In the lower part of the stocker 17, a supply port 171, which is a hole for supplying the resin material P to the inclined chute 11, and a stocker feeder 172 that vibrates the stocker 17 are provided. In accordance with an instruction from the control unit 100, the stocker feeder 172 vibrates, thereby giving vibration to the resin material P in the stocker 17, and as a result, a part of the resin material P in the stocker 17 passes through the supply port 171送至斜料槽11.

圖2中表示控制部100控制儲料器給料器172的振動的構成例，但也可使用與控制部100不同的控制部來實現儲料器給料器172的振動控制。FIG. 2 shows a configuration example in which the control unit 100 controls the vibration of the stocker feeder 172. However, a control unit different from the control unit 100 may be used to realize the vibration control of the stocker feeder 172.

料槽12相當於對作為粉粒體的典型例的顆粒狀的樹脂材料P進行供給的粉粒體供給路。料槽12的一端以與斜料槽11連通的方式與斜料槽11連接，在料槽12的另一端設置有噴出口121。通過噴出口121，樹脂材料P被供給至作為供給對象物的一例的樹脂材料搬送托盤15。在穩態下，在斜料槽11及料槽12的內部存在由儲料器17供給的樹脂材料P。The hopper 12 corresponds to a powder and granular material supply path that supplies a granular resin material P as a typical example of powder and granular materials. One end of the tank 12 is connected to the inclined tank 11 so as to communicate with the inclined tank 11, and the other end of the tank 12 is provided with a discharge port 121. The resin material P is supplied to the resin material transport tray 15 as an example of the supply target through the ejection port 121. In the steady state, the resin material P supplied from the accumulator 17 exists inside the inclined chute 11 and the chute 12.

樹脂材料供給裝置10具有使料槽12振動的振動部即料槽給料器13。再者，通過料槽給料器13的振動，除了料槽12以外，斜料槽11也可振動。在供給樹脂材料P時，在噴出口121的正下方，通過樹脂材料搬送部20而配置有樹脂材料搬送托盤15。The resin material supply device 10 includes a tank feeder 13 that is a vibrating portion that vibrates the tank 12. In addition, by vibrating the feeder 13 of the trough, in addition to the trough 12, the inclined trough 11 can also vibrate. When the resin material P is supplied, the resin material conveying tray 15 is arranged by the resin material conveying section 20 directly below the ejection port 121.

依照來自控制部100的指令，料槽給料器13振動，由此對料槽12內的樹脂材料P給予振動，結果，料槽12內的樹脂材料P通過噴出口121而被供給至樹脂材料搬送托盤15的凹部151。In accordance with an instruction from the control unit 100, the chute feeder 13 vibrates to vibrate the resin material P in the chute 12, and as a result, the resin material P in the chute 12 is supplied to the resin material transport through the ejection port 121 The recess 151 of the tray 15.

如此，在樹脂材料供給裝置10中，通過使存在顆粒狀的樹脂材料P（粉粒體）的料槽12（粉粒體供給路）振動，而使樹脂材料P移動，並自設置於料槽12的噴出口121將樹脂材料P供給至樹脂材料搬送托盤15（供給對象物）。In this manner, in the resin material supply device 10, by vibrating the tank 12 (powder and granule supply path) in which the granular resin material P (powder and granules) exists, the resin material P is moved and installed in the tank itself. The discharge port 121 of 12 supplies the resin material P to the resin material conveyance tray 15 (supply target).

在噴出口121的鉛垂下側且配置有樹脂材料搬送托盤15及樹脂材料搬送部20的位置的更下方配置有樹脂材料排出部16。樹脂材料排出部16在不對樹脂材料搬送托盤15供給樹脂材料P而是排出樹脂材料P的情況下，為接受樹脂材料P的容器。A resin material discharge portion 16 is arranged on the vertically downward side of the ejection port 121 and below the position where the resin material transfer tray 15 and the resin material transfer portion 20 are arranged. The resin material discharge unit 16 is a container that receives the resin material P when the resin material P is discharged without supplying the resin material P to the resin material conveying tray 15.

此處，對將樹脂材料P裝填至樹脂材料搬送托盤15時的動作進行說明。樹脂材料搬送部20將樹脂材料搬送托盤15配置於噴出口121與樹脂材料排出部16之間的位置。樹脂材料搬送部20可使樹脂材料搬送托盤15大致水平地移動以將樹脂材料搬送托盤15的任意位置配置於噴出口121的正下方。在裝填樹脂材料P後，樹脂材料搬送部20將樹脂材料搬送托盤15搬送至壓縮成形部30（參照圖1）的下模的上部。Here, the operation when the resin material P is loaded on the resin material transport tray 15 will be described. The resin material conveying section 20 arranges the resin material conveying tray 15 at a position between the discharge port 121 and the resin material discharging section 16. The resin material conveying section 20 can move the resin material conveying tray 15 substantially horizontally to arrange any position of the resin material conveying tray 15 directly under the ejection port 121. After the resin material P is loaded, the resin material conveying unit 20 conveys the resin material conveying tray 15 to the upper part of the lower mold of the compression molding unit 30 (see FIG. 1 ).

在不對樹脂材料搬送托盤15供給樹脂材料P而是排出樹脂材料P的情況下，樹脂材料搬送部20使樹脂材料搬送托盤15遠離噴出口121的正下方，由此將樹脂材料P排出至樹脂材料排出部16。When the resin material P is not supplied to the resin material conveying tray 15 but the resin material P is discharged, the resin material conveying unit 20 moves the resin material conveying tray 15 away from directly below the discharge port 121, thereby discharging the resin material P to the resin material排部16。 16 discharge section 16.

再者，並非將樹脂材料排出部16始終配置於噴出口121的正下方，而是在排出樹脂材料P的情況下，可使樹脂材料排出部16移動至噴出口121的正下方。In addition, the resin material discharge part 16 is not always arranged directly under the discharge port 121, but when the resin material P is discharged, the resin material discharge part 16 can be moved directly under the discharge port 121.

樹脂材料供給裝置10進而具有與斜料槽11及料槽12相關聯並用於測量樹脂材料P對供給對象物的供給量的測量部14。The resin material supply device 10 further includes a measuring section 14 associated with the inclined chute 11 and the chute 12 and measuring the supply amount of the resin material P to the supply target.

通過料槽給料器13振動，而料槽12內的樹脂材料P自噴出口121排出，因此只要不供給由儲料器17供給的樹脂材料P，則利用測量部14的測量值減少。根據來自料槽給料器13開始振動前的測量部14的測量值、與來自料槽給料器13完成振動後的測量部14的測量值的數差，可測量樹脂材料P的供給量。另外，來自測量部14的測量值的每單位時間的變化量相當於樹脂材料P的供給速度。The hopper feeder 13 vibrates and the resin material P in the hopper 12 is discharged from the ejection port 121. Therefore, unless the resin material P supplied from the hopper 17 is supplied, the measured value by the measuring section 14 decreases. The supply amount of the resin material P can be measured based on the number difference between the measurement value from the measurement unit 14 before the tank feeder 13 starts to vibrate and the measurement value from the measurement unit 14 after the tank feeder 13 completes the vibration. In addition, the amount of change per unit time of the measurement value from the measurement unit 14 corresponds to the supply speed of the resin material P.

控制部100基於來自測量部14的測量值並以樹脂材料P的供給量成為所指定的目標量的方式控制料槽給料器13。更具體而言，控制部100調整對料槽給料器13給予的指令值。The control unit 100 controls the tank feeder 13 so that the supply amount of the resin material P becomes the specified target amount based on the measurement value from the measurement unit 14. More specifically, the control unit 100 adjusts the command value given to the trough feeder 13.

再者，在圖2所示的樹脂材料供給裝置10中，使用計量斜料槽11及料槽12的重量的測量部14，但除了測量部14以外或者代替測量部14，也可配置計量樹脂材料搬送托盤15的重量的測量部。所述情況下，也可基於來自料槽給料器13開始振動前與完成振動後的測量部的測量值的數差來測量樹脂材料P的供給量。另外，也可基於每單位時間的變化量來算出樹脂材料P的供給速度。In addition, in the resin material supply device 10 shown in FIG. 2, the measuring part 14 for measuring the weight of the inclined chute 11 and the chute 12 is used, but in addition to the measuring part 14 or instead of the measuring part 14, a measuring resin may be arranged The measuring section of the weight of the material transfer tray 15. In this case, the supply amount of the resin material P may be measured based on the numerical difference between the measurement values from the measurement section before the start of the tank feeder 13 and after the completion of the vibration. In addition, the supply rate of the resin material P may be calculated based on the amount of change per unit time.

如此，在樹脂材料供給裝置10中，自儲料器17供給至斜料槽11的顆粒狀的樹脂材料P（粉粒體的典型例）通過作為粉粒體供給路的料槽12的振動而朝向設置於料槽12的一端的噴出口121移動。而且，樹脂材料P自噴出口121落下而被供給至供給對象物。樹脂材料P對供給對象物的供給量可通過如下方式來調整：基於利用測量部14的測量值來控制作為振動部的料槽給料器13的振動。In this manner, in the resin material supply device 10, the granular resin material P (typical example of powders and granules) supplied from the hopper 17 to the inclined chute 11 is vibrated by the vibration of the hopper 12 as the powder and granule supply path It moves toward the discharge port 121 provided at one end of the tank 12. Then, the resin material P falls from the ejection port 121 and is supplied to the supply target. The supply amount of the resin material P to the supply object can be adjusted by controlling the vibration of the tank feeder 13 as the vibration part based on the measurement value by the measurement part 14.

＜C. 控制部100的構成例＞ 其次，對構成樹脂材料供給裝置10的控制部100的構成例進行說明。<C. Configuration example of control unit 100> Next, a configuration example of the control unit 100 constituting the resin material supply device 10 will be described.

根據本實施形態的控制部100至少執行與利用樹脂材料供給裝置10供給樹脂材料P相關的控制。控制部100也可進而執行與樹脂材料搬送部20的搬送相關的控制。進而，也可由控制部100執行樹脂成形裝置1（參照圖1）的整體控制。所述情況下，與利用樹脂材料供給裝置10供給樹脂材料P相關的控制可作為控制部100所執行的控制的一部分來達成。The control unit 100 according to this embodiment executes at least control related to the supply of the resin material P by the resin material supply device 10. The control unit 100 may further execute control related to the transport of the resin material transport unit 20. Furthermore, the overall control of the resin molding apparatus 1 (see FIG. 1) may be executed by the control unit 100. In this case, the control related to the supply of the resin material P by the resin material supply device 10 can be achieved as part of the control performed by the control unit 100.

控制部100例如可使用可程式化邏輯控制器（Programmable Logic Controller，PLC）等控制裝置來達成，也可使用產業用個人計算機來達成。The control unit 100 may be implemented using a control device such as a programmable logic controller (PLC), or may be implemented using an industrial personal computer, for example.

圖3是表示構成根據本實施形態的樹脂材料供給裝置10的控制部100的硬體構成例的示意圖。圖3中，作為典型例而示出採用根據通用的架構（architecture）的產業用個人計算機的控制部100的構成例。控制部100中，通過分別執行通用操作系統（Operating System，OS）及實時（real time）OS而兼顧人機界面（Human-Machine Interface，HMI）功能及通信功能、與要求實時性的控制功能。FIG. 3 is a schematic diagram showing an example of the hardware configuration of the control unit 100 constituting the resin material supply device 10 according to this embodiment. FIG. 3 shows, as a typical example, a configuration example of a control unit 100 that uses an industrial personal computer based on a general architecture. The control unit 100 executes a general-purpose operating system (Operating System, OS) and a real-time (real time) OS, taking into account a Human-Machine Interface (HMI) function, a communication function, and a control function that requires real-time performance.

控制部100包括輸入部102、輸出部104、主記憶體106、光學驅動器108、處理器110、硬碟（Hard Disk Drive，HDD）120、網路界面112、測量部界面114、以及振動部界面116作為主要的部件（component）。這些部件以可經由內部總線118而彼此交換數據的方式連接。The control unit 100 includes an input unit 102, an output unit 104, a main memory 106, an optical drive 108, a processor 110, a Hard Disk Drive (HDD) 120, a network interface 112, a measurement unit interface 114, and a vibration unit interface 116 as the main component (component). These components are connected in such a manner that data can be exchanged with each other via the internal bus 118.

輸入部102為受理來自用戶的操作的部件，典型而言包含鍵盤、觸控面板、滑鼠、軌跡球（track ball）等。輸出部104為向外部輸出控制部100中的處理結果等的部件，典型而言包含顯示器、印表機、各種指示器（indicator）等。主記憶體106包含動態隨機存取記憶體（Dynamic Random Access Memory，DRAM）等，且保持處理器110中執行的程序的編碼或執行程序所需的各種工作數據（work data）。The input unit 102 is a component that accepts operations from the user, and typically includes a keyboard, a touch panel, a mouse, a track ball, and the like. The output unit 104 is a component that outputs the processing result of the control unit 100 to the outside, and typically includes a display, a printer, various indicators, and the like. The main memory 106 includes dynamic random access memory (Dynamic Random Access Memory, DRAM), etc., and holds the code of the program executed in the processor 110 or various work data required for executing the program.

處理器110為讀出HDD 120中所保存的程序並對所輸入的數據執行處理的處理主體。處理器110構成為可分別並聯地執行通用OS及在所述通用OS上進行動作的各種應用（application）、以及實時OS及在所述實時OS上進行動作的各種應用。作為一例，處理器110可由包含多個處理器的構成（所謂的「多重處理器（multiprocessor）」）、在單一的處理器內包含多個內核（core）的構成（所謂的「多核（multicore）」）、及具有多重處理器與多核兩者的特徵的構成的任一者來實現。The processor 110 is a processing subject that reads out the program stored in the HDD 120 and performs processing on the input data. The processor 110 is configured to be able to execute a general-purpose OS and various applications operating on the general-purpose OS in parallel, and a real-time OS and various applications operating on the real-time OS. As an example, the processor 110 may include a configuration including a plurality of processors (so-called "multiprocessor"), or a configuration including a plurality of cores in a single processor (so-called "multicore") "), and any one of the configurations with the characteristics of both a multi-processor and a multi-core.

HDD120為存儲部，典型而言，保存通用OS 122、實時OS 124、HMI程序126、以及控制程序128。HMI程序126在通用OS 122的執行環境下進行動作，主要實現和與用戶的交換相關的處理。控制程序128在實時OS 124的執行環境下進行動作，控制構成樹脂材料供給裝置10的各部件。The HDD 120 is a storage unit, and typically stores a general-purpose OS 122, a real-time OS 124, an HMI program 126, and a control program 128. The HMI program 126 operates in the execution environment of the general-purpose OS 122, and mainly implements processing related to user exchange. The control program 128 operates in the execution environment of the real-time OS 124, and controls each component constituting the resin material supply device 10.

控制部100中所執行的各種程序被保存於高密度只讀光碟（Digital Versatile Disc Read Only Memory，DVD-ROM）等記錄介質108A中並可進行流通。記錄介質108A的內容由光學驅動器108讀取並被安裝（install）於HDD 120。即，本發明的一方面包含用於實現控制部100的程序及保存所述程序的某些記錄介質。作為這些記錄介質，除了光學記錄介質以外，也可使用磁記錄介質、光磁記錄介質、半導體記錄介質等。Various programs executed in the control unit 100 are stored in a recording medium 108A such as a high-density read-only optical disc (Digital Versatile Disc Read Only Memory, DVD-ROM) and can be distributed. The content of the recording medium 108A is read by the optical drive 108 and installed on the HDD 120. That is, an aspect of the present invention includes a program for implementing the control unit 100 and some recording media storing the program. As these recording media, in addition to optical recording media, magnetic recording media, magneto-optical recording media, semiconductor recording media, and the like can also be used.

圖3中例示在HDD 120安裝有多種程序的形態，但也可將這些程序製成一個程序而一體化，進而，也可作為其他程序的一部分來組入。FIG. 3 illustrates an example in which a variety of programs are installed on the HDD 120, but these programs may be integrated into one program, and may be incorporated as part of other programs.

網路界面112在與外部裝置之間經由網路來交換數據。The network interface 112 exchanges data with external devices via a network.

安裝於HDD 120的程序可經由網路界面112而自伺服器（server）取得。即，實現根據本實施形態的控制部100的程序可利用任意方法來下載並安裝於HDD 120。The program installed on the HDD 120 can be obtained from a server through the network interface 112. That is, the program that realizes the control unit 100 according to this embodiment can be downloaded and installed on the HDD 120 by any method.

測量部界面114中輸入有來自測量部14的測量值。自振動部界面116向儲料器給料器172及料槽給料器13輸出指令值。The measurement value from the measurement unit 14 is input to the measurement unit interface 114. The command value is output from the vibration part interface 116 to the stocker feeder 172 and the trough feeder 13.

圖3中對通過處理器110執行程序而實現根據本實施形態的控制部100的構成例進行了說明，但並不限於此，可適宜採用與現實中達成根據本發明的粉粒體供給裝置或粉粒體供給方法的時代的技術水準相應的構成。例如，可代替通用的計算機而使用作為產業用的控制器的PLC（Programmable Logic Controller）。或者，可使用大規模積體電路（Large Scale Integrated Circuit，LSI）或專用積體電路（Application Specific Integrated Circuit，ASIC）等積體電路來達成控制部100所提供的功能的全部或一部分，也可使用電場可程式化邏輯閘陣列（Field-Programmable Gate Array，FPGA）等可再程式化的電路元件來達成。或者，進而也可通過多個處理主體彼此協作來實現圖3所示的控制部100所提供的功能。例如，可使多個計算機聯接來實現控制部100所提供的功能。FIG. 3 illustrates a configuration example in which the processor 110 executes a program to implement the control unit 100 according to the present embodiment, but it is not limited to this, and the powder and granular material supply device according to the present invention can be suitably used or The technical level of the era of the powder and granule supply method is structured accordingly. For example, PLC (Programmable Logic Controller) as an industrial controller can be used instead of a general-purpose computer. Alternatively, an integrated circuit such as a large scale integrated circuit (LSI) or an application specific integrated circuit (ASIC) may be used to achieve all or part of the functions provided by the control unit 100. This can be achieved by using reprogrammable circuit elements such as Field-Programmable Gate Array (FPGA). Alternatively, further, the functions provided by the control unit 100 shown in FIG. 3 may be realized by cooperation of a plurality of processing bodies with each other. For example, multiple computers can be connected to realize the functions provided by the control unit 100.

另外，圖3所示的構成要素並非全部為必需的，可適宜省略光學驅動器108、作為輸入部102的一例的滑鼠、作為輸出部104的一例的印表機等實際控制中不會使用的構成。In addition, not all of the constituent elements shown in FIG. 3 are necessary, and the optical driver 108, the mouse as an example of the input unit 102, and the printer as an example of the output unit 104 that are not used in actual control may be appropriately omitted. constitute.

＜D. 樹脂材料供給裝置10中的樹脂材料P的供給控制方法＞ 其次，對根據本實施形態的樹脂材料供給裝置10中的樹脂材料P的供給控制方法進行說明。<D. Supply control method of the resin material P in the resin material supply device 10> Next, the supply control method of the resin material P in the resin material supply device 10 according to this embodiment will be described.

（d1：概要） 樹脂材料供給裝置10在各供給動作中以供給所指定的目標量的樹脂材料P的方式執行供給控制。更具體而言，在根據本實施形態的供給控制方法中，控制部100在供給開始後的第1階段201中以連續地供給樹脂材料P的方式控制料槽給料器13，並且在第1階段201之後的第2階段202中以間歇地供給樹脂材料P的方式控制料槽給料器13。再者，第1階段201可設為剛開始供給之後。(D1: summary) The resin material supply device 10 performs supply control so as to supply the specified target amount of resin material P in each supply operation. More specifically, in the supply control method according to this embodiment, the control unit 100 controls the trough feeder 13 to continuously supply the resin material P in the first stage 201 after the start of the supply, and in the first stage In the second stage 202 after 201, the tank feeder 13 is controlled so that the resin material P is intermittently supplied. Furthermore, the first stage 201 can be set immediately after the start of supply.

圖4是用於說明根據本實施形態的樹脂材料供給裝置10中的樹脂材料P的供給控制方法的時間圖。FIG. 4 is a time chart for explaining the supply control method of the resin material P in the resin material supply device 10 according to this embodiment.

參照圖4，在第1階段201中，以樹脂材料P的供給速度（即，每單位時間的供給量）固定的方式控制對料槽給料器13給予的指令值的大小。根據指令值的大小，料槽給料器13產生的振動強度發生變化。指令值的大小可根據供給速度的目標值與供給速度的實測值的偏差來逐次算出。典型而言，指令值的大小可利用輸入供給速度的目標值與供給速度的實測值的反饋（feedback）控制來逐次算出。作為反饋控制的典型例，可使用比例積分微分（Proportional Integral Differential，PID）控制。Referring to FIG. 4, in the first stage 201, the magnitude of the command value given to the trough feeder 13 is controlled so that the supply speed of the resin material P (that is, the supply amount per unit time) is fixed. According to the magnitude of the command value, the vibration intensity generated by the trough feeder 13 changes. The magnitude of the command value can be calculated one by one according to the deviation of the target value of the supply speed from the actual value of the supply speed. Typically, the magnitude of the command value can be calculated one by one using feedback control that inputs the target value of the supply speed and the actual measured value of the supply speed. As a typical example of feedback control, Proportional Integral Differential (PID) control can be used.

第1階段201（時刻t1～時刻t2）在樹脂材料P的供給量的實績值到達比目標量少預先規定的量的結束判定值的時點結束。即，在第1階段201的結束時點，指令值更新為零。結束第1階段201的結束判定值根據料槽給料器13的振動停止後自樹脂材料供給裝置10的噴出口121噴出的樹脂材料P（即，振動停止後的流入）而被設定為樹脂材料P的供給量不會超過目標量的範圍。The first stage 201 (time t1 to time t2) ends when the actual value of the supply amount of the resin material P reaches the end judgment value that is less than the target amount by a predetermined amount. That is, at the end of the first stage 201, the command value is updated to zero. The end judgment value for ending the first stage 201 is set as the resin material P based on the resin material P ejected from the discharge port 121 of the resin material supply device 10 after the vibration of the chute feeder 13 stops (that is, the inflow after the vibration stops). The supply volume will not exceed the target volume.

再者，為了容易理解，而將圖4所示的指令值的波形描繪為大致直線狀。但是，例如在使用PID控制時等，實際的指令值的波形以如下方式變化：若供給速度下跌則上升，若供給速度上揚則下降。In addition, for easy understanding, the waveform of the command value shown in FIG. 4 is drawn substantially linearly. However, for example, when PID control is used, the actual command value waveform changes as follows: if the supply speed falls, it rises, and when the supply speed rises, it falls.

如此，在第1階段201中，因連續地使料槽給料器13振動，因此自樹脂材料供給裝置10的噴出口121連續地噴出樹脂材料P。In this manner, in the first stage 201, since the tank feeder 13 is continuously vibrated, the resin material P is continuously discharged from the discharge port 121 of the resin material supply device 10.

第2階段202（時刻t2～時刻t3）相當於以樹脂材料P的供給量成為目標量的方式間歇地噴出樹脂材料P的、供給量的調整期間。典型而言，對於料槽給料器13間歇地給予規定大小的指令值。即，控制部100在第2階段中對料槽給料器13給予脈衝狀的指令值。The second stage 202 (time t2 to time t3) corresponds to an adjustment period of the supply amount in which the resin material P is intermittently ejected so that the supply amount of the resin material P becomes the target amount. Typically, the tank feeder 13 is given a command value of a predetermined size intermittently. In other words, the control unit 100 gives the pulse feeder command value to the chute feeder 13 in the second stage.

此處，控制部100可基於在第1階段201中給予至料槽給料器13的指令值的大小（即，料槽給料器13產生的振動強度）來決定第2階段202中的指令值的大小。具體而言，可使第2階段202的指令值的大小與第1階段201即將結束前的指令值的大小大致一致。Here, the control unit 100 may determine the command value in the second stage 202 based on the magnitude of the command value given to the tank feeder 13 in the first stage 201 (that is, the vibration intensity generated by the tank feeder 13) size. Specifically, the size of the command value of the second stage 202 and the size of the command value immediately before the end of the first stage 201 can be made substantially the same.

另外，第2階段202中的指令值的大小只要適宜設為實際使用時無問題的程度的值即可。例如，相對於第1階段201即將結束前的指令值的大小，可將第2階段202的指令值的大小設為-50%～+10%，更具體而言，可設為自-50%、-45%、-40%、-35%、-30%、-25%、-20%、-15%、-10%、-9%、-8%、-7%、-6%、-5%、-4%、-3%、-2%、-1%、0%、+1%、+2%、+3%、+4%、+5%、+6%、+7%、+8%、+9%、+10%中選擇的兩個數值之間，也可設為自這些中選擇的至少一個數值。In addition, the size of the command value in the second stage 202 may be appropriately set to a value that does not cause a problem in actual use. For example, with respect to the size of the command value immediately before the end of the first stage 201, the size of the command value of the second stage 202 can be set from -50% to +10%, more specifically, from -50% , -45%, -40%, -35%, -30%, -25%, -20%, -15%, -10%, -9%, -8%, -7%, -6%,- 5%, -4%, -3%, -2%, -1%, 0%, +1%, +2%, +3%, +4%, +5%, +6%, +7%, Between two values selected from +8%, +9%, and +10%, at least one value selected from these can also be set.

通過在第1階段201與第2階段202之間維持指令值的大小的連續性，可維持作為粉粒體供給路的料槽12中殘留的樹脂材料P的分佈狀態，由此，即便在開始下次的樹脂材料P的供給時，也可連續地噴出樹脂材料P。By maintaining the continuity of the magnitude of the command value between the first stage 201 and the second stage 202, the distribution state of the resin material P remaining in the chute 12 as the powder and granular material supply path can be maintained. The next time the resin material P is supplied, the resin material P may be continuously discharged.

另外，也可將第2階段202分割為多個階段。在各分割的階段中，可使指令值的大小不同，也可使輸出指令值的期間的長度不同。In addition, the second stage 202 may be divided into a plurality of stages. In each division stage, the size of the command value may be different, and the length of the period during which the command value is output may be different.

以下，對第1階段201及第2階段202的更詳細的處理內容進行說明。Hereinafter, more detailed processing contents of the first stage 201 and the second stage 202 will be described.

（d2：第1階段201） 圖5是表示根據本實施形態的樹脂材料供給裝置10中的樹脂材料P的供給控制方法的第1階段201中的處理的一例的流程圖。典型而言，圖5所示的各步驟是通過控制部100的處理器110執行控制程序128來實現。(D2: Stage 1 201) 5 is a flowchart showing an example of processing in the first stage 201 of the supply control method of the resin material P in the resin material supply device 10 according to the present embodiment. Typically, each step shown in FIG. 5 is realized by the processor 110 of the control unit 100 executing the control program 128.

參照圖5，控制部100判斷是否接受到樹脂材料P的供給開始指令（步驟S1）。若未接受到樹脂材料P的供給開始指令（步驟S1中為否（NO）），則重複步驟S1的處理。若接受到樹脂材料P的供給開始指令（步驟S1中為是（YES）），則控制部100將來自測量部14的此刻的測量值設定為測量初期值（步驟S2）。步驟S2的處理相當於皮重去除處理。Referring to FIG. 5, control unit 100 determines whether a supply start instruction of resin material P has been received (step S1 ). If the supply start instruction of the resin material P is not received (NO in step S1), the process of step S1 is repeated. When the supply start instruction of the resin material P is received (YES in step S1), the control unit 100 sets the measured value from the measuring unit 14 at this moment as the initial measurement value (step S2). The processing in step S2 corresponds to the tare weight removal processing.

在執行步驟S2的處理後，開始對料槽給料器13輸出指令值。即，控制部100決定作為指令值的初期值的指令初期值（步驟S3），並跨及預先規定的初期動作時間輸出步驟S3中所決定的指令初期值作為指令值（步驟S4）。After the process of step S2 is performed, the output of the command value to the hopper feeder 13 is started. That is, the control unit 100 determines an initial command value as an initial value of the command value (step S3), and outputs the initial command value determined in step S3 as a command value over a predetermined initial operation time (step S4).

此種跨及初期動作時間而將指令值固定為指令初期值的操作的原因在於：使樹脂材料P的初期噴出的供給速度穩定化。在經過初期動作時間後，認為樹脂材料P的噴出穩定，因此繼而開始反饋控制。The reason for such an operation of fixing the command value to the command initial value across the initial operation time is to stabilize the supply speed of the initial discharge of the resin material P. After the initial operation time has elapsed, it is considered that the discharge of the resin material P is stable, so the feedback control is then started.

即，控制部100基於供給速度的目標值與供給速度的實測值來算出指令值（步驟S5），並將所輸出的指令值更新為步驟S5中所算出的指令值（步驟S6）。此處，供給速度的實測值是基於來自測量部14的測量值的時間變化來算出。That is, the control unit 100 calculates the command value based on the target value of the supply speed and the actual measured value of the supply speed (step S5), and updates the output command value to the command value calculated in step S5 (step S6). Here, the actual measurement value of the supply speed is calculated based on the time change of the measurement value from the measurement unit 14.

繼而，控制部100判斷樹脂材料P的供給量是否到達結束判定值（步驟S7）。若樹脂材料P的供給量未到達結束判定值（步驟S7中為否），則重複步驟S5以下的處理。Then, the control part 100 determines whether the supply amount of the resin material P has reached the end determination value (step S7). If the supply amount of the resin material P has not reached the end determination value (NO in step S7), the processing after step S5 is repeated.

相對於此，若樹脂材料P的供給量到達結束判定值（步驟S7中為是），則控制部100停止指令值的輸出（步驟S8）。即，控制部100將指令值更新為零。由此，第1階段201中的處理結束。In contrast, when the supply amount of the resin material P reaches the end determination value (YES in step S7), the control unit 100 stops the output of the command value (step S8). That is, the control unit 100 updates the command value to zero. Thus, the processing in the first stage 201 ends.

如此，在第1階段201中執行成為固定的供給速度（即，噴出速度）那樣的反饋控制，並連續地供給樹脂材料P。而且，在到達預先規定的結束判定值時，停止反饋控制。In this manner, in the first stage 201, feedback control such that the supply speed (ie, the discharge speed) becomes constant is executed, and the resin material P is continuously supplied. Then, when the predetermined end determination value is reached, the feedback control is stopped.

再者，根據料槽12及噴出口121的形狀及樹脂材料P的粒徑等，未必需要所述步驟S2～步驟S4的處理，在步驟S1完成時，可立即開始利用反饋控制的指令值的算出（步驟S5以下的處理）。In addition, depending on the shapes of the feed tank 12 and the ejection port 121 and the particle diameter of the resin material P, etc., the processes of steps S2 to S4 are not necessarily required. When step S1 is completed, the command value of the feedback control can be immediately started. Calculate (Processing after Step S5).

圖6是表示與根據本實施形態的樹脂材料供給裝置10中的樹脂材料P的供給控制方法的第1階段201中的處理相對應的功能構成的框圖。典型而言，圖6所示的各功能框是通過控制部100的處理器110執行控制程序128來實現。6 is a block diagram showing a functional configuration corresponding to the processing in the first stage 201 of the supply control method of the resin material P in the resin material supply device 10 according to this embodiment. Typically, each functional block shown in FIG. 6 is realized by the processor 110 of the control unit 100 executing the control program 128.

參照圖6，控制部100包括偏差算出部210、PID運算部212、選擇部214、選擇部216、指令值保持部218、計時器220、差分器222、微分器224、以及比較部226作為第1階段201的功能構成。6, the control unit 100 includes a deviation calculation unit 210, a PID calculation unit 212, a selection unit 214, a selection unit 216, a command value holding unit 218, a timer 220, a differentiator 222, a differentiator 224, and a comparison unit 226 as the first The functional structure of stage 1 201.

偏差算出部210及PID運算部212相當於用於實現反饋控制（相當於圖5所示的步驟S5及步驟S6）的功能構成。偏差算出部210算出供給速度的目標值與供給速度的實測值的偏差。PID運算部212接受來自偏差算出部210的供給速度的偏差的輸入，執行PID運算並算出指令值。The deviation calculation unit 210 and the PID calculation unit 212 correspond to a functional configuration for implementing feedback control (corresponding to step S5 and step S6 shown in FIG. 5 ). The deviation calculation unit 210 calculates the deviation between the target value of the supply speed and the actual value of the supply speed. The PID calculation unit 212 receives the input of the deviation of the supply speed from the deviation calculation unit 210, performs PID calculation, and calculates the command value.

差分器222相當於用於算出樹脂材料P的供給量的功能構成。即，差分器222根據給予有樹脂材料P的供給開始指令時的測量部14的測量值即測量初期值、與測量部14的現在的測量值的數差來算出現在的供給量。The differentiator 222 corresponds to a functional configuration for calculating the supply amount of the resin material P. That is, the differentiator 222 calculates the amount of supply present based on the numerical difference between the measurement initial value of the measurement unit 14 when the supply start instruction of the resin material P is given and the current measurement value of the measurement unit 14.

微分器224相當於用於算出樹脂材料P的供給速度的功能構成。更具體而言，微分器224算出來自差分器222的供給量的時間微分，並作為供給速度的實測值來輸出。The differentiator 224 corresponds to a functional configuration for calculating the supply speed of the resin material P. More specifically, the differentiator 224 calculates the time differential of the supply amount from the differentiator 222 and outputs it as the actual measured value of the supply speed.

選擇部216、指令值保持部218、及計時器220相當於用於實現跨及初期動作時間來輸出指令初期值的處理（相當於圖5所示的步驟S3及步驟S4）的功能構成。更具體而言，選擇部216依照來自計時器220的指令來輸出來自指令值保持部218的指令值、及來自PID運算部212（選擇部214）的指令值的一者作為最終的指令值。指令值保持部218在輸出有效的指令值的期間內，保持現在的指令值。因此，若停止指令值的輸出，則指令值保持部218中保持有即將停止前的指令值。如此保持於指令值保持部218中的指令值在開始下次的樹脂材料P的供給時，作為指令初期值來使用。計時器220在給予有樹脂材料P的供給開始指令時，在初期動作時間內向上計數（count up）。計時器220在經過初期動作時間之前的期間內，對選擇部216給予用於輸出來自指令值保持部218的指令值的選擇指令，另一方面，在經過初期動作時間時，對選擇部216給予用於輸出來自PID運算部212（選擇部214）的指令值的選擇指令。The selection unit 216, the command value holding unit 218, and the timer 220 correspond to a functional configuration for realizing a process of outputting the command initial value across the initial operation time (corresponding to step S3 and step S4 shown in FIG. 5). More specifically, the selection unit 216 outputs one of the command value from the command value holding unit 218 and the command value from the PID calculation unit 212 (selection unit 214) as the final command value in accordance with the command from the timer 220. The command value holding unit 218 holds the current command value while outputting a valid command value. Therefore, when the output of the command value is stopped, the command value holding unit 218 holds the command value immediately before the stop. The command value held in the command value holding unit 218 in this way is used as an initial command value when the next supply of the resin material P is started. The timer 220 counts up during the initial operation time when the supply start instruction of the resin material P is given. The timer 220 gives the selection unit 216 a selection command for outputting the command value from the command value holding unit 218 during the period before the initial operation time elapses, and on the other hand, gives the selection unit 216 when the initial operation time elapses A selection command for outputting the command value from the PID calculation unit 212 (selection unit 214).

選擇部214及比較部226相當於用於實現判斷第1階段201中的處理結束所需的處理（相當於圖5所示的步驟S7及步驟S8）的功能構成。更具體而言，選擇部214依照來自比較部226的指令來對是否輸出來自PID運算部212的指令值作為有效的指令值進行切換。比較部226對來自差分器222的樹脂材料P的供給量與結束判定值進行比較。比較部226在供給量到達結束判定值之前的期間內，對選擇部214給予用於輸出來自PID運算部212的指令值的選擇指令，另一方面，在供給量到達結束判定值時，對選擇部214給予用於停止指令值的輸出的選擇指令（指令值停止的指令）。The selection unit 214 and the comparison unit 226 correspond to the functional configuration for realizing the processing (corresponding to step S7 and step S8 shown in FIG. 5) required to determine the end of the processing in the first stage 201. More specifically, the selection unit 214 switches whether to output the command value from the PID calculation unit 212 as a valid command value in accordance with the command from the comparison unit 226. The comparison unit 226 compares the supply amount of the resin material P from the differentiator 222 with the end determination value. The comparison unit 226 gives the selection unit 214 a selection command for outputting the command value from the PID calculation unit 212 during the period before the supply amount reaches the end determination value, and, on the other hand, selects when the supply amount reaches the end determination value The unit 214 gives a selection command for stopping the output of the command value (command for stopping the command value).

再者，圖6中僅示出第1階段201的功能構成的一例，並不限定於此，也可使用其他構成作為第1階段201的功能構成。In addition, FIG. 6 shows only an example of the functional configuration of the first stage 201, and is not limited thereto, and other configurations may be used as the functional configuration of the first stage 201.

（d3：第2階段202） 圖7是表示根據本實施形態的樹脂材料供給裝置10中的樹脂材料P的供給控制方法的第2階段中的處理的一例的流程圖。典型而言，圖7所示的各步驟是通過控制部100的處理器110執行控制程序128來實現。(D3: Phase 2 202) 7 is a flowchart showing an example of processing in the second stage of the supply control method of the resin material P in the resin material supply device 10 according to this embodiment. Typically, each step shown in FIG. 7 is realized by the processor 110 of the control unit 100 executing the control program 128.

參照圖7，控制部100決定第2階段202中使用的指令值的大小（步驟S11）。典型而言，步驟S11中可決定第1階段201即將結束前的指令值的大小來作為第2階段202中使用的指令值的大小。7, the control unit 100 determines the size of the command value used in the second stage 202 (step S11 ). Typically, in step S11, the size of the command value immediately before the end of the first stage 201 can be determined as the size of the command value used in the second stage 202.

而且，控制部100判斷樹脂材料P的供給量是否到達目標量（步驟S12）。若樹脂材料P的供給量未到達目標量（步驟S12中為否），則控制部100判斷指令輸出的輸出週期是否到來（步驟S13）。Then, the control unit 100 determines whether the supply amount of the resin material P reaches the target amount (step S12). If the supply amount of the resin material P does not reach the target amount (NO in step S12), the control unit 100 determines whether the output cycle of the command output has come (step S13).

此處，輸出脈衝狀的指令值的輸出週期及輸出指令值的時間寬度是預先規定的。再者，也可代替輸出週期及時間寬度來預先規定輸出週期及占空比（即，時間寬度相對於輸出週期的比率）。Here, the output period for outputting the pulse-like command value and the time width for outputting the command value are predetermined. Furthermore, instead of the output period and the time width, the output period and the duty ratio (that is, the ratio of the time width to the output period) may be predetermined.

若指令輸出的輸出週期未到來（步驟S13中為否），則重複步驟S13的處理。若指令輸出的輸出週期到來（步驟S13中為是），則控制部100跨及預先規定的時間寬度來輸出步驟S11中所決定的大小的指令值（步驟S14）。而且，重複步驟S12以下的處理。If the output cycle of the command output has not arrived (NO in step S13), the process of step S13 is repeated. When the output cycle of the command output comes (YES in step S13), the control unit 100 outputs the command value of the size determined in step S11 over a predetermined time width (step S14). Furthermore, the processing after step S12 is repeated.

另一方面，若樹脂材料P的供給量到達目標量（步驟S12中為是），則第2階段202中的處理結束。On the other hand, when the supply amount of the resin material P reaches the target amount (YES in step S12), the processing in the second stage 202 ends.

如此，在第2階段202中，通過輸出脈衝狀的指令值，而在到達所指定的目標量之前，間歇地噴出樹脂材料P。In this manner, in the second stage 202, by outputting the pulse-like command value, the resin material P is intermittently discharged before reaching the specified target amount.

圖8是表示與根據本實施形態的樹脂材料供給裝置10中的樹脂材料P的供給控制方法的第2階段中的處理相對應的功能構成的框圖。典型而言，圖8所示的各功能框是通過控制部100的處理器110執行控制程序128來實現。8 is a block diagram showing a functional configuration corresponding to the processing in the second stage of the supply control method of the resin material P in the resin material supply device 10 according to this embodiment. Typically, each functional block shown in FIG. 8 is realized by the processor 110 of the control unit 100 executing the control program 128.

參照圖8，控制部100包括脈衝產生部230、放大部232、選擇部234、比較部236、以及差分器222作為第2階段202的功能構成。Referring to FIG. 8, the control unit 100 includes a pulse generation unit 230, an amplification unit 232, a selection unit 234, a comparison unit 236, and a differentiator 222 as the functional configuration of the second stage 202.

差分器222的功能與圖6所示的差分器222相同，是算出樹脂材料P的供給量。The function of the differentiator 222 is the same as that of the differentiator 222 shown in FIG. 6 and calculates the supply amount of the resin material P.

脈衝產生部230及放大部232相當於用於實現脈衝狀的指令值的輸出（相當於圖7所示的步驟S13及步驟S14）的功能構成。脈衝產生部230針對預先規定的每一輸出週期輸出預先規定的時間寬度的脈衝信號。放大部232將來自脈衝產生部230的脈衝信號的振幅調整為預先規定的指令值的大小，並生成脈衝狀的指令值。The pulse generating unit 230 and the amplifying unit 232 correspond to a functional configuration for realizing the output of a pulse-shaped command value (corresponding to step S13 and step S14 shown in FIG. 7 ). The pulse generator 230 outputs a pulse signal with a predetermined time width for each predetermined output cycle. The amplifying unit 232 adjusts the amplitude of the pulse signal from the pulse generating unit 230 to a predetermined command value, and generates a pulse-shaped command value.

選擇部234及比較部236相當於用於實現判斷第2階段202中的處理結束所需的處理（相當於圖7所示的步驟S12）的功能構成。更具體而言，選擇部234依照來自比較部236的指令來對是否輸出來自放大部232的指令值作為有效的指令值進行切換。比較部236對來自差分器222的樹脂材料P的供給量與目標量進行比較。比較部236在供給量到達目標量之前的期間內，對選擇部234給予用於輸出來自放大部232的指令值的選擇指令，另一方面，在供給量到達目標量時，對選擇部234給予用於停止指令值的輸出的選擇指令（指令值停止的指令）。The selection unit 234 and the comparison unit 236 correspond to the functional configuration for realizing the processing (corresponding to step S12 shown in FIG. 7) required to judge the end of the processing in the second stage 202. More specifically, the selection unit 234 switches whether or not to output the command value from the amplification unit 232 as a valid command value in accordance with the command from the comparison unit 236. The comparison unit 236 compares the supply amount of the resin material P from the differentiator 222 with the target amount. The comparison unit 236 gives the selection unit 234 a selection command for outputting the command value from the amplifying unit 232 during the period before the supply amount reaches the target amount. On the other hand, when the supply amount reaches the target amount, it gives the selection unit 234 Selection command (command to stop command value) to stop output of command value.

再者，圖8中僅示出第2階段202的功能構成的一例，並不限定於此，也可使用其他構成作為第2階段202的功能構成。In addition, FIG. 8 shows only an example of the functional configuration of the second stage 202 and is not limited to this, and other configurations may be used as the functional configuration of the second stage 202.

＜E. 第2階段202的分割＞ 在所述實施形態中，第2階段202中以相同輸出週期及時間寬度輸出脈衝狀的指令值。即，第2階段202中的每單位時間的供給量固定。代替此種處理，也可在第2階段202中，隨著樹脂材料P的供給量的實績值接近目標量而減少每單位時間的供給量。<E. Segmentation of the second stage 202> In the above embodiment, in the second stage 202, the pulse-shaped command value is output with the same output cycle and time width. That is, the supply amount per unit time in the second stage 202 is fixed. Instead of such processing, in the second stage 202, as the actual value of the supply amount of the resin material P approaches the target amount, the supply amount per unit time may be reduced.

作為此種減少每單位時間的供給量的處理例，以下說明將第2階段202分割為兩個區間（以下，分別稱為「第1子階段241」及「第2子階段242」）且使各子階段中輸出的指令值不同的情況。即，第2階段202包含第1子階段241以及第1子階段241之後的第2子階段242。其中，也可分割為更多的區間（例如，三個以上的子階段）。As an example of such a process of reducing the supply amount per unit time, the following description divides the second stage 202 into two sections (hereinafter, referred to as "first sub-stage 241" and "second sub-stage 242", respectively) and makes The command value output in each sub-stage is different. That is, the second stage 202 includes the first sub-stage 241 and the second sub-stage 242 after the first sub-stage 241. Among them, it can also be divided into more intervals (for example, more than three sub-stages).

自第1子階段241向第2子階段242的過渡條件可任意設定，例如可將目標量與樹脂材料P的供給量的實績值的差成為調整開始量以下作為過渡條件。The transition condition from the first sub-stage 241 to the second sub-stage 242 can be arbitrarily set. For example, the difference between the target amount and the actual value of the supply amount of the resin material P may be equal to or less than the adjustment start amount as the transition condition.

控制部100以第2子階段242中的每單位時間的供給量比第1子階段241中的每單位時間的供給量少的方式，在第1子階段241及第2子階段242中控制料槽給料器13。The control unit 100 controls the materials in the first sub-stage 241 and the second sub-stage 242 so that the supply amount per unit time in the second sub-stage 242 is smaller than the supply amount per unit time in the first sub-stage 241.槽Feeder 13.

作為減少每單位時間的供給量的具體方法，也可對指令輸出的輸出週期、指令輸出的時間寬度、指令輸出的大小中的至少任一者進行變更。再者，指令輸出的占空比由輸出週期與時間寬度的相對關係來規定，因此在對指令輸出的輸出週期及指令輸出的時間寬度的至少一者進行變更的情況下，意味著對指令輸出的占空比進行變更。As a specific method of reducing the supply amount per unit time, at least any one of the output cycle of the command output, the time width of the command output, and the size of the command output may be changed. In addition, the duty cycle of the command output is defined by the relative relationship between the output cycle and the time width. Therefore, when at least one of the output cycle of the command output and the time width of the command output is changed, it means that the command output To change the duty cycle.

圖9（a）～圖9（c）是表示根據本實施形態的變形例的第2階段202中輸出的指令值的一例的時間圖。在圖9（a）～圖9（c）所示的時間圖中，第2子階段242中的每單位時間的供給量比第1子階段241中的每單位時間的供給量設定得少。9(a) to 9(c) are time charts showing an example of command values output in the second stage 202 according to a modification of the present embodiment. In the time charts shown in FIGS. 9( a) to 9 (c ), the supply amount per unit time in the second sub-stage 242 is set smaller than the supply amount per unit time in the first sub-stage 241.

圖9（a）中表示在第1子階段241與第2子階段242之間延長指令輸出的輸出週期的處理例。在所述例子中，控制部100使在第2子階段242中對料槽給料器13給予指令值的週期比在第1子階段241中對料槽給料器13給予指令值的週期長。更具體而言，在第1子階段241中，針對每一輸出週期T1輸出時間寬度Td的指令值，在第2子階段242中，針對每一輸出週期T2（＞T1）輸出時間寬度Td的指令值。FIG. 9( a) shows an example of processing for extending the output cycle of the command output between the first sub-stage 241 and the second sub-stage 242. In the above example, the control unit 100 makes the cycle of giving the command value to the tank feeder 13 in the second sub-stage 242 longer than the cycle of giving the command value to the tank feeder 13 in the first sub-stage 241. More specifically, in the first sub-stage 241, the command value of the time width Td is output for each output period T1, and in the second sub-stage 242, the time width Td is output for each output period T2 (>T1) Command value.

在第1子階段241中，以相對高的供給速度供給樹脂材料P，由此可縮短第2階段202中的處理整體所需的時間，並且在第2子階段242中，以相對低的供給速度供給樹脂材料P，由此可以更高的精度控制樹脂材料P的供給量。In the first sub-stage 241, the resin material P is supplied at a relatively high supply speed, thereby reducing the time required for the entire process in the second stage 202, and in the second sub-stage 242, at a relatively low supply The resin material P is supplied at a speed, whereby the supply amount of the resin material P can be controlled with higher accuracy.

通過採用此種包含多個子階段的第2階段202，可抑制樹脂材料P的供給處理所需的整體的處理時間的增大，且可以更高的精度控制樹脂材料P的供給量。By adopting such a second stage 202 including a plurality of sub-stages, it is possible to suppress an increase in the overall processing time required for the supply process of the resin material P, and it is possible to control the supply amount of the resin material P with higher accuracy.

圖9（b）中表示除了圖9（a）所示的那樣的變更輸出週期的處理以外還變更指令輸出的大小時的時間圖。在所述例子中，控制部100使在第2子階段242中對料槽給料器13給予的指令值的大小比在第1子階段241中對料槽給料器13給予的指令值的大小小。更具體而言，在第1子階段241中針對每一輸出週期T1輸出具有時間寬度Td的大小為Y1的指令值，在第2子階段242中，針對每一輸出週期T2（＞T1）輸出具有時間寬度Td的大小為Y2（＜Y1）的指令值。即，在第2子階段242中，與第1子階段241相比較，料槽給料器13產生的振動強度變小。FIG. 9(b) shows a time chart when the size of the command output is changed in addition to the process of changing the output cycle as shown in FIG. 9(a). In the above example, the control unit 100 makes the command value given to the trough feeder 13 in the second sub-stage 242 smaller than the command value given to the trough feeder 13 in the first sub-stage 241 . More specifically, in the first sub-stage 241, an instruction value with a time width Td of Y1 is output for each output period T1, and in the second sub-stage 242, it is output for each output period T2 (>T1) A command value with a time width Td of Y2 (<Y1). That is, in the second sub-stage 242, the vibration intensity generated by the trough feeder 13 becomes smaller than that in the first sub-stage 241.

如此，通過延長輸出週期並且減小指令值的大小而第2子階段242中的每單位時間的供給量進一步變小，因此與圖9（a）的情況相比較，可進一步提高供給量的控制精度。In this way, by extending the output cycle and reducing the size of the command value, the supply amount per unit time in the second sub-stage 242 is further reduced, and thus the control of the supply amount can be further improved compared to the case of FIG. 9(a) Precision.

再者，即便在第2子階段242中變更指令值的大小，在第2子階段242中供給的樹脂材料P的量也為極其微小的量，因此可無視對料槽12中殘留的樹脂材料P的分佈狀態的影響，也可無視對下次的樹脂材料P的供給處理的影響。Furthermore, even if the magnitude of the command value is changed in the second sub-stage 242, the amount of the resin material P supplied in the second sub-stage 242 is an extremely small amount, so the resin material remaining in the feed tank 12 can be ignored The influence of the distribution state of P may be ignored regardless of the influence on the next supply process of the resin material P.

圖9（c）中表示在第1子階段241與第2子階段242之間縮短指令輸出的時間寬度的處理例。在所述例中，控制部100使在第2子階段242中對料槽給料器13給予的指令值的時間寬度比在第1子階段241中對料槽給料器13給予的指令值的時間寬度短。更具體而言，在第1子階段241中，針對每一輸出週期T1輸出時間寬度Td1的指令值，在第2子階段242中，針對每一輸出週期T1輸出時間寬度Td2（＜Td1）的指令值。FIG. 9(c) shows an example of processing for shortening the time width of command output between the first sub-stage 241 and the second sub-stage 242. In the above example, the control unit 100 makes the time width of the command value given to the trough feeder 13 in the second sub-stage 242 be longer than the time of the command value given to the trough feeder 13 in the first sub-stage 241 The width is short. More specifically, in the first sub-stage 241, the command value of the time width Td1 is output for each output period T1, and in the second sub-stage 242, the time width Td2 (<Td1) is output for each output period T1 Command value.

在第1子階段241中，以相對高的供給速度供給樹脂材料P，由此可縮短第2階段202中的處理整體所需的時間，並且在第2子階段242中，以相對低的供給速度供給樹脂材料P，由此可以更高的精度控制樹脂材料P的供給量。In the first sub-stage 241, the resin material P is supplied at a relatively high supply speed, thereby reducing the time required for the entire process in the second stage 202, and in the second sub-stage 242, at a relatively low supply The resin material P is supplied at a speed, whereby the supply amount of the resin material P can be controlled with higher accuracy.

通過採用此種包含多個子階段的第2階段202，可抑制樹脂材料P的供給處理所需的整體的處理時間的增大，且可以更高的精度控制樹脂材料P的供給量。By adopting such a second stage 202 including a plurality of sub-stages, it is possible to suppress an increase in the overall processing time required for the supply process of the resin material P, and it is possible to control the supply amount of the resin material P with higher accuracy.

所述圖9（a）～圖9（c）中表示典型例，且若可隨著樹脂材料P的供給量的實績值接近目標量而減少每單位時間的供給量，則可採用任意方法。例如，在圖9（b）所示的處理的第2子階段242中，也可不將輸出週期設為T2而是設為與第1子階段241相同的輸出週期T1，也可僅使具有時間寬度Td的指令值的大小Y2比第1子階段的指令值的大小Y1小。The above-mentioned FIGS. 9(a) to 9(c) show typical examples, and any method can be adopted as long as the actual value of the supply amount of the resin material P approaches the target amount and the supply amount per unit time can be reduced. For example, in the second sub-stage 242 of the processing shown in FIG. 9(b), the output period may be set to the same output period T1 as the first sub-stage 241 instead of T2, or only the time The size Y2 of the command value of the width Td is smaller than the size Y1 of the command value of the first sub-stage.

圖10是表示根據本實施形態的變形例的樹脂材料供給裝置10中的樹脂材料P的供給控制方法的第2階段中的處理的一例的流程圖。典型而言，圖10所示的各步驟是通過控制部100的處理器110執行控制程序128來實現。再者，在圖10所示的步驟中的執行與圖7實質上相同的處理的步驟中，標註相同的步驟編號。FIG. 10 is a flowchart showing an example of processing in the second stage of the supply control method of the resin material P in the resin material supply device 10 according to a modification of the present embodiment. Typically, each step shown in FIG. 10 is realized by the processor 110 of the control unit 100 executing the control program 128. In addition, among the steps shown in FIG. 10 that perform substantially the same processing as FIG. 7, the same step numbers are marked.

參照圖10，控制部100決定第2階段202中使用的指令值的大小（步驟S11）。典型而言，步驟S11中可決定第1階段201即將結束前的指令值的大小來作為第2階段202中使用的指令值的大小。Referring to FIG. 10, the control unit 100 determines the size of the command value used in the second stage 202 (step S11 ). Typically, in step S11, the size of the command value immediately before the end of the first stage 201 can be determined as the size of the command value used in the second stage 202.

而且，控制部100判斷樹脂材料P的供給量是否到達目標量（步驟S12）。若樹脂材料P的供給量未到達目標量（步驟S12中為否），則控制部100判斷目標量與樹脂材料P的供給量的差是否為調整開始量以下（步驟S15）。Then, the control unit 100 determines whether the supply amount of the resin material P reaches the target amount (step S12). If the supply amount of the resin material P does not reach the target amount (NO in step S12), the control unit 100 determines whether the difference between the target amount and the supply amount of the resin material P is equal to or less than the adjustment start amount (step S15).

若目標量與樹脂材料P的供給量的差為調整開始量以下（步驟S15中為是），則控制部100對指令輸出的輸出週期、指令輸出的時間寬度、指令輸出的大小中的至少任一者進行變更，以減少每單位時間的供給量（步驟S16）。If the difference between the target amount and the supply amount of the resin material P is equal to or less than the adjustment start amount (YES in step S15), the control unit 100 outputs at least any of the output cycle of the command output, the time width of the command output, and the size of the command output One changes to reduce the supply amount per unit time (step S16).

另一方面，若目標量與樹脂材料P的供給量的差並非調整開始量以下（步驟S15中為否），則跳過步驟S16的處理。On the other hand, if the difference between the target amount and the supply amount of the resin material P is not equal to or less than the adjustment start amount (NO in step S15), the process of step S16 is skipped.

控制部100判斷現在所設定的指令輸出的輸出週期是否到來（步驟S13）。若現在所設定的指令輸出的輸出週期未到來（步驟S13中為否），則重複步驟S13的處理。The control unit 100 determines whether the output cycle of the command output currently set has come (step S13). If the output cycle of the command output currently set has not arrived (NO in step S13), the process of step S13 is repeated.

若現在所設定的指令輸出的輸出週期到來（步驟S13中為是），則控制部100跨及現在所設定的時間寬度輸出現在所設定的大小的指令值（步驟S14）。而且，重複步驟S12以下的處理。When the output cycle of the command output currently set comes (YES in step S13), the control unit 100 outputs the command value of the currently set size across the time width currently set (step S14). Furthermore, the processing after step S12 is repeated.

另一方面，若樹脂材料P的供給量到達目標量（步驟S12中為是），則第2階段202中的處理結束。On the other hand, when the supply amount of the resin material P reaches the target amount (YES in step S12), the processing in the second stage 202 ends.

＜F. 變形例＞ 對於所述那樣的實施形態，可實施以下那樣的變形例。關於以下例示的多個變形例，可任意組合。＜F. Modified example＞ For the above-described embodiment, the following modifications can be implemented. The plurality of modified examples illustrated below can be arbitrarily combined.

（f1：第1階段201中的供給速度的控制的變形例） 在所述實施形態中，示出了利用反饋控制來算出第1階段201中的樹脂材料P的供給速度的例子，但也可輸出固定的指令值。(F1: Modified example of the control of the supply speed in the first stage 201) In the above-mentioned embodiment, an example in which the supply speed of the resin material P in the first stage 201 is calculated by feedback control is shown, but a fixed command value may be output.

例如，在樹脂材料P的供給量到達結束判定值之前，可直接持續輸出接受到樹脂材料P的供給開始指令後算出的指令初期值（參照圖5的步驟S3）。例如，在料槽12中殘留的樹脂材料P的分佈狀態穩定的情況下，即便在輸出固定值作為指令值的情況下，也可獲得充分的控制性能。For example, until the supply amount of the resin material P reaches the end determination value, the command initial value calculated after receiving the supply start command of the resin material P may be continuously output (see step S3 in FIG. 5 ). For example, when the distribution state of the resin material P remaining in the chute 12 is stable, even when a fixed value is output as a command value, sufficient control performance can be obtained.

（f2：第2階段202中的指令值） 在所述實施形態中，作為間歇地供給樹脂材料P的方法，例示有輸出具有脈衝狀的時間波形（即，矩形波）的指令值的方法，但並不限於此，例如也可輸出具有鋸形波或三角波的時間波形的指令值。(F2: command value in stage 2 202) In the above embodiment, as a method of intermittently supplying the resin material P, a method of outputting a command value having a pulse-like time waveform (that is, a rectangular wave) is exemplified, but it is not limited thereto, and for example, a saw having a saw The command value of the time waveform of the shape wave or triangle wave.

＜G. 附註＞ 本實施形態包含以下那樣的技術思想。＜G. Notes＞ This embodiment includes the following technical ideas.

根據一實施形體而提供一種粉粒體供給裝置，其通過使存在粉粒體的粉粒體供給路振動而使粉粒體移動並自設置於粉粒體供給路的噴出口對供給對象物供給粉粒體。粉粒體供給裝置包括：振動部，使粉粒體供給路振動；測量部，測量粉粒體對供給對象物的供給量；以及控制部，以供給量成為所指定的目標量的方式控制振動部的振動。控制部在供給開始後的第1階段中以連續地供給粉粒體的方式控制振動部，並且在第1階段之後的第2階段中以間歇地供給粉粒體的方式控制振動部。According to an embodiment, there is provided a powder and granular material supply device which moves powder and granular materials by vibrating a powder and granular material supply path in which powder and granular materials are present, and supplies a supply object from a discharge port provided in the powder and granular material supply path Powder granules. The powder and granular material supply device includes: a vibrating portion that vibrates the powder and granular material supply path; a measuring portion that measures the supply amount of the powder and granular material to the supply target; and a control portion that controls the vibration so that the supply amount becomes the specified target amount Department of vibration. The control unit controls the vibrating unit to continuously supply the powder and granules in the first stage after the start of the supply, and controls the vibrating unit to intermittently supply the powder and granules in the second stage after the first stage.

控制部也可在第2階段中對振動部給予脈衝狀的指令值。The control unit may give a pulse-shaped command value to the vibration unit in the second stage.

控制部也可基於在第1階段中給予至振動部的指令值的大小來決定第2階段中的指令值的大小。The control unit may determine the size of the command value in the second stage based on the size of the command value given to the vibration unit in the first stage.

第2階段也可包含第1子階段與第1子階段之後的第2子階段。控制部也可以第2子階段中的每單位時間的供給量比第1子階段中的每單位時間的供給量少的方式在第1子階段及第2子階段中控制振動部。The second stage may include the first substage and the second substage after the first substage. The control unit may control the vibration unit in the first sub-stage and the second sub-stage so that the supply amount per unit time in the second sub-stage is smaller than the supply amount per unit time in the first sub-stage.

控制部也可使在第2子階段中對振動部給予指令值的週期比在第1子階段中對振動部給予指令值的週期長。The control unit may make the cycle of giving the command value to the vibration unit in the second sub-stage longer than the cycle of giving the command value to the vibration unit in the first sub-stage.

控制部也可使在第2子階段中對振動部給予的指令值的大小比在第1子階段中對振動部給予的指令值的大小小。The control unit may make the size of the command value given to the vibration unit in the second sub-stage smaller than the size of the command value given to the vibration unit in the first sub-stage.

根據另一實施形態的樹脂成形裝置包括：所述粉粒體供給裝置；以及壓縮成形部，使用由粉粒體供給裝置供給的粉粒體即顆粒狀的樹脂材料進行壓縮成形。A resin molding apparatus according to another embodiment includes: the powder and granular material supply device; and a compression molding unit that performs compression molding using a granular resin material that is the powder and granular material supplied by the powder and granular material supply device.

根據又一實施形態而提供一種粉粒體供給方法，其通過使存在粉粒體的粉粒體供給路振動而使粉粒體移動並自設置於粉粒體供給路的噴出口對供給對象物供給所指定的目標量的粉粒體。粉粒體供給方法包括：在供給開始後的第1階段中，以連續地供給粉粒體的方式使與粉粒體供給路相關聯的振動部振動的步驟；以及在第1階段之後的第2階段中，以間歇地供給粉粒體的方式使振動部振動直至粉粒體對供給對象物的供給量到達目標量為止的步驟。According to still another embodiment, there is provided a method for supplying powder and granules, which vibrates a powder and granule supply passage in which powders and granules are present to move the powder and granules and supplies the object to be supplied from an ejection port provided in the powder and granule supply passage Supply the specified amount of powder and granules. The method of supplying powders and granules includes the steps of vibrating the vibrating portion associated with the supply path of powders and granules so that the powders and granules are continuously supplied in the first stage after the start of supply; and the first stage after the first stage In the 2nd stage, the step of vibrating the vibrating portion so as to intermittently supply powder and granules until the supply amount of the powder and granules to the supply target reaches the target amount.

在第2階段中使振動部振動的步驟也可包括對振動部給予脈衝狀的指令值的步驟。The step of vibrating the vibrator in the second stage may include a step of giving a pulse-shaped command value to the vibrator.

也可基於在第1階段中給予至振動部的指令值的大小來決定第2階段中的指令值的大小。The size of the command value in the second stage may be determined based on the size of the command value given to the vibration part in the first stage.

第2階段也可包含第1子階段及第1子階段之後的第2子階段。在第2階段中使振動部振動的步驟也可包括以第2子階段中的每單位時間的供給量比第1子階段中的每單位時間的供給量少的方式在第1子階段及第2子階段中控制振動部的步驟。The second stage may include the first substage and the second substage after the first substage. The step of vibrating the vibrating portion in the second stage may include the first sub-stage and the second sub-stage in such a way that the supply amount per unit time in the second sub-stage is smaller than the supply amount per unit time in the first sub-stage. Steps to control the vibration part in 2 sub-stages.

在第2子階段中對振動部給予指令值的週期也可比在第1子階段中對振動部給予指令值的週期設定得長。The period of giving the command value to the vibration part in the second sub-stage may be set longer than the period of giving the command value to the vibration part in the first sub-stage.

在第2子階段中對振動部給予的指令值的大小也可比在第1子階段中對振動部給予的指令值的大小設定得小。The size of the command value given to the vibrating part in the second sub-stage may be set smaller than the size of the command value given to the vibrating part in the first sub-stage.

根據又一實施形態的樹脂成形品的製造方法包括：所述粉粒體供給方法的步驟；以及使用所供給的粉粒體即顆粒狀的樹脂材料進行壓縮成形的步驟。The method for manufacturing a resin molded product according to still another embodiment includes the steps of the powder and granular material supply method and the step of performing compression molding using the supplied powder and granular material, that is, a granular resin material.

＜H. 優點＞ 根據本實施形態的粉粒體供給裝置及粉粒體供給方法採用以連續地供給粉粒體的方式控制振動部的第1階段、以及以間歇地供給粉粒體的方式控制振動部的第2階段。通過採用此種粉粒體的供給形態不同的多個階段，可以更高的精度控制粉粒體的供給量。＜H. Advantages＞ The powder and granular material supply device and the powder and granular material supply method according to the present embodiment adopt the first stage of controlling the vibrating portion to continuously supply the powder and granular material, and the second to control the vibrating portion to intermittently supply the powder and granular material. stage. By using such multiple stages in which the supply forms of the powder and granules are different, the supply amount of the powder and granules can be controlled with higher accuracy.

另外，在使用顆粒狀的樹脂材料作為根據本實施形態的粉粒體供給裝置及粉粒體供給方法所供給的粉粒體的典型例的情況下，可抑制由各供給動作供給的樹脂材料的重量偏差或相對於目標量而言過多或不足，因此可實現樹脂成形品的厚度的均勻化。In addition, in the case of using a granular resin material as a typical example of the powder and granular material supplied by the powder and granular material supply device and the powder and granular material supply method according to the present embodiment, the resin material supplied by each supply operation can be suppressed The weight deviation is too large or insufficient with respect to the target amount, so that the thickness of the resin molded product can be made uniform.

進而，在將樹脂成形品應用於電子零件的密封的情況下，即便為薄型封裝，也可實現封裝厚度的均勻化。Furthermore, when a resin molded product is applied to the sealing of electronic components, even if it is a thin package, the package thickness can be made uniform.

另外，通過將第2階段分割為多個子階段並使每單位時間的供給量不同，而不會延長供給動作所需的整體的處理時間且可進一步提高粉粒體的供給量的控制性能。In addition, by dividing the second stage into a plurality of sub-stages and varying the supply amount per unit time, the overall processing time required for the supply operation can be extended, and the control performance of the supply amount of the powder and granular material can be further improved.

對本發明的實施形態進行了說明，但應認為此次揭示的實施形態在所有方面均為例示而非限制性的。本發明的範圍由權利要求書示出，且旨在包含與權利要求書均等的含義及範圍內的所有的變更。The embodiment of the present invention has been described, but the embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown by the claims, and it is intended to include all modifications equivalent in meaning and scope to the claims.

1‧‧‧樹脂成形裝置 10‧‧‧樹脂材料供給裝置 11‧‧‧斜料槽 12‧‧‧料槽 13‧‧‧料槽給料器 14‧‧‧測量部 15‧‧‧樹脂材料搬送托盤 16‧‧‧樹脂材料排出部 17‧‧‧儲料器 20‧‧‧樹脂材料搬送部 30‧‧‧壓縮成形部 31‧‧‧接收模組 32‧‧‧成形模組 33‧‧‧交付模組 36‧‧‧主搬送裝置 37‧‧‧副搬送裝置 100‧‧‧控制部 102‧‧‧輸入部 104‧‧‧輸出部 106‧‧‧主記憶體 108‧‧‧光學驅動器 108A‧‧‧記錄介質 110‧‧‧處理器 112‧‧‧網路界面 114‧‧‧測量部界面 116‧‧‧振動部界面 118‧‧‧內部總線 120‧‧‧HDD 121‧‧‧噴出口 122‧‧‧通用OS 124‧‧‧實時OS 126‧‧‧HMI程序 128‧‧‧控制程序 151‧‧‧凹部 171‧‧‧供給口 172‧‧‧儲料器給料器 201‧‧‧第1階段 202‧‧‧第2階段 210‧‧‧偏差算出部 212‧‧‧PID運算部 214、216、234‧‧‧選擇部 218‧‧‧指令值保持部 220‧‧‧計時器 222‧‧‧差分器 224‧‧‧微分器 226、236‧‧‧比較部 230‧‧‧脈衝產生部 232‧‧‧放大部 241‧‧‧第1子階段 242‧‧‧第2子階段 311‧‧‧基板接收部 331‧‧‧樹脂成形品保持部 P‧‧‧樹脂材料 S‧‧‧基板 S1～S16‧‧‧步驟 T‧‧‧樹脂成形品 T1、T2‧‧‧輸出週期 t1、t2、t3‧‧‧時刻 Td、Td1、Td2‧‧‧時間寬度 Y1、Y2‧‧‧指令值的大小1‧‧‧Resin molding device 10‧‧‧Resin material supply device 11‧‧‧oblique material trough 12‧‧‧Feed trough 13‧‧‧Feeder feeder 14‧‧‧Measurement Department 15‧‧‧Resin material transfer tray 16‧‧‧Resin material discharge section 17‧‧‧storage 20‧‧‧Resin Material Transfer Department 30‧‧‧Compression molding department 31‧‧‧Receiving module 32‧‧‧Forming module 33‧‧‧delivery module 36‧‧‧Main conveying device 37‧‧‧Deputy conveying device 100‧‧‧Control Department 102‧‧‧Input 104‧‧‧ Output 106‧‧‧Main memory 108‧‧‧Optical drive 108A‧‧‧Recording medium 110‧‧‧ processor 112‧‧‧Web interface 114‧‧‧Measurement interface 116‧‧‧Vibration Department Interface 118‧‧‧Internal bus 120‧‧‧HDD 121‧‧‧Spray outlet 122‧‧‧General OS 124‧‧‧Real-time OS 126‧‧‧HMI program 128‧‧‧Control program 151‧‧‧recess 171‧‧‧Supply port 172‧‧‧storage feeder 201‧‧‧ Phase 1 202‧‧‧ Phase 2 210‧‧‧ Deviation Calculation Department 212‧‧‧PID operation unit 214, 216, 234‧‧‧ Selection Department 218‧‧‧ Command value holding section 220‧‧‧Timer 222‧‧‧differentiator 224‧‧‧differentiator 226、236‧‧‧Comparative Department 230‧‧‧Pulse generator 232‧‧‧Enlargement 241‧‧‧The first sub-stage 242‧‧‧The second sub-stage 311‧‧‧Board Receiving Department 331‧‧‧Resin molded product holding section P‧‧‧Resin materials S‧‧‧Substrate S1～S16‧‧‧Step T‧‧‧Resin molded product T1, T2‧‧‧ output cycle t1, t2, t3‧‧‧ Td, Td1, Td2 ‧‧‧ time width Y1, Y2‧‧‧Command value

圖1是表示根據本實施形態的樹脂成形裝置的整體構成的一例的示意圖。 圖2是表示構成根據本實施形態的樹脂成形裝置的樹脂材料供給裝置的整體構成的一例的示意圖。 圖3是表示構成根據本實施形態的樹脂材料供給裝置的控制部的硬體（hardware）構成例的示意圖。 圖4是用於說明根據本實施形態的樹脂材料供給裝置中的樹脂材料的供給控制方法的時間圖（time chart）。 圖5是表示根據本實施形態的樹脂材料供給裝置中的樹脂材料的供給控制方法的第1階段中的處理的一例的流程圖（flow chart）。 圖6是表示與根據本實施形態的樹脂材料供給裝置中的樹脂材料的供給控制方法的第1階段中的處理相對應的功能構成的框圖。 圖7是表示根據本實施形態的樹脂材料供給裝置中的樹脂材料的供給控制方法的第2階段中的處理的一例的流程圖。 圖8是表示與根據本實施形態的樹脂材料供給裝置中的樹脂材料的供給控制方法的第2階段中的處理相對應的功能構成的框圖。 圖9（a）～圖9（c）是表示根據本實施形態的變形例的第2階段中輸出的指令值的一例的時間圖。 圖10是表示根據本實施形態的變形例的樹脂材料供給裝置中的樹脂材料的供給控制方法的第2階段中的處理的一例的流程圖。FIG. 1 is a schematic diagram showing an example of the overall configuration of a resin molding apparatus according to this embodiment. 2 is a schematic diagram showing an example of the overall configuration of a resin material supply device constituting the resin molding device according to the present embodiment. FIG. 3 is a schematic diagram showing an example of a hardware configuration of a control unit that constitutes the resin material supply device according to this embodiment. FIG. 4 is a time chart for explaining a method of controlling the supply of resin material in the resin material supply device according to the present embodiment. 5 is a flow chart showing an example of processing in the first stage of the resin material supply control method in the resin material supply device according to the present embodiment. 6 is a block diagram showing a functional configuration corresponding to the processing in the first stage of the resin material supply control method in the resin material supply device according to the present embodiment. 7 is a flowchart showing an example of processing in the second stage of the resin material supply control method in the resin material supply device according to the present embodiment. 8 is a block diagram showing a functional configuration corresponding to the processing in the second stage of the resin material supply control method in the resin material supply device according to this embodiment. 9( a) to 9 (c) are time charts showing an example of command values output in the second stage according to a modification of the present embodiment. 10 is a flowchart showing an example of processing in the second stage of the resin material supply control method in the resin material supply device according to the modification of the present embodiment.

201‧‧‧第1階段 201‧‧‧ Phase 1

202‧‧‧第2階段 202‧‧‧ Phase 2

t1、t2、t3‧‧‧時刻 t1, t2, t3‧‧‧

Claims (12)

一種粉粒體供給裝置，其為通過使存在粉粒體的粉粒體供給路振動而使所述粉粒體移動並自設置於所述粉粒體供給路的噴出口對供給對象物供給所述粉粒體的粉粒體供給裝置，並且其特徵在於包括：振動部，使所述粉粒體供給路振動；測量部，測量所述粉粒體對所述供給對象物的供給量；以及控制部，以所述供給量成為所指定的目標量的方式控制所述振動部的振動，且所述控制部在供給開始後的第1階段中以連續地供給所述粉粒體的方式控制所述振動部，並且在所述第1階段之後的第2階段中以間歇地供給所述粉粒體的方式控制所述振動部，所述第2階段包含第1子階段及所述第1子階段之後的第2子階段，所述控制部以所述第2子階段中的每單位時間的供給量比所述第1子階段中的每單位時間的供給量少的方式在所述第1子階段及所述第2子階段中控制所述振動部。 A powder and granule supply device is a device for supplying an object to be supplied from a discharge port provided in the powder and granule supply path by vibrating the powder and granule supply path in which the powder and granules are present and moving the powder and granules The powder and granular material supply device of the powder and granular material, further comprising: a vibrating portion that vibrates the powder and granular material supply path; a measuring portion that measures the supply amount of the powder and granular material to the supply object; and The control section controls the vibration of the vibrating section so that the supply amount becomes the specified target amount, and the control section controls the continuous supply of the powder and granules in the first stage after the start of supply The vibrating part, and the vibrating part is controlled to intermittently supply the powders and granules in a second stage after the first stage, the second stage includes a first sub-stage and the first In the second sub-stage after the sub-stage, the control unit sets the amount of supply per unit time in the second sub-stage to be less than the supply amount per unit time in the first sub-stage. The vibration part is controlled in one sub-stage and the second sub-stage. 如申請專利範圍第1項所述的粉粒體供給裝置，其中所述控制部在所述第2階段中對所述振動部給予脈衝狀的指令值。 The powder and granular material supply device as described in Item 1 of the patent application range, wherein the control section gives the pulse-shaped command value to the vibration section in the second stage. 如申請專利範圍第1項或第2項所述的粉粒體供給裝置，其中所述控制部基於在所述第1階段中給予至所述振動部的指令值的大小來決定所述第2階段中的指令值的大小。 The powder and granular material supply device according to claim 1 or claim 2, wherein the control unit determines the second based on the magnitude of the command value given to the vibration unit in the first stage The size of the command value in the stage. 如申請專利範圍第1項或第2項所述的粉粒體供給裝置，其中所述控制部使在所述第2子階段中對所述振動部給予指令值的週期比在所述第1子階段中對所述振動部給予指令值的週期長。 The powder and granular material supply device according to claim 1 or claim 2, wherein the control unit sets the period ratio of giving the command value to the vibration unit in the second sub-stage to the first In the sub-stage, a period of giving a command value to the vibration part is long. 如申請專利範圍第1項或第2項所述的粉粒體供給裝置，其中所述控制部使在所述第2子階段中對所述振動部給予的指令值的大小比在所述第1子階段中對所述振動部給予的指令值的大小小。 The powder and granular material supply device according to claim 1 or claim 2, wherein the control unit makes the command value given to the vibrating unit in the second sub-stage larger than the The size of the command value given to the vibration part in one sub-stage is small. 一種樹脂成形裝置，包括：如申請專利範圍第1項至第5項中任一項所述的粉粒體供給裝置；以及壓縮成形部，使用由所述粉粒體供給裝置供給的所述粉粒體即顆粒狀的樹脂材料進行壓縮成形。 A resin molding apparatus comprising: the powder and granular material supply device according to any one of claims 1 to 5; and a compression molding section that uses the powder supplied by the powder and granular material supply device A granular resin material is compressed and molded. 一種粉粒體供給方法，其為通過使存在粉粒體的粉粒體供給路振動而使所述粉粒體移動並自設置於所述粉粒體供給路的噴出口對供給對象物供給所指定的目標量的所述粉粒體的粉粒體供給方法，並且其特徵在於包括：在供給開始後的第1階段中，以連續地供給所述粉粒體的方式使與所述粉粒體供給路相關聯的振動部振動的步驟；以及在所述第1階段之後的第2階段中，以間歇地供給所述粉粒體的方式使所述振動部振動直至所述粉粒體對所述供給對象物的供給量到達所述目標量為止的步驟，所述第2階段包含第1子階段及所述第1子階段之後的第2 子階段，在所述第2階段中使所述振動部振動的步驟包括以所述第2子階段中的每單位時間的供給量比所述第1子階段中的每單位時間的供給量少的方式在所述第1子階段及所述第2子階段中控制所述振動部的步驟。 A method for supplying powders and granules is to supply the supply object to the supply object by vibrating the powders and granules supply path in which the powders and granules are present to move the powders and granules from the discharge port provided in the powders and granules supply path A specified target amount of the powder and granule supply method of the powder and granules, which is characterized by comprising: in the first stage after the start of supply, the powder and granules are continuously supplied so as A step of vibrating the vibrating part associated with the body supply path; and in the second stage after the first stage, vibrating the vibrating part until the powder and granular bodies are intermittently supplied so as to intermittently supply the powder and granular bodies The step until the supply amount of the supply target object reaches the target amount, the second stage includes the first sub-stage and the second stage after the first sub-stage Sub-stage, the step of vibrating the vibrating part in the second stage includes that the supply amount per unit time in the second sub-stage is less than the supply amount per unit time in the first sub-stage The method of controlling the vibration part in the first sub-stage and the second sub-stage. 如申請專利範圍第7項所述的粉粒體供給方法，其中在所述第2階段中使所述振動部振動的步驟包括對所述振動部給予脈衝狀的指令值的步驟。 The method for supplying powders and granules according to item 7 of the patent application range, wherein the step of vibrating the vibrating portion in the second stage includes the step of giving a pulse-shaped command value to the vibrating portion. 如申請專利範圍第7項或第8項所述的粉粒體供給方法，其中基於在所述第1階段中給予至所述振動部的指令值的大小來決定所述第2階段中的指令值的大小。 The method for supplying powders and granules according to item 7 or 8 of the patent application scope, wherein the command in the second stage is determined based on the magnitude of the command value given to the vibrating part in the first stage The size of the value. 如申請專利範圍第7項或第8項所述的粉粒體供給方法，其中在所述第2子階段中對所述振動部給予指令值的週期比在所述第1子階段中對所述振動部給予指令值的週期設定得長。 The method for supplying powders and granules according to item 7 or 8 of the patent application range, wherein the cycle ratio of giving the command value to the vibrating part in the second sub-stage is higher than that in the first sub-stage. The period in which the vibration part gives the command value is set to be long. 如申請專利範圍第7項或第8項所述的粉粒體供給方法，其中在所述第2子階段中對所述振動部給予的指令值的大小比在所述第1子階段中對所述振動部給予的指令值的大小設定得小。 The method for supplying powders and granules according to item 7 or 8 of the patent application range, wherein the magnitude of the command value given to the vibrating part in the second sub-stage is larger than that in the first sub-stage. The magnitude of the command value given by the vibration unit is set small. 一種樹脂成形品的製造方法，包括：如申請專利範圍第7項至第11項中任一項所述的粉粒體供給方法的步驟；以及使用所供給的所述粉粒體即顆粒狀的樹脂材料進行壓縮成形的步驟。 A method for manufacturing a resin molded product, comprising: the steps of the method for supplying powders and granules as described in any one of items 7 to 11 of the patent application range; The step of compression molding the resin material.
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