TWI693250B - 組成物、環氧樹脂固化劑、環氧樹脂組成物、熱固化性組成物、固化物、半導體裝置以及層間絕緣材料 - Google Patents

組成物、環氧樹脂固化劑、環氧樹脂組成物、熱固化性組成物、固化物、半導體裝置以及層間絕緣材料 Download PDF

Info

Publication number: TWI693250B
Authority: TW; Taiwan
Prior art keywords: epoxy resin; composition; compound; chemical formula; resin composition
Prior art date: 2015-04-27

Application number

TW105110535A

Other languages

English (en)

Chinese (zh)

Other versions

TW201638175A (zh

Inventor

高橋航

村田清貴

Original Assignee

日商愛沃特股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-04-27

Filing date

2016-04-01

Publication date

2020-05-11

2016-04-01 Application filed by 日商愛沃特股份有限公司 filed Critical 日商愛沃特股份有限公司

2016-11-01 Publication of TW201638175A publication Critical patent/TW201638175A/zh

2020-05-11 Application granted granted Critical

2020-05-11 Publication of TWI693250B publication Critical patent/TWI693250B/zh

Links

239000000203 mixture Substances 0.000 title claims abstract description 185
239000003822 epoxy resin Substances 0.000 title claims abstract description 113
229920000647 polyepoxide Polymers 0.000 title claims abstract description 113
239000003795 chemical substances by application Substances 0.000 title claims abstract description 47
229920001187 thermosetting polymer Polymers 0.000 title claims description 48
239000004065 semiconductor Substances 0.000 title claims description 12
239000011229 interlayer Substances 0.000 title claims description 10
239000011810 insulating material Substances 0.000 title claims description 8
-1 maleimide compound Chemical class 0.000 claims abstract description 108
239000000126 substance Substances 0.000 claims abstract description 49
150000001875 compounds Chemical class 0.000 claims abstract description 18
125000004432 carbon atom Chemical group C* 0.000 claims abstract description 16
125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 13
125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 11
229910005965 SO 2 Inorganic materials 0.000 claims abstract description 9
125000000732 arylene group Chemical group 0.000 claims abstract description 9
229910052760 oxygen Inorganic materials 0.000 claims abstract description 9
125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 9
229910052717 sulfur Inorganic materials 0.000 claims abstract description 9
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 3
229910052799 carbon Inorganic materials 0.000 claims abstract description 3
125000001424 substituent group Chemical group 0.000 claims abstract description 3
125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 10
239000000047 product Substances 0.000 claims description 39
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 33
239000011256 inorganic filler Substances 0.000 claims description 10
229910003475 inorganic filler Inorganic materials 0.000 claims description 10
229930185605 Bisphenol Natural products 0.000 claims description 9
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 9
239000004202 carbamide Substances 0.000 claims description 9
239000007795 chemical reaction product Substances 0.000 claims description 7
239000000155 melt Substances 0.000 claims description 7
150000004714 phosphonium salts Chemical class 0.000 claims description 5
125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 3
125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
150000002989 phenols Chemical class 0.000 claims 1
238000000354 decomposition reaction Methods 0.000 abstract description 7
238000002156 mixing Methods 0.000 description 15
229920005989 resin Polymers 0.000 description 15
239000011347 resin Substances 0.000 description 15
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 12
239000000243 solution Substances 0.000 description 10
TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 8
239000003063 flame retardant Substances 0.000 description 8
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 7
230000000052 comparative effect Effects 0.000 description 7
WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 6
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
125000003700 epoxy group Chemical group 0.000 description 6
230000009477 glass transition Effects 0.000 description 6
150000002430 hydrocarbons Chemical group 0.000 description 6
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
238000000034 method Methods 0.000 description 6
229920003986 novolac Polymers 0.000 description 6
230000000704 physical effect Effects 0.000 description 6
RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
239000000945 filler Substances 0.000 description 5
238000000465 moulding Methods 0.000 description 5
238000012360 testing method Methods 0.000 description 5
0 *C(*)(c(cc1CC=C)ccc1O)c(cc1)cc(CC=C)c1O Chemical compound *C(*)(c(cc1CC=C)ccc1O)c(cc1)cc(CC=C)c1O 0.000 description 4
239000007822 coupling agent Substances 0.000 description 4
238000011156 evaluation Methods 0.000 description 4
239000012803 melt mixture Substances 0.000 description 4
238000005979 thermal decomposition reaction Methods 0.000 description 4
WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 3
CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 3
239000004593 Epoxy Substances 0.000 description 3
ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
239000004305 biphenyl Substances 0.000 description 3
235000010290 biphenyl Nutrition 0.000 description 3
PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical group C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
239000003086 colorant Substances 0.000 description 3
238000009472 formulation Methods 0.000 description 3
150000002460 imidazoles Chemical class 0.000 description 3
239000000463 material Substances 0.000 description 3
239000012778 molding material Substances 0.000 description 3
238000004806 packaging method and process Methods 0.000 description 3
229920003192 poly(bis maleimide) Polymers 0.000 description 3
238000007789 sealing Methods 0.000 description 3
239000003566 sealing material Substances 0.000 description 3
150000003672 ureas Chemical class 0.000 description 3
GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 2
LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
DGRGLKZMKWPMOH-UHFFFAOYSA-N 4-methylbenzene-1,2-diamine Chemical compound CC1=CC=C(N)C(N)=C1 DGRGLKZMKWPMOH-UHFFFAOYSA-N 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 2
229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 2
150000001463 antimony compounds Chemical class 0.000 description 2
125000003710 aryl alkyl group Chemical group 0.000 description 2
239000000378 calcium silicate Substances 0.000 description 2
229910052918 calcium silicate Inorganic materials 0.000 description 2
OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
239000004927 clay Substances 0.000 description 2
229910052570 clay Inorganic materials 0.000 description 2
229910002026 crystalline silica Inorganic materials 0.000 description 2
229910021488 crystalline silicon dioxide Inorganic materials 0.000 description 2
238000009826 distribution Methods 0.000 description 2
238000011049 filling Methods 0.000 description 2
239000005350 fused silica glass Substances 0.000 description 2
238000007429 general method Methods 0.000 description 2
239000011521 glass Substances 0.000 description 2
229910052736 halogen Inorganic materials 0.000 description 2
150000002367 halogens Chemical class 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
239000010410 layer Substances 0.000 description 2
229940018564 m-phenylenediamine Drugs 0.000 description 2
239000001095 magnesium carbonate Substances 0.000 description 2
ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
229910000021 magnesium carbonate Inorganic materials 0.000 description 2
235000014380 magnesium carbonate Nutrition 0.000 description 2
239000000395 magnesium oxide Substances 0.000 description 2
CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
238000005259 measurement Methods 0.000 description 2
239000010445 mica Substances 0.000 description 2
229910052618 mica group Inorganic materials 0.000 description 2
239000006082 mold release agent Substances 0.000 description 2
229910052757 nitrogen Inorganic materials 0.000 description 2
150000003003 phosphines Chemical class 0.000 description 2
239000002994 raw material Substances 0.000 description 2
235000012239 silicon dioxide Nutrition 0.000 description 2
229910000679 solder Inorganic materials 0.000 description 2
239000000454 talc Substances 0.000 description 2
229910052623 talc Inorganic materials 0.000 description 2
238000001721 transfer moulding Methods 0.000 description 2
IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
239000013585 weight reducing agent Substances 0.000 description 2
125000006839 xylylene group Chemical group 0.000 description 2
HEUDNCPBUYZJDR-UHFFFAOYSA-N 1,1-dimethyl-3-(2-methylphenyl)urea Chemical compound CN(C)C(=O)NC1=CC=CC=C1C HEUDNCPBUYZJDR-UHFFFAOYSA-N 0.000 description 1
HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
WCZNKVPCIFMXEQ-UHFFFAOYSA-N 2,3,5,6-tetramethylbenzene-1,4-diamine Chemical compound CC1=C(C)C(N)=C(C)C(C)=C1N WCZNKVPCIFMXEQ-UHFFFAOYSA-N 0.000 description 1
AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical compound C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 1
PESXPUCWMKUMSI-UHFFFAOYSA-N 3-[2-(dimethylcarbamoylamino)phenyl]-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=CC=C1NC(=O)N(C)C PESXPUCWMKUMSI-UHFFFAOYSA-N 0.000 description 1
KDQTUCKOAOGTLT-UHFFFAOYSA-N 3-[3-(dimethylcarbamoylamino)-4-methylphenyl]-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=C(C)C(NC(=O)N(C)C)=C1 KDQTUCKOAOGTLT-UHFFFAOYSA-N 0.000 description 1
USBRHIZNALIOEI-UHFFFAOYSA-N 4-[(4-hydroxy-3-prop-2-enylphenyl)methyl]-2-prop-2-enylphenol Chemical compound C1=C(CC=C)C(O)=CC=C1CC1=CC=C(O)C(CC=C)=C1 USBRHIZNALIOEI-UHFFFAOYSA-N 0.000 description 1
BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical group C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 1
GIGYUDLDUWARIU-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-methyl-5-prop-2-enylphenyl)propan-2-yl]-2-methyl-6-prop-2-enylphenol Chemical compound C=CCC1=C(O)C(C)=CC(C(C)(C)C=2C=C(CC=C)C(O)=C(C)C=2)=C1 GIGYUDLDUWARIU-UHFFFAOYSA-N 0.000 description 1
TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical group C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
229920000459 Nitrile rubber Polymers 0.000 description 1
239000005062 Polybutadiene Substances 0.000 description 1
239000006087 Silane Coupling Agent Substances 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
PLQFLSNFGHYRJO-UHFFFAOYSA-J [O-]B([O-])[O-].[O-]C(=O)c1cccc2ccccc12.[O-]C(=O)c1cccc2ccccc12.[O-]C(=O)c1cccc2ccccc12.[O-]C(=O)c1cccc2ccccc12.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1 Chemical compound [O-]B([O-])[O-].[O-]C(=O)c1cccc2ccccc12.[O-]C(=O)c1cccc2ccccc12.[O-]C(=O)c1cccc2ccccc12.[O-]C(=O)c1cccc2ccccc12.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1.c1ccc(cc1)[P+](c1ccccc1)(c1ccccc1)c1ccccc1 PLQFLSNFGHYRJO-UHFFFAOYSA-J 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
230000021736 acetylation Effects 0.000 description 1
238000006640 acetylation reaction Methods 0.000 description 1
125000000217 alkyl group Chemical group 0.000 description 1
125000003277 amino group Chemical group 0.000 description 1
150000004982 aromatic amines Chemical class 0.000 description 1
125000003118 aryl group Chemical group 0.000 description 1
FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
239000004841 bisphenol A epoxy resin Substances 0.000 description 1
239000004842 bisphenol F epoxy resin Substances 0.000 description 1
238000009529 body temperature measurement Methods 0.000 description 1
239000006229 carbon black Substances 0.000 description 1
239000004203 carnauba wax Substances 0.000 description 1
235000013869 carnauba wax Nutrition 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000013329 compounding Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
229930003836 cresol Natural products 0.000 description 1
238000013461 design Methods 0.000 description 1
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000012776 electronic material Substances 0.000 description 1
150000002118 epoxides Chemical class 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 1
239000003365 glass fiber Substances 0.000 description 1
125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
238000009413 insulation Methods 0.000 description 1
238000004898 kneading Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
229910000000 metal hydroxide Inorganic materials 0.000 description 1
150000004692 metal hydroxides Chemical class 0.000 description 1
125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
239000012188 paraffin wax Substances 0.000 description 1
XYQYGPLZIMRHFW-UHFFFAOYSA-N phenoxy(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)OC1=CC=CC=C1 XYQYGPLZIMRHFW-UHFFFAOYSA-N 0.000 description 1
125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
150000003018 phosphorus compounds Chemical class 0.000 description 1
229920002857 polybutadiene Polymers 0.000 description 1
239000004848 polyfunctional curative Substances 0.000 description 1
238000006116 polymerization reaction Methods 0.000 description 1
239000011148 porous material Substances 0.000 description 1
150000003242 quaternary ammonium salts Chemical class 0.000 description 1
FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
229920002545 silicone oil Polymers 0.000 description 1
229920002379 silicone rubber Polymers 0.000 description 1
239000004945 silicone rubber Substances 0.000 description 1
238000007711 solidification Methods 0.000 description 1
230000008023 solidification Effects 0.000 description 1
239000002904 solvent Substances 0.000 description 1
238000003756 stirring Methods 0.000 description 1
TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
230000000930 thermomechanical effect Effects 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
238000004448 titration Methods 0.000 description 1
TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
239000002966 varnish Substances 0.000 description 1
UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
230000004580 weight loss Effects 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/21—Urea; Derivatives thereof, e.g. biuret
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
- C08K5/3447—Five-membered rings condensed with carbocyclic rings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Spectroscopy & Molecular Physics (AREA)
Epoxy Resins (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Compositions Of Macromolecular Compounds (AREA)
Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Organic Insulating Materials (AREA)

TW105110535A 2015-04-27 2016-04-01 組成物、環氧樹脂固化劑、環氧樹脂組成物、熱固化性組成物、固化物、半導體裝置以及層間絕緣材料 TWI693250B (zh)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2015-090428		2015-04-27
JP2015090428		2015-04-27
JP2015-255473		2015-12-26
JP2015255473A JP6546527B2 (ja)	2015-04-27	2015-12-26	組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料

Publications (2)

Publication Number	Publication Date
TW201638175A TW201638175A (zh)	2016-11-01
TWI693250B true TWI693250B (zh)	2020-05-11

Family

ID=57488894

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW105110535A TWI693250B (zh)	2015-04-27	2016-04-01	組成物、環氧樹脂固化劑、環氧樹脂組成物、熱固化性組成物、固化物、半導體裝置以及層間絕緣材料

Country Status (4)

Country	Link
JP (1)	JP6546527B2 (ja)
KR (1)	KR20160127665A (ja)
CN (1)	CN106084184B (ja)
TW (1)	TWI693250B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101955754B1 (ko) *	2016-02-16	2019-03-07	삼성에스디아이 주식회사	반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
JP6724817B2 (ja) *	2017-02-24	2020-07-15	信越化学工業株式会社	光半導体用熱硬化性エポキシ樹脂組成物及び半導体装置
JP6867894B2 (ja) *	2017-06-22	2021-05-12	エア・ウォーター株式会社	組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料
JP7272405B2 (ja) *	2018-03-08	2023-05-12	味の素株式会社	樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP6988588B2 (ja) *	2018-03-08	2022-01-05	味の素株式会社	樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
WO2020054601A1 (ja) *	2018-09-12	2020-03-19	日本化薬株式会社	マレイミド樹脂、硬化性樹脂組成物およびその硬化物
WO2024064047A1 (en) *	2022-09-19	2024-03-28	Henkel Ag & Co. Kgaa	Resin composition for die attach film with excellent performance with large die applications

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102167825A (zh) *	2011-03-11	2011-08-31	南京航空航天大学	用于微径拉挤成型工艺的双马来酰亚胺树脂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CH647249A5 (de) *	1981-12-23	1985-01-15	Ciba Geigy Ag	Lagerstabile, waermehaertbare, einen polymerisationskatalysator enthaltende mischungen auf polyimidbasis.
US5037689A (en) *	1989-02-17	1991-08-06	Basf Aktiengesellschaft	Toughened thermosetting structural materials
JPH0597965A (ja)	1991-10-04	1993-04-20	Mitsui Toatsu Chem Inc	エポキシ樹脂組成物
JPH07268074A (ja) *	1994-03-31	1995-10-17	Toagosei Co Ltd	熱硬化性樹脂組成物
JP3349963B2 (ja)	1998-10-21	2002-11-25	日本電気株式会社	難燃性エポキシ樹脂組成物及びそれを用いた半導体装置
JP5030297B2 (ja) *	2007-05-18	2012-09-19	日本化薬株式会社	積層板用樹脂組成物、プリプレグ及び積層板
JP6060541B2 (ja) *	2012-02-23	2017-01-18	日立化成株式会社	半導体封止用熱硬化性樹脂組成物およびそれを用いた半導体装置
JP6192523B2 (ja) *	2013-03-05	2017-09-06	エア・ウォーター株式会社	エポキシ樹脂の硬化剤、製法、およびその用途
CN104530430B (zh) *	2015-01-09	2017-02-01	西北工业大学	一种高韧性阻燃型双马来酰亚胺树脂及其制备方法

2015
- 2015-12-26 JP JP2015255473A patent/JP6546527B2/ja active Active
2016
- 2016-04-01 TW TW105110535A patent/TWI693250B/zh not_active IP Right Cessation
- 2016-04-19 CN CN201610245333.XA patent/CN106084184B/zh not_active Expired - Fee Related
- 2016-04-25 KR KR1020160049928A patent/KR20160127665A/ko not_active Application Discontinuation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102167825A (zh) *	2011-03-11	2011-08-31	南京航空航天大学	用于微径拉挤成型工艺的双马来酰亚胺树脂及其制备方法

Also Published As

Publication number	Publication date
JP6546527B2 (ja)	2019-07-17
KR20160127665A (ko)	2016-11-04
JP2016204626A (ja)	2016-12-08
CN106084184B (zh)	2020-05-01
TW201638175A (zh)	2016-11-01
CN106084184A (zh)	2016-11-09

Legal Events

Date	Code	Title	Description
2024-02-11	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
TWI693250B (zh)	2020-05-11	組成物、環氧樹脂固化劑、環氧樹脂組成物、熱固化性組成物、固化物、半導體裝置以及層間絕緣材料
EP3127933B1 (en)	2018-02-07	Heat-curable epoxy resin composition
JP6192523B2 (ja)	2017-09-06	エポキシ樹脂の硬化剤、製法、およびその用途
JP5079721B2 (ja)	2012-11-21	エポキシ樹脂組成物および成形物
JP6052868B2 (ja)	2016-12-27	エポキシ樹脂の硬化剤、製法、およびその用途
KR102353480B1 (ko)	2022-01-20	열경화성 에폭시 수지 조성물
JP2010229260A (ja)	2010-10-14	エポキシ樹脂組成物および成形物
TW201636356A (zh)	2016-10-16	鏻化合物、含有其的環氧樹脂組成物及使用其製造的半導體裝置
JP5302147B2 (ja)	2013-10-02	封止用エポキシ樹脂組成物および硬化物
TWI826633B (zh)	2023-12-21	酯化合物、樹脂組成物、硬化物及增層膜
JP6867894B2 (ja)	2021-05-12	組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料
JP5946329B2 (ja)	2016-07-06	フェノール系オリゴマー、その製法及び用途
JP6374714B2 (ja)	2018-08-15	エポキシ樹脂組成物、接着剤、硬化物及び電子部材
JP2006249139A (ja)	2006-09-21	半導体封止用エポキシ樹脂組成物
JP2006117881A (ja)	2006-05-11	エポキシ樹脂用添加剤、その組成物及びその用途
JP2013142136A (ja)	2013-07-22	半導体封止用難燃性液状エポキシ樹脂組成物及び半導体装置
JP7295826B2 (ja)	2023-06-21	エポキシ樹脂組成物
TWI835960B (zh)	2024-03-21	密封組成物及半導體裝置
TWI680974B (zh)	2020-01-01	熱固性樹脂組成物、含有該熱固性樹脂組成物之絕緣材、密封材、導電膏、使該熱固性樹脂組成物硬化而成之硬化物、具有該熱固性樹脂組成物之基板材料、該熱固性樹脂組成物含浸於基材而成之預浸體、該預浸體的熱固性樹脂組成物硬化而成之構材以及熱膨脹率的調整方法
KR101724345B1 (ko)	2017-04-07	이미드기 함유 나프톨 수지 제조 방법, 열경화성 수지 조성물 및 그 경화물 그리고 용도
JPH04224859A (ja)	1992-08-14	樹脂組成物
JP2003041118A (ja)	2003-02-13	半導体封止材用樹脂組成物
JP2023066807A (ja)	2023-05-16	エポキシ樹脂組成物および硬化物
TW201805322A (zh)	2018-02-16	多元炔化合物及其製法和用途
JPH05255574A (ja)	1993-10-05	樹脂組成物