TWI680974B - 熱固性樹脂組成物、含有該熱固性樹脂組成物之絕緣材、密封材、導電膏、使該熱固性樹脂組成物硬化而成之硬化物、具有該熱固性樹脂組成物之基板材料、該熱固性樹脂組成物含浸於基材而成之預浸體、該預浸體的熱固性樹脂組成物硬化而成之構材以及熱膨脹率的調整方法 - Google Patents
熱固性樹脂組成物、含有該熱固性樹脂組成物之絕緣材、密封材、導電膏、使該熱固性樹脂組成物硬化而成之硬化物、具有該熱固性樹脂組成物之基板材料、該熱固性樹脂組成物含浸於基材而成之預浸體、該預浸體的熱固性樹脂組成物硬化而成之構材以及熱膨脹率的調整方法 Download PDFInfo
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- TWI680974B TWI680974B TW105106690A TW105106690A TWI680974B TW I680974 B TWI680974 B TW I680974B TW 105106690 A TW105106690 A TW 105106690A TW 105106690 A TW105106690 A TW 105106690A TW I680974 B TWI680974 B TW I680974B
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- resin composition
- thermosetting resin
- thermal expansion
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- PESXPUCWMKUMSI-UHFFFAOYSA-N 3-[2-(dimethylcarbamoylamino)phenyl]-1,1-dimethylurea Chemical compound CN(C)C(=O)NC1=CC=CC=C1NC(=O)N(C)C PESXPUCWMKUMSI-UHFFFAOYSA-N 0.000 description 1
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- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
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- KMJZIGLLNWFDIG-UHFFFAOYSA-N buta-1,3-diene;toluene Chemical compound C=CC=C.CC1=CC=CC=C1 KMJZIGLLNWFDIG-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
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- LVLZXBIWQHFREA-UHFFFAOYSA-N phenol;phosphane Chemical compound [PH4+].[O-]C1=CC=CC=C1 LVLZXBIWQHFREA-UHFFFAOYSA-N 0.000 description 1
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- 125000001424 substituent group Chemical group 0.000 description 1
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- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
- C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
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Abstract
本發明提供一種熱膨脹性調整劑,係對抑制加熱所致電路基板之變形有效,可降低絕緣樹脂層等所用之熱固性樹脂組成物之硬化物之線熱膨脹係數。藉由調配含有下述式(1)之乙炔脲衍生物化合物之熱膨脹性調整劑,可降低熱固性樹脂組成物硬化而成之硬化物之線熱膨脹係數,因此可提供熱所致變形較小之構材。
Description
本發明係關於一種熱膨脹性調整劑、作為熱膨脹性調整劑之用途、熱固性樹脂組成物、含有該熱固性樹脂組成物之絕緣材、密封材、導電膏、使該熱固性樹脂組成物硬化而成之硬化物、具有該熱固性樹脂組成物之基板材料、該熱固性樹脂組成物含浸於基材而成之預浸體、該預浸體的熱固性樹脂組成物硬化而成之構材、熱膨脹率的調整方法、以及使用該調整方法所製造的構材。
於以電氣電子產業為中心之各種領域中,隨著追求電子機器之小型化、多功能化、通信速度之高速化等,係要求電子機器中所用之電路基板進一步高密度化。為了響應此種高密度化之要求,係謀求電路基板之多層化。
多層化之電路基板例如以如下方式製作:在包含電氣絕緣層與形成於其表面之導體層之內層基板上,積層電氣絕緣層,在前述電氣絕緣層上形成導體,進一步重複於電氣絕緣層上形成導體。為了響應電路基板之多層化之要求,提出有各種熱固性樹脂組成物(專利文獻1~3)。
專利文獻1中記載有為了解決將無機填充材高填充而產生之問題,而使用含有特定環氧樹脂、酚樹脂、順丁烯二醯亞胺化合物及無機填充材之樹脂組成物。
專利文獻2中,作為可適宜用於電路基板之絕緣層形成之樹脂組成物,係記載有含有特定環氧樹脂、硬化劑、無機填充劑而成者。
專利文獻3中記載有為了提供低熱膨脹性、翹曲特性優異之預浸體等,係將預浸體中所含之熱固性樹脂組成物層以含有特定順丁烯二醯亞胺化合物、特定矽氧烷二胺、及特定具有酸性取代基之胺化合物的熱固性樹脂組成物而構成。
[先前技術文獻]
[專利文獻]
專利文獻1:日本專利特開2014-185221號公報
專利文獻2:日本專利特開2011-89038號公報
專利文獻3:日本專利特開2014-24927號公報
專利文獻1~3所揭示之熱固性樹脂組成物係為了使線熱膨脹係數下降而使用無機填充劑。然而,調配無機填充劑會成為使熱固性樹脂組成物之成形容易度(以下稱為「成形性」)下降的原因。
專利文獻3記載有使用特定之熱固性樹脂組成物使線熱膨脹率係數下降。然而,該文獻中所記載之熱固性樹脂組成物係含浸於基材而使用,並非使僅由熱固性樹脂組成物形成之硬化物之線熱膨脹係數下降。
本發明之目的在於提供一種可降低使熱固性樹脂組成物硬化而成之硬化物之線熱膨脹係數的熱膨脹性調整劑、作為熱膨脹性調整劑之用途、熱固性樹脂組成物、含有該熱固性樹脂組成物之密封材及導電膏、使該熱固性樹脂組成物硬化而成之硬化物、具有該熱固性樹脂組成物之基板材料、使該熱固性樹脂組成物含浸於基材而成之預浸體、使該預浸體的熱固性樹脂組成物硬化而成之構材、熱膨脹率的調整方法、以及使用該調整方法所製造的構材。
為了解決上述課題而提供之本發明如下所述。
(1)一種熱膨脹性調整劑,係含有下述式(1)之乙炔脲衍生物化合物。
(2)一種作為熱膨脹性調整劑之用途,係上述式(1)之乙炔脲衍生物化合物作為熱膨脹性調整劑之用途。
(3)一種熱固性樹脂組成物,係含有如(1)所記載之熱膨脹性調整劑。
(4)一種絕緣材,係含有如(3)所記載之熱固性樹脂組成物。
(5)一種密封材,係含有如(3)所記載之熱固性樹脂組成物。
(6)一種導電膏,係含有如(3)所記載之熱固性樹脂組成物。
(7)一種硬化物,係使如(3)所記載之熱固性樹脂組成物硬化而成。
(8)如(7)所記載之硬化物,其中線熱膨脹係數為40ppm/℃以下。
(9)如(7)所記載之硬化物,其中玻璃轉移溫度為180℃以上。
(10)一種基板材料,係具有如(3)所記載之熱固性樹脂組成物。
(11)一種預浸體,係如(3)所記載之熱固性樹脂組成物含浸於基材而成。
(12)一種構材,係如(5)所記載之密封材、如(6)所記載之導電膏、如(10)所記載之基板材料之前述熱固性樹脂組成物、或如(11)所記載之預浸體之前述熱固性樹脂組成物硬化而成。
(13)一種線熱膨脹係數之調整方法,係具備:測定步驟,係測定如(3)所記載之熱固性樹脂組成物硬化而成之構材之線熱膨脹係數;以及調整步驟,係基於前述測定之線熱膨脹係數,調整前述熱固性樹脂組成物之使用量及前述熱固性樹脂組成物中之熱膨脹率調整劑之含量之至少一個。
(14)如(12)所記載之構材,其中前述熱固性樹脂組成物之使用量或前述熱膨脹率調整劑之含量係使用如(13)所記載之線熱膨脹係數之調整方法而設定。
根據本發明可降低硬化性樹脂硬化而形成之硬化物之線熱膨脹係數。因此可抑制構成電路基板等之硬化物所構成之構材與其他構材之間的線熱膨脹係數差,藉此抑制熱應力所致電路基板等之變形。
以下說明本發明之實施形態。
本發明之熱膨脹性調整劑含有下述式(1)之乙炔脲衍生物化合物。
發明者們發現:有關於熱固性樹脂組成物中以式(1)所示之乙炔脲衍生物化合物(以下適當稱為「乙炔脲衍生物化合物」),藉由使其自身硬化,而可獲得線熱膨脹係數較低之硬化物,且若調配於熱固性樹脂組成物中,則使熱固性樹脂組成物硬化而成之硬化物之線熱膨脹係數變小。即,發明者們藉由發現上述乙炔脲衍生物化合物之新性質,而想到含有乙炔脲衍生物化合物之熱膨脹性調整劑之本發明。
本實施形態之熱固性樹脂組成物由於含有乙炔脲衍生物化合物,故藉由熱固性樹脂組成物硬化而成之硬化物而可形成線熱膨脹率較低之構材。
本實施形態之含有乙炔脲衍生物化合物之熱膨脹性調整劑,係包括含有乙炔脲衍生物化合物作為其成分之一部分者、及僅由乙炔脲衍生物化合物所構成者。而且,含有熱膨脹性調整劑之熱固性樹脂組成物亦同樣地,包括含有熱膨脹性調整劑作為其成分之一部分者、及僅由熱膨脹性調整劑所構成者。
本實施形態之熱固性樹脂組成物含有熱固性樹脂。作為熱固性樹脂之例,可列舉環氧樹脂。環氧樹脂之種類並無特別限定,例如6可列舉:雙酚A型環氧樹脂、雙酚F型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、苯酚酚醛清漆
型環氧樹脂、聯苯型環氧樹脂、苯酚聯苯基芳烷基型環氧樹脂、藉由苯酚、萘酚等與伸苯二甲基鍵結之芳烷基樹脂之環氧化物、二環戊二烯型環氧樹脂、二羥基萘型環氧樹脂、三酚基甲烷型環氧樹脂等縮水甘油醚型環氧樹脂、縮水甘油酯型環氧樹脂、縮水甘油胺型環氧樹脂等於一分子中具有2個以上環氧基之環氧化合物。該等環氧樹脂可單獨使用,亦可併用2種以上。
於環氧樹脂硬化時,較佳為併用硬化促進劑。作為硬化促進劑,可使用以酚系硬化劑使環氧樹脂硬化之公知硬化促進劑,例如可列舉:三級胺化合物、四級銨鹽、咪唑類、脲化合物、膦化合物、鏻鹽等。更具體而言可列舉:三乙胺、三乙二胺、苄基二甲基胺、2,4,6-三(二甲基胺基甲基)苯酚、1,8-二氮雙環(5,4,0)十一烯-7等三級胺化合物;2-甲基咪唑、2,4-二甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑等咪唑類;3-苯基-1,1-二甲基脲、3-(鄰甲基苯基)-1,1-二甲基脲、3-(對甲基苯基)-1,1-二甲基脲、1,1'-伸苯基雙(3,3-二甲基脲)、1,1'-(4-甲基-間伸苯基)-雙(3,3-二甲基脲)等脲化合物;三苯基膦、三丁基膦、三(對甲基苯基)膦、三(壬基苯基)膦等膦化合物;三苯基鏻酚鹽、四苯基鏻四苯基硼酸鹽、四苯基鏻四萘甲酸硼酸鹽等鏻鹽。
乙炔脲衍生物化合物為熱固性樹脂組成物之硬化物之熱膨脹調整劑且亦為環氧樹脂。熱固性樹脂組成物可含有乙炔脲衍生物化合物及其他環氧樹脂等作為熱固性樹脂,亦可僅含有乙炔脲衍生物化合物作為熱固性樹脂。
藉由使含有乙炔脲衍生物化合物之熱固性樹脂組成物硬化,而可形成各種形狀之硬化物。因此,若使用本發明之熱固性樹脂組成物,則可容易地形成具備特定線熱膨脹性係數之構材。
藉由在熱固性樹脂組成物中調配乙炔脲衍生物化合物,可獲得線熱膨脹係數較小之硬化物。藉由將上述乙炔脲衍生物化合物調配於熱固性樹脂組成物中,可獲得線熱膨脹係數為40ppm/℃以下、進一步為25ppm/℃以下之硬化物。
為了減小熱固性樹脂組成物硬化而成之硬化物之線熱膨脹係數,以往係使用有無機填充劑。本實施形態之熱固性樹脂組成物係含有包含乙炔脲衍生物化合物之熱膨脹性調整劑。因此,可減少為了減小硬化物之線熱膨脹係數所需之無機填充劑之量。進一步於不調配無機填充劑之情況下亦可形成線熱膨脹係數較小之硬化物。
硬化物之玻璃轉移溫度較佳為180℃以上,更佳為200℃以上,進一步較佳為250℃以上。
藉由將玻璃轉移溫度設為上述範圍內,可使包含硬化物之構材之剛性、耐熱性變得良好。玻璃轉移溫度係指使用示差熱分析法(TMA(熱機械分析法,Thermomechanical Analysis))自40℃以每分鐘10℃升溫至300℃進行測定所得之值。
熱固性樹脂組成物中之乙炔脲衍生物化合物之調配量係根據硬化物所要求之線熱膨脹係數而調整即可,為了獲得作為熱膨脹性調整劑之效果,於熱固性樹脂組成物100質量%中較佳為調配5質量%以上,更佳為調配20質量%以上。
本實施形態之熱固性樹脂組成物較佳為作為絕緣材之用途。例如可作為密封材(底部填充材)、導電膏、成形材、各種黏合劑、嵌裝(mounting)材、塗佈材、積層材等而使用。
所謂密封材係指藉由封堵間隙而防止構成電路基板之零件接觸外部空氣者。以防止焊料附著於多餘部分為目的而使用之阻焊劑亦包含於密封材。
所謂導電膏係指代替焊料而使用之具有導電性之膏狀材料,通常使用將低溫熔融金屬粒子分散於熱固性樹脂組成物中而成之樹脂組成物。
本實施形態之熱固性樹脂組成物可作為具有熱固性樹脂組成物之基板材料、或作為熱固性樹脂組成物含浸於基材而成之預浸體而使用。藉由使該等基板材料及預浸體之熱固性樹脂組成物硬化,可製作線熱膨脹係數較低之構材。所得之構材係用作構成可撓性基板或剛性基板之構材。
具有熱固性樹脂組成物之基板材料係指使用熱固性樹脂組成物作為其原料或構成要素者。作為此種基板材料,例如可列舉將熱固性樹脂組成物製成膜狀之絕緣樹脂片等膜狀基板材料、具備含有熱固性樹脂組成物之樹脂之附有樹脂的銅箔(Resin Coated Copper,RCC)等。
所謂預浸體係指將本實施形態之熱固性樹脂組成物製成清漆,含浸於基材並將其加熱或乾燥而成為半硬化狀態者。作為基材,例如可使用玻璃布、碳纖維等無機纖維;聚醯胺、聚醯亞胺、聚酯等有機纖維。該等可單獨使用或組合複數種而使用。
就成為高耐熱、阻燃性優異者之觀點而言,本實施形態之熱固性樹脂組成物亦可含有聚順丁烯二醯亞胺化合物及酚化合物。作為聚順丁烯二醯亞胺化合物,較佳為於1分子中具有2個以上順丁烯二醯亞胺基者。另外,作為酚化合物,較佳為於分子中至少具有2個OH基者。作為上述聚順丁烯二醯亞胺化合物及酚化合物具體而言可使用國際公開編號WO2012/057171中所記載者。
本實施形態之熱固性樹脂組成物中,可視需要添加硬化劑、無機填充劑、偶合劑、脫模劑、著色劑、阻燃劑、低應力劑等,而且,亦可將該等預先反應而使用。
作為無機填充劑之例,可列舉非晶性二氧化矽、結晶性二氧化矽、氧化鋁、玻璃、矽酸鈣、菱鎂礦、黏土、滑石、雲母、氧化鎂、硫酸鋇等,尤佳為非晶性二氧化矽、結晶性二氧化矽、硫酸鋇。而且,於欲維持優異之成形性並提高無機填充劑之調配量時,較佳為使用可細密填充之粒度分佈較廣之球形無機填充劑。
作為偶合劑之例,可例示巰基矽烷系、乙烯基矽烷系、胺基矽烷系、環氧矽烷系等矽烷偶合劑或鈦偶合劑,作為脫模劑之例,可例示巴西棕櫚蠟(carnauba wax)、石蠟等,另外,作為著色劑,可例示碳黑等。作為阻燃劑之例,可列舉磷化合物、金屬氫氧化物等,作為低應力劑
之例,可列舉矽橡膠、改質腈橡膠、改質丁二烯橡膠、改質矽油等。
使本實施形態之熱固性樹脂組成物硬化而成之硬化物,係使用乙炔脲衍生物化合物作為熱膨脹性調整劑,故可形成無機填充劑含量較少之構材。例如,相對於包含硬化物之構材之100質量%而可將無機填充劑之含量設為80質量%以下,進一步可設為50質量%以下。藉由減少熱固性樹脂組成物中之無機填充劑之含量,可抑制無機填充劑所引起之成形性下降。
本發明亦可作為線熱膨脹係數(熱膨脹率)之調整方法而實施。本實施形態之調整方法具備:測定步驟,係測定上述本實施形態之熱固性樹脂組成物硬化而成之構材之線熱膨脹係數;以及調整步驟,係基於前述測定之線熱膨脹係數,調整前述熱固性樹脂組成物之使用量及前述熱固性樹脂組成物中之熱膨脹率調整劑之含量之至少一個。
在調整步驟中,基於測定步驟中測定之線熱膨脹係數之測定值,調整熱固性樹脂組成物之使用量及熱固性樹脂組成物中之熱膨脹率調整劑之含量之至少一個。藉由該調整步驟,可使構材之線熱膨脹係數接近特定值。因此,視需要重複測定步驟與調整步驟,藉此可調整線熱膨脹係數而獲得具備特定線熱膨脹係數之構材。
根據上述構材之線熱膨脹係數之調整方法,可藉由調整步驟調整熱固性樹脂組成物之使用量或熱固性樹脂組成物中之熱膨脹率調整劑之含量,而容易地獲得包含特定線熱膨脹係數之硬化物之構材。
作為包含熱固性樹脂組成物硬化而成之硬化物之構材,可列舉:將本實施形態之熱固性樹脂組成物製成清漆並加熱使其硬化而成之樹脂膜、將預浸體加熱使其硬化而成者。清漆中可使用丙酮、甲基乙基酮、二甲基乙醯胺、N-甲基-2-吡咯啶酮等通用者作為樹脂成分之溶劑,溶劑之調配量並無特別限定。
[實施例]
以下以實施例更具體地說明本發明,但本發明並不限定於該等。
(評價方法)
以下實施例及比較例之性能評價中所使用之試驗方法如下述。
(1)玻璃轉移溫度
於實施例所得預浸體一片之上下部分配置Sepanium(鋁箔表面經耐熱脫模皮膜處理之脫模劑),於4MPa、180℃~230℃加熱120分鐘使其熱硬化。測定所得試樣
(樣品)之玻璃轉移溫度。測定裝置、測定條件等如下所述。
測定機器:Rigaku公司製造之「TMA8310evo」。
環境:氮氣中。
測定溫度:30℃~300℃。
升溫速度:10℃/min。
負荷:47mN。
(2)線熱膨脹係數
樹脂膜係於該狀態下、預浸體係於一片之上下部分配置Sepanium,且在4MPa、180℃~230℃加熱120分鐘使其熱硬化。測定所得成形品之線熱膨脹係數。測定裝置、測定條件等如下所述。
測定機器:Rigaku公司製造之「TMA8310evo」。
環境:氮氣中。
測定溫度:50℃~100℃。
升溫速度:10℃/min。
負荷:47mN。
實施例及比較例中所使用原料之詳情如下述。
(1)乙炔脲衍生物:1,3,4,6-四縮水甘油基乙炔脲,TG-G(商品名,四國化成股份有限公司製造)
(2)環氧樹脂A:雙酚環氧樹脂,JER828EL(商品名,三菱化學股份有限公司製造)
環氧樹脂B:聯苯芳烷基環氧樹脂,NC3000(商品名,日本化藥股份有限公司製造)
(3)雙順丁烯二醯亞胺化合物A:苯甲烷順丁烯二醯亞胺,BMI-2000(商品名,大和化成工業股份有限公司製造)
(4)雙順丁烯二醯亞胺化合物B:4,4'-二苯甲烷雙順丁烯二醯亞胺,BMI-1000(商品名,大和化成工業股份有限公司製造)
(5)酚樹脂:萘酚芳烷基樹脂,SN-485(商品名,新日鐵住金化學股份有限公司製造)
(6)硬化促進劑:U-CAT 3513N(商品名,三洋化成工業股份有限公司製造)
(7)反應稀釋劑:NEOALLYL G(商品名,Daiso股份有限公司製造)
(合成例1)
(清漆(I)之合成)
於設置有攪拌機、溫度計、冷卻管之圓底燒瓶加入4,4'-二苯甲烷雙順丁烯二醯亞胺(BMI-1000)270質量分、萘酚芳烷基樹脂(SN-485)82質量分、聯苯芳烷基環氧樹脂(NC-3000)221質量分、甲基乙基酮(MEK)120質量分,於內溫達到80℃後混合攪拌2小時。其後,添加反應性稀釋劑(烯丙基縮水甘油醚)27質量分、N-甲基-2-吡咯啶酮(NMP)12質量分,於80℃保持4小時。
其次,添加28質量分之NMP,進一步於80℃保持18小時。添加200質量分之MEK、40質量分之NMP並攪拌2小時,而獲得均勻溶解狀態之改質聚醯亞胺樹脂組成物之清漆(I)。
(實施例1)
將30質量分之TG-G與70質量分之清漆(I)混合,且添加0.2質量分作為硬化促進劑之U-CAT3513N,於150℃至230℃硬化6小時而獲得薄膜狀之樹脂膜。TG-G用溶劑係使用20質量分之甲基乙基酮。
(實施例2)
將實施例1之TG-G設為20質量分,將70質量分之清漆(I)設為78.4質量分之清漆(I)與1.6質量分之JER828EL混合而成者,且將TG-G用溶劑之甲基乙基酮設為15質量分,除此以外,利用與實施例1相同之方法獲得薄膜狀之樹脂膜。
(比較例1)
代替30質量分之TG-G及70質量分之清漆(I),而使用100質量分之清漆(I),且不使用TG-G用溶劑之甲基乙基酮,除此以外,利用與實施例1相同之方法獲得薄膜狀之樹脂膜。
(比較例2)
代替30質量分之TG-G及70質量分之清漆(I),而使用100質量分之JER828EL及115.0質量分之SN-485,除此以外,利用與實施例1相同之方法獲得薄膜狀之樹脂膜。
將實施例1、2及比較例1、2之結果示於以下之表。
相較於未調配有TG-G之比較例1及2,於熱固性樹脂組成物調配有TG-G之實施例1及2作為硬化物之薄膜狀之膜之線熱膨脹係數較小。根據該等結果可知TG-G具有減小硬化物之線熱膨脹係數之性質,且作為熱固性樹脂組成物之熱膨脹調整劑係有用的。
(實施例3)
於100質量分之TG-G添加0.2質量分作為硬化促進劑之U-CAT3513N,於150℃至230℃硬化6小時而獲得薄膜狀之樹脂膜。
(實施例4)
將100質量分之TG-G設為30質量分之TG-G及70質量分之BMI-2000,添加64質量分之SN485,且TG-G用溶劑使用110質量分之二甲基乙醯胺,除此以外,利用與實施例3相同之方法獲得樹脂膜。
(實施例5)
將SN485設為47質量分,除此以外,利用與實施例4相同之方法獲得樹脂膜。
(實施例6)
將70質量分之BMI-2000設為70質量分之BMI-1000,除此以外,利用與實施例4相同之方法獲得樹脂膜。
(實施例7)
將70質量分之BMI-2000設為70質量分之BMI-1000,除此以外,利用與實施例5相同之方法獲得樹脂膜。
可知藉由僅使用TG-G作為熱固性樹脂組成物中之熱固性樹脂,且使用TG-G作為環氧樹脂之主成分,而可獲得線熱膨脹係數較小之薄膜狀樹脂膜作為熱固性樹脂組成物之硬化物。
(實施例8)
於10質量分之TG-G添加88.2質量分之清漆(I)、1.8質量分之JER828EL、7質量分之甲基乙基酮、0.5質量分作為硬化促進劑之U-CAT3513N、0.01質量分之添加劑(調平劑)、65質量分之無機填充劑(球狀二氧化矽)並均勻攪拌,而調製樹脂清漆。
使其含浸於玻璃布(旭化成電子材料股份有限公司製造之2319),於230℃乾燥2小時,而獲得預浸體。將兩片該預浸體重疊,進一步於其上下之最外層配置18μm之銅箔,於2MPa~4MPa之壓力且180℃~230℃、120分鐘之加熱條件下使其成形而獲得覆銅積層板。
(實施例9)
將10質量分之TG-G、88.2質量分之清漆(I)、1.8質量分之JER828EL及7質量分之甲基乙基酮設為20質
量分之TG-G、78.4質量分之清漆(I)、1.6質量分之JER828EL、13質量分之甲基乙基酮,除此以外,利用與實施例8相同之方法獲得覆銅積層板。
(實施例10)
將10質量分之TG-G、88.2質量分之清漆(I)、1.8質量分之JER828EL及7質量分之甲基乙基酮設為30質量分之TG-G、68.6質量分之清漆(I)、1.4質量分之JER828EL及20質量分之甲基乙基酮,除此以外,利用與實施例8相同之方法獲得覆銅積層板。
將以上述方式製成之實施例8~10之預浸體,利用實施例說明最初之評價方法所記載之方法測定玻璃轉移溫度及線熱膨脹係數。將結果示於下表。
根據上述結果可知,藉由增加TG-G之調配量,而使預浸體之熱固性樹脂組成物硬化所得之硬化物之線熱膨脹係數變小。
(產業上之可利用性)
本發明提供之熱膨脹性調整劑可用於調整例如用作電路基板之材料等之熱固性樹脂組成物之硬化物的熱膨脹性,而獲得所希望之線熱膨脹係數之構材。
本發明提供之熱固性樹脂組成物係可提供線熱膨脹係數較低之優異硬化物之組成物,具體一例為包含環氧樹脂之熱固性樹脂組成物。
Claims (11)
- 一種絕緣材,係含有如請求項1所記載之熱固性樹脂組成物。
- 一種密封材,係含有如請求項1所記載之熱固性樹脂組成物。
- 一種導電膏,係含有如請求項1所記載之熱固性樹脂組成物。
- 一種硬化物,係使如請求項1所記載之熱固性樹脂組成物硬化而成。
- 如請求項5所記載之硬化物,其中線熱膨脹係數為40ppm/℃以下。
- 如請求項5所記載之硬化物,其中玻璃轉移溫度為180℃以上。
- 一種基板材料,係具有如請求項1所記載之熱固性樹脂組成物。
- 一種預浸體,係使如請求項1所記載之熱固性樹脂組成物含浸於基材而成。
- 一種構材,係使如請求項3所記載之密封材、如請求項4所記載之導電膏、如請求項8所記載之基板材料之前述熱固性樹脂組成物、或如請求項9所記載之預浸體之前述熱固性樹脂組成物硬化而成。
- 一種構材之線熱膨脹係數之調整方法,係具備:測定步驟,係測定如請求項1所記載之熱固性樹脂組成物硬化而成之構材之線熱膨脹係數;以及調整步驟,係基於前述測定之線熱膨脹係數,而調整前述熱固性樹脂組成物之使用量及前述熱固性樹脂組成物中之熱膨脹率調整劑之含量之至少一個。
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