TWI689357B - Substrate cleaning equipment and substrate cleaning method - Google Patents
Substrate cleaning equipment and substrate cleaning method Download PDFInfo
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- TWI689357B TWI689357B TW107105261A TW107105261A TWI689357B TW I689357 B TWI689357 B TW I689357B TW 107105261 A TW107105261 A TW 107105261A TW 107105261 A TW107105261 A TW 107105261A TW I689357 B TWI689357 B TW I689357B
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Abstract
本發明涉及一種基板清洗設備以及基板清洗方法，該基板清洗設備包含有一機座、一傳輸裝置、一溼式清潔組及一乾式清潔組所組成，其中溼式清潔組與乾式清潔組分別具有連續性無塵布條，而利用傳輸裝置夾掣與移動一基板，令基板可相對溼式清潔組與乾式清潔組的擦拭組，供分別以無塵布條進行基板表面的噴溼擦拭及擦拭，而能迅速、且有效的去除表面附著的污染物，再者本發明可進行兩階段清潔，其能在噴溼清潔後擦乾水份，因此不會殘留清潔水痕，有助於提升清潔品質。 The invention relates to a substrate cleaning device and a substrate cleaning method. The substrate cleaning device comprises a base, a transmission device, a wet cleaning group and a dry cleaning group, wherein the wet cleaning group and the dry cleaning group have continuous Dust-free cloth strips, and the transport device is used to clamp and move a substrate so that the substrate can be wiped with the wet cleaning group and the dry cleaning group, for the wet cleaning and wiping of the substrate surface with the dust-free cloth strip, It can quickly and effectively remove contaminants attached to the surface. Furthermore, the present invention can perform two-stage cleaning, which can wipe off the water after spray cleaning, so there will be no residual cleaning water marks, which helps to improve the cleaning quality. .
Description
本發明係隸屬一種基板之清洗技術，具體而言係一種以基板清洗設備以及基板清洗方法，藉以能快速、且有效的清理基板表面。 The invention belongs to a substrate cleaning technology, specifically a substrate cleaning device and a substrate cleaning method, so that the substrate surface can be cleaned quickly and effectively.
按，半導體基板，如晶圓、面板、光罩等，其表面潔淨度直接影響到製程與產品的良率，因此在儲存及製程中要不斷的檢查及清潔，以保持其潔淨度。以其中光罩而言，由於積體電路的線徑已發展至10奈米以下，因此製程中的任何污染物都可能直接影響到相對製程或產品的良率，而用于晶圓(Wafer)表面形成積體電路的所使用的光罩(Mask)是微影製程中不可或缺的元件之一，如第一圖所示之光罩(100)剖面圖來看，該光罩(100)包含有一板材(110)、一框架(120)及一保護膜(150)【Pellicle】，其中板材(110)係透光材質，例如石英或玻璃，而板材(110)具有兩平行間隔的表面(111、112)，其中一表面(111)中央具有一積體電路之圖形層(115)【Pattern】，又該框架(120)設於該表面(111)、且包圍該圖形層(115)，一般框架(120)的材質是陽極處理過的鋁合金，另該保護膜(150)係固定於框架(120)上、且其表面(151)與板材(110)表面(111)相互平行間隔，該保護膜(150)用來避免圖形層(115)遭受刮傷或 污染。 Press, semiconductor substrates, such as wafers, panels, photomasks, etc., the surface cleanliness directly affects the process and product yield, so in storage and manufacturing processes must be constantly checked and cleaned to maintain its cleanliness. In terms of the photomask, since the wire diameter of the integrated circuit has been developed below 10 nanometers, any contaminants in the process may directly affect the relative process or product yield, and are used for wafers (Wafer) The mask used to form the integrated circuit on the surface is one of the indispensable elements in the lithography process. As shown in the cross-sectional view of the mask (100) shown in the first figure, the mask (100) It includes a plate (110), a frame (120) and a protective film (150) [Pellicle]. The plate (110) is a light-transmitting material, such as quartz or glass, and the plate (110) has two parallel spaced surfaces ( 111, 112), wherein a surface (111) has a graphics layer (115) [Pattern] of an integrated circuit in the center, and the frame (120) is disposed on the surface (111) and surrounds the graphics layer (115), Generally, the material of the frame (120) is anodized aluminum alloy, and the protective film (150) is fixed on the frame (120), and the surface (151) and the surface (111) of the plate (110) are parallel to each other. The protective film (150) is used to prevent the graphic layer (115) from being scratched or Pollution.
然而，光罩污染問題是一直存在的，不論是光罩(100)中的板材(110)表面(112)或保護膜(150)表面(151)會附著污染物，這些污染物包含附著於表面的微粒、化學物質等，若受汙染之光罩用於半導體微影製程時，會於晶圓上產生相對應的缺陷(Defect)。而傳統光罩(100)板材(110)之表面(112)的清洗方法【非指保護膜(150)表面(151)】，係以大量的清洗液針對板材(110)之表面(112)作一潔淨處理，但過多的清洗液，極易造成人員因吸入或直接接觸該化學物質而不適，且清洗液清潔後於置乾時易生成水痕，不僅會影響清潔板材(110)的效率，也會破壞板材(110)表面(112)的潔淨度。再者保護膜(150)所使用的黏膠為酯類結構(RCOOR)x，如聚丙烯酸酯的高分子結構，使用過量的硫酸與過氧化氫溶液的清洗液時，(RCOOR)x會水解成可流動但不溶於水的膠態物質(RCOOH)x，且(RCOOH)x可能造成光罩圖案上的缺陷與光罩(100)的報廢； 換言之，現有的光罩(100)板材(110)之清潔上存在有清洗效果與效率不彰的問題，對板材(110)清洗工作極大的困擾與不便，如何解決前述問題，係業界的重要課題。 However, the problem of photomask contamination has always existed, whether it is the plate (110) surface (112) or the protective film (150) surface (151) in the photomask (100), there will be contaminants attached to it. If the contaminated photomask is used in the semiconductor lithography process, the corresponding particles and chemicals will produce corresponding defects on the wafer (Defect). The conventional cleaning method of the surface (112) of the photomask (100) plate (110) [not referring to the surface (151) of the protective film (150)] is to use a large amount of cleaning solution for the surface (112) of the plate (110) A clean treatment, but too much cleaning fluid, it is easy to cause people to be uncomfortable due to inhalation or direct contact with the chemical substance, and the cleaning fluid is prone to generate water marks when it is dried, which not only affects the efficiency of cleaning the plate (110), It also destroys the cleanliness of the surface (112) of the board (110). In addition, the adhesive used in the protective film (150) is an ester structure (RCOOR) x, such as a polymer structure of polyacrylate. When using an excessive amount of sulfuric acid and hydrogen peroxide solution cleaning solution, (RCOOR) x will hydrolyze Into a flowable but water-insoluble colloidal substance (RCOOH) x, and (RCOOH) x may cause defects on the mask pattern and the scrap of the mask (100); In other words, the cleaning of the existing photomask (100) plate (110) has problems of poor cleaning effect and efficiency, which is extremely troublesome and inconvenient for the cleaning work of the plate (110). How to solve the aforementioned problems is an important issue in the industry .
有鑑於此，本發明即基於上述缺失深入探討，並藉由本發明人多年從事相關開發的經驗，而積極尋求解決之道，經不斷努力之研究與發展，終於成功的創作出一種基板清洗設備以及基板清洗方法。 In view of this, the present invention is based on the above-mentioned lack of in-depth discussion, and through the inventors’ years of experience in related development, and actively seeking solutions, after continuous research and development, finally successfully created a substrate cleaning equipment and Substrate cleaning method.
因此，本發明之主要目的係在提供一種之基板清洗 設備以及基板清洗方法，藉以能迅速、且有效的進行基板表面清潔，並可迅速且有效的縮短清潔時間。 Therefore, the main purpose of the present invention is to provide a substrate cleaning The equipment and the substrate cleaning method can quickly and effectively clean the substrate surface, and can quickly and effectively shorten the cleaning time.
又，本發明之次一主要目的在於提供一基板清洗設備以及基板清洗方法，其可利用給水溼擦與乾擦之兩階段清潔，可有效清洗基板表面，且清洗後不會殘留水痕，有助於提升清潔效率。 In addition, the next main object of the present invention is to provide a substrate cleaning equipment and a substrate cleaning method, which can use two stages of cleaning: wet wiping and dry wiping of water supply, which can effectively clean the surface of the substrate, and no water marks remain after cleaning. Helps improve cleaning efficiency.
為此，本發明主要係透過下列的技術手段，來具體實現上述的各項目的與效能，用以清潔一基板，上述基板包含有至少一待清洗表面，該基板清洗設備包含有：一機座；一傳輸裝置，其設於機座上，該傳輸裝置具有一可移動之夾持機構，該夾持機構可夾掣上述基板，供該基板待清洗表面完全露出；一溼式清潔組，其設於機座上，該溼式清潔組包含有一具連續無塵布條之擦拭組及一給水泵浦，該擦拭組具有一可作動無塵布條接觸上述基板待清洗表面之觸抵元件，且給水泵浦可提供觸抵元件清潔液通過無塵布條接觸基板區域，藉以使基板與觸抵元件相對位移，供進行噴溼擦拭以去除污染物；一乾式清潔組，其設於機座上，該乾式清潔組包含有一具連續無塵布條之擦拭組，該擦拭組具有一可作動無塵布條接觸上述基板待清洗表面之觸抵元件，藉以使基板與觸抵元件相對位移，供進行擦拭以去除污染物及水痕。 To this end, the present invention mainly implements the above-mentioned objects and performances through the following technical means for cleaning a substrate, the substrate includes at least one surface to be cleaned, and the substrate cleaning equipment includes: a stand A transmission device, which is installed on the machine base, the transmission device has a movable clamping mechanism, the clamping mechanism can clamp the substrate, for the substrate to be cleaned surface is completely exposed; a wet cleaning group, which Set on the machine base, the wet cleaning group includes a wiping group with a continuous dust-free cloth strip and a water supply pump. The wiping group has a contact element that can move the dust-free cloth strip to contact the surface of the substrate to be cleaned, And the feed water pump can provide the contact element cleaning liquid to contact the substrate area through the dust-free cloth strip, so that the substrate and the contact element are relatively displaced for wet wiping to remove contaminants; a dry cleaning group, which is located on the base In the above, the dry cleaning group includes a wiping group with a continuous dust-free cloth strip. The wiping group has a contact element that can move the dust-free cloth strip to contact the surface of the substrate to be cleaned, so that the substrate and the contact element are relatively displaced. For wiping to remove contaminants and water marks.
藉此，透過前述技術手段的具體實現，使本發明之基板清洗設備利用傳輸裝置夾掣及移動該基板，令基板相對溼式 清潔組與乾式清潔組的擦拭組，分別進行基板待清洗表面的噴溼擦拭及吹氣擦拭，而能迅速、且有效的去除表面附著的污染物，利用本發明可進行兩階段清潔之特性，其能在噴溼清潔後擦乾水份，因此不會殘留清潔水痕，有助於提升清潔品質，更重要的是由於其係以含浸清潔液之溼式清潔組採直接擦拭方式去除污染物，不需使用到大量有機清潔液，不會產生大量待處理廢液，可達維持環境安全性，且降低處理成本之功效，故可大幅增進其實用性，而能增加其附加價值，並能提高其經濟效益。 In this way, through the specific implementation of the foregoing technical means, the substrate cleaning device of the present invention uses the transport device to grip and move the substrate, so that the substrate is relatively wet The wiping group of the cleaning group and the dry type cleaning group respectively performs the wet wiping and blowing wiping of the surface of the substrate to be cleaned, and can quickly and effectively remove the contaminants attached to the surface. The invention can be used for two-stage cleaning. It can wipe off the water after spray cleaning, so there will be no traces of cleaning water, which helps to improve the quality of cleaning. More importantly, it uses a wet cleaning group impregnated with cleaning fluid to remove contaminants by direct wiping. , No need to use a large amount of organic cleaning liquid, will not produce a large amount of waste liquid to be treated, which can maintain the environmental safety and reduce the treatment cost, so it can greatly improve its practicality, and can increase its added value, and Improve its economic efficiency.
為使 貴審查委員能進一步了解本發明的構成、特徵及其他目的，以下乃舉本發明之若干較佳實施例，並配合圖式詳細說明如后，供讓熟悉該項技術領域者能夠具體實施。 In order to enable your review committee to further understand the structure, features and other purposes of the present invention, the following are some preferred embodiments of the present invention, and the detailed description in conjunction with the drawings as follows, for those familiar with the technical field to be able to implement .
(1):基板 (1): substrate
(100):光罩 (100): Mask
(110):基板 (110): substrate
(111):表面 (111): Surface
(112):表面 (112): Surface
(113):空白表面 (113): blank surface
(115):圖形層 (115): Graphics layer
(120):框架 (120): Frame
(150):保護膜 (150): Protective film
(151):表面 (151): Surface
(10):機座 (10): base
(20):傳輸裝置 (20): Transmission device
(21):驅動機構 (21): Drive mechanism
(22):導軌機構 (22): Guide rail mechanism
(23):升降機構 (23): Lifting mechanism
(24):夾持機構 (24): clamping mechanism
(25):夾爪 (25): Gripper
(30):溼式清潔組 (30): Wet cleaning group
(31):給水泵浦 (31): Feed water pump
(32):給水導管 (32): Water supply pipe
(33):奈米氣泡產生器 (33): Nano bubble generator
(35):集水機構 (35): Water collecting mechanism
(40):乾式清潔組 (40): Dry cleaning group
(41):氣體供應器 (41): Gas supply
(42):給氣導管 (42): Air supply catheter
(50):擦拭組 (50): Wiping group
(51):觸抵元件 (51): contact element
(511):連通孔 (511): communication hole
(515):噴出孔 (515): Spray hole
(52):置料捲輪 (52): Material reel
(53):收料捲輪 (53): Receipt reel
(54):升降驅動機構 (54): Lifting drive mechanism
(55):滾壓導輪組 (55): Rolling guide wheel set
(56):張力輪組 (56): Tension wheel set
(57):擠壓輪組 (57): Squeeze wheel set
(58):無塵布條 (58): Clean cloth
(60):進料傳送組 (60): feed conveyor group
(61):驅動機構 (61): Drive mechanism
(62):導軌機構 (62): Guide rail mechanism
(63):載台機構 (63): Carrier mechanism
(65):夾爪 (65): Gripper
第一圖：係一種半導體基板之光罩的外觀示意圖。 The first figure is a schematic diagram of the appearance of a photomask of a semiconductor substrate.
第二圖：係本發明基板清洗設備的立體外觀示意圖，供說明各組件的相對關係。 The second figure is a schematic diagram of the three-dimensional appearance of the substrate cleaning device of the present invention, for explaining the relative relationship of the components.
第三圖：係本發明基板清洗設備中擦拭組的立體外觀示意圖。 The third figure is a schematic perspective view of the wiping group in the substrate cleaning device of the present invention.
第四圖：係本發明基板清洗設備中擦拭組的局部放大立體剖開示意圖。 The fourth figure is a partially enlarged schematic perspective sectional view of the wiping group in the substrate cleaning device of the present invention.
第五圖：係本發明基板清洗設備另一較佳實施例的平面示意圖，供說明各組件的相對關係。 Fig. 5 is a schematic plan view of another preferred embodiment of the substrate cleaning device of the present invention, for illustrating the relative relationship of the components.
第六圖：係本發明基板清洗方法的流程圖。 Figure 6: It is a flow chart of the substrate cleaning method of the present invention.
第七圖：係本發明基板清洗設備於實際清潔時的動作示意圖。 The seventh figure is a schematic diagram of the operation of the substrate cleaning device of the present invention during actual cleaning.
第八圖：係本發明基板清洗設備於實際清潔時中利用溼式清潔組進行給水溼擦的動作示意圖。 Figure 8 is a schematic diagram of the operation of the wet cleaning of the substrate cleaning equipment of the present invention using a wet cleaning group during actual cleaning.
第九圖：係本發明基板清洗設備於實際清潔時中利用乾式清潔組進行吹氣乾擦的動作示意圖。 Ninth figure: It is a schematic diagram of the operation of using the dry cleaning group to blow and dry wipe the substrate cleaning equipment of the present invention during actual cleaning.
本發明係一種基板清洗設備以及基板清洗方法，隨附圖例示本發明之具體實施例及其構件中，所有關於前與後、左與右、頂部與底部、上部與下部、以及水平與垂直的參考，僅用於方便進行描述，並非限制本發明，亦非將其構件限制於任何位置或空間方向。圖式與說明書中所指定的尺寸，當可在不離開本發明之申請專利範圍內，根據本發明之具體實施例的設計與需求而進行變化。 The present invention is a substrate cleaning device and substrate cleaning method. The accompanying drawings illustrate specific embodiments of the present invention and its components, all about front and rear, left and right, top and bottom, upper and lower, and horizontal and vertical Reference is only for convenience of description, and does not limit the present invention, nor does it limit its components to any position or spatial direction. The dimensions specified in the drawings and specifications can be changed according to the design and requirements of the specific embodiments of the present invention without departing from the scope of the present invention.
而本發明係一種供利用擦拭方式清潔基板表面之基板清洗設備以及基板清洗方法，該基板(1)尤指如第一圖所示之光罩(100)之板材(110)中異於保護膜(150)的一表面(112)的清潔，其中第二圖所顯示者係該基板清洗設備，其包含有一機座(10)、一傳輸裝置(20)、一溼式清潔組(30)及一乾式清潔組(40)所組成；其中傳輸裝置(20)設置於機座(10)上，用以移動及夾持基板(1)【如第七圖所示】。在某些實施例中，該傳輸裝置(20)包含一驅動機構(21)、一導軌機構(22)、一升降機構(23)及一夾持機構(24)，其中夾持機構(24)係設於升降機構(23)上，而驅動機構(21)可作動升降機構(23)於導軌機構(22)上沿移動方向X位移，且夾持機構(24)可利用升降 機構(23)相對導軌機構(22)沿移動方向Z位移。在某些實施例中，該夾持機構(24)內具有複數相對夾爪(25)，供同步夾掣基板(1)相對邊緣或相對角落、且不超出等待清洗之表面【如光罩(100)之表面(112)】，令夾持機構(24)可夾掣基板(1)同步沿移動方向X、Z位移；而溼式清潔組(30)包含有一擦拭組(50)、一給水泵浦(31)及一給水導管(32)，在某些實施例中，該擦拭組(50)係於機座(10)上設有一觸抵元件(51)、一置料捲輪(52)及一收料捲輪(53)，且置料捲輪(52)、觸抵元件(51)與收料捲輪(53)捲繞有一連續性之無塵布條(58)，再者該擦拭組(50)於觸抵元件(51)一側的機座(10)上設有一升降驅動機構(54)，供作動該觸抵元件(51)沿移動方向Z位移，且根據第四圖所示，該觸抵元件(51)上形成有至少一連通孔(511)，供透過給水導管(32)連接前述之給水泵浦(31)，以輸送清洗液至觸抵元件(51)的連通孔(511)，又各該連通孔(511)具有複數貫通觸抵元件(51)表面之噴出孔(515)，且該等噴出孔(515)可對應接觸通過的無塵布條(58)，令清洗液可噴溼無塵布條(58)的對應範圍。而在某些實施例中該觸抵元件(51)的進料方向及出料方向分設有一滾壓導輪組(55)，供保持無塵布條(58)於繞經觸抵元件(51)表面及移動時的平整性。又在某些實施例中觸抵元件(51)相對置料捲輪(52)與收料捲輪(53)的無塵布條(58)路徑中分設有一張力輪組(56)，使無塵布條(58)於放料及收料時可保持平整、順暢。另在某些實施例中，該給水泵浦(31)內設有一奈米氣泡生成器(33)【Nanobubble Generator】， 供於清潔液中產生奈米氣泡，以提高清潔效果。再者，於某些實施例中，如第五圖所示，該擦拭組(50)於觸抵元件(51)兩側與滾壓導輪組(55)間分別設有一供無塵布條(58)穿經之擠壓輪組(57)，且各該擠壓輪組(57)相對無塵布條(58)的擠壓高度低於無塵布條(58)通過該觸抵元件(51)及該滾壓導輪組(55)的高度，使無塵布條(58)中含浸的清洗液能在擠壓輪組(57)處被擠出，而不致向上移轉至兩側的滾壓導輪組(55)。且在某些實施例中，該溼式清潔組(30)於擦拭組(50)的觸抵元件(51)及擠壓輪組(57)下方設有一集水機構(35)，供收集多餘滴落的清洗液；又，如第三、四圖所示，乾式清潔組(40)包含有一前述之擦拭組(50)。且在某些實施例中，該乾式清潔組(40)進一步包含有一氣體供應器(41)及一給氣導管(42)，該擦拭組(50)之觸抵元件(51)連通孔(511)可透過給氣導管(42)連接前述之氣體供應器(41)，以輸送潔淨氣體至觸抵元件(51)的連通孔(511)，又各該連通孔(511)具有複數貫通觸抵元件(51)表面之噴出孔(515)，且該等噴出孔(515)可對應接觸通過的無塵布條(58)，令潔淨氣體可通過無塵布條(58)吹乾水分；再者，如第二圖所示，某些實施例中本發明基板清洗設備於機座上(10)之傳輸裝置(20)一端設有一相對之進料傳送組(60)，用以移動基板(1)進料。在某些實施例中，該該進料傳送組(60)包含一驅動機構(61)、一導軌機構(62)、一載台機構(63)，其中載台機構(63)係設於導軌機構(62)上 沿移動方向X位移。在某些實施例中，載台機構(63)並可於導軌機構(62)上沿旋轉方向θ轉動【如第二圖所示】，供配合前述傳輸裝置(20)之夾持機構(24)於夾掣基板(1)進行清洗的方位。又在某些實施例中，該載台機構(63)內具有複數相對夾爪(65)，供支持及夾掣基板(1)，令載台機構(63)可夾掣基板(1)同步沿移動方向X位移或旋轉方向θ轉動，且供移動對應傳輸裝置(20)之夾持機構(24)，以達成自動進料之目的。在某些實施例中，該進料傳送組(60)的另端是連接一檢查設備【圖中未示】，例如用於檢測基板(1)表面污染物之光學檢查設備，供完成基板(1)表面污染物的檢測後，讓未達標準的基板(1)可以立即進料至本發明之基板清洗設備中進行洗淨動作，且清洗後也可以立即進行基板(1)之表面污染物的檢測，以確認是否完成清洗；藉此，組構成一能迅速、且有效清潔之基板清洗設備者。 The present invention is a substrate cleaning device and a substrate cleaning method for cleaning the surface of a substrate by a wiping method. The substrate (1) is particularly different from the protective film in the plate (110) of the photomask (100) shown in the first figure (150) cleaning of a surface (112), wherein the second figure shows the substrate cleaning equipment, which includes a base (10), a transmission device (20), a wet cleaning group (30) and It consists of a dry cleaning group (40); the transmission device (20) is set on the base (10) to move and hold the substrate (1) [as shown in the seventh figure]. In some embodiments, the transmission device (20) includes a driving mechanism (21), a rail mechanism (22), a lifting mechanism (23) and a clamping mechanism (24), wherein the clamping mechanism (24) It is set on the lifting mechanism (23), and the driving mechanism (21) can actuate the lifting mechanism (23) on the rail mechanism (22) to move along the movement direction X, and the clamping mechanism (24) can use lifting The mechanism (23) is displaced relative to the rail mechanism (22) in the movement direction Z. In some embodiments, the clamping mechanism (24) has a plurality of relative clamping jaws (25) for synchronously clamping the opposite edges or corners of the substrate (1) without exceeding the surface to be cleaned [such as a photomask ( 100) the surface (112)], so that the clamping mechanism (24) can clamp the substrate (1) to move along the movement directions X and Z simultaneously; and the wet cleaning group (30) includes a wiping group (50) and a water supply A pump (31) and a water supply pipe (32), in some embodiments, the wiping group (50) is provided with a contact element (51) and a material reel (52) on the base (10) ) And a receiving reel (53), and the placing reel (52), the contact element (51) and the receiving reel (53) are wound with a continuous dust-free cloth strip (58), and The wiping group (50) is provided with a lifting drive mechanism (54) on the base (10) on the side of the contact element (51) for actuating the displacement of the contact element (51) along the moving direction Z, and according to the fourth As shown in the figure, the contact element (51) is formed with at least one communication hole (511) for connecting the aforementioned feed water pump (31) through the water supply conduit (32) to deliver the cleaning fluid to the contact element (51) The communication holes (511), and each of the communication holes (511) has a plurality of ejection holes (515) penetrating through the surface of the contact element (51), and the ejection holes (515) can correspond to the dust-free cloth strips that pass through ( 58), so that the cleaning liquid can spray the corresponding range of the dust-free cloth strip (58). In some embodiments, the feeding direction and the discharging direction of the contact element (51) are respectively provided with a rolling guide wheel group (55) for keeping the dust-free cloth strip (58) around the contact element ( 51) Flatness of surface and movement. In some embodiments, a force wheel set (56) is arranged in the path of the dust-free cloth strip (58) of the contacting member (51) opposite the material placing reel (52) and the receiving reel (53), so that The dust-free cloth strip (58) can be kept smooth and smooth during feeding and receiving. In some embodiments, a nano bubble generator (33) [Nanobubble Generator] is provided in the feed water pump (31), It is used to generate nano bubbles in the cleaning liquid to improve the cleaning effect. Furthermore, in some embodiments, as shown in the fifth figure, the wiper group (50) is provided with a dust-free cloth strip between the two sides of the contact element (51) and the rolling guide wheel group (55) (58) The squeezing wheel group (57) passing through, and the squeezing height of each squeezing wheel group (57) relative to the dust-free cloth strip (58) is lower than that of the dust-free cloth strip (58) through the contacting element (51) and the height of the rolling guide wheel group (55), so that the cleaning liquid impregnated in the dust-free cloth strip (58) can be squeezed out at the squeeze wheel group (57) without moving upward to two Side roller guide (55). And in some embodiments, the wet cleaning group (30) is provided with a water collecting mechanism (35) below the contact element (51) and the squeezing wheel group (57) of the wiping group (50) for collecting excess The dripping cleaning liquid; as shown in the third and fourth figures, the dry cleaning group (40) includes a wiping group (50) as described above. And in some embodiments, the dry cleaning set (40) further includes a gas supply (41) and an air supply duct (42), the contacting element (51) of the wiping set (50) communicating hole (511) ) Can be connected to the aforementioned gas supply (41) through the gas supply duct (42) to deliver clean gas to the communication hole (511) of the contact element (51), and each of the communication holes (511) has a plurality of through contact The ejection holes (515) on the surface of the element (51), and these ejection holes (515) can correspond to the dust-free cloth strip (58) that passes through, so that the clean gas can blow dry the moisture through the dust-free cloth strip (58); Moreover, as shown in the second figure, in some embodiments, the substrate cleaning equipment of the present invention is provided with an opposite feed conveying group (60) at one end of the transmission device (20) on the machine base (10) for moving the substrate ( 1) Feeding. In some embodiments, the feed conveyor group (60) includes a driving mechanism (61), a rail mechanism (62), and a stage mechanism (63), wherein the stage mechanism (63) is disposed on the rail Agency (62) Displace in X direction of movement. In some embodiments, the stage mechanism (63) can rotate on the guide rail mechanism (62) along the direction of rotation θ [as shown in the second figure] to cooperate with the clamping mechanism (24) of the aforementioned transmission device (20) ) The direction of cleaning the substrate (1). In some embodiments, the stage mechanism (63) has a plurality of relative clamping jaws (65) for supporting and clamping the substrate (1), so that the stage mechanism (63) can clamp the substrate (1) in synchronization Displacement along the movement direction X or rotation direction θ, and is used to move the clamping mechanism (24) of the corresponding conveying device (20) to achieve the purpose of automatic feeding. In some embodiments, the other end of the feed conveyor (60) is connected to an inspection device [not shown], such as an optical inspection device for detecting surface contamination on the substrate (1), for completing the substrate ( 1) After the detection of surface contaminants, the substandard substrate (1) can be immediately fed into the substrate cleaning device of the present invention for cleaning action, and the surface contaminants of the substrate (1) can also be immediately performed after cleaning In order to confirm whether the cleaning is completed; by this, a group can be formed to quickly and effectively clean the substrate cleaning equipment.
又如第六圖所示為根據一些實施例之基板清洗方法的流程圖。而第七、八及九圖所示是根據一些實施例之基板清洗方法中的動作示意圖。當目測或檢測設備檢測後發現該基板(1)表面，例如一光罩(100)之表面(112)有污染物時，可將基板(1)傳送至進料傳送組(60)之載台機構(63)，且令基板(1)待清洗表面向下，供進行清洗流程。該清洗流程步驟包含：在步驟S101中，夾持一基板使待清洗表面超出夾持範圍：當傳輸裝置(20)之夾持機構(24)夾掣放置於進料傳 送組(60)之載台機構(63)上的基板(1)時，該進料傳送組(60)可以是一半導體設備。在某些實施例中，該半導體設備可以是檢測污染物之光罩檢查設備、光罩儲存設備、微影設備，使該基板(1)的待清洗表面超出夾持機構(24)的夾持範圍，令該基板(1)的待清洗表面可以完成被進行清潔；在步驟S102中，移動上述基板至一具連續無塵布條之溼式清潔組：如第七圖所示，根據一些實施例，該傳輸裝置(20)的夾持機構(24)沿移動方向X、Z進行位移，將上述基板(1)移至一溼式清潔組(30)的上方；步驟S103中，對上述溼式清潔組之無塵布條異於上述基板一側提供一清洗液，以噴溼方式接觸擦拭上述基板之待清洗表面：如第七、八圖所示，根據一些實施例，上述溼式清潔組(30)中之擦拭組(50)可利用升降驅動機構(54)作動觸抵元件(51)沿移動方向Z位移，將無塵布條(58)推抵接觸基板(1)的待清洗表面，同時溼式清潔組(30)的給水泵浦(31)透過給水導管(32)、觸抵元件(51)的連通孔(511)與噴出孔(515)提供清潔液由下向上噴溼無塵布條(58)，接著將夾持機構(24)帶動基板(1)沿移動方向X位移，達到利用噴溼方式擦拭清潔之目的。再者根據一些實施例，該給水泵浦(31)內可利用奈米氣泡產生器(33)於清潔液中產生奈米氣泡，以提高污染物的剝離率，從而提升清潔效果；步驟S104中，移動上述基板至一具連續無塵布條之乾式清潔組：如第七圖所示，根據一些實施例，該傳輸裝置(20)的夾持機構(24)沿移動方向X、Z進行位移，將上述基板(1) 移至一乾式清潔組(40)的上方；步驟S105中，使上述乾式清潔組之無塵布條接觸擦拭上述基板之待清洗表面：如第七、九圖所示，根據一些實施例，上述乾式清潔組(40)中之擦拭組(50)可利用升降驅動機構(54)作動觸抵元件(51)沿移動方向Z位移，將無塵布條(58)推抵接觸基板(1)的待清洗表面，接著將夾持機構(24)帶動基板(1)沿移動方向X位移，達到利用擦拭方式進行清潔之目的。而根據某些實施例，可以進一步對上述乾式清潔組(40)之無塵布條(58)異於上述基板一側提供一潔淨氣體，其係由乾式清潔組(40)的氣體供應器(41)透過給氣導管(42)、觸抵元件(51)的連通孔(511)與噴出孔(515)提供潔淨氣體由下向上通過無塵布條(58)吹向基板(1)，接著將夾持機構(24)帶動基板(1)沿移動方向X位移，供利用吹乾方式擦拭清潔之目的；步驟S106中，將上述基板傳送至一半導體設備：在完成溼式噴溼擦拭及乾式吹氣擦拭上述基板(1)後，傳輸裝置(20)之夾持機構(24)再次將基板(1)放置於進料傳送組(60)之載台機構(63)，供載台機構(63)夾掣基板(1)並移出基板清洗設備，以傳送至一半導體設備中。在某些實施例中，該半導體設備可以是檢測污染物之光罩檢查設備、光罩儲存設備、微影設備。 Another example is a flowchart of a substrate cleaning method according to some embodiments, as shown in the sixth figure. The seventh, eighth and ninth figures are schematic diagrams of operations in the substrate cleaning method according to some embodiments. When the surface of the substrate (1), such as the surface (112) of a photomask (100), is contaminated by visual inspection or inspection equipment, the substrate (1) can be transferred to the stage of the feed transfer group (60) Mechanism (63), and the surface of the substrate (1) to be cleaned is downward for the cleaning process. The steps of the cleaning process include: in step S101, clamping a substrate so that the surface to be cleaned exceeds the clamping range: when the clamping mechanism (24) of the conveying device (20) is placed on the feed conveyor When feeding the substrate (1) on the stage mechanism (63) of the group (60), the feed transfer group (60) may be a semiconductor device. In some embodiments, the semiconductor device may be a photomask inspection device for detecting contaminants, a photomask storage device, a lithography device, so that the surface of the substrate (1) to be cleaned exceeds the clamping of the clamping mechanism (24) Range, so that the surface of the substrate (1) to be cleaned can be cleaned; in step S102, the above substrate is moved to a wet cleaning group with a continuous clean cloth strip: as shown in the seventh figure, according to some implementations For example, the clamping mechanism (24) of the conveying device (20) is displaced along the movement directions X and Z to move the substrate (1) above a wet cleaning group (30); in step S103, the wet The dust-free cloth strip of the type cleaning group is different from the side of the substrate to provide a cleaning solution, and the surface to be cleaned of the substrate is wiped by wet spraying: as shown in the seventh and eighth figures, according to some embodiments, the above-mentioned wet cleaning The wiping group (50) in the group (30) can use the lifting drive mechanism (54) to move the contacting element (51) to move along the moving direction Z, and push the dust-free cloth strip (58) against the substrate (1) to be cleaned At the same time, the feed pump (31) of the wet cleaning group (30) supplies the cleaning liquid through the feed pipe (32), the communication hole (511) and the spray hole (515) of the contact element (51), and sprays the cleaning liquid from the bottom to the top The dust-free cloth strip (58), and then the clamping mechanism (24) drives the substrate (1) to move along the movement direction X to achieve the purpose of wiping and cleaning by spraying wet. Furthermore, according to some embodiments, the nano-bubble generator (33) can be used in the feed water pump (31) to generate nano-bubble in the cleaning liquid to increase the stripping rate of contaminants, thereby improving the cleaning effect; in step S104 , Move the above-mentioned substrate to a dry cleaning group with a continuous dust-free cloth strip: as shown in the seventh figure, according to some embodiments, the clamping mechanism (24) of the conveying device (20) is displaced along the movement directions X, Z , The above substrate (1) Move to the top of a dry cleaning group (40); in step S105, make the dust-free cloth strip of the dry cleaning group contact to wipe the surface of the substrate to be cleaned: as shown in Figures 7 and 9, according to some embodiments, the above The wiping group (50) in the dry cleaning group (40) can use the lifting drive mechanism (54) to actuate the contacting element (51) to move along the movement direction Z, and push the dust-free cloth strip (58) against the contacting substrate (1) After the surface to be cleaned, the clamping mechanism (24) drives the substrate (1) to move along the movement direction X to achieve the purpose of cleaning by wiping. According to some embodiments, the clean cloth strip (58) of the dry cleaning group (40) may be further provided with a clean gas different from the side of the substrate, which is provided by the gas supply of the dry cleaning group (40) ( 41) The clean gas is supplied through the air supply duct (42), the communication hole (511) and the ejection hole (515) of the contacting element (51), and blows from the bottom to the substrate (1) through the dust-free cloth strip (58), and then The clamping mechanism (24) drives the substrate (1) to move in the movement direction X for the purpose of wiping and cleaning by blow drying; in step S106, the above substrate is transferred to a semiconductor device: after the wet spray wet wipe and dry type are completed After blowing and wiping the above substrate (1), the clamping mechanism (24) of the conveying device (20) again places the substrate (1) on the stage mechanism (63) of the feed conveyor group (60) for the stage mechanism ( 63) Clamp the substrate (1) and remove it from the substrate cleaning device to transfer it to a semiconductor device. In some embodiments, the semiconductor device may be a mask inspection device, a mask storage device, or a lithography device for detecting contaminants.
又在某些實施例中，當基板(1)的待清洗表面污染度較高時，可以重覆步驟S102~步驟S105，以提高其清洗效果。 In some embodiments, when the contamination of the surface of the substrate (1) to be cleaned is high, steps S102 to S105 may be repeated to improve the cleaning effect.
經由上述的說明，本發明基板清洗設置利用傳輸裝置(20)之夾持機構(24)夾掣基板(1)，令基板(1)相對溼式清潔組(30)與乾式清潔組(40)的擦拭組(50)，供分別進行基板(1)待清洗表面的噴溼擦拭及吹氣擦拭，而能迅速、且有效的去除表面附著的污染物，再者本發明可進行兩階段清潔，其能在噴溼清潔後擦乾水份，因此不會殘留清潔水痕，有助於提升清潔品質，更重要的是由於其係以含浸清潔液之溼式清潔組(30)採直接擦拭方式去除污染物，不需使用到大量有機清潔液，不會產生大量待處理廢液，可達維持環境安全性，且降低處理成本之功效，故可大幅增進其實用性。 Through the above description, the substrate cleaning device of the present invention uses the clamping mechanism (24) of the transport device (20) to clamp the substrate (1), so that the substrate (1) is relatively wet cleaning group (30) and dry cleaning group (40) The wiping group (50) is used to perform the wet wiping and blowing wiping of the surface of the substrate (1) to be cleaned, respectively, and can quickly and effectively remove the contaminants attached to the surface. Furthermore, the present invention can perform two-stage cleaning. It can wipe off the water after spray cleaning, so there will be no traces of cleaning water, which helps to improve the quality of cleaning. More importantly, it is a wet cleaning group (30) that is impregnated with cleaning fluid. To remove pollutants, there is no need to use a large amount of organic cleaning liquid, and a large amount of waste liquid to be processed will not be generated, which can maintain the environmental safety and reduce the processing cost, so it can greatly improve its practicality.
綜上所述，可以理解到本發明為一創意極佳之發明創作，除了有效解決習式者所面臨的問題，更大幅增進功效，且在相同的技術領域中未見相同或近似的產品創作或公開使用，同時具有功效的增進，故本發明已符合發明專利有關「新穎性」與「進步性」的要件，乃依法提出發明專利之申請。 In summary, it can be understood that the present invention is a creative invention with excellent creativity. In addition to effectively solving the problems faced by the learners, the efficiency is greatly improved, and the same or similar product creation has not been seen in the same technical field. Or it can be used openly, and at the same time it has the improvement of efficacy. Therefore, the present invention has met the requirements of "novelty" and "progressiveness" of the invention patent, and an application for the invention patent is filed according to law.
(10):機座 (10): base
(20):傳輸裝置 (20): Transmission device
(21):驅動機構 (21): Drive mechanism
(22):導軌機構 (22): Guide rail mechanism
(23):升降機構 (23): Lifting mechanism
(24):夾持機構 (24): clamping mechanism
(25):夾爪 (25): Gripper
(30):溼式清潔組 (30): Wet cleaning group
(31):給水泵浦 (31): Feed water pump
(32):給水導管 (32): Water supply pipe
(33):奈米氣泡產生器 (33): Nano bubble generator
(40):乾式清潔組 (40): Dry cleaning group
(41):氣體供應器 (41): Gas supply
(42):給氣導管 (42): Air supply catheter
(50):擦拭組 (50): Wiping group
(51):觸抵元件 (51): contact element
(52):置料捲輪 (52): Material reel
(53):收料捲輪 (53): Receipt reel
(54):升降驅動機構 (54): Lifting drive mechanism
(55):滾壓導輪組 (55): Rolling guide wheel set
(56):張力輪組 (56): Tension wheel set
(58):無塵布條 (58): Clean cloth
(60):進料傳送組 (60): feed conveyor group
(61):驅動機構 (61): Drive mechanism
(62):導軌機構 (62): Guide rail mechanism
(63):載台機構 (63): Carrier mechanism
(65):夾爪 (65): Gripper
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW107105261A TWI689357B (en) | 2018-02-13 | 2018-02-13 | Substrate cleaning equipment and substrate cleaning method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107105261A TWI689357B (en) | 2018-02-13 | 2018-02-13 | Substrate cleaning equipment and substrate cleaning method |
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| TW201934213A TW201934213A (en) | 2019-09-01 |
| TWI689357B true TWI689357B (en) | 2020-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102728580A (en) * | 2011-03-31 | 2012-10-17 | 东京毅力科创株式会社 | Substrate cleaning apparatus and vacuum processing system |
| TWI523097B (en) * | 2012-09-27 | 2016-02-21 | Screen Holdings Co Ltd | Processing liquid supply device, substrate processing device, treatment liquid supply method, substrate processing method, treatment liquid treatment device, and treatment liquid treatment method |
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2018
- 2018-02-13 TW TW107105261A patent/TWI689357B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102728580A (en) * | 2011-03-31 | 2012-10-17 | 东京毅力科创株式会社 | Substrate cleaning apparatus and vacuum processing system |
| TWI523097B (en) * | 2012-09-27 | 2016-02-21 | Screen Holdings Co Ltd | Processing liquid supply device, substrate processing device, treatment liquid supply method, substrate processing method, treatment liquid treatment device, and treatment liquid treatment method |
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| TW201934213A (en) | 2019-09-01 |
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