TWI689235B - 配線基板之製造方法及配線基板 - Google Patents

配線基板之製造方法及配線基板 Download PDF

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Publication number
TWI689235B
TWI689235B TW104137102A TW104137102A TWI689235B TW I689235 B TWI689235 B TW I689235B TW 104137102 A TW104137102 A TW 104137102A TW 104137102 A TW104137102 A TW 104137102A TW I689235 B TWI689235 B TW I689235B
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TW
Taiwan
Prior art keywords
free energy
surface free
compound
wiring board
pattern
Prior art date
Application number
TW104137102A
Other languages
English (en)
Chinese (zh)
Other versions
TW201626870A (zh
Inventor
伊藤牧八
遠藤亮介
Original Assignee
日商迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201626870A publication Critical patent/TW201626870A/zh
Application granted granted Critical
Publication of TWI689235B publication Critical patent/TWI689235B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Materials For Photolithography (AREA)
TW104137102A 2014-11-21 2015-11-11 配線基板之製造方法及配線基板 TWI689235B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014237191A JP6453622B2 (ja) 2014-11-21 2014-11-21 配線基板の製造方法、及び配線基板
JPJP2014-237191 2014-11-21

Publications (2)

Publication Number Publication Date
TW201626870A TW201626870A (zh) 2016-07-16
TWI689235B true TWI689235B (zh) 2020-03-21

Family

ID=56013805

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104137102A TWI689235B (zh) 2014-11-21 2015-11-11 配線基板之製造方法及配線基板

Country Status (4)

Country Link
US (1) US10136521B2 (ja)
JP (1) JP6453622B2 (ja)
TW (1) TWI689235B (ja)
WO (1) WO2016080263A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101325840A (zh) * 2007-06-15 2008-12-17 富士康(昆山)电脑接插件有限公司 防氧化印刷电路板及其金手指和该印刷电路板的制造方法
JP2009071037A (ja) * 2007-09-13 2009-04-02 Konica Minolta Holdings Inc 導電膜パターンの形成方法
TW200930183A (en) * 2007-10-26 2009-07-01 Samsung Techwin Co Ltd Method of manufacturing printed circuit board and printed circuit board manufactured by the same
CN101534607A (zh) * 2008-03-12 2009-09-16 南亚电路板股份有限公司 打线基板及其制作方法
US20090265929A1 (en) * 2005-09-29 2009-10-29 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic circuit constituting member and relevant mounting apparatus
US20100316849A1 (en) * 2008-02-05 2010-12-16 Millward Dan B Method to Produce Nanometer-Sized Features with Directed Assembly of Block Copolymers
JP2011014829A (ja) * 2009-07-06 2011-01-20 Ricoh Co Ltd パターン化膜およびその形成方法
TW201415164A (zh) * 2012-10-09 2014-04-16 Canon Kk 光可固化的組成物及製造膜的方法
JP2014067566A (ja) * 2012-09-25 2014-04-17 Bando Chem Ind Ltd 導電ペースト

Family Cites Families (18)

* Cited by examiner, † Cited by third party
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US4321404A (en) * 1980-05-20 1982-03-23 Minnesota Mining And Manufacturing Company Compositions for providing abherent coatings
US5834564A (en) * 1996-04-30 1998-11-10 Hewlett-Packard Company Photoconductor coating having perfluoro copolymer and composition for making same
JP4064125B2 (ja) 2002-02-22 2008-03-19 株式会社クラレ フレネルレンズシートおよびその製造方法
US6746825B2 (en) * 2001-10-05 2004-06-08 Wisconsin Alumni Research Foundation Guided self-assembly of block copolymer films on interferometrically nanopatterned substrates
JP4672233B2 (ja) * 2001-11-06 2011-04-20 大日本印刷株式会社 導電性パターン形成体の製造方法
US7749684B2 (en) 2002-08-28 2010-07-06 Dai Nippon Printing Co., Ltd. Method for manufacturing conductive pattern forming body
JP4325555B2 (ja) * 2002-09-19 2009-09-02 ダイキン工業株式会社 パターン表面をテンプレートとして用いる材料とその製法
JP2005052686A (ja) 2003-08-01 2005-03-03 Nitto Denko Corp パターン塗布方法、光学フィルム及び画像表示装置
JP4096941B2 (ja) * 2004-12-10 2008-06-04 セイコーエプソン株式会社 電気配線の形成方法、配線基板の製造方法、電気光学素子の製造方法、電子機器の製造方法、配線基板、電気光学素子、および電子機器
WO2006129800A1 (ja) 2005-06-03 2006-12-07 Daikin Industries, Ltd. パターン形成用表面処理剤
JP4876564B2 (ja) 2005-12-16 2012-02-15 凸版印刷株式会社 転写用凹版を用いた遮光性隔壁の形成方法
JP2008066567A (ja) 2006-09-08 2008-03-21 Ricoh Co Ltd 配線パターンとこれを用いた電子素子、有機半導体素子、積層配線パターンおよび積層配線基板
JP5978577B2 (ja) * 2011-09-16 2016-08-24 株式会社リコー 多層配線基板
US8765224B2 (en) * 2012-03-28 2014-07-01 Sharp Laboratories Of America, Inc. Controlling printed ink line widths using fluoropolymer templates
US9562170B2 (en) * 2012-11-05 2017-02-07 Nissan Chemical Industries, Ltd. Curable composition including fluorine-containing highly branched polymer and siloxane oligomer
JP5744112B2 (ja) 2013-06-11 2015-07-01 デクセリアルズ株式会社 パターン形成体の製造方法
JP6406817B2 (ja) * 2013-12-10 2018-10-17 デクセリアルズ株式会社 硬化樹脂成形体
JP6381971B2 (ja) * 2014-05-30 2018-08-29 デクセリアルズ株式会社 表面自由エネルギー転写用光硬化性樹脂組成物、及びこれを用いた基板の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090265929A1 (en) * 2005-09-29 2009-10-29 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic circuit constituting member and relevant mounting apparatus
CN101325840A (zh) * 2007-06-15 2008-12-17 富士康(昆山)电脑接插件有限公司 防氧化印刷电路板及其金手指和该印刷电路板的制造方法
JP2009071037A (ja) * 2007-09-13 2009-04-02 Konica Minolta Holdings Inc 導電膜パターンの形成方法
TW200930183A (en) * 2007-10-26 2009-07-01 Samsung Techwin Co Ltd Method of manufacturing printed circuit board and printed circuit board manufactured by the same
US20100316849A1 (en) * 2008-02-05 2010-12-16 Millward Dan B Method to Produce Nanometer-Sized Features with Directed Assembly of Block Copolymers
CN101534607A (zh) * 2008-03-12 2009-09-16 南亚电路板股份有限公司 打线基板及其制作方法
JP2011014829A (ja) * 2009-07-06 2011-01-20 Ricoh Co Ltd パターン化膜およびその形成方法
JP2014067566A (ja) * 2012-09-25 2014-04-17 Bando Chem Ind Ltd 導電ペースト
TW201415164A (zh) * 2012-10-09 2014-04-16 Canon Kk 光可固化的組成物及製造膜的方法

Also Published As

Publication number Publication date
WO2016080263A1 (ja) 2016-05-26
US20170325335A1 (en) 2017-11-09
JP2016100490A (ja) 2016-05-30
TW201626870A (zh) 2016-07-16
US10136521B2 (en) 2018-11-20
JP6453622B2 (ja) 2019-01-16

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