TWI688431B - Film forming method and film forming device - Google Patents

Film forming method and film forming device Download PDF

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TWI688431B
TWI688431B TW106126538A TW106126538A TWI688431B TW I688431 B TWI688431 B TW I688431B TW 106126538 A TW106126538 A TW 106126538A TW 106126538 A TW106126538 A TW 106126538A TW I688431 B TWI688431 B TW I688431B
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substrate
inkjet head
pattern
film
minimum size
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TW106126538A
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TW201805069A (en
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野本剛
岡本裕司
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日商住友重機械工業股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/008—Controlling printhead for accurately positioning print image on printing material, e.g. with the intention to control the width of margins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Ink Jet (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

本發明提供一種能夠利用噴墨印刷技術，高精細度地形成圖案中的賦予最小尺寸之邊緣之膜形成方法。一邊對於噴墨頭使基板相對移動，一邊基於用於定義應形成之膜的圖案之圖案資料從噴墨頭向基板吐出液滴而於前述基板形成膜。噴墨頭與基板的相對移動方向，是與由圖案資料所定義之圖案的最小尺寸的方向正交。The present invention provides a film forming method capable of forming an edge with a minimum size in a pattern with high precision using inkjet printing technology. While relatively moving the substrate with respect to the inkjet head, droplets are ejected from the inkjet head to the substrate based on the pattern data defining the pattern of the film to be formed, and a film is formed on the substrate. The relative movement direction of the inkjet head and the substrate is orthogonal to the direction of the smallest size of the pattern defined by the pattern data.

Description

膜形成方法及膜形成裝置Film forming method and film forming device

本申請主張基於2016年8月10日申請之日本專利申請2016-157066號的優先權。該申請的所有內容藉由參閱援用於本說明書中。 　　本發明係有關一種膜形成方法及膜形成裝置。This application claims priority based on Japanese Patent Application No. 2016-157066 filed on August 10, 2016. All contents of this application are incorporated into this specification by reference. The present invention relates to a film forming method and a film forming apparatus.

為了形成用於將觸控面板的透明導電膜圖案化之抗蝕圖案，是採用光微影法技術或網版印刷技術。採用光微影法技術之方法，雖能夠形成高精細度的圖案，但裝置成本、廢液處理成本等變高。採用網版印刷技術之方法，於裝置成本、廢液處理成本方面雖比採用光微影法技術之方法更有利，但難以形成高精細度的圖案。採用噴墨印刷技術來形成抗蝕圖案之技術已被提出（專利文獻1）。 （先前技術文獻） （專利文獻） 　　專利文獻1：日本專利第5797277號公報In order to form a resist pattern for patterning the transparent conductive film of the touch panel, photolithography technology or screen printing technology is used. Although the method using photolithography technology can form a high-definition pattern, the cost of equipment and the cost of waste liquid treatment become high. The method using screen printing technology is more advantageous than the method using photolithography in terms of device cost and waste liquid treatment cost, but it is difficult to form a high-definition pattern. The technique of forming a resist pattern using inkjet printing technology has been proposed (Patent Document 1). (Prior Art Literature) (Patent Literature) 　　 Patent Literature 1: Japanese Patent No. 5797277

（發明所欲解決之問題） 　　要求可將透明導電膜等更加高精細度地圖案化之技術。本發明的目的在於提供一種能夠利用噴墨印刷技術，高精細度地形成圖案中的賦予最小尺寸之邊緣之膜形成方法及膜形成裝置。 （解決問題之技術手段） 　　依本發明的一觀點，提供一種膜形成方法， 　　一邊對於噴墨頭使基板相對移動，一邊基於用於定義應形成之膜的圖案之圖案資料從前述噴墨頭向前述基板吐出液滴而於前述基板形成膜， 　　前述噴墨頭與前述基板的相對移動方向，是與由前述圖案資料所定義之圖案的最小尺寸的方向正交。 　　依本發明的另一觀點，提供一種膜形成裝置，其具有： 　　支撐部，對基板進行支撐； 　　噴墨頭，向前述基板吐出液滴； 　　移動機構，使被前述支撐部支撐之前述基板與前述噴墨頭當中的一方相對於另一方沿至少一維方向移動；及 　　控制裝置，控制前述噴墨頭及前述移動機構， 　　前述控制裝置，係儲存有用於定義應形成於前述基板之膜的圖案之圖案資料，並控制前述噴墨頭及前述移動機構，一邊使前述基板相對於前述噴墨頭朝向與由前述圖案資料所定義之圖案的最小尺寸的方向正交之方向移動，一邊基於前述圖案資料從前述噴墨頭向前述基板吐出液滴而形成膜。 （發明之效果） 　　能夠提高應形成之膜的圖案中的賦予最小尺寸之一對邊緣的相對位置的精度。(Problems to be solved by the invention) 　　Techniques that can pattern transparent conductive films with higher precision are required. An object of the present invention is to provide a film forming method and a film forming apparatus capable of forming an edge with a minimum size in a pattern with high precision using inkjet printing technology. (Technical means to solve the problem) According to an aspect of the present invention, a film forming method is provided, which moves the substrate relative to the inkjet head while moving from the inkjet head based on the pattern data for defining the pattern of the film to be formed. The substrate discharges droplets to form a film on the substrate. The relative movement direction of the inkjet head and the substrate is orthogonal to the direction of the smallest size of the pattern defined by the pattern data. According to another aspect of the present invention, there is provided a film forming apparatus having: a 　　 support portion to support a substrate; a 　　 inkjet head to eject droplets to the substrate; a 　　 moving mechanism to cause the substrate and the substrate One of the inkjet heads moves in at least one direction relative to the other; and a control device that controls the inkjet head and the moving mechanism, and the control device stores patterns for defining the film to be formed on the substrate Pattern data, and controlling the inkjet head and the moving mechanism, while moving the substrate relative to the inkjet head in a direction orthogonal to the direction of the smallest dimension of the pattern defined by the pattern data, based on the pattern data A liquid droplet is discharged from the inkjet head to the substrate to form a film. (Effect of the invention) 　　 can improve the accuracy of giving the relative position of one pair of edges with the smallest size in the pattern of the film to be formed.

參閱圖1～圖4，對基於實施例的膜形成方法及膜形成裝置進行說明。 　　圖1中示出基於實施例的膜成形裝置的概略圖。於基台20透過移動機構21支撐著支撐部23。於支撐部23的上表面（支撐面）支撐基板50。移動機構21能夠藉由使支撐部23沿與支撐面平行之二維方向移動來使基板50沿二維方向移動。通常，支撐部23的支撐面保持水平。定義將與支撐面平行之兩個方向設為x軸、y軸之xyz直角坐標系。 　　於被支撐部23支撐之基板50的上方配置有噴墨頭25。噴墨頭25藉由門型框架24被基台20支撐。噴墨頭25包含複數個頭塊26。複數個頭塊26安裝在共用的支撐構件28。於頭塊26的每一個設置有複數個噴嘴孔。從噴嘴孔向基板50吐出膜材料的液滴。 　　使附著在基板50之液態膜材料硬化而形成膜。作為膜材料，能夠使用光硬化性樹脂、熱硬化性樹脂等。於噴墨頭25的側方配置有使附著在基板50之膜材料硬化之光源或熱源。 　　控制裝置30控制移動機構21所致的支撐部23的移動及來自噴墨頭25的噴嘴孔的膜材料的吐出。控制裝置30包含記憶裝置31，且記憶裝置31中儲存有應形成之膜的圖案資料。控制裝置30基於圖案資料控制移動機構21及噴墨頭25，藉此能夠於基板50形成所希望的圖案的膜。 　　從輸入裝置35向控制裝置30輸入各種指令或資料。輸入裝置35例如使用鍵盤、指向裝置、USB埠、通信裝置等。向輸出裝置36輸出與膜形成裝置的動作有關之各種資訊。輸出裝置36是例如使用液晶顯示器、揚聲器、USB埠、通信裝置等。 　　於圖2中，作為應形成之膜的一例，示出將觸控面板的透明電極圖案化時用作蝕刻遮罩之抗蝕膜53。透明電極藉由將抗蝕膜53作為蝕刻遮罩而進行蝕刻來形成包括ITO等之透明導電膜。於圖2中，對塗佈有抗蝕劑之區域賦予點狀圖案。 　　複數個墊部51被配置成矩陣狀，連接部52沿列方向與複數個墊部51連接。於圖1中定義之xyz直角坐標系中，行方向與x方向對應，且列方向與y方向對應。於x方向上相鄰之墊部51的間隔G成為圖案的最小尺寸。該最小尺寸的方向為x方向，其大小例如為30μm左右。 　　若用於形成圖案中的賦予最小尺寸之一對邊緣54之液滴的著落位置在x方向發生偏離，會使於x方向上相鄰之墊部51連結。若原本應分開之兩個墊部51連結，則觸控面板無法正常動作。然而，即使液滴的著落位置在y方向發生偏離，於x方向上分開之兩個墊部51仍不會連結。從而，較佳為使形成圖案中的賦予最小尺寸之一對邊緣54之液滴的於x方向上的位置精度比於y方向上的位置精度更高。 　　接著，參閱圖3A及圖3B，對於x方向及y方向上的液滴的著落位置精度進行說明。 　　圖3A中示出液滴的著落目標位置及著落位置的偏差。以實線表示著落目標位置55，且以虛線表示發生偏差之複數個著落位置。於膜材料的塗佈時，一邊使基板50（圖1）沿y方向移動，一邊從噴墨頭25的既定噴嘴孔吐出膜材料的液滴。作為液滴的著落位置發生偏差之主要原因可考慮如下：從噴嘴孔向吐出方向的偏差、基板50的移動速度的偏差、從噴嘴孔的吐出時機的偏差、液滴的吐出速度的偏差等。 　　該等偏差的主要原因中，從噴嘴孔向吐出方向的偏差成為於x方向及y方向這兩方向上的位置的偏差的主要原因。其他3個偏差的主要原因成為於y方向上的位置的偏差的主要原因，但不會成為於x方向上的位置的偏差的主要原因。因此，於x方向上的偏差的最大寬度Dx比於y方向上的偏差的最大寬度Dy小。 　　圖3B中示出，一邊使基板50（圖1）沿y方向移動一邊形成帶狀膜時的膜形狀的一例。在噴墨頭25設置有沿x方向以等間隔排列之複數個噴嘴孔27。因為液滴的著落位置於x方向上的偏差比於y方向上的偏差小，長邊沿y方向的帶狀膜56的兩側的邊具有比長邊沿x方向的帶狀膜57的兩側的邊更高的直線度，且膜56的寬度的偏差（x方向的位置的偏差）比膜57的寬度偏差（y方向的位置的偏差）小。 　　接著，參閱圖4，對用於形成觸控面板用透明電極之抗蝕膜的形成方法進行說明。 　　圖4中示出應形成之抗蝕膜53與噴墨頭25的位置關係。以抗蝕膜53的最小尺寸的方向與x方向一致的方式作成圖案資料。藉由抗蝕膜53的一對邊緣54賦予最小尺寸。基於該圖案資料，控制裝置30（圖1）控制移動機構21，一邊使基板50（圖1）沿y方向移動，一邊從噴墨頭25的各噴嘴孔27吐出膜材料的液滴。當無法藉由向基板50的y方向移動（以下，稱為掃描）一次而於基板50的整個區域形成抗蝕膜53全體時，將基板50 x方向挪移而進行第2次以後的掃描，藉此能夠形成抗蝕膜53全體。 　　接著，對圖1～圖4中所示出之實施例的優異效果進行說明。 　　一邊使基板50向與應形成之膜的圖案的最小尺寸的方向（x方向）正交之方向（y方向）移動一邊形成膜時，邊緣54（圖4）的方向與基板50的移動的方向的關係，是和圖3B的膜56的邊緣的方向與基板的移動方向的關係相同。因此，如參閱圖3A及圖3B進行說明，能夠減少圖案中的賦予最小尺寸之一對邊緣54（圖4）的x方向的位置的偏差，並且能夠提高邊緣54的直線度。藉此，能夠抑制於x方向上相鄰之兩個墊部51隔著最小尺寸的部分相互連續之情況。 　　再者，於上述實施例中，如圖1所示，是使噴墨頭25相對於基台20呈靜止，一邊使支撐部23沿y方向移動一邊形成膜。若使噴墨頭25相對於基台20進行移動，起因於噴墨頭25的移動會導致其姿勢產生略微變動。噴墨頭25的姿勢變動會使液滴的吐出方向發生變動，因此成為著落位置的位置精度的偏差的主要原因。上述實施例中，於膜形成時使噴墨頭25相對於基台20呈靜止，因此能夠減少因噴墨頭25的姿勢變動所導致之著落位置的偏差。 　　上述實施例中，利用噴墨印刷技術而形成了抗蝕膜，但還能夠形成其他膜。又，上述實施例中，藉由塗佈有抗蝕劑之區域的間隙而賦予最小尺寸，但亦可以藉由塗佈有抗蝕劑之區域而賦予最小尺寸。例如，還能夠以抗蝕劑所構成之細線的寬度成為最小尺寸的形式來形成膜。於該情況下，藉由應用基於實施例的方法，能夠抑制於細線中產生斷線。 　　上述實施例中，使噴墨頭25靜止，且於膜形成時使基板50移動，但相反地，亦可以使基板50靜止，且使噴墨頭25移動。此外，於該情況下，雖可能產生因噴墨頭25的姿勢變動所導致之著落位置的偏差，但可得到如下效果，亦即在與應形成之膜的圖案的最小尺寸的方向（x方向）正交之方向（y方向），抑制使基板50與噴墨頭25相對移動所導致之位置的偏差。 　　接著，參閱圖5對另一實施例進行說明。以下，對與圖1～圖4所示之實施例不同之處進行說明，並省略對共用結構進行說明。 　　圖5中示出基於本實施例的膜形成裝置的噴墨頭25的配置與應形成之抗蝕膜53的位置關係。抗蝕膜53的圖案與圖2、圖4所示之實施例中的抗蝕膜53的圖案相同。於本實施例中，在噴墨頭25設置有沿與抗蝕膜53的最小尺寸的方向（x方向）正交之方向（y方向）排列之複數個噴嘴孔27y。除此以外，與圖4所示之實施例相同，設置有沿x方向以等間隔排列之複數個噴嘴孔27x。沿y方向排列之複數個噴嘴孔27y排列有兩列，且各列的複數個噴嘴孔27y配置在x坐標相同的位置。 　　例如，在頭塊26的每一個設置有排列成一列之複數個噴嘴孔27。兩個頭塊26以噴嘴孔27的排列方向與y方向平行之姿勢配置。藉此，可實現兩列份的噴嘴孔27y。藉由以噴嘴孔27的排列方向與x方向平行之姿勢配置複數個頭塊26，可實現複數個噴嘴孔27x。 　　兩列噴嘴孔27y的x方向的間隔與抗蝕膜53的最小尺寸對應。在此，“對應”不是指噴嘴孔27y的x方向的間隔與最小尺寸相等，而是指藉由從一列的噴嘴孔27y吐出之液滴而形成之膜的邊緣與藉由從另一列的噴嘴孔27y吐出之液滴而形成之膜的邊緣的間隔變得與最小尺寸相等。 　　控制裝置30（圖1）控制噴墨頭25及移動機構21（圖1），且藉由從複數個噴嘴孔27y的一部分噴嘴孔27y吐出之液滴形成抗蝕膜53中的賦予最小尺寸之一對邊緣54。邊緣54以外的部分是藉由從噴嘴孔27x吐出之液滴而形成。 　　圖5所示之實施例中，即使複數個噴嘴孔27y中的一個發生故障，仍能夠使用同一列內的另一噴嘴孔27y而形成賦予最小尺寸之邊緣54。藉此，能夠減少邊緣形成用頭塊26的更換頻率。 　　圖5所示之實施例中，將沿y方向排列之複數個噴嘴孔27y構成為兩列，但亦可以構成為一列。於該情況下，藉由第1次掃描而形成一邊緣54，且藉由第2次掃描而形成另一邊緣54即可。 　　接著，參閱圖6對又一實施例進行說明。以下，對與圖1～圖4所示之實施例不同之處進行說明，並省略對共用的結構進行說明。 　　圖6中示出基於本實施例的膜形成裝置的噴墨頭25的配置與應形成之抗蝕膜53的位置關係。噴墨頭25具有沿與最小尺寸的方向（x方向）平行之方向排列之複數個噴嘴孔27。將吐出用於形成抗蝕膜53的圖案中的賦予最小尺寸之一對邊緣54之液滴之噴嘴孔27的節距設為第1節距P1。複數個噴嘴孔27的列係包含：以比第1節距P1短的第2節距P2排列之部分、和確保有第1節距P1之部分。於以第1節距P1排列之兩個噴嘴孔27之間未配置有其他噴嘴孔。 　　例如，以第2節距P2排列之噴嘴孔27設置在複數個頭塊26的每一個。以一個頭塊26的端（圖6中的右端）的噴嘴孔27與另一頭塊26的端（圖6中的左端）的噴嘴孔27的節距成為第1節距P1的方式，對兩個頭塊26進行定位。 　　控制裝置30（圖1），以藉由從確保有第1節距P1之兩個噴嘴孔27吐出之液滴形成抗蝕膜53內的賦予最小尺寸之一對邊緣54之方式控制噴墨頭25及移動機構21（圖1）。 　　圖6所示之實施例中，於賦予最小尺寸之邊緣54之間未配置有噴嘴孔27。因此，能夠防止因噴嘴孔27的故障等而導致液滴著落到邊緣54之間。藉此，能夠抑制抗蝕膜53的應隔離之部位連續之不良情況。 　　接著，參閱圖7A～圖8B對又一實施例進行說明。以下，對與圖1～圖4所示之實施例不同之處進行說明，並省略對共用的結構進行說明。 　　圖7A中示出基於本實施例的膜形成裝置的噴墨頭25與應形成之抗蝕膜53的位置關係。抗蝕膜53的用虛線表示之區域表示尚未塗佈有抗蝕劑之區域。兩個頭塊26沿y方向排列而配置。在頭塊26的每一個設置有沿x方向以等間隔排列之複數個噴嘴孔27。一頭塊26固定成，相對於另一頭塊26在x方向偏離噴嘴孔27的節距的一半。因此，就噴墨頭25整體而言，噴嘴孔27的x方向的節距窄化成一個頭塊26的噴嘴孔27的節距的一半。 　　如圖7B所示，一邊使基板50（圖1）沿與最小尺寸的方向（x方向）正交之方向（y方向）移動，一邊形成抗蝕膜53。於圖7B中，於塗佈有抗蝕劑之區域賦予點狀圖案。抗蝕膜53中的賦予最小尺寸之一邊緣54，是藉由從一頭塊26的一噴嘴孔27吐出之液滴而形成。 　　如圖8A所示，將基板50（圖1）向最小尺寸的方向（x方向）挪移。藉此，成為能夠對藉由第1次掃描未塗佈抗蝕劑之區域塗佈從噴墨頭25吐出之液滴之狀態。 　　如圖8B所示，一邊使基板50（圖1）沿與最小尺寸的方向（x方向）正交之方向（y方向）移動，一邊形成抗蝕膜53。藉由該掃描，形成抗蝕膜53中的賦予最小尺寸之一對邊緣54當中藉由圖7B的製程未形成的另一邊緣54。此時，吐出形成邊緣54之液滴之頭塊26，係與在圖7B的製程吐出形成一邊緣54之液滴之頭塊26相同者。 　　若藉由從不同的頭塊26吐出之液滴形成一對邊緣54，其位置精度會受到頭塊26對於支撐構件28（圖1）的安裝精度的影響。圖7A～圖8B所示之實施例中，一對邊緣54藉由從相同的頭塊26吐出之液滴而形成，因此一對邊緣54的相對位置精度不會受到頭塊26的安裝位置公差的影響。藉此，能夠抑制一對邊緣54的相對位置精度的降低。 　　圖7A～圖8B所示之例中，藉由二次掃描來形成賦予最小尺寸之一對邊緣54。當一個頭塊26的噴嘴孔27的節距與賦予最小尺寸之一對邊緣54的間隔相對應時，可以藉由一次掃描來形成一對邊緣54。 　　接著，參閱圖9A～圖10B對又一實施例進行說明。以下，對與圖7A～圖8B所示之實施例不同之處進行說明，並省略對共用的結構進行說明。 　　圖9A中示出基於本實施例的膜形成裝置的噴墨頭25與應形成之抗蝕膜53的位置關係。抗蝕膜53的以虛線表示之區域表示尚未塗佈有抗蝕劑之區域。在噴墨頭25設置有沿x方向以等間隔排列之複數個噴嘴孔27。 　　如圖9B所示，一邊使基板50（圖1）沿與最小尺寸的方向（x方向）正交之方向（y方向）移動，一邊形成抗蝕膜53。於圖9B中，於塗佈有抗蝕劑之區域賦予點狀圖案。抗蝕膜53中的賦予最小尺寸之一邊緣54藉由從噴墨頭25的一個噴嘴孔27A吐出之液滴而形成。 　　如圖10A所示，將基板50（圖1）向最小尺寸的方向（x方向）挪移與最小尺寸對應的距離。藉此，藉由第1次掃描未形成之另一邊緣54成為能夠藉由從噴嘴孔27A吐出之液滴來形成之狀態。 　　如圖10B所示，一邊使基板50（圖1）沿與最小尺寸的方向（x方向）正交之方向（y方向）移動，一邊形成抗蝕膜53。藉由該掃描，形成抗蝕膜53中的賦予最小尺寸之一對邊緣54當中藉由圖9B的製程未形成之另一邊緣54。吐出形成邊緣54之液滴之噴嘴孔27A，係與於圖9B的製程吐出形成一邊緣54之液滴之噴嘴孔27A相同者。 　　圖9A～圖10B所示之實施例中，邊緣54的位置不會受到每一噴嘴孔27的液滴的吐出方向的偏差的影響。因此，能夠進一步減少一對邊緣54的相對位置關係的偏差。 　　接著，參閱圖11～圖13B對又一實施例進行說明。以下，對與圖1～圖4所示之實施例不同之處進行說明，並省略對共用的結構進行說明。本實施例中，移動機構21（圖1）具有使基板50沿支撐面的面內方向（以與支撐面垂直的軸為中心之旋轉方向）旋轉之功能。 　　圖11中示出應形成之膜60的圖案。圖1～圖4所示之實施例中，抗蝕膜53為最小尺寸的方向僅為x方向的1方向。於本實施例中，對配置成矩陣狀之複數個孤立圖案的行方向（x方向）的間隔G及列方向（y方向）的間隔G相等，且間隔G為圖案的最小尺寸。亦即，最小尺寸的方向成為x方向及y方向這兩方向。 　　圖12A中示出基於本實施例的膜形成裝置的噴墨頭25與應形成之膜60的位置關係。膜60的以虛線表示之區域表示尚未塗佈有膜材料之區域。在噴墨頭25設置有沿x方向以等間隔排列之複數個噴嘴孔27。 　　如圖12B所示，一邊使基板50（圖1）沿與一最小尺寸的方向（x方向）正交之方向（y方向）移動，一邊形成膜60的一部分。於圖12B中，於塗佈有膜材料之區域賦予點狀圖案。對包含賦予x方向的最小尺寸之一對邊緣61之區域塗佈膜材料。於包含賦予y方向的最小尺寸之一對邊緣62之區域未塗佈有膜材料。 　　如圖13A所示，控制裝置30（圖1）控制移動機構21，使基板50旋轉90°。藉此，由已形成之邊緣61賦予y方向的最小尺寸，且未形成的邊緣62賦予x方向的最小尺寸。 　　如圖13B所示，一邊使基板50（圖1）沿與由未形成的邊緣62賦予之最小尺寸的方向（x方向）正交之方向（y方向）移動，一邊形成膜60。藉由該掃描，將膜材料塗佈於包含膜60的圖案中的賦予最小尺寸之一對邊緣62之區域。 　　於圖11～圖13B中示出之實施例中，賦予相互正交之方向的最小尺寸之邊緣任一方均於沿與最小尺寸的方向正交之方向對基板進行掃描時形成。因此，於任一方的邊緣都能夠提高直線度，並且提高一對邊緣的相對位置精度。 　　接著，參閱圖14A～圖15A對又一實施例進行說明。以下，對與圖11～圖13B所示之實施例不同之處進行說明，並省略對共用的結構進行說明。 　　圖14A中示出基於本實施例的膜形成裝置的噴墨頭25與應形成之膜60的位置關係。膜60的以虛線表示之區域表示尚未塗佈有膜材料之區域。噴墨頭25包含：設置有沿x方向以等間隔排列之複數個噴嘴孔27之頭塊26、和設置有沿y方向以等間隔排列之複數個噴嘴孔27之另一頭塊26。 　　如圖14B所示，一邊使基板50（圖1）沿與一最小尺寸的方向（x方向）正交之方向（y方向）移動，一邊形成膜60的一部分。於圖14B中，對塗佈有膜材料之區域賦予點狀圖案。對包含賦予x方向的最小尺寸之一對邊緣61之區域，塗佈從具有沿x方向排列之噴嘴孔27之頭塊26吐出之膜材料。 　　如圖15A所示，一邊使基板50（圖1）沿與另一最小尺寸的方向（y方向）正交之方向（x方向）移動，一邊對於圖14B的製程中未塗佈膜材料之區域塗佈膜材料，完成了膜60的形成。於圖15A中，對塗佈有膜材料之區域賦予點狀圖案。藉由該掃描，形成賦予y方向的最小尺寸之一對邊緣62。 　　於本實施例中，與圖11～圖13B所示之實施例相同，賦予相互正交之方向的最小尺寸之邊緣任一方均於沿與最小尺寸的方向正交之方向對基板進行掃描時形成。因此，於任一方的邊緣都能夠提高直線度，並且提高一對邊緣的相對位置精度。 　　接著，參閱圖16A及圖16B對又一實施例進行說明。以下，對與圖1～圖4所示之實施例不同之處進行說明，並省略對共用的結構進行說明。 　　圖16A中示出基於本實施例的膜形成裝置的概略圖。從退繞輥71向捲取輥72傳送撓性基板70。移動機構73被控制裝置30控制，而使退繞輥71及捲取輥72旋轉。於從退繞輥71退繞而捲繞於捲取輥72之間的撓性基板70的上方配置有噴墨頭25。噴墨頭25的結構與圖1～圖4所示之實施例的噴墨頭25的結構相同。 　　撓性基板70的傳送方向與圖1～圖4的實施例中的基板50的掃描方向（y方向）對應，且撓性基板70的寬度方向與圖1～圖4的實施例中的x方向對應。一邊沿y方向傳送撓性基板70，一邊從噴墨頭25吐出膜材料的液滴，藉此能夠於撓性基板70形成膜。 　　圖16B中示出形成於撓性基板70之膜75的圖案的一例。將膜75的圖案的最小尺寸的方向設為寬度方向（x方向）。控制裝置30（圖16A）控制撓性基板70的傳送速度及來自噴墨頭25的膜材料的吐出。 　　於本實施例中，與圖1～圖4所示之實施例相同，噴墨頭25與撓性基板70的相對移動方向與應形成之膜的圖案的最小尺寸的方向正交。因此，可得到與圖1～圖4所示之實施例相同的效果。 　　接著，參閱圖17對又一實施例進行說明。以下，對於圖1～圖4所示之實施例不同之處進行說明，並省略對共用的結構進行說明。 　　圖17中示出由基於本實施例的膜形成裝置的控制裝置30執行之製程的流程圖。首先，將從輸入裝置35（圖1）輸入之圖案資料儲存於記憶裝置31（圖1）（步驟S1）。檢測由所輸入之圖案資料定義之圖案的最小尺寸的方向（步驟S2）。對最小尺寸的方向與膜形成時的基板的移動方向進行比較（步驟S3）。將膜形成時的基板的移動方向預先儲存在控制裝置30。 　　當兩者為正交的關係時，執行膜形成（步驟S4）。當兩者不是正交的關係時，控制裝置30向輸出裝置36（圖1）輸出通知圖案資料的最小尺寸的方向從最佳方向偏離之資訊（步驟S5）。 　　操作者看到從輸出裝置36輸出之資訊，能夠知道圖案資料的最小尺寸的方向從最佳方向偏離之情況。操作者以使最小尺寸的方向旋轉之方式對圖案資料進行修正。從輸入裝置35再次輸入已修正後之圖案資料。藉此，能夠抑制賦予最小尺寸之圖案中的邊緣的相對位置精度的降低。 　　輸出到輸出裝置之資訊，也可以輸出由現有的圖案資料所定義之圖案的最小尺寸的方向。又，當最小尺寸的方向與膜形成時的基板的移動方向不是正交的關係時，也可以以兩者成為正交之關係的方式自動修正圖案資料。 　　上述各實施例為例示，當然能夠進行不同實施例所示之結構的局部替換或組合。關於複數個實施例之相同結構所產生的相同效果，並未於每一實施例逐一提及。進而，本發明並不限定於上述實施例。例如，能夠進行各種變更、改良、組合等，對於本領域具有通常知識者而言是顯而易見的。1 to 4, the film forming method and film forming apparatus according to the embodiment will be described. FIG. 1 is a schematic diagram of a film forming apparatus according to an embodiment. The base 20 supports the support portion 23 through the moving mechanism 21. The substrate 50 is supported on the upper surface (support surface) of the support portion 23. The moving mechanism 21 can move the substrate 50 in the two-dimensional direction by moving the supporting portion 23 in the two-dimensional direction parallel to the supporting surface. Generally, the supporting surface of the supporting portion 23 is kept horizontal. Define the xyz rectangular coordinate system with the two directions parallel to the support surface as the x-axis and y-axis. The inkjet head 25 is arranged above the substrate 50 supported by the support portion 23. The inkjet head 25 is supported by the base 20 by the gate frame 24. The inkjet head 25 includes a plurality of head blocks 26. A plurality of head blocks 26 are mounted on a common support member 28. Each of the head blocks 26 is provided with a plurality of nozzle holes. The droplet of the film material is discharged from the nozzle hole to the substrate 50.　　 The liquid film material attached to the substrate 50 is hardened to form a film. As the film material, photocurable resin, thermosetting resin, or the like can be used. A light source or a heat source that hardens the film material adhering to the substrate 50 is arranged on the side of the inkjet head 25. The control device 30 controls the movement of the support portion 23 by the moving mechanism 21 and the discharge of the film material from the nozzle hole of the inkjet head 25. The control device 30 includes a memory device 31, and the memory device 31 stores pattern data of the film to be formed. The control device 30 controls the moving mechanism 21 and the inkjet head 25 based on the pattern data, whereby a film of a desired pattern can be formed on the substrate 50.　　 Input various commands or materials from the input device 35 to the control device 30. The input device 35 uses, for example, a keyboard, a pointing device, a USB port, a communication device, or the like. Various information related to the operation of the film forming device is output to the output device 36. The output device 36 uses, for example, a liquid crystal display, a speaker, a USB port, a communication device, or the like. FIG. 2 shows, as an example of a film to be formed, a resist film 53 used as an etching mask when patterning a transparent electrode of a touch panel. The transparent electrode is formed by etching the resist film 53 as an etching mask to form a transparent conductive film including ITO or the like. In FIG. 2, a dot pattern is given to the area where the resist is applied. The plural pad portions 51 are arranged in a matrix, and the connecting portion 52 is connected to the plural pad portions 51 in the column direction. In the xyz rectangular coordinate system defined in FIG. 1, the row direction corresponds to the x direction, and the column direction corresponds to the y direction. The interval G of the pad portions 51 adjacent in the x direction becomes the minimum size of the pattern. The direction of this minimum size is the x direction, and its size is, for example, about 30 μm.　　 If the landing position of one of the droplets with the smallest size used to form the pattern is deviated in the x direction, the pad portions 51 adjacent in the x direction are connected. If the two pads 51 that should be separated are connected, the touch panel cannot operate normally. However, even if the landing position of the droplet deviates in the y direction, the two pad portions 51 separated in the x direction will not be connected. Therefore, it is preferable to make the positional accuracy of the droplet of one of the paired edges 54 of the smallest size in the formed pattern in the x direction higher than the positional accuracy in the y direction.　　 Next, referring to FIGS. 3A and 3B, the accuracy of the landing position of the droplets in the x direction and the y direction will be described. FIG. 3A shows the deviation of the drop target position and the drop position of the droplet. The landing target position 55 is indicated by a solid line, and the plural landing positions where deviation occurs are indicated by a broken line. When coating the film material, while moving the substrate 50 (FIG. 1) in the y direction, droplets of the film material are discharged from the predetermined nozzle hole of the inkjet head 25. The main reasons for the deviation of the droplet landing position are as follows: deviation from the nozzle hole to the discharge direction, deviation of the moving speed of the substrate 50, deviation of the discharge timing from the nozzle hole, deviation of the discharge speed of the droplet, and the like. Among the causes of these deviations, the deviation from the nozzle hole to the discharge direction is the cause of the deviation of the position in both the x direction and the y direction. The other three main causes of deviations are the main causes of positional deviations in the y direction, but they are not the main causes of positional deviations in the x direction. Therefore, the maximum width Dx of the deviation in the x direction is smaller than the maximum width Dy of the deviation in the y direction. FIG. 3B shows an example of the film shape when a strip-shaped film is formed while moving the substrate 50 (FIG. 1) in the y direction. The inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. Since the deviation of the droplet landing position in the x direction is smaller than the deviation in the y direction, the sides of the long side along the y-direction of the strip-shaped film 56 have both sides of the long side along the x-direction of the strip-shaped film 57 The sides have higher straightness, and the deviation of the width of the film 56 (the deviation of the position in the x direction) is smaller than the deviation of the width of the film 57 (the deviation of the position in the y direction).　　 Next, referring to FIG. 4, a method of forming a resist film for forming a transparent electrode for a touch panel will be described. FIG. 4 shows the positional relationship between the resist film 53 to be formed and the inkjet head 25. The pattern data is prepared so that the direction of the smallest dimension of the resist film 53 coincides with the x direction. The minimum size is given by the pair of edges 54 of the resist film 53. Based on the pattern data, the control device 30 (FIG. 1) controls the moving mechanism 21 to discharge the droplets of the film material from the nozzle holes 27 of the inkjet head 25 while moving the substrate 50 (FIG. 1) in the y direction. When it is impossible to form the entire resist film 53 over the entire area of the substrate 50 by moving it once in the y direction of the substrate 50 (hereinafter referred to as scanning), the substrate 50 is moved in the x direction to perform the second and subsequent scans. This can form the entire resist film 53. Next, the excellent effects of the embodiments shown in FIGS. 1 to 4 will be described. When forming the film while moving the substrate 50 in the direction (y direction) orthogonal to the direction of the smallest dimension of the film pattern to be formed (x direction), the direction of the edge 54 (FIG. 4) and the direction of movement of the substrate 50 The relationship is the same as the relationship between the direction of the edge of the film 56 of FIG. 3B and the moving direction of the substrate. Therefore, as described with reference to FIGS. 3A and 3B, it is possible to reduce the deviation of the position of the edge 54 (FIG. 4) in one of the smallest dimensions in the pattern in the x direction, and to improve the straightness of the edge 54. With this, it is possible to suppress the two pad portions 51 adjacent to each other in the x direction from being continuous with each other across the smallest-sized portion. In addition, in the above embodiment, as shown in FIG. 1, the inkjet head 25 is stationary with respect to the base 20, and the film is formed while moving the support 23 in the y direction. When the inkjet head 25 is moved relative to the base 20, the posture of the inkjet head 25 slightly changes due to the movement of the inkjet head 25. A change in the posture of the inkjet head 25 changes the direction in which the liquid droplets are discharged, and therefore causes a variation in the positional accuracy of the landing position. In the above-described embodiment, the inkjet head 25 is stationary relative to the base 20 during film formation, and therefore it is possible to reduce the deviation of the landing position caused by the posture change of the inkjet head 25. In the above embodiment, the resist film was formed by the inkjet printing technique, but other films can also be formed. In addition, in the above-mentioned embodiment, the minimum size is given by the gap of the area where the resist is applied, but the minimum size may be given by the area where the resist is applied. For example, the film can also be formed so that the width of the thin line formed by the resist becomes the smallest size. In this case, by applying the method based on the embodiment, it is possible to suppress the occurrence of disconnection in the thin line. In the above embodiment, the inkjet head 25 is stationary, and the substrate 50 is moved during film formation, but conversely, the substrate 50 may be stationary and the inkjet head 25 may be moved. In addition, in this case, although there may be a deviation in the landing position caused by the posture change of the inkjet head 25, the following effect can be obtained, that is, in the direction of the minimum size of the pattern of the film to be formed (x direction) ) The orthogonal direction (y direction) suppresses the positional deviation caused by the relative movement of the substrate 50 and the inkjet head 25.　　 Next, referring to FIG. 5, another embodiment will be described. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common structure will be omitted. FIG. 5 shows the positional relationship between the arrangement of the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The pattern of the resist film 53 is the same as the pattern of the resist film 53 in the embodiments shown in FIGS. 2 and 4. In this embodiment, the inkjet head 25 is provided with a plurality of nozzle holes 27y arranged in a direction (y direction) orthogonal to the direction (x direction) of the smallest dimension of the resist film 53. Except for this, as in the embodiment shown in FIG. 4, a plurality of nozzle holes 27x arranged at equal intervals in the x direction are provided. The plurality of nozzle holes 27y arranged in the y direction are arranged in two rows, and the plurality of nozzle holes 27y in each row are arranged at the same position on the x coordinate.　　 For example, each of the head blocks 26 is provided with a plurality of nozzle holes 27 arranged in a row. The two head blocks 26 are arranged such that the arrangement direction of the nozzle holes 27 is parallel to the y direction. Thereby, two rows of nozzle holes 27y can be realized. By arranging the plurality of head blocks 26 in a posture in which the arrangement direction of the nozzle holes 27 is parallel to the x direction, a plurality of nozzle holes 27x can be realized. The distance between the two rows of nozzle holes 27y in the x direction corresponds to the minimum size of the resist film 53. Here, "corresponding" does not mean that the interval of the nozzle holes 27y in the x direction is equal to the minimum size, but refers to the edge of the film formed by the droplets ejected from the nozzle holes 27y of one row and the nozzles from the other row The distance between the edges of the film formed by the droplets ejected from the hole 27y becomes equal to the minimum size. The control device 30 (FIG. 1) controls the inkjet head 25 and the moving mechanism 21 (FIG. 1 ), and forms the smallest dimension given in the resist film 53 by droplets ejected from a part of the nozzle holes 27y of the plurality of nozzle holes 27y A pair of edges 54. The portion other than the edge 54 is formed by droplets ejected from the nozzle hole 27x. In the embodiment shown in FIG. 5, even if one of the plurality of nozzle holes 27y fails, the other nozzle hole 27y in the same row can still be used to form the edge 54 with the smallest size. This can reduce the frequency of replacement of the head block 26 for edge formation. In the embodiment shown in FIG. 5, the plurality of nozzle holes 27y arranged in the y direction are configured in two rows, but they may be configured in one row. In this case, one edge 54 is formed by the first scan, and the other edge 54 is formed by the second scan.　　 Next, another embodiment will be described with reference to FIG. 6. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 6 shows the positional relationship between the arrangement of the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The inkjet head 25 has a plurality of nozzle holes 27 arranged in a direction parallel to the direction of the smallest size (x direction). The pitch of the nozzle holes 27 that discharge the droplets of one of the smallest sizes of the pair of edges 54 in the pattern for forming the resist film 53 is set as the first pitch P1. The row system of the plurality of nozzle holes 27 includes a portion arranged at a second pitch P2 shorter than the first pitch P1, and a portion secured with the first pitch P1. No other nozzle holes are arranged between the two nozzle holes 27 arranged at the first pitch P1.　　 For example, the nozzle holes 27 arranged at the second pitch P2 are provided in each of the plurality of head blocks 26. The pitch of the nozzle holes 27 at the end of one head block 26 (the right end in FIG. 6) and the nozzle holes 27 at the end of the other head block 26 (the left end in FIG. 6) becomes the first pitch P1. The head block 26 is positioned. The control device 30 (FIG. 1) controls the inkjet head in such a manner that a pair of edges 54 of the smallest size given in the resist film 53 is formed by the droplets ejected from the two nozzle holes 27 having the first pitch P1 25 and mobile mechanism 21 (Figure 1). In the embodiment shown in FIG. 6, the nozzle hole 27 is not arranged between the edges 54 with the smallest dimension. Therefore, it is possible to prevent the liquid droplets from landing between the edges 54 due to the failure of the nozzle hole 27 or the like. With this, it is possible to suppress the defect that the portions to be isolated of the resist film 53 are continuous.　　 Next, another embodiment will be described with reference to FIGS. 7A to 8B. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 7A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The area of the resist film 53 indicated by the dotted line indicates the area where the resist has not been applied. The two head blocks 26 are arranged in the y direction. Each of the head blocks 26 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. One head block 26 is fixed so as to be offset from the other head block 26 by half the pitch of the nozzle holes 27 in the x direction. Therefore, for the entire inkjet head 25, the pitch of the nozzle holes 27 in the x direction is narrowed to half the pitch of the nozzle holes 27 of one head block 26. As shown in FIG. 7B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in the direction (y direction) orthogonal to the direction (x direction) that is the smallest dimension (x direction). In FIG. 7B, a dot pattern is given to the area where the resist is applied. One of the edges 54 of the resist film 53 with the smallest dimension is formed by droplets ejected from a nozzle hole 27 of a head block 26.　　As shown in FIG. 8A, the substrate 50 (FIG. 1) is moved in the direction of the smallest size (x direction). This makes it possible to apply droplets discharged from the inkjet head 25 to the area where the resist is not applied by the first scan. As shown in FIG. 8B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the smallest size (x direction). By this scanning, the other edge 54 which is not formed by the process of FIG. 7B is formed among the pair of edges 54 in the resist film 53 which is given the smallest size. At this time, the discharge of the head block 26 forming the edge 54 is the same as the discharge of the head block 26 forming the edge 54 in the process of FIG. 7B.　　If a pair of edges 54 are formed by droplets ejected from different head blocks 26, their position accuracy will be affected by the mounting accuracy of the head block 26 on the support member 28 (FIG. 1). In the embodiment shown in FIGS. 7A-8B, a pair of edges 54 are formed by droplets ejected from the same head block 26, so the relative position accuracy of the pair of edges 54 is not affected by the mounting position tolerance of the head block 26 Impact. With this, it is possible to suppress a decrease in the relative position accuracy of the pair of edges 54. In the example shown in FIGS. 7A to 8B, the pair of edges 54 with the smallest size is formed by second scanning. When the pitch of the nozzle holes 27 of one head block 26 corresponds to the interval of the pair of edges 54 given the smallest size, a pair of edges 54 can be formed by one scan.　　 Next, another embodiment will be described with reference to FIGS. 9A to 10B. Hereinafter, the differences from the embodiments shown in FIGS. 7A to 8B will be described, and the description of the common configuration will be omitted. FIG. 9A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed. The area indicated by the dotted line of the resist film 53 indicates the area to which the resist has not been applied. The inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. As shown in FIG. 9B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the smallest size (x direction). In FIG. 9B, a dot pattern is given to the area where the resist is applied. One of the edges 54 of the resist film 53 with the smallest size is formed by droplets ejected from one nozzle hole 27A of the inkjet head 25.　　 As shown in FIG. 10A, the substrate 50 (FIG. 1) is moved in the direction of the minimum size (x direction) by the distance corresponding to the minimum size. With this, the other edge 54 that is not formed by the first scan becomes a state that can be formed by the droplet discharged from the nozzle hole 27A. As shown in FIG. 10B, the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the smallest size (x direction). By this scanning, the other edge 54 which is not formed by the process of FIG. 9B among the pair of edges 54 of the minimum size given in the resist film 53 is formed. The nozzle hole 27A that ejects the droplet forming the edge 54 is the same as the nozzle hole 27A that ejects the droplet forming the edge 54 in the process of FIG. 9B. In the embodiment shown in FIGS. 9A to 10B, the position of the edge 54 is not affected by the deviation of the discharge direction of the liquid droplets for each nozzle hole 27. Therefore, the deviation of the relative positional relationship of the pair of edges 54 can be further reduced.　　 Next, another embodiment will be described with reference to FIGS. 11 to 13B. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. In this embodiment, the moving mechanism 21 (FIG. 1) has the function of rotating the substrate 50 in the in-plane direction of the support surface (the rotation direction centered on the axis perpendicular to the support surface). FIG. 11 shows the pattern of the film 60 to be formed. In the embodiments shown in FIGS. 1 to 4, the direction in which the resist film 53 has the smallest size is only one direction in the x direction. In this embodiment, the interval G in the row direction (x direction) and the interval G in the column direction (y direction) of the plurality of isolated patterns arranged in a matrix are equal, and the interval G is the minimum size of the pattern. That is, the direction of the smallest size becomes both the x direction and the y direction. FIG. 12A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the film 60 to be formed. The area indicated by the dotted line of the film 60 indicates the area that has not been coated with the film material. The inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. As shown in FIG. 12B, a part of the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to a direction (x direction) of a minimum size. In FIG. 12B, a dot pattern is given to the area coated with the film material. The film material is applied to the area containing one of the pair of edges 61 with the smallest dimension given in the x direction. The area containing one of the pair of edges 62 with one of the smallest dimensions given in the y direction is not coated with the film material. As shown in FIG. 13A, the control device 30 (FIG. 1) controls the moving mechanism 21 to rotate the substrate 50 by 90°. By this, the smallest dimension in the y direction is given by the formed edge 61, and the smallest dimension in the x direction is given by the unformed edge 62. As shown in FIG. 13B, the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction (x direction) that is the smallest dimension given by the unformed edge 62. With this scan, the film material is applied to the region of the pair of edges 62 that gives the smallest dimension in the pattern containing the film 60. In the embodiments shown in FIGS. 11 to 13B, any one of the edges that are given the smallest dimension in the mutually orthogonal directions is formed when the substrate is scanned in the direction perpendicular to the smallest dimension direction. Therefore, the straightness can be improved on either edge, and the relative position accuracy of a pair of edges can be improved.　　 Next, another embodiment will be described with reference to FIGS. 14A to 15A. Hereinafter, the differences from the embodiments shown in FIGS. 11 to 13B will be described, and the description of the common configuration will be omitted. FIG. 14A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the film 60 to be formed. The area indicated by the dotted line of the film 60 indicates the area that has not been coated with the film material. The inkjet head 25 includes a head block 26 provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction, and another head block 26 provided with a plurality of nozzle holes 27 arranged at equal intervals in the y direction. As shown in FIG. 14B, a part of the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to a direction (x direction) of a minimum size. In FIG. 14B, a dot pattern is given to the region coated with the film material. For the region including the pair of edges 61 with the smallest dimension given in the x direction, the film material discharged from the head block 26 having the nozzle holes 27 arranged in the x direction is applied. As shown in FIG. 15A, while moving the substrate 50 (FIG. 1) in a direction (x direction) orthogonal to the direction of the other smallest dimension (y direction), the area where the film material is not coated in the process of FIG. 14B The film material is applied, and the formation of the film 60 is completed. In FIG. 15A, a dot pattern is given to the area coated with the film material. By this scanning, a pair of edges 62 that is the smallest dimension given to the y direction is formed. In this embodiment, as in the embodiments shown in FIGS. 11 to 13B, any one of the edges that are given the smallest dimension in the mutually orthogonal directions is formed when the substrate is scanned in the direction orthogonal to the smallest dimension direction . Therefore, the straightness can be improved on either edge, and the relative position accuracy of a pair of edges can be improved.　　 Next, another embodiment will be described with reference to FIGS. 16A and 16B. Hereinafter, the differences from the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 16A shows a schematic diagram of the film forming apparatus according to this embodiment. The flexible substrate 70 is transferred from the unwinding roller 71 to the winding roller 72. The moving mechanism 73 is controlled by the control device 30 to rotate the unwinding roller 71 and the winding roller 72. The inkjet head 25 is disposed above the flexible substrate 70 unwound from the unwinding roller 71 and wound between the take-up rollers 72. The structure of the inkjet head 25 is the same as the structure of the inkjet head 25 of the embodiment shown in FIGS. 1 to 4. The transfer direction of the flexible substrate 70 corresponds to the scanning direction (y direction) of the substrate 50 in the embodiments of FIGS. 1 to 4, and the width direction of the flexible substrate 70 corresponds to the x direction in the embodiments of FIGS. 1 to 4. correspond. While the flexible substrate 70 is conveyed in the y direction, droplets of the film material are discharged from the inkjet head 25, whereby a film can be formed on the flexible substrate 70. FIG. 16B shows an example of the pattern of the film 75 formed on the flexible substrate 70. Let the direction of the smallest dimension of the pattern of the film 75 be the width direction (x direction). The control device 30 (FIG. 16A) controls the transfer speed of the flexible substrate 70 and the discharge of the film material from the inkjet head 25. In this embodiment, as in the embodiments shown in FIGS. 1 to 4, the relative movement direction of the inkjet head 25 and the flexible substrate 70 is orthogonal to the direction of the smallest size of the pattern of the film to be formed. Therefore, the same effect as the embodiments shown in FIGS. 1 to 4 can be obtained.　　 Next, referring to FIG. 17, another embodiment will be described. Hereinafter, the differences between the embodiments shown in FIGS. 1 to 4 will be described, and the description of the common configuration will be omitted. FIG. 17 shows a flowchart of the process performed by the control device 30 of the film forming apparatus based on this embodiment. First, the pattern data input from the input device 35 (FIG. 1) is stored in the memory device 31 (FIG. 1) (step S1). The direction of the smallest size of the pattern defined by the input pattern data is detected (step S2). The direction of the smallest size is compared with the moving direction of the substrate at the time of film formation (step S3). The moving direction of the substrate at the time of film formation is stored in the control device 30 in advance.　　 When the two are in an orthogonal relationship, film formation is performed (step S4). When the two are not in an orthogonal relationship, the control device 30 outputs to the output device 36 (FIG. 1) that the direction in which the direction of the minimum size of the pattern data deviates from the optimal direction (step S5). The operator sees the information output from the output device 36 and can know that the direction of the smallest size of the pattern data deviates from the optimal direction. The operator corrects the pattern data by rotating the direction of the smallest size. The corrected pattern data is input again from the input device 35. With this, it is possible to suppress a decrease in the relative position accuracy of the edge in the pattern given the smallest size.　　 The information output to the output device can also output the direction of the minimum size of the pattern defined by the existing pattern data. In addition, when the direction of the minimum size is not orthogonal to the moving direction of the substrate at the time of film formation, the pattern data may be automatically corrected so that the relationship between them is orthogonal.　　The above embodiments are examples, and of course, partial replacement or combination of the structures shown in the different embodiments is possible. Regarding the same effect produced by the same structure of the plurality of embodiments, it is not mentioned one by one in each embodiment. Furthermore, the present invention is not limited to the above embodiments. For example, various changes, improvements, combinations, etc. are obvious to those having ordinary knowledge in the art.

20‧‧‧基台 21‧‧‧移動機構 23‧‧‧支撐部 24‧‧‧門型框架 25‧‧‧噴墨頭 26‧‧‧頭塊 27‧‧‧噴嘴孔 27A‧‧‧噴嘴孔 27x‧‧‧沿x方向排列之噴嘴孔 27y‧‧‧沿y方向排列之噴嘴孔 28‧‧‧支撐構件 30‧‧‧控制裝置 31‧‧‧記憶裝置 35‧‧‧輸入裝置 36‧‧‧輸出裝置 50‧‧‧基板 51‧‧‧墊部 52‧‧‧連接部 53‧‧‧抗蝕膜 54‧‧‧賦予最小尺寸之邊緣 55‧‧‧著落目標位置 56、57‧‧‧帶狀膜 60‧‧‧膜 61、62‧‧‧邊緣 70‧‧‧撓性基板 71‧‧‧退繞輥 72‧‧‧捲取輥 73‧‧‧移動機構 75‧‧‧膜 20‧‧‧Abutment 21‧‧‧Moving mechanism 23‧‧‧Support 24‧‧‧door frame 25‧‧‧Inkjet head 26‧‧‧Head block 27‧‧‧ nozzle hole 27A‧‧‧Nozzle hole 27x‧‧‧ nozzle holes arranged along the x direction 27y‧‧‧ nozzle holes arranged along the y direction 28‧‧‧Supporting member 30‧‧‧Control device 31‧‧‧memory device 35‧‧‧Input device 36‧‧‧Output device 50‧‧‧ substrate 51‧‧‧Pad 52‧‧‧Connection 53‧‧‧resist film 54‧‧‧The edge with the smallest size 55‧‧‧ landing target 56, 57‧‧‧ Ribbon film 60‧‧‧membrane 61, 62‧‧‧ edge 70‧‧‧Flexible substrate 71‧‧‧Unwinding roller 72‧‧‧ Take-up roller 73‧‧‧Moving mechanism 75‧‧‧membrane

圖1係基於實施例的膜成形裝置的概略圖。 　　圖2係表示作為應形成之膜的一例，於將觸控面板的透明電極圖案化時用作蝕刻遮罩之抗蝕圖案之俯視圖。 　　圖3A係表示液滴的著落目標位置及著落位置的偏差之圖，圖3B係表示一邊使基板沿y方向移動一邊形成帶狀膜時的膜形狀的一例之圖。 　　圖4係表示應形成之抗蝕膜與噴墨頭的位置關係之圖。 　　圖5係表示基於另一實施例的膜形成裝置的噴墨頭的配置與應形成之抗蝕膜的位置關係之圖。 　　圖6係表示基於又一實施例的膜形成裝置的噴墨頭的配置與應形成之抗蝕膜的位置關係之圖。 　　圖7A及圖7B係表示基於又一實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的位置關係之圖。 　　圖8A及圖8B係表示基於圖7A及圖7B所示之實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的另一位置關係之圖。 　　圖9A及圖9B係表示基於又一實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的位置關係之圖。 　　圖10A及圖10B係表示基於圖9A及圖9B所示之實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的另一位置關係之圖。 　　圖11係藉由基於另一實施例的膜形成方法表示應形成之膜的圖案之圖。 　　圖12A及圖12B係表示基於圖11所示之實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的位置關係之圖。 　　圖13A及圖13B係表示基於圖12A及圖12B所示之實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的另一位置關係之圖。 　　圖14A及圖14B係表示基於又一實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的位置關係之圖。 　　圖15A係表示基於圖14A及圖14B所示之實施例的膜形成裝置的噴墨頭與應形成之抗蝕膜的另一位置關係之圖。 　　圖16A係基於又一實施例的膜形成裝置的概略圖，圖16B係表示形成於撓性基板之膜的圖案的一例之圖。 　　圖17係由基於又一實施例的膜形成裝置的控制裝置執行之製程的流程圖。FIG. 1 is a schematic diagram of a film forming apparatus according to an embodiment. FIG. 2 is a plan view of a resist pattern used as an etching mask when patterning transparent electrodes of a touch panel as an example of a film to be formed. FIG. 3A is a diagram showing the difference between the landing target position of the droplet and the landing position, and FIG. 3B is a diagram showing an example of the film shape when a strip-shaped film is formed while moving the substrate in the y direction. FIG. 4 is a diagram showing the positional relationship between the resist film to be formed and the inkjet head. FIG. 5 is a diagram showing the positional relationship between the arrangement of the inkjet head of the film forming apparatus according to another embodiment and the resist film to be formed. FIG. 6 is a diagram showing the positional relationship between the arrangement of the inkjet head and the resist film to be formed in the film forming apparatus according to still another embodiment. FIG. 7A and FIG. 7B are diagrams showing the positional relationship between the inkjet head of the film forming apparatus according to still another embodiment and the resist film to be formed. FIGS. 8A and 8B are diagrams showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiment shown in FIGS. 7A and 7B and the resist film to be formed. FIGS. 9A and 9B are diagrams showing the positional relationship between the inkjet head and the resist film to be formed in the film forming apparatus according to still another embodiment. FIGS. 10A and 10B are diagrams showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiments shown in FIGS. 9A and 9B and the resist film to be formed. FIG. 11 is a diagram showing the pattern of the film to be formed by the film forming method according to another embodiment. FIG. 12A and FIG. 12B are diagrams showing the positional relationship between the inkjet head of the film forming apparatus according to the embodiment shown in FIG. 11 and the resist film to be formed. FIGS. 13A and 13B are diagrams showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiments shown in FIGS. 12A and 12B and the resist film to be formed. FIGS. 14A and 14B are diagrams showing the positional relationship between the inkjet head and the resist film to be formed in the film forming apparatus according to still another embodiment. FIG. 15A is a diagram showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiment shown in FIGS. 14A and 14B and the resist film to be formed. FIG. 16A is a schematic diagram of a film forming apparatus according to still another embodiment, and FIG. 16B is a diagram showing an example of a pattern of a film formed on a flexible substrate. FIG. 17 is a flowchart of a process performed by the control device of the film forming apparatus based on still another embodiment.

25‧‧‧噴墨頭 25‧‧‧Inkjet head

27‧‧‧噴嘴孔 27‧‧‧ nozzle hole

51‧‧‧墊部 51‧‧‧Pad

52‧‧‧連接部 52‧‧‧Connection

53‧‧‧抗蝕膜 53‧‧‧resist film

54‧‧‧賦予最小尺寸之邊緣 54‧‧‧The edge with the smallest size

Claims (11)

一種膜形成方法，係一邊對於噴墨頭使基板相對移動，一邊基於用於定義應形成之膜的圖案之圖案資料從前述噴墨頭向前述基板吐出液滴而於前述基板形成膜，前述噴墨頭與前述基板的相對移動方向，是與由前述圖案資料所定義之圖案的最小尺寸的方向正交，前述噴墨頭係包含吐出液滴之複數個噴嘴孔，一邊使前述基板沿與前述最小尺寸的方向正交之方向移動，一邊形成前述圖案中的賦予前述最小尺寸之一邊緣，然後，將前述基板向前述最小尺寸的方向挪移，然後，一邊使前述基板沿與前述最小尺寸的方向正交之方向移動，一邊形成前述圖案中的賦予前述最小尺寸之另一邊緣，形成前述一邊緣和另一邊緣之液滴，是從前述複數個噴嘴孔當中相同的噴嘴孔吐出。 A film forming method is to form a film on the substrate by ejecting droplets from the inkjet head to the substrate based on pattern data defining a pattern of a film to be formed while moving the substrate relative to the inkjet head The relative movement direction of the ink head and the substrate is orthogonal to the direction of the smallest size of the pattern defined by the pattern data. The inkjet head includes a plurality of nozzle holes for discharging liquid droplets, while the substrate is aligned with the The direction of the minimum size is moved in a direction orthogonal to the edge of the minimum size in the pattern, and then the substrate is moved in the direction of the minimum size, and then the substrate is oriented in the direction of the minimum size. Moving in the orthogonal direction, while forming the other edge given the minimum size in the aforementioned pattern, droplets forming the aforementioned one edge and the other edge are ejected from the same nozzle hole among the plurality of nozzle holes. 如申請專利範圍第1項所述之膜形成方法，其中，前述噴墨頭被基台支撐，且形成前述膜時係使前述基板相對於前述基台進行移動。 The film forming method as described in item 1 of the patent application range, wherein the inkjet head is supported by the base, and the substrate is moved relative to the base when forming the film. 一種膜形成裝置，其具有：支撐部，對基板進行支撐； 噴墨頭，向前述基板吐出液滴；移動機構，使被前述支撐部支撐之前述基板及前述噴墨頭的一方相對於另一方沿至少一維方向移動；及控制裝置，控制前述噴墨頭及前述移動機構，前述控制裝置，係儲存有用於定義應形成於前述基板之膜的圖案之圖案資料，並控制前述噴墨頭及前述移動機構，一邊使前述基板相對於前述噴墨頭朝向與由前述圖案資料所定義之圖案的最小尺寸的方向正交之方向移動，一邊基於前述圖案資料從前述噴墨頭向前述基板吐出液滴而形成膜，前述噴墨頭係具有沿與前述最小尺寸的方向平行之方向排列之複數個噴嘴孔，將吐出用於形成前述圖案中的賦予前述最小尺寸之一對邊緣之液滴之噴嘴孔的節距設為第1節距時，前述複數個噴嘴孔的列係包含：以比前述第1節距短的第2節距排列之部分、和確保有前述第1節距之部分，前述控制裝置係藉由從確保有前述第1節距之兩個前述噴嘴孔吐出之液滴，來形成前述圖案中的賦予前述最小尺寸之一對邊緣。 A film forming device having: a support portion that supports a substrate; An inkjet head ejects droplets to the substrate; a moving mechanism moves one of the substrate and the inkjet head supported by the support portion in at least one direction relative to the other; and a control device that controls the inkjet head And the moving mechanism, the control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and the moving mechanism while orienting the substrate with respect to the inkjet head The direction of the minimum size of the pattern defined by the pattern data is moved in a direction orthogonal to each other, and a liquid droplet is ejected from the inkjet head to the substrate based on the pattern data to form a film. The inkjet head has a length along the minimum size The plurality of nozzle holes are arranged in a direction parallel to the direction, and when the pitch of the nozzle holes that discharge the droplets that give one of the pair of edges of the minimum size for forming the pattern is the first pitch, the plurality of nozzles The row of holes includes: a part arranged at a second pitch shorter than the first pitch, and a part ensuring the first pitch, the control device is provided with two parts by ensuring the first pitch The droplets ejected from the aforementioned nozzle holes form a pair of edges that are given the aforementioned minimum size in the aforementioned pattern. 一種膜形成裝置，其具有：支撐部，對基板進行支撐；噴墨頭，向前述基板吐出液滴；移動機構，使被前述支撐部支撐之前述基板及前述噴 墨頭的一方相對於另一方沿至少一維方向移動；及控制裝置，控制前述噴墨頭及前述移動機構，前述控制裝置，係儲存有用於定義應形成於前述基板之膜的圖案之圖案資料，並控制前述噴墨頭及前述移動機構，一邊使前述基板相對於前述噴墨頭朝向與由前述圖案資料所定義之圖案的最小尺寸的方向正交之方向移動，一邊基於前述圖案資料從前述噴墨頭向前述基板吐出液滴而形成膜，前述噴墨頭係包含安裝在共用的支撐構件之複數個頭塊，前述複數個頭塊具有吐出液滴之複數個噴嘴孔，前述控制裝置係藉由從前述複數個頭塊當中相同的頭塊的前述複數個噴嘴孔當中任一個噴嘴孔吐出之液滴，來形成前述圖案中的賦予前述最小尺寸之一對邊緣。 A film forming apparatus includes: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; and a moving mechanism that causes the substrate and the spray supported by the supporting portion One of the ink heads moves in at least one direction relative to the other; and a control device that controls the inkjet head and the moving mechanism, and the control device stores pattern data for defining the pattern of the film that should be formed on the substrate , And control the inkjet head and the moving mechanism, while moving the substrate relative to the inkjet head in a direction orthogonal to the direction of the minimum size of the pattern defined by the pattern data, based on the pattern data from the An inkjet head ejects droplets onto the substrate to form a film. The inkjet head includes a plurality of head blocks mounted on a common support member, the plurality of head blocks has a plurality of nozzle holes for ejecting droplets, and the control device is provided by The droplets ejected from any one of the nozzle holes of the plurality of nozzle holes of the same head block among the plurality of head blocks form a pair of edges that are given the minimum size in the pattern. 一種膜形成裝置，其具有：支撐部，對基板進行支撐；噴墨頭，向前述基板吐出液滴；移動機構，使被前述支撐部支撐之前述基板及前述噴墨頭的一方相對於另一方沿至少一維方向移動；及控制裝置，控制前述噴墨頭及前述移動機構，前述控制裝置，係儲存有用於定義應形成於前述基板之膜的圖案之圖案資料，並控制前述噴墨頭及前述移動機構，一邊使前述基板相對於前述噴墨頭朝向與由前述圖案資料所定義之圖案的最小尺寸的方向正交之方向移動，一 邊基於前述圖案資料從前述噴墨頭向前述基板吐出液滴而形成膜，前述移動機構係具有使前述基板沿二維方向移動之功能，前述噴墨頭係包含吐出液滴之複數個噴嘴孔，前述控制裝置係一邊使前述基板沿與前述最小尺寸的方向正交之方向移動，一邊形成前述圖案中的賦予前述最小尺寸之一邊緣，然後，將前述基板向前述最小尺寸的方向挪移，然後，一邊使前述基板沿與前述最小尺寸的方向正交之方向移動，一邊形成前述圖案中的賦予前述最小尺寸之另一邊緣，形成前述一邊緣和另一邊緣之液滴，是從前述複數個噴嘴孔當中相同的噴嘴孔吐出。 A film forming apparatus comprising: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; a moving mechanism that causes one of the substrate and the inkjet head supported by the supporting portion to be opposed to the other Moving in at least one direction; and a control device that controls the inkjet head and the moving mechanism, the control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and The moving mechanism moves the substrate relative to the inkjet head in a direction orthogonal to the direction of the smallest dimension of the pattern defined by the pattern data, a A film is formed by ejecting droplets from the inkjet head to the substrate based on the pattern data, the moving mechanism has a function of moving the substrate in a two-dimensional direction, and the inkjet head includes a plurality of nozzle holes that eject droplets , The control device moves the substrate in a direction orthogonal to the direction of the minimum size, while forming an edge of the pattern that is given the minimum size, then moves the substrate in the direction of the minimum size, and then , While moving the substrate in the direction orthogonal to the direction of the minimum size, while forming the other edge in the pattern given the minimum size, forming the droplets of the one edge and the other edge from the plurality of The same nozzle hole among the nozzle holes is ejected. 一種膜形成裝置，其具有：支撐部，對基板進行支撐；噴墨頭，向前述基板吐出液滴；移動機構，使被前述支撐部支撐之前述基板及前述噴墨頭的一方相對於另一方沿至少一維方向移動；及控制裝置，控制前述噴墨頭及前述移動機構，前述控制裝置，係儲存有用於定義應形成於前述基板之膜的圖案之圖案資料，並控制前述噴墨頭及前述移動機構，一邊使前述基板相對於前述噴墨頭朝向與由前述圖案 資料所定義之圖案的最小尺寸的方向正交之方向移動，一邊基於前述圖案資料從前述噴墨頭向前述基板吐出液滴而形成膜，前述移動機構係具有使前述基板沿二維方向移動之功能，由前述圖案資料所定義之圖案的最小尺寸，是於相互正交之第1方向及第2方向上顯現，前述噴墨頭係包含：具有沿前述第1方向排列之複數個噴嘴孔之第1頭塊、和具有沿前述第2方向排列之複數個噴嘴孔之第2頭塊，於形成前述膜時，前述控制裝置係控制前述噴墨頭及前述移動機構，一邊使前述基板沿前述第1方向移動，一邊藉由從前述第2頭塊的前述複數個噴嘴孔吐出之液滴形成前述圖案中的前述第2方向上的賦予最小尺寸之邊緣，然後，一邊使前述基板沿前述第2方向移動，一邊藉由從前述第1頭塊的前述複數個噴嘴孔吐出之液滴形成前述圖案中的前述第1方向上的賦予最小尺寸之邊緣。 A film forming apparatus comprising: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; a moving mechanism that causes one of the substrate and the inkjet head supported by the supporting portion to be opposed to the other Moving in at least one direction; and a control device that controls the inkjet head and the moving mechanism, the control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and The moving mechanism, while orienting the substrate with respect to the inkjet head and the pattern The direction of the minimum dimension of the pattern defined by the data is moved in a direction orthogonal to each other, and a liquid droplet is ejected from the inkjet head to the substrate based on the pattern data to form a film, and the moving mechanism has the The function, the minimum size of the pattern defined by the pattern data, appears in the first direction and the second direction that are orthogonal to each other. The inkjet head includes: a plurality of nozzle holes arranged along the first direction The first head block and the second head block having a plurality of nozzle holes arranged in the second direction, when forming the film, the control device controls the inkjet head and the moving mechanism while causing the substrate to move along the substrate Moving in the first direction, while forming the edge with the smallest dimension in the second direction in the pattern by the droplets ejected from the plurality of nozzle holes in the second head block, and then moving the substrate along the first Moving in two directions, the edge with the smallest dimension in the first direction in the pattern is formed by droplets ejected from the plurality of nozzle holes in the first head block. 一種膜形成裝置，其具有：支撐部，對基板進行支撐；噴墨頭，向前述基板吐出液滴；移動機構，使被前述支撐部支撐之前述基板及前述噴墨頭的一方相對於另一方沿至少一維方向移動；及控制裝置，控制前述噴墨頭及前述移動機構， 前述控制裝置，係儲存有用於定義應形成於前述基板之膜的圖案之圖案資料，並控制前述噴墨頭及前述移動機構，一邊使前述基板相對於前述噴墨頭朝向與由前述圖案資料所定義之圖案的最小尺寸的方向正交之方向移動，一邊基於前述圖案資料從前述噴墨頭向前述基板吐出液滴而形成膜，進一步具有輸入裝置和輸出裝置，前述控制裝置，係儲存有於形成膜時相對於前述噴墨頭的前述基板的移動方向，檢測出由從前述輸入裝置輸入之前述圖案資料所定義之圖案的最小尺寸的方向，將所檢測出之最小尺寸的方向和前述基板的移動方向進行比較，當兩者不處於正交關係時，使前述輸出裝置輸出通知由前述圖案資料所定義之圖案的最小尺寸的方向從最佳方向偏離之資訊。 A film forming apparatus comprising: a supporting portion that supports a substrate; an inkjet head that ejects liquid droplets to the substrate; a moving mechanism that causes one of the substrate and the inkjet head supported by the supporting portion to be opposed to the other Move in at least one direction; and a control device to control the inkjet head and the moving mechanism, The control device stores pattern data for defining the pattern of the film to be formed on the substrate, and controls the inkjet head and the moving mechanism while orienting the substrate with respect to the inkjet head and determined by the pattern data The direction of the smallest dimension of the defined pattern moves in a direction orthogonal to the above, while ejecting droplets from the inkjet head to the substrate based on the pattern data to form a film, further comprising an input device and an output device, the control device is stored in When forming a film, the direction of the minimum size of the pattern defined by the pattern data input from the input device is detected relative to the moving direction of the substrate of the inkjet head, and the detected minimum size direction and the substrate The movement directions of the two are compared, and when the two are not in an orthogonal relationship, the output device is caused to output information informing that the direction of the minimum size of the pattern defined by the pattern data deviates from the optimal direction. 如申請專利範圍第3至7項中任一項所述之膜形成裝置，其中，前述移動機構係使被前述支撐部支撐之前述基板移動。 The film forming apparatus according to any one of claims 3 to 7, wherein the moving mechanism moves the substrate supported by the supporting portion. 如申請專利範圍第3至7項中任一項所述之膜形成裝置，進一步具有支撐前述噴墨頭之基台，前述移動機構係使前述基板相對於前述基台進行移 動。 The film forming apparatus according to any one of claims 3 to 7 further includes a base supporting the inkjet head, and the moving mechanism moves the substrate relative to the base move. 如申請專利範圍第3至7項中任一項所述之膜形成裝置，其中，前述噴墨頭係包含：沿與前述最小尺寸的方向正交之方向排列之複數個第1噴嘴孔，前述控制裝置係控制前述噴墨頭及前述移動機構，藉由從前述複數個第1噴嘴孔的一部分的噴嘴孔吐出之液滴來形成前述圖案中的賦予前述最小尺寸之一對邊緣。 The film forming apparatus according to any one of claims 3 to 7, wherein the inkjet head includes: a plurality of first nozzle holes arranged in a direction orthogonal to the direction of the smallest dimension; The control device controls the inkjet head and the moving mechanism to form a pair of edges in the pattern that are given the minimum size by droplets ejected from a part of the nozzle holes of the plurality of first nozzle holes. 如申請專利範圍第3至7項中任一項所述之膜形成裝置，其中，前述移動機構進一步具有使被前述支撐部支撐之前述基板沿面內方向旋轉之功能，由前述圖案資料所定義之圖案的最小尺寸，是於相互正交之第1方向及第2方向上顯現，於形成前述膜時，前述控制裝置係控制前述噴墨頭及前述移動機構，一邊使前述基板沿前述第1方向移動，一邊形成由前述圖案資料所定義之圖案中的前述第2方向上的賦予最小尺寸之邊緣之後，使前述基板旋轉90°，然後，一邊使前述基板沿前述第2方向移動，一邊形成由前述圖案資料所定義之圖案中的前述第1方向上的賦予最小尺寸之邊緣。 The film forming apparatus according to any one of claims 3 to 7, wherein the moving mechanism further has a function of rotating the substrate supported by the supporting portion in the in-plane direction, as defined by the pattern data The minimum size of the pattern appears in the first direction and the second direction that are orthogonal to each other. When the film is formed, the control device controls the inkjet head and the moving mechanism while moving the substrate in the first direction After moving, while forming the edge with the smallest dimension in the second direction in the pattern defined by the pattern data, rotate the substrate by 90°, and then move the substrate in the second direction while moving the substrate Among the patterns defined by the pattern data, the edge with the smallest dimension in the first direction.
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