TWI687317B - 基板之貼合裝置及貼合方法以及電子裝置之製造方法 - Google Patents

基板之貼合裝置及貼合方法以及電子裝置之製造方法 Download PDF

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Publication number
TWI687317B
TWI687317B TW104139213A TW104139213A TWI687317B TW I687317 B TWI687317 B TW I687317B TW 104139213 A TW104139213 A TW 104139213A TW 104139213 A TW104139213 A TW 104139213A TW I687317 B TWI687317 B TW I687317B
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TW
Taiwan
Prior art keywords
substrate
roller
force
laminate
bonding
Prior art date
Application number
TW104139213A
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English (en)
Chinese (zh)
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TW201632357A (zh
Inventor
宇津木洋
伊藤泰則
大坪豊
Original Assignee
日商Ａｇｃ股份有限公司
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Publication of TW201632357A publication Critical patent/TW201632357A/zh
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Publication of TWI687317B publication Critical patent/TWI687317B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Fluid Mechanics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Quality & Reliability (AREA)
  • Mathematical Physics (AREA)
  • Laminated Bodies (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW104139213A 2014-11-25 2015-11-25 基板之貼合裝置及貼合方法以及電子裝置之製造方法 TWI687317B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014237358 2014-11-25
JP2014-237358 2014-11-25

Publications (2)

Publication Number Publication Date
TW201632357A TW201632357A (zh) 2016-09-16
TWI687317B true TWI687317B (zh) 2020-03-11

Family

ID=56074270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104139213A TWI687317B (zh) 2014-11-25 2015-11-25 基板之貼合裝置及貼合方法以及電子裝置之製造方法

Country Status (5)

Country Link
JP (1) JP6566386B2 (ja)
KR (1) KR20170087453A (ja)
CN (2) CN106796913A (ja)
TW (1) TWI687317B (ja)
WO (1) WO2016084703A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039329B (zh) * 2017-03-22 2019-12-17 上海凯虹科技电子有限公司 针对薄基板的小尺寸封装体的封装方法及封装体
EP3722096B1 (en) * 2018-02-13 2023-01-11 Shanjin Optoelectronics (Suzhou) Co.,LTD. System and device for laminating optical film
JP6733966B2 (ja) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 基板組立装置及び基板組立方法
KR20210148127A (ko) 2019-03-29 2021-12-07 닛토덴코 가부시키가이샤 유리 수지 적층체 제조방법
JP7389703B2 (ja) * 2019-12-25 2023-11-30 住友化学株式会社 積層体の製造方法、及び、貼合装置
US11858244B2 (en) 2020-09-15 2024-01-02 Chengdu Boe Optoelectronics Technology Co., Ltd. Laminating device, laminating method thereof, flexible display module and display device
CN114005370B (zh) * 2021-11-19 2024-02-20 云谷（固安）科技有限公司 贴合装置和贴合方法
CN114248529B (zh) * 2021-12-16 2023-10-27 武汉天马微电子有限公司 一种柔性屏贴合装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1606142A (zh) * 2003-10-10 2005-04-13 松下电器产业株式会社 电子电路装置及其制造方法以及制造装置
JP2007326358A (ja) * 2006-05-08 2007-12-20 Asahi Glass Co Ltd 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板
JP2009040617A (ja) * 2007-08-06 2009-02-26 Kuraimu Prod Kk 板ガラスの貼合方法およびその装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720415A (en) * 1985-07-30 1988-01-19 Kimberly-Clark Corporation Composite elastomeric material and process for making the same
CN1300630C (zh) * 2003-03-27 2007-02-14 友达光电股份有限公司 液晶显示器的组件的组装方法
JP5710761B2 (ja) * 2011-06-15 2015-04-30 クライムプロダクツ株式会社 ワークの精密貼合装置、およびワークの精密貼合方法
JP5311527B1 (ja) * 2013-04-04 2013-10-09 株式会社Ｆｕｋ 貼付装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1606142A (zh) * 2003-10-10 2005-04-13 松下电器产业株式会社 电子电路装置及其制造方法以及制造装置
JP2007326358A (ja) * 2006-05-08 2007-12-20 Asahi Glass Co Ltd 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板
JP2009040617A (ja) * 2007-08-06 2009-02-26 Kuraimu Prod Kk 板ガラスの貼合方法およびその装置

Also Published As

Publication number Publication date
KR20170087453A (ko) 2017-07-28
JPWO2016084703A1 (ja) 2017-08-31
CN113658902A (zh) 2021-11-16
CN106796913A (zh) 2017-05-31
JP6566386B2 (ja) 2019-08-28
TW201632357A (zh) 2016-09-16
WO2016084703A1 (ja) 2016-06-02

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