TWI687317B - 基板之貼合裝置及貼合方法以及電子裝置之製造方法 - Google Patents
基板之貼合裝置及貼合方法以及電子裝置之製造方法 Download PDFInfo
- Publication number
- TWI687317B TWI687317B TW104139213A TW104139213A TWI687317B TW I687317 B TWI687317 B TW I687317B TW 104139213 A TW104139213 A TW 104139213A TW 104139213 A TW104139213 A TW 104139213A TW I687317 B TWI687317 B TW I687317B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- roller
- force
- laminate
- bonding
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 234
- 238000004519 manufacturing process Methods 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 24
- 238000005096 rolling process Methods 0.000 claims abstract description 16
- 238000001179 sorption measurement Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 62
- 239000002346 layers by function Substances 0.000 claims description 34
- 238000003825 pressing Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 description 103
- 229920005989 resin Polymers 0.000 description 57
- 239000011347 resin Substances 0.000 description 57
- 239000011521 glass Substances 0.000 description 33
- 238000002788 crimping Methods 0.000 description 32
- 238000005452 bending Methods 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 9
- 239000010409 thin film Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000010030 laminating Methods 0.000 description 5
- 230000002787 reinforcement Effects 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Fluid Mechanics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Quality & Reliability (AREA)
- Mathematical Physics (AREA)
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014237358 | 2014-11-25 | ||
JP2014-237358 | 2014-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201632357A TW201632357A (zh) | 2016-09-16 |
TWI687317B true TWI687317B (zh) | 2020-03-11 |
Family
ID=56074270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104139213A TWI687317B (zh) | 2014-11-25 | 2015-11-25 | 基板之貼合裝置及貼合方法以及電子裝置之製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6566386B2 (ja) |
KR (1) | KR20170087453A (ja) |
CN (2) | CN106796913A (ja) |
TW (1) | TWI687317B (ja) |
WO (1) | WO2016084703A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107039329B (zh) * | 2017-03-22 | 2019-12-17 | 上海凯虹科技电子有限公司 | 针对薄基板的小尺寸封装体的封装方法及封装体 |
EP3722096B1 (en) * | 2018-02-13 | 2023-01-11 | Shanjin Optoelectronics (Suzhou) Co.,LTD. | System and device for laminating optical film |
JP6733966B2 (ja) * | 2018-07-09 | 2020-08-05 | Aiメカテック株式会社 | 基板組立装置及び基板組立方法 |
KR20210148127A (ko) | 2019-03-29 | 2021-12-07 | 닛토덴코 가부시키가이샤 | 유리 수지 적층체 제조방법 |
JP7389703B2 (ja) * | 2019-12-25 | 2023-11-30 | 住友化学株式会社 | 積層体の製造方法、及び、貼合装置 |
US11858244B2 (en) | 2020-09-15 | 2024-01-02 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Laminating device, laminating method thereof, flexible display module and display device |
CN114005370B (zh) * | 2021-11-19 | 2024-02-20 | 云谷(固安)科技有限公司 | 贴合装置和贴合方法 |
CN114248529B (zh) * | 2021-12-16 | 2023-10-27 | 武汉天马微电子有限公司 | 一种柔性屏贴合装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1606142A (zh) * | 2003-10-10 | 2005-04-13 | 松下电器产业株式会社 | 电子电路装置及其制造方法以及制造装置 |
JP2007326358A (ja) * | 2006-05-08 | 2007-12-20 | Asahi Glass Co Ltd | 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板 |
JP2009040617A (ja) * | 2007-08-06 | 2009-02-26 | Kuraimu Prod Kk | 板ガラスの貼合方法およびその装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4720415A (en) * | 1985-07-30 | 1988-01-19 | Kimberly-Clark Corporation | Composite elastomeric material and process for making the same |
CN1300630C (zh) * | 2003-03-27 | 2007-02-14 | 友达光电股份有限公司 | 液晶显示器的组件的组装方法 |
JP5710761B2 (ja) * | 2011-06-15 | 2015-04-30 | クライムプロダクツ株式会社 | ワークの精密貼合装置、およびワークの精密貼合方法 |
JP5311527B1 (ja) * | 2013-04-04 | 2013-10-09 | 株式会社Fuk | 貼付装置 |
-
2015
- 2015-11-19 CN CN201580055520.5A patent/CN106796913A/zh active Pending
- 2015-11-19 KR KR1020177012870A patent/KR20170087453A/ko unknown
- 2015-11-19 WO PCT/JP2015/082556 patent/WO2016084703A1/ja active Application Filing
- 2015-11-19 JP JP2016561539A patent/JP6566386B2/ja active Active
- 2015-11-19 CN CN202110802644.2A patent/CN113658902A/zh active Pending
- 2015-11-25 TW TW104139213A patent/TWI687317B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1606142A (zh) * | 2003-10-10 | 2005-04-13 | 松下电器产业株式会社 | 电子电路装置及其制造方法以及制造装置 |
JP2007326358A (ja) * | 2006-05-08 | 2007-12-20 | Asahi Glass Co Ltd | 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板 |
JP2009040617A (ja) * | 2007-08-06 | 2009-02-26 | Kuraimu Prod Kk | 板ガラスの貼合方法およびその装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20170087453A (ko) | 2017-07-28 |
JPWO2016084703A1 (ja) | 2017-08-31 |
CN113658902A (zh) | 2021-11-16 |
CN106796913A (zh) | 2017-05-31 |
JP6566386B2 (ja) | 2019-08-28 |
TW201632357A (zh) | 2016-09-16 |
WO2016084703A1 (ja) | 2016-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI687317B (zh) | 基板之貼合裝置及貼合方法以及電子裝置之製造方法 | |
JP5991373B2 (ja) | ガラス積層体および電子デバイスの製造方法 | |
TWI602703B (zh) | Substrate stripping apparatus and stripping method, and electronic device manufacturing method | |
US20170266943A1 (en) | Substrate suction device, substrate bonding device, substrate bonding method, and electronic device manufacturing method | |
TW201725166A (zh) | 積層體之剝離裝置及剝離方法與電子裝置之製造方法 | |
KR102535656B1 (ko) | 적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법 | |
TW201441137A (zh) | 基板之剝離裝置及剝離方法以及電子元件之製造方法 | |
JP2016147758A (ja) | 積層体の剥離装置、及び剥離方法並びに電子デバイスの製造方法 | |
TWI601682B (zh) | Substrate stripping apparatus and stripping method, and electronic device manufacturing method | |
KR102406292B1 (ko) | 적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법 | |
TWI681939B (zh) | 玻璃薄膜的製造方法、及包含玻璃薄膜的電子裝置的製造方法 | |
CN105084085B (zh) | 层叠体的剥离装置和剥离方法及电子器件的制造方法 | |
TWI671253B (zh) | 積層體之剝離裝置及剝離方法與電子裝置之製造方法 | |
JP2016037328A (ja) | ガラスフィルムの剥離方法および電子デバイスの製造方法 | |
CN105904830A (zh) | 层叠体的剥离装置和剥离方法及电子器件的制造方法 | |
CN105856798A (zh) | 层叠体的剥离装置和剥离方法及电子器件的制造方法 |