TWI681515B - Manufacturing semiconductor package apparatus, laser processing method and workpiece flattening method - Google Patents

Manufacturing semiconductor package apparatus, laser processing method and workpiece flattening method Download PDF

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TWI681515B
TWI681515B TW108106971A TW108106971A TWI681515B TW I681515 B TWI681515 B TW I681515B TW 108106971 A TW108106971 A TW 108106971A TW 108106971 A TW108106971 A TW 108106971A TW I681515 B TWI681515 B TW I681515B
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optical glass
film layer
glass layer
processing
carrier
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TW108106971A
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TW202034465A (en
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鄭朝興
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鐳射谷科技股份有限公司
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Abstract

A laser processing method is provided. The laser processing method includes the following steps. First, a carrier is disposed on an absorption frame, wherein the carrier includes a film layer and a workpiece, the workpiece is attached on the film layer. Then, a chamber is form between the film layer and an optical glass layer of the adsorption frame, wherein the film layer is located between the workpiece and the chamber. The chamber is pumped to create a vacuum between the film layer and the optical glass layer, and the film moves toward the optical glass layer to flatten the workpiece to the optical glass layer. In addition, a manufacturing semiconductor package apparatus and a workpiece flattening method are also provided.

Description

半導體封裝製造設備、雷射加工方法以及加工載板之整平方法Semiconductor packaging manufacturing equipment, laser processing method and leveling method for processing carrier board

本發明是有關於一種半導體封裝製造設備、雷射加工方法以及加工載板之整平方法。The invention relates to a semiconductor packaging manufacturing equipment, a laser processing method and a flattening method for processing a carrier board.

近來有人提出扇出式晶圓級封裝構造(fan-out wafer level package，FOWLP)與扇出式面板等級封裝構造(fan-out panel level package， FOPLP)，以晶圓承載系統(Wafer Support System,WSS)或面板承載系統(Panel Support System，PSS)等暫時載板作為封裝製程中的晶片承載件，以重配置線路層作為晶片之訊號延伸，在最終封裝產品再予以移除暫時載板，藉此可以省略基板而更加的封裝薄化，並且線路可以更加的微間距與密集化。Recently, a fan-out wafer level package (FOWLP) and a fan-out panel level package (FOPLP) have been proposed to use a wafer support system (Wafer Support System, WSS) or Panel Support System (PSS) and other temporary carrier boards are used as chip carriers in the packaging process, and the reconfiguration circuit layer is used as the signal extension of the chip, and then the temporary carrier boards are removed in the final packaged product. This can omit the substrate and make the package thinner, and the circuit can be more fine-pitch and denser.

針對雷射加工而言，當加工載板進行加工之前，需要先對載板固定。習用固定方式中，係可利用吸盤吸附以固定載板。由於加工載板被吸盤吸附的地方無法進行雷射加工，故往往以局部吸附的方式，即吸盤先吸附加工載板的一部份以固定載板位置，而雷射對加工載板的另一部分(即加工載板未被吸盤吸附之表面)進行加工，亦即習用技術僅能做到局部吸附，無法確保未被吸附之加工載板是否平貼，影響到後續雷射加工精度。For laser processing, the carrier board needs to be fixed before processing the carrier board. In the conventional fixing method, the suction plate can be used to fix the carrier board. Laser processing is not possible where the processing carrier is adsorbed by the suction cup, so it is often localized, that is, the suction cup first adsorbs a part of the processing carrier to fix the position of the carrier, and the laser absorbs the other part of the processing carrier. (That is, the surface of the processing carrier board that is not adsorbed by the suction cup) The processing, that is, the conventional technology can only achieve local adsorption, and cannot ensure whether the processing carrier board that is not adsorbed is flat, affecting the accuracy of subsequent laser processing.

此外，針對其他製程而言，亦有固定加工載板之需求，係在加工載板之不同位置設置多個吸盤，透過多個吸盤抽真空的方式去吸附加工載板，不僅無法全面性整平加工載板，且多個吸盤在其設置上困難度提升，且成本提高。In addition, for other processes, there is also a need to fix the processing carrier plate. Multiple suction cups are installed at different positions of the processing carrier plate, and the processing carrier plate is adsorbed by vacuuming through multiple suction cups. The carrier board is processed, and the difficulty of setting up multiple suction cups is increased, and the cost is increased.

因此，如何改良並能提供一種『半導體封裝製造設備、雷射加工方法及加工載板之整平方法』來避免上述所遭遇到的問題，係業界所待解決之課題。Therefore, how to improve and provide a "semiconductor packaging manufacturing equipment, laser processing method, and processing carrier leveling method" to avoid the above-mentioned problems is a problem to be solved by the industry.

本發明提供一種半導體封裝製造設備與雷射加工方法，利用加工載板放置於光學玻璃層抽氣，使膜層與光學玻璃層之間形成真空，以使加工載板能平貼於光學玻璃層，確保後續雷射加工之穩定度。The invention provides a semiconductor packaging manufacturing equipment and a laser processing method. The processing carrier is placed on the optical glass layer for suction, so that a vacuum is formed between the film layer and the optical glass layer, so that the processing carrier can be flat on the optical glass layer To ensure the stability of subsequent laser processing.

本發明提供一種加工載板之整平方法，加工載板放置於光學玻璃層抽氣，讓膜層與光學玻璃層之間形成真空，使加工載板能平貼於光學玻璃層，達到整平加工載板之需求。The invention provides a flattening method for processing a carrier board. The processing carrier board is placed in the optical glass layer for suction, so that a vacuum is formed between the film layer and the optical glass layer, so that the processing carrier board can be flatly attached to the optical glass layer to achieve leveling Processing board requirements.

本發明之一實施例提出一種半導體封裝製造設備，用於扇出式等級封裝構造及晶圓產品，半導體封裝製造設備包括一吸附框體、一光學玻璃層以及至少一抽氣元件。吸附框體用以供一載具放置，載具包含一膜層與一加工載板，加工載板貼附於膜層。光學玻璃層設置於吸附框體之內，當載具放置於吸附框體時，膜層與光學玻璃層形成一腔室，膜層位於加工載板與腔室之間。抽氣元件設置於吸附框體之內，抽氣元件抽氣，使膜層與光學玻璃層之間形成真空，膜層朝光學玻璃層移動，以使加工載板平貼於光學玻璃層。An embodiment of the present invention provides a semiconductor package manufacturing equipment for fan-out grade packaging structures and wafer products. The semiconductor package manufacturing equipment includes an adsorption frame, an optical glass layer, and at least one air extraction element. The adsorption frame is used for placing a carrier. The carrier includes a film layer and a processing carrier board, and the processing carrier board is attached to the film layer. The optical glass layer is disposed inside the adsorption frame. When the carrier is placed on the adsorption frame, the film layer and the optical glass layer form a chamber, and the film layer is located between the processing carrier and the chamber. The air suction element is arranged inside the suction frame, and the air suction element draws air to form a vacuum between the film layer and the optical glass layer, and the film layer moves toward the optical glass layer, so that the processing carrier plate is flatly attached to the optical glass layer.

在一實施例中，上述半導體封裝製造設備更包括一雷射元件，雷射元件用以發出一雷射光束，雷射光束穿過光學玻璃層與膜層，用以對加工載板進行加工。In one embodiment, the above semiconductor package manufacturing equipment further includes a laser element. The laser element is used to emit a laser beam. The laser beam passes through the optical glass layer and the film layer for processing the processing carrier.

在一實施例中，上述吸附框體包括一凸部，凸部凸出於光學玻璃層之表面，且該凸部凸出於該吸附框體之一表面，形成一環形凸部。In an embodiment, the above-mentioned suction frame includes a convex portion, the convex portion protrudes from the surface of the optical glass layer, and the convex portion protrudes from a surface of the suction frame body to form an annular convex portion.

本發明之另一實施例提出一種雷射加工方法，包括以下步驟：放置一載具於一吸附框體，其中載具包含一膜層與一加工載板，加工載板貼附於膜層；使膜層與吸附框體之一光學玻璃層之間形成一腔室，其中膜層位於加工載板與腔室之間；對腔室抽氣，使膜層與光學玻璃層之間形成真空，膜層朝光學玻璃層移動，以使加工載板平貼於光學玻璃層；以及雷射元件用以發出一雷射光束，雷射光束穿過光學玻璃層與膜層，用以對加工載板進行加工。Another embodiment of the present invention provides a laser processing method, including the following steps: placing a carrier on an adsorption frame, wherein the carrier includes a film layer and a processing carrier board, and the processing carrier board is attached to the film layer; A chamber is formed between the film layer and one of the optical glass layers of the adsorption frame, wherein the film layer is located between the processing carrier and the chamber; the chamber is evacuated to form a vacuum between the film layer and the optical glass layer, The film layer moves toward the optical glass layer, so that the processing carrier plate is flat against the optical glass layer; and the laser element is used to emit a laser beam, and the laser beam passes through the optical glass layer and the film layer, which is used to process the processing carrier board For processing.

在一實施例中，上述光學玻璃層係為一透明玻璃。In one embodiment, the optical glass layer is a transparent glass.

在一實施例中，上述使膜層與吸附框體之光學玻璃層之間形成腔室的步驟，包括以下步驟：使膜層接觸於吸附框體之一凸部，其中凸部凸出於光學玻璃層，且凸部凸出於吸附框體之一表面，形成一環形凸部。In an embodiment, the step of forming a cavity between the film layer and the optical glass layer of the adsorption frame includes the following steps: contacting the film layer with a convex portion of the adsorption frame, wherein the convex portion protrudes out of the optical The glass layer, and the convex part protrudes from one surface of the adsorption frame body, forming an annular convex part.

本發明之再一實施例提出一種加工載板之整平方法，包括以下步驟：放置一載具於一吸附框體，其中載具包含一膜層與一加工載板，加工載板貼附於膜層；使膜層與吸附框體之一光學玻璃層之間形成一腔室，其中膜層位於加工載板與腔室之間；以及對腔室抽氣，使膜層與光學玻璃層之間形成真空，膜層朝光學玻璃層移動，以使加工載板平貼於光學玻璃層。Yet another embodiment of the present invention provides a method for leveling a processing carrier board, which includes the following steps: placing a carrier on an adsorption frame, wherein the carrier includes a film layer and a processing carrier board, and the processing carrier board is attached to Membrane layer; forming a chamber between the membrane layer and the optical glass layer of the adsorption frame, wherein the membrane layer is located between the processing carrier and the chamber; and evacuating the chamber to make the membrane layer and the optical glass layer A vacuum is formed between them, and the film layer moves toward the optical glass layer, so that the processed carrier plate is flat on the optical glass layer.

在一實施例中，上述使膜層與吸附框體之光學玻璃層之間形成腔室的步驟，包括以下步驟：使膜層接觸於吸附框體之一凸部，其中凸部凸出於光學玻璃層，且凸部凸出於吸附框體之一表面，形成一環形凸部。In an embodiment, the step of forming a cavity between the film layer and the optical glass layer of the adsorption frame includes the following steps: contacting the film layer with a convex portion of the adsorption frame, wherein the convex portion protrudes out of the optical The glass layer, and the convex part protrudes from one surface of the adsorption frame body, forming an annular convex part.

基於上述，在本發明之半導體封裝製造設備、雷射加工方法以及加工載板之整平方法中，使膜層與光學玻璃層之間形成一腔室，利用對腔室抽氣，使膜層與光學玻璃層之間的腔室形成真空，膜層朝光學玻璃層移動，以使加工載板平貼於光學玻璃層，來壓平加工載板，避免加工載板形成翹曲或造成位移。Based on the above, in the semiconductor package manufacturing equipment, laser processing method, and processing carrier leveling method of the present invention, a cavity is formed between the film layer and the optical glass layer, and the film layer is evacuated by evacuating the cavity A vacuum is formed in the chamber between the optical glass layer, and the film layer moves toward the optical glass layer to flatten the processing carrier plate to the optical glass layer to flatten the processing carrier plate to avoid warping or displacement of the processing carrier plate.

為讓本發明能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the present invention more comprehensible, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.

下面結合實施例，對本發明的具體實施方式作進一步描述。以下實施例僅用於更加清楚地說明本發明的技術方案，而不能以此來限制本發明的保護範圍。The specific implementation of the present invention will be further described below in conjunction with examples. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention, and cannot be used to limit the protection scope of the present invention.

需說明的是，在各個實施例的說明中，當一元件被描述是在另一元件之「上方/上」或「下方/下」，係指直接地或間接地在該另一元件之上或之下的情況，其可能包含設置於其間的其他元件；所謂的「直接地」係指其間並未設置其他中介元件。「上方/上」、「下方/下」、「左邊/左」或「右邊/右」等的描述係以圖式為基準進行說明，但亦包含其他可能的方向轉變。為了說明上的便利和明確，圖式中各元件的厚度或尺寸，係以誇張或省略或概略的方式表示，且各元件的尺寸並未完全為其實際的尺寸。It should be noted that, in the description of various embodiments, when an element is described as being "above/above" or "below/below" of another element, it means directly or indirectly on the other element In the following cases, it may include other components disposed therebetween; the so-called "directly" means that no other intermediary components are disposed therebetween. The descriptions of "above/up", "below/down", "left/left", or "right/right" are based on illustrations, but also include other possible changes in direction. For the convenience and clarity of description, the thickness or size of each element in the drawings is exaggerated or omitted or outlined, and the size of each element is not exactly its actual size.

圖1為本發明之半導體封裝製造設備的示意圖。請參閱圖1。本實施例之半導體封裝製造設備10用於扇出式等級封裝構造及晶圓產品，半導體封裝製造設備10至少包括一吸附框體11、一光學玻璃層13以及至少一抽氣元件14。吸附框體11用以供一載具21放置。載具21包含一膜層22與一加工載板23，加工載板23貼附於膜層22，且加工載板23與膜層22兩者緊密接合，其中膜層22為一薄膜，薄膜本身為一軟性結構。需說明的是，加工載板23之表面231為一線路面，其具有電子電路配置；加工載板23之底面232為一加工面，加工載板23之底面232貼附至膜層22。由此可知，本實施例係利用膜層22將加工載板23固定在載具21上，即膜層22為加工載板23與載具21連結在一起之一媒介物。除此之外，可利用載具21來移動加工載板23至一加工處(如本實施例之雷射加工)。在一實施例中，可利用機械手臂移動載具21，或利用滾輪輸送方式移動載具21，其中加工載板23之類型可端視實際半導體封裝製程而定。FIG. 1 is a schematic diagram of the semiconductor package manufacturing equipment of the present invention. Please refer to Figure 1. The semiconductor package manufacturing equipment 10 of this embodiment is used for fan-out grade packaging structures and wafer products. The semiconductor package manufacturing equipment 10 at least includes an adsorption frame 11, an optical glass layer 13, and at least one exhaust element 14. The suction frame 11 is used for placing a carrier 21. The carrier 21 includes a film layer 22 and a processing carrier board 23, the processing carrier board 23 is attached to the film layer 22, and the processing carrier board 23 and the film layer 22 are tightly joined, wherein the film layer 22 is a thin film, the film itself It is a soft structure. It should be noted that the surface 231 of the processing carrier board 23 is a circuit surface with an electronic circuit configuration; the bottom surface 232 of the processing carrier board 23 is a processing surface, and the bottom surface 232 of the processing carrier board 23 is attached to the film layer 22. Therefore, in this embodiment, the film layer 22 is used to fix the processing carrier plate 23 on the carrier 21, that is, the film layer 22 is a medium that connects the processing carrier plate 23 and the carrier 21 together. In addition, the carrier 21 can be used to move the processing carrier 23 to a processing location (such as the laser processing in this embodiment). In an embodiment, the carrier 21 can be moved by a robotic arm, or the carrier 21 can be moved by a roller conveyor. The type of the processing carrier 23 can depend on the actual semiconductor packaging process.

在本實施例中，光學玻璃層13設置於吸附框體11之內。光學玻璃層13係以光學玻璃所製成，其中光學玻璃層13具有相對的一受光面132與一出光面131，其中受光面132係接收雷射元件30發出之雷射光束，使雷射元件30之雷射光束能穿過光學玻璃層13並由出光面131射出。吸附框體11包括一凸部12與一表面112，凸部12係由表面112凸出形成之一凸緣，即凸部12凸出於吸附框體11之表面112，形成一環形凸部。以圖1為例，凸部12除了凸出於吸附框體11之表面112以外，凸部12也凸出於光學玻璃層13之表面，且光學玻璃層13之表面低於吸附框體11之表面112。然，本發明不對此加以限制，在另一實施例中，光學玻璃層13之表面高於吸附框體11之表面112，凸部12可凸出於光學玻璃層13之表面，且凸部12仍高於吸附框體11之表面112。當載具21放置於吸附框體11之表面112時，膜層22接觸於凸部12，且使得膜層22與光學玻璃層13之出光面131之間形成具密閉空間之一腔室S，其中膜層22位於加工載板23與腔室S之間，加工載板23之底面232為一加工面並朝向雷射元件30，凸部12位於腔室S之周圍。In this embodiment, the optical glass layer 13 is disposed inside the suction frame 11. The optical glass layer 13 is made of optical glass, wherein the optical glass layer 13 has a light-receiving surface 132 and a light-emitting surface 131 opposite to each other, wherein the light-receiving surface 132 receives the laser beam emitted by the laser element 30, so that The laser beam of 30 can pass through the optical glass layer 13 and exit from the light exit surface 131. The suction frame 11 includes a convex portion 12 and a surface 112. The convex portion 12 is a flange formed by protruding from the surface 112, that is, the convex portion 12 protrudes from the surface 112 of the suction frame 11 to form an annular convex portion. Taking FIG. 1 as an example, in addition to the convex portion 12 protruding from the surface 112 of the suction frame 11, the convex portion 12 also protrudes from the surface of the optical glass layer 13, and the surface of the optical glass layer 13 is lower than that of the suction frame 11 Surface 112. However, the present invention is not limited to this. In another embodiment, the surface of the optical glass layer 13 is higher than the surface 112 of the adsorption frame 11, the convex portion 12 may protrude from the surface of the optical glass layer 13, and the convex portion 12 It is still higher than the surface 112 of the suction frame 11. When the carrier 21 is placed on the surface 112 of the suction frame 11, the film layer 22 contacts the convex portion 12, and a chamber S with a closed space is formed between the film layer 22 and the light exit surface 131 of the optical glass layer 13, The film layer 22 is located between the processing carrier 23 and the chamber S, the bottom surface 232 of the processing carrier 23 is a processing surface and faces the laser element 30, and the convex portion 12 is located around the cavity S.

此外，至少一抽氣元件14設置於吸附框體11內，吸附框體11內具有一抽氣孔洞113，抽氣孔洞113之一端連通至光學玻璃層13之周圍，抽氣孔洞113之另一端連通抽氣元件14。由此可知，本實施例之抽氣元件14藉由吸附框體11內之抽氣孔洞113以連通至腔室S之內。In addition, at least one suction element 14 is disposed in the suction frame 11, the suction frame 11 has a suction hole 113, one end of the suction hole 113 communicates with the periphery of the optical glass layer 13, and the other end of the suction hole 113通信压装置14。 Connect the suction element 14. It can be seen from this that the suction element 14 of the present embodiment communicates into the chamber S by sucking the suction hole 113 in the frame 11.

在此配置之下，抽氣元件14抽氣，使膜層22與光學玻璃層13之間的腔室S形成真空，由於光學玻璃層13係為一硬性結構且為透明結構，而膜層22為一軟性結構，使得軟性結構之膜層22會朝硬性結構之光學玻璃層13移動，進而使加工載板23之整個之底面232(即加工面)能平貼於光學玻璃層13之出光面131，來壓平加工載板23之底面232(即加工面)，避免加工載板23形成翹曲或造成位移。當壓平加工載板23後，雷射元件30用以發出一雷射光束，雷射光束穿過光學玻璃層13與膜層22，用以對加工載板23進行雷射加工。由此可知，本實施例利用光學玻璃層13與膜層22來達到整平加工載板23的同時，更可利用透明之光學玻璃層13的特性，來對加工載板23進行雷射加工。Under this configuration, the pumping element 14 pumps to vacuum the chamber S between the film layer 22 and the optical glass layer 13, since the optical glass layer 13 is a rigid structure and a transparent structure, and the film layer 22 It is a flexible structure, so that the film layer 22 of the flexible structure will move toward the optical glass layer 13 of the rigid structure, so that the entire bottom surface 232 (ie, processing surface) of the processing carrier board 23 can be flatly attached to the light emitting surface of the optical glass layer 13 131, to flatten the bottom surface 232 (ie, the processing surface) of the processing carrier board 23 to avoid warping or displacement of the processing carrier board 23; After the carrier board 23 is flattened, the laser element 30 is used to emit a laser beam, and the laser beam passes through the optical glass layer 13 and the film layer 22 to perform laser processing on the processed carrier board 23. It can be seen that, in this embodiment, the optical glass layer 13 and the film layer 22 are used to level the processing carrier 23, and the characteristics of the transparent optical glass layer 13 can also be used to perform laser processing on the processing carrier 23.

在一實施例中，本實施例可透過上述的半導體封裝製造設備10去執行本發明的加工載板之整平方法，其可在任一製程對加工載板進行整平。加工載板之整平方法包括以下步驟：提供一吸附框體11，吸附框體11的型態與尺寸可依據實際半導體封裝製造方法所需而擇定。以圖1為例，吸附框體11包括凸部12以及表面112，凸部12係由表面112凸出形成之一凸緣，即凸部12凸出於吸附框體之表面112，形成一環形凸部。In an embodiment, in this embodiment, the above-mentioned semiconductor package manufacturing apparatus 10 can be used to perform the method for leveling a processed carrier board of the present invention, which can level the processed carrier board in any manufacturing process. The leveling method for processing the carrier board includes the following steps: providing an adsorption frame 11, the shape and size of the adsorption frame 11 can be selected according to the actual semiconductor package manufacturing method. Taking FIG. 1 as an example, the suction frame 11 includes a convex portion 12 and a surface 112. The convex portion 12 is a flange formed by protruding from the surface 112, that is, the convex portion 12 protrudes from the surface 112 of the suction frame, forming a ring shape Convex part.

接著，設置光學玻璃層13於吸附框體11之內。光學玻璃層13係以光學玻璃所製成，使雷射元件30之雷射光束能穿過光學玻璃層13。以圖1為例，凸部12凸出於光學玻璃層13之表面，且光學玻璃層13之表面低於吸附框體11之表面112。然，本發明不對此加以限制，在另一實施例中，光學玻璃層13之表面高於吸附框體11之表面112，凸部12可凸出於光學玻璃層13之表面，且凸部12仍高於吸附框體11之表面112。此外，設置至少一抽氣元件14於吸附框體11內，吸附框體11內具有一抽氣孔洞113，抽氣孔洞113之一端連通至光學玻璃層13之周圍，抽氣孔洞113之另一端連通抽氣元件14。Next, the optical glass layer 13 is provided inside the suction frame 11. The optical glass layer 13 is made of optical glass, so that the laser beam of the laser element 30 can pass through the optical glass layer 13. Taking FIG. 1 as an example, the convex portion 12 protrudes from the surface of the optical glass layer 13, and the surface of the optical glass layer 13 is lower than the surface 112 of the adsorption frame 11. However, the present invention is not limited to this. In another embodiment, the surface of the optical glass layer 13 is higher than the surface 112 of the adsorption frame 11, the convex portion 12 may protrude from the surface of the optical glass layer 13, and the convex portion 12 It is still higher than the surface 112 of the suction frame 11. In addition, at least one suction element 14 is provided in the suction frame 11, the suction frame 11 has a suction hole 113, one end of the suction hole 113 communicates with the periphery of the optical glass layer 13, and the other end of the suction hole 113通信压装置14。 Connect the suction element 14.

接著，放置一載具21於一吸附框體11，在一實施例中，可利用機械手臂移動載具21，或利用滾輪輸送方式移動載具21。載具21包含一膜層22與一加工載板23，加工載板23設置於膜層22，其中膜層22為一薄膜，薄膜本身為一軟性結構，其中加工載板23之類型可端視實際半導體封裝製程而定。需說明的是，加工載板23之表面231為一線路面，其具有電子電路配置；加工載板23之底面232為一加工面，加工載板23之底面232貼附至膜層22。由此可知，本實施例係利用膜層22將加工載板23固定在載具21上，即膜層22為加工載板23與載具21連結在一起之一媒介物。Next, a carrier 21 is placed on an adsorption frame 11. In an embodiment, the carrier 21 can be moved by a robotic arm or moved by a roller conveyor. The carrier 21 includes a film layer 22 and a processing carrier board 23, and the processing carrier board 23 is disposed on the film layer 22, wherein the film layer 22 is a thin film, and the film itself is a flexible structure, wherein the type of the processing carrier board 23 can be viewed The actual semiconductor packaging process depends. It should be noted that the surface 231 of the processing carrier board 23 is a circuit surface with an electronic circuit configuration; the bottom surface 232 of the processing carrier board 23 is a processing surface, and the bottom surface 232 of the processing carrier board 23 is attached to the film layer 22. Therefore, in this embodiment, the film layer 22 is used to fix the processing carrier plate 23 on the carrier 21, that is, the film layer 22 is a medium that connects the processing carrier plate 23 and the carrier 21 together.

接著，使膜層22與吸附框體11之一光學玻璃層13之間形成一腔室S。詳細而言，當載具21放置於吸附框體11之表面112時，使膜層22接觸於吸附框體11之凸部12，進而使得膜層22與光學玻璃層13之出光面131之間形成具密閉空間之一腔室S，其中膜層22位於加工載板23與腔室S之間，加工載板23之底面232為一加工面並朝向雷射元件30。Next, a chamber S is formed between the film layer 22 and one of the optical glass layers 13 of the suction frame 11. In detail, when the carrier 21 is placed on the surface 112 of the suction frame 11, the film layer 22 is brought into contact with the convex portion 12 of the suction frame 11, so that the film layer 22 and the light exit surface 131 of the optical glass layer 13 are between A chamber S with a closed space is formed, in which the film layer 22 is located between the processing carrier 23 and the cavity S, and the bottom surface 232 of the processing carrier 23 is a processing surface and faces the laser element 30.

接著，抽氣元件14對腔室S抽氣，使膜層22與光學玻璃層13之間的腔室S形成真空，由於光學玻璃層13係為一硬性結構且為透明結構，而膜層22為一軟性結構，使得軟性結構之膜層22會朝硬性結構之光學玻璃層13移動，進而使加工載板23之整個之底面232(即加工面)能平貼於光學玻璃層13之出光面131，來壓平加工載板23之底面232(即加工面)，避免加工載板23形成翹曲或造成位移，達到整平加工載板23之需求。Next, the suction element 14 evacuates the chamber S to make the chamber S between the film layer 22 and the optical glass layer 13 form a vacuum. Since the optical glass layer 13 is a rigid structure and a transparent structure, the film layer 22 It is a flexible structure, so that the film layer 22 of the flexible structure will move toward the optical glass layer 13 of the rigid structure, so that the entire bottom surface 232 (ie, processing surface) of the processing carrier board 23 can be flatly attached to the light emitting surface of the optical glass layer 13 131, to flatten the bottom surface 232 (ie, the processing surface) of the processing carrier board 23, to avoid warping or displacement of the processing carrier board 23, and to achieve the requirement of leveling the processing carrier board 23.

在一實施例中，本實施例可透過上述的半導體封裝製造設備10去執行本發明的雷射加工方法。需說明的是，本發明的雷射加工方法與前述加工載板之整平方法相似，其中相同的步驟不再重複說明，以下僅說明差異處。本發明的雷射加工方法中，光學玻璃層13係為一透明玻璃。除此之外，前述對腔室S抽氣，使膜層22與光學玻璃層13之間的腔室S形成真空，以使加工載板23之整個之底面232(即加工面)能平貼於光學玻璃層13之出光面131，來壓平加工載板23之底面232(即加工面)之後，接著，雷射元件30用以發出一雷射光束，由於光學玻璃層13係為一透明玻璃，雷射光束能穿過光學玻璃層13與膜層22，用以對加工載板23進行雷射加工。In one embodiment, this embodiment can perform the laser processing method of the present invention through the semiconductor package manufacturing apparatus 10 described above. It should be noted that the laser processing method of the present invention is similar to the aforementioned method for processing the carrier board leveling, wherein the same steps are not repeated, and only the differences are described below. In the laser processing method of the present invention, the optical glass layer 13 is a transparent glass. In addition, the aforementioned chamber S is evacuated to form a vacuum in the chamber S between the film layer 22 and the optical glass layer 13 so that the entire bottom surface 232 (ie, processing surface) of the processing carrier 23 can be flatly attached After the light-emitting surface 131 of the optical glass layer 13 is used to flatten the bottom surface 232 (ie, the processing surface) of the processing board 23, then the laser element 30 is used to emit a laser beam, because the optical glass layer 13 is a transparent In glass, the laser beam can pass through the optical glass layer 13 and the film layer 22 for laser processing the processing carrier board 23.

綜上所述，在本發明之半導體封裝製造設備、雷射加工方法以及加工載板之整平方法中，使膜層與光學玻璃層形成一腔室，利用對腔室抽氣，使膜層與光學玻璃層之間的腔室形成真空，膜層朝光學玻璃層移動，以使加工載板平貼於光學玻璃層，來壓平加工載板，避免加工載板形成翹曲或造成位移。In summary, in the semiconductor package manufacturing equipment, laser processing method and flattening method for processing the carrier of the present invention, the film layer and the optical glass layer are formed into a chamber, and the film layer is evacuated by using the chamber A vacuum is formed in the chamber between the optical glass layer, and the film layer moves toward the optical glass layer to flatten the processing carrier plate to the optical glass layer to flatten the processing carrier plate to avoid warping or displacement of the processing carrier plate.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Anyone who has ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the attached patent application.

10‧‧‧半導體封裝製造設備 11‧‧‧吸附框體 112‧‧‧ 113‧‧‧抽氣孔洞 12‧‧‧凸部 13‧‧‧光學玻璃層 131‧‧‧出光面 132‧‧‧受光面 14‧‧‧抽氣元件 21‧‧‧載具 22‧‧‧膜層 23‧‧‧加工載板 231‧‧‧表面 232‧‧‧底面 30‧‧‧雷射元件 S‧‧‧腔室10‧‧‧Semiconductor packaging manufacturing equipment 11‧‧‧Adsorption frame 112‧‧‧ 113‧‧‧Vacuum hole 12‧‧‧Convex 13‧‧‧Optical glass layer 131‧‧‧Glossy 132‧‧‧Receiving surface 14‧‧‧Suction components 21‧‧‧Vehicle 22‧‧‧film 23‧‧‧Processed carrier board 231‧‧‧surface 232‧‧‧Bottom 30‧‧‧Laser components S‧‧‧Chamber

圖1為本發明之半導體封裝製造設備的示意圖。FIG. 1 is a schematic diagram of the semiconductor package manufacturing equipment of the present invention.

10‧‧‧半導體封裝製造設備 10‧‧‧Semiconductor packaging manufacturing equipment

11‧‧‧吸附框體 11‧‧‧Adsorption frame

112‧‧‧表面 112‧‧‧Surface

113‧‧‧抽氣孔洞 113‧‧‧Vacuum hole

12‧‧‧凸部 12‧‧‧Convex

13‧‧‧光學玻璃層 13‧‧‧Optical glass layer

131‧‧‧出光面 131‧‧‧Glossy

132‧‧‧受光面 132‧‧‧Receiving surface

14‧‧‧抽氣元件 14‧‧‧Suction components

21‧‧‧載具 21‧‧‧Vehicle

22‧‧‧膜層 22‧‧‧film

23‧‧‧加工載板 23‧‧‧Processed carrier board

231‧‧‧表面 231‧‧‧surface

232‧‧‧底面 232‧‧‧Bottom

30‧‧‧雷射元件 30‧‧‧Laser components

S‧‧‧腔室 S‧‧‧Chamber

Claims (8)

一種半導體封裝製造設備，用於一扇出式等級封裝構造及一晶圓產品，該半導體封裝製造設備包括： 一吸附框體，用以供一載具放置，其中該載具包含一膜層與一加工載板，該加工載板貼附於該膜層； 一光學玻璃層，設置於該吸附框體之內，其中當該載具放置於該吸附框體時，該膜層與該光學玻璃層之間形成一腔室，該膜層位於該加工載板與該腔室之間；以及 至少一抽氣元件，設置於該吸附框體之內，該至少一抽氣元件抽氣，使該膜層與該光學玻璃層之間形成真空，該膜層朝該光學玻璃層移動，以使該加工載板平貼於該光學玻璃層。 A semiconductor packaging manufacturing equipment for a fan-out grade packaging structure and a wafer product. The semiconductor packaging manufacturing equipment includes: An adsorption frame for placing a carrier, wherein the carrier includes a film layer and a processing carrier board, and the processing carrier board is attached to the film layer; An optical glass layer is provided in the adsorption frame, wherein when the carrier is placed in the adsorption frame, a cavity is formed between the film layer and the optical glass layer, and the film layer is located on the processing carrier With the chamber; and At least one suction element is disposed within the suction frame, and the at least one suction element draws air to form a vacuum between the film layer and the optical glass layer, and the film layer moves toward the optical glass layer so that The processed carrier plate is flat on the optical glass layer. 如申請專利範圍第1項所述之半導體封裝製造設備，更包括： 一雷射元件，用以發出一雷射光束，該雷射光束穿過該光學玻璃層與該膜層，用以對該加工載板進行加工。 The semiconductor packaging manufacturing equipment as described in item 1 of the scope of patent application further includes: A laser element is used to emit a laser beam, and the laser beam passes through the optical glass layer and the film layer for processing the processing carrier board. 如申請專利範圍第1項所述之半導體封裝製造設備，其中該吸附框體包括一凸部，該凸部凸出於該光學玻璃層，且該凸部凸出於該吸附框體之一表面，形成一環形凸部。The semiconductor package manufacturing equipment as described in item 1 of the patent application range, wherein the suction frame includes a convex portion, the convex portion protrudes from the optical glass layer, and the convex portion protrudes from a surface of the suction frame , Forming an annular convex portion. 一種雷射加工方法，包括以下步驟： 放置一載具於一吸附框體，其中該載具包含一膜層與一加工載板，該加工載板貼附於該膜層； 使該膜層與該吸附框體之一光學玻璃層之間形成一腔室，其中該膜層位於該加工載板與該腔室之間； 對該腔室抽氣，使該膜層與該光學玻璃層之間形成真空，該膜層朝該光學玻璃層移動，以使該加工載板平貼於該光學玻璃層；以及 一雷射元件用以發出一雷射光束，該雷射光束穿過該光學玻璃層與該膜層，用以對該加工載板進行加工。 A laser processing method includes the following steps: Placing a carrier on an adsorption frame, wherein the carrier includes a film layer and a processing carrier board, and the processing carrier board is attached to the film layer; Forming a cavity between the film layer and an optical glass layer of the adsorption frame, wherein the film layer is located between the processing carrier and the cavity; Pumping the chamber to form a vacuum between the film layer and the optical glass layer, the film layer moves toward the optical glass layer, so that the processing carrier is flat against the optical glass layer; and A laser element is used to emit a laser beam. The laser beam passes through the optical glass layer and the film layer for processing the processing carrier. 如申請專利範圍第4項所述之雷射加工方法，其中該光學玻璃層係為一透明玻璃。The laser processing method as described in item 4 of the patent application scope, wherein the optical glass layer is a transparent glass. 如申請專利範圍第4項所述之雷射加工方法，其中所述使該膜層與該吸附框體之該光學玻璃層之間形成該腔室的步驟，包括以下步驟： 使該膜層接觸於該吸附框體之一凸部，其中該凸部凸出於該光學玻璃層，且該凸部凸出於該吸附框體之一表面，形成一環形凸部。 The laser processing method as described in item 4 of the patent application scope, wherein the step of forming the chamber between the film layer and the optical glass layer of the adsorption frame includes the following steps: The film layer is brought into contact with a convex portion of the suction frame body, wherein the convex portion protrudes from the optical glass layer, and the convex portion protrudes from a surface of the suction frame body to form an annular convex portion. 一種加工載板之整平方法，包括以下步驟： 放置一載具於一吸附框體，其中該載具包含一膜層與一加工載板，該加工載板貼附於該膜層； 使該膜層與該吸附框體之一光學玻璃層之間形成一腔室，其中該膜層位於該加工載板與該腔室之間；以及 對該腔室抽氣，使該膜層與該光學玻璃層之間形成真空，該膜層朝該光學玻璃層移動，以使該加工載板平貼於該光學玻璃層。 A leveling method for processing carrier board includes the following steps: Placing a carrier on an adsorption frame, wherein the carrier includes a film layer and a processing carrier board, and the processing carrier board is attached to the film layer; Forming a cavity between the film layer and an optical glass layer of the adsorption frame, wherein the film layer is located between the processing carrier and the cavity; and The chamber is evacuated to form a vacuum between the film layer and the optical glass layer, and the film layer moves toward the optical glass layer, so that the processing carrier plate is flat against the optical glass layer. 如申請專利範圍第7項所述之加工載板之整平方法，其中所述使該膜層與該吸附框體之該光學玻璃層之間形成該腔室的步驟，包括以下步驟： 使該膜層接觸於該吸附框體之一凸部，其中該凸部凸出於該光學玻璃層，且該凸部凸出於該吸附框體之一表面，形成一環形凸部。 The leveling method for processing a carrier plate as described in item 7 of the patent application scope, wherein the step of forming the cavity between the film layer and the optical glass layer of the adsorption frame includes the following steps: The film layer is brought into contact with a convex portion of the suction frame body, wherein the convex portion protrudes from the optical glass layer, and the convex portion protrudes from a surface of the suction frame body to form an annular convex portion.
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TW200427521A (en) * 2003-03-03 2004-12-16 Toray Industries Slit die, and method and apparatus for manufacturing base material having coated film
TW200610954A (en) * 2004-09-16 2006-04-01 Jen-I Kuo Method for measuring numbers of via and checking qualities of filled-via for ceramic green tapes
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TWM554224U (en) * 2017-10-02 2018-01-11 盟立自動化股份有限公司 Laser assisted bonding apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200427521A (en) * 2003-03-03 2004-12-16 Toray Industries Slit die, and method and apparatus for manufacturing base material having coated film
TW200610954A (en) * 2004-09-16 2006-04-01 Jen-I Kuo Method for measuring numbers of via and checking qualities of filled-via for ceramic green tapes
WO2014071179A2 (en) * 2012-11-01 2014-05-08 Thermalens, Llc Thermally influenced changeable tint device
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