TWI680305B - Free form display panel and manufacturing method thereof - Google Patents
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Abstract
一種異型顯示面板，包括一基板、多個畫素、一檢測線路以及一驅動晶片。檢測線路設置在基板上。檢測線路包括多個電極墊、多個開關元件、多條導線以及一訊號輸入墊。多條導線與多個開關元件電性連接，且多條導線中的至少一條的至少一端與基板的邊緣切齊。驅動晶片電性連接於多個電極墊以及訊號輸入墊，其中訊號輸入墊連接至驅動晶片的閘極低電位（VGL），使得多個開關元件持續處於關閉狀態。一種異型顯示面板的製造方法亦被提出。A special-shaped display panel includes a substrate, a plurality of pixels, a detection circuit, and a driving chip. The detection circuit is provided on the substrate. The detection circuit includes a plurality of electrode pads, a plurality of switching elements, a plurality of wires, and a signal input pad. The plurality of wires are electrically connected to the plurality of switching elements, and at least one end of at least one of the plurality of wires is aligned with an edge of the substrate. The driving chip is electrically connected to a plurality of electrode pads and signal input pads, wherein the signal input pad is connected to the gate low potential (VGL) of the driving chip, so that a plurality of switching elements are continuously turned off. A method for manufacturing a special-shaped display panel is also proposed.
Description
本發明是有關於一種顯示面板及其製造方法，且特別是有關於一種異型顯示面板及其製造方法。 The present invention relates to a display panel and a method for manufacturing the same, and in particular, to a special-shaped display panel and a method for manufacturing the same.
在顯示面板與後端模組貼合前，通常會先以P檢(Panel light-on檢測；面板點燈檢測)治具向顯示面板輸入訊號來檢測顯示面板是否有點、線或色彩異常等不良問題，以篩除不良品。藉此避免將不良品與後端模組(如背光模組)接合所造成的浪費，進而節省成本。隨著顯示面板解析度的提升，檢測線路所需的線路布局空間隨之增加。因此，在顯示面板的尺寸固定下，解析度的提升將使得檢測線路的布局(線路設計)變得更困難。對於形狀特殊的異型顯示面板，其具有比傳統面板更小的線路布局空間，因此其檢測線路的布局更是困難。 Before the display panel and the back-end module are attached, usually a P-check (Panel light-on detection) is used to input a signal to the display panel to detect whether the display panel is defective, abnormal, or abnormal. Problems to screen out defective products. In this way, waste caused by joining defective products with a back-end module (such as a backlight module) is avoided, thereby saving costs. With the improvement of the display panel resolution, the wiring layout space required for detecting the wiring increases accordingly. Therefore, with the fixed size of the display panel, the improvement of the resolution will make it more difficult to detect the layout (wiring design) of the wiring. For the special-shaped special-shaped display panel, it has a smaller wiring layout space than the traditional panel, so it is more difficult to detect the layout of the wiring.
本發明提供一種異型顯示面板及其製造方法，其能解決 線路布局空間不足的問題，同時確保顯示品質。 The invention provides a special-shaped display panel and a manufacturing method thereof, which can solve the problem. The problem of insufficient circuit layout space, while ensuring the display quality.
本發明的一實施例提供一種異型顯示面板，其包括一基板、多個畫素、一檢測線路以及一驅動晶片。多個畫素設置在基板上，以形成基板的一顯示區。檢測線路設置在基板上，且檢測線路包括多個電極墊、多個開關元件、多條導線以及一訊號輸入墊。多個電極墊設置在基板的顯示區的周圍，且多個電極墊分別與位於顯示區中的訊號線電性連接。多個開關元件與多個電極墊電性連接，其中多個電極墊位於顯示區與多個開關元件之間。多條導線與多個開關元件電性連接，且多條導線中的至少一條的至少一端與基板的邊緣切齊。訊號輸入墊與每一個開關元件的閘極電性連接。驅動晶片與多個電極墊以及訊號輸入墊電性連接，其中訊號輸入墊連接至驅動晶片的閘極低電位，使得多個開關元件持續處於關閉狀態。 An embodiment of the present invention provides a special-shaped display panel including a substrate, a plurality of pixels, a detection circuit, and a driving chip. A plurality of pixels are disposed on the substrate to form a display area of the substrate. The detection circuit is disposed on the substrate, and the detection circuit includes a plurality of electrode pads, a plurality of switching elements, a plurality of wires, and a signal input pad. The plurality of electrode pads are disposed around the display area of the substrate, and the plurality of electrode pads are electrically connected to the signal lines located in the display area, respectively. The plurality of switching elements are electrically connected to the plurality of electrode pads, wherein the plurality of electrode pads are located between the display area and the plurality of switching elements. The plurality of wires are electrically connected to the plurality of switching elements, and at least one end of at least one of the plurality of wires is aligned with an edge of the substrate. The signal input pad is electrically connected to the gate of each switching element. The driving chip is electrically connected to a plurality of electrode pads and a signal input pad, wherein the signal input pad is connected to a low potential of a gate of the driving chip, so that a plurality of switching elements are continuously turned off.
本發明的一實施例提供一種異型顯示面板的製造方法，其包括以下步驟。提供一顯示面板。顯示面板包括一基板、多個畫素以及檢測線路。多個畫素以及檢測線路設置在基板上。多個畫素形成基板的一顯示區。檢測線路包括多個電極墊、多個開關元件、一訊號輸入墊、多個檢測訊號輸入墊以及多條導線，其中訊號輸入墊以及多個檢測訊號輸入墊透過多條導線與多個開關元件電性連接。訊號輸入墊與每一個開關元件的閘極電性連接，且多個檢測訊號輸入墊與多個開關元件的多個源極電性連接。以P檢治具向顯示面板進行檢查。對顯示面板進行一異型切割製程， 以改變顯示面板的形狀，並移除多個檢測訊號輸入墊。將經異型切割的顯示面板與一驅動晶片接合，以形成異型顯示面板。 An embodiment of the invention provides a method for manufacturing a special-shaped display panel, which includes the following steps. A display panel is provided. The display panel includes a substrate, a plurality of pixels, and a detection circuit. A plurality of pixels and detection lines are provided on the substrate. A plurality of pixels form a display area of the substrate. The detection circuit includes a plurality of electrode pads, a plurality of switching elements, a signal input pad, a plurality of detection signal input pads, and a plurality of wires. The signal input pad and the plurality of detection signal input pads communicate with a plurality of switching elements through a plurality of wires. Sexual connection. The signal input pads are electrically connected to the gates of each switching element, and the plurality of detection signal input pads are electrically connected to multiple sources of the plurality of switching elements. Inspect the display panel with the P fixture. Performing a special cutting process on the display panel, To change the shape of the display panel and remove multiple detection signal input pads. The profiled-cut display panel is bonded to a driving chip to form a profiled display panel.
基於上述，在本發明的實施例的異型顯示面板及其製造方法中，多個檢測訊號輸入墊設置在異型切割所欲切除的區域，在P檢後，即將多個檢測訊號輸入墊移除，以滿足異型顯示面板的形狀設計。由於多個檢測訊號輸入墊的布局不用受限於異型顯示面板的形狀設計，因此不但增大了線路布局的餘裕度及降低設計的困難度，還可依需求設置更多的導線、增加P檢的檢測項目或增加檢測強度。此外，在異型切割製程之後，多個開關元件透過訊號輸入墊連接至驅動晶片的閘極低電位而持續處於關閉狀態，因此可避免外部雜訊透過多個開關元件傳入顯示區而影響顯示效果。是以，本發明的實施例的異型顯示面板及其製造方法能解決線路布局空間不足的問題，同時確保顯示品質。 Based on the above, in the special-shaped display panel and the manufacturing method thereof according to the embodiments of the present invention, a plurality of detection signal input pads are disposed in a region to be cut off by the abnormal cutting. After the P-test, the plurality of detection signal input pads are removed. To meet the shape design of the special-shaped display panel. Because the layout of multiple detection signal input pads is not limited to the shape design of the special-shaped display panel, it not only increases the margin of circuit layout and reduces the difficulty of design, but also can set more wires and increase the P detection as required. Test items or increase the intensity of the test. In addition, after the special-shaped cutting process, multiple switching elements are connected to the low potential of the gate of the driving chip through the signal input pad and remain in a closed state, so that external noise can be prevented from entering the display area through multiple switching elements and affecting the display effect. . Therefore, the special-shaped display panel and the manufacturing method thereof according to the embodiments of the present invention can solve the problem of insufficient circuit layout space and ensure the display quality.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.
100、800、1000‧‧‧顯示面板 100, 800, 1000‧‧‧ display panels
100A、800A、1000A‧‧‧異型顯示面板 100A, 800A, 1000A‧‧‧ Special-shaped display panel
110、810、1010‧‧‧基板 110, 810, 1010‧‧‧ substrate
111、811、1011‧‧‧邊緣 111, 811, 1011 ‧ ‧ ‧ edge
120、120A‧‧‧檢測線路 120, 120A‧‧‧Test line
121‧‧‧電極墊 121‧‧‧ electrode pad
122‧‧‧開關元件 122‧‧‧Switch element
123、127、131‧‧‧導線 123, 127, 131‧‧‧ wires
123a‧‧‧第一導線 123a‧‧‧first lead
123b‧‧‧第二導線 123b‧‧‧Second Lead
124‧‧‧訊號輸入墊 124‧‧‧Signal input pad
125‧‧‧檢測訊號輸入墊 125‧‧‧test signal input pad
126‧‧‧開關墊 126‧‧‧Switch Pad
130‧‧‧顯示區 130‧‧‧display area
140‧‧‧驅動晶片 140‧‧‧Driver
150、850、1050、1450、1451‧‧‧切割線 150, 850, 1050, 1450, 1451‧‧‧ cutting lines
1212‧‧‧主動元件陣列基板 1212‧‧‧Active Element Array Substrate
1213‧‧‧對向基板 1213‧‧‧ Opposite substrate
1314‧‧‧顯示介質 1314‧‧‧Display media
1400‧‧‧面板陣列 1400‧‧‧ Panel Array
1460‧‧‧面板單元 1460‧‧‧ Panel Unit
A、A1‧‧‧區域 A, A1‧‧‧ area
D‧‧‧汲極 D‧‧‧ Drain
G‧‧‧閘極 G‧‧‧Gate
S‧‧‧源極 S‧‧‧Source
S110‧‧‧基板組立製程 S110‧‧‧Substrate assembly process
S120‧‧‧液晶注入製程 S120‧‧‧LCD injection process
S130‧‧‧面板陣列切割製程 S130‧‧‧ Panel Array Cutting Process
圖1是顯示面板進行異型切割製程前的一種正視示意圖。 FIG. 1 is a schematic front view of a display panel before a special-shaped cutting process is performed.
圖2是檢測線路在圖1的區域A的一種放大示意圖。 FIG. 2 is an enlarged schematic diagram of the detection line in the area A of FIG. 1.
圖3是圖1的顯示面板進行異形切割製程的示意圖。 FIG. 3 is a schematic diagram of a special cutting process performed by the display panel of FIG. 1.
圖4是本發明的一實施例的一種異型顯示面板的正視示意 圖。 4 is a schematic front view of a special-shaped display panel according to an embodiment of the present invention; Illustration.
圖5是檢測線路在圖4的區域A1的一種放大示意圖。 FIG. 5 is an enlarged schematic diagram of the detection line in the area A1 of FIG. 4.
圖6是檢測線路在圖1的區域A的另一種放大示意圖。 FIG. 6 is another enlarged schematic diagram of the detection line in the area A of FIG. 1.
圖7是檢測線路在圖4的區域A1的另一種放大示意圖。 FIG. 7 is another enlarged schematic diagram of the detection line in the area A1 of FIG. 4.
圖8是顯示面板進行異型切割製程前的另一種正視示意圖。 FIG. 8 is another schematic front view of the display panel before the profile cutting process is performed.
圖9是本發明的另一實施例的一種異型顯示面板的正視示意圖。 FIG. 9 is a schematic front view of a special-shaped display panel according to another embodiment of the present invention.
圖10是顯示面板進行異型切割製程前的又一種正視示意圖。 FIG. 10 is another schematic front view of the display panel before the profile cutting process is performed.
圖11是本發明的又一實施例的一種異型顯示面板的正視示意圖。 11 is a schematic front view of a special-shaped display panel according to another embodiment of the present invention.
圖12是顯示面板的基板組立製程的側視示意圖。 FIG. 12 is a schematic side view of a substrate assembly process of a display panel.
圖13是顯示面板的液晶注入製程的側視示意圖。 13 is a schematic side view of a liquid crystal injection process of a display panel.
圖14是顯示面板的面板陣列切割製程的正視示意圖。 14 is a schematic front view of a panel array cutting process of a display panel.
圖1是顯示面板進行異型切割製程前的一種正視示意圖。圖2是檢測線路在圖1的區域A的一種放大示意圖。請參照圖1與圖2，本發明的實施例的異型顯示面板的製造方法首先提供一顯示面板100。顯示面板100包括一基板110、多個畫素(未繪示)以及一檢測線路120。所述多個畫素以及檢測線路120設置在基板110上，且所述多個畫素形成基板110的顯示區130。檢測線路120包括多個電極墊121、多個開關元件122、多條導線123、 一訊號輸入墊124以及多個檢測訊號輸入墊125。 FIG. 1 is a schematic front view of a display panel before a special-shaped cutting process is performed. FIG. 2 is an enlarged schematic diagram of the detection line in the area A of FIG. 1. Please refer to FIG. 1 and FIG. 2. A method for manufacturing a special-shaped display panel according to an embodiment of the present invention first provides a display panel 100. The display panel 100 includes a substrate 110, a plurality of pixels (not shown), and a detection circuit 120. The plurality of pixels and the detection circuit 120 are disposed on a substrate 110, and the plurality of pixels form a display area 130 of the substrate 110. The detection circuit 120 includes a plurality of electrode pads 121, a plurality of switching elements 122, a plurality of wires 123, A signal input pad 124 and a plurality of detection signal input pads 125.
多個電極墊121設置在基板110的顯示區130的周圍。舉例來說，多個電極墊121可全部設置在顯示區130的其中一側，但不以此為限。替代地，多個電極墊121也可依設計需求而設置在顯示區130的兩側、三側或四側。 A plurality of electrode pads 121 are provided around the display area 130 of the substrate 110. For example, the plurality of electrode pads 121 may be all disposed on one side of the display area 130, but is not limited thereto. Alternatively, the plurality of electrode pads 121 may be disposed on two sides, three sides, or four sides of the display area 130 according to design requirements.
多個電極墊121分別與位於顯示區130中的多條訊號線(未繪示)電性連接。舉例來說，檢測線路120可進一步包括多條導線131，且顯示區130中的多條訊號線(包括多條掃描線以及多條資料線)可透過多條導線131與多個電極墊121電性連接。在本實施例中，每一條訊號線透過一條導線131與對應的一個電極墊121電性連接，但不以此為限。 The plurality of electrode pads 121 are respectively electrically connected to a plurality of signal lines (not shown) located in the display area 130. For example, the detection circuit 120 may further include a plurality of wires 131, and a plurality of signal lines (including a plurality of scan lines and a plurality of data lines) in the display area 130 may be electrically connected to the plurality of electrode pads 121 through the plurality of wires 131 Sexual connection. In this embodiment, each signal line is electrically connected to a corresponding electrode pad 121 through a wire 131, but is not limited thereto.
多個開關元件122與多個電極墊121電性連接，且多個電極墊121位於顯示區130與多個開關元件122之間。舉例來說，檢測線路120可進一步包括多條導線127，且多個電極墊121透過多條導線127而與多個開關元件122的多個汲極D電性連接。 The plurality of switching elements 122 are electrically connected to the plurality of electrode pads 121, and the plurality of electrode pads 121 are located between the display area 130 and the plurality of switching elements 122. For example, the detection circuit 120 may further include a plurality of wires 127, and the plurality of electrode pads 121 are electrically connected to the plurality of drain electrodes D of the plurality of switching elements 122 through the plurality of wires 127.
多條導線123與多個開關元件122電性連接，且多個開關元件122位於多條導線123與多個電極墊121之間。舉例來說，多條導線123包括一第一導線123a以及多條第二導線123b。第一導線123a電性連接多個開關元件122的多個閘極G，而多條第二導線123b分別電性連接多個開關元件122的多個源極S。 The plurality of leads 123 are electrically connected to the plurality of switching elements 122, and the plurality of switching elements 122 are located between the plurality of leads 123 and the plurality of electrode pads 121. For example, the plurality of conductive lines 123 includes a first conductive line 123a and a plurality of second conductive lines 123b. The first wire 123a is electrically connected to the plurality of gates G of the plurality of switching elements 122, and the plurality of second wires 123b are electrically connected to the plurality of sources S of the plurality of switching elements 122, respectively.
訊號輸入墊124與每一個開關元件122的閘極G電性連接。舉例來說，訊號輸入墊124透過第一導線123a而與每一個開 關元件122的閘極G電性連接。在本實施例中，訊號輸入墊124、多個開關元件122以及多個電極墊121位於顯示區130與多條導線123之間。然而，上述元件的相對設置關係不以此為限。 The signal input pad 124 is electrically connected to the gate G of each switching element 122. For example, the signal input pad 124 is connected to each of the signals through the first wire 123a. The gate G of the off element 122 is electrically connected. In this embodiment, the signal input pad 124, the plurality of switching elements 122, and the plurality of electrode pads 121 are located between the display area 130 and the plurality of wires 123. However, the relative arrangement relationship of the above elements is not limited to this.
多個檢測訊號輸入墊125透過多條導線123與多個開關元件122電性連接。舉例來說，多個檢測訊號輸入墊125透過多條第二導線123b而與多個開關元件122的多個源極S電性連接。在本實施例中，多個檢測訊號輸入墊125位於多條第二導線123b的相對兩端，但不以此為限。 The plurality of detection signal input pads 125 are electrically connected to the plurality of switching elements 122 through the plurality of wires 123. For example, the plurality of detection signal input pads 125 are electrically connected to the plurality of sources S of the plurality of switching elements 122 through the plurality of second wires 123b. In this embodiment, the plurality of detection signal input pads 125 are located at opposite ends of the plurality of second wires 123b, but not limited thereto.
顯示面板100的檢測線路120還可進一步包括一開關墊126，開關墊126與每一個開關元件122的閘極G電性連接。舉例來說，開關墊126透過第一導線123a而與每一個開關元件122的閘極G電性連接。在此架構下，開關墊126與訊號輸入墊124也透過第一導線123a而彼此電性連接。 The detection circuit 120 of the display panel 100 may further include a switch pad 126. The switch pad 126 is electrically connected to the gate G of each switching element 122. For example, the switch pad 126 is electrically connected to the gate G of each switching element 122 through the first wire 123a. Under this architecture, the switch pad 126 and the signal input pad 124 are also electrically connected to each other through the first wire 123a.
在以P檢治具向顯示面板100進行檢查時，以P檢治具向開關墊126輸入一第一訊號，以開啟多個開關元件122。此外，以P檢治具向多個檢測訊號輸入墊125輸入一第二訊號，以點亮位於顯示區130中的多個畫素(未繪示)。在本實施例中，每一個畫素包括一個紅色子畫素、一個綠色子畫素以及一個藍色子畫素。然而，每一個畫素中的子畫素的顏色種類以及每一種顏色的子畫素的數量可依需求改變，而不以上述為限。 When the display panel 100 is inspected with the P inspection fixture, a first signal is input to the switch pad 126 with the P inspection fixture to turn on the plurality of switching elements 122. In addition, a second signal is input to the plurality of detection signal input pads 125 with a P inspection fixture to light up a plurality of pixels (not shown) located in the display area 130. In this embodiment, each pixel includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel. However, the color type of the sub-pixels in each pixel and the number of sub-pixels of each color can be changed according to requirements, not limited to the above.
在以P檢治具向顯示面板100進行檢查時，多個檢測訊號輸入墊125的其中兩個(左右各一個)可透過對應的一條第二 導線123b、對應的多個開關元件122、對應的多條導線127、對應的多個電極墊121以及對應的多條導線131而與顯示區130中的多條掃描線電性連接，且可藉由所述兩個檢測訊號輸入墊125將掃描訊號提供至顯示區130中的多條掃描線。此外，多個檢測訊號輸入墊125的其中兩個(左右各一個)可透過對應的一條第二導線123b、對應的多個開關元件122、對應的多條導線127、對應的多個電極墊121以及對應的多條導線131而與顯示區130中的多個紅色子畫素(或綠色子畫素；或藍色子畫素)的多條資料線電性連接，且可藉由所述兩個檢測訊號輸入墊125將紅色子畫素(或綠色子畫素；或藍色子畫素)的資料訊號提供至顯示區130中的多個紅色子畫素(或綠色子畫素；或藍色子畫素)的多條資料線。如此，可同時檢測顯示區130中的多個紅色子畫素(或綠色子畫素；或藍色子畫素)是否皆能正常操作。 When inspecting the display panel 100 with the P inspection fixture, two of the plurality of detection signal input pads 125 (one each on the left and right) can pass through the corresponding second The wires 123b, the corresponding switching elements 122, the corresponding wires 127, the corresponding electrode pads 121, and the corresponding wires 131 are electrically connected to the scanning lines in the display area 130, and can be borrowed. The two detection signal input pads 125 provide scanning signals to a plurality of scanning lines in the display area 130. In addition, two of the plurality of detection signal input pads 125 (one each left and right) can pass through a corresponding second wire 123b, a corresponding plurality of switching elements 122, a corresponding plurality of wires 127, and a corresponding plurality of electrode pads 121. And a plurality of corresponding wires 131 are electrically connected to a plurality of data lines of a plurality of red sub-pixels (or green sub-pixels or blue sub-pixels) in the display area 130, and the two The detection signal input pads 125 provide data signals of red sub pixels (or green sub pixels) or blue sub pixels to a plurality of red sub pixels (or green sub pixels) or blue pixels in the display area 130. Dice pixels). In this way, whether multiple red sub-pixels (or green sub-pixels or blue sub-pixels) in the display area 130 can operate normally can be detected at the same time.
應說明的是，圖2僅示意性繪示出四條導線131、四個電極墊121、四條導線127、四個開關元件122、一個訊號輸入墊124、兩個開關墊126(左右各一個)以及八個檢測訊號輸入墊125(左右各四個)，但上述各元件的數量、這些元件的相對設置關係及連接關係可依需求改變，而不以圖2所繪示的為限。舉例來說，多個電極墊121可透過多條導線127連接至一個開關元件122，但不以此為限。 It should be noted that FIG. 2 only schematically illustrates four wires 131, four electrode pads 121, four wires 127, four switching elements 122, one signal input pad 124, two switch pads 126 (one on each side), and Eight detection signal input pads 125 (four from left and right), but the number of the above components, the relative arrangement relationship and connection relationship of these components can be changed according to requirements, and is not limited to what is shown in FIG. 2. For example, the plurality of electrode pads 121 may be connected to one switching element 122 through a plurality of wires 127, but is not limited thereto.
圖3是圖1的顯示面板進行異形切割製程的示意圖。圖4是本發明的一實施例的一種異型顯示面板的正視示意圖。請參照 圖3與圖4，當顯示面板100通過P檢後，可對顯示面板100進行一異型切割製程，以改變顯示面板100的形狀，並移除多個檢測訊號輸入墊125。舉例來說，可沿著圖3的切割線150進行切割。在本實施例中，異型切割製程除了移除多個檢測訊號輸入墊125之外，還移除了開關墊126。 FIG. 3 is a schematic diagram of a special cutting process performed by the display panel of FIG. 1. FIG. 4 is a schematic front view of a special-shaped display panel according to an embodiment of the present invention. Please refer to 3 and 4, after the display panel 100 passes the P-test, a special cutting process may be performed on the display panel 100 to change the shape of the display panel 100 and remove a plurality of detection signal input pads 125. For example, cutting may be performed along the cutting line 150 of FIG. 3. In this embodiment, in addition to removing the plurality of detection signal input pads 125, the special-shaped cutting process also removes the switch pads 126.
由於多個檢測訊號輸入墊125以及開關墊126是設置在異型切割會切除的區域中，因此上述元件的布局不用受限於異型顯示面板的形狀設計。在這樣的設計下，不但增大了線路布局的餘裕度及降低設計的困難度，還可依需求設置更多的導線、增加P檢的檢測項目(例如檢測更多模式)或增加檢測強度。是以，本實施例的異型顯示面板的製造方法能有效解決線路布局空間不足的問題。 Since the plurality of detection signal input pads 125 and the switch pads 126 are disposed in the area cut by the special-shaped cutting, the layout of the above components is not limited to the shape design of the special-shaped display panel. Under such a design, not only the margin of the circuit layout is increased and the difficulty of the design is reduced, but also more wires may be set as required, the detection items of the P inspection (such as detecting more modes), or the detection intensity may be increased. Therefore, the manufacturing method of the special-shaped display panel of this embodiment can effectively solve the problem of insufficient circuit layout space.
在異型切割製程後，將經異型切割的顯示面板100與一驅動晶片140接合，以形成如圖4所示的異型顯示面板100A。 After the special-shaped cutting process, the special-shaped display panel 100 is bonded to a driving chip 140 to form the special-shaped display panel 100A as shown in FIG. 4.
圖5是檢測線路在圖4的區域A1的一種放大示意圖。請參照圖4與圖5，驅動晶片140覆蓋在未被異型切割製程移除的檢測線路120A的一部分上。在圖5中，以實線繪示出位於驅動晶片140下的檢測線路120A，以清楚顯示這些元件之間的相對設置關係。 FIG. 5 is an enlarged schematic diagram of the detection line in the area A1 of FIG. 4. Please refer to FIG. 4 and FIG. 5, the driving chip 140 covers a part of the detection circuit 120A that is not removed by the profile cutting process. In FIG. 5, the detection circuit 120A located under the driving chip 140 is drawn with a solid line to clearly show the relative arrangement relationship between these components.
異型顯示面板100A的檢測線路120A包括多個電極墊121、多個開關元件122、多條導線123以及訊號輸入墊124。驅動晶片140電性連接於多個電極墊121以及訊號輸入墊124，其中 訊號輸入墊124連接至驅動晶片140的閘極低電位，使得多個開關元件122持續處於關閉狀態。 The detection circuit 120A of the special-shaped display panel 100A includes a plurality of electrode pads 121, a plurality of switching elements 122, a plurality of wires 123, and a signal input pad 124. The driving chip 140 is electrically connected to a plurality of electrode pads 121 and a signal input pad 124, wherein The signal input pad 124 is connected to the low potential of the gate of the driving chip 140, so that the plurality of switching elements 122 are continuously turned off.
進一步來說，上述的異型切割製程還移除了基板110及其上的多條導線123中的至少一條的至少部分，使得在異型切割製程之後，至少一條導線123的至少一端(即被切割的導線的切割端)與基板110的邊緣111(即基板的切割邊緣)切齊。例如，圖3中位於切割線150所圍設的範圍之外的第一導線123a與多條第二導線123b的這些部分被移除，使得圖4中的第一導線123a與多條第二導線123b的一端與基板110的邊緣111切齊。在第一導線123a與多條第二導線123b沒有連接到任何電位的情況下，第一導線123a與多條第二導線123b的電位是浮置(floating)的，使得多個開關元件122可能在不該開啟時被開啟。當開關元件122在不該開啟時被開啟，外部雜訊會進入顯示區130而影響顯示效果。在本實施例中，多個開關元件122透過訊號輸入墊124連接至驅動晶片140的閘極低電位而持續處於關閉狀態，因此可避免外部雜訊透過多個開關元件122傳入顯示區130。是以，異型顯示面板100A可具有良好的顯示品質。 Further, the aforementioned special-shaped cutting process also removes at least part of at least one of the substrate 110 and the plurality of wires 123 thereon, so that after the special-shaped cutting process, at least one end of the at least one wire 123 (that is, the cut The cutting end of the wire is aligned with the edge 111 of the substrate 110 (ie, the cutting edge of the substrate). For example, the portions of the first conductive line 123a and the plurality of second conductive lines 123b outside the area surrounded by the cutting line 150 in FIG. 3 are removed, so that the first conductive line 123a and the plurality of second conductive lines in FIG. 4 are removed. One end of 123b is aligned with the edge 111 of the substrate 110. When the first lead 123a and the plurality of second leads 123b are not connected to any potential, the potentials of the first lead 123a and the plurality of second leads 123b are floating, so that the plurality of switching elements 122 may be at It should be turned on when it shouldn't. When the switching element 122 is turned on when it should not be turned on, external noise may enter the display area 130 and affect the display effect. In this embodiment, the plurality of switching elements 122 are connected to the low potential of the gate of the driving chip 140 through the signal input pad 124 and are continuously turned off. Therefore, external noise can be prevented from entering the display area 130 through the plurality of switching elements 122. Therefore, the special-shaped display panel 100A can have good display quality.
圖6是檢測線路在圖1的區域A的另一種放大示意圖。圖7是檢測線路在圖4的區域A1的另一種放大示意圖。具體地，圖6的檢測線路在異型切割製程與驅動晶片接合製程後形成圖7的檢測線路。請參照圖6與圖7，圖6與圖7分別相似於圖2與圖5。圖6與圖2的主要差異以及圖7與圖5的主要差異在於，圖6 與圖7省略了圖2與圖5的開關墊126。此外，在P檢時，P檢治具向訊號輸入墊124輸入第一訊號，以開啟多個開關元件122。 FIG. 6 is another enlarged schematic diagram of the detection line in the area A of FIG. 1. FIG. 7 is another enlarged schematic diagram of the detection line in the area A1 of FIG. 4. Specifically, the detection circuit of FIG. 6 forms the detection circuit of FIG. 7 after the profile cutting process and the driving wafer bonding process. Please refer to FIG. 6 and FIG. 7, which are similar to FIG. 2 and FIG. 5, respectively. The main difference between FIG. 6 and FIG. 2 and the main difference between FIG. 7 and FIG. 5 is that FIG. 6 The switching pad 126 of FIGS. 2 and 5 is omitted from FIG. 7. In addition, during the P test, the P test fixture inputs a first signal to the signal input pad 124 to turn on the plurality of switching elements 122.
圖8是顯示面板進行異型切割製程前的另一種正視示意圖。圖9是本發明的另一實施例的一種異型顯示面板的正視示意圖。圖10是顯示面板進行異型切割製程前的又一種正視示意圖。圖11是本發明的又一實施例的一種異型顯示面板的正視示意圖。具體地，圖8的顯示面板在異型切割製程與驅動晶片接合製程後形成圖9的異型顯示面板，而圖10的顯示面板在異型切割製程與驅動晶片接合製程後形成圖11的異型顯示面板。 FIG. 8 is another schematic front view of the display panel before the profile cutting process is performed. FIG. 9 is a schematic front view of a special-shaped display panel according to another embodiment of the present invention. FIG. 10 is another schematic front view of the display panel before the profile cutting process is performed. 11 is a schematic front view of a special-shaped display panel according to another embodiment of the present invention. Specifically, the display panel of FIG. 8 forms the shaped display panel of FIG. 9 after the profiled cutting process and the driving wafer bonding process, and the display panel of FIG. 10 forms the shaped display panel of FIG. 11 after the shaped cutting process and the driving wafer bonding process.
如圖8至圖11所示，透過本發明實施例的異型顯示面板的製造方法所完成的異型顯示面板的形狀可依實際需求決定，而不以圖4的異型顯示面板100A為限。舉例來說，若沿著圖8的切割線850對顯示面板800進行異型切割製程，則可形成圖9的異型顯示面板800A，其中圖9的異型顯示面板800A中的第一導線123a與多條第二導線123b的一端與基板810的邊緣811切齊。另一方面，若沿著圖10的切割線1050對顯示面板1000進行異型切割製程，則可形成圖11的異型顯示面板1000A，其中圖11的異型顯示面板1000A中的第一導線123a與多條第二導線123b的一端與基板1010的邊緣1011切齊。 As shown in FIG. 8 to FIG. 11, the shape of the special-shaped display panel completed through the manufacturing method of the special-shaped display panel according to the embodiment of the present invention may be determined according to actual requirements, and is not limited to the special-shaped display panel 100A of FIG. 4. For example, if the special-shaped cutting process is performed on the display panel 800 along the cutting line 850 of FIG. 8, the special-shaped display panel 800A of FIG. 9 may be formed, where the first conductive line 123 a and a plurality of wires in the special-shaped display panel 800A of FIG. 9 are formed. One end of the second conductive line 123b is aligned with the edge 811 of the substrate 810. On the other hand, if the special-shaped cutting process is performed on the display panel 1000 along the cutting line 1050 of FIG. 10, the special-shaped display panel 1000A of FIG. 11 may be formed, in which the first conductive line 123 a and a plurality of wires in the special-shaped display panel 1000A of FIG. 11 are formed. One end of the second lead 123b is aligned with the edge 1011 of the substrate 1010.
圖12是顯示面板的基板組立製程的側視示意圖。圖13是顯示面板的液晶注入製程的側視示意圖。圖14是顯示面板的面板陣列切割製程的正視示意圖。請參照圖12至圖14，在上述異型 顯示面板的製造方法中，提供顯示面板100的方法可包括一基板組立製程S110(請參照圖12)、一液晶注入製程S120(請參照圖13)以及一面板陣列切割製程S130(請參照圖14)，其中液晶注入製程S120可在基板組立製程S110之前進行或在面板陣列切割製程S130之後進行。 FIG. 12 is a schematic side view of a substrate assembly process of a display panel. 13 is a schematic side view of a liquid crystal injection process of a display panel. 14 is a schematic front view of a panel array cutting process of a display panel. Please refer to FIGS. 12 to 14. In the manufacturing method of the display panel, the method for providing the display panel 100 may include a substrate assembly process S110 (see FIG. 12), a liquid crystal injection process S120 (see FIG. 13), and a panel array cutting process S130 (see FIG. 14). ), Wherein the liquid crystal injection process S120 may be performed before the substrate assembly process S110 or after the panel array cutting process S130.
詳細來說，液晶注入製程S120可包括真空吸入法或滴下式注入法(One Drop Filling,ODF)。就真空吸入法而言，先進行基板組立製程S110，以接合一主動元件陣列基板1212與一對向基板1213，並形成如圖14所示的面板陣列1400；其次，進行面板陣列切割製程S130，例如沿圖14的切割線1450與切割線1451對面板陣列1400進行切割，以形成多個面板單元1460；然後，再進行液晶注入製程S120，以形成顯示面板(如圖1或圖3的顯示面板100、圖8的顯示面板800或圖10的顯示面板1000)。另一方面，就滴下式注入法而言，可先將主動元件陣列基板1212與對向基板1213的其中之一上膠以形成多個凹槽，再進行液晶注入製程S120；其次，進行基板組立製程S110，以將主動元件陣列基板1212與對向基板1213互相組立，且顯示介質1314位於經組立的主動元件陣列基板1212與對向基板1213之間；然後，再進行面板陣列切割製程S130，以形成顯示面板(如圖1或圖3的顯示面板100、圖8的顯示面板800或圖10的顯示面板1000)。 In detail, the liquid crystal injection process S120 may include a vacuum suction method or a One Drop Filling (ODF) method. As for the vacuum suction method, a substrate assembly process S110 is first performed to join an active element array substrate 1212 and a pair of opposing substrates 1213 to form a panel array 1400 as shown in FIG. 14; secondly, a panel array cutting process S130 is performed. For example, the panel array 1400 is cut along the cutting line 1450 and the cutting line 1451 of FIG. 14 to form a plurality of panel units 1460. Then, a liquid crystal injection process S120 is performed to form a display panel (such as the display panel of FIG. 1 or FIG. 3). 100, the display panel 800 of FIG. 8 or the display panel 1000 of FIG. 10). On the other hand, in the case of the drip implantation method, one of the active element array substrate 1212 and the opposite substrate 1213 may be glued to form a plurality of grooves, and then the liquid crystal injection process S120 is performed; secondly, the substrate assembly is performed. The process S110 is to assemble the active device array substrate 1212 and the opposite substrate 1213 with each other, and the display medium 1314 is located between the assembled active device array substrate 1212 and the opposite substrate 1213. Then, the panel array cutting process S130 is performed to A display panel (such as the display panel 100 of FIG. 1 or FIG. 3, the display panel 800 of FIG. 8, or the display panel 1000 of FIG. 10) is formed.
綜上所述，在本發明的實施例的異型顯示面板及其製造方法中，多個檢測訊號輸入墊設置在異型切割所欲切除的區域， 在P檢後，即將多個檢測訊號輸入墊移除，以滿足異型顯示面板的形狀設計。由於多個檢測訊號輸入墊的布局不用受限於異型顯示面板的形狀設計，因此不但增大了線路布局的餘裕度及降低設計的困難度，還可依需求設置更多的導線、增加P檢的檢測項目或增加檢測強度。此外，在異型切割製程之後，多個開關元件透過訊號輸入墊連接至驅動晶片的閘極低電位而持續處於關閉狀態，因此可避免外部雜訊透過多個開關元件傳入顯示區而影響顯示效果。是以，本發明的實施例的異型顯示面板及其製造方法能解決線路布局空間不足的問題，同時確保顯示品質。 In summary, in the special-shaped display panel and the manufacturing method thereof according to the embodiments of the present invention, a plurality of detection signal input pads are disposed in a region to be cut off by special-shaped cutting. After the P inspection, multiple detection signal input pads are removed to meet the shape design of the special-shaped display panel. Because the layout of multiple detection signal input pads is not limited to the shape design of the special-shaped display panel, it not only increases the margin of circuit layout and reduces the difficulty of design, but also can set more wires and increase the P detection as required Test items or increase the intensity of the test. In addition, after the special-shaped cutting process, multiple switching elements are connected to the low potential of the gate of the driving chip through the signal input pad and remain in a closed state, so that external noise can be prevented from entering the display area through multiple switching elements and affecting the display effect. . Therefore, the special-shaped display panel and the manufacturing method thereof according to the embodiments of the present invention can solve the problem of insufficient circuit layout space and ensure the display quality.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107139228A TWI680305B (en) | 2018-11-06 | 2018-11-06 | Free form display panel and manufacturing method thereof |
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| TW (1) | TWI680305B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI746311B (en) * | 2020-12-11 | 2021-11-11 | 凌巨科技股份有限公司 | Free form display panel and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303462A (en) * | 2008-07-04 | 2008-11-12 | 友达光电股份有限公司 | Liquid crystal display panel testing circuit and method |
| US20110018571A1 (en) * | 2009-07-21 | 2011-01-27 | Bung-Goo Kim | Chip on glass type lcd device and inspecting method of the same |
| CN103713410A (en) * | 2013-12-31 | 2014-04-09 | 京东方科技集团股份有限公司 | Array substrate and display device |
| TWM564172U (en) * | 2018-04-25 | 2018-07-21 | 凌巨科技股份有限公司 | Examining circuit for display panel |
-
2018
- 2018-11-06 TW TW107139228A patent/TWI680305B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303462A (en) * | 2008-07-04 | 2008-11-12 | 友达光电股份有限公司 | Liquid crystal display panel testing circuit and method |
| US20110018571A1 (en) * | 2009-07-21 | 2011-01-27 | Bung-Goo Kim | Chip on glass type lcd device and inspecting method of the same |
| CN103713410A (en) * | 2013-12-31 | 2014-04-09 | 京东方科技集团股份有限公司 | Array substrate and display device |
| TWM564172U (en) * | 2018-04-25 | 2018-07-21 | 凌巨科技股份有限公司 | Examining circuit for display panel |
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| Publication number | Publication date |
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| TW202018318A (en) | 2020-05-16 |
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